Acoustic component temperature drift prediction method and system and related device

Abstract

The present invention is applicable to the technical field of wireless communications, and particularly relates to an acoustic component temperature drift prediction method and system and a related device. The present invention comprises: by means of a prearranged method, modifying material parameters of a first two-dimensional simulation model; under conditions of a prearranged input signal frequency, a prearranged environmental temperature and prearranged input power, performing acoustic simulation on a second two-dimensional simulation model; substituting component loss data into a three-dimensional equivalent model for steady-state heat transfer simulation; substituting an actual operating temperature into the second two-dimensional simulation model for calculation; and, on the basis of first admittance data and second admittance data, predicting the temperature drift of an acoustic component. The present invention uses multi-field coupling and solution inheritance of solid mechanics, electrostatics and heat transfer, and takes into account the effect of the self-heating of acoustic components on component performance and heat transfer conditions of environments where the components are located, thus effectively improving the capability of predicting the temperature drift performance of the acoustic components, greatly reducing resource consumption in component design, and accelerating product iteration.

Description

A temperature drift prediction method and system for an acoustic device and related equipment TECHNICAL FIELD

[0001] The present application is suitable for the field of wireless communication technology, and particularly relates to a temperature drift prediction method and system for an acoustic device and related equipment. BACKGROUND

[0002] The working frequency of acoustic devices such as surface acoustic wave (SAW) piezoelectric devices and bulk acoustic wave (BAW) piezoelectric devices will drift with changes in temperature, which is referred to as temperature drift. The temperature drift characteristic will cause the passband of a filter to shift, which will affect the insertion loss of the passband, especially the insertion loss at the edge of the passband, and the out-of-band suppression. In the design of a radio frequency filter, it is necessary to minimize the temperature drift, appropriately widen the range of the passband, reduce the transition band range, ensure that the shifted passband can still cover the target frequency band, and the out-of-band suppression can still meet the index requirements. Therefore, improving the temperature drift performance prediction capability of the design end will greatly reduce the resource consumption of device design and accelerate product iteration.

[0003] However, the temperature drift prediction model used in the prior art only considers the influence of changes in ambient temperature on the temperature drift of SAW piezoelectric devices and BAW piezoelectric devices, but ignores the fact that even at a very small input power, the self-heating of the piezoelectric device will cause a regional temperature change, thereby causing a certain disturbance to the device performance. In addition, the existing prediction technology does not take into account the heat transfer conditions of the environment in which the acoustic device is located, thereby leading to inaccurate temperature prediction.

[0004] Therefore, there is an urgent need for a new temperature drift prediction method and system for an acoustic device and related equipment to solve the above problems. SUMMARY

[0005] The present application provides a temperature drift prediction method and system for an acoustic device and related equipment, aiming to solve the problem that the prior art ignores the fact that even at a very small input power, the self-heating of the acoustic device will cause a regional temperature change, thereby causing a certain disturbance to the device performance, and does not take into account the heat transfer conditions of the environment in which the acoustic device is located, thereby leading to inaccurate temperature prediction.

[0006] In a first aspect, the present application provides a temperature drift prediction method for an acoustic device, which comprises the following steps:

[0007] S1, a first two-dimensional simulation model corresponding to a resonator in the acoustic device is established;

[0008] S2, a material parameter of the first two-dimensional simulation model is modified by a preset method to obtain a second two-dimensional simulation model; wherein the material parameter includes a thermal expansion coefficient, an elastic constant, a piezoelectric constant, a dielectric constant and a density;

[0009] S3. Establish a three-dimensional equivalent model of the acoustic device;

[0010] S4. Perform acoustic simulation on the second two-dimensional simulation model under preset input signal frequency, preset ambient temperature and preset input power conditions to obtain device loss data and first admittance data of the second two-dimensional simulation model;

[0011] S5. Substitute the device loss data into the three-dimensional equivalent model to perform heat transfer steady-state simulation to obtain the actual operating temperature of the heating area of ​​the acoustic device.

