Electronic device comprising frame, and method for manufacturing frame

Abstract

An electronic device according to one embodiment comprises a display and a frame. The frame comprises: an edge part formed of a first metal material and defining a side exterior surface of the electronic device; a bracket formed of a second metal material different from the first metal material; and a clad metal disposed between the edge part and the bracket to couple the edge part and the bracket, and including a first layer, a second layer, and a plurality of concave portions. The first layer is formed of the first metal material, the second layer is formed of the second metal material, and the plurality of concave portions are interlocked with a plurality of convex portions of the bracket.

Description

Electronic device including a frame and method for manufacturing the frame

[0001] The present disclosure relates to an electronic device including a frame and a method for manufacturing the frame.

[0002] An electronic device may include a housing assembly defining at least a portion of an exterior appearance. The housing assembly may include a frame and a rear cover. The frame may include an edge part defining a side surface of the electronic device and a bracket wrapped around the frame. The bracket may support components located within the electronic device (e.g., a battery, a printed circuit board). The bracket may be coupled to the frame. To provide rigidity to the housing assembly, the frame and the bracket may include a metal material. For example, the metal material may include titanium, stainless steel, aluminum, and / or magnesium. The frame and the bracket may include different metal materials.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0004] An electronic device is provided. The electronic device may include a display. The electronic device may include a frame supporting at least a portion of the display. The frame may include an edge portion formed of a first metal material and defining a side exterior surface of the electronic device. The frame may include a bracket formed of a second metal material different from the first metal material, the bracket including a plurality of convex portions, and surrounded by the edge portion. The frame may include a clad metal disposed between the edge portion and the bracket, the clad metal connecting the bracket to the edge portion. The clad metal may include a first layer formed of the first metal material and connected to the edge portion. The clad metal may include a second layer laminated on the first layer, formed of the second metal material, and connected to the bracket. The clad metal may be formed by removing a portion of the second layer, exposing a portion of the first layer, and may include a plurality of concave portions interlocked with the plurality of convex portions.

[0005] A method of manufacturing a frame used for an electronic device is provided. The method may include providing a clad metal comprising a first layer formed of a first metal material and a second layer formed of a second metal material, the first layer being laminated on the first layer. The method may include removing a portion of the second layer to form a plurality of recesses exposing a portion of the first layer in a direction facing the second layer. The method may include contacting the first layer with an inner surface of an edge part formed of the first metal material. The method may include forming a first intermediate structure comprising the edge part joined to the first layer by irradiating an electron beam to the portion of the first layer exposed through the plurality of recesses. The method may include seating the first intermediate structure within a cavity of a die. The method may include casting a second metal material in a liquid state into the cavity of the die. In the above operation, the second metal material in a liquid state can be introduced into the plurality of concave portions. The manufacturing method may include an operation of forming a second intermediate structure including a bracket coupled to the second layer by casting the second metal material in a liquid state and then solidifying the second metal material in a liquid state. The manufacturing method may include an operation of separating the second intermediate structure from the die. The manufacturing method may include an operation of filling a gap between the edge part and the bracket with an injection part.

[0006] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.

[0007] Figure 2 illustrates an electronic device according to an exemplary embodiment.

[0008] Figure 3 is an exploded perspective view of an electronic device according to an exemplary embodiment.

[0009] FIG. 4A illustrates an electronic device according to an exemplary embodiment.

[0010] Figure 4b illustrates an edge part of a frame according to an exemplary embodiment.

[0011] Figure 4c illustrates a bracket of a frame according to an exemplary embodiment.

[0012] FIG. 5A illustrates a frame of an electronic device according to an exemplary embodiment.

[0013] Figure 5b is an enlarged view of area A of Figure 5a.

[0014] FIG. 5c is a cross-sectional view of an exemplary electronic device taken along line BB' of FIG. 5b.

[0015] Figure 6 is a flowchart showing a method for manufacturing a frame according to an exemplary embodiment.

[0016] Figure 7a illustrates a clad metal according to an exemplary embodiment.

[0017] Figure 7b illustrates the process in which the clad metal comes into contact with the inner surface of the edge part.

[0018] Figure 7c illustrates the electron beam welding process.

[0019] Figure 7d illustrates a first intermediate structure formed by bonding a first layer of clad metal to the inner surface of an edge part.

[0020] Figure 7e illustrates a process for manufacturing a bracket according to an exemplary embodiment.

[0021] Figure 7f illustrates a second intermediate structure.

[0022] Figures 7g, 7h, and 7i illustrate the process of injecting resin into the gap between the edge part and the bracket.

[0023] FIGS. 8A and 8B illustrate a plurality of recesses according to various embodiments.

[0024] FIG. 1 is a block diagram of an electronic device within a network environment, according to one embodiment.

[0025] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0026] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0027] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0028] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0029] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0030] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0031] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0032] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0033] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0034] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0035] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) to an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0036] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0037] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0038] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0039] The power management module (188) can manage the power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0040] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0041] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0042] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0043] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0044] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0045] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0046] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0047] Figure 2 illustrates an electronic device according to an exemplary embodiment.

[0048] Referring to FIG. 2, an electronic device (101) according to an exemplary embodiment may include a housing assembly (210) forming an exterior of the electronic device (101). For example, the housing assembly (210) may include a first side (or front side) (200A), a second side (or back side) (200B), and a third side (or side side) (200C) surrounding a space between the first side (200A) and the second side (200B).

[0049] An electronic device (101) according to an exemplary embodiment may include a display (e.g., a display module (160) of FIG. 1). The display (201) may include a substantially transparent window (e.g., a window (201b) of FIG. 3). The window (201b) may form at least a portion of the first surface (200A). For example, the window (201b) may include, but is not limited to, a glass plate or a polymer plate including various coating layers.

[0050] An electronic device (101) according to an exemplary embodiment may include a substantially opaque rear cover (211). According to an exemplary embodiment, the rear cover (211) may form at least a portion of the second surface (200B). According to an exemplary embodiment, the rear cover (211) may be formed of coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials.

[0051] An electronic device (101) according to an exemplary embodiment may include a peripheral part (218). The peripheral part (218) may be combined with the window (201b) and / or the rear cover (211) to form at least a portion of a third side (200C) of the electronic device (101). For example, the peripheral part (218) may form the entire third side (200C) of the electronic device (101). For example, the peripheral part (218) may form the third side (200C) of the electronic device (101) together with the window (201b) and / or the rear cover (211).

[0052] An electronic device (101) according to an exemplary embodiment may include at least one of a display (201), an audio module (203, 204, 207), a sensor module (not shown), a camera module (205, 212, 213), a key input device (217), a light-emitting element (not shown), and / or a connector hole (208). According to an exemplary embodiment, the electronic device (101) may omit at least one of the above components (e.g., the key input device (217) or the light-emitting element (not shown)), or may additionally include other components.

[0053] According to an exemplary embodiment, at least a portion of the display (201) may be viewed through a window (201b) forming the first surface (200A). According to an exemplary embodiment, the display (201) may include a display panel (e.g., display panel (201a) of FIG. 3) disposed on the back surface of the window (201b).

[0054] According to an exemplary embodiment, the display (201) may include a display area (201A). According to an exemplary embodiment, the display (201) may provide visual information to a user through the display area (201A).

[0055] According to an exemplary embodiment, the display area (201A) may include a sensing area (201B) configured to acquire biometric information of the user. Here, the meaning of "the display area (201A) includes the sensing area (201B)" may be understood to mean that at least a portion of the sensing area (201B) may overlap the display area (201A). For example, the sensing area (201B) may be an area capable of displaying visual information by the display (201) like other areas of the display area (201A) and additionally capable of acquiring biometric information of the user (e.g., a fingerprint). According to an exemplary embodiment, the sensing area (201B) may also be formed in the key input device (217).

[0056] According to an exemplary embodiment, the display (201) may include an area where a first camera module (205) (e.g., camera module (180) of FIG. 1) is positioned. According to an exemplary embodiment, an opening is formed in the area of ​​the display (201), and the first camera module (205) (e.g., a punch hole camera) may be at least partially positioned within the opening so as to face the first surface (200A). In this case, the display area (201A) may surround at least a portion of an edge of the opening. According to an exemplary embodiment, the first camera module (205) (e.g., an under display camera (UDC)) may be positioned under the display (201) so as to overlap the area of ​​the display (201). In this case, the display (201) can provide visual information to the user through the above area, and additionally, the first camera module (205) can obtain an image corresponding to the direction toward the first surface (200A) through the above area of ​​the display (201).

