Display panel, display screen module and electronic device

Abstract

Provided in the embodiments of the present invention are a display panel, a display screen module and an electronic device. The display panel comprises a light-emitting layer, a touch layer, a color film layer and a plurality of micro lenses; the light-emitting layer comprises a plurality of sub-pixels spaced apart on a light-emitting surface; the touch layer is located between the light-emitting layer and the color film layer; the color film layer comprises a black matrix and a color resist layer, the orthographic projection of the black matrix on the light-emitting surface being offset with respect to the sub-pixels, and the orthographic projection of the color resist layer on the light-emitting surface covering the plurality of sub-pixels; the plurality of micro lenses are located between the color resist layer and the touch layer, and the plurality of micro lenses are arranged corresponding to the plurality of sub-pixels. Light rays passing through the micro lenses are less likely to be reflected or absorbed, which can weaken the total internal reflection of light rays occurring in the display panel and improves the passing rate of light rays, thus improving the light emitting efficiency of display panels, and satisfying the use requirements of users for high brightness of display panels.

Description

Display panel, display screen module and electronic equipment

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to the Chinese patent application filed with the Intellectual Property Office of the People's Republic of China on February 23, 2024, with application number 202410208526.2 and application name "Display panel, display module and electronic device", all contents of which are incorporated by reference into this application. Technical Field

[0003] Embodiments of the present invention relate to the field of display technology, and in particular to a display panel, a display screen module, and an electronic device. Background Art

[0004] With the development and upgrading of High Dynamic Range (HDR) technology and the demand for outdoor use, consumers are demanding higher brightness from display products. However, the external quantum efficiency (EQE) of display modules currently on the market is low, resulting in low light extraction efficiency. The brightness of display products still has significant room for improvement, and the brightness of current display products cannot meet user needs. Summary of the Invention

[0005] Embodiments of the present invention provide a display panel, a display screen module, and an electronic device, which can improve the light extraction efficiency of the display panel and facilitate obtaining a display panel with higher brightness.

[0006] In a first aspect, embodiments of the present invention provide a display panel comprising a light-emitting layer, a touch layer, a color filter layer, and a plurality of microlenses. The light-emitting layer has a plurality of sub-pixels spaced apart on a light-emitting surface. The touch layer is located on the light-emitting side of the light-emitting layer. The color filter layer is located on the light-emitting side of the touch layer. The color filter layer comprises a black matrix and a color resist layer. The orthographic projection of the black matrix on the light-emitting surface is staggered with the plurality of sub-pixels. The orthographic projection of the color resist layer on the light-emitting surface covers the plurality of sub-pixels. The plurality of microlenses are arranged corresponding to the plurality of sub-pixels and are located between the color resist layer and the touch layer.

[0007] It should be understood that the light-emitting side mentioned above refers to the side of the display panel's structure that is away from the light-emitting layer and closer to the light-emitting surface of the display panel. The color filter layer is located on the light-emitting side of the touch layer, that is, the color filter layer is located on the side of the touch layer away from the light-emitting layer. The light-emitting surface mentioned above refers to the plane where the multiple sub-pixels arranged coplanarly are located, not a structural plane.

[0008] In the aforementioned display panel, light emitted by a sub-pixel first passes through a microlens before entering the color-resistance layer during propagation. The microlens has excellent light-collecting performance and a low light absorption rate, which can reduce or prevent total reflection of light at the interface of the structural layers. It also increases the rate of light passing through the color filter layer, allowing as much light as possible to enter the environment from the light-emitting side of the display panel. This improves the light extraction efficiency of the display panel and meets users' demand for high-brightness display panels. This higher light extraction efficiency not only increases the brightness of the display panel, but also saves power consumption, thereby increasing the service life of the display panel.

[0009] In some embodiments, the microlens is configured to focus light emitted by the corresponding sub-pixel. The microlens' focus on light emitted by the corresponding sub-pixel is achieved by focusing at least a portion of the light emitted by the sub-pixel toward the normal (axis or centerline) of the microlens itself when passing through the microlens. Focusing light through the microlens effectively reduces the angle of incidence of light entering subsequent structural layers, lowering the reflectivity of light at the interface between the structural layers, thereby increasing the light transmission rate.

[0010] Exemplarily, the microlens is formed as a convex lens, so that light is focused after passing through the microlens.

[0011] Exemplarily, the refractive index of the microlens is greater than that of the color resist layer. The microlens has a larger refractive index, and light can be deflected toward the normal of the microlens itself when entering the microlens, thereby having a focusing effect after exiting the microlens.

[0012] In some embodiments, the light-emitting layer further comprises a substrate, a pixel definition layer, and an encapsulation layer. The pixel definition layer and the sub-pixels are both disposed on the substrate, and the encapsulation layer covers the light-emitting side of the pixel definition layer and the sub-pixels. The encapsulation layer in this embodiment not only provides encapsulation and protection for the sub-pixels but also provides a smooth surface on the light-emitting side of the light-emitting layer, facilitating the processing and arrangement of the touch layer.

[0013] In some embodiments, the microlenses are located within the color filter layer. Exemplarily, the plurality of microlenses are arranged in the same layer as the black matrix. It should be noted that this embodiment is not limited to requiring that the light-incoming and light-outgoing surfaces of the plurality of microlenses arranged in the same layer as the black matrix are flush with each other. For example, the light-outgoing surface of the microlenses may be higher than the light-outgoing surface of the black matrix.

[0014] Specifically, the black matrix includes a plurality of black cells arranged at intervals, and the microlenses are located in the gaps between adjacent black cells. Since light entering the black cells is absorbed, light emitted by the sub-pixels is emitted outward through the gaps between the black cells. The microlenses located in the gaps between adjacent black cells can cover the light output path of the sub-pixels, increase the amount of light that enters the color resist layer through the gaps between the black cells, and improve light extraction efficiency.

[0015] In some embodiments, the distance between the orthographic projection of the black cell on the light-emitting surface and the closest sub-pixel is 3 μm to 7 μm, ensuring a large light-transmitting gap between adjacent black cells, facilitating the passage of light emitted by the sub-pixels and facilitating the arrangement of microlenses. Exemplarily, the distance between the orthographic projection of the black cell on the light-emitting surface and the closest sub-pixel can be 3 μm, 4 μm, 5 μm, or 6 μm.

[0016] In some embodiments, the orthographic projection of the microlens on the light-emitting surface completely covers the corresponding sub-pixel, so that the microlens can cover the light output path of the corresponding sub-pixel. Exemplarily, the spacing between the orthographic projection of the microlens on the light-emitting surface P and the corresponding sub-pixel is 0-3 μm, for example, 1 μm or 2 μm.

[0017] In some embodiments, the side of the microlens facing the light-emitting layer abuts the touch layer, and the light-emitting side of the microlens abuts the color resist layer. The color resist layer directly abuts the light-emitting side of the microlens, providing encapsulation and protection for the microlens without requiring additional encapsulation structures on the light-emitting side of the microlens. This embodiment simplifies the internal structure of the display panel and reduces the problem of increased reflectivity caused by the introduction of additional structures.

[0018] Exemplarily, the color resist layer also covers the gaps between the black units. Compared to the position where the color resist layer does not abut the microlens, the color resist layer and the microlens can have a smaller thickness. The light emitted from the microlens passes through the color resist layer with a smaller thickness, and the reflectivity of the light is reduced, and the light has a higher transmission rate, thereby improving the light extraction efficiency.

[0019] In some embodiments, the refractive index of the microlens can be 1.55 to 1.8, for example, 1.60, 1.75, or 1.8, to ensure that the microlens has a good light-gathering function. In embodiments where the refractive index of the microlens is greater than the refractive index of the color resist layer, the refractive index of the color resist layer can be 1.45 to 1.65, for example, 1.5, 1.55, or 1.6.

[0020] In some embodiments, the side of the microlens facing the light-emitting layer abuts the touch layer. The display panel further includes a planarization layer that covers the light-emitting side of the microlens. The color resist layer is located on the light-emitting side of the planarization layer. The planarization layer is used to flatten (or level) the light-emitting side of the microlens, facilitating the formation of the color resist layer on the light-emitting side of the planarization layer. The planarization layer also provides encapsulation and protection for the microlens.

[0021] In combination with the embodiment in which the microlens and the black matrix are arranged on the same layer, the flattening layer also covers the side of the black matrix facing away from the light-emitting layer. That is, the flattening layer can simultaneously flatten the side of the black matrix and the microlens facing away from the light-emitting side, fill the gap that may exist between the microlens and the black matrix, and level the light-emitting surface, which is beneficial to the formation and arrangement of the color resist layer.

[0022] Exemplarily, the refractive index of the microlens is greater than the refractive index of the planar layer. In some embodiments, the refractive index of the microlens may be 1.55 to 1.8. The refractive index of the planar layer may be 1.45 to 1.65, for example, 1.5, 1.55, or 1.6.

[0023] In some embodiments, the plurality of microlenses are positioned between the touch layer and the black matrix, the planar layer also covers the light-exiting side of the touch layer, and the black matrix and color resist layer are both positioned on the light-exiting side of the planar layer. In this embodiment, light exiting the touch layer and entering the microlenses can reduce total internal reflection at the interface between the touch layer and the microlenses. The focused light enters the color filter layer with a smaller angle of incidence, resulting in a higher transmittance for the color filter layer and improving the light extraction efficiency of the display panel.

[0024] In some embodiments, the touch layer includes an insulating layer, a first wiring layer, and a second wiring layer spaced apart from each other, and the side of the microlens facing the light-emitting layer abuts the insulating layer. The insulating layer can be used to provide insulation between the first wiring layer and the second wiring layer. Exemplarily, the first wiring layer and the second wiring layer are each provided with different electrodes (for example, one is an Rx electrode and the other is a Tx electrode), and the different electrodes are located on the two layers without a bridge touch solution.

[0025] In some embodiments, the first wiring layer is located inside the insulating layer, and the second wiring layer may be located on a light-emitting side of the insulating layer.

