Substrate processing device and substrate processing method

Abstract

This substrate processing device comprises: a substrate processing unit for processing a substrate; a light source for irradiating, with a spotlight, a monitored object which is located inside the substrate processing unit or outside the substrate processing unit; an imaging unit for imaging a region which includes the monitored object irradiated with the spotlight to generate image data; and a control unit for monitoring the monitored object on the basis of the image data.

Description

Substrate processing apparatus and substrate processing method

[0001] The present invention relates to a substrate processing apparatus and a substrate processing method.

[0002] 2. Description of the Related Art Substrate processing apparatuses are known that process substrates. Substrate processing apparatuses are suitable for processing semiconductor substrates. Typically, substrate processing apparatuses process substrates using a processing liquid.

[0003] It has been considered to monitor the status inside a substrate processing apparatus by capturing images of the internal state of the apparatus (see Patent Document 1). Patent Document 1 describes monitoring substrate processing based on captured video. The monitoring apparatus of Patent Document 1 aims to reduce the processing load on a computer by increasing the resolution of the captured video when a processing liquid is discharged from a nozzle onto the surface of a substrate compared to the resolution of the captured video when a coating of the processing liquid is formed on the surface of the substrate.

[0004] International Publication No. 2021 / 095612

[0005] However, in Patent Document 1, a light source is not installed in the substrate processing apparatus, and depending on the imaging environment when capturing a video for monitoring, the object to be monitored may not be monitored appropriately.

[0006] An object of the present invention is to provide a substrate processing apparatus and a substrate processing method that are capable of monitoring an object to be monitored with high accuracy in the substrate processing apparatus.

[0007] According to one aspect of the present invention, a substrate processing apparatus includes a substrate processing unit for processing a substrate, a light source for irradiating a spot light onto a monitored object located inside or outside the substrate processing unit, an imaging unit for imaging an area including the monitored object irradiated with the spot light and generating image data, and a control unit for monitoring the monitored object based on the image data.

[0008] In one embodiment, the image capturing section captures an image of an area including the monitored object from a direction in which the light source emits the spot light.

[0009] In one embodiment, the light source irradiates the spot light onto the monitored object from a position on one side of the substrate, and the imaging unit images the area including the monitored object irradiated with the spot light from a position on the other side of the substrate.

[0010] In one embodiment, the light source includes a first light source that emits a first spot light toward a first monitored object as the monitored object, and a second light source that emits a second spot light toward a second monitored object as the monitored object.

[0011] In one embodiment, the first light source emits the first spot light at a timing different from the timing at which the second light source emits the second spot light.

[0012] In one embodiment, the second light source emits light of a different wavelength from the first spot light as the second spot light during a period overlapping with a period during which the first light source emits the first spot light, and the imaging unit selectively images an area including the first monitored object illuminated with the first spot light from an area illuminated with the first spot light and the second spot light to generate the image data, and selectively images an area including the second monitored object illuminated with the second spot light from an area illuminated with the first spot light and the second spot light to generate the image data.

[0013] In one embodiment, the substrate processing apparatus further includes a first filter that selectively transmits the first spot light, and a second filter that selectively transmits the second spot light.

[0014] In one embodiment, the substrate processing unit includes a chamber, a substrate holding part that holds the substrate within the chamber, and a processing liquid supply part that supplies processing liquid to the substrate held by the substrate holding part, the light source irradiates the spot light onto the monitored object within the chamber, and the imaging part images an area including the monitored object within the chamber illuminated by the light source.

[0015] In one embodiment, the substrate processing apparatus further includes a transport robot that transports the substrate to the substrate processing unit, the light source irradiates a portion of the transport robot with the spot light, and the imaging unit images an area including the portion of the transport robot irradiated with the spot light.

[0016] According to another aspect of the present invention, a substrate processing method includes a step of processing a substrate in a substrate processing unit, a step of irradiating a monitored object located inside or outside the substrate processing unit with a spot light, a step of capturing an image of an area including the monitored object irradiated with the spot light to generate image data, and a step of monitoring the monitored object based on the image data.

[0017] According to at least one aspect of the present invention, an object to be monitored can be monitored with high accuracy in a substrate processing apparatus.

[0018] 1 is a schematic diagram of a substrate processing apparatus according to the present embodiment; FIG. 2 is a schematic diagram of a substrate processing unit in the substrate processing apparatus according to the present embodiment; FIG. 3 is a block diagram of the substrate processing apparatus according to the present embodiment; FIG. 4 is a schematic diagram of the inside of a substrate processing unit in the substrate processing apparatus according to the present embodiment; FIG. 5 is a schematic diagram showing image data generated by imaging an area including a monitored object irradiated with a spot light in a substrate processing unit in the substrate processing apparatus according to the present embodiment; FIG. 6 is a flow diagram of a substrate processing method according to the present embodiment; FIG. 7 is a flow diagram of a substrate processing method according to the present embodiment; FIG. 8 is a schematic diagram of a substrate processing unit in the substrate processing apparatus according to the present embodiment; FIG. 9 is a schematic diagram of the inside of a substrate processing unit in the substrate processing apparatus according to the present embodiment; FIG. 10 is a schematic diagram showing image data generated by imaging an area including a monitored object irradiated with a spot light in a substrate processing unit in the substrate processing apparatus according to the present embodiment; FIG. 11 is a schematic diagram of a substrate processing unit in the substrate processing apparatus according to the present embodiment; FIG. 12 is a schematic diagram of the inside of a substrate processing unit in the substrate processing apparatus according to the present embodiment; 1 is a schematic view showing image data generated by imaging an area including a monitored object irradiated with a second spot light in a substrate processing unit in the substrate processing apparatus of the present embodiment. FIG. 2 is a schematic view of a substrate processing unit in the substrate processing apparatus of the present embodiment. FIG. 3 is a schematic view of the inside of a substrate processing unit in the substrate processing apparatus of the present embodiment. FIG. 4 is a schematic view showing image data generated by imaging an area including a monitored object irradiated with a first spot light in a substrate processing unit in the substrate processing apparatus of the present embodiment. FIG. 5 is a schematic view showing image data generated by imaging an area including a monitored object irradiated with a second spot light in a substrate processing unit in the substrate processing apparatus of the present embodiment. FIG. 6 is a schematic view of a substrate processing unit in the substrate processing apparatus of the present embodiment. FIG. 7 is a schematic view of a substrate processing apparatus of the present embodiment. FIG. 8 is a schematic side view of a load port and an indexer unit in the substrate processing apparatus of the present embodiment. FIG. 9 is a schematic side view of a hand of an indexer robot in the substrate processing apparatus of the present embodiment.2 is a schematic side view of a hand of an indexer robot in the substrate processing apparatus of the present embodiment. FIG.

[0019] Hereinafter, embodiments of a substrate processing apparatus and a substrate processing method according to the present invention will be described with reference to the drawings. In the drawings, identical or corresponding parts are designated by the same reference numerals, and description thereof will not be repeated. In this specification, to facilitate understanding of the invention, mutually orthogonal X-, Y-, and Z-axes may be described. Typically, the X- and Y-axes are parallel to the horizontal direction, and the Z-axis is parallel to the vertical direction.

[0020] First, a substrate processing apparatus 100 according to this embodiment will be described with reference to Fig. 1. Fig. 1 is a schematic plan view of the substrate processing apparatus 100.

[0021] 1, the substrate processing apparatus 100 processes a substrate W. The substrate processing apparatus 100 processes the substrate W by performing at least one of etching, surface treatment, property imparting, treatment film formation, removal of at least a portion of a film, and cleaning on the substrate W.

[0022] The substrate W is used as a semiconductor substrate. The substrate W includes a semiconductor wafer. For example, the substrate W has a substantially circular disk shape. The substrate processing apparatus 100 processes the substrates W one by one.

[0023] The substrate processing apparatus 100 includes a plurality of substrate processing units 110, each of which processes a substrate W. Each substrate processing unit 110 processes a substrate W one by one.

[0024] Here, the substrate processing apparatus 100 includes, in addition to a plurality of substrate processing units 110, a plurality of load ports LP, a fluid cabinet 10A, a fluid box 10B, an indexer unit 20, an indexer robot IR arranged in the indexer unit 20, an installation table 30, a center robot CR, and a control device 101. The control device 101 controls the load ports LP, the indexer robot IR, the center robot CR, and the substrate processing units 110.

[0025] A plurality of stacked substrates W are placed on each of the load ports LP.

[0026] An indexer unit 20 is disposed adjacent to the load port LP. An indexer robot IR is disposed within the indexer unit 20. The indexer robot IR transfers substrates W between the load port LP and the placement table 30. The indexer robot IR pulls out substrates W from the load port LP and places them on the placement table 30. The indexer robot IR also transports substrates W placed on the placement table 30 to the load port LP.

[0027] The placement table 30 is located between the indexer robot IR and the center robot CR. The placement table 30 temporarily places a substrate W between the indexer robot IR and the center robot CR.

[0028] The center robot CR transfers the substrate W between the setting table 30 and the substrate processing unit 110. The center robot CR transports the substrate W placed on the setting table 30 to the substrate processing unit 110. The center robot CR also transports the substrate W processed in the substrate processing unit 110 to the setting table 30.

[0029] The fluid cabinet 10A contains a processing liquid. The fluid cabinet 10A may contain a gas. The processing liquid and / or gas contained in the fluid cabinet 10A is supplied to the substrate processing unit 110.

[0030] Each of the substrate processing units 110 discharges a processing liquid onto a substrate W to process the substrate W. The substrate processing units 110 form a plurality of towers TW (four towers TW in FIG. 1 ) arranged to surround the center robot CR in a plan view. Each tower TW includes vertically stacked substrate processing units 110 (three substrate processing units 110 in FIG. 1 ). Each fluid box 10B corresponds to a plurality of towers TW. The processing liquid in the fluid cabinet 10A is supplied to all of the substrate processing units 110 included in the tower TW corresponding to the fluid box 10B via one of the fluid boxes 10B. Furthermore, the gas in the fluid cabinet 10A is supplied to all of the substrate processing units 110 included in the tower TW corresponding to the fluid box 10B via one of the fluid boxes 10B.

[0031] The control device 101 controls various operations of the substrate processing apparatus 100. The control device 101 includes a control unit 102 and a storage unit 104. The control unit 102 has a processor. The control unit 102 has, for example, a central processing unit (CPU). Alternatively, the control unit 102 may have a general-purpose computer.

[0032] The storage unit 104 includes a main storage device and an auxiliary storage device. The main storage device is, for example, a semiconductor memory. The auxiliary storage device is, for example, a semiconductor memory and / or a hard disk drive. The storage unit 104 may also include removable media. The control unit 102 executes computer programs stored in the storage unit 104 to perform substrate processing operations.

[0033] The storage unit 104 stores data. The data includes recipe data. The recipe data includes information indicating a plurality of recipes. Each of the plurality of recipes defines the processing content and processing procedure for the substrate W.

[0034] The storage unit 104 may also store reference image data obtained when an area including a monitored object was previously captured. Alternatively, the storage unit 104 may store the brightness value of the reference image data. Alternatively, the storage unit 104 may store data indicating the position or movement of the monitored object extracted from the reference image data.

[0035] Next, the substrate processing unit 110 in the substrate processing apparatus 100 of this embodiment will be described with reference to Fig. 2. Fig. 2 is a schematic diagram of the substrate processing unit 110 in the substrate processing apparatus 100.

[0036] The substrate processing unit 110 includes a chamber 112, a substrate holding part 120, a processing liquid supply part 130, a light source 140, and an imaging part 150. The chamber 112 accommodates at least a part of the substrate holding part 120 and the processing liquid supply part 130.

[0037] The chamber 112 is substantially box-shaped and has an internal space. The chamber 112 accommodates substrates W. Here, the substrate processing unit 110 is a single-wafer type that processes substrates W one by one, and the chamber 112 accommodates substrates W one by one. The substrates W are accommodated in the chamber 112 and are processed in the chamber 112.

