Display module and electronic device

By using piezoelectric vibration plates and support plates in electronic devices to drive the vibration of the display screen, the problem of sound-generating devices occupying space is solved, the device can be made ultra-thin and miniaturized, and the sound effect is improved.

WO2025194918A1PCT designated stage Publication Date: 2025-09-25HUAWEI TECH CO LTD
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Patent Information

Application Number
PCT/CN2024/141507
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-03-20
Filing Date
2024-12-23
Publication Date
2025-09-25

AI Technical Summary

Technical Problem

In existing electronic devices, sound-generating components such as speakers, buzzers, and sonar modules occupy a large space, hindering the miniaturization and lightweight design of the devices.

Method used

A piezoelectric vibrating plate is used to drive the display screen to vibrate, and a supporting plate is used for support to achieve the sound function, replacing the traditional sound-generating device. The piezoelectric vibrating plate is covered by the supporting plate to improve the vibration conduction effect.

Benefits of technology

This eliminates the need for traditional sound-generating devices, saves internal space, supports ultra-thin and miniaturized equipment, and improves the sound effect.

✦ Generated by Eureka AI based on patent content.

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Abstract

A display module (10). A support plate (102) is arranged on a rear surface of a display screen (101) and is connected to the display screen (101). A piezoelectric vibration plate (103) is connected to the surface of the support plate (102) facing away from the display screen (101). A vertical projection of the piezoelectric vibration plate (103) on the rear surface of the display screen (101) lies within the range of a vertical projection of the support plate (102) on the rear surface of the display screen (101). The piezoelectric vibration plate (103) drives the display screen (101) to vibrate, so as to achieve sound emission from the screen, thereby enabling functions of sound-emitting components such as loudspeakers, buzzers, and sonar modules. Further provided is an electronic device (01). Sound-emitting components such as loudspeakers, buzzers, and sonar modules need not be provided within the electronic device (01), thereby saving internal space of the electronic device (01).
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Description

Display module and electronic device

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office on March 20, 2024, with application number 202410325727.0 and invention name “A display module and electronic device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of smart wearable technology, and in particular to a display module and an electronic device. Background Art

[0003] As users have higher and higher requirements for the functionality and portability of electronic devices, these electronic devices need to be equipped with more electronic components within a limited layout space to achieve diversified functions while also meeting the design requirements of lightweight and miniaturization. For example, in order to meet user needs, these electronic devices may usually include sound-generating devices such as speakers, buzzers, or sonar modules. These sound-generating devices are large in size, thus occupying a large space inside the electronic device, which is not conducive to the development trend of miniaturization and lightweight electronic devices. Summary of the Invention

[0004] The present application provides a display module and an electronic device, which are used to solve the problem of large size of electronic devices.

[0005] To achieve the above objectives, this application adopts the following technical solutions:

[0006] In one aspect of the present application, a display module is provided, which may include a display screen, a support sheet, and at least one piezoelectric vibrating sheet. The support sheet is disposed on the back of the display screen and is connected to the display screen. The piezoelectric vibrating sheet is disposed on a side of the support sheet facing away from the display screen and is connected to the support sheet. The piezoelectric vibrating sheet is used to drive the display screen to vibrate in the thickness direction of the display screen. The vertical projection of the piezoelectric vibrating sheet on the back of the display screen is within the vertical projection of the support sheet on the back of the display screen.

[0007] In summary, on the one hand, since the piezoelectric vibrating plate can drive the display screen to vibrate in the thickness direction of the display screen, the display screen can act as a diaphragm and achieve screen sound under the drive of the piezoelectric vibrating plate. In this case, the screen sound can realize the functions of a speaker such as making calls, playing music, and voice broadcasting, as well as the function of a buzzer that emits a buzzing sound. In addition, when the user wears the electronic device underwater, for example, when the user is diving underwater, the screen sound can use sound waves to communicate text, pictures, voice, etc. underwater, thereby realizing the function of a sonar module. In this way, the electronic device does not need to be equipped with a speaker, buzzer, sonar module, or other sound-generating devices, thereby saving internal space of the electronic device and facilitating the design trend of ultra-thin and miniaturized electronic devices. On the other hand, a support plate is provided between the piezoelectric vibrating plate and the display screen, and the piezoelectric vibrating plate is connected to the back of the display screen. In addition, the vertical projection of the piezoelectric vibrating plate on the back of the display screen is located within the vertical projection range of the support plate on the back of the display screen, so that the surface of the piezoelectric vibrating plate facing the display screen can be completely covered by the support plate. In this way, the entire piezoelectric vibrating plate can be supported by the supporting plate, and the supporting plate can provide a flat supporting surface for the piezoelectric supporting plate, which is conducive to transmitting the vibration of the piezoelectric vibrating plate to the display screen and improving the sound effect of the screen.

[0008] In an optional embodiment, the piezoelectric vibrating plate is directly bonded to the support plate, meaning no additional film layers are required between the two plates, other than the adhesive layer. This avoids the problem of vibration dampening caused by inserting vibration-absorbing components, such as foam, between the piezoelectric vibrating plate and the display.

[0009] In an optional embodiment, the above-mentioned support sheet is made of shading material, such as at least one of a resin or metal with a shading effect, so that the support sheet has a shading effect, so that the support sheet can replace the foam, that is, the position where the foam is originally required in the electronic device is covered with the above-mentioned support sheet, thereby increasing the area of ​​the support sheet, which is conducive to increasing the area of ​​the piezoelectric vibration sheet.

[0010] In an optional embodiment, the display module further includes an electrical connection portion, which is electrically connected to the display screen and is bent to the side of the support sheet facing away from the display screen. The electrical connection portion can be electrically connected to a mainboard provided with a processor (e.g., an MCU), thereby being able to receive control signals output from the processor on the mainboard. The electrical connection portion has a third vertical projection on the display screen, and the third vertical projection overlaps with the second vertical projection of the support sheet on the display screen. In this way, the electrical connection portion and the support sheet can be stacked, which can effectively improve the space utilization of the electronic device.

[0011] In one optional embodiment, the support sheet covers the entire back of the display screen. This allows, within manufacturing and installation tolerances, the vertical projection of the support sheet on the display surface of the electronic device to completely overlap with the vertical projection of the display screen on the display surface. In this case, the shape of the support sheet can be identical or approximately identical to the shape and size of the display screen. In this case, the area of ​​the display screen covered by the support sheet can be maximized, or nearly maximized, thereby providing a larger support area for the piezoelectric vibrating plate, thereby increasing the area of ​​the piezoelectric vibrating plate.

[0012] In an optional embodiment, the electrical connection portion has a third vertical projection on the display screen, and this third vertical projection does not overlap with the first vertical projection of the piezoelectric vibrating plate on the display screen. This prevents interference between the piezoelectric vibrating plate's location and the electrical connection portion's location. For example, the piezoelectric vibrating plate can be positioned on the entire back surface of the support plate, excluding the area where the electrical connection portion is located. This effectively increases the piezoelectric vibrating plate's coverage area and enhances the sound quality of the screen.

[0013] In one optional embodiment, the back of the display screen has a first region and a second region, the sum of the areas of the first and second regions being equal to the area of ​​the back of the display screen. The piezoelectric vibrating plate covers the entire first region, and the electrical connection portion is located in the second region. Thus, when the area of ​​the second region is reduced, the area of ​​the first region can be increased, thereby increasing the area of ​​the piezoelectric vibrating plate within the first region within the plane of the display surface. As can be seen from the above, when the area of ​​the piezoelectric vibrating plate within the plane of the display surface is increased, the effect of the piezoelectric vibrating plate driving the display screen to achieve screen sound can be effectively improved.

[0014] In one optional embodiment, the back of the display screen has a first region and a second region, the sum of the areas of the first and second regions being equal to the area of ​​the back of the display screen. The electrical connection portion is located in the second region, and the display module includes a plurality of piezoelectric vibrating plates, which are spaced apart in the first region. Similarly, when the area of ​​the second region is reduced, the area of ​​the first region can be increased, thereby increasing the number of piezoelectric vibrating plates located in the first region, effectively improving the effect of the piezoelectric vibrating plates driving the display screen to generate screen sound.

[0015] In an optional embodiment, the back of the display screen has a first area, a second area, and a third area, and the sum of the areas of the first area, the second area, and at least one third area is the same as the area of ​​the back of the display screen. The first area and the second area are arranged along the first direction; the second area and the third area are arranged along the second direction, the first direction and the second direction are different, and the first direction and the second direction are parallel to the back of the display screen. The electrical connection portion is located in the second area. In addition, at least one piezoelectric vibration plate includes a first piezoelectric vibration plate and a second piezoelectric vibration plate. The first piezoelectric vibration plate covers the entire first area, and the second piezoelectric vibration plate is located in the third area. In this way, a piezoelectric vibration plate, such as the above-mentioned second piezoelectric vibration plate, can be set on at least one of the left and right sides of the second area where the electrical connection portion is located, thereby increasing the number of piezoelectric vibration plates and the contact area between the piezoelectric vibration plate and the display screen, thereby achieving the purpose of improving the sound effect of driving the screen.

