Relay device for transmitting wireless signal

Abstract

This relay device comprises: a first substrate having a first metal pattern disposed on one surface, the first metal pattern being configured to receive a first signal; a second substrate having a second metal pattern disposed on one surface to correspond to the first metal pattern, the second metal pattern being configured to receive a second signal; and a flexible substrate, one end of which is connected to the first substrate, the other end of which is connected to the second substrate, and which has a transmission line provided on one surface. The first substrate, the second substrate, and the flexible substrate may be arranged as an integrated module integrally formed to surround a first surface, a second surface, and a side surface between the first surface and the second surface of a structure to which the relay device is attached.

Description

A relay device that transmits wireless signals

[0001] This specification relates to a relay device for transmitting wireless signals. More specifically, it relates to a relay device for transmitting wireless signals that can be placed on doors, fire doors, etc.

[0002] With the rapid development of 4th and 5th generation mobile communications, communication module design technology to support ultra-high-speed, high-capacity communications is rapidly evolving. In 5G communications, coverage expansion methods are being researched to expand the communication area due to the short radio wave range.

[0003] Reconfigurable Intelligent Surfaces (RIS) can expand communication coverage at a lower cost than repeater installations. Consequently, RIS is being actively developed by domestic and international telecommunications companies. However, the limited availability of phase-variable elements for use in high-frequency bands presents challenges in development and deployment.

[0004] Meanwhile, indoor environments can experience degradation of signal transmission characteristics due to polarization mismatch. In this regard, there is a problem in that the polarization direction of radio waves can change due to scattering caused by the internal structure of the room. Therefore, repeater devices deployed indoors must have a radiator structure designed to support dual polarization.

[0005] Meanwhile, indoor environments present a problem: signal loss characteristics increase due to the internal structure of the room compared to free space. Furthermore, signal loss characteristics can be further increased when relay devices are placed on one side and the other side of structures such as metal elevator doors or fire doors.

[0006] This specification is intended to prevent degradation of signal transmission characteristics due to polarization mismatch in an indoor environment.

[0007] The purpose of this specification is to increase the probability of signal reception in shaded areas.

[0008] The present specification is intended to improve the reflection performance of a reflective metasurface and thereby enhance wireless communication coverage using a reflective metasurface.

[0009] The purpose of this specification is to provide a relay device capable of responding to various radio environment by adjusting the gain of the relay device.

[0010] A relay device according to the present specification comprises: a first substrate having a first metal pattern disposed on one surface thereof, the first metal pattern configured to receive a signal; a second substrate having a second metal pattern disposed on one surface thereof corresponding to the first metal pattern; and a flexible substrate having one end connected to the first substrate, the other end connected to the second substrate, and a transmission line disposed on one surface thereof. The first substrate, the second substrate, and the flexible substrate may be arranged as an integral module integrally formed to surround a first surface, a second surface, and a side surface between the first surface and the second surface of a structure to which the relay device is attached.

[0011] According to an embodiment, the first metal pattern may form first radiators arranged on a second axis perpendicular to one axis of the first surface and spaced apart by a first interval. The second metal pattern may form second radiators arranged on a second axis perpendicular to the one axis of the second surface and spaced apart by a second interval equal to the first interval. The transmission line may include a plurality of transmission lines configured to connect each of the first radiators to each of the second radiators. Each of the first radiators, each of the second radiators, and each of the transmission lines may form a respective sub-module. Each of the sub-modules may be expanded and arranged in a plurality of pieces on the other axis of the structure and spaced apart by the first interval.

[0012] According to an embodiment, the first spacing between the first radiators adjacent to the other axis and the second spacing between the second radiators may be a value between 0.5 and 1 wavelength based on a wavelength corresponding to a maximum frequency within an operating frequency band. A first beam pattern formed through the first radiators may be formed to have a narrower beam width in the other axis direction than in the one axis direction. A second beam pattern formed through the second radiators may be formed to have a narrower beam width in the other axis direction than in the one axis direction.

[0013] According to an embodiment, the structure may form a door made of a metal material. The first radiators may be arranged on a front surface of the door, and the second radiators may be arranged on a rear surface of the door. The positions on the first surface where the first radiators are arranged may correspond to the positions on the second surface where the second radiators are arranged.

[0014] According to an embodiment, the transmission line of the flexible substrate may be arranged to extend to an inner region of the first substrate where the first metal pattern is formed. It may be arranged to extend to an inner region of the second substrate where the second metal pattern is formed.

[0015] According to an embodiment, the first signal received in the first region through the first metal pattern may be transmitted to a second region different from the first region through the transmission line and the second metal pattern. The second signal received in the second region through the second metal pattern may be transmitted to the first region through the transmission line and the first metal pattern. The first region may be a region in the front direction where the first metal pattern is arranged, and the second region may be a region in the front direction where the second metal pattern is arranged.

[0016] According to an embodiment, the transmission line may be implemented as a horizontal connection portion that horizontally connects the first metal pattern and the second metal pattern. The flexible substrate may include first and second ground patterns formed on the front and back surfaces; and the horizontal connection portion arranged between the first and second ground patterns and parallel to the first and second ground patterns.

[0017] According to an embodiment, the horizontal connecting portion may include a first feed pattern configured to transmit a first polarized signal in one axial direction; and a second feed pattern arranged parallel to and spaced apart from the first feed pattern to transmit a second polarized signal in an opposite axial direction perpendicular to the one axial direction.

[0018] According to an embodiment, the first substrate may include a first vertical connection via vertically connecting a first point of the first metal pattern and the first power supply pattern, and a second vertical connection via vertically connecting a second point of the first metal pattern and the second power supply pattern. The second substrate may include a third vertical connection via vertically connecting a third point of the second metal pattern and the first power supply pattern, and a fourth vertical connection via vertically connecting a fourth point of the second metal pattern and the second power supply pattern.

