Display substrate and display device

Abstract

A display substrate and a display device. The display substrate comprises a substrate layer (110); the substrate layer (110) comprises a display area (10), an isolation area (20) and an opening area (30) which are sequentially arranged in a first direction; the isolation area (20) comprises isolation columns (21), and each isolation column (21) sequentially comprises a first gate insulating layer (210), a second gate insulating layer (220) and an isolation layer (230) in a second direction, the second direction being perpendicular to the first direction; the projection of the isolation layer (230) on the substrate layer (110) covers the projection of the second gate insulating layer (220) on the substrate layer (110), and the material of the isolation layer (230) is an inorganic material. On this basis, black spot defects of the display area (10) around the opening area (30) of the display substrate can be mitigated.

Description

Display substrate and display device

[0001] The present application claims priority from the Chinese patent application No. 202410634494.2 filed on May 21, 2024 and entitled "Display substrate and display device", the contents of which should be understood as incorporated by reference into the present application. TECHNICAL FIELD

[0002] The present application relates to the technical field of display, more particularly, to a display substrate and a display device. BACKGROUND

[0003] With the increasing demand for high screen-to-body ratio of electronic devices, current smart terminal products are developing towards full-screen display technology. As a light transmission area for functional elements such as cameras and fingerprint recognition, the hole in the display area is the mainstream trend of current full-screen display technology.

[0004] In a flexible display device, the core of the hole in the display area is to separate the organic material. The current separation technology includes organic isolation groove, metal isolation column technology, laser removal technology, etc. Among them, setting the SD metal isolation column has the advantages of increasing the height of the film layer and enhancing the structural strength, but it has the disadvantage of being unable to disconnect the power, which is easy to induce electrochemical corrosion to cause packaging failure, and then produce black spots in the hole area. SUMMARY

[0005] The first aspect of the present application provides a display substrate. The display substrate comprises: a substrate layer, the substrate layer comprising a display area, an isolation area and a hole area arranged in sequence along a first direction; the isolation area comprises an isolation column, the isolation column comprising a first gate insulating layer, a second gate insulating layer and an isolation layer in sequence in a second direction, the second direction being perpendicular to the first direction; wherein the projection of the isolation layer on the substrate layer covers the projection of the second gate insulating layer on the substrate layer, and the material of the isolation layer is inorganic material.

[0006] In a possible implementation, the isolation column comprises a first part, a second part and a third part arranged in sequence along the first direction; the first part and the third part are symmetrically distributed at both ends of the second part, so that the isolation column presents a concave structure.

[0007] In a possible implementation, in the first direction, the size of the second part is greater than the size of the first part and the third part.

[0008] In a possible implementation, the isolation column further includes a first source-drain layer; in the second direction, the isolation layer is disposed between the second gate insulating layer and the first source-drain layer, and a projection of the isolation layer on the substrate layer covers a projection of the first source-drain layer on the substrate layer.

[0009] In a possible implementation, the first portion and the third portion further include a first sacrificial layer and a second sacrificial layer; in the second direction, the first sacrificial layer is disposed between the first gate insulating layer and the second gate insulating layer, and the second sacrificial layer is disposed between the second gate insulating layer and the isolation layer; a projection of the isolation layer on the substrate layer covers projections of the first sacrificial layer and the second sacrificial layer on the substrate layer.

[0010] In a possible implementation, the isolation column further includes a third sacrificial layer and a fourth sacrificial layer; in the second direction, the third sacrificial layer is disposed between the first gate insulating layer and the second gate insulating layer, and the fourth sacrificial layer is disposed between the second gate insulating layer and the isolation layer; wherein, on the substrate layer, a projection of the isolation layer further covers projections of the third sacrificial layer and the fourth sacrificial layer, a projection of the third sacrificial layer covers projections of the second gate insulating layer and the fourth sacrificial layer, and a projection of the second gate insulating layer covers a projection of the fourth sacrificial layer.

[0011] In a possible implementation, the isolation column further includes a second source-drain layer; in the second direction, the isolation layer is disposed between the second gate insulating layer and the second source-drain layer; wherein, a projection of the isolation layer on the substrate layer covers a projection of the second source-drain layer on the substrate layer.

[0012] In a possible implementation, the isolation column further includes a third source-drain layer; in the second direction, the second source-drain layer is disposed between the isolation layer and the third source-drain layer; on the substrate layer, projections of the isolation layer and the second source-drain layer cover a projection of the third source-drain layer.

