Handler for electronic component testing

Abstract

The present invention relates to a handler for electronic component testing. According to the present invention, the handler for electronic component testing controls that a controller identifies specific test pins corresponding to specific terminals of electronic components from among test pins captured by a confirmation camera so as to use a rearrangement device and a moving device in correspondence to the positions of the specific test pins, thereby rearranging the electronic components loaded on a test table. According to the present invention, the electrical connection between electronic components and a tester can be more precisely performed, thereby ensuring test reliability.

Description

Handler for testing electronic components

[0001] The present invention relates to a handler for supporting testing of electronic components by electrically connecting the electronic components and a tester.

[0002] An electronic component test handler is a piece of equipment that handles electronic components in order to electrically connect them to a tester.

[0003] As the integration of electronic components, such as semiconductors, increases, circuit line widths are becoming increasingly narrow. Consequently, greater precision is required when connecting electronic components to testers.

[0004] For example, while in the past it was possible to achieve proper electrical connection between electronic components and testers even with a tolerance of 20㎛, now the tolerance is required to be within a tolerance of 10㎛ or even several ㎛.

[0005] Meanwhile, among electronic components, there are dies that are separated into individual units in a wafer state.

[0006] The die can be packaged or stacked for HBM (High Bandwidth Memory) production and then packaged to form the final product.

[0007] Testing of the die is required to perform post-die operations.

[0008] Electronic components in die state can be tested by electrically connecting the contact pads to a tester.

[0009] Traditionally, testing of die has been done on wafers before they are separated into individual units.

[0010] A probe card was used to make electrical connections between the wafer-state die and the tester.

[0011] Electronic components must undergo various tests.

[0012] For example, in order for electronic components to be delivered, various tests must be conducted in advance, including DC characteristic tests, function tests, reliability tests, current tests, AC characteristic tests, timing tests, and noise tests.

[0013] However, if testing is performed on wafers, even if a defect occurs during a single test, the entire testing process, including the defective die, must be repeated. This reduces processing capacity and requires special procedures to halt testing of the defective die. Furthermore, because each test process requires test equipment, the cost of building equipment to test wafer-level dies is prohibitive.

[0014] So there have been attempts to test individual dies individually.

[0015] Because dies have minute gaps between contact pads and are extremely thin, they are easily broken or cracked. Therefore, automated testing methods capable of adequately supporting the testing of electronic components in die or HBM state have not been proposed. Accordingly, the applicant has proposed Republic of Korea Patent Publication No. 10-2021-0088373 (hereinafter referred to as "prior art").

[0016] Prior art proposes a technique for aligning the positions of electronic components by rearranging the electronic components before connecting them to a tester.

[0017] Prior art uses a camera to scan electronic components on a test table (called a "chuck" in the prior art) to determine their current positions, and then readjust the positions of the electronic components to reduce the margin of error.

[0018] According to the prior art, the precise location of electronic components can be set, thereby supporting the precision required for testing of die-level electronic components.

[0019] HBM is an electronic component made up of stacked dies molded together, requiring die-level precision. Prior art can adequately support automated testing of HBM.

[0020] According to prior art, electronic components loaded on a test table are electrically connected to a tester through a test board.

[0021] However, as the prior art is an initial model, research on more advanced precision is needed to cope with the trend of narrowing line widths of electronic components due to increasing integration.

[0022] [Prior Art Literature]

[0023] [Patent Document]

[0024] (Patent Document 1) Republic of Korea Publication No. 10-2021-0088373

[0025] A technology is required that enables electrical connections between electronic components and testers at a level of precision greater than that of prior art.

[0026] A handler for testing electronic components according to the present invention comprises: a transport shuttle having a transport table capable of transporting electronic components by being moved while the electronic components are loaded; a first hand for loading electronic components to be tested onto the transport table in a first area by operation of the transport shuttle or unloading electronic components whose tests have been completed and which have been loaded onto the transport table and brought to the first area; a second hand for unloading electronic components from the transport table moved from the first area to a second area separated from the first area by operation of the transport shuttle; a test table on which the electronic components to be tested unloaded from the transport table by the second hand are loaded; a rearrangement mechanism for rearranging the electronic components loaded onto the test table by the second hand; The test table is moved between a loading space where electronic components are loaded onto the test table by the second hand and a test space where a test board for electrically connecting the electronic components to a tester is provided, and a moving mechanism that electrically connects or disconnects terminals of the electronic components loaded onto the test table and test pins of the test board; a confirmation camera that is installed to be moved together with the test table by the moving mechanism and photographs the test pins to confirm the positions of the test pins on the test board; and a controller that controls the transport shuttle, the first hand, the second hand, the rearrangement mechanism, the moving mechanism, and the confirmation camera; wherein the controller confirms specific test pins corresponding to specific terminals of the electronic components among the test pins photographed by the confirmation camera, and controls the rearrangement of the electronic components loaded onto the test table using the rearrangement mechanism and the moving mechanism to correspond to the positions of the specific test pins.

