Labeling apparatus for semiconductor manufacturing process

Abstract

A labeling apparatus for a semiconductor manufacturing process. The labeling apparatus comprises a label manufacturing device, a bearing platform (3), and a manipulator (4). The label manufacturing device comprises a printer (1) and a label transferring platform (2). The printer is used for generating a label. The label transferring platform is movably provided on the side of the printer and comprises a support surface connected to a plurality of protrusions (21). The label transferring platform supports a bonding surface of the label by means of the plurality of protrusions. The bearing platform is used for bearing a target object to be labeled. According to the labeling apparatus, said target object is fixed to the bearing platform; on the label transferring platform, the label is in contact with the plurality of protrusions of the support surface; the area of the tops of the protrusions connected to the bonding surface is small, so that the bonding and fixation between the bonding surface of the label and the label transferring platform caused by large-area contact is prevented; the manipulator can transfer the label and attach the label on the target object; and the whole labeling process can be automatically operated.

Description

Labeling equipment for semiconductor processes

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to Chinese patent application No. 202420355097.7, filed on February 26, 2024, entitled “Labeling Device for Semiconductor Processing,” the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present application relates to the field of semiconductor technology, and in particular to a labeling device for semiconductor manufacturing processes. Background Art

[0004] In the semiconductor processing process, it is necessary to paste corresponding labels on the cards on the surface of opal boxes, crystal boxes and crystal boats. In the related technology, the degree of automation of label pasting in semiconductor processing production lines is relatively low. At present, label pasting operations still require a lot of manual operation, and labels need to be manually printed and pasted to the corresponding opal boxes, crystal boxes and crystal boats. Among them, after the labels are pasted, the opal boxes, crystal boxes and crystal boats need to be manually transferred to the designated platform to wait for the robot to grab them. The mismatch between the manual operation speed and the robot speed makes the efficiency low, and there are also risks in the interaction between humans and robots.

[0005] Summary of the Invention

[0006] The embodiment of the present application provides a labeling device for semiconductor manufacturing process, which can quickly and accurately perform full-process automated labeling on various types of components to be labeled.

[0007] An embodiment of the present application provides a labeling device for semiconductor processes, which includes a label making part, a carrying platform and a robot. The label making part includes a printer and a label transfer platform. The printer is used to generate labels. The label transfer platform is movably arranged on the side of the printer. The label transfer platform includes a carrying surface. The carrying surface is provided with a plurality of raised portions distributed in an array and spaced a preset distance apart from each other. The label transfer platform carries the adhesive surface of the label through the plurality of raised portions.

[0008] The carrying platform is used to carry the target object to be labeled, and the carrying platform includes a clamping member, and the carrying platform fixes the target object through the clamping member. The manipulator is arranged between the label making member and the carrying platform, and is constructed so that the range of movement covers at least part of the label making member and part of the carrying platform. The manipulator includes an adsorption component, which is used to adsorb the label surface of the label on the label transfer platform and transport the label to the target object to be labeled for pasting operation.

[0009] In some embodiments, an extension line of the moving path of the label transfer platform intersects with a center line of the carrying platform passing through the labeling position, and the intersection point is adjacent to a longitudinal line of the robot arm.

[0010] In some embodiments, a negative pressure sensor is adjacent to the outside of the manipulator, and the manipulator also includes a main body and a moving part connected to the main body. The adsorption component includes an adsorption arm connected to one end of the moving part and a negative pressure pipeline built into the main body and the moving part, and the negative pressure pipeline is connected to the negative pressure sensor.

[0011] In some embodiments, the label transfer platform has a preset transfer position, which is away from the label outlet position of the printer along the moving direction of the label transfer platform and is within the movement range of the robot.

[0012] In some embodiments, the label production component further includes a slide seat, which is fixed to a side of the printer and adjacent to the label outlet position, and the label transfer platform is slidably mounted on the slide seat.

[0013] In some embodiments, the label transfer platform includes a first plate and a second plate stacked on each other, a photoelectric sensor is sandwiched between the first plate and the second plate, and the photoelectric sensor is limitedly connected to at least one of the first plate and the second plate.

[0014] In some embodiments, the label transfer platform further has a sensing area, which is provided on the first plate and has a light-transmitting hole therein, and the projection of the light-transmitting hole along the thickness direction of the first plate at least partially overlaps with the photoelectric sensor.

[0015] In some embodiments, the carrying surface is a side of the first plate away from the second plate, the plurality of protrusions are distributed in a multi-row array, and the arrangement direction of the protrusions in each row is consistent with the moving direction of the label transfer platform.

