Stretchable substrate, electronic device, and related manufacturing method

Abstract

The present disclosure provides a stretchable substrate, an electronic device, and a related manufacturing method. The stretchable substrate comprises a flexible part and a rigid part which are integrally arranged; the flexible part comprises a flexible polymer network; the rigid part comprises a rigid polymer network; and the ratio of a hydrogen bond to a cross-linked chemical bond in the flexible polymer network is greater than the ratio of a hydrogen bond to a cross-linked chemical bond in the rigid polymer network.

Description

A stretchable substrate, electronic device, and related fabrication method Technical Field

[0001] This disclosure relates to the field of stretchable electronic device technology, and in particular to a stretchable substrate, electronic device, and related fabrication methods. Background Technology

[0002] Stretchable electronic devices have attracted widespread interest in recent years due to their ability to function under complex deformations, leading to many important applications such as wearable electronic devices and curved surface electronic devices.

[0003] Commercially available electronic components possess excellent electrical properties, but the materials used to manufacture them are difficult to deform. Furthermore, the electrical properties of electronic components made from intrinsically stretchable materials currently fall short of the requirements for electronic devices. Integrating rigid electronic components with an elastic substrate is one approach to achieving excellent electronic performance and overall mechanical stretchability. However, due to the mechanical mismatch between the electronic components and the elastic substrate, the reliability and durability of such heterogeneously integrated stretchable electronic devices are poor.

[0004] Summary of the Invention

[0005] This disclosure provides a stretchable substrate, an electronic device, and a related fabrication method, as detailed below:

[0006] This disclosure provides a stretchable substrate comprising an integrally formed flexible portion and a rigid portion. The flexible portion includes a flexible polymer network, and the rigid portion includes a rigid polymer network. The ratio of hydrogen bonds to crosslinked chemical bonds in the flexible polymer network is greater than the ratio of hydrogen bonds to crosslinked chemical bonds in the rigid polymer network.

[0007] In one possible implementation, in the stretchable substrate provided in the embodiments of this disclosure, the ratio of the elastic modulus of the rigid portion to that of the flexible portion is at least greater than 10.

[0008] In one possible implementation, in the stretchable substrate provided in the embodiments of this disclosure, the ratio of the elastic modulus of the rigid portion to that of the flexible portion is greater than 1000.

[0009] In one possible implementation, in the stretchable substrate provided in the embodiments of this disclosure, the flexible polymer network includes a crosslinked long-chain polymer, a long-chain crosslinking agent, a hydrogen-rich monomer, and a rigid monomer, wherein the long-chain crosslinking agent, the hydrogen-rich monomer, the rigid monomer, and the crosslinked long-chain polymer are connected by hydrogen bonds.

[0010] In one possible implementation, in the stretchable substrate provided in the embodiments of this disclosure, the rigid polymer network is formed by cross-linking a long-chain crosslinking agent, hydrogen-rich monomers, and rigid monomers through chemical bonds.

[0011] In one possible implementation, in the stretchable substrate provided in the embodiments of this disclosure, the long-chain crosslinking agent comprises aliphatic urethane diacrylate, the hydrogen-rich monomer comprises 2-hydroxyethyl acrylate, and the rigid monomer comprises isobornyl acrylate.

[0012] In one possible implementation, in the stretchable substrate provided in the embodiments of this disclosure, the thickness of the rigid portion is greater than the thickness of the flexible portion.

[0013] In one possible implementation, in the stretchable substrate provided in the embodiments of this disclosure, the stretchable substrate is square in shape, and there are multiple rigid parts, which are distributed in a matrix.

[0014] In one possible implementation, in the stretchable substrate provided in the embodiments of this disclosure, the shape of the stretchable substrate is circular or elliptical, and the number of rigid parts is multiple, with the multiple rigid parts distributed in a ring array.

[0015] In one possible implementation, in the stretchable substrate provided in the embodiments of this disclosure, the shape of the stretchable substrate is square, circular or elliptical, and the number of rigid parts is multiple, with the multiple rigid parts being irregularly distributed.

[0016] In one possible implementation, in the stretchable substrate provided in the embodiments of this disclosure, the shape of the rigid part includes at least one of a square, a rectangle, a circle, and an ellipse.

[0017] In one possible implementation, in the stretchable substrate provided in the embodiments of this disclosure, the stretchable substrate is square in shape, and both the rigid part and the flexible part are strip-shaped, extending in the same direction and being alternately arranged.

[0018] Accordingly, this disclosure also provides an electronic device, including: the stretchable substrate provided in this disclosure, and electronic components located on the rigid portion of the stretchable substrate.

[0019] In one possible implementation, the electronic device provided in the embodiments of this disclosure further includes a conductive electrode located on the side of the rigid portion facing the electronic element, and the electronic element is electrically connected to the conductive electrode.

[0020] In one possible implementation, the electronic device provided in the embodiments of this disclosure further includes a wire located on the flexible portion of the stretchable substrate, the wire being electrically connected to the conductive electrode.

[0021] In one possible implementation, the electronic device provided in the embodiments of this disclosure includes at least one of LED, capacitor, resistor, and chip.

[0022] In one possible implementation, the electronic device provided in the embodiments of this disclosure further includes a polymer encapsulation layer located on the side of the electronic element opposite to the stretchable substrate.

[0023] Accordingly, this disclosure also provides a method for manufacturing a stretchable substrate, used to manufacture the stretchable substrate provided in this disclosure, the method comprising:

[0024] Forming a fully flexible substrate with a flexible polymer network;

[0025] The target area of ​​the fully flexible substrate is subjected to rigidification, which transforms the flexible polymer network of the target area into a rigid polymer network, so that the target area forms a rigid part, and the remaining areas except the rigid part constitute a flexible part.

[0026] In one possible implementation, the fabrication method provided in the embodiments of this disclosure, wherein forming a fully flexible substrate with a flexible polymer network specifically includes:

[0027] A mixed solution is obtained by mixing a long-chain crosslinking agent, a hydrogen-rich monomer, a rigid monomer, and a photoinitiator.

[0028] A gasket is placed around the first release film, and the mixed solution is drop-coated onto the first release film, the height of the mixed solution being the same as the height of the gasket.

[0029] A second release film is placed on the pad, and the second release film is in contact with the mixed solution;

[0030] The mixed solution is irradiated by a first preset light through the second release film, and the mixed solution polymerizes under the irradiation of the first preset light to form the flexible polymer network.