[0027] The above specific test pins are two in number and correspond to the two specific terminals that are the furthest apart from each other among the terminals of one electronic component.

[0028] The above specific test pins are diagonally opposite to each other.

[0029] The above repositioning mechanism includes a repositioning picker capable of holding an electronic component; and a repositioning camera disposed spaced apart from the repositioning picker; and the controller analyzes an image obtained by the repositioning camera photographing an electronic component placed on the test table by the second hand, calculates an angle between a parallel line parallel to one side of the electronic component and a horizontal line passing through the center of the test table, calculates a degree of misalignment of the electronic component, and then controls the repositioning so that the misalignment of the electronic component is corrected.

[0030] A temperature controller for controlling the temperature of the test table is further included; the number of test tables is two, and the temperature controller includes two chillers for supplying cold air to the two test tables using a cooling fluid.

[0031] The above two chillers supply cold air to the above two test tables, respectively.

[0032] The above controller controls the two chillers to supply cold air differentially to the two test tables.

[0033] The above controller controls the two chillers so that more cold air is supplied to the test table on which the electronic components are currently being tested than to the test table on which the electronic components are currently being rearranged.

[0034] A manipulator for coupling a tester; further comprising: a support on which the tester can be detachably mounted; a rotation device capable of rotating the tester mounted on the support by 90 degrees; and a body for supporting the support and the rotation device and firmly fixing the position.

[0035] It further includes a supply mechanism for supplying wafers to the test table or retrieving wafers from the test table.

[0036] According to the present invention, the precision of the electrical connection between the electronic component and the tester is further improved, thereby ensuring the reliability of the test.

[0037] FIG. 1 is a conceptual plan view of a handler for testing electronic components according to one embodiment of the present invention.

[0038] Figures 2 to 11 are reference drawings for explaining the handler for testing electronic components of Figure 1.

[0039] Figures 12 to 20 are reference drawings for explaining modified examples of the electronic component test handler of Figure 1.

[0040] Preferred embodiments according to the present invention are described for each embodiment with reference to the attached drawings. However, for the sake of brevity of explanation, descriptions of well-known or duplicated configurations are omitted or compressed as much as possible.

[0041] <First embodiment of a handler for testing electronic components>

[0042] FIG. 1 is a conceptual plan view of an electronic component testing handler (TH, hereinafter abbreviated as “handler”) according to a first embodiment of the present invention.

[0043] The handler (TH) according to the present invention can be divided into a moving part (MP), an unloading part (LU), a repositioning part (RP), and a connecting part (CP), and includes a transport shuttle (100), a first hand (210), a second hand (220), a test table (300), a vacuum (400), a repositioning mechanism (500), a moving mechanism (600), a temperature controller (710), a confirmation camera (720), and a controller (800).

[0044] In the moving section (MF), electronic components can be moved between the unloading section (LU) and the relocation section (RP) to exchange them. To this end, a transport shuttle (100) for transporting electronic components is installed in the moving section (MP).

[0045] A transport shuttle (100) is provided to transport electronic components between the unloading section (LU) and the relocation section (RP).

[0046] The transport shuttle (100) has a movable transport table (110).

[0047] The transport shuttle (100) may have at least one transport table (110).

[0048] The transport table (110) can move back and forth in one direction.

[0049] The transport table (110) can move back and forth in the X-axis direction.

[0050] In the case where there are multiple transport tables (100), the multiple transport tables (110) may be provided in parallel in the Y-axis direction. In this case, the multiple transport tables (110) need to be implemented so that they can move back and forth in the X-axis direction independently of each other.

[0051] The transport table (110) can move between the first area (A1) on the unloading section (LU) side and the second area (A2) on the relocation section (RP) side.

[0052] Electronic components can be loaded on the transport table (110).

[0053] The transport table (110) is not a pocket structure with a mounting groove in which electronic components can be mounted, but rather a vacuum structure that fixes electronic components mounted on a flat surface by vacuum pressure.

[0054] As shown in the schematic plan view of Fig. 2, vacuum holes (VH) and vacuum grooves (VG) for vacuum-absorbing electronic components are formed on the transport table (110).

[0055] One vacuum hole (VH) and one vacuum groove (VG) form a pair.

[0056] The vacuum pressure coming through the vacuum hole (VH) is evenly distributed through the vacuum groove (VG) and acts on the electronic components.

[0057] Since the electronic components can be fixed to the transport table (110) by vacuum pressure, no movement of the electronic components occurs during the process of being loaded onto the transport table (110) and moving in the X-axis direction. Therefore, if the electronic components are precisely placed on the transport table (110), the tolerance for misalignment of the electronic components, which has been a problem, can be minimized.

[0058] Vacuum holes (VH) and vacuum grooves (VG) can be arranged in a 2x8 matrix.

[0059] Since the loading capacity of the transport table (110) can be increased or decreased, the number of vacuum holes (VH) and vacuum grooves (VG) can also be increased or decreased.

[0060] In the unloading section (LU), electronic components are supplied to the handler (TH) or recovered from the handler (TH).

