Display module and display device

Abstract

Disclosed are a display module and a display device. The display module comprises: a display panel 10 having a light-emitting side and a backlight side opposite the light-emitting side, the display panel 10 comprising a display area and a bonding area 101, and the bonding area being bent toward the backlight side; a flexible circuit board 30 comprising a main body portion 301, an extension portion 302, and a connection portion 303, the extension portion 302 being located between the main body portion 301 and the connection portion 303, the end of the main body portion 301 away from the extension portion 302 being connected to the bonding area 101 of the display panel 10, and the connection portion 303, the extension portion 302, and at least part of the main body portion 301 being located on the backlight side of the display panel 10; and a heat dissipation film 20 disposed on the backlight side of the display panel 10, an accommodating groove 201 being recessed from the surface of the heat dissipation film 20 away from the display panel 10, and the extension portion 302 of the flexible circuit board 30 being accommodated in the accommodating groove 201.

Description

Display module and display device

[0001] This application claims priority to Chinese Patent Application No. 202410669779.X, filed on May 28, 2024, entitled “Display Module and Display Device”, the contents of which are to be construed as incorporated herein by reference. Technical Field

[0002] This disclosure relates to, but is not limited to, the field of display technology. In particular, it relates to a display module and a display device. Background Technology

[0003] Display modules, as display components of electronic devices, are widely used in various electronic products. The design of narrow bezels and ultra-thin modules is increasingly favored by terminal manufacturers and consumers. The narrow bezel solution is mainly achieved by bending the bonding area so that the driver chip is bent to the back of the display module. The back of the display panel in existing display modules is generally covered with an SCF (Super Clean Foam) structural layer, which plays a role in buffering heat dissipation.

[0004] With the market demand for ultra-thin and lightweight mobile phones, the overall space of the terminal device is becoming increasingly limited, requiring continuous optimization and improvement of the internal component layout and connection methods. Summary of the Invention

[0005] The following is an overview of the subject matter described in detail herein. This overview is not intended to limit the scope of the claims.

[0006] This disclosure provides a display module, including:

[0007] The display panel has a light-emitting side and a backlight side opposite to the light-emitting side. The display panel includes a display area and a bonding area located on one side of the display area. The bonding area is bent toward the backlight side.

[0008] A flexible circuit board, the flexible circuit board including a main body, an extension, and a connecting part; the extension is located between the main body and the connecting part; one end of the main body away from the extension is connected to a bonding area of ​​the display panel; the connecting part, the extension, and at least a portion of the main body are located on the backlight side of the display panel;

[0009] A heat dissipation film is disposed on the backlight side of the display panel, and a receiving groove is formed by a recess on the surface of the heat dissipation film away from the display panel, and the extension of the flexible circuit board is received in the receiving groove.

[0010] In some exemplary embodiments, the width of the extension portion and the connecting portion of the flexible circuit board is smaller than the width of the main body portion, the width of the receiving groove of the heat dissipation film is greater than or equal to the width of the extension portion, and the depth of the receiving groove is greater than or equal to the thickness of the extension portion of the flexible circuit board.

[0011] In some exemplary embodiments, the display module further includes a fixing film layer that at least partially covers the extension of the flexible circuit board. The fixing film layer is attached to the heat dissipation film and the flexible circuit board so that the extension of the flexible circuit board is fixed in the receiving groove of the heat dissipation film.

[0012] In some exemplary embodiments, a first opening is provided on the fixing film layer at the position corresponding to the connection portion of the flexible circuit board, and the connection portion is located in the first opening so that the connection portion exposes the fixing film layer.

[0013] In some exemplary embodiments, the heat dissipation film has a multi-layer structure, including an adhesive layer, a buffer layer and a thermally conductive layer that are sequentially bonded together, wherein the adhesive layer is bonded to the backlight side surface of the display panel.

[0014] In some exemplary embodiments, the surface of the buffer layer near the heat-conducting layer is recessed to form a first groove, and the heat-conducting layer has a second opening corresponding to the groove of the first groove, the second opening and the first groove together forming the receiving groove.

[0015] In some exemplary embodiments, the main body of the flexible circuit board is provided with a driving chip, and the fixing film extends to the main body and covers the driving chip.

[0016] In some exemplary embodiments, the heat dissipation film has a double-layer structure, including an adhesive layer and a thermally conductive layer that are bonded together in sequence, wherein the adhesive layer is bonded to the backlight side surface of the display panel.