[0031] In one possible implementation, the fabrication method provided in this embodiment of the present disclosure involves rigidifying the target region of the fully flexible substrate, specifically including:

[0032] Remove the second release film and cover the side of the fully flexible substrate away from the first release film with a mask; wherein the mask includes a light-transmitting area and a light-blocking area, the light-transmitting area corresponding to the target area and the light-blocking area corresponding to the non-target area;

[0033] The flexible substrate is irradiated through the mask using a second preset light source, and the target area corresponding to the light-transmitting area undergoes a cross-linking reaction to form a rigid polymer network; wherein the intensity of the second preset light source is greater than the intensity of the first preset light source.

[0034] Remove the mask to obtain the stretchable substrate.

[0035] In one possible implementation, in the manufacturing method provided in the embodiments of this disclosure, the long-chain crosslinking agent includes aliphatic urethane diacrylate, the hydrogen-rich monomer includes 2-hydroxyethyl acrylate, the rigid monomer includes isobornyl acrylate, and the photoinitiator includes phenyl bis(2,4,6-trimethylbenzoyl)phosphine oxide.

[0036] In one possible implementation, in the manufacturing method provided in the embodiments of this disclosure, the mass ratio of the rigid monomer, the hydrogen-rich monomer, and the long-chain crosslinking agent is 1:3:1, and the mass fraction of the photoinitiator is 0.5-10%.

[0037] In one possible implementation, in the manufacturing method provided in this embodiment, the intensity of the first preset illumination is 0.25-0.75 mW / cm². 2 The intensity of the second preset illumination is 1.25-50 mW / cm². 2 .

[0038] In one possible implementation, in the manufacturing method provided in the embodiments of this disclosure, the irradiation time of the first preset light is 5-60s, and the irradiation time of the second preset light is 2-20s.

[0039] Accordingly, this disclosure also provides a method for manufacturing an electronic device, used to manufacture the electronic device provided in this disclosure, the method comprising:

[0040] A stretchable substrate is formed using the fabrication method for a stretchable substrate provided in the embodiments of this disclosure.

[0041] Electronic components are integrated onto the rigid portion of the stretchable substrate.

[0042] In one possible implementation, the manufacturing method provided in the embodiments of this disclosure, prior to integrating the electronic components onto the rigid portion of the stretchable substrate, further includes:

[0043] Gallium-indium alloy, deionized water and sodium alginate were mixed and stirred evenly to obtain a liquid metal slurry.

[0044] The liquid metal paste is printed onto the rigid and flexible portions of the stretchable substrate using a printing method, forming conductive electrodes on the rigid portion and wires on the flexible portion.

[0045] In one possible implementation, the manufacturing method provided in the embodiments of this disclosure further includes:

[0046] The electronic component is encapsulated using a polymer material to form a polymer encapsulation layer located on the side of the electronic component away from the stretchable substrate. Attached Figure Description

[0047] Figure 1 is a schematic diagram of a stretchable substrate provided in an embodiment of this disclosure;

[0048] Figure 2 is a schematic diagram of the internal structure of the flexible part in Figure 1;

[0049] Figure 3 is a schematic diagram of the internal structure of the rigid part in Figure 1;

[0050] Figure 4 is a schematic diagram of the specific structure within the dashed box in Figure 2;

[0051] Figure 5 is a schematic diagram of the specific structure within the dashed box in Figure 3;

[0052] Figure 6 shows a schematic diagram of the reactions of IBOA, 2-HEA and AUD under different ultraviolet light intensities;

[0053] Figure 7 is a schematic diagram of another stretchable substrate provided in an embodiment of this disclosure;

[0054] Figure 8 is a schematic diagram of another stretchable substrate provided in an embodiment of this disclosure;

[0055] Figure 9 is a schematic diagram of another stretchable substrate provided in an embodiment of this disclosure;

[0056] Figure 10 is a schematic diagram of another stretchable substrate provided in an embodiment of this disclosure;

[0057] Figure 11 is a schematic diagram of another stretchable substrate provided in an embodiment of this disclosure;

[0058] Figure 12 is a schematic flowchart of a method for manufacturing a stretchable substrate according to an embodiment of this disclosure;

[0059] Figure 13 is a schematic diagram of the fabrication process for forming a fully flexible substrate with a flexible polymer network;

[0060] Figure 14A is a schematic diagram of a stretchable substrate during the manufacturing process according to an embodiment of this disclosure;

[0061] Figure 14B is another structural schematic diagram of a stretchable substrate provided in the present disclosure during the manufacturing process;

[0062] Figure 14C is another structural schematic diagram of a stretchable substrate provided in the present disclosure during the manufacturing process;

[0063] Figure 14D is another structural schematic diagram of a stretchable substrate provided in the present disclosure during the manufacturing process;

[0064] Figure 15 is a schematic diagram of the fabrication process for rigidifying the target area of ​​a fully flexible substrate.

[0065] Figure 16A is a structural schematic diagram of another stretchable substrate provided in the present disclosure during the manufacturing process;

[0066] Figure 16B is a schematic diagram of another structure of a stretchable substrate provided in the present disclosure during the manufacturing process;

[0067] Figure 16C is a schematic diagram of another structure of a stretchable substrate provided in the present disclosure during the manufacturing process;

[0068] Figure 16D is a schematic diagram of another structure of a stretchable substrate provided in the present disclosure during the manufacturing process;

[0069] Figure 17 shows the tensile stress-strain curves of the substrate under different light intensities;

[0070] Figure 18 shows the curve of elastic modulus as a function of light intensity;

[0071] Figure 19A is a schematic diagram of the structure of an electronic device during the manufacturing process according to an embodiment of this disclosure;

[0072] Figure 19B is a schematic diagram of another structure of an electronic device provided in the present disclosure during the manufacturing process;

[0073] Figure 19C is a schematic diagram of another structure of an electronic device provided in the present disclosure during the manufacturing process;

[0074] Figure 20A is a schematic diagram of the structure of another electronic device provided in the present disclosure during the manufacturing process;

[0075] Figure 20B is a schematic diagram of another electronic device provided in the present disclosure during the manufacturing process;

[0076] Figure 20C is a schematic diagram of another electronic device provided in the present disclosure during the manufacturing process;

[0077] Figure 21 is a schematic flowchart of a method for manufacturing an electronic device according to an embodiment of this disclosure;

[0078] Figure 22 is a schematic flowchart of another manufacturing method of an electronic device provided in an embodiment of this disclosure;

[0079] Figure 23 is a schematic flowchart of another manufacturing method of an electronic device provided in an embodiment of this disclosure. Detailed Implementation

[0080] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. Furthermore, the embodiments and features in the embodiments of this disclosure can be combined with each other without conflict. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0081] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms "comprising" or "including," and similar terms as used in this disclosure, mean that an element or object preceding the term encompasses the elements or objects listed following the term and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. Terms such as "inner," "outer," "upper," and "lower" are used only to indicate relative positional relationships; these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0082] It should be noted that the dimensions and shapes of the figures in the accompanying drawings do not reflect actual proportions and are intended only to illustrate the content of this disclosure. Furthermore, the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout.

