Bluetooth earphone

Abstract

The present application relates to a bluetooth earphone, comprising a shell, a high-gain antenna module and a signal processing device, wherein the high-gain antenna module comprises a substrate, a radiation layer and a ground layer, the radiation layer being arranged on a first side surface of the substrate, and the ground layer being arranged on a second side surface of the substrate. The first side surface of the substrate is arranged close to an inner side of the shell where a sound output hole is provided, and the second side surface of the substrate is arranged close to an outer side opposite the inner side of the shell.

Description

Bluetooth headset

[0001] Related applications

[0002] This application claims priority to Chinese patent application number 202420678511.8, filed on April 2, 2024, entitled “Bluetooth Headset,” the entire text of which is incorporated herein by reference. Technical Field

[0003] The present application relates to the field of earphone technology, and in particular to a Bluetooth earphone. Background Art

[0004] With the continuous development of Bluetooth headset technology, users' demands for Bluetooth headsets have gradually diversified. There is not only the basic requirement of connecting mobile phones and other terminals to Bluetooth headsets for broadcasting, but also the functional demand for real-time voice or data transmission between Bluetooth headsets via Bluetooth.

[0005] However, in the related art, the communication distance between Bluetooth headsets is relatively short (within 50 meters), which is difficult to meet the needs of long-distance communication.

[0006] Application Contents

[0007] Based on this, it is necessary to provide a Bluetooth headset to improve the communication distance between Bluetooth headsets.

[0008] An embodiment of the present application provides a Bluetooth headset, comprising: a shell, a high-gain antenna module and a signal processing device, wherein the high-gain antenna module is arranged inside the shell, and the high-gain antenna module includes a substrate, a ground layer and a radiation layer, the radiation layer is arranged on the first side surface of the substrate close to the inner side of the shell, and the ground layer is arranged on the second side surface of the substrate close to the outer side of the shell, wherein the inner side of the shell is the side of the shell where the sound outlet is provided, and the outer side of the shell is arranged opposite to the inner side of the shell; the signal processing device is connected to the radiation layer.

[0009] In some embodiments, the radiation layer includes a first radiation portion and a second radiation portion that are connected to each other, the second radiation portion is electrically connected to the signal processing device, and a width of the first radiation portion is greater than a width of the second radiation portion.

[0010] In some embodiments, the radiation layer includes a first radiation portion and a second radiation portion that are connected to each other, the second radiation portion is electrically connected to the signal processing device, and the length of the first radiation portion is greater than the length of the second radiation portion.

[0011] In some embodiments, the first radiating portion has a width consistent with a width of the substrate and is flatly disposed on the first side surface of the substrate.

[0012] In some embodiments, a ratio of a width of the first radiating portion to a width of the second radiating portion is 10:1 to 100:1.

[0013] In some embodiments, the second radiation portion has a width of 0.1 mm to 1 mm and is flatly disposed on the first side surface of the substrate.

[0014] In some embodiments, the formation has a thickness of 0.01 mm to 0.1 mm.

[0015] In some embodiments, the thickness of the radiation layer is 0.01 mm to 0.1 mm.

[0016] In some embodiments, the substrate has a thickness of 2 mm to 5 mm.

[0017] In some embodiments, the Bluetooth headset further includes a printed circuit board, which is disposed on a side of the high-gain antenna module close to the ground.

[0018] In some embodiments, the signal processing device includes a Bluetooth chip and a radio frequency base, the base is further provided with solder joints, the radiation layer is connected to the radio frequency base through the solder joints, and the radio frequency base is connected to the Bluetooth chip.

[0019] In some embodiments, the housing includes an ear hook housing, and the high-gain antenna module is disposed inside the ear hook housing.

[0020] In some embodiments, the housing includes an ear rod housing, and the high-gain antenna module is disposed inside the ear rod housing.

[0021] In some embodiments, the gain range of the high-gain antenna module is -3dbi to 0dbi. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the conventional technology, the following briefly introduces the drawings required for use in the embodiments or the conventional technology descriptions. Obviously, the drawings described below are merely embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the disclosed drawings without any creative work.

