Electronic device including metal housing

Abstract

This electronic device comprises: a side frame forming a side surface of the electronic device; and a metal housing connected to an inner side of the side frame and including a bracket positioned inside the electronic device. The side frame includes: a first metal member exposed to the outside of the electronic device and including a first metal material; a second metal member connected to the first metal member along the inner circumference of the first metal member and including a second metal material; and a bonding region formed around a bonding interface between the first metal member and the second metal member and in which the first metal material and the second metal material are mixed. The bonding region includes: a first diffusion layer formed from the bonding interface to the first metal member; and a second diffusion layer formed from the bonding interface to the second metal member.

Description

Electronic devices including metal housings

[0001] The disclosure relates to an electronic device comprising a housing made of a metallic material.

[0002] Wireless communication technology enables the transmission and reception of various types of information. As wireless communication technology advances, electronic devices, such as smartphones, capable of wireless communication can provide services utilizing communication functions such as the global positioning system (GPS), Wi-Fi, long-term evolution (LTE), and near field communication (NFC). To perform such wireless communication, the electronic devices may include an antenna structure. The aforementioned background technology was acquired or acquired during the process of developing the present disclosure and cannot necessarily be considered publicly available technology prior to the filing of the present disclosure.

[0003] An electronic device according to one embodiment may include a metal housing including a side frame forming a side surface of the electronic device, and a bracket connected to an inner side of the side frame and positioned within the electronic device. In one embodiment, the side frame may include a first metal member that is exposed to the outside of the electronic device and includes a first metal material, a second metal member that is connected to the first metal member along an inner periphery of the first metal member and includes a second metal material, and a bonding region formed around a bonding interface between the first metal member and the second metal member, the first metal material and the second metal material being mixed. In one embodiment, the bonding region may include a first diffusion layer formed from the first metal member from the bonding interface, and a second diffusion layer formed from the second metal member from the bonding interface.

[0004] In one embodiment, the melting point of the first metal material may be higher than the melting point of the second metal material. In one embodiment, the difference between the melting points of the first metal material and the second metal material may be 300 degrees or less. In one embodiment, the thickness of the first diffusion layer may be less than or equal to the thickness of the second diffusion layer based on the bonding interface. In one embodiment, the first metal material may have a higher hardness than the second metal material.

[0005] In one embodiment, the first metal member may include a first contact portion extending inwardly of the electronic device and in contact with the contact member. In one embodiment, the first metal material and the third metal material forming the contact member may have a potential difference of 0.2 or less. In one embodiment, the second metal member may include a second contact portion in contact with the contact member.

[0006] An electronic device according to one embodiment may include a housing structure including a first metal member that is exposed to the outside to form a side surface of the electronic device and includes a first metal material, a second metal member that is joined to the first metal member along an inner periphery of the first metal member and includes a second metal material, and an insulating member that includes an insulating material, and a printed circuit board on which a wireless communication circuit is arranged. In one embodiment, a bonding area may be formed around a bonding interface between the first metal member and the second metal member. In one embodiment, the bonding area may include a first diffusion layer and a second diffusion layer that are formed on the first metal member and the second metal member, respectively, with the bonding interface therebetween, and in which the first metal material and the second metal material are mixed. In one embodiment, the insulating member may be connected to the first metal member and the second metal member to cover the bonding area.

[0007] In one embodiment, the first metal material may have a higher melting point than the second metal material. In one embodiment, with respect to the bonding interface, the first thickness from the bonding interface to the boundary of the first diffusion layer may be less than or equal to the second thickness from the bonding interface to the boundary of the second diffusion layer.

[0008] In one embodiment, the printed circuit board may include one or more contact members electrically connected to the wireless communication circuit. In one embodiment, the one or more contact members may contact the first metal member or the second metal member.

[0009] According to one embodiment, a wearable electronic device may include a housing structure including a front surface, a rear surface, and a side surface surrounding a space between the front surface and the rear surface, the housing structure including a side frame forming at least a portion of the side surface, and a strap detachably connected to the housing structure and configured to be worn on a user's body. In one embodiment, the side frame may include a first metal member formed of a first metal material and forming at least a portion of the side surface and exposed to the outside, a second metal member connected to the first metal member along an inner periphery of the first metal member and including a second metal material, and a bonding region formed around a bonding interface between the first metal member and the second metal member, the first metal material and the second metal material being mixed. In one embodiment, the bonding region may include a first diffusion layer formed from the first metal member from the bonding interface, and a second diffusion layer formed from the second metal member from the bonding interface. In one embodiment, the thickness of the first diffusion layer may be less than or equal to the thickness of the second diffusion layer based on the bonding interface.

[0010] The effects of the electronic device including the metal housing according to the embodiments are not limited to those mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description below.

[0011] The above and other aspects, features and advantages according to specific embodiments of the present disclosure will become more apparent from the detailed description below with reference to the accompanying drawings.

[0012] FIG. 1 is a block diagram of an electronic device within a network environment according to embodiments.

[0013] FIG. 2A is a front perspective view of an electronic device according to one embodiment.

[0014] FIG. 2b is a rear perspective view of an electronic device according to one embodiment.

[0015] FIG. 3A is an exploded perspective view of an electronic device according to one embodiment.

[0016] FIG. 3b is a drawing illustrating a metal housing of an electronic device according to one embodiment.

[0017] FIG. 4a is a cross-sectional view of an exemplary metal housing taken along line AA of FIG. 3b to explain the structure of a metal housing according to one embodiment.

[0018] FIG. 4b is a drawing illustrating an exemplary form of area B of FIG. 3b, which is intended to explain a side frame according to one embodiment.

[0019] FIG. 4c is an enlarged view of the bonding portion of the first metal member and the second metal member to illustrate a bonding area according to one embodiment.

[0020] FIG. 5a is a partial cross-sectional perspective view showing a joint structure of a first metal member and a second metal member according to one embodiment.

[0021] FIG. 5b is a drawing illustrating an exemplary shape of area C of FIG. 3b to explain a joint structure of a side frame and an insulating member according to one embodiment.

[0022] FIG. 5c is a drawing showing an exemplary form of area E of FIG. 3b to explain the joint structure of the side frame and bracket according to one embodiment.

[0023] FIG. 6a is a drawing illustrating an exemplary form of region D of FIG. 3b to explain a connection structure between a first metal member and a contact member according to one embodiment.

[0024] FIG. 6b is a drawing illustrating an exemplary form of area B of FIG. 3b to explain a connection structure between a second metal member and a contact member according to one embodiment.

[0025] FIG. 7 is a cross-sectional view of an exemplary metal housing taken along line AA of FIG. 3b to illustrate a metal housing according to one embodiment.

[0026] FIG. 8A is a front perspective view of a wearable electronic device according to one embodiment.

[0027] FIG. 8b is a rear perspective view of a wearable electronic device according to one embodiment.

[0028] FIG. 8c is an exploded perspective view of a wearable electronic device according to one embodiment.

[0029] FIG. 9 is an exemplary exploded perspective view of a housing structure of a wearable electronic device according to one embodiment.

[0030] Hereinafter, embodiments will be described in detail with reference to the attached drawings. In the description with reference to the attached drawings, identical components are assigned the same reference numerals regardless of the drawing numbers, and redundant descriptions thereof will be omitted.

[0031] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments.

[0032] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0033] The processor (120) may control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing, for example, software (e.g., a program (140)), and may perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculation, the processor (120) may store a command or data received from another component (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the command or data stored in the volatile memory (132), and store the resulting data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0034] The auxiliary processor (123) may control at least a part of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0035] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0036] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0037] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0038] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0039] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0040] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0041] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0042] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0043] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0044] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0045] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0046] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0047] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0048] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0049] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) may support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 eB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0050] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. According to some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0051] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0052] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0053] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service by itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0054] The embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0055] The term "module" used in the embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0056] Embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0057] According to one embodiment, the method according to the embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0058] According to embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0059] FIG. 2a is a front perspective view of an electronic device according to one embodiment. FIG. 2b is a rear perspective view of the electronic device according to one embodiment.