[0016] In one optional embodiment, the piezoelectric vibrating plate covers the entire surface of the support plate facing away from the display screen, with the electrical connection located on the side of the piezoelectric vibrating plate facing away from the support plate. This approach can approximately maximize the area of ​​the piezoelectric vibrating plate. For example, within the permitted manufacturing and installation tolerances, the area of ​​the piezoelectric vibrating plate and the support plate can be the same as the area of ​​the back of the display screen, thereby improving the sound quality of the screen.

[0017] In an optional embodiment, the display module further includes an electrical connection portion electrically connected to the display screen, the electrical connection portion being bent to the side of the support sheet facing away from the display screen. The electrical connection portion has a third vertical projection on the display screen, and the third vertical projection does not overlap with the second vertical projection of the support sheet on the display screen. This ensures that the support sheet and piezoelectric vibrating plate are positioned so as not to interfere with the electrical connection portion.

[0018] In one optional embodiment, the electrical connection portion includes a bent portion and a non-bent portion, wherein a first end of the bent portion is electrically connected to the display screen, and a second end of the bent portion is bent toward the back side of the display screen. The non-bent portion is electrically connected to the second end of the bent portion, and the non-bent portion is disposed on the back side of the display screen. After the bent portion is bent, the non-bent portion electrically connected to the bent portion is disposed toward the back side of the display screen, thereby enabling the non-bent portion to be electrically connected to the motherboard on which the processor is disposed.

[0019] In one optional embodiment, the electrical connection portion is a first circuit board. In this case, the bending portion and the non-bending portion are connected to form an integral structure, and the first circuit board is a flexible and rigid circuit board. A portion of the first circuit board is formed from a flexible material, which constitutes the bending portion, while another portion of the first circuit board is formed from a rigid material. Alternatively, the non-bending portion is a second circuit board, which may be a flexible circuit board or a printed circuit board, and the non-bending portion and the bending portion are separate components.

[0020] In one optional embodiment, the non-bending portion is a second circuit board. The bending portion has a fourth vertical projection on the display screen, and the fourth vertical projection is within the range of the non-bending portion's fifth vertical projection on the display screen. This allows the bending portion and the non-bending portion to be stacked, allowing a portion of their area to overlap, thereby reducing the area occupied by the bending portion and the non-bending portion parallel to the plane of the display screen, thereby improving the internal space utilization of the electronic device.

[0021] In an optional embodiment, the bending portion has a first end facing the display screen and a second end facing away from the display screen, and the first end is connected to the display screen. The non-bending portion has an electrical connection end and a non-electrical connection end. Relative to the electrical connection end, the non-electrical connection end is arranged close to the display screen, and the electrical connection end is electrically connected to the second end of the bending portion. For example, the electrical connection end of the non-bending portion may be the location of the gold finger in the non-bending portion. In this way, the non-bending portion can be reversely bound to the bending portion, so that the non-electrical connection end of the non-bending portion is arranged closer to the display screen relative to the electrical connection end. Compared with the forward binding method of extending the non-electrical connection end of the non-bending portion out of the bending portion, the reverse binding method can make the overlapping area between the non-bending portion and the bending portion larger, thereby being more conducive to improving the utilization rate of the internal space of the electronic device.

[0022] In an optional embodiment, a avoidance hole is provided on the non-bending portion, and the avoidance hole passes through the non-bending portion. In addition, the display module also includes a display driver chip and at least one electronic component. The display driver chip is arranged on the bending portion and is electrically connected to the display screen. The display driver chip is arranged in the avoidance hole. At least one electronic component is arranged on the non-bending portion, and the electronic component is electrically connected to the non-bending portion and the display driver chip. The display driver chip has a sixth vertical projection on the bending portion, and the sixth vertical projection and the seventh vertical projection of the electronic component on the bending portion do not overlap. In this case, when the bending portion and the non-bending portion are stacked, the display driver chip electrically connected to the bending portion can be arranged in the avoidance hole, thereby avoiding positional interference between the display driver chip and the non-bending portion.

[0023] In an optional embodiment, the vertical projection of the piezoelectric vibrating plate on the supporting plate is in the shape of a ring, a circle or a rectangle. The supporting plate does not need to cover the entire back of the display screen.

[0024] In one optional embodiment, the support sheet includes a flexible substrate and an NFC coil. The NFC coil is disposed within the flexible substrate. This eliminates the need for a separate NFC coil; the flexible substrate with the NFC coil and the support sheet can be shared, thereby reducing the number of components within the electronic device, simplifying the internal structure, and optimizing the size of the electronic device.

[0025] In an optional embodiment, when the electronic device does not need to have the NFC function, or the NFC coil is set at another location, the above-mentioned support sheet can be a resin substrate or a metal substrate.

[0026] Another aspect of the present application provides a display module comprising a display screen and a piezoelectric vibrating plate. The piezoelectric vibrating plate is disposed on the back of the display screen and connected to the display screen. The piezoelectric vibrating plate is configured to drive the display screen to vibrate along its thickness. This allows the piezoelectric vibrating plate to drive the display screen to vibrate along its thickness. The display screen can then function as a diaphragm, driven by the piezoelectric vibrating plate, to generate screen sound, replacing the functions of a speaker, buzzer, or sonar module.

[0027] In an optional embodiment, the display module further includes an electrical connection portion electrically connected to the display screen, the electrical connection portion being bent to a side of the support sheet facing away from the display screen. The electrical connection portion has a third vertical projection on the display screen, and the third vertical projection overlaps with the second vertical projection of the piezoelectric vibrating plate on the display screen, or the third vertical projection does not overlap with the second vertical projection of the piezoelectric vibrating plate on the display screen. The technical effects of the electrical connection portion are the same as those described above and are not further elaborated here.

[0028] In one optional embodiment, the electrical connection portion includes a bent portion and a non-bent portion, wherein the first end of the bent portion is electrically connected to the display screen, and the second end of the bent portion is bent toward the back side of the display screen. The non-bent portion is electrically connected to the second end of the bent portion and is disposed on the back side of the display screen. The technical effects of the bent portion and the non-bent portion are the same as those described above and will not be further elaborated here.

[0029] In an optional embodiment, the non-bending portion is a second circuit board. The bending portion has a fourth vertical projection on the display screen, and the fourth vertical projection is within the range of the non-bending portion's fifth vertical projection on the display screen. In this manner, the bending portion and the non-bending portion can be stacked. The technical effects of this stacking arrangement are the same as those described above and will not be further elaborated here.

[0030] In an optional embodiment, the bending portion has a first end facing the display screen and a second end facing away from the display screen, and the first end is connected to the display screen. The non-bending portion has an electrical connection end and a non-electrical connection end. Relative to the electrical connection end, the non-electrical connection end is arranged close to the display screen, and the electrical connection end is electrically connected to the second end of the bending portion. For example, the electrical connection end of the non-bending portion can be the location of the gold finger in the non-bending portion. In this way, the non-bending portion can be reversely bound to the bending portion. The technical effect of the reverse binding is the same as described above and will not be repeated here.

[0031] In an optional embodiment, an avoidance hole is provided on the non-bending portion, and the avoidance hole passes through the non-bending portion. In addition, the display module also includes a display driver chip and at least one electronic component. The display driver chip is arranged on the bending portion and is electrically connected to the display screen. The display driver chip is arranged in the avoidance hole. At least one electronic component is arranged on the non-bending portion, and the electronic component is electrically connected to the non-bending portion and the display driver chip. The display driver chip has a sixth vertical projection on the bending portion, and the sixth vertical projection and the seventh vertical projection of the electronic component on the bending portion do not overlap. The technical effect of the avoidance hole is the same as described above and will not be repeated here.

[0032] In an optional embodiment, the vertical projection of the piezoelectric vibrating plate on the supporting plate is in the shape of a ring, a circle or a rectangle. The supporting plate does not need to cover the entire back of the display screen.

[0033] In one optional embodiment, the support sheet includes a flexible substrate and an NFC coil. The NFC coil is disposed within the flexible substrate. This eliminates the need for a separate NFC coil; the flexible substrate with the NFC coil and the support sheet can be shared, thereby reducing the number of components within the electronic device, simplifying the internal structure, and optimizing the size of the electronic device.

[0034] In an optional embodiment, when the electronic device does not need to have the NFC function, or the NFC coil is set at another location, the above-mentioned support sheet can be a resin substrate or a metal substrate.

[0035] Another aspect of the present application provides an electronic device comprising a middle frame and any one of the display modules described above, wherein the display module is disposed within the middle frame. The electronic device has the same technical effects as the display module provided in the aforementioned embodiment, and will not be described in detail here.