[0023] FIG1 is a schematic diagram of the structure of a Bluetooth headset in some embodiments of the present application;

[0024] FIG2 is a schematic diagram of the structure of a high-gain antenna module in some embodiments of the present application;

[0025] FIG3 is a schematic diagram of the second side surface structure of a high-gain antenna module in some embodiments of the present application;

[0026] FIG4 is a schematic diagram of a cross-sectional structure of a high-gain antenna module in some embodiments of the present application;

[0027] FIG5 is a schematic diagram of the structure of a Bluetooth headset in some other embodiments of the present application;

[0028] FIG6 is a schematic diagram of the structure of a Bluetooth headset in some other embodiments of the present application;

[0029] FIG7 is a schematic diagram of an S11 return loss waveform of a Bluetooth headset in some embodiments of the present application;

[0030] FIG8 is a schematic diagram of a Smith chart of a Bluetooth headset in an embodiment of the present application;

[0031] FIG9 is a schematic diagram of a waveform of head model radiation efficiency of a Bluetooth headset in some embodiments of the present application;

[0032] FIG10 is a comparison of antenna radiation patterns of Bluetooth headsets in some implementations of the present application. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0034] The Bluetooth headset provided in the embodiments of the present application is essentially a Bluetooth headset that has the function of communicating with other Bluetooth headsets, or has the need to communicate with other Bluetooth headsets. In this way, Bluetooth connections can be established between Bluetooth headsets, and data exchange can be carried out between two or more Bluetooth headsets, meeting the functional requirements of real-time voice or data transmission between Bluetooth headsets.

[0035] However, in-depth research has revealed that data exchange between Bluetooth headsets is currently typically achieved using PIFA (Planar Inverted F-shaped Antenna). PIFA antennas only provide short-range communication (up to 50 meters). In the presence of obstructions, the signal strength between Bluetooth headsets gradually deteriorates, leading to frequent disconnections and increased data packet loss, significantly impacting the user experience.

[0036] Therefore, the solution of the embodiment of the present application proposes a high-gain antenna design solution in the headset that effectively improves the signal radiation capability. The Bluetooth headset referred to in this application can be an in-ear Bluetooth headset, an open-ear Bluetooth headset, etc., which is not limited here. The solution of this application, through a reasonable layout setting, ensures that the radiation energy directed toward the user during use of the Bluetooth headset is reflected and transmitted in a direction away from the user, thereby effectively improving the communication range of the Bluetooth headset.

[0037] Please refer to Figure 1. The present application provides a Bluetooth headset, including: a shell 10, a high-gain antenna module 20 and a signal processing device (not shown in the figure), the high-gain antenna module 20 is arranged inside the shell 10, the high-gain antenna module 20 includes a base 202, a ground layer 201 and a radiation layer 203, the radiation layer 203 is arranged on the first side surface of the base 202 close to the inner side 101 of the shell 10, and the ground layer 201 is arranged on the second side surface of the base 202 close to the outer side 103 of the shell 10, wherein the inner side 101 of the shell 10 is the side of the shell 10 where the sound outlet is provided, and the outer side 103 of the shell 10 is arranged opposite to the inner side 101 of the shell 10; the signal processing device is connected to the radiation layer 203.

[0038] The high-gain antenna module 20 is an antenna module specifically designed to concentrate radiated energy in a specific direction. Compared to a typical antenna, its radiation direction is narrower, and the radiation in certain directions is more concentrated, thereby concentrating the energy in certain directions, resulting in higher signal strength and coverage in these directions. In the embodiment of the present application, when the headset is worn, the radiated energy from the high-gain antenna module 20 toward the user is concentrated and reflected away from the user, thereby enhancing the gain in this direction and improving the communication range of the Bluetooth headset.