[0060] Referring to FIGS. 2A and 2B, an electronic device (201) (e.g., the electronic device (101) of FIG. 1) may include a front surface (210a) (or first surface), a rear surface (210b) (or second surface), and a side surface (211c) surrounding a space between the front surface (210a) and the rear surface (210b).

[0061] An electronic device (201) according to one embodiment may include a housing structure (210) that forms an exterior and accommodates components therein. The housing structure (210) may form a front surface (210a) of the electronic device (201) (e.g., a surface facing the +Z direction), a rear surface (210c) (e.g., a surface facing the -Z direction), and a side surface (211c) that surrounds an interior space between the front surface (210a) and the rear surface (210b). In one embodiment, the housing structure (210) may form a side surface (211c) through a first side surface (211c-1) (e.g., a side facing the - Y direction), a second side surface (211c-2) (e.g., a side facing the + Y direction), a third side surface (211c-3) (e.g., a side facing the + X direction), and a fourth side surface (211c-4) (e.g., a side facing the - X direction) connecting the front surface (210a) and the back surface (210b).

[0062] In one embodiment, the housing structure (210) may include a front plate (211a) forming a front surface (210a) of the electronic device (201). In one embodiment, the front plate (211a) may be formed to be at least partially transparent. For example, the front plate (211a) may include a glass plate or a polymer plate including at least one coating layer. In one embodiment, the housing structure (210) may include a back plate (211b) forming a back surface (210b) of the electronic device (201). In one embodiment, the back plate (211b) may be formed to be substantially opaque. For example, the back plate (211b) may be formed of coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel, magnesium), or a combination thereof. In one embodiment, the housing structure (210) may include a metal housing (240). In one embodiment, the metal housing (240) may form a side surface (211c) of the electronic device (201) at least in part. For example, the metal housing (240) may include a side frame (241) that forms the side surface (211c) of the electronic device (201) and has a surface exposed to the outside. In one embodiment, the metal housing (240) may be coupled to a front plate (211a) and a back plate (211b). The metal housing (240) may include a metal and / or a polymer. In one embodiment, the side frame (241) may be seamlessly formed integrally with the back plate (211b). In one embodiment, at least a portion of the metal housing (240) may be formed of substantially the same material as the back plate (211b), such as, but not limited to, aluminum. For example, the metal housing (240) may include various types of metal materials.

[0063] In one embodiment, the front plate (211a) may include a plurality of first edge regions (212a-1) facing one direction (e.g., + / - X direction) and extending from at least a portion of the front surface (210a) to the back plate (211b) and having a rounded surface, a plurality of second edge regions (212a-2) facing another direction (e.g., + / - Y direction) and extending from at least a portion of the front surface (210a) to the back plate (211b) and having a rounded surface, and a plurality of third edge regions (212a-3) extending from at least a portion of the front surface (210a) to the back plate (211b) and having a rounded surface and positioned between the plurality of first edge regions (212a-1) and the plurality of second edge regions (212a-2).

[0064] In one embodiment, the back plate (211b) may include a plurality of fourth edge regions (212b-1) facing one direction (e.g., + / - X direction) and extending from at least a portion of the back plate (210b) to the front plate (211a) and having a rounded surface, a plurality of fifth edge regions (212b-2) facing another direction (e.g., + / - Y direction) and extending from at least a portion of the back plate (210b) to the front plate (211a) and having a rounded surface, and a plurality of sixth edge regions (212b-3) extending from at least a portion of the back plate (210b) to the front plate (211a) and having a rounded surface and positioned between the plurality of fourth edge regions (212b-1) and the plurality of fifth edge regions (212b-2).

[0065] In one embodiment, the metal housing (240) may surround at least a portion of a space formed between the front (210a) and the back (210b) of the electronic device (201). In one embodiment, a display (261) may be positioned on one side (e.g., in the +Z direction) of the metal housing (240). A back plate (211b) may be positioned on the other side (e.g., in the -Z direction) of the metal housing (240).

[0066] In one embodiment, the electronic device (201) may include a display (261) (e.g., the display module (160) of FIG. 1). In one embodiment, the display (261) may be located on the front surface (210a) of the electronic device (201). In one embodiment, the display (261) may be visually exposed through at least a portion of the front plate (211a) (e.g., the first edge regions (212a-1), the second edge regions (212a-2), and the third edge regions (212a-3). In one embodiment, the display (261) may have a shape substantially the same as the outer contour shape of the front plate (211a). Although not shown in the drawing, the display (261) according to one embodiment may include a touch screen panel (TSP), a pressure sensor, and / or a digitizer (not shown) for detecting a stylus pen.

[0067] In one embodiment, the display (261) may include a screen display area (261a) that is visually exposed to the outside of the electronic device (201) and displays content through pixels or a plurality of cells. In one embodiment, the screen display area (261a) may include a sensing area (261a-1) and a camera area (261a-2). The sensing area (261a-1) may overlap at least a portion of the screen display area (261a). The sensing area (261a-1) may allow transmission of an input signal related to a sensor module (e.g., the sensor module (176) of FIG. 1). The sensing area (261a-1) may display content together with a screen display area (261a) that does not overlap with the sensing area (261a-1).

[0068] In one embodiment, the camera area (261a-2) may overlap at least a portion of the screen display area (261a). The camera area (261a-2) may expose a lens of a first camera module (280a) (e.g., the camera module (180) of FIG. 1) positioned to face the front of the electronic device (201). For example, the camera area (261a-2) may allow transmission of an optical signal (e.g., light) associated with the camera module (280a). In one embodiment, the camera area (261a-2) may display content similarly to the screen display area (261a) that does not overlap the camera area (261a-2). For example, the camera area (261a-2) may display content while the first camera module (280a) is not operating.

[0069] In one embodiment, the electronic device (201) may include a sensor module (276). The sensor module (276) may sense a signal applied to the electronic device (201). The sensor module (276) may be located, for example, on the front surface (210a) of the electronic device (201). The sensor module (276) may be arranged in the electronic device (201) to correspond to a sensing area (261a-1) of a screen display area (261a). For example, the sensor module (276) may be arranged to perform its function without being visually exposed through the display (261) in an internal space of the electronic device (201). The sensor module (276) may receive an input signal penetrating the sensing area (261a-1) and generate an electrical signal based on the received input signal. For example, the input signal may have a specified physical quantity (e.g., heat, light, temperature, sound, pressure, ultrasound). In one embodiment, the input signal may include a signal relating to the user's biometric information (e.g., the user's fingerprint, voice).

[0070] In one embodiment, the electronic device (201) may include a camera module (280a, 280b) (e.g., the camera module (180) of FIG. 1). In one embodiment, the camera module (280a, 280b) may include a first camera module (280a) and a second camera module (280b). In one embodiment, the electronic device (201) may include a flash (280c) disposed near the first camera module (280a) and the second camera module (280b).

[0071] In one embodiment, the first camera module (280a) is disposed on the front side (210a) of the housing (210) such that its lens is exposed, and can receive an optical signal from the front side (e.g., +Z direction) of the electronic device (201). The second camera module (280b) is disposed on the rear side (210b) of the housing (210) such that its lens is exposed, and can receive an optical signal from the rear side (e.g., -Z direction) of the electronic device (201). In one embodiment, at least a portion of the first camera module (280a) may be disposed on the housing (210) such that it is covered by the display (261). For example, the first camera module (280a) may include an under-display camera (UDC). In one embodiment, the first camera module (280a) may receive an optical signal that passes through the camera area (261a-2). In one embodiment, the second camera module (280b) may include multiple cameras (e.g., dual cameras, triple cameras, or quad cameras). In one embodiment, the flash (280c) may include a light-emitting diode or a xenon lamp.

[0072] In one embodiment, the electronic device (201) may include an input module (250) (e.g., the input module (150) of FIG. 1). The input module (250) may receive an operation signal from a user. For example, the input module (250) may include at least one key input device that is positioned so as to be exposed on a side surface (211c) of the housing (210).

[0073] In one embodiment, the electronic device (201) may include a connection terminal (278) (e.g., connection terminal (178) of FIG. 1). In one embodiment, the connection terminal (278) may be disposed on an outer surface of the housing (210). The electronic device (201) may be wired to an external device (e.g., another electronic device or an external power source) through the connection terminal (278).

