Display device and testing method therefor

Abstract

A display device and a testing method therefor. The display device comprises a display substrate (11), an integrated circuit (12) and a flexible circuit board (13); the display substrate (11) comprises a first switch unit (S1), a second switch unit (S2), a plurality of first substrate pads (111A) and a plurality of second substrate pads (111B); the flexible circuit board (13) is connected to the second substrate pads (111B) by means of second connection pads (131); the integrated circuit (12) comprises a first control pad (124A), a second control pad (124B), a plurality of first connection pads (121), and a plurality of test pads (123); at least two of the first connection pads (121) are connected to at least two of the test pads (123) by means of the first switch unit (S1), and the first control pad (124A) control the on-off of the first switch unit (S1); at least two of the second substrate pads (111B) are connected to at least two of the test pads (123) by means of the second switch unit (S2), and the second control pad (124B) control the on-off of the second switch unit (S2); the integrated circuit (12) controls the on-off of the first switch unit (S1) and the second switch unit (S2), transmits an impedance test signal by means of the test pads (123), and detects the binding connection among the integrated circuit (12), the display substrate (11) and the flexible circuit board (13).

Description

Display device and test method thereof

[0001] The present application claims priority from the Chinese patent application No. 202410693121.2, filed on May 30, 2024, and entitled "Display device and test method thereof", the contents of which should be understood as incorporated herein by reference. TECHNICAL FIELD

[0002] The present disclosure relates to, but is not limited to, display technology, and in particular to a display device and a test method thereof. BACKGROUND

[0003] An organic light emitting diode (OLED) is an active light emitting display device, which has the advantages of self-emission, wide viewing angle, high contrast, low power consumption, and extremely high response speed. With the continuous development of display technology, a display device using OLED as a light emitting element and controlled by a thin film transistor (TFT) has become the mainstream product in the current display field.

[0004] However, the weight of the display device is not easy to reduce. SUMMARY

[0005] The following is a summary of the subject matter of the detailed description herein. This summary is not intended to limit the scope of the claims.

[0006] In a first aspect, embodiments of this disclosure provide a display device, including a display substrate, the display substrate including a display area and a non-display area surrounding the display area; a plurality of sub-pixels located in the display area; a plurality of data lines located in the display area and extending to the non-display area, the plurality of sub-pixels and the plurality of data lines being electrically connected; a plurality of first substrate pads and a plurality of second substrate pads located in the non-display area, the plurality of second substrate pads being located on the side of the plurality of first substrate pads away from the display area, the plurality of data lines being electrically connected to a portion of the plurality of first substrate pads; an integrated circuit located in the non-display area, the integrated circuit including a plurality of integrated circuit pads, the plurality of integrated circuit pads being bonded to the plurality of first substrate pads; a flexible circuit board located in the non-display area, the flexible circuit board including a plurality of second connection pads, the plurality of second connection pads being bonded to the plurality of second substrate pads; a first switching unit and a second switching unit located in the non-display area; wherein, the plurality of integrated circuit pads include a first control pad, a second control pad, and a second control pad. The integrated circuit comprises control pads, a plurality of first connection pads, and a plurality of test pads. The first control pads, second control pads, the plurality of first connection pads, and the plurality of test pads are correspondingly bonded to another portion of first substrate pads on the display substrate. At least two of the plurality of first connection pads are electrically connected to at least two of the plurality of test pads through a first switching unit. The first control pad is electrically connected to the gate electrode of the first switching unit and is configured to control the on / off state of the first switching unit. At least two of the plurality of second connection pads are electrically connected to the at least two test pads through a second switching unit. The second control pad is electrically connected to the gate electrode of the second switching unit and is configured to control the on / off state of the second switching unit. The integrated circuit is configured to detect the bonding connection between the integrated circuit and the display substrate or between the flexible circuit board and the integrated circuit by controlling the on / off state of the first switching unit and the second switching unit and transmitting impedance test signals through the at least two test pads.

[0007] In an exemplary embodiment, the integrated circuit further includes a first connection portion, wherein at least two of the plurality of first connection pads are connected through the first connection portion.

[0008] In an example embodiment, the first connection portion is connected with two first connection pads, and the two first connection pads are connected with two test pads respectively; the first switch unit comprises a first sub-switch and a second sub-switch; the first sub-switch is located between one pair of the first connection pad and the test pad, and the second sub-switch is located between another pair of the first connection pad and the test pad; a gate electrode of the first sub-switch and a gate electrode of the second sub-switch are connected with the first control pad.

[0009] In an example embodiment, a gate electrode of the first sub-switch is connected with the corresponding first control pad through a first trace, a first pole of the first sub-switch is connected with the corresponding first substrate pad through a second trace to be connected with the corresponding first connection pad, and a second pole of the first sub-switch is connected with the corresponding first substrate pad through a second trace to be connected with the corresponding test pad; a gate electrode of the second sub-switch is connected with the corresponding first control pad through a fourth trace, a first pole of the second sub-switch is connected with the corresponding first substrate pad through a fifth trace to be connected with the corresponding first connection pad, and a second pole of the second sub-switch is connected with the corresponding first substrate pad through a sixth trace to be connected with the corresponding test pad.

[0010] In an example embodiment, the flexible circuit board further comprises a second connection portion, and at least two second connection pads in the plurality of second connection pads are connected through the second connection portion.

[0011] In an example embodiment, the second connection portion is connected with two second connection pads, and the two second connection pads are connected with two test pads respectively; the second switch unit comprises a third sub-switch and a fourth sub-switch; the third sub-switch is located between one pair of the second connection pad and the test pad, and the fourth sub-switch is located between another pair of the second connection pad and the test pad; a gate electrode of the third sub-switch and a gate electrode of the fourth sub-switch are connected with the second control pad.

[0012] In an example embodiment, the gate electrode of the third sub-switch is connected to the corresponding second control pad through a seventh trace, the first pole of the third sub-switch is connected to the corresponding second substrate pad through an eighth trace to be connected to the corresponding second connection pad, and the second pole of the third sub-switch is connected to the first substrate pad through a ninth trace to be connected to the corresponding test pad; the gate electrode of the fourth sub-switch is connected to the corresponding second control pad through a tenth trace, the first pole of the fourth sub-switch is connected to the corresponding second substrate pad through an eleventh trace to be connected to the corresponding second connection pad, and the second pole of the fourth sub-switch is connected to the corresponding first substrate pad through a twelfth trace to be connected to the corresponding test pad.

[0013] In an example embodiment, the display substrate further comprises a third switch unit and a crack detection line, the crack detection line partially surrounds the display area; the integrated circuit further comprises a third control pad, the crack detection line is electrically connected to the test pad through the third switch unit; the third control pad is electrically connected to the gate electrode of the third switch unit and is configured to control the on-off of the third switch unit; the crack detection line is configured to detect whether the display substrate has a crack by transmitting the impedance test signal.

