Optical sensor and electronic device

Abstract

The utility model discloses an optical sensor and an electronic device, the optical sensor comprises a substrate, a first optical sensing chip, a dodging structure, a first light transmission layer and a shading packaging layer, the first optical sensing chip is arranged on the substrate and is electrically connected with the substrate, the dodging structure is arranged above the first optical sensing chip, and the first light transmission layer is electrically connected with the first light transmission layer. The vertical projection of the dodging structure at least covers the effective photosensitive area of the first optical sensing chip, the first light transmitting layer is arranged above the dodging structure, and the vertical projection of the first light transmitting layer at least covers the effective photosensitive area of the first optical sensing chip. The shading packaging layer is arranged on the substrate and packages the first optical sensing chip, the dodging structure and the side portion of the first light transmitting layer. The electronic equipment comprises the optical sensor. According to the utility model, the half-power angle of the light above the first optical sensing chip is enlarged, so that the application performance of the optical sensor is improved; and the dodging structure is embedded in the packaging structure, so that the miniaturization design of the optical sensor can be realized.

Description

Technical Field

[0001] This utility model relates to the field of sensor technology, and more specifically, to an optical sensor and electronic device. Background Technology

[0002] With the development of high-end consumer electronics, the demand for installing optical sensors or integrating multiple optical sensors under the screens of electronic devices is becoming increasingly strong. In natural environments, light typically follows a Lambertian distribution, but after passing through the screen of an electronic device, the screen attenuates light at large angles. Optical sensors primarily detect light above the optical sensing chip; the attenuation of large-angle light by the screen reduces the effective angle of light received by the optical sensing chip, thus degrading the performance of the optical sensor. Utility Model Content

[0003] To address the shortcomings of existing technologies, this invention innovatively provides an optical sensor and electronic device. By setting a light-uniforming structure above the effective photosensitive area of ​​the first optical sensor chip, the half-power angle of the light rays above the first optical sensor chip is expanded, thereby increasing the angle of the effective light rays received by the effective photosensitive area of ​​the first optical sensor chip and improving the application performance of the optical sensor. The light-uniforming structure is embedded inside the packaging structure, which does not increase the length and width of the optical sensor. The size of the light-uniforming structure in the height direction is also very small, which enables the miniaturization design of the optical sensor.

[0004] To achieve the aforementioned technical objectives, the first aspect of this utility model discloses an optical sensor, including a substrate and a first optical sensing chip. 、 The light-uniform structure, the first light-transmitting layer, and the light-shielding encapsulation layer

[0005] The first optical sensing chip is disposed on the substrate and electrically connected to the substrate.

[0006] The light-diffusing structure is disposed above the first optical sensor chip, and the vertical projection of the light-diffusing structure at least covers the effective photosensitive area of ​​the first optical sensor chip.

[0007] The first light-transmitting layer is disposed above the light-uniforming structure, and the vertical projection of the first light-transmitting layer at least covers the effective photosensitive area of ​​the first optical sensing chip.

[0008] The light-shielding encapsulation layer is disposed on the substrate and encapsulates the first optical sensing chip, the light-uniforming structure, and the side portion of the first light-transmitting layer.

[0009] Furthermore, the light-uniforming structure has a flat upper surface and multiple first protrusions on the lower surface. A first light-transmitting adhesive layer is provided below the light-uniforming structure. The refractive index of the first light-transmitting adhesive layer is less than that of the light-uniforming structure. The light-uniforming structure is bonded to the first optical sensor chip or to a first transparent layer disposed on the first optical sensor chip through the first light-transmitting adhesive layer. The vertical projection of the first transparent layer at least covers the effective photosensitive area of ​​the first optical sensor chip.

[0010] Furthermore, the refractive index difference between the light-uniforming structure and the first light-transmitting adhesive layer is greater than 0.25.

[0011] Furthermore, the refractive index difference between the light-uniforming structure and the first light-transmitting adhesive layer is greater than 0.4.

[0012] Furthermore, the light-uniforming structure has a flat upper surface and a lower surface with multiple first protrusions. A leveling layer is provided below the light-uniforming structure. The upper surface of the leveling layer has multiple second protrusions, which fill the gaps between the first protrusions on the lower surface of the light-uniforming structure. The lower surface of the leveling layer is a flat plane, and the refractive index of the leveling layer is less than that of the light-uniforming structure. The lower surface of the leveling layer is attached to the first optical sensing chip or to a second transparent layer disposed on the first optical sensing chip. The vertical projection of the second transparent layer at least covers the effective photosensitive area of ​​the first optical sensing chip.

[0013] Furthermore, the refractive index difference between the uniform light structure and the leveling layer is greater than 0.25.

[0014] Furthermore, the refractive index difference between the uniform light structure and the leveling layer is greater than 0.4.

[0015] Furthermore, the light-uniforming structure has a flat upper surface and multiple first protrusions on the lower surface. A dam is provided around the lower perimeter of the light-uniforming structure. The dam is attached to the first optical sensor chip to form an air gap between the light-uniforming structure and the first optical sensor chip. Alternatively, the dam is attached to a third transparent layer disposed on the first optical sensor chip to form an air gap between the light-uniforming structure and the third transparent layer. The vertical projection of the air gap at least covers the effective photosensitive area of ​​the first optical sensor chip, and the vertical projection of the third transparent layer at least covers the effective photosensitive area of ​​the first optical sensor chip.

[0016] Furthermore, the optical sensor also includes a first filter layer, which is attached to the first light-transmitting layer or disposed between the first light-transmitting layer and the light-uniforming structure.

[0017] Furthermore, the light-uniforming structure includes at least one light-concentrating unit and at least one light-blocking unit. At least one light-blocking unit is disposed below each light-concentrating unit. The at least one light-concentrating unit at least covers the effective photosensitive area of ​​the first optical sensor chip. The light-blocking unit corresponding to the light-concentrating unit is located between the light-concentrating unit and the effective photosensitive area of ​​the first optical sensor chip. The light-blocking unit is used to block the concentrated light from reaching the effective photosensitive area of ​​the first optical sensor chip after the first incident light in the incident light is concentrated by the light-concentrating unit corresponding to the light-blocking unit. The angle between the first incident light and the normal of the plane of the effective photosensitive area of ​​the first optical sensor chip is less than an angle threshold, and the angle threshold is less than 90°.

[0018] Furthermore, each of the light-concentrating units corresponds to a light-blocking unit below it; the central axis of the light-concentrating unit is perpendicular to the effective photosensitive area plane of the first optical sensor chip, and the light-blocking unit corresponding to the light-concentrating unit intersects with the central axis of the light-concentrating unit; the projection of the light-blocking unit corresponding to the light-concentrating unit on the first optical sensor chip is located within the projection of the light-concentrating unit on the first optical sensor chip.

[0019] Furthermore, the light-uniforming structure also includes a dielectric layer disposed between the light-concentrating unit and the first optical sensing chip, and the at least one light-blocking unit is disposed within the dielectric layer.

[0020] Furthermore, the light-uniform structure also includes a light-transmitting encapsulation layer, which is disposed on the upper surface of the dielectric layer, and the at least one light-concentrating unit is located within the light-transmitting encapsulation layer.

[0021] Furthermore, the optical sensor also includes a second filter layer, which is attached to the first light-transmitting layer, or disposed between the first light-transmitting layer and the light-uniforming structure, or disposed between the dielectric layer and the first optical sensing chip.

[0022] Furthermore, the dielectric layer includes a first sub-dielectric layer and a second sub-dielectric layer arranged vertically, and the optical sensor further includes a third filter layer disposed between the first sub-dielectric layer and the second sub-dielectric layer.

[0023] Furthermore, the refractive index of the light-concentrating unit is greater than the refractive index of the light-transmitting encapsulation layer.

[0024] Furthermore, the refractive index difference between the light-concentrating unit and the light-transmitting encapsulation layer is greater than 0.25.

[0025] Furthermore, the refractive index difference between the light-concentrating unit and the light-transmitting encapsulation layer is greater than 0.4.

[0026] Furthermore, the light-blocking unit includes a circular light-blocking unit, and in a direction perpendicular to the first optical sensing chip, the central axis of the light-blocking unit corresponding to the light-concentrating unit coincides with the central axis of the light-concentrating unit.

[0027] Furthermore, the optical sensor includes multiple focusing units, which are arranged in an array.

[0028] Furthermore, the top layer of the optical sensor is provided with a light-transmitting and conductive shielding layer, which is electrically connected to the ground wire of the substrate.

[0029] Furthermore, the light-transmitting conductive shielding layer is electrically connected to the ground wire of the substrate through a connector, which is one of a circuit board, a conductive pillar, or a bonding wire, and the light-shielding encapsulation layer encapsulates the connector.

[0030] Furthermore, the material of the light-transmitting conductive shielding layer includes at least one of indium tin oxide, indium zinc oxide, transparent conductive ink, nano silver, or metal grid.

[0031] Furthermore, the optical sensor also includes a processing chip, which is disposed on the substrate and electrically connected to the substrate, and the first optical sensing chip is electrically connected to the processing chip; the first optical sensing chip and the processing chip are laid flat on the substrate, or the first optical sensing chip is disposed on the processing chip; the light-shielding encapsulation layer encapsulates the processing chip.