[0074] Electronic devices according to embodiments disclosed herein may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments disclosed herein are not limited to the aforementioned devices.

[0075] FIG. 3A is an exploded perspective view of an electronic device according to one embodiment. FIG. 3B is a drawing illustrating a metal housing of an electronic device according to one embodiment.

[0076] Referring to FIGS. 3A and 3B, an electronic device (301) (e.g., electronic device (201) of FIG. 2A) according to one embodiment may include a front plate (311a) forming a front surface (e.g., front surface (210a) of FIG. 2A) of the electronic device (301), a rear plate (311b) forming a rear surface (e.g., rear surface (210b) of FIG. 2A) (e.g., rear plate (211b) of FIG. 2A)), and a metal housing (340) forming a side surface (e.g., side surface (211c) of FIG. 2A) of the electronic device (301) (e.g., metal housing (240) of FIG. 2A).

[0077] In one embodiment, the metal housing (340) may include a side frame (341) surrounding a side of the electronic device (302). In one embodiment, the side frame (341) may include a metal material and may function as an antenna radiator of the electronic device (301). In one embodiment, the metal housing (340) may include a bracket (342) (or bracket portion, support portion) connected to the inside of the side frame (341) and supporting components of the electronic device (301) inside the electronic device (301). In one embodiment, the bracket (342) may be formed integrally with the side frame (341) (e.g., bracket portion (7412-2) of FIG. 7) or manufactured separately from the side portion (341) and connected to the side frame (341) (e.g., bracket (342) of FIG. 4A). In one embodiment, the side frame (341) may form a plurality of electrically isolated conductive regions along the side of the electronic device (301). In one embodiment, the side frame (341) may be formed of one or more conductive metal materials and / or polymer materials. In one embodiment, the bracket (342) may be formed of conductive metal and / or polymer materials similar to the side frame (341). In one embodiment, when the bracket (342) is directly connected to the side frame (341), the bracket (342) may form an electrical path from a metal member (e.g., a conductive region) of the side frame (341) to ground.

[0078] In one embodiment, the electronic device (301) may include one or more printed circuit boards (PCBs). For example, the electronic device (301) may include a first circuit board (351) (or a main circuit board) and a second circuit board (352) (or a sub-circuit board). In one embodiment, the first circuit board (351) and the second circuit board (352) may be disposed inside the electronic device (301), for example, in a second support structure (342). At least one of the circuit boards (351, 352) may be connected to a bracket (342) via a ground. In one embodiment, the first circuit board (351) may be accommodated in a first substrate slot (342a) formed by the bracket (342). In one embodiment, the second circuit board (352) can be accommodated in the second board slot (342b) formed by the bracket (342). In one embodiment, the circuit boards (351, 352) can be a rigid printed circuit board (PCB) or a flexible printed circuit board (FPCB) that is at least partially bendable.

[0079] In one embodiment, the electronic device (301) may include a battery (389) disposed internally. The battery may be disposed in a battery slot (345) formed in the support portion (342).

[0080] A metal housing (340) according to one embodiment may include a side frame (341), a bracket (342), and an insulating member (343).

[0081] In one embodiment, the side frame (341) may form a side surface of the electronic device (301). The side frame (341) may include a first metal member (3411) that is exposed to the outside along the side surface of the electronic device (301), and a second metal member (3412) that is connected to the first metal member (3411) along an inner perimeter of the first metal member (3411). In one embodiment, the first metal member (3411) may include a first metal material, and the second metal member (3412) may include a second metal material. In one embodiment, the first metal material forming the first metal member (3411) may have a relatively high hardness compared to the second metal material forming the second metal member (3412). In one embodiment, the first metal member (3411) and the second metal member (3412) may be connected integrally. For example, the first metal member (3411) and the second metal member (3412) can be connected through diffusion bonding. In this case, the first metal material forming the first metal member (3411) and the second metal material forming the second metal member (3412) can be mutually bonded through material diffusion of each metal material.

[0082] In one embodiment, the first metal member (3411) and the second metal member (3412) may be formed by a metal injection molding (MIM) method. For example, the first metal member (3411) and the second metal member (3412) may be formed by continuously injecting a first metal material and a second metal material into a mold. For example, the first metal member (3411) may be formed by sintering a first metal powder. For example, the second metal member (3412) may be formed by sintering a second metal powder. In one embodiment, the side frame (341) may be formed by bonding the first metal powder of the first metal member (3411) and the second metal powder of the second metal member (3412) before sintering. For example, the side frame (341) can be formed in such a way that the first metal member (3411) is first metal injection molded, and then the second metal member (3412) is second metal injection molded before the first metal member (3411) is debinded.

[0083] In one embodiment, the bracket (342) may be connected to the inside of the side frame (341). For example, at least a portion (e.g., an edge portion) of the bracket (342) may be integrally connected to the first metal member (3411) and / or the second metal member (3412) of the side frame (341) by bonding or by being connected in an assembly manner.

[0084] In one embodiment, the insulating member (343) may be connected to the side frame (341). For example, the insulating member (343) may be connected to the side frame (341) so as to cover at least a portion of the first metal member (3411) and the second metal member (3412) along the perimeter of the side frame (341). In one embodiment, the insulating member (343) may be connected to the side frame (341) so as to cover the joint portion of the first metal member (3411) and the second metal member (3412) of the side frame (341) so as not to be directly exposed to the outside. In one embodiment, the insulating member (343) may include an insulating material. The insulating member (343) may include segments (3431) that divide the side frame (341) into a plurality of electrically isolated conductive regions in the circumferential direction, i.e., along the side of the electronic device (301).

[0085] In one embodiment, the metal housing (340) may support a circuit board (350). For example, the circuit board (350) may be placed on a bracket (342). In one embodiment, when a plurality of circuit boards (350) are provided, for example, when the circuit board (350) includes a first circuit board (351) and a second circuit board (352), the first circuit board (351) and the second circuit board (352) may be placed at different positions of the bracket (342) with a space between them. In one embodiment, each circuit board (350) may be fixed in position to the bracket (342) by means of screw coupling or the like. In one embodiment, the first circuit board (351) and the second circuit board (352) may be electrically connected through a connecting board (e.g., FPCB; flexible printed circuit board) (not shown). In one embodiment, a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) may be disposed on the first circuit board (351) or the second circuit board (352). In one embodiment, each circuit board (350) may be electrically connected to a side frame (341) of a metal housing (340) to form an electrical path between a conductive area formed by the side frame (341) and the wireless communication circuit. For example, the circuit board (350) may include one or more contact members (e.g., a contact member (653) of FIG. 6A) disposed on a surface of the circuit board (350) and electrically connected to the wireless communication circuit through a signal line, and may be electrically connected to the side frame (341) through the contact members.

[0086] FIG. 4A is a cross-sectional view of an exemplary metal housing taken along line AA of FIG. 3B to illustrate a structure of a metal housing according to one embodiment. FIG. 4B is a drawing illustrating an exemplary shape of area B of FIG. 3B to illustrate a side frame according to one embodiment. FIG. 4C is an enlarged view of a joint portion of a first metal member and a second metal member to illustrate an external area according to one embodiment.

[0087] Referring to FIGS. 4A to 4C, a metal housing (440) according to one embodiment (e.g., the metal housing (340) of FIG. 3B) may be formed with a structure in which a first metal member (4411) (e.g., the first metal member (3411) of FIG. 3B), a second metal member (4412) (e.g., the second metal member (3412) of FIG. 3B), a bracket (442) (e.g., the bracket (342) of FIG. 3B), and an insulating member (443) (e.g., the insulating member (343) of FIG. 3B) are interconnected.

[0088] In one embodiment, the first metal member (4411) and the second metal member (4412) may be integrally connected to form a side frame (441) (e.g., the side frame (341) of FIG. 3A). In one embodiment, the first metal member (4411) and the second metal member (4412) may form a side of an electronic device (e.g., the electronic device (401) of FIG. 3A).

