Light-emitting module, print head and image forming apparatus

Abstract

Provided in the embodiments of the present application are a light-emitting module, a print head, and an image forming apparatus, relating to the technical field of image formation. The light-emitting module comprises a substrate, a drive circuit array, and a light source array. The drive circuit array is disposed on the side of the light source array in a first direction, and the spacing between the drive circuit array and the light source array in the first direction is greater than 0. The light source array comprises a plurality of light sources, the drive circuit array comprises a plurality of drive circuits in one-to-one correspondence with the plurality of light sources, and the light sources are electrically connected to the corresponding drive circuits by means of electrical connection lines. The first direction is perpendicular to the thickness direction of the substrate. In this way, light emission of the light sources of the light-emitting module is unlikely to affect the performance of the drive circuits.

Description

Light-emitting modules, printheads and image forming equipment

[0001] This application claims priority to Chinese Patent Application No. 202410710863.1, filed on May 31, 2024, entitled "Light Emitting Module, Printhead and Image Forming Apparatus", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of image forming technology, and in particular to a light-emitting module, a print head, and an image forming device. Background Technology

[0003] Image forming devices such as printers, copiers, fax machines, and display devices may include a light-emitting module. The light-emitting module may include multiple light sources arranged in an array and multiple driving circuits corresponding to each of the multiple light sources. The driving circuits are electrically connected to the corresponding light sources to drive the corresponding light sources to emit light.

[0004] In related technologies, the heat generated by the light source of the light-emitting module can easily affect the driving circuit, causing the performance of the driving circuit to drift or fail, which in turn affects the performance and lifespan of the light-emitting module. Summary of the Invention

[0005] This application provides a light-emitting module, a printhead, and an image forming apparatus, wherein the light emitted by the light-emitting module does not easily affect the performance of the driving circuit.

[0006] A first aspect of this application provides a light-emitting module, which includes a substrate, a driving circuit array, and a light source array. The driving circuit array is disposed to the side of the light source array in a first direction, and the distance between the driving circuit array and the light source array in the first direction is greater than zero. The light source array includes multiple light sources, and the driving circuit array includes multiple driving circuits corresponding one-to-one with the multiple light sources. The light sources are electrically connected to their corresponding driving circuits via electrical connection lines. The first direction is perpendicular to the thickness direction of the substrate, and the substrate is a glass substrate.

[0007] The light-emitting module provided in this application embodiment can increase the spacing between the driving circuit array and the light source array by utilizing the dimensions of the substrate in the length and width directions. This reduces the impact of heat generated by the light source on the driving circuit, making the performance of the driving circuit less prone to drift or failure, thus maintaining the performance of the light-emitting module and extending its service life. Furthermore, by placing the driving circuit array to the side of the light source array in the first direction, the size of the driving circuit is no longer limited by the center distance between two adjacent light sources in the light source array. This lowers the size requirements for the driving circuit, allowing for the use of a glass substrate as the substrate for high-resolution image forming equipment, thus reducing restrictions on substrate selection. In addition, using a glass substrate as the substrate for the light-emitting module results in lower costs, leading to a lower overall cost for the light-emitting module.

[0008] In one possible implementation, the light source array includes n groups of light sources distributed along a second direction, and the driving circuit array includes n groups of driving circuits distributed along the second direction, each group of driving circuits corresponding to a group of light sources. In the second direction, at least a portion of the driving circuit group is located between the two ends of the corresponding light source group. Each light source group includes multiple light sources distributed along the second direction, and each driving circuit group includes multiple driving circuits corresponding one-to-one with the multiple light sources in the corresponding light source group. The second direction is perpendicular to the thickness direction of the substrate and perpendicular to the first direction, and n is an integer greater than or equal to 2. Thus, when the number of driving circuits is large, multiple groups of driving circuits can be arranged in groups using the dimensions of the substrate in the second direction, which helps to reduce the size of the light-emitting module in the first direction.

[0009] In one possible implementation, each light source group contains m light sources, where m is an integer greater than or equal to 2. This ensures that the drive circuits in each drive circuit group have the same arrangement, reducing the likelihood of different parasitic capacitances in different drive circuit groups due to variations in their arrangement, thus improving the uniformity of light emission from the light-emitting module.

[0010] In one possible implementation, all the driving circuits are located on the same side of the light source array in the first direction. Thus, compared to a scheme where driving circuits are arranged on both sides of the light source array in the first direction, the driving circuits have less impact on the routing of data lines, scan lines, and other lines, making the routing of data lines, scan lines, and other lines easier.

[0011] In one possible implementation, the two ends of the drive circuit extend along a second direction in the length direction. In the same group of drive circuits, all drive circuits are distributed along a first direction. Thus, the drive circuits are formed along the length or width direction of the substrate, making it easier to control the forming direction of the drive circuits during formation, thus facilitating the formation of the drive circuits on the substrate. Furthermore, the distribution of all drive circuits in the same group along the first direction facilitates the arrangement of a large number of drive circuits within a single group, making it easier to implement the arrangement of drive circuits in high-resolution image forming equipment.

[0012] In one possible implementation, the driving circuit includes a first end, which is one end of the driving circuit along its length. The first ends of the driving circuits located on the same side of the light source array in the first direction have the same orientation. In the same group of driving circuits, the first ends of the driving circuits located on the same side of the light source array in the first direction are arranged in a straight line along the first direction. Thus, the size of the driving circuit group in the second direction is smaller.

[0013] In one possible implementation, the electrical connection line includes a circuit connection segment, which is a straight line extending at both ends along a second direction, with one end of the circuit connection segment connected to the driving circuit. This facilitates ensuring that the projection of the electrical connection line in the thickness direction of the substrate does not intersect with the projections of all the driving circuits in the thickness direction of the substrate.

[0014] In one possible implementation, the driving circuit includes a first end, which is one end along the length of the driving circuit. The first ends of the driving circuits located on the same side of the light source array in the first direction have the same orientation. In the same group of driving circuits, the first ends of the driving circuits located on the same side of the light source array in the first direction, away from the light source array, protrude beyond the first ends of the driving circuits closer to the light source array. Thus, the driving circuit can be connected to the electrical connection lines by means of the side facing the light source array, which reduces the space required for the circuit connection segment in the second direction. This allows for the arrangement of driving circuits with a larger size in the second direction. When the space for arranging the driving circuit group and its electrical connection lines is fixed in the second direction, the size requirements for the driving circuit can be reduced.

[0015] In one possible implementation, the electrical connection line includes a circuit connection segment, which is a straight line extending at both ends along a first direction, and one end of the circuit connection segment is connected to a driving circuit. Thus, compared to a solution where the circuit connection segment is a straight line extending at both ends along a second direction, the corners of the electrical connection line's projection in the thickness direction of the substrate can be reduced, resulting in lower process requirements for forming the electrical connection line and making its formation easier. Furthermore, the electrical connection line can be shorter, leading to lower resistance and less current loss when current flows through it.

[0016] In one possible implementation, the two ends of the driving circuit extend along a third direction along its length. Within the same group of driving circuits, the driving circuits located on the same side of the light source array in the first direction are arranged along a fourth direction. Both the third and fourth directions are perpendicular to the thickness direction of the substrate, and both are inclined relative to the second direction, with the fourth direction perpendicular to the third direction. This allows for a smaller spacing between adjacent groups of driving circuits along their length, enabling more flexible arrangement of the driving circuit array.