[0014] In an example embodiment, the third switch unit comprises a fifth sub-switch and a sixth sub-switch; two ends of the crack detection line are respectively connected to two test pads, the fifth sub-switch is located between one end of the crack detection line and the test pad, the sixth sub-switch is located between the other end of the crack detection line and the test pad, and the fifth sub-switch and the sixth sub-switch are connected to the third control pad.

[0015] In an example embodiment, the gate electrode of the fifth sub-switch is connected to the third control pad through a thirteenth trace, one end of the crack detection line is connected to the first pole of the fifth sub-switch, and the second pole of the fifth sub-switch is connected to the corresponding first substrate pad through a fourteenth trace to be connected to the corresponding test pad; the gate electrode of the sixth sub-switch is connected to the third control pad through a fifteenth trace, the other end of the crack detection line is connected to the first pole of the sixth sub-switch, and the second pole of the sixth sub-switch is connected to the corresponding first substrate pad through a sixteenth trace to be connected to the corresponding test pad.

[0016] In a second aspect, the display device testing method is provided. The method is applied to the display device as described above, and includes: transmitting, by an integrated circuit, a first control signal to a first switch unit through a first control pad to control the first switch unit to open; transmitting, by the integrated circuit, a second control signal to a second switch unit through a second control pad to control the second switch unit to close; transmitting, by the integrated circuit, an impedance test signal to a first connection pad through a test pad to test a binding connection between the integrated circuit and a display substrate; or transmitting, by the integrated circuit, the second control signal to the first switch unit through the first control pad to control the first switch unit to close; transmitting, by the integrated circuit, the first control signal to the second switch unit through the second control pad to control the second switch unit to open; transmitting, by the integrated circuit, the impedance test signal to a second connection pad through the test pad to test a binding connection between a flexible circuit board and the display substrate; or transmitting, by the integrated circuit, the second control signal to the first switch unit through the first control pad to control the first switch unit to close; transmitting, by the integrated circuit, the second control signal to the second switch unit through the second control pad to control the second switch unit to close.

[0017] In an example embodiment, when the first switch unit or the second switch unit is in an open state, the method further includes: transmitting, by the integrated circuit, the second control signal to a third switch unit through a third control pad to control the third switch unit to close.

[0018] In an example embodiment, when the first switch unit and the second switch unit are in a closed state, the method further includes: transmitting, by the integrated circuit, the first control signal to a third switch unit through a third control pad to control the third switch unit to open, and transmitting, by the integrated circuit, an impedance test signal to the first connection pad through the test pad to perform crack detection on the display substrate.

[0019] In an example embodiment, the first control signal and the second control signal are voltage signals.

[0020] Other aspects can become apparent after reading and understanding the accompanying drawings and detailed description.

[0021] SUMMARY

[0022] The accompanying drawings are included to provide a further understanding of the present disclosure and are incorporated in and constitute a part of this specification, illustrate embodiments of the present disclosure and serve to explain the principles of the present disclosure, and do not limit the present disclosure.

[0023] FIG. 1 is a structural schematic diagram of a display device;

[0024] Fig. 2 is a side view of the display device shown in Fig. 1;

[0025] Fig. 3 is a schematic view of a bonding connection of an integrated circuit, a flexible circuit board, and a display substrate;

[0026] Fig. 4 is a schematic view of a structure of a display device in an exemplary embodiment of the present disclosure;

[0027] Fig. 5 is a schematic view of a structure of a display substrate of Fig. 4 in an exemplary embodiment;

[0028] Fig. 6 is a schematic view of a structure of an integrated circuit of Fig. 4 in an exemplary embodiment;

[0029] Fig. 7 is a cross-sectional view of a display substrate at a first sub-switch in an exemplary embodiment.

[0030] Detailed description

[0031] The present disclosure describes a number of embodiments, but the description is exemplary rather than limiting and many further embodiments and implementations can be possible within the scope of the embodiments described in the present disclosure. Although a number of possible combinations of features have been set forth herein, and discussed in the specific implementation, many other combinations of the disclosed features can be possible. Unless specifically intended otherwise, any feature or element of any embodiment can be used in combination with any other feature or element of any other embodiment, or in replacement of any other feature or element in any other embodiment.

[0032] The present disclosure includes and contemplates combinations of features and elements known to those of ordinary skill in the art. The embodiments, features and elements disclosed herein can also be combined with any conventional feature or element to form a unique application of the presently claimed disclosure. Any feature or element of any embodiment can also be combined with features or elements from other applications to form another unique application of the presently claimed disclosure. Therefore, it should be understood that any feature shown and / or discussed in the present disclosure can be used, both individually and in any appropriate combination. Accordingly, the embodiments are not to be restricted, except as by the appended claims and their equivalents. Also, various modifications and changes can be made within the scope of the attached claims.

[0033] Furthermore, in describing representative embodiments, the present disclosure can have presented the method and / or process as a particular sequence of steps. However, to the extent that the method or process depends on the performance of such steps in the recited particular order, the method or process should not be limited to those steps executed in the particular order described herein. Rather, the particular sequence of steps described in this disclosure can be subject to variations and alterations and can be performed in an order different than that described without departing from the spirit of the present disclosure. Accordingly, the particular sequence of steps set forth in this disclosure should not be construed as a limitation on the claims. In addition, the claims should not be limited to the steps of performing the steps in the order written, and one skilled in the art can readily understand that these orderings can be varied and that the scope of the present disclosure encompasses these variations.

[0034] In the drawings, the size, the layer thickness, or the region of one or more constituent elements can sometimes be exaggerated for the sake of explanation. In addition, the drawings are schematically show ideal examples, and the shape, the numerical value, and the like are not limited to the drawings.

[0035] The ordinal numbers, such as "first", "second", and "third" in the specification are used to avoid confusion among constituent elements having the same or similar functions and do not limit the number thereof. In the present disclosure, "a plurality of" means two or more.

[0036] In the present specification, the words "center", "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like used to describe the positional relationship of the constituent elements with reference to the drawings are used to facilitate the description of the present specification and simplify the description, and do not indicate or imply that the referred device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be construed as limiting the present disclosure. The positional relationship of the constituent elements can be appropriately changed according to the direction of the described constituent elements. Therefore, it is not limited to the words described in the specification, and can be appropriately replaced according to the situation.

