Image sensor module, camera module, and electronic device

Abstract

Embodiments of the present application provide an image sensor module. The image sensor module comprises a module bottom plate, a carrier, image sensors, and a driving mechanism; the carrier is arranged on the module bottom plate; a contact portion is provided on the side of the carrier facing the module bottom plate; and the driving mechanism is used for driving the carrier to move on the module bottom plate by means of the contact portion, so that the image sensors move relative to the module bottom plate. The contact portion of the carrier is in contact with the module bottom plate, so that movement inclination and longitudinal sliding caused by offset of the resultant force center of friction and the resultant force center of pressure during movement of image sensors can be reduced, thereby improving the optical anti-shake performance.

Description

Image sensor modules, camera modules and electronic devices

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on March 8, 2024, with application number 202410282634.4, and invention name “Image sensor module, camera module and electronic device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of imaging, and in particular to image sensor modules, imaging modules and electronic equipment. Background Art

[0003] When shooting video, images can be blurred due to hand or object shaking, or due to limitations in the optical environment. Optical image stabilization (OIS) technology has been introduced to improve this situation. Currently, OIS can be achieved by moving the image sensor. However, moving the image sensor causes tilt and axial slip, which affects the performance of OIS.

[0004] Therefore, how to improve the performance of optical image stabilization has become an urgent problem to be solved. Summary of the Invention

[0005] The present application provides an image sensor module, a camera module and an electronic device, which can reduce the movement tilt and longitudinal slip generated during the movement of the image sensor, thereby improving the performance of optical image stabilization.

[0006] In a first aspect, an image sensor module is provided, comprising a module base plate; a carrier, the carrier being arranged on the module base plate, and a contact portion being provided on a side of the carrier facing the module base plate; an image sensor; and a driving mechanism, the driving mechanism being used to drive the carrier to move on the module base plate through the contact portion so as to move the image sensor relative to the module base plate.

[0007] In the embodiments of the present application, a contact portion is provided on a carrier, which contacts the module base plate via the contact portion, thereby driving the image sensor to move. During the movement of the image sensor, the center of force resulting from the frictional force and the center of force resulting from the pressure force causing the carrier to contact the module base plate remain relatively stationary. This reduces movement tilt and longitudinal slippage caused by the offset between the centers of force resulting from the frictional force and the pressure force during movement of the image sensor, thereby improving optical image stabilization performance.

[0008] In combination with the first aspect, in certain implementations of the first aspect, the carrier includes: a first protrusion toward the module base plate, a first groove is provided on the side of the first protrusion toward the module base plate, a ball is provided in the first groove, and the first groove and the ball form a contact portion.

[0009] In combination with the first aspect, in certain implementations of the first aspect, the carrier includes: a second protrusion facing the module bottom plate, the friction coefficient of the second protrusion facing the module bottom plate is less than 0.3, and the second protrusion forms a contact portion.

[0010] In the embodiment of the present application, by providing a contact portion on the carrier and having the contact portion protrude from the carrier, the functions of the carrier and the contact portion can be integrated, which is beneficial to modularizing drive-related components, avoiding grooving or plating on the module base plate, and helping to reduce the volume of the image sensor module.

[0011] In combination with the first aspect, in certain implementations of the first aspect, the image sensor module further includes: a flexible circuit board arranged between the carrier and the module base plate; the flexible circuit board includes: a bearing portion, an elastic connector and a fixed connector, the elastic connector connects the bearing portion and the fixed connector, the bearing portion is provided with a notch passing through the bearing portion in a direction parallel to the optical axis of the image sensor, and the contact portion contacts the module base plate through the notch.

[0012] In the embodiment of the present application, the image sensor is carried on the carrying part, and the image sensor is moved relative to the module base plate through the elastic connecting member and the fixed connecting member, thereby achieving stable optical image stabilization compensation.

[0013] In combination with the first aspect, in certain implementations of the first aspect, the image sensor module further includes: a support member, the support member being used to support the carrying portion and supporting the image sensor; the support member being connected to the carrying portion, and the carrying portion and the carrier being connected so that the carrier drives the image sensor to move relative to the module base plate.

[0014] In combination with the first aspect, in certain implementations of the first aspect, the support member is provided with a notch running through the support member in a direction parallel to the optical axis of the image sensor, and the contact portion contacts the module base plate through the notch of the bearing portion and the notch of the support member.

[0015] In combination with the first aspect, in certain implementations of the first aspect, the image sensor module further includes: a module top plate, the module top plate and the module bottom plate are arranged opposite to each other along the optical axis direction of the image sensor and are stationary relative to the module bottom plate; the driving mechanism includes a first driving member and a second driving member, the first driving member is arranged on the module top plate, and the second driving member is arranged on the carrier.

[0016] In combination with the first aspect, in some implementations of the first aspect, the first driving member is a coil, and the second driving member is a first magnetic member.

[0017] In combination with the first aspect, in some implementations of the first aspect, the first driving member is a first magnetic member, and the first driving member is a coil.

[0018] In combination with the first aspect, in certain implementations of the first aspect, the first magnetic member is a magnet arranged in a Halbach array.

[0019] In combination with the first aspect, in certain implementations of the first aspect, the carrier includes a first frame and a second frame arranged opposite to each other along a first direction, and a third frame and a fourth frame arranged opposite to each other along a second direction, the second driving member is arranged on the first frame and the third frame, and the first driving member is arranged on the frame of the module top plate on the same side as the second driving member.

[0020] In the embodiment of the present application, since the contact portion is arranged on the carrier, the center of the resultant force of the friction force of the movement and the center of the resultant force of the pressure that causes the carrier to contact the module base plate remain relatively stationary, thereby improving the stability of the movement. Therefore, it is possible to meet the stability requirements of unilateral driving. Accordingly, the size of the side frame of the carrier where no driving member is provided can be reduced, effectively reducing the size of the image sensor module.

[0021] In combination with the first aspect, in certain implementations of the first aspect, the first magnetic component is a bar magnet, the top plate of the module is provided with a chamfer, the chamfer is made of magnetic conductive material, and a notch is provided in the middle of the bar magnet, which passes through the bar magnet along the optical axis direction of the image sensor, and the chamfer is used to shield the magnetic interference of the first magnetic component at the notch along the first direction or the second direction.

[0022] In the embodiment of the present application, a notch is provided in the middle of the magnet, and magnetic interference at the notch is shielded by chamfering, thereby reducing magnetic interference between magnetic parts and facilitating shortening the distance between magnetic parts, thereby further reducing the size of the image sensor module.

[0023] In combination with the first aspect, in certain implementations of the first aspect, the module base plate is at least partially made of magnetic conductive material, and the image sensor module further includes: a second magnetic member disposed on the carrier, and the first magnetic member is used to generate a magnetic attraction force with the module base plate to provide at least partial pressure between the carrier and the module base plate.

[0024] In combination with the first aspect, in certain implementations of the first aspect, the image sensor module further includes: a second magnetic member disposed on the carrier, the second magnetic member being configured to generate a repulsive force with the first magnetic member to provide at least partial pressure between the carrier and the module base plate.

[0025] In combination with the first aspect, in certain implementations of the first aspect, a second groove is provided on a surface of the carrier away from the module, and the second magnetic member is accommodated in the second groove.

[0026] In combination with the first aspect, in some implementations of the first aspect, the second groove and the contact portion are arranged opposite to each other along a direction parallel to the optical axis of the image sensor.

[0027] In the embodiment of the present application, the second magnetic member and the contact portion are arranged relative to each other, and the resultant center of the friction force of the movement and the resultant center of the pressure that causes the carrier to contact the module base plate remain relatively stationary and close, further improving the movement stability of the image sensor.

