Wiring board, electronic component housing package, and electronic device

Abstract

This wiring board is provided with a substrate, a signal conductor located on the substrate, and a tubular waveguide located on the substrate. The signal conductor comprises: a first end connected to the waveguide; an inverse taper section having a linewidth that gradually widens toward the first end; and a rectilinear section having a constant linewidth and located between the inverse taper section and the first end.

Description

Wiring board, package for storing electronic components, and electronic device

[0001] The present disclosure relates to a wiring board, an electronic component storage package, and an electronic device.

[0002] Japanese Patent Application Laid-Open No. 2004-153368 discloses a signal transmission path in which a microstrip line and a waveguide-type waveguide are connected within a wiring board.

[0003] A wiring board according to the present disclosure comprises a base, a signal conductor located on the base, and a waveguide-type waveguide located on the base, wherein the signal conductor has a first end connected to the waveguide, an inverted tapered portion whose line width gradually increases toward the first end, and a straight portion whose line width is constant and located between the inverted tapered portion and the first end.

[0004] The package for storing electronic components according to the present disclosure includes the wiring substrate described above.

[0005] An electronic device according to the present disclosure includes the electronic component storage package described above, and an electronic component stored in the electronic component storage package.

[0006] 1 is a perspective view showing a wiring board according to a first embodiment of the present disclosure; FIG. 2 is a plan view showing the wiring board of the first embodiment; FIG. 3 is a side view showing the wiring board of the first embodiment; FIG. 4 is a back view showing the wiring board of the first embodiment; FIG. 5 is a front view showing the wiring board of the first embodiment; FIG. 6 is a plan view showing details of the wiring board of the first embodiment; FIG. 7 is a graph showing the reflection characteristics of embodiments 1a to 1c having different lengths of straight portions of signal conductors and reference example R1; FIG. 8 is a graph showing the transmission characteristics of embodiments 1a to 1c having different lengths of straight portions of signal conductors and reference example R1; FIG. 9 is a graph showing the reflection characteristics of embodiments 1d to 1f having different lengths of straight portions of signal conductors and reference example R1; FIG. 10 is a graph showing the transmission characteristics of embodiments 1d to 1f having different lengths of straight portions of signal conductors and reference example R1; FIG. 11 is a graph comparing worst values ​​of reflection characteristics in a signal band; FIG. 12 is a plan view showing a wiring board of comparative example 1; FIG. 13 is a plan view showing a wiring board of comparative example 2; FIG. 14 is a plan view showing a wiring board of comparative example 3; FIG. 15 is a graph showing the reflection characteristics of a plurality of comparative examples 1 having different lengths of inverted tapered portions; and FIG. 16 is a graph showing the transmission characteristics of a plurality of comparative examples 1 having different lengths of inverted tapered portions. 14B is a graph showing the reflection characteristics of Comparative Examples 2 and 3. FIG. 14C is a graph showing the transmission characteristics of Comparative Examples 2 and 3. FIG. 14D is a plan view showing a wiring board according to a second embodiment of the present disclosure. FIG. 14E is an enlarged view of a main portion of a wiring board according to a second embodiment of the present disclosure. FIG. 14F is a graph showing the reflection characteristics of Embodiments 2a to 2c having different lengths of straight portions of signal conductors and Reference Example R2. FIG. 14G is a graph showing the transmission characteristics of Embodiments 2a to 2c having different lengths of straight portions of signal conductors and Reference Example R2. FIG. 14H is a graph showing the reflection characteristics of Embodiments 2d to 2g having different lengths of straight portions of signal conductors. FIG. 14H is a graph showing the transmission characteristics of Embodiments 2d to 2g having different lengths of straight portions of signal conductors. FIG. 14I is a graph showing the reflection characteristics of Embodiments 2h to 2k having different lengths of wide sections of waveguides and Reference Example R3. FIG. 14I is a graph showing the transmission characteristics of Embodiments 2h to 2k having different lengths of wide sections of waveguides and Reference Example R3. FIG. 14I is a side view of a wiring board according to the first and second embodiments. FIG. 14A is a cross-sectional view taken along line B-B in FIG. 14A. FIG. 14B is a side view of a wiring board according to a third embodiment of the present disclosure. FIG. 14C is a cross-sectional view taken along line D-D in FIG. 14C. 15A is a side view of a wiring board according to a fourth embodiment of the present disclosure, FIG. 15B is a cross-sectional view taken along line BB in FIG. 15A, FIG. 15C is a side view of a wiring board according to a fifth embodiment of the present disclosure, and FIG. 15C is a cross-sectional view taken along line DD in FIG.1A and 1B are exploded perspective views illustrating an electronic component storage package and an electronic device according to an embodiment of the present disclosure, respectively, and plan views illustrating an electronic component storage package and an electronic device according to an embodiment of the present disclosure.