[0057] According to an exemplary embodiment, the display (201) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field-type stylus pen.

[0058] According to an exemplary embodiment, the audio module (203, 204, 207) (e.g., the audio module (170) of FIG. 1) may include a microphone hole (203, 204) and / or a speaker hole (207).

[0059] According to an exemplary embodiment, the microphone holes (203, 204) may include a first microphone hole (203) formed in a portion of the third surface (200C) and / or a second microphone hole (204) formed in a portion of the second surface (200B). A microphone (not shown) for acquiring external sound may be arranged inside the microphone holes (203, 204). The microphone may include a plurality of microphones so as to detect the direction of the sound.

[0060] According to an exemplary embodiment, the second microphone hole (204) formed in a portion of the second surface (200B) may be positioned adjacent to the camera module (205, 212, 213). For example, the second microphone hole (204) may acquire sound according to the operation of the camera module (205, 212, 213). However, the present invention is not limited thereto.

[0061] According to an exemplary embodiment, the speaker hole (207) may include an external speaker hole (207) and a call receiver hole (not shown). The external speaker hole (207) may be formed in a part of the third surface (200C) of the electronic device (101). According to an exemplary embodiment, the external speaker hole (207) may be implemented as a single hole together with the microphone hole (203). Although not shown, the call receiver hole (not shown) may be formed in another part of the third surface (200C). For example, the call receiver hole may be formed on the opposite side of the external speaker hole (207) on the third surface (200C). For example, based on the city of FIG. 2, the external speaker hole (207) may be formed on the third surface (200C) corresponding to the lower part of the electronic device (101), and the call receiver hole may be formed on the third surface (200C) corresponding to the upper part of the electronic device (101). However, this is not limited thereto, and according to an exemplary embodiment, the call receiver hole may be formed at a location other than the third surface (200C). For example, the call receiver hole may be formed by a spaced space between the display (201) and the edge part (218).

[0062] According to an exemplary embodiment, the electronic device (101) may include at least one speaker (not shown) configured to output sound to the outside of the housing assembly (210) through an external speaker hole (207) and / or a call receiver hole (not shown).

[0063] According to an exemplary embodiment, a sensor module (not shown) (e.g., sensor module (176) of FIG. 1) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. For example, the sensor module may include at least one of a proximity sensor, an HRM sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0064] According to an exemplary embodiment, a camera module (205, 212, 213) (e.g., camera module (180) of FIG. 1) may include a first camera module (205) arranged to face a first side (200A) of an electronic device (101), a second camera module (212) arranged to face a second side (200B), and a flash (213).

[0065] According to an exemplary embodiment, the second camera module (212) may include multiple cameras (e.g., dual cameras, triple cameras, or quad cameras). However, the second camera module (212) is not necessarily limited to including multiple cameras and may include a single camera.

[0066] According to an exemplary embodiment, the first camera module (205) and the second camera module (212) may include one or more lenses, image sensors, and / or image signal processors.

[0067] According to an exemplary embodiment, the flash (213) may include, for example, a light-emitting diode or a xenon lamp. According to an exemplary embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (101).

[0068] According to an exemplary embodiment, a key input device (217) (e.g., input module (150) of FIG. 1) may be disposed on a third side (200C) of the electronic device (101). According to an exemplary embodiment, the electronic device (101) may not include some or all of the key input devices (217), and the key input devices (217) that are not included may be implemented in another form, such as a soft key, on the display (201).

[0069] According to an exemplary embodiment, a connector hole (208) may be formed on the third surface (200C) of the electronic device (101) so that a connector of an external device can be accommodated. A connection terminal (e.g., a connection terminal (178) of FIG. 1) electrically connected to the connector of the external device may be arranged within the connector hole (208). The electronic device (101) according to an exemplary embodiment may include an interface module (e.g., an interface (177) of FIG. 1) for processing an electrical signal transmitted and received through the connection terminal.

[0070] According to an exemplary embodiment, the edge part (218) may include a vent hole (206). For example, air outside the housing assembly (210) may be introduced into the housing assembly (210) through the vent hole (206). For example, air inside the housing assembly (210) may be discharged out of the housing assembly (210) through the vent hole (206). The location of the vent hole (206) is not limited to the location illustrated in FIG. 2.

[0071] According to an exemplary embodiment, the electronic device (101) may include a light-emitting element (not shown). For example, the light-emitting element (not shown) may be disposed on a first surface (200A) of the housing assembly (210). The light-emitting element (not shown) may provide status information of the electronic device (101) in the form of light. According to an exemplary embodiment, the light-emitting element (not shown) may provide a light source that is linked to the operation of the first camera module (205). For example, the light-emitting element (not shown) may include an LED, an IR LED, and / or a xenon lamp.

[0072] Figure 3 is an exploded perspective view of an electronic device according to an exemplary embodiment.

[0073] In the following, redundant descriptions of configurations having the same reference numerals as the configurations described above are omitted.

[0074] Referring to FIG. 3, an electronic device (101) according to an exemplary embodiment may include an edge part (218), a bracket (243), a printed circuit board (250), a cover plate (260), and / or a battery (270). The printed circuit board (250) may include a first printed circuit board (251), which is a main board, and a second printed circuit board (252), which is a sub board.

[0075] An electronic device (101) according to an exemplary embodiment may include an edge part (218) forming an exterior of the electronic device (101) (e.g., a third surface (200C) of FIG. 2) and a bracket (243) coupled to an inner side of the edge part (218). According to an exemplary embodiment, the edge part (218) and the bracket (243) may be positioned between a display (201) and a rear cover (211). For example, the edge part (218) may surround a space between the rear cover (211) and the display (201). A window (201b) may be attached to the edge part (218).

[0076] According to an exemplary embodiment, the bracket (243) may support or accommodate other components included in the electronic device (101). For example, a display (201) may be disposed on one side of the bracket (243) facing one direction (e.g., +z direction), and a portion of the display (201) may be supported by the bracket (243). For example, a first printed circuit board (251), a second printed circuit board (252), a battery (270), and a second camera module (212) may be disposed on the other side of the bracket (243) facing the opposite direction (e.g., -z direction). For example, the first printed circuit board (251), the second printed circuit board (252), the battery (270), and the second camera module (212) may be respectively seated in recesses defined by the edge part (218) and / or the bracket (243).

[0077] According to an exemplary embodiment, the first printed circuit board (251), the second printed circuit board (252), and the battery (270) may be respectively coupled to the bracket (243). For example, the first printed circuit board (251) and the second printed circuit board (252) may be fixedly disposed on the bracket (243) through a coupling member such as a screw. For example, the battery (270) may be fixedly disposed on the bracket (243) through an adhesive member (e.g., double-sided tape). However, the present invention is not limited to the above-described examples.

[0078] According to an exemplary embodiment, the cover plate (260) may be disposed between the first printed circuit board (251) and the rear cover (211). According to an exemplary embodiment, the cover plate (260) may be disposed on the first printed circuit board (251). For example, the cover plate (260) may be disposed on a surface of the first printed circuit board (251) facing the -z direction.

[0079] According to an exemplary embodiment, the cover plate (260) may at least partially overlap the first printed circuit board (251) with respect to the z-axis. According to an exemplary embodiment, the cover plate (260) may cover at least a portion of the first printed circuit board (251). Through this, the cover plate (260) may protect the first printed circuit board (251) from physical impact or prevent detachment of a connector coupled to the first printed circuit board (251).

[0080] According to an exemplary embodiment, the cover plate (260) may be fixedly arranged to the first printed circuit board (251) via a joining member (e.g., a screw), or may be coupled to the bracket (243) together with the first printed circuit board (251) via the joining member.

[0081] According to an exemplary embodiment, the display (201) may be positioned between a bracket (243) and a window (201b). For example, the window (201b) may be positioned on one side (e.g., in the +z direction) of the display panel (201a), and the bracket (243) may be positioned on the other side (e.g., in the -z direction).