[0019] According to an embodiment, the first substrate may include a first ground layer disposed on a back surface of the first substrate; a first signal pattern layer disposed in an upper region in the Z-axis direction of the first ground layer; a second ground layer disposed in an upper region in the Z-axis direction of the first signal pattern layer; and a first antenna layer having the first metal pattern disposed in an upper region in the Z-axis direction of the second ground layer. A first dielectric layer may be disposed between the first ground layer and the first signal pattern layer, a second dielectric layer may be disposed between the first signal pattern layer and the second ground layer, and a third dielectric layer may be disposed between the second ground layer and the first antenna layer.

[0020] According to an embodiment, the second substrate may include a third ground layer disposed on a back surface of the second substrate; a second signal pattern layer disposed in an upper region in the Z-axis direction of the third ground layer; a fourth ground layer disposed in an upper region in the Z-axis direction of the second signal pattern layer; and a second antenna layer having the second metal pattern disposed in an upper region in the Z-axis direction of the fourth ground layer. A fourth dielectric layer may be disposed between the third ground layer and the second signal pattern layer, a fifth dielectric layer may be disposed between the second signal pattern layer and the fourth ground layer, and a sixth dielectric layer may be disposed between the fourth ground layer and the second antenna layer.

[0021] According to an embodiment, the first substrate may further include a first ground via vertically connecting the first ground layer and the second ground layer, and first and second vertical connection vias connecting the first metal pattern and the first signal pattern layer. The second substrate may further include a second ground via vertically connecting the third ground layer and the fourth ground layer, and third and fourth vertical connection vias connecting the second metal pattern and the second signal pattern layer. The first and second feed patterns of the flexible substrate may be arranged to extend to the first signal pattern layer of the first substrate. The first and second feed patterns of the flexible substrate may be arranged to extend to the second signal pattern layer of the second substrate.

[0022] According to an embodiment, the first metal pattern and the second metal pattern may be arranged in a direction rotated by a first angle with respect to the X-axis. The first metal pattern and the second metal pattern may be formed as a square patch having first to fourth sides. The first and second power supply patterns may be arranged parallel to the Y-axis.

[0023] According to an embodiment, the first substrate may further include first and second parasitic patterns arranged parallel to a first side and a second side opposite the first side of the first metal pattern, and third and fourth parasitic patches arranged parallel to a third side and a fourth side opposite the third side. The second substrate may further include fifth and sixth parasitic patterns arranged parallel to a first side and a second side opposite the first side of the second metal pattern, and seventh and eighth parasitic patches arranged parallel to a third side and a fourth side opposite the third side.

[0024] According to an embodiment, the first and third parasitic patches may be formed with a first length and a first width, the second and fourth parasitic patches may be formed with a second length and a second width, the fifth and seventh parasitic patches may be formed with the first length and the first width, and the sixth and eighth parasitic patches may be formed with the second length and the second width.

[0025] According to an embodiment, the first and second ground patterns of the flexible substrate may include metal mesh lines formed in a first axis direction and a second axis direction perpendicular to the first axis. A dielectric region from which the metal pattern is removed may be formed between adjacent metal mesh lines among the metal mesh lines. The spacing between the adjacent metal mesh lines may be formed within a predetermined range based on 3.6 mm.

[0026] According to an embodiment, the third width of the first and second power supply patterns of the flexible substrate may be formed with a characteristic impedance of less than 50 ohm within a predetermined range based on 100 um. The fourth width of the first and second power supply patterns formed on the first and second signal pattern layers of the first and second substrates may be formed with a characteristic impedance of less than the third width and 50 ohm.

[0027] According to an embodiment, the flexible substrate may further include a first vertical via configured to vertically connect the first and second ground patterns between the first horizontal connecting portion and the second horizontal connecting portion; a second vertical via configured to vertically connect the first and second ground patterns and spaced apart from an end of the first horizontal connecting portion; and a third vertical via configured to vertically connect the first and second ground patterns and spaced apart from an end of the second horizontal connecting portion. A first horizontal distance between the first vertical via and the second vertical via and a second horizontal distance between the first vertical via and the third vertical via may be set to be the same.

[0028] According to an embodiment, the transmission line may be implemented with the vertical connection portion formed perpendicularly to the first metal pattern and the second metal pattern. The first substrate and the second substrate may be connected via a flexible substrate. The flexible substrate may include first and second ground patterns formed on the front and back surfaces; and the vertical connection portion arranged perpendicularly to the first and second ground patterns between the first and second ground patterns.

[0029] According to an embodiment, the vertical connecting portion may include a first vertical via configured to vertically connect center points of the first and second ground patterns; a second vertical via configured to vertically connect first points on one side of the first and second ground patterns; and a third vertical via configured to vertically connect second points on the other side of the first and second ground patterns. A first horizontal distance between the first vertical via and the second vertical via and a second horizontal distance between the first vertical via and the third vertical via may be set to be the same.

[0030] According to an embodiment, a first polarized signal in one axial direction can be transmitted through a first waveguide region between the first vertical via and the second vertical via. A second polarized signal in another axial direction perpendicular to the one axial direction can be transmitted through a second waveguide region between the first vertical via and the third vertical via.

[0031] According to an embodiment, the first metal pattern may form first radiators that are spaced apart in a different axial direction perpendicular to the one axial direction. The second metal pattern may form second radiators that are spaced apart in the different axial direction. The transmission line may include a plurality of transmission lines configured to connect each of the first radiators to each of the second radiators.

