Display panel and its manufacturing method, display device

Abstract

This invention provides a display panel, comprising: a display area, an aperture area, and an isolation area located between the display area and the aperture area. The isolation area is characterized by comprising: a substrate; an inorganic insulating layer on the substrate, the inorganic insulating layer having at least one recess; a light-emitting layer and a cathode located on the side of the inorganic insulating layer away from the substrate, wherein the light-emitting layer and the cathode are disconnected at the at least one recess in the inorganic insulating layer as they extend from the display area to the isolation area. The display panel provided by this invention, by providing a recess in the inorganic insulating layer of the isolation area, can isolate both the light-emitting layer and the cathode, preventing further corrosion of the light-emitting layer and cathode under the influence of water and oxygen, and also isolating the cathode signal to prevent the aggravation of black spot phenomena.

Description

Technical Field

[0001] This invention relates to the field of display technology, and in particular to a photomask, a color filter substrate and its manufacturing method, a display panel, and a display device. Background Technology

[0002] OLED (Organic Light-Emitting Diode) display devices have been listed as a promising next-generation display technology due to their advantages such as being thin, light, having a wide viewing angle, being actively emitting light, having continuously adjustable emission colors, having low cost, fast response speed, low energy consumption, low driving voltage, wide operating temperature range, simple manufacturing process, high luminous efficiency, and being flexible in display.

[0003] In existing technologies, holes are made in the screen to accommodate devices such as cameras and sensors. However, making holes in the screen can easily expose the OLED film layer, creating channels for water and oxygen to invade the electroluminescent (EL) layer. The EL layer is corroded by water and oxygen, causing the organic light-emitting element in the EL layer to oxidize and fail, resulting in growing dark spots (GDS) on the screen.

[0004] Currently, the main method used is to block the EL layer by using isolation columns, thereby cutting off the channels for water and oxygen intrusion.

[0005] However, the isolation pillars in the existing technology are achieved through the metal pattern of the source and drain metal layers, using a "Ti-Al-Ti" film structure. The Al film layer is subject to lateral etching on both sides. While this can isolate the EL layer, the cathode, being made of metal, remains electrically connected to the "Ti-Al-Ti" film structure, making it impossible to isolate the cathode signal. When the cathode signal becomes a continuous area, the black spot phenomenon becomes more pronounced. Summary of the Invention

[0006] This invention provides a display panel and its manufacturing method, as well as a display device, which can solve the problem of the cathode not being isolated, thereby aggravating the black spot phenomenon.

[0007] A first aspect of the present invention provides a display panel, comprising: a display area, an opening area, and an isolation area located between the display area and the opening area, wherein the isolation area is provided with:

[0008] Substrate;

[0009] An inorganic insulating layer located on the substrate, the inorganic insulating layer having at least one recess;

[0010] A light-emitting layer and a cathode are located on the side of the inorganic insulating layer away from the substrate, wherein the light-emitting layer and the cathode are disconnected at at least one recess in the inorganic insulating layer as they extend from the display area to the isolation area.

[0011] Optionally, the recess includes two side surfaces and a bottom surface. The two side surfaces are at a certain angle to the substrate, and the bottom surface is parallel to the substrate. At least one groove is provided on at least one side surface of the recess. The projections of at least one groove on the at least one side surface of the recess overlap on the substrate. The at least one groove on the at least one side surface is arranged sequentially along a first direction, which is perpendicular to the direction away from the substrate.

[0012] Optionally, the height of the at least one groove in the direction away from the substrate is...

[0013] The length of the at least one groove in the first direction is from 0.1 micrometers to 2.0 micrometers.

[0014] Optionally, a groove is provided at the bottom surface of the recessed portion.

[0015] Optionally, the height of the groove at the bottom surface of the recessed portion in the direction away from the substrate is...

[0016] Optionally, the display panel is an LTPS display panel, an LTPO display panel, or an OXIDE display panel.

[0017] A second aspect of the present invention provides a display device, wherein the display panel described above is included.