[0032] Furthermore, the optical sensor also includes a second optical sensing chip, which is disposed on the substrate and electrically connected to the substrate. A second light-transmitting layer is disposed on the second optical sensing chip, and the vertical projection of the second light-transmitting layer covers at least the effective light-sensitive area of ​​the second optical sensing chip. The light-shielding encapsulation layer encapsulates the side portions of the second optical sensing chip and the second light-transmitting layer.

[0033] Furthermore, the first optical sensor chip is used to detect visible light, and the second optical sensor chip is used to detect infrared light.

[0034] Furthermore, the optical sensor also includes a processing chip, which is disposed on the substrate and electrically connected to the substrate. The first optical sensing chip and the second optical sensing chip are electrically connected to the processing chip, and the second optical sensing chip is disposed on the processing chip or on the substrate.

[0035] Furthermore, the light-shielding encapsulation layer is a black epoxy resin molding compound layer or a light-absorbing material layer.

[0036] To achieve the above-mentioned technical objectives, the second aspect of this utility model discloses an electronic device, including the optical sensor described in the first aspect.

[0037] The beneficial effects of this utility model are as follows:

[0038] The optical sensor of this invention expands the half-power angle of the light rays above the first optical sensor chip by setting a light-uniforming structure above the effective photosensitive area of ​​the first optical sensor chip, thereby increasing the angle of the effective light rays received by the effective photosensitive area of ​​the first optical sensor chip and thus improving the application performance of the optical sensor. The light-uniforming structure is embedded inside the packaging structure, which does not increase the length and width of the optical sensor. The size of the light-uniforming structure in the height direction is also very small, which can realize the miniaturization design of the optical sensor. Attached Figure Description

[0039] Figure 1 This is a schematic diagram of the light distribution in a screenless state.

[0040] Figure 2 This is a schematic diagram of the light distribution under the screen.

[0041] Figure 3 This is a longitudinal sectional view of the optical sensor according to the first embodiment of this utility model.

[0042] Figure 4 This is a longitudinal sectional view of the optical sensor according to the second embodiment of this utility model.

[0043] Figure 5 This is a longitudinal sectional view of the optical sensor according to the third embodiment of this utility model.

[0044] Figure 6 This is a longitudinal sectional view of the optical sensor according to the fourth embodiment of this utility model.

[0045] Figure 7 This is a longitudinal sectional view of the optical sensor according to the fifth embodiment of this utility model.

[0046] Figure 8 This is a longitudinal sectional view of the optical sensor according to the sixth embodiment of this utility model.

[0047] Figure 9 This is a longitudinal sectional view of the optical sensor according to the seventh embodiment of this utility model.

[0048] Figure 10 This is a longitudinal sectional view of the optical sensor according to the eighth embodiment of this utility model.

[0049] Figure 11 This is a longitudinal sectional view of the optical sensor according to the ninth embodiment of this utility model.

[0050] Figure 12This is a longitudinal sectional view of the optical sensor according to the tenth embodiment of this utility model.

[0051] Figure 13 This is a schematic diagram of light focusing according to an embodiment of this application.

[0052] Figure 14 This is a schematic diagram of light focusing according to an embodiment of this application.

[0053] Figure 15 This is a schematic diagram of light incident according to an embodiment of this application.

[0054] Figure 16 This is a longitudinal sectional view of the optical sensor according to the eleventh embodiment of this utility model.

[0055] Figure 17 This is a longitudinal sectional view of the optical sensor according to the twelfth embodiment of the present invention.

[0056] Figure 18 This is a longitudinal sectional view of the optical sensor according to the thirteenth embodiment of this utility model.

[0057] Figure 19 This is a longitudinal sectional view of the optical sensor according to the fourteenth embodiment of this utility model.

[0058] Figure 20 This is a longitudinal sectional view of the optical sensor according to the fifteenth embodiment of this utility model.

[0059] Figure 21 This is a longitudinal sectional view of the optical sensor according to the sixteenth embodiment of the present invention.

[0060] Figure 22 This is a longitudinal sectional view of the optical sensor according to the seventeenth embodiment of the present invention.

[0061] Figure 23 This is a longitudinal sectional view of the optical sensor according to the eighteenth embodiment of this utility model.

[0062] Figure 24 This is a longitudinal sectional view of the optical sensor according to the nineteenth embodiment of this utility model.

[0063] Figure 25 This is a longitudinal sectional view of the optical sensor according to the twentieth embodiment of the present invention.

[0064] In the picture,

[0065] 1. Substrate; 2. First optical sensor chip; 3. Light-diffusing structure; 31. Concentrating unit; 32. Light-blocking unit; 33. Dielectric layer; 331. First sub-dielectric layer; 332. Second sub-dielectric layer; 34. Transparent encapsulation layer; 4. First transparent layer; 5. Light-shielding encapsulation layer; 6. First transparent adhesive layer; 7. First transparent layer; 8. Filler layer; 9. Second transparent layer; 10. Dike; 11. Air barrier; 12. Third transparent layer; 13. First filter layer; 14. Second filter layer; 15. Third filter layer; 16. Transparent conductive shielding layer; 17. Connector; 18. Processing chip; 19. Second optical sensor chip; 20. Bonding wire; 21. Second transparent layer; 22. Transparent adhesive. Detailed Implementation

[0066] The optical sensor and electronic device provided by this utility model will be explained and described in detail below with reference to the accompanying drawings.

[0067] In practical applications, the light detection performance of optical sensors is more accurate when the intensity of the received light is more than half that of light with an incident angle of 0°. This intensity of light is called effective light. Light with an incident angle of 0° refers to light that is incident at a 0° angle to the normal to the photosensitive plane, i.e., light in the normal direction, hereinafter referred to as 0° light. On the light intensity distribution curve, the angular range of light with an intensity half that of the 0° light is called the half-power angle. Therefore, in practical applications, the half-power angle is usually used as the application scenario for light detection and also as the screen dimming threshold.

[0068] like Figure 1 and 2 As shown, the intensity of the 0° ray is the highest, and the intensity gradually decreases from 0° towards both the positive and negative semi-axis. Under the same incident light intensity, Figure 1 This is a schematic diagram of light distribution in a screenless state, such as... Figure 1 As shown, in the screenless state, the half-power angle of the light is about 124°, and the half angle of the half-power angle (positive or negative half-axis angle) is about 62°. Figure 2 This is a schematic diagram of light distribution under the screen. The half-power angle of light after passing through the screen of some electronic devices is about 82°, and the half angle of the half-power angle (positive or negative half-axis angle) is only about 41°. It can be seen that the screen attenuates large-angle light, which reduces the field of view of under-screen light detection applications. This results in a reduction in the effective angle of light received by the optical sensor, thus degrading the application performance of the optical sensor.

[0069] This embodiment specifically discloses an optical sensor, such as... Figures 3-12 , Figure 16 Figure 19 shows a substrate 1 and a first optical sensor chip 2. 、The system comprises a light-uniform structure 3, a first light-transmitting layer 4, and a light-shielding encapsulation layer 5. A first optical sensor chip 2 is disposed on and electrically connected to the substrate 1. The first optical sensor chip 2 is bonded to the substrate 1 using silver paste, DAF film (Die Attach Film), or water-based adhesive. The substrate 1 has circuitry and serves as a carrier, enabling interconnection with external signals. The first optical sensor chip 2 is electrically connected to the substrate 1 via bonding wires 20. The first optical sensor chip 2 can receive external light signals and convert them into electrical signals. In this embodiment, the first optical sensor chip 2 is used to detect visible light, and the optical sensor is an ambient light sensor or a color temperature sensor.

[0070] The light-uniform structure 3 is disposed above the first optical sensor chip 2, and the vertical projection of the light-uniform structure 3 at least covers the effective photosensitive area (Active Area, AA area) of the first optical sensor chip 2. Preferably, the vertical projection area of ​​the light-uniform structure 3 is larger than the area of ​​the effective photosensitive area of ​​the first optical sensor chip 2, ensuring that the light-uniform structure 3 receives enough light and performs light-uniform processing on the received light. The light after light-uniform processing then enters the effective photosensitive area of ​​the first optical sensor chip 2, so that the effective photosensitive area of ​​the first optical sensor chip 2 receives as much effective light as possible.

[0071] The first light-transmitting layer 4 is disposed above the light-uniforming structure 3. The vertical projection of the first light-transmitting layer 4 covers at least the effective photosensitive area of ​​the first optical sensing chip 2. Preferably, the vertical projection area of ​​the first light-transmitting layer 4 is larger than the area of ​​the effective photosensitive area of ​​the first optical sensing chip 2. The vertical projection of the light-uniforming structure 3 coincides with the vertical projection of the first light-transmitting layer 4, or the vertical projection of the light-uniforming structure 3 is within the vertical projection of the first light-transmitting layer 4. The first light-transmitting layer 4 protects the light-uniforming structure 3 while ensuring that enough light enters the light-uniforming structure 3.