[0089] In one embodiment, the first metal member (4411) may be directly exposed to the outside to form the exterior of the electronic device, as illustrated in FIG. 4A. In one embodiment, the second metal member (4412) may be connected to the inside of the first metal member (4411). In one embodiment, the second metal member (4412) may function as a power supply portion that receives an electrical signal from a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1) or as a heat dissipation portion that dissipates heat generated inside the electronic device (401).

[0090] In one embodiment, the bracket (442) may be connected to the inner side of the side frame (441), for example, to the inner side of the second metal member (4412). In one embodiment, the bracket (442) may be connected to the second metal member (4412) along the inner perimeter of the second metal member (4412).

[0091] In one embodiment, the insulating member (443) may be formed of an insulating material, and the insulating member (443) may be connected to the side frame (441) so as to cover at least a portion of the first metal member (4411) and the second metal member (4412) along the perimeter of the side frame (441). In one embodiment, the insulating member (443) may be bonded to the first metal member (4411) and the second metal member (4412). For example, the insulating member (443) may be injection-molded to the first metal member (4411) and the second metal member (4412). In one embodiment, the insulating member (443) may be structurally connected to the side frame (441). For example, as illustrated in FIG. 4B, the second metal member (4412) may include a contact portion (44125) that protrudes inwardly and has a through hole (44125a) formed therethrough. In one embodiment, at least a portion of the insulating member (443) may be anchored and bonded within the through hole (44125a) formed in the second metal member (4412).

[0092] In one embodiment, the first metal member (4411) may include a first metal material, and the second metal member (4412) may include a second metal material. In one embodiment, the first metal material forming the first metal member (4411) may have a higher surface hardness than the second metal material forming the second metal member (4412). For example, since the first metal member (4411) is directly exposed to the outside, it may be formed of a material having higher hardness and corrosion resistance than the second metal member (4412). In one embodiment, the second metal material may have higher thermal conductivity and conductivity than the first metal material.

[0093] In one embodiment, the first metal material may include at least one of titanium, stainless steel, and aluminum. For example, the second metal material may include at least one of stainless steel, a copper alloy, an aluminum-magnesium alloy, an aluminum-chromium alloy, an aluminum-titanium alloy, magnesium, and zinc. In one embodiment, the first metal material and the second metal material may be combined in various forms. For example, when the first metal material includes titanium, the second metal material may include stainless steel. For example, when the first metal material includes stainless steel, the second metal material may include at least one of stainless steel, an aluminum alloy, a copper alloy, nickel, and cobalt of a different series from the first metal material. For example, when the first metal material includes aluminum, the second metal material may include at least one of aluminum, magnesium, and zinc of a different grade from the first metal material.

[0094] In one embodiment, the melting point of the first metal material forming the first metal member (4411) may be higher than the melting point of the second metal material forming the second metal member (4412). In one embodiment, the difference in melting points between the first metal material and the second metal material may be, for example, 300 degrees or less.

[0095] In one embodiment, the first metal member (4411) and the second metal member (4412) may be integrally connected through diffusion bonding. In one embodiment, a bonding region (4413) may be formed around a bonding interface (4410) at the bonding portion of the first metal member (4411) and the second metal member (4412), as shown in FIG. 4C. In one embodiment, the bonding region (4413) may be formed by mixing the first metal material forming the first metal member (4411) and the second metal material forming the second metal member (4412). In one embodiment, the bonding region (4413) may include a first diffusion layer (4410a) formed from the bonding interface (4410) to at least a portion of the first metal member (4411), and a second diffusion layer (4410b) formed from the bonding interface (4410) to at least a portion of the second metal member (4412). In one embodiment, the first diffusion layer (4410a) may be formed by diffusing metal particles of the second metal material forming the second metal member (4412) into the metal particles of the first metal material forming the first metal member (4411). The second diffusion layer (4410b) may be formed by diffusing metal particles of the first metal material forming the first metal member (4411) into the metal particles of the second metal material forming the second metal member (4412). The first metal member (4411) and the second metal member (4412) can be joined as one piece through the joining area.

[0096] In one embodiment, as illustrated in FIG. 4c, based on the bonding interface (4410), the first thickness (T1) of the first diffusion layer (4410a) may be less than or equal to the second thickness (T2) of the second diffusion layer (4410b). For example, the first thickness (T1) from the bonding interface (4410) to the boundary of the first diffusion layer (4410a) may be less than the second thickness (T2) from the bonding interface (4410) to the boundary of the second diffusion layer (4410b). In one embodiment, depending on the difference in melting points of the second metal material and the second metal material, the ratio of the first thickness (T1) of the first diffusion layer (4410a) to the second thickness (T2) of the second diffusion layer (4410b) may vary.

[0097] In one embodiment, the insulating member (443) may be connected to the side frame (441) to cover at least a portion of the first metal member (4411) and the second metal member (4412) so that the bonding area of ​​the first metal member (4411) and the second metal member (4412) is not exposed to the outside.

[0098] FIG. 5a is a partial cross-sectional perspective view illustrating a joint structure of a first metal member and a second metal member according to an embodiment. FIG. 5b is a drawing illustrating an exemplary shape of area C of FIG. 3b to explain a joint structure of a side frame and an insulating member according to an embodiment. FIG. 5c is a drawing illustrating an exemplary shape of area E of FIG. 3b to explain a joint structure of a side frame and a bracket according to an embodiment.

[0099] Referring to FIG. 5a, in one embodiment, the first metal member (5411) (e.g., the first metal member (3411) of FIG. 3b) and the second metal member (5412) (e.g., the second metal member (3412) of FIG. 3b) can improve the bonding strength according to diffusion bonding through a structural bonding method.

[0100] In one embodiment, the first metal member (5411) may include a recess (54111) formed on at least a portion of the inner surface facing the second metal member (5412). In one embodiment, the recess (54111) may be formed in an undercut shape. In one embodiment, the second metal member (5412) may include an insertion portion (54121) formed on an outer surface facing the first metal member (5411) and connected to the recess (54111) formed on the inner surface of the first metal member (5411). In one embodiment, the joint structure of the recess (54111) and the insertion portion (54121) may be formed on a portion extending in a straight line of a side frame (e.g., the side frame (341) of FIG. 3B).

[0101] In one embodiment, the first metal member (5411) and the second metal member (5412) may be connected via an anchor structure. For example, as illustrated in FIG. 5A, the first metal member (5411) includes an anchor portion (54112) that extends into the interior of the second metal member (5412) and is formed at least partially through the anchor portion, and the second metal member (5412) may be anchored to the first metal member (5411) via the anchor portion (54112).

[0102] Referring to FIG. 5b, in one embodiment, the side frame may include a first metal member (5411) (e.g., the first metal member (3411) of FIG. 3b) and a second metal member (5412) connected to the inside of the first metal member (5411) (e.g., the second metal member (3412) of FIG. 3b).

[0103] In one embodiment, an insulating member (543) (e.g., insulating member (343) of FIG. 3B) may be connected to the inside of the side frame to cover at least a portion (e.g., a bonding area) of the first metal member (5411) and the second metal member (5412). In one embodiment, the insulating member (543) may include one or more segments (5431) (e.g., segments (3431) of FIG. 3B) that separate the side frame (541) into a plurality of electrically isolated conductive portions. For example, at least a portion of the first metal member (5411) and the second metal member (5412) may be cut away, and the cut portions of the first metal member (5411) and the second metal member (5412) may be occupied by the segments (5431) in which the insulating member (543) is formed.

[0104] In one embodiment, the insulating member (543) (e.g., the insulating member (343) of FIG. 3B) may be structurally joined to the side frame (541) to enhance the bonding strength to the side frame (541) at the portion where the segmented portion (5431) is formed. For example, the second metal member (542) may include a contact portion (54112) (or anchor portion) that protrudes inwardly (e.g., in the direction opposite to the first metal member (541)) at a portion adjacent to the segmented portion (5431) (e.g., on both sides of the segmented portion) and has a through hole (54122a) formed therein. At least a portion of the insulating member (543) may be anchored and fixed within the through hole (54122a) formed in the contact portion (54112).