[0018] A third aspect of the present invention provides a method for manufacturing a display panel, the display panel comprising: a display area, an opening area, and an isolation area located between the display area and the opening area, wherein the manufacturing method comprises:

[0019] Provide substrates;

[0020] An inorganic insulating layer is formed on the substrate, the inorganic insulating layer having at least one recess;

[0021] A light-emitting layer and a cathode are formed on the side of the inorganic insulating layer away from the substrate, wherein the light-emitting layer and the cathode are disconnected at at least one recess in the inorganic insulating layer as they extend from the display area to the isolation area.

[0022] Optionally, forming the inorganic insulating layer on the substrate specifically includes:

[0023] At least one inorganic insulator film layer and at least one metal sub-pattern are formed in an alternating arrangement in a direction away from the substrate. The projection portions of the metal sub-patterns of each layer on the substrate overlap, and the metal sub-patterns of each layer are arranged sequentially along a first direction, which is perpendicular to the direction away from the substrate.

[0024] At least one etched hole is formed by drilling holes in the at least one inorganic insulator film layer. The etched hole has two sidewalls and a bottom wall. The two sidewalls are at a certain angle to the substrate, and the bottom wall is parallel to the substrate. At least one sidewall of the etched hole exposes the metal sub-pattern of each layer.

[0025] Remove the metal sub-patterns of each layer exposed on at least one sidewall, wherein the location where the metal sub-patterns are removed forms a groove.

[0026] Optionally, removing the exposed metal sub-patterns of each layer on the at least one sidewall specifically includes:

[0027] The metal subpatterns of each layer exposed on at least one sidewall are removed using phosphoric acid solution and nitric acid solution.

[0028] Optionally, the method for manufacturing the display panel further includes:

[0029] When a metal sub-pattern is formed on the bottom wall of the etched hole, the metal sub-pattern on the bottom wall of the etched hole is removed by using a phosphoric acid solution and a nitric acid solution to form a groove.

[0030] The embodiments of the present invention have the following beneficial effects:

[0031] The display panel provided in this embodiment of the invention can isolate both the light-emitting layer and the cathode by setting a recess in the inorganic insulating layer of the isolation area. This not only prevents the light-emitting layer and the cathode from being further corroded by water and oxygen, but also isolates the cathode signal and prevents the black spot phenomenon from aggravating. Attached Figure Description

[0032] Figure 1 A top view of a display panel provided for related technologies;

[0033] Figure 2 for Figure 1 A cross-sectional view along the A-A' direction;

[0034] Figure 3 This is a cross-sectional schematic diagram of the isolation area of ​​the display panel provided in an embodiment of the present invention;

[0035] Figures 3A to 3C A schematic diagram illustrating the manufacturing process of the first type of display panel provided in an embodiment of the present invention;

[0036] Figures 4A to 4E A schematic diagram illustrating the manufacturing process of a second type of display panel provided in an embodiment of the present invention;

[0037] Figures 5A to 5C A schematic diagram illustrating the manufacturing process of a third type of display panel provided in an embodiment of the present invention;

[0038] Figures 6A to 6C A schematic diagram illustrating the manufacturing process of the fourth type of display panel provided in an embodiment of the present invention;

[0039] Figures 7A to 7B This is a schematic diagram illustrating the manufacturing process of the fifth type of display panel provided in an embodiment of the present invention.

[0040] Figure Labels

[0041] 1 Display Area

[0042] 2. Isolation Zone

[0043] 3. Opening area

[0044] 10 Substrate

[0045] 20 Buffer Layers

[0046] 30 Gate insulating layer

[0047] 40 Gate metal layer

[0048] 41 First gate metal layer

[0049] 42 Second gate metal layer

[0050] 43 Third gate metal layer

[0051] 44 Fourth gate metal layer

[0052] 50 Interlayer dielectric layer

[0053] 60 Source / Drain Metal Layers

[0054] 61 First protective layer

[0055] 62 Metal Wire Layers

[0056] 63 Second protective layer

[0057] 70 Emissive Layer

[0058] 80 Cathode

[0059] 90 Inorganic insulating layer Detailed Implementation

[0060] To make the technical problems, technical solutions and advantages of the embodiments of the present invention clearer, a detailed description will be given below in conjunction with the accompanying drawings and specific embodiments.

[0061] refer to Figure 1 , Figure 1 A top view of a display panel provided for related technologies, wherein the display panel includes: a display area 1, an opening area 3, and an isolation area 2 located between the display area 1 and the opening area 3.