[0016] In some embodiments, the first plate and the second plate are provided with two or more groups of mutually corresponding through holes along their thickness direction, and bolts can be passed through each group of the mutually corresponding through holes to connect the first plate and the second plate in a limited position.

[0017] In some embodiments, the carrying platform further comprises a rotating member connected to the clamping member, the rotating member can cause the clamping member and the target object to rotate synchronously, and the target object is any one of a crystal boat, an opal box and a crystal box.

[0018] The labeling device for semiconductor processes provided in the embodiment of the present application fixes the target object to be labeled on a carrying platform, the printer can automatically generate labels, the label transfer platform can translate on one side of the printer to receive and transfer the label, the robot grabs the label on the label transfer platform through the adsorption component and sticks it to the surface of the target object, the label contacts the multiple raised parts of the carrying surface on the label transfer platform, and since the top area where the raised parts meet the adhesive surface is small, it can effectively prevent the adhesive surface of the label from contacting and bonding the label to the label transfer platform over a large area, and the entire label pasting process can be automated, thereby ensuring that the rhythm of the label pasting process can match the rhythm of automatic grabbing and transfer of the target object after labeling. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The features, advantages and technical effects of exemplary embodiments of the present application will be described below with reference to the accompanying drawings.

[0020] FIG1 is a schematic diagram of the layout of a labeling device provided in an embodiment of the present application on an operating table;

[0021] FIG2 is a schematic diagram of the position of the label transfer platform and the chute seat on one side of the printer provided in an embodiment of the present application;

[0022] FIG3 is an exploded view of a label transfer platform provided in an embodiment of the present application;

[0023] FIG4 is a top view of a label transfer platform provided in an embodiment of the present application;

[0024] FIG5 is a schematic structural diagram of a manipulator provided in an embodiment of the present application;

[0025] FIG6 is a schematic structural diagram of the carrying platform provided in an embodiment of the present application.

[0026] In the accompanying drawings, the drawings are not necessarily drawn to scale.

[0027] Reference numerals: printer 1; label transfer platform 2; raised portion 21; first plate 22; second plate 23; photoelectric sensor 24; light-transmitting hole 25; through hole 26; carrying platform 3; clamping member 31; rotating member 32; robot 4; main body 41; moving portion 42; suction arm 43; negative pressure sensor 5;

[0028] Chute seat 6; preset transfer position A; label outlet position B; operating table C. DETAILED DESCRIPTION

[0029] To make the purpose, technical solutions, and advantages of the embodiments of this application more clear, the technical solutions in the embodiments of this application will be clearly described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0030] Unless otherwise defined, all technical and scientific terms used in this application have the same meanings as commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned drawings are intended to cover non-exclusive inclusions. The terms "first" and "second" in the specification and claims of this application or the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order or a primary-secondary relationship.

[0031] This application is based on the inventor's discovery and understanding of the following facts and problems:

[0032] In the semiconductor processing process, it is necessary to paste corresponding labels on the cards on the surface of the opal boxes, crystal boxes and crystal boats. Currently, the degree of automation of label pasting in semiconductor processing production lines is low, and the label pasting operation still requires a lot of manual operation, which makes the label pasting efficiency low. During the label pasting process, it is necessary to manually print the labels and paste them on the corresponding opal boxes, crystal boxes and crystal boats, etc., and after the label pasting is completed, the opal boxes, crystal boxes and crystal boats need to be manually transferred to the designated platform to wait for the robot to grab them. Due to the mismatch between the manual operation speed of the label pasting process and the speed of the robot grabbing the opal boxes, crystal boxes and crystal boats after labeling, it is difficult to match the rhythm of the label pasting process corresponding to the opal boxes, crystal boxes and crystal boats with the finished product grabbing process, and there are also safety risks in the interaction between human and robot actions.

[0033] In order to solve the above problems, an embodiment of the present application provides a labeling device for semiconductor process. The labeling device for semiconductor process according to the embodiment of the present application is described in detail below with reference to FIG. 1 to FIG. 6 .

[0034] As shown in Figure 1, an embodiment of the present application provides a labeling device for semiconductor processes, which can be placed on an operating table C and includes a label making part, a carrying platform 3 and a manipulator 4. The label making part includes a printer 1 and a label transfer platform 2. The printer 1 is used to generate labels. The label transfer platform 2 is movably arranged on the side of the printer 1. The carrying platform 3 is used to carry the target object to be labeled. It can be understood that when labeling the target object, the target object can be fixed on the carrying platform 3, and the label can be made into a sheet by the printer 1. The label transfer platform 2 can receive the label cut from the printer 1 and transfer it to the movement range of the manipulator 4. The label can be pasted to the labeling surface of the target object through the transfer action of the manipulator.