[0037] In the present disclosure, unless explicitly defined and limited otherwise, the terms "mount", "connected", "connecting" should be interpreted broadly. For example, it can be fixedly connected, or detachably connected, or integrally connected; it can be mechanically connected, or electrically connected; it can be directly connected, or indirectly connected through an intermediate piece, or the communication between two elements inside. For those skilled in the art, the meaning of the above terms in the present disclosure can be understood according to the situation.

[0038] In the present embodiment, a transistor refers to an element including at least a gate electrode, a drain electrode, and a source electrode. A transistor has a channel region between a drain electrode (a drain electrode terminal, a drain region, or a drain) and a source electrode (a source electrode terminal, a source region, or a source), and current can flow through the drain electrode, the channel region, and the source electrode. Note that in the present embodiment, the channel region refers to a region through which current mainly flows.

[0039] In the present embodiment, the first electrode can be a drain electrode and the second electrode can be a source electrode, or the first electrode can be a source electrode and the second electrode can be a drain electrode. In the case of using a transistor having opposite polarity or in the case of changing the direction of current in circuit operation, the functions of the "source electrode" and the "drain electrode" are sometimes interchanged. Thus, in the present embodiment, the "source electrode" and the "drain electrode" can be interchanged, and the "source terminal" and the "drain terminal" can be interchanged.

[0040] In the present embodiment, "electrically connected" includes the case where the constituent elements are connected through an element having some kind of electrical action. The element having some kind of electrical action is not particularly limited as long as it can transmit an electrical signal between the connected constituent elements. Examples of the element having some kind of electrical action include not only electrodes and wiring but also a switching element such as a transistor, a resistor, an inductor, a capacitor, and other elements having various functions.

[0041] In the present embodiment, "parallel" refers to a state where the angle formed by two straight lines is -10° or more and 10° or less, and thus, a state where the angle is -5° or more and 5° or less is also included. In addition, "perpendicular" refers to a state where the angle formed by two straight lines is 80° or more and 100° or less, and thus, a state where the angle is 85° or more and 95° or less is also included.

[0042] Embodiments of the present disclosure will be described in detail below with reference to the drawings.

[0043] FIG. 1 is a structural schematic diagram of a display device. FIG. 2 is a side view of the display device shown in FIG. 1, illustrating a state after a binding area is bent. As shown in FIG. 1 and FIG. 2, the display device provided in the embodiment includes a display substrate 11, an integrated circuit (IC) 12, and a flexible printed circuit (FPC) 13 which are bindingly connected to the display substrate 11. The display substrate 11 includes a display area 100 and a non-display area 200 which surrounds the periphery of the display area 100. The non-display area 200 includes a binding area 300 which is located on a side of the display area 100 along a second direction Y. The display area 100 includes at least a plurality of pixel units arranged in a regular manner, for example, the plurality of pixel units can be arranged in an array along a first direction X and a second direction Y which are perpendicular to each other. The plurality of pixel units are configured to display dynamic pictures or still images, and the display area 100 can be referred to as an active area (AA). In an exemplary embodiment, the display device can be deformable, for example, rolled, bent, folded or rolled up.

[0044] In an exemplary embodiment, the display area 100 can have a shape of a quadrilateral, a circle, an ellipse, a polygon of other shapes, or an irregular shape, and the corner of the display area 100 can have a rounded corner, which is not limited in the present disclosure.

[0045] In an exemplary embodiment, the binding area 300 can include, in sequence along a direction away from the display area 100, a fan-out area 400, a driving chip area 600, and a binding pin area 700. The fan-out area 400 is connected to the display area 100 and can include at least a plurality of parallel data fan-out lines. The signal lines such as power lines and data lines of the display area 100 can pass through the fan-out area 400 by fan-out wiring and be connected to corresponding signal providing ends. The driving chip area 600 can include at least a plurality of bonding pads. The integrated circuit 12 can be bindingly connected to the display substrate 11 through the plurality of bonding pads of the driving chip area 600. The integrated circuit 12 is configured to be connected to the plurality of data fan-out lines, and the integrated circuit 12 can be a driving integrated circuit (DIC). The binding pin area 700 can include at least a plurality of bonding pads. The flexible printed circuit 13 can be bindingly connected to the display substrate 11 through the plurality of bonding pads of the binding pin area 700.

[0046] In an exemplary embodiment, the binding area 400 can further include a bending area 500, which can be located between the fan-out area 400 and the driving chip area 600, connected to the fan-out area 400, can include a composite insulating layer provided with a groove, configured to bend the binding area 300 to the back of the display area 100, after the binding area 300 is bent, the integrated circuit 12 and the flexible circuit board 13 are bent to the back of the display area 100.

[0047] In an exemplary embodiment, as shown in FIG. 1, two crack detection lines 201 are provided in the non-display area 200, which are wrapped outside the display area 100, and the two ends of the crack detection line 201 are connected with the integrated circuit 12, which can provide a crack detection signal to the crack detection line 201, so as to detect the crack condition of the display substrate 11 around the display area 100. The number and distribution of the crack detection line 201 can be set as needed, and the present disclosure does not limit this.

[0048] In an exemplary embodiment, after the integrated circuit 12 and the flexible circuit board 13 are bound and connected with the display substrate 11, the effect of the binding and connection needs to be detected, for example, the impedance between the flexible circuit board 13 and the display substrate 11 can be detected to judge the binding condition between the flexible circuit board 13 and the display substrate 11, and the impedance between the integrated circuit 12 and the display substrate 11 can be detected to judge the binding condition between the integrated circuit 12 and the display substrate 11.