[0017] In some exemplary embodiments, the surface of the adhesive layer near the thermally conductive layer is recessed to form a second groove, the thermally conductive layer has a second opening corresponding to the groove of the second groove, the second opening and the second groove together form the receiving groove, the extension of the flexible circuit board is received in the receiving groove, and the extension is attached to the adhesive layer.

[0018] In some exemplary embodiments, the adhesive layer is in the shape of a mesh.

[0019] This disclosure also provides a display device, including the display module of any of the above.

[0020] Other features and advantages of this application will be set forth in the following description, and will be apparent in part from the description, or may be learned by practicing the application. Other advantages of this application can be realized and obtained by means of the solutions described in the description and the accompanying drawings.

[0021] After reading and understanding the accompanying diagrams and detailed descriptions, the other aspects can be understood.

[0022] Overview of the attached figures

[0023] The accompanying drawings are used to provide an understanding of the technical solutions of this application and constitute a part of the specification. They are used together with the embodiments of this application to explain the technical solutions of this application and do not constitute a limitation on the technical solutions of this application.

[0024] The embodiments of the present disclosure will be described in further detail below with reference to the accompanying drawings.

[0025] Figure 1 shows a rear view structural diagram of a display module according to an embodiment of the present disclosure;

[0026] Figure 2 shows a rear view of a display module whose bonding area is bent to the backlight side in an embodiment of the present disclosure;

[0027] Figure 3 shows a rear view of a display module according to an embodiment of the present disclosure;

[0028] Figure 4 shows a rear view of another display module in an embodiment of this disclosure;

[0029] Figure 5 shows a BB-side cross-sectional view of a display module according to an embodiment of the present disclosure;

[0030] Figure 6 shows a cross-sectional view of an AA-section of a display module according to an embodiment of the present disclosure;

[0031] Figure 7 shows an AA-plane cross-sectional view of another display module in an embodiment of this disclosure.

[0032] Detailed Explanation

[0033] The embodiments of this disclosure will now be described in detail with reference to the accompanying drawings. The implementation can be carried out in many different forms. Those skilled in the art will readily understand that the methods and content can be transformed into other forms without departing from the spirit and scope of this disclosure. Therefore, this disclosure should not be construed as limited to the content described in the following embodiments. Without conflict, the embodiments and features in the embodiments of this disclosure can be arbitrarily combined with each other.

[0034] In the accompanying drawings, the size of one or more constituent elements, the thickness of layers, or areas are sometimes exaggerated for clarity. Therefore, this disclosure is not necessarily limited to these dimensions, and the shape and size of one or more parts in the drawings do not reflect true proportions. Furthermore, the drawings schematically illustrate ideal examples, and this disclosure is not limited to the shapes or values ​​shown in the drawings.

[0035] The ordinal numbers such as "first," "second," and "third" used in this specification are used to avoid confusion among the constituent elements, not to limit the quantity. The term "multiple" in this disclosure refers to two or more quantities.

[0036] In this specification, for convenience, terms such as "middle," "upper," "lower," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," and "outer" are used to indicate orientation or positional relationships in conjunction with the accompanying drawings. This is solely for the purpose of facilitating the description and simplification, and does not imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this disclosure. The positional relationships of the constituent elements may be appropriately varied depending on the orientation of the constituent elements being described. Therefore, the use of terms not limited to those described in the specification may be appropriately replaced as needed.

[0037] In this specification, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; a mechanical connection or joint; a direct connection, an indirect connection via an intermediate component, or a connection within two components. Those skilled in the art will understand the meaning of these terms in this disclosure as appropriate. "Joining" can include "electrical connection," which can include situations where constituent elements are connected together by a component having some electrical function. There are no particular limitations on "components having some electrical function," as long as they enable the transmission of electrical signals between the connected constituent elements. Examples of "components having some electrical function" include not only electrodes and wiring, but also switching elements such as transistors, resistors, inductors, capacitors, and other multifunctional components.

[0038] As shown in Figures 1 to 7, this embodiment of the present disclosure provides a display module, including: a display panel 10, a heat dissipation film 20, and a flexible circuit board 30. The display panel 10 has a light-emitting side and a backlight side opposite to the light-emitting side. The display panel 10 includes a display area and a peripheral area surrounding the display area. The peripheral area is used to lay out wiring, such as gate driving circuits. The display area is used to display images.