[0036] In an optional embodiment, the electronic device further includes a rear housing connected to the midframe and defining an installation space. The display module further includes an electrical connector electrically connected to the display screen of the display module. The electrical connector is bent to the back of the display screen and located within the installation space to prevent the electrical connector from being exposed. Furthermore, the display screen's display surface is exposed on the side of the midframe facing away from the rear housing for image display. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] FIG1 is a schematic structural diagram of an electronic device provided in an embodiment of the present application;

[0038] FIG2 is a schematic diagram of an explosion of the electronic device in FIG1 ;

[0039] FIG3 is an exploded schematic diagram of the display module in FIG2 ;

[0040] FIG4 is a diagram of a control circuit for driving a piezoelectric vibrating piece to vibrate in an electronic device provided by an embodiment of the present application;

[0041] FIG5 is a schematic diagram of the voltage provided by the driving circuit in FIG4 to the piezoelectric vibrating piece;

[0042] FIG. 6 (a), FIG. 6 (b), and FIG. 6 (c) are diagrams showing different vibration states of the piezoelectric vibrating piece provided in an embodiment of the present application;

[0043] FIG7 is a schematic structural diagram of an electronic device provided with foam in the related art;

[0044] FIG8 is a schematic structural diagram of a display screen and an electrical connection portion provided in an embodiment of the present application;

[0045] FIG9 is a schematic diagram of a packaging method for a display screen provided in an embodiment of the present application;

[0046] FIG10A is a schematic diagram of another packaging method of a display screen provided in an embodiment of the present application;

[0047] FIG10B is a schematic diagram of another packaging method of a display screen provided in an embodiment of the present application;

[0048] FIG11 is a schematic diagram of an electrical connection method between a display screen and an electrical connection portion provided in an embodiment of the present application;

[0049] FIG12 is a schematic diagram of the bent portion of the electrical connection portion of the structure shown in FIG11 before being bent;

[0050] FIG13 is an exploded schematic diagram of a display module provided in an embodiment of the present application;

[0051] FIG14 is a schematic structural diagram of a support sheet provided in an embodiment of the present application;

[0052] FIG15 is a schematic structural diagram of a display module with a support sheet provided in an embodiment of the present application;

[0053] FIG16 is a schematic diagram of a structure in which the bending portion and the non-bending portion in FIG15 are arranged on the back of the display screen;

[0054] FIG17 is a schematic structural diagram of a display module having a piezoelectric vibrating piece provided in an embodiment of the present application;

[0055] FIG18 is a schematic structural diagram of another electronic device provided in an embodiment of the present application;

[0056] FIG19A is a schematic diagram of a top view of the structure obtained along the direction A in FIG17;

[0057] FIG19B is a schematic diagram of an electronic device transmitting signals underwater provided by an embodiment of the present application;

[0058] FIG20 is another schematic diagram of a top view of the structure obtained along the direction A in FIG17;

[0059] FIG21 is a schematic structural diagram of another electronic device provided in an embodiment of the present application;

[0060] FIG22 is a schematic structural diagram of another electronic device provided in an embodiment of the present application;

[0061] FIG23 is a schematic structural diagram of another electronic device provided in an embodiment of the present application;

[0062] FIG24 is a schematic structural diagram of a display module provided in an embodiment of the present application;

[0063] FIG25 is a schematic structural diagram of another display module provided in an embodiment of the present application;

[0064] FIG26A is a schematic structural diagram of another display module provided in an embodiment of the present application;

[0065] FIG26B is a schematic structural diagram of another display module provided in an embodiment of the present application;

[0066] FIG26C is a schematic structural diagram of another display module provided in an embodiment of the present application;

[0067] FIG27 is an exploded schematic diagram of another display module provided in an embodiment of the present application;

[0068] FIG28 is an exploded schematic diagram of another display module provided in an embodiment of the present application;

[0069] FIG29 is an exploded schematic diagram of another display module provided in an embodiment of the present application;

[0070] FIG30 is a schematic structural diagram of another display module provided in an embodiment of the present application.

[0071] Figure markings: 01-electronic device; 10-display module; 11-middle frame; 12-back cover; 101-display screen; 102-support plate; 103-piezoelectric vibration plate; 200-driving circuit; 201-processor; 40-electronic components; 50-foam; 101-display screen; 110-electrical connection part; 111-bending part; 300-display driver chip; 301-non-bending part; 3011-avoidance hole; 1021-flexible substrate; 1022-NFC coil; 601-first area; 602-second area; 603-third area; 1031-first piezoelectric vibration plate; 1032-second piezoelectric vibration plate. DETAILED DESCRIPTION

[0072] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments.

[0073] In the following, the terms "first," "second," etc., are used for descriptive convenience only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Thus, a feature specified as "first," "second," etc. may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0074] In this application, unless otherwise expressly specified or limited, the term "connection" should be understood in a broad sense. For example, "connection" can be a fixed mechanical connection, a detachable mechanical connection, or an integral connection; or, "connection" can be a direct connection or an indirect connection through an intermediate medium. In addition, "transmission connection" refers to a connection relationship that can achieve mechanical transmission, such as rotation, movement, and other movements. This "transmission connection" includes but is not limited to fixed mechanical connections, detachable connections (e.g., snap connections, threaded connections), and surface contact abutment and meshing.

[0075] In addition, unless otherwise clearly specified and limited, the term "electrical connection" should be understood in a broad sense. For example, "electrical connection" can be a direct electrical connection, for example, physical contact and electrical conduction between two components. It can also be understood as the electrical connection between different components in the circuit structure through physical lines such as printed circuit board (PCB) copper foil or wires that can transmit electrical signals to transmit electrical signals; or, "electrical connection" can be an indirect electrical connection between two components through an intermediate medium; or, "electrical connection" can be an electrical connection between two components in an air / non-contact manner, for example, two components are electrically connected by capacitive coupling to transmit electrical signals.

[0076] "Communication connection" can refer to the transmission of electrical signals, including wireless communication connections and wired communication connections. Wireless communication connections do not require physical media and do not constitute a connection relationship that limits the product structure.

[0077] In the embodiments of the present application, the descriptions "vertical" and "parallel" respectively indicate approximately vertical and approximately parallel within a certain error range, and the error range may be a range in which the deviation angle relative to absolute vertical and absolute parallel is less than or equal to 5°, 8° or 10°, respectively, and no specific limitation is made here.

[0078] In the embodiments of the present application, directional terms such as "up", "down", "left" and "right" may be defined including but not limited to the orientation relative to the components schematically placed in the drawings. It should be understood that these directional terms may be relative concepts, which are used for relative description and clarification, and may change accordingly according to changes in the orientation of the components in the drawings.

[0079] In the drawings of the embodiments of the present application, components are represented only by guide lines; hollow structures such as openings and holes are represented by guide lines with wavy lines at the ends.

[0080] An embodiment of the present application provides an electronic device having a display function. The electronic device can be applied to various communication systems or communication protocols, such as Bluetooth (BT) communication technology, global positioning system (GPS) communication technology, global system of mobile communication (GSM) communication technology, wireless fidelity (WiFi) communication technology, wideband code division multiple access wireless (WCDMA) communication technology, long term evolution (LTE), 5G communication technology, and other future communication technologies.

[0081] The electronic device in the embodiments of the present application may be a mobile phone, a tablet computer (pad), a laptop computer, a smart home, a smart wearable device (e.g., a smart watch, a smart bracelet, smart glasses, a smart helmet), a virtual reality (VR) electronic device, an augmented reality (AR) electronic device, etc. The electronic device may also be a handheld device with wireless communication capabilities, a computing device or other processing device connected to a wireless modem, an in-vehicle device, an electronic device in a 5G network, or an electronic device in a future-evolved public land mobile network (PLMN), etc., and the embodiments of the present application are not limited thereto.

[0082] For ease of illustration, the following description uses the example of electronic device 01 being a smartwatch as shown in FIG1 . The electronic device 01 may include a display module 10 and a midframe 11, which supports the display module 10. Furthermore, as shown in FIG2 (an exploded view of the electronic device shown in FIG1 ), the electronic device 01 may also include a rear housing 12, which is connected to the midframe 11.

[0083] For ease of explanation, an XYZ coordinate system is established in the accompanying drawings. The Z direction corresponds to the thickness of the electronic device 01, i.e., the stacking direction of the display module 10, the middle frame 11, and the rear cover 12. The XY plane formed by the X and Y directions is parallel to the display surface of the display module 10. Furthermore, the accompanying drawings illustrate the case where the electronic device 01 is a smartwatch, and the vertical projection of the display module 10 on the XY plane is a circle.

[0084] In other embodiments of the present application, the vertical projection of the display module 10 on the XY plane can also be other regular shapes, such as rectangles, polygons, etc., or irregular shapes, which are not limited in this application. In this case, the contours of the middle frame 11 and the rear housing 12 match the contours of the display module 10.

[0085] The electronic device 01 may further include a processor electrically connected to the display module 10. The processor may be disposed on a side of the middle frame 11 away from the display module 10. The rear housing 12 is buckled onto the middle frame 11, thereby forming an installation space (not shown in FIG. 2 ) between the rear housing 12 and the middle frame 11 for accommodating the processor, battery, and other components.

[0086] The processor can provide display data to the display module 10 to drive the display module 10 to display images. For example, the processor may include one or more processing units, for example, the processor may include a central processing unit (CPU), a microcontroller unit (MCU), an application processor (AP), a modem processor, a graphics processing unit (GPU), an image signal processor (ISP), a controller, a video codec, a digital signal processor (DSP), a baseband processor, and / or a neural-network processing unit (NPU). Among them, different processing units can be independent devices or integrated into one or more processors.