[0105] Referring to FIG. 5C, in one embodiment, a bracket (542) may be connected to the inner side of the side frame (541). In one embodiment, the side frame (541) may include a joint (5415) that extends at least partially into the inner side of the electronic device (e.g., the electronic device (301) of FIG. 3A). The joint (5415) may overlap at least a portion of the bracket (542). In one embodiment, the bracket (542) may be connected to the joint (5415) of the side frame (541). For example, the bracket (542) may be integrally connected to the joint (5415) of the side frame (541) through laser bonding or welding.

[0106] In one embodiment, the side frame (541) may include one or more guide grooves (5416) formed through the joint portion (5415), and the bracket (542) may include one or more guide members (5422) inserted into and engaged with each of the guide grooves (5416). In one embodiment, when the bracket (542) is positioned in an aligned position (e.g., a correct assembly position) with respect to the side frame (541), the guide members (5422) of the bracket (542) may engage with the guide grooves (5416) of the side frame (541). For example, the engagement of the guide members (5422) with the guide grooves (5416) may guide the joint positions of the bracket (542) and the side frame (541).

[0107] FIG. 6A is a drawing illustrating an exemplary shape of area D of FIG. 3B to explain a connection structure between a first metal member and a contact member according to one embodiment. FIG. 6B is a drawing illustrating an exemplary shape of area B of FIG. 3B to explain a connection structure between a second metal member and a contact member according to one embodiment.

[0108] Referring to FIGS. 6A and 6B, in one embodiment, a side frame (641) (e.g., the side frame (341) of FIG. 3B) may be electrically connected to a printed circuit board (650) (e.g., the printed circuit board (350) of FIG. 3B). In one embodiment, the printed circuit board (650) may include one or more contact members (653) that are electrically connected to a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1). In one embodiment, each contact member (653) may be disposed on a surface of the printed circuit board (650) and may be electrically connected to the wireless communication circuit through a signal line. Each contact member (653) may function as a power supply point that applies an electrical signal to a conductive area of ​​the side frame (641), or as a ground point that receives an electrical signal from the conductive area.

[0109] In one embodiment, the side frame (641) may include one or more contact portions (64115, 54125) that are directly or indirectly connected to one or more contact members (653). The contact portions (64115, 54125) may be, for example, connected to the contact member (653) to form an electrical path with the wireless communication circuit.

[0110] In one embodiment, as illustrated in FIG. 6A, the side frame (641) may be connected to the contact member (653) to form a direct electrical path via the first metal member (6411). For example, the first metal member (6411) may include one or more first contact portions (64115) extending toward the inside of the electronic device (e.g., the inside of the electronic device (301) of FIG. 3B). The first contact portions (64115) may extend across the second metal member (6412) toward the printed circuit board (650). In one embodiment, the first contact portions (64115) may contact the contact member (653).

[0111] In one embodiment, when the first metal member (6411) directly contacts the contact member (653) through the first contact portion (64115), the first metal material forming the first metal member (6411) and the third metal material forming the contact member (653) that contacts the first contact portion (64115) may be selected such that the potential difference that causes galvanic corrosion is less than or equal to a set value. For example, the first metal material and the third metal material may have a metal potential difference of 0.2 or less. For example, in order to reduce galvanic corrosion due to dissimilar metal contact between a first contact portion (64115) of a first metal member (6411) formed of a first metal material and a contact member (653) of a third metal material in contact with the first contact portion (64115), the first metal material and the third metal material may be selected to have a potential difference less than a set value.

[0112] In one embodiment, as illustrated in FIG. 6B, the side frame (641) may be connected to the contact member (653) to form a direct electrical path via the second metal member (6412). For example, the second metal member (6412) may include one or more second contact portions (64112) extending toward the interior of the electronic device (e.g., the interior of the electronic device (301) of FIG. 3B). The second contact portions (64112) may extend across the insulating member (643) toward the printed circuit board (650). In one embodiment, the second contact portions (64112) may be in direct contact with the contact member (653).

[0113] FIG. 7 is a cross-sectional view of an exemplary metal housing taken along line AA of FIG. 3B to illustrate a metal housing according to one embodiment. In one embodiment, unless otherwise specifically stated, the configuration of the metal housing described through FIGS. 3A to 6B can be equally applied to the metal housing of FIG. 7.

[0114] Referring to FIG. 7, a metal housing according to one embodiment may include a first metal member (7411), a second metal member (7412), and an insulating member (743).

[0115] In one embodiment, the first metal member (7411) may be exposed to the outside to form a side surface of an electronic device (e.g., the electronic device (301) of FIG. 3A). In one embodiment, the first metal member (7411) may be formed of a first metal material. In one embodiment, the second metal member (7412) may be bonded to the first metal member (7411) along an inner perimeter of the first metal member. In one embodiment, the second metal member (7412) may be formed of a second metal material. In one embodiment, the second metal member (7412) may include a bracket portion (7412-2) and a bonding portion (7412-1) bonded to an inner surface of the first metal member (7411) along the perimeter of the bracket portion (7412-2). In one embodiment, the bracket portion (7412-2) (e.g., bracket (342) of FIG. 3B) may support each component of the electronic device within the electronic device. For example, a printed circuit board (e.g., printed circuit board (350) of FIG. 3B) may be disposed on the bracket portion (7412-2).

[0116] In one embodiment, the bonding portion (7412-1) of the second metal member (7412) may be integrally bonded to the first metal member (7411). For example, the bonding portion (7412-1) and the first metal member (7411) may be diffusion bonded. In one embodiment, a bonding region (e.g., bonding region (4413) of FIG. 4C) may be formed between the bonding portion (7412-1) of the first metal member (7411) and the second metal member (7412) with a bonding interface (e.g., bonding interface (3410) of FIG. 4C) therebetween. For example, the bonding region may be formed by mixing a first metal material forming the first metal member (7411) and a second metal material forming the second metal member (7412). In one embodiment, the bonding region may include a first diffusion layer (e.g., the first diffusion layer (4410a) of FIG. 4c) formed on at least a portion of the first metal member (7411) from the bonding interface (e.g., the bonding interface (4410) of FIG. 4c) and a second diffusion layer (e.g., the second diffusion layer (4410b) of FIG. 4c) formed on at least a portion of the bonding portion (7412-1) of the second metal member (7412) from the bonding interface. In one embodiment, the second diffusion layer may have a thickness greater than that of the first diffusion layer with respect to the bonding interface.

[0117] In one embodiment, an insulating member (743) (e.g., insulating member (343) of FIG. 3c) can be connected to the first metal member (7411) and the second metal member (7412) to cover a bonding area (e.g., bonding area (4413) of FIG. 4c). In one embodiment, the insulating member (743) can form one or more segments (e.g., segments (3431) of FIG. 3b) that divide the bonding portion (7412-1) of the first metal member (7411) and the second metal member (7412) along a side of the electronic device into a plurality of electrically isolated conductive areas.

[0118] FIG. 8A is a front perspective view of a wearable electronic device according to an embodiment. FIG. 8B is a rear perspective view of a wearable electronic device according to an embodiment. FIG. 8C is an exploded perspective view of a wearable electronic device according to an embodiment.

[0119] Referring to FIGS. 8A to 8C, a wearable electronic device (801) according to one embodiment may include a body (800) of the wearable electronic device (801), a strap (850) connected to the body (800) and configured to detachably attach the wearable electronic device (801) to a part of the user's body (e.g., wrist, ankle), and a strap fastening structure (870) connected to the strap (850).

[0120] In one embodiment, the body (800) may include a housing structure forming an exterior. In one embodiment, the housing structure (e.g., the electronic device (101) of FIG. 1) may include a first side (or front side) (810A), a second side (or back side) (810B), and a side surface (810C) surrounding a space between the first side (810A) and the second side (810B). In one embodiment, the housing structure may also refer to a structure forming a portion of the first side (810A), the second side (810B), and the side surface (810C) of FIG. 2A. In one embodiment, the first side (810A) may be formed by a front plate (811) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). In one embodiment, the second side (810B) may be formed by a substantially opaque back plate (807). In one embodiment, the back plate (807) may be formed of a material such as, for example, a coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel, or magnesium), or a combination of at least two of the foregoing materials. In one embodiment, the side (810C) may be formed by a side frame (806) (or, 'side bezel structure', or 'side member') (806) that is joined to the front plate (811) and the back plate (807) and comprises a metal and / or polymer. In one embodiment, the back plate (807) and the side frame (806) may be formed as separate structures and then joined, but may alternatively be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0121] In one embodiment, various components for the operation of the wearable electronic device (801) may be arranged in the main body (800). For example, the wearable electronic device (801) may include at least one of a display (861), an audio module (805, 208), a sensor module (812), a key input device (802, 203, 204), and a connector hole (809). In one embodiment, at least one of the components of the above-described wearable electronic device (801) (e.g., the key input device (802, 203, 204), the connector hole (809), or the sensor module (812)) may be omitted or replaced with another component, and the wearable electronic device (801) may additionally include other components that are not mentioned.