[0061] Electronic components to be tested are supplied to the handler (TH) through the unloading section (LU), and electronic components that have completed testing are retrieved from the handler (TH) through the unloading section (LU).

[0062] Electronic components can be supplied to or retrieved from the handler (TH) on customer trays such as Jedec Tray, Ring Frame or other types.

[0063] Electronic components to be tested in the unloading section (LU) are loaded onto a transport table (110) in the first area (A1), and tested electronic components loaded onto the transport table (110) in the first area (A1) are unloaded from the transport table (110). For this purpose, a first hand (210) is provided in the unloading section (LU).

[0064] The first hand (210) is provided to load electronic components onto or remove them from the transport table (110).

[0065] In order to perform unloading work using the first hand (210), the transport table (110) must be moved toward the unloading section (LU) and be in the first area (A1).

[0066] The first hand (210) loads electronic components to be tested onto the transport table (110) in the first area (A1), or unloads electronic components that have been tested from the transport table (110) in the first area (A1).

[0067] The first hand (210) may have one or more pickers capable of gripping or releasing electronic components. The pickers may grip electronic components using vacuum pressure.

[0068] Preferably, four pickers may be installed in pairs on the first hand (210) to improve processing capacity.

[0069] For example, as in the schematic diagram of Fig. 3, the first hand (210) may have four pickers (P) arranged in a 2x2 matrix form. Of course, the number of pickers (P) provided in the first hand (210) may be increased or decreased.

[0070] The first hand (210) may further include a camera (C).

[0071] The first hand (210) is controlled by the controller (800) to grasp an electronic component whose position is accurately calculated from an image captured by the camera (C) before grasping the electronic component from the customer tray.

[0072] The first hand (210) is controlled so that the center of the electronic component is aligned with the vacuum hole (VH) whose location is accurately calculated from an image captured by the camera (C) by the controller (800) before the electronic component is placed on the transport tray (110).

[0073] The first hand (210) is controlled by the controller (800) to load electronic components at a position accurately calculated from an image captured by the camera (C) when moving electronic components from the transport table (110) to the customer tray.

[0074] Therefore, the picker (P) can pick up or load electronic components at more precise locations, thereby enabling more precise positioning of the electronic components.

[0075] In the relocation section (RP), electronic components (ED) to be tested are unloaded from the transport table (110) and loaded onto the test table (300), and the electronic components loaded onto the test table (300) are relocated. For this purpose, a relocation space (RS) is formed in the relocation section (RP) for relocating the electronic components.

[0076] According to this embodiment, the repositioning portion (RP) is placed on one side of the connecting portion (CP) in the X-axis direction.

[0077] The relocation section (RP) is equipped with a second hand (220).

[0078] The second hand (220) removes the electronic component (ED) to be tested from the transport table (110) or loads the electronic component (ED) for which testing has been completed onto the transport table (110).

[0079] In order to perform unloading work using the second hand (220), the transport table (110) must be moved toward the relocation section (RP) and placed in the second area (A2).

[0080] The second hand (220) carries electronic components to be tested from the transport table (110) in the second area (A2) or loads electronic components that have been tested from the transport table (110) in the second area (A2).

[0081] The second hand (220) can be configured identically to the first hand (210).

[0082] The number of pickers (P) provided in the first hand (210) and the number of pickers (P) provided in the second hand (220) may be different.

[0083] The second hand (220) loads the electronic components to be tested from the transport table (110) in the second area (A2) onto the test table (300) that has been moved to the relocation section (RP).

[0084] In order for electronic components to be tested by the second hand (220) to be loaded onto the test table (300), the test table (300) must be located in the relocation space (RS). Therefore, the relocation space (RP) can be renamed as a loading space.

[0085] The second hand (220) loads the tested electronic components loaded on the test table (300) onto the transport table (110) in the second area (A2).

[0086] The test table (300) is provided to load electronic components (ED) that are transferred from the transport table (110) by the second hand (220).

[0087] As shown in the schematic excerpt of Fig. 4, the test table (300) has a circular shape and a flat upper surface.

[0088] The test table (300) may be in the shape of a square plate when viewed from a plane, and in this case, the upper surface is flat.

[0089] Electronic components are loaded onto the test table (300) in a form that is placed on the flat upper surface of the test table (300).

[0090] The test table (300) can be moved in the X-axis, Y-axis, and Z-axis directions.

[0091] The test table (300) can be rotated in the Θ-axis direction with the vertical line (V) passing through the center of the test table (300) in the Z-axis direction as the rotation axis.

[0092] Typically, when electronic components (ED) are moved to a test table (300), shock or inertia associated with the movement occurs. Such shock or inertia may disturb the position of electronic components loaded on the test table (300). To prevent this, vacuum holes (h) are formed in the area where electronic components are loaded on the test table (300).

[0093] The vacuum structure of the test table (300) for fixing electronic components may be the same as the vacuum structure of the transport table (110) referring to FIG. 2.

[0094] When an electronic component is placed on the test table (300) by the second hand (220), the electronic component can be fixed in the position it was placed in by vacuum pressure. When the second hand (220) releases the grip on the electronic component in that state, the electronic component is fixed in the position it was placed in without any distortion of its position.