[0017] In one possible implementation, the light source array comprises multiple rows of light sources distributed along a first direction, each row including a light source. This allows for a reduction in the number of light sources per row while maintaining the same resolution, enabling the arrangement of larger light sources and improving their brightness. Furthermore, the smaller size of the light source array in the second direction allows for a smaller size of the light-emitting module in that direction.

[0018] In one possible implementation, the multiple rows of light sources in the light source group include adjacent first and second light source rows, each containing a light source. Within the same light source group, the light sources of the first and second light source rows are staggered in a second direction. Thus, after the first light source row emits light, simply rotating the photosensitive drum to activate the second light source row allows for exposure imaging while maintaining constant resolution, simplifying the exposure imaging operation.

[0019] In one possible implementation, the multiple rows of light sources in the light source group include adjacent third and fourth light source rows, each comprising multiple light sources arranged in a straight line along a second direction. Within the same light source group, the light sources of the third and fourth light source rows are symmetrically arranged with respect to a plane of symmetry located between them, wherein the plane of symmetry is a plane perpendicular to the first direction. Thus, the size of the light source array in the second direction is smaller, allowing the light-emitting module to also be smaller in the second direction.

[0020] In one possible implementation, the projections of any two electrical connection lines in the thickness direction of the substrate do not intersect. Thus, compared to two electrical connection lines whose projections in the thickness direction intersect, the two electrical connection lines are less likely to experience parasitic capacitance at the intersection, which could affect the light source driving. Furthermore, all electrical connection lines can be routed in the same layer of the semiconductor thin film structure, reducing the number of processes involved in forming the semiconductor thin film structure, resulting in a simpler and lower-cost process.

[0021] In one possible implementation, the projection of each electrical connection line in the thickness direction of the substrate does not intersect with the projections of all driving circuits in the thickness direction of the substrate. Thus, for electrical connection lines whose projections in the thickness direction of the substrate intersect with the projections of the driving circuits in the thickness direction of the substrate, the parasitic capacitance generated between the driving circuits and the electrical connection lines due to the intersection of their projections in the thickness direction of the substrate is less likely to affect the light source driving. Furthermore, it facilitates the routing of electrical connection lines through the structural layer containing the driving circuits, reducing the process of forming the semiconductor thin film structure, making the process of forming the semiconductor thin film structure simpler and less costly.

[0022] In one possible implementation, the projection of the electrical connection line in the thickness direction of the substrate is a straight line extending from both ends along a first direction. Thus, the projection of the electrical connection line in the thickness direction of the substrate has no corners, reducing the process requirements for forming the electrical connection line and making its formation easier. Furthermore, the length of the electrical connection line can be shorter, resulting in lower resistance and less current loss when current flows through it.

[0023] In one possible implementation, the driving circuit is formed on a substrate using semiconductor technology. This allows for higher precision in the formed driving circuit and facilitates the formation of a smaller driving circuit.

[0024] In one possible implementation, the light-emitting module includes a first temperature zone and a second temperature zone separated by a preset isotherm. The driving circuit array is located in the first temperature zone, and the light source array is located in the second temperature zone. The preset isotherm is the isotherm at a preset temperature when the light source array emits light at its highest power. The preset temperature is the temperature of the light-emitting module and is less than or equal to 60°C. This design minimizes the impact of heat generated by the light source on the driving circuit.

[0025] In one possible implementation, the resistance of each electrical connection line is the same. Thus, the resistance between each driving circuit and its corresponding light source is identical, resulting in better uniformity of light emission from the light-emitting module.

[0026] A second aspect of this application provides a printhead, which includes a housing, a lens assembly, and a light-emitting module as described in any of the above embodiments. The light-emitting module is disposed within the housing, and the substrate of the light-emitting module is connected to the housing. The housing has a light-emitting aperture located on the light-emitting side of the light source array of the light-emitting module, and the lens assembly is disposed at the light-emitting aperture.

[0027] A third aspect of this application provides an image forming apparatus, which includes a body and a light-emitting module as described in any of the above embodiments. The substrate of the light-emitting module is disposed on the body.

[0028] In some possible implementations, the image forming apparatus includes a printhead. The printhead includes a housing, a lens assembly, and a light-emitting module. The housing is mounted on a main body, the light-emitting module is disposed within the housing, and a substrate is connected to the housing. The housing has a light-emitting aperture located on the light-emitting side of the light source array of the light-emitting module, and the lens assembly is disposed at the light-emitting aperture. Attached Figure Description

[0029] Figure 1 is a schematic diagram of an image forming apparatus provided in an embodiment of this application;

[0030] Figure 2 is a schematic diagram of a printhead provided in an embodiment of this application;

[0031] Figure 3 is a schematic diagram of the cooperation between a printhead and a photosensitive drum provided in an embodiment of this application;

[0032] Figure 4 is a schematic diagram of another printhead provided in an embodiment of this application;

[0033] Figure 5 is a schematic diagram of another printhead provided in an embodiment of this application;

[0034] Figure 6 is a schematic diagram of the electrical connections of a light-emitting module provided in an embodiment of this application;

[0035] Figure 7 is a schematic diagram of a light-emitting module provided in an embodiment of this application;

[0036] Figure 8 is a schematic diagram of the arrangement of a light source array and a driving circuit array in the direction perpendicular to the thickness of the substrate according to an embodiment of this application.

[0037] Figure 9 is a schematic diagram of the arrangement of a light source array and a driving circuit array in the direction perpendicular to the thickness of the substrate according to another embodiment of this application.

[0038] Figure 10 is a schematic diagram of the arrangement of a light source array and a driving circuit array in the direction perpendicular to the thickness of the substrate according to another embodiment of this application.

[0039] Figure 11 is a schematic diagram of the arrangement of a light source array and a driving circuit array in the direction perpendicular to the thickness of the substrate according to another embodiment of this application.

[0040] Figure 12 is a schematic diagram of the arrangement of a light source array and a driving circuit array in the direction perpendicular to the thickness of the substrate according to another embodiment of this application.

[0041] Figure 13 is a schematic diagram of a light-emitting module provided in an embodiment of this application on one side in the second direction;

[0042] Figure 14 is a schematic diagram of the arrangement of a light source array and a driving circuit array in the direction perpendicular to the thickness of the substrate according to another embodiment of this application.

[0043] Figure 15 is a schematic diagram of the arrangement of a light source array and a driving circuit array in the direction perpendicular to the thickness of the substrate according to another embodiment of this application.

[0044] Figure 16 is a schematic diagram of the arrangement of a light source array and a driving circuit array in a direction perpendicular to the thickness of the substrate according to another embodiment of this application.

[0045] Figure 17 is a schematic diagram of the arrangement of a light source array and a driving circuit array in the direction perpendicular to the thickness of the substrate according to another embodiment of this application.

[0046] Figure 18 is a schematic diagram of the arrangement of a light source array and a driving circuit array in the direction perpendicular to the thickness of the substrate according to another embodiment of this application.

[0047] Figure 19 is a schematic diagram of the arrangement of a light source array and a driving circuit array in the direction perpendicular to the thickness of the substrate according to another embodiment of this application.

