Display device and testing method therefor
By setting up a switch unit and control pads in the display device for impedance testing, the problem of difficulty in reducing the weight of the display device is solved, and efficient testing and lightweight design are achieved.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-04-16
- Publication Date
- 2026-03-26
AI Technical Summary
The weight of display devices is not easy to reduce. Existing detection methods require probe detection and redundant structures, resulting in low space utilization, high cost, time consumption, and are not conducive to thinner and lighter designs.
By setting first and second switching units in the display device, the impedance test signal is transmitted by the control pad of the integrated circuit to detect the bonding connection between the integrated circuit and the display substrate and the flexible circuit board and the display substrate, thus avoiding probe detection and redundant structures.
It enables efficient detection of bonded connections, saves space on flexible circuit boards, reduces thickness and weight, and promotes the thinning and narrow-bezel design of display devices.
Smart Images
Figure CN2025089329_26032026_PF_FP_ABST
Abstract
Description
Display device and test method thereof
[0001] The present application claims priority from the Chinese patent application No. 202410693121.2, filed on May 30, 2024, and entitled "Display device and test method thereof", the contents of which should be understood as incorporated herein by reference. TECHNICAL FIELD
[0002] The present disclosure relates to, but is not limited to, display technology, and in particular to a display device and a test method thereof. BACKGROUND
[0003] An organic light emitting diode (OLED) is an active light emitting display device, which has the advantages of self-emission, wide viewing angle, high contrast, low power consumption, and extremely high response speed. With the continuous development of display technology, a display device using OLED as a light emitting element and controlled by a thin film transistor (TFT) has become the mainstream product in the current display field.
[0004] However, the weight of the display device is not easy to reduce. SUMMARY
[0005] The following is a summary of the subject matter of the detailed description herein. This summary is not intended to limit the scope of the claims.
[0006] In a first aspect, the display device includes a display substrate, a plurality of sub-pixels, a plurality of data lines, a plurality of first substrate pads and a plurality of second substrate pads, an integrated circuit, a flexible circuit board, a first switch unit and a second switch unit.
[0007] In an example embodiment, the integrated circuit further includes a first connection portion, and at least two of the plurality of first connection pads are connected through the first connection portion.
[0008] In an example embodiment, the first connection portion is connected with two first connection pads, and the two first connection pads are connected with two test pads respectively; the first switch unit comprises a first sub-switch and a second sub-switch; the first sub-switch is located between one pair of the first connection pad and the test pad, and the second sub-switch is located between another pair of the first connection pad and the test pad; a gate electrode of the first sub-switch and a gate electrode of the second sub-switch are connected with the first control pad.
[0009] In an example embodiment, a gate electrode of the first sub-switch is connected with the corresponding first control pad through a first trace, a first pole of the first sub-switch is connected with the corresponding first substrate pad through a second trace to be connected with the corresponding first connection pad, and a second pole of the first sub-switch is connected with the corresponding first substrate pad through a second trace to be connected with the corresponding test pad; a gate electrode of the second sub-switch is connected with the corresponding first control pad through a fourth trace, a first pole of the second sub-switch is connected with the corresponding first substrate pad through a fifth trace to be connected with the corresponding first connection pad, and a second pole of the second sub-switch is connected with the corresponding first substrate pad through a sixth trace to be connected with the corresponding test pad.
[0010] In an example embodiment, the flexible circuit board further comprises a second connection portion, and at least two second connection pads in the plurality of second connection pads are connected through the second connection portion.
[0011] In an example embodiment, the second connection portion is connected with two second connection pads, and the two second connection pads are connected with two test pads respectively; the second switch unit comprises a third sub-switch and a fourth sub-switch; the third sub-switch is located between one pair of the second connection pad and the test pad, and the fourth sub-switch is located between another pair of the second connection pad and the test pad; a gate electrode of the third sub-switch and a gate electrode of the fourth sub-switch are connected with the second control pad.
[0012] In an example embodiment, the gate electrode of the third sub-switch is connected to the corresponding second control pad through a seventh trace, the first pole of the third sub-switch is connected to the corresponding second substrate pad through an eighth trace to be connected to the corresponding second connection pad, and the second pole of the third sub-switch is connected to the first substrate pad through a ninth trace to be connected to the corresponding test pad; the gate electrode of the fourth sub-switch is connected to the corresponding second control pad through a tenth trace, the first pole of the fourth sub-switch is connected to the corresponding second substrate pad through an eleventh trace to be connected to the corresponding second connection pad, and the second pole of the fourth sub-switch is connected to the corresponding first substrate pad through a twelfth trace to be connected to the corresponding test pad.
[0013] In an example embodiment, the display substrate further comprises a third switch unit and a crack detection line, the crack detection line partially surrounds the display area; the integrated circuit further comprises a third control pad, the crack detection line is electrically connected to the test pad through the third switch unit; the third control pad is electrically connected to the gate electrode of the third switch unit and is configured to control the on-off of the third switch unit; the crack detection line is configured to detect whether the display substrate has a crack by transmitting the impedance test signal.
[0014] In an example embodiment, the third switch unit comprises a fifth sub-switch and a sixth sub-switch; two ends of the crack detection line are respectively connected to two test pads, the fifth sub-switch is located between one end of the crack detection line and the test pad, the sixth sub-switch is located between the other end of the crack detection line and the test pad, and the fifth sub-switch and the sixth sub-switch are connected to the third control pad.
[0015] In an example embodiment, the gate electrode of the fifth sub-switch is connected to the third control pad through a thirteenth trace, one end of the crack detection line is connected to the first pole of the fifth sub-switch, and the second pole of the fifth sub-switch is connected to the corresponding first substrate pad through a fourteenth trace to be connected to the corresponding test pad; the gate electrode of the sixth sub-switch is connected to the third control pad through a fifteenth trace, the other end of the crack detection line is connected to the first pole of the sixth sub-switch, and the second pole of the sixth sub-switch is connected to the corresponding first substrate pad through a sixteenth trace to be connected to the corresponding test pad.
[0016] In a second aspect, the display device testing method is provided. The method is applied to the display device as described above, and includes: transmitting, by an integrated circuit, a first control signal to a first switch unit through a first control pad to control the first switch unit to open; transmitting, by the integrated circuit, a second control signal to a second switch unit through a second control pad to control the second switch unit to close; transmitting, by the integrated circuit, an impedance test signal to a first connection pad through a test pad to test a binding connection between the integrated circuit and a display substrate; or transmitting, by the integrated circuit, the second control signal to the first switch unit through the first control pad to control the first switch unit to close; transmitting, by the integrated circuit, the first control signal to the second switch unit through the second control pad to control the second switch unit to open; transmitting, by the integrated circuit, the impedance test signal to a second connection pad through the test pad to test a binding connection between a flexible circuit board and the display substrate; or transmitting, by the integrated circuit, the second control signal to the first switch unit through the first control pad to control the first switch unit to close; transmitting, by the integrated circuit, the second control signal to the second switch unit through the second control pad to control the second switch unit to close.