[0032] According to an embodiment, the first beam pattern formed through the first radiators may be formed to have a narrower beam width in the other axis direction than in the one axis direction. The second beam pattern formed through the second radiators may be formed to have a narrower beam width in the other axis direction than in the one axis direction.

[0033] According to an embodiment, the first radiators may be arranged on the front surface of the door, and the second radiators may be arranged on the rear surface of the door. The areas where the first radiators are arranged may correspond to the areas where the second radiators are arranged.

[0034] According to an embodiment of the present disclosure, by utilizing an antenna supporting dual polarization in a relay device, it is possible to prevent degradation of signal transmission characteristics due to polarization mismatch in an indoor environment.

[0035] According to an embodiment of the present disclosure, by utilizing an array antenna having radiators in an array structure in a relay device, the probability of signal reception in a shadow area can be increased.

[0036] According to an embodiment of the present disclosure, the modular structure allows for easy adjustment of the number of repeaters, and allows for adjustment of the gain of the repeater according to the adjustment of the number of repeaters, thereby enabling adaptation to various radio environments.

[0037] Further scope of the applicability of this specification will become apparent from the detailed description below. However, since various changes and modifications within the spirit and scope of this specification will be apparent to those skilled in the art, it should be understood that the detailed description and specific examples, such as preferred embodiments, are given by way of example only.

[0038] Figure 1 shows the basic structure of a relay device according to this specification.

[0039] Figure 2 illustrates embodiments of a relay device for transmitting a wireless signal.

[0040] Figure 3 is a conceptual diagram showing a relay device of an array structure receiving a first signal from a base station and transmitting a second signal to an electronic device.

[0041] Figure 4 is a conceptual diagram showing a wireless signal transmitting relay device positioned on the outside and inside of a door transmitting a signal from a base station to the inside of the door.

[0042] Fig. 5 shows the structure of a relay device in which first and second metal patterns of first and second substrates are connected by transmission lines of a flexible substrate.

[0043] Fig. 6 shows a cross-sectional view of a flexible substrate on which the transmission line of Fig. 5 is formed.

[0044] Fig. 7 shows an implementation example of the relay device of Fig. 5.

[0045] Fig. 8 shows a cross-sectional view of the relay device of Fig. 7.

[0046] FIG. 9 shows the reflection coefficient characteristics and transmission coefficient characteristics of the first and second metal patterns constituting a relay device transmitting a wireless signal according to the present specification.

[0047] Figure 10 shows first and second ground patterns of upper and lower regions of a transmission line formed in a strip line structure on a flexible substrate.

[0048] Figure 11 shows the structure of a transmission line formed on a first substrate, a flexible substrate, and a second substrate.

[0049] Figure 12 shows a cross-sectional view of a flexible substrate of a relay device formed with a feed structure of a waveguide structure.

[0050] Figure 13a shows a relay device in which transmission lines are formed with equal lengths.

[0051] Figure 13b shows a relay device in which transmission lines are formed with different lengths.

[0052] Figure 14 shows structures in which a relay device can be placed on the inner side of an elevator door or a fire door.

[0053] Figures 15a and 15b show the radiator structures of the relay device arranged on one side of the inside and the outside of the door.

[0054] Fig. 16a shows beam patterns by the radiator of the relay device of Fig. 15a.

[0055] Fig. 16b shows beam patterns by the radiators of the relay devices of Figs. 13b and 15b.

[0056] Figures 17 and 18 illustrate a relay device including first and second metal patterns on first and second substrates connected by a coaxial cable.

[0057] Hereinafter, specific embodiments of the present invention will be described in detail with drawings.

[0058] Hereinafter, embodiments related to this specification will be described in more detail with reference to the drawings. The suffixes "module" and "part" used in the following description for components are assigned or used interchangeably solely for the convenience of writing the specification, and do not have a distinct meaning or role in themselves.

[0059] Hereinafter, a repeater device for transmitting wireless signals in connection with this specification will be described. The repeater device for transmitting wireless signals according to this specification is configured as a wireless signal repeater for transmitting wireless signals. In this regard, Fig. 1 illustrates the basic structure of the repeater device according to this specification.

[0060] Referring to FIG. 1(a), a relay device (1000) may be configured to include a first antenna (1000a), a second antenna (1000b), and a transmission line (1300). The relay device (1000) may transmit a wireless signal received through the first antenna (1000) to the second antenna (1000b) through the transmission line (1300L).

[0061] Referring to FIG. 1(b), the repeater device (1000) can receive a first signal received from a base station (100) through a first antenna (1000) disposed in a first region (R1). The repeater device (1000) can transmit the first signal received through the first antenna (1000) to a second antenna (1000b) disposed in a second region (R2) through a transmission line (1300L). Since the repeater device (1000) transmits a wireless signal from the first region (R1) to the second region (R2) without amplifying the wireless signal, it can be referred to as a passive repeater device.

[0062] The relay device (1000) can transmit the second signal transmitted through the transmission line (1300L) to the second area (R2) via the second antenna (1000b). Accordingly, the electronic device (200) placed in the second area (R2) can receive the second signal and wirelessly communicate with the base station (100). Even when the electronic device (200) cannot directly receive the first signal from the base station (100) or is in an area where the first signal reception strength is lower than a threshold, the electronic device (200) can receive the second signal and wirelessly communicate with the base station (100).

[0063] To this end, the relay device (1000) may be configured to have first and second antennas (1000a, 1000b) arranged on both sides of the transmission line (1300L). The transmission line (1300L) may be formed of a film structure. Depending on the application, both the first and second antennas (1000a, 1000b) may also be formed of an integral film structure. Depending on the application, the transmission line (1300L) may be formed of a film structure and the first and second antennas (1000a, 1000b) may be formed of a substrate structure. The relay device (1000) may be attached to a gap in a door such as a fire door or an elevator to transmit an external signal into a shielded space, thereby eliminating a shadow area (1 to 2 m space) of a wireless signal.