[0013] In a possible implementation, the isolation column further includes a light-emitting layer; in the second direction, the isolation layer has a size greater than the light-emitting layer.

[0014] In a possible implementation, the isolation layer protrudes from both ends of the second gate layer.

[0015] A second aspect of the present application provides a display device, including the display substrate in any of the implementations of the first aspect.

[0016] BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments of the present application will be briefly introduced as follows. Obviously, the drawings described below are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative effort on the basis of the drawings.

[0018] FIG. 1 is a structural schematic diagram of a display substrate according to an embodiment of the related art;

[0019] FIG. 2 is a structural schematic diagram of a spacer according to an embodiment of the related art;

[0020] FIG. 3 is a structural schematic diagram of a display substrate according to an embodiment of the present application;

[0021] FIG. 4 is a structural schematic diagram of a display substrate according to another embodiment of the present application;

[0022] FIG. 5 is a structural schematic diagram of a spacer according to an embodiment of the present application;

[0023] FIG. 6 is a structural schematic diagram of a spacer according to another embodiment of the present application;

[0024] FIG. 7 is a structural schematic diagram of a spacer according to yet another embodiment of the present application;

[0025] FIG. 8 is a structural schematic diagram of a spacer according to yet another embodiment of the present application;

[0026] FIG. 9 is a structural schematic diagram of a spacer according to yet another embodiment of the present application;

[0027] FIG. 10 is a structural schematic diagram of a spacer according to yet another embodiment of the present application;

[0028] FIG. 11 is a structural schematic diagram of a spacer according to yet another embodiment of the present application;

[0029] FIG. 12 is a structural schematic diagram of a spacer according to yet another embodiment of the present application;

[0030] FIG. 13 is a preparation schematic diagram of a spacer according to an embodiment of the present application;

[0031] FIG. 14 is a preparation schematic diagram of a spacer according to another embodiment of the present application.

[0032] Detailed description

[0033] In order to make the purpose, technical solutions and advantages of the present application more clear, the embodiments of the present application will be further described in detail below with reference to the drawings.

[0034] The ranges disclosed herein are intended to be "open" ranges, i.e., the upper and lower limits of the range are not included. The ranges are also intended to include any and all sub-ranges of the range, i.e., all combinations of any two of the range limits, unless otherwise indicated. For example, a range of "1 to 10" is intended to include any number from 1 to 10, including the end points 1 and 10, and any intervening combinations, e.g., 1-3, 4-7, 8-10, 1-2, 3-4, etc. All such numbers fall within the range of "1 to 10." In addition, the phrase "a range of "a to b" is a shorthand way of referring to the "open" range consisting of any and all sub-ranges between (and including) the minimum "a" and maximum "b" end points. For example, the range "0-5" is intended to include any and all sub-ranges between (and including) the minimum of "0" and the maximum of "5," i.e., any and all sub-ranges whose minimum value is between and including 0 and 5, and whose maximum value is between and including 0 and 5. Thus, the range "0-5" includes the range "1-4," the range "2-3," the range "0-2," the range "3-5," and the like.

[0035] All embodiments and optional embodiments of the present application can be combined with each other to form new technical solutions, unless otherwise specified.

[0036] All technical features and optional technical features of the present application can be combined with each other to form new technical solutions, unless otherwise specified.

[0037] The terms used in the following embodiments are only for the purpose of describing specific embodiments and are not intended to be limiting of the present application. As used in the specification and the appended claims, the singular forms "a," "an" and "the" are intended to include both singular and plural forms, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and / or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. Expressions such as "at least one of," when preceding the syllables of a list of elements, modify the entire list of elements and do not change the meaning of the list.

[0038] Reference in the specification to "one embodiment", "some embodiments", "one implementation", or "some implementations", etc., means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the application. The appearances of the phrase "in one embodiment" or "in some embodiments" in various places in the specification are not necessarily all referring to the same embodiment, although it can. The terms "including", "containing", "having" and variations thereof are meant to encompass the terms "including but not limited to" unless otherwise indicated.

[0039] In the description of the embodiments of the application, the technical terms "first", "second", etc. are only used to distinguish different description objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the application, the meaning of "multiple" is more than two, unless otherwise explicitly specified.