[0049] FIG. 3 is a schematic diagram of the binding connection of the integrated circuit, the flexible circuit board and the display substrate, which simplifies the structure of the display substrate. In FIG. 3, the structures such as the pads, alignment marks, test points and connection lines provided on the display device can be symmetrically arranged, which is not limited in the present disclosure. As shown in FIG. 3, a plurality of first substrate pads 111A, a plurality of second substrate pads 111B, a plurality of first connection lines 112 and a plurality of second connection lines 113 are provided in the binding area of the display substrate 11, the plurality of first substrate pads 111A are configured to be bound and connected with the integrated circuit 12, the plurality of second substrate pads 111B are configured to be bound and connected with the flexible circuit board 13, the plurality of first substrate pads 111A can be arranged in sequence along the first direction X, the plurality of second substrate pads 111B can be arranged in sequence along the first direction X, and the plurality of second substrate pads 111B can be located on one side of the plurality of first substrate pads 111A along the second direction Y. The integrated circuit 12 includes a plurality of integrated circuit pads, the plurality of integrated circuit pads include a plurality of first connection pads 121, a plurality of third connection lines 122 and a plurality of test pads 123, the plurality of first connection pads 121 can be located at both ends of the integrated circuit 12 along the second direction Y, the plurality of test pads 123 can be located at both ends of the integrated circuit 12 along the first direction X, the first connection pad 121 is configured to be bound and connected with the display substrate 11 through the corresponding first substrate pad 111A, the test pad 123 is configured to be connected with the crack detection line 201 to provide a crack detection signal to the crack detection line 201, and the third connection line 122 is configured to connect the corresponding two first connection pads 121, which can be two pads adjacent in the first direction X. The flexible circuit board 13 includes a plurality of second connection pads 131, a plurality of alignment marks 132, a plurality of test points 133, a plurality of fourth connection lines 134 and a plurality of second test pads 135, the plurality of test points 133 include a pair of first point A and second point B, and a pair of third point C and fourth point D. The plurality of second connection pads 131 are configured to be bound and connected with the display substrate 11 through the corresponding second substrate pad 111B, and connected with the first point A and the second point B through the fourth connection line 134, and the second substrate pad 111B can be connected with each other through the first connection line 112 on the display substrate 11 after being connected with the second connection pad 131. As shown in FIG. 3, the first connection line 112 can connect two second substrate pads 111B adjacent in the first direction X, thereby forming a test path between the first point A and the second point B, and subsequently the impedance test can be performed at the first point A and the second point B by using a probe, thereby determining the binding and connection effect between the display substrate 11 and the flexible circuit board 13.The first substrate pad 111A, connected to the first connecting pad 121, can be connected to the second test pad 135 of the flexible circuit board 13 via the second connecting line 113 and the second substrate pad 111B correspondingly provided on the display substrate 11. The second test pad 135 can be connected to the third point C and the fourth point D via the fourth connecting line 134. With the connection of the third connecting line 122, a test path is formed between the third point C and the fourth point D. Subsequently, impedance testing can be performed at the third point C and the fourth point D using probes to determine the bonding connection effect between the display substrate 11 and the integrated circuit 12. By setting the second test pad 135 and related structures on the flexible circuit board 13, the connection between the first connecting pad 121 and the first substrate pad 111A can be detected at the test point 135 of the flexible circuit board 13, which facilitates the detection of the bonding connection between the display substrate 11, the integrated circuit 12, and the flexible circuit board 13.

[0050] In an exemplary embodiment, the alignment mark 132 is set near the test point 133. For example, the alignment mark 132 can be set on one side of the test point 133 in the first direction X, so that the probe can accurately find the corresponding test point when the test is performed.

[0051] As shown in Figure 3, during impedance testing, the alignment mark 132 can be used to quickly locate the test point 133. The probe of the impedance testing equipment can accurately find the corresponding test point 133 and perform impedance detection on the test path to determine whether there is an abnormality in the bonding connection. In the probe-type impedance detection method, as shown in Figure 3, the alignment mark 132, test point 133, fourth connecting line 134, and second test pad 135 need to be pre-set on the flexible circuit board 13. Due to the limitations of the testing equipment and probe size, the size of the alignment mark 132 and test point 133 cannot be reduced. This results in low space utilization of the flexible circuit board 13, and a large thickness and weight, which is not conducive to achieving a thinner and lighter display device, nor is it conducive to achieving a narrow bezel. Furthermore, the probe-type impedance detection method requires specialized testing equipment, resulting in high production costs. The contact-type testing method is time-consuming, resulting in high time costs, which is not conducive to improving the production capacity of display devices.

[0052] This disclosure provides a display device including a display substrate, the display substrate including a display area and a non-display area surrounding the display area; a plurality of sub-pixels located in the display area; a plurality of data lines located in the display area and extending to the non-display area, the plurality of sub-pixels and the plurality of data lines being electrically connected; a plurality of first substrate pads and a plurality of second substrate pads located in the non-display area, the plurality of second substrate pads being located on the side of the plurality of first substrate pads away from the display area, the plurality of data lines being electrically connected to a portion of the plurality of first substrate pads; an integrated circuit located in the non-display area, the integrated circuit including a plurality of integrated circuit pads, the plurality of integrated circuit pads being bonded to the plurality of first substrate pads; a flexible circuit board located in the non-display area, the flexible circuit board including a plurality of second connection pads, the plurality of second connection pads being bonded to the plurality of second substrate pads; a first switching unit and a second switching unit located in the non-display area; wherein, the plurality of integrated circuit pads include a first control pad and a second control pad. The circuit includes pads, a plurality of first connection pads, and a plurality of test pads. A first control pad, a second control pad, the plurality of first connection pads, and the plurality of test pads are correspondingly bonded to another portion of first substrate pads on the display substrate. At least two of the plurality of first connection pads are electrically connected to at least two of the plurality of test pads via a first switching unit. The first control pad is electrically connected to the gate electrode of the first switching unit and configured to control the on / off state of the first switching unit. At least two of the plurality of second connection pads are electrically connected to the at least two test pads via a second switching unit. The second control pad is electrically connected to the gate electrode of the second switching unit and configured to control the on / off state of the second switching unit. The integrated circuit is configured to detect the bonding connection between the integrated circuit and the display substrate or between the flexible circuit board and the display substrate by controlling the on / off state of the first and second switching units and transmitting impedance test signals through the at least two test pads.

[0053] The display device provided in this disclosure can detect the bonding effect between the integrated circuit and the display substrate by forming a detection path at the bonding connection between the integrated circuit and the display substrate, and transmitting an impedance test signal to the detection path using the integrated circuit. Similarly, by forming a detection path at the bonding connection between the flexible circuit board and the display substrate, and transmitting an impedance test signal to the detection path using the integrated circuit, the bonding effect between the flexible circuit board and the display substrate can be detected. The display device provided in this disclosure facilitates the detection of the bonding effect between the display substrate, integrated circuit, and flexible circuit board. It eliminates the need for probe detection and redundant structures such as alignment marks and test points on the flexible circuit board, significantly saving space and layout space on the flexible circuit board. This helps reduce the thickness and weight of the flexible circuit board and the display device, achieving a thinner and lighter display device with a narrower bezel.

[0054] In an exemplary embodiment, "another portion" of the first substrate pads refers to a portion of the remaining first substrate pads excluding the first substrate pads connected to the data line.