[0017] In an example embodiment, when the first switch unit or the second switch unit is in an open state, the method further includes: transmitting, by the integrated circuit, the second control signal to a third switch unit through a third control pad to control the third switch unit to close.
[0018] In an example embodiment, when the first switch unit and the second switch unit are in a closed state, the method further includes: transmitting, by the integrated circuit, the first control signal to a third switch unit through a third control pad to control the third switch unit to open, and transmitting, by the integrated circuit, an impedance test signal to the first connection pad through the test pad to perform crack detection on the display substrate.
[0019] In an example embodiment, the first control signal and the second control signal are voltage signals.
[0020] Other aspects can become apparent after reading and understanding the accompanying drawings and detailed description.
[0021] SUMMARY
[0022] The accompanying drawings are included to provide a further understanding of the present disclosure and are incorporated in and constitute a part of this specification, illustrate embodiments of the present disclosure and serve to explain the principles of the present disclosure, and do not limit the present disclosure.
[0023] FIG. 1 is a structural schematic diagram of a display device;
[0024] Fig. 2 is a side view of the display device shown in Fig. 1;
[0025] Fig. 3 is a schematic view of a bonding connection of an integrated circuit, a flexible circuit board, and a display substrate;
[0026] Fig. 4 is a schematic view of a structure of a display device in an exemplary embodiment of the present disclosure;
[0027] Fig. 5 is a schematic view of a structure of a display substrate of Fig. 4 in an exemplary embodiment;
[0028] Fig. 6 is a schematic view of a structure of an integrated circuit of Fig. 4 in an exemplary embodiment;
[0029] Fig. 7 is a cross-sectional view of a display substrate at a first sub-switch in an exemplary embodiment.
[0030] Detailed description
[0031] The present disclosure describes a number of embodiments, but the description is exemplary rather than limiting and many further embodiments and implementations can be possible within the scope of the embodiments described in the present disclosure. Although a number of possible combinations of features have been set forth herein, and discussed in the specific implementation, many other combinations of the disclosed features can be possible. Unless specifically intended otherwise, any feature or element of any embodiment can be used in combination with any other feature or element of any other embodiment, or in replacement of any other feature or element in any other embodiment.
[0032] The present disclosure includes and contemplates combinations of features and elements known to those of ordinary skill in the art. The embodiments, features and elements disclosed herein can also be combined with any conventional feature or element to form a unique application of the presently claimed disclosure. Any feature or element of any embodiment can also be combined with features or elements from other applications to form another unique application of the presently claimed disclosure. Therefore, it should be understood that any feature shown and / or discussed in the present disclosure can be used, both individually and in any appropriate combination. Accordingly, the embodiments are not to be restricted, except as by the appended claims and their equivalents. Also, various modifications and changes can be made within the scope of the attached claims.
[0033] Furthermore, in describing representative embodiments, the present disclosure can have presented the method and / or process as a particular sequence of steps. However, to the extent that the method or process depends on the performance of such steps in the recited particular order, the method or process should not be limited to those steps executed in the particular order described herein. Rather, the particular sequence of steps described in this disclosure can be subject to variations and alterations and can be performed in an order different than that described without departing from the spirit of the present disclosure. Accordingly, the particular sequence of steps set forth in this disclosure should not be construed as a limitation on the claims. In addition, the claims should not be limited to the steps of performing the steps in the order written, and one skilled in the art can readily understand that these orderings can be varied and that the scope of the present disclosure encompasses these variations.
[0034] In the drawings, the size, the layer thickness, or the region of one or more constituent elements can sometimes be exaggerated for the sake of explanation. In addition, the drawings are schematically show ideal examples, and the shape, the numerical value, and the like are not limited to the drawings.
[0035] The ordinal numbers, such as "first", "second", and "third" in the specification are used to avoid confusion among constituent elements having the same or similar functions and do not limit the number thereof. In the present disclosure, "a plurality of" means two or more.
[0036] In the present specification, the words "central", "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like used to describe the positional relationship of the constituent elements with reference to the drawings are used to facilitate the description of the present specification and simplify the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be construed as limiting the present disclosure. The positional relationship of the constituent elements can be appropriately changed according to the direction of the constituent elements described. Therefore, it is not limited to the words described in the specification, and can be appropriately replaced according to the situation.
[0037] In the present disclosure, unless explicitly defined and limited otherwise, the terms "mount", "connected", "connecting" should be interpreted broadly. For example, it can be fixedly connected, or detachably connected, or integrally connected; it can be mechanically connected, or electrically connected; it can be directly connected, or indirectly connected through an intermediate piece, or the communication between two elements inside. For those skilled in the art, the meaning of the above terms in the present disclosure can be understood according to the situation.
[0038] In the present embodiment, a transistor refers to an element including at least a gate electrode, a drain electrode, and a source electrode. A transistor has a channel region between a drain electrode (a drain electrode terminal, a drain region, or a drain) and a source electrode (a source electrode terminal, a source region, or a source), and current can flow through the drain electrode, the channel region, and the source electrode. Note that in the present embodiment, the channel region refers to a region through which current mainly flows.
[0039] In the present embodiment, the first electrode can be a drain electrode and the second electrode can be a source electrode, or the first electrode can be a source electrode and the second electrode can be a drain electrode. In the case of using a transistor having opposite polarity or in the case of changing the direction of current in circuit operation, the functions of the "source electrode" and the "drain electrode" are sometimes interchanged. Thus, in the present embodiment, the "source electrode" and the "drain electrode" can be interchanged, and the "source terminal" and the "drain terminal" can be interchanged.
[0040] In the present embodiment, "electrically connected" includes the case where the constituent elements are connected through an element having some kind of electrical action. The element having some kind of electrical action is not particularly limited as long as it can transmit an electrical signal between the connected constituent elements. Examples of the element having some kind of electrical action include not only electrodes and wiring but also a switching element such as a transistor, a resistor, an inductor, a capacitor, and other elements having various functions.