[0048] Explanation of reference numerals in the attached diagram: 1. Printhead; 2. Body; 3. Photosensitive drum; 4. Charging roller; 5. Ink cartridge; 6. Developing roller; 7. Pressure roller; 8. Transfer roller; 9. Waste toner container; 10. Light-emitting module; 20. Housing; 21. Light emission hole; 30. Lens group; 31. Microlens; 40. Light-absorbing layer; 100. Substrate; 200. Light source array; 210. Light source group; 211. Light source row; 211a. First light source row; 211b. Second light source row; 211c. Third light source row; 211d. Fourth light source row; 2111. Light source; 300. Drive circuit array; 310. Drive circuit group; 310a. First sub-drive circuit group; 310b. Second sub-drive circuit group; 311. Drive circuit; 3111. First terminal; 3112. Second terminal; 400, Driver chip; 500, Circuit board; 600, Semiconductor thin film structure; L1, Electrical connection line; L11, Circuit connection segment; L12, Light source connection segment; L13, Jumper segment; L2, Data line; L3, Scan line; L4, Positive voltage line of light source; L5, Negative voltage line of light source; p, Paper; t, Isotherm of preset temperature; Q1, First temperature zone; Q2, Second temperature zone; m, Symmetry plane; x, Paper feed direction; a1, First direction; a2, Second direction; a3, Third direction; a4, Fourth direction; b, Thickness direction of substrate. Detailed Implementation

[0049] The terminology used in the implementation section of this application is only for explaining specific embodiments of this application and is not intended to limit this application. The implementation of the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0050] This application provides an image forming apparatus, which may include, but is not limited to, a printer, copier, fax machine, display device, etc. The display device may include, but is not limited to, a monitor, electronic notebook, electronic dictionary, e-book, electronic tag, electronic bulletin board, etc., any device capable of displaying images.

[0051] Those skilled in the art will understand that a printer refers to a device with printing capabilities, a copier refers to a device with copying capabilities, and a fax machine refers to a device with faxing capabilities. For example, an all-in-one machine that integrates printing, copying, and faxing functions can be called a printer, a copier, or a fax machine.

[0052] In this embodiment, the image forming apparatus includes a body and a light-emitting module. The light-emitting module is disposed on the body and includes a light source array. The image forming apparatus can use the light emitted by the light source array to form an image.

[0053] The following explanation uses a printer as an example of an image forming device.

[0054] Figure 1 is a schematic diagram of an image forming apparatus provided in an embodiment of this application. In the figure, the x-direction is the paper feeding direction.

[0055] As shown in Figure 1, the image forming apparatus provided in this application embodiment may include a body 2, a printhead 1, a charging roller 4, a photosensitive drum 3, a developing roller 6, an ink cartridge 5, a transfer roller 8, a pressure roller 7, and a waste toner container 9. The printhead 1, charging roller 4, photosensitive drum 3, developing roller 6, ink cartridge 5, transfer roller 8, pressure roller 7, and waste toner container 9 are all disposed within the body 2. The charging roller 4, photosensitive drum 3, developing roller 6, transfer roller 8, and pressure roller 7 may be arranged in parallel. The axial directions of the charging roller 4, photosensitive drum 3, developing roller 6, transfer roller 8, and pressure roller 7 are all perpendicular to the paper feeding direction of the paper p to be printed.

[0056] A charging roller 4 is positioned close to the photosensitive drum 3 and is used to charge the photosensitive drum 3 so that its surface carries a positive charge. A printhead 1 is positioned close to the photosensitive drum 3 and is located downstream of the charging roller 4 in the rotation direction of the photosensitive drum 3. The printhead 1 is used to selectively expose the charged photosensitive drum 3. As the photosensitive drum 3 rotates, the light emitted by the printhead 1 sweeps across its surface. The potential of the exposed portion of the photosensitive drum 3 decreases, while the unexposed portion remains at a high potential, thus forming an electrostatic latent image on the surface of the photosensitive drum 3. A developing roller 6 is positioned between the photosensitive drum 3 and the ink cartridge 5, downstream of the printhead 1 in the rotation direction of the photosensitive drum 3. The developing roller 6 can rotate with the photosensitive drum 3, carrying charged toner from the ink cartridge 5. As the photosensitive drum 3 rotates, the charged toner is attracted from the developing roller 6 to the low-potential electrostatic latent image on the surface of the photosensitive drum 3, thereby developing the electrostatic latent image into a toner image. The transfer roller 8 is positioned close to the photosensitive drum 3 and downstream of the developing roller 6 in the rotation direction of the photosensitive drum 3. Through the cooperation of the rotating photosensitive drum 3 and the transfer roller 8, the toner on the surface of the photosensitive drum 3 can be transferred onto the paper p. The pressure roller 7 is positioned downstream of the transfer roller 8 in the paper feeding direction. The paper p with toner transferred onto it moves to the pressure roller 7, where it is heated and the toner is solidified on the surface of the paper p, completing the fixing process and enabling image printing. The waste toner bin 9 is positioned close to the photosensitive drum 3 and downstream of the transfer roller 8 in the rotation direction of the photosensitive drum 3. After the transfer is completed, the photosensitive drum 3 continues to rotate, carrying excess toner from its surface to the waste toner bin 9 for recycling.

[0057] Figure 2 is a schematic diagram of a printhead provided in an embodiment of this application, and Figure 3 is a schematic diagram of the cooperation between a printhead and a photosensitive drum provided in an embodiment of this application.

[0058] As shown in Figures 2 and 3, in this embodiment, the printhead 1 includes a housing 20, a lens group 30, and a light-emitting module 10. The housing 20 is disposed on the body 2, and the light-emitting module 10 is disposed inside the housing 20. The light-emitting module 10 includes a substrate 100 and a light source array 200. The substrate 100 is connected to the housing 20, and the light source array 200 is disposed on one side of the substrate 100 in the thickness direction. The light source array 200 emits light in a direction away from the substrate 100; that is, the side of the light source array 200 away from the substrate 100 is the light-emitting side of the light source array 200. The housing 20 has a light-emitting hole 21, which is located on the light-emitting side of the light source array 200. The light-emitting hole 21 is used to allow the light emitted by the light source array 200 to exit the housing 20. The lens group 30 is disposed at the light-emitting hole 21 and can block the light-emitting hole 21. The photosensitive drum 3 is located on the light-emitting side of the light source array 200. The light emitted by the light source array 200 is focused by the lens group 30 and then irradiates the surface of the photosensitive drum 3 to achieve selective exposure of the photosensitive drum 3.

[0059] The housing 20 can be a strip structure with both ends extending along the axial direction of the photosensitive drum 3 in the length direction, and the light outlet 21 can be a strip hole with both ends extending along the axial direction of the photosensitive drum 3 in the length direction.

[0060] For example, the housing 20 can be a cuboid structure, and the light-emitting hole 21 can be located on the surface where the long side and the wide side of the housing 20 are located.

[0061] For example, the lens group 30 can be inserted into the light outlet 21, and a portion of the lens group 30 can extend to the outside of the housing 20.

[0062] For example, the lens group 30 may be disposed on the surface of the housing 20.

[0063] In some examples, the printhead 1 also includes a light-absorbing layer 40 disposed on the inner wall of the housing 20. The light-absorbing layer 40 is used to absorb scattered light within the housing 20. By providing the light-absorbing layer 40, scattered light emitted by the light source array 200 that illuminates the portion outside the lens group 30 can be absorbed, preventing the scattered light from being reflected by the housing 20 and illuminating the photosensitive drum 3, thus preventing interference with imaging. The light-absorbing layer 40 can be attached to the inner surface of the housing 20 and can be a polymer film, metal film, ceramic film, etc.

[0064] Figure 4 is a schematic diagram of another printhead provided in an embodiment of this application.

[0065] For example, the lens group 30 includes a plurality of microlenses 31 arranged in a row along the axial direction of the photosensitive drum 3.

[0066] Figure 5 is a schematic diagram of another printhead provided in an embodiment of this application.