[0082] According to an exemplary embodiment, the window (201b) may be coupled with the display panel (201a). For example, the window (201b) and the display panel (201a) may be adhered to each other through an optical adhesive material (e.g., optically clear adhesive (OCA) or optically clear resin (OCR)) interposed therebetween.

[0083] According to an exemplary embodiment, the window (201b) may be coupled with the edge part (218). For example, the window (201b) may include an outer portion extending outside the display (201) when viewed in the z-axis direction, and may be adhered to the edge part (218) through an adhesive member (e.g., waterproof tape) disposed between the outer portion of the window (201b) and the edge part (218). However, the present invention is not limited to the above-described example.

[0084] According to an exemplary embodiment, a processor (e.g., processor (120) of FIG. 1), a memory (e.g., memory (130) of FIG. 1), and / or an interface (e.g., interface (177) of FIG. 1) may be disposed on the first printed circuit board (251) and / or the second printed circuit board (252). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector. According to an exemplary embodiment, the first printed circuit board (251) and the second printed circuit board (252) may be operatively or electrically connected to each other via a connecting member (e.g., a flexible printed circuit board).

[0085] According to an exemplary embodiment, a battery (270) (e.g., battery (189) of FIG. 1 ) may power at least one component of the electronic device (101). For example, the battery (270) may include a rechargeable secondary battery or a fuel cell. At least a portion of the battery (270) may be disposed substantially coplanar with the first printed circuit board (251) and / or the second printed circuit board (252).

[0086] An electronic device (101) according to an exemplary embodiment may include an antenna module (not shown) (e.g., antenna module (197) of FIG. 1). According to an exemplary embodiment, the antenna module may be disposed between a rear cover (211) and a battery (270). The antenna module may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna module may, for example, perform short-range communication with an external device or wirelessly transmit and receive power with an external device.

[0087] According to an exemplary embodiment, a first camera module (205) (e.g., a front camera) may be positioned on at least a portion of the bracket (243) such that the lens can receive external light through a portion (e.g., the camera area (237)) of the window (201b) (e.g., the front (200A) of FIG. 2).

[0088] According to an exemplary embodiment, a second camera module (212) (e.g., a rear camera) may be disposed between the bracket (243) and the rear cover (211). According to an exemplary embodiment, the second camera module (212) may be electrically connected to the first printed circuit board (251) via a connecting member (e.g., a connector). According to an exemplary embodiment, the second camera module (212) may be disposed such that a lens can receive external light through the camera area (284) of the rear cover (211) of the electronic device (101).

[0089] According to an exemplary embodiment, the camera area (284) may be formed on a surface of the rear cover (211) (e.g., the rear surface (200B) of FIG. 2). According to an exemplary embodiment, the camera area (284) may be formed to be at least partially transparent so that external light may be incident on the lens of the second camera module (212). According to an exemplary embodiment, at least a portion of the camera area (284) may protrude from the surface of the rear cover (211) by a predetermined height. However, the present invention is not limited thereto, and according to an exemplary embodiment, the camera area (284) may form a substantially same plane as the surface of the rear cover (211).

[0090] According to an exemplary embodiment, the housing assembly (210) of the electronic device (101) may refer to a configuration or structure that forms at least a portion of the exterior of the electronic device (101). In this respect, at least a portion of the window (201b), the edge part (218), the bracket (243), and / or the rear cover (211) that form the exterior of the electronic device (101) may be referred to as the housing assembly (210) of the electronic device (101).

[0091] The electronic device (101) described below may include a housing assembly (210) comprising dissimilar metals. According to an exemplary embodiment, the edge part (218) may include a first metal material, and the bracket (243) may include a second metal material. In the examples described below, the first metal is described as titanium or zinc, and the second metal is described as aluminum, but is not limited thereto.

[0092] Fig. 4a illustrates an electronic device according to an exemplary embodiment. Fig. 4b illustrates an edge part of a frame according to an exemplary embodiment. Fig. 4c illustrates a bracket of a frame according to an exemplary embodiment.

[0093] An electronic device (101) according to an exemplary embodiment may include a display (201) and a frame (300).

[0094] According to an exemplary embodiment, the display (201) may be configured to display visual information. The display (201) may include a display panel (e.g., the display panel (201a) of FIG. 3) and a window (e.g., the window (201b) of FIG. 3). For example, the electronic device (101) may include a display driver integrated circuit (DDI) configured to control the display (201). The display driver circuit may be configured to control a plurality of pixels included in the display panel (201a) to display visual information through the display (201). The window (201b) may be disposed at the outermost portion of the display (201) to protect the display (201). The window (201b) may include a substantially transparent material so that the visual information displayed through the display (201) may be viewed from the outside. The window (201b) may be attached to the display panel (201a).

[0095] According to an exemplary embodiment, the frame (300) may support the display (201). For example, the edge of the window (201b) may be attached to the edge of the frame (300). The frame (300) may be positioned below (e.g., in the -z direction) the display (201). According to an exemplary embodiment, the frame (300) may include an edge part (218) and a bracket (243). A rear cover (e.g., the rear cover (211) of FIG. 3) may be coupled below (e.g., in the -z direction) the frame (300). The rear cover (211) may define the back of the electronic device (101). The rear cover (211) may be opposite to the display (201).

[0096] According to an exemplary embodiment, the edge part (218) may at least partially define a side surface (200C) of the electronic device (101). The edge part (218) may be referred to as a side bezel, or a side structure, in terms of defining the side surface (200C) of the electronic device (101).

[0097] According to an exemplary embodiment, the bracket (243) may be surrounded by the edge part (218). For example, the bracket (243) may be coupled to the inner surface of the frame (300). The bracket (243) may be configured to support components of the electronic device (101). For example, electronic components such as a printed circuit board (e.g., printed circuit board (250) of FIG. 3) and a battery (e.g., battery (270) of FIG. 3) may be supported by the bracket (243) by being placed on the bracket (243). The bracket (243) may be referred to as a support member, a support part, or a support plate from the perspective of supporting the components of the electronic device (101). The gap between the edge part (218) and the bracket (243) may be filled with an injection part (310).

[0098] Referring to FIG. 4B, the edge part (218) may have a shape including a hollow space therein. At least a portion of the edge part (218) may include one or more conductive portions (410) to function as an antenna radiator used for communication with an external electronic device (101).

[0099] When one or more conductive portions (410) operate as antenna radiators, the resonant frequency of a signal transmitted and / or received through one or more conductive portions (410) can be determined based on the electrical length of one or more conductive portions (410). For example, when the wavelength corresponding to the resonant frequency of the signal is w, the electrical length of one or more conductive portions (410) for transmitting and / or receiving a signal having the resonant frequency can be 1 / 4w to 1 / 2w.

[0100] To adjust the electrical length of one or more conductive portions (410), the edge part (218) may include a slot (or slit) (415). The slot (or slit) (415) may be filled with a non-conductive material to determine the electrical length of one or more conductive portions (410) that act as an antenna radiator. The slot (415) may electrically isolate one or more conductive portions (410) from other conductive portions. When the slot (or slit) (415) is filled with a non-conductive material, one or more non-conductive portions (e.g., one or more non-conductive portions (420) of FIG. 7i) that contact one or more conductive portions (410) may be formed.

[0101] According to an exemplary embodiment, the edge part (218) may be exposed to the outside of the electronic device (101) because it at least partially defines the side surface (200C) of the electronic device (101). The edge part (218) may be required to have relatively high strength, hardness, and excellent surface properties in order to protect components disposed inside the electronic device (101) from external impact. If the strength of the edge part (218) is low, the electronic device (101) may be easily damaged by external impact, thereby causing damage to the electronic components inside. If the surface properties of the edge part (218) are poor, the edge part (218) may be easily corroded, thereby deteriorating the surface quality of the electronic device (101). For high strength and excellent surface properties, the edge part (218) may include a first metal material having high strength and excellent surface properties. For example, the first metal material may include, but is not limited to, titanium and / or stainless steel, which have high strength and excellent corrosion resistance.

[0102] Referring to FIG. 4c, the bracket (243) may be coupled to the inside of an edge part (e.g., an edge part (218) of FIG. 4b) by die casting. The bracket (243) may not be exposed to the outside of the electronic device (101) by being wrapped by the edge part (218). The bracket (243) may be formed of a second metal material having a lower specific gravity than the edge part (218). Since the bracket (243) is disposed inside the electronic device (101) and is not visible from the outside of the electronic device (101), it may be formed of a second metal material having a relatively lower specific gravity, and thus, the overall weight of the electronic device (101) may be reduced.