[0055] Figure 4 is a schematic diagram of the display device structure in an exemplary embodiment of this disclosure. Figure 4 shows enlarged views of bonding pads and traces, while other structures and areas are omitted. The arcs in Figure 4 represent traces crossing but not connecting. Figure 4 illustrates an example where the display device structure is symmetrically distributed along a first direction; this disclosure does not limit this. As shown in Figure 4, the display device includes a display substrate 11, an integrated circuit 12, and a flexible circuit board 13. The display substrate 11 includes a display area 100 and a non-display area 200 surrounding the display area 100. The non-display area 200 includes a bonding area 300 located on one side of the display area 100. The integrated circuit 12 and the flexible circuit board 13 are bonded and connected in the bonding area 300. The integrated circuit 12 is located on one side of the display area 100 in the second direction Y, and the flexible circuit board 13 is located on one side of the integrated circuit 12 along the second direction Y. The display area 100 includes multiple sub-pixels P, which can be arranged in an array. A column of sub-pixels P arranged along the second direction Y can be connected to the same data line 101. Multiple data lines 101 can be connected to the integrated circuit 12. The integrated circuit 12 provides data signals to the corresponding sub-pixels through the data lines 101 to drive the sub-pixels to display.

[0056] Figure 5 is a schematic diagram of the display substrate of Figure 4 in an exemplary embodiment, and Figure 6 is a schematic diagram of the integrated circuit of Figure 4 in an exemplary embodiment. Figures 5 and 6 illustrate the arrangement of structures such as bonding pads on the display substrate and the integrated circuit. As shown in Figures 4 to 6, the display substrate 11 in the non-display area 200 includes a first switching unit S1, a second switching unit S2, a plurality of first substrate pads 111A and a plurality of second substrate pads 111B. The plurality of first substrate pads 111A are located in the integrated circuit area 600 and are configured to be bonded to the integrated circuit 12. The plurality of second substrate pads 111B are located in the bonding pin area 700 and are configured to be bonded to the flexible circuit board 13. The integrated circuit 12 includes a first control pad 124A, a second control pad 124B, multiple test pads 123, and multiple first connection pads 121. The multiple first connection pads 121 are distributed along the second direction Y at both ends of the integrated circuit 12. The integrated circuit 12 covers the integrated circuit area 600. The multiple first connection pads 121 located near the display area 100 are correspondingly bonded to a portion of the first substrate pads 111A and connected to the corresponding data lines 101. The multiple first connection pads 121 located away from the display area 100 are bonded to the corresponding first substrate pads 111A. At least two of the multiple first connection pads 121 located away from the display area 100 are electrically connected to at least two test pads 123 through a first switching unit S1, forming a detection loop between the display substrate 11 and the integrated circuit 12 to facilitate the transmission of impedance test signals. The first control pad 124A is electrically connected to the gate electrode of the first switching unit S1 and is configured to control the on / off state of the first switching unit. The first control pad 124A, the second control pad 124B, and a plurality of test pads 123 are correspondingly bonded to a portion of the remaining first substrate pads 111A. The flexible circuit board 13 covers the bonding pin area 700, including a plurality of second connection pads 131. Each second connection pad 131 is bonded to a corresponding second substrate pad 111B. At least two of the plurality of second substrate pads 111B are electrically connected to at least two test pads 123 via a second switching unit S2, forming a detection loop between the display substrate 11 and the flexible circuit board 13. The second control pad 124B is electrically connected to the gate electrode of the second switching unit S2, configured to control the on / off state of the second switching unit S2. The integrated circuit 12 is configured to detect the bonding connection between the integrated circuit 12 and the display substrate 11, or between the flexible circuit board 13 and the display substrate 11, by controlling the on / off state of the first switching unit S1 and the second switching unit S2 and transmitting impedance test signals through at least two test pads 123.

[0057] In an exemplary embodiment, as shown in FIG5, a plurality of second substrate pads 111B may be distributed along the first direction D1 at opposite ends of the bonding pin area 700. As shown in FIG6, a plurality of first control pads 124A, a plurality of second control pads 124B, and a plurality of test pads 123 may be distributed along the first direction D1 at both ends of the integrated circuit 12. This disclosure does not limit this.

[0058] In an exemplary embodiment, the bonding area 300 may further include a bending area located between the display area 100 and the integrated circuit 12. The position of the bending area can be shown in FIG1. ​​The bending area is configured to bend the bonding area 300 to the back of the display area 100. After bending, the integrated circuit 12 and the flexible circuit board 13 can be bent to the back of the display area 100, thereby achieving a narrow bezel.

[0059] In an exemplary embodiment, multiple pads on the integrated circuit 12 can be connected one-to-one with multiple first substrate pads 111A on the display substrate 11. Structures such as the crack detection line 201 and the switch unit can be electrically connected to the pads on the integrated circuit 12 through the corresponding first substrate pads 111A.

[0060] In an exemplary embodiment, the first switching unit S1, the second switching unit S2, and the third switching unit S3 can be transistors, and the gate electrode of the transistor can be connected to the corresponding control pad.

[0061] In an exemplary embodiment, as shown in FIG4, the integrated circuit 12 may include a first connection portion 126, which can be connected to two first connection pads 121. The two first connection pads 121 are respectively connected to two test pads 123. The first switching unit may include a first sub-switch K1 and a second sub-switch K2. A first sub-switch K1 is disposed between one pair of first connection pads 121 and test pads 123, and a second sub-switch K2 is disposed between another pair of first connection pads 121 and test pads 123. The gate electrodes of the first sub-switch K1 and the second sub-switch K2 are both connected to a first control pad 124A. By providing the first connection portion 126 inside the integrated circuit 12, the integrated circuit 12 itself has the conditions to form a detection path. The traces on the display substrate 11 only need to be connected to the corresponding pads to form a detection path, which helps to save the trace space of the display substrate 11 and facilitates the trace layout. In other embodiments, the first connection portion 126 may be connected to a greater number of first connection pads 121, and the first switching unit may include a greater number of sub-switches; this disclosure does not limit this.

[0062] In an exemplary embodiment, as shown in FIG4, the gate electrode of the first sub-switch K1 can be connected to the corresponding first control pad 124A via the first trace L1. The first electrode of the first sub-switch K1 can be connected to the corresponding first substrate pad 111A on the display substrate 11 via the second trace L2, thereby achieving connection between the first electrode and the corresponding first connection pad 121. The second electrode of the first sub-switch K1 can be connected to the corresponding first substrate pad 111A on the display substrate 11 via the second trace L2, thereby achieving connection between the second electrode and the corresponding test pad 123. The gate electrode of the second sub-switch K2 can be connected to the corresponding first control pad 124A via the fourth trace L4, and the fourth trace L4 and the first trace L1 can be interconnected. The first pole of the second sub-switch K2 can be connected to the corresponding first substrate pad 111A on the display substrate 11 via the fifth trace L5, thereby connecting the first pole to the corresponding first connection pad 121. The second pole of the second sub-switch K2 can be connected to the corresponding first substrate pad 111A on the display substrate 11 via the sixth trace L6, thereby connecting the second pole to the corresponding test pad 123.