[0083] In related technologies, stretchable electronic devices generally integrate rigid electronic components with a stretchable substrate. Due to the mechanical mismatch between the rigid electronic components and the stretchable substrate, the reliability and durability of such heterogeneously integrated stretchable electronic devices are very poor. Specifically, because of the high strain concentration at the interface between the rigid electronic components and the stretchable substrate, the encapsulated electronic components with a certain thickness are prone to delamination and sliding from the stretchable substrate; another type of thin-film device, when integrated with a stretchable substrate, often develops irreversible cracks at low strain (<5%), leading to the failure of the thin-film device. Therefore, while endowing heterogeneously integrated devices with overall stretchability, how to ensure the excellent electrical performance of stretchable electronic devices is a major challenge facing the field of flexible stretchable electronics.

[0084] In view of this, in order to solve the problems of low tensile strength and unstable electromechanical performance caused by integrating rigid electronic components on a stretchable substrate, this disclosure provides a stretchable substrate 100, as shown in FIG1, including an integrally formed flexible part 1 and a rigid part 2; as shown in FIG2, FIG2 is a schematic diagram of the internal structure of the flexible part 1 in FIG1, the flexible part 1 includes a flexible polymer network 11; as shown in FIG3, FIG3 is a schematic diagram of the internal structure of the rigid part 2 in FIG1, the rigid part 2 includes a rigid polymer network 21; wherein, the ratio of hydrogen bonds to crosslinking chemical bonds in the flexible polymer network 11 is greater than the ratio of hydrogen bonds to crosslinking chemical bonds in the rigid polymer network 21. Specifically, the polymer network is generally formed by polymerization of organic material monomers that can undergo crosslinking reactions. The wavy lines of shape A in the flexible polymer network 11 represent organic material monomers that have not undergone chemical crosslinking. These organic material monomers that have not undergone chemical reactions can form hydrogen bonds with each other or with crosslinked long-chain polymers that have undergone chemical crosslinking. The wavy lines of shape B represent polymer networks that have formed crosslinking chemical bonds.

[0085] The stretchable substrate provided in this disclosure introduces a rigid portion embedded within the stretchable substrate. Since both the flexible and rigid portions have internal structures comprising polymer networks, the same polymer network precursor can be used to fabricate both portions, meaning they have the same material composition. Therefore, the interface between the flexible and rigid portions exhibits strong bonding. Furthermore, because the ratio of hydrogen bonds to cross-linked chemical bonds in the flexible polymer network is greater than that in the rigid polymer network, the mechanical strength of the rigid portion is significantly enhanced. Thus, under tensile strain, only the flexible portion deforms, effectively protecting the rigid portion from deformation during stretching. This achieves strain isolation protection for the rigid portion, allowing different types of rigid electronic components to be directly integrated onto the rigid portion, ensuring that the electronic components are not damaged during stretching. Therefore, the rigid-flexible compatible stretchable substrate provided in this disclosure can achieve strain isolation of electronic components, ensuring the functional stability of the device, and has broad application prospects in stretchable electronic devices, medical and health applications, and wearable devices.

[0086] In some embodiments, as shown in Figures 1-3, in the stretchable substrate provided in this disclosure, by controlling the degree of crosslinking of the polymer networks in the flexible portion 1 and the rigid portion 2, the ratio of the elastic moduli of the rigid portion 2 and the flexible portion 1 can be made at least greater than 10. This results in a significant modulus difference between the rigid portion 2 and the flexible portion 1. When the entire device undergoes tensile deformation, only the flexible portion 1 deforms, and almost all the strain is absorbed by the flexible portion 1. Essentially no strain acts on the electronic components in the rigid portion 2, thereby ensuring the overall tensile and electrical properties of the device.

[0087] In some embodiments, as shown in Figures 1-3, in the stretchable substrate provided in the present disclosure, by controlling the degree of crosslinking of the polymer network chemical bonds in the flexible part 1 and the rigid part 2, the ratio of the elastic modulus of the rigid part 2 and the flexible part 1 can be greater than 1000. Such a high modulus difference can better achieve the effect of strain isolation and protection of the rigid part 2 during stretching.

[0088] In some embodiments, in the stretchable substrate provided in this disclosure, as shown in FIG4 (FIG4 is a schematic diagram of the specific structure within the dashed box in FIG2), the flexible polymer network 11 includes a crosslinked long-chain polymer X1, a long-chain crosslinking agent X2, a hydrogen-rich monomer X3, and a rigid monomer X4. The long-chain crosslinking agent X2, the hydrogen-rich monomer X3, the rigid monomer X4, and the crosslinked long-chain polymer X1 are connected by hydrogen bonds (e.g., NH…O, OH…O). Specifically, the crosslinked long-chain polymer X1 is formed by chemically crosslinking the long-chain crosslinking agent X2 with the hydrogen-rich monomer X3 and / or the rigid monomer X4.

[0089] In some embodiments, in the stretchable substrate provided in the present disclosure, as shown in FIG5, FIG5 is a schematic diagram of the specific structure within the dashed box in FIG3, the rigid polymer network 21 is formed by cross-linking of long-chain crosslinking agent X2, hydrogen-rich monomer X3 and rigid monomer X4 through chemical bonds.

[0090] It should be noted that the long-chain crosslinking agent X2, the hydrogen-rich monomer X3, and the rigid monomer X4 are the aforementioned organic material monomers.

[0091] In some embodiments, in the stretchable substrate provided in the present disclosure, as shown in Figures 4 and 5, the long-chain crosslinking agent X2 may include, but is not limited to, aliphatic urethane diacrylate (chemical structural formula: Abbreviated as AUD), R1, R2, and R3 can be aliphatic or aromatic groups; the hydrogen-rich monomer X3 can include, but is not limited to, 2-hydroxyethyl acrylate (chemical structural formula: Abbreviated as 2-HEA), the rigid monomer X4 can include, but is not limited to, isobornyl acrylate (chemical structural formula is...). Abbreviated as IBOA).