[0095] The vacuum device (400) provides vacuum pressure to the vacuum holes (h) in the test table (300) through a vacuum circuit (not shown).

[0096] The vacuum pressure provided by the vacuum device (400) is transmitted to the electronic components (ED) through the vacuum hole (h), and the electronic components loaded on the test table (300) are fixed in position by the vacuum pressure.

[0097] The vacuum holes (h) can be implemented to be selectively opened and closed according to the control of the vacuum circuit. The electronic components (ED) can be selectively fixed to the test table (300) or detached from the test table (300).

[0098] Electronic components are loaded onto a test table (300) and electrically connected to the tester.

[0099] Electrical connection between the electronic components loaded on the test table (300) and the tester is made through a test board (20).

[0100] The test board (20) has test pins that make electrical contact with electronic components.

[0101] The test board (20) is connected to the handler (TH) at the connection part (CP).

[0102] The electronic components loaded on the test table (300) moved to the connection part (CP) and the test pins of the test board (20) are electrically contacted.

[0103] The test board (20) may have any structure as long as it has a configuration that can be electrically connected to electronic components.

[0104] The test board (20) may be a widely known probe card. In this case, it is preferable that the test table (300) be provided in the form of a circular plate.

[0105] The test board (20) may have a structure having socket modules. The test pins are provided in the socket module, and the socket module is installed in the socket body. In this case, it is preferable that the test table (300) be provided in a square plate shape.

[0106] As shown in the bottom view of Fig. 5, test zones (TZs) each corresponding to one electronic component are arranged on the test board (20).

[0107] The test zones (TZs) correspond one-to-one with the electronic components loaded on the test table (300).

[0108] One test zone (TZ) is equipped with test pins (t) for electrical connection to one electronic component.

[0109] The test pins (t) in one test zone (TZ) form a group of test zones (TZ) and are electrically connected to the electronic components (ED).

[0110] When the test board (20) is a probe card, a set of test pins (t) are densely arranged in a test zone (TZ). Here, a set of test pins (t) corresponds to terminals on one electronic component.

[0111] When the test board (20) has a structure with a socket module, a set of test pins (t) are installed in one socket module (22), and one socket module (22) forms one test zone (TZ). Therefore, when one socket module (22) is replaced, one test zone (TZ) is replaced.

[0112] The test zone (TZ) and the electronic component (ED) must be aligned. If the coordinates of the electronic component (ED) on the test table (300) and the coordinates of the test zone (TZ) on the XY plane do not match, a fault occurs in the electrical connection between the electronic component (ED) and the tester.

[0113] As in the conceptual example of Fig. 6, if an electronic component (ED) on a test table (300) is at an angular position having a twisted rotation angle (Θ1) in the Θ-axis direction with respect to a test zone (TZ), a fault occurs in the electrical connection between the electronic component (ED) and the tester. Therefore, all test zones (TZ) of the test board (20) and all electronic components (ED) on the test table (300) must be aligned.

[0114] A relocation mechanism (500) is provided to achieve alignment between the test zone (TZ) and the electronic component (ED).

[0115] According to this embodiment, the electronic component (ED) is moved from the transport table (110) to the test table (300) by the second hand (220). During this process, an error may occur in the position of the electronic component (ED) due to an operating error or operating shock of the second hand (220).

[0116] The positions or angular positions of the electronic components (ED) loaded onto the test table (300) by the second hand (220) on the XY plane may be different, and the electronic components (ED) loaded onto the test table (300) and the test zones (TZ) of the test board (20) may not match each other.

[0117] This is acceptable as long as the tolerance between the electronic component (ED) and the test zone (TZ) is wide. However, packaged semiconductor devices require precision within 30㎛, and dyna HBM requires precision within 5㎛.

[0118] In the present invention, when the second hand (220) moves electronic components (ED) from the transport table (110) to the test table (300), the electronic components (ED) are loaded into temporary areas and then rearranged from the temporary areas to fixed position areas.

[0119] The temporary area is not a set location, but an arbitrary location where the electronic component (ED) is placed on the test table (300) by the second hand (220).

[0120] The temporary zone is not set or fixed by the controller (800), but is a location arbitrarily determined by the second hand (220). For example, when the second hand (220) places an electronic component (ED) on the test table (300), the zone where the electronic component (ED) is placed becomes the temporary zone.

[0121] Exaggerated Figure 7 shows an example of a temporary zone (BZ) on a test table (300).

[0122] The fixed position zone refers to the location where the electronic component (ED) and the test zone (TZ) are aligned. Exaggerated Fig. 8 shows the relationship between the temporary zone (BZ) and the fixed position zone (RZ) on the test table (300).

[0123] The test zone (RZ) may be preset, but may also be set to match the position and arrangement of the test zones (TZ) on the test board (20) after the electronic components (ED) to be tested are loaded onto the test table (300).

[0124] In Fig. 8, the temporary zone (BZ) has errors in the X-axis direction, Y-axis direction, and Θ-axis direction with respect to the fixed location zone (RZ).