[0040] The embodiments of the application will be described in more detail with reference to the accompanying drawings. In the various drawings, the same elements are denoted by similar reference numerals. For the sake of clarity, the various parts in the drawings are not drawn to scale. In addition, some parts that are well known can not be shown in the drawings.

[0041] With the development and update of display technology, organic electroluminescent display devices (OLED) have gradually become mainstream products in the display field due to their characteristics such as self-emission, high brightness, high contrast, low operating voltage, and the ability to make flexible displays.

[0042] OLED display panels mainly develop towards full-screen and narrower bezels. Therefore, how to realize the opening of the display screen becomes a technical problem in development. At present, when evaporating the electroluminescent layer (EL layer) of the OLED display panel, an open mask (i.e. Open Mask) is usually used to fully evaporate the active area (AA area) of the display panel. Therefore, if it is required to open the display area, the EL layer between the AA area and the hole needs to be blocked to prevent water vapor and oxygen from entering the display area, so as to avoid the growing dark spot at HIAA (GDSH) phenomenon in the AA area, which affects the user experience.

[0043] FIG. 1 is a structural schematic diagram of a display substrate according to an embodiment of the related art. FIG. 2 is a structural schematic diagram of an isolation column according to an embodiment of the related art. As shown in FIG. 1, in a reliability process, K+ is precipitated from a polaroid (POL), and the hole region cathode is negatively charged due to the failure of the isolation column 21 to be de-energized. Water vapor undergoes electrolytic reaction to generate OH-, and K+ and OH- form a strong alkaline environment, which corrodes a chemical vapor deposition (CVD) layer. The CVD layer is corroded to generate holes and swell, leading to encapsulation failure, and then water vapor enters the opening region to generate black spots and other phenomena in the opening region. FIG. 2 shows a conductive path of the cathode material.

[0044] In view of this, embodiments of the present application provide a display substrate and a display device, which further improve the isolation column in the related art, so that the isolation column can play a de-energizing role, and completely solve the GDSH phenomenon caused by electrochemical corrosion.

[0045] FIG. 3 is a structural schematic diagram of a display substrate according to an embodiment of the present application. FIG. 4 is a structural schematic diagram of a display substrate according to another embodiment of the present application. As shown in FIGS. 3 and 4, the display substrate 100 includes a substrate layer 110, which includes a display region 10, an isolation region 20, and an opening region 30 arranged in sequence along a first direction X.

[0046] Exemplarily, the first direction X can be as shown in FIG. 3 or FIG. 4, and the first direction X can be referred to as a length direction of the display substrate 100.

[0047] Specifically, along the first direction X, the display region 10, the isolation region 20, and the opening region 30 are arranged in sequence from left to right.

[0048] The substrate layer 110 is a bottom basic layer of the display substrate 100, and provides support and a structural basis for the display device. The material, thickness, and the like of the substrate layer 110 are not limited in the present application. For example, the substrate layer 110 can be a glass substrate, a polyamide sub-material, and the like. For example, the substrate layer 110 can be a single layer or a double layer.

[0049] It should be understood that the division of the display region 10, the isolation region 20, and the opening region 30 in FIG. 1 is exemplary, and does not constitute a limitation on the structure of the display substrate 100 of the present application.

[0050] FIG. 5 is a structural schematic diagram of an isolation column according to an embodiment of the present application. As shown in FIGS. 3 and 5, the isolation region 20 includes an isolation column 21, which includes a first gate insulating layer 210, a second gate insulating layer 220, and an isolation layer 230 in sequence along a second direction Y, and the second direction Y is perpendicular to the first direction X.

[0051] Exemplarily, the second direction Y can be as shown in FIG. 5, and the second direction Y can also be referred to as a height direction or a thickness direction of the display substrate 100.

[0052] In the second direction Y, the first gate insulating layer 210, the second gate insulating layer 220 and the isolation layer 230 are sequentially arranged, that is, in the second direction Y, the first gate insulating layer 210, the second gate insulating layer 220 and the isolation layer 230 are sequentially arranged from bottom to top, or it can also be said that the isolation layer 230, the second gate insulating layer 220 and the first gate insulating layer 210 are sequentially arranged from top to bottom.

[0053] The projection of the isolation layer 230 on the substrate layer 110 covers the projection of the second gate layer 220 on the substrate layer 110, and the material of the isolation layer 230 is an inorganic material.