[0038] The substrate holding unit 120 holds the substrate W. The substrate holding unit 120 holds the substrate W horizontally so that the top surface (front surface) Wa of the substrate W faces upward and the back surface (bottom surface) Wb of the substrate W faces vertically downward. The substrate holding unit 120 also rotates the substrate W while holding it. The top surface Wa of the substrate W may be flattened. Alternatively, a device surface may be provided on the top surface Wa of the substrate W, or a pillar-shaped stacked body with a recess may be provided. The substrate holding unit 120 rotates together with the substrate W while holding it.

[0039] For example, the substrate holding unit 120 may be a clamping type that clamps the edge of the substrate W. Alternatively, the substrate holding unit 120 may have any mechanism that holds the substrate W from the back surface Wb. For example, the substrate holding unit 120 may be a vacuum type. In this case, the substrate holding unit 120 holds the substrate W horizontally by sucking the central portion of the back surface Wb of the substrate W, which is the non-device formation surface, onto its upper surface. Alternatively, the substrate holding unit 120 may be a combination of a clamping type that brings multiple chuck pins into contact with the peripheral edge surface of the substrate W, and a vacuum type.

[0040] For example, the substrate holder 120 includes a spin base 121, a chuck member 122, a shaft 123, an electric motor 124, and a housing 125. The chuck member 122 is provided on the spin base 121. The chuck member 122 chucks the substrate W. Typically, the spin base 121 is provided with a plurality of chuck members 122.

[0041] The shaft 123 is a hollow shaft. The shaft 123 extends vertically along the rotation axis Ax. The spin base 121 is coupled to the upper end of the shaft 123. The substrate W is placed above the spin base 121.

[0042] The spin base 121 is disk-shaped. The chuck member 122 supports the substrate W horizontally. The shaft 123 extends downward from the center of the spin base 121. The electric motor 124 applies rotational force to the shaft 123. The electric motor 124 rotates the shaft 123 in a rotational direction, thereby rotating the substrate W and the spin base 121 around the rotation axis Ax. The housing 125 surrounds the shaft 123 and the electric motor 124.

[0043] The processing liquid supply unit 130 supplies a processing liquid to the substrate W. Typically, the processing liquid supply unit 130 supplies the processing liquid to the upper surface Wa of the substrate W held by the substrate holder 120. Note that the processing liquid supply unit 130 may supply a plurality of types of processing liquid to the substrate W.

[0044] The processing liquid may be an etching liquid for etching the substrate W. Examples of the etching liquid include hydrofluoric nitric acid (a mixture of hydrofluoric acid (HF) and nitric acid (HNO)), hydrofluoric acid, buffered hydrofluoric acid (BHF), ammonium fluoride, HFEG (a mixture of hydrofluoric acid and ethylene glycol), and phosphoric acid (HPO). The type of etching liquid is not particularly limited, and may be, for example, acidic or alkaline.

[0045] Alternatively, the treatment liquid may be a rinse liquid, such as deionized water (DIW), carbonated water, electrolytic ionized water, ozone water, ammonia water, diluted hydrochloric acid water (e.g., about 10 ppm to 100 ppm), and reduced water (hydrogen water).

[0046] Alternatively, the treatment liquid may be an organic solvent. Typically, the volatility of the organic solvent is higher than that of the rinse liquid. Examples of organic solvents include isopropyl alcohol (IPA), methanol, ethanol, acetone, hydrofluoroether (HFE), propylene glycol monoethyl ether (PGEE), and propylene glycol monomethyl ether acetate (PGMEA).

[0047] The processing liquid supply unit 130 includes a pipe 132, a valve 134, a nozzle 136, and a moving mechanism 138. The processing liquid is supplied to the pipe 132 from a supply source. The valve 134 opens and closes a flow path in the pipe 132. The nozzle 136 is connected to the pipe 132. The nozzle 136 ejects the processing liquid onto the upper surface Wa of the substrate W. The nozzle 136 is preferably configured to be movable relative to the substrate W.

[0048] The pipe 132 and the nozzle 136 may be made of resin. In this case, the light emitted from the light source 140 passes through the pipe 132 and the nozzle 136, while the light emitted from the light source 140 is refracted by the liquid in the pipe 132 and / or the nozzle 136.

[0049] The movement mechanism 138 moves the nozzle 136 in the horizontal and vertical directions. Specifically, the movement mechanism 138 moves the nozzle 136 in the circumferential direction around a rotation axis extending in the vertical direction. The movement mechanism 138 also raises and lowers the nozzle 136 in the vertical direction.

[0050] The movement mechanism 138 has an arm 138a, a shaft 138b, and a drive unit 138c. The arm 138a extends horizontally. The nozzle 136 is disposed at the tip of the arm 138a. The nozzle 136 is disposed at the tip of the arm 138a in a position that allows the nozzle 136 to supply a processing liquid toward the upper surface Wa of the substrate W held by the chuck member 122. More specifically, the nozzle 136 is coupled to the tip of the arm 138a and protrudes downward from the arm 138a. The base end of the arm 138a is coupled to the shaft 138b. The shaft 138b extends vertically.

[0051] The drive unit 138c has a rotation drive mechanism and an elevation drive mechanism. The rotation drive mechanism of the drive unit 138c rotates the shaft portion 138b around the rotation axis, causing the arm 138a to pivot along a horizontal plane around the shaft portion 138b. As a result, the nozzle 136 moves along the horizontal plane. More specifically, the nozzle 136 moves in the circumferential direction around the shaft portion 138b. The rotation drive mechanism of the drive unit 138c includes, for example, a motor that can rotate forward and backward.

[0052] The lifting drive mechanism of the drive unit 138c raises and lowers the shaft 138b in the vertical direction. The lifting drive mechanism of the drive unit 138c raises and lowers the shaft 138b, thereby raising and lowering the nozzle 136 in the vertical direction. The lifting drive mechanism of the drive unit 138c has a drive source such as a motor and a lifting mechanism, and the drive source drives the lifting mechanism to raise or lower the shaft 138b. The lifting mechanism includes, for example, a rack and pinion mechanism or a ball screw.

[0053] The light source 140 emits a spot light. Typically, the light source 140 emits relatively parallel light toward the monitored object. The light emitted from the light source 140 partially illuminates at least a portion of the monitored object. In this example, the light source 140 emits a spot light toward the monitored object in the chamber 112, and the monitored object is illuminated by the spot light.

[0054] The light source 140 may emit light of a particular wavelength. For example, the light source 140 may emit visible light. In one example, the light source 140 may emit red, green, or blue light.

[0055] Alternatively, light source 140 may emit near-infrared light. For example, light source 140 emits near-infrared light having a wavelength in the range of at least 800 nm to 2.5 μm. Typically, light source 140 emits near-infrared light having a wavelength in the range of at least 800 nm to 1.5 μm.

[0056] Alternatively, the light source 140 may switch between emitting light of specific wavelengths. The number of light sources 140 may be two or more. In this case, the light source 140 may irradiate spot lights onto different monitored objects. Furthermore, the light source 140 may irradiate spot lights onto monitored objects in the chamber 112 from different positions.

[0057] Alternatively, the light source 140 may emit light of different color temperatures. For example, the light source 140 may switch between emitting light of warm white (e.g., 2600 to 3200 K), daylight white (4600 to 5500 K), and daylight white (5700 to 7100 K).

[0058] The light source 140 may be capable of changing the emission direction of the spot light. For example, the light source 140 may change the emission direction of the spot light in response to the movement of the monitored object and / or a change in the monitored object.

[0059] The imaging unit 150 has a plurality of pixels and is sensitive to at least the light emitted from the light source 140. The imaging unit 150 captures an image of an area including a monitored object and generates image data.

[0060] The imaging unit 150 captures an image of the area including the monitored object in the chamber 112 by receiving a component reflected and / or a component scattered by the monitored object out of the spot light emitted from the light source 140 toward the monitored object, thereby generating image data. Here, the imaging unit 150 receives a component reflected by the monitored object out of the spot light emitted from the light source 140.

[0061] The imaging unit 150 may include a charge coupled device (CCD), or alternatively, may include a complementary metal oxide semiconductor (CMOS) image sensor.

[0062] The frame rate of the image capturing unit 150 may be 30 fps, 60 fps, or 120 fps.

[0063] The image capturing unit 150 receives visible light. The image capturing unit 150 may receive light of a specific wavelength. For example, the image capturing unit 150 may receive light of a red, green, or blue wavelength.

[0064] Alternatively, the image capturing unit 150 may receive near-infrared light. For example, the image capturing unit 150 receives near-infrared light having a wavelength that is at least within the range of 800 nm to 2.5 μm. The image capturing unit 150 may include a SWIR (Short Wavelength Infra-Red) image sensor. In this case, the image capturing unit 150 detects near-infrared light having a wavelength that is at least within the range of 800 nm to 2.5 μm.

[0065] The imaging unit 150 may switch between receiving near-infrared light and visible light.

[0066] The imaging unit 150 generates image data by capturing an image of an area including the monitored object illuminated by the spotlight within the chamber 112. The image data represents an image of the area including the monitored object within the chamber 112. The image data allows the monitored object within the chamber 112 to be monitored.

[0067] The substrate processing apparatus 100 further includes a cup 180. The cup 180 collects the processing liquid splashed from the substrate W. The cup 180 moves up and down. For example, the cup 180 moves up vertically to the side of the substrate W during the period in which the processing liquid supply unit 130 supplies the processing liquid to the substrate W. In this case, the cup 180 collects the processing liquid splashed from the substrate W due to the rotation of the substrate W. Furthermore, when the period in which the processing liquid supply unit 130 supplies the processing liquid to the substrate W ends, the cup 180 moves down vertically from the side of the substrate W.

[0068] As described above, the control device 101 includes the control unit 102 and the memory unit 104. The control unit 102 controls the substrate holder 120, the processing liquid supply unit 130, the light source 140, the imaging unit 150, and / or the cup 180. In one example, the control unit 102 controls the electric motor 124, the valve 134, the moving mechanism 138, the light source 140, the imaging unit 150, and / or the cup 180.

[0069] According to the substrate processing apparatus 100 of this embodiment, the imaging unit 150 captures an image of at least a portion of the monitoring object in the chamber 112 irradiated with the spot light emitted from the light source 140. Therefore, the image data generated by the imaging unit 150 can be appropriately processed to generate image data that includes the monitoring object, thereby enabling the monitoring object to be monitored with high accuracy.

[0070] Here, the object to be monitored is housed within the chamber 112. The object to be monitored is movable within the chamber 112. Typically, the object to be monitored relates to a property of the processed substrate W or to the movement of the substrate W.

[0071] For example, the object to be monitored is the nozzle 136. The nozzle 136 moves to a predetermined position above the substrate W and discharges the processing liquid onto the substrate W. The object to be monitored may be the position of the nozzle 136 that discharges the processing liquid. Alternatively, the object to be monitored may be the processing liquid discharged from the nozzle 136 onto the substrate W.

[0072] Alternatively, the object to be monitored may be the cup 180. While the processing liquid is being supplied to the substrate W from the nozzle 136 and / or while the substrate holder 120 is holding and rotating the substrate W, the cup 180 rises to a position that covers the side of the substrate W. On the other hand, when the substrate W is being loaded into and / or unloaded from the chamber 112, the cup 180 lowers below the side of the substrate W. In one example, the object to be monitored may be the height of the cup 180 when the substrate W is being loaded and / or unloaded.

[0073] 2, the light source 140 and the imaging unit 150 are located vertically higher than the monitored object. Therefore, the light source 140 emits spot light toward the monitored object located below the light source 140. The imaging unit 150 captures an image of an area including the monitored object located below the imaging unit 150.

[0074] 2, the light source 140 and the image capturing unit 150 are disposed outside the chamber 112. By disposing the light source 140 and the image capturing unit 150 outside the chamber 112, it is possible to prevent the processing liquid from adhering to the light source 140 and / or the image capturing unit 150.