[0087] In addition, the electronic device 01 may further include a mainboard carrying the processor, such as a printed circuit board (PCB), and an external memory interface electrically connected to the processor, an internal memory, a universal serial bus (USB) interface, a charging management module, a power management module, a battery, an antenna, a mobile communication module, a wireless communication module, an audio module, a receiver, a microphone, an earphone interface, a sensor module, buttons, and a camera. The sensor module may include at least one of a pressure sensor, a gyroscope sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a distance sensor, a proximity light sensor, a fingerprint sensor, a temperature sensor, a touch sensor, an ambient light sensor, and a bone conduction sensor.

[0088] In related art, electronic device 01 may also include a sound-generating device such as a speaker, buzzer, or sonar module, located within the aforementioned installation space. These sound-generating devices are relatively large; for example, a speaker may occupy approximately one-quarter of the volume of a smartwatch. Furthermore, the multiple sound-generating devices may overlap in at least one direction, such as the Z direction, resulting in a larger size in that direction, which is detrimental to the trend toward thinner, lighter, and more compact electronic devices.

[0089] To address the aforementioned issues, embodiments of the present application provide electronic devices 01 that do not require a speaker, buzzer, or sonar module, while still being able to implement the functions of the speaker, buzzer, or sonar module. This solves the problem of the larger size of the electronic device 01 without affecting the functionality of the product. In some embodiments of the present application, as shown in FIG3 (an exploded view of the display module 10 in FIG2 ), the display module 10 may include a display screen 101, a support sheet 102, and at least one piezoelectric vibrating sheet 103 (one piezoelectric vibrating sheet 103 is used as an example in FIG3 ).

[0090] Among them, the above-mentioned display screen 101 can be a self-luminous display screen, such as an organic light emitting diode (OLED) display screen, a micro light emitting diode (Micro LED) display screen, or a mini LED display screen, or a quantum dot light emitting diode (QLED) display screen. Alternatively, the above-mentioned display screen 101 can also be a liquid crystal display (LED) that requires a backlight module. This application does not limit the type of the above-mentioned display screen 101. Based on this, the above-mentioned display screen 101 has a display surface for displaying an image, and a back surface arranged opposite to the display surface. The side of the middle frame 11 shown in Figure 2 away from the rear shell 12 can expose the display surface of the above-mentioned display screen 101.

[0091] Continuing with FIG3 , the support sheet 102 can be disposed on the back side (B) of the display screen 101 and connected to the display screen 101. Furthermore, the piezoelectric vibrating sheet 103 can be disposed on a side of the support sheet 102 facing away from the display screen 101 and connected to the support sheet 102. Furthermore, the piezoelectric vibrating sheet 103 can be used to drive the display screen 101 to vibrate in the thickness direction (i.e., the Z direction) of the display screen 101.

[0092] The piezoelectric vibrating piece 103 has a first vertical projection on the display screen 101 (i.e., the XY plane), and the first vertical projection can be located within the second vertical projection range of the supporting piece 102 on the display screen 101, that is, the back side of the piezoelectric vibrating piece 103 facing the supporting piece 102 can be completely covered by the supporting piece 102.

[0093] For example, the material of the piezoelectric vibrating piece 103 may include a piezoelectric material, such as a piezoelectric ceramic. For example, the piezoelectric vibrating piece 103 may include a single piezoelectric ceramic piece or a plurality of stacked piezoelectric ceramic pieces. The piezoelectric ceramic piece may vibrate along the thickness direction of the piezoelectric ceramic piece, and thus the thickness direction of the piezoelectric ceramic piece may be its vibration direction. In the vibration direction of the piezoelectric ceramic piece, the piezoelectric vibrating piece 103 may further include a metal layer provided on two opposing surfaces of the piezoelectric ceramic piece, for example, a silver layer or other metal layer formed by electroplating. The metal layer may be electrically connected to the electrodes of the piezoelectric vibrating piece 103.

[0094] Based on this, piezoelectric materials exhibit both direct and inverse piezoelectric effects. The direct piezoelectric effect refers to the phenomenon of electrical polarization caused by deformation. When physical pressure is applied to a piezoelectric material, the electric dipole moment within the material shortens due to compression. To counteract this change, the piezoelectric material generates equal amounts of positive and negative charges on opposing surfaces. When the pressure is removed, the positive and negative charges generated on the material's surfaces disappear. The direct piezoelectric effect is essentially the process of converting mechanical energy into electrical energy.

[0095] Conversely, the inverse piezoelectric effect refers to the fact that when an electric field is applied in the polarization direction of a piezoelectric material, the piezoelectric material will produce mechanical deformation or mechanical pressure in a certain direction. When the external electric field is removed, these deformations or stresses disappear. This inverse piezoelectric effect can be used to apply different voltages to the piezoelectric vibrating plate 103 to control the movement direction and vibration frequency of the piezoelectric vibrating plate 103, depending on the needs of screen sound generation. The embodiments of the present application can utilize this inverse piezoelectric effect to enable the piezoelectric vibrating plate 103 to drive the display screen 101 to vibrate, thereby achieving screen sound generation.

[0096] In some embodiments of the present application, as shown in FIG4 , the electronic device 01 may further include a drive circuit 200 electrically connected to the piezoelectric vibrating piece 103. For example, the drive circuit 200 may be electrically connected to the electrodes of the piezoelectric vibrating piece 103. Furthermore, the drive circuit 200 may be disposed on the mainboard and electrically connected to the processor 201 (e.g., an MCU).

[0097] The processor 201 can use a virtual low-frequency algorithm or an audio effect algorithm to control the AC voltage output by the driving circuit 200 (as shown in FIG5 ), as needed. The frequency of the AC voltage can match the vibration frequency of the piezoelectric vibrating piece 103 and the display screen 101. For example, the driving circuit 200 can include a digital signal processor (DSP) and a power amplifier.

[0098] Furthermore, the direction of the AC voltage waveform can be matched to the vibration direction of the piezoelectric vibrating piece 103. For example, when the voltage received by the piezoelectric vibrating piece 103 is the voltage at point A in FIG5 , the piezoelectric vibrating piece 103 can arch upward in the Z direction from the initial state shown in FIG6 (b) to form the shape shown in FIG6 (a). Alternatively, when the voltage received by the piezoelectric vibrating piece 103 is the voltage at point B in FIG5 , the piezoelectric vibrating piece 103 can arch downward in the Z direction from the initial state shown in FIG6 (b) to form the shape shown in FIG6 (c).

[0099] Because the voltage applied to the piezoelectric vibrating plate 103 continuously changes at points A and B, the piezoelectric vibrating plate 103 continuously arches upward or downward in the Z direction, thereby generating vibrations in the Z direction. As can be seen above, the piezoelectric vibrating plate 103 is connected to the back of the display screen 101 via the support plate 102. Therefore, during the vibration process, the piezoelectric vibrating plate 103 can also drive the display screen 101 to vibrate at a preset frequency along the Z direction in Figure 2, thereby achieving the purpose of screen sound.

[0100] In summary, on the one hand, since the piezoelectric vibrating piece 103 can drive the display screen 101 to vibrate in the thickness direction (i.e., the Z direction) of the display screen 101 shown in Figure 3, the above-mentioned display screen 101 can act as a diaphragm to realize screen sound under the drive of the piezoelectric vibrating piece 103. In this case, the above-mentioned screen sound can realize the functions of a speaker such as making calls, playing music, and voice broadcasting, as well as the function of a buzzer that emits a buzzing sound. In addition, when the user wears the above-mentioned electronic device 01 underwater, for example, when the user is diving underwater, the above-mentioned screen sound can use sound waves to communicate text, pictures, voice, etc. underwater to realize the function of a sonar module. In this way, the above-mentioned electronic device 01 does not need to be provided with a speaker, a buzzer, a sonar module, etc. for sound-generating devices, thereby saving the internal space of the electronic device, which is conducive to the design trend of ultra-thin and miniaturized electronic devices.

[0101] Continuing with Figure 3, a support sheet 102 is disposed between the piezoelectric vibrating plate 103 and the display screen 101. The piezoelectric vibrating plate 102 is connected to the back of the display screen 101. Furthermore, the first vertical projection of the piezoelectric vibrating plate 103 on the display screen 101 lies within the second vertical projection of the support sheet 102 on the display screen 101. This ensures that the surface of the piezoelectric vibrating plate 103 facing the display screen 101 is completely covered by the support sheet 102. This allows the entire piezoelectric vibrating plate 103 to be supported by the support sheet 102, providing a flat support surface for the piezoelectric vibrating plate 103. This facilitates the transmission of vibrations from the piezoelectric vibrating plate 102 to the display screen 101, enhancing the sound effect of the screen.

[0102] For example, the larger the area of ​​the support sheet 102 covering the back of the display screen 101, the larger the area of ​​the support sheet 102 used to support the piezoelectric vibration sheet 103. Therefore, the area of ​​the piezoelectric vibration sheet 103 can be increased, thereby effectively improving the effect of the piezoelectric vibration sheet 103 driving the display screen 101 to produce sound.