[0062] refer to Figure 2 , Figure 2 for Figure 1 A cross-sectional diagram along the A-A' direction, as shown below. Figure 2 As shown, the isolation zone 2 is provided with:

[0063] Substrate 10;

[0064] Buffer layer 20 located on the substrate 10;

[0065] At least one gate metal layer 40 and at least one gate insulating layer 30 are located on the side of the buffer layer 20 away from the substrate 10. The gate metal layer 40 includes at least one gate. The at least one gate metal layer 40 and the at least one gate insulating layer 30 are arranged alternately and the gate insulating layer 30 covers the gate metal layer 40.

[0066] Interlayer dielectric layer 50 located on the side of the at least one gate metal layer 40 and the at least one gate insulating layer 30 away from the substrate 10.

[0067] Among them, the buffer layer 20, the gate insulating layer 30, and the interlayer dielectric layer 50 are all made of inorganic materials and can be collectively referred to as the inorganic insulating layer 90.

[0068] An active / drain metal layer 60 is disposed on the side of the interlayer dielectric layer 50 away from the substrate 10.

[0069] The source / drain metal layers can be metals such as Cu, Al, Ag, Mo, Cr, Nd, Ni, Mn, Ti, Ta, and W, as well as alloys of these metals. The source / drain metal layers can be single-layer or multi-layer structures; multi-layer structures include Cu\Mo, Ti\Cu\Ti, Mo\Al\Mo, etc.

[0070] In related technologies, to prevent water and oxygen from intruding into the display area from the opening area, isolation pillars are installed in the isolation area to block the water and oxygen intrusion channel. Furthermore, these isolation pillars are implemented using metal patterns in the source and drain metal layers. For example... Figure 2The source / drain metal layer 60 shown includes a third metal layer 63, a second metal layer 62, and a first metal layer 61 stacked sequentially. The third metal layer 63 and the first metal layer 61 are made of Ti, and the second metal layer 62 is made of Al. The left and right sides of the Al layer are etched. Specifically, an etching process is used to etch the metal layer portion of the middle layer, such as using a mixed solution of nitric acid, acetic acid, and phosphoric acid. This solution only etches aluminum (Al) and does not etch titanium (Ti). The light-emitting layer 70, located on the side of the source / drain metal layer 60 away from the substrate 10, is separated from the left and right sides of the Al layer.

[0071] The cathode 80 is disposed on the side of the light-emitting layer 70 away from the substrate 10. Commonly used cathode materials include Al, Mg-Ag (magnesium-silver alloy), Ag, Ca, etc.

[0072] Since both the cathode 80 and the source / drain metal layer 60 are made of metal or alloy materials, the cathode 80 and the source / drain metal layer 60 can be electrically connected, and the cathode signal cannot be isolated. When the cathode signal is connected, the black spot phenomenon becomes more obvious.

[0073] To address the problem of more pronounced black spots due to the cathode not being isolated, embodiments of the present invention provide a display panel, a method for manufacturing the same, and a display device.

[0074] The display panel provided in this embodiment of the invention includes: a display area, an opening area, and an isolation area located between the display area and the opening area, characterized in that the isolation area is provided with:

[0075] Substrate;

[0076] An inorganic insulating layer located on the substrate, the inorganic insulating layer having at least one recess;

[0077] A light-emitting layer and a cathode are located on the side of the inorganic insulating layer away from the substrate, wherein the light-emitting layer and the cathode are disconnected at at least one recess in the inorganic insulating layer as they extend from the display area to the isolation area.

[0078] Figure 3 This is a cross-sectional schematic diagram of the isolation area of ​​the display panel provided in an embodiment of the present invention, as shown below. Figure 3 As shown, the display panel provided in this embodiment of the invention includes: a display area 1, an opening area 3, and an isolation area 2 located between the display area 1 and the opening area 3, wherein the isolation area 2 is provided with:

[0079] Substrate 10;

[0080] An inorganic insulating layer 90 is located on the substrate 10, and the inorganic insulating layer 90 has at least one recess; wherein the inorganic insulating layer 90 may include a buffer layer 20, a gate insulating layer 30 and an interlayer dielectric layer 50.