[0026] As an exemplary embodiment, the black matrix is ​​located on the light-exiting side of the insulating layer and covers the second wiring layer. The black matrix acts as an encapsulation structure to provide encapsulation and protection for the second wiring layer, simplifying the internal structure of the display panel. Exemplarily, the black matrix is ​​made of an insulating material.

[0027] As another exemplary embodiment, the display panel further includes a first encapsulation portion, the first encapsulation portion being located on the light-exiting side of the insulating layer and covering the second wiring layer. The black matrix is ​​located on the light-exiting side of the first encapsulation portion and covering the first encapsulation portion. In this embodiment, the first encapsulation portion provides encapsulation and protection for the second wiring layer, ensuring the stability of the touch function. Exemplarily, the first encapsulation portion is made of an insulating material.

[0028] In conjunction with the embodiment in which the planar layer covers the light-emitting side of the touch layer, as an implementation method, the first wiring layer is located within the insulating layer, the second wiring layer is located between the insulating layer and the planar layer, and the planar layer covers the second wiring layer. The planar layer here can serve as an encapsulation structure to protect the second wiring layer. Exemplarily, the planar layer is made of an insulating material.

[0029] In another embodiment, the first wiring layer is located inside the insulating layer, the planar layer covers the light-emitting side of the touch layer, the black cells are located on the light-emitting side of the planar layer, and the second wiring layer is located between the planar layer and the black cells. The black cells cover the second wiring layer and can encapsulate and protect the second wiring layer. Exemplarily, the black cells are made of an insulating material.

[0030] In another embodiment, the first wiring layer is located within the insulating layer, and the display panel further includes a second encapsulation portion provided corresponding to the black cell. The second wiring layer is located between the insulating layer and the second encapsulation portion, and the second encapsulation portion covers the second wiring layer, and the second encapsulation portion is used to protect the second wiring layer. In this embodiment, the planar layer also covers the light-emitting side of the second encapsulation portion.

[0031] In some embodiments, the microlens is formed into a truncated cone structure, a spherical structure, or an aspherical structure to provide good light-gathering performance. Exemplarily, the microlens is formed into a truncated cone structure, comprising a first end surface, a side surface, and a second end surface, wherein the first end surface faces the light-emitting layer, the second end surface is disposed opposite the first end surface, and the area of ​​the second end surface is smaller than that of the first end surface.

[0032] In some embodiments, the angle between the side surrounding surface and the first end surface is 30°-80°. For example, the angle between the side surrounding surface and the first end surface is 30°, 45°, 50°, 60°, 75°, or 80°. In this embodiment, the side surrounding surface cooperates with the first end surface to effectively focus light at the edge.

[0033] In some embodiments, the distance between the first end surface and the second end surface is 0.5um-4um, for example, 0.5um, 1um, 2um, 3um or 4um.

[0034] In a second aspect, an embodiment of the present invention provides a method for manufacturing a display panel, the method comprising:

[0035] forming a light-emitting layer, the light-emitting layer including a plurality of sub-pixels spaced apart on a light-emitting surface;

[0036] forming a touch layer, wherein the touch layer is located on the light-emitting side of the light-emitting layer;

[0037] A color filter layer and a plurality of microlenses are formed, wherein the color filter layer is located on the light-emitting side of the touch layer, the color filter layer includes a black matrix and a color resist layer, the orthographic projection of the black matrix on the light-emitting surface is staggered with the sub-pixels, and the orthographic projection of the color resist layer on the light-emitting surface covers the plurality of sub-pixels. The plurality of microlenses are arranged corresponding to the plurality of sub-pixels, and the plurality of microlenses are located between the color resist layer and the touch layer.

[0038] In some embodiments, the forming of the color filter layer and the plurality of micro lenses includes:

[0039] forming the black matrix;

[0040] forming a plurality of micro lenses, wherein the plurality of micro lenses are arranged in the same layer as the black matrix;

[0041] The color resist layer is formed, and the color resist layer abuts against the light-emitting side of the micro lens.

[0042] In some other embodiments, the forming of the color filter layer and the plurality of micro lenses includes:

[0043] forming a plurality of microlenses;

[0044] forming a plurality of first encapsulation parts, wherein the first encapsulation parts are located on the light-emitting side of the insulating layer and cover the second wiring layer;

[0045] forming a black matrix, the black matrix being located on a light-emitting side of the first packaging portion and covering the first packaging portion, and the plurality of microlenses being arranged in the same layer as the black matrix;

[0046] The color resist layer is formed, and the color resist layer abuts against the light-emitting side of the micro lens.

[0047] In some further embodiments, the forming of the color filter layer and the plurality of micro lenses includes:

[0048] forming the black matrix;

[0049] forming a plurality of micro lenses, wherein the plurality of micro lenses are arranged in the same layer as the black matrix;

[0050] forming a flat layer, the flat layer covering the light-emitting side of the microlens and the side of the black matrix facing away from the light-emitting layer;

[0051] The color resist layer is formed, and the color resist layer is located on the light-emitting side of the planar layer.

[0052] Based on the above-mentioned manufacturing method, a display panel with good light extraction efficiency can be manufactured. In this display panel, the light emitted by the sub-pixel passes through the microlens during the process of being emitted outward, which can reduce the total reflection phenomenon that occurs when the light is emitted from the color film layer, so that as much light as possible can be emitted into the environment from the light extraction side of the display panel, thereby improving the light extraction efficiency of the display panel.

[0053] In a third aspect, an embodiment of the present invention provides another method for manufacturing a display panel, the method comprising:

[0054] forming a light-emitting layer, the light-emitting layer including a plurality of sub-pixels spaced apart on a light-emitting surface;

[0055] forming a touch layer, wherein the touch layer is located on the light-emitting side of the light-emitting layer;

[0056] forming a plurality of micro lenses, wherein the plurality of micro lenses are arranged corresponding to the plurality of sub-pixels, and the micro lenses are located on the light-emitting side of the touch layer;

[0057] A color filter layer is formed, and the color filter layer is located on the light-emitting side of the multiple microlenses. The color filter layer includes a black matrix and a color resist layer. The orthographic projection of the black matrix on the light-emitting surface is staggered with the sub-pixels, and the orthographic projection of the color resist layer on the light-emitting surface covers the multiple sub-pixels.

[0058] Based on the above-mentioned manufacturing method, a display panel with good light extraction efficiency can be manufactured. In this display panel, the light emitted by the sub-pixel passes through the microlens during the process of being emitted outward, which can reduce the incident angle of the light when entering the color filter layer, so as to weaken or avoid the total reflection phenomenon of the light when entering and exiting the color filter layer, so that as much light as possible can be emitted into the environment from the light extraction side of the display panel, thereby improving the light extraction efficiency of the display panel.

[0059] In a fourth aspect, embodiments of the present invention provide a display screen module comprising the aforementioned display panel and a flexible circuit board electrically connected to the display panel. The flexible circuit board can be used to provide current to the display panel, and the display panel can be connected to a battery, power supply, or control circuit board via the flexible circuit board. This display screen module has higher light extraction efficiency, making it suitable for outdoor use. It not only provides higher brightness but also saves power consumption, thereby extending the service life of the display screen module.

[0060] In a fifth aspect, an embodiment of the present invention provides an electronic device, which includes a control circuit board and the aforementioned display screen module, wherein the flexible circuit board in the display screen module is connected between the control circuit board and the display panel.

[0061] In some embodiments, the electronic device further includes a back plate, and the display panel is connected to the back plate to together form an outer contour of the electronic device.

[0062] In the electronic device described above, the control circuit board can provide current to the display panel via the flexible circuit board. This electronic device can have higher display light efficiency, which can facilitate the use of the electronic device in outdoor environments or strong light environments. The electronic device can not only have higher brightness but also save power consumption. BRIEF DESCRIPTION OF THE DRAWINGS

[0063] FIG1 is a schematic structural diagram of an electronic device provided by an exemplary implementation of an embodiment of the present invention;

[0064] FIG2 is a schematic diagram of a partial structure of a display panel provided by an exemplary implementation of an embodiment of the present invention;

[0065] FIG3 is a schematic diagram of a partial structure of a display panel provided by another exemplary embodiment of the present invention;

[0066] FIG4 is a schematic diagram of a partial structure of a display panel provided in the first embodiment of the present invention;

[0067] FIG5 is a schematic diagram of a partial structure of a display panel provided in a specific implementation manner of the second embodiment of the present invention;

[0068] FIG6 is a schematic diagram of a partial structure of a display panel provided in another specific implementation manner of the second embodiment of the present invention;

[0069] 7 is a schematic diagram of a partial structure of a display panel provided in a third embodiment of the present invention;

[0070] FIG8 is a schematic diagram of a partial structure of a display panel provided in a fourth embodiment of the present invention;

[0071] FIG9 is a schematic diagram of a partial structure of a display panel provided in a fifth embodiment of the present invention;

[0072] FIG10 is a schematic diagram of a partial structure of a display panel provided in accordance with a sixth embodiment of the present invention.

[0073] Figure numerals: Electronic device-1000; back panel-1001; front camera-1002; flexible circuit board-2; control circuit board-3; display panel-1; light-emitting layer-10; substrate-101; sub-pixel-102; pixel definition layer-103; encapsulation layer-104; first inorganic layer-1041; organic layer-1042; second inorganic layer-1043; touch layer-12; first wiring layer-121; second wiring layer-122; insulating layer-123; color filter layer-13; black matrix-131; black unit-1311; color resist layer-132; color resist unit-1321; microlens-141; first end face-1411; second end face-1412; side surface-1413; first encapsulation part-1421 second encapsulation part-1422; flat layer-15; cover plate-16. DETAILED DESCRIPTION

[0074] To make the objectives, technical solutions and advantages of the present invention more clear, the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.

[0075] In the following, the terms "first," "second," etc., are used for descriptive convenience only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature identified with "first," "second," etc., may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0076] In the embodiments of the present invention, unless otherwise clearly defined or limited, the term “electrical connection” may refer to a direct electrical connection or an indirect electrical connection via an intermediate medium.