[0012] S6. Substitute the actual operating temperature into the second two-dimensional simulation model for calculation to obtain the second admittance data;

[0013] S7. Based on the first admittance data and the second admittance data, predict the temperature drift of the acoustic device to obtain the temperature drift prediction result.

[0014] Preferably, the preset method is as follows:

[0015] The thermal expansion coefficient of the first two-dimensional simulation model is modified using the first modification rule;

[0016] Based on the thermistor characteristics corresponding to the resonator, the elastic constant, piezoelectric constant, dielectric constant, and density of the first two-dimensional simulation model are modified according to the second modification rule to obtain the second two-dimensional simulation model.

[0017] Preferably, if T is defined as the operating temperature and T0 as the ambient temperature, then the first modification rule satisfies the following relationship:

[0018] in, Both represent constants, α i (T) represents the coefficient of thermal expansion of the resonator at operating temperature T, α i (T0) represents the coefficient of thermal expansion of the resonator at ambient temperature T0.

[0019] Preferably, the second modification rule satisfies the following relationship:

[0020] Among them, C ijkl (T) represents the elastic constant at operating temperature T, e kij (T) represents the piezoelectric constant at operating temperature T, ε kj ρ(T) represents the dielectric constant at operating temperature T, and ρ(T) represents the density at operating temperature T. as well as All of these represent the material properties of the resonator.

[0021] Preferably, the acoustic device is a surface acoustic wave piezoelectric device or a bulk acoustic wave piezoelectric device.

[0022] In a second aspect, the present application further provides a temperature drift prediction system of an acoustic device, the temperature drift prediction system comprising:

[0023] a two-dimensional model establishing module configured to establish a first two-dimensional simulation model corresponding to a resonator in the acoustic device;

[0024] a material parameter modifying module configured to modify material parameters of the first two-dimensional simulation model by a preset method to obtain a second two-dimensional simulation model, wherein the material parameters include a thermal expansion coefficient, an elastic constant, a piezoelectric constant, a dielectric constant and a density;

[0025] a three-dimensional model establishing module configured to establish a three-dimensional equivalent model of the acoustic device;

[0026] an acoustic simulation module configured to perform acoustic simulation on the second two-dimensional simulation model under a preset input signal frequency, a preset ambient temperature and a preset input power to obtain device loss data and first admittance data of the second two-dimensional simulation model;

[0027] a heat transfer steady-state simulation module configured to substitute the device loss data into the three-dimensional equivalent model to perform heat transfer steady-state simulation to obtain an actual working temperature of a heating area of the acoustic device;

[0028] an admittance calculation module configured to substitute the actual working temperature into the second two-dimensional simulation model to perform calculation to obtain second admittance data;

[0029] a temperature drift prediction module configured to predict temperature drift of the acoustic device according to the first admittance data and the second admittance data to obtain a temperature drift prediction result.

[0030] In a third aspect, the present application further provides a computer device, comprising a memory, a processor and a temperature drift prediction program of an acoustic device stored in the memory and executable on the processor, wherein the processor implements the steps in the temperature drift prediction method of the acoustic device according to any one of the above embodiments when executing the temperature drift prediction program of the acoustic device.

[0031] In a fourth aspect, the present application further provides a computer readable storage medium, wherein the computer readable storage medium stores a temperature drift prediction program of an acoustic device, and the temperature drift prediction program of the acoustic device implements the steps in the temperature drift prediction method of the acoustic device according to any one of the above embodiments when executed by a processor.