[0125] A relocation mechanism (500) is provided to precisely relocate the position of electronic components (ED) loaded on a test table (300) in a relocation space (RS).

[0126] The relocation mechanism (500) is provided to relocate the position of the electronic component (ED) loaded on the test table (300) by the second hand (220) from the temporary zone (BZ) to the fixed position zone (RZ).

[0127] According to the present embodiment, the second hand (220) loads the electronic components (ED) to be tested, which are unloaded from the transport table (110), into the temporary zone (BZ). Then, the repositioning mechanism (500) is utilized to move the electronic components (ED) in the temporary zone (BZ) to the fixed position zone (RZ).

[0128] As shown in the schematic diagram of Fig. 9, the repositioning mechanism (500) includes a repositioning picker (510) and a repositioning camera (520).

[0129] The relocation mechanism (500) has a fixed position.

[0130] The repositioning mechanism (500) can be fixedly mounted on a frame forming the skeleton of the handler (TH).

[0131] The repositioning picker (510) can grip or release electronic components (ED). The repositioning picker (510) can grip electronic components (ED) by vacuum pressure.

[0132] The repositioning picker (510) is fixed in position in the horizontal direction, i.e., the X-axis and Y-axis directions.

[0133] The relocation camera (520) is placed apart from the relocation picker (510).

[0134] The relocation camera (520) is provided to photograph electronic components (ED).

[0135] As in the example of Fig. 10, the relocation camera (520) photographs identification marks (M: M1, M2) on an electronic component (ED). The identification marks (M) may be arranged diagonally from each other.

[0136] However, the object captured by the relocation camera (520) for relocating the electronic component (ED) need not be limited to the identification mark (M). The object captured by the relocation camera (520) may be replaced with a corner of the electronic component (ED), an identification pad or identification pattern of the electronic component (ED), etc.

[0137] The relocation picker (510) and the relocation camera (520) are combined and combined into a single module. Therefore, the mutual placement positions of the relocation picker (510) and the relocation camera (520) are fixed.

[0138] The moving mechanism (600) can move the test table (300) in the horizontal direction along the X-axis and Y-axis.

[0139] The moving mechanism (600) can rotate the test table (300) in the Θ-axis direction.

[0140] The moving mechanism (600) can move the test table (300) up and down in the Z-axis direction.

[0141] As shown in the schematic excerpt of FIG. 11, the moving mechanism (600) includes a rotating machine (610), an elevator (620), a first moving machine (640), and a second moving machine (660).

[0142] The rotator (610) rotates the test table (300) in the Θ-axis direction.

[0143] The angular position of the electronic component (ED) can be adjusted by rotating the test table (300) by the rotator (610).

[0144] The elevator (620) elevates the test table (300).

[0145] The test table (300) is connected to the elevator (620) via a rotator (610).

[0146] When the test table (300) is raised by the elevator (620), the electronic components (ED) of the test table (300) come into contact with the test pins (t), thereby electrically connecting the electronic components (ED) to the tester. When the test table (300) is lowered by the elevator (620), the contact between the electronic components (ED) and the test pins (t) is released, and the test table (300) becomes capable of moving horizontally.

[0147] The first mover (640) moves the test table (300) in the X-axis direction.

[0148] By moving the test table (300) in the X-axis direction by the first mover (640), the test table (300) can be selectively positioned in the rearrangement space (RS) and the test space (TS). Here, the test space (TS) is a space formed in the test portion (TP), and when the test table (300) is in the test space (TS), an electrical connection is made between the electronic component (ED) and the tester (TESTER) by the elevation of the test table (300).

[0149] The second mover (660) moves the test table (300) in the Y-axis direction.

[0150] The above moving device (600) has four functions.

[0151] The first function is to move the test table (300) between the relocation space (RS) and the test space (TS) formed in the connection part (CP).

[0152] The second function is to electrically connect or disconnect the electronic component (ED) to the tester.

[0153] The third function is the function for rearranging electronic components (ED) in the rearrangement space (RS).

[0154] The fourth function is to move the confirmation camera (720) to photograph the test pin (t) of the test board (20). Here, the photographing of the test pin (t) can be performed in units of a set forming a cluster.

[0155] Let me explain the third function further.

[0156] Since the repositioning picker (510) is fixed, the test table (300) moves in the horizontal X-axis and Y-axis directions or rotates in the Θ-axis direction to adjust the position of the electronic component (ED) on the horizontal plane.

[0157] Depending on the implementation, the test table (300) is raised and lowered during the relocation process of the electronic component (ED), enabling the gripping or release of the electronic component (ED) by the relocation picker (510).

[0158] Here, the operation of the electronic components (ED) during relocation is described.

[0159] As shown in Fig. 8, the temporary zone (BZ) of the electronic component (ED) may have differences from the fixed location zone (RZ) in the X-axis direction, Y-axis direction, and Θ-axis direction.

[0160] The relocation camera (520) photographs the electronic components (ED) on the test table (300) and confirms the temporary zone (BZ) through the location of the identification mark (M).