[0041] In the present embodiment, "parallel" refers to a state where the angle formed by two straight lines is -10° or more and 10° or less, and thus, a state where the angle is -5° or more and 5° or less is also included. In addition, "perpendicular" refers to a state where the angle formed by two straight lines is 80° or more and 100° or less, and thus, a state where the angle is 85° or more and 95° or less is also included.
[0042] Embodiments of the present disclosure will be described in detail below with reference to the drawings.
[0043] FIG. 1 is a structural schematic diagram of a display device. FIG. 2 is a side view of the display device shown in FIG. 1, illustrating a state after a binding area is bent. As shown in FIG. 1 and FIG. 2, the display device provided in the embodiment includes a display substrate 11, an integrated circuit (IC) 12, and a flexible printed circuit (FPC) 13 which are bindingly connected to the display substrate 11. The display substrate 11 includes a display area 100 and a non-display area 200 which surrounds the periphery of the display area 100. The non-display area 200 includes a binding area 300 which is located on a side of the display area 100 along a second direction Y. The display area 100 includes at least a plurality of pixel units arranged in a regular manner, for example, the plurality of pixel units can be arranged in an array along a first direction X and a second direction Y which are perpendicular to each other. The plurality of pixel units are configured to display dynamic pictures or still images, and the display area 100 can be referred to as an active area (AA). In an exemplary embodiment, the display device can be deformable, for example, rolled, bent, folded or rolled up.
[0044] In an exemplary embodiment, the display area 100 can have a shape of a quadrilateral, a circle, an ellipse, a polygon of other shapes, or an irregular shape, and the corner of the display area 100 can have a rounded corner, which is not limited in the present disclosure.
[0045] In an exemplary embodiment, the binding area 300 can include, in sequence along a direction away from the display area 100, a fan-out area 400, a driving chip area 600, and a binding pin area 700. The fan-out area 400 is connected to the display area 100 and can include at least a plurality of parallel data fan-out lines. The signal lines such as power lines and data lines of the display area 100 can pass through the fan-out area 400 by fan-out wiring and be connected to corresponding signal providing ends. The driving chip area 600 can include at least a plurality of bonding pads. The integrated circuit 12 can be bindingly connected to the display substrate 11 through the plurality of bonding pads of the driving chip area 600. The integrated circuit 12 is configured to be connected to the plurality of data fan-out lines, and the integrated circuit 12 can be a driving integrated circuit (DIC). The binding pin area 700 can include at least a plurality of bonding pads. The flexible printed circuit 13 can be bindingly connected to the display substrate 11 through the plurality of bonding pads of the binding pin area 700.
[0046] In an exemplary embodiment, the binding area 400 can further include a bending area 500, which can be located between the fan-out area 400 and the driving chip area 600, connected to the fan-out area 400, can include a composite insulating layer provided with a groove, configured to bend the binding area 300 to the back of the display area 100, after the binding area 300 is bent, the integrated circuit 12 and the flexible circuit board 13 are bent to the back of the display area 100.
[0047] In an exemplary embodiment, as shown in FIG. 1, two crack detection lines 201 are provided in the non-display area 200, which are wrapped outside the display area 100, and the two ends of the crack detection line 201 are connected with the integrated circuit 12, which can provide a crack detection signal to the crack detection line 201, so as to detect the crack condition of the display substrate 11 around the display area 100. The number and distribution of the crack detection line 201 can be set as needed, and the present disclosure does not limit this.
[0048] In an exemplary embodiment, after the integrated circuit 12 and the flexible circuit board 13 are bound and connected with the display substrate 11, the effect of the binding and connection needs to be detected, for example, the impedance between the flexible circuit board 13 and the display substrate 11 can be detected to judge the binding condition between the flexible circuit board 13 and the display substrate 11, and the impedance between the integrated circuit 12 and the display substrate 11 can be detected to judge the binding condition between the integrated circuit 12 and the display substrate 11.
[0049] FIG. 3 is a schematic diagram of the binding connection of the integrated circuit, the flexible circuit board and the display substrate, which simplifies the structure of the display substrate. In FIG. 3, the structures such as the pads, alignment marks, test points and connection lines provided on the display device can be symmetrically arranged, which is not limited in the present disclosure. As shown in FIG. 3, a plurality of first substrate pads 111A, a plurality of second substrate pads 111B, a plurality of first connection lines 112 and a plurality of second connection lines 113 are provided in the binding area of the display substrate 11, the plurality of first substrate pads 111A are configured to be bound and connected with the integrated circuit 12, the plurality of second substrate pads 111B are configured to be bound and connected with the flexible circuit board 13, the plurality of first substrate pads 111A can be arranged in sequence along the first direction X, the plurality of second substrate pads 111B can be arranged in sequence along the first direction X, and the plurality of second substrate pads 111B can be located on one side of the plurality of first substrate pads 111A along the second direction Y. The integrated circuit 12 includes a plurality of integrated circuit pads, the plurality of integrated circuit pads include a plurality of first connection pads 121, a plurality of third connection lines 122 and a plurality of test pads 123, the plurality of first connection pads 121 can be located at both ends of the integrated circuit 12 along the second direction Y, the plurality of test pads 123 can be located at both ends of the integrated circuit 12 along the first direction X, the first connection pad 121 is configured to be bound and connected with the display substrate 11 through the corresponding first substrate pad 111A, the test pad 123 is configured to be connected with the crack detection line 201 to provide a crack detection signal to the crack detection line 201, and the third connection line 122 is configured to connect the corresponding two first connection pads 121, which can be two pads adjacent in the first direction X. The flexible circuit board 13 includes a plurality of second connection pads 131, a plurality of alignment marks 132, a plurality of test points 133, a plurality of fourth connection lines 134 and a plurality of second test pads 135, the plurality of test points 133 include a pair of first point A and second point B, and a pair of third point C and fourth point D. The plurality of second connection pads 131 are configured to be bound and connected with the display substrate 11 through the corresponding second substrate pad 111B, and connected with the first point A and the second point B through the fourth connection line 134, and the second substrate pad 111B can be connected with each other through the first connection line 112 on the display substrate 11 after being connected with the second connection pad 131. As shown in FIG. 3, the first connection line 112 can connect two second substrate pads 111B adjacent in the first direction X, thereby forming a test path between the first point A and the second point B, and subsequently the impedance test can be performed at the first point A and the second point B by using a probe, thereby determining the binding and connection effect between the display substrate 11 and the flexible circuit board 13.The first substrate pad 111A connected with the first connection pad 121 can be connected to the second test pad 135 of the flexible circuit board 13 through the second connection line 113 and the second substrate pad 111B arranged on the display substrate 11 correspondingly, and the second test pad 135 can be connected with the third point C and the fourth point D through the fourth connection line 134. Under the communication of the third connection line 122, the test path is formed between the third point C and the fourth point D, and the impedance test can be performed at the third point C and the fourth point D by using the probe subsequently, so as to determine the binding connection effect between the display substrate 11 and the integrated circuit 12. By arranging the second test pad 135 and the related structure on the flexible circuit board 13, the connection between the first connection pad 121 and the first substrate pad 111A can be detected at the test point 135 of the flexible circuit board 13, and the binding connection of the display substrate 11, the integrated circuit 12 and the flexible circuit board 13 can be detected.