[0032] Compared with the prior art, the application establishes a first two-dimensional simulation model corresponding to a resonator in an acoustic device; modifies material parameters of the first two-dimensional simulation model by a preset method to obtain a second two-dimensional simulation model; establishes a three-dimensional equivalent model of the acoustic device; performs acoustic simulation on the second two-dimensional simulation model under a preset input signal frequency, a preset ambient temperature and a preset input power to obtain device loss data and first admittance data of the second two-dimensional simulation model; substitutes the device loss data into the three-dimensional equivalent model to perform heat transfer steady-state simulation and obtain an actual working temperature of a heating area of the acoustic device; substitutes the actual working temperature into the second two-dimensional simulation model to obtain second admittance data; and predicts temperature drift of the acoustic device according to the first admittance data and the second admittance data to obtain a temperature drift prediction result. In this way, the application effectively improves the prediction ability of the temperature drift performance of the acoustic device by multi-field coupling and solution inheritance of solid mechanics, electrostatics and heat transfer, considers the influence of self-heating of the acoustic device on the device performance and the heat transfer condition of the environment where the device is located, greatly reduces the resource consumption of device design and speeds up product iteration. BRIEF DESCRIPTION OF DRAWINGS

[0033] The application will be described in detail below with reference to the drawings. The above or other aspects of the application will become more apparent and more readily appreciated through the detailed description, taken in conjunction with the following drawings, in which:

[0034] Fig. 1 is a flowchart of a temperature drift prediction method of an acoustic device according to an embodiment of the application;

[0035] Fig. 2 is a schematic diagram of a first two-dimensional simulation model of the temperature drift prediction method of the acoustic device according to an embodiment of the application;

[0036] Fig. 3 is a schematic diagram of a three-dimensional equivalent model of the temperature drift prediction method of the acoustic device according to an embodiment of the application;

[0037] Fig. 4 is a schematic diagram of a temperature drift prediction result of the temperature drift prediction method of the acoustic device according to an embodiment of the application;

[0038] Fig. 5 is a schematic diagram of a structure of a temperature drift prediction system of the acoustic device according to an embodiment of the application;

[0039] Fig. 6 is a schematic diagram of a structure of a computer device according to an embodiment of the application. DETAILED DESCRIPTION

[0040] In order to make the objectives, technical solutions and advantages of the application clearer, the application will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the application and not to limit the application.

[0041] Embodiment One

[0042] Referring to FIGS. 1-4, the present application provides a temperature drift prediction method of an acoustic device, which comprises the following steps:

[0043] S1, a first two-dimensional simulation model corresponding to a resonator in the acoustic device is established;

[0044] In the embodiment of the present application, the first two-dimensional simulation model is modeled based on a finite element simulation software, and the acoustic device is a surface acoustic wave piezoelectric device or a bulk acoustic wave piezoelectric device.

[0045] Specifically, taking a surface acoustic wave piezoelectric device with a lithium niobate LiNbO3 substrate as an example, in other application scenarios, the device can be a device of other materials, a bulk acoustic wave piezoelectric device, other piezoelectric devices, or a filter formed by cascading devices.

[0046] S2, a material parameter of the first two-dimensional simulation model is modified by a preset method to obtain a second two-dimensional simulation model; wherein the material parameter includes a thermal expansion coefficient, an elastic constant, a piezoelectric constant, a dielectric constant, and a density;

[0047] In the embodiment of the present application, the first two-dimensional simulation model of the resonator of the surface acoustic wave piezoelectric device is established, as shown in FIG. 2, which is a first two-dimensional simulation model schematic diagram of the temperature drift prediction method of the acoustic device provided by the embodiment of the present application, and the preset method is:

[0048] The thermal expansion coefficient of the first two-dimensional simulation model is modified by a first modification rule; the material parameter in the first two-dimensional simulation model is modified so that it changes from a constant to a temperature relationship. First, consider thermal expansion, and obtain the thermal expansion coefficient of the material corresponding to the resonator. The thermal expansion coefficient refers to the relative change amount of the length or volume of an object per unit length or unit volume when the temperature rises by 1℃. It is generally given in the form of Taylor expansion:

[0049] Specifically, define T as the working temperature and T0 as the environmental temperature, and the first modification rule satisfies the following relationship:

[0050] wherein, both represent constants, and i (T) represents the thermal expansion coefficient of the resonator at the working temperature T, and i (T0) represents the thermal expansion coefficient of the resonator at the environmental temperature T0.