[0063] In an exemplary embodiment, as shown in FIG4, the flexible circuit board 13 may include a second connection portion 136, which can be connected to two second connection pads 131. The two second connection pads 131 are respectively connected to two test pads 123 of the integrated circuit 12. The second switching unit may include a third sub-switch K3 and a fourth sub-switch K4. The third sub-switch K3 is disposed between one pair of second connection pads 131 and the test pads 123, and the fourth sub-switch K4 is disposed between the other pair of second connection pads 131 and the test pads 123. The gate electrodes of the third sub-switch K3 and the fourth sub-switch K4 are both connected to the second control pad 124B. By providing the second connection portion 136 inside the flexible circuit board 13, the flexible circuit board 13 itself has the conditions to form a detection path. The traces on the display substrate 11 only need to be connected to the corresponding pads to form a detection path, which helps to save the trace space of the display substrate 11 and facilitates the trace layout. In other embodiments, the second connection portion 136 may be connected to a greater number of second connection pads 131, and the second switching unit may include a greater number of sub-switches; this disclosure does not limit this.

[0064] In an exemplary embodiment, as shown in FIG4, the gate electrode of the third sub-switch K3 can be connected to the corresponding second control pad 124B via the seventh trace L7. The first electrode of the third sub-switch K3 can be connected to the corresponding second substrate pad 111B on the display substrate 11 via the eighth trace L8, thereby connecting the first electrode to the corresponding second connection pad 131. The second electrode of the third sub-switch K3 can be connected to the corresponding first substrate pad 111A on the display substrate 11 via the ninth trace L9, thereby connecting the second electrode to the corresponding test pad 123. The ninth trace L9 can be interconnected with the sixth trace L6. The gate electrode of the fourth sub-switch K4 can be connected to the corresponding second control pad 124B via the tenth trace L10. The tenth trace L10 can be interconnected with the seventh trace L7. The first pole of the fourth sub-switch K4 can be connected to the corresponding second substrate pad 111B on the display substrate 11 via the eleventh trace L11, thereby connecting the first pole to the corresponding second connection pad 131. The second pole of the fourth sub-switch K4 can be connected to the corresponding first substrate pad 111A on the display substrate 11 via the twelfth trace L12, thereby connecting the second pole to the corresponding test pad 123. The twelfth trace L12 and the third trace L3 can be connected to each other.

[0065] In an exemplary embodiment, the display substrate 11 includes a crack detection line 201, which partially surrounds the display area 100 of the display substrate 11. The display substrate 11 also includes a third switching unit S3, and the integrated circuit 12 includes a third control pad 124C. The crack detection line 201 can be connected to two test pads 123 through the third switching unit S3, and the third control pad 124C is electrically connected to the gate electrode of the third switching unit S3, configured to control the on / off state of the third switching unit S3. In this embodiment, by setting the crack detection line 201 to be electrically connected to the two test pads 123, the integrated circuit 12 can use the crack detection signal to detect the crack condition of the display substrate 11. In an exemplary embodiment, the first switch unit S1 and the second switch unit S2 can be controlled to be closed and the third switch unit S3 can be controlled to be open to detect cracks in the display substrate 11. Then, the first switch unit S1 can be controlled to be open and the second switch unit S2 and the third switch unit S3 can be closed to test the bonding connection between the display substrate 11 and the integrated circuit 12. Finally, the first switch unit S1 and the third switch unit S3 can be controlled to be closed and the second switch unit S2 can be opened to detect the bonding connection between the display substrate 11 and the flexible circuit board 13. This bonding connection detection method is fast and accurate, does not require the use of specific probe detection equipment, and does not require the addition of new production processes. It not only helps to achieve the thinning of the display device, but also improves the production efficiency of the display device. In other embodiments, at least two of the first switch unit S1, the second switch unit S2, and the third switch unit S3 can be turned on at a time, enabling integrated testing of at least two detection items. For example, the first switch unit S1 and the second switch unit S2 can be turned on while the third switch unit S3 is turned off, allowing simultaneous testing of the bonding connection between the display substrate 11 and the integrated circuit 12. Alternatively, the first switch unit S1 and the third switch unit S3 can be turned on while the second switch unit S2 is turned off, allowing testing of the bonding connection between the display substrate 11 and the integrated circuit 12. The present disclosure does not limit the detection of the bonding connection between the display substrate 11 and the integrated circuit 12, as well as the crack condition of the display substrate 11. Alternatively, the second switch unit S2 and the third switch unit S3 can be turned on while the first switch unit S1 is turned off, allowing simultaneous detection of the bonding connection between the display substrate 11 and the integrated circuit 12, as well as the crack condition of the display substrate 11.

[0066] In an exemplary embodiment, as shown in FIG4, the two ends of the crack detection line 201 are respectively connected to two test pads 123. The third switching unit may include a fifth sub-switch K5 and a sixth sub-switch K6. A fifth sub-switch K5 is provided between one end of the crack detection line 201 and the test pad 123, and a sixth sub-switch K6 is provided between the other end of the crack detection line 201 and the test pad 123. The gate electrodes of the fifth sub-switch K5 and the sixth sub-switch K6 are both connected to the third control pad 124C.

[0067] In an exemplary embodiment, as shown in FIG4, the gate electrode of the fifth sub-switch K5 can be connected to the corresponding third control pad 124C via the thirteenth trace L13. The first electrode of the fifth sub-switch K5 can be connected to one end of the crack detection line 201. The second electrode of the fifth sub-switch K5 can be connected to the corresponding first substrate pad 111A on the display substrate 11 via the fourteenth trace L14, thereby realizing the connection between the second electrode and the corresponding test pad 123. The fourteenth trace L14 can be interconnected with the ninth trace L9. The gate electrode of the sixth sub-switch K6 can be connected to the corresponding third control pad 124C via the fifteenth trace L15. The fifteenth trace L15 and the thirteenth trace L13 can be interconnected. The first pole of the sixth sub-switch K6 can be connected to the other end of the crack detection line 201. The second pole of the sixth sub-switch K6 can be connected to the corresponding first substrate pad 111A on the display substrate 11 through the sixteenth trace L16, thereby realizing the connection between the second pole and the corresponding test pad 123. The sixteenth trace L16 and the twelfth trace L12 can be connected to each other.