[0077] In the embodiments of the present invention, words such as "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present invention should not be construed as being preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner.

[0078] In the embodiments of the present invention, "and / or" describes the association relationship between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A exists alone, A and B exist simultaneously, and B exists alone. A and B can be singular or plural. The character " / " generally indicates that the associated objects are in an "or" relationship.

[0079] In the embodiments of the present invention, directional indications such as up, down, left, right, front, and back, used to explain the structure and movement of different components in the present invention are relative. These indications are appropriate when the components are in the positions shown in the figures. However, if the description of the component position changes, these directional indications will also change accordingly. It should also be noted that in the embodiments of the present invention, the same reference numerals are used to represent the same component or the same part. For the same parts in the embodiments of the present invention, the figure may only mark one of the parts or components as an example. It should be understood that the reference numerals apply to the other identical parts or components.

[0080] An embodiment of the present invention provides an electronic device, which may be a mobile phone, a tablet personal computer, a laptop computer, a personal digital assistant (PDA), a camera, a personal computer, a notebook computer, an in-vehicle device, a wearable device, a watch, augmented reality (AR) glasses, an AR helmet, virtual reality (VR) glasses, or a VR helmet. For example, the electronic device may be a portable electronic device.

[0081] As shown in Figure 1, Figure 1 is a schematic structural diagram of an electronic device 1000 provided in an embodiment of the present invention. In the embodiment shown in Figure 1, the electronic device 1000 is a mobile phone. Exemplarily, the electronic device 1000 may include a display panel 1, which is used to receive electrical signals and optically display information for user viewing. The display panel 1 in the electronic device 100 may be used only for optical display, or the display panel 1 may also be integrated with a touch module, and the user can input information or implement specific functions by performing touch operations on the display panel 1.

[0082] The electronic device 1000 may also include a back shell 1001, a control circuit board 3, a battery (not shown), a camera and other components. For example, the display panel 1 can be combined with the back shell 1001 to jointly form the outer contour of the electronic device 1000. The back shell 1001 can be used to protect the internal electronic components of the electronic device 1000 (such as circuit boards, batteries, etc.). In some embodiments, the back shell 1001 may include a back cover and a middle frame, and the middle frame is fixed to the back cover. For example, the middle frame can be fixedly connected to the back cover by adhesive. The middle frame can also be an integrally molded structure with the back cover, that is, the middle frame and the back cover are an integral structure. The display panel 1 can be connected to the middle frame by, for example, bonding. The aforementioned circuit boards, batteries and other components can be accommodated in the space formed by the display panel 1, the middle frame and the back cover. The circuit board may include a flexible circuit board, a rigid circuit board, etc. Power devices such as chips and controllers may be provided on the circuit board.

[0083] For another example, the electronic device 1000 may further include a front camera 1002, and a camera hole may be provided on the display panel 1, through which the front camera 1002 can obtain image information of the light-emitting side of the display panel 1. In some other examples, the electronic device 1000 may also not include a battery, for example, it may be directly connected to an external power supply. It will be understood that FIG1 only schematically illustrates some components of the electronic device 1000, and the actual shape, actual size, actual position, and actual structure of these components are not limited by FIG1 and the following figures.

[0084] An embodiment of the present invention further provides a display screen module, which may include a display panel 1 and a flexible circuit board 2. The flexible circuit board 2 is electrically connected to the display panel 1 to provide electrical signals to the display panel 1. For example, a first end of the flexible circuit board 2 may be electrically connected to the display panel 1, and the other end of the flexible circuit board 2 may be provided with a connector for connecting to an external controller or power supply to facilitate installation and removal of the display screen module. In an embodiment in which the display screen module is applied to an electronic device 1000, the flexible circuit board 2 of the display screen module may be connected between the display panel 1 and the control circuit board 3 of the electronic device 1000 to facilitate signal transmission.

[0085] The display panel 1 in the embodiment of the present invention can be a flexible display screen or a rigid display screen. Exemplarily, the display panel 1 can be any one of an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini organic light-emitting diode (MID) display screen, a micro organic light-emitting diode (MID) display screen, a micro organic light-emitting diode (MID) display screen, a quantum dot light-emitting diode (QLED) display screen, and a liquid crystal display (LCD).

[0086] In a display panel, external ambient light enters the display panel and is reflected, which will cause the user to be unable to clearly view the content on the display panel. In the related art, a polarizer is usually provided in the display panel to absorb the reflected ambient light. However, since the polarizer is an absorption-type polarizer, the light emitted from the display panel will also be absorbed by the polarizer, thereby reducing the light extraction efficiency of the display panel. In other words, although the polarizer can enable the display panel to achieve visual function under ambient light, it also brings the problem of low light extraction efficiency. In order to solve this problem, the industry has proposed a technology of forming a color filter on a thin film encapsulation structure (color filter on thin film encapsulation, CF on TFE, COE). COE technology is a new technology that can replace polarizers. By making the color filter on the thin film encapsulation (TFE) layer, and utilizing the characteristics of the color filter that transmits specific spectrum light and absorbs other spectrum light, it can achieve the suppression of ambient light, so that the display panel can also clearly show the content in strong light environments such as outdoors. Moreover, compared with the technical solution using polarizers, the color film has a thinner structure, which is conducive to achieving a lighter and thinner display panel and realizing flexible display characteristics.

[0087] Taking the display panel 1 as an OLED display panel as an example, the OLED display panel has many advantages, such as light weight, high contrast, high response speed, flexible and foldable. With the development and upgrading of High Dynamic Range Imaging (HDRI or HDR) technology and the demand for outdoor use scenarios, consumers have increasingly higher demands for the brightness of display products. The current OLED display panel is limited by factors such as the luminous efficiency of the material of the electroluminescence (EL) layer, the external quantum efficiency (EQE) of the OLED display panel, and the gap size of the pixel definition layer (PDL). The brightness of the OLED display panel still has a lot of room for improvement. Among them, due to the surface plasmon polaritons (SPP) loss at the cathode and anode interfaces on both sides of the EL layer, the waveguide loss inside the OLED display panel, and the absorption of the material, the external quantum efficiency EQE of the OLED display panel is less than 20%, which limits the luminous efficiency of the OLED display panel.

[0088] An embodiment of the present invention provides a display panel. Referring to FIG2 , FIG2 illustrates a schematic structural diagram of a display panel provided by an exemplary embodiment of the present invention. It should be noted that FIG2 merely illustrates a schematic partial structural diagram of a display panel cut along its thickness. In actual applications, the display panel 1 may include one or more partial structures as shown in FIG2 . Furthermore, the display panel 1 may also include other structures not shown in the accompanying drawings of the present invention. For example, the display panel 1 may also include an encapsulation frame and a frame adhesive layer, etc., but the present invention does not impose specific limitations on this.

[0089] In the display panel 1 provided in an embodiment of the present invention, as shown in FIG2 , the display panel 1 may include a light-emitting layer 10, a touch layer 12, and a color filter layer 13. The light-emitting layer 10 is provided with a plurality of sub-pixels 102 spaced apart on a light-emitting surface P. It should be noted that the light-emitting surface P here is not a structural surface, but rather a non-structural plane on which the plurality of sub-pixels 102 are coplanarly arranged for ease of understanding. Specifically, the light-emitting surface P may be the plane on which the light-emitting surfaces of the plurality of sub-pixels 102 are located. The touch layer 12 is located on the light-emitting side of the light-emitting layer 10, and the color filter layer 13 is located on the light-emitting side of the touch layer 12. It is understood that the light-emitting side of the display panel 1 refers to the side facing away from the light-emitting layer 10 of the display panel 1 and toward the light-emitting surface of the display panel 1, and the color filter layer 13 is located on the light-emitting side of the touch layer 12, that is, the color filter layer 13 is located on the side of the touch layer 12 away from the light-emitting layer 10. In other words, the touch layer 12 is located between the light-emitting layer 10 and the color filter layer 13.

[0090] In some embodiments, the display panel 1 may further include a cover plate 16, which is located on the light-emitting side of the color filter layer 13 and can provide support and protection for the display panel 1. The cover plate 16 may be a glass cover plate or a flexible film cover plate 16 (e.g., a transparent polyimide cover plate).

[0091] The light-emitting layer 10 specifically includes the relevant structure for realizing light emission in the display panel 1, wherein the sub-pixel 102 refers to a single minimum unit that can realize light emission. For example, the sub-pixel in the OLED display panel can be an organic light-emitting diode (OLED), such as an organic small molecule light-emitting material, a complex light-emitting material, a high molecular polymer, etc. The plurality of sub-pixels 102 can be used to emit light of different colors. As shown in FIG2 , two adjacent sub-pixels 102 in FIG2 can be used to emit light of different colors. Exemplarily, the display panel 1 can adopt a red-green-blue (RGB) color matching mode, that is, the plurality of sub-pixels 102 can include a plurality of red sub-pixels R (capable of emitting red light), a plurality of green sub-pixels G (capable of emitting green light), and a plurality of blue sub-pixels B (capable of emitting blue light) that are distributed at intervals. In other embodiments, the display panel 1 may also adopt a red-green-blue-white (RGBW) color matching mode. The multiple sub-pixels 102 in this embodiment may include red sub-pixels R (capable of emitting red light), green sub-pixels G (capable of emitting green light), blue sub-pixels B (capable of emitting blue light) and white sub-pixels W (capable of emitting white light).

[0092] In addition, the light-emitting layer 10 may also include other structural components. For example, as shown in Figure 2, the light-emitting layer 10 may also include a substrate 101, an anode and a cathode on both sides of the sub-pixel 102 (not shown in the figure), a pixel definition layer (pixel define layer, PDL) 103 and an encapsulation layer 104, etc. The sub-pixels 102 and the pixel definition layer 103 are both arranged on the substrate 101, and the encapsulation layer 104 is located on the light-emitting side of the sub-pixels 102 and the pixel definition layer 103. In some embodiments, the substrate 101 can be made of any material such as glass, ceramic, plastic, metal or rubber, and the present invention is not limited to this. For example, the substrate 101 can be made of a flexible material, such as a polyimide material, so that the substrate 101 can be bent and deformed, and the display panel 1 using the substrate 101 can meet the use requirements of foldable terminal devices (such as foldable mobile phones).