[0122] In one embodiment, the display (861) may be exposed to the first surface (810A) of the housing (810), for example, through a substantial portion of the front plate (811). In one embodiment, the display (861) may be formed in a shape corresponding to the shape of the front plate (811), or may be formed in various shapes such as circular, oval, or polygonal. In one embodiment, the display (861) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor for sensing touch intensity (pressure), and / or a fingerprint sensor for recognizing a user's fingerprint.

[0123] In one embodiment, the audio module (805, 208) may include a microphone hole (805) and a speaker hole (808). In one embodiment, a microphone for acquiring external sound may be placed in the microphone hole (805), and in some embodiments, multiple microphones may be placed in the microphone hole (805) to detect the direction of sound. In some embodiments, the speaker hole (808) and the microphone hole (805) may be implemented as a single hole, and a speaker (e.g., a piezo speaker) without the speaker hole (808) may be applied to the wearable electronic device (801).

[0124] In one embodiment, the sensor module (812) may generate an electrical signal or data value corresponding to an operating state inside the wearable electronic device (801) (e.g., inside the main body (800)) or an external environmental state. In one embodiment, the sensor module (812) may include, for example, a biometric sensor module (e.g., an HRM sensor) disposed on the second surface (810B) of the housing (810). In one embodiment, the wearable electronic device (801) may further include at least one sensor among other sensor modules not shown, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0125] In one embodiment, the sensor module (812) may include an electrode region (813, 214) forming a portion of a surface of the main body (800), and a biosignal detection circuit (not shown) electrically connected to the electrode region (813, 214). For example, the electrode region (813, 214) may include a first electrode region (813) and a second electrode region (814) disposed on a second surface (810B) of the housing (810). The sensor module (812) may be configured such that the electrode region (813, 214) obtains an electric signal from a portion of the user's body, and the biosignal detection circuit detects bioinformation of the user based on the obtained electric signal.

[0126] In one embodiment, the key input devices (802, 203, 204) may include a wheel key (802) disposed on a first surface (810A) of the housing (810) and rotatable in at least one rotational direction, and / or a side key button (803, 204) disposed on a side surface (810C) of the housing (810). In one embodiment, the wheel key (802) may be formed in a shape corresponding to the shape of the front plate (811). In some embodiments, the wearable electronic device (801) may not include some or all of the above-described key input devices (802, 203, 204), and the key input devices (802, 203, 204) that are not included may be implemented in another form, such as a soft key, on the display (861).

[0127] In one embodiment, the connector hole (809) may accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device. In one embodiment, the wearable electronic device (801) may also include another connector hole (not shown) for transmitting and receiving audio signals with an external electronic device. In one embodiment, a connector cover (not shown) may be placed in the connector hole (809) to block or reduce the inflow of foreign substances into the connector hole (809).

[0128] In one embodiment, the strap (850) may include a first strap (850a) and a second strap (850b). In one embodiment, the first strap (850a) may be detachably connected to a first portion (806a) of the housing (810) via a first locking member (851a). The second strap (850b) may be detachably connected to a second portion (806b) of the housing (810) via a second locking member (851b). In one embodiment, the strap (850) may be formed of a metallic material (e.g., metal) that may be magnetic.

[0129] In one embodiment, a fastening groove (853) may be formed in the strap (850). The fastening groove (853) may be formed, for example, concavely on a surface of the first strap (850a) (e.g., a surface facing the -Z direction in FIG. 2a). In one embodiment, a plurality of fastening grooves (853) may be formed, and the plurality of fastening grooves (853) may be spaced apart at regular intervals along the longitudinal direction of the first strap (850a) (e.g., the longitudinal direction of the first strap (850a) parallel to the Y-axis direction in FIG. 2a). Meanwhile, although the drawing illustrates that the fastening groove (853) is formed only in the first strap (850a), this is merely an example, and the fastening groove (853) may be formed on the surfaces of both the first strap (850a) and the second strap (850b).

[0130] In one embodiment, a strap fastening structure (870) may be connected to the strap (850). The strap fastening structure (870) may be configured to secure the body (800) of the wearable electronic device (801) to the user's body by bringing the strap (850) into close contact with a part of the user's body (e.g., wrist, ankle). For example, the strap fastening structure (870) may be configured to be connected to an end of the first strap (850a) (e.g., an end of the first strap (850a) facing the +Y direction of FIG. 2a) and to fasten the first strap (850a) and the second strap (850b) to each other. The strap fastening structure (870) may be configured to limit the movement between the first strap (850a) and the second strap (850b) while the first strap (850a) and the second strap (850b) are in close contact with the user's body part, thereby stably maintaining the mounting state of the wearable electronic device (801) on the user's body. In one embodiment, a fastening member (880) may be connected to an end of the first strap (850a) (e.g., an end of the first strap (850a) facing the -Y direction of FIG. 2a). In one embodiment, the fastening member (880) may be connected to the end of the first strap (850a) (e.g., an end of the first strap (850a) facing the -Y direction of FIG. 2a). In one embodiment, the fastening member (880) may be connected to the end of the first strap (850a). The attachment member (880) may include a magnetic material. If the second strap (850b) includes a metal material having magnetism, the attachment member (880) may be attached to the second strap (850b).

[0131] In one embodiment, the wearable electronic device (801) may further include a first antenna (896), a second antenna (897), a bracket (820) (e.g., a support member), a battery (830), a printed circuit board (840), a sealing member (899), and a back plate (807) disposed on the body (800).

[0132] In one embodiment, the bracket (820) may be positioned inside the main body (800) and connected to the side frame (806) or may be formed integrally with the side frame (806). In one embodiment, the support member (820) may be formed of, for example, a metallic material and / or a non-metallic material (e.g., a polymer). The support member (820) may have a display (861) connected to one surface and a printed circuit board (840) connected to the other surface.

[0133] In one embodiment, a printed circuit board (840) may have a processor, a memory, and / or an interface disposed thereon. The processor may include, for example, one or more of a central processing unit, an application processor, a graphic processing unit (GPU), a sensor processor, or a communication processor. In one embodiment, the memory may include, for example, volatile memory or non-volatile memory. In one embodiment, the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may include, for example, a USB connector, an SD card / MMC connector, or an audio connector that may electrically or physically connect the electronic device (801) to an external electronic device.

[0134] In one embodiment, a battery (830) may power at least one component of an electronic device (801). The battery (830) may include, for example, a rechargeable secondary battery. At least a portion of the battery (830) may be disposed substantially flush with, for example, a printed circuit board (840). The battery (830) may be disposed within the body (800) and may be detachably connected to the body (800).

[0135] In one embodiment, the first antenna (896) may be disposed between the display (861) and the support member (820). The first antenna (896) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. In one embodiment, the first antenna (896) may, for example, perform short-range communication with an external device, wirelessly transmit and receive power required for charging, and transmit a magnetic-based signal including a short-range communication signal or payment data. In one embodiment, a portion of the side bezel structure (806) and / or a portion of the support member (820) may include a conductive portion, through which the function of the first antenna (896) may be performed.

[0136] In one embodiment, the second antenna (897) may be disposed between the printed circuit board (840) and the back plate (807). The second antenna (897) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. In one embodiment, the second antenna (897) may, for example, perform short-range communication with an external device, wirelessly transmit and receive power required for charging, and transmit a magnetic-based signal including a short-range communication signal or payment data. In one embodiment, a portion of the side frame (806) and / or the back plate (807) may include a conductive portion, through which the function of the second antenna (897) may be performed.