[0068] Figure 7 is a cross-sectional view of the display substrate at the first sub-switch in an exemplary embodiment. Cross-sectional views of the other sub-switches can be seen with reference to Figure 7. As shown in Figure 7, the first sub-switch K1 is a transistor, including a semiconductor layer 303, a gate electrode 305, a first electrode 311, and a second electrode 312. In the direction perpendicular to the display substrate, the display substrate may include a substrate 301, a buffer layer 302, a semiconductor layer 303, a first insulating layer 304, a gate electrode 305, a second insulating layer 306, a third trace L3, a third insulating layer 308, a source / drain metal layer, and a planarization layer 309. The source / drain metal layer may include the first electrode 311, the second electrode 312, and the first trace L1. The gate electrode 305 can be connected to the corresponding first control pad 124A through the first trace L1. The first trace L1 and the gate electrode 305 can be connected through vias. The orthographic projection of the first trace L1 on the substrate 301 and the orthographic projection of the gate electrode 305 on the substrate 301 can overlap each other. The first electrode 311 can be connected to the corresponding first substrate pad 111A on the display substrate 11 via the second trace L2, thereby connecting the first electrode 311 to the corresponding first connection pad 121. The first electrode 311 and the second trace L2 can be interconnected or form an integral structure. The second electrode 312 can be connected to the corresponding first substrate pad 111A on the display substrate 11 via the third trace L3, thereby connecting the second electrode to the corresponding test pad 123. The third trace L3 and the second electrode 312 can be connected via vias. The orthographic projection of the third trace L3 on the substrate 301 does not overlap with the orthographic projection of the gate electrode 305 on the substrate 301. The substrate 301 can be a flexible substrate, facilitating bending. The first insulating layer 304 and the second insulating layer 306 can be referred to as gate insulating layers, the third insulating layer 308 can be referred to as interlayer insulating layers, and the planarization layer 309 can be on the same layer as the pixel definition layer of the display area; this disclosure does not impose any limitations on this.

[0069] This disclosure also provides a method for testing a display device, the method comprising:

[0070] The integrated circuit transmits a first control signal to the first switching unit via a first control pad to control the first switching unit to open; the integrated circuit transmits a second control signal to the second switching unit via a second control pad to control the second switching unit to close; the integrated circuit transmits a test signal to the first connection pad via a test pad to test the bonding connection between the integrated circuit and the display substrate; or,

[0071] The integrated circuit transmits a second control signal to the first switching unit via the first control pad to control the first switching unit to turn off; the integrated circuit transmits a first control signal to the second switching unit via the second control pad to control the second switching unit to turn on; the integrated circuit transmits a test signal to the second connection pad via the test pad to test the bonding connection between the flexible circuit board and the display substrate; or...

[0072] The integrated circuit transmits a second control signal to the first switching unit through the first control pad to control the first switching unit to turn off; the integrated circuit transmits a second control signal to the second switching unit through the second control pad to control the second switching unit to turn off.

[0073] In an exemplary embodiment, when the first switch unit or the second switch unit is in the open state, the method further includes: the integrated circuit transmitting a second control signal to the third switch unit through a third control pad to control the third switch unit to close.

[0074] In an exemplary embodiment, when the first switch unit and the second switch unit are in the off state, the method further includes: the integrated circuit transmitting a first control signal to the third switch unit through the third control pad to control the third switch unit to open; and the integrated circuit transmitting an impedance test signal to the first connection pad through the test pad to detect cracks in the display substrate.

[0075] In an exemplary embodiment, as shown in FIG4, when testing the bonding connection between integrated circuit 12 and display substrate 11, integrated circuit 12 can issue code instructions to open the first sub-switch K1 and the second sub-switch K2 through the first control signal, and to close the third sub-switch K3 to the sixth sub-switch K6 through the second control signal. Integrated circuit 12 can transmit test signals to the detection path between integrated circuit 12 and display substrate 11 through test pad 123 to detect the impedance in the detection path. Based on the detection results, it can be determined whether there is a problem with the bonding connection between integrated circuit 12 and display substrate 11. When testing the bonding connection between the flexible circuit board 13 and the display substrate 11, the integrated circuit 12 can issue code instructions to open the third sub-switch K3 and the fourth sub-switch K4 via a first control signal, and close the first sub-switch K1, the second sub-switch K2, the fifth sub-switch K5, and the sixth sub-switch K6 via a second control signal. The integrated circuit 12 can transmit test signals to the detection path between the flexible circuit board 13 and the display substrate 11 through the test pad 123 to detect the impedance within the detection path. Based on the detection results, it can be determined whether there is a problem with the bonding connection between the flexible circuit board 13 and the display substrate 11. When performing crack detection on the display substrate 11, the integrated circuit 12 can issue code instructions to open the fifth sub-switch K5 and the sixth sub-switch K6 via a first control signal, and close the first sub-switch K1 to the fourth sub-switch K4 via a second control signal. The integrated circuit 12 can transmit test signals to the crack detection line 201 via the test pad 123 to detect the impedance of the crack detection line 201. Based on the detection results, it can be determined whether there is a crack in the display substrate 11. In other embodiments, at least two detection items can be integrated and detected at a time by controlling the on / off state of the switching unit, which will not be elaborated here.

[0076] In an exemplary embodiment, one of the two test pads 123 can be used to emit an impedance test signal. After passing through the detection path, the impedance test signal reaches the other test pad 123. The transmission of the impedance test signal within the detection path can detect the connection between the bonding pads. The transmission of the impedance test signal within the crack detection line 201 can detect whether a crack exists on the display substrate. This disclosure does not limit the detection principle or method.

[0077] In an exemplary embodiment, the first control signal and the second control signal can be voltage signals. In another exemplary embodiment, the first control signal can be a low voltage signal, such as -7 volts, and the second control signal can be a high voltage signal, such as +7 volts. In other embodiments, the first control signal can be a high voltage signal, and the second control signal can be a low voltage signal. The terms "low voltage signal" and "high voltage signal" are relative concepts, and the transistor type and conduction signal of the switching unit can be set as needed; this disclosure does not impose any limitations on this.

[0078] The display device provided in this disclosure can be any product or component with display function, such as an OLED display, mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigator. This disclosure is not limited to this.

[0079] While the embodiments disclosed herein are as described above, the content is merely for the purpose of facilitating understanding of this disclosure and is not intended to limit this disclosure. Any person skilled in the art to which this disclosure pertains may make any modifications and changes in the form and details of the implementation without departing from the spirit and scope disclosed herein; however, the scope of patent protection of this disclosure shall still be determined by the scope defined in the appended claims.