[0161] When the temporary zone (BZ) is confirmed, the first mover (640) and the second mover (660) operate to position the center of the temporary zone (BZ) below the relocation picker (510), and the elevator (620) operates to raise the test table (300).

[0162] When the relocation picker (510) suctions and grips the electronic component (ED) of the elevated test table (300) with vacuum pressure, the elevator (620) operates to lower the test table (300). Thereafter, the first mover (640) and the second mover (660) operate to align the center of the positioning zone (RZ) with the center of the electronic component (ED) gripped by the relocation picker (510), and the rotator (610) operates to align the electronic component (ED) with the positioning zone (RZ). In this state, the elevator (620) operates to raise the test table (300), thereby causing the electronic component (ED) gripped by the relocation picker (510) to settle in the positioning zone (RZ).

[0163] When the electronic component (ED) is fixed to the test table (300) by vacuum pressure applied through the vacuum hole (h) while the electronic component (ED) is settled in the fixed position zone (RZ), the relocation picker (510) releases the grip of the electronic component (ED). Then, the test table (300) descends and begins relocation of the next electronic component (ED).

[0164] A temperature controller (710) is provided to control the temperature of the test table (300) and the test board (320).

[0165] The temperature controller (710) may include at least one heater for heating or one chiller for cooling.

[0166] The heater can be installed embedded in the test table (300) or test board (20).

[0167] A cooling path may be formed in the test table (300) and test board (20) to supply cold air by the chiller.

[0168] A confirmation camera (720) is provided to photograph the test pin (t) of the test board (20).

[0169] The confirmation camera (720) can be installed in a structure that is coupled to the test table (300). Accordingly, the position of the confirmation camera (720) can be moved by the moving mechanism (620).

[0170] The confirmation camera (720) may be equipped to photograph test pins (t) in a group unit.

[0171] The controller (800) can accurately calculate the positions of the test pins (t) through the positions of the confirmation camera (720) and the test pins (t) in the image captured by the confirmation camera (720).

[0172] The controller (800) controls components necessary for the proper operation of the handler (TH), such as the transport shuttle (100), the first hand (210), the second hand (220), the vacuum (400), the repositioning mechanism (500), the moving mechanism (600), the temperature controller (710), and the confirmation camera (720).

[0173] Next, the method of operating the handler (TH) according to the present invention from the perspective of rearrangement of electronic components (ED) will be described.

[0174] In the unloading section (LU), the first hand (210) loads electronic components (ED) to be tested onto the transport table (110) in the first area (A1).

[0175] When all electronic components (ED) are loaded onto the transport table (110), the transport shuttle (100) operates and the transport table (110) moves to the second area (A2).

[0176] The second hand (220) moves electronic components (ED) from the transport table (110) in the second area (A2) to the test table (300) in the relocation area (RS). At this time, the locations of the electronic components (ED) loaded onto the test table (300) by the second hand (220) are temporary zones (BZ).

[0177] When all electronic components (ED) to be tested are loaded on the test table (300), the controller (800) operates the relocation mechanism (500) and the moving mechanism (600) to relocate the electronic components (ED) from temporary zones (BZ) to fixed zones (RZ).

[0178] When the rearrangement of electronic components (ED) on the test table (300) is completed, the moving mechanism (600) operates to move the test table (300) to the test space (TS). Thereafter, the connector (700) operates to raise the test table (300) toward the test board (20) so that the electronic components (ED) are electrically connected to the tester.

[0179] When the test on the electronic components (ED) is completed, the test table (300) is moved to the rearrangement section (RP) by the moving mechanism (600). Then, the second hand (220) moves the tested electronic components (ED) to the transport tray (110) in the second area (A2), and the transport tray (110) filled with the tested electronic components (ED) is moved to the first area (A1). Then, the first hand (210) unloads the tested electronic components (ED) from the transport table (110) and loads them onto an empty customer tray.

[0180] By the above basic operating method, electronic components (ED) are supplied to the tester, tested, and returned after the test is completed.

[0181] Meanwhile, tests requiring high or low temperature environments may be required.

[0182] The controller (800) operates the temperature controller (710) to control the temperature of the test board (20). Accordingly, the test board (20) undergoes thermal contraction or thermal expansion, and the positions of the test pins (t) are slightly moved.

[0183] When the test board (20) is adjusted to the required temperature, the controller (800) operates the moving mechanism (600) and the confirmation camera (720) to photograph the test pins (t) with the confirmation camera (720) and then analyze the exact position of the test pins (t).

[0184] The controller (800) confirms the positions of specific test pins (t) corresponding to specific terminals of electronic components (ED) among the test pins (t) photographed by the confirmation camera (720) and controls the electronic components loaded on the test table (300) to be rearranged using the rearrangement mechanism (500) and the moving mechanism (600) to correspond to the positions of the specific test pins (t).

[0185] As an example, there are two specific test pins (t).