[0092] Specifically, IBOA, 2-HEA, and AUD can undergo different reactions under different UV light intensities and photoinitiators (e.g., phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide), as shown in Figure 6. Under weak UV light irradiation, a small portion of AUD, 2-HEA, and IBOA undergo chemical reactions, forming a rigid cross-linked long-chain polymer X1 through chemical bonds. Most of the unreacted AUD, 2-HEA, IBOA, and cross-linked long-chain polymer X1 are connected by NH…O hydrogen bonds. In addition, 2-HEA has abundant -OH groups, which form OH…O hydrogen bonds with the cross-linked long-chain polymer X1. The polymer network with a large number of hydrogen bonds is flexible and can provide high stretchability, thus forming a fully flexible substrate under weak UV light irradiation. As shown in Figure 6, under strong ultraviolet light irradiation, AUD, 2-HEA, and IBOA, which have not undergone chemical cross-linking, undergo a chemical cross-linking reaction initiated by a photoinitiator to form long-chain polymers. These long-chain polymers can then undergo chemical cross-linking, resulting in a higher degree of chemical cross-linking under strong ultraviolet light irradiation, forming a rigid polymer network and thus creating a rigid part with higher modulus. Therefore, this disclosure can employ a two-step photoirradiation method: first, a mixed solution of AUD, 2-HEA, IBOA, and a photoinitiator is irradiated with weak ultraviolet light to solidify it into a fully flexible substrate; then, a localized area of ​​the fully flexible substrate is irradiated with strong ultraviolet light using a mask, thereby achieving a patterned, programmable, stretchable substrate. This integrated flexible part 1 and rigid part 2 do not require complex semiconductor processes such as deposition or etching, making the fabrication process simpler, more efficient, and environmentally friendly, suitable for mass production.

[0093] In some embodiments, in the stretchable substrate provided in the present disclosure, as shown in FIG1, since the rigid part 2 is formed under strong ultraviolet light irradiation and the flexible part 1 is formed under weak ultraviolet light irradiation, the thickness of the rigid part 2 is generally greater than the thickness of the flexible part 1 due to thermal expansion and contraction. The specific thicknesses of the rigid part 2 and the flexible part 1 are determined according to the actual manufacturing process.

[0094] In some embodiments, the shape of the stretchable substrate and the shape of the rigid part provided in the present disclosure can be adjusted according to actual needs. For example, the shape of the stretchable substrate can be square, circular, elliptical, etc.; the size of the stretchable substrate and the size of the rigid part can be adjusted according to actual needs.

[0095] In some embodiments, as shown in Figures 1, 7, and 8, the stretchable substrate provided in this disclosure has a square shape and a plurality of rigid portions 2 arranged in a matrix. Specifically, the thickness of the stretchable substrate is designed as needed, for example, 50 μm; the rigid portions 2 are embedded in the stretchable substrate, that is, the rigid portions 2 penetrate the entire substrate, the rigid portions 2 are surrounded by flexible portions 1, the plurality of rigid portions 2 are arranged in a 4×4 matrix, the size of the rigid portions 2 is designed as needed, for example, 2 mm × 2 mm, and the spacing between adjacent rigid portions 2 is designed as needed, for example, 4 mm.

[0096] In some embodiments, as shown in FIG1, the rigid part 2 in the stretchable substrate provided in the present disclosure is square in shape.

[0097] In some embodiments, in the stretchable substrate provided in the present disclosure, as shown in FIG7, the rigid part 2 can be rectangular in shape, and multiple rigid parts 2 are distributed in a 14×10 matrix. The size of the rigid part 2 is designed as needed, for example, 1mm×0.5mm, and the spacing between adjacent rigid parts 2 is designed as needed, for example, 0.75mm.

[0098] In some embodiments, in the stretchable substrate provided in this disclosure, as shown in FIG8, the rigid portion 2 can be circular in shape, and multiple rigid portions 2 are distributed in a 9×9 matrix. The radius of the circular rigid portion 2 is designed as needed, for example, 0.5 mm, and the spacing between adjacent rigid portions 2 is designed as needed, for example, 0.5 mm. Compared with the high strain concentration at the rigid-flexible interface (sharp corner) corresponding to the square rigid portion 2 shown in FIG1 and FIG7, the design of the circular rigid portion 2 is beneficial to reducing the strain concentration at the rigid-flexible interface (curved surface).

[0099] In some embodiments, the shape of the rigid portion in the stretchable substrate provided in the present disclosure can also be elliptical or the like.

[0100] In some embodiments, as shown in FIG9, the stretchable substrate provided in this disclosure has a circular shape and a plurality of rigid parts 2 arranged in a ring array, which provides higher circumferential symmetry. Specifically, the shape of the stretchable substrate is not limited to a circle; for example, it can also be elliptical.

[0101] In some embodiments, as shown in FIG9, the shape of the rigid part 2 in the stretchable substrate provided in the present disclosure can be circular, but is not limited thereto. For example, the shape of the rigid part 2 can also be square, rectangular, elliptical, etc.

[0102] In some embodiments, as shown in FIG10, the stretchable substrate provided in the present disclosure has a square shape and a plurality of rigid portions 2, which are irregularly distributed. Specifically, the shape of the stretchable substrate is not limited to a square, and may also be circular or elliptical.

[0103] In some embodiments, as shown in FIG10, the stretchable substrate provided in the present disclosure may include rigid portions 2 of different sizes. For example, the shape of the rigid portion 2 may include rectangles and squares, but is not limited thereto. For example, the shape of the rigid portion 2 may also include circles, ellipses, etc.

[0104] In some embodiments, as shown in FIG11, the stretchable substrate provided in the present disclosure is square (e.g., rectangular or square), and both the rigid part 2 and the flexible part 1 are strip-shaped, extending in the same direction and alternately arranged.

[0105] It should be noted that Figures 1 and 7-11 are several possible implementations of the stretchable substrate provided in this disclosure, but are not limited thereto.