[0103] In addition, the above-mentioned support sheet 102 can be made of a material that absorbs less vibration. For example, the support sheet 102 can be a resin material, such as a resin substrate composed of polyimide (PI) or polyester (PET). Alternatively, the support sheet 102 is also a metal substrate made of a metal material. Alternatively, the above-mentioned support sheet 102 can also be a flexible circuit board including the above-mentioned resin material. Based on this, in some embodiments of the present application, the above-mentioned piezoelectric vibration sheet 103 can be directly bonded to the support sheet 103, that is, no other film layer is required between the piezoelectric vibration sheet 103 and the support sheet 103 except for the glue layer. Thereby, it is possible to avoid the phenomenon that a component that can absorb vibration, such as foam, is provided between the piezoelectric vibration sheet 103 and the display screen 101, which leads to a weakening of the vibration effect.

[0104] In addition, the above-mentioned support sheet 103 can also be made of shading materials, such as at least one of resin or metal with shading effect, so that the support sheet 103 has a shading effect, so that the support sheet 102 can replace the foam 50 shown in Figure 7 used for shading in the original electronic device 01 (the foam 50 covers the back of the display screen 101, and components such as FPC can be set on the foam 50), that is, the positions where the foam was originally required to be set are covered with the above-mentioned support sheet 103, thereby increasing the area of ​​the support sheet 103, which is conducive to increasing the area of ​​the piezoelectric vibration sheet 103.

[0105] The following describes the structure of the piezoelectric vibrating plate 103 and the supporting plate 102 with reference to the structure of the display screen 101. In some embodiments of the present application, the display module 10 may further include an electrical connection portion 110 as shown in FIG8 . The display module 10 may further include a display driver IC (DDIC) 300 disposed on the electrical connection portion 110. The display driver IC 300 is electrically connected to the pixel circuits in the display screen 101 to drive the display screen 101 to display images.

[0106] Based on this, as shown in Figure 9, the electrical connection portion 110 can be bent to the back side B of the display screen 101 and located in the installation space enclosed by the above-mentioned middle frame 11 and the rear shell 12 (as shown in Figure 2). The above-mentioned electrical connection portion 110 may include a bending portion 111 and a non-bending portion 301. The first end a1 of the bending portion 111 is electrically connected to the display screen 101, and the second end a2 of the bending portion 111 is bent to the side where the back side B of the display screen 101 is located. The non-bending portion 301 is electrically connected to the second end a2 of the bending portion 111, and the non-bending portion 301 is arranged on the side where the back side of the display screen 101 is located.

[0107] In this case, after the bending portion 111 is bent, the non-bending portion 301 electrically connected to the bending portion 111 can be set on the back side B of the display screen 101, so that the non-bending portion 301 can be electrically connected to a mainboard provided with a processor (for example, MCU), for example, through a board-to-board (BTB) connector, so that the control signal output from the processor on the mainboard can be transmitted to the bending portion 111 through the non-bending portion 301, and then transmitted to the display driver chip 300.

[0108] In some embodiments of the present application, the electrical connection portion 110 may be a first circuit board that combines rigidity and flexibility. Therefore, the bending portion 111 and the non-bending portion 301 of the electrical connection portion 110 are integrally formed. A portion of the first circuit board may be constructed from a flexible material, and this portion may constitute the bending portion 111. Furthermore, another portion of the first circuit board may be constructed from a rigid material, and this portion may constitute the non-bending portion 301.

[0109] Alternatively, in other embodiments of the present application, the bending portion 111 and the non-bending portion 301 in the electrical connection portion 110 are two independent parts. For example, the non-bending portion 301 can be a second circuit board. The second circuit board can be a flexible printed circuit board (FPC) or a PCB, which is not limited in this application. The non-bending portion 301 can be bonded to the bending portion 111. The following uses the bending portion 111 and the non-bending portion 301 as two independent parts as an example to illustrate the packaging method of the display module 10.

[0110] For example, the display module 10 can use a chip on plastic (COP) packaging process to form the display screen 101 and the bent portion 111 as shown in Figure 9. In this case, the display screen 101 can be a flexible display screen, such as the OLED described above. The display screen 101 can include a substrate and a pixel array circuit and a light-emitting device disposed on the substrate. The substrate can be a flexible substrate (filled with a dotted pattern in Figure 9), such as polyimide (PI). In this case, the display screen 101 and the bent portion 111 share the same flexible substrate.

[0111] Alternatively, for another example, the display module 10 may utilize a chip on film (COF) packaging process to form the display screen 101 and the bent portion 111 as shown in FIG10A . In this case, the bent portion 111 may be an FPC, and the bent portion 111 may have a first end a1 facing the display screen 101. The first end a1 of the bent portion 111 may be electrically connected to a circuit structure on the substrate (filled with a grid pattern in FIG10A ) of the display screen 101. The substrate may be a flexible substrate or a rigid substrate, such as glass, which is not limited in this application.

[0112] FIG10A illustrates an example in which the electrical connection portion 110 is bent to the back of the display screen 101, with the non-bending portion 301, which serves as an FPC or PCB, and the display driver chip 300 being disposed above the bent portion 111. In other embodiments of the present application, as shown in FIG10B , the non-bending portion 301 and the display driver chip 300 may also be disposed below the bent portion 111, and this application is not limited thereto.

[0113] As shown in FIG9 , FIG10A or FIG10B , when the bent portion 111 is bent to the back surface B of the display screen 101, the non-bent portion 301 electrically connected to the bent portion 111 can also be disposed on the back surface B of the display screen 101. This application does not limit the packaging process of the display module 10. For the sake of convenience, the following description uses the display module 10 using the COP process shown in FIG9 as an example.

[0114] Based on this, when the bending portion 111 and the non-bending portion 301 are two independent parts, that is, the non-bending portion 301 is the above-mentioned second circuit board, in order to further improve the utilization rate of the internal space of the electronic device 01, as shown in Figure 11, the bending portion 111 has a fourth vertical projection on the display screen 101, and the fourth vertical projection can be located within the range of the fifth vertical projection of the non-bending portion 301 on the display screen 101.

[0115] In this way, the bending portion 111 and the non-bending portion 301 can be stacked so that a portion of the area of ​​the bending portion 111 and the non-bending portion 301 can overlap, reducing the occupied area of ​​the bending portion 111 and the non-bending portion 301 in the XY plane (parallel to the plane where the display screen 101 is located), thereby achieving the purpose of improving the internal space utilization of the electronic device 01.

[0116] Based on this, when the bending portion 111 and the non-bending portion 301 are stacked, as shown in Figure 11 , a clearance hole 3011 can be formed on the non-bending portion 301, and the clearance hole 3011 can pass through the non-bending portion 301. In this case, the display driver chip 300 electrically connected to the bending portion 111 can be disposed within the clearance hole 3011, thereby avoiding positional interference between the display driver chip 300 and the non-bending portion 301.

[0117] In some embodiments of the present application, the display screen 101, the display driver chip 300, the bent portion 111, the non-bending portion 301, the support plate 102, and the piezoelectric vibrating plate 103 may be arranged in the following order: first, as shown in FIG12 , the display driver chip 300 is electrically connected to the bent portion 111. Next, the non-bending portion 301 is reversely bonded to the bent portion 111, and the display driver chip 300 is passed through the avoidance hole 3011 in the non-bending portion 301 (as shown in FIG11 ).

[0118] For example, as shown in Figure 12, the bending portion 111 has a first end a1 facing the display screen 101 and a second end a2 facing away from the display screen 101, and the first end a1 of the bending portion 111 can be connected to the display screen 101. Based on this, the non-bending portion 301 can be reversely bound to the bending portion 111 in such a way that the non-bending portion 301 has a non-electrical connection end b1 and an electrical connection end b2. Wherein, relative to the electrical connection end b2, the non-electrical connection end b1 is arranged close to the display screen 101, and the electrical connection end b2 of the non-bending portion 301 can be electrically connected to the second end a2 of the bending portion 111. The electrical connection end b2 of the non-bending portion 301 can be the location of the gold finger in the non-bending portion 301 as the second circuit board.

[0119] In the embodiments of the present application, "gold fingers" may refer to multiple metal conductive contacts arranged at the edge of a circuit board, arranged in a finger-like structure for electrical connection to other circuit boards or electronic components. The metal conductive contacts may be made of gold or a gold alloy, or may be gold-plated metal sheets to provide good electrical conductivity, thereby effectively transmitting electrical signals.

[0120] Thus, through the reverse binding method, the non-electrical connection end b1 of the non-bending portion 301 can be positioned closer to the display screen 101 relative to the electrical connection end b2. Compared to the forward binding method in which the non-electrical connection end b1 of the non-bending portion 301 extends beyond the bending portion 111, the reverse binding method can increase the overlapping area between the non-bending portion 301 and the bending portion 111, thereby further improving the utilization rate of the internal space of the electronic device 01.

[0121] In addition, when the non-bending portion 301 is bound to the bending portion 111, the non-bending portion 301 can be electrically connected to the display driver chip 300. Based on this, the above-mentioned display module 10 can also include at least one electronic component 40 as shown in Figure 12. The above-mentioned electronic component 40 can be a device that matches the above-mentioned display driver chip 300, such as a capacitor, an inductor, a resistor, etc., so that the display driver chip 300 can work normally. The above-mentioned electronic component 40 is arranged on the non-bending portion 301, and the electronic component 40 is electrically connected to the non-bending portion 301. Since the non-bending portion 301 is electrically connected to the display driver chip 300, the electronic component 40 can be electrically connected to the display driver chip 300 through the non-bending portion 301.