[0075] A housing section 113 for housing the light source 140 and the image capturing section 150 is provided on a side wall 112s of the chamber 112. The housing section 113 is attached to the side wall 112s of the chamber 112. The housing section 113 has a box shape. The light source 140 and the image capturing section 150 are housed inside the housing section 113. The atmosphere inside the housing section 113 is isolated from the atmosphere of the chamber 112.

[0076] The chamber 112 preferably has a window 112w. The window 112w is located between the light source 140 and the imaging unit 150 and the monitored object inside the chamber 112. For example, the window 112w is plate-shaped. The window 112w transmits at least light. The window 112w is located above the side wall 112s of the chamber 112.

[0077] A window 112w is provided in the side wall 112s of the chamber 112 in front of the light source 140 and the imaging unit 150. For example, the window 112w is transparent. In one example, the window 112w is made of a transparent material such as quartz glass.

[0078] The light source 140 emits a spot light onto the monitored object through the window 112w, and the image capturing unit 150 captures an image of the area including the monitored object through the window 112w.

[0079] Specifically, the light source 140 emits a spot light through the window 112w onto the monitored object inside the chamber 112. The window 112w has high translucency for the wavelength of the light emitted by the light source 140. The transmittance of the window 112w in the range of the emitted wavelength of the light source 140 is, for example, 60% or more, and preferably 80% or more.

[0080] The imaging unit 150 captures an image of an area including a monitored object inside the chamber 112 through the window 112w. The window 112w has high translucency for the wavelength of light detected by the imaging unit 150. The transmittance of the window 112w in the detection wavelength range of the imaging unit 150 is, for example, 60% or more, and preferably 80% or more.

[0081] The accommodation section 113, together with the side wall 112s, forms a space for accommodating the light source 140 and the imaging section 150. The window section 112w can protect the light source 140 and the imaging section 150 from the processing liquid in the chamber 112 and volatile components of the processing liquid.

[0082] The substrate processing apparatus 100 of this embodiment is suitable for use in the manufacture of semiconductor devices having semiconductors. Typically, in semiconductor devices, conductive layers and insulating layers are stacked on a substrate. The substrate processing apparatus 100 is suitable for use in cleaning and / or processing (e.g., etching, changing characteristics, etc.) the conductive layers and / or insulating layers during the manufacture of semiconductor devices.

[0083] Next, a substrate processing apparatus 100 according to this embodiment will be described with reference to Figures 1 to 3. Figure 3 is a block diagram of the substrate processing apparatus 100.

[0084] 3 , the control device 101 controls various operations of the substrate processing apparatus 100. The control device 101 controls the indexer robot IR, the center robot CR, the substrate holding unit 120, the processing liquid supply unit 130, the light source 140, the image capturing unit 150, and the cup 180. Specifically, the control device 101 controls the indexer robot IR, the center robot CR, the substrate holding unit 120, the processing liquid supply unit 130, the light source 140, the image capturing unit 150, and the cup 180 by transmitting control signals to the indexer robot IR, the center robot CR, the substrate holding unit 120, the processing liquid supply unit 130, the light source 140, the image capturing unit 150, and the cup 180. Note that in this specification, the indexer robot IR and the center robot CR may be collectively referred to as a robot or a transport robot.

[0085] The memory unit 104 also stores computer programs and data. The data includes recipe data. The recipe data includes information indicating a plurality of recipes. Each of the plurality of recipes specifies the processing content, processing procedure, and substrate processing conditions for the substrate W. The control unit 102 executes the computer programs stored in the memory unit 104 to perform substrate processing operations.

[0086] The control unit 102 controls the indexer robot IR to transfer the substrate W by the indexer robot IR.

[0087] The control unit 102 controls the center robot CR to transfer the substrate W. For example, the center robot CR receives an unprocessed substrate W and transports the substrate W into one of the plurality of chambers 112. The center robot CR also receives a processed substrate W from the chamber 112 and transports the substrate W out of the chamber 112.

[0088] The control unit 102 controls the substrate holding unit 120 to start rotation of the substrate W, change the rotation speed, and stop rotation of the substrate W. For example, the control unit 102 can control the substrate holding unit 120 to change the rotation speed of the substrate holding unit 120. Specifically, the control unit 102 can change the rotation speed of the substrate W by changing the rotation speed of the electric motor 124 of the substrate holding unit 120.

[0089] The control unit 102 controls the valve 134 of the processing liquid supply unit 130 to switch the state of the valve 134 between an open state and a closed state. Specifically, the control unit 102 controls the valve 134 of the processing liquid supply unit 130 to open the valve 134, thereby allowing the processing liquid flowing through the pipe 132 toward the nozzle 136 to pass. Furthermore, the control unit 102 controls the valve 134 of the processing liquid supply unit 130 to close the valve 134, thereby stopping the supply of the processing liquid flowing through the pipe 132 toward the nozzle 136.

[0090] The control unit 102 controls the movement mechanism 138 of the processing liquid supply unit 130 to move the nozzle 136. Specifically, the control unit 102 controls the movement mechanism 138 of the processing liquid supply unit 130 to move the nozzle 136 above the upper surface Wa of the substrate W. The control unit 102 also controls the movement mechanism 138 of the processing liquid supply unit 130 to move the nozzle 136 to a retracted position away from above the upper surface Wa of the substrate W.

[0091] The control unit 102 controls the light source 140 to emit a spot light toward the monitored object. For example, the control unit 102 controls the light source 140 to irradiate at least a partial area of ​​the monitored object inside the chamber 112 with the spot light. Note that the control unit 102 may also control the light source 140 to irradiate at least a partial area of ​​the monitored object outside the substrate processing unit 110 with the spot light.

[0092] The control unit 102 controls the imaging unit 150 to capture an image of an area including the monitored object and generate image data. The control unit 102 controls the imaging unit 150 to capture an image of at least a partial area of ​​the monitored object in the chamber 112 and generate image data. The control unit 102 also controls the imaging unit 150 to capture an image of at least a partial area of ​​the monitored object outside the substrate processing unit 110 and generate image data.

[0093] In this way, the control unit 102 controls the light source 140 and the imaging unit 150 to irradiate a spot light onto a monitored object located inside or outside the substrate processing unit 110, capture an image, and generate image data. In detail, the control unit 102 controls the light source 140 and the imaging unit 150 so that the light source 140 emits light toward the monitored object, and the imaging unit 150 receives the light reflected by the monitored object and measures a luminance value. The control unit 102 also controls the light source 140 and the imaging unit 150 so that the light source 140 emits light toward the monitored object, and the imaging unit 150 receives the light scattered by the monitored object and measures a luminance value.

[0094] The control unit 102 processes the image data. For example, the control unit 102 identifies the outer edge of the monitored object in the image data based on the brightness values ​​in the image data. In the image data, the outer edge of the monitored object is identified based on the difference between the brightness values ​​of the monitored object and the brightness values ​​of the other parts of the monitored object. In one example, the control unit 102 identifies the outer edge of the monitored object in the image data by referring to the brightness values ​​of the reference image data stored in the storage unit 104. Alternatively, the control unit 102 identifies the outer edge of the monitored object in the image data based on the image data generated by the imaging unit 150 and the reference image data.

[0095] The control unit 102 may also identify the monitoring target in the image data based on the luminance values ​​in the image data. The control unit 102 identifies the monitoring target in the image data based on the luminance values ​​in the image data and the luminance values ​​of the reference image data stored in the storage unit 104. The control unit 102 then monitors the monitoring target in the image data based on the reference image data. For example, the control unit 102 compares the position of the monitoring target in the image data with the position of the monitoring target shown in the reference image data, and if the positions differ significantly, determines that the monitoring target is abnormal. The control unit 102 also compares the behavior of the monitoring target in the image data with the behavior of the monitoring target shown in the reference image data, and if the behavior differs significantly, determines that the monitoring target is abnormal.

[0096] In the image data, the part of the monitored object illuminated by the spotlight exhibits a relatively high brightness value, while the background of the monitored object and other components located around the monitored object exhibit relatively low brightness values.

[0097] For example, the imaging section 150 images an area including the nozzle 136 of the processing liquid supply section 130. Alternatively, the imaging section 150 images an area in which the processing liquid supplied from the processing liquid supply section 130 to the substrate W and / or the processing liquid in the processing liquid supply section 130 is present.

[0098] The control unit 102 may control the light source 140 and the image capturing unit 150 to move the light source 140 and the image capturing unit 150 relative to the substrate W.

[0099] The control unit 102 may control the cup 180 to move the cup 180 relative to the substrate W. Specifically, the control unit 102 raises the cup 180 vertically upward to the side of the substrate W during the period in which the processing liquid supply unit 130 supplies the processing liquid to the substrate W. Furthermore, when the period in which the processing liquid supply unit 130 supplies the processing liquid to the substrate W ends, the control unit 102 lowers the cup 180 vertically downward from the side of the substrate W.

[0100] The control unit 102 monitors the object to be monitored based on the image data, thereby determining whether or not an abnormality has occurred in the object to be monitored.

[0101] For example, the monitored object is the nozzle 136, the processing liquid discharged from the nozzle 136, the cup 180, and / or the substrate W. In this case, the control unit 102 monitors the monitored object based on image data generated by capturing an image of an area including the nozzle 136, the processing liquid discharged from the nozzle 136, the cup 180, and / or the substrate W.

[0102] The control unit 102 can monitor the position of the nozzle 136, the type of processing liquid ejected from the nozzle 136, the ejection time of the processing liquid ejected from the nozzle 136, splashes of the processing liquid ejected from the nozzle 136 onto the substrate W, processing liquid unintentionally ejected from the nozzle 136 onto the substrate W (dripping), processing liquid that continues to be unintentionally ejected from the nozzle 136 due to a malfunction of the valve 134 (outflow), collisions between the center robot CR and the cup 180, etc.

[0103] If the monitoring result indicates that the monitored object is abnormal, the processing of the substrate W may be interrupted. Alternatively, image data generated when monitoring the monitored object may be selectively saved, if the monitored object is determined to be abnormal. Alternatively, the processing status of the substrate W involved in the monitored object determined to be abnormal may be stored in the storage unit 104, if the image data generated when monitoring the monitored object is abnormal. For example, the processing status of the substrate W may be used to determine whether the substrate W is abnormal.

[0104] The substrate processing apparatus 100 of this embodiment is preferably used for forming semiconductor elements. For example, the substrate processing apparatus 100 is preferably used for processing a substrate W used as a semiconductor element having a stacked structure. The semiconductor element is a so-called 3D structure memory (storage device). As an example, the substrate W is preferably used as a NAND flash memory.

[0105] The substrate processing apparatus 100 of this embodiment will be described below with reference to Figures 1 to 4B. Figure 4A is a schematic diagram of the inside of a substrate processing unit 110 in the substrate processing apparatus 100 of this embodiment, and Figure 4B is a schematic diagram showing image data generated by capturing an image of an area including a monitoring target irradiated with a spot light in the substrate processing unit 110 in the substrate processing apparatus 100 of this embodiment.

[0106] 4A, a substrate W is accommodated in the chamber 112 of the substrate processing unit 110. The substrate W is held by the substrate holder 120 (FIG. 2), and the substrate W is surrounded by a cup 180. The nozzle 136 is positioned above the substrate W surrounded by the cup 180, and the nozzle 136 ejects a processing liquid onto the substrate W. When the light source 140 is turned off, the inside of the chamber 112 appears relatively dark.

[0107] 4B , when light source 140 is turned on, the spot light emitted from light source 140 illuminates nozzle 136. In this case, nozzle 136 is the monitored object, and nozzle 136 is illuminated by the spot light. The spot light emitted from light source 140 illuminates the tip of nozzle 136, while the spot light does not illuminate areas other than nozzle 136 within chamber 112. For this reason, only the tip of nozzle 136 appears bright.

[0108] In the imaging range captured by the imaging unit 150, the area of ​​the monitored object that appears bright due to the spot light may be 20% or less. In the imaging range, the area of ​​the monitored object may be 10% or less, or may be 5% or less.