[0072] In this embodiment, the vertical direction refers to the direction perpendicular to the substrate 1.

[0073] Optionally, the first light-transmitting layer 4 is a glass plate or a transparent organic plate. The transparent organic plate can be a phenolic resin plate, a PETG (polyethylene terephthalate-1,4-cyclohexanediol) plate, a PMMA (polymethyl methacrylate) plate, a PI (polyimide) plate, or a PET (polyethylene terephthalate) plate.

[0074] A light-shielding encapsulation layer 5 is disposed on the substrate 1 and encapsulates the sides of the first optical sensor chip 2, the light-uniforming structure 3, and the first light-transmitting layer 4. The top of the first light-transmitting layer 4 is exposed outside the light-shielding encapsulation layer 5, and the light-shielding encapsulation layer 5 does not affect the effective light intake. The light-shielding encapsulation layer 5 encapsulates the bonding wire 20, sealing and protecting it. The light-shielding encapsulation layer 5 solves the problem of light leakage from the sides of the optical sensor, eliminates the problem of light reflection inside the transparent encapsulation introducing optical signal interference, improves the signal-to-noise ratio, enhances the accuracy of optical signal recognition, improves the reliability of the optical sensor, and meets the needs of more complex application environments.

[0075] Optionally, the light-shielding encapsulation layer 5 is a black epoxy molding compound (EMC) layer or a light-absorbing material layer. The black epoxy molding compound layer is made of transparent EMC filled with black material, which improves the coefficient of thermal expansion compared to transparent EMC, thereby improving the problems of warpage and high stress in optical sensors and reducing the reliability risks caused by stress.

[0076] The light-uniforming structure 3 in this embodiment can achieve a light-uniforming effect, expanding the half-power angle of the light rays above the first optical sensor chip 2, that is, expanding the effective field of view angle above the first optical sensor chip 2. This makes the angle of effective light rays received by the effective photosensitive area of ​​the first optical sensor chip 2 larger, thereby improving the application performance of the first optical sensor chip 2. The light-uniforming structure 3 is embedded inside the packaging structure, which does not increase the length and width of the optical sensor. The size of the light-uniforming structure 3 in the height direction is also very small, which can realize the miniaturization design of the optical sensor.

[0077] In some embodiments, the light-diffusing structure 3 has a flat upper surface and multiple first protrusions on its lower surface; that is, the light-diffusing structure 3 is a diffuser. The first protrusions on the surface of the light-diffusing structure 3 are tiny protrusions. The first protrusions on the surface of the light-diffusing structure 3 reflect the 0° incident light, which originally had the highest intensity, and refract and scatter it into light at other angles, reducing the light intensity in the normal direction and increasing the light intensity at other angles. This results in a batwing-shaped distribution of light intensity above the first optical sensor chip 2. Since the half-power angle is the beam angle when the light intensity is half that of the 0° light intensity, the reduced 0° light intensity effectively expands the half-power angle, increasing the effective field of view angle above the first optical sensor chip 2. This increases the effective light angle received by the effective photosensitive area of ​​the first optical sensor chip 2, enabling light detection at a larger angle. Figure 3 and 4As shown, a first light-transmitting adhesive layer 6 is provided below the light-uniforming structure 3. The refractive index of the first light-transmitting adhesive layer 6 is less than that of the light-uniforming structure 3, ensuring a difference in refractive index between the upper and lower surfaces of the light-uniforming structure 3 to guarantee the light-uniforming effect. Preferably, the refractive index difference between the light-uniforming structure 3 and the first light-transmitting adhesive layer 6 is greater than 0.25; more preferably, the refractive index difference between the light-uniforming structure 3 and the first light-transmitting adhesive layer 6 is greater than 0.4, ensuring a better light-uniforming effect. The light transmittance of the first light-transmitting adhesive layer 6 is greater than or equal to the light transmittance of the first light-transmitting layer 4. The first light-transmitting adhesive layer 6 can be a transparent adhesive layer, a DAF film, or a water-based adhesive. In one embodiment, such as... Figure 3 As shown, the light-diffusing structure 3 is bonded to the first optical sensing chip 2 via the first light-transmitting adhesive layer 6; in another embodiment, as... Figure 4 As shown, the light-uniforming structure 3 is bonded to the first transparent layer 7 disposed on the first optical sensor chip 2 via the first light-transmitting adhesive layer 6. The vertical projection of the first transparent layer 7 at least covers the effective photosensitive area of ​​the first optical sensor chip 2. The first light-transmitting adhesive layer 6 not only achieves the bonding and fixation of the light-uniforming structure 3 to the structure below it, but also ensures the light-uniforming effect of the light-uniforming structure 3.

[0078] Figure 4 In the illustrated embodiment, the first transparent layer 7 is used to support the light-uniforming structure 3. The vertical projection of the first transparent layer 7 at least covers the effective photosensitive area of ​​the first optical sensor chip 2, that is, the vertical projection area of ​​the first transparent layer 7 is equal to or greater than the area of ​​the effective photosensitive area of ​​the first optical sensor chip 2. Preferably, the vertical projection area of ​​the first transparent layer 7 is greater than the area of ​​the effective photosensitive area of ​​the first optical sensor chip 2, such as... Figure 4 As shown, the first transparent layer 7 can extend to the outside of the first optical sensing chip 2 in the direction where the bonding wire 20 is not set, providing a larger bearing area for the light uniform structure 3, which facilitates the installation and fixation of the light uniform structure 3, and allows the light uniform structure 3 to be set larger, ensuring a better light uniform effect.

[0079] Optionally, the first transparent layer 7 is a glass plate or a transparent organic plate. The transparent organic plate can be a phenolic resin plate, a PETG (polyethylene terephthalate-1,4-cyclohexanediol) plate, a PMMA (polymethyl methacrylate) plate, a PI (polyimide) plate, or a PET (polyethylene terephthalate) plate. When the first transparent layer 7 is a glass plate, it is bonded to the first optical sensor chip 2 using a light-transmitting adhesive 22 (not shown in the figure). When the first transparent layer 7 is a transparent organic plate, it can be bonded to the first optical sensor chip 2 using the light-transmitting adhesive 22 (not shown in the figure) or directly injection molded onto the first optical sensor chip 2 using transparent organic material. The specific bonding method between the first transparent layer 7 and the first optical sensor chip 2 is adjusted according to the hardness of the transparent organic material after it is molded into a plate shape. The light-transmitting adhesive 22 is preferably DAF adhesive or water-based adhesive.

[0080] This embodiment also provides a Figure 3 The method for fabricating the optical sensor shown includes the following steps:

[0081] S1. The first optical sensor chip 2 is attached to the substrate 1 by silver paste, DAF film or water adhesive, and connected to the substrate 1 by bonding wire 20 to achieve electrical interconnection.

[0082] S2. A uniform light structure 3 is formed on the first light-transmitting layer 4 by nanoimprinting, dry etching or wet etching. Then, the uniform light structure 3 is bonded to the first optical sensing chip 2 through the first light-transmitting adhesive layer 6, with the first light-transmitting layer 4 above the uniform light structure 3.

[0083] S3. On the upper surface of the substrate 1, the first optical sensor chip 2, the first light-transmitting adhesive layer 6, the light-uniforming structure 3 and the first light-transmitting layer 4 are encapsulated with a light-shielding material or a light-absorbing material to provide comprehensive protection for the first optical sensor chip 2, the first light-transmitting adhesive layer 6, the light-uniforming structure 3 and the first light-transmitting layer 4.

[0084] S4. The top surface of the first light-transmitting layer 4 is exposed through a grinding process.

[0085] Alternatively, in step S3, when encapsulating the first optical sensor chip 2, the first light-transmitting adhesive layer 6, the light-uniforming structure 3, and the first light-transmitting layer 4 with light-shielding or light-absorbing materials, the top surface of the first light-transmitting layer 4 can be directly exposed using an open mold process, so that light can enter the effective photosensitive area of ​​the first optical sensor chip 2.

[0086] Figure 4 The method for manufacturing the optical sensor shown involves first attaching the first transparent layer 7 to the first optical sensor chip 2 before step S2, and then attaching the light-diffusing structure 3 to the first transparent layer 7 through the first light-transmitting adhesive layer 6 during step S2.