[0007] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. The dimensions and dimensional ratios of the various parts in the drawings do not faithfully represent the dimensions and dimensional ratios of the actual configurations.

[0008] 1 is a perspective view showing a wiring board 10 according to a first embodiment of the present disclosure. 2A to 2D are a plan view, a side view, a back view, and a front view, respectively, showing the wiring board 10 of the first embodiment.

[0009] 1 and 2A to 2D, the wiring board 10 according to the first embodiment includes a base 11, signal lines 13 and 14 located on the base 11, and a waveguide-type waveguide 15 located on the base 11. The signal lines 13 and 14 may include a first signal line 13 located on one side of the waveguide 15 and a second signal line 14 located on the other side.

[0010] The substrate 11 may be plate-shaped and have a first main surface 111 and a second main surface 112 opposite to the first main surface 111. The main surface may refer to the widest surface of the plate and the surface opposite to the widest surface. The substrate 11 may be a dielectric. The material of the substrate 11 may be ceramic such as an aluminum oxide sintered body, a glass ceramic sintered body, a mullite sintered body, or an aluminum nitride sintered body, or a resin.

[0011] In the following description, the signal transmission direction is referred to as the front-rear direction, the direction in which the first main surface 111 and the second main surface 112 are located is referred to as the up-down direction, and the direction perpendicular to the front-rear direction and the up-down direction is referred to as the width direction. These directions may be different from the direction in which the wiring board 10 is used.

[0012] The wiring board 10 may be configured to transmit signals from the front to the rear of the wiring board 10, from the rear to the front, or in both directions, from the front to the rear and from the rear to the front. As shown in Figures 2A to 2C, the wiring board 10 may be configured in such a way that a first section 210 in which one first signal line 13 is located, a second section 220 in which a waveguide 15 is located, and a third section 230 in which the other second signal line 14 is located are arranged in this order in the front-to-rear direction. The first signal line 13 may be connected to one end of the waveguide 15, and the second signal line 14 may be connected to the other end of the waveguide 15. This connection means that they are connected so that signals can be transmitted.

[0013] The first signal line 13 may be a microstrip line. The first signal line 13 includes a signal conductor 131 located on the base 11. The signal conductor 131 may be located on the first main surface 111 of the base 11. Furthermore, the first signal line 13 may be configured to include a film conductor 132 located on the second main surface 112 of the base 11. The film conductor 132 of the first signal line 13 is a ground potential plane and may be a solid ground conductor located across the entire second main surface 112 in the first section 210. The first signal line 13 may be configured to transmit a transmission signal in a transverse electromagnetic (TEM) mode.

[0014] The waveguide 15 may include film conductors 151, 152 and wall conductors 153, 154 that divide the signal transmission path in the vertical and width directions, respectively. The film conductors 151, 152 may be located on the first main surface 111 and the second main surface 112, respectively. The wall conductors 153, 154 may have their upper and lower ends connected to the film conductors 151, 152, respectively. The wall conductors 153, 154 may be multiple via conductors spaced apart in the front-to-rear direction. Even if the wall conductors 153, 154 are spaced apart in the front-to-rear direction, the spacing is narrow compared to the wavelength of the transmission signal, minimizing leakage of the transmission signal and functioning as a partition that confines the transmission signal to the transmission path. The front-to-rear spacing may be less than ¼ or ⅛ of the effective wavelength of the transmission signal. The film conductors 151, 152 and the wall conductors 153, 154 may be grounded. The waveguide 15 may have a shape symmetrical in the width direction. The waveguide 15 may have a shape symmetrical in the front-rear direction. The waveguide 15 may be configured to transmit a transmission signal in a mode other than the TEM mode.

[0015] The second signal line 14 may have a configuration similar to that of the first signal line 13, except that it is oriented in a different direction in the front-to-rear direction and is connected to the other end of the waveguide 15. Specifically, the second signal line 14 may be a microstrip line. The second signal line 14 may include a film conductor 142 located on the second main surface 112 of the base 11 and a signal conductor 141 located on the first main surface 111. The film conductor 142 of the second signal line 14 may be a ground potential surface and may be located over the entire second main surface 112 in the third section 230. The signal conductor 141 of the second signal line 14 may have a shape that is inverted in the front-to-rear direction from the signal conductor 131 of the first signal line 13. The second signal line 14 may be configured to transmit a transmission signal in a transverse electromagnetic (TEM) mode.