[0109] Here, the imaging unit 150 images the monitored object from the same direction as the light source 140. Therefore, part of the spot light emitted from the light source 140 that is reflected by the monitored object reaches the imaging unit 150. The imaging unit 150 images an area including the nozzle 136 that is irradiated with the spot light emitted from the light source 140. In detail, the imaging unit 150 images an area including the nozzle 136 and the area other than the nozzle 136 in the chamber 112. In this case, in the image captured by the imaging unit 150, the brightness value of the tip of the nozzle 136 is high, while the brightness value of the area other than the nozzle 136 in the chamber 112 is low.

[0110] When the spot light emitted from the light source 140 irradiates the nozzle 136, the spot light is strongly reflected by the nozzle 136, and therefore the nozzle 136 exhibits a high brightness value in the image data. On the other hand, in the image data, the spot light emitted from the light source 140 in the chamber 112 does not irradiate the area around the nozzle 136, and therefore the area around the nozzle 136 exhibits a low brightness value.

[0111] In this way, in the image data, the nozzle 136 irradiated with the spotlight exhibits a high brightness value, while the area other than the nozzle 136 in the chamber 112 does not exhibit a high brightness value. Therefore, the control unit 102 can identify the outer edge of the nozzle 136 in the image data with high accuracy based on the image data. This allows the control unit 102 to monitor the nozzle 136 with high accuracy.

[0112] In FIG. 4B, the nozzle 136 is the monitored object, and the spot light is irradiated onto the nozzle 136 of the monitored object, but the monitored object may be something other than the nozzle 136.

[0113] In this case, too, when the spot light emitted from the light source 140 is irradiated onto the monitored object, the spot light is strongly reflected by the monitored object. Therefore, in the image data, the monitored object exhibits a high luminance value. On the other hand, in the image data, areas in the chamber 112 where the spot light emitted from the light source 140 is not irradiated onto the monitored object exhibit a low luminance value.

[0114] In the image data, the monitored object illuminated with the spotlight exhibits a high brightness value, while areas other than the monitored object in the chamber 112 do not exhibit a high brightness value. Therefore, the control unit 102 can identify the outer edge of the monitored object in the image data with high accuracy based on the image data. This allows the control unit 102 to monitor the monitored object with high accuracy.

[0115] If the light source uniformly illuminates the entire imaging range of the imaging unit, even if the imaging range includes a monitored object, not only the monitored object but also areas other than the monitored object will be bright and show high brightness. In this case, the control unit may not be able to accurately identify the outer edge of the monitored object, and may not be able to monitor the monitored object with high accuracy.

[0116] In particular, if the substrate W has a mirror surface, when light reflected by a substrate W other than the monitored object is captured by the imaging unit, not only the monitored object but also areas other than the monitored object become bright. As a result, the control unit may not be able to accurately identify the outer edge of the monitored object and may not be able to monitor the monitored object with high accuracy. In this case, even if machine learning is used for image processing and monitoring of the monitored object, there is a risk of erroneous determination.

[0117] According to this embodiment, the monitored object is illuminated with spot light within the imaging range of the imaging unit 150, and therefore the monitored object can be monitored with high accuracy based on image data showing an image including the monitored object in the substrate processing apparatus 100.

[0118] Next, a substrate processing method according to the present embodiment will be described with reference to Figures 1 to 5. Figure 1 is a flow chart of the substrate processing method according to the present embodiment.

[0119] 5, in step SA, the substrate W is loaded into the substrate processing apparatus 100. Specifically, the substrate W is loaded into the chamber 112 of the substrate processing unit 110 via the indexer robot IR and the center robot CR.

[0120] In step SB, the substrate W is held. Specifically, the substrate holding part 120 holds the substrate W. When the substrate W is loaded into the chamber 112, the substrate W is held by the substrate holding part 120.

[0121] In step SC, the substrate W is processed in the substrate processing unit 110. Typically, the substrate holder 120 holds and rotates the substrate W, and the processing liquid supply unit 130 supplies a processing liquid to the substrate W.

[0122] In step SD, the substrate W is released from its hold. Specifically, the substrate holder 120 releases the hold of the substrate W.

[0123] In step SE, the substrate W is unloaded from the substrate processing unit 110. The substrate W is unloaded from the substrate processing apparatus 100. Specifically, the substrate W is unloaded from the chamber 112 of the substrate processing unit 110 via the center robot CR and the indexer robot IR.

[0124] According to this embodiment, the monitoring object is monitored during at least any period from when the substrate W is loaded into the substrate processing apparatus 100, processed, and unloaded from the substrate processing apparatus 100. For example, during the period from when the substrate W is loaded into the substrate processing unit 110 in step SA to when the substrate W is unloaded from the substrate processing unit 110 in step SE, the imaging section 150 captures an image of an area in the chamber 112 that includes the monitoring object irradiated with spot light from the light source 140, and generates image data. This allows the monitoring object to be monitored with high accuracy based on image data that indicates an image including the monitoring object in the substrate processing apparatus 100.

[0125] In this embodiment, the light source 140 emits a spot light toward the monitored object. The monitored object in the chamber 112 is illuminated with the spot light emitted from the light source 140. For example, if the monitored object is a nozzle 136 that discharges a processing liquid onto a substrate W, the nozzle 136 in the chamber 112 is illuminated with the spot light emitted from the light source 140. Alternatively, if the monitored object is a cup 180 used when loading or unloading a substrate W, the cup 180 is illuminated with the spot light emitted from the light source 140.

[0126] The imaging unit 150 captures an image of the area in the chamber 112 that includes the monitored object illuminated with the spot light. For example, the imaging unit 150 captures an image of the area that includes the monitored object illuminated with the spot light. By capturing an image of the area in the chamber 112 that includes the monitored object illuminated with the spot light, the imaging unit 150 can capture an image of the monitored object with high accuracy.

[0127] For example, when the substrate W is loaded into the substrate processing unit 110 in step SA, the object to be monitored may be the cup 180, and monitoring may be performed to ensure that the cup 180 is positioned below the cup 180 so as not to collide with the center robot CR. In this case, the light source 140 emits a spot light toward the cup 180. The cup 180 in the chamber 112 is illuminated with the spot light emitted from the light source 140. The imaging unit 150 captures an image of the area in the chamber 112 including the cup 180 illuminated by the spot light, and generates image data. This makes it possible to monitor that the cup 180 does not collide with the center robot CR that loads the substrate W into the chamber 112.

[0128] Alternatively, when the substrate holding unit 120 holds the substrate W in step SB, the monitored object may be the substrate holding unit 120, and monitoring may be performed to ensure that the chuck member 122 of the substrate holding unit 120 properly chucks the substrate W. In this case, the light source 140 emits spot light toward the chuck member 122. The chuck member 122 in the chamber 112 is illuminated with the spot light emitted from the light source 140. The imaging unit 150 captures an image of the area in the chamber 112 including the chuck member 122 illuminated with the spot light, and generates image data. This makes it possible to monitor whether the chuck member 122 is properly chucking the substrate W.

[0129] Alternatively, when processing the substrate W in step SC, the nozzle 136 may be used as the monitored object, and monitoring may be performed to determine whether the nozzle 136 is discharging the processing liquid from an appropriate position above the substrate W. In this case, the light source 140 emits spot light toward the nozzle 136 that discharges the processing liquid. The nozzle 136 in the chamber 112 is illuminated with the spot light emitted from the light source 140. The imaging unit 150 captures an image of the area in the chamber 112 including the nozzle 136 illuminated by the spot light, and generates image data. This makes it possible to monitor whether the nozzle 136 is discharging the processing liquid from an appropriate position above the substrate W.

[0130] Alternatively, when processing the substrate W in step SC, the pipes 132 and the nozzles 136 may be monitored as the objects to be monitored, and appropriate sucking back of the processing liquid in the pipes 132 and the nozzles 136 may be monitored. In this case, the light source 140 emits spot light toward the sucked-back pipes 132 and the nozzles 136. The pipes 132 and the nozzles 136 in the chamber 112 are illuminated with the spot light emitted from the light source 140. The imaging unit 150 captures an image of the area in the chamber 112 including the pipes 132 and the nozzles 136 illuminated with the spot light, and generates image data. This makes it possible to monitor appropriate sucking back of the processing liquid in the pipes 132 and the nozzles 136.

[0131] Alternatively, when the substrate holding unit 120 releases its hold on the substrate W in step SD, the monitored object may be the substrate holding unit 120, and monitoring may be performed to monitor whether the chuck member 122 of the substrate holding unit 120 properly releases the chuck of the substrate W. In this case, the light source 140 emits spot light toward the chuck member 122. The chuck member 122 in the chamber 112 is illuminated with the spot light emitted from the light source 140. The imaging unit 150 captures an image of the area in the chamber 112 including the chuck member 122 illuminated with the spot light, and generates image data. This makes it possible to monitor whether the chuck member 122 properly releases the chuck of the substrate W.

[0132] Alternatively, when the substrate W is unloaded from the substrate processing unit 110 in step SE, the object to be monitored may be the cup 180, and monitoring may be performed to ensure that the cup 180 is positioned below the cup 180 so as not to collide with the center robot CR. In this case, the light source 140 emits a spot light toward the cup 180. The cup 180 in the chamber 112 is illuminated with the spot light emitted from the light source 140. The imaging unit 150 captures an image of the area in the chamber 112 including the cup 180 illuminated by the spot light, and generates image data. This makes it possible to monitor that the cup 180 does not collide with the center robot CR unloading the substrate W from the chamber 112.

[0133] Next, the substrate processing method of this embodiment will be described with reference to Figures 1 to 6. Figure 6 is a flow chart of the substrate processing method of this embodiment.

[0134] 6 , in step S202, the substrate W is loaded into the substrate processing apparatus 100. Specifically, the substrate W is loaded into the load port LP. Thereafter, the substrate W is loaded into the chamber 112 of the substrate processing unit 110 via the indexer robot IR, the placement table 30, and the center robot CR. After being loaded into the chamber 112, the substrate W is held by the substrate holder 120.

[0135] In step S204, processing of the substrate W is started. Specifically, the control unit 102 starts processing of the substrate W in accordance with the recipe information. First, the substrate holding unit 120 holds and starts rotating the substrate W. Thereafter, the substrate W is processed in accordance with the recipe information.

[0136] In step S206, it is determined whether the object to be monitored has started a predetermined operation. Specifically, the control unit 102 determines whether the object to be monitored has started a predetermined operation based on the steps of the recipe information.

[0137] If the monitored object does not start the predetermined operation (No in step S206), the process returns to step S206. This repeats the determination until the monitored object starts the predetermined operation. On the other hand, if the monitored object starts the predetermined operation (Yes in step S206), the process proceeds to step S208.

[0138] In step S208, the light source 140 irradiates the monitored object with a spot light, which illuminates at least a portion of the monitored object, while not irradiating the background and surroundings of the monitored object.

[0139] In step S210, the image capturing unit 150 captures an image of an area including the monitored object, thereby generating image data showing the area including the monitored object.

[0140] In step S212, the image data is processed. The image data is processed to monitor the monitored object. For example, based on the image data, the outer edge of the monitored object shown in the image data is identified, and the position or movement of the monitored object is monitored.

[0141] Specifically, the control unit 102 identifies the monitored object in the image data based on the image data generated by the imaging unit 150. The control unit 102 identifies the monitored object in the image data based on the image data. For example, the control unit 102 identifies the outer edge of the monitored object in the image data based on the image data.

[0142] In one example, the control unit 102 identifies the outer edge of the monitored object in the image data based on the luminance values ​​in the image data. For example, the control unit 102 identifies the outer edge of the monitored object in the image data based on the luminance values ​​in the image data and the luminance values ​​of the reference image data stored in the storage unit 104.

[0143] In step S214, the control unit 102 determines whether or not the monitored object is abnormal based on the image data. Specifically, the control unit 102 determines whether or not the monitored object is abnormal based on the image data and the reference image data.