[0081] The light-emitting layer 70 and the cathode 80 are located on the side of the inorganic insulating layer 90 away from the substrate 10, wherein the light-emitting layer 70 and the cathode 80 are disconnected at at least one recess in the inorganic insulating layer 90 when they extend from the display area 1 to the isolation area 2.

[0082] Optionally, the recess includes two side surfaces and a bottom surface. The two side surfaces are at a certain angle to the substrate, and the bottom surface is parallel to the substrate. At least one groove is provided on at least one side surface of the recess. The projections of at least one groove on the at least one side surface of the recess overlap on the substrate. The at least one groove on the at least one side surface is arranged sequentially along a first direction, which is perpendicular to the direction away from the substrate.

[0083] In this invention, by providing at least one groove on at least one side of the recessed portion and utilizing the advantage that the groove is surrounded by an inorganic insulating material, the problem in the prior art that the cathode is electrically connected to the "Ti-Al-Ti" film structure, which cannot isolate the cathode signal and makes the black spot phenomenon more obvious when the cathode signal is connected to a whole is avoided.

[0084] The display panel provided in this embodiment of the invention can isolate both the light-emitting layer and the cathode by setting a recess in the inorganic insulating layer of the isolation area. This not only prevents the light-emitting layer and the cathode from being further corroded by water and oxygen, but also isolates the cathode signal and prevents the black spot phenomenon from aggravating.

[0085] like Figure 3 As shown, only one groove is provided on one side of the recessed portion. Of course, grooves can also be provided on both sides of the recessed portion, and the number of grooves can be determined according to the actual application scenario.

[0086] like Figure 4E As shown, two grooves are provided on one side of the recessed portion. Figure 5B As shown, three grooves are provided on one side of the recessed portion. Figure 6B As shown, three grooves are provided on each of the two sides of the recess.

[0087] Optionally, the height of the at least one groove in the direction away from the substrate is...

[0088] The length of the at least one groove in the first direction is from 0.1 micrometers to 2.0 micrometers. Optionally, a groove is provided at the bottom surface of the recess.

[0089] Optionally, the height of the groove at the bottom surface of the recessed portion in the direction away from the substrate is...

[0090] By setting at least one groove on the bottom surface of the recess, both the light-emitting layer and the cathode can be isolated. This not only prevents the light-emitting layer and the cathode from being further corroded by water and oxygen, but also isolates the cathode signal and prevents the black spot phenomenon from aggravating.

[0091] like Figure 7B As shown, three grooves are provided on each of the two sides of the recessed portion, and one groove is provided on the bottom surface of the recessed portion. Furthermore, the display panel provided in this embodiment of the invention also specifies the thickness of the inorganic insulating layer between the grooves, wherein the thickness 'a' of the inorganic insulating layer on the side of the third gate metal layer 43 away from the substrate is... The thickness b of the inorganic insulating layer between the third gate metal layer 43 and the second gate metal layer 42 is The thickness c of the inorganic insulating layer between the second gate metal layer 42 and the first gate metal layer 41 is... The thickness d of the inorganic insulating layer between the first gate metal layer 41 and the fourth gate metal layer 44 is

[0092] Optionally, the display panel is an LTPS display panel, an LTPO display panel, or an OXIDE display panel.

[0093] The problem of the inability to isolate the cathode signal is solved by setting a recess in the inorganic insulating layer of the isolation area. This method is applicable not only to LTPS (Low Temperature Poly-Silicon) display panels, but also to LTPO (Low Temperature Polycrystalline Oxide) display panels or OXIDE (oxide) display panels, making the display panels provided in this embodiment of the invention applicable in a variety of scenarios.

[0094] Embodiments of the present invention also provide a display device, including the display panel described above.

[0095] The display device includes, but is not limited to, components such as: a radio frequency unit, a network module, an audio output unit, an input unit, a sensor, a display unit, a user input unit, an interface unit, a memory, a processor, and a power supply. Those skilled in the art will understand that the above-described structure of the display device does not constitute a limitation on the display device; the display device may include more or fewer of the aforementioned components, or combine certain components, or arrange different components. In embodiments of the present invention, the display device includes, but is not limited to, a monitor, a mobile phone, a tablet computer, a television set, a wearable electronic device, a navigation display device, etc.

[0096] The display device can be any product or component with display function, such as a monitor, digital photo frame, mobile phone, or tablet computer. The display device also includes a flexible circuit board, a printed circuit board, and a backplate.