[0103] For example, if the bracket (243) is formed of titanium, identical to the edge part (218), the overall weight of the electronic device (101) may increase. The specific gravity of titanium (e.g., about 4.5 g / cm 3 ) is lower than that of metal materials such as iron and stainless steel, but the specific gravity of aluminum (e.g. about 2.7 g / cm 3 ), the relatively high specific gravity of titanium may cause an increase in the weight of the electronic device (101). If the weight of the electronic device (101) is too heavy, a problem of reduced portability of the electronic device (101) may occur.

[0104] According to an exemplary embodiment, the bracket (243) may include a different metal material from the edge part (218). For example, the bracket (243) may include a second metal material that is relatively lighter than the first metal material included in the edge part (218). The specific gravity of the second metal material may be lower than the specific gravity of the first metal material. Unlike the edge part (218), the bracket (243) wrapped by the edge part (218) is not exposed to the outside of the electronic device (101), but is at least partially wrapped by the edge part (218), thereby being disposed inside the electronic device (101). Since the bracket (243) is disposed inside the electronic device (101), even if the bracket (243) has a lower strength than the edge part (218), the bracket (243) may have a small effect on the rigidity of the electronic device (101).

[0105] According to an exemplary embodiment, the second metal material may include aluminum and / or magnesium, which are relatively lighter than the first metal material (e.g., titanium). However, the present invention is not limited thereto. Since the specific gravity of aluminum is lower than that of titanium, an electronic device (101) including a bracket (243) including aluminum may be lighter than an electronic device according to a comparative example including a bracket (243) including titanium.

[0106] According to an exemplary embodiment, the edge part (218) and the bracket (243) may be manufactured in separate processes. The bonding strength between the edge part (218) and the bracket (243) may require a bonding strength that is not easily separated by external impact. For example, the bonding strength between the edge part (218) and the bracket (243) may be required to be about 25 MPa or more.

[0107] The edge part (218) and the bracket (243) may be manufactured through separate processes. A separate process may be performed to join the edge part (218) and the bracket (243) manufactured through separate processes. The joining process of the edge part (218) and the bracket (243) may vary. For example, a process may be performed in which the edge part (218) and the bracket (243) are manufactured separately, and then the bracket (243) is welded to the edge part (218). The process for welding dissimilar metals may include laser welding, electron-beam welding, and / or friction stir welding.

[0108] In the process of joining the edge part (218) and the bracket (243) by welding, bubbles may be created inside the edge part (218) and / or the bracket (243) during the welding process.

[0109] For example, if the difference in melting points between the first metal material included in the edge part (218) and the second metal material included in the bracket (243) is large, the welding process may be performed at a temperature higher than the higher melting point. In this case, the temperature at which the welding process is performed may cause vaporization of the metal material having the lower melting point. As the metal material having the relatively low melting point vaporizes, gas may be generated. The gas may cause the formation of bubbles inside during the welding process.

[0110] For example, when the first metal material is titanium and the second metal material is aluminum, the melting point of titanium is about 2,850°C, and the melting point of aluminum is about 659°C. Since the welding process can be performed at a temperature higher than the melting point of titanium (e.g., about 2,850°C), the temperature at which the welding process is performed may be too high compared to the melting point of aluminum. Due to the high temperature, the aluminum may vaporize and generate gas, and the gas may generate bubbles. The generation of bubbles may form an irregular bonding surface. If the bonding surface is irregular, a weakening of the bonding strength may occur. In addition, in the case of the welding process, since an additional welding process is required after each of the edge part (218) and the bracket (243) is manufactured, the manufacturing time and manufacturing cost may increase.

[0111] The process of joining the edge part (218) and the bracket (243) may include a method of die casting a second metal material on the inside of the edge part (218). In the case of the die casting process, the bracket (243) joined to the edge part (218) may be formed by seating the edge part (218) in a die and casting the second metal material forming the bracket (243) on the inside of the edge part (218). If the edge part (218) and the bracket (243) include different metal materials, the bonding force between the edge part (218) and the bracket (243) may be weak due to differences in physical properties and chemical properties between the different metals. If the bonding force between the edge part (218) and the bracket (243) is weak, the edge part (218) and the bracket (243) may be separated by external impact. The frame (300) may be damaged by the above separation, and may cause defects in the exterior coloring of the frame (300).

[0112] To improve the bonding strength between dissimilar metals (e.g., titanium and aluminum), a special treatment may be required for the bonding surface. For example, by adjusting the inner roughness of the edge part (218) using a method such as laser hatching or blasting, a concavo-convex portion may be formed, and by infiltrating aluminum into the concavo-convex portion, the bracket (243) may be bonded to the edge part (218). In the case of the above process, a separate process for forming the concavo-convex portion may be required to achieve roughness.

[0113] The frame (300) of the electronic device (101) according to an exemplary embodiment may include a clad metal (e.g., clad metal (500) of FIG. 5A) for bonding between the edge part (218) and the bracket (243).

[0114] The clad metal (500) is a composite metal formed by combining two or more types of metals with different properties. The clad metal (500) may be formed by joining two or more types of metal materials through a rolling process, a welding process, or the like. The clad metal (500) may include a plurality of laminated layers. Within the present disclosure, the clad metal (500) may include a first layer (510) and a second layer (520) to couple the edge part (218) and the bracket (243). According to an exemplary embodiment, the first layer (510) of the clad metal (500) may be coupled to the edge part (218), and the second layer (520) of the clad metal (500) may be coupled to the bracket (243). According to an exemplary embodiment, the first layer (510) of the clad metal (500) bonded to the edge part (218) may be formed of a first metal material forming the edge part (218). According to an exemplary embodiment, the second layer (520) of the clad metal (500) bonded to the bracket (243) may be formed of a second metal material forming the bracket (243). For example, when the edge part (218) is formed of titanium and the bracket (243) is formed of aluminum, the first layer (510) may be formed of titanium and the second layer (520) may be formed of aluminum.

[0115] Below, the structure of the clad metal (500) and the joint structure between the edge part (218) and the bracket (243) using the clad metal (500) are described.

[0116] Fig. 5a illustrates a frame of an electronic device according to an exemplary embodiment. Fig. 5b is an enlarged view of area A of Fig. 5a. Fig. 5c is a cross-sectional view of the exemplary electronic device taken along line BB' of Fig. 5b.

[0117] Referring to FIG. 5A, the frame (300) may include an edge part (218), a bracket (243), and a clad metal (500). The clad metal (500) may be positioned between the edge part (218) and the bracket (243). The clad metal (500) may be coupled to each of the edge part (218) and the bracket (243), thereby coupling the edge part (218) and the bracket (243).

[0118] According to an exemplary embodiment, the clad metal (500) may include a first layer (510) and a second layer (520). The first layer (510) may be formed of a first metal material forming the edge part (218). The second layer (520) may be formed of a second metal material forming the bracket (243). For example, if the edge part (218) is formed of titanium, the first layer (510) may also be formed of titanium, and if the bracket (243) is formed of aluminum, the second layer (520) may also be formed of aluminum. However, the first metal material and the second metal material are not limited to the examples described above.

[0119] The first layer (510) and the second layer (520) can be laminated through a rolling process or a welding process, etc. For example, the clad metal (500) can be formed by passing the first metal material and the second metal material between two rotating rolls at room temperature and then heat treating them by a method that utilizes plastic deformation of the metal material (e.g., a roll-to-roll process). In addition, the clad metal (500) including the first layer (510) and the second layer (520) can be manufactured by various methods. The second layer (520) can be laminated on the first layer (510). In the present disclosure, the expression "the second layer (520) is laminated on the first layer (510)" indicates a structure in which the first layer (510) and the second layer (520) are strongly bonded together through a rolling process or a welding process, etc.