[0106] Based on the same inventive concept, this disclosure also provides a method for manufacturing a stretchable substrate, used to manufacture the stretchable substrate provided in this disclosure, as shown in FIG12. The manufacturing method includes:

[0107] S1201, Forming a fully flexible substrate with a flexible polymer network;

[0108] S1202. The target area of ​​the fully flexible substrate is rigidified to transform the flexible polymer network of the target area into a rigid polymer network, so that the target area forms a rigid part, and the remaining areas except the rigid part constitute a flexible part.

[0109] In some embodiments, the fabrication method described above in this disclosure involves forming a fully flexible substrate with a flexible polymer network, as shown in FIG13, specifically including:

[0110] S1301. A mixed solution is obtained by mixing a long-chain crosslinking agent, a hydrogen-rich monomer, a rigid monomer and a photoinitiator.

[0111] Specifically, hydrogen-rich monomer (2-HEA), rigid monomer (IBOA), and long-chain crosslinking agent (AUD) are mixed and stirred evenly in a mass ratio of 1:3:1, and a photoinitiator (phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide) with a mass fraction of 0.5-10% is added to obtain a mixed solution. In this embodiment, the mass fraction of the photoinitiator is 1%.

[0112] S1302. A gasket is placed around the first release film, and a mixed solution is dripped onto the first release film, with the height of the mixed solution being the same as the height of the gasket.

[0113] Specifically, as shown in Figure 14A, the mixed solution 1' from step S1301 is drop-coated onto the first release film 3, which is surrounded by gaskets (not shown), ensuring that the height of the mixed solution 1' is approximately the same as the height of the gaskets. Specifically, the thickness of the mixed solution 1' can be controlled by the height of the gaskets.

[0114] S1303. Place the second release film on the gasket, and bring the second release film into contact with the mixed solution;

[0115] Specifically, as shown in Figure 14A, the second release film 4 is placed on the gasket, and the second release film 4 is in contact with the mixed solution 1'.

[0116] S1304. The mixed solution is irradiated by the first preset light through the second release film, and the mixed solution polymerizes under the irradiation of the first preset light to form a flexible polymer network.

[0117] Specifically, as shown in Figure 14B, the mixed solution 1' is irradiated by a first preset light source transmitted through the second release film 4. The intensity of the first preset light source is 0.25-0.75 mW / cm². 2 (This disclosure uses 0.75mW / cm 2 For example, the wavelength can be 405nm and the irradiation time is 5-60s (30s is used as an example in this disclosure). The first preset light is also called weak ultraviolet light. Under the irradiation of weak ultraviolet light, the mixed solution 1' undergoes the polymerization reaction shown in Figure 6 to form a flexible polymer network 11 connected by a large number of hydrogen bonds and a small number of chemical bonds, that is, to form a fully flexible substrate 10.

[0118] In some embodiments, in the fabrication method provided in this disclosure, the target area of ​​the fully flexible substrate is subjected to rigid treatment, as shown in FIG15, specifically including:

[0119] S1501. Remove the second release film and cover the flexible substrate on the side opposite to the first release film with a mask; wherein the mask includes a light-transmitting area and a light-blocking area, the light-transmitting area corresponds to the target area, and the light-blocking area corresponds to the non-target area.

[0120] Specifically, as shown in Figure 14C, the second release film 4 is removed, and a mask 5 is used to cover the side of the fully flexible substrate 10 away from the first release film 3. The mask 5 includes a light-transmitting area 51 and a light-shielding area 52. The light-transmitting area 51 corresponds to the target area (the area where the rigid part 2 is located), and the light-shielding area 52 corresponds to the non-target area (the area where the flexible part 1 is located). For example, the mask 5 has a square light-transmitting area 51 with the same matrix arrangement as the rigid part 2 in Figure 1. That is, the size of the light-transmitting area 51 is 2mm × 2mm, and the spacing between adjacent light-transmitting areas 51 is 4mm.

[0121] S1502. The flexible substrate is irradiated through a mask using a second preset light source, and a cross-linking reaction occurs in the target area corresponding to the light-transmitting area to form a rigid polymer network; wherein, the intensity of the second preset light source is greater than the intensity of the first preset light source.

[0122] Specifically, as shown in Figure 14C, the flexible substrate 10 is illuminated by a second preset illumination through the mask 5. The intensity of the second preset illumination is greater than that of the first preset illumination; for example, the intensity of the second preset illumination is 1.25-50 mW / cm². 2 (This disclosure uses 50mW / cm) 2 For example, the wavelength is 405nm and the irradiation time is 2-20s (4s is used as an example in this disclosure). The second preset light is also called strong ultraviolet light. As shown in Figure 6, the target area corresponding to the light-transmitting area 51 undergoes a higher degree of chemical bond cross-linking under strong ultraviolet light irradiation, and the target area forms a rigid polymer network 21 so that the target area forms a rigid part 2 with a higher modulus. The remaining areas except the rigid part 2 constitute the flexible part 1.

[0123] S1503. Remove the mask to obtain a stretchable substrate;

[0124] Specifically, as shown in Figure 14D, the mask 5 is removed to obtain the rigid-flexible stretchable substrate 1.

[0125] Specifically, Figures 14A-14D illustrate the fabrication of the stretchable substrate shown in Figure 1. The fabrication methods of the stretchable substrates shown in Figures 7-11 are basically the same as those of the stretchable substrates shown in Figure 1, except that the mask 5 and the shape of the stretchable substrate are different.

[0126] Figures 16A-16D show the structural diagrams corresponding to each step in the fabrication of the stretchable substrate shown in Figure 10. Figure 16A corresponds to the fabrication method of Figure 14A, Figure 16B corresponds to the fabrication method of Figure 14B, Figure 16C corresponds to the fabrication method of Figure 14C, and Figure 16D corresponds to the fabrication method of Figure 14D.

[0127] This disclosure utilizes the same polymer network precursors (X2, X3, X4) under ultraviolet light irradiation of different intensities to fabricate a flexible part 1 and a rigid part 2 with strong bonding through hydrogen bonding and chemical cross-linking. The preparation method of this disclosure eliminates the need for complex semiconductor processes such as deposition or etching, making the fabrication process simpler and more efficient. The rigid-flexible stretchable substrate provided by this disclosure exhibits excellent properties, and the fabrication process is simple, environmentally friendly, and pollution-free, making it suitable for mass production.