[0122] Based on this, since the non-bending portion 301, which is reversely bound to the bent portion 111, is stacked with the bent portion 111, and the display driver chip 300 passes through the avoidance hole 3011 in the non-bending portion 301 (as shown in FIG11 ), the at least one electronic component 40 can be disposed on the surface of the non-bending portion 301 facing away from the bent portion 111, and is located around the display driver chip 300. In this way, the display driver chip 300 can have a sixth vertical projection on the bent portion 111, and this sixth vertical projection does not overlap with the seventh vertical projection of the electronic component 40 on the bent portion 111, thereby preventing interference between the placement of the electronic component 40 and the placement of the display driver chip 300.

[0123] The above description is based on the example of the non-bending portion 301 being reversely bonded to the bending portion 111 as shown in FIG12 . In other embodiments of the present application, a forward bonding method can be used to electrically connect the electrical connection end b2 of the non-bending portion 301 having the gold finger to the second end a1 of the bending portion 111 facing away from the display screen, with the remaining non-electrically connected portion of the non-bending portion 301 extending out of the bending portion 111. In this case, the electronic component 40 can be disposed on the portion of the non-bending portion 301 extending out of the bending portion 111, thereby preventing interference between the electronic component 40 and the display driver chip 300 on the bending portion 111.

[0124] Next, as shown in FIG13 , a support sheet 102 and a piezoelectric vibrating sheet 103 may be sequentially arranged on the back side B of the display screen 101. For example, the support sheet 102 may be first pasted on the back side B of the display screen 101. In some embodiments of the present application, in order to improve the integration of the display module 10, the support sheet 102 may include a flexible substrate 1021 and a near field communication (NFC) coil 1022 as shown in FIG14 , and the NFC coil 1022 may be arranged in the flexible substrate 1021. In this way, there is no need to additionally set up an NFC coil, and the flexible substrate with the NFC coil is shared with the support sheet 102, thereby achieving the purpose of reducing the number of internal components of the electronic device, simplifying the internal structure of the electronic device, and optimizing the size.

[0125] For example, the material of the flexible substrate 1021 may include a resin material such as polyimide (PI) or polyester (PET), and the material constituting the NFC coil 1022 may include metallic copper. Therefore, the support sheet 102 may be prepared using the method for preparing an FPC. As can be seen from the above, the larger the area of ​​the support sheet 102, the larger the area of ​​the support sheet 102 used to support the piezoelectric vibrating piece 103, which is conducive to increasing the area of ​​the piezoelectric vibrating piece 103. Therefore, as shown in Figure 14, in order to increase the contact area between the support sheet 102 and the back surface B of the display screen 101 (as shown in Figure 13), the area of ​​the flexible substrate 1021 in the support sheet 102 can be increased as much as possible, and the NFC coil 1022 does not need to cover the entire flexible substrate 1021. In this way, the performance of the NFC coil 1022 can be guaranteed while increasing the area of ​​the entire support sheet 102.

[0126] Alternatively, in other embodiments of the present application, when the electronic device 01 does not need to have NFC functionality, or the NFC coil is located elsewhere, the support sheet 102 may be a resin substrate, such as a substrate made of a resin material such as polyimide (PI) or polyester (PET). Alternatively, the support sheet 102 may be a metal substrate or an FPC.

[0127] Based on this, in order to maximize the area of ​​the support sheet 102 used to support the piezoelectric vibrating piece 103, in some embodiments of the present application, as shown in FIG15 , the support sheet 102 can cover the entire back surface B of the display screen 101 (as shown in FIG13 ). In this way, within the manufacturing and installation tolerances, the vertical projection of the support sheet 102 on the XY plane can completely overlap with the vertical projection of the display screen 101 on the XY plane. In this case, the shape of the support sheet 102 can be the same or approximately the same as the shape and size of the display screen 101. In this case, the area covered by the support sheet 102 on the display screen 101 can be maximized or approximately maximized, thereby providing a larger support area for the piezoelectric vibrating piece 103, which is beneficial for increasing the area of ​​the piezoelectric vibrating piece 103.

[0128] Next, as shown in FIG15 , the bent portion 111 bounded by the non-bent portion 301 is bent in the direction indicated by the arrow toward the back side B of the display screen 101, so that the electrical connection portion 110 (including the bent portion 111 and the non-bent portion 301) is disposed on the side of the support sheet 102 facing away from the display screen 101, that is, bent toward the back side of the display screen 101. Simultaneously, the display driver chip 300 disposed on the bent portion 111 and the electronic component 40 disposed on the non-bent portion 301 can both be disposed along the bent portion 111 on the back side B of the display screen 101.

[0129] In this case, as shown in Figure 16, the electrical connection portion 110 (including the bent portion 111 and the non-bent portion 301) has a third vertical projection on the display screen 101, which can overlap with the second vertical projection of the support sheet 102 on the display screen 101. In addition, the vertical projections of the display driver chip 300 and the electronic component 40 on the display screen 101 can also overlap with the second vertical projection of the support sheet 102 on the display screen 101. In this way, the electrical connection portion 110 can be stacked with the support sheet 102. Similarly, the display driver chip 300 and the electronic component 40 can be stacked with the support sheet 102, thereby effectively improving the space utilization of the electronic device in the XY plane.

[0130] Next, the piezoelectric vibrating plate 103 shown in Figure 17 is attached to the side of the support plate 102 facing away from the display screen 101. The third vertical projection of the electrical connection portion 110 on the display screen 101 can be arranged to not overlap with the first vertical projection of the piezoelectric vibrating plate 103 on the display screen 101. This prevents interference between the placement of the piezoelectric vibrating plate 103 and the placement of the electrical connection portion 110. For example, the piezoelectric vibrating plate 103 can be placed on the entire back surface of the support plate 102, except for the area where the electrical connection portion 110 is located. This effectively increases the coverage area of ​​the piezoelectric vibrating plate and enhances the sound generation effect of the screen.

[0131] Furthermore, as shown in Figure 17 , the vertical projections of the display driver chip 300 and electronic components 40 on the display screen 101 do not overlap with the vertical projections of the piezoelectric vibrating piece 103 on the display screen 101. This prevents the display driver chip 300 and electronic components 40 from interfering with the positions of the bent portion 111 and the non-bent portion 301, thereby affecting the vibration effect of the piezoelectric vibrating piece 103. Furthermore, as can be seen from the above, the display driver chip 300 can be positioned within the avoidance hole 3011 on the non-bent portion 301, thereby avoiding positional interference with the electronic components 40 on the non-bent portion 301. Based on this, the display module 10 shown in Figure 17 can be positioned within the frame 11 shown in Figure 18 , and the rear housing 12 shown in Figure 2 can then be fastened to the back of the display module 10, thereby completing the assembly of the electronic device 01.

[0132] The above description uses the example of installing the support sheet 102 on the back surface B of the display screen 101 before the electrical connection portion 110 is bent to the back surface of the display screen 101. After the electrical connection portion 110 is bent to the back surface of the display screen 101, the piezoelectric vibrating piece 103 is installed on the surface of the support sheet 102 facing away from the display screen 101. In other embodiments of the present application, if the electrical connection portion 110 and the piezoelectric vibrating piece 103 do not overlap, the piezoelectric vibrating piece 103 can be first attached to the surface of the support sheet 102 facing away from the display screen 101. The support sheet 102, along with the piezoelectric vibrating piece 103, can then be attached to the back surface of the display screen 101. Finally, the electrical connection portion 110 is bent to the back surface of the display screen 101.

[0133] On this basis, in order to avoid interference between the setting position of the piezoelectric vibration piece 103 and the setting position of the electrical connection part 110, in some embodiments of the present application, as shown in Figure 19A (a top view obtained along the direction A in Figure 17), the back of the display screen 101 can have a first area 601 and a second area 602, and the sum of the areas of the above-mentioned first area 601 and the second area 602 can be the same as the area of ​​the back of the display screen 101, that is, the back of the display screen 101 can be divided into two areas in total, and the above-mentioned two areas can be the first area 601 and the second area 602 respectively.

[0134] In this case, as shown in Figure 19A , the piezoelectric vibrating piece 103 can be located in the first region 601. For example, the piezoelectric vibrating piece 103 can cover the entire first region 601. That is, within manufacturing and installation tolerances, the first vertical projection of the piezoelectric vibrating piece 103 on the display screen 101 completely overlaps the first region 601. Furthermore, the electrical connection portion 110, the display driver chip 300, and the electronic components 40 can be located in the second region 602.

[0135] In the case where the third perpendicular projection of the electrical connection portion 110 on the display screen 101 does not overlap with the first perpendicular projection of the piezoelectric vibrating piece 103 on the display screen 101, a gap H may be provided between the piezoelectric vibrating piece 103 and the electrical connection portion 110. For example, within the manufacturing and installation tolerances, the smaller the gap between the piezoelectric vibrating piece 103 and the electrical connection portion 110, the better, thereby facilitating a larger area of ​​the piezoelectric vibrating piece 103. Alternatively, if the manufacturing process can meet precision requirements, the gap H may not be required between the piezoelectric vibrating piece 103 and the electrical connection portion 110.