[0093] In some embodiments, the pixel definition layer 103 is made of an opaque material, and a plurality of opening areas are formed therein, and a sub-pixel 102 is provided in each opening area. An anode is provided on the side of the sub-pixel 102 facing the substrate 101, and the anode is also located in the opening area defined by the pixel definition layer. A cathode is provided on the side of the sub-pixel 102 facing away from the substrate 101, and the cathode has at least sufficient light transmittance so that the light emitted by the sub-pixel 102 can be emitted through the cathode. In order to supply power to the light-emitting layer 10, in some embodiments, the light-emitting layer 10 also includes a circuit structure layer (not shown in the figure) located on the substrate 101, such as a pixel circuit and a gate drive circuit. In some embodiments, the encapsulation layer 104 may include a first inorganic layer 1041, an organic layer 1042, and a second inorganic layer 1043.

[0094] The touch layer 12 specifically includes relevant structures for realizing the touch function of the display panel 1. The touch layer 12 in the embodiment of the present invention can realize the touch of the display panel 1 by using mutual capacitance touch technology, or can realize the touch of the display panel 1 by using self-capacitive touch technology. Exemplarily, the touch layer 12 may include an insulating layer 123 and a first wiring layer 121 and a second wiring layer 122 arranged at intervals. The insulating layer 123 may be made of an inorganic insulating material such as silicon nitride and silicon oxide, or may be made of an organic insulating material such as a polymer organic material and a resin material. The insulating layer 123 made of an inorganic insulating material is widely used in display panels due to its lightness and thinness. In some embodiments, the first wiring layer 121 and the second wiring layer 122 can each be a different electrode (for example, one is an Rx electrode and the other is a Tx electrode), and the two electrodes are respectively in two layers. This design can be called a non-bridge touch solution.

[0095] The color filter layer 13 can also be called a color filter on encapsulation (COE), which plays a role in reducing the reflection of external ambient light and allows the display panel 1 to eliminate the polarizer. Therefore, the technology of using the color filter layer 13 to reduce the reflection of ambient light is also called polarizer-free technology. The color filter layer 13 includes a black matrix 131 and a color resist layer 132. The orthographic projection of the black matrix 131 on the light-emitting surface P is staggered with the sub-pixels 102. When light enters the black matrix 131, it is absorbed, while when light enters the gaps in the black matrix 131, it can enter the color resist layer. The orthographic projection of the color resist layer 132 on the light-emitting surface P covers multiple sub-pixels 102. The color resist layer 132 has the characteristic of transmitting light under a specific spectrum and absorbing light in other spectrums. The black matrix 131 and the color resist layer 132 cooperate to realize the function of the color filter layer 13 to reduce the impact of ambient light.

[0096] Exemplarily, the black matrix 131 may include a plurality of black cells 1311 arranged at intervals. The color resist layer 132 may include a plurality of color resist cells 1321 corresponding to the plurality of sub-pixels 102. The color resist cells 1321 are capable of transmitting light emitted by the corresponding sub-pixels 102. Exemplarily, the plurality of sub-pixels 102 include a red sub-pixel 102, a green sub-pixel 102, and a blue sub-pixel 102. The plurality of color resist cells 1321 may include a red color resist cell, a green color resist cell, and a blue color resist cell. The red color resist cell may be located on the light-emitting side of the red sub-pixel 102, the green color resist cell may be located on the light-emitting side of the green sub-pixel 102, and the blue color resist cell may be located on the light-emitting side of the blue sub-pixel 102. Because the color filter layer 13 has high transmittance for the R / G / B spectrum and high absorptivity for other wavelength bands, and the black matrix 131 has an absorbing effect on the spectrum, the display panel 1 using the color filter layer 13 has low reflectivity to ambient light, good contrast, high brightness, and low power consumption. It is understood that adjacent color resist units 1321 may be adjacent to each other. As shown in FIG2 , multiple color resist units 1321 are adjacent to each other to form a color resist layer 132. Alternatively, multiple color resist units 1321 may be arranged at intervals, with adjacent color resist units 1321 separated by black units 1311 or filling structures.

[0097] It's understandable that because not all light emitted by a sub-pixel enters the structural layer above it perpendicularly, some light travels at angles between structural layers composed of different media, where it undergoes refraction or reflection. When the angle of incidence of light at the interface between different dielectric layers exceeds the critical angle for total internal reflection, the light undergoes total internal reflection at the interface. The reflected light then propagates back into the panel and is ultimately absorbed by the material within the panel, preventing it from exiting the light-emitting side of the display panel. This results in low luminous efficiency.

[0098] To address the issue of low luminous efficiency of the display panel 1, in the embodiments provided by the present invention, as shown in Figures 2 and 3 , the display panel 1 further includes a plurality of microlenses 141 arranged corresponding to the plurality of sub-pixels 102. As optical lenses, the microlenses 141 have excellent light-collecting performance. They have a low light absorption rate, which can reduce or prevent total reflection of light within the display panel 1, thereby increasing the transmittance of light exiting the display panel 1 and allowing as much light as possible to enter the environment from the light-exiting side of the display panel 1. This improves the light-exiting efficiency of the display panel 1 and meets the user's demand for high-brightness display panel 1.

[0099] Exemplarily, the microlens 141 can be used to gather the light emitted by its corresponding sub-pixel 102. It should be noted that the microlens 141 gathers the light emitted by its corresponding sub-pixel 102 in that the light emitted by the sub-pixel 102 can be at least partially gathered in the direction of the normal (axis, center line) of the microlens 141 itself when passing through the microlens 141. The present invention does not limit the light emitted by the sub-pixel 102 to pass through the microlens 141. In actual applications, the position of the microlens 141 can be adaptively adjusted according to the light emission path of the sub-pixel 102 to cover the light emission path of the sub-pixel 102 as comprehensively as possible. The display panel 1 gathers the light emitted by its corresponding sub-pixel 102 through the microlens 141, reduces the incident angle of the light in the subsequent propagation process, and enables the light to be more nearly vertically incident on the subsequent structural layer, so as to weaken or avoid the total reflection of the light in the display panel 1.

[0100] The microlenses 141 can be positioned anywhere within the display panel 1. For example, the microlenses 141 can be positioned within the insulating layer 123 of the touch layer 12. The insulating layer 123 can serve to encapsulate and protect the microlenses 141. This solution is suitable for applications where the insulating layer 123 of the touch layer 12 is made of an organic material. In applications where the insulating layer 123 is made of an inorganic material, such as silicon nitride or silicon oxide, positioning the microlenses 141 within the insulating layer 123 is not conducive to forming. Furthermore, the relatively thin insulating layer 123 made of an inorganic insulating material makes it difficult to position the microlenses 141.

[0101] Based on the above considerations, the microlens 141 in this embodiment of the present invention is located between the color resist layer 132 and the touch layer 12. In this solution, the microlens 141 is located on the light-emitting side of the touch layer 12. Since the microlens 141 and the touch layer 12 are formed separately, they are no longer limited by the structure or material of the touch layer 12, thus enabling a wider range of applications. For example, this solution is applicable to embodiments where the insulating layer 123 of the touch layer 12 is made of an organic material, as well as embodiments where the insulating layer 123 of the touch layer 12 is made of an inorganic material (e.g., silicon nitride or silicon oxide).

[0102] Figure 3 shows a schematic diagram of a partial structure of a display panel 1 according to an exemplary embodiment of the present invention. Only the partial structure corresponding to a sub-pixel 102 within the display panel 1 is shown. Arrows in Figure 3 exemplarily illustrate the propagation path of light emitted by sub-pixel 102 to facilitate understanding of the light focusing effect of microlens 141. These arrows do not represent the actual propagation path of light and do not constitute a limitation of the present invention. In practical applications, the display panel 1 may include one or more of the partial structures shown in Figure 3.

[0103] As shown in FIG3 , in the display panel 1 described above, light emitted by the sub-pixel 102 passes through the focusing effect of the microlens 141 during its outward emission process. This deflects the light toward the normal of the microlens 141 itself, thereby reducing the incident angle of the light during subsequent propagation, allowing the light to enter subsequent structural layers more vertically, thereby reducing or preventing total internal reflection of the light within the display panel 1. The microlens is located between the color resist layer 132 and the touch layer 12. This reduces the amount of light that is totally reflected at the air interface from the display panel into the air after the light is focused. The color resist layer 132 can have a higher transmittance, allowing as much light as possible to enter the environment from the light-emitting side of the display panel 1, thereby improving the light extraction efficiency of the display panel 1 and meeting the user's demand for high brightness of the display panel 1. The higher light extraction efficiency of the display panel 1 in this embodiment not only increases the brightness of the display panel 1, but also saves power consumption, thereby increasing the service life of the display panel 1.

[0104] It should be noted that the above embodiment does not limit any position on the microlens 141 to having a focusing effect or having the same focusing effect. For example, as shown in FIG3 , light emitted from the edge of the light exit path of the sub-pixel 102 has a larger incident angle. Based on this, the portion of the microlens 141 located at the edge of the light exit path can be shaped to have a better focusing effect to adjust the angle of the light at the edge of the light exit path and minimize the amount of light that undergoes total internal reflection. The central area of ​​the microlens 141 can have a smaller focusing effect to avoid excessive refraction of light with a smaller incident angle.

[0105] Based on this, in practical applications, the position, material, or shape of the microlens 141 can be adaptively adjusted according to the angle of light at different locations. In some embodiments, the orthographic projection of the microlens 141 on the light-emitting surface P completely covers the corresponding sub-pixel 102, so that the microlens 141 can cover the light exit path of the corresponding sub-pixel 102, thereby improving the focusing effect of the microlens 141. In this embodiment, as shown in Figure 3, the distance b between the edge of the orthographic projection of the microlens 141 on the light-emitting surface P and the edge of the corresponding sub-pixel 102 is 0-3μm. For example, the distance b between the edge of the orthographic projection of the microlens 141 on the light-emitting surface P and the edge of the corresponding sub-pixel 102 can be 1μm, 2μm, or 3μm.

