Deviation rectifying device and feeding and discharging equipment

By using a lifting mechanism and support columns of the same material to support the silicon wafers in the alignment device, the problem of damage to the textured surface of the silicon wafers by the alignment device is solved, thereby improving the surface quality of the silicon wafers and the performance of photovoltaic cells.

CN224395013UActive Publication Date: 2026-06-23TRINA SOLAR CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
TRINA SOLAR CO LTD
Filing Date
2025-06-17
Publication Date
2026-06-23

AI Technical Summary

Technical Problem

The materials in existing spin correction devices are prone to causing surface damage when in contact with silicon wafers, affecting electrical performance.

Method used

A lifting mechanism is used to move the alignment plate. Support columns made of the same material as the silicon wafer surface are set on the alignment plate for support, reducing the contact area and using a textured layer of the same material to avoid damage.

Benefits of technology

It effectively reduces damage and contamination on the silicon wafer surface, and improves the surface quality of silicon wafers and the electrical performance of photovoltaic cells after chemical vapor deposition.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to a kind of deviation rectifying device and feeding equipment, deviation rectifying device includes jacking mechanism and deviation rectifying plate, deviation rectifying plate is connected in jacking mechanism, jacking mechanism is used to drive deviation rectifying plate relative to carrier plate movement, deviation rectifying plate includes plate body and multiple support columns;Multiple support columns are spaced apart on the same side of plate body;Wherein, the face of support column away from plate body is provided with the same pile face layer with the surface of workpiece to be rectified.And by the face of support column away from plate body is provided with the same pile face layer with the surface of workpiece to be rectified, since the material of both is same, so that workpiece is contacted with support column, workpiece after pile making will not be damaged and contaminated, thereby effectively solve the problem of black spot and black dot caused by the position of workpiece and deviation rectifying plate contact, thereby improve the surface quality of workpiece after chemical vapor deposition process, and the electrical performance of photovoltaic cell.
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Description

Technical Field

[0001] This utility model relates to the field of photovoltaic cell manufacturing equipment technology, and in particular to a correction device and a loading and unloading device. Background Technology

[0002] Web alignment devices are widely used in automated loading and unloading processes during plasma-enhanced chemical vapor deposition (PECVD) and physical vapor deposition (PVD) processes in heterojunctions. These devices correct the position of silicon wafers on a cutout carrier substrate, ensuring the wafers are centered in the substrate's positioning grooves, thus correcting loading errors caused by inaccuracies in automated loading. They also ensure the wafers do not rest on the steps of the substrate's positioning grooves. Currently, the mainstream web alignment devices on the market are made of polyetheretherketone (PEEK). The contact points between the PEEK material and the silicon wafer are wrapped with Teflon or PTFE tape to reduce damage to the textured or PECVD-processed silicon wafer surface.

[0003] With the above structure, the Teflon tape at the top of the PEEK chip comes into contact with the texturized silicon wafer, which will damage the textured surface. The damaged parts cannot be passivated during the PECVD process, resulting in defects on the silicon wafer surface and affecting electrical performance. Utility Model Content

[0004] Therefore, it is necessary to provide a spin correction device and loading / unloading equipment to address the technical problem that spin correction devices in related technologies can easily cause defects on the silicon wafer surface, thereby affecting electrical performance.

[0005] A correction device, the correction device comprising:

[0006] Lifting mechanism;

[0007] A correction plate is connected to the lifting mechanism, which is used to move the correction plate relative to the carrier plate. The correction plate includes a plate body and multiple support columns.

[0008] Multiple support columns are spaced apart on the same side of the plate body;

[0009] The support column has a textured surface layer on the side facing away from the plate body, which is the same as the surface of the workpiece to be corrected.

[0010] In one embodiment, the support column is made of either monocrystalline silicon or polycrystalline silicon.

[0011] In one embodiment, the side of the support column away from the plate body is constructed as an arc surface.

[0012] In one embodiment, the plate body includes:

[0013] A base layer for connection to the lifting mechanism;

[0014] A connecting layer is disposed on the base layer, and the support columns are spaced apart on the side of the connecting layer opposite to the base layer.

[0015] In one embodiment, the connecting layer is provided with a plurality of mounting holes, the number of which corresponds to the number of the support columns, and one end of each support column is embedded in a mounting hole.

[0016] In one embodiment, the base layer and the connecting layer are made of plastic.

[0017] In one embodiment, the base layer is bonded to the connecting layer.

[0018] In one embodiment, the correction device further includes a first fastener, wherein the base layer and the connecting layer are provided with a plurality of spaced through holes, and the first fastener passes through the through holes to fasten the base layer and the connecting layer.