[0039] The display area contains multiple display pixels, such as multiple display pixels arranged in a matrix. Each display pixel contains a pixel circuit and an OLED (Organic Light Emitting Diode) connected to the pixel circuit. The pixel circuit can drive the light-emitting device to emit light. In this case, the OLEDs among the multiple display pixels can emit at least three primary colors of light, such as red (R), green (G), and blue (B).

[0040] The peripheral area can be further divided into a bonding area 101 and a bending area, with the bending area located between the bonding area 101 and the display area. To achieve a narrow bezel design, the bonding area 101 of the display panel 10 can be bent to the backlight side. The bonding area 101 is used to connect signal traces to the driver chip 50, and the bonding area 101 can be bent to the backlight side of the display panel 10 so that the driver chip 50 is located on the backlight side of the display panel 10.

[0041] The heat dissipation film 20 is attached to the backlight side surface of the display panel 10 through an adhesive layer. The bonding area 101 of the display panel 10 is connected to the flexible circuit board 30, so that the flexible circuit board 30 is also located on the backlight side of the display panel.

[0042] In some exemplary embodiments, the display area of ​​the display panel 10 may further include multiple data signal lines (DL) and multiple gate signal lines (GL). Pixel circuits of display pixels located in the same row can be electrically connected to the same gate signal line. Pixel circuits of display pixels located in the same column can be electrically connected to the same data signal line. When a gate signal transmitted through a gate signal line selects a pixel circuit, a data signal can be written to the pixel circuit through the data signal line. In this way, the pixel circuit can drive the light-emitting device (OLED) electrically connected to the pixel circuit to emit light, thereby realizing the display image of the display module. To provide data signals and gate signals, the display module includes a driver chip 50 and a flexible circuit board 30, wherein the flexible circuit board 30 is used to connect the main circuit board to the display panel 10. The main circuit board can provide gate signals to the pixel circuits through the flexible circuit board 30. Furthermore, under the control of the main circuit board, the driver chip 50 can provide data signals to the pixel circuits.

[0043] The flexible circuit board 30 includes a main body portion 301, an extension portion 302, and a connecting portion 303 connected in sequence, with the extension portion 302 located between the main body portion 301 and the connecting portion 303. One end of the main body portion 301 away from the extension portion 302 is connected to a bonding area 101 of the display panel 10. For example, a bonding process is used to press the end of the main body portion 301 of the flexible circuit board 30 away from the extension portion 302 to the bonding area 101 of the display panel 10 to achieve electrical connection between the flexible circuit board 30 and the display panel 10.

[0044] The end of the connecting portion 303 of the flexible circuit board 30 away from the extension portion 302 is connected to the main circuit board. The connecting portion 303 can be a board-to-board (BTB) connector. For example, a board-to-board connector (BTB) is divided into a female connector (Rece) and a male connector (plug). The two are respectively disposed on the connecting portion 303 of the flexible circuit board 30 and the main circuit board, and are connected by mating during use.

[0045] In some exemplary embodiments, the display panel 10 is a flexible display panel.

[0046] When the display panel 10 is a flexible display panel, it has the characteristic of being bendable. The display panel 10 includes a display area, a bending area, and a bonding area 101. The bending area is located between the display area and the bonding area 101. By bending the bending area, the bonding area 101 can be positioned on the backlight side of the display panel 10, and the flexible circuit board 30 can be positioned on the backlight side of the display panel 10. This reduces the area occupied by the flexible circuit board 30 on the bezel of the light-emitting side of the display panel 10, which is beneficial for achieving a narrow bezel of the display panel 10 and improving the screen-to-body ratio of the display device.

[0047] In some exemplary embodiments, as shown in FIG1, the driver chip 50 is disposed on the bonding area 101. After the bonding area 101 is bent to the backlight side of the display panel 10, the driver chip 50 is located on the backlight side of the display panel 10.

[0048] In some exemplary embodiments, the driver chip 50 is disposed on the main body 301 of the flexible circuit board 30. The width of the main body 301 is greater than the width of the extension 302, so that the main body 301 has a larger area to facilitate the placement of multiple driver chips 50 or a large-area driver chip. The width of the extension 302 is equal to the width of the connecting portion 303 to reduce the area of ​​the extension 302, and the length of the extension 302 can be set to be relatively long to meet the needs of the connecting portion 303 and the main circuit board.