[0051] Then, considering the thermal sensitivity of the material, the temperature will affect the elastic constant, piezoelectric constant, dielectric constant and density of the piezoelectric material, and the elastic constant, piezoelectric constant, dielectric constant and density of the first two-dimensional simulation model are modified according to the thermal sensitivity corresponding to the resonator through a second modification rule, to obtain a second two-dimensional simulation model.

[0052] The second modification rule satisfies the following relationship:

[0053] Wherein, C ijkl (T) represents the elastic constant at the working temperature T, e kij (T) represents the piezoelectric constant at the working temperature T, ε kj (T) represents the dielectric constant at the working temperature T, and p(T) represents the density at the working temperature T. And Both represent the material properties of the resonator.

[0054] It should be noted that for the metal electrode, the metal film TCR and the thermal expansion coefficient also need to be considered, which are ignored in the present example. The θ related terms in all the above formulas need to be obtained by consulting literature.

[0055] S3, a three-dimensional equivalent model of the acoustic device is established;

[0056] In the embodiment of the application, as shown in Figure 3, Figure 3 is a three-dimensional equivalent model schematic diagram of the temperature drift prediction method of the acoustic device provided by the embodiment of the application, wherein the dark part is the device working area, i.e. the heating area of the acoustic device.

[0057] S4, acoustic simulation is performed on the second two-dimensional simulation model under the conditions of a preset input signal frequency, a preset environmental temperature and a preset input power, to obtain device loss data and first admittance data of the second two-dimensional simulation model;

[0058] In the embodiment of the application, the device loss data Qh and the first admittance data Y1 under the conditions of a preset input signal frequency freq, a preset environmental temperature T0 and a preset input power P are obtained by performing acoustic frequency domain simulation on the second two-dimensional simulation model. The device loss data Qh can be a built-in loss operator of the finite element simulation software, such as Qh_tot, or can be loss data calculated by current and voltage. In the present embodiment, the total power consumption operator Qh=solid.Qh_tot is used. It should be noted that the preset input power P should be at the same level as the input power when the acoustic device is normally working, otherwise the simulation accuracy of the acoustic device will be affected.

[0059] S5, substituting the device loss data into the three-dimensional equivalent model for heat transfer steady-state simulation to obtain an actual working temperature of a heat generation region of the acoustic device;

[0060] In the embodiment of the present application, the device loss data Qh is substituted into the three-dimensional equivalent model, and the initial working temperature is T0. The dark region is taken as a heat source of the working region of the acoustic device, and heat transfer steady-state simulation is performed to obtain the actual working temperature T1 of the acoustic device (representing the average working temperature of the surface of the dark region at the actual time, i.e., the resonator temperature). This step not only considers the influence of the ambient temperature on the acoustic device, but also considers the temperature change caused by the self-heating effect of the acoustic device under small signal input.

[0061] S6, substituting the actual working temperature into the second two-dimensional simulation model for calculation to obtain second admittance data;

[0062] In the embodiment of the present application, the actual working temperature T1 is inherited as the ambient temperature of the second two-dimensional equivalent model to obtain the second admittance data Y2 of the acoustic device under the preset input signal frequency freq and the preset input power P.

[0063] S7, predicting the temperature drift of the acoustic device according to the first admittance data and the second admittance data to obtain a temperature drift prediction result.

[0064] In the embodiment of the present application, the temperature drift prediction result is shown in FIG. 4, which is a schematic diagram of the temperature drift prediction result of the temperature drift prediction method of the acoustic device according to the embodiment of the present application. The dashed line part is the first admittance data Y1, and the solid line part is the second admittance data Y2.