[0067] As shown in Figure 5, the lens group 30 may include multiple rows of microlens arranged along the width direction of the housing 20. Each row of microlens may include multiple microlenses 31 arranged in a row along the axial direction of the photosensitive drum 3. The width direction of the housing 20 is perpendicular to the axial direction of the photosensitive drum 3 and perpendicular to the thickness direction of the substrate 100.

[0068] Those skilled in the art will understand that in the embodiments of this application, "many" refers to a quantity greater than or equal to 2. For example, "multiple rows" refers to more than or equal to 2 rows, and "multiple" refers to more than or equal to 2.

[0069] Printhead 1 does not specifically refer to the device in a printer used for exposure to form an image. In addition to printers, other devices that can form images through exposure, such as copiers and fax machines, can also include printhead 1.

[0070] Figure 6 is a schematic diagram of the electrical connection of a light-emitting module provided in an embodiment of this application, and Figure 7 is a schematic diagram of a light-emitting module provided in an embodiment of this application. In the figures, direction a1 is the first direction, direction a2 is the second direction, and direction b is the thickness direction of substrate 100. Both the first and second directions are perpendicular to the thickness direction of substrate 100, and the first direction is perpendicular to the second direction.

[0071] As shown in Figures 6 and 7, the light-emitting module 10 also includes a driving circuit array 300. The light source array 200 includes multiple light sources 2111, and the driving circuit array 300 includes multiple driving circuits 311 corresponding to the multiple light sources 2111. The light sources 2111 are electrically connected to the corresponding driving circuits 311 through electrical connection lines L1. The driving circuits 311 can be used to generate driving current to drive the corresponding light sources 2111 to emit light.

[0072] The substrate 100 has a strip-shaped structure. The length direction of the substrate 100 is the same as the length direction of the housing 20, and the width direction of the substrate 100 is the same as the width direction of the housing 20. That is, the two ends of the length direction of the substrate 100 extend along the axial direction of the photosensitive drum 3, and the two ends of the width direction of the substrate 100 extend in a direction perpendicular to the axial direction of the photosensitive drum 3.

[0073] For example, each light source 2111 in the light source array 200 is the same light source 2111, and each driving circuit 311 in the driving circuit array 300 is the same driving circuit 311. In this way, the uniformity of light emission from the light source 2111 of the light-emitting module 10 can be improved.

[0074] The light source array 200 includes a plurality of light sources 2111 distributed along the length direction of the substrate 100.

[0075] For example, substrate 100 can be a rectangular plate.

[0076] For example, the light source 2111 may include, but is not limited to, inorganic light-emitting diodes (LEDs), organic light-emitting diodes (OLEDs), mini organic light-emitting diodes (Mini LEDs), micro light-emitting diodes (Micro LEDs), etc.

[0077] For example, the driving circuit 311 may include, but is not limited to, a thin film transistor (TFT) driving circuit, a metal oxide semiconductor (MOS) driving circuit, a complementary metal oxide semiconductor (CMOS) driving circuit, etc.

[0078] In some examples, the drive circuit 311 may also have one or more of the following functions: data writing, reset, compensation, etc.

[0079] The light-emitting module 10 may include a semiconductor thin-film structure 600, which is formed on one side of the substrate 100 in the thickness direction. The semiconductor thin-film structure 600 may include a driving circuit array 300 and electrical connection lines L1. The semiconductor thin-film structure 600 is a structure formed on the substrate 100 based on semiconductor technology. That is, the driving circuit 311 and electrical connection lines L1 can be formed on the substrate 100 based on semiconductor technology. In this way, the formed driving circuit 311, electrical connection lines L1 and other structures have high precision, which facilitates the formation of small-sized microstructures such as driving circuit 311 and electrical connection lines L1 on the substrate 100.

[0080] The semiconductor thin film structure 600 includes a multilayer structure stacked along the thickness direction of the substrate.

[0081] In some examples, the light source 2111 can be attached to the side of the semiconductor thin film structure 600 away from the substrate 100. In this case, the semiconductor thin film structure 600 may not include the light source 2111.

[0082] In other examples, the semiconductor thin film structure 600 may include a light source 2111, that is, the light source 2111 may be formed on the substrate 100 based on semiconductor processes.

[0083] The light-emitting module 10 also includes a driver chip 400, and each driver circuit 311 is electrically connected to the driver chip 400 via a corresponding data line L2. The driver chip 400 can be used to generate a drive signal to control the light source 2111 to emit light according to a target brightness, and send the drive signal to the driver circuit 311 corresponding to the light source 2111. The driver circuit 311 generates a drive current to drive the light source 2111 to emit light according to the target brightness based on the drive signal.

[0084] The light-emitting module 10 also includes a circuit board 500. Each driving circuit 311 is electrically connected to the circuit board 500 through the corresponding positive voltage line L4 (VDD) of the light-emitting power supply, and each light source 2111 is electrically connected to the circuit board 500 through the negative voltage line L5 (VSS) of the light-emitting power supply, so that a loop can be formed between the circuit board 500, the driving circuit 311 and the corresponding light source 2111.

[0085] For example, circuit board 500 can be a flexible printed circuit board (FPC).

[0086] The circuit board 500 is electrically connected to the controller (not shown), and the circuit board 500 is electrically connected to the drive circuit array 300 through the scan line L3, so that the controller can send scan signals to the drive circuit array 300 through the circuit board 500 and the scan line L3 to realize that the light sources 2111 of the light source array 200 emit light in sequence.

[0087] The circuit board 500 is also electrically connected to the driver chip 400, so that the controller is electrically connected to the driver chip 400 through the circuit board 500. For example, the driver chip 400 can be disposed on the circuit board 500 or on the substrate 100.

[0088] The controller can send a brightness control signal to the driver chip 400 through the circuit board 500, and the driver chip 400 can generate a drive signal based on the brightness control signal.

[0089] For example, the brightness control signal can be a digital signal, and the drive signal can be an analog signal.

[0090] For example, the brightness control signal and the drive signal can be voltage signals, or they can be current signals.

[0091] The semiconductor thin film structure 600 may include a data line L2, a scan line L3, a positive voltage line for light emission L4, and a negative voltage line for light emission L5. In other words, the data line L2, the scan line L3, the positive voltage line for light emission L4, and the negative voltage line for light emission L5 can all be formed on the substrate 100 based on semiconductor technology.

[0092] In related technologies, the light source and the corresponding driving circuit are often arranged overlappingly in the thickness direction of the substrate. That is, the projection of the light source along the thickness direction of the substrate and the projection of the corresponding driving circuit along the thickness direction of the substrate at least partially overlap.

[0093] In related technologies, since the distance between the light source and the driving circuit in the thickness direction of the substrate is often small, the heat generated by the light source can easily affect the driving circuit, causing the performance of the driving circuit to drift or fail, which in turn affects the performance and lifespan of the light-emitting module.