[0120] According to an exemplary embodiment, a first layer (510) formed of a first metal material may be coupled to an edge part (218) formed of the first metal material. For example, a clad metal (500) may be coupled to the edge part (218) in a direction in which the first layer (510) faces the inner surface of the edge part (218). A second layer (520) formed of a second metal material may be coupled to a bracket (243) formed of the second metal material. When the clad metal (500) is coupled to the edge part (218) in this direction, the second layer (520) laminated on the first layer (510) may face the inner surface surrounded by the edge part (218). As described below, a bracket (243) may be formed by die casting the second metal material into the inner surface surrounded by the edge part (218). The second layer (520) facing inward, wrapped by the edge part (218), can be joined to the bracket (243).

[0121] Referring to FIG. 5B, the edge part (218) and the bracket (243) can be indirectly joined through the clad metal (500). Since the first layer (510) and the edge part (218) are formed of the same first metal material, the joining of the first layer (510) and the edge part (218) can be a joining between like metals. Similarly, since the second layer (520) and the bracket (243) are formed of the same second metal material, the joining of the second layer (520) and the bracket (243) can be a joining between like metals. Since the first layer (510) and the second layer (520) are strongly joined through a rolling process or the like, the edge part (218) and the bracket (243) can be strongly joined through the clad metal (500). The clad metal (500) may be configured to function as a flux in terms of joining the edge part (218) and the bracket (243).

[0122] According to an exemplary embodiment, the clad metal (500) may include a plurality of concave portions (530). The plurality of concave portions (530) may be formed by removing a portion of the second layer (520). As the portion of the second layer (520) is removed, the plurality of concave portions (530) may contact a portion of the first layer (510) corresponding to the plurality of concave portions (530). Through the plurality of concave portions (530) formed by removing a portion of the second layer (520), the portion of the first layer (510) corresponding to the plurality of concave portions (530) may be exposed.

[0123] Referring to FIG. 5c, the bracket (243) may include a plurality of convex portions (243a). The plurality of convex portions (243a) may interlock with a plurality of concave portions (530). For example, the plurality of convex portions (243a) of the bracket (243) may be inserted into a plurality of concave portions (530) of the clad metal (500), thereby coupling the bracket (243) to the clad metal (500). Through the interlocking structure of the plurality of concave portions (530) and the plurality of convex portions (243a), the bracket (243) may be coupled to the clad metal (500). Since the plurality of concave portions (530) are formed by removing the second layer (e.g., the second layer (520) of FIG. 5B), the plurality of concave portions (530) can be formed of a second metal material. Since the bracket (243) is formed of a second metal material, the plurality of convex portions (243a) can also be formed of the second metal material. As the plurality of concave portions (530) formed of the second metal material and the plurality of convex portions (243a) are joined, a joining between the same metal materials can be possible.

[0124] Referring to FIG. 5c, the plurality of recessed portions (530) may include a plurality of through holes (e.g., the plurality of through holes (810) of FIG. 8a) that penetrate from one surface (520a) of the second layer (520) that contacts the first layer (510) to the other surface (520b) of the second layer (520) that is opposite to the one surface (520a). For example, the first layer (510) may be perforated to form the plurality of through holes (810). A plurality of convex portions (243a) may be inserted into the plurality of through holes (810). However, the plurality of through holes (810) is only one example of the plurality of recessed portions (530), and the plurality of recessed portions (530) are not necessarily limited to the plurality of through holes. Various embodiments of the plurality of recessed portions (530) will be described below.

[0125] According to an exemplary embodiment, the first layer (510) may be formed of a first metal material as a portion of the clad metal (500) that is joined to the edge part (218). The first layer (510) may be joined to the edge part (218) by welding (e.g., electron beam welding). As described below, through the plurality of recesses (530), the first layer (510) is exposed in the direction that the second layer (520) faces, so that the exposed first layer (510) may be welded to the inner surface of the edge part (218) by irradiating the electron beam. Since the first layer (510) formed of the first metal material is welded to the inner surface of the edge part (218) formed of the first metal material, a bond between like metal materials may be possible.

[0126] When the edge part (218) and the bracket (243) including different metal materials are directly bonded, electrochemical corrosion may occur due to contact between the different metal materials, which may weaken the bonding strength or cause uneven bonding strength. According to an exemplary embodiment, the above problems can be solved by indirectly bonding the edge part (218) and the bracket (243) through the clad metal (500). The edge part (218) can be bonded to the clad metal (500) through the first layer (510) of the clad metal (500), and the bracket (243) can be bonded to the clad metal (500) through the second layer (520) of the clad metal (500), so that a stable and firm bonding can be achieved.

[0127] Referring again to FIG. 5A, the frame (300) may include a plurality of clad metals (500, 501). According to an exemplary embodiment, the frame (300) may further include other clad metals (501) spaced apart from the clad metal (500). The structure of the other clad metals (501) may be the same as that of the clad metal (500). The structure of the clad metal (500) may also be applied to the other clad metals (501). The plurality of clad metals (500, 501) may be spaced apart from each other along the boundary between the edge part (218) and the bracket (243). Each of the plurality of clad metals (500, 501) may couple the edge part (218) and the bracket (243) at different locations.

[0128] Hereinafter, a method for manufacturing a frame (300) according to an exemplary embodiment is described.

[0129] Figure 6 is a flowchart showing a method for manufacturing a frame according to an exemplary embodiment.

[0130] Referring to FIG. 6, in operation 601, a clad metal (500) including a first layer (510) and a second layer (520) laminated on the first layer (510) may be provided (prepared).

[0131] FIG. 7A illustrates a clad metal (500) according to an exemplary embodiment. Referring to FIG. 7A, the clad metal (500) may include a first layer (510) and a second layer (520) laminated on the first layer (510). The first layer (510) may be formed of a first metal material. The second layer (520) may be formed of a second metal material different from the first layer (510). The first layer (510) and the second layer (520) of the clad metal (500) may be strongly bonded together, such as by a roll-to-roll process. The first layer (510) can form a first surface (500a) of the clad metal (500), and the second layer (520) can form a second surface (500b) of the clad metal (500) opposite to the first surface (500a).

[0132] Referring again to FIG. 6, at operation 603, a portion of the second layer (520) may be removed to form a plurality of recesses (530).

[0133] Referring again to FIG. 7A, a portion of the second layer (520) of the clad metal (500) may be removed. Through the portion of the second layer (520) that is removed, the first layer (510) may be exposed to the other side of the clad metal (500). By removing a portion of the second layer (520), a plurality of recesses (530) may be formed. The plurality of recesses (530) may include, but are not limited to, a plurality of through holes (e.g., a plurality of through holes (810) of FIG. 8A) formed by punching a portion of the second layer (520).

[0134] According to an exemplary embodiment, as the plurality of recesses (530) are formed, the first layer (510) may be exposed through the plurality of recesses (530). Since the second layer (520) is laminated on the first layer (510) before a portion of the second layer (520) is removed, the first layer (510) may not be exposed through the second surface (500b) of the clad metal (500) formed by the second layer (520). When the plurality of recesses (530) are formed by removing a portion of the second layer (520), a portion of the first layer (510) corresponding to the plurality of recesses (530) may be exposed to the second surface (500b) through the plurality of recesses (530). When the second surface (500b) is viewed from the front, a portion of the first layer (510) corresponding to the plurality of concave portions (530) can be recognized.

[0135] Referring again to FIG. 6, at operation 605, the first layer (510) may be brought into contact with the inner surface of the edge part (218).

[0136] FIG. 7b illustrates a process in which the clad metal (500) comes into contact with the inner surface (218a) of the edge part (218). Referring to FIG. 7b, in order to bond the first layer (510) of the clad metal (500) to the inner surface (218a) of the edge part (218), the first layer (510) may come into contact with the inner surface (218a) of the edge part (218). The first surface (500a) formed by the first layer (510) may come into contact with the inner surface (218a) of the edge part (218). When the first layer (510) comes into contact with the inner surface (218a) of the edge part (218), a second surface (500b) opposite to the first surface (500a) may be visible. When the second surface (500b) is viewed from the front, a portion of the first layer (510) corresponding to the plurality of recesses (530) can be seen. In Fig. 7b, the plurality of recesses (530) are illustrated in the form of a plurality of through holes, but are not limited thereto.

[0137] Referring again to FIG. 6, in operation 607, a first intermediate structure (701) can be formed by irradiating an electron beam to a portion of the first layer (510) exposed through a plurality of recesses (530).