[0186] The two specific test pins (t) are the test pins (t) corresponding to the two specific terminals that are the farthest from each other among the terminals that an electronic component (ED) has. Typically, the test pins (t) corresponding to the two specific terminals that are the farthest from each other are diagonally opposite to each other.

[0187] The test zone (TZ) can be identified more accurately by identifying specific test pins (t) corresponding to two specific terminals that are the furthest from each other.

[0188] In addition, the controller (800) operates the temperature controller (710) to preheat or cool the test table (300) so as to achieve the required temperature conditions. Accordingly, the test table (300) is thermally deformed to correspond to the required temperature conditions. In this state where the test table (300) is thermally deformed, the electronic components (ED) are repositioned using the repositioning mechanism (500). Accordingly, the fixed position zone (RZ) of the electronic components (ED) according to the repositioning can be precisely aligned with the test zone (TZ).

[0189] <Variation 1>

[0190] Above, the controller (800) checks the positions of the X-axis, Y-axis, and Θ-axis of the electronic component by the identification marks (M1, M2) in the image captured by the relocation camera (520).

[0191] However, the position of the Θ axis can be confirmed in other ways.

[0192] For example, see Figure 12.

[0193] FIG. 12 shows a controller (800) that analyzes an image obtained by photographing an electronic component (ED) placed on a test table (300) by a second hand (220) and calculates an angle (α) between a parallel line (PL) parallel to one side of the electronic component (ED) and a horizontal line (HL) passing through the center of the test table (300), and then calculates the degree of misalignment of the electronic component (ED) in the Θ-axis direction, and then controls a moving mechanism (600) so that the misalignment of the electronic component (ED) is corrected and repositioned.

[0194] Of course, the degree of distortion of the electronic component (ED) can be implemented so that it is confirmed through both the identification marks (M1, M2) and the confirmation referred to in Fig. 12. In addition, either of the two confirmation methods can be applied as an auxiliary for verification.

[0195] <Variation 2>

[0196] Figure 13 is a conceptual plan view of a handler (TH, hereinafter abbreviated as “handler”) according to a second modified example of the present invention.

[0197] A handler (TH) according to a second modified example includes a transport shuttle (100), a first hand (210), a second hand (220), a pair of test tables (300A, 300B), a vacuum device (400), a pair of repositioning mechanisms (500), a pair of moving mechanisms (600), a temperature controller (710), a pair of confirmation cameras (720), and a controller (800).

[0198] Each component of the second embodiment basically performs the same function as each component of the first embodiment. However, the handler (TH) according to the second embodiment is positioned on either side of the connection portion (CP) with the reposition portion (RP) positioned between the connection portion (CP). In addition, the test tables (300A, 300B) and all related components are provided as a pair.

[0199] In the second embodiment, a pair of test tables (300A, 300B) are used alternately and controlled to electrically connect electronic components (EDs) aligned on a pair of test tables (300A, 300B) to a tester.

[0200] When one test table (300A / 300B) is being used for testing electronic components (ED), the remaining test tables (300B / 300A) can be used for other preparations such as rearrangement of electronic components (ED).

[0201] <Variation 3>

[0202] The third variation is derived from the second variation.

[0203] As in Fig. 14, in the third modified example, two chillers (711, 712) are provided in the temperature controller (710).

[0204] Two chillers (711, 712) each supply cold air to a pair of test tables (300A, 300B).

[0205] If you have one chiller, you have to have a large capacity, so the production cost increases.

[0206] Therefore, it is desirable to lower the production cost by having two chillers (711, 712) with relatively small capacities.

[0207] Furthermore, the controller (800) controls two chillers (711, 712) to supply cold air differentially to two test tables (300A, 300B).

[0208] For example, the controller (800) controls so that more cold air is supplied to the test table (300B / 300A) on which the electronic component (ED) currently being tested is loaded than to the test table (300A / 300B) on which the electronic component (ED) is currently being rearranged among the two test tables (300A, 300B).

[0209] According to a preferred example, the controller (800) can control two chillers (711, 712) to supply 80% of the cold air to the test table (300B / 300A) on which the electronic component (ED) currently being tested is loaded, and to supply 20% of the cold air to the test table (300A / 300B) on which the electronic component (ED) is currently being rearranged.

[0210] <Variation 4>

[0211] The fourth variation is for a manipulator for coupling a tester (more specifically, the test head portion excluding the main body of the tester) to a handler (TH).

[0212] The tester is coupled to the handler (TH) at the connection point (CP).

[0213] In the handler (TH) according to Fig. 13, the manipulator (900) is placed at the rear of the transport shuttle (100). Accordingly, the transport shuttle (300) is placed between the connecting portion (CP) and the manipulator (900).

[0214] FIG. 15 illustrates a manifold (900) that can be appropriately applied to the handler (TH) according to FIG. 13.

[0215] The manipulator (900) is implemented to include a main body (910), a support (920), a rotation device (930), a forward / reverse device (940), and an elevator device (950).

[0216] The main body (910) firmly fixes the position of the manipulator (900) and supports the overall configuration.

[0217] The support (920) supports the tester. The tester can be detachably mounted on the support (920).