[0097] Embodiments of the present invention also provide a method for manufacturing a display panel, the display panel comprising: a display area, an opening area, and an isolation area located between the display area and the opening area, wherein the manufacturing method comprises:

[0098] A substrate is provided; wherein the substrate may be a flexible substrate made of polyimide or the like, or a glass substrate;

[0099] An inorganic insulating layer is formed on the substrate, the inorganic insulating layer having at least one recess;

[0100] A light-emitting layer and a cathode are formed on the side of the inorganic insulating layer away from the substrate, wherein the light-emitting layer and the cathode are disconnected at at least one recess in the inorganic insulating layer as they extend from the display area to the isolation area.

[0101] Specifically, forming the inorganic insulating layer located on the substrate includes:

[0102] At least one inorganic insulator film layer and at least one metal sub-pattern are formed in an alternating arrangement in a direction away from the substrate. The projection portions of the metal sub-patterns of each layer on the substrate overlap, and the metal sub-patterns of each layer are arranged sequentially along a first direction, which is perpendicular to the direction away from the substrate.

[0103] At least one etched hole is formed by drilling holes in the at least one inorganic insulator film layer. The etched hole has two sidewalls and a bottom wall. The two sidewalls are at a certain angle to the substrate, and the bottom wall is parallel to the substrate. At least one sidewall of the etched hole exposes the metal sub-pattern of each layer.

[0104] Remove the metal sub-patterns of each layer exposed on at least one sidewall, wherein the location where the metal sub-patterns are removed forms a groove.

[0105] By utilizing at least one inorganic insulating film layer and at least one metal sub-pattern, and punching holes in at least one inorganic insulating film layer and removing the metal sub-patterns of each layer to form grooves, the light-emitting layer and the cathode can be disconnected at the grooves. This not only prevents the light-emitting layer and the cathode from being further corroded by water and oxygen, but also isolates the cathode signal and prevents the black spot phenomenon from aggravating.

[0106] Figure 3 This is a cross-sectional schematic diagram of the isolation area of ​​the display panel provided in an embodiment of the present invention. Figures 3A to 3C This is a schematic diagram illustrating the manufacturing process of the first type of display panel provided in an embodiment of the present invention, with reference to... Figure 3 and Figures 3A to 3C The formation process of the inorganic insulating layer is described in detail. Figure 3A There are three inorganic insulating film layers: a buffer layer 20, a gate insulating layer 30, and an interlayer dielectric layer 50. The metal sub-pattern is the gate or gate line of the gate metal layer 40.

[0107] Step 1: Form a buffer layer 20 on the substrate 10; wherein the buffer layer 20 is made of inorganic material and is formed on the substrate 10 by deposition;

[0108] Step 2: Form the gate and gate line patterns on the substrate after completing Step 1;

[0109] Specifically, a thickness of approximately [thickness missing] can be deposited on the substrate after step 1 using sputtering or thermal evaporation methods. The gate metal layer can be made of metals such as Cu, Al, Ag, Mo, Cr, Nd, Ni, Mn, Ti, Ta, and W, or alloys of these metals. The gate metal layer can be a single-layer or multi-layer structure, such as Cu\Mo, Ti\Cu\Ti, or Mo\Al\Mo. A photoresist layer is coated on the gate metal layer. The photoresist is exposed using a mask, creating areas where the photoresist is retained and areas where it is not retained. The retained areas correspond to the regions containing the gate lines and gate electrodes, while the unretained areas correspond to the regions outside the patterns. A development process is performed to completely remove the photoresist in the unretained areas, while the photoresist thickness in the retained areas remains unchanged. An etching process is then used to completely etch away the gate metal film in the unretained areas, and the remaining photoresist is stripped off to form the gate lines and gate electrode patterns.

[0110] Step 3: Form a gate insulating layer 30 on the substrate 10 after completing step 2;

[0111] Specifically, plasma-enhanced chemical vapor deposition (PECVD) can be used to deposit a thickness of [thickness value missing] on the substrate after step 2. The gate insulating layer can be made of oxide, nitride or oxygen-nitrogen compound, and the corresponding reaction gases are SiH4, NH3, N2 or SiH2Cl2, NH3, N2.