[0138] According to an exemplary embodiment, electron beam welding may be used to weld the first layer (510) to the inner surface of the edge part (218). The first layer (510) and the edge part (218) may be joined using electron beam welding, which irradiates an electron beam to a portion of the first layer (510) exposed through a plurality of recesses (530).

[0139] Figure 7c illustrates an electron beam welding process. Electron beam welding is a welding technique that locally generates high heat by irradiating a high-density focused electron beam to the welding area in a vacuum. Electron beam welding can form a deep and narrow weld joint because it utilizes an electron beam (712) that is more than 10,000 times stronger than arc welding or laser welding. Electron beam welding can provide high weld strength with less welding deformation and weld defects with low heat input. To ensure the straightness of the electron beam, the object to be welded (weldment (714)) can be welded within a vacuum chamber (713).

[0140] Referring to FIG. 7c, when current is applied to a filament (711a) within an electron beam gun (711) in a vacuum environment, the filament (711a) can be heated to a high temperature of about 2,700°C or higher. Electrons (electron beam (712)) accelerated by a high voltage can be emitted from the heated filament (711a). The electrons (electron beam (712)) emitted from the filament (711a) can be irradiated to a weldment (714) placed within a vacuum chamber (713) while being controlled by a grid. The weldment (714) may be a first intermediate structure (701) including a clad metal (500) in contact with the inner surface of the edge part (218), as illustrated in FIG. 7B, and an electron beam (712) may be irradiated to a portion of the first layer (510) exposed through a plurality of recesses (530). The direction and density of the electron beam (712) may be adjusted by a magnetic lens. When the electron beam (712) collides with the weldment (714), welding may be possible as kinetic energy is converted into thermal energy. The weldment (714) may be placed within a vacuum chamber (713). Since the electrons forming the electron beam (712) are light in weight, they may collide with relatively heavy air molecules and be scattered when moving in the air. To provide straightness of the electron beam (712) and prevent oxidation that occurs during welding, welding may be performed within the vacuum chamber (713).

[0141] FIG. 7d illustrates a first intermediate structure (701) formed by bonding a first layer (510) of a clad metal (500) to an inner surface of an edge part (218). Referring to FIG. 7d, as an electron beam is irradiated onto a portion of the first layer (510) exposed through a plurality of recesses (530), the first layer (510) may be bonded to the inner surface of the edge part (218). The first intermediate structure (701) may be referred to as an intermediate structure in which the first layer (510) of the clad metal (500) is bonded to the edge part (218).

[0142] According to an exemplary embodiment, a wedge-shaped joining surface (720) can be formed between the first layer (510) and the edge part (218) by electron beam welding. When welding is performed by electron beam welding, the welded portion can have a narrow and long wedge-shaped joining surface (720) compared to other welding methods. The wedge-shaped joining surface (720) does not appear in other welding methods and can exhibit excellent welding quality in terms of precision, deformation, etc. In the case of electron beam welding, when electrons emitted from a filament (e.g., the filament (711a) of FIG. 7c) are accelerated at a high speed and then collide with the weldment, the kinetic energy of the electrons can be converted into thermal energy at a portion just below the surface of the weldment portion. The converted thermal energy is high-density energy and can generate localized high heat at the weldment portion. The high heat can instantly melt the metal material of the weldment portion and heat the weldment portion above the vaporization temperature of the metal material. The metal material of the welded portion, heated above its vaporization temperature, can generate vapor pressure at the center of the welded portion. This vapor pressure opens the upper portion of the welded portion, and vapor due to vaporization of the metal material and liquid due to melting of the metal material can be generated. After the vapor and liquid are generated, electrons reaching the welded portion can pass through the vapor without resistance and collide with the surface of the welded portion, generating vapor and liquid again. As this process is repeated, a deep welded portion can be formed. Therefore, in the case of electron beam welding, a narrow and long key hole can be formed, and high-quality welding can be achieved.

[0143] According to an exemplary embodiment, the first layer (510) and the edge part (218) can be stably and firmly joined because they are formed of the same first metal material. In the case of electron beam welding, the thickness of the clad metal (500) can be made relatively thin. In order to perform welding, a certain thickness of the weldment may be required. In the case of electron beam welding, since a weldment having a relatively thin thickness can be welded, when the first layer (510) of the clad metal (500) is joined to the inner surface of the edge part (218) using electron beam welding, the thickness requirement of the first layer (510) can be reduced. In the case where a welding method other than electron beam welding is used, the thickness of the first layer (510) increases, thereby increasing the overall thickness or size of the frame (e.g., the frame (300) of FIG. 5A). When the first layer (510) is welded using electron beam welding, the thickness of the first layer (510) can be formed relatively thin, so that the manufacture of a thin frame (300) can be possible. According to an exemplary embodiment, the thickness of the first layer (510) can be about 0.2 mm or less. However, the above-described numerical range is merely exemplary, and the thickness of the first layer (510) is not limited to the above-described numerical range.

[0144] Referring again to FIG. 6, at operation 609, the first intermediate structure (701) is seated within the cavity (731) of the die (730), and a second metal material in a liquid state can be cast into the cavity (731).

[0145] FIG. 7E illustrates a process for manufacturing a bracket (243) according to an exemplary embodiment. The cavity (731) of the die (730) may have a shape for forming the bracket (243). After the first intermediate structure (701) is positioned within the cavity (731), a second metal material in a liquid state may be cast into the cavity (731). When the first intermediate structure (701) is positioned within the cavity (731), a second layer (520) of the clad metal (500) may be positioned so as to be connected to the cavity (731). When the second metal material is cast within the cavity (731), the second metal material may flow along the cavity (731) to form the bracket (243). The second metal material may be injected under high pressure so as to evenly fill the entire cavity (731). The second metal material in a liquid state can be brought into contact with the second layer (520) of the clad metal (500) within the cavity (731). At this time, the second metal material in a liquid state can flow into a plurality of recesses (530) formed by removing the second layer (520).

[0146] Referring again to FIG. 6, at operation 611, a second intermediate structure (702) may be formed by solidifying the second metal material.

[0147] FIG. 7F illustrates a second intermediate structure (702). Referring to FIG. 7F, the second intermediate structure (702) may be referred to as an intermediate structure in which a bracket (243) is coupled to a first intermediate structure (e.g., the first intermediate structure (701) of FIG. 7D). In the second intermediate structure (702), the edge part (218) may be coupled to the first layer (510) of the clad metal (500), and the bracket (243) may be coupled to the second layer (520) of the clad metal (500).

[0148] According to an exemplary embodiment, the bracket (243) may include a plurality of convex portions (243a). To form the bracket (243), when a second metal material in a liquid state is cast into a die (730), the liquid metal material may flow within a cavity (731) of the die (730). The second metal material in a liquid state may fill a space of the cavity (e.g., the cavity (731) of FIG. 7E) for forming the bracket (243) and may flow into a plurality of recessed portions (530) formed by removing the second layer (520). The space formed by the plurality of recessed portions (530) may be filled with the second metal material in a liquid state. When the second metal material in a liquid state is solidified, the second metal material introduced into the plurality of recessed portions (530) may solidify, thereby forming a plurality of convex portions (243a). The plurality of convex portions (243a) may have a shape corresponding to the shape of the plurality of concave portions (530) because they are formed by solidifying the second metal material in a liquid state that has been introduced into the plurality of concave portions (530). The plurality of convex portions (243a) may be inserted into the plurality of concave portions (530) and interlocked with the plurality of concave portions (530). As the second metal material forming the bracket (243) extends into the plurality of concave portions (530), the bracket (243) and the second layer (520) of the clad metal (500) may be firmly combined. According to an exemplary embodiment, the edge part (218) and the bracket (243) may be stably combined by the clad metal (500).

[0149] According to an exemplary embodiment, the length of the plurality of concave portions (530) and the length of the plurality of convex portions (243a) may be determined based on the thickness of the second layer (520). Since the plurality of concave portions (530) are formed by removing a portion of the second layer (520) to expose the first layer (510), the length may correspond to the thickness of the second layer (520). Since the plurality of convex portions (243a) are formed by solidifying the second metal material in a liquid state after filling the interior of the plurality of convex portions (530), the length of the plurality of convex portions (243a) may correspond to the length of the plurality of convex portions (530). If the length of the plurality of concave portions (530) and the length of the plurality of convex portions (243a) are too short, the bonding force between the bracket (243) and the second layer (520) of the clad metal (500) due to the interlocking structure may be weak. In order to provide a strong bonding force between the bracket (243) and the second layer (520), the thickness of the second layer (520) may be a certain thickness or more. According to an exemplary embodiment, the thickness of the second layer (520) may be about 2.0 mm or more. However, the above-described numerical range is merely exemplary, and the thickness of the second layer (520) is not limited to the above-described numerical range.