[0016] At the connection between the first signal line 13 and the waveguide 15, the signal conductor 131 of the first signal line 13 may be physically connected to the film conductor 151 of the waveguide 15. Similarly, the film conductor 132 of the first signal line 13 may be physically connected to the film conductor 152 of the waveguide 15. The first signal line 13 may be connected to the center of the waveguide 15 in the width direction. The same applies to the connection between the second signal line 14 and the waveguide 15.

[0017] <Signal Conductors 131, 141> FIG. 3 is a plan view showing details of the wiring board of the first embodiment. The signal conductor 131 may be a strip-shaped conductor extending in the front-rear direction. The signal conductor 131 may be located from the front end to the rear end of the first section 210. The signal conductor 131 may have a first end 131a connected to the waveguide 15, an inverse tapered portion 131b whose width gradually increases toward the first end 131a, and a linear portion 131c whose width is constant and located between the inverse tapered portion 131b and the first end 131a. The inverse tapered portion 131b may have a linearly increasing width or a gradually increasing nonlinearly increasing width. The remaining portion of the signal conductor 131 (i.e., the opposite side of the linear portion 131c across the inverse tapered portion 131b) may have a constant width. The signal conductor 131 may have a symmetrical shape in the width direction.

[0018] A configuration may be adopted in which no ground conductors such as wall conductors 153 and 154 (specifically, via conductors) are located in the ranges on both sides of the inverted tapered portion 131b and the straight portion 131c in the width direction. Specifically, the "ranges on both sides" refers to a range in the width direction centered on the signal conductor 131 and having a width at least equal to the width W15 of the waveguide 15, and also corresponds to a range between the film conductor 132 and the signal conductor 131 in the up-down direction. This range may be occupied by a dielectric, or a conductor other than a ground conductor may be located within the dielectric.

[0019] According to the wiring board 10 of the first embodiment, the inverse tapered portion 131b and the straight portion 131c described above make it possible to obtain favorable reflection characteristics and favorable transmission characteristics even in a high frequency band when a transmission signal changes from the TEM mode to another mode or vice versa between the first signal line 13 and the waveguide 15. Therefore, the wiring board 10 can be used at even higher frequencies.

[0020] The signal conductor 141 may have the same configuration as the signal conductor 131, except that it is oriented in the opposite direction to the signal conductor 131. That is, the signal conductor 141 may have an inverted tapered portion 141b and a straight portion 141c, just like the signal conductor 131. With this configuration, when a transmission signal changes from the TEM mode to another mode or vice versa between the second signal line 14 and the waveguide 15, good reflection characteristics and good transmission characteristics can be obtained even in high frequency bands. Therefore, the wiring board 10 can be made to operate at even higher frequencies.

[0021] <Transmission characteristics> Figures 4A and 4B are graphs showing the reflection and transmission characteristics of Examples 1a to 1c and Reference Example R1, which have different lengths of the straight portion 131c of the signal conductor 131. Figures 5A and 5B are graphs showing the reflection and transmission characteristics of Examples 1d to 1f and Reference Example R1, which have different lengths of the straight portion 131c of the signal conductor 131. Figure 6 is a graph comparing the worst values ​​of the reflection characteristics in the signal band.

[0022] The characteristics shown in Figures 4A, 4B, 5A, and 5B were obtained by simulation. In the simulation, the frequency band of the transmission signal was selected to be 150 GHz to 175 GHz. In the simulation, the reflection characteristics (denoted as "S11") and transmission characteristics (denoted as "S21") were calculated for multiple samples (referred to as "Embodiments 1a to 1f") with different lengths of the straight portion 131c of the signal conductor 131 and a sample (referred to as "Reference Example R1") without the straight portion 131c. The dimensions of the inverse tapered portion 131b in the front-rear and width directions were selected to obtain good characteristics according to the frequency band of the transmission signal and were standardized for all samples. The length L of the straight portion 131c (see Figure 3) was set to zero for Reference Example R1 and to the lengths indicated in the legend for Embodiments 1a to 1f. The second signal line 14 was the same as the first signal line 13. Embodiments 1a to 1f have the configuration of the aforementioned Embodiment 1.

[0023] 4A, 4B, 5A, and 5B, compared to Reference Example R1, which does not have the straight portion 131c, Embodiments 1a to 1e have good transmission characteristics with low reflection and high transmittance. Furthermore, Embodiment 1f, in which the straight portion 131c is as long as 150 μm, has transmission characteristics equivalent to Reference Example R1, which does not have the straight portion 131c.