[0094] Furthermore, in related technologies, because the driving circuit and the corresponding light source are overlapped in the thickness direction of the substrate, the size of the driving circuit is limited by the center distance between two adjacent light sources in the light source array. This places high demands on the size of the driving circuit. Specifically, when the size of the driving circuit is larger than the center distance between two adjacent light sources in the light source array, it is difficult to arrange the driving circuit one-to-one at each overlapping position of the light sources in the light source array. For high-resolution image forming equipment, the center distance between two adjacent light sources in the light source array is small. For example, for an image forming equipment with a resolution of 1200 dpi, the center distance between two adjacent light sources in the light source array is only 21.16 μm. However, when the substrate is a glass substrate, the size of the resulting driving circuit is often large due to limitations in the structural forming process and inspection process on the glass substrate, making it difficult to arrange in high-resolution image forming equipment. For example, when the substrate is a glass substrate, it is difficult to form a driving circuit with a size less than or equal to 21.16 μm. For an image forming equipment with a resolution of 1200 dpi, it is difficult to arrange the driving circuit formed on the glass substrate one-to-one with the light sources in the light source array. For high-resolution image forming equipment, in order to ensure that the driving circuits can be arranged one-to-one with the light sources in the light source array, the driving circuits often need to be fabricated on a silicon substrate to form a smaller driving circuit. In other words, a silicon substrate is required. However, using a silicon substrate increases the cost of the light-emitting module. Therefore, in related technologies, for high-resolution image forming equipment, there are significant limitations on the selection of the substrate for the light-emitting module, resulting in a higher cost for the light-emitting module.

[0095] Figure 8 is a schematic diagram of the arrangement of a light source array and a driving circuit array in the direction perpendicular to the thickness of the substrate according to an embodiment of this application.

[0096] As shown in Figure 8 and referring to Figure 7, in this embodiment of the application, the driving circuit array 300 is disposed to the side of the light source array 200 in the first direction, and the interval between the driving circuit array 300 and the light source array 200 in the first direction is greater than 0. That is, the projection of the driving circuit array 300 in the thickness direction of the substrate 100 does not coincide with the projection of the light source array 200 in the thickness direction of the substrate 100, and the interval between the projection of the driving circuit array 300 in the thickness direction of the substrate 100 and the projection of the light source array 200 in the thickness direction of the substrate 100 in the first direction is greater than 0.

[0097] The substrate 100 has a relatively large dimension in the length and width directions. This allows for a larger spacing between the driving circuit array 300 and the light source array 200, thereby reducing the impact of heat generated by the light source 2111 on the driving circuit 311. This makes the performance of the driving circuit 311 less prone to drift or failure, helping to maintain the performance of the light-emitting module 10 and extending its lifespan. Furthermore, since the driving circuit array 300 is positioned to the side of the light source array 200 in the first direction, the size of the driving circuit 311 is no longer limited by the center-to-center distance between two adjacent light sources 2111 in the light source array 200. In other words, the size of the driving circuit 311 can be larger than the center-to-center distance between two adjacent light sources 2111 in the light source array 200, thus lowering the size requirements for the driving circuit 311. In the embodiments of this application, even for high-resolution image forming equipment, a glass substrate or similar material can be used as the substrate 100 of the light-emitting module 10. This reduces the selection restrictions on the substrate 100 of the light-emitting module 10, facilitating the use of lower-cost substrates to manufacture the light-emitting module 10 and reducing its cost.

[0098] In some possible implementations, the substrate 100 is a glass substrate, which has a lower cost and helps to reduce the cost of the light-emitting module 10.

[0099] In some possible implementations, the light-emitting module 10 includes a first temperature zone Q1 and a second temperature zone Q2 separated by a preset isotherm. The second temperature zone Q2 is the area within the region enclosed by the preset isotherm, and the first temperature zone Q1 is the area outside the region enclosed by the preset isotherm. The driving circuit array 300 is located in the first temperature zone Q1, and the light source array 200 is located in the second temperature zone Q2. The preset isotherm is the isotherm t of a preset temperature when the light source array 200 emits light at its highest power. The preset temperature is the temperature of the light-emitting module 10, and the preset temperature is less than or equal to 60°C. When the light source array 200 emits light at its highest power, the temperature of the first temperature zone Q1 is lower than the preset temperature, and the temperature of the second temperature zone Q2 is higher than the preset temperature.

[0100] In this way, the driving circuit 311 is less affected by the heat generated by the light source 2111.

[0101] The preset isotherm, the first temperature zone Q1, and the second temperature zone Q2 can be obtained by performing thermal simulation on the light-emitting module 10 when the light source array 200 emits light at the highest power.

[0102] For example, the preset temperature can be 60℃, 55℃, 50℃, 45℃, 40℃, 35℃, etc.

[0103] In some examples, the first direction can be the width direction of the substrate 100, that is, the first direction can be perpendicular to the axis of the photosensitive drum 3. In this case, the second direction is the length direction of the substrate 100.

[0104] In this way, the substrate 100 has a large space on both sides of the light source array 200 in the first direction, and the substrate 100 has a large space available for arranging the driving circuit array 300, which facilitates the arrangement of a large number of driving circuits 311 on the substrate 100.

[0105] In other examples, the first direction can be the length direction of the substrate 100, that is, the first direction can be the axial direction of the photosensitive drum 3, and in this case, the second direction is the width direction of the substrate 100.

[0106] As shown in Figures 7 and 8, in some examples, the light source array 200 includes a plurality of light sources 2111 distributed along a second direction. In the second direction, at least a portion of the driving circuit array 300 is located between the two ends of the light source array 200.

[0107] In this way, the positions of the driving circuit array 300 and the light source array 200 in the second direction at least partially overlap, which is beneficial to reducing the size of the light-emitting module 10 in the second direction.

[0108] In some possible implementations, the light source array 200 includes n groups of light sources 210 distributed along a second direction, and the driving circuit array 300 includes n groups of driving circuits 310 distributed along the second direction. Each group of driving circuits 310 corresponds to a group of light sources 210, and each group of driving circuits 310 is used to drive the corresponding group of light sources 210 to emit light. In the second direction, at least a portion of the driving circuit group 310 is located between the two ends of the corresponding group of light sources 210.

[0109] The light source group 210 includes a plurality of light sources 2111 distributed along the second direction. The driving circuit group 310 includes a plurality of driving circuits 311 corresponding one-to-one with the plurality of light sources 2111 in the corresponding light source group 210. Each driving circuit 311 in the driving circuit group 310 is electrically connected to a corresponding light source 2111 in the corresponding light source group 210 through an electrical connection line L1. Each driving circuit 311 in the driving circuit group 310 is used to drive a corresponding light source 2111 in the corresponding light source group 210 to emit light. Here, n is an integer greater than or equal to 2.

[0110] In this way, when there are a large number of driving circuits 311, multiple groups of driving circuit groups 310 can be arranged in groups using the size of the substrate 100 in the second direction, which helps to reduce the size of the light-emitting module 10 in the first direction.

[0111] The number of light sources 2111 in the light source group 210 can be adjusted according to the size of the drive circuit 311 in the second direction.

[0112] For example, all the drive circuit groups 310 are arranged in a straight line along the second direction, and all the light source groups 210 are arranged in a straight line along the second direction. In this way, the exposure imaging operation is relatively simple.

[0113] In some possible implementations, all the driving circuits 311 are located on the same side of the light source array 200 in the first direction, that is, the driving circuit array 300 is arranged on one side of the light source array 200 in the first direction.

[0114] In this way, compared with the scheme where the light source array 200 has driving circuits 311 arranged on both sides of the first direction, the driving circuit 311 has less impact on the routing of data lines L2, scan lines L3, positive voltage lines of light source L4, negative voltage lines of light source L5, etc., and the routing of data lines L2, scan lines L3, positive voltage lines of light source L4, negative voltage lines of light source L5, etc. is easier.

[0115] In some examples where all the driving circuits 311 are located on the same side of the light source array 200 in a first direction, the light source array 200 is located between the driving chip 400 and the driving circuit array 300 in the first direction.