[0028] In combination with the first aspect, in certain implementations of the first aspect, it further includes: an elastic member, one end of the elastic member is connected to the module top plate, and the other end is connected to the side of the carrier facing the module top plate; the elastic member is used to generate an elastic force toward the module bottom plate to provide at least partial pressure between the carrier and the module bottom plate.

[0029] In combination with the first aspect, in certain implementations of the first aspect, the carrier and the coil are integrally formed by an injection molding process.

[0030] In a second aspect, a camera module is provided, which includes: a lens module and an optical module as in the second aspect, wherein the lens is fixed to a lens driving device, the image sensor is carried on a carrier, and the lens module is located on the light incident side of the image sensor.

[0031] In a third aspect, a camera module is provided, which includes: an image sensor, a lens module and an image sensor module as implemented in any of the first aspects, the lens module is fixed to a lens driving device, the image sensor is fixed to a carrier, and the lens module is located on the light incident side of the image sensor.

[0032] In a fourth aspect, an electronic device is provided, characterized in that the electronic device includes a processor and a camera module such as the third aspect or the fourth aspect, and the processor is used to process the output signal and output drive signal of the image sensor. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] FIG1 shows a schematic structural diagram of an electronic device 100 .

[0034] FIG. 2 shows a front view of the electronic device 100 .

[0035] FIG. 3 shows a rear appearance view of the electronic device 100 .

[0036] FIG4 is a schematic structural diagram of a camera module according to an embodiment of the present application.

[0037] FIG5 is a schematic diagram of the assembly structure of an image sensor module 450 according to an embodiment of the present application.

[0038] FIG6 is a schematic diagram of the exploded structure of an image sensor module 450 according to an embodiment of the present application.

[0039] FIG7A is a schematic cross-sectional view of an image sensor module 450 according to an embodiment of the present application.

[0040] FIG7B is a cross-sectional structural diagram of the image sensor module 450 taken along line AA according to an embodiment of the present application.

[0041] FIG7C is a CC cross-sectional structural diagram of an image sensor module 450 according to an embodiment of the present application.

[0042] FIG7D is a cross-sectional structural diagram of the image sensor module 450 taken along line EE according to an embodiment of the present application.

[0043] FIG8A is a three-dimensional structural diagram of a carrier in one embodiment of the present application.

[0044] FIG8B is a three-dimensional structural diagram of the carrier from another angle in one embodiment of the present application.

[0045] FIG8C is an exploded structural diagram of the carrier from another angle in one embodiment of the present application.

[0046] FIG9A is a schematic cross-sectional view of a carrier in one embodiment of the present application.

[0047] FIG9B is a cross-sectional view of the carrier taken along line AA in one embodiment of the present application.

[0048] FIG10 is a schematic cross-sectional view of an image sensor module 450 according to an embodiment of the present application.

[0049] FIG11 is a schematic cross-sectional view of an image sensor module 450 according to another embodiment of the present application. DETAILED DESCRIPTION

[0050] The terms used in the following embodiments are only for the purpose of describing specific embodiments and are not intended to limit the present application. As used in the specification of this application and the appended claims, the singular expressions "a", "an", "said", "above", "the" and "this" are intended to also include expressions such as "one or more", unless there is a clear contrary indication in the context. It should also be understood that in the following embodiments of the present application, "at least one", "one or more" refer to one, two or more. The term "and / or" is used to describe the association relationship of associated objects, indicating that three relationships can exist; for example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone, where A and B can be singular or plural. The character " / " generally indicates that the previous and subsequent associated objects are in an "or" relationship.

[0051] References to "one embodiment" or "some embodiments" in this specification mean that a particular feature, structure, or characteristic described in conjunction with that embodiment is included in one or more embodiments of the present application. Thus, phrases such as "in one embodiment," "in some embodiments," "in other embodiments," and "in yet other embodiments" appearing in various places in this specification do not necessarily refer to the same embodiment, but rather mean "one or more but not all embodiments," unless otherwise specifically emphasized. The terms "including," "comprising," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0052] In the description of the embodiments of the present application, unless otherwise specified, “ / ” means or, for example, A / B can mean A or B; in the embodiments of the present application, the terms “first” and “second” are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as “first” and “second” may explicitly or implicitly include one or more of the features. In addition, in the description of the embodiments of the present application, “multiple” means two or more than two, and “at least one” and “one or more” mean one, two or more. The singular expressions “a”, “an”, “said”, “the” and “this” are intended to also include expressions such as “one or more” unless there is a clear indication to the contrary in the context.

[0053] In the description of the embodiments of the present application, the terms "up", "down", "left", "right", "inside", "outside", "vertical", "horizontal", etc. indicate orientations or positional relationships that are defined relative to the orientations or positions of the components schematically placed in the accompanying drawings. It should be understood that these directional terms are relative concepts. They are used for relative descriptions and clarifications, rather than indicating or implying that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. They may change accordingly according to changes in the orientation of the components placed in the accompanying drawings, and therefore cannot be understood as limitations on the present application. In addition, the "vertical" involved in the present application is not vertical in the strict sense, but is within the allowable error range. The "parallel" is not parallel in the strict sense, but is within the allowable error range.

[0054] The following describes an electronic device with a camera function and an embodiment for using such an electronic device. In some embodiments, the electronic device may be a portable electronic device that also includes other functions such as a personal digital assistant and / or a music player function, such as a mobile phone, a tablet computer, a wearable electronic device (such as a smart bracelet, a smart watch, a wireless headset, augmented reality glasses, augmented reality helmets, virtual reality glasses and virtual reality helmets, etc.), a video surveillance device, etc. Exemplary embodiments of portable electronic devices include but are not limited to those equipped with Or a portable electronic device with other operating systems. The portable electronic device may also be other portable electronic devices, such as a laptop computer. It should also be understood that in some other embodiments, the electronic device may not be a portable electronic device, but a desktop computer.

[0055] 1 shows a schematic structural diagram of an electronic device 100. The electronic device 100 may include a processor 110, an external memory interface 120, an internal memory 121, a universal serial bus (USB) interface 130, a charging management module 140, a power management module 141, a battery 142, an antenna 1, an antenna 2, a mobile communication module 150, a wireless communication module 160, an audio module 170, a speaker 170A, a receiver 170B, a microphone 170C, an earphone interface 170D, a sensor module 180, a button 190, a motor 191, an indicator 192, a camera 193, a display 194, and a subscriber identification module (SIM) card interface 195.

[0056] It should be understood that the structures illustrated in the embodiments of the present application do not constitute a specific limitation on the electronic device 100. In other embodiments of the present application, the electronic device 100 may include more or fewer components than shown, or may combine or separate certain components, or arrange the components differently. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.

[0057] The processor 110 may include one or more processing units, for example: the processor 110 may include an application processor (AP), a modem processor, a graphics processing unit (GPU), an image signal processor (ISP), a controller, a video codec, a digital signal processor (DSP), a baseband processor, and / or a neural-network processing unit (NPU), etc. Among them, different processing units can be independent components or integrated into one or more processors. In some embodiments, the electronic device 100 may also include one or more processors 110. Among them, the controller can generate an operation control signal based on the instruction opcode and the timing signal to complete the control of instruction fetching and execution. In some other embodiments, a memory can also be provided in the processor 110 for storing instructions and data.

[0058] In some embodiments, processor 110 may include one or more interfaces.

[0059] The charging management module 140 is configured to receive charging input from a charger.

[0060] The power management module 141 is used to connect the battery 142, the charging management module 140, and the processor 110. The power management module 141 receives input from the battery 142 and / or the charging management module 140 to provide power to the processor 110, the internal memory 121, the external memory, the display 194, the camera 193, and the wireless communication module 160.