[0150] In operation 613, the second intermediate structure (702) is separated from the die (730), and the gap between the edge part (218) and the bracket (243) can be filled with an injection part.

[0151] Figures 7g, 7h, and 7i illustrate the process of injecting resin into the gap between the edge part (218) and the bracket (243).

[0152] Referring to FIG. 7g, a gap may exist between the edge part (218) and the bracket (243). If the edge part (218) is entirely composed of a first metal material that is a conductive material, it may be difficult to use the edge part (218) as an antenna radiator because the resonant frequency of a signal radiated or received through the edge part (218) cannot be controlled. In order to use one or more conductive portions (410) of the edge part (218) as an antenna radiator, the edge part (218) may have a segmented structure. The segmented structure may be referred to as a structure of the edge part (218) that includes a plurality of segments that are separated from each other in order to determine the electrical length of one or more conductive portions (410). The electrical length of one or more conductive portions (410) can determine the frequency characteristics of a signal transmitted and / or received through the antenna radiator, so that one or more conductive portions (410) can be used as an antenna radiator for transmitting and / or receiving a signal on a specified frequency band.

[0153] FIG. 7h illustrates a process in which a resin (740) is injected between an edge part (218) and a bracket (243). Referring to FIG. 7h, the resin (740) may be injected to fill a gap between the edge part (218) and the bracket (243). The resin (740), which is a non-conductive material, fills at least a portion of the gap between the edge part (218) and the bracket (243), thereby allowing the edge part (218) and the bracket (243) to be firmly bonded together. The resin (740) may form one or more non-conductive portions (e.g., one or more non-conductive portions (420) of FIG. 7i) that come into contact with one or more conductive portions (410). By filling the empty portion of the edge part (218) with the resin (470), a segmented structure including one or more conductive portions (410) and one or more non-conductive portions (420) can be formed. For example, a wireless communication module (e.g., the wireless communication module (192) of FIG. 1) can be configured to transmit or receive a signal on a designated band using the one or more conductive portions (410). For example, the resin (740) may include, but is not limited to, polybutyleneterephthalate (PBT), which has excellent electrical properties and flame retardancy. For example, the resin (740) may also include polycarbonate (PC) and / or polyphthalamide (PPA).

[0154] Fig. 7i illustrates the final state of the processed frame (300). Referring to Fig. 7i, the resin (740) can form the injection-molded portion (310) of the bracket (243) by filling at least a portion of the gap between the edge part (218) and the bracket (243). After the injection-molded portion (310) is formed, a processing process for improving dimensional accuracy, a polishing process for improving the quality of the outer surface, and / or a coating process (e.g., PVD (physical vapor deposition) coating) for implementing color can be performed. For example, a processing process for rounding the outer surface of the edge part (218) can be performed.

[0155] According to an exemplary embodiment, the first layer (510) of the clad metal (500) (e.g., the clad metal (500) of FIG. 7A) and the edge part (218) can be joined by electron beam welding. The second layer (520) of the clad metal (500) and the bracket (243) can be joined by a plurality of convex portions (243a) formed by solidification within the plurality of concave portions (530). The edge part (218) and the bracket (243) can be indirectly and firmly joined to each other through the clad metal (500). Since the first layer (510) and the edge part (218) are formed of a first metal material, and the second layer (520) and the bracket (243) are formed of a second metal material, a strong bonding force between the same metals can be provided. An electronic device (101) according to an exemplary embodiment may have a joint structure of an edge part (218) and a bracket (243) using a clad metal (500) without having to form a separate uneven portion on the inner side of the edge part (218) or adjust the roughness for jointing between the edge part (218) and the bracket (243). The above-described manufacturing method can improve the joint strength between the edge part (218) and the bracket (243) and reduce unnecessary processes, thereby reducing manufacturing costs. According to an exemplary embodiment, even if the first layer (510) and the edge part (218) are joined using electron beam welding, a post-processing process such as heat treatment can be omitted because the heat-affected zone due to welding heat is absent or small.

[0156] According to an exemplary embodiment, the edge part (218) and the bracket (243) may include different metals. The edge part (218) exposed to the outside of the electronic device (101) may include a first metal material (e.g., titanium and / or zinc) having a relatively high strength for the rigidity of the electronic device (101). The bracket (243), which is disposed inside the electronic device (101) and not exposed to the outside, may include a second metal material (e.g., aluminum) having a relatively low specific gravity for the weight lightening of the electronic device (101). The exemplary electronic device (101) may provide a light weight while having a high rigidity.

[0157] FIGS. 8A and 8B illustrate a plurality of recesses according to various embodiments.

[0158] The plurality of recesses (530) formed by removing a portion of the second layer (520) of the clad metal (500) can be implemented to have various shapes.

[0159] Referring to FIG. 8a, the plurality of concave portions (530) may include a plurality of through holes (810) formed by perforating the second layer (520). The plurality of through holes (810) may penetrate from one side (520a) of the second layer (520) that is in contact with the first layer (510) to the other side (520b) of the second layer (520) that is opposite to the one side (520a). The bracket (243) and the clad metal (500) may be joined by engaging a plurality of convex portions (e.g., the plurality of convex portions (243a) of FIG. 7f) of the bracket (e.g., the bracket (243) of FIG. 7f) into the plurality of through holes (810).

[0160] According to an exemplary embodiment, the inner surface of the plurality of concave portions (530) may have a spiral portion (811). For example, when the plurality of concave portions (530) are implemented as a plurality of through holes (810), a spiral portion (811) may be formed on the inner surface of the plurality of through holes (810). The spiral portion (811), as a screw line, may increase the contact area between the plurality of convex portions (243a) and the plurality of concave portions (530), thereby improving the bonding force. By having the plurality of convex portions (243a) of the bracket (243) come into contact with the spiral portion (811) formed on the inner surface of the plurality of concave portions (530), the bonding force between the bracket (243) and the second layer (520) may be improved.

[0161] Referring to FIG. 8B, the plurality of recessed portions (530) may include a plurality of slots (820). The plurality of slots (820) may extend in a direction parallel to the edge of the clad metal (500). In the embodiment illustrated in FIG. 8B, the plurality of slots (820) are illustrated as extending in a horizontal direction, but the shape of the plurality of slots (820) is not limited thereto. For example, the plurality of slots (820) may extend in a vertical direction. The plurality of slots (820) may enhance the bonding force between the plurality of convex portions (243a) and the plurality of recessed portions (530) by extending long. When the second metal material forming the bracket (243) is solidified after being introduced into the plurality of slots (820), a plurality of convex portions (243a) that engage with the plurality of slots (820) may be formed. The plurality of slots (820) can provide a relatively wide contact area with the plurality of convex portions (243a), thereby firmly bonding the bracket (243) and the second layer (520). In addition, embodiments of the plurality of concave portions (530) may vary. The bonding force between the edge part (218) and the bracket (243) by the clad metal (500) can be about 25 MPa or more. The clad metal (500) can improve the mass productivity of an electronic device (e.g., the electronic device (101) of FIG. 2) by providing a bond between dissimilar metal materials that are difficult to bond.

[0162] An electronic device (101) is provided. The electronic device (101) may include a display (201). The electronic device (101) may include a frame (300) that supports the display (201). The frame (300) may include an edge part (218) formed of a first metal material and defining a side exterior surface of the electronic device (101). The frame (300) may include a bracket (243) formed of a second metal material different from the first metal material and including a plurality of convex portions (243a), and surrounded by the edge part (218). The frame (300) may include a clad metal (500) that is disposed between the edge part (218) and the bracket (243) and that couples the bracket (243) to the edge part (218). The clad metal (500) may include a first layer (510) formed of the first metal material and coupled to the edge part (218). The clad metal (500) may include a second layer (520) laminated on the first layer (510), formed of the second metal material, and coupled to the bracket (243). The clad metal (500) may be formed by removing a portion of the second layer (520), exposing a portion of the first layer (510), and including a plurality of concave portions (530) interlocked with the plurality of convex portions (243a).