[0065] Compared with the prior art, the present application establishes a first two-dimensional simulation model corresponding to the resonator in the acoustic device; modifies the material parameters of the first two-dimensional simulation model by a preset method to obtain a second two-dimensional simulation model; establishes a three-dimensional equivalent model of the acoustic device; performs acoustic simulation on the second two-dimensional simulation model under the conditions of a preset input signal frequency, a preset ambient temperature and a preset input power to obtain device loss data and first admittance data of the second two-dimensional simulation model; substitutes the device loss data into the three-dimensional equivalent model for heat transfer steady-state simulation to obtain an actual working temperature of a heat generation region of the acoustic device; substitutes the actual working temperature into the second two-dimensional simulation model for calculation to obtain second admittance data; and predicts the temperature drift of the acoustic device according to the first admittance data and the second admittance data to obtain a temperature drift prediction result. In this way, the present application effectively improves the prediction ability of the temperature drift performance of the acoustic device by multi-field coupling and solution inheritance of solid mechanics, electrostatics and heat transfer, simultaneously considers the influence of the self-heating of the acoustic device on the device performance and the heat transfer condition of the environment where the device is located, effectively improves the prediction ability of the temperature drift performance of the acoustic device, greatly reduces the resource consumption of device design, and speeds up product iteration.

[0066] Embodiment Two

[0067] The embodiment of the present application also provides a temperature drift prediction system 200 of an acoustic device, referring to Fig. 5, which is a structural schematic diagram of the temperature drift prediction system 200 of the acoustic device provided by the embodiment of the present application, and the system comprises:

[0068] 201, a two-dimensional model establishing module, configured to establish a first two-dimensional simulation model corresponding to a resonator in the acoustic device;

[0069] In the embodiment of the present application, the first two-dimensional simulation model is modeled based on a finite element simulation software, and the acoustic device is a surface acoustic wave piezoelectric device or a bulk acoustic wave piezoelectric device.

[0070] Specifically, taking a surface acoustic wave piezoelectric device with a lithium niobate LiNbO3 substrate as an example, in other application scenarios, the device can be a device of other materials, a bulk acoustic wave piezoelectric device, other piezoelectric devices, or a filter formed by cascading devices.

[0071] 202, a material parameter modifying module, configured to modify material parameters of the first two-dimensional simulation model by a preset method to obtain a second two-dimensional simulation model; wherein the material parameters include a thermal expansion coefficient, an elastic constant, a piezoelectric constant, a dielectric constant, and a density;

[0072] In the embodiment of the present application, the first two-dimensional simulation model of the resonator of the surface acoustic wave piezoelectric device is established, as shown in Fig. 2, which is a first two-dimensional simulation model schematic diagram of the temperature drift prediction method of the acoustic device provided by the embodiment of the present application, and the preset method is:

[0073] The thermal expansion coefficient of the first two-dimensional simulation model is modified by a first modification rule; the material parameters in the first two-dimensional simulation model are modified so that they change from constants to temperature relations. First, thermal expansion is considered, and the thermal expansion coefficient of the material corresponding to the resonator needs to be obtained. The thermal expansion coefficient refers to the relative change amount of the length or volume of an object per unit length or volume when the temperature rises by 1℃. It is generally given in the form of Taylor expansion:

[0074] Specifically, T is defined as the working temperature, and T0 is defined as the environmental temperature, and the first modification rule satisfies the following relation:

[0075] wherein, both represent constants, and i (T) represents the thermal expansion coefficient of the resonator at the working temperature T, and i (T0) represents the thermal expansion coefficient of the resonator at the environmental temperature T0.

[0076] Then, considering the thermal sensitivity of the material, the temperature will affect the elastic constant, piezoelectric constant, dielectric constant and density of the piezoelectric material, and the elastic constant, piezoelectric constant, dielectric constant and density of the first two-dimensional simulation model are modified according to the thermal sensitivity of the resonator through a second modification rule to obtain a second two-dimensional simulation model.

[0077] The second modification rule satisfies the following relationship:

[0078] Wherein, C ijkl (T) represents the elastic constant at the working temperature T, e kij (T) represents the piezoelectric constant at the working temperature T, ε kj (T) represents the dielectric constant at the working temperature T, and p(T) represents the density at the working temperature T. And Both represent the material properties of the resonator.