[0136] Based on this, as shown in Figure 19A , it can be seen from the above that the bent portion 111 and the non-bent portion 301 of the electrical connection portion 110 are stacked, the display driver chip 300 is located within the avoidance hole 3011 (as shown in Figure 17 ) on the non-bent portion 301, and the electronic components 40 are located around the display driver chip 300. This effectively improves the utilization rate of the second region 602 and helps reduce the area of ​​the second region 602. In this way, when the area of ​​the second region 602 is reduced, the area of ​​the first region 601 can be increased, thereby increasing the XY area of ​​the piezoelectric vibrating piece 103 located within the first region 601. As can be seen from the above, when the area of ​​the piezoelectric vibrating piece 103 in the XY plane is increased, the effect of the piezoelectric vibrating piece 103 driving the display screen 101 to achieve screen sound can be effectively improved.

[0137] For example, when the piezoelectric vibrating piece 103 drives the display screen 101 to function as a speaker to play voice (for example, to play a prompt sound or video when the user wears the electronic device 01 to exercise), the sound intensity of the screen sound can reach approximately 78.9 dBSPL as shown in Table 1. Alternatively, for another example, when the piezoelectric vibrating piece 103 drives the display screen 101 to function as a speaker to play music, the sound intensity of the screen sound can reach approximately 84.9 dBSPL as shown in Table 1. Alternatively, for another example, when the piezoelectric vibrating piece 103 drives the display screen 101 to function as a buzzer to play a buzzer sound, the sound intensity of the screen sound can reach approximately 68.2 dBSPL as shown in Table 1.

[0138] Table 1

[0139] Or, as another example, when the piezoelectric vibrating piece 103 drives the display screen 101 to realize the function of the sonar module, as shown in Figure 19B, the above-mentioned two electronic devices 01a and electronic device 01b can both be placed underwater at a depth D of 7 to 8 meters, and the distance H between electronic device 01a and electronic device 01b can be about 20 meters.

[0140] In this case, the processor within electronic device 01a converts text, voice, image, and other information into electrical signals. After the encoder digitizes the information (for example, each data packet can include 100 frames, each containing 24 bits of valid information), the electrical signals are transmitted to the piezoelectric vibrating plate 103 shown in FIG19A via the driving circuit 200 shown in FIG4 . The piezoelectric vibrating plate 103 drives the display screen 101 (shown in FIG17 ) to vibrate and emit sound in response to the electrical signals. The sound, transmitted through water as a transmission medium, reaches electronic device 01b, where it is converted into the corresponding text, voice, image, and other information. The success rate of electronic device 01b receiving the signal can reach over 80%.

[0141] The above description is based on the example of a piezoelectric vibrating piece 103 disposed in the first region 601 in FIG19A. In other embodiments of the present application, as shown in FIG20 , where the back of the display screen 101 may have a first region 601 and a second region 602, the display module 10 may include multiple piezoelectric vibrating pieces 103, which may be spaced apart within the first region 601. For example, the multiple piezoelectric vibrating pieces 103 may have the same shape and size, and may be arranged in an array.

[0142] Alternatively, for example, at least two of the plurality of piezoelectric vibrating plates 103 may have different shapes or sizes. For example, the piezoelectric vibrating plate 103 located in the center may have a regular shape, such as a rectangle. The portion of the piezoelectric vibrating plate 103 located at the edge of the display screen may match the edge contour of the display screen. This effectively utilizes the layout area of ​​the first region 601 and increases the number of piezoelectric vibrating plates 103.

[0143] Furthermore, the above description is based on the example of the piezoelectric vibrating piece 103 located in the first region 601 in FIG19A covering the entire first region 601. In other embodiments of the present application, the piezoelectric vibrating piece 103 need not cover the entire first region 601. For example, the vertical projection of the piezoelectric vibrating piece 103 located in the first region 601 onto the support plate 102 may be in the shape of a ring as shown in FIG21 (a circular ring is used as an example in FIG21 , but a rectangular ring is also possible), a circle (or ellipse) as shown in FIG22 , or a rectangle as shown in FIG23 .

[0144] In other embodiments of the present application, when the display module 10 has multiple piezoelectric vibrating plates, for example, as shown in Figure 24, the back side B of the display screen 101 can have a first area 601, a second area 602 and at least one third area 603, and the sum of the areas of the first area 601, the second area 602 and the third area 603 is the same as the area of ​​the back side B of the display screen 101, that is, the back side of the display screen 101 can be divided into three areas in total, and the above three areas can be the first area 601, the second area 602 and the third area 603 respectively.

[0145] The first region 601 and the second region 602 are arranged along a first direction (i.e., the X direction), while the second region 602 and the third region 603 are arranged along a second direction (i.e., the Y direction). The first direction (i.e., the X direction) and the second direction (i.e., the Y direction) are different, and the first direction (i.e., the X direction) and the second direction (i.e., the Y direction) are parallel to the back surface of the display screen 101. The electrical connection portion 110 (including the non-bending portion 301 and the bending portion 111) can be located within the second region 602.

[0146] On this basis, as shown in Figure 25 , the at least one piezoelectric vibrating piece can include a first piezoelectric vibrating piece 1031 and a second piezoelectric vibrating piece 1032. The first piezoelectric vibrating piece 1031 can cover the entire first region 601. Similarly, within manufacturing and installation tolerances, the vertical projection of the first piezoelectric vibrating piece 1031 on the XY plane can completely overlap with the first region 601. In this case, the shape and size of the first piezoelectric vibrating piece 1031 can be identical or approximately identical to those of the first region 601. Furthermore, the second piezoelectric vibrating piece 1032 is located within the third region 603.

[0147] Based on this, the second region 602 and the third region 603 are arranged along the second direction, i.e., the Y direction. In this case, the second region 602 and the third region 603 can be located above the first region 601, and the third region 603 is provided on one side of the second region 602. For example, the third region 603 can be provided on at least one of the left and right sides of the second region 602 where the electrical connection portion 110 is located.

[0148] In this way, a piezoelectric vibration piece, such as the second piezoelectric vibration piece 1032 mentioned above, can be set on at least one of the left and right sides of the second area 602 where the electrical connection part 110 is located, thereby increasing the number of piezoelectric vibration pieces and the contact area between the piezoelectric vibration piece and the display screen 101, thereby achieving the purpose of improving the sound effect of driving the screen.

[0149] Figure 25 illustrates the spacing between the first piezoelectric vibrating plate 1031 and the second piezoelectric vibrating plate 1032. In other embodiments of the present application, within the permitted range of manufacturing process and manufacturing tolerances, a gap may not be required between the first piezoelectric vibrating plate 1031 and the second piezoelectric vibrating plate 1032. Alternatively, the first piezoelectric vibrating plate 1031 and the second piezoelectric vibrating plate 1032 may be connected to form an integrated structure. In this case, the integrated structure may cover both sides of the electrical connection portion 110 along the Y direction, with the electrodes of the integrated structure being located on both sides of the electrical connection portion 110.

[0150] The above example illustrates the arrangement of the piezoelectric vibrating piece 103 and the electrical connection portion 110, assuming the display module 10 has a circular outline. In other embodiments of the present application, as shown in FIG26A , when the display module 10 has a rectangular outline, the piezoelectric vibrating piece 103 can be a regular rectangle, and a gap H can be provided between the piezoelectric vibrating piece 103 and the electrical connection portion 110 (including the non-bent portion 301 and the bent portion 111). As shown in FIG26B , within the permitted range of the manufacturing process and manufacturing tolerances, no gap is required between the piezoelectric vibrating piece 103 and the electrical connection portion 110.

[0151] Alternatively, as shown in FIG26C , when the display module 10 is rectangular, the piezoelectric vibrating piece 103 may be irregularly shaped, and the piezoelectric vibrating piece 103 may cover both sides of the electrical connection portion 110 along the Y direction. Similarly, the electrodes of the piezoelectric vibrating piece 103 may be provided on both sides of the electrical connection portion 110 along the Y direction.

[0152] For the sake of convenience, the following description will still be based on the example of a circular outline of the display module 10. When the outline of the display module 10 is a rectangle or other shape, the setting method can be obtained in the same way and will not be described in detail. Based on this, the above description is based on the example of the piezoelectric vibration piece 103 and the electrical connection part 110 (including the non-bending part 301 and the bending part 111) not overlapping when the support piece 102 covers the entire back of the display screen 101. In other embodiments of the present application, as shown in Figure 27, when the support piece 102 covers the entire back of the display screen 101, the piezoelectric vibration piece 103 can cover the entire surface B of the support piece 102 facing away from the display screen 101. In this case, the piezoelectric vibration piece 103 can have the same shape as the support piece 102.

[0153] In this case, the support sheet 102 and the piezoelectric vibrating piece 103 can be attached sequentially to the back surface B of the display screen 101. Alternatively, the support sheet 102 and the piezoelectric vibrating piece 103 can be attached together to form an assembly, and then the assembly can be attached to the back surface B of the display screen 101. Next, the electrical connection portion 110 is bent toward the back surface of the display screen 101, so that the electrical connection portion 110 is located on the side of the piezoelectric vibrating piece 103 facing away from the support sheet 102, thereby allowing the electrical connection portion 110 to be stacked with the piezoelectric vibrating piece 103. This approach can approximately maximize the area of ​​the piezoelectric vibrating piece 103. For example, within the allowable range of manufacturing and assembly tolerances, the area of ​​the piezoelectric vibrating piece 103 and the support sheet 102 can be the same as the area of ​​the back surface B of the display screen 101, thereby achieving the purpose of improving the sound effect of the screen.