[0087] In some embodiments, such as Figure 5 and 6As shown, the light-uniforming structure 3 has a flat upper surface and multiple first protrusions on its lower surface. These first protrusions reflect, refract, and scatter 0° light, thereby reducing the light intensity in the normal direction, expanding the half-power angle, and increasing the effective field of view angle above the first optical sensor chip 2. This increases the effective light angle received by the effective photosensitive area of ​​the first optical sensor chip 2, enabling light detection at a larger angle. A leveling layer 8 is provided below the light-uniforming structure 3. The upper surface of the leveling layer 8 has multiple second protrusions that fill the gaps between the first protrusions on the lower surface of the light-uniforming structure 3. The lower surface of the leveling layer 8 is a flat plane, and its refractive index is less than that of the light-uniforming structure 3, ensuring a refractive index difference at the top and bottom of the surface of the light-uniforming structure 3 to guarantee the light-uniforming effect. Preferably, the refractive index difference between the light-uniforming structure 3 and the leveling layer 8 is greater than 0.25; more preferably, the refractive index difference is greater than 0.4, ensuring a better light-uniforming effect. The leveling layer 8 can be a film or other material with a refractive index lower than that of the uniform light structure 3. This application does not specifically limit its application, as long as it meets the refractive index difference requirement with the uniform light structure 3. In one embodiment, such as... Figure 5 As shown, the lower surface of the leveling layer 8 is bonded to the first optical sensing chip 2; in another embodiment, as... Figure 6 As shown, the lower surface of the leveling layer 8 is bonded to the second transparent layer 9 disposed on the first optical sensor chip 2, and the vertical projection of the second transparent layer 9 at least covers the effective photosensitive area of ​​the first optical sensor chip 2. The leveling layer 8 ensures the light uniformity of the light uniform structure 3 on the one hand, and its flat lower surface facilitates the bonding and fixation with the structure below it on the other hand.

[0088] When the leveling layer 8 is an adhesive layer, the leveling layer 8 can be directly bonded to the first optical sensor chip 2 or the second transparent layer 9 on the first optical sensor chip 2; the leveling layer 8 can also be made of other materials, and then bonded to the first optical sensor chip 2 or the second transparent layer 9 on the first optical sensor chip 2 through the light-transmitting adhesive 22. The refractive index of the light-transmitting adhesive 22 is not subject to special requirements, and commonly used light-transmitting adhesives 22 with a refractive index of 1.4-1.6 can be used, such as DAF adhesive or water adhesive.

[0089] Figure 6 In the illustrated embodiment, the second transparent layer 9 is used to support the light-uniforming structure 3 and the leveling layer 8. The vertical projection of the second transparent layer 9 at least covers the effective photosensitive area of ​​the first optical sensor chip 2, that is, the vertical projection area of ​​the second transparent layer 9 is equal to or greater than the area of ​​the effective photosensitive area of ​​the first optical sensor chip 2. Preferably, the vertical projection area of ​​the second transparent layer 9 is greater than the area of ​​the effective photosensitive area of ​​the first optical sensor chip 2, such as... Figure 6As shown, the second transparent layer 9 can extend beyond the first optical sensor chip 2 in the direction where the bonding wire 20 is not provided, providing a larger bearing area for the light-uniforming structure 3 and the leveling layer 8, which facilitates the installation and fixation of the light-uniforming structure 3 and the leveling layer 8, and allows the light-uniforming structure 3 to be set larger, ensuring a better light-uniforming effect.

[0090] Optionally, the second transparent layer 9 is a glass plate or a transparent organic plate. The transparent organic plate can be a phenolic resin plate, a PETG (polyethylene terephthalate-1,4-cyclohexanediol) plate, a PMMA (polymethyl methacrylate) plate, a PI (polyimide) plate, or a PET (polyethylene terephthalate) plate. When the second transparent layer 9 is a glass plate, it is bonded and fixed to the first optical sensor chip 2 by a light-transmitting adhesive 22. When the second transparent layer 9 is a transparent organic plate, it can be bonded and fixed to the first optical sensor chip 2 by the light-transmitting adhesive 22 or directly injection molded onto the first optical sensor chip 2 using transparent organic material. The specific bonding method between the second transparent layer 9 and the first optical sensor chip 2 is adjusted according to the hardness of the transparent organic material after it is molded into a plate shape. The light-transmitting adhesive 22 is preferably DAF adhesive or water-based adhesive.

[0091] In some embodiments, such as Figure 7 and 8 As shown, the uniform light structure 3 has a flat upper surface and multiple first protrusions on its lower surface. These first protrusions reflect, refract, and scatter 0° light, thereby reducing the light intensity in the normal direction, expanding the half-power angle, and increasing the effective field of view angle above the first optical sensor chip 2. This increases the effective light angle received by the effective photosensitive area of ​​the first optical sensor chip 2, enabling light detection at a larger angle. A dike 10 is provided around the lower perimeter of the uniform light structure 3. The dike 10 is a ring structure, such as a circular ring or a square ring, etc., which is not specifically limited in this application. In one embodiment, such as... Figure 7 As shown, the cofferdam 10 is bonded to the first optical sensing chip 2, forming an air gap 11 between the light-diffusing structure 3 and the first optical sensing chip 2; in another embodiment, as Figure 8As shown, the cofferdam 10 is bonded to the third transparent layer 12 disposed on the first optical sensor chip 2, forming an air gap 11 between the light-uniforming structure 3 and the third transparent layer 12. The vertical projection of the air gap 11 at least covers the effective photosensitive area of ​​the first optical sensor chip 2, and the vertical projection of the third transparent layer 12 at least covers the effective photosensitive area of ​​the first optical sensor chip 2. The air gap 11 is formed by the cofferdam 10 in the horizontal direction, and the outer surface of the cofferdam 10 is wrapped by the light-shielding encapsulation layer 5. The cofferdam 10 serves to support the light-uniforming structure 3 in the vertical direction, so that an air gap 11 is formed between the light-uniforming structure 3 and the first optical sensor chip 2 below it or the third transparent layer 12 on the first optical sensor chip 2. The refractive index of air is less than that of the light-uniforming structure 3, so that there is a difference in refractive index at the top and bottom of the morphological interface of the light-uniforming structure 3, thereby ensuring the light-uniforming effect.

[0092] The material of the cofferdam 10 can be the same as that of the uniform light structure 3, or it can be a rubber material or other materials. This application does not make any specific limitations, nor does it limit the refractive index of the cofferdam 10.

[0093] When the cofferdam 10 and the uniform light structure 3 are made of the same material, the uniform light structure 3 and the cofferdam 10 can be directly formed on the first light-transmitting layer 4 by nanoimprinting, dry etching, or wet etching. When the cofferdam 10 is made of adhesive material, it can be formed by dispensing or die-cutting DAF adhesive on the first optical sensor chip 2 or on the third transparent layer 12 of the first optical sensor chip 2. The specific manufacturing method of the cofferdam 10 is adjusted according to its specific material.

[0094] Figure 8 In the illustrated embodiment, the third transparent layer 12 is used to support the light-uniforming structure 3 and the leveling layer 8. The vertical projection of the third transparent layer 12 at least covers the effective photosensitive area of ​​the first optical sensor chip 2, that is, the vertical projection area of ​​the third transparent layer 12 is equal to or greater than the area of ​​the effective photosensitive area of ​​the first optical sensor chip 2. Preferably, the vertical projection area of ​​the third transparent layer 12 is greater than the area of ​​the effective photosensitive area of ​​the first optical sensor chip 2. The third transparent layer 12 can extend beyond the first optical sensor chip 2 in the direction where the bonding wire 20 is not provided, providing a larger supporting area for the light-uniforming structure 3 and the dam 10, which facilitates the installation and fixation of the light-uniforming structure 3 and the dam 10, and allows the light-uniforming structure 3 and the dam 10 to be set larger, thereby making the area of ​​the air gap 11 larger and ensuring a better light-uniforming effect.

[0095] Optionally, the third transparent layer 12 is a glass plate or a transparent organic plate. The transparent organic plate can be a phenolic resin plate, a PETG (polyethylene terephthalate-1,4-cyclohexanediol) plate, a PMMA (polymethyl methacrylate) plate, a PI (polyimide) plate, or a PET (polyethylene terephthalate) plate. When the third transparent layer 12 is a glass plate, it is bonded to the first optical sensor chip 2 using a light-transmitting adhesive 22. When the third transparent layer 12 is a transparent organic plate, it can be bonded to the first optical sensor chip 2 using the light-transmitting adhesive 22 or directly injection molded onto the first optical sensor chip 2 using a transparent organic material. The specific bonding method between the third transparent layer 12 and the first optical sensor chip 2 is adjusted according to the hardness of the light-transmitting organic material after it is molded into a plate shape. The light-transmitting adhesive 22 is preferably DAF adhesive or water-based adhesive.

[0096] In some embodiments, such as Figure 9 and 10 As shown, the optical sensor also includes a first filter layer 13 for allowing light of a specific wavelength to enter the effective photosensitive area of ​​the first optical sensing chip 2. In one embodiment, as... Figure 9 As shown, the first filter layer 13 is attached to the first light-transmitting layer 4; in another embodiment, as... Figure 10 As shown, a first filter layer 13 is disposed between the first light-transmitting layer 4 and the light-uniforming structure 3. The upper surface of the first filter layer 13 is attached to the first light-transmitting layer 4, and the lower surface of the first filter layer 13 is attached to the light-uniforming structure 3. The vertical projection of the first filter layer 13 at least covers the effective photosensitive area of ​​the first optical sensor chip 2. The first filter layer 13 can be a color filter layer or an infrared cut-off filter layer.