[0079] It should be noted that for the metal electrode, the metal film TCR and the thermal expansion coefficient should also be considered, which are ignored in the present example. The θ related terms in all the above formulas need to be consulted from the literature.

[0080] 203, a three-dimensional model establishing module, used for establishing a three-dimensional equivalent model of the acoustic device;

[0081] In the embodiment of the present application, as shown in Figure 3, Figure 3 is a three-dimensional equivalent model schematic diagram of the acoustic device drift prediction method provided by the embodiment of the present application, wherein the dark part is the device working area, that is, the heating area of the acoustic device.

[0082] 204, an acoustic simulation module, used for performing acoustic simulation on the second two-dimensional simulation model under the conditions of a preset input signal frequency, a preset ambient temperature and a preset input power, to obtain device loss data and first admittance data of the second two-dimensional simulation model;

[0083] In the embodiment of the present application, the device loss data Qh and the first admittance data Y1 under the conditions of a preset input signal frequency freq, a preset ambient temperature T0 and a preset input power P are obtained by simulating the second two-dimensional simulation model in the acoustic frequency domain. The device loss data Qh can be a built-in loss operator of the finite element simulation software, such as Qh_tot, or can be loss data calculated by current and voltage. In the present embodiment, the total power consumption operator Qh=solid.Qh_tot is adopted. It should be noted that the preset input power P should be at the same level as the input power when the acoustic device is normally working, otherwise the simulation accuracy of the acoustic device will be affected.

[0084] 205、a heat transfer steady-state simulation module, configured to substitute the device loss data into the three-dimensional equivalent model for heat transfer steady-state simulation to obtain an actual working temperature of a heat generation region of the acoustic device;

[0085] In the embodiment of the present application, the device loss data Qh is substituted into the three-dimensional equivalent model with an initial working temperature T0. The dark region is taken as a heat source of the working region of the acoustic device, and heat transfer steady-state simulation is performed to obtain an actual working temperature T1 of the acoustic device (representing the average surface working temperature of the dark region at the actual time, i.e., the resonator temperature). This step not only considers the influence of the ambient temperature on the acoustic device, but also considers the temperature change caused by the self-heating effect of the acoustic device under small signal input.

[0086] 206、a conductance calculation module, configured to substitute the actual working temperature into the second two-dimensional simulation model for calculation to obtain second conductance data;

[0087] In the embodiment of the present application, the actual working temperature T1 is taken as the ambient temperature of the second two-dimensional equivalent model to obtain the second conductance data Y2 of the acoustic device under the preset input signal frequency freq and the preset input power P.

[0088] 207、a temperature drift prediction module, configured to predict the temperature drift of the acoustic device according to the first conductance data and the second conductance data to obtain a temperature drift prediction result.

[0089] In the embodiment of the present application, the temperature drift prediction result is shown in FIG. 4, which is a temperature drift prediction result schematic diagram of the acoustic device temperature drift prediction method provided by the embodiment of the present application. The dashed line part is the first conductance data Y1, and the solid line part is the second conductance data Y2.

[0090] The acoustic device temperature drift prediction system 200 can realize the steps in the acoustic device temperature drift prediction method in the above-described embodiments, and can realize the same technical effects. Please refer to the description in the above-described embodiments, which will not be repeated here.

[0091] Embodiment three

[0092] The embodiment of the present application also provides a computer device. Please refer to FIG. 6, which is a structural schematic diagram of a computer device provided by the embodiment of the present application. The computer device 300 includes a memory 302, a processor 301, and an acoustic device temperature drift prediction program stored in the memory 302 and capable of running on the processor 301.