[0064] Meanwhile, a relay device transmitting a wireless signal according to the present specification may be placed in a vehicle, a window, an elevator, a fire door, and a shaded area in a building. In this regard, FIG. 2 illustrates embodiments of a relay device transmitting a wireless signal. FIG. 2(a) illustrates a structure in which a relay device (1000) is placed in a passenger window (10) of a vehicle. FIG. 2(b) illustrates a structure in which a relay device (1000) is placed in a window (20) of a building. FIG. 2(c) illustrates a structure in which a relay device (1000) is placed in a door (30) of an elevator of a building. FIG. 2(d) illustrates a structure in which a relay device (1000) is placed in a fire door (40).

[0065] The relay device transmitting a wireless signal according to the present specification is not limited to the arrangement structure of FIG. 2. In this regard, the relay device (100) may be attached through a space between a window (10), a window (20), a door (30), and a fire door (40). In addition, the relay device (100) may be placed regardless of the medium of the attachment surface, such as glass, SUS (stainless steel), cement, etc.

[0066] Meanwhile, 5G wireless signals have narrow cell coverage, so 5G repeaters can be installed at outdoor base stations or in a repeater deployment configuration. Conversely, 4G wireless signals have wide cell coverage, so indoor repeaters can be deployed in a deployment configuration. LTE is the dominant technology. Meanwhile, if 5G NSA (non-standalone) is adopted, a large number of indoor repeaters are expected during the future transition to SA.

[0067] Meanwhile, a relay device transmitting a wireless signal according to the present specification can transmit a wireless signal in a desired direction by utilizing the electromagnetic properties of metamaterials. In this regard, FIG. 3 illustrates a conceptual diagram of an array-structured relay device receiving a first signal from a base station and transmitting a second signal to an electronic device.

[0068] Referring to FIG. 3, a relay device (1000) transmitting a wireless signal can receive a first signal from a base station (100). A first beam coverage of the first signal transmitted from the base station (100) can be formed at a first angle. The relay device (1000) can receive the first signal from the base station (100). An antenna of the relay device (1000) can be formed in a two-dimensional array structure. The antenna of the relay device (1000) can be formed in a two-dimensional array structure having N antenna elements. A second beam coverage of a second signal transmitted from the relay device (1000) can be formed at a second angle. The second beam coverage is formed at a second angle narrower than the first beam coverage at the first angle, so that a more directional beam can be transmitted to the electronic device (200).

[0069] The relay device (1000) of FIG. 3 may be configured as a reconfigurable intelligent surface (RIS) including a plurality of antenna elements. A wireless signal of a specific frequency band may be configured to be reflected or transmitted by the relay device (1000) having a reflective RIS or a transparent RIS structure. The beamforming angle of the second signal may be varied by independently varying the on / off state of each element constituting the relay device (1000) having a reflective RIS or a transparent RIS structure. The relay device (1000) may be applied in an embedded form within a product, but is not limited thereto.

[0070] Meanwhile, a wireless signal transmitting relay device according to this specification may be positioned both outside and inside the door to receive a first signal from a base station and transmit it as a second signal to the inside of the door. In this regard, FIG. 4 is a conceptual diagram illustrating a wireless signal transmitting relay device positioned outside and inside the door to transmit a signal from a base station to the inside of the door.

[0071] Referring to Fig. 4(a), the power level of a signal received at a first point spaced a predetermined distance from the base station (100) may be A dBm. Referring to Fig. 4(b), an obstacle, such as a door (30) or a fire door (40) of Fig. 2, may be placed at a second point between the base station (100) and the first point. An obstacle, such as a door (30) or a fire door (40), may have a loss value of B dB.

[0072] Referring to FIG. 2 and FIG. 4(c), a relay device (1000) having first and second metal patterns (1110, 1120) on one side and the other side of a door (30) or a fire door (40) may be placed. The first and second metal patterns (1110, 1120) of the relay device (1000) for transmitting a wireless signal between a first region (R1) and a second region (R2) are placed at corresponding positions, and thus may be referred to as a relay device having a back-to-back structure.

[0073] A first distance (D1) may be spaced from a first point to a second point where a relay device (1000) is placed. A second distance (D2) may be spaced from the second point where a relay device (1000) is placed to a base station (100). The distance (D) from the base station (100) to the first point may be determined as the sum of the first distance (D1) and the second distance (D2).

[0074] A first antenna (ANT1) formed by a first metal pattern (1110) may be formed to have a first gain value (G1). A second antenna (ANT2) formed by a second metal pattern (1120) may be formed to have a second gain value (G2). A transmission line (1300L) connecting the first and second metal patterns (1110, 1120) may be formed to have a predetermined feed loss (α). As a repeater (1000) is arranged to compensate for loss due to an obstacle, the power level of a signal received at the first point must satisfy the condition of mathematical expression 1. Here, N is the number of elements of the first antenna (ANT1) and the second antenna (ANT2). FSPL is a free space path loss from the base station (100) to the first point.

[0075]

[0076] Therefore, it is necessary to configure the array antenna gain G1+G2+20log(N) of the first and second antennas (ANT1, ANT2) of the relay device (100) to compensate for B dB, which is a loss value due to an obstacle. Hereinafter, a relay device (100) having the array antenna gain of the first and second antennas (ANT1, ANT2) to compensate for B dB, which is a loss value due to an obstacle, will be described.