[0112] Step 4: Form an interlayer dielectric layer 50 on the substrate 10 after completing step 3;

[0113] Specifically, the interlayer dielectric layer is typically an insulating material with a low dielectric constant (less than 3), such as boron-doped silicon glass (BSG), phosphorus-doped silicon glass (PSG), or boron-phosphorus-doped silicon glass (BPSG). The lower the dielectric constant, the better the insulation performance. High aspect ratio deposition processes are commonly used to fabricate the interlayer dielectric layer to improve the adhesion between the interlayer dielectric layer and surrounding devices.

[0114] After step 4, it forms Figure 3A The cross-sectional structure shown.

[0115] Step 5: Using dry etching, holes are drilled in the interlayer dielectric layer 50, gate insulating layer 30, and buffer layer 20 to form etched holes; the etched holes have two sidewalls and one bottom wall, the two sidewalls are at a certain angle to the substrate, the bottom wall is parallel to the substrate, and at least one sidewall of the etched hole exposes the gate or gate line of each layer.

[0116] In this process, dry etching cannot penetrate the protective metal layer (such as Mo) of the gate metal layer, and the etching holes will continue to etch downwards along the edge of the protective metal layer. Due to the obstruction of the protective metal layer, the slope angle of the inorganic layer below the edge of the protective metal layer becomes steeper as the etching depth increases.

[0117] After step 5, it is formed Figure 3B The cross-sectional structure shown.

[0118] Step 6: Remove the gate or gate line of each layer exposed on at least one sidewall, wherein the location where the gate or gate line is removed forms a groove.

[0119] Specifically, phosphoric acid solution and nitric acid solution are used to remove the gate or gate line of each layer exposed on at least one sidewall.

[0120] Phosphoric acid and nitric acid solutions can react with the gate or gate line, thereby forming a groove at the corresponding location.

[0121] Because of the steep slope of the groove and inorganic layer, complete isolation between the light-emitting layer and the cathode can be achieved.

[0122] Figure 3ASince there is only one layer of metallic subpattern, the projection pattern of each layer's metallic subpattern onto the substrate 10 is not obvious. (Reference) Figure 4A , Figure 5A , Figure 6A and Figure 7A The metal subpatterns of each layer overlap on the projection of the substrate, and the metal subpatterns of each layer are arranged sequentially along a first direction, which is perpendicular to the direction away from the substrate.

[0123] The metal subpatterns of each layer are formed in a stepped shape in the direction from near the substrate 10 to away from the substrate 10. Furthermore, if the direction from near the substrate 10 to away from the substrate 10 is taken as the second direction, and the first direction is the direction perpendicular to the second direction, the metal subpatterns of each layer are arranged sequentially along the first direction, gradually moving away from the center of the recess.

[0124] Figures 4A to 4E A schematic diagram illustrating the manufacturing process of a second type of display panel provided in an embodiment of the present invention; Figure 4A Unlike Figure 3A The key difference lies in the fact that the display panel includes two gate metal layers: a first gate metal layer 41 and a second gate metal layer 42. Correspondingly, the dry etching process for the inorganic insulator film layer needs to be repeated twice. For example... Figure 4B As shown, after the first dry etching, the second gate metal layer is exposed. Figure 4C As shown, after the second dry etching, the first gate metal layer is exposed. Figure 4D As shown, the exposed gates or gate lines of each layer are removed using phosphoric acid solution and nitric acid solution. Finally, a light-emitting layer 70 and a cathode 80 are formed on the formed inorganic insulating layer 90.

[0125] Figures 5A to 5C This is a schematic diagram illustrating the manufacturing process of a third type of display panel provided in an embodiment of the present invention; as shown. Figure 5A As shown, different Figure 4A The key difference lies in the fact that the display panel comprises three gate metal layers: a first gate metal layer 41, a second gate metal layer 42, and a third metal layer 43. Correspondingly, the dry etching of the inorganic insulator film layer needs to be repeated three times. After the first dry etching, the third gate metal layer is exposed; after the second dry etching, the second gate metal layer is exposed; and after the third dry etching, the first gate metal layer is exposed. The exposed gates or gate lines of each layer are removed using a phosphoric acid solution and a nitric acid solution, forming... Figure 5B The structure is shown. Finally, a light-emitting layer 70 and a cathode 80 are formed on the formed inorganic insulating layer 90.