[0093] The processor 301 invokes the acoustic device temperature drift prediction program stored in the memory 302 to execute the steps in the acoustic device temperature drift prediction method provided by the embodiment of the present application. Please refer to FIG. 6, which specifically includes the following steps:

[0094] S1, a first two-dimensional simulation model corresponding to a resonator in an acoustic device is established;

[0095] S2, a material parameter of the first two-dimensional simulation model is modified by a preset method to obtain a second two-dimensional simulation model; wherein the material parameter includes a thermal expansion coefficient, an elastic constant, a piezoelectric constant, a dielectric constant and a density;

[0096] S3, a three-dimensional equivalent model of the acoustic device is established;

[0097] S4, the second two-dimensional simulation model is subjected to acoustic simulation under a preset input signal frequency, a preset ambient temperature and a preset input power condition to obtain device loss data and first admittance data of the second two-dimensional simulation model;

[0098] S5, the device loss data is substituted into the three-dimensional equivalent model to perform heat transfer steady-state simulation to obtain an actual working temperature of a heating area of the acoustic device;

[0099] S6, the actual working temperature is substituted into the second two-dimensional simulation model to perform calculation to obtain second admittance data;

[0100] S7, temperature drift of the acoustic device is predicted according to the first admittance data and the second admittance data to obtain a temperature drift prediction result.

[0101] The computer device 300 provided by the embodiment of the present application can realize the steps in the temperature drift prediction method of the acoustic device in the above-mentioned embodiment, and can realize the same technical effects. For details, refer to the description in the above-mentioned embodiment, which will not be repeated here.

[0102] Embodiment four

[0103] The embodiment of the present application also provides a computer readable storage medium, which stores an acoustic device temperature drift prediction program. The acoustic device temperature drift prediction program is executed by a processor to realize each process and step in the acoustic device temperature drift prediction method provided by the embodiment of the present application, and can realize the same technical effects. To avoid repetition, it will not be repeated here.

[0104] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment method can be completed by a computer program instructing related hardware. The program can be stored in a computer readable storage medium. When the program is executed, it can include the processes of the above-mentioned embodiments. The storage medium can be a magnetic disc, an optical disc, a read-only memory (ROM) or a random access memory (RAM).

[0105] It is to be understood that the terms "including", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus. An element proceeded by "comprises a... " does not, without more constraints, exclude the existence of additional identical elements in the process, method, article, or apparatus that comprises the element.

[0106] Those skilled in the art can clearly understand the above-mentioned embodiment method can be realized by means of software and necessary general hardware platform, of course, also can be realized by hardware, but in many cases, the former is the better embodiment. Based on such understanding, the technical solutions of the present application can be embodied in the form of software product, and the computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk), including a plurality of instructions to make a terminal (may be mobile phone, computer, server, air conditioner, or network equipment, etc.) execute the method described in various embodiments of the present application.

[0107] The above describes the embodiments of the present application in conjunction with the drawings, the disclosed is only the preferred embodiment of the present application, but the present application is not limited to the above specific embodiments, the above specific embodiments are only illustrative, but not restrictive, those skilled in the art can make many equivalent changes without departing from the scope of the present application under the inspiration of the present application, all belong to the protection of the present application.

Claims

1. A method for predicting temperature drift of an acoustic device, characterized in that, The temperature drift prediction method comprises the following steps: S1, a first two-dimensional simulation model corresponding to a resonator in an acoustic device is established; S2, material parameters of the first two-dimensional simulation model are modified by a preset method to obtain a second two-dimensional simulation model; wherein the material parameters comprise a thermal expansion coefficient, an elastic constant, a piezoelectric constant, a dielectric constant and a density; S3, a three-dimensional equivalent model of the acoustic device is established; S4, acoustic simulation is performed on the second two-dimensional simulation model under a preset input signal frequency, a preset environmental temperature and a preset input power condition to obtain device loss data and first admittance data of the second two-dimensional simulation model; S5, the device loss data is substituted into the three-dimensional equivalent model for heat transfer steady-state simulation to obtain an actual working temperature of a heating area of the acoustic device; S6, the actual working temperature is substituted into the second two-dimensional simulation model for calculation to obtain second admittance data; S7, temperature drift of the acoustic device is predicted according to the first admittance data and the second admittance data to obtain a temperature drift prediction result.