[0024] 6, when comparing the worst values ​​of the reflection characteristics in the signal band, the worst values ​​of the reflection characteristics of the embodiments 1a to 1e were lower than that of the reference example R1. Furthermore, the worst value of the reflection characteristics was extremely small for the length of the straight portion 131c of the embodiment 1c.

[0025] <Comparative Examples> Figures 7A to 7C are plan views showing wiring boards 81 to 83 of Comparative Examples 1 to 3, respectively. Figures 8A and 8B show the reflection and transmission characteristics of wiring board 81 of Comparative Example 1, in which the lengths of reverse tapered portions 131b and 141b are different. Figures 9A and 9B show the reflection and transmission characteristics of wiring boards 82 and 83 of Comparative Examples 2 and 3. The legends in Figures 8A and 8B indicate the lengths of reverse tapered portions 131b and 141b in the front-to-rear direction in Comparative Example 1.

[0026] Wiring board 81 of Comparative Example 1 has signal conductors 131, 141 that have inverse tapered portions 131b, 141b but do not have straight portions 131c, 141c. Wiring board 82 of Comparative Example 2 has signal conductors 131, 141 with a constant line width. Wiring board 83 of Comparative Example 3 has a configuration in which the line width of signal conductors 131, 141 widens in a step-like manner to connect to waveguide 15. The step-widened portion of Comparative Example 3 has a configuration known as a λ / 4 transformer, and the length of the step-widened portion in the front-to-rear direction is λ / 4, where λ is the effective wavelength of the transmission signal.

[0027] 8A, even when the length of the reverse tapered portion 131b in the front-to-rear direction was adjusted, the worst value of the reflectance in the signal band was around −15 dB in the wiring board 81 of Comparative Example 1, and the transmission characteristics were lower than those of the wiring board 10 of Embodiment 1. Furthermore, as shown in FIGS. 9A and 9B, the wiring board 82 of Comparative Example 2 had very low transmission characteristics compared to the wiring board 10 of Embodiment 1, and the wiring board 83 of Comparative Example 3 had transmission characteristics equal to or lower than those of the wiring board 81 of Comparative Example 1.

[0028] As can be seen from the comparison with Comparative Examples 1 to 3, the wiring board 10 of the first embodiment has good transmission characteristics even in high frequency bands, and the wiring board 10 can be used at even higher frequencies.

[0029] <Detailed Example 1 of Signal Conductor 131> In the signal conductor 131, the length L (see FIG. 3) of the straight portion 131c may be expressed by the following formula (1): L ≦(3 / 16)×λ (1), where λ is the effective wavelength of the center frequency in the signal band, and so on. When the signal band is selected to be 150 GHz to 175 GHz as in the above simulation, (3 / 16)×λ is 134 μm, and the transmission characteristics of the configuration expressed by formula (1) correspond to the transmission characteristics in the range of 134 μm on the horizontal axis in the graph of FIG. 6. In the graph of FIG. 6, the configuration with the horizontal axis at 0 μm is the configuration of Reference Example R1, which does not have the straight portion 131c.

[0030] As can be seen from the graph of FIG. 6, the configuration of formula (1) makes it possible to obtain more suitable transmission characteristics in the high-frequency signal band.

[0031] <Detailed Example 2 of Signal Conductor 131> In the signal conductor 131, the length L of the straight portion 131c may be expressed by the following formula (2): (1 / 32)×λ ≦ L ≦ (3 / 16)×λ (2) When the signal band is selected to be 150 GHz to 175 GHz as in the above simulation, (1 / 32)×λ is 22 μm, and the transmission characteristics of the configuration expressed by formula (2) correspond to the transmission characteristics in the range of 22 μm to 134 μm on the horizontal axis in the graph of FIG.

[0032] As can be seen from the graph of FIG. 6, the configuration of equation (2) makes it possible to obtain more suitable transmission characteristics in the high-frequency signal band.

[0033] <Detailed Example 3 of Signal Conductor 131> In the signal conductor 131, the length L of the straight portion 131c may be expressed by the following formula (3): (1 / 12)×λ ≦ L ≦ (1 / 8)×λ (3) When the signal band is selected to be 150 GHz to 175 GHz as in the above simulation, (1 / 12)×λ is 59 μm, and (1 / 8)×λ is 89 μm, and the transmission characteristics of the configuration expressed by formula (3) correspond to the transmission characteristics in the range of 59 μm to 89 μm on the horizontal axis in the graph of FIG.

[0034] As can be seen from the graph of FIG. 6, the configuration of equation (3) makes it possible to obtain more suitable transmission characteristics in the high-frequency signal band.