[0097] In some embodiments, such as Figure 11 and 12 As shown, the uniform light structure 3 includes at least one light-concentrating unit 31 and at least one light-blocking unit 32. At least one light-blocking unit 32 is disposed below each light-concentrating unit 31. At least one light-concentrating unit 31 covers at least the effective photosensitive area of ​​the first optical sensing chip 2. The light-blocking unit 32 corresponding to the light-concentrating unit 31 is located between the light-concentrating unit 31 and the effective photosensitive area of ​​the first optical sensing chip 2. The light-blocking unit 32 is used to block the concentrated light from reaching the effective photosensitive area of ​​the first optical sensing chip 2 after the first incident light in the incident light is concentrated by the light-concentrating unit 31 corresponding to the light-blocking unit 32. The angle between the first incident light and the normal of the plane of the effective photosensitive area of ​​the first optical sensing chip 2 is less than an angle threshold, and the angle threshold is less than 90°.

[0098] The incident light with an angle less than the angle threshold between itself and the normal to the effective photosensitive area plane of the first optical sensor chip 2 is focused by the light-concentrating unit 31 and blocked by the light-blocking unit 32, thus failing to illuminate the effective photosensitive area of ​​the first optical sensor chip 2. Incident light with an angle greater than or equal to the angle threshold between itself and the normal to the effective photosensitive area plane of the first optical sensor chip 2 can normally illuminate the effective photosensitive area of ​​the first optical sensor chip 2 after passing through the light-concentrating unit 31. Therefore, the light intensity of the small-angle incident light detected by the effective photosensitive area of ​​the first optical sensor chip 2 decreases, and the light intensity of the small-angle incident light detected by the first optical sensor chip 2 decreases. The light intensity of the incident light at a large angle detected by the effective photosensitive area remains unchanged. Therefore, when the effective photosensitive area of ​​the first optical sensor chip 2 detects the light intensity of the incident light at a large angle, the difference between the light intensity of the incident light at a small angle detected by the effective photosensitive area of ​​the first optical sensor chip 2 and the light intensity of the incident light at a small angle is smaller under the same light intensity. This increases the photosensitive ability of the first optical sensor chip 2 to detect light at large angles, thereby increasing the angle of the effective light received by the effective photosensitive area of ​​the first optical sensor chip 2, improving the performance of the optical sensor, and realizing the light detection function at a larger angle.

[0099] In one example, when multiple light-blocking units 32 are included between each focusing unit 31 and the effective photosensitive area of ​​the first optical sensing chip 2, the multiple light-blocking units 32 can be arranged in parallel on the same plane and spliced ​​together to form a large light-blocking unit 32, or the multiple light-blocking units 32 can be arranged in parallel on the same plane, or the multiple light-blocking units 32 can be arranged on different planes; no limitation is made here. The focusing unit 31 can concentrate light. Specifically, after light shines on the focusing unit 31, the light is refracted, causing a change in the transmission direction. Light shining on different positions of the focusing unit 31 will be concentrated, and the light-blocking units 32 can block the concentrated light. Figure 13 This is a schematic diagram of light focusing provided in an embodiment of this application, such as... Figure 13 As shown, after the light is transmitted to the focusing unit 31, the light is refracted, causing a change in the direction of light transmission. The light blocking unit 32 is disposed between the focusing unit 31 and the effective photosensitive area of ​​the first optical sensor chip 2, opposite to the light blocking unit 32. After the first incident light passes through the focusing unit 31, it is refracted and its propagation direction changes. The light then shines on the light blocking unit 32 and is blocked by the light blocking unit 32, preventing it from shining on the effective photosensitive area of ​​the first optical sensor chip 2. The first incident light is light whose angle between the incident light and the normal to the plane of the effective photosensitive area of ​​the first optical sensor chip 2 is less than an angle threshold, for example: Figure 13 The image shows a first incident light beam with an angle of α and a first incident light beam with an angle of 0° (i.e., perpendicular incidence). The angle α between the first incident light beam and the normal is less than an angle threshold. Figure 14This is a schematic diagram of another light focusing method provided in an embodiment of this application, such as... Figure 14 As shown, the second incident light, whose angle between the incident light and the normal to the effective photosensitive area plane of the first optical sensor chip 2 is greater than or equal to the angle threshold, will not be blocked by the light blocking unit 32 after passing through the light focusing unit 31, and will directly illuminate the effective photosensitive area of ​​the first optical sensor chip 2. Figure 14 The angle β between the light and the normal to the effective photosensitive area plane of the first optical sensor chip 2 is greater than or equal to the angle threshold. It should be understood that, due to the characteristics of light, light rays with an angle greater than 90° between their angle and the normal to the effective photosensitive area plane of the first optical sensor chip 2 will not illuminate the effective photosensitive area of ​​the first optical sensor chip 2; therefore, the angle threshold is less than 90°. It should be noted that, due to the presence of the light-blocking unit 32, the light rays of the first incident light whose angle with the normal to the effective photosensitive area plane of the first optical sensor chip 2 is less than the angle threshold are blocked by the light-blocking unit 32 after passing through the light-focusing unit 31. Conversely, the second incident light whose angle with the normal to the effective photosensitive area plane of the first optical sensor chip 2 is greater than or equal to the angle threshold is not blocked by the light-blocking unit 32 after passing through the light-focusing unit 31 and can directly illuminate the effective photosensitive area of ​​the first optical sensor chip 2. It should also be noted that the effective photosensitive area of ​​the first optical sensor chip 2 in this embodiment is not completely covered by at least one focusing unit 31. Therefore, some rays of the first incident light, whose angle between the ray and the normal to the plane of the effective photosensitive area of ​​the first optical sensor chip 2 is less than the angle threshold, do not pass through the focusing unit 31, but instead pass through a position where no focusing unit 31 is provided, and can then illuminate the effective photosensitive area of ​​the first optical sensor chip 2. For example: Figure 15 This is a schematic diagram of light incidence provided in an embodiment of this application, as shown below. Figure 15 As shown, a portion of the first incident light with an angle of α passes through the gap between the focusing units 31 and illuminates the effective photosensitive area of ​​the first optical sensor chip 2. Therefore, in this embodiment, the optical sensor reduces the amount of light from the first incident light reaching the effective photosensitive area of ​​the first optical sensor chip 2 at an angle less than a threshold angle between the incident light and the normal to the plane of the effective photosensitive area of ​​the first optical sensor chip 2, rather than completely blocking the first incident light. For the second incident light with an angle greater than or equal to the threshold angle between the incident light and the normal to the plane of the effective photosensitive area of ​​the first optical sensor chip 2, the amount of light reaching the effective photosensitive area of ​​the first optical sensor chip 2 remains unchanged. Thus, this application can expand the effective field of view angle above the first optical sensor chip 2, resulting in higher accuracy of the light intensity detected by the optical sensor.

[0100] Optional, such as Figure 11 and 12As shown, each focusing unit 31 corresponds to a light-blocking unit 32 below it; the central axis of the focusing unit 31 is perpendicular to the effective photosensitive area plane of the first optical sensing chip 2, and the light-blocking unit 32 corresponding to the focusing unit 31 intersects the central axis of the focusing unit 31; the projection of the light-blocking unit 32 corresponding to the focusing unit 31 on the first optical sensing chip 2 is located within the projection of the focusing unit 31 on the first optical sensing chip 2. The light-blocking unit 32 can be of various shapes, such as square light-blocking units, circular light-blocking units, etc. The light-blocking unit 32 can be disposed at any position in the effective photosensitive area plane of the focusing unit 31 and the first optical sensing chip 2, for example, the light-blocking unit 32 can be disposed on the upper surface of the first optical sensing chip 2 (e.g., Figure 11 As shown), the light-blocking unit 32 can also be disposed above the effective photosensitive area of ​​the first optical sensor chip 2, without contacting the first optical sensor chip 2. The light-blocking unit 32 corresponding to different light-concentrating units 31 can be disposed in different positions (e.g., Figure 12 (As shown). It should be understood that since the light-blocking unit 32 needs to block incident light at a small angle, that is, to block the light rays of the first incident light whose angle between the incident light and the normal of the effective photosensitive area plane of the first optical sensor chip 2 is less than the angle threshold after passing through the light-concentrating unit 31, and the first incident light is generally concentrated around the central axis of the light-concentrating unit 31 after passing through the light-concentrating unit 31, the light-blocking unit 32 corresponding to the light-concentrating unit 31 intersects with the central axis of the light-concentrating unit 31. It should also be noted that since the second incident light whose angle between the incident light and the normal of the effective photosensitive area plane of the first optical sensor chip 2 is greater than or equal to the angle threshold is generally concentrated at the edge of the light-concentrating unit 31 after passing through the light-concentrating unit 31, in the direction perpendicular to the effective photosensitive area plane of the first optical sensor chip 2, the projection of the light-blocking unit 32 corresponding to the light-concentrating unit 31 on the first optical sensor chip 2 is located within the projection of the light-concentrating unit 31 on the first optical sensor chip 2, that is, the vertical projection of the light-blocking unit 32 does not exceed the vertical projection of the corresponding light-concentrating unit 31. While blocking small-angle incident light, it can prevent the light-blocking unit 32 from blocking large-angle incident light, and it can also prevent the light-blocking unit 32 from exceeding the light-concentrating unit 31 so that incident light not located at the position of the light-concentrating unit 31 is blocked by the light-blocking unit 32, thereby expanding the angle of effective light entering the effective photosensitive area of ​​the first optical sensing chip 2.