[0050] In the example embodiment, the alignment mark 132 is arranged near the test point 133, for example, the alignment mark 132 can be arranged on one side of the test point 133 in the first direction X, so that the probe can accurately find the corresponding test point when the test is performed.
[0051] As shown in FIG. 3, when the impedance test is performed, the test point 133 can be quickly positioned by using the alignment mark 132, the probe of the impedance test equipment can accurately find the corresponding test point 133, and the impedance of the test path is detected, so as to determine whether the binding connection is abnormal. In the probe type impedance detection mode, as shown in FIG. 3, the alignment mark 132, the test point 133, the fourth connection line 134 and the second test pad 135 and the like need to be arranged on the flexible circuit board 13 in advance, and the size of the alignment mark 132 and the test point 133 cannot be reduced due to the limitation of the detection equipment and the probe size, which makes the space utilization of the flexible circuit board 13 low, the thickness and the weight large, and is not conducive to realize the lightness and thinness of the display device, and is not conducive to realize the narrow frame. Moreover, the probe type impedance detection mode needs to use special detection equipment, the production cost is high, the contact type test mode takes a long time, the time cost is large, and the production capacity of the display device cannot be improved.
[0052] The display device provided by the embodiments of the present disclosure comprises a display substrate, the display substrate comprises a display area and a non-display area surrounding the display area; a plurality of sub-pixels are located in the display area; a plurality of data lines are located in the display area and extend to the non-display area, the plurality of sub-pixels and the plurality of data lines are electrically connected; a plurality of first substrate pads and a plurality of second substrate pads are located in the non-display area, the plurality of second substrate pads are located on the side of the plurality of first substrate pads away from the display area, the plurality of data lines are electrically connected with a part of the plurality of first substrate pads; an integrated circuit is located in the non-display area, the integrated circuit comprises a plurality of integrated circuit pads, the plurality of integrated circuit pads are bonded with the plurality of first substrate pads; a flexible circuit board is located in the non-display area, the flexible circuit board comprises a plurality of second connection pads, the plurality of second connection pads are bonded with the plurality of second substrate pads; a first switch unit and a second switch unit are located in the non-display area; wherein the plurality of integrated circuit pads comprise a first control pad, a second control pad, a plurality of first connection pads and a plurality of test pads, the first control pad, the second control pad, the plurality of first connection pads and the plurality of test pads are bonded with another part of the first substrate pads on the display substrate, at least two of the plurality of first connection pads are electrically connected with at least two of the plurality of test pads through the first switch unit, the first control pad is electrically connected with the gate electrode of the first switch unit and is configured to control the on-off of the first switch unit; at least two of the plurality of second connection pads are electrically connected with the at least two test pads through the second switch unit, the second control pad is electrically connected with the gate electrode of the second switch unit and is configured to control the on-off of the second switch unit; the integrated circuit is configured to control the on-off of the first switch unit and the second switch unit, and transmit an impedance test signal through the at least two test pads, so as to detect the bonding connection between the integrated circuit and the display substrate or between the flexible circuit board and the display substrate, respectively.
[0053] The display device provided by the embodiments of the present disclosure can form a detection channel at the binding connection between the integrated circuit and the display substrate, transmit an impedance test signal to the detection channel by the integrated circuit, and thus detect the binding connection effect between the integrated circuit and the display substrate. The display device provided by the embodiments of the present disclosure can form a detection channel at the binding connection between the flexible circuit board and the display substrate, transmit an impedance test signal to the detection channel by the integrated circuit, and thus detect the binding connection effect between the flexible circuit board and the display substrate. The display device provided by the embodiments of the present disclosure can facilitate the detection of the binding effect between the display substrate, the integrated circuit and the flexible circuit board, and does not need to use a probe detection method or set redundant structures such as alignment marks and test points on the flexible circuit board, thereby greatly saving the space and layout of the flexible circuit board, reducing the thickness and weight of the flexible circuit board and the display device, and achieving the lightness, thinness and narrow frame of the display device.
[0054] In the example embodiment, the "another part" of the first substrate pads refers to a part of the first substrate pads other than the first substrate pads connected to the data lines.
[0055] FIG. 4 is a structural schematic diagram of a display device in an example embodiment of the present disclosure. In FIG. 4, the binding pads and the wires and other components are shown in an enlarged manner, and other structures and regions are omitted. In FIG. 4, the arc shape represents the crossing of the wires but no connection. In FIG. 4, the display device is shown as an example in which the structure of the display device is distributed symmetrically along the first direction. The present disclosure is not limited in this regard. As shown in FIG. 4, the display device includes a display substrate 11, an integrated circuit 12 and a flexible circuit board 13. The display substrate 11 includes a display area 100 and a non-display area 200 surrounding the display area 100. The non-display area 200 includes a binding area 300 on one side of the display area 100. The integrated circuit 12 and the flexible circuit board 13 are bindingly connected in the binding area 300. The integrated circuit 12 is located on one side of the display area 100 along a second direction Y. The flexible circuit board 13 is located on one side of the integrated circuit 12 along the second direction Y. The display area 100 includes a plurality of sub-pixels P. The plurality of sub-pixels P can be arranged in an array. A column of sub-pixels P arranged along the second direction Y can be connected to the same data line 101. A plurality of data lines 101 can be connected to the integrated circuit 12. The integrated circuit 12 provides a data signal to the corresponding sub-pixels through the data line 101 to drive the sub-pixels to display.