[0128] To verify the feasibility of the fabrication method provided in this disclosure, specifically to verify that the degree of chemical crosslinking of X2, X3, and X4 differs under ultraviolet light irradiation of different intensities, and that the stiffness of the substrate corresponds to different degrees of crosslinking, thus verifying that the fabrication method provided in this disclosure can prepare a stretchable substrate with programmable stiffness, the inventors of this disclosure measured the change in the elastic modulus of the substrate with light intensity. Referring to Figures 14A and 14B, the specific steps are as follows:

[0129] (1) Mix 2-HEA, IBOA and AUD in a mass ratio of 1:3:1 and stir until homogeneous. Add 1% by mass of photoinitiator (phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide) to obtain mixed solution 1'.

[0130] (2) The mixed solution 1' from step (1) is dripped onto the first release film 3, which is surrounded by a gasket, ensuring that the height of the mixed solution 1' is approximately the same as the height of the gasket, and the second release film 4 is placed on the gasket, with the second release film 4 in contact with the mixed solution 1'.

[0131] (3) Fabricate six structures as shown in Figure 14A, using ultraviolet light of different intensities at a wavelength of 405 nm (intensities of 0.25 mW / cm²). 2 0.75mW / cm 2 1.25mW / cm 2 2.75mW / cm 2 12.25mW / cm 2 and 50mW / cm 2 The mixed solution 1' in the above six structures shown in Figure 14A was irradiated through the second release membrane 4, and the irradiation time corresponding to each intensity was 30s.

[0132] (4) Remove the first release film 3 and the second release film 4 after ultraviolet light irradiation of the six structures shown in Figure 14A to obtain six substrates in free states. Tensile tests are performed on the six substrates in free states using a stretching machine to obtain the tensile stress-strain curves of the substrates under different light intensities, as shown in Figure 17. Furthermore, the elastic modulus of the six substrates in free states is calculated, and the change curve of the elastic modulus with light intensity, as shown in Figure 18, is obtained. It can be seen that as the ultraviolet light intensity increases, the elastic modulus of the substrate increases, that is, the stiffness of the substrate is greater. Therefore, the method for manufacturing a stretchable substrate provided in this embodiment can precisely control the elastic modulus of a local area of ​​the stretchable substrate, thereby producing a stretchable substrate that is both rigid and flexible.

[0133] In practical implementation, the degree of cross-linking reaction in the mixed solution determines the elastic modulus of the cured substrate. The elastic modulus is positively correlated with light intensity, light exposure time, and the amount of photoinitiator added. Under the same conditions, the elastic modulus of the substrate increases with increasing light intensity, prolonged light exposure time, and increased amount of photoinitiator added. Therefore, the stretchable substrate provided in this disclosure has higher patterning accuracy, and the minimum achievable rigid part size reaches 2.2 μm.

[0134] Based on the same inventive concept, this disclosure also provides an electronic device, as shown in Figures 19C and 20C, including: the stretchable substrate 100 provided in this disclosure, and an electronic component 6 located on the rigid portion 2 of the stretchable substrate 100.

[0135] The electronic device provided in this embodiment of the present disclosure, by using the stretchable substrate provided in this embodiment of the present disclosure, can integrate non-stretchable rigid electronic components on the rigid part of the stretchable substrate. Since the flexible part and the rigid part have a huge modulus difference, when the stretchable device as a whole is stretched and deformed, only the flexible part deforms, and the strain is almost entirely absorbed by the flexible part. There is basically no strain acting on the electronic components in the rigid part, thereby ensuring the overall stretchability and electrical performance of the electronic device.

[0136] In some embodiments of the electronic device provided in this disclosure, as shown in FIG19C and FIG20C, a conductive electrode 7 is further provided on the side of the rigid portion 2 facing the electronic component 6. The electronic component 6 is electrically connected to the conductive electrode 7, so that power can be supplied to the electronic component 6 through the conductive electrode 7.

[0137] In some embodiments of the electronic device provided in this disclosure, as shown in FIG19C and FIG20C, a wire 8 located on the flexible portion 1 of the stretchable substrate 100 is further included. The wire 8 is electrically connected to the conductive electrode 7, so that the electronic components 6 can be interconnected through the stretchable wire 8 integrated on the flexible portion 1 of the stretchable substrate 100, and electrical signals can be transmitted to the conductive electrode 7 through the wire 8 to supply power to the electronic components 6.

[0138] In some embodiments, as shown in FIG19C and FIG20C, the electronic component 6 in the above-described electronic device provided in the present disclosure may include, but is not limited to, at least one of LED, capacitor, resistor, and chip. Specifically, the corresponding electronic component 6 may be integrated according to the type of electronic device.

[0139] In some embodiments, as shown in FIG19C and FIG20C, the electronic device provided in this disclosure further includes a polymer encapsulation layer 9 located on the side of the electronic component 6 opposite to the stretchable substrate 100. Specifically, the polymer encapsulation layer 9 can be made of platinum-cured silicone (Ecoflex) to obtain a fully encapsulated stretchable electronic device.

[0140] In some embodiments of the electronic device provided in this disclosure, as shown in FIG19C, the electronic component 6 can be an LED. The size of the LED is selected as needed. The positive and negative electrodes of the LED are respectively interconnected with the conductive electrodes 7 on the rigid part 2. All LEDs can be connected in series, or LEDs located in the same row can be connected in series. This disclosure takes LEDs located in the same row connected in series as an example. The conductive electrodes 7 on adjacent rigid parts 2 are interconnected by wires 8 located on the flexible part 1. Due to the huge modulus difference between the rigid part 2 and the flexible part 1, when the electronic device is stretched and deformed as a whole, only the flexible part 1 deforms. Almost all the strain is absorbed by the flexible part 1, and there is basically no strain acting on the LED, thereby ensuring the overall tensile and electrical performance of the device.

[0141] In some embodiments of the electronic device provided in this disclosure, as shown in FIG20C, the electronic device can be a stretchable acceleration sensing circuit device. The electronic component 6 may include capacitors (C1-C6) and chips (I1 and I2). The electrodes of the electronic component 6 are interconnected with the conductive electrodes 7 on the rigid part 2, and the conductive electrodes 7 are interconnected with each other through wires 8 located on the flexible part 1. Due to the huge modulus difference between the rigid part 2 and the flexible part 1, when the electronic device is stretched and deformed as a whole, only the flexible part 1 deforms, and almost all the strain is absorbed by the flexible part 1, with virtually no strain acting on the electronic component 6, thereby ensuring the overall tensile and electrical performance of the device.

[0142] It should be noted that Figures 19C and 20C of the embodiments of this disclosure are merely examples illustrating the types of electronic devices, and are not limited thereto. The electronic devices provided in the embodiments of this disclosure are applicable to any electronic device with stretchable properties, and are not listed one by one here.