[0019] In one embodiment, the base layer is provided with a plurality of spaced-apart connection holes, and the second fastener passes through the connection holes and connects to the lifting mechanism.

[0020] A loading and unloading device, the loading and unloading device including the deviation correction device as described above, and:

[0021] A carrier plate with perforated holes is provided, and a lifting mechanism is provided correspondingly to the carrier plate. The lifting mechanism can drive the correction plate to move into the perforated holes.

[0022] The beneficial effects of this utility model are:

[0023] This invention provides a deviation correction device, comprising a lifting mechanism and a deviation correction plate. By connecting the deviation correction plate to the lifting mechanism, the lifting mechanism moves the deviation correction plate relative to a carrier plate, thereby correcting the deviation of a workpiece supported on the deviation correction plate so that the workpiece is positioned in the middle of the limiting groove of the carrier plate. Multiple spaced support columns are provided on the plate body to support the workpiece, reducing the contact area between the workpiece and the deviation correction plate. This reduces surface damage to the workpiece caused by contact with the deviation correction plate, thus improving the surface quality of the workpiece. Furthermore, the support columns, facing away from the plate body, are covered with the same textured layer as the surface of the workpiece being corrected. Because both are made of the same material, contact between the workpiece and the support columns will not damage or contaminate the textured workpiece, effectively solving the problem of black spots and blemishes caused by contact between the workpiece and the deviation correction plate. This improves the surface quality of the workpiece after chemical vapor deposition (CVD) and the electrical performance of photovoltaic cells. Attached Figure Description

[0024] Figure 1 A simplified structural diagram of the correction device provided in an embodiment of this utility model.

[0025] Figure 2 This is a top view of the correction plate in a correction device provided in an embodiment of the present invention.

[0026] Figure 3 A front view of the base layer and connecting layer of the correction plate in an embodiment of the present invention being connected by an adhesive method.

[0027] Figure 4 A top view of the base layer and connecting layer of the correction plate in a correction device provided in an embodiment of the present invention, which are fastened together by fasteners.

[0028] Figure 5 This is a schematic diagram of the support column in the correction plate of the correction device provided in an embodiment of the present invention.

[0029] Figure 6 A simplified structural diagram of a loading and unloading device including a correction device is provided for an embodiment of this utility model.

[0030] Figure 7 This is a top view of a loading and unloading device including a correction device, provided as an embodiment of the present invention.

[0031] Figure label:

[0032] 100 Lifting mechanism; 110 Driving component; 120 Lifting component; 200 Correction plate; 210 Plate body; 211 Base layer; 212 Connecting layer; 220 Support column; 300 First fastener; 400 Second fastener; 500 Carrier plate; 510 Limiting groove; 520 Hole. Detailed Implementation

[0033] To make the above-mentioned objects, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a full understanding of this utility model. However, this utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed below.

[0034] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0035] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0036] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0037] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0038] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0039] See Figures 1 to 5 An embodiment of this utility model provides a correction device, which includes a lifting mechanism 100 and a correction plate 200. The correction plate 200 is connected to the lifting mechanism 100, which is used to drive the correction plate 200 to move relative to the carrier plate 500. The correction plate 200 includes a plate body 210 and a plurality of support columns 220. The plurality of support columns 220 are spaced apart on the same side of the plate body 210. The support columns 220 are provided with a textured surface layer that is the same as the surface of the workpiece to be corrected on the side away from the plate body 210.

[0040] This technical solution provides a deviation correction device, which includes a lifting mechanism 100 and a deviation correction plate 200. By connecting the deviation correction plate 200 to the lifting mechanism 100, the lifting mechanism 100 drives the deviation correction plate 200 to move relative to the carrier plate 500, thereby correcting the deviation of the workpiece supported on the deviation correction plate 200 so that the workpiece can be placed in the middle of the limiting groove 510 of the carrier plate 500. By providing multiple spaced support columns 220 on the plate body 210, the workpiece is supported by the support columns 220, thereby reducing the contact area between the workpiece and the deviation correction plate 200, thus reducing surface damage to the workpiece caused by contact with the deviation correction plate 200, and thus improving the surface quality of the workpiece. By providing a textured surface layer identical to that of the workpiece with correction on the surface of the support column 220 away from the plate body 210, the same material as the support column 220 prevents damage and contamination to the textured workpiece after contact with the support column 220. This effectively solves the problem of black spots and black dots caused by the contact between the workpiece and the correction plate 200, thereby improving the surface quality of the workpiece after chemical vapor deposition and the electrical performance of the photovoltaic cell.