[0039] The housing 10 is also the outer shell of the Bluetooth headset. A sound outlet is often provided on one side of the end of the Bluetooth headset housing. When a user wears the Bluetooth headset, the portion provided with the sound outlet is inserted into the user's ear, and the sound produced by the Bluetooth headset is transmitted to the user through the sound outlet, thereby being received by the user. Therefore, in the solution of this embodiment, the side provided with the sound outlet serves as the inner side 101 of the housing 10, the radiation layer 203 is provided on the first side surface of the base 202 close to the inner side 101 of the housing 10, and the ground layer 201 is provided on the second side surface of the base 202 close to the outer side 103 of the housing 10. This arrangement ensures that when a user wears the Bluetooth headset, the radiation layer 203 is closer to the user, and is located between the ground layer 201 and the user. This ensures that when the radiation layer 203 radiates energy, it will be reflected by the ground layer 201, thereby increasing the communication distance of the Bluetooth headset.

[0040] It should be noted that the material selection for substrate 202 is not exclusive and can be selected based on actual functional requirements, durability requirements, environmental requirements, or cost requirements, and is not specifically limited. For example, in one embodiment, an FR-4 type substrate can be selected, that is, a substrate formed of a material with a flame retardant grade of FR-4. FR-4 substrates have stable dielectric properties, high mechanical strength, good processing properties, good heat resistance, strong flame retardancy, and high cost-effectiveness. Thus, using FR-4 substrate to construct substrate 202 can effectively improve the operational reliability of high-gain antenna module 20.

[0041] It is understood that the specific types of the ground layer 201 and the radiation layer 203 are not limited. They can be made of the same material or different materials, depending on actual needs. In one embodiment, the ground layer 201 and the radiation layer 203 can be made of metal materials. For example, in one embodiment, the ground layer 201 and the radiation layer 203 are of the same type: the ground layer 201 is a copper ground layer, and the radiation layer 203 is a copper radiation layer, that is, both are made of copper.

[0042] It should be noted that the specific shape of the base 202 is not limited and can be flexibly adjusted according to the internal space of the Bluetooth headset to adapt to the different internal structures of the Bluetooth headset. In one embodiment, the base 202 can be set to a regular shape, such as a polyhedron, a cylinder, a sphere, etc. In other embodiments, the base 202 can also be set to a special-shaped structure, such as a combination of a polyhedron and a cylinder, a combination of different polyhedrons, etc., without limitation. In one embodiment, the base 202 can be set to a rectangular parallelepiped.

[0043] The Bluetooth headset comprises a housing 10, a high-gain antenna module 20, and a signal processing device. Data transmission between Bluetooth headsets is achieved by placing the high-gain antenna module 20 inside the housing 10 of the Bluetooth headset. The high-gain antenna module 20 comprises a substrate 202, a radiating layer 203, and a ground layer 201. The radiating layer 203 is disposed on a first side surface of the substrate 202, while the ground layer 201 is disposed on a second side surface of the substrate 202. When the high-gain antenna is disposed inside the housing 10, the first side surface of the substrate 202 is positioned adjacent to the inner side 101 of the housing 10, where the sound outlet is located, and the second side surface of the substrate 202 is positioned adjacent to the outer side 103 of the housing 10, which is opposite the inner side 101. Through this solution, when the earphones are worn and used, the inner side 101 of the shell 10 where the sound outlet is provided is close to the user, while the relatively outer side 103 is away from the user. In this way, the energy generated by the high-gain antenna module 20 when it is running and directed toward the user can be reflected outward (away from the user), thereby enhancing the external radiation capability of the high-gain antenna module 20, thereby effectively improving the communication distance of the Bluetooth headset, that is, improving the communication distance between Bluetooth headsets.

[0044] Please refer to Figure 2. In one embodiment, the radiation layer 203 includes a first radiation portion 2031 and a second radiation portion 2032 connected to each other. The second radiation portion 2032 is electrically connected to the signal processing device (the connection relationship diagram is not shown). The width of the first radiation portion 2031 is greater than the width of the second radiation portion 2032.

[0045] In another embodiment, the radiation layer 203 may include a first radiation portion 2031 and a second radiation portion 2032 connected to each other, the second radiation portion 2032 is electrically connected to the signal processing device, and the length of the first radiation portion 2031 is greater than that of the second radiation portion 2032.