[0143] It should be noted that Figures 19C and 20C of the present disclosure are merely examples illustrating the shape of the electronic rigid part 2. The shape of the electronic component 6 is the same as the shape of the rigid part 2. When the shape of the rigid part 2 is a circle as shown in Figures 8 and 9, the electronic component 6 can be, for example, a circular LED bead.

[0144] Based on the same inventive concept, this disclosure also provides a method for manufacturing an electronic device, used to manufacture the electronic device provided in this disclosure, as shown in FIG21. The manufacturing method includes:

[0145] S2101. A stretchable substrate is formed using the manufacturing method for a stretchable substrate provided in the embodiments of this disclosure.

[0146] Specifically, the stretchable substrate shown in Figure 1 is formed by using steps S1301 to S1304 and S1501 to S1503.

[0147] S2102. Integrating electronic components onto the rigid portion of a stretchable substrate.

[0148] In some embodiments, as shown in FIG22, the manufacturing method provided in this disclosure includes the following steps before step S2102:

[0149] S2102': Mix gallium-indium alloy, deionized water and sodium alginate evenly to obtain liquid metal slurry;

[0150] Specifically, 16g of gallium-indium alloy (75wt.% Ga, 25wt.% In), 32g of deionized water and 1.28g of sodium alginate were mixed and stirred evenly with an electric stirring motor at a stirring speed of 1500 rpm for 10 minutes to obtain a printable liquid metal slurry.

[0151] S2102” uses a printing method to print liquid metal paste onto the rigid and flexible parts of a stretchable substrate, forming conductive electrodes on the rigid part and wires on the flexible part;

[0152] Specifically, the liquid metal paste is placed into the printing barrel of the printer and printed using a needle with a diameter of 100 μm. During the printing process, the air pressure is set to 40 psi and the distance between the needle and the stretchable substrate is 10 μm. Conductive electrodes 7 are printed on the rigid part 2 according to the set pattern, and wires 8 are printed on the flexible part 1, as shown in Figure 19A.

[0153] Specifically, as shown in Figure 19B, the electronic component 6 (LED) is attached to the conductive electrode 7 integrated on the rigid part 2.

[0154] In some embodiments, as shown in FIG23, the manufacturing method provided in this disclosure further includes:

[0155] S2103. The electronic component is encapsulated using polymer materials to form a polymer encapsulation layer located on the side of the electronic component away from the stretchable substrate.

[0156] Specifically, 10g of each of the two platinum-curing silicone (Ecoflex) prepolymers were weighed out, mixed and stirred for 3 minutes, placed in an oven and vacuumed for 1 minute, and then poured onto the device shown in Figure 19B. After standing for 2 hours, the polymer encapsulation layer 9 was cured, and a stretchable electronic device with overall encapsulation was obtained, as shown in Figure 19C.

[0157] Therefore, the stretchable substrate shown in FIG1 is formed through the above steps S1301 to S1304 and S1501 to S1503, and the electronic device shown in FIG19C is formed through steps S2102', S2102" and S2102 and S2103.

[0158] The fabrication process of the electronic device shown in Figure 20C is as follows:

[0159] (1) The stretchable substrate shown in FIG10 is formed by steps S1301 to S1304 and S1501 to S1503, wherein the mask 5 in step S1502 has a light-transmitting area 51 corresponding to the rigid part 2 shown in FIG10.

[0160] (2) Specifically, 16g of gallium-indium alloy (75wt.%Ga, 25wt.%In), 32g of deionized water and 1.28g of sodium alginate were mixed and stirred evenly with an electric stirring speed of 1500 rpm for 10 minutes to obtain a printable liquid metal slurry.

[0161] (3) The above liquid metal paste is placed into the printing cylinder of the printer and printed using a needle with a diameter of 100μm. During the printing process, the air pressure is set to 40psi and the distance between the needle and the stretchable substrate is 10μm. Conductive electrodes 7 are printed on the rigid part 2 according to the set pattern, and wires 8 are printed on the flexible part 1, as shown in Figure 20A.

[0162] (4) As shown in Figure 20B, electronic components 6 (capacitors and chips) are attached to conductive electrodes 7 integrated on the rigid part 2.

[0163] (5) Weigh 10g of each of the two platinum-curing silicone (Ecoflex) prepolymers, mix and stir for 3 minutes, place in an oven and vacuum for 1 minute, then pour onto the device shown in Figure 19B. After standing for 2 hours, the polymer encapsulation layer 9 is cured, and a stretchable electronic device with overall encapsulation is obtained, as shown in Figure 20C.

[0164] This disclosure provides a stretchable substrate, electronic device, and related fabrication method. By introducing a rigid portion into the stretchable substrate, the rigid portion is embedded within it. Since both the flexible and rigid portions have internal structures comprising polymer networks, the same polymer network precursor can be used to fabricate both portions, meaning they have the same material composition. Therefore, the interface between the flexible and rigid portions exhibits strong bonding. Furthermore, because the ratio of hydrogen bonds to cross-linked chemical bonds in the flexible polymer network is greater than that in the rigid polymer network, the mechanical strength of the rigid portion is significantly enhanced. Thus, under tensile strain, only the flexible portion deforms, effectively protecting the rigid portion from deformation during stretching. This achieves strain isolation protection for the rigid portion, allowing different types of rigid electronic components to be directly integrated onto the rigid portion, ensuring that the electronic components are not damaged during stretching. Therefore, the rigid-flexible compatible stretchable substrate provided by this disclosure can achieve strain isolation of electronic components, ensuring the functional stability of the device, and has broad application prospects in stretchable electronic devices, medical and health applications, and wearable devices.

[0165] Although preferred embodiments have been described in this disclosure, it should be understood that those skilled in the art can make various modifications and variations to the embodiments of this disclosure without departing from the spirit and scope of the embodiments of this disclosure. Therefore, this disclosure is also intended to include such modifications and variations if they fall within the scope of the claims of this disclosure and their equivalents.

Claims

1. A stretchable substrate, wherein, The device includes an integrally formed flexible portion and a rigid portion. The flexible portion includes a flexible polymer network, and the rigid portion includes a rigid polymer network. The ratio of hydrogen bonds to cross-linked chemical bonds in the flexible polymer network is greater than the ratio of hydrogen bonds to cross-linked chemical bonds in the rigid polymer network.