[0116] This makes it easier to position the light source array 200 in the middle of the substrate 100 in the first direction, and the light source array 200 is less likely to be damaged due to accidental contact.

[0117] In some other examples, all the drive circuits 311 are located on the same side of the light source array 200 in the first direction, where the drive circuit array 300 is located between the light source array 200 and the drive chip 400 in the first direction.

[0118] This makes the wiring of data lines such as L2 connecting the driver chip 400 and the driver circuit 311 easier.

[0119] Figure 9 is a schematic diagram of the arrangement of a light source array and a driving circuit array in the direction perpendicular to the thickness of the substrate according to another embodiment of this application.

[0120] As shown in Figure 9, in some possible embodiments, driving circuits 311 are provided on both sides of the light source array 200 in the first direction. This facilitates placing the light source array 200 at the middle position of the substrate 100 in the first direction.

[0121] In some examples where the driving circuit array 300 includes n groups of driving circuit groups 310 distributed along the second direction, the driving circuit group 310 includes a first sub-driving circuit group 310a and a second sub-driving circuit group 310b. The first sub-driving circuit group 310a and the second sub-driving circuit group 310b are located on both sides of the light source array 200 in the first direction, respectively. Both the first sub-driving circuit group 310a and the second sub-driving circuit group 310b include driving circuits 311. The number of light sources 2111 in the light source group 210 is equal to the sum of the number of driving circuits 311 in the first sub-driving circuit group 310a and the second sub-driving circuit group 310b of the corresponding driving circuit group 310.

[0122] In some possible implementations, each group of light sources 2110 has m light sources 2111, where m is an integer greater than or equal to 2. That is, the number of light sources 2111 in each group of light sources 210 is the same, and the number of drive circuits 311 in each group of drive circuits 310 is the same.

[0123] This makes it easier to achieve the same arrangement of the drive circuits 311 in each drive circuit group 310, so that the parasitic capacitance generated by different drive circuit groups 310 is not different due to the different number of drive circuits 311 in different drive circuit groups 310, and the uniformity of the light source 2111 of the light-emitting module 10 can be better.

[0124] For example, each group of driving circuits 310 and its corresponding light source group 210 are in the same relative position. In this way, the difference in the relative position of different driving circuit groups 310 and their corresponding light source groups 210 will not easily lead to different parasitic capacitances between them, thus ensuring better uniformity of light emission from the light source 2111 of the light-emitting module 10.

[0125] For example, the driving circuits 311 in each group of driving circuits 311 are arranged in the same way. In this way, it is not easy for different driving circuit groups 310 to have different parasitic capacitances due to different arrangements of the driving circuits 311, and the light source 2111 of the light-emitting module 10 can emit light with better uniformity.

[0126] In some possible implementations, the resistance of each electrical connection line L1 is the same.

[0127] In this way, the resistance between each driving circuit 311 and the corresponding light source 2111 is the same, which can make the light emission of the light source 2111 of the light-emitting module 10 more uniform.

[0128] The resistance of each electrical connection line L1 can be made the same by making the current-carrying cross section of the electrical connection line L1 the same as the product of the electrical connection lines L1.

[0129] For example, if the thickness of electrical connection lines L1 is the same, the resistance of each electrical connection line L1 can be made the same by making the product of the length of electrical connection line L1 and the line width of electrical connection line L1 the same.

[0130] Figure 10 is a schematic diagram of the arrangement of a light source array and a driving circuit array in the direction perpendicular to the thickness of the substrate according to another embodiment of this application.

[0131] As shown in Figure 10, the driving circuit 311 includes a first end 3111 and a second end 3112. The first end 3111 and the second end 3112 are located at the two ends of the driving circuit 311 along its length. The first end 3111 of the driving circuit 311 located on the same side of the light source array 200 in the first direction has the same orientation, and the second end 3112 of the driving circuit 311 located on the same side of the light source array 200 in the first direction has the same orientation.

[0132] In some possible implementations, the two ends of the drive circuit 311 extend along a second direction in the longitudinal direction; that is, the first end 3111 and the second end 3112 of the drive circuit 311 are spaced apart in the second direction. In the same group of drive circuits 310, all the drive circuits 311 are distributed along the first direction.

[0133] In this way, the driving circuit 311 is formed along the length or width direction of the substrate 100, making it easier to control the forming direction of the driving circuit 311 during its formation, thus facilitating its formation on the substrate 100. Furthermore, all the driving circuits 311 in the same group of driving circuits 310 are distributed along the first direction, which facilitates the arrangement of a larger number of driving circuits 311 within a single group of driving circuits 310, and makes it easier to implement the arrangement of driving circuits 311 in a high-resolution image forming apparatus.

[0134] In some examples where both ends of the drive circuit 311 extend along the second direction and all drive circuits 311 in the same group of drive circuits 310 are distributed along the first direction, the first ends 3111 of the drive circuits 311 located on the same side of the light source array 200 in the first direction are arranged in a straight line along the first direction. Thus, the size of the drive circuit group 310 in the second direction is smaller.

[0135] When the first end 3111 of the driving circuit 311 located on the same side of the light source array 200 in the first direction in the same driving circuit group 310 is arranged in a straight line along the first direction, the second end 3112 of the driving circuit 311 located on the same side of the light source array 200 in the first direction in the same driving circuit group 310 is also arranged in a straight line along the first direction.

[0136] In some possible implementations, the projections of any two electrical connection lines L1 in the thickness direction of the substrate 100 do not intersect.

[0137] Thus, compared to the two electrical connection lines L1 whose projections intersect in the thickness direction of the substrate 100, the two electrical connection lines L1 are less likely to generate parasitic capacitance at the point of intersection in the thickness direction of the substrate 100, thereby affecting the driving of the light source 2111. Furthermore, all electrical connection lines L1 can be routed in the same layer of the semiconductor thin film structure 600, reducing the fabrication process of the semiconductor thin film structure 600 and making the fabrication process simpler and less costly.

[0138] In some possible implementations, the projection of each electrical connection line L1 in the thickness direction of the substrate 100 does not intersect with the projection of all the drive circuits 311 in the thickness direction of the substrate 100.

[0139] Thus, relative to the electrical connection line L1 whose projection in the thickness direction of the substrate 100 intersects with the projection of the driving circuit 311 in the thickness direction of the substrate 100, the parasitic capacitance generated between the driving circuit 311 and the electrical connection line L1 due to the intersection of their projections in the thickness direction of the substrate 100 is less likely to affect the driving of the light source 2111. Furthermore, it facilitates the routing of the electrical connection line L1 through the structural layer containing the driving circuit 311, reducing the fabrication process for the semiconductor thin film structure 600, making the process for forming the semiconductor thin film structure 600 simpler and less costly.

[0140] The electrical connection line L1 includes a circuit connection section L11 and a light source connection section L12. One end of the circuit connection section L11 is connected to the drive circuit 311, and the other end of the circuit connection section L11 is connected to the light source 2111 through the light source connection section L12.

[0141] In some examples, the circuit connection segment L11 is a straight line extending at both ends along the second direction. This facilitates ensuring that the projection of the electrical connection line L1 in the thickness direction of the substrate 100 does not intersect with the projections of all the drive circuits 311 in the thickness direction of the substrate 100.

[0142] Figure 11 is a schematic diagram of the arrangement of a light source array and a driving circuit array in the direction perpendicular to the thickness of the substrate according to another embodiment of this application.