[0035] It should be emphasized that the label transfer platform 2 includes a carrying surface provided with a plurality of raised portions 21 arranged in an array and spaced apart from each other by a preset distance. The label transfer platform 2 carries the adhesive surface of the label via the plurality of raised portions 21 .

[0036] It can be understood that since the label produced by the printer 1 needs to be pasted on the target object, the label has a relative adhesive surface and label surface. The robot 4 is connected to the label surface of the label during operation, thereby transferring the label and making the adhesive surface of the label abut against the target object. Based on this, the label transfer platform 2 needs to be connected to the adhesive surface of the label in the process of receiving the label. There are multiple raised portions 21 distributed in an array on the carrying surface of the embodiment of the present application, and the raised portions 21 abut against the adhesive surface of the label, and the top area of ​​the raised portion 21 connecting with the adhesive surface is small, which can effectively prevent large-area contact and bonding between the adhesive surface of the label and the label transfer platform 2.

[0037] In addition, please refer to Figures 1 and 6. The carrying platform 3 includes a clamping member 31, and the carrying platform 3 fixes the target object through the clamping member 31. The manipulator 4 is arranged between the label making member and the carrying platform 3, and the manipulator 4 is constructed so that its movement range covers at least part of the label making member and part of the carrying platform 3. The manipulator 4 includes an adsorption component, which can adsorb the label surface of the label on the label transfer platform 2 and transport the label to the target object to be labeled for pasting operation.

[0038] It can be understood that when labeling the target object, since the automatic movement of the robot 4 is set by the program, the robot 4 will transfer the label to the predetermined labeling position after sucking the label. Based on this, the target object can be fixed on the supporting platform by the clamping member 31, and the installation position of the target object on the clamping member 31 can be adjusted to ensure that the position of the target object to be labeled is consistent with the aforementioned labeling position.

[0039] In some embodiments, referring to FIG. 1 and FIG. 2 , the extension line of the moving path of the label transfer platform 2 intersects with the center line of the carrying platform 3 passing through the labeling position, and the intersection point is adjacent to the longitudinal line of the robot 4 .

[0040] It can be understood that in order to make the movement range of the manipulator 4 cover the label transfer area to the greatest extent, the printer 1 and the carrier platform 3 can be arranged diagonally, and the moving direction of the label transfer platform 2 intersects with the center line passing through the labeling position and makes the intersection point adjacent to the longitudinal line of the manipulator 4, thereby ensuring that the manipulator 4 is at the corner formed by the carrier platform 3 and the label transfer platform 2, thereby facilitating the manipulator 4 to transfer labels between the label transfer platform 2 and the carrier platform 3.

[0041] In some embodiments, please refer to Figures 1 and 5 together. A negative pressure sensor 5 is adjacent to the outside of the manipulator 4. The manipulator 4 also includes a main body 41 and a moving part 42 connected to the main body 41. The adsorption component includes an adsorption arm 43 connected to one end of the moving part 42 and a negative pressure pipeline built into the main body 41 and the moving part 42. The negative pressure pipeline is connected to the negative pressure sensor 5.

[0042] It can be understood that the movable part 42 and the adsorption arm 43 can be twisted and moved relative to the main body 41, the first end of the negative pressure pipeline can be connected to the adsorption arm 43, and the second end of the negative pressure pipeline can be connected to the negative pressure generator. During operation, the negative pressure generator can create negative pressure on the surface of the adsorption arm 43, so that the adsorption arm 43 can smoothly absorb the label under the action of negative pressure.

[0043] It should be emphasized that since the negative pressure pipeline is connected to a negative pressure sensor 5, the negative pressure sensor can be installed on the operating table C and adjacent to the manipulator 4. The negative pressure sensor 5 can monitor and display the adsorption force value formed by the adsorption arm 43 on the label.

[0044] In some embodiments, please refer to Figures 1 and 2 together. The label making part also includes a slide seat 6, which is fixed to the side of the printer 1 and adjacent to the label outlet position B. The label transfer platform 2 can be slidably installed on the slide seat 6. The label transfer platform 2 has a preset transfer position A. The preset transfer position A is away from the label outlet position B of the printer 1 along the moving direction of the label transfer platform 2 and is within the movement range of the robot 4.