2. The stretchable substrate as claimed in claim 1, wherein, The ratio of the elastic modulus of the rigid part to that of the flexible part is at least greater than 10.

3. The stretchable substrate as described in claim 2, wherein, The ratio of the elastic modulus of the rigid part to that of the flexible part is greater than 1000.

4. The stretchable substrate according to any one of claims 1-3, wherein, The flexible polymer network includes a cross-linked long-chain polymer, a long-chain cross-linking agent, a hydrogen-rich monomer, and a rigid monomer, wherein the long-chain cross-linking agent, the hydrogen-rich monomer, the rigid monomer, and the cross-linked long-chain polymer are connected by hydrogen bonds.

5. The stretchable substrate according to any one of claims 1-3, wherein, The rigid polymer network is formed by cross-linking long-chain crosslinking agents, hydrogen-rich monomers, and rigid monomers through chemical bonds.

6. The stretchable substrate as described in claim 4 or 5, wherein, The long-chain crosslinking agent includes aliphatic carbamate diacrylate, the hydrogen-rich monomer includes 2-hydroxyethyl acrylate, and the rigid monomer includes isobornyl acrylate.

7. The stretchable substrate according to any one of claims 1-6, wherein, The thickness of the rigid part is greater than the thickness of the flexible part.

8. The stretchable substrate according to any one of claims 1-7, wherein, The stretchable base is square in shape, and there are multiple rigid parts arranged in a matrix.

9. The stretchable substrate according to any one of claims 1-7, wherein, The stretchable base is circular or elliptical in shape, and there are multiple rigid parts arranged in a ring array.

10. The stretchable substrate according to any one of claims 1-7, wherein, The shape of the stretchable base is square, circular or elliptical, and the number of rigid parts is multiple, which are irregularly distributed.

11. The stretchable substrate according to any one of claims 8-10, wherein, The shape of the rigid part includes at least one of square, rectangle, circle, and ellipse.

12. The stretchable substrate according to any one of claims 1-7, wherein, The stretchable substrate is square in shape, and both the rigid part and the flexible part are strip-shaped. The rigid part and the flexible part extend in the same direction and are alternately arranged.

13. An electronic device, wherein, include: The stretchable substrate as described in any one of claims 1 to 12, and the electronic component located on the rigid portion of the stretchable substrate.

14. The electronic device of claim 13, wherein, It also includes a conductive electrode located on the side of the rigid portion facing the electronic component, and the electronic component is electrically connected to the conductive electrode.

15. The electronic device as claimed in claim 14, wherein, It also includes a wire located on the flexible portion of the stretchable substrate, the wire being electrically connected to the conductive electrode.

16. The electronic device according to any one of claims 13-15, wherein, The electronic components include at least one of LEDs, capacitors, resistors, and chips.

17. The electronic device according to any one of claims 13-16, wherein, It also includes a polymer encapsulation layer located on the side of the electronic component opposite to the stretchable substrate.

18. A method for manufacturing a stretchable substrate, used to manufacture the stretchable substrate as described in any one of claims 1-12, wherein, The manufacturing method includes: Forming a fully flexible substrate with a flexible polymer network; The target area of ​​the fully flexible substrate is subjected to rigidification, which transforms the flexible polymer network of the target area into a rigid polymer network, so that the target area forms a rigid part, and the remaining areas except the rigid part constitute a flexible part.

19. The manufacturing method as described in claim 18, wherein, The formation of the fully flexible substrate with a flexible polymer network specifically includes: A mixed solution is obtained by mixing a long-chain crosslinking agent, a hydrogen-rich monomer, a rigid monomer, and a photoinitiator. Gaskets are placed around the first release film, and the mixed solution is drop-coated onto the first release film. The height of the mixed solution is the same as the height of the gasket; A second release film is placed on the pad, and the second release film is in contact with the mixed solution; The mixed solution is irradiated by a first preset light through the second release film, and the mixed solution polymerizes under the irradiation of the first preset light to form the flexible polymer network.

20. The manufacturing method as described in claim 19, wherein, The target area of ​​the fully flexible substrate is subjected to rigid treatment, specifically including: Remove the second release film and cover the side of the fully flexible substrate away from the first release film with a mask; wherein the mask includes a light-transmitting area and a light-blocking area, the light-transmitting area corresponding to the target area and the light-blocking area corresponding to the non-target area; The flexible substrate is irradiated through the mask using a second preset light source, and the target area corresponding to the light-transmitting area undergoes a cross-linking reaction to form a rigid polymer network; wherein the intensity of the second preset light source is greater than the intensity of the first preset light source. Remove the mask to obtain the stretchable substrate.

21. The manufacturing method as described in claim 19, wherein, The long-chain crosslinking agent includes aliphatic carbamate diacrylate, the hydrogen-rich monomer includes 2-hydroxyethyl acrylate, the rigid monomer includes isobornyl acrylate, and the photoinitiator includes phenyl bis(2,4,6-trimethylbenzoyl)phosphine oxide.

22. The manufacturing method as described in claim 21, wherein, The mass ratio of the rigid monomer, the hydrogen-rich monomer, and the long-chain crosslinking agent is 1:3:1, and the mass fraction of the photoinitiator is 0.5-10%.

23. The manufacturing method as described in claim 20, wherein, The intensity of the first preset illumination is 0.25-0.75 mW / cm². 2 The intensity of the second preset illumination is 1.25-50 mW / cm². 2 .

24. The manufacturing method as described in claim 20, wherein, The first preset illumination time is 5-60s, and the second preset illumination time is 2-20s.

25. A method for manufacturing an electronic device, used to manufacture the electronic device as described in any one of claims 13-17, wherein, The manufacturing method includes: A stretchable substrate is formed using the manufacturing method described in any one of claims 18-24; Electronic components are integrated onto the rigid portion of the stretchable substrate.

26. The manufacturing method as described in claim 25, wherein, Before integrating the electronic components onto the rigid portion of the stretchable substrate, the method further includes: Gallium-indium alloy, deionized water and sodium alginate were mixed and stirred evenly to obtain a liquid metal slurry. The liquid metal paste is printed onto the rigid and flexible portions of the stretchable substrate using a printing method, forming conductive electrodes on the rigid portion and wires on the flexible portion.

27. The manufacturing method as described in claim 25, wherein, Also includes: The electronic component is encapsulated using a polymer material to form a polymer encapsulation layer located on the side of the electronic component away from the stretchable substrate.

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