[0126] In this embodiment of the disclosure, during the process of removing the exposed gates or gate lines of each layer using phosphoric acid solution and nitric acid solution, the proportion of gates or gate lines removed can be controlled by controlling the reaction time between the phosphoric acid solution and nitric acid solution and the gates or gate lines. This controls the amount of gate or gate line residue remaining in the trench, further controlling the depth of the trench. (Refer to...) Figure 5C .

[0127] In addition, the proportion of the gate or gate line that is removed can also be controlled by controlling the concentration of phosphoric acid solution and nitric acid solution.

[0128] In this embodiment of the disclosure, the length of the groove in the first direction is 0.1 micrometers to 2.0 micrometers;

[0129] For example, the metal etching of the control gate or gate line film layer can be designed with the length of the groove in the first direction as 0.1 micrometer, 0.2 micrometer, 0.5 micrometer, 1.0 micrometer, 1.5 micrometer, etc., so that the cathode and the light-emitting material can be better isolated.

[0130] Figures 6A to 6C This is a schematic diagram illustrating the manufacturing process of the fourth type of display panel provided in an embodiment of the present invention. Figure 6A Unlike Figure 5A The key difference is that during dry etching, the gate metal layer on both sides of the recess is exposed, not just on one side. Figure 6B In the process, the exposed gates or gate lines of each layer are removed by wet etching using phosphoric acid solution and nitric acid solution, forming grooves at the locations where the gates or gate lines are removed.

[0131] In this embodiment of the disclosure, during the process of removing the exposed gates or gate lines of each layer using phosphoric acid solution and nitric acid solution, the proportion of gates or gate lines removed can be controlled by controlling the reaction time between the phosphoric acid solution and nitric acid solution and the gates or gate lines. This controls the amount of gate or gate line residue remaining in the trench, further controlling the depth of the trench. (Refer to...) Figure 6C .

[0132] In addition, the proportion of the gate or gate line that is removed can also be controlled by controlling the concentration of phosphoric acid solution and nitric acid solution.

[0133] Finally, a light-emitting layer 70 and a cathode 80 are formed on the inorganic insulating layer 90.

[0134] Optionally, the method for manufacturing the display panel further includes:

[0135] When a metal sub-pattern is formed on the bottom wall of the etched hole, the metal sub-pattern on the bottom wall of the etched hole is removed by using a phosphoric acid solution and a nitric acid solution to form a groove.

[0136] Figures 7A to 7B This is a schematic diagram illustrating the manufacturing process of the fifth type of display panel provided in an embodiment of the present invention.

[0137] Figure 7A Unlike Figure 6A The key feature is that a metallic sub-pattern is formed on the bottom wall of the etched hole. This metallic sub-pattern serves as the underlying shielding metal, used to block electromagnetic waves.

[0138] Figure 7B In the process, the exposed gates or gate lines of each layer and the underlying shielding metal are removed using phosphoric acid solution and nitric acid solution, forming grooves at the locations where the gates or gate lines and the underlying shielding metal are removed.

[0139] Finally, a light-emitting layer 70 and a cathode 80 are formed on the inorganic insulating layer 90.

[0140] In the various method embodiments of the present invention, the sequence numbers of each step are not intended to limit the order of the steps. For those skilled in the art, any changes in the order of the steps without creative effort are also within the scope of protection of the present invention.

[0141] It should be noted that the various embodiments in this specification are described in a progressive manner, and the same or similar parts between the various embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, since the embodiments are basically similar to the product embodiments, the descriptions are relatively simple, and the relevant parts can be referred to the descriptions of the product embodiments.

[0142] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as “comprising” or “including” mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as “connected” or “linked” are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as “upper,” “lower,” “left,” and “right” are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0143] It is understandable that when a component such as a layer, film, region, or substrate is referred to as being "above" or "below" another component, the component may be "directly" located "above" or "below" the other component, or there may be intermediate components present.