[0144] If it is determined that the monitored object is not abnormal (No in step S214), the process proceeds to step S216. On the other hand, if it is determined that the monitored object is abnormal (Yes in step S214), the process proceeds to step S218.

[0145] In step S216, processing of the recipe continues for normal processing, after which the process proceeds to step S220.

[0146] In step S218, abnormality processing is performed. In the abnormality processing, the processing of the substrate W may be interrupted. Alternatively, image data generated when the monitored object is determined to be abnormal may be selectively saved. Alternatively, the processing status of the substrate W for the substrate W involved in the monitored object determined to be abnormal may be stored in the memory unit 104 from the image data generated when the monitored object is monitored. For example, the processing status of the substrate W may be used to determine whether the substrate W is abnormal. Thereafter, the processing proceeds to step S220.

[0147] In step S220, it is determined whether the predetermined operation has been completed. Specifically, the control unit 102 determines whether the predetermined operation has been completed based on the steps of the recipe information.

[0148] If the predetermined operation has not ended (No in step S220), the process returns to step S208. On the other hand, if the predetermined operation has ended (Yes in step S220), the process proceeds to step S222.

[0149] In step S222, it is determined whether or not to terminate the processing of the substrate W. Specifically, the control unit 102 determines whether or not to terminate the processing of the substrate W based on the steps of the recipe information.

[0150] If the processing of the substrate W is not to be terminated (No in step S222), the process returns to step S206. This repeats the determination until the monitored object starts a predetermined movement. On the other hand, if the processing of the substrate W is to be terminated (Yes in step S222), the process proceeds to step S224.

[0151] In step S224, the substrate W is unloaded from the substrate processing apparatus 100. For example, the control unit 102 releases the substrate W from the substrate holder 120. Next, the substrate W is loaded into the load port LP via the center robot CR, the placement table 30, and the indexer robot IR. Thereafter, the substrate W is unloaded from the substrate processing apparatus 100.

[0152] In this manner, the substrate processing apparatus 100 processes the substrate W in the substrate processing unit 110. According to this embodiment, the object to be monitored in the substrate processing apparatus 100 can be monitored with high accuracy based on image data representing an image including the object to be monitored.

[0153] 2, the imaging unit 150 is located in the same accommodation unit 113 as the light source 140, and the imaging unit 150 images the area including the monitored object from the same direction as the light source 140 that emits the spot light, but this embodiment is not limited to this. The imaging unit 150 may be located in an area separate from the light source 140, and the imaging unit 150 may image the area including the monitored object from a direction different from that of the light source 140 that emits the spot light. For example, the light source 140 may be located on one side of the substrate W and / or the substrate holding unit 120, and the imaging unit 150 may be located on the other side of the substrate W and / or the substrate holding unit 120.

[0154] Next, a substrate processing apparatus 100 of this embodiment will be described with reference to Figures 1 to 7. Figure 7 is a schematic diagram of a substrate processing unit 110 in the substrate processing apparatus 100 of this embodiment. The substrate processing unit 110 in the substrate processing apparatus 100 of Figure 7 has a configuration similar to that of the substrate processing unit 110 in the substrate processing apparatus 100 of Figure 2, except that the light source 140 is located on one side of the substrate W and / or the substrate holding part 120, and the imaging part 150 is located on the other side of the substrate W and / or the substrate holding part 120. Therefore, to avoid redundancy, duplicated descriptions will be omitted.

[0155] 7, the light source 140 is located on one side of the substrate W and / or the substrate holding part 120, and the imaging part 150 is located on the other side of the substrate W and / or the substrate holding part 120. For example, the light source 140 and the imaging part 150 are located on the X-axis line passing through the center of the substrate W and / or the substrate holding part 120. The imaging part 150 images an area including the monitored object from a direction different from that of the light source 140 that emits the spot light.

[0156] The substrate processing unit 110 includes a first storage section 113a and a second storage section 113b as storage sections for accommodating the light source 140 and the imaging section 150. The first storage section 113a and the second storage section 113b are attached to a side wall 112s of the chamber 112. The first storage section 113a and the second storage section 113b are box-shaped.

[0157] The light source 140 is accommodated inside the first accommodation portion 113 a. The atmosphere inside the first accommodation portion 113 a is isolated from the atmosphere inside the chamber 112 .

[0158] The imaging unit 150 is accommodated inside the second accommodation portion 113b. The atmosphere inside the second accommodation portion 113b is isolated from the atmosphere inside the chamber 112.

[0159] The first storage section 113 a may be located on one side of the chamber 112 , and the second storage section 113 b may be located on the other side of the chamber 112 .

[0160] The chamber 112 preferably has windows 112wa and 112wb as windows. For example, the windows 112wa and 112wb transmit at least light. The window 112wa is located at an upper side of the chamber 112. For example, the light source 140 emits a spot light onto the monitored object through the window 112wa. The imaging unit 150 captures an image of the area including the monitored object through the window 112wb.

[0161] The light source 140 is located on one side of the substrate W and / or the substrate holding part 120, and the imaging part 150 is located on the other side of the substrate W and / or the substrate holding part 120. Therefore, part of the spot light emitted from the light source 140 that is scattered by the monitored object reaches the imaging part 150. Therefore, the imaging part 150 can image an area including the monitored object illuminated by the spot light, using the spot light scattered by the monitored object.

[0162] In the processing liquid supply unit 130, if the processing liquid remains at the tip of the nozzle 136 when the supply of the processing liquid is stopped after the processing liquid has been supplied to the substrate W from the nozzle 136, there is a risk that the processing liquid may unintentionally fall from the tip of the nozzle 136 into the substrate W, the substrate holding unit 120, and / or the chamber 112. For this reason, when the supply of the processing liquid is stopped after the processing liquid has been supplied to the substrate from the nozzle 136, it is preferable to suck the processing liquid from the tip of the nozzle 136 and move the position of the processing liquid in the pipe 132 from the tip of the nozzle 136 to the back side of the nozzle 136. Such movement of the position of the processing liquid in the nozzle 136 and the pipe 132 is also called suck-back.

[0163] According to this embodiment, when the light source 140 irradiates the nozzle 136 and the tip of the pipe 132 with spot light, the light is scattered by portions of the nozzle 136 and the tip of the pipe 132 where no treatment liquid is present. Furthermore, the light is refracted in a different direction by portions of the nozzle 136 and the tip of the pipe 132 where treatment liquid is present. Therefore, the imaging unit 150 can determine whether the suck-back is successful and the position of the treatment liquid in the nozzle 136 and the pipe 132 by capturing an image of the tip of the nozzle 136 and the pipe 132 irradiated with the spot light from the light source 140. For example, if the suck-back of the treatment liquid is insufficient, the control unit 102 may suck back the treatment liquid again.

[0164] The substrate processing apparatus 100 of this embodiment will be described below with reference to Figures 1 to 8B. Figure 8A is a schematic diagram of the inside of a substrate processing unit 110 in the substrate processing apparatus 100 of this embodiment, and Figure 8B is a schematic diagram showing image data generated by capturing an image of an area including a monitoring target irradiated with a spot light in the substrate processing unit 110 in the substrate processing apparatus 100 of this embodiment.

[0165] As shown in Figure 8A, a substrate W is accommodated in the chamber 112 of the substrate processing unit 110. The substrate W is held by the substrate holder 120 (Figure 2), and the substrate W is surrounded by a cup 180. The nozzle 136 is positioned above the substrate W surrounded by the cup 180, and the nozzle 136 has finished discharging the processing liquid onto the substrate W. After the nozzle 136 has finished discharging the processing liquid onto the substrate W, the processing liquid is sucked back and returns to the nozzle 136 and the pipe 132. When the light source 140 is turned off, the inside of the chamber 112 appears relatively dark.

[0166] 8B , when light source 140 is turned on, spot light emitted from light source 140 illuminates nozzle 136 and the tip of pipe 132. In this case, the tips of nozzle 136 and pipe 132 are the objects to be monitored, and the tips of nozzle 136 and pipe 132 are illuminated by the spot light. While the spot light emitted from light source 140 illuminates the tips of nozzle 136 and pipe 132, the spot light does not illuminate areas other than nozzle 136 in chamber 112. Furthermore, in the portion of the tip of pipe 132 where the processing liquid is present, light is refracted in a different direction. As a result, only the tips of nozzle 136 and pipe 132 appear bright.

[0167] Here, the light source 140 is located on one side relative to the substrate W and / or the substrate holding part 120, and the imaging part 150 is located on the other side relative to the substrate W and / or the substrate holding part 120. Therefore, part of the spot light emitted from the light source 140 that is scattered by the monitored object reaches the imaging part 150. The imaging part 150 images an area irradiated with the spot light emitted from the light source 140, the area including the nozzle 136 and the tip of the pipe 132. In detail, the imaging part 150 images an area in the chamber 112 including the nozzle 136 and the area other than the nozzle 136. In this case, in the image captured by the imaging part 150, the brightness value of the nozzle 136 and the tip of the pipe 132 is high, while the brightness value of the area in the chamber 112 other than the tip of the nozzle 136 and the pipe 132 is low.

[0168] In this way, the spot light emitted from the light source 140 is scattered by the nozzle 136 and the pipe 132. Therefore, in the image data, the nozzle 136 and the pipe 132 exhibit high brightness values. On the other hand, in the image data, the spot light emitted from the light source 140 in the chamber 112 is not irradiated onto the area around the nozzle 136, so the area around the nozzle 136 exhibits a low brightness value. Furthermore, the spot light emitted from the light source 140 in the chamber 112 is refracted by the processing liquid in the pipe 132, so the processing liquid portion in the pipe 132 exhibits a low brightness value.

[0169] Therefore, in the image data, the nozzle 136 and the pipe 132 irradiated with the spot light exhibit high brightness values, while the area in the chamber 112 not irradiated with the spot light and the portion in the pipe 132 where the processing liquid exists do not exhibit high brightness values. Therefore, the control unit 102 can identify the outer edge of the processing liquid in the pipe 132 in the image data with high accuracy based on the image data. This allows the control unit 102 to monitor suck-back with high accuracy.

[0170] In FIG. 8B, the nozzle 136 is the object to be monitored, and the nozzle 136 and the pipe 132 of the object to be monitored are irradiated with spot light, but the object to be monitored may be something other than the nozzle 136 and the pipe 132 .

[0171] 7, the light source 140 and the imaging unit 150 are located at a position higher in the vertical direction than the monitored object, but this embodiment is not limited to this. The light source 140 and the imaging unit 150 may be located at approximately the same height in the vertical direction as the monitored object. In this case, the imaging unit 150 may receive a component of the spot light emitted from the light source 140 that passes through the monitored object and its surroundings, and capture an image of the area including the monitored object.

[0172] Alternatively, the light source 140 and the imaging unit 150 may be arranged at different heights along the vertical direction, and the light source 140, the monitored object, and the imaging unit 150 may be arranged in a straight line parallel to the spot light emitted as parallel light from the light source 140. In this case, the imaging unit 150 may receive a component of the spot light as parallel light emitted from the light source 140 that has passed through the monitored object and its surroundings, and capture an image of an area including the monitored object.

[0173] 7 , the light source 140 and the image capturing unit 150 are located on one side and the other side of the substrate W and / or the substrate holding unit 120, respectively, but this embodiment is not limited to this. The light source 140 and the image capturing unit 150 may be located in a direction intersecting the center of the substrate W and / or the substrate holding unit 120. For example, the light source 140 may be located on the X-axis with respect to the center of the substrate W and / or the substrate holding unit 120, and the image capturing unit 150 may be located on the Y-axis with respect to the center of the substrate W and / or the substrate holding unit 120.

[0174] 1 and 7, the interior of the chamber 112 of the substrate processing unit 110 is irradiated with spot light emitted from one light source 140 and imaged by one imaging section 150, but this embodiment is not limited to this. The interior of the chamber 112 of the substrate processing unit 110 may be imaged by two or more imaging sections 150.