[0054] The projection of the isolation layer 230 on the substrate layer 110 covers the projection of the second gate layer 220 on the substrate layer 110, that is, in the first direction X, the size of the isolation layer 230 is greater than the size of the second gate insulating layer 220, and both ends of the isolation layer 230 protrude from both ends of the second gate layer 220.

[0055] It should be understood that, in order to reduce the production difficulty, we default that the center of the projection of the isolation layer 230 on the substrate layer 110 coincides with the center of the projection of the second gate insulating layer 220 on the substrate layer 110, that is, all film layers are symmetrically distributed in the first direction X. If the size of the film layer in the first direction X is mentioned, it is defaulted that the centers of all film layers on the substrate layer 110 are coincided, which will not be described below.

[0056] Please combine FIG. 1, FIG. 3 and FIG. 5. As shown above, the display substrate 100 will be re-evaporated with the light-emitting layer 120 in the subsequent processing process, that is, the conductive material 120 is arranged on the display substrate 100. When the isolation column 21 cannot cut off the conductive path of the conductive material 120 on the display substrate 100, it will cause the black spot phenomenon near the display area 10. When the isolation layer 230 of the inorganic material is arranged above the second gate insulating layer 220, and the projection of the isolation layer 230 on the substrate layer 110 covers the projection of the second gate insulating layer 220 on the substrate layer 110, the loop of the conductive material 120 on the isolation column 21 will be cut off, that is, the conductive loop cannot be formed, and the isolation column 21 plays a role of cutting off the electricity.

[0057] In the above scheme, the substrate layer 110 includes the display area 10, the isolation area 20, and the opening area 30 arranged along the first direction X, the isolation area 20 includes the isolation column 21, and the isolation column 21 includes the first gate insulating layer 210, the second gate insulating layer 220, and the isolation layer 230 arranged along the second direction Y in sequence. By arranging the isolation layer 230 above the second gate insulating layer 220 and the first gate insulating layer 210, and by making the isolation layer 230 be an inorganic material and by making the projection of the isolation layer 230 on the substrate layer 110 cover the projection of the second gate insulating layer 220 on the substrate layer 110, the loop of the conductive material 120 on the isolation column 21 can be cut off, so that the conductive loop cannot be formed, and the isolation column 21 can play a role of cutting off electricity, thereby avoiding the phenomenon of black spots near the display area 10 caused by electrochemical corrosion.

[0058] Specifically, the material of the isolation layer 230 can be a mixture of SiNx and SiOx, or other inorganic materials, which are not limited in the present application.

[0059] Specifically, the display area 10 further includes the first encapsulation layer 11, the second encapsulation layer 12, the pixel definition layer 13, the planarization layer 14, and other some conventional film layers, which are not described herein again.

[0060] Specifically, there is also a common inorganic film layer (not shown in the figure) such as a barrier layer between the substrate layer 110 and the first gate insulating layer 210, which is not described herein again.

[0061] The structure formed by the isolation layer 230 and the second gate insulating layer 220 can also be called a "suspended" structure, that is, the isolation column 21 has a "suspended" structure.

[0062] Please continue to refer to FIG. 5. In some embodiments, the isolation column 21 includes the first portion 130, the second portion 140, and the third portion 150 arranged along the first direction X in sequence; the first portion 130 and the third portion 150 are symmetrically distributed at both ends of the second portion 140, so that the isolation column 21 presents a concave structure.

[0063] Along the first direction X, the first portion 130, the second portion 140, and the third portion 150 are arranged in sequence.

[0064] The first portion 130 and the third portion 150 are symmetrically distributed at both ends of the second portion 140, which can be understood as that the first portion 130 and the third portion 150 are symmetrically distributed at both ends of the second portion 140 or the isolation column 21 with the second portion 140 as the center.

[0065] The isolation column 21 has a concave structure. That is, the second portion 140 is concave, but the first portion 130 and the third portion 150 are convex, that is, in the second direction Y, the height of the positions where the first portion 130 and the third portion 150 are located is higher than the position where the second portion 140 is located. Therefore, we can also describe the isolation column 21 at this time as a structure of "two ends are raised and the middle is concave".

[0066] In the above scheme, in the second direction Y, the first portion 130 and the third portion 150 are symmetrically distributed at both ends of the isolation column 21; in the first direction X, the isolation layer 230 is arranged above the second gate insulating layer 220, and both ends have a "hanging" structure, so that the isolation column 21 has a concave structure. Such an isolation column 21 can cut off the conductive loop of the conductive material 120, thereby avoiding the phenomenon of display failure of the display substrate 100.