[0035] 10A is a plan view showing a wiring board 10A according to a second embodiment of the present disclosure. FIG. 10B is an enlarged view of a main portion of the wiring board 10A. The wiring board 10A of the second embodiment may be the same as that of the first embodiment, except that the configuration of a portion of the waveguide 15 is different. The different configuration will be described in detail below.

[0036] The waveguide 15 of the second embodiment may have a second end 15 a connected to the signal line 13, an equal-width section 15 c in which the width of the signal transmission line is constant, and a wide section 15 b located between the equal-width section 15 c and the second end 15 a and in which the width of the signal transmission line is wider than that of the equal-width section 15 c.

[0037] The waveguide 15 may further have a third end 15e connected to the signal line 14, and a wide section 15d located between the equal-width section 15c and the third end 15e, in which the width of the signal transmission line is wider than that of the equal-width section 15c.

[0038] The wide sections 15b and 15d may be realized by widening the widthwise spacing of the wall conductors 153 and 154 (specifically, via conductors) more than that of the equal-width section 15c.

[0039] According to the wiring board 10A of the second embodiment, more preferable transmission characteristics can be obtained in the high-frequency signal band by the inverse tapered portion 131b and the straight portion 131c of the signal conductor 131 and the wide section 15b of the waveguide 15. Similarly, more preferable transmission characteristics can be obtained in the high-frequency signal band by the inverse tapered portion 141b and the straight portion 141c of the signal conductor 141 and the wide section 15d of the waveguide 15.

[0040] 11A and 11B are graphs showing the reflection and transmission characteristics of Examples 2a to 2c and Reference Example R2, in which the straight portion of the signal conductor has a different length. Figures 12A and 12B are graphs showing the reflection and transmission characteristics of Examples 2d to 2g, in which the straight portion of the signal conductor has a different length.

[0041] The characteristics shown in Figures 11A, 11B, 12A, and 12B were obtained by simulation. In the simulation, the frequency band of the transmission signal was selected to be 150 GHz to 175 GHz. In the simulation, the reflection and transmission characteristics were calculated for multiple samples (referred to as Examples 2a to 2g) in which the length of the straight portion 131c of the signal conductor 131 in the configuration of Example 2 was varied, and for a sample (referred to as Reference Example R2) that did not have the straight portion 131c. The longitudinal and widthwise dimensions of the inverted tapered portion 131b, as well as the width and length of the wide sections 15b and 15d, were selected to obtain good characteristics in accordance with the frequency band of the transmission signal and were standardized for all samples. The length L of the straight portion 131c (see Figure 10A) was set to zero for Reference Example R2 and to the lengths indicated in the legend for Examples 2a to 2g. The second signal line 14 was the same as the first signal line 13. The embodiments 2a to 2g have the configuration of the above-described embodiment 2.

[0042] 11A, 11B, 12A, and 12B, in Embodiments 2a to 2g in which the waveguide 15 has the wide sections 15b and 15d, the signal conductor 131 has the straight portion 131c, thereby achieving good transmission characteristics, as in Embodiment 1. That is, Embodiments 2a to 2f have good transmission characteristics with less reflection and higher transmittance than Reference Example R2, which does not have the straight portion 131c. Furthermore, Embodiment 2g, in which the straight portion 131c is as long as 150 μm, has transmission characteristics equivalent to Reference Example R2, which does not have the straight portion 131c.

[0043] The length L of the straight portion 131c (see FIG. 10A ) may satisfy formula (1) as in the first embodiment, and under this condition, good transmission characteristics with less reflection and higher transmittance are obtained compared to a configuration without the straight portion 131c. Also, formula (2) may be satisfied as in the first embodiment, and under this condition, good transmission characteristics with less reflection and higher transmittance are obtained compared to a configuration without the straight portion. Furthermore, formula (3) may be satisfied as in the first embodiment, and under this condition, good transmission characteristics with even less reflection and even higher transmittance are obtained compared to a configuration without the straight portion. L ≦(3 / 16)×λ (1) (1 / 32)×λ ≦L ≦(3 / 16)×λ (2) (1 / 12)×λ ≦L ≦(1 / 8)×λ (3)

[0044] 4A to 5B for the first embodiment and the graphs of FIGS. 11A to 12B for the second embodiment, particularly good transmission characteristics are obtained in the second embodiment, in which the length of the straight portion 131c is 87 μm. This configuration corresponds to the configuration that satisfies the condition of the above formula (3).

[0045] <Detailed Example of Waveguide 15> FIGS. 13A and 13B are graphs showing the reflection characteristics and transmission characteristics of Examples 2h to 2k and Reference Example R3, which have different lengths of the wide section of the waveguide.