[0163] In one embodiment, the first metal material may include titanium. The second metal material may include aluminum.

[0164] According to one embodiment, the second layer (520) can be coupled to the bracket (243) through the plurality of convex portions (243a) of the bracket (243) that are inserted into the plurality of concave portions (530) and engage with the plurality of concave portions (530).

[0165] According to one embodiment, the plurality of convex portions (243a) of the bracket (243) can be formed by solidifying the second metal material in a liquid state after it flows into the plurality of concave portions (530).

[0166] According to one embodiment, the first layer (510) and the edge part (218) can be joined using electron beam welding, which irradiates an electron beam to the portion of the first layer (510) exposed through the plurality of recesses (530).

[0167] According to one embodiment, a wedge-shaped bonding surface (720) can be formed between the first layer (510) and the edge part (218) by the electron beam welding.

[0168] In one embodiment, the specific gravity of the second metal material may be lower than the specific gravity of the first metal material.

[0169] According to one embodiment, the plurality of recesses (530) may include a plurality of through holes (810) penetrating from one side (520a) of the second layer (520) that is in contact with the first layer (510) to the other side (520b) of the second layer (520) that is opposite to the one side (520a).

[0170] According to one embodiment, the plurality of through holes (810) may have a spiral portion (811) formed on the inner surface of the plurality of through holes (810).

[0171] According to one embodiment, the plurality of recesses (530) may include a plurality of slots (820) extending in a direction parallel to the edge of the clad metal (500).

[0172] According to one embodiment, the thickness of the first layer (510) may be 0.2 mm or less.

[0173] According to one embodiment, the thickness of the second layer (520) may be 2.0 mm or more.

[0174] According to one embodiment, the electronic device (101) may further include other clad metals spaced apart from the clad metal (500). The clad metal (500) and the clad metals may be spaced apart from each other along a boundary between the edge part (218) and the bracket (243).

[0175] According to one embodiment, the electronic device (101) may further include an injection-molded portion that fills the gap between the edge part (218) and the bracket (243).

[0176] According to one embodiment, the electronic device (101) may further include a rear cover (211) opposite the display (201).

[0177] A method of manufacturing a frame (300) used for an electronic device (101) is provided. The method may include providing a clad metal (500) including a first layer (510) formed of a first metal material and a second layer (520) laminated on the first layer (510) and formed of a second metal material. The method may include removing a portion of the second layer (520) to form a plurality of recesses (530) that expose a portion of the first layer (510) in a direction in which the second layer (520) faces. The method may include contacting the first layer (510) with an inner surface (218a) of an edge part (218) formed of the first metal material. The manufacturing method may include an operation of forming a first intermediate structure (701) including the edge part (218) coupled to the first layer (510) by irradiating an electron beam to the portion of the first layer (510) exposed through the plurality of recesses (530). The manufacturing method may include an operation of seating the first intermediate structure (701) within a cavity (731) of a die (730). The manufacturing method may include an operation of casting a second metal material in a liquid state into the cavity (731) of the die (730). In the operation, the second metal material in a liquid state may flow into the plurality of recesses. The manufacturing method may include an operation of forming a second intermediate structure (702) including a bracket (243) coupled to the second layer (520) by solidifying the second metal material in a liquid state after casting the second metal material in a liquid state. The above manufacturing method may include an operation of separating the second intermediate structure (702) from the die (730).The above manufacturing method may include an operation of filling the gap between the edge part (218) and the bracket (243) with an injection part.

[0178] In one embodiment, the first metal material may include titanium. The second metal material may include aluminum.

[0179] According to one embodiment, the manufacturing method may further include an operation of forming a plurality of convex portions (243a) of the bracket (243) by solidifying the second metal material in a liquid state introduced into the plurality of concave portions (530).

[0180] According to one embodiment, the second layer (520) can be coupled to the bracket (243) through the plurality of convex portions (243a) of the bracket (243) that are inserted into the plurality of concave portions (530) and engage with the plurality of concave portions (530).

[0181] In one embodiment, the specific gravity of the second metal material may be lower than the specific gravity of the first metal material.

[0182] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0183] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0184] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0185] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (120) (e.g., the processor (120)) of a machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0186] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created in a device-readable storage medium, such as a memory (130) of a manufacturer's server, an application store's server, or an intermediary server.

[0187] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In electronic devices, display; and comprising a frame supporting at least a portion of the display; The above frame is, An edge part formed of a first metal material and defining a side surface of the electronic device, A bracket formed of a second metal material different from the first metal material, including a plurality of convex portions, and surrounded by the edge part, and A clad metal is disposed between the edge part and the bracket, and includes a clad metal that joins the bracket to the edge part. The above clad metal is, A first layer formed of the first metal material and bonded to the edge part, A second layer laminated on the first layer, formed of the second metal material, and bonded to the bracket, and A plurality of concave portions interlocked with the plurality of convex portions, formed by removing a portion of the second layer, exposing a portion of the first layer, Electronic devices.

2. In paragraph 1, The above first metal material is, Contains titanium, The above second metal material is, Containing aluminum, Electronic devices.

3. In paragraph 1 or 2, The second layer above is, By being inserted into the plurality of concave portions, the bracket is joined to the bracket through the plurality of convex portions of the bracket that are engaged with the plurality of concave portions. Electronic devices.

4. In paragraph 3, The above plurality of convex portions of the above bracket are, The second metal material in a liquid state is formed by flowing into the plurality of concave portions and then solidifying. Electronic devices.

5. In any one of paragraphs 1 to 4, The above first layer and the edge part, The first layer is bonded using electron beam welding, which irradiates an electron beam to the portion of the first layer exposed through the plurality of concave portions. Electronic devices.

6. In paragraph 5, By the above electron beam welding, a wedge-shaped bonding surface is formed between the first layer and the edge part. Electronic devices.

7. In any one of paragraphs 1 to 6, The specific gravity of the above second metal material is Lower than the specific gravity of the first metal material, Electronic devices.

8. In any one of paragraphs 1 to 7, The above plurality of concave portions are, A plurality of through holes penetrating from one side of the second layer in contact with the first layer to the other side of the second layer opposite to the one side, Electronic devices.

9. In paragraph 8, The above plurality of through holes are, Having a spiral portion formed on the inner surface of the above plurality of through holes, Electronic devices.

10. In any one of paragraphs 1 to 9, The above plurality of concave portions are, comprising a plurality of slots extending in a direction parallel to the edge of the clad metal; Electronic devices.

11. In any one of paragraphs 1 to 10, The thickness of the above first layer is Less than 0.2mm, Electronic devices.

12. In any one of paragraphs 1 to 11, The thickness of the second layer is 2.0mm or more, Electronic devices.

13. In any one of paragraphs 1 to 12, Further comprising other clad metals separated from the above clad metal, The above clad metal and the above clad metals, are spaced apart from each other along the boundary between the above edge part and the above bracket, Electronic devices.

14. In any one of paragraphs 1 to 13, Further comprising an injection part that fills the gap between the edge part and the bracket. Electronic devices.

15. A method for manufacturing a frame used for an electronic device, An operation of providing a clad metal comprising a first layer formed of a first metal material and a second layer laminated on the first layer and formed of a second metal material; An operation of removing a portion of the second layer to form a plurality of recesses exposing a portion of the first layer in a direction toward the second layer; An action of bringing the first layer into contact with the inner surface of an edge part formed of the first metal material; An operation of forming a first intermediate structure including the edge part coupled to the first layer by irradiating an electron beam to the part of the first layer exposed through the plurality of concave portions; An action of placing the first intermediate structure into a cavity of a die; An operation of casting a second metal material in a liquid state into the cavity of the die, wherein the second metal material in a liquid state flows into the plurality of concave portions; After casting the second metal material in a liquid state, an operation of forming a second intermediate structure including a bracket bonded to the second layer by solidifying the second metal material in a liquid state; An operation of separating the second intermediate structure from the die; and Including an action of filling the gap between the edge part and the bracket with an injection part, Manufacturing method.

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