[0106] The microlens 141 can be designed to have a focusing function through material and / or shape. For example, the microlens 141 can be formed as a convex lens. In some embodiments, the microlens 141 can be formed as a boss structure, a spherical structure, or an aspherical structure. The microlens 141 can also be made of a material with a high refractive index. In some embodiments, the refractive index of the microlens 141 can be 1.55 to 1.8 to ensure that the microlens 141 can play a good light focusing role. For example, the refractive index of the microlens 141 can be 1.55, 1.65, 1.7, 1.75 or 1.8. Exemplarily, the microlens 141 can be made of a resin material, or the microlens 141 can be made of a glass material.

[0107] In embodiments where the microlens 141 is formed as a convex cone structure, the microlens 141 can be formed as a truncated cone structure or a frustum structure. As an exemplary embodiment, as shown in FIG4 , the truncated cone structure can include a first end surface 1411, a side surface 1413, and a second end surface 1412. The first end surface 1411 is close to the light-emitting layer 10, the second end surface 1412 is disposed opposite the first end surface 1411, and the area of ​​the first end surface 1411 is larger than the area of ​​the second end surface 1412. Exemplarily, the angle θ between the side surface 1413 and the first end surface 1411 can be 30° to 80°. For example, the angle θ between the side surface 1413 and the first end surface 1411 can be 30°, 45°, 50°, 60°, 75°, or 80°. As shown in FIG3 , in this embodiment, the side surface 1413 and the first end surface 1411 are arranged at a certain angle. The side surface 1413 and the first end surface 1411 cooperate to have good light-gathering performance, so that light can be well gathered when passing through the side surface 1413 of the microlens 141, thereby reducing the probability of total reflection of light.

[0108] In some embodiments, the distance c between the first end surface 1411 and the second end surface 1412 may be 0.5um-4um. For example, the distance c between the first end surface 1411 and the second end surface 1412 may be 0.5um, 1um, 2um, 3um or 4um.

[0109] The microlens 141 is located between the color filter layer 132 and the touch layer 12. The color filter layer 132 is located on the light-emitting side of the microlens 141. The positional relationship between the microlens 141 and the black matrix 131 is not limited. In some embodiments, the microlens 141 can be disposed within the color filter layer 13. For example, the microlens 141 can be arranged on the same layer as the black matrix 131. Alternatively, the microlens 141 can be located between the black matrix 131 and the color filter layer 132. In other embodiments, both the black matrix 131 and the color filter layer 132 can be located on the light-emitting side of the microlens 141.

[0110] Taking the arrangement of the microlens 141 and the black matrix 131 in the same layer as an example, the microlens 141 and the black matrix 131 can be located in the same plane. For example, the black matrix 131 and the microlens 141 can both be formed on the light-emitting surface of the touch layer 12. Exemplarily, as shown in Figures 3 and 4, the black matrix 131 includes a plurality of black units 1311 arranged at intervals, and the microlens 141 is located in the gaps between adjacent black units 1311. The black unit 1311 can absorb light of all spectra, and the light emitted by the sub-pixel 102 can be emitted through the gaps between adjacent black units 1311. By distributing the microlens 141 in the gaps between the plurality of black units 1311, the microlens 141 can cover the light emission path of the sub-pixel 102, thereby focusing the light emitted by the sub-pixel 102, increasing the amount of light entering the color resist layer 132, and improving the light extraction efficiency.

[0111] In the above embodiment, as shown in Figure 4, in some embodiments, the distance a between the orthographic projection of the black unit 1311 on the light-emitting surface P and the sub-pixel 102 closest to it can be 3um to 7um, for example, 4um, 5um or 6um. Based on this, there is sufficient gap between adjacent black units 1311, which is beneficial for the passage of light emitted by the sub-pixel 102 and the arrangement of the microlens 141.

[0112] In practical applications, since the microlens may have an uneven structural surface, it is usually necessary to set a packaging structure on the light-input side and / or the light-output side of the microlens. The packaging structure will also introduce a new dielectric interface, increasing the risk of total reflection of light between the packaging structure and the microlens. Based on this, in some embodiments, as shown in Figures 3 and 4, the side of the microlens 141 facing the light-emitting layer 10 abuts against the touch layer 12, and the light-output side of the microlens 141 abuts against the color resist layer 132. By directly abutting the color resist layer 132 against the light-output side of the microlens 141, the color resist layer 132 can play a packaging and protective role for the microlens 141, so that the light-output side of the microlens 141 does not need to be provided with other packaging structures. In this way, the internal structure of the display panel 1 can be simplified, and the risk of total reflection of light between the packaging structure and the microlens caused by the introduction of other packaging structures can be avoided, thereby ensuring light extraction efficiency.

[0113] 4 , the color resist layer 132 not only covers the light-emitting side of the microlenses 141, but also covers the gaps between adjacent black cells 1311. Compared to the portion of the color resist layer 132 not in contact with the microlenses 141, the portion of the color resist layer 132 located on the light-emitting side of the microlenses 141 has a smaller thickness. Light emitted from the microlenses 141 passes through the color resist layer 132 having a smaller thickness, thereby reducing the light absorption rate of the color resist layer 132. This allows the color resist layer 132 to have a higher light transmittance, thereby improving the light extraction efficiency of the display panel 1.

[0114] In some embodiments, the color resist layer 132 also covers the side of the black matrix 131 facing away from the light-emitting layer 10, thereby simultaneously encapsulating and protecting the black matrix 131 and the microlenses 141. The color resist layer 132 can flatten (or level) the side of the black matrix 131 facing away from the light-emitting layer 10 and the light-emitting side of the microlenses 141, facilitating the arrangement of external structures (e.g., the cover 16). In other embodiments, the side of the black cells 1311 facing away from the light-emitting layer 10 can be higher than the light-emitting side of the microlenses 141. The color resist layer 132 can fill the gaps between adjacent black cells 1311, and the light-emitting side of the color resist layer 132 can be flush with the side of the black cells 1311 facing away from the light-emitting layer 10, thereby flattening the light-emitting side of the color filter layer 13.

[0115] In some embodiments, the refractive index of microlens 141 is greater than that of color resist layer 132. The greater refractive index of microlens 141 ensures good light focusing. For example, the refractive index of microlens 141 can be 1.55 to 1.8, for example, 1.60, 1.75, or 1.8, to ensure good light focusing. For example, the refractive index of color resist layer 132 can be 1.45 to 1.65, for example, 1.5, 1.55, or 1.6.

[0116] In some embodiments, the touch layer 12 includes an insulating layer 123, a first wiring layer 121, and a second wiring layer 122 spaced apart from each other. The microlens 141 is located between the insulating layer 123 and the color filter layer 13, and the side of the microlens 141 facing the light-emitting layer 10 abuts against the insulating layer 123. For example, the first wiring layer 121 and the second wiring layer 122 can each be a different electrode (for example, one is an Rx electrode and the other is a Tx electrode), with the two electrodes located in two layers. The insulating layer 123 can be used to provide insulation between the first wiring layer 121 and the second wiring layer 122.

[0117] In some embodiments, the first wiring layer 121 may be located inside the insulating layer 123 , and the insulating layer 123 may serve as an insulating package for the first wiring layer 121 . The second wiring layer 122 may be located on the light-emitting side of the insulating layer 123 .

[0118] In order to achieve the encapsulation of the second wiring layer 122, the second wiring layer 122 can be encapsulated using the structural layer of the display panel 1, or a new encapsulation structure can be added. As an exemplary embodiment, as shown in FIG4 , the black matrix 131 is located on the light-emitting side of the insulating layer 123 and covers the second wiring layer 122. The black matrix 131 is used to achieve encapsulation protection of the second wiring layer 122. There is no need to add a new structural layer in the display panel 1, which can simplify the internal structure of the display panel 1 and reduce the risk of reduced light extraction efficiency due to the increase in structural layers. Exemplarily, the black matrix 131 can be made of an insulating material, such as a black resin material.

[0119] As another exemplary embodiment, as shown in FIG5 , the display panel 1 may include a first encapsulation portion 1421 , which is located on the light-exiting side of the insulating layer 123 and covers the second wiring layer 122 . The black matrix 131 is located on the light-exiting side of the first encapsulation portion 1421 and covers the first encapsulation portion 1421 . In this embodiment, the first encapsulation portion 1421 covers the second wiring layer 122 to provide protection, ensuring that the touch layer 12 has stable and good touch functionality. Furthermore, because the black matrix 131 covers the first encapsulation portion 1421 , the first encapsulation portion 1421 is located away from the light-exiting optical path, and thus has minimal impact on the light-exiting efficiency of the display panel 1 .

[0120] In some embodiments, the thickness of the first encapsulation portion 1421 may be smaller than the thickness of the microlens 141 to reduce the impact on the thickness of the display panel 1 .

[0121] Exemplarily, referring to FIG. 5 , the black unit 1311 covers the first encapsulation portion 1421 , and the side of the black unit 1311 facing away from the light emitting layer 10 may be located in the same plane as the light emitting side of the microlens 141 .

[0122] In other embodiments, as shown in Figure 6, the thickness of the first packaging portion 1421 can be the same as the thickness of the microlens 141, that is, the side of the first packaging portion 1421 facing away from the light-emitting layer 10 can be flush with the light-emitting side of the microlens 141. In the embodiment where the microlens 141 includes a second end surface 1412, the side of the first packaging portion 1421 facing away from the light-emitting layer 10 can be flush with the second end surface 1412.