[0077] Meanwhile, the structure of a relay device transmitting a wireless signal according to the present specification will be described in detail with reference to the drawings. In this regard, FIG. 5 shows the structure of a relay device in which first and second metal patterns of first and second substrates are connected by transmission lines of a flexible substrate. FIG. 6 shows a cross-sectional view of the flexible substrate on which the transmission lines of FIG. 5 are formed. FIG. 6 shows a cross-sectional view in the Y-axis direction of the flexible substrate (1300) on which the transmission lines of FIG. 5 are formed.

[0078] Fig. 7 illustrates an implementation example of the relay device of Fig. 5. Referring to Fig. 7, the first and second metal patterns (1110, 1120) may be arranged in a form rotated by a predetermined angle, for example, 45 degrees, with respect to the X-axis. Fig. 8 illustrates a cross-sectional view of the relay device of Fig. 7.

[0079] Referring to FIGS. 1 to 8, a relay device (1000) according to the present specification will be described. The relay device (1000) may be configured to include a flexible substrate (1300) having a first substrate (1010), a second substrate (1020), and a transmission line (1300L).

[0080] A first substrate (1010) may have a first metal pattern (1110) configured to receive a signal of a specific frequency band arranged on one surface thereof. The first metal pattern (1110) may be implemented as a first radiator (first antenna) to radiate a signal of a specific frequency band. A second substrate (1020) may have a second metal pattern (1120) arranged on one surface thereof to correspond to the first metal pattern (1110). The second metal pattern (1120) may be configured to radiate a signal received from the first metal pattern (1110). The shape of the first metal pattern (1110) and the shape of the second metal pattern (1120) may be the same. The X, Y coordinates at which the first metal pattern (1110) is arranged may be the same as the X, Y coordinates of the second metal pattern (1120).

[0081] The second metal pattern (1120) may be implemented as a second radiator (second antenna) to radiate a signal of a specific frequency band. The second metal pattern (1120) may be implemented as a second radiator (second antenna) to receive a second signal of a specific frequency band. The first metal pattern (1110) may be configured to radiate a second signal received through the second metal pattern (1120). The first metal pattern (1110) and the second metal pattern (1120) may be disposed on the front surface of the first substrate (1010) and the front surface of the second substrate (1020), but are not limited thereto.

[0082] A flexible substrate (1300) may be configured such that one end is connected to a first substrate (1010) and the other end is connected to a second substrate (1020). The flexible substrate (1300) may have a transmission line (1300L) on one surface. The flexible substrate (1300) may have a transmission line (1300L) coupled to a first metal pattern (1110) and a second metal pattern (1120). One end of the transmission line (1300L) may be coupled to the first metal pattern (1110), and the other end may be coupled to the second metal pattern (1120).

[0083] The transmission line (1300L) may have a connection portion connecting the first metal pattern (1110) and the second metal pattern (1120). A signal received in the first region (R1) through the first metal pattern (1110) may be transmitted to a second region (R2) different from the first region (R1) through the transmission line (1300L) and the second metal pattern (1120). A second signal received in the second region (R2) through the second metal pattern (1120) may be transmitted to the first region (R1) through the transmission line (1300L) and the first metal pattern (1110).

[0084] The first region (R1) may be a region in the front direction where the first metal pattern (1110) is arranged. The second region (R2) may be a region in the front direction where the second metal pattern (1120) is arranged. The first region (R1) may be a front direction of the door (30) or the fire door (40) of FIG. 4. The second region (R2) may be a back direction of the door (30) or the fire door (40) of FIG. 4.

[0085] The door (30) or the fire door (40) corresponds to the structure (30, 40) to which the relay device (1000) is attached. The first substrate (1010) may be disposed on the first surface of the structure (30, 40) to which the relay device (100) is attached. The second substrate (1020) may be disposed on the second surface of the structure (30, 40) to which the relay device (100) is attached. The flexible substrate (1300) may be disposed on the side surface between the first surface and the second surface of the structure (30, 40) to which the relay device (100) is attached. The first substrate (1010), the second substrate (1020), and the flexible substrate (1300) may be disposed as an integrated module formed integrally to surround the first surface, the second surface, and the side surface of the structure (30, 40).

[0086] The transmission line (1300L) may be implemented as a horizontal connection portion (1300L1) that horizontally connects the first metal pattern (1110) and the second metal pattern (1120). The first substrate (1010) and the second substrate (1020) may be connected through a flexible substrate (1300). The flexible substrate (1300) may include first and second ground patterns (1110g, 1120g) and a horizontal connection portion (1300L1). The first and second ground patterns (1110g, 1120g) may be formed on the front and back surfaces of the flexible substrate (1300). The horizontal connection portion (1300L1) may be arranged between the first and second ground patterns (1110g, 1120g) and in parallel with the first and second ground patterns (1110g, 1120g).

[0087] The flexible substrate (1300) may be configured to include a plurality of vertical vias. Referring to FIGS. 5 and 6, the plurality of vertical vias of the flexible substrate (1300) may be formed as a plurality of vertical ground vias that vertically connect the first and second ground patterns (1110g, 1120g). The flexible substrate (1300) may be configured to include a first vertical via (VV1), a second vertical via (VV2), and a third vertical via (VV3). A first horizontal connecting portion (1310L1) and a second horizontal connecting portion (1320L1) may be arranged in a strip line structure within the flexible substrate (1300). The first horizontal connecting portion (1310L1) and the second horizontal connecting portion (1320L2) may correspond to the first power supply pattern (F1) and the second power supply pattern (F2), respectively.

[0088] The first vertical via (VV1) may be configured to vertically connect the first and second ground patterns (1110g, 1120g) between the first horizontal connection portion (1310L1) and the second horizontal connection portion (1320L2). The second vertical via (VV2) may be configured to vertically connect the first and second ground patterns (1110g, 1120g) by being spaced apart from an end of the first horizontal connection portion (1310L1). The third vertical via (VV3) may be configured to vertically connect the first and second ground patterns (1110g, 1120g) by being spaced apart from an end of the second horizontal connection portion (1320L2).