[0046] The direction parallel to the first side surface of the antenna is defined as the length direction of the radiating layer 203; the direction perpendicular to the length direction and parallel to the first side surface is defined as the width direction of the radiating layer 203. The radiating layer 203 includes a first radiating portion 2031 having a larger width or length, and a second radiating portion 2032 having a smaller width or length. The first radiating portion 2031 is used for signal reception, while the second radiating portion 2032 is used for impedance transformation. This embodiment provides a radiating layer 203 with first radiating portions 2031 and second radiating portions 2032 of different lengths and widths, ensuring reliable signal reception while also maintaining high impedance characteristics, effectively improving the operational reliability of the radiating layer 203.

[0047] It should be noted that the shapes of the first radiating portion 2031 and the second radiating portion 2032 are not limited to a single shape. The first radiating portion 2031 and the second radiating portion 2032 can also be configured as regular shapes, for example, both configured as rectangular parallelepiped shapes. Alternatively, the first radiating portion 2031 and the second radiating portion 2032 can both be configured as irregular shapes. In another embodiment, one of the first radiating portion 2031 and the second radiating portion 2032 can be configured as a regular shape, while the other can be configured as an irregular shape. The specific configuration can be determined based on actual needs or scenarios.

[0048] It can be understood that if both the first radiating portion 2031 and the second radiating portion 2032 are of regular shape (e.g., a rectangular parallelepiped), it is sufficient to set the length of the first radiating portion 2031 to be greater than the length of the second radiating portion 2032, or to set the width of the first radiating portion 2031 to be greater than the width of the second radiating portion 2032, or both. If one of the first radiating portion 2031 and the second radiating portion 2032 is of an irregular shape, it is necessary to set the minimum length of the first radiating portion 2031 to be greater than the maximum length of the second radiating portion 2032, or to set the minimum width of the first radiating portion 2031 to be greater than the maximum width of the second radiating portion 2032, or both. This ensures both signal reception and good impedance conversion characteristics.

[0049] In one embodiment, the thicknesses of the first radiation portion 2031 and the second radiation portion 2032 (ie, the distance in a direction perpendicular to a plane determined by the length and width directions) may be set to be the same or different, without specific limitation.

[0050] Furthermore, in one embodiment, the width of the first radiating portion 2031 is consistent with the width of the substrate 202 , and is flatly disposed on the first side surface of the substrate 202 .

[0051] In the solution of this embodiment, the width of the first radiating portion 2031 is set to be consistent with the width of the substrate 202 , thereby increasing the signal receiving area of ​​the first radiating portion 2031 as much as possible, which can effectively improve the signal transmission reliability of the radiating layer 203 .

[0052] It can be understood that in other embodiments, the width of the first radiating portion 2031 can be set to be smaller than the width of the substrate 202, for example, it can be set to three quarters of the width of the substrate 202, or it can be set to half the width of the substrate 202, etc. There is no specific limitation, as long as the width of the first radiating portion 2031 is greater than the width of the second radiating portion 2032.

[0053] In one embodiment, the substrate 202 is a regular rectangular parallelepiped. In this embodiment, the length of the substrate 202 is set to 42 mm (millimeters), and the width of the substrate 202 is set to 10 mm. Accordingly, the length of the first radiating portion 2031 can be set to be greater than 21 mm to ensure that the length of the first radiating portion 2031 is greater than the length of the second radiating portion 2032. The width of the first radiating portion 2031 can be set to 10 mm, and the first radiating portion 2031 can be flatly arranged on the second surface of the substrate 202.

[0054] In one embodiment, the length of the first radiating portion 2031 can be set to 32 mm, the width of the first radiating portion 2031 can be set to 10 mm, the length of the second radiating portion 2032 can be set to 10 mm, and the width can be set to less than 10 mm.

[0055] It is understood that the width of the second radiating portion 2032 is not limited to a single value. In one embodiment, the ratio of the width of the first radiating portion 2031 to the width of the second radiating portion 2032 is 10:1 to 100:1. In other words, the width of the first radiating portion 2031 can be set to 10 to 100 times the width of the second radiating portion 2032, thereby ensuring that the radiating layer 203 has good impedance variation performance.