[0154] Furthermore, the above description uses the stacked arrangement of the support sheet 102 and the electrical connection portion 110 shown in FIG17 as an example. In other embodiments of the present application, the support sheet 102 and the electrical connection portion 110 do not overlap. For example, as shown in FIG28 , the electrical connection portion 110 has a third vertical projection on the display screen 101, and this third vertical projection does not overlap with the second vertical projection of the support sheet 102 on the display screen 101. Based on this, it can be seen from the above description that the piezoelectric vibrating piece 103 is completely covered by the support sheet 102. Therefore, the third vertical projection of the electrical connection portion 110 on the display screen 101 does not overlap with the first vertical projection of the piezoelectric vibrating piece 103 on the display screen 101, that is, the electrical connection portion 110 and the piezoelectric vibrating piece 103 do not overlap. As a result, the arrangement of the support sheet 102 and the piezoelectric vibrating piece 103 does not interfere with the arrangement of the electrical connection portion 110.

[0155] On this basis, to increase the area covered by the support sheet 102 and piezoelectric vibrating piece 103 on the back of the display screen 101, as shown in Figure 28 , the edges of the support sheet 102 and piezoelectric vibrating piece 103 can overlap with the edges of the display screen 101. This allows the entire back of the display screen 101, excluding the portion where the electrical connection portion 110 is located, to be covered by the support sheet 102 and piezoelectric vibrating piece 103, thereby increasing the support area for the piezoelectric vibrating piece 103. Based on this, the arrangement of the piezoelectric vibrating piece 103 is the same as described above and will not be further elaborated here. Furthermore, the stacking arrangement of the electrical connection portion 110, as well as the arrangement of the display driver chip 300 and electronic components 40, are the same as described above and will not be further elaborated here.

[0156] The above description uses the example of a display module 10 in which a support plate 102 is disposed between the piezoelectric vibrating plate 103 and the back of the display screen 101. In other embodiments of the present application, as described above, as shown in FIG29 , the display module 10 includes the aforementioned display screen 101 and the piezoelectric vibrating plate 103. Alternatively, the display module 10 further includes an electrical connection portion 110 (including a bent portion 111 and a non-bent portion 301). The arrangement of the display screen 101 and the electrical connection portion 110 is the same as described above and will not be further described here.

[0157] 29 , the piezoelectric vibrating piece 103 is disposed on the back surface B of the display screen 101. Furthermore, the piezoelectric vibrating piece 103 can be directly connected to the display screen 101. For example, the piezoelectric vibrating piece 103 can be directly bonded to the back surface B of the display screen 101 by a glue dispensing process.

[0158] On this basis, as shown in Figure 30 , the vertical projection of the piezoelectric vibrating plate 103 on the display screen 101 can be non-overlapping with the vertical projection of the electrical connection portion 110 on the display screen 101. Furthermore, the edge of the piezoelectric vibrating plate 103 can overlap with the edge of the display screen 101. This allows the entire backside of the display screen 101, excluding the portion where the electrical connection portion 110 is located, to be covered by the piezoelectric vibrating plate 103, thereby increasing the area of ​​the piezoelectric vibrating plate 103 and improving the sound effects of the screen. Based on this, the configuration of the piezoelectric vibrating plate 103 is the same as described above and will not be further elaborated here. Furthermore, the technical effects of the piezoelectric vibrating plate 103 are the same as described above and will not be further elaborated here.

[0159] The above is only a specific embodiment of the present application, but the scope of protection of this application is not limited to this. Any changes or substitutions within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A display module, characterized in that: include: Display screen; A supporting sheet, disposed on the back of the display screen and connected to the display screen; At least one piezoelectric vibrating plate is disposed on a side of the supporting plate facing away from the display screen and is connected to the supporting plate; in the thickness direction of the display screen, the piezoelectric vibrating plate is used to drive the display screen to vibrate; The piezoelectric vibrating plate has a first vertical projection on the display screen, and the first vertical projection is located within a second vertical projection range of the supporting plate on the display screen.

2. The display module according to claim 1, wherein: The piezoelectric vibrating piece is directly bonded to the supporting piece.

3. The display module according to claim 1 or 2, characterized in that: The display module further includes: an electrical connection portion, electrically connected to the display screen, wherein the electrical connection portion is bent to a side of the support sheet facing away from the display screen; The electrical connection portion has a third vertical projection on the display screen; the third vertical projection overlaps with the second vertical projection of the support sheet on the display screen.

4. The display module according to claim 3, wherein: The supporting sheet covers the entire back side of the display screen.

5. The display module according to claim 3 or 4, characterized in that: The third vertical projection does not overlap with the first vertical projection of the piezoelectric vibrating piece on the display screen.

6. The display module according to claim 5, wherein: The back of the display screen has a first area and a second area, and the sum of the areas of the first area and the second area is the same as the area of ​​the back of the display screen; The piezoelectric vibrating piece covers the entire first area; The electrical connection portion is located in the second area.

7. The display module according to claim 5, wherein: The back of the display screen has a first area and a second area, and the sum of the areas of the first area and the second area is the same as the area of ​​the back of the display screen; The display module includes a plurality of piezoelectric vibrating pieces, and the plurality of piezoelectric vibrating pieces are arranged at intervals in the first area; The electrical connection portion is located in the second area.

8. The display module according to claim 5, wherein: The back of the display screen has a first area, a second area, and a third area, and the sum of the areas of the first area, the second area, and at least one third area is the same as the area of ​​the back of the display screen; The first area and the second area are arranged along a first direction; the second area and the third area are arranged along a second direction; the first direction and the second direction are different, and the first direction and the second direction are parallel to the back of the display screen; The electrical connection portion is located in the second area; The at least one piezoelectric vibrating piece includes: a first piezoelectric vibrating plate, covering the entire first area; The second piezoelectric vibrating piece is located in the third area.

9. The display module according to claim 4, wherein: The piezoelectric vibrating plate covers the entire surface of the supporting plate away from the display screen; the electrical connection portion is located on a side of the piezoelectric vibrating plate away from the supporting plate.

10. The display module according to claim 2, wherein: The display module further includes: an electrical connection portion, electrically connected to the display screen, wherein the electrical connection portion is bent to a side of the support sheet facing away from the display screen; The electrical connection portion has a third vertical projection on the display screen; the third vertical projection does not overlap with the second vertical projection of the support sheet on the display screen.

11. The display module according to any one of claims 3 to 10, wherein: The electrical connection portion includes: a bending portion; a first end of the bending portion is electrically connected to the display screen, and a second end of the bending portion is bent to a side where the back of the display screen is located; The non-bending portion is electrically connected to the second end of the bending portion; the non-bending portion is arranged on the side where the back of the display screen is located.

12. The display module according to claim 11, wherein: The electrical connection portion is a first circuit board; or the non-bending portion is a second circuit board.

13. The display module according to claim 11 or 12, characterized in that: The non-bending portion is a second circuit board; The bent portion has a fourth vertical projection on the display screen, and the fourth vertical projection is located within the range of the fifth vertical projection of the non-bending portion on the display screen.

14. The display module according to claim 13, wherein: The bent portion has a first end facing the display screen and a second end facing away from the display screen, wherein the first end is connected to the display screen; The non-bending portion has an electrical connection end and a non-electrical connection end. Relative to the electrical connection end, the non-electrical connection end is arranged close to the display screen, and the electrical connection end is electrically connected to the second end of the bending portion.

15. The display module according to claim 13 or 14, wherein: The non-bending portion is provided with an avoidance hole, and the avoidance hole passes through the non-bending portion; The display module further includes: A display driver chip is disposed on the bent portion and electrically connected to the display screen; the display driver chip is disposed in the avoidance hole; At least one electronic component is arranged on the non-bending portion and is electrically connected to the non-bending portion and the display driver chip; the display driver chip has a sixth vertical projection on the bending portion, and the sixth vertical projection and the seventh vertical projection of the electronic component on the bending portion do not overlap.

16. The display module according to any one of claims 1 to 15, characterized in that: The vertical projection of the piezoelectric vibrating plate on the supporting plate is in the shape of a ring, a circle or a rectangle.

17. The display module according to any one of claims 1 to 16, wherein: The support sheet includes: Flexible substrates; The near field communication (NFC) coil is disposed in the flexible substrate.

18. The display module according to any one of claims 1 to 16, characterized in that: The supporting sheet is a resin substrate or a metal substrate.

19. An electronic device, characterized in that: include: middle frame; The display module according to any one of claims 1 to 18; The display module is arranged in the middle frame.

20. The electronic device according to claim 19, wherein The electronic device further includes a rear shell, the rear shell being connected to the middle frame and enclosing an installation space; The display module also includes an electrical connection portion, which is electrically connected to the display screen of the display module. The electrical connection portion is bent to the back of the display screen and is located in the installation space; the side of the middle frame facing away from the rear shell exposes the display surface of the display screen.

Citation Information

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