[0041] Specifically, in this embodiment, the workpiece is a silicon wafer, which is the basic material in photovoltaic cells. The correction device is used in the PECVD process of the silicon wafer. Before PECVD, a textured surface structure needs to be formed on the surface of the silicon wafer through a surface etching process to reduce light reflectivity and improve photoelectric conversion efficiency. During PECVD, the four edges of the silicon wafer are placed on the steps of the limiting groove 510 of the carrier plate 500. The lifting mechanism 100 includes a driving component 110 such as a driving cylinder or hydraulic cylinder, and a lifting component 120 for connecting to the correction plate 200. The lifting component 120 is connected to the piston rod of the driving component 110, and the correction plate 200 is connected to the end of the lifting component 120 opposite to the piston rod. The lifting member 120 is driven by the driving member 110 to move relative to the carrier plate 500, thereby causing the correction plate 200 to move relative to the carrier plate 500. The correction plate 200 corrects the silicon wafer so that the silicon wafer can be supported on the step of the limiting groove 510 of the carrier plate 500 and located in the middle position of the carrier plate 500.

[0042] It is understood that in this embodiment, the workpiece is a silicon wafer, the textured layer on the workpiece is a structural layer formed by an etching process, and the textured layer on the support column 220 is the same structural layer as the textured layer on the workpiece. Therefore, the textured layer on the support column 220 is also a structural layer formed by an etching process.

[0043] Specifically, there is no limit to the number of support columns 220; it can be three, four, five, or even more. For example... Figure 2 and Figure 4As shown, in this embodiment, there are five support columns 220. The plate body 210 is a rectangular plate structure. Two spaced-apart support columns 220 are respectively provided at both ends of the rectangular plate body 210 along its length, and one support column 220 is provided in the middle of the plate body 210. This ensures the stability of the workpiece support while reducing the number of support columns 220, thus reducing the contact area between the support columns 220 and the workpiece. This effectively solves the problem of black spots and blemishes on the silicon wafer surface caused by contact between the silicon wafer and the correction plate 200.

[0044] In one embodiment, the support post 220 is made of either monocrystalline silicon or polycrystalline silicon. By setting the material of the support post 220 to either monocrystalline silicon or polycrystalline silicon, the material of the support post 220 is the same as that of the silicon wafer. Consequently, the material of the textured layer formed after etching the top surface of the support post 220 is consistent with the textured layer on the silicon wafer. This ensures that the support post 220 will not damage or contaminate the silicon wafer after it comes into contact with the silicon wafer, effectively solving the problem of black spots on the silicon wafer surface caused by contact between the silicon wafer and the correction plate 200.

[0045] like Figure 5 As shown, in one embodiment, the side of the support post 220 facing away from the plate body 210 is constructed as an arc surface. By setting the side of the support post 220 facing away from the plate body 210 as an arc surface, the contact area between the silicon wafer and the support post 220 is reduced, thereby further reducing the problem of black spots on the silicon wafer surface caused by the contact between the silicon wafer and the support post 220, and thus improving the surface quality of the silicon wafer.

[0046] like Figure 1 and Figure 3 As shown, in one embodiment, the plate body 210 includes a base layer 211 and a connecting layer 212. The base layer 211 is used to connect with the lifting mechanism 100; the connecting layer 212 is disposed on the base layer 211, and the support columns 220 are spaced apart on the side of the connecting layer 212 facing away from the base layer 211. Specifically, the plate body 210 is a rectangular plate structure, and correspondingly, the base layer 211 and the connecting layer 212 are also rectangular plate structures. The base layer 211 is used to connect and support the connecting layer 212, and the connecting layer 212 is used to support and connect the support columns 220. By connecting the base layer 211 to the lifting mechanism 100 so that the lifting mechanism 100 drives the base layer 211 to move relative to the carrier plate 500, the connecting layer 212 and the support columns 220 are moved relative to the carrier plate 500.

[0047] Specifically, the base layer 211 and the connecting layer 212 are made of plastic. More specifically, the base layer 211 and the connecting layer 212 can be made of PEEK resin, polyethylene, polypropylene, etc. By making the base layer 211 and the connecting layer 212 plastic, the plate body 210 becomes lighter, more durable, and more corrosion-resistant.

[0048] In one embodiment, the connecting layer 212 has a plurality of mounting holes, the number of which corresponds to the number of support columns 220. One end of each support column 220 is embedded in a mounting hole. By providing a plurality of mounting holes on the connecting layer 212, the number of which corresponds to the number of support columns 220, so that each support column 220 can be installed into a corresponding mounting hole. By embedding one end of each support column 220 into a mounting hole, a fixed connection between the support column 220 and the connecting layer 212 is achieved.