[0089] A first horizontal distance between the first vertical via (VV1) and the second vertical via (VV2) and a second horizontal distance between the first vertical via (VV1) and the third vertical via (VV3) can be set to be the same. A first distance between one end of the first horizontal connecting portion (1310L1) and the first vertical via (VV1) and a second distance between the other end of the first horizontal connecting portion (1310L1) and the second vertical via (VV2) can be set to be the same. A third distance between one end of the second horizontal connecting portion (1310L2) and the third vertical via (VV3) and a fourth distance between the other end of the second horizontal connecting portion (1310L2) and the first vertical via (VV1) can be set to be the same.

[0090] Accordingly, the first power supply pattern (F1) and the second power supply pattern (F2) corresponding to the first horizontal connection portion (1310L1) and the second horizontal connection portion (1320L2) arranged on the flexible substrate (1300) are formed in a symmetrical structure. Accordingly, the first and second signal characteristics (reflection loss, insertion loss) on the first power supply pattern (F1) and the second power supply pattern (F2) can be maintained at the same level or at a similar level within a predetermined range.

[0091] The horizontal connection part (1300L1) may be configured to include a first feed pattern (F1) and a second feed pattern (F2). The first feed pattern (F1) may be configured to transmit a first polarized signal in one axial direction. The second feed pattern (F2) may be arranged parallel to and spaced apart from the first feed pattern (F1) so as to transmit a second polarized signal in another axial direction perpendicular to the one axial direction. Referring to FIG. 5, the first polarized signal may be formed in the X-axis direction and the second polarized signal may be formed in the Y-axis direction. Referring to FIG. 7, the first polarized signal may be formed in the X'-axis direction and the second polarized signal may be formed in the Y'-axis direction. The X'-axis direction may be formed at a predetermined angle, for example, an angle rotated by 45 degrees, with respect to the X-axis direction. The Y'-axis direction may be formed at a predetermined angle, for example, an angle rotated by 45 degrees, with respect to the Y-axis direction.

[0092] The first substrate (1010) may include a first vertical connection via (V1) and a second vertical connection via (V2). The first vertical connection via (V1) may vertically connect a first point of the first metal pattern (1110) and a first power supply pattern (F1). The second vertical connection via (V2) may vertically connect a second point of the first metal pattern (1110) and a second power supply pattern (F2).

[0093] The second substrate (1020) may include a third vertical connection via (V3) and a fourth vertical connection via (V4). The third vertical connection via (V3) may vertically connect a third point of the second metal pattern (1120) and a first power supply pattern (F1). The fourth vertical connection via (V4) may vertically connect a fourth point of the second metal pattern (1120) and a second power supply pattern (F2).

[0094] The first substrate (1010) and the second substrate (1020) may be formed in a multi-layer substrate structure. The first substrate (1010) may be configured to include a first ground layer (GL1), a first signal pattern layer (SP1), a second ground layer (GL2), and a first antenna layer (1110L). The second substrate (1020) may be configured to include a third ground layer (GL3), a first signal pattern layer (SP2), a fourth ground layer (GL4), and a second antenna layer (1120L).

[0095] A first ground layer (GL1) may be disposed on the back surface of a first substrate (1010). A first protective layer (PR1), such as a PSR (Photo Solder Resist) layer, may be formed in a lower region of the first ground layer (GL1) in the Z-axis direction. A first signal pattern layer (SP1) may be disposed in an upper region of the first ground layer (GL1) in the Z-axis direction. A second ground layer (GL2) may be disposed in an upper region of the first signal pattern layer (SP1) in the Z-axis direction. A first antenna layer (1110L) may be disposed in an upper region of the second ground layer (GL2) in the Z-axis direction. A first metal pattern (1110) may be disposed on the first antenna layer (1110L). A second protective layer (PR2), such as a PSR layer, may be formed in an upper region of the first antenna layer (1110L) in the Z-axis direction.

[0096] A first dielectric layer (DL1) may be disposed between a first ground layer (GL1) and a first signal pattern layer (SP1). A second dielectric layer (DL2) may be disposed between the first signal pattern layer (SP1) and a second ground layer (GL2). A third dielectric layer (DL3) may be disposed between the second ground layer (GL2) and the first antenna layer (1110L).

[0097] A third ground layer (GL3) may be disposed on the back surface of the second substrate (1020). A third protective layer (PR3), such as a PSR layer, may be formed in a lower region of the third ground layer (GL3) in the Z-axis direction. A second signal pattern layer (SP2) may be disposed in an upper region of the third ground layer (GL3) in the Z-axis direction. A fourth ground layer (GL4) may be disposed in an upper region of the second signal pattern layer (SP2) in the Z-axis direction. A second antenna layer (1120L) may be disposed in an upper region of the fourth ground layer (GL4) in the Z-axis direction. A second metal pattern (1120) may be disposed on the second antenna layer (1120L). A fourth protective layer (PR4), such as a PSR layer, may be formed in an upper region of the second antenna layer (1120L) in the Z-axis direction.

[0098] A fourth dielectric layer (DL4) may be disposed between the third ground layer (GL3) and the second signal pattern layer (SP2). A fifth dielectric layer (DL5) may be disposed between the second signal pattern layer (SP2) and the fourth ground layer (GL4). A sixth dielectric layer (DL6) may be disposed between the fourth ground layer (GL4) and the second antenna layer (1120L).