[0123] As shown in FIG7 , as an optional embodiment, the display panel 1 may include a planar layer 15 that covers at least the light-exiting side of the microlens 141, with the color resist layer 132 located on the light-exiting side of the planar layer 15. The planar layer 15 in this embodiment is used to flatten (or level) the side of the black matrix 131 facing away from the light-exiting side and the light-exiting side of the microlens 141. The light-exiting side of the planar layer 15 has a flat surface, which facilitates the formation and arrangement of the color resist layer 132. Furthermore, in this embodiment, only one planar layer 15 is introduced to simultaneously encapsulate and protect the microlens 141 and the black matrix 131, eliminating the need to provide separate encapsulation structures for the microlens 141 and the black matrix 131. This reduces the number of encapsulation structures provided within the display panel and mitigates the problem of increased reflectivity.

[0124] In some embodiments, the flat layer 15 can be made of a material with high light transmittance to reduce the light absorption rate of the flat layer 15. Exemplarily, the flat layer 15 can be made of materials such as acrylic resin, epoxy resin, phenolic resin, polyurethane, polyamide resin, polyimide resin, or unsaturated polyester. Exemplarily, the refractive index of the microlens 141 is greater than the refractive index of the flat layer 15. The larger refractive index of the microlens 141 can ensure that it has a good light focusing effect. Exemplarily, the refractive index of the flat layer 15 can be 1.45 to 1.65. For example, the refractive index of the flat layer 15 can be 1.5, 1.55, or 1.6.

[0125] 8 to 10 , in some embodiments, the microlenses 141 may also be located between the color filter layer 13 and the touch layer 12, that is, the black matrix 131 and the color resist layer 132 are both located on the light-emitting side of the microlenses 141. In conjunction with an embodiment in which the display panel 1 includes a planar layer 15, illustratively, the side of the microlenses 141 facing the light-emitting layer 10 abuts against the touch layer 12, the planar layer 15 also covers the light-emitting side of the touch layer 12, and the black matrix 131 and the color resist layer 132 are both located on the light-emitting side of the planar layer 15. The planar layer 15 can cover the touch layer 12 and the light-emitting side of the microlenses 141, thereby flattening (or leveling) the light-emitting side of the touch layer 12 and the light-emitting side of the microlenses 141, thereby facilitating the formation of the color filter layer 13.

[0126] Because the light emitted by the sub-pixel 102 is concentrated by the microlens 141 after exiting the touch layer 12, the concentrated light is more likely to pass through the gaps within the black matrix 131 and enter the color resist layer 132, thereby improving the light transmission rate in the black matrix 131. Because the concentrated light has a smaller incident angle, the reflectivity of the light on the incident surface of the color resist layer 132 is reduced, thereby increasing the light transmission rate into the color filter layer 13 and the light output rate from the color filter layer 13, thereby improving the luminous efficiency of the display panel 1.

[0127] In the aforementioned embodiment where the microlenses 141 are located between the black matrix 131 and the touch layer 12, the planarization layer 15 can simultaneously cover the microlenses 141 and the light-exiting side of the insulating layer 123. The planarization layer 15 not only serves as a leveling function but also provides encapsulation and protection for the touch layer 12, thereby improving the functional stability of the touch layer 12. The following describes three specific implementations for the layout of the touch layer 12, based on the specific structure of the touch layer 12. The touch layer 12 includes a first wiring layer 121, a second wiring layer 122, and an insulating layer 123, with the first wiring layer located within the insulating layer 123.

[0128] 8 , as an exemplary embodiment, the second wiring layer 122 may be located between the insulating layer 123 and the planar layer 15. The planar layer 15 covers the second wiring layer 122 to protect the second wiring layer 122. For example, the planar layer 15 may be made of an insulating material.

[0129] As shown in FIG9 , as another exemplary embodiment, the display panel 1 may further include a second encapsulation portion 1422 corresponding to the black cells 1311. The second wiring layer 122 is located between the insulating layer 123 and the second encapsulation portion 1422. The second encapsulation portion 1422 covers the second wiring layer 122. The second encapsulation portion 1422 can protect the second wiring layer 122.

[0130] As shown in FIG10 , as another exemplary embodiment, the first wiring layer 121 is located within the insulating layer 123, and the second wiring layer 122 is located on the side of the planar layer 15 facing away from the light-emitting layer 10. The second wiring layer 122 can be located between the planar layer 15 and the black unit 1311, that is, the black unit 1311 covers the second wiring layer 122. Here, the black unit 1311 can provide encapsulation and protection for the second wiring layer 122. For example, the black unit 1311 can be made of an insulating material.

[0131] For ease of understanding, six specific embodiments of the present invention are described below with reference to the accompanying drawings.

[0132] The first embodiment provided by the present invention is shown in FIG4 , which exemplarily shows a structural diagram of a display panel 1 provided by the first embodiment of the present invention.

[0133] In the first embodiment, the display panel 1 includes a light-emitting layer 10, a touch layer 12, and a color filter layer 13, which are arranged in sequence. The touch layer 12 includes an insulating layer 123, a first wiring layer 121, and a second wiring layer 122, which are spaced apart. The first wiring layer 121 is located within the insulating layer 123, and the second wiring layer 122 is located between the insulating layer 123 and the black cells 1311 of the color filter layer 13. The black cells 1311 directly cover the second wiring layer 122 to encapsulate and protect the second wiring layer 122, thereby reducing the packaging structure within the display panel. In the color filter layer 13, microlenses 141 are distributed in the gaps between the multiple black cells 1311. The color resist cells 1321 directly cover the light-emitting side of the microlenses 141 to provide packaging and protection for the microlenses 141. This eliminates the need to introduce a packaging structure for the microlenses 141, thereby avoiding the risk of increased total reflection caused by the introduction of a packaging structure. The color resist layer 132 also covers the gaps between the black cells 1311. Compared to the position where the color resist layer 132 does not contact the microlens 141, the color resist layer 132 has a smaller thickness at the contact portion with the microlens 141. Light emitted from the microlens 141 passes through the color resist layer 132 with a smaller thickness, and the reflectivity of the light is reduced, so the light has a higher transmission rate in the color filter layer 13.

[0134] Based on the first embodiment, the present invention provides a method for manufacturing a display panel 1, which may include:

[0135] A light emitting layer 10 is formed, and the light emitting layer 10 includes a plurality of sub-pixels 102 arranged at intervals on a light emitting surface P.

[0136] A touch layer 12 is formed and located on the light-emitting side of the light-emitting layer 10 .

[0137] A color filter layer 13 and a plurality of microlenses 141 are formed. The color filter layer 13 is located on the light-emitting side of the touch layer 12. The color filter layer 13 includes a black matrix 131 and a color resist layer 132. The orthographic projection of the black matrix 131 on the light-emitting surface P is staggered with the sub-pixels 102. The orthographic projection of the color resist layer 132 on the light-emitting surface P covers the multiple sub-pixels 102. The multiple microlenses 141 are arranged corresponding to the multiple sub-pixels 102.

[0138] Exemplarily, forming the color filter layer 13 and the plurality of micro lenses 141 may include:

[0139] A black matrix 131 is formed. The black matrix 131 includes a plurality of black units 1311 arranged at intervals. The orthographic projections of the plurality of black units 1311 on the light-emitting surface P are staggered with the sub-pixels 102 .

[0140] Micro lenses 141 are formed and distributed in the gaps between the plurality of black units 1311 .

[0141] A color-resist layer 132 is formed, and the light-emitting side of the micro-lens 141 abuts against the color-resist layer 132 .

[0142] Based on the above manufacturing method, the production process for the color filter layer 13 and the plurality of microlenses 141 can be as follows: a black matrix 131 is formed on the touch layer 12 through coating and photolithography processes. Then, microlenses 141 are formed on the touch layer 12 through a yellow photolithography process, i.e., through coating, soft baking, exposure, development, and hard baking, the microlenses 131 are photolithographically formed. Finally, a yellow photolithography process is used to form the color resist layer 132. Specifically, a color resist unit (e.g., red color resist unit) can be formed by coating photoresist (e.g., applying red photoresist first), followed by exposure, development, and baking, followed by sequential production of green and blue color resist units.

[0143] The second embodiment provided by the present invention is shown in Figures 5 and 6. Figure 5 exemplarily shows a structural schematic diagram of a display panel 1 provided by a specific implementation of the second embodiment of the present invention, and Figure 6 exemplarily shows a structural schematic diagram of a display panel 1 provided by another specific implementation of the second embodiment of the present invention.

[0144] In the second embodiment, the display panel 1 further includes a first encapsulation portion 1421. In the touch layer 12, the first wiring layer 121 is located inside the insulating layer 123, the second wiring layer 122 is located between the insulating layer 123 and the first encapsulation portion 1421, and the first encapsulation portion 1421 covers the second wiring layer 122. The color filter layer 13 is located on the light-emitting side of the touch layer 12, and the black cells 1311 cover the first encapsulation portion 1421. Because the first encapsulation portion 1421 encapsulates and protects the second wiring layer 122, the functional stability of the touch layer 12 can be improved. Moreover, the first encapsulation portion 1421 is arranged between the black cells 1311 and the insulating layer 123 and is not disposed on the light-emitting optical path, and thus has a low impact on light-extraction efficiency.

[0145] Based on the second embodiment, the present invention provides a method for manufacturing a display panel 1, which may include:

[0146] A light emitting layer 10 is formed, and the light emitting layer 10 includes a plurality of sub-pixels 102 arranged at intervals on a light emitting surface P.

[0147] A touch layer 12 is formed and located on the light-emitting side of the light-emitting layer 10 .

[0148] A color filter layer 13 and a plurality of microlenses 141 are formed. The color filter layer 13 is located on the light-emitting side of the touch layer 12. The color filter layer 13 includes a black matrix 131 and a color resist layer 132. The orthographic projection of the black matrix 131 on the light-emitting surface P is staggered with the sub-pixels 102. The orthographic projection of the color resist layer 132 on the light-emitting surface P covers the multiple sub-pixels 102. The multiple microlenses 141 are arranged corresponding to the multiple sub-pixels 102.

[0149] Exemplarily, forming the color filter layer 13 and the plurality of micro lenses 141 may include:

[0150] A microlens 141 and a first packaging portion 1421 are formed. The microlens 141 is located on the light-emitting side of the touch layer 12 . The first packaging portion 1421 is located on the light-emitting side of the touch layer 12 and covers the second wiring layer 122 .