[0045] It can be understood that in order to ensure that the label transfer platform 2 can receive the label from the label outlet position B and move it to the preset transfer position A, a slide seat can be installed on the side of the printer 1 and the label transfer platform 2 can slide back and forth on the slide seat 6; in addition, the preset transfer position A is within the movement range of the manipulator 4, thereby ensuring that the manipulator 4 can smoothly absorb the label at the preset transfer position A.

[0046] In some embodiments, please refer to Figures 3 and 4 together. The label transfer platform 2 includes a first plate 22 and a second plate 23 stacked on each other, and a photoelectric sensing sensor 24 is sandwiched between the first plate 22 and the second plate 23. The photoelectric sensing sensor 24 is limitedly connected to at least one of the first plate 22 and the second plate 23. The label transfer platform 2 also has a sensing area, which is provided on the first plate 22 and has a light-transmitting hole 25 therein. The projection of the light-transmitting hole 25 along the thickness direction of the first plate 22 at least partially overlaps with the photoelectric sensing sensor 24.

[0047] In an embodiment of the present application, since the automated process of the printer 1 in making labels and separating the labels to the label transfer platform 2 may cause errors during actual application, when the printer 1 fails to make labels smoothly, in order to prevent the label transfer platform 1 and the robot 4 from operating empty, the embodiment of the present application can detect whether there is a label on the label transfer platform 2 by setting a photoelectric sensor 24.

[0048] It can be understood that since the projection of the format of the light-transmitting hole 25 along the thickness direction of the first plate 22 at least partially overlaps with the photoelectric sensor 21, when there is no label on the label transfer platform 2, the photoelectric sensor 24 can sense the light transmitted from the light-transmitting hole 25. When there is a label on the label transfer platform 2, the photoelectric sensor 24 cannot sense the light transmitted from the light-transmitting hole 25. At this time, the label is smoothly transferred from the printer 1 to the label transfer platform 2.

[0049] In some embodiments, please refer to Figures 3 and 4 together. The loading surface is the side of the first plate 22 away from the second plate 23. The multiple protrusions 21 are distributed in a multi-row array and the arrangement direction of each row of protrusions 21 is consistent with the moving direction of the label transfer platform 2. The multiple protrusions 21 are arranged on the first plate 22 adjacent to the label. The first plate 22 and the second plate 23 are provided with two or more groups of corresponding through holes 26 along their own thickness directions. Bolts can be passed through each group of corresponding through holes 26 to limit the connection between the first plate 22 and the second plate 23.

[0050] It can be understood that the cross-sectional dimension of the raised portion 21 parallel to the aforementioned load-bearing surface gradually decreases along the extension direction from the bottom of the first plate 22 to the top away from the first plate 22. The raised portion 21 has a smaller top dimension to reduce its contact area with the label, thereby avoiding large-area contact and bonding between the adhesive surface of the label and the raised portion 21.

[0051] In one example, the protrusion 21 can be configured as a polygonal pyramid structure, a polygonal pyramid structure, a truncated cone structure, a cone structure, or other suitable structural forms.

[0052] In some embodiments, please refer to Figure 6, the supporting platform 3 also includes a rotating member 32 connected to the clamping member 31, and the rotating member 32 can involve the clamping member 31 and the target object to rotate synchronously. It can be understood that after the target object is fixed on the clamping member 31, it is difficult for the labeling surface of the target object to directly coincide with the preset labeling position. Therefore, in order to facilitate the manipulator 4 to perform programmed and patterned operations, the rotating member 32 can be used to involve the clamping member 31 and the target object to rotate synchronously so that the labeling surface of the target object coincides with the preset labeling position.

[0053] In one example, the target object can be any one of a wafer boat, an opal box and a crystal box, that is, the labeling device for semiconductor process provided in the embodiment of the present application can label any one of the wafer boat, crystal box and opal box needed in the semiconductor manufacturing process.

[0054] In summary, the labeling device for semiconductor processes provided in the embodiment of the present application fixes the target object to be labeled on the supporting platform 3, the printer 1 can automatically generate labels, the label transfer platform 2 can translate on one side of the printer 1 to receive and transfer the label, and the robot 4 grabs the label on the label transfer platform 2 through the adsorption component and sticks it to the surface of the target object. The label contacts the multiple raised portions 21 on the supporting surface on the label transfer platform 2. Since the top area where the raised portion 21 is connected to the adhesive surface of the label is small, it can effectively prevent the adhesive surface of the label from contacting and bonding with the label transfer platform 2 over a large area. The entire label pasting process can be automated, and the labeling device can perform fast and accurate full-process automated labeling on various types of components to be labeled.

[0055] References to "embodiments" in this application mean that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments.