[0056] Fig. 5 is a structural schematic diagram of the display substrate of Fig. 4 in an example embodiment, and Fig. 6 is a structural schematic diagram of the integrated circuit of Fig. 4 in an example embodiment, which show the arrangement of structures such as the bonding pads on the display substrate and the integrated circuit. As shown in Figs. 4-6, the display substrate 11 of the non-display area 200 includes the first switch unit S1, the second switch unit S2, a plurality of first substrate pads 111A, and a plurality of second substrate pads 111B. The plurality of first substrate pads 111A are located in the integrated circuit area 600 and are configured to be bonded to the integrated circuit 12. The plurality of second substrate pads 111B are located in the bonding pin area 700 and are configured to be bonded to the flexible circuit board 13. The integrated circuit 12 includes a first control pad 124A, a second control pad 124B, a plurality of test pads 123, and a plurality of first connection pads 121. The plurality of first connection pads 121 are distributed at both ends of the integrated circuit 12 along the second direction Y. The integrated circuit 12 covers the integrated circuit area 600. The plurality of first connection pads 121 located at one end close to the display area 100 are bonded to a portion of the first substrate pads 111A and are connected to the corresponding data lines 101. The plurality of first connection pads 121 located at one end away from the display area 100 are bonded to the corresponding first substrate pads 111A. At least two of the plurality of first connection pads 121 located at one end away from the display area 100 are electrically connected to at least two of the test pads 123 through the first switch unit S1, forming a detection loop between the display substrate 11 and the integrated circuit 12, which facilitates the transmission of impedance test signals. The first control pad 124A is electrically connected to the gate electrode of the first switch unit S1 and is configured to control the on-off state of the first switch unit. The first control pad 124A, the second control pad 124B, the plurality of test pads 123, and a portion of the first substrate pads 111A are bonded to each other. The flexible circuit board 13 covers the bonding pin area 700 and includes a plurality of second connection pads 131. The second connection pads 131 are bonded to the corresponding second substrate pads 111B. At least two of the plurality of second substrate pads 111B are electrically connected to at least two of the test pads 123 through the second switch unit S2, forming a detection loop between the display substrate 11 and the flexible circuit board 13. The second control pad 124B is electrically connected to the gate electrode of the second switch unit S2 and is configured to control the on-off state of the second switch unit S2. The integrated circuit 12 is configured to control the on-off state of the first switch unit S1 and the second switch unit S2 and transmit impedance test signals through the at least two test pads 123, thereby detecting the bonding connection between the integrated circuit 12 and the display substrate 11 or between the flexible circuit board 13 and the display substrate 11, respectively.
[0057] In an example embodiment, as shown in FIG. 5, the plurality of second substrate pads 111B can be distributed at opposite ends of the binding pin region 700 along the first direction D1. As shown in FIG. 6, the plurality of first control pads 124A, the plurality of second control pads 124B and the plurality of test pads 123 can be distributed at two ends of the integrated circuit 12 along the first direction D1. The present disclosure does not limit this.
[0058] In an example embodiment, the binding region 300 can further comprise a bending region, the bending region being located between the display region 100 and the integrated circuit 12, the position of the bending region can be referred to as shown in FIG. 1, the bending region is configured to bend the binding region 300 to the back of the display region 100, after bending, the integrated circuit 12 and the flexible circuit board 13 can be bent to the back of the display region 100, and a narrow frame can be achieved.
[0059] In an example embodiment, the plurality of pads on the integrated circuit 12 can be connected one-to-one with the plurality of first substrate pads 111A on the display substrate 11, and the crack detection line 201, the switch unit and other structures can be electrically connected to the pads on the integrated circuit 12 through the corresponding first substrate pads 111A.
[0060] In an example embodiment, the first switch unit S1, the second switch unit S2 and the third switch unit S3 can be transistors, and the gate electrodes of the transistors can be connected to the corresponding control pads.
[0061] In an example embodiment, as shown in FIG. 4, the integrated circuit 12 can comprise a first connection part 126, the first connection part 126 can be connected to two first connection pads 121, the two first connection pads 121 are respectively connected to two test pads 123, the first switch unit can comprise a first sub-switch K1 and a second sub-switch K2, one pair of first connection pads 121 and test pads 123 are provided with the first sub-switch K1, and the other pair of first connection pads 121 and test pads 123 are provided with the second sub-switch K2, and the gate electrodes of the first sub-switch K1 and the second sub-switch K2 are connected to the first control pad 124A. By providing the first connection part 126 inside the integrated circuit 12, the integrated circuit 12 itself has the condition to form a detection path, and the wiring on the display substrate 11 only needs to connect the corresponding pads to form the detection path, which helps to save the wiring space of the display substrate 11 and facilitates the wiring layout. In other embodiments, the first connection part 126 can be connected to a larger number of first connection pads 121, and the first switch unit can comprise a larger number of sub-switches, and the present disclosure does not limit this.
[0062] In an example embodiment, as shown in FIG. 4, the gate electrode of the first sub-switch K1 can be connected with the corresponding first control pad 124A through the first trace L1, the first electrode of the first sub-switch K1 can be connected with the corresponding first substrate pad 111A on the display substrate 11 through the second trace L2, so as to realize the connection between the first electrode and the corresponding first connection pad 121, and the second electrode of the first sub-switch K1 can be connected with the corresponding first substrate pad 111A on the display substrate 11 through the second trace L2, so as to realize the connection between the second electrode and the corresponding test pad 123. The gate electrode of the second sub-switch K2 can be connected with the corresponding first control pad 124A through the fourth trace L4, and the fourth trace L4 and the first trace L1 can be connected with each other. The first electrode of the second sub-switch K2 can be connected with the corresponding first substrate pad 111A on the display substrate 11 through the fifth trace L5, so as to realize the connection between the first electrode and the corresponding first connection pad 121, and the second electrode of the second sub-switch K2 can be connected with the corresponding first substrate pad 111A on the display substrate 11 through the sixth trace L6, so as to realize the connection between the second electrode and the corresponding test pad 123.
[0063] In an example embodiment, as shown in FIG. 4, the flexible circuit board 13 can include a second connection part 136, the second connection part 136 can be connected with two second connection pads 131, the two second connection pads 131 are respectively connected with two test pads 123 of the integrated circuit 12, and the second switch unit can include a third sub-switch K3 and a fourth sub-switch K4, one pair of the second connection pad 131 and the test pad 123 is provided with the third sub-switch K3, and the other pair of the second connection pad 131 and the test pad 123 is provided with the fourth sub-switch K4, and the gate electrodes of the third sub-switch K3 and the fourth sub-switch K4 are connected with the second control pad 124B. By arranging the second connection part 136 inside the flexible circuit board 13, the flexible circuit board 13 itself has the condition of forming a detection path, and the traces on the display substrate 11 only need to be connected with the corresponding pads to form the detection path, which helps to save the trace space of the display substrate 11 and facilitates the layout of the traces. In other embodiments, the second connection part 136 can be connected with a larger number of second connection pads 131, and the second switch unit can include a larger number of sub-switches, which is not limited in the present disclosure.