[0151] A black matrix 131 is formed. The black matrix 131 includes a plurality of black units 1311 arranged at intervals. The orthographic projections of the plurality of black units 1311 on the light-emitting surface P are staggered with the sub-pixels 102 . The black units 1311 cover the first encapsulation portion 1421 .

[0152] A color-resist layer 132 is formed, and the light-emitting side of the micro-lens 141 abuts against the color-resist layer 132 .

[0153] Based on the above manufacturing method, the production process of the color filter layer 13 and the plurality of microlenses 141 can be as follows: Microlenses 141 and the first encapsulation portion 1421 are simultaneously formed on the touch layer 12 using a yellow light process. Specifically, the microlenses 131 and the first encapsulation portion 1421 are photolithographically formed through a process of coating, soft baking, exposure, development, and hard baking. The black matrix 131 is then formed on the touch layer 12 through coating and photolithography. Finally, the color resist layer 132 is formed using a yellow light process. Specifically, the process can be performed by coating photoresist (for example, applying red photoresist first), exposing, developing, and baking to form color resist units (for example, red color resist units), followed by sequentially forming green and blue color resist units.

[0154] The third embodiment provided by the present invention is shown in FIG7 , which exemplarily shows a structural diagram of a display panel 1 provided by the third embodiment of the present invention.

[0155] In the third embodiment, the display panel 1 includes a planarization layer 15. The touch layer 12 is located on the light-emitting side of the light-emitting layer 10. The first wiring layer 121 is located within the insulating layer 123. The second wiring layer 122 is located between the insulating layer 123 and the black cells 1311. The black cells 1311 cover the second wiring layer 122. The color filter layer 13 is located on the light-emitting side of the touch layer 12. The microlenses 141 are distributed in the gaps between the multiple black cells 1311. The planarization layer 15 covers the light-emitting side of the microlenses 141 and the side of the black matrix 131 facing away from the light-emitting layer 10. The color resist layer 132 is located on the light-emitting side of the planarization layer 15. In this embodiment, the planarization layer 15 can be used to planarize the side of the black matrix 131 facing away from the light-emitting layer 10 and the light-emitting side of the microlenses 141, so as to facilitate the formation of the color resist layer 132 on the light-emitting side of the planarization layer 15.

[0156] Based on the third embodiment, the present invention provides a method for manufacturing a display panel 1, which may include:

[0157] A light emitting layer 10 is formed, and the light emitting layer 10 includes a plurality of sub-pixels 102 arranged at intervals on a light emitting surface P.

[0158] A touch layer 12 is formed and located on the light-emitting side of the light-emitting layer 10 .

[0159] A color filter layer 13 and a plurality of microlenses 141 are formed. The color filter layer 13 is located on the light-emitting side of the touch layer 12. The color filter layer 13 includes a black matrix 131 and a color resist layer 132. The orthographic projection of the black matrix 131 on the light-emitting surface P is staggered with the sub-pixels 102. The orthographic projection of the color resist layer 132 on the light-emitting surface P covers the multiple sub-pixels 102. The multiple microlenses 141 are arranged corresponding to the multiple sub-pixels 102.

[0160] Exemplarily, forming the color filter layer 13 and the plurality of micro lenses 141 may include:

[0161] A black matrix 131 is formed. The black matrix 131 includes a plurality of black units 1311 arranged at intervals. The orthographic projections of the plurality of black units 1311 on the light-emitting surface P are staggered with the sub-pixels 102 .

[0162] A plurality of micro lenses 141 are formed, and the micro lenses 141 are distributed in the gaps between the plurality of black units 1311 .

[0163] A planar layer 15 is formed, and the planar layer 15 covers the side of the black matrix 131 facing away from the light emitting layer 10 and the light emitting side of the micro lens 141 .

[0164] A color resist layer 132 is formed. The color resist layer 132 is located on the light-emitting side of the planar layer 15 .

[0165] Based on the above manufacturing method, the production process of the color filter layer 13 and the plurality of microlenses 141 can be as follows: a black matrix 131 is formed on the touch layer 12 through coating and photolithography processes. Microlenses 141 are formed on the touch layer 12 through a yellow photolithography process, that is, through coating, soft baking, exposure, development, and hard baking, the microlenses 131 are photolithographically formed. A planarization layer 15 is coated on the black matrix 131 and microlenses 141. A color resist layer 132 is formed on the planarization layer 15 through a yellow photolithography process. Specifically, a photoresist is applied (for example, red photoresist is applied first), followed by exposure, development, and baking to form color resist units (for example, red color resist units), followed by green and blue color resist units.

[0166] A fourth embodiment of the present invention is shown in FIG8 , which exemplarily shows a schematic structural diagram of a display panel 1 provided in the fourth embodiment of the present invention.

[0167] In the fourth embodiment, the display panel 1 includes a planar layer 15. The touch layer 12 is located on the light-emitting side of the light-emitting layer 10, and a plurality of microlenses 141 are located on the light-emitting side of the touch layer 12. The planar layer 15 covers the touch layer 12 and the light-emitting sides of the microlenses 141, and also covers the second wiring layer 122. The color filter layer 13 is located on the light-emitting side of the planar layer 15. In this embodiment, the planar layer 15 can be used to flatten (or level) the light-emitting side of the touch layer 12 and the light-emitting side of the microlenses 141, thereby facilitating the formation of the color filter layer 13 on the light-emitting side of the planar layer 15. The planar layer 15 covers the second wiring layer 122 and also protects the second wiring layer 122.

[0168] Based on the fourth embodiment, an embodiment of the present invention provides a method for manufacturing a display panel 1, which may include:

[0169] A light emitting layer 10 is formed, and the light emitting layer 10 includes a plurality of sub-pixels 102 arranged at intervals on a light emitting surface P.

[0170] A touch layer 12 is formed and located on the light-emitting side of the light-emitting layer 10 .

[0171] A plurality of micro lenses 141 are formed, and the plurality of micro lenses 141 are arranged corresponding to the plurality of sub-pixels 102 .

[0172] A color filter layer 13 is formed. The color filter layer 13 is located on the light-emitting side of the multiple microlenses 141. The color filter layer 13 includes a black matrix 131 and a color resist layer 132. The orthographic projection of the black matrix 131 on the light-emitting surface P is staggered with the sub-pixels 102, and the orthographic projection of the color resist layer 132 on the light-emitting surface P covers the multiple sub-pixels 102.

[0173] Specifically, forming the touch layer 12 includes forming an insulating layer 123 , a first wiring layer 121 and a second wiring layer 122 spaced apart from each other. The first wiring layer 121 is located inside the insulating layer 123 , and the second wiring layer 122 is located on the light-emitting side of the insulating layer 123 .

[0174] Specifically, after forming the plurality of micro lenses 141 and before forming the color filter layer 13, the preparation method further includes:

[0175] A planarization layer 15 is formed to cover the insulating layer 123 and the light-emitting side of the microlens 141 . The planarization layer 15 also covers the second wiring layer 122 .

[0176] Based on the above manufacturing method, the production process of the plurality of microlenses 141 and the planar layer 15 can be as follows: Microlenses 141 are formed on the touch layer 12 using a yellow light process, that is, through coating, soft baking, exposure, development, and hard baking, and then the microlenses 131 are photoetched. The planar layer 15 is then coated on the touch layer 12 and microlenses 131.

[0177] A fifth embodiment of the present invention is shown in FIG9 , which exemplarily shows a schematic structural diagram of a display panel 1 provided in the fifth embodiment of the present invention.

[0178] In the fifth embodiment, the display panel 1 includes a second encapsulation portion 1422 and a planar layer 15. The touch layer 12 is located on the light-emitting side of the light-emitting layer 10. The microlenses 141 and the second encapsulation portion 1422 are both located on the light-emitting side of the insulating layer 123, and the second encapsulation portion 1422 covers the second wiring layer 122. The planar layer 15 covers the touch layer 12, the microlenses 141, and the light-emitting side of the second encapsulation portion 1422. The color filter layer 13 is located on the light-emitting side of the planar layer 15. In the fifth embodiment, light focused by the microlenses 141 can enter the color filter layer 13 at a smaller incident angle, and its reflectivity between the planar layer 15 and the color filter layer 13 can also be reduced. The flat layer 15 can be used to flatten (or level) the light-emitting side of the touch layer 12, the microlens 141, and the light-emitting side of the second packaging part 1422, so as to facilitate the formation of the color filter layer 13 on the light-emitting side of the flat layer 15, and the second packaging part 1422 can cover the second wiring layer 122 to protect the second wiring layer 122.

[0179] Based on the fifth embodiment, an embodiment of the present invention provides a method for manufacturing a display panel 1, which may include:

[0180] A light emitting layer 10 is formed, and the light emitting layer 10 includes a plurality of sub-pixels 102 arranged at intervals on a light emitting surface P.

[0181] A touch layer 12 and a plurality of micro lenses 141 are formed. The touch layer 12 is located on the light-emitting side of the light-emitting layer 10 .

[0182] A plurality of micro lenses 141 are formed, and the plurality of micro lenses 141 are arranged corresponding to the plurality of sub-pixels 102 .

[0183] A color filter layer 13 is formed. The color filter layer 13 is located on the light-emitting side of the multiple microlenses 141. The color filter layer 13 includes a black matrix 131 and a color resist layer 132. The orthographic projection of the black matrix 131 on the light-emitting surface P is staggered with the sub-pixels 102, and the orthographic projection of the color resist layer 132 on the light-emitting surface P covers the multiple sub-pixels 102.

[0184] Specifically, forming the touch layer 12 includes forming an insulating layer 123 , a first wiring layer 121 and a second wiring layer 122 spaced apart from each other. The first wiring layer 121 is located inside the insulating layer 123 , and the second wiring layer 122 is located on the light-emitting side of the insulating layer 123 .