[0067] It should be noted that, in order to enhance the stability of the isolation column 21 with the above structure and prevent it from collapsing and other phenomena, in the first direction X, the size of the second portion 140 can be greater than the size of the first portion 130 and the third portion 150.

[0068] FIG. 6 is a schematic structural diagram of an isolation column according to another embodiment of the present application. As shown in FIG. 6, the isolation column 21 further includes a first source-drain layer 240; in the second direction Y, the isolation layer 230 is arranged between the second gate insulating layer 220 and the first source-drain layer 240; and the projection of the isolation layer 230 on the substrate layer 110 covers the projection of the first source-drain layer 240 on the substrate layer 110.

[0069] In the second direction Y, the isolation layer 230 is arranged between the second gate insulating layer 220 and the first source-drain layer 240, that is, in the second direction Y, the first source-drain layer 240, the isolation layer 230, the second gate insulating layer 220 and the first gate insulating layer 210 are sequentially arranged from top to bottom.

[0070] The projection of the isolation layer 230 on the substrate layer 110 covers the projection of the first source-drain layer 240 on the substrate layer 110, that is, in the first direction X, the size of the first source-drain layer 240 is smaller than the size of the isolation layer 230.

[0071] In the above scheme, by increasing the first source-drain layer 240 on the isolation layer 230 in the isolation column 21, and making the projection of the isolation layer 230 on the substrate layer 110 cover the projection of the first source-drain layer 240 on the substrate layer 110, both the height and the structural strength of the isolation column 21 can be increased, and the influence of the first source-drain layer 240 on the isolation function of the isolation column 21 can also be avoided.

[0072] It should be noted that the structure feature formed by the first source / drain layer 240 can also be referred to as an "undercut" structure.

[0073] FIGS. 7 and 8 are structural schematic diagrams of the isolation column according to another embodiment of the present application. As shown in FIGS. 7 and 8, the first portion 130 and the third portion 150 further include a first sacrificial layer 250 and a second sacrificial layer 260; in the second direction Y, the first sacrificial layer 250 is disposed between the first gate insulating layer 210 and the second gate insulating layer 220, and the second sacrificial layer 260 is disposed between the second gate insulating layer 220 and the isolation layer 230; a projection of the isolation layer 230 on the substrate layer 110 covers projections of the first sacrificial layer 250 and the second sacrificial layer 260 on the substrate layer 110.

[0074] In the second direction Y, the first sacrificial layer 250 is disposed between the first gate insulating layer 210 and the second gate insulating layer 220, and the second sacrificial layer 260 is disposed between the second gate insulating layer 220 and the isolation layer 230, i.e., in the second direction Y, the isolation layer 230, the second sacrificial layer 260, the second gate insulating layer 220, the first sacrificial layer 250, and the first gate insulating layer 210 are sequentially arranged from top to bottom.

[0075] Specifically, the first sacrificial layer 250 and the second sacrificial layer 260 need to be etched by AND etching to achieve the overhanging structure, i.e., the projection on the substrate layer 110 is covered by the projection of the isolation layer 230 on the substrate layer 110. Therefore, the first sacrificial layer 250 and the second sacrificial layer 260 are materials that can be etched by AND etching liquid, for example, can be a metal material Mo, or other materials such as semiconductor materials, etc., as long as different sacrificial layer materials are selected according to different etching liquids.

[0076] In the above scheme, in the actual preparation process of the display substrate 100, the display substrate 100 needs to be etched to achieve the final overhanging structure. By allowing the first sacrificial layer 250 and the second sacrificial layer 260 to still exist in the first portion 130 and the third portion 150 of the isolation column 21, the structural strength of the isolation column 21 can be appropriately enhanced.

[0077] When the first source / drain layer 240 exists, the stacking mode of each film layer is shown in FIG. 8, i.e., in the second direction Y, the first source / drain layer 240, the isolation layer 230, the second sacrificial layer 260, the second gate insulating layer 220, the first sacrificial layer 250, and the first gate insulating layer 210 are sequentially arranged from top to bottom.