[0101] Optional, such as Figure 11 and 12As shown, the light-uniforming structure 3 also includes a dielectric layer 33, which is disposed between the light-concentrating unit 31 and the first optical sensing chip 2. At least one light-blocking unit 32 is disposed within the dielectric layer 33. The dielectric layer 33 provides a light transmission medium and supports the light-concentrating unit 31. After filling the dielectric layer 33, the refractive indices of the light-concentrating unit 31 and the dielectric layer 33 are similar, which can prevent the light propagation direction from changing due to the difference between the refractive indices of air and the light-concentrating unit 31 after the light is emitted from the light-concentrating unit 31. Furthermore, the dielectric layer 33 can seal the effective photosensitive area of ​​the first optical sensing chip 2, preventing the effective photosensitive area plane of the first optical sensing chip 2 from being affected by foreign objects. The light-blocking unit 32 can be completely enclosed within the dielectric layer 33, or it can be disposed on the first optical sensing chip 2 with the dielectric layer 33 covering the sides and top of the light-blocking unit 32.

[0102] In one possible implementation, the light-blocking unit 32 includes a reflective layer or a light-absorbing layer.

[0103] The light-blocking unit 32 may include a reflective layer, which can reflect light and block it. In one example, the reflective layer may be made of metal, such as the metal traces of the first optical sensor chip 2 or the metal layer in the first optical sensor chip 2. The light-blocking unit 32 may also include a light-absorbing layer, which can absorb light and block it. In one example, the light-absorbing layer may be a black material or a coating. The light-blocking unit 32 may be set in the dielectric layer 33 and / or on the surface of the effective photosensitive area of ​​the first optical sensor chip 2.

[0104] The focusing unit 311 can be a lens. In some other implementations, the focusing unit 31 can also be a Fresnel zone plate, a superlens, or other devices with focusing function.

[0105] Optional, such as Figure 11 , Figure 12 , Figures 16-19 As shown, the light-uniform structure 3 also includes a light-transmitting encapsulation layer 34, which is disposed on the upper surface of the dielectric layer 33. At least one light-concentrating unit 31 is located inside the light-transmitting encapsulation layer 34. The light-transmitting encapsulation layer 34 protects the light-concentrating unit 31 and facilitates its bonding and fixation with the first light-transmitting layer 4.

[0106] Optionally, the refractive index of the focusing unit 31 is greater than that of the light-transmitting encapsulation layer 34. When the refractive indices of the focusing unit 31 and the light-transmitting encapsulation layer 34 are different, the focusing unit 31 can function as a light-concentrating unit, that is, to focus the light passing through the focusing unit 31. Preferably, the refractive index difference between the focusing unit 31 and the light-transmitting encapsulation layer 34 is greater than 0.25; more preferably, the refractive index difference between the focusing unit 31 and the light-transmitting encapsulation layer 34 is greater than 0.4, which can achieve a better light-concentrating effect.

[0107] Optional, such as Figure 16-18 As shown, the optical sensor also includes a second filter layer 14, which allows light of a specific wavelength to enter the effective photosensitive area of ​​the first optical sensor chip 2. Figure 16 As shown, the second filter layer 14 is attached to the first light-transmitting layer 4; as Figure 17 As shown, the second filter layer 14 is disposed between the first light-transmitting layer 4 and the light-uniforming structure 3. When the light-uniforming structure 3 includes a light-transmitting encapsulation layer 34, the upper surface of the second filter layer 14 is bonded to the first light-transmitting layer 4, and the lower surface of the second filter layer 14 is bonded to the light-transmitting encapsulation layer 34; as shown... Figure 18 As shown, the second filter layer 14 is disposed between the dielectric layer 33 and the first optical sensor chip 2. The upper surface of the second filter layer 14 is bonded to the dielectric layer 33, and the lower surface of the second filter layer 14 is bonded to the first optical sensor chip 2. The second filter layer 14 can be a color filter layer or an infrared cut-off filter layer.

[0108] Optional, such as Figure 19 As shown, the dielectric layer 33 includes a first sub-dielectric layer 331 and a second sub-dielectric layer 332 arranged vertically. The optical sensor also includes a third filter layer 15, which is disposed between the first sub-dielectric layer 331 and the second sub-dielectric layer 332. The third filter layer 15 allows light of a specific wavelength to enter the effective photosensitive area of ​​the first optical sensor chip 2. The third filter layer 15 can be a color filter layer or an infrared cutoff filter layer. The light-blocking unit 32 can be disposed within the first sub-dielectric layer 331 or the second sub-dielectric layer 332. When each focusing unit 31 corresponds to multiple light-blocking units 32, the light-blocking unit 32 corresponding to each focusing unit 31 can be disposed within the first sub-dielectric layer 331 and / or the second sub-dielectric layer 332. When each focusing unit 31 corresponds to a single light-blocking unit 32, the light-blocking unit 32 can be disposed within the first sub-dielectric layer 331 or the second sub-dielectric layer 332. The light-blocking units 32 corresponding to different focusing units 31 can be disposed in different positions.

[0109] Optionally, the light-blocking unit 32 includes a circular light-blocking unit. In the direction perpendicular to the first optical sensor chip 2, the central axis of the light-blocking unit 32 corresponding to the light-concentrating unit 31 coincides with the central axis of the light-concentrating unit 31. This can block the light that is concentrated near the axis after passing through the light-concentrating unit 31, thereby blocking the first incident light whose angle with the normal of the effective photosensitive area plane of the first optical sensor chip 2 is less than the angle threshold. This can weaken the light of the small-angle incident light detected by the first optical sensor chip 2, thereby improving the application performance of the optical sensor.

[0110] In one possible implementation, the diameter of the light-blocking unit 32 is in the range of [1 μm, 10 μm], and / or the height of the light-concentrating unit 31 is in the range of [0.5 μm, 8 μm]. In this embodiment, the light-concentrating unit 31 can be a lens, and the height of the light-concentrating unit 31 is the distance from the top of the lens to the surface of the dielectric layer 33 in contact with the light-concentrating unit 31. In a preferred example, the height of the light-concentrating unit 31 is in the range of [1 μm, 5 μm].

[0111] Optionally, the optical sensor includes multiple focusing units 31, arranged in an array. The multiple focusing units 31 are arranged in a square periodic pattern to form an array of focusing units 31. It should be understood that since the first incident light, whose angle between the focusing unit 31 and the normal to the effective photosensitive area plane of the first optical sensor chip 2 is less than an angle threshold, is blocked by the blocking unit 32 after passing through the focusing unit 31, any adjacent focusing units 31 can have a certain spacing. The first incident light, whose angle between the focusing unit 31 and the normal to the effective photosensitive area plane of the first optical sensor chip 2 is less than an angle threshold, can directly illuminate the part where no focusing unit 31 is set. For example, between any adjacent focusing units 31 or at a position where no focusing unit 31 is set, it can directly illuminate the effective photosensitive area of ​​the first optical sensor chip 2. This allows the detection of the first incident light whose angle between the focusing unit 31 and the normal to the effective photosensitive area plane of the first optical sensor chip 2 is less than an angle threshold.

[0112] In one possible implementation, the arrangement period of the focusing units 31 ranges from [4μm to 40μm], and the aperture of the focusing units 31 ranges from [4μm to 40μm], wherein the arrangement period is greater than or equal to the aperture of the focusing units 31. The arrangement period of the focusing units 31 refers to the distance between the centers of two adjacent focusing units 31 in the array, and the aperture of the focusing units 31 refers to the effective light-transmitting diameter of the focusing units 31. Since there can be a certain spacing between adjacent focusing units 31, and the spacing between adjacent focusing units 31 is equal to the difference between the arrangement period and the aperture of the focusing units 31, the arrangement period needs to be greater than or equal to the aperture of the focusing units 31.

[0113] In a preferred example, the arrangement period of the focusing unit 31 ranges from [5μm to 25μm], the aperture of the focusing unit 31 ranges from [5μm to 25μm], and the arrangement period is greater than or equal to the aperture of the focusing unit 31.

[0114] In one possible implementation, the distance between the lower surface of the light-concentrating unit 31 and the lower surface of the light-blocking unit 32 corresponding to the light-concentrating unit 31 in the direction perpendicular to the effective photosensitive area plane of the first optical sensing chip 2 is in the range of [5μm, 30μm]. By adjusting the distance between the lower surfaces of the light-concentrating unit 31 and the light-blocking unit 32, the relative position between the focal plane of the light-blocking unit 32 and the light-concentrating unit 31 can be adjusted, thereby adjusting the amount of light blocked by the light-blocking unit 32. Thus, light can be blocked as needed, and the degree of attenuation of small-angle incident light can be adjusted.