[0137] In one embodiment, a sealing member (899) may be positioned between the side frame (806) and the rear plate (807). The sealing member (899) may be configured to block or reduce moisture or foreign substances from entering the space between the side frame (806) and the rear plate (807) from the outside.

[0138] FIG. 9 is an exemplary exploded perspective view of a housing structure of a wearable electronic device according to one embodiment.

[0139] Referring to FIG. 9, a housing structure according to one embodiment may include a side frame (941) (e.g., side frame (806) of FIG. 8A), and a bracket (942).

[0140] In one embodiment, the side frame (806) may form a side surface of a body (e.g., the body (800) of FIG. 8A) of a wearable electronic device (e.g., the wearable electronic device (801) of FIG. 8A). In one embodiment, the side frame (806) may include a first metal member (9411) that forms at least a portion of the side surface and is exposed to the outside, and a second metal member (9412) that is connected to the first metal member (9411) along an inner periphery of the first metal member. In one embodiment, the first metal member (9411) may be formed of a first metal material. In one embodiment, the second metal member (9412) may be formed of a second metal material.

[0141] In one embodiment, the bracket (942) may be connected to the inner side of the side frame (941), for example, the inner side of the second metal member (9412). In one embodiment, the bracket (942) may be connected to the second metal member (9412) along the inner perimeter of the second metal member (9412). In one embodiment, a printed circuit board (950) (e.g., the printed circuit board (840) of FIG. 8C) on which a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1) is disposed may be disposed on the bracket (942). In one embodiment, a contact member (e.g., the contact member (653) of FIG. 6A) connected to form an electrical path with the wireless communication circuit may be disposed on a surface of the printed circuit board (950).

[0142] In one embodiment, the first metal material forming the first metal member (9411) may have a higher surface hardness than the second metal material forming the second metal member (9412). For example, since the first metal member (9411) is directly exposed to the outside, it may be formed of a material having higher hardness and corrosion resistance than the second metal member (9412). In one embodiment, the second metal material may have higher thermal conductivity and conductivity than the first metal material.

[0143] In one embodiment, the first metal material may include at least one of titanium, stainless steel, and aluminum. For example, the second metal material may include at least one of stainless steel, a copper alloy, an aluminum-magnesium alloy, an aluminum-chromium alloy, an aluminum-titanium alloy, magnesium, and zinc. In one embodiment, the first metal material and the second metal material may be combined in various forms. For example, when the first metal material includes titanium, the second metal material may include stainless steel. For example, when the first metal material includes stainless steel, the second metal material may include at least one of stainless steel, an aluminum alloy, a copper alloy, nickel, and cobalt of a different series from the first metal material. For example, when the first metal material includes aluminum, the second metal material may include at least one of aluminum, magnesium, and zinc of a different grade from the first metal material.

[0144] In one embodiment, the second metal member (9412) may be integrally bonded to the first metal member (9411). For example, the first metal member (9411) and the second metal member (9412) may be diffusion bonded. In one embodiment, a bonding region (e.g., a bonding region (3413) of FIG. 4C) may be formed between the first metal member (9411) and the second metal member (9412) with a bonding interface (e.g., a bonding interface (3410) of FIG. 4C) therebetween. For example, the bonding region may be formed by mixing a first metal material forming the first metal member (9411) and a second metal material forming the second metal member (9412). In one embodiment, the bonding region may include a first diffusion layer (e.g., the first diffusion layer (4410a) of FIG. 4c) formed on at least a portion of the first metal member (9411) from the bonding interface (e.g., the bonding interface (4410) of FIG. 4c)) and a second diffusion layer (e.g., the second diffusion layer (4410b) of FIG. 4c) formed on at least a portion of the second metal member (9412) from the bonding interface. In one embodiment, the second diffusion layer may have a thickness greater than that of the first diffusion layer with respect to the bonding interface.

[0145] In one embodiment, an insulating member formed of an insulating material (e.g., an insulating member (343) of FIG. 3B) may be disposed on the side frame (941). The insulating member may cover a bonding area of ​​the first metal member (9411) and the second metal member (9412) so that the bonding area is not exposed to the outside. In one embodiment, the insulating member may include one or more segments (e.g., an insulating member (3431) of FIG. 3B) that divide the side frame (941) into a plurality of electrically isolated conductive areas along the circumferential direction.

[0146] In one embodiment, the side frame (941) may be in contact with a contact member disposed on the surface of the printed circuit board (950). In one embodiment, the side frame (941) may be connected to a wireless communication circuit through the contact member and may function as a radiator for transmitting and receiving wireless signals of the wearable electronic device through the conductive region.

[0147] An electronic device (101; 201; 301) according to one embodiment may include a metal housing (240; 340), which includes a side frame (241; 341) forming a side surface (211c) of the electronic device (201; 301), and a bracket (342) connected to the inside of the side frame (241; 341) and positioned inside the electronic device (201; 301). In one embodiment, the side frame (241; 341) is formed around a first metal member (3411; 4411; 5411; 6411) that is exposed to the outside of the electronic device and includes a first metal material, a second metal member (3412; 4412; 5412; 6412) that is connected to the first metal member (3411; 4411; 5411; 6411) along an inner perimeter of the first metal member (3411; 4411; 5411; 6411), and a bonding interface (4410) between the first metal member (3411; 4411; 5411; 6411) and the second metal member (3412; 4412; 5412; 6412), and the bonding is a mixture of the first metal material and the second metal material. It may include an area (4413). In one embodiment, the bonding area (4413) may include a first diffusion layer (4410a) formed from the first metal member (3411; 4411; 5411; 6411) from the bonding interface (4410), and a second diffusion layer (4410b) formed from the second metal member (3412; 4412; 5412; 6412) from the bonding interface (4410).

[0148] In one embodiment, the melting point of the first metal material may be higher than the melting point of the second metal material.

[0149] In one embodiment, the difference between the melting point of the first metal material and the melting point of the second metal material may be 300 degrees or less.

[0150] In one embodiment, based on the bonding interface (4410), the thickness of the first diffusion layer (4410a) may be less than or equal to the thickness of the second diffusion layer (4410b).

[0151] In one embodiment, the first metal material may have a higher hardness than the second metal material.

[0152] In one embodiment, the first metal material may include at least one of titanium, stainless steel, and aluminum. In one embodiment, the second metal material may include at least one of stainless steel, a copper alloy, an aluminum-magnesium alloy, an aluminum-chromium alloy, an aluminum-titanium alloy, magnesium, and zinc.

[0153] In one embodiment, the metal housing (240; 340) may further include an insulating member (343; 443; 543; 643) that includes an insulating material and is connected to the side frame (341; 441; 541; 641) to cover the bonding area (4413). In one embodiment, the insulating member (343; 443; 543; 643) may include one or more segments (3431; 5431) that divide the side frame (341; 441; 541; 641) into a plurality of electrically isolated conductive areas along the circumferential direction.

[0154] In one embodiment, the side frame (341; 441; 541; 641) may include a through hole (44122a; 54122a) formed in the second metal member. In one embodiment, the insulating member (343; 543) may be fixed within the through hole (44122a; 54122a).

[0155] In one embodiment, the through hole (44122a; 54122a) may be formed adjacent to the segment (3413; 5413).

[0156] In one embodiment, the first metal member (3411; 4411; 5411; 6411) may include a recess (54111) formed on at least a portion of the inner surface facing the second metal member (3412; 4412; 5412; 6412). In one embodiment, the second metal member (2312; 4412; 5412; 6412) may include an insertion portion (54121) that is connected to and engages the recess (54111).

[0157] In one embodiment, the electronic device (101; 201; 301) may further include a printed circuit board (350; 650) disposed inside the electronic device (101; 201; 301), a wireless communication circuit (192), and one or more contact members (653) disposed on the printed circuit board (350; 650) and electrically connected to the wireless communication circuit. In one embodiment, the side frame (341; 441; 541; 641) may include one or more contact portions (64115; 64112) that respectively contact the one or more contact members (653).

[0158] In one embodiment, the first metal member (6411) may extend inwardly of the electronic device and include a first contact portion (64115) that contacts the contact member (653). In one embodiment, the first metal material and the third metal material forming the contact member (653) may have a potential difference of 0.2 or less.