[0049] Therefore, by setting one end of the main body 301 away from the extension 302 to the bonding area 101 of the display panel 10, and the other end of the connecting part 303 away from the extension 302 to the main circuit board of the whole machine, the main circuit board can be connected to the display panel 10 via the flexible circuit board 30 to provide driving signals to the display panel 10.

[0050] However, when the flexible circuit board 30 is located on the backlight side of the display panel 10, the extension portion 302 of the flexible circuit board 30 is relatively long, which will occupy a large amount of internal space of the whole device. Therefore, for thin electronic products, such as mobile phones and tablet computers, the internal space is greatly affected.

[0051] The present invention discloses a display module in which a receiving groove 201 is formed on the heat dissipation film 20 attached to the backlight side of the display panel 10, and the extension portion 302 of the flexible circuit board 30 is placed in the receiving groove 201 to reduce the internal space occupied by the extension portion 302 in the thickness direction.

[0052] As shown in Figure 2, a recessed receiving groove 201 is formed on the surface of the heat dissipation film 20 away from the display panel 10. The length of the receiving groove 201 is equal to the length of the extension 302, and the width of the receiving groove 201 is slightly larger than the width of the extension 302, thereby facilitating the placement of the extension 302 within the receiving groove 201. Both the main body 301 and the connecting portion 303 of the flexible circuit board 30 are located outside the receiving groove. The extension 302 is located within the receiving groove 201, meaning it is embedded within the heat dissipation film 20. This not only reduces the overall space occupied by the flexible circuit board 30, but also reduces the weight of the display module due to the receiving groove 201 on the heat dissipation film 20, achieving an overall weight reduction effect. In some exemplary embodiments, the connecting portion 303 of the flexible circuit board 30 is located outside the receiving groove 201, meaning the receiving groove 201 does not extend to the position of the corresponding connecting portion 303 on the heat dissipation film 20. This avoids the connecting portion 303 being embedded within the heat dissipation film 20, thus preventing the connecting portion 303 from being inconvenient to connect to the main circuit board.

[0053] In some exemplary embodiments, the widths of the extension portion 302 and the connecting portion 303 of the flexible circuit board 30 are both less than or equal to the width of the main body portion 301. The width of the extension portion 302 may be equal to the width of the connecting portion 303, or the width of the extension portion 302 may be less than the width of the connecting portion 303. The width of the connecting portion 303 is the width of the flexible circuit board connector. No electrical components are provided on the extension portion 302, but circuit traces connecting the electrical components of the main body portion 301 to the connecting portion 303 are provided, ensuring that the extension portion 302 has a thinner overall size. The depth of the receiving groove 201 is greater than or equal to the thickness of the extension portion 302, so that the extension portion 302 is entirely located inside the receiving groove 201. In some exemplary embodiments, due to limitations in the manufacturing process, the depth of the receiving groove 201 is slightly greater than the thickness of the extension portion 302 to avoid the phenomenon that the extension portion 302 cannot be completely embedded in the receiving groove 201.

[0054] In some exemplary embodiments, as shown in FIG3, the display module further includes a fixing film layer 40, which at least partially covers the extension portion 302 of the flexible circuit board 30. In some exemplary embodiments, the fixing film layer 40 is attached to the surface of the extension portion 302 and extends to the surface of the heat dissipation film 20 on both sides of the receiving groove 201. That is, the two sides of the fixing film layer 40 are attached to the heat dissipation film 20, and the middle part of the fixing film layer 40 is attached to the extension portion 302, thereby fixing the extension portion 302 of the flexible circuit board 30 in the receiving groove 201, avoiding collision and abnormal noise between the extension portion 302 and the heat dissipation film 20 or other components, and improving the overall noise level.

[0055] In some exemplary embodiments, as shown in FIG4, the fixing film layer 40 covers the surface of the heat dissipation film 20 except for the main body portion 301, and a first opening 401 is formed at the corresponding connecting portion 303 to expose the fixing film layer 40. That is, the width of the fixing film layer 40 is equal to or less than the width of the heat dissipation film 20, the length of the fixing film layer 40 is less than the length of the heat dissipation film 20, and the fixing film layer 40 covers most of the area of ​​the heat dissipation film 20, except for the area of ​​the main body portion 301 of the flexible circuit board 30. The connecting portion 303 of the flexible circuit board 30 can extend from the first opening 401 and connect to the main circuit board. The opening area of ​​the first opening 401 is larger than the area of ​​the connecting portion 303, avoiding the problem of the fixing film layer 40 affecting the connection between the flexible circuit board 30 and the main circuit board.