[0064] In an example embodiment, as shown in FIG. 4, the gate electrode of the third sub-switch K3 can be connected with the corresponding second control pad 124B through the seventh wire L7, the first pole of the third sub-switch K3 can be connected with the corresponding second substrate pad 111B on the display substrate 11 through the eighth wire L8, so as to realize the connection between the first pole and the corresponding second connection pad 131, the second pole of the third sub-switch K3 can be connected with the corresponding first substrate pad 111A on the display substrate 11 through the ninth wire L9, so as to realize the connection between the second pole and the corresponding test pad 123, and the ninth wire L9 can be connected with the sixth wire L6. The gate electrode of the fourth sub-switch K4 can be connected with the corresponding second control pad 124B through the tenth wire L10, and the tenth wire L10 can be connected with the seventh wire L7. The first pole of the fourth sub-switch K4 can be connected with the corresponding second substrate pad 111B on the display substrate 11 through the eleventh wire L11, so as to realize the connection between the first pole and the corresponding second connection pad 131, and the second pole of the fourth sub-switch K4 can be connected with the corresponding first substrate pad 111A on the display substrate 11 through the twelfth wire L12, so as to realize the connection between the second pole and the corresponding test pad 123, and the twelfth wire L12 can be connected with the third wire L3.
[0065] In the example embodiment, the display substrate 11 comprises a crack detection line 201 which partially surrounds the display area 100 of the display substrate 11; the display substrate 11 further comprises a third switch unit S3, and the integrated circuit 12 further comprises a third control pad 124C; the crack detection line 201 can be connected to the two test pads 123 through the third switch unit S3, and the third control pad 124C is electrically connected to the gate electrode of the third switch unit S3 and is configured to control the on-off of the third switch unit S3. In this embodiment, by configuring the crack detection line 201 to be electrically connected to the two test pads 123, the integrated circuit 12 can use the crack detection signal to detect the crack condition of the display substrate 11. In the example embodiment, the first switch unit S1 and the second switch unit S2 can be controlled to be closed and the third switch unit S3 can be controlled to be opened, so as to detect the crack of the display substrate 11; then, the first switch unit S1 can be controlled to be opened and the second switch unit S2 and the third switch unit S3 can be controlled to be closed, so as to test the binding connection between the display substrate 11 and the integrated circuit 12; finally, the first switch unit S1 and the third switch unit S3 can be controlled to be closed and the second switch unit S2 can be controlled to be opened, so as to detect the binding connection between the display substrate 11 and the flexible circuit board 13. This detection method of the binding connection is fast and accurate, does not need to use a specific probe detection device, and does not need to increase a new production process, which not only helps to realize the thinning of the display device, but also improves the production efficiency of the display device. In other embodiments, at least two of the first switch unit S1, the second switch unit S2 and the third switch unit S3 can be controlled to be opened at a time, so as to realize the integrated detection of at least two detection items. For example, the first switch unit S1 and the second switch unit S2 can be controlled to be opened and the third switch unit S3 can be controlled to be closed, so as to synchronously test the binding connection between the display substrate 11 and the integrated circuit 12 and the binding connection between the display substrate 11 and the integrated circuit 12; or the first switch unit S1 and the third switch unit S3 can be controlled to be opened and the second switch unit S2 can be controlled to be closed, so as to synchronously detect the binding connection between the display substrate 11 and the integrated circuit 12 and the crack of the display substrate 11; or the second switch unit S2 and the third switch unit S3 can be controlled to be opened and the first switch unit S1 can be controlled to be closed, so as to synchronously detect the binding connection between the display substrate 11 and the integrated circuit 12 and the crack of the display substrate 11; or the first switch unit S1, the second switch unit S2 and the third switch unit S3 can all be controlled to be opened, so as to synchronously detect the binding connection between the display substrate 11 and the integrated circuit 12, the binding connection between the display substrate 11 and the integrated circuit 12 and the crack of the display substrate 11, and the present disclosure does not limit this.
[0066] In the example embodiment, as shown in FIG. 4, the two ends of the crack detection line 201 are connected with the two test pads 123 respectively, the third switch unit can include a fifth sub-switch K5 and a sixth sub-switch K6, the fifth sub-switch K5 is arranged between one end of the crack detection line 201 and the test pad 123, the sixth sub-switch K6 is arranged between the other end of the crack detection line 201 and the test pad 123, and the gate electrodes of the fifth sub-switch K5 and the sixth sub-switch K6 are connected with the third control pad 124C.
[0067] In the example embodiment, as shown in FIG. 4, the gate electrode of the fifth sub-switch K5 can be connected with the corresponding third control pad 124C through the thirteenth wire L13, the first pole of the fifth sub-switch K5 can be connected with one end of the crack detection line 201, the second pole of the fifth sub-switch K5 can be connected with the corresponding first substrate pad 111A on the display substrate 11 through the fourteenth wire L14, so as to realize the connection between the second pole and the corresponding test pad 123, and the fourteenth wire L14 can be connected with the ninth wire L9. The gate electrode of the sixth sub-switch K6 can be connected with the corresponding third control pad 124C through the fifteenth wire L15, and the fifteenth wire L15 can be connected with the thirteenth wire L13. The first pole of the sixth sub-switch K6 can be connected with the other end of the crack detection line 201, and the second pole of the sixth sub-switch K6 can be connected with the corresponding first substrate pad 111A on the display substrate 11 through the sixteenth wire L16, so as to realize the connection between the second pole and the corresponding test pad 123, and the sixteenth wire L16 can be connected with the twelfth wire L12.