[0061] The wireless communication function of the electronic device 100 can be implemented through the antenna 1, the antenna 2, the mobile communication module 150, the wireless communication module 160, the modem processor and the baseband processor.

[0062] The wireless communication module 160 can provide wireless communication solutions for application on the electronic device 100, including wireless local area networks (WLAN) (such as wireless fidelity (Wi-Fi) networks), Bluetooth (BT), global navigation satellite system (GNSS), frequency modulation (FM), near field communication technology (NFC), infrared technology (IR), etc.

[0063] Electronic device 100 implements display functionality through a GPU, display screen 194, and an application processor. A GPU is a microprocessor for image processing that connects display screen 194 and the application processor. The GPU is used to perform mathematical and geometric calculations for graphics rendering. Processor 110 may include one or more GPUs that execute program instructions to generate or modify display information.

[0064] The display screen 194 is used to display images, videos, etc. In some embodiments, the electronic device 100 may include one or more display screens 194 .

[0065] The electronic device 100 can implement a shooting function through an ISP, a camera 193, a video codec, a GPU, a display screen 194, and an application processor.

[0066] The ISP processes data fed back by camera 193. For example, when taking a photo, the shutter is opened, and light is transmitted through the lens to the camera's photosensitive element. The light signal is converted into an electrical signal, which is then passed to the ISP for processing and converted into a visible image. The ISP can also perform algorithmic optimization on image noise, brightness, and skin tone. It can also optimize parameters such as exposure and color temperature of the captured scene. In some embodiments, the ISP can be located within camera 193.

[0067] The camera 193 is used to capture still images or videos. The object generates an optical image through the lens and projects it onto the photosensitive element. The photosensitive element can also be called an image sensor, which can be a charge coupled device (CCD) or a complementary metal-oxide-semiconductor (CMOS) phototransistor. The photosensitive element converts the light signal into an electrical signal, and then passes the electrical signal to the ISP for conversion into a digital image signal. The ISP outputs the digital image signal to the DSP for processing. The DSP converts the digital image signal into an image signal in a standard RGB, YUV or other format. In some embodiments, the electronic device 100 may include one or more cameras 193.

[0068] The external memory interface 120 can be used to connect an external memory card, such as a Micro SD card, to expand the storage capacity of the electronic device 100. The external memory card communicates with the processor 110 via the external memory interface 120 to implement data storage functions. For example, files such as music and videos can be stored on the external memory card.

[0069] The internal memory 121 can be used to store one or more computer programs, which include instructions. The processor 110 can execute the above instructions stored in the internal memory 121, thereby enabling the electronic device 100 to perform the optical image stabilization in some embodiments of the present application, as well as various applications and data processing. The internal memory 121 may include a program storage area and a data storage area. The program storage area may store an operating system; the program storage area may also store one or more applications (such as a gallery), etc. The data storage area may store data (such as photos) created during the use of the electronic device 100. In addition, the internal memory 121 may include a high-speed random access memory, and may also include a non-volatile memory, such as one or more disk storage components, a flash memory component, a universal flash storage (UFS), etc. In some embodiments, the processor 110 can execute the instructions stored in the internal memory 121, and / or the instructions stored in the memory provided in the processor 110, thereby enabling the electronic device 100 to execute the optical image stabilization solution in the embodiments of the present application, as well as other applications and data processing. The electronic device 100 can implement audio functions through the audio module 170, the speaker 170A, the receiver 170B, the microphone 170C, the headphone jack 170D, and the application processor.

[0070] The sensor module 180 may include a pressure sensor 180A, a gyroscope sensor 180B, an air pressure sensor 180C, a magnetic sensor 180D, an acceleration sensor 180E, a distance sensor 180F, a proximity light sensor 180G, a fingerprint sensor 180H, a temperature sensor 180J, a touch sensor 180K, an ambient light sensor 180L, a bone conduction sensor 180M, and the like.

[0071] The gyroscope sensor 180B can be used to determine the motion posture of the electronic device 100. In some embodiments, the angular velocity of the electronic device 100 around three axes (i.e., X, Y, and Z axes) can be determined by the gyroscope sensor 180B. The gyroscope sensor 180B can be used for optical image stabilization. For example, when the shutter is pressed, the gyroscope sensor 180B detects the angle of the electronic device 100 shaking, calculates the moving distance that the lens or image sensor needs to compensate for based on the angle, and allows the lens or image sensor to offset the shaking of the electronic device 100 through reverse motion to achieve image stabilization. The gyroscope sensor 180B can also be used for navigation and somatosensory game scenes.

[0072] Accelerometer 180E can detect the magnitude of the electronic device 100's acceleration in all directions (generally three axes), thereby estimating shake compensation in optical image stabilization solutions. When the electronic device 100 is stationary, it can detect the magnitude and direction of gravity. It can also be used to identify the electronic device's posture, enabling applications such as switching between landscape and portrait modes and pedometers.

[0073] Keys 190 include a power button, a volume button, and the like. Keys 190 can be mechanical or touch-sensitive. Electronic device 100 can receive key inputs and generate key signal inputs related to user settings and function control of electronic device 100. For example, key 190 can trigger a signal to capture an image and simultaneously trigger the processor to perform optical image stabilization.

[0074] Please refer to Figures 2 and 3 together, wherein Figure 2 shows the front appearance of the electronic device 100. Figure 3 shows the rear appearance of the electronic device 100. The camera 193 of the electronic device 100 may include a front camera 1931 and a rear camera 1932. The front camera 1931 can capture images of the area facing the display screen 194 of the electronic device 100, and the rear camera 1932 can capture images of the area facing the back cover of the electronic device 100.

[0075] In some possible embodiments, the front camera 1931 may be located below the display screen 194 to collect light through a camera hole provided in the display screen 194. The front camera may include the camera module 400 described in the following possible embodiments.

[0076] In some possible embodiments, the rear camera 1932 may be located below the back cover of the electronic device 100 and collect light through a camera hole provided on the back cover. The rear camera may include the camera module 400 in the possible embodiments described below.

[0077] The number of the front camera 1931 and the rear camera 1932 can be one or more.

[0078] The front camera 1931 and the rear camera 1932 may include at least one camera module 400 in possible embodiments described below, which may be, for example, one or more of a standard camera module, a telephoto camera module, a wide-angle camera module, an ultra-telephoto camera module, and an ultra-wide-angle camera module.

[0079] In some possible embodiments, the electronic device 100 may further include a flash module 310 for compensating for light intensity during shooting.

[0080] When the electronic device 100 is shooting, the image may be blurred due to shaking of the hand or object, or limitations of the optical environment of the camera. In this case, the blurred image can be improved by moving the lens and / or the image sensor.

[0081] In some possible embodiments, camera shake can be detected by feedback signals from motion sensors such as the gyroscope sensor 180B or the accelerometer 180E, or by detecting images. In this case, the camera lens, image sensor, and camera module 400 can be moved to perform anti-motion compensation. Specifically, anti-motion compensation can be performed for tilt and offset, lateral or longitudinal translation, and rotation to achieve optical image stabilization.

[0082] FIG4 is a schematic structural diagram of a camera module according to an embodiment of the present application.

[0083] As shown in FIG4 , the camera module 400 may include a lens module and an image sensor module 450. Specifically, the lens module may include a lens 410 and a lens driving device 420. The lens 410 may include one or more lenses. The lens 410 may collect light in the direction of the lens module and direct the collected light toward the image sensor 5. The image sensor 5 is mounted in the image sensor module 450. The image sensor 5 converts the light collected by the lens 410 into an electrical signal, which is then transmitted to the processor via a circuit. The processor processes the electrical signal to generate an image.