[0056] In some exemplary embodiments, the first opening 401 includes an opening of a defined shape, the area of ​​which may be smaller than the area of ​​the connecting portion 303, and the connecting portion 303 is exposed to the fixing film layer 40 through the first opening 401. Alternatively, the opening area may be equal to or greater than the area of ​​the connecting portion 303, so as to prevent the connecting portion 303 from being covered by the fixing film layer 40. Thus, the effect of exposing the fixing film layer 40 to the connecting portion 303 can be achieved.

[0057] It should be noted that the fixing film layer 40 can be a foam layer, which can be removed before the entire machine is assembled, thus not occupying space in the machine and not affecting the fixation of the flexible circuit board 30. For example, after the battery assembly is assembled, the battery assembly contacts the heat dissipation film 20, confining the extension 302 of the flexible circuit board 30 within the receiving groove 201. Alternatively, the foam layer can be partially retained as needed to replace the foam adhesive of the entire machine's mid-frame.

[0058] In some exemplary embodiments, as shown in Figures 5 and 6, the heat dissipation film 20 has a multi-layer structure, including an adhesive layer 204, a buffer layer 203, and a thermally conductive layer 202 sequentially bonded together. The adhesive layer 204 is bonded to the backlight side surface of the display panel 10, and is used to attach the heat dissipation film 20 to the display panel 10. In some exemplary embodiments, the material of the thermally conductive layer 202 includes at least one of copper, aluminum, or silver, and the buffer layer 203 can be selected as foam for cushioning.

[0059] A first groove is formed by a recess on the surface of the buffer layer 203 near the heat-conducting layer 202. A second opening is formed on the heat-conducting layer 202, and the second opening corresponds to the groove opening of the first groove, so that the second opening and the first groove together form a receiving groove 201. That is, the bottom of the receiving groove 201 is located in the buffer layer 203. In the thickness direction of the flexible circuit board 30, a part of the extension portion 302 is located in the first groove, and another part is located in the second opening. The surface of the extension portion 302 is flush with the surface of the heat dissipation film 20, so that the fixing film layer 40 can be flatly attached to the surface of the heat dissipation film 20.

[0060] To protect the driver chip, an adhesive tape (IC Cover Tape) is typically attached to its top. In some exemplary embodiments, the fixing film layer 40 extends to the main body 301 of the flexible circuit board 30 and covers the driver chip 50, thus fixing the extension 302 of the flexible circuit board 30 and protecting the driver chip 50 in a single bonding process. In other words, the fixing film layer 40 attached to the surface of the heat dissipation film 20 covers both the main body 301 and the extension 302 of the flexible circuit board 30.

[0061] In some exemplary embodiments, as shown in FIG7, the heat dissipation film 20 has a double-layer structure, including an adhesive layer 204 and a thermally conductive layer 202 that are bonded together. The adhesive layer 204 is bonded to the backlight side surface of the display panel 10 and is used to attach the heat dissipation film 20 to the display panel 10. A second groove is formed by a recess on the surface of the adhesive layer 204 near the thermally conductive layer 202, and a second opening is formed on the thermally conductive layer 202. The second opening is corresponding to the groove opening of the second groove, so that the second opening and the second groove together form a receiving groove 201. The bottom of the receiving groove 201 is located in the adhesive layer 204. In the thickness direction of the flexible circuit board 30, a part of the extension portion 302 is located in the second groove, and another part is located in the second opening. The extension portion 302 is bonded to the adhesive layer 204. It can be understood that in this structure, the extension portion 302 can be bonded and fixed to the adhesive layer 204, so there is no need to provide a fixing film layer 40.

[0062] In some exemplary embodiments, the adhesive layer 204 is in the shape of a mesh, which is used for venting and preventing air bubbles from forming when the heat dissipation film 20 is attached.