[0078] It should be noted that the isolation column 21 in the above Figs. 5-8 is all two-sided isolation, that is, the second part 140 has the first part 130 and the third part 150 on both sides which can disconnect the conductive material 120. In actual application, the isolation column 21 can also have a single-sided isolation structure as shown in Fig. 9, that is, the isolation column 21 only has the first part 130 and the second part 140, and the isolation column 21 can also play a role in disconnecting the conductive material 120.

[0079] Fig. 10 is a schematic structural diagram of an isolation column according to another embodiment of the present application. As shown in Fig. 10, in some embodiments, the isolation column 21 further comprises a third sacrificial layer 270 and a fourth sacrificial layer 280; in the second direction Y, the third sacrificial layer 270 is arranged between the first gate insulating layer 210 and the second gate insulating layer 220, and the fourth sacrificial layer 280 is arranged between the second gate insulating layer 220 and the isolation layer 230.

[0080] In the second direction Y, the third sacrificial layer 270 is arranged between the first gate insulating layer 210 and the second gate insulating layer 220, and the fourth sacrificial layer 280 is arranged between the second gate insulating layer 220 and the isolation layer 230, that is, the isolation layer 230, the fourth sacrificial layer 280, the second gate insulating layer 220, the third sacrificial layer 270 and the first gate insulating layer 210 are sequentially stacked from top to bottom.

[0081] On the substrate layer 110, the projection of the isolation layer 230 also covers the projections of the third sacrificial layer 270 and the fourth sacrificial layer 280, the projection of the third sacrificial layer 270 covers the projections of the second gate insulating layer 220 and the fourth sacrificial layer 280, and the projection of the second gate insulating layer 220 covers the projection of the fourth sacrificial layer 280.

[0082] Specifically, the third sacrificial layer 270 and the fourth sacrificial layer 280 are made of the same material as the first sacrificial layer 250 and the second sacrificial layer 260, for example, metal material Mo.

[0083] By making the projection of the isolation layer 230 on the substrate layer 110 cover the projections of the third sacrificial layer 270 and the fourth sacrificial layer 280 on the substrate layer 110, the projection of the third sacrificial layer 270 on the substrate layer 110 covers the projections of the second gate insulating layer 220 and the fourth sacrificial layer 280 on the substrate layer 110, the isolation column 21 can have an undercut structure, thereby cutting off the conductive path of the conductive material 120; by making the projection of the second gate insulating layer 220 on the substrate layer 110 cover the projection of the fourth sacrificial layer 280 on the substrate layer 110, the second gate insulating layer 220 can better isolate the third sacrificial layer 270 and the third sacrificial layer 270, preventing short circuit inside the isolation column 21.

[0084] In the above scheme, when the isolation column 21 has a stacked structure, in the second direction Y, the isolation layer 230, the fourth sacrificial layer 280, the second gate insulating layer 220, the third sacrificial layer 270, and the first gate insulating layer 210 are sequentially stacked from top to bottom, and by limiting the projection size of the film layers such as the isolation layer 230, the third sacrificial layer 270, and the fourth sacrificial layer 280 on the substrate layer 110, the conduction of the conductive material 120 can be effectively cut off, thereby preventing the display substrate 100 from displaying failure.

[0085] FIG. 11 is a structural schematic diagram of an isolation column according to another embodiment of the present application. As shown in FIG. 11, in some embodiments, the isolation column 21 further includes a second source-drain layer 2910; in the second direction Y, the isolation layer 230 is arranged between the fourth sacrificial layer 280 and the second source-drain layer 2910.

[0086] In the second direction Y, the isolation layer 230 is arranged between the fourth sacrificial layer 280 and the second source-drain layer 2910, i.e., the second source-drain layer 2910, the isolation layer 230, the fourth sacrificial layer 280, the second gate insulating layer 220, the third sacrificial layer 270, and the first gate insulating layer 210 are sequentially stacked from top to bottom.

[0087] The projection of the isolation layer 230 on the substrate layer 110 covers the projection of the second source-drain layer 2910 on the substrate layer 110.

[0088] Generally, the source-drain layer adopts a film layer structure of “Ti+Al+Ti”, i.e., a metal film layer, so that the projection of the source-drain layer on the substrate layer 110 is covered by the projection of the isolation layer 230 on the substrate layer 110, which can further avoid the formation of a conductive loop of the conductive material 120 on the isolation column 21.