[0056] Furthermore, in one embodiment, the second radiation portion 2032 has a width of 0.1 mm to 1 mm and is flatly disposed on the first side surface of the substrate 202 .

[0057] The width of the second radiating portion 2032 is 0.1 mm to 1 mm. Specifically, the width of the second radiating portion 2032 can be set to 0.1 mm, 1 mm, or any other value between 0.1 mm and 1 mm, such as 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, or 0.9 mm, depending on actual needs. This solution sets the width of the second radiating portion 2032 to 0.1 mm to 1 mm, thereby ensuring that the radiating layer 203 has good impedance conversion characteristics.

[0058] Referring to Figures 3 and 4 , in one embodiment, the base 202 is a rectangular parallelepiped with a length of 42 mm and a width of 10 mm. In this case, the length of the first radiating portion 2031 can be set to 32 mm, the width of the first radiating portion 2031 can be set to 10 mm, and the length of the second radiating portion 2032 can be set to 10 mm, and the width of the second radiating portion 2032 can be set to 0.5 mm. This ensures that the radiating layer 203 has high signal transmission efficiency and good impedance conversion performance, allowing the radiating layer 203 to meet the remaining design space requirements of the Bluetooth headset while still providing excellent performance.

[0059] The direction perpendicular to the plane determined by the length direction and the width direction is defined as the thickness direction. It should be noted that the thickness of the stratum 201 and the radiation layer 203 is not unique. The two can be set to be the same or different according to actual needs, and there is no specific limitation.

[0060] For example, in one embodiment, the thickness of the layer 201 is 0.01 mm to 0.1 mm.

[0061] In this embodiment, the thickness of the ground layer 201 is set to 0.01mm or 0.1mm. Alternatively, the thickness of the ground layer 201 may be set to any value between 0.01mm and 0.1mm, such as 0.02mm, 0.04mm, 0.05mm, 0.06mm, 0.08mm, etc., without limitation. The thickness may be adaptively set based on the remaining space within the housing 10 of the Bluetooth headset. This solution sets the thickness of the ground layer 201 to 0.01mm-0.1mm, ensuring that the ground layer 201 functions as a ground wire while improving operational reliability.

[0062] It should be pointed out that the length and width of the layer 201 are not unique. In one embodiment, in order to reflect the energy toward the human body back as much as possible and increase the communication distance of the Bluetooth headset, the length and width of the layer 201 should be set as large as possible so that the coverage of the layer 201 on the second side surface is large enough.

[0063] In one embodiment, the length and width of the stratum 201 can be set to be consistent with the length and width of the second side surface of the substrate 202, so that the stratum 201 can completely cover the second side surface of the substrate 202, thereby achieving higher energy reflection efficiency and improving the communication distance of the Bluetooth headset.

[0064] Similarly, taking the base 202 as a rectangular parallelepiped with a length of 42 mm and a width of 10 mm as an example, in the solution of this embodiment, the length of the layer 201 can be set to 42 mm and the width of the layer 201 can be set to 10 mm.

[0065] In one embodiment, the thickness of the radiation layer 203 is 0.01 mm to 0.1 mm.

[0066] In this embodiment, the thickness of the radiating layer 203 is set to 0.01mm or 0.1mm. Alternatively, the thickness of the radiating layer 203 may be set to any value between 0.01mm and 0.1mm, such as 0.02mm, 0.04mm, 0.05mm, 0.06mm, 0.08mm, etc., without limitation. The thickness can be adaptively set based on the remaining space within the Bluetooth headset housing 10. This solution sets the thickness of the radiating layer 203 to 0.01mm to 0.1mm, ensuring that the radiating layer 203 can perform its signal transmission function while also improving its operational reliability.

[0067] It should only be noted that the distance between the ground layer 201 and the radiation layer 203 is not limited to a specific setting, and the remaining space inside the earphone can be flexibly set in combination with actual scenarios. For example, in one embodiment, the thickness of the base 202 is 2 mm to 5 mm.