[0084] As another possible embodiment, when only the image sensor 5 needs to be moved for optical image stabilization, the camera module 400 may include the lens 410 and the image sensor module 450 but not the lens driving device 420 .

[0085] Other components may also be installed in the image sensor module 450, such as an infrared filter 6. The infrared filter 6 may be installed above the image sensor 5 to filter infrared light in the light.

[0086] In some embodiments, the image sensor module 450 drives the image sensor 5 to move on a plane, which can be a plane perpendicular to the optical axis of the camera module 400, or the plane can be a plane perpendicular to the optical axis P of the image sensor 5, that is, the plane can be parallel to the photosensitive surface of the image sensor 5.

[0087] In the camera module 400, in theory, the optical axis of the lens module and the optical axis P of the image sensor 5 can coincide. In the case of assembly errors or design tolerances, the optical axis of the lens module and the optical axis P of the image sensor 5 can also have a relative offset or tilt. However, regardless of whether they coincide or have an offset or tilt, the extension direction of the optical axis of the lens module and the optical axis P of the image sensor 5 are consistent (the consistent extension direction can be understood as basically the same direction, allowing a small range of relative tilt). In this case, the optical axis of the lens module and the optical axis P of the image sensor 5 can both be regarded as the optical axis of the camera module 400. In other embodiments, a prism can be added to the optical path to refract the light path. In this case, the extension directions of the optical axis of the lens module and the optical axis P of the image sensor 5 can also be different. In the embodiments below, unless otherwise specified, the optical axis of the camera module 400, the optical axis of the lens module, the optical axis of the lens 410, the optical axis of the image sensor module 450, and the optical axis P of the image sensor 5 are taken as examples.

[0088] The lens driving device 420 can drive the lens 410 to move to achieve optical focus, optical image stabilization, aberration adjustment and other functions of the camera module 400.

[0089] In a possible embodiment, the lens driving device 420 includes a housing and a lens driving mechanism. The housing can be configured to accommodate the lens 410 and a frame structure through which the light collected by the lens 410 can pass, and the housing is connected to other mechanisms (such as the image sensor module 450). The lens driving mechanism can be disposed in the housing to drive the lens 410 to move to achieve functions such as optical focus, optical image stabilization, and aberration adjustment. Specifically, the lens driving mechanism can move or tilt the lens of the lens 410 along the direction of the optical axis or in a direction perpendicular to the optical axis, thereby compensating for camera shake by counter-motion. Exemplarily, the lens driving mechanism may include a magnetic member and a magnetic driving coil, the magnetic member being connected to the housing, and the magnetic driving coil being connected to the lens 410. When there is camera shake, current is generated in the magnetic driving coil, and the lens 410 is driven by the Lorentz force between the magnetic member and the magnetic driving coil to move relative to the housing.

[0090] In an embodiment of the present application, a magnetic shielding structure (e.g., a shell having a magnetic conductive material) may be provided between the lens driving device 420 and the image sensor module 450 to shield magnetic interference between the image sensor module 450 and the lens driving device 420.

[0091] The lens module and the image sensor module 450 can constitute an optical assembly. The lens module and the image sensor module 450 can be independent modular structures that can adapt to different optical image stabilization scenarios. The lens module and the image sensor module 450 can be fixedly connected in a variety of ways (for example, in FIG4 , the lens module and the image sensor module 450 can be fixedly connected in an adhesive manner through the adhesive layer 430). In one possible embodiment, the lens module and the image sensor module 450 can also be fixed as a whole, and the image sensor 5 and the lens 410 can be mounted on the optical assembly as a whole.

[0092] The image sensor module 450 can drive the image sensor 5 carried thereon to move so as to realize functions such as optical image stabilization of the camera module 400 .

[0093] The image sensor module 450 can perform signal interaction with the processor of the electronic device 100 through the flexible circuit board 451 to transmit the electrical signal generated by the image sensor 5 and receive control signals from the processor, such as receiving a driving signal.

[0094] In one possible embodiment, the image sensor module 450 may include a housing and a drive mechanism. The housing may be configured as a frame structure that accommodates the image sensor 5 and allows light collected by the lens to pass through. The housing is connected to other mechanisms (e.g., the lens drive device 420). The drive mechanism may drive the image sensor 5 to move along a plane perpendicular to the optical axis P, thereby compensating for camera shake through inverse motion.

[0095] However, when the image sensor module 450 moves the image sensor, due to limitations in the processing technology, the contact surface of the contact portion may be uneven, which may cause movement tilt or slip along the optical axis, thereby affecting the performance of optical image stabilization.

[0096] Please refer to FIG. 5 , FIG. 6 , FIG. 7A , FIG. 7B , FIG. 7C and FIG. 7D for the image sensor module 450 .

[0097] FIG5 is a schematic diagram of the assembled structure of the image sensor module 450 according to an embodiment of the present application. FIG6 is a schematic diagram of the exploded structure of the image sensor module 450 according to an embodiment of the present application. FIG7A is a schematic diagram of a cross-section of the image sensor module 450 according to an embodiment of the present application. FIG7B is a structural diagram of the image sensor module 450 taken along line AA according to an embodiment of the present application. FIG7C is a structural diagram of the image sensor module 450 taken along line CC according to an embodiment of the present application. FIG7D is a structural diagram of the image sensor module 450 taken along line EE according to an embodiment of the present application.

[0098] As shown in Figures 5, 6, 7A, and 7D, the image sensor module 450 may include a module base plate 4522, a module top plate 4521, a carrier 453, and a drive mechanism 456. The module top plate 4521 and the module base plate 4522 are arranged opposite each other along the optical axis P of the image sensor 5. The module top plate 4521 may include a structure (e.g., a sidewall) connected to the module base plate 4522. The module top plate 4521 and the module base plate 4522 together constitute the housing of the image sensor module 450. The module top plate 4521 of the image sensor module 450 may be fixedly connected to the bottom of the lens drive device 420 by, for example, gluing (e.g., adhesive layer 430). The carrier 453 is disposed on the module base plate 4522. A contact portion is provided on the side of the carrier 453 facing the module base plate 4522, i.e., a structure that contacts the module base plate 4522 through sliding or friction. The carrier 453 contacts the module base plate 4522 via the contact portion. The driving mechanism 456 is used to drive the carrier 453 to move on the module base plate 4522 via the contact portion, so that the carrier 453 drives the image sensor 5 to move relative to the module base plate 4522.

[0099] The contact portion in the embodiment of the present application can be understood as a structure that contacts other objects through sliding friction or rolling friction.

[0100] When camera shake is detected, the image sensor module 450 receives a drive signal, and the drive mechanism generates a driving force based on the drive signal. This driving force pushes the carrier 453, causing it to move along the module base plate 4522 via the contact portion. Consequently, the image sensor carried on the carrier 453 also moves along the module base plate 4522, enabling the camera module 400 to compensate for camera shake.

[0101] The image sensor module 450 is provided with an opening K1 so that the light collected by the lens module can be collected by the image sensor 5 through K1. In the embodiments below, any component with an opening provided on the light incident side of the image sensor 5 can be represented by the opening K1.

[0102] The module base plate 4522 may be made of a thermally conductive material, for example, a material with a thermal conductivity greater than 0.5 W / m·K, to improve the heat dissipation performance of the module base plate 4522 , thereby reducing or avoiding image noise caused by overheating of the image sensor module 450 .

[0103] The image sensor 5 may be directly carried on the carrier 453 , or the carrier 453 may indirectly carry the image sensor 5 , for example, by carrying the image sensor 5 through the flexible circuit board 451 or the support member 454 .