[0175] 1 and 7, the monitored object in the chamber 112 of the substrate processing unit 110 is irradiated with spot light emitted from one light source 140, but this embodiment is not limited to this. Two or more monitored objects in the chamber 112 of the substrate processing unit 110 may be irradiated with spot light emitted from two or more light sources 140.

[0176] Next, a substrate processing apparatus 100 according to this embodiment will be described with reference to Figures 1 to 9. Figure 9 is a schematic diagram of a substrate processing unit 110 in the substrate processing apparatus 100 according to this embodiment. The substrate processing unit 110 in the substrate processing apparatus 100 of Figure 9 has a configuration similar to that of the substrate processing unit 110 in the substrate processing apparatus 100 of Figure 2, except that spot lights emitted from a first light source 140a and a second light source 140b illuminate an object to be monitored. Therefore, a redundant description will be omitted to avoid redundancy.

[0177] 9, the substrate processing unit 110 includes a first light source 140a and a second light source 140b as light sources. The first light source 140a irradiates a spot light onto a first monitored object in the chamber 112. The second light source 140b irradiates a spot light onto a second monitored object different from the first monitored object in the chamber 112.

[0178] The first light source 140a is located on one side of the substrate W and / or the substrate holding part 120, and the second light source 140b is located on the other side of the substrate W and / or the substrate holding part 120. For example, the first light source 140a and the second light source 140b are located on the X-axis line that passes through the center of the substrate W and / or the substrate holding part 120. The imaging part 150 images the inside of the chamber 112 from the same direction as the first light source 140a.

[0179] The substrate processing unit 110 includes a first storage section 113a and a second storage section 113b that house the light source and the imaging section. The first storage section 113a and the second storage section 113b are attached to a side wall 112s of the chamber 112. The first storage section 113a and the second storage section 113b are box-shaped.

[0180] The first housing portion 113a houses the first light source 140a and the image capturing unit 150. The first light source 140a and the image capturing unit 150 are fixed in the first housing portion 113a so as to face a predetermined direction.

[0181] The second housing portion 113b houses the second light source 140b, which is fixed in the second housing portion 113b and faces a predetermined direction.

[0182] The chamber 112 may have a window 112wa and a window 112wb. For example, the window 112wa and the window 112wb are at least light-transmitting.

[0183] The window 112wa and the window 112wb are preferably disposed on opposing side walls 112s of the chamber 112. The window 112wa is located on one side relative to the substrate W and / or the substrate holder 120, and the window 112wb is located on the other side relative to the substrate W and / or the substrate holder 120. For example, the first light source 140a emits a spot light onto the first monitored object through the window 112wa. The second light source 140b emits a spot light onto the second monitored object through the window 112wb. The imaging unit 150 captures an image of an area including the first monitored object and the second monitored object through the window 112wa.

[0184] Next, the substrate processing apparatus 100 of this embodiment will be described with reference to Figures 1 to 11B. Figure 10A is a schematic diagram of the inside of a substrate processing unit 110 in the substrate processing apparatus 100 of this embodiment, Figure 10B is a schematic diagram showing image data generated by imaging an area including a first monitored object irradiated with a first spot light in the substrate processing unit 110 in the substrate processing apparatus 100 of this embodiment, Figure 11A is a schematic diagram of the inside of the substrate processing unit 110 in the substrate processing apparatus 100 of this embodiment, and Figure 11B is a schematic diagram showing image data generated by imaging an area including a second monitored object irradiated with a second spot light in the substrate processing unit 110 in the substrate processing apparatus 100 of this embodiment.

[0185] 10A , a substrate W is accommodated in a chamber 112 of a substrate processing unit 110. The substrate W is surrounded by a cup 180. The processing liquid supply unit 130 supplies a processing liquid to the substrate W surrounded by the cup 180. When the first light source 140 a and the second light source 140 b are turned off, the inside of the chamber 112 appears relatively dark.

[0186] 10B , when first light source 140a is turned on, the spot light emitted from first light source 140a illuminates nozzle 136. In this case, nozzle 136 is the monitored object. The spot light emitted from light source 140a illuminates the tip of nozzle 136, while the spot light does not illuminate areas other than nozzle 136 within chamber 112. Therefore, only the tip of nozzle 136 appears bright.

[0187] The imaging unit 150 captures an image of an area including the nozzle 136 illuminated by the spot light emitted from the first light source 140a. Specifically, the imaging unit 150 captures an image of the nozzle 136 and an area inside the chamber 112 that includes the nozzle 136 and areas other than the nozzle 136. In this case, in the image captured by the imaging unit 150, the brightness value of the tip of the nozzle 136 is high, while the brightness value of areas inside the chamber 112 other than the nozzle 136 is low. Therefore, the control unit 102 can identify the outer edge of the nozzle 136 in the image data with high accuracy based on the image data. This allows the control unit 102 to monitor the nozzle 136 with high accuracy.

[0188] Thereafter, when the supply of the processing liquid to the substrate W is completed, the substrate W is unloaded from the chamber 112. Before the center robot CR enters the chamber 112 to unload the substrate W from the chamber 112, the cup 180 moves downward.

[0189] 11A, when the cup 180 is lowered, it exposes the side of the substrate W. When the first light source 140a and the second light source 140b are turned off, the inside of the chamber 112 appears relatively dark.

[0190] 11B, when second light source 140b is turned on, the spot light emitted from second light source 140b illuminates a portion of the upper edge of cup 180. In this case, cup 180 is the monitored object. The spot light emitted from second light source 140b illuminates a portion of the upper edge of cup 180, while the spot light is not irradiated onto areas other than the portion of the upper edge of cup 180 within chamber 112. As a result, only a portion of the upper edge of cup 180 appears bright.

[0191] The image capturing unit 150 captures an image of an area including a portion of the upper edge of the cup 180 illuminated with the spot light emitted from the second light source 140b. Specifically, the image capturing unit 150 captures an image of an area including a portion of the upper edge of the cup 180 and the rest of the area. In this case, in the image captured by the image capturing unit 150, the brightness value of a portion of the upper edge of the cup 180 is high, while the brightness value of the other areas in the chamber 112 is low. Therefore, the control unit 102 can identify the outer edge of the cup 180 in the image data with high accuracy based on the image data. This allows the control unit 102 to monitor the cup 180 with high accuracy.

[0192] According to this embodiment, different light sources are turned on depending on the operation performed on the substrate W. Therefore, the object to be monitored can be monitored with high accuracy depending on the operation inside the chamber 112.

[0193] 9, the first light source 140a and the second light source 140b emit spot lights to different monitoring objects, but this embodiment is not limited to this. One light source 140 may change the emission destination of the spot light so that the irradiation destination of the spot light moves from the first monitoring object to the second monitoring object.

[0194] 9 to 11B, the first light source 140a and the second light source 140b emit spot lights at different timings, but this embodiment is not limited to this. The first light source 140a and the second light source 140b may emit spot lights at the same timing, and the image capturing unit 150 may selectively capture images of different monitored objects illuminated with spot lights by the first light source 140a and the second light source 140b.

[0195] Next, a substrate processing apparatus 100 of this embodiment will be described with reference to Figures 1 to 12. Figure 12 is a schematic diagram of a substrate processing unit 110 in the substrate processing apparatus 100 of this embodiment. The substrate processing unit 110 in the substrate processing apparatus 100 of Figure 12 has a configuration similar to that of the substrate processing unit 110 in the substrate processing apparatus 100 of Figure 9, except that the imaging section 150 images a first monitored object illuminated with a first spot light from a first light source 140a via a filter 152a, and also images a second monitored object illuminated with a second spot light from a second light source 140b via a filter 152b. Therefore, to avoid redundancy, a duplicated description will be omitted.

[0196] 12 , the substrate processing unit 110 includes a first light source 140a and a second light source 140b as light sources. The first light source 140a is located on one side of the substrate W and / or the substrate holding part 120, and the second light source 140b is located on the other side of the substrate W and / or the substrate holding part 120. The first light source 140a and the second light source 140b are located on the X-axis line that passes through the center of the substrate W and / or the substrate holding part 120. The imaging part 150 captures an image of the inside of the chamber 112 from the same direction as the first light source 140a.

[0197] The first light source 140a irradiates a spot light onto a first monitored object in the chamber 112. The second light source 140b irradiates a spot light onto a second monitored object different from the first monitored object in the chamber 112.

[0198] The first light source 140a emits light of a different wavelength from the second light source 140b. For example, the first light source 140a emits red light (with a wavelength peak of 600 nm to 700 nm), and the second light source 140b emits blue light (with a wavelength peak of 400 nm to 500 nm).

[0199] The imaging unit 150 captures an image of a monitored object through the filter 152a or the filter 152b. The filters 152a and 152b are replaceable with respect to the imaging unit 150. It is preferable that the filters 152a and 152b be automatically switchable in response to an operation.

[0200] For example, one of the filters 152a and 152b transmits light emitted from the first light source 140a and blocks light emitted from the second light source 140b, while the other of the filters 152a and 152b blocks light emitted from the first light source 140a and transmits light emitted from the second light source 140b.

[0201] In one example, the filter 152a selectively transmits the light emitted from the first light source 140a. The filter 152a is red.

[0202] The filter 152b selectively transmits light emitted from the second light source 140b. The filter 152b is blue.

[0203] The image capturing unit 150 can capture an image of a first monitored object illuminated by the spot light emitted from the first light source 140a through the filter 152a. The image capturing unit 150 can capture an image of a second monitored object illuminated by the spot light emitted from the second light source 140b through the filter 152b. At this time, both the first light source 140a and the second light source 140b may be turned on.

[0204] In the explanation given above with reference to Figure 12, the monitored object imaged by the imaging unit 150 is switched between the first monitored object and the second monitored object by switching between the filters 152a and 152b placed in front of the imaging unit 150, but this embodiment is not limited to this.

[0205] The monitoring object imaged by the imaging unit 150 may be switched between the first monitoring object and the second monitoring object by switching a filter in the imaging unit 150. For example, the imaging unit 150 can switch the monitoring object imaged by the imaging element between the first monitoring object and the second monitoring object by switching a filter located between the opening and the imaging element.

[0206] Alternatively, the image capturing unit 150 may have an image capturing element with multiple types of pixels having different sensitivities to light of different wavelengths. In this case, by changing the type of image capturing element used to generate image data, the monitored object captured by the image capturing unit 150 may be switched between the first monitored object and the second monitored object.

[0207] Next, the substrate processing apparatus 100 of this embodiment will be described with reference to Figures 1 to 13C. Figure 13A is a schematic diagram of the interior of the substrate processing unit 110 in the substrate processing apparatus 100 of this embodiment. Figure 13B is a schematic diagram showing image data generated by capturing an image of an area including a first monitored object irradiated with a first spot light in the substrate processing unit 110 in the substrate processing apparatus 100 of this embodiment. Figure 13C is a schematic diagram showing image data generated by capturing an image of an area including a second monitored object irradiated with a second spot light in the substrate processing unit 110 in the substrate processing apparatus 100 of this embodiment.

[0208] 13A , a substrate W is accommodated in a chamber 112 of a substrate processing unit 110. The substrate W is held by a substrate holder 120, and the substrate W is surrounded by a cup 180. A nozzle 136 of the processing liquid supply unit 130 is positioned above the substrate W surrounded by the cup 180. When the light source 140 is turned off, the inside of the chamber 112 appears relatively dark.

[0209] 13B , when first light source 140a is turned on, the spot light emitted from first light source 140a illuminates nozzle 136. At this time, second light source 140b is turned on, and the spot light emitted from second light source 140b illuminates a portion of the upper end of cup 180.