[0218] The rotation device (930) rotates the tester 180 degrees as shown in Fig. 16 to change the up-down direction of the tester.

[0219] When the terminal side of the tester is facing upward by the rotating device (930), repair of the tester becomes convenient.

[0220] The forward / reverse device (940) moves the tester forward and backward as shown in Fig. 17.

[0221] The position of the tester (TESTER) can be positioned toward the test space (TS) or moved away from the test space (TS) by the forward / reverse device (940).

[0222] The elevator device (950) elevates the tester as shown in Fig. 18.

[0223] When the tester (TESTER) is lowered by the elevator (950), the tester (TESTER) is mounted, and the tester (TESTER) and the test board (20) are electrically contacted.

[0224] When the tester (TESTER) is raised by the elevator (950), the tester (TESTER) is separated from the handler (TH), and the contact between the tester (TESTER) and the test board (20) is released.

[0225] Furthermore, as shown in FIG. 19, the rotation device (930) can rotate the tester by only 90 degrees. In this case, repairs to various positions of the tester become easier.

[0226] <Variation 5>

[0227] The fifth variation is implemented as a hybrid.

[0228] Referring to FIG. 20, the handler (TH) according to the fifth modified example further includes a supply mechanism (730).

[0229] The supply mechanism (730) supplies a wafer (W) to the test table (300) or retrieves a wafer from the test table (300).

[0230] That is, according to the second variant, not only can testing of individual electronic components (EDs) be supported, but also testing of dies in wafer form can be supported. This further expands versatility and specialization, and reduces the construction costs required for testing electronic components (EDs).

[0231] The above-described embodiments merely illustrate preferred examples of the present invention, and it may have various applications. Therefore, the present invention should not be construed as being limited to the above-described content. Instead, the scope of the present invention should be construed within the scope of the separately described claims and their equivalents.

Claims

1. A transport shuttle having a transport table capable of transporting electronic components by moving while the electronic components are loaded; A first hand that loads electronic components to be tested onto the transport table in the first area by the operation of the transport shuttle or removes electronic components that have been tested and are loaded onto the transport table and brought to the first area; A second hand that moves electronic components from a transport table moved from the first area to a second area located away from the first area by the operation of the transport shuttle; A test table on which electronic components to be tested are loaded and transported from the transport table by the second hand; A rearrangement mechanism for rearranging electronic components loaded on the test table by the second hand; A moving mechanism that moves the test table between a loading space where electronic components are loaded onto the test table and a test space where a test board for electrically connecting the electronic components to a tester is located by the second hand, and electrically connects or disconnects terminals of the electronic components loaded onto the test table and test pins of the test board; A confirmation camera that is installed to move together with the test table by the moving mechanism and photographs the test pins on the test board to confirm their locations; and A controller for controlling the above-mentioned transport shuttle, the first hand, the second hand, the relocation mechanism, the moving mechanism, and the confirmation camera; The above controller controls the electronic components loaded on the test table to be rearranged using the rearrangement mechanism and the moving mechanism to correspond to the positions of the specific test pins by identifying specific test pins corresponding to specific terminals of electronic components among the test pins photographed by the confirmation camera. Handler for testing electronic components.

2. In paragraph 1, The above specific test pins are two in number and correspond to the two specific terminals that are the farthest apart from each other among the terminals that one electronic component has. Handler for testing electronic components.

3. In paragraph 2, The above specific test pins are diagonally opposite to each other. Handler for testing electronic components.

4. In paragraph 1, The above relocation mechanism A repositioning picker capable of retrieving electronic components; and A relocation camera positioned apart from the above relocation picker; The controller analyzes the image obtained by the relocation camera photographing the electronic component placed on the test table by the second hand, calculates the angle between the parallel line parallel to one side of the electronic component and the horizontal line passing through the center of the test table, calculates the degree of misalignment of the electronic component, and controls the relocation so that the misalignment of the electronic component is corrected. Handler for testing electronic components.

5. In paragraph 1, Further comprising a temperature controller for controlling the temperature of the above test table; There are two test tables above, The above temperature controller Two chillers for supplying cold air to the two test tables using a cooling fluid; Handler for testing electronic components.

6. In paragraph 5, The above two chillers supply cold air to the above two test tables respectively. Handler for testing electronic components.

7. In paragraph 6, The above controller controls the two chillers to supply cold air differentially to the two test tables. Handler for testing electronic components.

8. In paragraph 7, The above controller controls the two chillers so that more cold air is supplied to the test table on which the electronic components are currently being tested than to the test table on which the electronic components are currently being rearranged among the two test tables. Handler for testing electronic components.

9. In paragraph 1, A manipulator for combining testers; further comprising: The above manipulator A support on which the tester can be detachably mounted; A rotating device capable of rotating the tester mounted on the support by 90 degrees; and A main body for supporting the above support and rotating device and firmly fixing the position; Handler for testing electronic components.

10. In paragraph 1, Further comprising a supply mechanism for supplying wafers to the test table or retrieving wafers from the test table; Handler for testing electronic components.

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