[0104] As shown in Figure 6, in some embodiments, the image sensor module 450 may include a flexible circuit board 451, which is used to connect to the processor of the electronic device 100, and the connection method may be an electrical connection. The flexible circuit board 451 may be provided with an opening K1, which is aligned with the optical axis of the image sensor module 450. The image sensor 5 is disposed in the opening K1 of the flexible circuit board 451. The flexible circuit board 451 can transmit the signal collected by the image sensor 5 to the processor. The flexible circuit board 451 can be provided with a driver chip, which can also receive and transmit the drive signal to the driver chip. The driver chip generates a drive current in the coil based on the received drive signal, so that the drive mechanism can drive the carrier 453 to move the image sensor along a plane perpendicular to the optical axis P of the image sensor 5.

[0105] The drive mechanism can generate a driving force that moves the image sensor relative to the module base plate 4522. In some possible embodiments, the drive mechanism can be a magnetic structure motor, such as a voice coil motor (VCM). The drive mechanism can include a first drive member 4561 and a second drive member 4562, wherein the first drive member 4561 is disposed on the module top plate 4521 and the second drive member 4562 is disposed on the carrier 453. For example, the first drive member 4561 can be a magnetic member (such as a magnet) and the second drive member 4562 can be a coil. When the coil is energized, a Lorentz force is generated between the magnetic member and the energized coil, thereby using the Lorentz force as the driving force to drive the carrier 453 to move along the module base plate 4522 through the contact portion. As another example, due to the reciprocity of force action, the first drive member 4561 can be a coil and the second drive member 4562 can be a magnetic member. In other possible embodiments, the driving mechanism may also be other types of devices, such as a shape memory alloy motor (SMA) and a piezoelectric motor (PM).

[0106] In some embodiments, the first magnetic part can be a Halbach magnet. Since the embodiment of the present application adopts the scheme of contacting the module base plate 4522 through the contact portion of the carrier 453, the center of the resultant force of the friction force of the movement and the center of the resultant force of the pressure that causes the carrier 453 to contact the module base plate 4522 remain relatively stationary, thereby improving the movement stability. Therefore, the stability of the first magnetic part using the Halbach magnet is improved.

[0107] Halbach magnets, also known as Halbach arrays, are magnets whose magnetization directions differ from one another. Specifically, these magnets confine the magnetic flux lines to the surface, enhancing driving force without increasing module size. This improved stability reduces the risk of tipping over due to increased driving force.

[0108] As shown in Figures 6, 7B, 7C, and 7D, in some embodiments, the flexible circuit board 451 may include a load-bearing portion 4511, an elastic connector 4512 (e.g., a suspension wire or a spring), and a fixed connector 4513. The fixed connector 4513 is fixed relative to the module top plate 4521 and the module bottom plate 4522. The fixed connector 4513 may be connected to the module top plate 4521 or the module bottom plate 4522, or may not be connected to the module top plate 4521 or the module bottom plate 4522. When the fixed connector 4513 is connected to the module bottom plate 4522, it may be connected by gluing or other means (e.g., the adhesive layer 455 in Figure 6). The elastic connector 4512 connects the load-bearing portion 4511 and the fixed connector 4513. The load-bearing portion 4511, the elastic connector 4512, and the fixed connector 4513 of the flexible circuit board 451 may be independent structures or may be integrally formed through a circuit board manufacturing process. The opening K1 of the flexible circuit board 451 is provided in the carrier portion 4511. The carrier portion 4511 is used to support the image sensor 5 and is connected to the support member 454 and the carrier 453. When the carrier 453 is driven by the driving force generated by the driving mechanism 456, it moves the carrier portion 4511 and the image sensor 5 carried thereon. During this movement, the elastic connector 4512 elastically deforms relative to the fixed connector 4513, allowing the carrier portion 4511 and the image sensor 5 carried thereon to move within a certain range to compensate for camera shake and achieve movement and return of the image sensor 5 relative to the module base plate 4522.

[0109] The elastic connector 4512 connecting the load-bearing portion 4511 and the fixed connector 4513 can be a mechanical or electrical connection. In one possible embodiment, the elastic connector 4512 can include a conductive portion and an elastic portion, wherein the conductive portion is provided with circuit board traces for transmitting signals between the load-bearing portion 4511 and the fixed connector 4513. The conductive portion and the elastic portion can be separate components or the same component, such as a copper suspension wire, which can function both as a signal transmission component and an elastic connection component. The fixed connector 4513 is connected to an external circuit, transmitting image sensor signals transmitted via the elastic connector 4512 to the external circuit and transmitting drive signals transmitted by the external circuit. In other possible embodiments, the fixed connector 4513 can also be provided with a corresponding driver chip to process the drive signals. The elastic portion is used to ensure the strength of the elastic connector 4512 and to generate elastic deformation. When the elastic connector 4512 is made of metal, an insulating layer can be provided between the elastic connectors 4512 to shield electromagnetic interference between the traces of the elastic connector 4512. The insulating layer can be made of an insulating material such as polyamide.

[0110] In some embodiments, the image sensor module 450 may further include a support member 454, which may be a component made of a rigid material, such as a reinforcing steel sheet, a rigid organic material, or a ceramic steel sheet. The support member 454 is connected to the carrier 4511 and is located at the opening K1 of the carrier 4511. The image sensor 5 is carried on the support member 454. The carrier 4511 is connected to the carrier. The support member 454 can provide bending strength to the carrier 4511, thereby enabling the carrier 453 to drive the image sensor 5 on the carrier 4511 to move relative to the module base plate 4522. When the bending strength of the carrier 4511 itself is sufficient to enable the carrier 453 to drive the carrier 4511, the support member 454 may not be connected to the flexible circuit board 451.

[0111] The support member 454 in the embodiment of the present application can provide rigidity to the image sensor 5 and the flexible circuit board 451. The thickness of the support member 454 can be less than 300 microns. To ensure the reliability of the rigidity of the image sensor 5 and the flexible circuit board 451, the support member 454 can be a planar structure, that is, a structure without openings or grooves. This ensures that the support member 454 has good structural integrity and reduces the risk of bending of the image sensor 5 and the flexible circuit board 451 during movement.

[0112] In the embodiment of the present application, by setting the contact part on the carrier 453, the center of the resultant force of the friction force of the movement and the center of the resultant force of the pressure that makes the carrier 453 contact with the module base plate 4522 remain relatively stationary, thereby improving the stability of movement, and can also ensure that the structural integrity of the support member 454 is not destroyed, thereby reducing the risk of bending of the image sensor 5 and the flexible circuit board 451 during movement.

[0113] As another possible embodiment, if the support member 454 is relatively thick, for example, greater than 300 microns, a contact portion can be provided on the support member 454 to ensure that the center of the combined force of the frictional force and the center of the combined force of the pressure in contact with the module base plate 4522 remain relatively stationary. In this case, the sufficient thickness of the support member 454 can also ensure the rigidity of the image sensor 5 and the flexible circuit board 451.

[0114] Furthermore, due to the solution in the embodiment of the present application, the center of the resultant force of the frictional force of the movement and the center of the resultant force of the pressure that causes the carrier 453 to contact the module base plate 4522 remain relatively stationary, thereby improving the stability of the movement. The elastic coefficient (also called K value) of the elastic connector 4512 can be relatively small, for example, less than 160. Using an elastic connector 4512 with a small elastic coefficient is beneficial for saving energy consumption.

[0115] In some embodiments, the module base plate 4522 may be a planar structure, and the plane of the module base plate 4522 may be perpendicular to the optical axis direction of the camera module 400 , that is, may be perpendicular to the photosensitive surface of the image sensor 5 .