[0046] The characteristics shown in Figures 13A and 13B were obtained by simulation. In the simulation, the frequency band of the transmission signal was selected to be 150 GHz to 175 GHz. In the simulation, the reflection and transmission characteristics were calculated for several samples (referred to as "Embodiments 2h to 2k") in which the width W15b of the wide sections 15b and 15d of the waveguide 15 in the configuration of Embodiment 2 was varied, and for a sample (referred to as "Reference Example R3") that did not have the wide sections 15b and 15d. The dimensions of the straight sections 131c and 141c and the inverse tapered sections 131b and 141b of the signal conductors 131 and 141, as well as the width W15c of the equal-width section 15c of the waveguide 15 and the lengths L15b and L15d of the wide sections 15b and 15d (see Figures 10A and 10B) were selected to obtain good characteristics in accordance with the frequency band of the transmission signal, and were the same for all samples. Specifically, the width W15c of the equal width section 15c of the waveguide 15 was set to 0.65 mm, and the lengths L15b and L15d of the wide sections 15b and 15d were set to 0.15 mm (<(1 / 3)×λ).

[0047] The widths W15b and W15d of the wide sections 15b and 15d (see FIG. 10A) were set to 0.65 mm, the same as the width W15c of the equal-width section 15c in Reference Example R3, and the widths in Examples 2h to 2k were set to the widths shown in the legend. Examples 2h to 2k have the configuration of Example 2 described above.

[0048] The width W15c of the equal-width section 15c of the waveguide 15 and the widths W15b and W15d of the wide sections 15b and 15d may satisfy the conditions of the following equations (4) and (5). W15b / W15c = 1.07 to 1.15 (4) W15d / W15c = 1.07 to 1.15 (5) When the width W15c of the equal-width section 15c is 0.65 mm, the widths W15b and W15d correspond to 0.7 mm to 0.75 mm. As shown in the graphs of Figures 13A and 3B, satisfying the above conditions results in good transmission characteristics with low reflection and high transmittance.

[0049] In the above simulation, the lengths L15b and L15d of the wide sections 15b and 15d were selected to be 0.15 mm, a value that provides good characteristics in accordance with the frequency band of the transmission signal. However, because the wide sections 15b and 15d are configured to provide a good effect when the signal transmission mode changes, the lengths L15b and L15d may also satisfy the following conditions (6 and 7): L15b < (1 / 3) × λ (6) L15d < (1 / 3) × λ (7) Under these conditions, the wide sections 15b and 15d can provide good characteristics in accordance with the frequency band of the transmission signal.

[0050] Although the wiring boards 10 and 10A of the first and second embodiments have been described above, the wiring boards of the present disclosure are not limited to the configurations of the first and second embodiments. For example, in the first and second embodiments, the wall conductors 153 and 154 of the waveguide 15 are pseudo-conductor walls in which multiple via conductors are arranged at intervals. However, as the wall conductors 153 and 154, via conductors having a long hole shape in a planar view may be used instead of via conductors having a circular shape in a planar view, or film-shaped, wall plate-shaped, or block-shaped conductors that separate the transmission path from the sides may be used. Furthermore, while the wall conductors 153 are shown having multiple rows of via conductors, one wall conductor 153 in the width direction may have only a single row of via conductors. The same applies to the other wall conductor 154 in the width direction. However, having multiple rows of via conductors allows the film-shaped conductors 151 and 152 to be sufficiently grounded, contributing to good transmission characteristics. Furthermore, one or both of the film conductors 151, 152 of the waveguide 15 may be positioned in a range that covers the transmission line from above and below rather than the entire second section 220, but may not be positioned in part or all of the range that is vertically out of the transmission line. Furthermore, in the above-described first and second embodiments, the signal lines 13, 14 and the waveguide 15 have a symmetrical structure in the width direction. However, one or more of the signal lines 13, 14 and the waveguide 15 may have an asymmetrical structure in the width direction. However, a symmetrical structure can achieve better transmission characteristics.

[0051] 14A to 14D and 15A to 15D are schematic diagrams illustrating variations in the vertical arrangement of the first signal line 13, the waveguide 15, and the second signal line 14. Fig. 14A is a side view of the wiring boards 10 and 10A according to the first and second embodiments, Fig. 14B is a cross-sectional view taken along line B-B in Fig. 14A, Fig. 14C is a side view of the wiring board 10B according to the third embodiment of the present disclosure, and Fig. 14D is a cross-sectional view taken along line D-D in Fig. 14C. Fig. 15A is a side view of the wiring board 10C according to the fourth embodiment of the present disclosure, Fig. 15B is a cross-sectional view taken along line B-B in Fig. 15A, Fig. 15C is a side view of the wiring board 10D according to the fifth embodiment of the present disclosure, and Fig. 15D is a cross-sectional view taken along line D-D in Fig. 15C.