[0099] The first substrate (1010) may be configured to include a first ground via (GV1) and first and second vertical connection vias (V1, V2). The first ground via (GV1) may be configured to vertically connect the first ground layer (GL1) and the second ground layer (GL2). The first and second vertical connection vias (V1, V2) may be configured to connect the first metal pattern (1110) and the first and second power supply patterns (F1, F2) of the first signal pattern layer (SP1).

[0100] The second substrate (1020) may be configured to include a second ground via (GV2) and third and fourth vertical connection vias (V3, V4). The second ground via (GV2) may be configured to vertically connect the third ground layer (GL3) and the fourth ground layer (GL4). The third and fourth vertical connection vias (V3, V4) may be configured to connect the second metal pattern (1120) and the first and second power supply patterns (F1, F2) of the second signal pattern layer (SP2).

[0101] The flexible substrate (1300) may be formed into a multilayer substrate structure. The flexible substrate (1300) may be laminated in the following order: a first cover layer (CV1), a first attachment layer (AL1), a first ground pattern (1110g), a second attachment layer (AL2), a horizontal connection portion (1310L1), a second ground pattern (1120g), a third attachment layer (AL3), and a second cover layer (CV2).

[0102] The first and second power supply patterns (F1, F2) of the flexible substrate (1300) may be arranged to extend to the first signal pattern layer (SP1) of the first substrate (1010). The first and second power supply patterns (F1, F2) of the flexible substrate (1300) may be arranged to extend to the second signal pattern layer (SP2) of the second substrate (1010).

[0103] The first metal pattern (1110) and the second metal pattern (1120) may be arranged in a direction rotated by a first angle with respect to the X-axis. The first metal pattern (1110) and the second metal pattern (1120) may be arranged in a direction rotated within a predetermined angle range with respect to 45 degrees with respect to the X-axis. The first metal pattern (1110) and the second metal pattern (1120) may be formed as a square patch having first to fourth sides (S1, S2, S3, S4). The first and second feed patterns (F1, F2) may be arranged parallel to the Y-axis.

[0104] The first substrate (1010) may be configured to include first and second parasitic patterns (PP1, PP2) and third and fourth parasitic patterns (PP3, PP4). The first to fourth parasitic patterns (PP1, PP2, PP3, PP4) may be arranged on the first antenna layer (1110L) on which the first metal pattern (1110) is arranged. The second substrate (1020) may be configured to include fifth and sixth parasitic patterns (PP5, PP6) and seventh and eighth parasitic patterns (PP7, PP8). The fifth to eighth parasitic patterns (PP5, PP6, PP7, PP8) may be arranged on the second antenna layer (1120L) on which the second metal pattern (1120) is arranged.

[0105] The first and second parasitic patterns (PP1, PP2) may be arranged parallel to and spaced apart from the first side (S1) of the first metal pattern (1110) and the second side (S2) opposite the first side (S1). The third and fourth parasitic patterns (PP3, PP4) may be arranged parallel to and spaced apart from the third side (S3) of the first metal pattern (1110) and the fourth side (S4) opposite the third side (S3).

[0106] The fifth and sixth parasitic patterns (PP5, PP6) may be arranged parallel to and spaced apart from the first side (S1) of the second metal pattern (1120) and the second side (S2) opposite the first side (S1). The seventh and eighth parasitic patterns (PP7, PP8) may be arranged parallel to and spaced apart from the third side (S3) of the second metal pattern (1120) and the fourth side (S4) opposite the third side (S3).

[0107] The first and third parasitic patches (PP1, PP3) may be formed with a first length (L1a) and a first width (W1a). The fifth and seventh parasitic patches (PP1, PP3) may be formed with a first length (L1a) and a first width (W1a). The first and third parasitic patches (PP1, PP3) adjacent to the first metal pattern (1110) may be arranged to correspond to the fifth and seventh parasitic patches (PP1, PP3) adjacent to the second metal pattern (1120). The second and fourth parasitic patches (PP2, PP4) may be formed with a second length (L2a) and a second width (W2a). The sixth and eighth parasitic patches (PP6, PP8) may be formed with a second length (L2a) and a second width (W2a). The second and fourth parasitic patches (PP2, PP4) adjacent to the first metal pattern (1110) can be arranged to correspond to the sixth and eighth parasitic patches (PP6, PP8) adjacent to the second metal pattern (1120).

[0108] The second and fourth parasitic patches (PP2, PP4) can be formed to have a second length (L2a) that is the same as the first length (L1a) of the first and third parasitic patches (PP1, PP3). The second and fourth parasitic patches (PP2, PP4) adjacent to the first and second vertical vias (V1, V2) can be formed to have a second width (W2a) that is wider than the first width (W1a) of the first and third parasitic patches (PP1, PP3). Therefore, the power supply loss and unwanted radiation caused by the first and second vertical vias (V1, V2) and the first and second power supply portions (F1, F2) can be reduced.

[0109] The second and fourth parasitic patches (PP2, PP4) can be formed to have a second length (L2a) that is the same as the first length (L1a) of the first and third parasitic patches (PP1, PP3). The second and fourth parasitic patches (PP2, PP4) adjacent to the first and second vertical vias (V1, V2) can be formed to have a second width (W2a) that is wider than the first width (W1a) of the first and third parasitic patches (PP1, PP3). Therefore, the power supply loss and unwanted radiation caused by the first and second vertical vias (V1, V2) and the first and second power supply portions (F1, F2) can be reduced.

[0110] The first and second metal patterns constituting the relay device transmitting a wireless signal according to the present specification operate as first and second radiators in the first and second regions. In this regard, Fig. 9 illustrates the reflection coefficient characteristics and transmission coefficient characteristics of the first and second metal patterns constituting the relay device transmitting a wireless signal according to the present specification.