[0116] In the embodiment of the present application, the contact portion is arranged on the carrier 453, and the image sensor is carried on the carrier 453. During the movement of the image sensor, the center of the resultant force of the friction force of the movement and the center of the resultant force of the pressure that causes the carrier 453 to contact the module base plate 4522 remain relatively stationary, thereby reducing the movement tilt and longitudinal slippage caused by the offset of the center of the resultant force of the friction force and the center of the resultant force of the pressure during the movement of the image sensor, thereby improving the performance of optical image stabilization.

[0117] Specifically, in the currently used image sensor drive scheme, the contact portion is provided on the module base plate 4522, for example, by providing a groove on the module base plate 4522, providing a ball bearing in the groove, or providing a sliding coating on the module base plate 4522. The image sensor contacts the contact portion of the module base plate 4522 via a supporting mechanism. Since the module base plate 4522 is a planar structure, the module base plate 4522 needs to be etched when the groove is provided in the module base plate 4522, which makes it difficult to ensure the flatness of the bottom of the groove. Furthermore, since the resultant force of the friction between the movable mechanism supporting the image sensor and the module base plate 4522 is located at the center of the module base plate 4522, and the center of the resultant force of the pressure pressing the movable mechanism supporting the image sensor and the module base plate 4522 together is located at the center of the movable mechanism, the center of the resultant force of the friction and the center of the resultant force of the pressure move relative to each other during the movement of the image sensor, making it difficult to ensure the stability of the image sensor movement. Furthermore, due to the unevenness of the bottom of the groove of the module base plate 4522, the image sensor may tilt and slip axially during movement. In the embodiment of the present application, the image sensor module 450 contacts the module base plate 4522 via the contact portion provided on the carrier 453. This ensures that the center of the resultant friction force and the center of the resultant pressure force remain relatively stationary during movement of the image sensor, thereby ensuring the motion stability of the image sensor and improving the optical image stabilization performance of the camera module 400.

[0118] The module top plate 4521 can be a frame-shaped structure with an opening K1 in the center. The opening K1 is aligned with the optical axis P of the image sensor 5. Light collected by the lens 410 passes through the opening K1 in the module top plate 4521 and can be captured by the image sensor 5, thereby achieving imaging. The module top plate 4521 can be made of a magnetically conductive material. When connected to the lens driver 420, the module top plate 4521 can shield magnetic interference between the lens driver 420 and the image sensor module 450. The module top plate 4521 can include side walls of the image sensor module 450, that is, the module top plate 4521 and the side walls of the image sensor module 450 are an integral structure. The side walls can also be made of a magnetically conductive material. When the sensor module is fixed in an electronic device, the side walls of the image sensor module 450 can shield magnetic interference between the electronic device 100 and the image sensor module 450.

[0119] In some possible embodiments, the image sensor module 450 may not be provided with the module top plate 4521 , and only the side walls of the housing may be retained, and the components in the image sensor module 450 may be fixed on the side walls.

[0120] The structure of the carrier is described below with reference to FIG. 6 , FIG. 7D , FIG. 8A , FIG. 8B , FIG. 8C , FIG. 9A , and FIG. 9B .

[0121] Figure 8A is a three-dimensional structural diagram of a carrier in one embodiment of the present application. Figure 8B is a three-dimensional structural diagram of a carrier in one embodiment of the present application from another angle. Figure 8C is an exploded structural diagram of a carrier in one embodiment of the present application from another angle. Figure 9A is a cross-sectional schematic diagram of a carrier in one embodiment of the present application. Figure 9B is a cross-sectional diagram of the carrier taken along line AA in one embodiment of the present application.

[0122] In certain possible embodiments, in the image sensor module 450, the carrier 453 may include a first protrusion 4531 facing the module base plate 4522. A first groove 4533 is provided on the side of the first protrusion 4531 facing the module base plate 4522. Ball bearings are arranged in the first groove 4533. The first groove 4533 and the ball bearings form a contact portion that forms a low-friction contact with the module base plate 4522. For example, the friction coefficient can be less than 0.3. The top of the first groove 4533 can be provided with a rigid material 4539 with a smooth surface. The carrier 453 and the rigid material 4539 can be integrally formed using a two-material injection molding process. If the flatness of the top of the first groove 4533 can be guaranteed, the top of the first groove 4533 can also be free of any structure.

[0123] The balls can be made of steel or other rigid materials, for example, balls made of rigid organic materials (such as plastic) or ceramic steel materials, which is not limited in this application.

[0124] In certain possible embodiments, in the image sensor module 450, the carrier 453 may include a second protrusion facing the module base plate 4522, the friction coefficient of the second protrusion facing the module base plate 4522 being less than 0.3, and the second protrusion constituting a contact portion. The contact surface of the second protrusion with the module base plate 4522 may be achieved by a micro-nanostructure with an extremely low friction coefficient, such as an ultra-slip graphite microstructure, or by a surface coating or plating with an extremely low friction coefficient, such as liquid lubricating lubricating oil, solid lubricating tetrafluoroethylene, etc., distributed to the contact surface of the second protrusion with the module base plate 4522 through manufacturing processes such as physical spraying, electroplating, pasting, and physical pressing. Other processes may also be used to achieve low friction coefficient contact, such as surface treatment processes such as polishing, surface alloying processes such as carburizing and nitriding, and chemical conversion film processes.

[0125] The first protrusion 4531 or the second protrusion can be a point-like protrusion, such as three protrusions arranged in a triangular pattern. Because the triangle provides stability, it can reduce material usage while ensuring stability and help reduce the size of the sensor module. The first protrusion 4531 or the second protrusion can also be distributed in other patterns, such as at four corners or more locations, and this application is not limited to this.

[0126] In the embodiment of the present application, the carrier 453 and the module base plate 4522 are in contact through point-distributed protrusions, which is conducive to adjusting the contact position between the carrier 453 and the module base plate 4522, can reduce the requirements for the plane processing accuracy of the module base plate 4522, and improve the motion stability of the image sensor.

[0127] When heat-generating components such as the flexible printed circuit board 451 in the image sensor module 450 are suspended relative to the module base plate 4522, the thermal resistance of the air gap above the module base plate 4522 is relatively high. To reduce the area of ​​the air gap above the module base plate 4522, the first protrusion 4531 or the second protrusion can be strip-shaped protrusions, such as protruding ribs. The ribs can be distributed in a ring-like, mesh-like, or other manner. This increases the contact area between the carrier 453 and the module base plate 4522, facilitating heat dissipation from the heat-generating components in the image sensor module 450, reducing the operating junction temperature of the image sensor, and improving imaging quality.

[0128] The dimensions of carrier 453 can be slightly larger than the dimensions of carrying portion 4511. After carrier 453 is connected to carrying portion 4511, the first protrusion 4531 or the second protrusion can be located at the edge of carrier 453 that extends beyond carrying portion 4511. The dimensions of carrier 453 can also be no larger than the dimensions of carrying portion 4511. A notch 4514 is provided on the outer edge of carrying portion 4511, extending through carrying portion 4511 along the optical axis of the image sensor. The first protrusion 4531 or the second protrusion can also be located above this notch, with the contact portion of the first protrusion 4531 or the second protrusion contacting the module base plate 4522 through this notch.

[0129] The support member 454 can be adapted to the size of the bearing portion 4511. Furthermore, the support member 454 can also be provided with a notch that passes through the support member 454 along the optical axis of the image sensor. The contact portion of the first protrusion 4531 or the second protrusion contacts the module bottom plate 4522 through the notch of the bearing portion 4511 and the notch of the support member 454.

[0130] A welding site may be provided on one side of the carrier 453 facing the module base plate 4522 , and the support member 454 is welded to the carrier 453 via the welding site, thereby ensuring reliable connection among the carrier 453 , the support member 454 and the flexible circuit board 451 .