[0068] FIG. 7 is a sectional view of a display substrate at a first sub-switch in an example embodiment, and the sectional view of the display substrate at the other sub-switches can refer to FIG. 7. As shown in FIG. 7, the first sub-switch K1 is a transistor, which includes a semiconductor layer 303, a gate electrode 305, a first electrode 311, and a second electrode 312. In a direction perpendicular to the display substrate, the display substrate can include a base 301, a buffer layer 302, the semiconductor layer 303, a first insulating layer 304, the gate electrode 305, a second insulating layer 306, a third trace L3, a third insulating layer 308, a source-drain metal layer, and a planar layer 309. The source-drain metal layer can include the first electrode 311, the second electrode 312, and a first trace L1. The gate electrode 305 can be connected to a corresponding first control pad 124A through the first trace L1. The first trace L1 and the gate electrode 305 can be connected through a via. The first trace L1 and the gate electrode 305 can overlap each other in a projection on the base 301. The first electrode 311 can be connected to a corresponding first substrate pad 111A on the display substrate 11 through a second trace L2, so as to realize the connection between the first electrode 311 and a corresponding first connection pad 121. The first electrode 311 and the second trace L2 can be connected to each other or be an integral structure. The second electrode 312 can be connected to a corresponding first substrate pad 111A on the display substrate 11 through a third trace L3, so as to realize the connection between the second electrode and a corresponding test pad 123. The third trace L3 and the second electrode 312 can be connected through a via. The third trace L3 and the gate electrode 305 do not overlap each other in a projection on the base 301. The base 301 can be a flexible base, which is convenient for bending. The first insulating layer 304 and the second insulating layer 306 can be referred to as gate insulating layers. The third insulating layer 308 can be referred to as an interlayer insulating layer. The planar layer 309 can be in the same layer as a pixel definition layer of a display area, and the present disclosure does not make any limitation in this regard.
[0069] The display device testing method provided in the embodiments of the present disclosure can be used for testing the display device.
[0070] The integrated circuit transmits a first control signal to the first switch unit through the first control pad to control the first switch unit to open. The integrated circuit transmits a second control signal to the second switch unit through the second control pad to control the second switch unit to close. The integrated circuit transmits a test signal to the first connection pad through the test pad to test the binding connection between the integrated circuit and the display substrate. Alternatively,
[0071] The integrated circuit transmits a second control signal to the first switch unit through the first control pad to control the first switch unit to be closed; the integrated circuit transmits a first control signal to the second switch unit through the second control pad to control the second switch unit to be opened; the integrated circuit transmits a test signal to the second connection pad through the test pad to test the binding connection between the flexible circuit board and the display substrate; or,
[0072] The integrated circuit transmits a second control signal to the first switch unit through the first control pad to control the first switch unit to be closed; the integrated circuit transmits a second control signal to the second switch unit through the second control pad to control the second switch unit to be closed.
[0073] In an exemplary embodiment, when the first switch unit or the second switch unit is in an opened state, the method further comprises: the integrated circuit transmits a second control signal to the third switch unit through the third control pad to control the third switch unit to be closed.
[0074] In an exemplary embodiment, when the first switch unit and the second switch unit are in a closed state, the method further comprises: the integrated circuit transmits a first control signal to the third switch unit through the third control pad to control the third switch unit to be opened, and the integrated circuit transmits an impedance test signal to the first connection pad through the test pad to detect a crack of the display substrate.
[0075] In the example embodiment, as shown in FIG. 4, when testing the binding connection between the integrated circuit 12 and the display substrate 11, the integrated circuit 12 can issue a code instruction to open the first sub-switch K1 and the second sub-switch K2 through the first control signal, and close the third sub-switch K3 to the sixth sub-switch K6 through the second control signal. The integrated circuit 12 can transmit a test signal to the detection path between the integrated circuit 12 and the display substrate 11 through the test pad 123, detect the impedance in the detection path, and determine whether the binding connection between the integrated circuit 12 and the display substrate 11 has a problem according to the detection result. When testing the binding connection between the flexible circuit board 13 and the display substrate 11, the integrated circuit 12 can issue a code instruction to open the third sub-switch K3 and the fourth sub-switch K4 through the first control signal, and close the first sub-switch K1, the second sub-switch K2, the fifth sub-switch K5, and the sixth sub-switch K6 through the second control signal. The integrated circuit 12 can transmit a test signal to the detection path between the flexible circuit board 13 and the display substrate 11 through the test pad 123, detect the impedance in the detection path, and determine whether the binding connection between the flexible circuit board 13 and the display substrate 11 has a problem according to the detection result. When testing the crack of the display substrate 11, the integrated circuit 12 can issue a code instruction to open the fifth sub-switch K5 and the sixth sub-switch K6 through the first control signal, and close the first sub-switch K1 to the fourth sub-switch K4 through the second control signal. The integrated circuit 12 can transmit a test signal to the crack detection line 201 through the test pad 123, detect the impedance of the crack detection line 201, and determine whether the display substrate 11 has a crack according to the detection result. In other embodiments, at least two detection items can be integrated and detected at a time by controlling the on-off of the switch unit, which will not be described herein.
[0076] In the example embodiment, one of the two test pads 123 can be used to issue an impedance test signal, which reaches the other test pad 123 after passing through the detection path. The connection between the binding pads can be detected by the transmission of the impedance test signal in the detection path, and whether the display substrate has a crack can be detected by the transmission of the impedance test signal in the crack detection line 201. The detection principle and method of the present disclosure are not limited.
[0077] In the example embodiment, the first control signal and the second control signal can be voltage signals. In the example embodiment, the first control signal can be a low voltage signal, for example, can be -7 volts, and the second control signal can be a high voltage signal, for example, can be +7 volts. In other embodiments, the first control signal can be a high voltage signal, and the second control signal can be a low voltage signal. The low voltage signal and the high voltage signal can be a relative concept, and the type of transistor of the switching unit and the conduction signal can be set as needed, and the present disclosure is not limited in this regard.
[0078] The display device provided by the embodiments of the present disclosure can be an OLED display, a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, or any product or component having a display function, and the embodiments of the present disclosure are not limited thereto.
[0079] Although the embodiments disclosed by the present disclosure are as described above, the content described is only the embodiments adopted for the purpose of facilitating the understanding of the present disclosure, and is not intended to limit the present disclosure. Any person skilled in the art to which the present disclosure belongs can make any modification and change in the form and details without departing from the spirit and scope of the present disclosure, and the patent protection scope of the present disclosure shall be subject to the scope defined by the appended claims.