[0063] Referring again to Figure 5, the two ends of the extension portion 302 of the flexible circuit board 30 are respectively provided with bending portions, that is, bending portions are provided between the main body portion 301 and the extension portion 302, and between the connecting portion 303 and the extension portion 302, so that the extension portion 302 bends toward the display panel 10. Thus, when the main body portion 301, the connecting portion 303 and the surface of the heat dissipation film 20 come into contact, the extension portion 302 can be located in the receiving groove 201. That is, there is a step difference between the extension portion 302 and the main body portion 301 and the connecting portion 303. The height of the step difference is equal to the depth of the receiving groove 201, which is conducive to the flexible circuit board 30 being flatly attached to the heat dissipation film 20.

[0064] In some exemplary embodiments, a cover plate 60 is provided on the light-emitting side of the display panel 10. The cover plate 60 is used to protect the display panel 10. The cover plate 60 can be a 3D glass cover plate or a 2D glass cover plate. The cover plate 60 can be made of other transparent materials besides glass. The cover plate 60 can be a flexible transparent material, such as plastic (CPI: Colorless PI, PET: polyethylene terephthalate, etc.) or ultra-thin glass (UTG, Ultra Thin Glass), etc. Those skilled in the art can choose according to actual needs.

[0065] This disclosure also provides a display device, including the display module described in any of the embodiments.

[0066] The display device provided in this disclosure can be a mobile phone, and a portion of the display module of the mobile phone is shown in FIG4. It can also be any electronic product with display function, including but not limited to the following categories: television, laptop, desktop monitor, tablet computer, digital camera, smart bracelet, smart glasses, vehicle display, medical equipment, industrial control equipment, touch interactive terminal, etc. This disclosure does not make any special limitation on these.

[0067] Although embodiments of this disclosure have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A display module, comprising: The display panel has a light-emitting side and a backlight side opposite to the light-emitting side. The display panel includes a display area and a bonding area located on one side of the display area. The bonding area is bent toward the backlight side. A flexible circuit board, the flexible circuit board including a main body, an extension, and a connecting part; the extension is located between the main body and the connecting part; one end of the main body away from the extension is connected to a bonding area of ​​the display panel; the connecting part, the extension, and at least a portion of the main body are located on the backlight side of the display panel; A heat dissipation film is disposed on the backlight side of the display panel, and a receiving groove is formed by a recess on the surface of the heat dissipation film away from the display panel, and the extension of the flexible circuit board is received in the receiving groove. 2.The display module of claim 1, wherein, The width of the extension and the connecting portion of the flexible circuit board is smaller than the width of the main body portion, the width of the receiving groove of the heat dissipation film is greater than or equal to the width of the extension portion, and the depth of the receiving groove is greater than or equal to the thickness of the extension portion of the flexible circuit board.

3. The display module according to claim 1 or 2 further includes a fixing film layer that at least partially covers the extension portion of the flexible circuit board, the fixing film layer being adhered to the heat dissipation film and the flexible circuit board, so that the extension portion of the flexible circuit board is fixed in the receiving groove of the heat dissipation film.

4. The display module according to claim 3, wherein, A first opening is provided on the fixed film layer at the position corresponding to the connection part of the flexible circuit board, and the connection part is located in the first opening so that the connection part exposes the fixed film layer.

5. The display module according to claim 3, wherein, The heat dissipation film has a multi-layer structure, including an adhesive layer, a buffer layer and a thermally conductive layer that are sequentially bonded together. The adhesive layer is bonded to the backlight side surface of the display panel.

6. The display module according to claim 5, wherein, The surface of the buffer layer near the heat-conducting layer is recessed to form a first groove, and the heat-conducting layer has a second opening corresponding to the groove of the first groove. The second opening and the first groove together form the receiving groove.

7. The display module according to claim 3, wherein, The main body of the flexible circuit board is provided with a driving chip, and the fixing film extends to the main body and covers the driving chip.

8. The display module according to claim 1 or 2, wherein, The heat dissipation film has a double-layer structure, including an adhesive layer and a thermally conductive layer that are bonded together in sequence. The adhesive layer is bonded to the backlight side surface of the display panel.

9. The display module according to claim 8, wherein, The surface of the adhesive layer near the thermally conductive layer is recessed to form a second groove. The thermally conductive layer has a second opening corresponding to the groove of the second groove. The second opening and the second groove together form the receiving groove. The extension of the flexible circuit board is received in the receiving groove, and the extension is attached to the adhesive layer.

10. The display module according to claim 5, 8, or 9, wherein, The adhesive layer has a mesh-like shape.

11. A display device comprising a display module as described in any one of claims 1-10.

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