[0131] In the embodiment of the present application, the carrier 453 contacts the module base plate 4522, on which the active components of the image sensor module 450, such as the carrier 453 and the support member 454, are carried. The carrier 453 maintains contact with the module base plate 4522 through pressure. The pressure is directed toward the contact surface between the carrier 453 and the module base plate 4522, and the pressure is greater than the combined weight of the carrier 453 and the active components supported on the carrier 453. This ensures that the carrier 453 maintains contact with the module base plate 4522 in any operating state (for example, when the camera is inverted).

[0132] The carrier 453 described in each of the above embodiments can be integrally formed using an injection molding process, such as a two-component injection molding process, which facilitates installation and modular use, thereby improving the convenience of using the image sensor module. Furthermore, since the flatness of the mold during the injection molding process can be controlled, the problem of uneven groove bottoms caused by the etching process is avoided.

[0133] 10 and 11 illustrate how the carrier maintains contact with the module base plate.

[0134] Fig. 10 is a schematic cross-sectional view of an image sensor module 450 according to one embodiment of the present application. Fig. 11 is a schematic cross-sectional view of an image sensor module 450 according to another embodiment of the present application.

[0135] Referring to FIG. 10 , the module base plate 4522 of the image sensor module 450 can be at least partially made of a magnetically conductive material, such as an alloy containing iron, cobalt, or nickel. A second magnetic member 1010 can be disposed on the carrier 453 of the image sensor module 450. The magnetic attraction between this magnetic member and the module base plate 4522 can provide at least partial pressure between the carrier 453 and the module base plate 4522. The second magnetic member 1010 can be directly fixed to the carrier 453, or a second groove 4532 can be provided on a surface of the carrier 453 facing away from the module base plate 4522, with the second magnetic member 1010 accommodated in the second groove 4532. The method of securing the second magnetic member 1010 by accommodating the second magnetic member 1010 in the second groove is more reliable.

[0136] The number of second grooves 4532 can be three. When there are three second grooves 4532, the second magnetic member 1010 disposed in the second grooves 4532 can achieve stable pressing between the carrier 453 and the module bottom plate 4522. The number of second grooves 4532 can also be four or more, which is not limited in this application.

[0137] The second grooves 4532 and the contact portions may be provided correspondingly or independently of each other, that is, the number of the second grooves 4532 and the contact portions may be different, and the relative positions of the second grooves 4532 and the contact portions may also be different.

[0138] As a possible embodiment, the second groove 4532 can be arranged relative to the first protrusion 4531 or the second protrusion along a direction parallel to the optical axis P of the image sensor 5 to form a plug-in structure. At this time, the position of the applied pressure is located above or near the contact position between the carrier 453 and the module base plate 4522. When the driving mechanism drives the carrier 453 to move relative to the module base plate 4522, the center of the resultant force of the applied pressure and the center of the resultant force of the friction force during movement are relatively stationary and almost remain coincident, thereby improving the movement stability.

[0139] In another possible embodiment, the module base plate 4522 of the image sensor module 450 may also not include magnetic conductive material, and the image sensor module 450 may include a second magnetic member 1010 arranged on the carrier 453, and a repulsive force is generated between the second magnetic member 1010 and the first magnetic member to provide at least partial pressure between the carrier 453 and the module base plate 4522.

[0140] In another possible embodiment, referring to FIG. 10 , the module base plate 4522 of the image sensor module 450 may be at least partially made of a magnetically conductive material. A second magnetic member 1010 is disposed on the carrier 453 of the image sensor module 450, and the coil is fixed to the module top plate 4521. The second magnetic member 1010 simultaneously provides a Lorentz force that interacts with the coil to drive the carrier 453, and generates a magnetic attraction force between the module base plate 4522 to provide at least partial pressure between the carrier 453 and the module base plate 4522. The second magnetic member 1010 may be directly fixed to the carrier 453, or it may be disposed in a second groove 4532 disposed on a surface of the carrier 453 away from the module base plate 4522. The fixing method of accommodating the first magnetic member 710 in the groove is more reliable.

[0141] The above is merely an exemplary embodiment. In the embodiment shown in FIG. 9 , the second magnetic member 1010 and the second driving member 4562 may also be independent components.

[0142] Referring to Figures 6, 7C, 9A, and 10, in certain possible embodiments, the first driver 4561 is a bar magnet, the second driver 4562 is a coil, and the module top plate 4521 is provided with a chamfer 701 made of a magnetically conductive material. A notch is provided in the middle of the bar magnet, extending along the optical axis of the image sensor. The chamfer 701 isolates the notch in the bar magnet from the bar magnet along a first direction X and a second direction Y, thereby shielding magnetic interference from the bar magnet. The notch in the middle of the bar magnet can be used to accommodate a second magnetic element. When the second magnetic element is placed in the notch in the middle of the bar magnet, magnetic interference along the first and second directions is shielded by the chamfer 701 in the module top plate 4521. This ensures that the direction of the magnetic attraction between the second magnetic element and the module bottom plate 4522 is always along the optical axis of the image sensor, ensuring the reliability of the pressure provided.

[0143] A groove (such as the second groove 4532 above FIG. 9A ) can be provided on the side of the carrier 453 facing the module top plate 4521 at a position relative to the notch in the middle of the bar magnet. Placing the second magnetic member 1010 in the groove at this position can reduce or shield the magnetic interference of the first magnetic member along the first direction X and the second direction Y.

[0144] The first driving member 4561 and the second driving member 4562 in the driving mechanism of the present application can be independent components as shown in Figure 7, or can be an integrated structure, such as an SMA, which can change its size by heating it with electricity to generate driving force. In this case, the first driving member 4561 and the second driving member 4562 can refer to parts of a single component.

[0145] FIG11 is a schematic cross-sectional view of an image sensor module 450 according to an embodiment of the present application.

[0146] Referring to Figure 11, an elastic member 1110 can be set on the carrier 453 of the image sensor module 450. One end of the elastic member 1110 is connected to the carrier 453, and the other end is connected to the module top plate 4521. The elastic force generated by the elastic member 1110 being compressed along the optical axis direction of the image sensor toward the module bottom plate 4522 provides at least partial pressure between the carrier 453 and the module bottom plate 4522.

[0147] The connection point between the elastic member 1110 and the carrier 453 can be arranged relative to the first protrusion 4531 or the second protrusion along the optical axis direction of the image sensor. At this time, the position of the applied pressure is located above or near the contact position between the carrier 453 and the module base plate 4522. When the driving mechanism drives the carrier 453 to move relative to the module base plate 4522, the center of the resultant force of the applied pressure and the center of the resultant force of the friction force during movement are relatively stationary and almost coincide with each other, thereby improving the movement stability.

[0148] In conjunction with Figures 6, 9A, and 11, in certain possible embodiments, the drive mechanism may adopt a unilateral drive solution. As shown in Figure 9A, the carrier 453 includes a first frame 4535 and a second frame 4536 arranged opposite to each other along a first direction X, and a third frame 4537 and a fourth frame 4538 arranged opposite to each other along a second direction Y. The second drive member 4562 may be disposed on any side frame of the carrier 453 along the first direction X and any side frame of the carrier 453 along the second direction Y, for example, the first frame 4535 of the carrier 453 along the first direction X and the third frame 4537 of the carrier 453 along the second direction Y shown in Figure 9A. Due to the adoption of the solution in the embodiment of the present application, the center of the resultant force of the friction force of the movement and the center of the resultant force of the pressure that causes the carrier 453 to contact the module base plate 4522 remain relatively stationary, thereby improving the stability of the movement and ensuring the stability of the unilateral drive solution.