[0210] In this case, the image capturing unit 150 captures an image of an area including the nozzle 136 illuminated by the spot light emitted from the first light source 140a via the filter 152a. Specifically, the image capturing unit 150 captures an image of the nozzle 136 and an area inside the chamber 112 that includes the nozzle 136 and the area outside the nozzle 136. In this case, in the image captured by the image capturing unit 150, the brightness value of the tip of the nozzle 136 is high, while the brightness value of the area inside the chamber 112 other than the nozzle 136 is low. Therefore, the control unit 102 can identify the outer edge of the nozzle 136 in the image data with high accuracy based on the image data. This allows the control unit 102 to monitor the nozzle 136 with high accuracy.

[0211] 13C , when second light source 140b is turned on, the spot light emitted from second light source 140b illuminates a part of the upper end of cup 180. At this time, first light source 140a is turned on, and the spot light emitted from first light source 140a illuminates nozzle 136.

[0212] In this case, the image capturing unit 150 captures an image of an area including a portion of the upper edge of the cup 180 illuminated with the spot light emitted from the second light source 140b via the filter 152b. Specifically, the image capturing unit 150 captures an image of an area including a portion of the upper edge of the cup 180 and the rest of the area. In this case, in the image captured by the image capturing unit 150, the brightness value of a portion of the upper edge of the cup 180 is high, while the brightness value of the other areas in the chamber 112 is low. Therefore, the control unit 102 can identify the outer edge of the cup 180 in the image data with high accuracy based on the image data. This allows the control unit 102 to monitor the cup 180 with high accuracy.

[0213] In this way, the imaging unit 150 captures images of the first and second monitored objects by switching between the filters 152a and 152b, so that even when the second light source 140b is turned on, the imaging unit 150 can capture an image of the area including the first monitored object with high precision using the spot light emitted from the first light source 140a. Also, even when the first light source 140a is turned on, the imaging unit 150 can capture an image of the area including the second monitored object with high precision using the spot light emitted from the second light source 140b.

[0214] Therefore, even if the second light source 140b emits light of a different wavelength from the first spot light as the second spot light during a period overlapping with a period during which the first light source 140a emits the first spot light, the imaging unit 150 can selectively capture an image of an area including the first monitored object illuminated with the first spot light from the areas illuminated with the first and second spot lights, and generate image data. Also, the imaging unit 150 can selectively capture an image of an area including the second monitored object illuminated with the second spot light from the areas illuminated with the first and second spot lights, and generate image data.

[0215] 1 to 13C, the light source 140 and the image capturing unit 150 are positioned outside the chamber 112 of the substrate processing unit 110, and a spot light is irradiated onto the monitored object inside the chamber 112 from outside the chamber 112, and an image of the area including the monitored object is captured. However, this embodiment is not limited to this. At least one of the light source 140 and the image capturing unit 150 may be disposed inside the chamber 112 of the substrate processing unit 110.

[0216] Next, the substrate processing apparatus 100 of this embodiment will be described with reference to Figures 1 to 14. Figure 14 is a schematic diagram of a substrate processing unit 110 in the substrate processing apparatus 100 of this embodiment. The substrate processing unit 110 in the substrate processing apparatus 100 of Figure 14 has a configuration similar to that of the substrate processing unit 110 in the substrate processing apparatus 100 of Figure 2, except that the light source 140 and the imaging unit 150 are located inside the chamber 112, and therefore, redundant description will be omitted to avoid redundancy.

[0217] 14 , light source 140 and imaging unit 150 are located inside chamber 112. Light source 140 irradiates a spot light onto a monitored object inside chamber 112. Imaging unit 150 captures an image of an area inside chamber 112 that includes the monitored object irradiated with the spot light.

[0218] The light source 140 and the imaging unit 150 are surrounded by a cover member 162. The cover member 162 is box-shaped, and the light source 140 and the imaging unit 150 are installed inside the cover member 162. For example, the cover member 162 is transparent. The cover member 162 can prevent the processing liquid used to process the substrate W from adhering to the light source 140 and the imaging unit 150.

[0219] As described above, the light source 140 may emit parallel light. Alternatively, the light source 140 may emit light all around the light source 140 and function as a point light source. Even if the light source 140 is a point light source, the light source 140 can irradiate a spot light on the monitored object by positioning the light source 140 near the monitored object.

[0220] The light source 140 and the imaging unit 150 may be movable relative to the substrate W. For example, it is preferable that the light source 140 and the imaging unit 150 are movable in the horizontal and / or vertical directions according to a movement mechanism controlled by the control unit 102. When the light source 140 and the imaging unit 150 are movable, the light source 140 and the imaging unit 150 may be movable independently of each other. Alternatively, the light source 140 and the imaging unit 150 may be movable as a single unit.

[0221] 1 to 14 , the light source 140 irradiates a spot light onto the monitoring object inside the chamber 112 of the substrate processing unit 110, and the image capturing section 150 captures an image of an area including the monitoring object inside the chamber 112 of the substrate processing unit 110. However, this embodiment is not limited to this. The light source 140 may irradiate a spot light onto the monitoring object outside the substrate processing unit 110, and the image capturing section 150 may capture an image of an area including the monitoring object outside the substrate processing unit 110.

[0222] Next, a substrate processing apparatus 100 according to this embodiment will be described with reference to Figures 1 to 15. Figure 15 is a schematic diagram of the substrate processing apparatus 100 according to this embodiment. The substrate processing apparatus 100 in Figure 15 has the same configuration as the substrate processing apparatus 100 described above with reference to Figure 1, except that the light source 140 and the imaging unit 150 are mounted on an indexer robot IR, and therefore, redundant description will be omitted to avoid redundancy.

[0223] 15 , in the substrate processing apparatus 100, the light source 140 and the image capturing unit 150 are mounted on the indexer robot IR. In this example, the object to be monitored is the indexer robot IR. The indexer robot IR is disposed in the indexer unit 20.

[0224] The indexer robot IR holds a substrate W. As described above, the indexer robot IR transfers the substrate W between the load port LP and the installation table 30. The indexer robot IR pulls out the substrate W from the load port LP and places it on the installation table 30. The indexer robot IR also transports the substrate W placed on the installation table 30 to the load port LP.

[0225] In this example, the indexer robot IR is equipped with a light source 140 and an imaging unit 150. The light source 140 irradiates a spot light onto the indexer robot IR holding a substrate W. The imaging unit 150 generates image data by capturing an image of the area including the indexer robot IR irradiated with the spot light. The image data represents an image of the area including the indexer robot IR. The image data allows the indexer robot IR to be monitored.

[0226] In detail, when the indexer robot IR holds the substrate W, the light source 140 irradiates a spot light onto the contact portion where the indexer robot IR holds the substrate W. The imaging unit 150 generates image data by imaging an area including the contact portion of the indexer robot IR irradiated with the spot light from the light source 140. Furthermore, when the indexer robot IR hands over the substrate W, the light source 140 is turned off and the imaging unit 150 ends imaging.

[0227] Even if the indexer robot IR continues to hold the substrate W, the light source 140 may be turned off and the imaging unit 150 may end imaging after a predetermined period has elapsed since the indexer robot IR started to hold the substrate W.

[0228] Furthermore, the light source 140 irradiates a spot light when the indexer robot IR is handed over to the substrate processing unit 110 or the placement stage 30. The imaging unit 150 may capture an image of a region including the contact portion of the indexer robot IR.

[0229] The light source 140 may irradiate spot light onto two contact portions where the indexer robot IR holds the substrate W. The imaging unit 150 may generate image data by imaging areas including the two contact portions of the indexer robot IR irradiated with the spot light from the light source 140.

[0230] Next, the substrate processing apparatus 100 of this embodiment will be described with reference to Figures 1 to 16. Figure 16 is a schematic side view of the load port LP and the indexer unit 20 in the substrate processing apparatus 100 of this embodiment.

[0231] 16 , the indexer unit 20 is disposed adjacent to the load port LP. The indexer unit 20 is also disposed adjacent to the installation table 30. The indexer unit 20 is located between the load port LP and the installation table 30.

[0232] The indexer robot IR is housed in the indexer unit 20. The indexer robot IR operates within the indexer robot IR.

[0233] The indexer unit 20 has a bottom 21, side walls 22, and a ceiling 23. The bottom 21, side walls 22, and ceiling 23 form a predetermined space, and the indexer robot IR operates within the predetermined space. The atmosphere inside the indexer unit 20 is isolated from the outside atmosphere, and a clean environment is maintained.

[0234] The indexer robot IR is fixed to the bottom 21 .

[0235] A passage hole 22a for allowing the substrate W to pass through is provided in the portion of the side wall 22 that is connected to the load port LP.

[0236] The load port LP includes a mounting table 31, a stage 32, a wall portion 33, and a load port opening / closing mechanism 34. The mounting table 31 is disposed adjacent to the side wall 22.

[0237] The installation table 31 has a box shape. A drive mechanism such as an electric motor that is connected to and drives the load port opening / closing mechanism 34 is housed below the installation table 31.

[0238] The stage 32 is disposed above the installation base 31. The stage 32 is provided so as to be movable in the horizontal direction relative to the installation base 31 so as to move toward and away from the indexer unit 20.

[0239] A substrate storage container Sh is placed on the stage 32. The substrate storage container Sh is configured to be able to store a plurality of substrates W. The substrates W are placed inside the substrate storage container Sh.

[0240] The substrate storage container Sh is, for example, a front opening unified pod (FOUP) that stores in a sealed state the substrates W. Instead of a FOUP, a standard mechanical inter face (SMIF) pod, an open cassette (OC), or the like may be used.

[0241] The substrate storage container Sh has a housing Sha, a lid Shb, and a plurality of substrate guides Shc. The lid Shb is removable from the front surface of the housing Sha. When the lid Shb is attached to the front surface of the housing Sha, the housing Sha is sealed. When the lid Shb is removed, an opening B on the front surface of the housing Sha is exposed.

[0242] The substrate guide portions Shc are provided horizontally in a pair on the left and right sides of the inner wall of the substrate storage container Sh when viewed from the lid Shb side. The substrate guide portions Shc support the lower end of the substrate W. For example, if the substrate storage container Sh stores 25 substrates W, 25 stages of substrate guide portions Shc are provided.

[0243] When the stage 32 moves toward and approaches the indexer unit 20 , the substrate storage container Sh can be connected to the indexer unit 20 .

[0244] The wall portion 33 extends vertically from the upper surface of the installation table 31 along the side wall 22. The wall portion 33 is provided with a load port opening L that communicates with the passage hole 22a.

[0245] The load port opening and closing mechanism 34 opens and closes the lid Shb of the substrate storage container Sh. For example, the load port opening and closing mechanism 34 removes the lid Shb from the casing Sha. The load port opening and closing mechanism 34 also attaches the lid Shb to the casing Sha.

[0246] The load port opening / closing mechanism 34 includes a shutter member 34a and a shutter driver 34b. The shutter member 34a fits into the load port opening L to close the load port opening L. The shutter member 34a holds the lid Shb of the substrate storage container Sh. When the substrate storage container Sh is not installed on the load port LP, the shutter member 34a is fitted into the load port opening L, and the load port opening L is closed.

[0247] The shutter driving unit 34b is connected to the shutter member 34a and moves horizontally and vertically together with the shutter member 34a.

[0248] Specifically, the shutter driver 34b moves the shutter member 34a from the load port LP toward the indexer unit 20 (two-dot chain line arrow D) while the shutter member 34a is holding the lid Shb, thereby detaching the lid Shb from the substrate storage container Sh. By further moving the shutter member 34a vertically downward (two-dot chain line arrow E), the substrate storage container Sh and the indexer unit 20 are connected to each other, enabling the indexer robot IR to enter the substrate storage container Sh.

[0249] Typically, the shutter driving unit 34b is configured with an electric motor and a ball screw. When closing the substrate storage container Sh, the operations described above are performed in reverse, so that the lid Shb closes the opening B and the shutter member 34a closes the load port opening L.

[0250] The indexer robot IR pulls out a substrate W from a substrate storage container Sh installed on a load port LP, and also places a substrate W into a substrate storage container Sh installed on a load port LP.