[0052] In the above-described first and second embodiments, as shown in Figures 14A and 14B, the signal lines 13, 14, and the waveguide 15 have the same thickness and are located in the same layer of the substrate 11. However, any of the signal lines 13, 14, and the waveguide 15 may have a different thickness, or the first signal line 13 and the waveguide 15 may be located at different heights in the vertical direction and connected to each other. Similarly, the waveguide 15 and the second signal line 14 may be located at different heights in the vertical direction and connected to each other. The above phrase "located in a layer" means located from the top to the bottom of the layer, but "located in a layer" also encompasses a state in which the signal lines 13, 14, and the waveguide 15 are located within a certain height range within the layer.

[0053] 14C and 14D is an example in which signal lines 13 and 14 are located across the first layer 117 and the second layer 118 of the base 11, and the waveguide 15 is located on the first layer 117 of the base 11. Although not particularly limited, Fig. 14C shows an example in which conductive films are present on both side surfaces of the waveguide 15, and conductive films are not present on the side surfaces of the signal lines 13 and 14.

[0054] The wiring board 10C of embodiment 4 shown in Figures 15A and 15B is an example in which the signal lines 13 and 14 are located on the first layer 117 of the base 11, and the waveguide 15 is located across the first layer 117 and the second layer 118 of the base 11.

[0055] 15C and 15D is an example in which the thickness of the base 11 is different between the section for the signal lines 13 and 14 and the section for the waveguide 15. The signal lines 13 and 14 may be located on the second layer 118, and the waveguide 15 may be located across the first layer 117 and the second layer 118.

[0056] In the above-described embodiments 1 to 5, a configuration is shown in which the waveguide 15 is sandwiched between the first signal line 13 and the second signal line 14 in the front-to-rear direction, but this configuration is not limited to this, and the wiring board may have at least one signal line and one waveguide that are connected to each other.

[0057] (Electronic component storage package and electronic device) Fig. 16 is an exploded perspective view showing an electronic component storage package and an electronic device according to an embodiment of the present disclosure. Fig. 17 is a plan view showing an electronic component storage package and an electronic device according to an embodiment of the present disclosure.

[0058] The electronic component storage package 300 of this embodiment includes the wiring substrate 10 of embodiment 1. Instead of the wiring substrate 10, the wiring substrates 10A to 10D of the other embodiments may be applied. The electronic component storage package 300 may have a recess 310 that stores an electronic component 410 and a lid 320 that closes the opening of the recess 310. The wiring substrate 10 may be located in a through hole 312 that is located in a part of the side wall of the recess 310. The through hole 312 leads from the inside to the outside of the recess 310. One end of the signal transmission path of the wiring substrate 10 may be located inside the recess 310, and the other end may be located outside the recess 310. The side wall of the recess 310 may be a conductor and may be in contact with a film conductor 151 of the wiring substrate 10 and be grounded. In the wiring substrate 10, the film conductors 132, 151, 152, and 142 may be bonded to the inner surface of the through hole 312 via a bonding material to close the through hole 312. The wiring board 10 may also have a film conductor on the side surface, and the film conductor may be bonded to the inner surface of the through hole 312 via a bonding material to close the through hole 312. This configuration ensures high airtightness of the through hole 312. However, good high-frequency characteristics of the wiring board 10 can be obtained even without the film conductor on the side surface. The film conductor on the side surface may be located in the range facing the inner surface of the through hole 312, i.e., in the range of the waveguide 15. Specifically, the film conductor on the side surface may be located over the entire side surface of the wiring board 10, or may be located in the range of the waveguide 15 but not in the range of the signal lines 13 and 14.

[0059] The electronic component storage package 300 may have a plurality of wiring substrates 10. The electronic component storage package 300 may have a substrate 330 that transmits other signals, such as a power supply voltage, between the outside and inside of the recess 310.

[0060] The electronic device 400 of this embodiment includes an electronic component storage package 300 and an electronic component 410 stored in the electronic component storage package 300. The electronic component 410 may be configured to input and / or output high-frequency signals. A high-frequency signal terminal of the electronic component 410 may be connected to the signal conductor 131 of the signal line 14 of the wiring board 10 via a connecting conductor.

[0061] The electronic component storage package of the present disclosure is not limited to the above example. For example, the wiring board may be disposed in a recess that stores an electronic component and configured to transmit high-frequency signals within the recess.