[0068] In this embodiment, the thickness of substrate 202 (i.e., the distance between the first and second side surfaces) is set to 2 mm to 5 mm. Layer 201 is disposed on the second side surface of substrate 202, while radiating layer 203 is disposed on the first side surface of substrate 202. This ensures that the distance between layer 201 and radiating layer 203 is 2 mm to 5 mm. Specifically, the thickness can be 2 mm, 5 mm, or any value between 2 mm and 5 mm, such as 3 mm, 4 mm, etc.

[0069] In this way, the ground layer 201 and the radiation layer 203 are arranged at a certain distance, which can further improve the operation reliability of the high-gain antenna module 20.

[0070] In one embodiment, the Bluetooth headset further includes a printed circuit board, which is disposed on a side of the high-gain antenna module 20 close to the ground.

[0071] The high-gain antenna module 20 can be placed in any space within the earphone housing 10, as long as it can be placed in that space. In this embodiment, the high-gain antenna module 20 is placed between the printed circuit board and the outer side 103 of the housing 10. This ensures a longer communication range for the high-gain antenna module 20 and isolates interference from components on the printed circuit board through the ground layer 201, further improving the communication reliability of the Bluetooth headset.

[0072] Please refer to Figures 5 and 6. Furthermore, in one embodiment, the signal processing device includes a Bluetooth chip 62 and a radio frequency base 61. The base 202 is also provided with solder joints. The radiation layer 203 is connected to the radio frequency base 61 through the solder joints (the connection relationship diagram is not shown), and the radio frequency base 61 is connected to the Bluetooth chip 62 (the connection relationship diagram is not shown).

[0073] The Bluetooth chip 62 is an integrated chip that integrates a processor and other peripherals and is the core component for implementing Bluetooth functionality. The RF base 61 is a component that connects the RF signal between the high-gain antenna module 20 and the Bluetooth chip 62. Comprising the base and the RF chip, it effectively transmits RF signals, ensuring the proper functioning of the Bluetooth headset.

[0074] It should be noted that the location of the solder joints on the substrate 202 is not unique. In one embodiment, the solder joints may be located at the edge of the first side surface of the substrate 202, and the radiating layer 203 may extend to the edge of the first side surface and then connect to the RF base 61. In another embodiment, the solder joints may be located on other side surfaces, and the radiating layer 203 may extend to the edge of the first side surface and then further extend through other side surfaces to the solder joints and connect to the RF base 61.

[0075] It is understandable that the connection method between the radiation layer 203 and the RF base 61 is not unique. In one embodiment, the radiation layer 203 and the RF base 61 are connected via a coaxial cable, which has strong RF signal transmission reliability.

[0076] It should be noted that the type of the substrate 202 is not unique. In one embodiment, the relative dielectric constant of the substrate 202 is 3 to 5.

[0077] The solution of this embodiment adopts a substrate with a relative dielectric constant of 3 to 5 as the substrate 202 of the high-gain antenna module 20, thereby effectively controlling the antenna cost while taking into account the performance.

[0078] In some embodiments, the housing 10 includes an ear hook housing, and the high-gain antenna module 20 is disposed inside the ear hook housing.

[0079] As shown in the above embodiment, the high-gain antenna module 20 should be set in the non-in-ear part of the Bluetooth headset to ensure that Bluetooth communication is not affected by the human body and improve the reliability of Bluetooth communication. The solution of this embodiment is for open-type headphones (such as ring-neck ear-hanging type, ear-hanging type, ear-clip type, etc.), which can be combined with Figure 6. The housing 10 includes an earphone head housing (not shown) and an earhook housing 13, wherein the earphone head housing is used to open the sound outlet and sound receiving holes, and the earhook housing 13 is used to assist wearing.

[0080] Furthermore, in some embodiments, the housing 10 includes an ear rod housing, and the high-gain antenna module 20 is disposed inside the ear rod housing.