[0144] In the description of the above embodiments, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0145] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A display panel, comprising: The display area, the opening area and the isolation area between the display area and the opening area are characterized in that the isolation area is provided with: a substrate substrate; an inorganic insulating layer on the substrate substrate, the inorganic insulating layer having at least one recess; wherein the inorganic insulating layer comprises a buffer layer, a gate insulating layer and an interlayer dielectric layer, and at least one layer of metal sub-patterns is included between the buffer layer, the gate insulating layer and the interlayer dielectric layer, and the at least one recess is formed after the at least one layer of metal sub-patterns is completely etched; a light-emitting layer and a cathode on the side of the inorganic insulating layer away from the substrate substrate, wherein the light-emitting layer and the cathode are disconnected at the at least one recess of the inorganic insulating layer when they extend from the display area to the isolation area; the recess comprises two side surfaces and a bottom surface, the two side surfaces are at an angle to the substrate substrate, and the bottom surface is parallel to the substrate substrate, at least one groove is provided on at least one side surface of the recess, the projection of the at least one groove on the substrate substrate overlaps, and the at least one groove on the at least one side surface is arranged in sequence in a first direction, which is perpendicular to the direction away from the substrate substrate.

2. The display panel of claim 1, wherein, The height of the at least one groove in the direction away from the substrate substrate is 500-4000 angstroms; The length of the at least one groove in the first direction is 0.1-2.0 microns.

3. The display panel of claim 1, wherein, The bottom surface of the recess is provided with a groove.

4. The display panel of claim 3, wherein, The height of the groove at the bottom surface of the recess in the direction away from the substrate substrate is 500-4000 angstroms.

5. The display panel of claim 1, wherein, The display panel is an LTPS display panel, an LTPO display panel or an OXIDE display panel.

6. A display device, characterized by comprising: The display panel comprises any one of claims 1-5.

7. A method of fabricating a display panel, the display panel comprising: The display area, the opening area and the isolation area between the display area and the opening area are characterized in that the manufacturing method comprises: providing a substrate substrate; forming an inorganic insulating layer on the substrate substrate, the inorganic insulating layer having at least one recess; wherein the inorganic insulating layer comprises a buffer layer, a gate insulating layer and an interlayer dielectric layer, and at least one layer of metal sub-patterns is included between the buffer layer, the gate insulating layer and the interlayer dielectric layer, and the at least one recess is formed after the at least one layer of metal sub-patterns is completely etched; forming a light-emitting layer and a cathode on the side of the inorganic insulating layer away from the substrate substrate, wherein the light-emitting layer and the cathode are disconnected at the at least one recess of the inorganic insulating layer when they extend from the display area to the isolation area; the recess comprises two side surfaces and a bottom surface, the two side surfaces are at an angle to the substrate substrate, and the bottom surface is parallel to the substrate substrate, at least one groove is provided on at least one side surface of the recess, the projection of the at least one groove on the substrate substrate overlaps, and the at least one groove on the at least one side surface is arranged in sequence in a first direction, which is perpendicular to the direction away from the substrate substrate.

8. The manufacturing method of a display panel according to claim 7, wherein, The forming of the inorganic insulating layer on the substrate base plate specifically comprises: forming at least one layer of inorganic insulating sub-film and at least one layer of metal sub-patterns in an alternating arrangement in a direction away from the substrate base plate, the projected part of each layer of metal sub-patterns on the substrate base plate is overlapped, and each layer of metal sub-patterns is arranged in a first direction, which is perpendicular to the direction away from the substrate base plate; punching the at least one layer of inorganic insulating sub-film to form at least one etching hole, the etching hole has two side walls and a bottom wall, the two side walls are at an angle to the substrate base plate, the bottom wall is parallel to the substrate base plate, and at least one side wall of the etching hole exposes the metal sub-patterns of each layer; removing the metal sub-patterns of each layer exposed on at least one side wall, wherein the position of removing the metal sub-patterns forms a groove.

9. The manufacturing method of a display panel according to claim 8, wherein, The removing of the metal sub-patterns of each layer exposed on at least one side wall specifically comprises: using a phosphoric acid solution and a nitric acid solution to remove the metal sub-patterns of each layer exposed on at least one side wall.

10. The manufacturing method of a display panel according to claim 8, wherein, Further comprising: when the bottom wall of the etching hole is formed with a metal sub-pattern, using a phosphoric acid solution and a nitric acid solution to remove the metal sub-pattern on the bottom wall of the etching hole and form a groove.

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