[0089] In the above scheme, by adding the second source-drain layer 2910 on the isolation layer 230 in the isolation column 21, and making the projection of the isolation layer 230 on the substrate layer 110 cover the projection of the first source-drain layer 240 on the substrate layer 110, the height and structural strength of the isolation column 21 can be increased, and the influence of the second source-drain layer 2910 on the isolation function of the isolation column 21 can be avoided.

[0090] FIG. 12 is a structural schematic diagram of an isolation column according to another embodiment of the present application. As shown in FIG. 12, the isolation column 21 further includes a third source-drain layer 2920, and in the second direction Y, the second source-drain layer 2910 is arranged between the isolation layer 230 and the third source-drain layer 2920.

[0091] In the second direction Y, the second source-drain layer 2910 is disposed between the isolation layer 230 and the third source-drain layer 2920, i.e., the third source-drain layer 2920, the second source-drain layer 2910, the isolation layer 230, the fourth sacrificial layer 280, the second gate insulating layer 220, the third sacrificial layer 270 and the first gate insulating layer 210 are sequentially stacked from top to bottom.

[0092] The projection of the isolation layer 230 and the second source-drain layer 2910 on the substrate layer 110 covers the projection of the third source-drain 2920.

[0093] The projection of the isolation layer 230 and the second source-drain layer 2910 on the substrate layer 110 covers the projection of the third source-drain 2920.

[0094] In the above scheme, by further increasing the third source-drain layer 2920 on the second source-drain layer 2910 in the isolation column 21, and making the projection of the isolation layer 230 and the second source-drain layer 2910 on the substrate layer 110 cover the projection of the second source-drain layer 2910 on the substrate layer 110, the height and structural strength of the isolation column 21 can be further increased, and the influence of the increase of the second source-drain layer 2910 on the isolation column 21 can be avoided.

[0095] Please refer to any one of FIGS. 5-12. In some embodiments, the isolation column 21 further includes a light-emitting layer 120, and in the second direction Y, the size of the isolation layer 230 is greater than the size of the light-emitting layer 120.

[0096] As described above, the light-emitting layer 120, i.e., the conductive material 120, will eventually be disposed on the display substrate 100 by evaporation, and if the size of the light-emitting layer 120 in the second direction Y is greater than the size of the isolation layer 230, the light-emitting layer 120 will eventually still form a conductive path, thereby affecting the display effect of the display substrate 100.

[0097] In the above scheme, when the display substrate 100 includes the light-emitting layer 120, by making the size of the isolation layer 230 in the second direction Y greater than the size of the light-emitting layer 120, the light-emitting layer 120 can be further avoided from forming a conductive loop on the isolation column 21.

[0098] The above introduces the display substrate provided by the embodiments of the present application, and the following introduces a preparation method of the display substrate provided by the embodiments of the present application, and parts similar to the above display substrate or parts similar to the prior art will not be described again.

[0099] FIG. 13 is a preparation schematic diagram of an isolation column according to an embodiment of the present application, corresponding to the isolation column in FIG. 7.

[0100] As shown in FIG. 13, the preparation method includes:

[0101] S110: stacking a GATE1 ring and a GATE2 ring on a substrate layer,

[0102] wherein the GATE1 ring and the GATE2 ring comprise, from bottom to top, a first gate insulating layer, a first sacrificial layer, a second gate insulating layer, and a second sacrificial layer, as shown in 13a in FIG. 13;

[0103] S120: etching the isolation layer to expose the second sacrificial layer and the first sacrificial layer not covered by the second sacrificial layer, as shown in 13b in FIG. 13;

[0104] S130: AND etching to form a suspended structure of the isolation layer / second gate insulating layer, as shown in 13c in FIG. 13;

[0105] S140: the second gate insulating layer is removed by HPDL water washing and gravity, etc., to form an isolation column, as shown in 13d in FIG. 13.

[0106] When the light-emitting layer is evaporated, the isolation column can block the light-emitting layer, as shown in 13e in FIG. 13.

[0107] FIG. 14 is a schematic diagram of preparation of an isolation column according to another embodiment of the present application, corresponding to the isolation column in FIG. 10.