[0115] In some embodiments, such as Figures 1-12 and Figures 16-25 As shown, a light-transmitting and conductive shielding layer 16 is disposed on the top layer of the optical sensor, and the light-transmitting and conductive shielding layer 16 is electrically connected to the ground wire of the substrate 1. When the optical sensor is applied below the screen, the screen module above the optical sensor can generate interference signals on the entire upper surface of the optical sensor. Therefore, in this embodiment, the light-transmitting and conductive shielding layer 16 is disposed on the top layer of the optical sensor, covering the entire substrate 1 and the structure on the substrate 1, effectively shielding interference signals, ensuring light transmittance while improving the signal-to-noise ratio, and improving the performance of the optical sensor.

[0116] Optionally, the light-transmitting conductive shielding layer 16 is formed by sputtering, vapor deposition, printing, or spraying onto the light-shielding encapsulation layer 5 and the first light-transmitting layer 4. Preferably, the light-transmitting conductive shielding layer 16 is made of an organic or inorganic material with a light transmittance greater than 90%. More preferably, the material of the light-transmitting conductive shielding layer 16 includes at least one of indium tin oxide, indium zinc oxide, transparent conductive ink (mainly composed of conductive polymer PEDOT), nano-silver, or metal grid, to meet the light transmittance requirements of the effective photosensitive area of ​​the first optical sensing chip 2.

[0117] The light-transmitting conductive shielding layer 16 is electrically connected to the ground wire of the substrate 1 via a connector 17. The connector 17 can be one of a circuit board, a conductive pillar, or a bonding wire 20. The light-shielding encapsulation layer 5 encapsulates the connector 17. The circuit board can be arranged perpendicular to the substrate 1 or at an angle. Both ends of the circuit board are electrically connected to the light-transmitting conductive shielding layer 16 and the substrate 1, respectively. Specifically, the circuit board is electrically connected to the substrate 1 via a silver paste layer, a solder layer, or a DAF film, thereby achieving an electrical connection to the ground wire of the substrate 1. The circuit board can be a printed circuit board, a flexible circuit board, or other circuit boards with conductive lines. The conductive pillar can be arranged perpendicular to the substrate 1 or at an angle. Both ends of the conductive pillar are electrically connected to the light-transmitting conductive shielding layer 16 and the substrate 1, respectively. Specifically, the conductive pillar is electrically connected to the substrate 1 via a silver paste layer, a solder layer, or a DAF film. Preferably, the conductive pillar is a metal pillar, more preferably a copper pillar. Both ends of the bonding wire 20 are electrically connected to the light-transmitting conductive shielding layer 16 and the substrate 1, respectively. The top end of the bonding wire 20 is electrically connected to the light-transmitting conductive shielding layer 16, and the bottom end of the bonding wire 20 is electrically connected to the circuit inside the substrate 1, thereby achieving an electrical connection with the ground wire of the substrate 1. The wire diameter of the bonding wire 20 can be larger than that of the bonding wire 20 connecting the first optical sensor chip 2 and the substrate 1, and the material can be the same as or different from that of the bonding wire 20 connecting the first optical sensor chip 2 and the substrate 1. The connector 17 can be a circuit board, a conductive post, or the bonding wire 20, which is readily available and has a simple packaging process.

[0118] In some embodiments, such as Figure 20 and Figure 21 As shown, the optical sensor also includes a processing chip 18, which is disposed on and electrically connected to the substrate 1. The processing chip 18 is bonded to the substrate 1 using silver paste, DAF film, or water-based adhesive, and is electrically connected to the substrate 1 via bonding wires 20. A first optical sensing chip 2 is electrically connected to the processing chip 18 via bonding wires 20. The processing chip 18 can process the electrical signals transmitted from the first optical sensing chip 2 and transmit the processing results externally. A light-shielding encapsulation layer 5 encapsulates the processing chip 18, sealing and protecting it.

[0119] Optional, such as Figure 20 As shown, the first optical sensor chip 2 and the processing chip 18 are laid flat on the substrate 1, and the first optical sensor chip 23 and the processing chip 18 are bonded and fixed to the substrate 1 by silver paste, DAF film or water adhesive.

[0120] Optional, such as Figure 21 As shown, the first optical sensor chip 2 is disposed on the processing chip 18. The first optical sensor chip 2 is bonded and fixed to the processing chip 18 by silver paste, DAF film or water adhesive, relative to... Figure 20 The embodiment shown reduces the area of ​​substrate 1.

[0121] The processing chip 18 includes at least one of an analog front-end chip, a control chip, or a signal processing chip, and the type of processing chip 18 is set as needed.

[0122] In some embodiments, such as Figures 22-25 As shown, the optical sensor also includes a second optical sensing chip 19, which is disposed on and electrically connected to the substrate 1. A second light-transmitting layer 21 is disposed on the second optical sensing chip 19, and the vertical projection of the second light-transmitting layer 21 covers at least the effective light-sensitive area of ​​the second optical sensing chip 19. A light-shielding encapsulation layer 5 encapsulates the sides of the second optical sensing chip 19 and the second light-transmitting layer 21, so that light can enter the effective light-sensitive area of ​​the second optical sensing chip 19.

[0123] The second light-transmitting layer 21 is a glass plate or a transparent organic plate. The transparent organic plate can be a phenolic resin plate, a PETG (polyethylene terephthalate-1,4-cyclohexanediol) plate, a PMMA (polymethyl methacrylate) plate, a PI (polyimide) plate, or a PET (polyethylene terephthalate) plate. When the second light-transmitting layer 21 is a glass plate, it is bonded and fixed to the second optical sensor chip 19 using a light-transmitting adhesive 22. When the second light-transmitting layer 21 is a transparent organic plate, it can be bonded and fixed to the second optical sensor chip 19 using the light-transmitting adhesive 22, or it can be directly injection molded onto the second optical sensor chip 19 using transparent organic material. The specific bonding method between the second light-transmitting layer 21 and the second optical sensor chip 19 is adjusted according to the hardness of the transparent organic material after it is molded into a plate shape. The light-transmitting adhesive 22 is preferably DAF adhesive or water-based adhesive.

[0124] Preferably, the first optical sensor chip 2 is used to detect visible light, and the second optical sensor chip 19 is used to detect infrared light.

[0125] The optical sensor also includes a processing chip 18, and a second optical sensing chip 19 is disposed on the processing chip 18 or on the substrate 1. The second optical sensing chip 19 is bonded and fixed to the processing chip 18 or the substrate 1 by silver paste, DAF film, or water-based adhesive, and is electrically connected to the processing chip 18 by bonding wires 20. Figure 22 As shown, the first optical sensor chip 2, the second optical sensor chip 19, and the processing chip 18 are laid flat on the substrate 1; as Figure 23 As shown, the first optical sensor chip 2 is disposed on the substrate 1, and the second optical sensor chip 19 is disposed on the processing chip 18; as Figure 24 As shown, the second optical sensor chip 19 is disposed on the substrate 1, and the first optical sensor chip 2 is disposed on the processing chip 18; as Figure 25 As shown, the first optical sensor chip 2 and the second optical sensor chip 19 are both disposed on the processing chip 18. At this time, the area of ​​the optical sensor is minimized.

[0126] Verification has shown that, in an application environment below a screen, under the same incident light intensity and angle, when comparing an optical sensor without a uniform light structure 3 but with the optical sensor of this application embodiment, the effective field of view half-angle above the first optical sensing chip 2 of the optical sensor without the uniform light structure 3 is about 37°, while the optical sensor of this application embodiment can increase the effective field of view half-angle to more than 55°, significantly expanding the effective field of view angle.

[0127] The height of the optical sensor in this embodiment can be controlled to be around 0.6 mm. Compared to the prior art where a bracket is set outside the entire packaging structure to place the light-diffusing structure (setting a bracket significantly increases the overall length, width, and height of the optical sensor), this application effectively reduces the overall size of the optical sensor by embedding the light-diffusing structure inside the packaging structure.

[0128] This application also discloses an electronic device including the optical sensor described in the above embodiments. The electronic device can be an electronic device with a screen, and the optical sensor is disposed below the screen. The electronic device can be a laptop, mobile phone, tablet computer, desktop computer, gaming device, in-vehicle electronic device, wearable smart device, etc. By setting the light-shielding encapsulation layer 5, there is no need to fill the area around the optical sensor with foam for light shielding, which allows for the reduction or elimination of foam during the manufacturing of the electronic device, reducing module size and lowering costs.

[0129] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0130] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0131] In the description of this specification, the references to terms such as "this embodiment," "an embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in a suitable manner in any at least one embodiment or example. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0132] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0133] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and simple improvements made on the substantive content of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An optical sensor, characterized in that, Includes a substrate (1) and a first optical sensor chip (2). 、 The light-uniform structure (3), the first light-transmitting layer (4), and the light-shielding encapsulation layer (5) The first optical sensing chip (2) is disposed on the substrate (1) and electrically connected to the substrate (1). The light-diffusing structure (3) is disposed above the first optical sensing chip (2), and the vertical projection of the light-diffusing structure (3) at least covers the effective photosensitive area of ​​the first optical sensing chip (2). The first light-transmitting layer (4) is disposed above the light-uniforming structure (3), and the vertical projection of the first light-transmitting layer (4) at least covers the effective photosensitive area of ​​the first optical sensing chip (2). The light-shielding encapsulation layer (5) is disposed on the substrate (1) and encapsulates the side of the first optical sensing chip (2), the light-uniforming structure (3), and the first light-transmitting layer (4).