[0251] The indexer robot IR has two hands 210, a base 222, a lifting / lowering unit 224, a connecting unit 226, and an extendable unit 228. The two hands 210 are arranged in a vertical direction. The base 222 is fixed to the bottom 21 of the indexer unit 20. The base 222 forms the base of the indexer robot IR.

[0252] The lifting unit 224 extends vertically upward from the base unit 222. The lifting unit 224 has a lifting mechanism. The lifting mechanism is made up of a motor, an encoder, and a ball screw. However, the lifting mechanism may also be made up of a cylinder.

[0253] The vertical position of the hand 210 can be changed by raising and lowering the lifting unit 224. Specifically, when unloading a substrate W from a substrate storage container Sh, the lifting unit 224 moves to a pick-up position (lower position), which is a height position where the uppermost part of the hand 210 is lower than the lower surface of the substrate W to be unloaded. When loading a substrate W into a substrate storage container Sh, the lifting unit 224 moves to a place position (upper position), which is a height position where the lower surface of the hand 210 is higher than the upper surface of the substrate guide unit Shc.

[0254] The connecting portion 226 connects the lifting / lowering portion 224 and the extension / contraction portion 228. The connecting portion 226 transmits the lifting / lowering operation of the lifting / lowering portion 224 to the extension / contraction portion 228. Specifically, the upper portion of the connecting portion 226 is connected to the extension / contraction portion 228. Furthermore, the upper portion of the extension / contraction portion 228 is connected to the support portion 211 that supports the hand 210. The extension / contraction portion 228 and the support portion 211 are connected to each hand 210, respectively, so that the two hands 210 can be operated independently.

[0255] The extendable section 228 can extend and retract in a predetermined direction. The extendable section 228 has a plurality of joints. When the joints are rotationally driven, the extendable section 228 extends and retracts in a predetermined direction. When the extendable section 228 extends and retracts, the horizontal position of the hand 210 changes.

[0256] For example, the hand 210 changes between a position when the telescopic unit 228 is retracted in the horizontal direction and a position when the telescopic unit 228 is extended in the horizontal direction. In this specification, the position of the hand 210 when the telescopic unit 228 is retracted in the horizontal direction may be referred to as a home position (retracted position), and the position of the hand 210 when the telescopic unit 228 is extended in the horizontal direction may be referred to as a forward position (advanced position). The home position is the reference position of the hand 210 in the horizontal direction.

[0257] 16, for the upper hand 210, a home position HM (retracted position), which is the position when the extendable unit 228 is retracted in the horizontal direction, is shown by a solid line, and a forward position FW (advanced position), which is the position when the extendable unit 228 is extended in the horizontal direction, is shown by a two-dot chain line. The home position HM is the reference position in the horizontal direction of the hand 210. The extendable unit 228 extends and contracts by bending each of multiple joints, thereby reducing the installation space. Similarly, the lower hand 210 extends and contracts between the home position (retracted position) and the forward position (advanced position).

[0258] The light source 140 and the imaging unit 150 are mounted on the hand 210. The light source 140 irradiates a spot light onto a contact portion where the hand 210 holds the substrate W. The imaging unit 150 generates image data by imaging an area including the contact portion of the hand 210 irradiated with the spot light from the light source 140.

[0259] Next, the substrate processing apparatus 100 of this embodiment will be described with reference to Figures 1 to 17B. Figure 17A is a schematic plan view of the hand 210 of the indexer robot IR in the substrate processing apparatus 100 of this embodiment, and Figure 17B is a schematic side view of the hand 210 of the indexer robot IR in the substrate processing apparatus 100 of this embodiment. In each of Figures 17A and 17B, the substrate W is indicated by a two-dot chain line.

[0260] 17A , the hand 210 has a support part 211, a main body 212, two claw guide parts 213, two back guide parts 214, and a pusher part 215. The support part 211 is supported on the upper part of the extension part 228 ( FIG. 16 ). The support part 211 supports the main body 212.

[0261] The main body 212 holds the substrate W in a horizontal position. The main body 212 is a plate-like member that is horizontally flat in a plan view of the hand 210. One end of the main body 212 is connected to the support portion 211, and the other end of the main body 212 holds the substrate W. The main body 212 has a hollow shape that does not support at least a portion of the substrate W when holding the substrate W. For example, the hollow shape is a V-shape. The main body 212 is formed of a lightweight and strong material such as ceramics or aluminum.

[0262] The claw guide portions 213 are disposed at each tip of the V-shaped portion of the main body 212. The claw guide portions 213 are L-shaped in side view. When the main body 212 supports the substrate W in the horizontal direction, the substrate W is guided by and supported by the claw guide portions 213.

[0263] The back guide portion 214 is located closer to the support portion 211 than the claw guide portion 213 on the surface of the main body 212. The back guide portion 214 is arranged at a certain distance so that it can support the substrate W. In a plan view, the back guide portion 214 is substantially cylindrical. More specifically, the back guide portion 214 has an inclined shape that becomes thinner from the middle of the cylinder toward the top. The inclined portion of the back guide portion 214 supports the peripheral edge of the substrate W.

[0264] The substrate W is supported at four points: the two claw guides 213 and the two back guides 214. This reduces the contact area with the rear surface and edge of the substrate W compared to when the substrate W is directly supported over the entire surface of the main body 212, thereby suppressing scratches and contamination on the rear surface of the substrate W.

[0265] The pusher portion 215 pushes out the substrate W supported at four points, namely, the two claw guide portions 213 and the two back guide portions 214. The pusher portion 215 can fix and hold the substrate W.

[0266] The pusher portion 215 has a movable portion 215 a and a fixed portion 215 b. The movable portion 215 a is movable relative to the fixed portion 215 b. The movable portion 215 a is connected to the fixed portion 215 b. The fixed portion 215 b is fixed to the support portion 211.

[0267] The movable part 215a expands and contracts in the horizontal direction relative to the fixed part 215b. The movable part 215a includes, for example, a spring, a cylinder, and a motor.

[0268] 17B, ​​the claw guide portion 213 has a flat portion 213a and a side portion 213b. In the claw guide portion 213, the flat portion 213a supports the substrate W from below. The side portion 213b supports the peripheral edge of the substrate W.

[0269] The lower surface of the substrate W is held by the claw guides 213 and the back guides 214. The upper surface of the substrate W is positioned lower than the uppermost parts of the claw guides 213 and the back guides 214, which prevents the substrate W from easily coming off the hand 210.

[0270] When the substrate W is placed on the hand 210, the substrate W is supported by the claw guide portion 213 and the back guide portion 214. In this state, the movable portion 215a of the pusher portion 215 extends toward the substrate W, thereby clamping the substrate W and fixing and holding the substrate W. For example, when the movable portion 215a extends toward the substrate W, it pushes in the edge of the substrate W, causing the edge of the substrate W to be pressed against the side surface portion 213b of the claw guide portion 213, thereby clamping the substrate W and fixing and holding the substrate W. Conversely, when the movable portion 215a contracts, the side surface portion 213b of the claw guide portion 213 moves away from the edge of the substrate W, and the fixed holding of the substrate W is released.

[0271] The light source 140 and the imaging unit 150 are mounted on the support unit 211. The light source 140 irradiates a spot light onto the claw guide unit 213 where the hand 210 holds the substrate W. The imaging unit 150 generates image data by imaging an area including the claw guide unit 213 irradiated with the spot light from the light source 140.

[0272] 15 to 17B, the light source 140 and the image capturing unit 150 are mounted on the indexer robot IR, but this embodiment is not limited to this. The light source 140 and the image capturing unit 150 may be mounted on the center robot CR. Alternatively, the light source 140 and the image capturing unit 150 may be mounted on each of the indexer robot IR and the center robot CR. In this way, the light source 140 and the image capturing unit 150 may be mounted on a transport robot.

[0273] The embodiments of the present invention have been described above with reference to the drawings. However, the present invention is not limited to the above embodiments and can be embodied in various forms without departing from the spirit and scope of the present invention. Furthermore, various inventions can be formed by appropriately combining multiple components disclosed in the above embodiments. For example, some components may be omitted from all components shown in the embodiments. Furthermore, components from different embodiments may be appropriately combined. The drawings mainly show each component in a schematic manner to facilitate understanding. The thickness, length, number, spacing, etc. of each component shown may differ from the actual thickness, length, number, spacing, etc. of each component shown in the above embodiments due to the convenience of drawing. Furthermore, the materials, shapes, dimensions, etc. of each component shown in the above embodiments are merely examples and are not particularly limited. Various modifications are possible within a scope that does not substantially deviate from the effects of the present invention.

[0274] 1 to 17B, the substrate processing apparatus 100 images an area including one or more monitored objects using one imaging unit 150, but may image an area including two or more monitored objects using two or more imaging units 150. Alternatively, the imaging unit 150 may image an area including two or more monitored objects by changing its orientation.

[0275] 1 to 17B, the substrate W is processed with a processing liquid in the substrate processing unit 110 of the substrate processing apparatus 100, but this embodiment is not limited to this. In the substrate processing unit 110, the substrate W does not have to be processed with a processing liquid. For example, in the substrate processing unit 110, the substrate W may be subjected to exposure processing. Or, in the substrate processing unit 110, the substrate W may be subjected to heat processing.

[0276] The present invention is suitably used in a substrate processing apparatus and a substrate processing method.

[0277] This application claims priority to Japanese Patent Application No. 2024-043338, filed March 19, 2024, the entire contents of which are incorporated herein by reference.

Claims

1. A substrate processing apparatus comprising: a substrate processing unit for processing substrates; a light source for irradiating a monitoring object located inside or outside the substrate processing unit with a spot light; an imaging unit for capturing an image of an area including the monitoring object irradiated with the spot light and generating image data; and a control unit for monitoring the monitoring object based on the image data.

2. The substrate processing apparatus according to claim 1, wherein the imaging unit images an area including the object to be monitored from the direction in which the light source emits the spot light.

3. A substrate processing apparatus as described in claim 1 or 2, wherein the light source irradiates the spot light onto the object to be monitored from a position on one side of the substrate, and the imaging unit images an area including the object to be monitored that is irradiated with the spot light from a position on the other side of the substrate.

4. A substrate processing apparatus as described in any one of claims 1 to 3, wherein the light source includes a first light source that emits a first spot light onto a first monitored object as the monitored object, and a second light source that emits a second spot light onto a second monitored object as the monitored object.

5. The substrate processing apparatus according to claim 4, wherein the first light source emits the first spot light at a timing different from a timing at which the second light source emits the second spot light.

6. The substrate processing apparatus according to claim 4 or 5, wherein the second light source emits light of a different wavelength from the first spot light as the second spot light during a period overlapping with a period during which the first light source emits the first spot light, and the imaging unit selectively images an area including the first monitored object irradiated with the first spot light from areas irradiated with the first spot light and the second spot light to generate the image data, and selectively images an area including the second monitored object irradiated with the second spot light from areas irradiated with the first spot light and the second spot light to generate the image data.

7. The substrate processing apparatus according to claim 6, further comprising: a first filter that selectively transmits the first spot light; and a second filter that selectively transmits the second spot light.

8. A substrate processing apparatus as described in any one of claims 1 to 7, wherein the substrate processing unit comprises: a chamber; a substrate holding section that holds the substrate in the chamber; and a processing liquid supply section that supplies processing liquid to the substrate held in the substrate holding section; the light source irradiates the spot light onto the object to be monitored in the chamber; and the imaging section images an area including the object to be monitored in the chamber that is irradiated with the spot light.

9. A substrate processing apparatus as described in any one of claims 1 to 8, further comprising a transport robot that transports the substrate to the substrate processing unit, wherein the light source irradiates the spot light onto a portion of the transport robot, and the imaging unit images an area including the portion of the transport robot irradiated with the spot light.

10. A substrate processing method comprising the steps of: processing a substrate in a substrate processing unit; irradiating a spot light onto a monitored object located inside or outside the substrate processing unit; capturing an image of an area including the monitored object irradiated with the spot light to generate image data; and monitoring the monitored object based on the image data.

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