Claims

1. A display device comprising a display substrate, the display substrate including a display area and a non-display area surrounding the display area; Multiple sub-pixels are located in the display area; Multiple data lines are located in the display area and extend to the non-display area, and the multiple sub-pixels and the multiple data lines are electrically connected; Multiple first substrate pads and multiple second substrate pads are located in the non-display area. The multiple second substrate pads are located on the side of the multiple first substrate pads away from the display area. The multiple data lines are electrically connected to a portion of the multiple first substrate pads. An integrated circuit is located in the non-display area. The integrated circuit includes multiple integrated circuit pads, which are bonded to the multiple first substrate pads. A flexible circuit board is located in the non-display area. The flexible circuit board includes a plurality of second connection pads, which are bonded to a plurality of second substrate pads. The first and second switching units are located in the non-display area; The plurality of integrated circuit pads include a first control pad, a second control pad, a plurality of first connection pads, and a plurality of test pads. The first control pad, the second control pad, the plurality of first connection pads, and the plurality of test pads are correspondingly bonded to another portion of the first substrate pads on the display substrate. At least two of the plurality of first connection pads are electrically connected to at least two of the plurality of test pads through the first switching unit. The first control pad is electrically connected to the gate electrode of the first switching unit and is configured to control the on / off state of the first switching unit. At least two of the plurality of second connection pads are electrically connected to the at least two test pads via the second switching unit, and the second control pad is electrically connected to the gate electrode of the second switching unit, configured to control the on / off state of the second switching unit; The integrated circuit is configured to detect the bonding connection between the integrated circuit and the display substrate or between the flexible circuit board and the integrated circuit by controlling the on / off state of the first switching unit and the second switching unit and transmitting impedance test signals through the at least two test pads.

2. The display device according to claim 1, wherein, The integrated circuit further includes a first connection portion, wherein at least two of the plurality of first connection pads are connected through the first connection portion.

3. The display device according to claim 2, wherein, The first connection portion is connected to two first connection pads, which are respectively connected to two test pads; the first switch unit includes a first sub-switch and a second sub-switch; the first sub-switch is located between one pair of first connection pads and the test pads, and the second sub-switch is located between another pair of first connection pads and the test pads; the gate electrode of the first sub-switch and the gate electrode of the second sub-switch are both connected to the first control pad.

4. The display device according to claim 3, wherein, The gate electrode of the first sub-switch is connected to the corresponding first control pad via a first trace, the first electrode of the first sub-switch is connected to the corresponding first substrate pad via a second trace to connect to the corresponding first connection pad, and the second electrode of the first sub-switch is connected to the corresponding first substrate pad via a second trace to connect to the corresponding test pad. The gate electrode of the second sub-switch is connected to the corresponding first control pad via a fourth trace, the first electrode of the second sub-switch is connected to the corresponding first substrate pad via a fifth trace to connect to the corresponding first connection pad, and the second electrode of the second sub-switch is connected to the corresponding first substrate pad via a sixth trace to connect to the corresponding test pad.

5. The display device according to claim 1, wherein, The flexible circuit board further includes a second connection portion, and at least two of the plurality of second connection pads are connected through the second connection portion.

6. The display device according to claim 5, wherein, The second connection portion is connected to two second connection pads, which are respectively connected to two test pads; the second switching unit includes a third sub-switch and a fourth sub-switch; the third sub-switch is located between one pair of second connection pads and the test pads, and the fourth sub-switch is located between another pair of second connection pads and the test pads; the gate electrode of the third sub-switch and the gate electrode of the fourth sub-switch are both connected to the second control pads.

7. The display device according to claim 6, wherein, The gate electrode of the third sub-switch is connected to the corresponding second control pad via the seventh trace, the first electrode of the third sub-switch is connected to the corresponding second substrate pad via the eighth trace, and is connected to the corresponding second connection pad via the ninth trace. The gate electrode of the fourth sub-switch is connected to the corresponding second control pad via the tenth trace, the first electrode of the fourth sub-switch is connected to the corresponding second substrate pad via the eleventh trace, and the second electrode of the fourth sub-switch is connected to the corresponding first substrate pad via the twelfth trace, and the second electrode of the fourth sub-switch is connected to the corresponding test pad via the twelfth trace.

8. The display device according to claim 1, wherein, The display substrate further includes a third switching unit and a crack detection line, the crack detection line partially surrounding the display area; the integrated circuit further includes a third control pad, the crack detection line being electrically connected to the test pad via the third switching unit; the third control pad is electrically connected to the gate electrode of the third switching unit, configured to control the on / off state of the third switching unit; The crack detection line is configured to detect whether cracks appear in the display substrate by transmitting the impedance test signal.

9. The display device according to claim 8, wherein, The third switch unit includes a fifth sub-switch and a sixth sub-switch; the two ends of the crack detection line are respectively connected to the two test pads, the fifth sub-switch is located between one end of the crack detection line and the test pad, the sixth sub-switch is located between the other end of the crack detection line and the test pad, and both the fifth sub-switch and the sixth sub-switch are connected to the third control pad.

10. The display device according to claim 9, wherein, The gate electrode of the fifth sub-switch is connected to the third control pad via the thirteenth trace, the first electrode of the fifth sub-switch is connected to one end of the crack detection line, and the second electrode of the fifth sub-switch is connected to the corresponding first substrate pad via the fourteenth trace, so as to connect with the corresponding test pad. The gate electrode of the sixth sub-switch is connected to the third control pad via the fifteenth trace. The first electrode of the sixth sub-switch is connected to the other end of the crack detection line. The second electrode of the sixth sub-switch is connected to the corresponding first substrate pad via the sixteenth trace, so as to connect with the corresponding test pad.

11. A method for testing a display device, applied to the display device as described in any one of claims 1 to 10, the method comprising: The integrated circuit transmits a first control signal to the first switching unit through the first control pad to control the first switching unit to turn on; The integrated circuit transmits a second control signal to the second switching unit via the second control pad to control the second switching unit to turn off; the integrated circuit transmits an impedance test signal to the first connection pad via the test pad to test the bonding connection between the integrated circuit and the display substrate; or... The integrated circuit transmits the second control signal to the first switching unit via the first control pad to control the first switching unit to turn off; the integrated circuit transmits the first control signal to the second switching unit via the second control pad to control the second switching unit to turn on; the integrated circuit transmits the impedance test signal to the second connection pad via the test pad to test the bonding connection between the flexible circuit board and the display substrate; or... The integrated circuit transmits the second control signal to the first switching unit through the first control pad to control the first switching unit to turn off; the integrated circuit transmits the second control signal to the second switching unit through the second control pad to control the second switching unit to turn off.

12. The test method according to claim 11, wherein, When the first switch unit or the second switch unit is in the open state, the method further includes: the integrated circuit transmitting the second control signal to the third switch unit through the third control pad to control the third switch unit to close.

13. The test method according to claim 11, wherein, When the first switch unit and the second switch unit are in the off state, the method further includes: the integrated circuit transmitting the first control signal to the third switch unit through the third control pad to control the third switch unit to open; and the integrated circuit transmitting an impedance test signal to the first connection pad through the test pad to detect cracks in the display substrate.

14. The test method according to claim 11, wherein, The first control signal and the second control signal are voltage signals.

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