[0108] As shown in FIG. 14, the preparation method comprises:

[0109] S210: stacking, on the substrate layer, a first gate insulating layer, a third sacrificial layer, a second gate insulating layer, a fourth sacrificial layer, and a second source-drain layer, in sequence from top to bottom, to form a GATE ring, as shown in 14a in FIG. 14;

[0110] S220: removing the isolation layer film layer on both sides of the GATE ring by a MASK process, and etching the isolation layer to expose the fourth sacrificial layer and the third sacrificial layer not covered by the fourth sacrificial layer, as shown in 14b in FIG. 14;

[0111] S230: providing the second source-drain layer, as shown in 14c in FIG. 14;

[0112] S240: AND etching to form a suspended structure of the isolation layer / second gate insulating layer and an undercut structure of the second source-drain layer, as shown in 14d in FIG. 14;

[0113] S250: the second gate insulating layer is removed by HPDL water washing and gravity, etc., to form an isolation column, as shown in 14e in FIG. 14.

[0114] When the light-emitting layer is evaporated, the isolation column can block the light-emitting layer, as shown in 14f in FIG. 14.

[0115] The application also provides a display device comprising the display substrate.

[0116] The display device can be a display device such as an OLED display, and a television, a digital camera, a mobile phone, a tablet computer, or any product or component having a display function.

[0117] The above merely provides the specific implementation of the application, but the protection scope of the application is not limited to this. Any person skilled in the art can easily think of the changes or replacements within the technical range disclosed by the application, which should be covered in the protection scope of the application. Therefore, the protection scope of the application should be subject to the protection scope of the claims.

Claims

1. A display substrate, comprising: a substrate layer comprising a display area, an isolation area and an opening area arranged in sequence along a first direction; the isolation area comprises an isolation column, the isolation column comprises a first gate insulating layer, a second gate insulating layer and an isolation layer in sequence along a second direction, the second direction is perpendicular to the first direction; wherein, a projection of the isolation layer on the substrate layer covers a projection of the second gate insulating layer on the substrate layer, and a material of the isolation layer is an inorganic material. 2.The display substrate of claim 1, wherein, the isolation column comprises a first part, a second part and a third part arranged in sequence along the first direction; the first part and the third part are symmetrically distributed at two ends of the second part, so that the isolation column presents a concave structure. 3.The display substrate of claim 2, wherein, in the first direction, sizes of the second part are greater than sizes of the first part and the third part. 4.The display substrate of claim 2, wherein, the isolation column further comprises a first source-drain layer; in the second direction, the isolation layer is arranged between the second gate insulating layer and the first source-drain layer, and a projection of the isolation layer on the substrate layer covers a projection of the first source-drain layer on the substrate layer. 5.The display substrate according to any one of claims 2 to 4, wherein the first part and the third part further comprise a first sacrificial layer and a second sacrificial layer; in the second direction, the first sacrificial layer is arranged between the first gate insulating layer and the second gate insulating layer, and the second sacrificial layer is arranged between the second gate insulating layer and the isolation layer; a projection of the isolation layer on the substrate layer covers projections of the first sacrificial layer and the second sacrificial layer on the substrate layer. 6.The display substrate of claim 1, wherein, the isolation column further comprises a third sacrificial layer and a fourth sacrificial layer; in the second direction, the third sacrificial layer is arranged between the first gate insulating layer and the second gate insulating layer, and the fourth sacrificial layer is arranged between the second gate insulating layer and the isolation layer; on the substrate layer, a projection of the isolation layer further covers projections of the third sacrificial layer and the fourth sacrificial layer, a projection of the third sacrificial layer covers projections of the second gate insulating layer and the fourth sacrificial layer, and a projection of the second gate insulating layer covers a projection of the fourth sacrificial layer. 7.The display substrate of claim 6, wherein, the isolation column further comprises a second source-drain layer; in the second direction, the isolation layer is arranged between the fourth sacrificial layer and the second source-drain layer; wherein, a projection of the isolation layer on the substrate layer covers a projection of the second source-drain layer on the substrate layer. 8.The display substrate of claim 7, wherein, the isolation column further comprises a third source-drain layer; in the second direction, the second source-drain layer is arranged between the isolation layer and the third source-drain layer; on the substrate layer, projections of the isolation layer and the second source-drain layer cover a projection of the third source-drain layer. 9.The display substrate according to any one of claims 1 to 8, wherein the isolation column further comprises a light-emitting layer; in the second direction, a size of the isolation layer is greater than a size of the light-emitting layer.

10. The display substrate according to any one of claims 1 to 8, wherein two ends of the isolation layer protrude from two ends of the second gate layer.

11. A display device, comprising the display substrate according to any one of claims 1 to 10.

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