2. The acoustic device temperature drift prediction method of claim 1, wherein, The preset method is: the thermal expansion coefficient of the first two-dimensional simulation model is modified according to a first modification rule; the elastic constant, the piezoelectric constant, the dielectric constant and the density of the first two-dimensional simulation model are modified according to a thermal sensitivity characteristic of the resonator by a second modification rule to obtain the second two-dimensional simulation model.

3. The acoustic device temperature drift prediction method of claim 2, wherein, where T is the operating temperature and To is the ambient temperature, the first modification rule satisfies the following relationship: wherein represent constants, a i (T) represents the thermal expansion coefficient corresponding to the resonator at the operating temperature T, a i (T0) represents the thermal expansion coefficient corresponding to the resonator at the ambient temperature T0.

4. The acoustic device temperature drift prediction method of claim 3, wherein, The second modification rule satisfies the following relationship: where C ijkl (T) represents the elastic constant at the operating temperature T, e kij (T) represents the piezoelectric constant at the operating temperature T, ε kj (T) represents the dielectric constant at the operating temperature T, ρ(T) represents the density at the operating temperature T, and Both represent material properties of the resonator.

5. The acoustic device temperature drift prediction method of claim 1, wherein, The acoustic device is a surface acoustic wave piezoelectric device or a bulk acoustic wave piezoelectric device.

6. A temperature drift prediction system for an acoustic device, characterized by The temperature drift prediction system comprises: a two-dimensional model establishment module configured to establish a first two-dimensional simulation model corresponding to a resonator in an acoustic device; a material parameter modification module configured to modify material parameters of the first two-dimensional simulation model by a preset method to obtain a second two-dimensional simulation model; wherein the material parameters comprise a thermal expansion coefficient, an elastic constant, a piezoelectric constant, a dielectric constant and a density; a three-dimensional model establishment module configured to establish a three-dimensional equivalent model of the acoustic device; an acoustic simulation module configured to perform acoustic simulation on the second two-dimensional simulation model under a preset input signal frequency, a preset environmental temperature and a preset input power condition to obtain device loss data and first admittance data of the second two-dimensional simulation model; a heat transfer steady-state simulation module configured to substitute the device loss data into the three-dimensional equivalent model for heat transfer steady-state simulation to obtain an actual working temperature of a heating area of the acoustic device; an admittance calculation module configured to substitute the actual working temperature into the second two-dimensional simulation model for calculation to obtain second admittance data; a temperature drift prediction module configured to predict temperature drift of the acoustic device according to the first admittance data and the second admittance data to obtain a temperature drift prediction result.

7. The temperature drift prediction system of an acoustic device of claim 6, wherein, The preset method is: the thermal expansion coefficient of the first two-dimensional simulation model is modified according to a first modification rule; the elastic constant, the piezoelectric constant, the dielectric constant and the density of the first two-dimensional simulation model are modified according to a thermal sensitivity characteristic of the resonator by a second modification rule to obtain the second two-dimensional simulation model.

8. The temperature drift prediction system of an acoustic device of claim 6, wherein, The acoustic device is a surface acoustic wave piezoelectric device or a bulk acoustic wave piezoelectric device.

9. A computer device, comprising: The acoustic device comprises: A memory, a processor, and a temperature drift prediction program of the acoustic device stored in the memory and executable on the processor, wherein the processor implements the steps in the temperature drift prediction method of the acoustic device according to any one of claims 1-5 when executing the temperature drift prediction program of the acoustic device.

10. A computer-readable storage medium, characterized in that, A computer readable storage medium having stored thereon a temperature drift prediction program of the acoustic device, wherein the temperature drift prediction program of the acoustic device, when executed by a processor, implements the steps in the temperature drift prediction method of the acoustic device according to any one of claims 1-5.

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