[0143] As shown in Figure 11, in some examples where both ends of the drive circuit 311 extend along the second direction and all drive circuits 311 in the same group of drive circuits 310 are distributed along the first direction, in the same group of drive circuits 310, the first end 3111 of the drive circuit 311 located on the same side of the light source array 200 in the first direction, away from the light source array 200, protrudes beyond the first end 3111 of the drive circuit 311 close to the light source array 200. At the same time, in the same group of drive circuits 310, the second end 3112 of the drive circuit 311 located on the same side of the light source array 200 in the first direction, close to the light source array 200, protrudes beyond the second end 3112 of the drive circuit 311 located away from the light source array 200.

[0144] In this way, the driving circuit 311 can be connected to the electrical connection line L1 on the side facing the light source array 200, which reduces the space required for the circuit connection section L11 in the second direction. This allows for the arrangement of a larger driving circuit 311 in the second direction. When the space for arranging the driving circuit group 310 and its electrical connection line L1 in the second direction is fixed, the size requirements for the driving circuit 311 can be reduced.

[0145] In some examples, the circuit connection segment L11 is a straight line extending from both ends along a first direction.

[0146] In this way, compared to the scheme where the circuit connection segment L11 is a straight line extending from both ends along the second direction, the corners of the projection of the electrical connection line L1 in the thickness direction of the substrate 100 can be reduced, making the process requirements for forming the electrical connection line L1 lower and thus making the formation of the electrical connection line L1 easier. In addition, the length of the electrical connection line L1 can be shorter, which in turn results in lower resistance and less loss when current flows through the electrical connection line L1.

[0147] Figure 12 is a schematic diagram of the arrangement of a light source array and a driving circuit array in the direction perpendicular to the thickness of the substrate according to another embodiment of this application.

[0148] As shown in Figure 12, in some possible embodiments, the projection of the electrical connection line L1 in the thickness direction of the substrate 100 is a straight line with both ends extending along a first direction.

[0149] In this way, the projection of the electrical connection line L1 in the thickness direction of the substrate 100 has no corners, which reduces the process requirements for forming the electrical connection line L1 and makes it easier to form the electrical connection line L1. In addition, the length of the electrical connection line L1 can be shorter, which in turn reduces the resistance of the electrical connection line L1 and the loss when current passes through the electrical connection line L1.

[0150] Figure 13 is a schematic diagram of a light-emitting module provided in an embodiment of this application on one side in the second direction.

[0151] As shown in Figure 13 and referring to Figure 12, in some examples, the projection of at least one electrical connection line L1 in the thickness direction of the substrate 100 intersects the projection of at least one driving circuit 311 in the thickness direction of the substrate 100. The at least one electrical connection line L1 includes a jumper segment L13, the projection of which intersects the projection of the at least one driving circuit 311 in the thickness direction of the substrate 100. The jumper segment L13 and the driving circuit 311 are located in different structural layers of the semiconductor thin film structure 600 in the thickness direction of the substrate 100.

[0152] This makes it easier to ensure that the projection of the electrical connection line L1 in the thickness direction of the substrate 100 is a straight line with both ends extending along the first direction.

[0153] In some examples, in the second direction, the drive circuit group 310 is located between the two ends of the corresponding light source group 210. Thus, the drive circuit array 300 is smaller in size in the second direction, which in turn allows the light-emitting module 10 to be smaller in size in the second direction.

[0154] Figure 14 is a schematic diagram of the arrangement of a light source array and a driving circuit array in the direction perpendicular to the thickness of the substrate according to another embodiment of this application.

[0155] As shown in Figure 14, in some other examples, in the second direction, a portion of the drive circuit group 310 is located between the two ends of the corresponding light source group 210, and a portion protrudes from the corresponding light source group 210.

[0156] This makes it easier to arrange the larger drive circuit 311 in the second direction, and the size of the drive circuit 311 is less restricted.

[0157] Figure 15 is a schematic diagram of the arrangement of a light source array and a driving circuit array in the direction perpendicular to the thickness of the substrate according to another embodiment of this application.

[0158] As shown in Figure 15, in some possible embodiments, the two ends of the driving circuit 311 extend along a third direction in the length direction. In the same group of driving circuits 310, the driving circuits 311 located on the same side of the light source array 200 in the first direction are arranged along a fourth direction. Both the third and fourth directions are perpendicular to the thickness direction of the substrate 100, both are inclined relative to the second direction, and the fourth direction is perpendicular to the third direction.

[0159] This allows for a smaller spacing between adjacent groups of drive circuits 310 along the length of the drive circuit 311, making the arrangement of the drive circuit array 300 more flexible.

[0160] For example, in the same group of driving circuits 310, the first end 3111 of the driving circuit 311 located on the same side of the light source array 200 in the first direction is arranged in a straight line along the fourth direction, and the second end 3112 of the driving circuit 311 located on the same side of the light source array 200 in the first direction is arranged in a straight line along the fourth direction.

[0161] Figure 16 is a schematic diagram of the arrangement of a light source array and a driving circuit array in the direction perpendicular to the thickness of the substrate according to another embodiment of this application.

[0162] As shown in Figure 16, in some possible embodiments, the light source group 210 includes multiple rows of light source rows 211 distributed along a first direction, each row of light source rows 211 including a light source 2111.

[0163] In this way, by arranging multiple rows of light sources 2111 along the first direction, the number of light sources 2111 in each row can be reduced while maintaining the same resolution. This allows for the arrangement of larger light sources 2111, which is beneficial for increasing the brightness of the light emitted by the light sources 2111. In addition, the size of the light source array 200 in the second direction is smaller, which allows the size of the light-emitting module 10 in the second direction to be smaller as well.

[0164] In some possible implementations, the multiple rows of light sources 211 in the light source group 210 include adjacent first light source rows 211a and second light source rows 211b, both of which include light sources 2111. In the same group of light sources 210, the light sources 2111 of the first light source row 211a and the light sources 2111 of the second light source row 211b are staggered in a second direction.

[0165] In this way, after the first light source row 211a emits light, it is only necessary to rotate the photosensitive drum 3 to make the second light source row 211b emit light, so that exposure imaging can be performed while maintaining the same resolution. The exposure imaging operation is relatively simple.

[0166] Figure 17 is a schematic diagram of the arrangement of a light source array and a driving circuit array in the direction perpendicular to the thickness of the substrate according to another embodiment of this application.

[0167] As shown in Figure 17, in some examples, the light sources 2111 of all the light source rows 211 of the light source group 210 are staggered in the second direction.

[0168] In some examples, each row of light sources 211 includes multiple light sources 2111 that are linearly distributed along the second direction.

[0169] Figure 18 is a schematic diagram of the arrangement of a light source array and a driving circuit array in the direction perpendicular to the thickness of the substrate according to another embodiment of this application.

[0170] As shown in Figure 18, in some examples, each row of light sources 211 includes one light source 2111, and the light sources 2111 of all the light sources in the light source group 210 are staggered in the second direction.

[0171] Figure 19 is a schematic diagram of the arrangement of a light source array and a driving circuit array in the direction perpendicular to the thickness of the substrate according to another embodiment of this application.

[0172] As shown in Figure 19, in some possible embodiments, the multiple rows of light sources 211 in the light source group 210 include adjacent third light source rows 211c and fourth light source rows 211d. Both the third light source rows 211c and fourth light source rows 211d include multiple light sources 2111 distributed in a straight line along the second direction. In the same light source group 210, the light sources 2111 of the third light source row 211c and the fourth light source row 211d are symmetrically arranged with respect to a plane of symmetry m located between them, where the plane of symmetry m is a plane perpendicular to the first direction.