Claims
1. A display device, comprising a display substrate, the display substrate comprising a display area and a non-display area surrounding the display area; a plurality of sub-pixels located in the display area; a plurality of data lines located in the display area and extending to the non-display area, the plurality of sub-pixels and the plurality of data lines being electrically connected; a plurality of first substrate pads and a plurality of second substrate pads located in the non-display area, the plurality of second substrate pads being located on a side of the plurality of first substrate pads away from the display area, the plurality of data lines being electrically connected to a part of the plurality of first substrate pads; an integrated circuit located in the non-display area, the integrated circuit comprising a plurality of integrated circuit pads, the plurality of integrated circuit pads being bonded to the plurality of first substrate pads; a flexible circuit board located in the non-display area, the flexible circuit board comprising a plurality of second connection pads, the plurality of second connection pads being bonded to the plurality of second substrate pads; a first switch unit and a second switch unit located in the non-display area; wherein the plurality of integrated circuit pads comprise a first control pad, a second control pad, a plurality of first connection pads and a plurality of test pads, the first control pad, the second control pad, the plurality of first connection pads and the plurality of test pads being bonded to another part of the first substrate pads on the display substrate, at least two of the plurality of first connection pads being electrically connected to at least two of the plurality of test pads through the first switch unit, the first control pad being electrically connected to a gate electrode of the first switch unit and configured to control on-off of the first switch unit; at least two of the plurality of second connection pads being electrically connected to the at least two of the test pads through the second switch unit, the second control pad being electrically connected to a gate electrode of the second switch unit and configured to control on-off of the second switch unit; the integrated circuit being configured to detect bonding between the integrated circuit and the display substrate or between the flexible circuit board and the integrated circuit by controlling on-off of the first switch unit and the second switch unit and transmitting an impedance test signal through the at least two test pads. The integrated circuit further comprises a first connection part, the at least two of the plurality of first connection pads being connected through the first connection part. The first connection part is connected to two of the first connection pads, the two of the first connection pads being connected to two of the test pads respectively; the first switch unit comprises a first sub-switch and a second sub-switch; the first sub-switch is located between one pair of the first connection pad and the test pad, the second sub-switch is located between another pair of the first connection pad and the test pad, and a gate electrode of the first sub-switch and a gate electrode of the second sub-switch are both connected to the first control pad. 2. The display device according to claim 1, wherein 3. The display device according to claim 2, wherein 4. The display device according to claim 3, wherein The gate electrode of the first sub-switch is connected with the corresponding first control pad through a first trace, the first pole of the first sub-switch is connected with the corresponding first substrate pad through a second trace to be connected with the corresponding first connection pad, and the second pole of the first sub-switch is connected with the corresponding first substrate pad through a second trace to be connected with the corresponding test pad. The gate electrode of the second sub-switch is connected with the corresponding first control pad through a fourth trace, the first pole of the second sub-switch is connected with the corresponding first substrate pad through a fifth trace to be connected with the corresponding first connection pad, and the second pole of the second sub-switch is connected with the corresponding first substrate pad through a sixth trace to be connected with the corresponding test pad.
5. The display device according to claim 1, wherein The flexible circuit board further comprises a second connection part, and at least two second connection pads in the plurality of second connection pads are connected through the second connection part.
6. The display device of claim 5, wherein, The second connection part is connected with two second connection pads which are respectively connected with two test pads; the second switch unit comprises a third sub-switch and a fourth sub-switch; the third sub-switch is located between one pair of the second connection pad and the test pad, the fourth sub-switch is located between another pair of the second connection pad and the test pad, and the gate electrode of the third sub-switch and the gate electrode of the fourth sub-switch are connected with the second control pad.
7. The display device of claim 6, wherein, The gate electrode of the third sub-switch is connected with the corresponding second control pad through a seventh trace, the first pole of the third sub-switch is connected with the corresponding second substrate pad through an eighth trace to be connected with the corresponding second connection pad, and the second pole of the third sub-switch is connected with the first substrate pad through a ninth trace to be connected with the corresponding test pad. The gate electrode of the fourth sub-switch is connected with the corresponding second control pad through a tenth trace, the first pole of the fourth sub-switch is connected with the corresponding second substrate pad through an eleventh trace to be connected with the corresponding second connection pad, and the second pole of the fourth sub-switch is connected with the corresponding first substrate pad through a twelfth trace to be connected with the corresponding test pad.
8. The display device according to claim 1, wherein The display substrate further comprises a third switch unit and a crack detection line, and the crack detection line partially surrounds the display area; the integrated circuit further comprises a third control pad, the crack detection line is electrically connected with the test pad through the third switch unit; the third control pad is electrically connected with the gate electrode of the third switch unit and is configured to control the on-off of the third switch unit. The crack detection line is configured to detect whether the display substrate has a crack by transmitting the impedance test signal. The crack detection line is configured to detect whether the display substrate has a crack by transmitting the impedance test signal.
9. The display device of claim 8, wherein, The third switch unit includes a fifth sub-switch and a sixth sub-switch; two ends of the crack detection line are connected with two test pads respectively; the fifth sub-switch is located between one end of the crack detection line and the test pad; the sixth sub-switch is located between the other end of the crack detection line and the test pad; the fifth sub-switch and the sixth sub-switch are connected with the third control pad.
10. The display device of claim 9, wherein, The gate electrode of the fifth sub-switch is connected with the third control pad through a thirteenth trace; the first pole of the fifth sub-switch is connected with one end of the crack detection line; the second pole of the fifth sub-switch is connected with the corresponding first substrate pad through a fourteenth trace to be connected with the corresponding test pad; The gate electrode of the sixth sub-switch is connected with the third control pad through a fifteenth trace; the first pole of the sixth sub-switch is connected with the other end of the crack detection line; the second pole of the sixth sub-switch is connected with the corresponding first substrate pad through a sixteenth trace to be connected with the corresponding test pad.
11. A method of testing a display device, applied to the display device according to any one of claims 1 to 10, the method comprising: The integrated circuit transmits a first control signal to the first switch unit through a first control pad to control the first switch unit to open; The integrated circuit transmits a second control signal to the second switch unit through a second control pad to control the second switch unit to close; the integrated circuit transmits an impedance test signal to the first connection pad through a test pad to test the binding connection between the integrated circuit and the display substrate; or, The integrated circuit transmits the second control signal to the first switch unit through the first control pad to control the first switch unit to close; the integrated circuit transmits the first control signal to the second switch unit through the second control pad to control the second switch unit to open; the integrated circuit transmits the impedance test signal to the second connection pad through the test pad to test the binding connection between the flexible circuit board and the display substrate; or, The integrated circuit transmits the second control signal to the first switch unit through the first control pad to control the first switch unit to close; the integrated circuit transmits the second control signal to the second switch unit through the second control pad to control the second switch unit to close.
12. The test method of claim 11, wherein, When the first switch unit or the second switch unit is in an open state, the method further includes that the integrated circuit transmits the second control signal to the third switch unit through a third control pad to control the third switch unit to close.
13. The test method of claim 11, wherein, When the first switch unit and the second switch unit are in a closed state, the method further includes that the integrated circuit transmits the first control signal to the third switch unit through a third control pad to control the third switch unit to open; the integrated circuit transmits an impedance test signal to the first connection pad through the test pad to detect cracks of the display substrate.
14. The test method of claim 11, wherein, The first control signal and the second control signal are voltage signals.