[0081] This embodiment also ensures that Bluetooth communication is not affected by the human body. The high-gain antenna module 20 should be placed in the non-in-ear portion of the Bluetooth headset. For in-ear headphones, as shown in Figure 1 , the housing 10 includes an earphone head housing 11 and an ear stem housing 12 . The earphone head housing 11 is used to define the sound output and reception holes, while the ear stem housing 12 houses components related to Bluetooth communication and signal processing.

[0082] In some embodiments, the gain range of the high-gain antenna module is -3dbi to 0dbi.

[0083] In the solution of this embodiment, when worn, the gain range of the high-gain antenna module is set to -3dbi to 0dbi, that is, -3dbi or any value between -3dbi and 0dbi, so that communication over longer distances can be achieved.

[0084] In order to facilitate understanding of the technical solution of the present application, the present application is explained below in conjunction with more detailed embodiments.

[0085] The high-gain antenna module 20 includes a substrate 202, a ground layer 201, and a radiating layer 203. The substrate 202 is rectangular and positioned between the headset's printed circuit board and the outer side 103 of the housing 10. The first side surface of the substrate 202 is adjacent to the inner side 101 of the housing 10, while the second side surface of the substrate 202 is adjacent to the outer side 103 of the housing 10. The substrate 202 has a length of 42 mm, a width of 10 mm, and a height (i.e., thickness) of 3 mm. The ground layer 201 is a copper layer 201 with a length of 42 mm, a width of 10 mm, and a thickness of 0.02 mm. It is flatly positioned on the second side surface of the substrate 202. The radiating layer 203 includes a first radiating portion 2031 and a second radiating portion 2032. The first radiating portion 2031 is 32 mm long and 10 mm wide, and is flatly arranged on one end of the first side surface of the substrate 202. The second radiating portion 2032 is 10 mm long and 0.5 mm wide, directly connected to the first radiating portion 2031, and is arranged on the other end of the first side surface of the substrate 202. A solder joint is provided on a surface between the first and second side surfaces of the substrate 202. The second radiating portion 2032 extends to the solder joint and is connected to the RF base 61 through the solder joint. The RF base 61 is connected to the Bluetooth chip 62. The RF base 61 and the SCO can also be placed on a silver circuit board. In this way, a Bluetooth headset with high gain is constructed. During user use, when the high-gain antenna module 20 is in operation, the energy generated toward the user is reflected outward (away from the user), thereby enhancing the external radiation capability of the high-gain antenna module 20, thereby effectively improving the communication distance of the Bluetooth headset, that is, improving the communication distance between Bluetooth headsets.

[0086] The Bluetooth headset of the above embodiment is verified, and its S11 return loss, Smith chart (Smith chart, a graph describing the impedance characteristics of the headset), and antenna radiation efficiency graph are shown in Figures 7, 8, and 9, respectively. It can be seen that the radiation efficiency of the high-gain antenna module 20 provided in this application is basically the same as the efficiency of the conventional headset antenna. Furthermore, compared with the antenna radiation pattern shown in Figure 10, it can be seen that the gain of the high-gain antenna module 20 of the embodiment of the present application is -1.78dBi, while the gain of the conventional antenna is -5.76dBi. The gain of the high-gain antenna module 20 is 4dB higher than that of the conventional one, which has obvious advantages. Therefore, if both bilateral Bluetooth headsets (left and right Bluetooth headsets) are equipped with the high-gain antenna module 20 of this application, the use distance can be doubled, that is, it meets the long-distance Bluetooth data transmission scenario of more than 100m.

[0087] An embodiment of the present application also provides a headphone device, comprising two Bluetooth headphones as described above.

[0088] As shown in the above embodiments and drawings, the two Bluetooth earphones are respectively a left earphone and a right earphone. In one embodiment, the Bluetooth earphones further include a charging box, and both Bluetooth earphones can be stored in the charging box for charging.