[0185] Specifically, forming multiple microlenses 141 also includes: forming microlenses 141 and a second packaging part 1422, the side of the microlens 141 close to the light-emitting layer 10 abuts against the insulating layer 123, the side of the second packaging part 1422 close to the light-emitting layer 10 abuts against the insulating layer 123, and the second packaging part 1422 covers the second wiring layer 122.

[0186] After forming the plurality of microlenses 141 , the manufacturing method further includes forming a planar layer 15 , where the planar layer 15 covers the insulating layer 123 , the microlenses 141 and the light-emitting side of the second packaging portion 1422 .

[0187] Based on the above manufacturing method, the production process of the plurality of microlenses 141 can be as follows: Microlenses 141 and second encapsulation portion 1422 are formed on the touch layer 12 using a yellow light process, that is, through resist coating, soft baking, exposure, development, and hard baking, the microlenses 131 and second encapsulation portion 1422 are photoetched. A planarization layer 15 is then applied on the touch layer 12, microlenses 131, and second encapsulation portion 1422.

[0188] A sixth embodiment of the present invention is shown in FIG10 , which exemplarily shows a schematic structural diagram of a display panel 1 provided in the sixth embodiment of the present invention.

[0189] In the sixth embodiment, the display panel 1 includes a second packaging portion 1422. A plurality of microlenses 141 are located on the light-emitting side of the touch layer 12, and the planar layer 15 covers the touch layer 12 and the light-emitting side of the microlenses 141. The color filter layer 13 is located on the light-emitting side of the planar layer 15. The first wiring layer 121 is located inside the insulating layer 123, and the second wiring layer 122 is located between the planar layer 15 and the black cells 1311, which cover the second wiring layer 122. In the sixth embodiment, light that has been focused by the microlenses 141 can enter the color filter layer 13 at a smaller incident angle, and the reflectivity of the light between the planar layer 15 and the color filter layer 13 can also be reduced. The flat layer 15 can be used to flatten (or level) the light-emitting side of the touch layer 12 and the light-emitting side of the microlens 141 to facilitate the formation of the color filter layer 13 on the light-emitting side of the flat layer 15. The second wiring layer 122 is located between the flat layer 15 and the black unit 1311. The black unit 1311 can protect the second wiring layer 122.

[0190] Based on the sixth embodiment, the present invention provides a method for manufacturing a display panel 1, which may include:

[0191] A light emitting layer 10 is formed, and the light emitting layer 10 includes a plurality of sub-pixels 102 arranged at intervals on a light emitting surface P.

[0192] A touch layer 12 and a plurality of micro lenses 141 are formed. The touch layer 12 is located on the light-emitting side of the light-emitting layer 10 . The plurality of micro lenses 141 are arranged corresponding to the plurality of sub-pixels 102 .

[0193] A color filter layer 13 is formed. The color filter layer 13 is located on the light-emitting side of the multiple microlenses 141. The color filter layer 13 includes a black matrix 131 and a color resist layer 132. The orthographic projection of the black matrix 131 on the light-emitting surface P is staggered with the sub-pixels 102, and the orthographic projection of the color resist layer 132 on the light-emitting surface P covers the multiple sub-pixels 102.

[0194] Specifically, forming the touch layer 12 and the plurality of micro lenses 141 includes:

[0195] An insulating layer 123 and a first wiring layer 121 are formed. The first wiring layer 121 is located inside the insulating layer 123 , and the second wiring layer 122 is located on the light-emitting side of the insulating layer 123 .

[0196] A microlens 141 is formed, and a side of the microlens 141 close to the light emitting layer 10 is in contact with the insulating layer 123 .

[0197] A planarization layer 15 is formed, and the planarization layer 15 covers the insulating layer 123 and the light-emitting side of the microlens 141 .

[0198] A second wiring layer 122 is formed and is located on the light-emitting side of the planar layer 15 .

[0199] Based on the above manufacturing method, the fabrication process for the touch layer 12, the plurality of microlenses 141, and the color filter layer 13 can be as follows: an insulating layer 123 and a first wiring layer 121 located within the insulating layer 123 are formed above the light-emitting layer 10. Microlenses 141 are formed on the insulating layer 123 using a yellow photolithography process, i.e., by applying a resin, soft baking, exposure, development, and hard baking, thereby photolithographically forming microlenses 131. A planarization layer 15 is applied on the insulating layer 123 and the microlenses 131. A second wiring layer 122 is formed on the planarization layer 15. A black matrix 131 is formed on the planarization layer 15 using a coating and photolithography process, with the black matrix 131 covering the second wiring layer 122. A color resist layer 132 is formed on the black matrix 131 using a yellow photolithography process. Specifically, a photoresist is applied (for example, red photoresist is applied first), followed by exposure, development, and baking to form color resist cells (for example, red color resist cells), followed by sequentially forming green and blue color resist cells.

[0200] The above are only some of the embodiments and implementations of the present invention, and the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this invention should be included in the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. A display panel, characterized in that: include: A light-emitting layer (10) comprising a plurality of sub-pixels (102) arranged at intervals on a light-emitting surface; A touch layer (12) is located on the light-emitting side of the light-emitting layer (10); a color filter layer (13) located on the light-emitting side of the touch layer (12), the color filter layer (13) comprising a black matrix (131) and a color resist layer (132), the orthographic projection of the black matrix (131) on the light-emitting surface being staggered with the plurality of sub-pixels (102), and the orthographic projection of the color resist layer (132) on the light-emitting surface covering the plurality of sub-pixels (102); A plurality of micro lenses (141) are located between the color resist layer (132) and the touch layer (12), and the plurality of micro lenses (141) are arranged corresponding to the plurality of sub-pixels (102).

2. The display panel according to claim 1, wherein: The plurality of micro lenses (141) are arranged in the same layer as the black matrix (131).

3. The display panel according to claim 2, wherein: The black matrix (131) includes a plurality of black units (1311) arranged at intervals, and the microlenses (141) are located in gaps between adjacent black units (1311).

4. The display panel according to any one of claims 1 to 3, wherein: The side of the microlens (141) facing the light-emitting layer (10) abuts against the touch layer (12), and the light-emitting side of the microlens (141) abuts against the color-resistance layer (132).

5. The display panel according to any one of claims 1 to 4, characterized in that: The touch control layer (12) comprises an insulating layer (123), a first wiring layer (121) and a second wiring layer (122) arranged at intervals, the first wiring layer (121) being located inside the insulating layer (123), the second wiring layer (122) being located on the light-emitting side of the insulating layer (123), and the side of the microlens (141) facing the light-emitting layer (10) being in contact with the light-emitting side of the insulating layer (123).

6. The display panel according to claim 5, wherein: The black matrix (131) is located on the light-emitting side of the insulating layer (123) and covers the second wiring layer (122).

7. The display panel according to claim 5, wherein: The display panel (1) further comprises a first encapsulation portion (1421), the first encapsulation portion (1421) being located on the light-emitting side of the insulating layer (123) and covering the second wiring layer (122), and the black matrix (131) being located on the light-emitting side of the first encapsulation portion (1421) and covering the first encapsulation portion (1421).

8. The display panel according to any one of claims 1 to 7, characterized in that: The side of the microlens (141) facing the light-emitting layer (10) abuts against the touch layer (12); the display panel (1) further comprises a flat layer (15); the flat layer (15) covers the light-emitting side of the microlens (141); and the color resist layer (132) is located on the light-emitting side of the flat layer (15).

9. The display panel according to claim 8, wherein: The flat layer (15) also covers the side of the black matrix (131) facing away from the light-emitting layer (10).

10. The display panel according to claim 8, wherein The plurality of microlenses (141) are located between the black matrix (131) and the touch layer (12); the flat layer (15) also covers the light-emitting side of the touch layer (12); and the black matrix (131) and the color resist layer (132) are both located on the light-emitting side of the flat layer (15).

11. The display panel according to any one of claims 8 to 10, characterized in that: The refractive index of the microlens (141) is greater than the refractive index of the flat layer (15).

12. The display panel according to any one of claims 1 to 11, characterized in that: The microlens (141) is used to gather light emitted by the corresponding sub-pixel (102).

13. The display panel according to claim 12, wherein: The microlens (141) is formed as a convex lens; and / or, The refractive index of the microlens (141) is greater than the refractive index of the color resist layer (132).

14. The display panel according to claim 13, wherein: The microlens (141) is formed into a truncated cone structure or a spherical structure.

15. The display panel according to claim 13, wherein: The microlens (141) is formed into a truncated cone structure, comprising a first end face (1411), a second end face (1412), and a side surface (1413), wherein the first end face (1411) faces the light-emitting layer (10), the second end face (1412) is arranged opposite to the first end face (1411), and the area of ​​the second end face (1412) is smaller than the area of ​​the first end face (1411), and the angle between the side surface (1413) and the first end face (1411) is 30°-80°.

16. The display panel according to claim 15, wherein: The distance between the first end surface (1411) and the second end surface (1412) is 0.5um-4um.

17. The display panel according to any one of claims 1 to 16, characterized in that: The orthographic projection of the microlens (141) on the light-emitting surface completely covers the sub-pixel (102) corresponding thereto, and the distance between the edge of the orthographic projection of the microlens (141) on the light-emitting surface and the edge of the sub-pixel (102) corresponding thereto is 0-3 μm.

18. The display panel according to any one of claims 1 to 17, characterized in that: The refractive index of the microlens (141) is 1.55 to 1.

8.

19. The display panel according to any one of claims 3 to 18, characterized in that: The distance between the orthographic projection of the black unit (1311) on the light-emitting surface and the sub-pixel (102) closest thereto is 3um-7um.

20. A display screen module, characterized in that: It comprises a display panel (1) according to any one of claims 1 to 19 and a flexible circuit board (2), wherein the flexible circuit board (2) is electrically connected to the display panel (1).

21. An electronic device, characterized in that: include: Control circuit board (3); as well as The display screen module according to claim 20, wherein the flexible circuit board (2) in the display screen module is used to connect the control circuit board (3) and the display panel (1).

Images