[0056] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," "connected," and "attached" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; they may refer to direct connections, indirect connections through an intermediate medium, or internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0057] In the embodiments of this application, the same reference numerals represent the same components, and for the sake of brevity, detailed descriptions of the same components in different embodiments are omitted. It should be understood that the thickness, length, width, and other dimensions of the various components in the embodiments of this application, as well as the overall thickness, length, width, and other dimensions of the integrated device shown in the drawings are merely illustrative and should not constitute any limitation on this application.

[0058] The term "plurality" used in this application refers to more than two, including two.

[0059] Although the present application has been described with reference to preferred embodiments, various modifications may be made thereto and components may be replaced with equivalents without departing from the scope of the present application. In particular, the various technical features described in the various embodiments may be combined in any manner as long as there are no structural conflicts. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions within the scope of the claims.

Claims

1. A labeling device for semiconductor manufacturing, comprising: A label production component comprises a printer (1) and a label transfer platform (2), wherein the printer (1) is used to generate labels, the label transfer platform (2) is movably arranged on the side of the printer (1), the label transfer platform (2) comprises a carrying surface, the carrying surface is provided with a plurality of raised portions (21) distributed in an array and spaced apart from each other by a preset distance, and the label transfer platform (2) carries the adhesive surface of the label via the plurality of raised portions (21); A carrying platform (3) for carrying a target object to be labeled, the carrying platform (3) comprising a clamping member (31), the carrying platform (3) fixing the target object via the clamping member (31); and A robot (4) is provided between the label making part and the carrying platform (3), and is constructed so that its range of motion covers at least a portion of the label making part and a portion of the carrying platform (3). The robot (4) includes an adsorption component for adsorbing the label surface of the label on the label transfer platform (2) and transporting the label to a position on the target object to be labeled for attachment, so as to perform an attachment operation.

2. The semiconductor process labeling device according to claim 1, wherein: The extension line of the moving path of the label transfer platform (2) intersects with the center line of the carrying platform (3) passing through the labeling position, and the intersection point is adjacent to the longitudinal line of the robot (4).

3. The semiconductor process labeling device according to claim 1 or 2, wherein: A negative pressure sensor (5) is adjacent to the outside of the manipulator (4). The manipulator (4) further comprises a main body (41) and a movable part (42) connected to the main body (41). The adsorption assembly comprises an adsorption arm (43) connected to one end of the movable part (42) and a negative pressure pipeline built into the main body (41) and the movable part (42). The negative pressure pipeline is connected to the negative pressure sensor (5).

4. The semiconductor process labeling device according to claim 1 or 2, wherein: The label transfer platform (2) has a preset transfer position (A), and the preset transfer position (A) is away from the label outlet position (B) of the printer (1) along the moving direction of the label transfer platform (2) and is within the range of motion of the robot (4).

5. The semiconductor process labeling device according to claim 4, wherein: The label making component further comprises a slide seat (6), the slide seat (6) being fixed to the side of the printer (1) and adjacent to the label outlet position (B), and the label transfer platform (2) being slidably mounted on the slide seat (6).

6. The semiconductor process labeling device according to claim 1, wherein: The label transfer platform (2) comprises a first plate (22) and a second plate (23) stacked on each other, a photoelectric sensor (24) is sandwiched between the first plate (22) and the second plate (23), and the photoelectric sensor (24) is positionally connected to at least one of the first plate (22) and the second plate (23).

7. The semiconductor process labeling device according to claim 6, wherein: The label transfer platform (2) further comprises a sensing area, which is arranged on the first plate (22) and has a light-transmitting hole (25) therein, wherein the projection of the light-transmitting hole (25) along the thickness direction of the first plate (22) at least partially overlaps with the photoelectric sensor (24).

8. The semiconductor process labeling device according to claim 6 or 7, wherein: The carrying surface is the side of the first plate (22) away from the second plate (23), the plurality of protrusions (21) are distributed in a multi-row array, and the arrangement direction of the protrusions (21) in each row is consistent with the moving direction of the label transfer platform (2).

9. The semiconductor process labeling device according to claim 6 or 7, wherein: The first plate (22) and the second plate (23) are provided with two or more groups of mutually corresponding through holes (26) along their thickness direction, and bolts can be passed through each group of the mutually corresponding through holes (26) to connect the first plate (22) and the second plate (23) in a limited manner.

10. The semiconductor process labeling device according to claim 1 or 2, wherein: The carrying platform (3) further comprises a rotating member (32) connected to the clamping member (31), wherein the rotating member (32) can cause the clamping member (31) and the target object to rotate synchronously, and the target object is any one of a crystal boat, an opal box and a crystal box.

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