[0149] As shown in Figures 6 and 11 , the first driver 4561 is located on the same side of the module top plate 4521 as the second driver 4562. Due to the single-sided drive design, the edge of one side of the carrier 453 can be extended to accommodate the second driver 4562, while the side not housing the second driver 4562 can be appropriately reduced in size. For example, in Figures 10 and 11 , the width of the right side of the carrier is smaller than the width of the left side. This facilitates reducing the size of the image sensor module along the first direction X and the second direction Y.

[0150] In the embodiment of the present application, the center of the resultant force of the friction force of the movement and the center of the resultant force of the pressure that causes the carrier 453 to contact the module base plate 4522 remain relatively stationary, thereby improving the stability of the movement, ensuring the stability of the solution using a single-sided drive, and effectively compressing the size in the first direction X and the size in the second direction Y.

[0151] The carrier 453 and the second driving member 4562 carried on the carrier 453 can be integrally formed by an injection molding process. For example, the second driving member 4562 can be a coil, and the carrier 453 and the coil can be integrally formed by an insert molding process or a double-material injection molding process.

[0152] The second driving member 4562 may also be disposed on at least one side frame of the carrier 453 along the first direction X and at least one side frame of the carrier 453 along the second direction Y. That is, three-side driving or four-side driving is adopted.

[0153] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. An image sensor module, characterized in that: include: Module base plate (4522); A carrier (453), the carrier (453) being arranged on the module base plate (4522), and a contact portion being arranged on a side of the carrier (453) facing the module base plate (4522); Image sensor (5); A driving mechanism (456) is used to drive the carrier (453) to move on the module base plate (4522) through the contact portion, so as to move the image sensor (5) relative to the module base plate (4522).

2. The image sensor module according to claim 1, wherein: The carrier (453) comprises: A first protrusion (4531) is disposed toward the module base plate (4522), and a first groove (4533) is provided on one side of the first protrusion (4531) toward the module base plate (4522). A ball is disposed in the first groove (4533), and the first groove (4533) and the ball form the contact portion.

3. The image sensor module according to claim 1, wherein: The carrier (453) comprises: A second protrusion facing the module bottom plate (4522), the friction coefficient of the second protrusion facing the module bottom plate (4522) is less than 0.3, and the second protrusion forms the contact portion.

4. The image sensor module according to any one of claims 1 to 3, wherein: Also includes: A flexible circuit board (451) disposed between the carrier (453) and the module base plate (4522); The flexible circuit board (451) comprises: a bearing portion (4511), an elastic connecting member (4512) and a fixed connecting member (4513), wherein the elastic connecting member (4512) connects the bearing portion (4511) and the fixed connecting member (4513). The bearing portion (4511) is provided with a notch penetrating the bearing portion (4511) in a direction parallel to the optical axis of the image sensor (5), and the contact portion contacts the module base plate (4522) through the notch of the bearing portion (4511).

5. The image sensor module according to claim 4, wherein: Also includes: a support member (454), the support member (454) being used to support the carrying portion (4511) and bear the image sensor (5); The support member (454) is connected to the bearing portion (4511), and the bearing portion (4511) is connected to the carrier (453), so that the carrier (453) drives the image sensor (5) to move relative to the module base plate (4522).

6. The image sensor module according to claim 5, wherein: The support member (454) is provided with a notch penetrating the support member (454) in a direction parallel to the optical axis of the image sensor (5). The contact portion contacts the module bottom plate (4522) through the notch of the bearing portion (4511) and the notch of the support member (454).

7. The image sensor module according to any one of claims 1 to 6, wherein: Also includes: a module top plate (4521), the module top plate (4521) and the module bottom plate (4522) being arranged opposite to each other along the optical axis direction of the image sensor (5) and being stationary relative to the module bottom plate (4522); The driving mechanism (456) includes a first driving member (4561) and a second driving member (4562), wherein the first driving member (4561) is arranged on the module top plate (4521), and the second driving member (4562) is arranged on the carrier (453).

8. The image sensor module according to claim 7, wherein: The first driving member (4561) is a coil, and the second driving member (4562) is a first magnetic member.

9. The image sensor module according to claim 7, wherein: The first driving member (4561) is a first magnetic member, and the first driving member (4561) is a coil.

10. The image sensor module according to claim 8 or 9, characterized in that: The first magnetic member is a magnet arranged in a Halbach array.

11. The image sensor module according to any one of claims 7 to 10, wherein: The carrier (453) comprises a first frame and a second frame arranged opposite to each other along a first direction (X), and a third frame and a fourth frame arranged opposite to each other along a second direction (Y), wherein the first direction (X) and the second direction (Y) are perpendicular to each other and the first direction (X) and the second direction (Y) are perpendicular to the optical axis of the image sensor (5). The second driving member (4562) is provided on the first frame and the third frame, The first driving member (4561) is arranged on the frame of the module top plate (4521) on the same side as the second driving member (4562).

12. The image sensor module according to claim 9, wherein: The first magnetic member is a bar magnet, the module top plate (4521) is provided with a chamfer (701), and the chamfer (701) is made of a magnetic conductive material. A notch is provided in the middle of the bar magnet and passes through the bar magnet along the optical axis direction of the image sensor. The chamfer (701) is used to shield magnetic interference of the first magnetic member at the notch along a first direction (X) or a second direction (Y), wherein the first direction (X) and the second direction (Y) are perpendicular to each other and the first direction (X) and the second direction (Y) are perpendicular to the optical axis of the image sensor (5).

13. The image sensor module according to any one of claims 1 to 12, wherein: The module base plate (4522) is at least partially made of magnetic conductive material. The image sensor module further comprises: A second magnetic member (1010) is provided on the carrier (453), and the second magnetic member (1010) is used to generate a magnetic attraction force between the module base plate (4522) to provide at least partial pressure between the carrier (453) and the module base plate (4522).

14. The image sensor module according to claim 9, wherein: Also includes: A second magnetic member (1010) is provided on the carrier (453), and the second magnetic member (1010) is used to generate a repulsive force with the first magnetic member to provide at least partial pressure between the carrier (453) and the module bottom plate (4522).

15. The image sensor module according to claim 13 or 14, wherein: A second groove (4532) is provided on a side of the carrier (453) away from the module (4522), and the second magnetic member (1010) is accommodated in the second groove (4532).

16. The image sensor module according to claim 15, wherein: The second groove (4532) and the contact portion are arranged relative to each other along a direction parallel to the optical axis of the image sensor (5).

17. The image sensor module according to claim 7, wherein: Also includes: an elastic member (1110), one end of the elastic member (1110) being connected to the module top plate (4521), and the other end being connected to a side of the carrier (453) facing the module top plate (4521); The elastic member (1110) is used to generate an elastic force toward the module bottom plate (4522) to provide at least partial pressure between the carrier (453) and the module bottom plate (4522).

18. The image sensor module according to claim 9, wherein: The carrier (453) and the coil are integrally formed by injection molding.

19. A camera module, characterized in that: The camera module comprises: a lens module and an image sensor module as described in any one of claims 1 to 18, the lens module comprises a lens (410) and a lens driving device (420), the image sensor (5) is carried on the carrier (453), and the lens module is located on the light incident side of the image sensor (5).

20. A camera module, characterized in that: The camera module comprises: a lens (410) and an image sensor module according to any one of claims 1 to 18, the image sensor (5) is fixed to the carrier (453), and the lens (410) is located on the light incident side of the image sensor (5).

21. An electronic device, characterized in that: The electronic device includes a processor and a camera module as described in claim 19 or 20, and the processor is used to process the output signal and output drive signal of the image sensor.

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