[0089] The above-mentioned Bluetooth devices, such as any Bluetooth headset, include a housing 10, a high-gain antenna module 20, and a signal processing device. Data transmission between Bluetooth headsets is achieved by placing the high-gain antenna module 20 inside the housing 10 of the Bluetooth headset. The high-gain antenna module 20 includes a substrate 202, a radiating layer 203, and a ground layer 201. The radiating layer 203 is disposed on a first side surface of the substrate 202, while the ground layer 201 is disposed on a second side surface of the substrate 202. When the high-gain antenna is disposed inside the housing 10, the first side surface of the substrate 202 is disposed near the inner side 101 of the housing 10 where the sound outlet is disposed, and the second side surface of the substrate 202 is disposed near the outer side 103 of the housing 10, which is opposite to the inner side 101. With this solution, when the earphones are worn, the inner side 101 of the housing 10, where the sound outlet is located, is close to the user, while the outer side 103, located opposite the user, is located away from the user. This allows the energy generated by the high-gain antenna module 20 and directed toward the user to be reflected outward (away from the user), enhancing the external radiation capability of the high-gain antenna module 20. With this solution, both Bluetooth earphones can perform energy reflection, ensuring data exchange between the two Bluetooth earphones at a longer distance and improving communication reliability between the Bluetooth earphones.

[0090] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0091] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A Bluetooth headset, comprising: case; a high-gain antenna module disposed inside the housing, the high-gain antenna module comprising a substrate, a ground layer, and a radiating layer, the radiating layer being disposed on a first side surface of the substrate close to the inner side of the housing, and the ground layer being disposed on a second side surface of the substrate close to the outer side of the housing, wherein the inner side of the housing is the side of the housing provided with a sound outlet, and the outer side of the housing is disposed opposite the inner side of the housing; and The signal processing device is electrically connected to the radiation layer.

2. The Bluetooth headset according to claim 1, wherein: The radiation layer includes a first radiation portion and a second radiation portion that are connected to each other. The second radiation portion is electrically connected to the signal processing device. The width of the first radiation portion is greater than that of the second radiation portion.

3. The Bluetooth headset according to claim 1, wherein: The radiation layer includes a first radiation portion and a second radiation portion that are connected to each other. The second radiation portion is electrically connected to the signal processing device. The length of the first radiation portion is greater than that of the second radiation portion.

4. The Bluetooth headset according to claim 2, wherein: The first radiation portion has a width consistent with that of the base, and is flatly arranged on the first side surface of the base.

5. The Bluetooth headset according to claim 2, wherein: A ratio of a width of the first radiation portion to a width of the second radiation portion is 10:1 to 100:

1.

6. The Bluetooth headset according to claim 5, wherein: The second radiation portion has a width of 0.1 mm to 1 mm and is flatly arranged on the first side surface of the base.

7. The Bluetooth headset according to any one of claims 1 to 6, wherein: The thickness of the stratum is 0.01 mm to 0.1 mm.

8. The Bluetooth headset according to any one of claims 1 to 6, wherein: The thickness of the radiation layer is 0.01 mm to 0.1 mm.

9. The Bluetooth headset according to any one of claims 1 to 6, wherein: The thickness of the substrate is 2 mm to 5 mm.

10. The Bluetooth headset according to any one of claims 1 to 6, wherein: The Bluetooth headset further includes a printed circuit board, which is arranged on a side of the high-gain antenna module close to the ground layer.

11. The Bluetooth headset according to any one of claims 1 to 6, wherein: The signal processing device includes a Bluetooth chip and a radio frequency base. The base is further provided with welding points. The radiation layer is connected to the radio frequency base through the welding points, and the radio frequency base is connected to the Bluetooth chip.

12. The Bluetooth headset according to any one of claims 1 to 6, wherein: The shell includes an ear hook shell, and the high-gain antenna module is arranged inside the ear hook shell.

13. The Bluetooth headset according to any one of claims 1 to 6, wherein: The housing includes an ear rod housing, and the high-gain antenna module is arranged inside the ear rod housing.

14. The Bluetooth headset according to any one of claims 1 to 6, wherein: The gain range of the high-gain antenna module is -3dbi to 0dbi.

15. The Bluetooth headset according to any one of claims 1 to 6, wherein: The relative dielectric constant of the substrate is 3 to 5.

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