[0062] Although the embodiments of the present disclosure have been described above, the wiring board, electronic component storage package, and electronic component of the present disclosure are not limited to the above-described embodiments, and the details shown in the embodiments can be modified as appropriate without departing from the spirit of the invention.

[0063] An embodiment of the present disclosure is described below. In the embodiment, (1) a wiring board includes: a base; a signal conductor located on the base; and a waveguide-type waveguide located on the base, wherein the signal conductor has a first end connected to the waveguide, an inverse tapered portion whose line width gradually increases toward the first end, and a linear portion whose line width is constant and located between the inverse tapered portion and the first end.

[0064] (2) In the wiring board of (1) above, the length L of the straight portion satisfies L≦(3 / 16)×λ, where λ is the effective wavelength of the center frequency in the signal band.

[0065] (3) In the wiring board of (1) above, the length L of the straight portion satisfies (1 / 32)×λ≦L≦(3 / 16)×λ, where λ is the effective wavelength of the center frequency in the signal band.

[0066] (4) In the wiring board of (1) above, the length L of the straight portion satisfies (1 / 12)×λ≦L≦(1 / 8)×λ, where λ is the effective wavelength of the center frequency in the signal band.

[0067] (5) The wiring board of any one of (1) to (4) above further comprises a solid ground conductor located on the base and facing the signal conductor in the vertical direction, and no ground conductor is located on either side of the reverse tapered portion and the straight portion in the width direction within a range of width equal to at least the width of the waveguide with the signal conductor at the center, and between the solid ground conductor and the signal conductor in the vertical direction.

[0068] (6) In the wiring board of any one of (1) to (5) above, the waveguide has a second end connected to the signal conductor, a constant-width section in which the width of the signal transmission path is constant, and a wide section located between the constant-width section and the second end and in which the width of the signal transmission path is wider than the constant-width section.

[0069] (7) A package for storing electronic components includes the wiring substrate according to any one of (1) to (6) above.

[0070] (8) An electronic device includes: the electronic component storage package according to (7); and an electronic component stored in the electronic component storage package.

[0071] The present disclosure can be used for wiring boards, packages for housing electronic components, and electronic devices.

[0072] 10, 10A to 10D Wiring board 11 Base 13, 14 Signal line 15 Waveguide 15a Second end 15b, 15d Wide section 15c Equal width section 15e Third end 111 First main surface 112 Second main surface 117 First layer 118 Second layer 131, 141 Signal conductor 131a, 141a First end 131b, 141b Reverse tapered section 131c, 141c Straight section 132, 142 Film conductor 151, 152 Film conductor 153, 154 Wall conductor 210 First section 220 Second section 230 Third section 300 Electronic component storage package 330 Substrate 400 Electronic device 410 Electronic component L Length of straight section L15b, L15d: Length of wide section W15, W15b to W15d: Width

Claims

1. A wiring board comprising: a base; a signal conductor located on the base; and a waveguide-type waveguide located on the base, wherein the signal conductor has a first end connected to the waveguide, an inverse tapered portion whose line width gradually increases toward the first end, and a straight portion whose line width is constant and located between the inverse tapered portion and the first end.

2. The wiring board according to claim 1, wherein the length L of the straight line portion is L≦(3 / 16)×λ, where λ is the effective wavelength of the center frequency in the signal band.

3. The wiring board according to claim 1, wherein the length L of the straight line portion satisfies the following relationship: (1 / 32) x λ ≦ L ≦ (3 / 16) x λ, where λ is the effective wavelength of the center frequency in the signal band.

4. The wiring board according to claim 1, wherein the length L of the straight line portion satisfies (1 / 12) x λ ≦ L ≦ (1 / 8) x λ, where λ is the effective wavelength of the center frequency in the signal band.

5. A wiring board as described in any one of claims 1 to 4, further comprising a solid ground conductor located within the base or on the surface of the base and facing the signal conductor in the vertical direction, wherein no ground conductor is located on either side of the reverse tapered portion and the straight portion in the width direction within a range of width at least equal to the width of the waveguide with the signal conductor at the center, and between the solid ground conductor and the signal conductor in the vertical direction.

6. A wiring board as claimed in any one of claims 1 to 5, wherein the waveguide has: a second end connected to the signal conductor; an equal-width section in which the width of the signal transmission path is constant; and a wide section located between the equal-width section and the second end and in which the width of the signal transmission path is wider than the equal-width section.

7. A package for storing electronic components, comprising the wiring board according to any one of claims 1 to 6.

8. An electronic device comprising: the electronic component storage package according to claim 7; and an electronic component stored in the electronic component storage package.

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