2. The optical sensor according to claim 1, characterized in that, The light-uniform structure (3) has a flat upper surface and multiple first protrusions on the lower surface. A first light-transmitting adhesive layer (6) is provided below the light-uniform structure (3). The refractive index of the first light-transmitting adhesive layer (6) is less than that of the light-uniform structure (3). The light-uniform structure (3) is bonded to the first optical sensor chip (2) through the first light-transmitting adhesive layer (6) or bonded to the first transparent layer (7) provided on the first optical sensor chip (2). The vertical projection of the first transparent layer (7) at least covers the effective photosensitive area of ​​the first optical sensor chip (2).

3. The optical sensor according to claim 2, characterized in that, The difference in refractive index between the uniform light structure (3) and the first light-transmitting adhesive layer (6) is greater than 0.

25.

4. The optical sensor according to claim 2, characterized in that, The difference in refractive index between the uniform light structure (3) and the first light-transmitting adhesive layer (6) is greater than 0.

4.

5. The optical sensor according to claim 1, characterized in that, The light-uniform structure (3) has a flat upper surface and multiple first protrusions on the lower surface. A filler layer (8) is provided below the light-uniform structure (3). The upper surface of the filler layer (8) has multiple second protrusions. The multiple second protrusions fill the gaps between the first protrusions on the lower surface of the light-uniform structure (3). The lower surface of the filler layer (8) is a flat plane. The refractive index of the filler layer (8) is less than that of the light-uniform structure (3). The lower surface of the filler layer (8) is attached to the first optical sensor chip (2) or to the second transparent layer (9) provided on the first optical sensor chip (2). The vertical projection of the second transparent layer (9) covers at least the effective photosensitive area of ​​the first optical sensor chip (2).

6. The optical sensor according to claim 5, characterized in that, The refractive index difference between the uniform light structure (3) and the leveling layer (8) is greater than 0.

25.

7. The optical sensor according to claim 5, characterized in that, The refractive index difference between the uniform light structure (3) and the leveling layer (8) is greater than 0.

4.

8. The optical sensor according to claim 1, characterized in that, The light-diffusing structure (3) has a flat upper surface and multiple first protrusions on the lower surface. A dam (10) is provided around the lower perimeter of the light-diffusing structure (3). The dam (10) is attached to the first optical sensor chip (2) to form an air gap (11) between the light-diffusing structure (3) and the first optical sensor chip (2). Alternatively, the dam (10) is attached to the third transparent layer (12) provided on the first optical sensor chip (2) to form an air gap (11) between the light-diffusing structure (3) and the third transparent layer (12). The vertical projection of the air gap (11) at least covers the effective photosensitive area of ​​the first optical sensor chip (2), and the vertical projection of the third transparent layer (12) at least covers the effective photosensitive area of ​​the first optical sensor chip (2).

9. The optical sensor according to any one of claims 2-8, characterized in that, The optical sensor further includes a first filter layer (13), which is attached to the first light-transmitting layer (4) or disposed between the first light-transmitting layer (4) and the light-uniforming structure (3).

10. The optical sensor according to claim 1, characterized in that, The uniform light structure (3) includes at least one light-concentrating unit (31) and at least one light-blocking unit (32). At least one light-blocking unit (32) is disposed below each light-concentrating unit (31). The at least one light-concentrating unit (31) covers at least the effective photosensitive area of ​​the first optical sensing chip (2). The light-blocking unit (32) corresponding to the light-concentrating unit (31) is located between the light-concentrating unit (31) and the effective photosensitive area of ​​the first optical sensing chip (2). The light-blocking unit (32) is used to block the concentrated light from reaching the effective photosensitive area of ​​the first optical sensing chip (2) after the first incident light in the incident light is concentrated by the light-concentrating unit (31) corresponding to the light-blocking unit (32). The angle between the first incident light and the normal of the plane of the effective photosensitive area of ​​the first optical sensing chip (2) is less than an angle threshold, and the angle threshold is less than 90°.

11. The optical sensor according to claim 10, characterized in that, Below each light-concentrating unit (31) is a light-blocking unit (32); the central axis of the light-concentrating unit (31) is perpendicular to the effective photosensitive area plane of the first optical sensing chip (2), and the light-blocking unit (32) corresponding to the light-concentrating unit (31) intersects with the central axis of the light-concentrating unit (31); the projection of the light-blocking unit (32) corresponding to the light-concentrating unit (31) on the first optical sensing chip (2) is located within the projection of the light-concentrating unit (31) on the first optical sensing chip (2).

12. The optical sensor according to claim 10, characterized in that, The light-diffusing structure (3) further includes a dielectric layer (33), which is disposed between the light-focusing unit (31) and the first optical sensing chip (2), and the at least one light-blocking unit (32) is disposed within the dielectric layer (33).

13. The optical sensor according to claim 12, characterized in that, The light-diffusing structure (3) further includes a light-transmitting encapsulation layer (34), which is disposed on the upper surface of the medium layer (33), and the at least one light-concentrating unit (31) is located within the light-transmitting encapsulation layer (34).

14. The optical sensor according to claim 12 or 13, characterized in that, The optical sensor further includes a second filter layer (14), which is attached to the first light-transmitting layer (4), or disposed between the first light-transmitting layer (4) and the light-uniforming structure (3), or disposed between the medium layer (33) and the first optical sensing chip (2).

15. The optical sensor according to claim 12, characterized in that, The dielectric layer (33) includes a first sub-dielectric layer (331) and a second sub-dielectric layer (332) arranged vertically. The optical sensor also includes a third filter layer (15), which is disposed between the first sub-dielectric layer (331) and the second sub-dielectric layer (332).

16. The optical sensor according to claim 13, characterized in that, The refractive index of the light-concentrating unit (31) is greater than that of the light-transmitting encapsulation layer (34).

17. The optical sensor according to claim 16, characterized in that, The difference in refractive index between the light-concentrating unit (31) and the light-transmitting encapsulation layer (34) is greater than 0.

25.

18. The optical sensor according to claim 16, characterized in that, The difference in refractive index between the light-concentrating unit (31) and the light-transmitting encapsulation layer (34) is greater than 0.

4.

19. The optical sensor according to claim 11, characterized in that, The light-blocking unit (32) includes a circular light-blocking unit. In the direction perpendicular to the first optical sensing chip (2), the central axis of the light-blocking unit (32) corresponding to the light-concentrating unit (31) coincides with the central axis of the light-concentrating unit (31).

20. The optical sensor according to claim 10, characterized in that, The optical sensor includes a plurality of focusing units (31), which are arranged in an array.

21. The optical sensor according to claim 1, characterized in that, The optical sensor has a light-transmitting and conductive shielding layer (16) on its top layer, and the light-transmitting and conductive shielding layer (16) is electrically connected to the ground wire of the substrate (1).

22. The optical sensor according to claim 21, characterized in that, The light-transmitting conductive shielding layer (16) is electrically connected to the ground wire of the substrate (1) through a connector (17). The connector (17) is one of a circuit board, a conductive pillar or a bonding wire. The light-shielding encapsulation layer (5) encapsulates the connector (17).

23. The optical sensor according to claim 21, characterized in that, The material of the light-transmitting conductive shielding layer (16) includes at least one of indium tin oxide, indium zinc oxide, transparent conductive ink, nano silver, or metal grid.

24. The optical sensor according to claim 1, characterized in that, The optical sensor further includes a processing chip (18), which is disposed on the substrate (1) and electrically connected to the substrate (1). The first optical sensing chip (2) is electrically connected to the processing chip (18). The first optical sensing chip (2) and the processing chip (18) are laid flat on the substrate (1), or the first optical sensing chip (2) is disposed on the processing chip (18). The light-shielding encapsulation layer (5) encapsulates the processing chip (18).

25. The optical sensor according to claim 1, characterized in that, The optical sensor further includes a second optical sensing chip (19), which is disposed on the substrate (1) and electrically connected to the substrate (1). A second light-transmitting layer (21) is disposed on the second optical sensing chip (19), and the vertical projection of the second light-transmitting layer (21) covers at least the effective light-sensitive area of ​​the second optical sensing chip (19). The light-shielding encapsulation layer (5) encapsulates the sides of the second optical sensing chip (19) and the second light-transmitting layer (21).

26. The optical sensor according to claim 25, characterized in that, The first optical sensor chip (2) is used to detect visible light, and the second optical sensor chip (19) is used to detect infrared light.

27. The optical sensor according to claim 25 or 26, characterized in that, The optical sensor further includes a processing chip (18), which is disposed on the substrate (1) and electrically connected to the substrate (1). The first optical sensing chip (2) and the second optical sensing chip (19) are electrically connected to the processing chip (18), and the second optical sensing chip (19) is disposed on the processing chip (18) or on the substrate (1).

28. The optical sensor according to claim 1, characterized in that, The light-shielding encapsulation layer (5) is a black epoxy resin molding compound layer or a light-absorbing material layer.

29. An electronic device, characterized in that, Includes the optical sensor described in any one of claims 1-28.

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