[0049] In one embodiment, the base layer 211 is bonded to the connecting layer 212. Bonding the base layer 211 to the connecting layer 212 achieves a fixed connection between them. Specifically, the base layer 211 and the connecting layer 212 can be bonded using double-sided adhesive or an adhesive such as epoxy resin. Bonding the base layer 211 and the connecting layer 212 simplifies their structure and makes the connection process simpler.

[0050] like Figure 4 As shown, in one embodiment, the correction device further includes a first fastener 300. Both the base layer 211 and the connecting layer 212 have multiple spaced-apart through holes. The first fastener 300 passes through these through holes to secure the base layer 211 and the connecting layer 212. Specifically, the first fastener 300 is a bolt and a nut. By providing multiple spaced-apart through holes on the base layer 211 and the connecting layer 212, bolts can pass through these holes, and the fasteners are secured with nuts, thereby achieving a fixed connection between the base layer 211 and the connecting layer 212. The base layer 211 and the connecting layer 212 are fixedly connected by bolts to ensure the reliability of their fixed connection.

[0051] like Figure 1 As shown, in one embodiment, the base layer 211 has a plurality of spaced-apart connecting holes, through which the second fastener 400 passes and connects to the lifting mechanism 100. In this embodiment, the second fastener 400 is a bolt. By providing a plurality of spaced-apart connecting holes on the base layer 211, and by passing the second fastener 400 through the connecting holes on the base layer and engaging the bolt with the threaded hole on the lifting member 120 in the lifting mechanism 100, a fixed connection between the base layer 211 and the lifting mechanism 100 is achieved.

[0052] like Figure 6 and Figure 7 As shown, an embodiment of the present invention also provides a loading and unloading device, which includes the above-mentioned correction device and a carrier plate 500. The carrier plate 500 has a 520-hole structure. A lifting mechanism 100 is correspondingly arranged with the carrier plate 500. The lifting mechanism 100 can drive the correction plate 200 to move into the 520-hole.

[0053] By applying the above-mentioned correction device to the loading and unloading equipment, and by setting the surface of the support column 220 away from the plate body 210 with a textured layer that is the same as the surface of the workpiece with correction, since the two are made of the same material, the workpiece will not be damaged or contaminated after contacting the support column 220. This effectively solves the problem of black spots and black dots caused by the contact position between the workpiece and the correction plate 200, thereby improving the surface quality of the workpiece after the chemical vapor deposition process and the electrical performance of the photovoltaic cell.

[0054] Specifically, by setting a perforated hole 520 on the carrier plate 500 and corresponding the lifting mechanism 100 to the carrier plate 500, the lifting mechanism 100 drives the correction plate 200 to move relative to the carrier plate 500 into the perforated hole, so that the workpiece placed on the correction plate 200 is placed on the step of the limiting groove 510 of the carrier plate 500, thereby realizing the correction of the workpiece and ensuring the reliable operation of the PECVD process.

[0055] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0056] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A deviation rectifying device characterized by comprising: The correction device includes: Lifting mechanism; A correction plate is connected to the lifting mechanism, which is used to move the correction plate relative to the carrier plate. The correction plate includes a plate body and multiple support columns. Multiple support columns are spaced apart on the same side of the plate body; The support column has a textured surface layer on the side facing away from the plate body, which is the same as the surface of the workpiece to be corrected.

2. The correction device of claim 1, wherein The support column is made of either monocrystalline silicon or polycrystalline silicon.

3. The correction device according to claim 1, characterized in that, The side of the support column away from the plate body is constructed as an arc surface.

4. The correction device according to claim 1, characterized in that, The plate body includes: A base layer for connection to the lifting mechanism; A connecting layer is disposed on the base layer, and the support columns are spaced apart on the side of the connecting layer opposite to the base layer.

5. The correction device according to claim 4, characterized in that, The connecting layer has multiple mounting holes, the number of which corresponds to the number of support columns, and one end of each support column is embedded in a mounting hole.

6. The correction device according to claim 4, characterized in that, The base layer and the connecting layer are made of plastic.

7. The correction device according to claim 4, characterized in that, The base layer is bonded to the connecting layer.

8. The correction device according to claim 4, characterized in that, The correction device further includes a first fastener. Both the base layer and the connecting layer are provided with a plurality of spaced through holes. The first fastener passes through the through holes to fasten the base layer and the connecting layer.

9. The correction device according to claim 4, characterized in that, The base layer is provided with a plurality of spaced connection holes, and the second fastener passes through the connection holes and is connected to the lifting mechanism.

10. A loading and unloading device, characterized in that, The loading and unloading equipment includes a deviation correction device as described in any one of claims 1-9, and: A carrier plate with perforated holes is provided, and a lifting mechanism is provided correspondingly to the carrier plate. The lifting mechanism can drive the correction plate to move into the perforated holes.