[0159] In one embodiment, the second metal member (6412) may include a second contact portion (64112) that contacts the contact member (653).

[0160] In one embodiment, the side frame (541) may include a joint (5415) extending inwardly of the electronic device (201; 301) and overlapping at least a portion of the bracket (542). In one embodiment, the bracket (542) may be joined to the joint (5415).

[0161] In one embodiment, the side frame (541) may include a guide groove (5416) formed through the joint (5415). In one embodiment, the bracket (542) may include a guide member (5422) inserted into and engaged with the guide groove (5416).

[0162] An electronic device (201; 301) according to an embodiment may include a metal housing (740) that is exposed to the outside to form a side surface (211c) of the electronic device (201; 301), a first metal member (7411) including a first metal material, a second metal member (7412) that is bonded to the first metal member (7411) along an inner circumference of the first metal member (7411) and includes a second metal material, an insulating member (743) that includes an insulating material, and a printed circuit board (350) on which a wireless communication circuit (192) is arranged. In an embodiment, a bonding area (3413) may be formed around a bonding interface (3410) of the first metal member (7411) and the second metal member (7412). In one embodiment, the bonding area (3413) may include a first diffusion layer (3410a) and a second diffusion layer (3410b) formed on the first metal member (7411) and the second metal member (7412) with the bonding interface (3410) interposed therebetween, respectively, and in which the first metal material and the second metal material are mixed. In one embodiment, the insulating member (743) may be connected to the first metal member (7411) and the second metal member (7412) to cover the bonding area (3413).

[0163] In one embodiment, the first metal material may have a higher melting point than the second metal material. In one embodiment, with respect to the bonding interface (3410), a first thickness (T1) from the bonding interface (3410) to the boundary of the first diffusion layer (3410a) may be less than or equal to a second thickness (T2) from the bonding interface (3410) to the boundary of the second diffusion layer (3410b).

[0164] In one embodiment, the second metal member (7412) may include a bracket portion (7412-2) and a bonding portion (7412-1) bonded to the inner surface of the first metal member (7411) along the periphery of the bracket portion (7412-2). In one embodiment, the insulating member (743) may include a segment (3431) that divides the bonding portion (7412-1) of the first metal member (7411) and the second metal member into a plurality of electrically isolated conductive regions along the side surface of the electronic device (203; 301).

[0165] In one embodiment, the printed circuit board (350; 550) may include one or more contact members (653) electrically connected to the wireless communication circuit (192). The one or more contact members (653) may contact the first metal member (7411) or the second metal member (7412).

[0166] A wearable electronic device (801) according to one embodiment may include a housing structure including a front side (810A), a back side (810B), and a side side (810C) surrounding a space between the front side and the back side, and a side frame (806; 941) forming at least a portion of the side side, and a strap (860) detachably connected to the housing structure and intended to be worn on a user's body. In one embodiment, the side frame (806; 941) may include a first metal member (9411) formed of a first metal material and formed to form at least a portion of the side and exposed to the outside, a second metal member (9412) connected to the first metal member (9411) along an inner perimeter of the first metal member (9411) and including a second metal material, and a bonding area (3413) formed around a bonding interface (3410) of the first metal member (9411) and the second metal member (9412), wherein the first metal material and the second metal material are mixed. In one embodiment, the bonding region (3413) may include a first diffusion layer (3410a) formed from the first metal member (9411) from the bonding interface (3410), and a second diffusion layer (3410b) formed from the second metal member (9412) from the bonding interface (3410). In one embodiment, with respect to the bonding interface (3410), the thickness of the first diffusion layer (3410a) may be less than or equal to the thickness of the second diffusion layer (3410b).

Claims

1. In an electronic device (101; 201; 301), As a metal housing (240; 340), A side frame (241; 341) forming a side surface (211c) of the electronic device (201; 301); and The metal housing (240; 340) is connected to the inside of the side frame (241; 341) and includes a bracket (342) located inside the electronic device (201; 301), The above side frame (241; 341) is A first metal member (3411; 4411; 5411; 6411) exposed to the outside of the electronic device and including a first metal material; A second metal member (3412; 4412; 5412; 6412) connected to the first metal member (3411; 4411; 5411; 6411) along the inner circumference of the first metal member (3411; 4411; 5411; 6411) and including a second metal material; and It is formed around the joint interface (4410) of the first metal member (3411; 4411; 5411; 6411) and the second metal member (3412; 4412; 5412; 6412), and includes a joint area (4413) in which the first metal material and the second metal material are mixed. The above joint area (4413) is A first diffusion layer (4410a) formed from the first metal member (3411; 4411; 5411; 6411) from the above bonding interface (4410); and An electronic device comprising a second diffusion layer (4410b) formed from the second metal member (3412; 4412; 5412; 6412) from the above bonding interface (4410).

2. In paragraph 1, An electronic device wherein the melting point of the first metal material is higher than the melting point of the second metal material.

3. In either of paragraphs 1 and 2, An electronic device wherein the difference between the melting points of the first metal material and the second metal material is 300 degrees or less.

4. In any one of paragraphs 1 to 3, An electronic device in which the thickness of the first diffusion layer (4410a) is less than or equal to the thickness of the second diffusion layer (4410b) based on the above bonding interface (4410).

5. In any one of paragraphs 1 to 4, An electronic device wherein the first metal material has a higher hardness than the second metal material.

6. In any one of paragraphs 1 to 5, The above first metal material includes at least one material among titanium, stainless steel, and aluminum, An electronic device wherein the second metal material comprises at least one of stainless steel, copper alloy, aluminum-magnesium alloy, aluminum-chromium alloy, aluminum-titanium alloy, magnesium, and zinc.

7. In any one of paragraphs 1 to 6, The above metal housing (240; 340) is Further comprising an insulating member (343;443;543;643) connected to the side frame (341;441;541;641) to cover the bonding area (4413) and including an insulating material, An electronic device, wherein the insulating member (343; 443; 543; 643) comprises one or more segments (3431; 5431) that divide the side frame (341; 441; 541; 641) into a plurality of electrically isolated conductive regions along the circumferential direction.

8. In paragraph 7, The above side frame (341; 441; 541; 641) includes a through hole (44122a; 54122a) formed in the second metal member, An electronic device in which the insulating member (343; 543) is fixed within the through hole (44122a; 54122a).

9. In paragraph 8, An electronic device in which the above through hole (44122a; 54122a) is formed adjacent to the segmented portion (3413; 5413).

10. In any one of paragraphs 1 to 9, An electronic device, wherein the first metal member (3411; 4411; 5411; 6411) includes a recess (54111) formed on at least a portion of the inner surface facing the second metal member (3412; 4412; 5412; 6412), and the second metal member (2312; 4412; 5412; 6412) includes an insertion portion (54121) that is connected to and engages the recess (54111).

11. In any one of paragraphs 1 to 10, A printed circuit board (350; 650) disposed inside the above electronic device (101; 201; 301); wireless communication circuit (192); and It further includes one or more contact members (653) arranged on the printed circuit board (350;650) and electrically connected to the wireless communication circuit, An electronic device, wherein the side frame (341; 441; 541; 641) includes one or more contact portions (64115; 64112) that contact one or more of the contact members (653), respectively.

12. In any one of paragraphs 1 to 11, The first metal member (6411) extends inwardly of the electronic device and includes a first contact portion (64115) that comes into contact with the contact member (653). An electronic device in which the first metal material and the third metal material forming the contact member (653) have a potential difference of 0.2 or less.

13. In any one of paragraphs 1 to 12, An electronic device, wherein the second metal member (6412) includes a second contact portion (64112) that contacts the contact member (653).

14. In any one of paragraphs 1 to 13, The side frame (541) extends inwardly of the electronic device (201; 301) and includes a joint (5415) overlapping at least a portion of the bracket (542), An electronic device in which the above bracket (542) is joined to the above joint (5415).

15. In paragraph 14, The above side frame (541) includes a guide groove (5416) formed through the above joint (5415), An electronic device in which the above bracket (542) includes a guide member (5422) that is inserted into the guide groove (5416) to engage with it.

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