[0173] In this way, the size of the light source array 200 in the second direction is smaller, which allows the size of the light-emitting module 10 in the second direction to be smaller as well.

[0174] At this point, after the third light source row 211c emits light, the photosensitive drum 3 needs to be rotated, and the print head 1 or the light-emitting module 10 needs to be moved along the axis of the photosensitive drum 3 to make the position of the fourth light source row 211d emitting light different from that of the third light source row 211c. Then the fourth light source row 211d emits light. In this way, exposure imaging can be performed while keeping the resolution unchanged.

[0175] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0176] The devices or elements referred to in the embodiments of this application or implied herein must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the embodiments of this application. In the description of the embodiments of this application, "a plurality of" means two or more, unless otherwise precisely specified.

[0177] The terms "first," "second," "third," "fourth," etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of the present application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0178] The term "multiple" in this article refers to two or more. The term "and / or" in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone. Furthermore, the character " / " in this article generally indicates an "or" relationship between the preceding and following related objects; in formulas, the character " / " indicates a "division" relationship between the preceding and following related objects.

[0179] It is understood that the various numerical designations used in the embodiments of this application are merely for descriptive convenience and are not intended to limit the scope of the embodiments of this application.

[0180] It is understood that, in the embodiments of this application, the order of the above-mentioned process numbers does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

Claims

1. A light-emitting module, characterized in that, Includes a substrate, a driving circuit array, and a light source array; The driving circuit array is disposed to the side of the light source array in the first direction, and the distance between the driving circuit array and the light source array in the first direction is greater than 0. The light source array includes multiple light sources, and the driving circuit array includes multiple driving circuits that correspond one-to-one with the multiple light sources. The light sources are electrically connected to the corresponding driving circuits via electrical connection lines. Wherein, the first direction is perpendicular to the thickness direction of the substrate, and the substrate is a glass substrate.

2. The light-emitting module according to claim 1, characterized in that, The light source array includes n groups of light sources distributed along the second direction, and the driving circuit array includes n groups of driving circuits distributed along the second direction, with each group of driving circuits corresponding to one group of light sources. In the second direction, at least a portion of the driving circuit group is located between the two ends of the corresponding light source group; The light source group includes a plurality of light sources distributed along the second direction, and the driving circuit group includes a plurality of driving circuits that correspond one-to-one with the plurality of light sources in the corresponding light source group; Wherein, the second direction is perpendicular to the thickness direction of the substrate, the second direction is perpendicular to the first direction, and n is an integer greater than or equal to 2.

3. The light-emitting module according to claim 2, characterized in that, The number of light sources in each group of light sources is m; Where m is an integer greater than or equal to 2.

4. The light-emitting module according to claim 2 or 3, characterized in that, All of the driving circuits are located on the same side of the light source array in the first direction.

5. The light-emitting module according to any one of claims 2-4, characterized in that, The two ends of the driving circuit extend along the second direction in the length direction; In the same group of drive circuits, all the drive circuits are distributed along the first direction.

6. The light-emitting module according to claim 5, characterized in that, The driving circuit includes a first end, which is one end of the driving circuit along its length. The first ends of the driving circuit located on the same side of the light source array in the first direction have the same orientation. In the same group of driving circuits, the first ends of the driving circuits located on the same side of the light source array in the first direction are arranged in a straight line along the first direction.

7. The light-emitting module according to claim 6, characterized in that, The electrical connection line includes a circuit connection segment, which is a straight line extending from both ends along the second direction, and one end of the circuit connection segment is connected to the driving circuit.

8. The light-emitting module according to claim 5, characterized in that, The driving circuit includes a first end, which is one end of the driving circuit along its length. The first ends of the driving circuit located on the same side of the light source array in the first direction have the same orientation. In the same group of driving circuits, the first end of the driving circuit located on the same side of the light source array in the first direction, away from the light source array, protrudes from the first end of the driving circuit close to the light source array.

9. The light-emitting module according to claim 8, characterized in that, The electrical connection line includes a circuit connection segment, which is a straight line extending at both ends along the first direction, and one end of the circuit connection segment is connected to the driving circuit.

10. The light-emitting module according to any one of claims 2-4, characterized in that, The two ends of the drive circuit extend along the third direction in the length direction; In the same group of driving circuits, the driving circuits located on the same side of the light source array in the first direction are arranged along the fourth direction; Wherein, the third direction and the fourth direction are both perpendicular to the thickness direction of the substrate, the third direction and the fourth direction are both inclined relative to the second direction, and the fourth direction is perpendicular to the third direction.

11. The light-emitting module according to any one of claims 2-10, characterized in that, The light source group includes multiple rows of light sources distributed along the first direction, and each row of light sources includes the light source.

12. The light-emitting module according to claim 11, characterized in that, The multiple rows of light sources in the light source group include adjacent first light source rows and second light source rows, and both the first light source row and the second light source row include the light source; In the same group of light sources, the light sources in the first row of light sources and the light sources in the second row of light sources are staggered in the second direction.

13. The light-emitting module according to claim 11 or 12, characterized in that, The multiple rows of light sources in the light source group include an adjacent third light source row and a fourth light source row, and each of the third light source row and the fourth light source row includes a plurality of light sources that are linearly distributed along the second direction; In the same group of light sources, the light sources of the third light source row and the light sources of the fourth light source row are symmetrically arranged with respect to a symmetrical plane located between them, wherein the symmetrical plane is a plane perpendicular to the first direction.

14. The light-emitting module according to any one of claims 1-13, characterized in that, The projections of any two of the electrical connection lines in the thickness direction of the substrate do not intersect.

15. The light-emitting module according to any one of claims 1-14, characterized in that, The projection of each of the electrical connection lines in the thickness direction of the substrate does not intersect with the projection of all the drive circuits in the thickness direction of the substrate.

16. The light-emitting module according to any one of claims 1-15, characterized in that, The projection of the electrical connection line in the thickness direction of the substrate is a straight line extending at both ends along the first direction.

17. The light-emitting module according to any one of claims 1-16, characterized in that, The driving circuit is formed on the substrate using semiconductor technology.

18. The light-emitting module according to any one of claims 1-17, characterized in that, The light-emitting module includes a first temperature zone and a second temperature zone separated by a preset isotherm. The driving circuit array is located in the first temperature zone, and the light source array is located in the second temperature zone. The preset isotherm is the isotherm of the preset temperature when the light source array emits light at the highest power, the preset temperature is the temperature of the light-emitting module, and the preset temperature is less than or equal to 60°C.

19. The light-emitting module according to any one of claims 1-18, characterized in that, Each of the aforementioned electrical connection lines has the same resistance.

20. A printhead, characterized in that, Includes a housing, a lens assembly, and a light-emitting module as described in any one of claims 1-19; The light-emitting module is disposed inside the housing, and the substrate of the light-emitting module is connected to the housing; The housing has a light-emitting hole located on the light-emitting side of the light source array of the light-emitting module, and the lens group is disposed at the light-emitting hole.

21. An image forming apparatus, characterized in that, Includes the body and the light-emitting module as described in any one of claims 1-19; The substrate of the light-emitting module is mounted on the body.

22. The image forming apparatus according to claim 21, characterized in that, Including the print head; The printhead includes a housing, a lens group, and the light-emitting module; The housing is disposed on the body, the light-emitting module is disposed inside the housing, and the substrate is connected to the housing; The housing has a light-emitting hole located on the light-emitting side of the light source array of the light-emitting module, and the lens group is disposed at the light-emitting hole.

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