[0111] Referring to FIGS. 7 to 9, the reflection coefficient (S11) at the first point of the first metal pattern (1110) and the first feed pattern (F1) connected through the first vertical via (V1) has a value of 0 dB or less in a frequency band of 3.37-3.5 GHz. The reflection coefficient (S22) at the second point of the first metal pattern (1110) and the second feed pattern (F2) connected through the second vertical via (V2) has a value of 0 dB or less in a frequency band of 3.37-3.5 GHz. The isolation (S21, S12) between the first feed pattern (F1) and the second feed pattern (F2) has a value of 5 dBc or less in a frequency band of 3.37-3.5 GHz.

[0112] In addition, the reflection coefficient (S11) at the first power supply pattern (F1) connected through the third point of the second metal pattern (1120) and the third vertical via (V3) has a value of 0 dB or less in a frequency band of 3.37-3.5 GHz. The reflection coefficient (S22) at the second power supply pattern (F2) connected through the fourth point of the second metal pattern (1120) and the fourth vertical via (V4) has a value of 0 dB or less in a frequency band of 3.37-3.5 GHz. The isolation (S21, S12) between the first power supply pattern (F1) and the second power supply pattern (F2) has a value of 5 dBc or less in a frequency band of 3.37-3.5 GHz.

[0113] Accordingly, the first and second metal patterns constituting the relay device for transmitting a wireless signal according to the present specification can operate as first and second radiators in the first and second regions, thereby transmitting a wireless signal even when radio wave blocking / loss occurs between the first and second regions. In addition, the first and second metal patterns of the relay device can maintain a reduced level of mutual interference while receiving signals of polarizations orthogonal to each other. Accordingly, even in a situation where the polarization of radio waves is transformed in an arbitrary direction in an indoor area, a signal of an arbitrary polarization can be received and a wireless signal can be transmitted to a shadow area.

[0114] The transmission line of the relay device transmitting the wireless signal according to the present specification may be arranged in a strip-line structure with first and second ground patterns arranged in upper and lower regions in the Z-axis direction. In this regard, Fig. 10 illustrates first and second ground patterns in upper and lower regions of a transmission line formed in a strip-line structure on a flexible substrate.

[0115] Referring to FIGS. 8 and 10(a), the first ground pattern (1110g) of the flexible substrate (1300) is illustrated. Referring to FIGS. 8 and 10(b), the second ground pattern (1120g) of the flexible substrate (1300) is illustrated.

[0116] Referring to FIGS. 7, 8, and 10, the transmission line (1300L) of the relay device is implemented on a flexible substrate (1300), and thus the first and second ground patterns (1110g, 1120g) may be formed as a metal mesh structure (MSS). The first ground pattern (1110g) may include a first metal mesh structure (MSS1) and a first metal pattern (MP1) formed to surround the first metal mesh structure (MSS1). The second ground pattern (1120g) may include a second metal mesh structure (MS2S) and a second metal pattern (MP2) formed to surround the second metal mesh structure (MSS2).

[0117] The first and second ground patterns (1110g, 1120g) of the flexible substrate (1300) may include metal mesh lines formed in a first axis direction and a second axis direction perpendicular to the first axis. A dielectric region (DR) from which the metal pattern is removed may be formed between adjacent metal mesh lines among the metal mesh lines. The distance between adjacent metal mesh lines where the dielectric region (DR) is formed may be formed within a predetermined range based on 3.6 mm.

[0118] As the first and second ground patterns (1110g, 1120g) of the flexible substrate (1300) are formed into the first and second metal mesh structures (MSS1, MSS2), the dielectric area where the metal is removed increases, thereby increasing the flexibility of the flexible substrate (1300). Accordingly, the flexible substrate (1300) on which the transmission line (1300L) is arranged is arranged in the area between the side and the gap of the door structure of FIG. 2, while maintaining electrical characteristics and improving mechanical stability.

[0119] Meanwhile, the transmission lines of the relay device transmitting wireless signals according to this specification can be implemented with different widths for each region to optimize electrical and mechanical characteristics. In this regard, Fig. 11 illustrates the structure of transmission lines formed on the first substrate, the flexible substrate, and the second substrate.

[0120] Referring to FIGS. 7, 8, and 11, the third width (W3) of the first and second power supply patterns (F1, F2) of the flexible substrate (1300) can be formed with a characteristic impedance smaller than 50 ohm within a predetermined range based on 100 um. The fourth width (W4) of the first and second power supply patterns (F1, F2) formed on the first signal pattern layer (SP1) of the first substrate (1010) can be formed with a smaller width (W3) of the first and second power supply patterns (F1, F2) of the flexible substrate (1300) and an impedance of 50 ohm. The fourth width (W4) of the first and second power supply patterns (F1, F2) of the flexible substrate (1300) formed on the second signal pattern layer (SP2) of the second substrate (1020) may be smaller than the third width (W3) of the first power supply pattern (F1) of the flexible substrate (1300) and may be formed with an impedance of 50 ohm.

[0121] Meanwhile, first and second conversion patterns (TP1, TP2) for impedance conversion may be formed in a third region (RR3) between the first region (RR1) of the first signal pattern layer (SP1) and the second region (RR2) of the first and second power supply patterns (F1, F2). The fifth width (W5) of the first and second conversion patterns (TP1, TP2) may be formed to have a value between the third width (W3) and the fourth width (W4). The length of the first and second conversion patterns (TP1, TP2) may be formed within a predetermined range based on 1 / 4 of the wavelength of the operating frequency.

[0122] Third and fourth conversion patterns (TP3, TP4) for impedance conversion may be formed in a sixth region (RR6) between the fourth region (RR4) of the second signal pattern layer (SP2) and the fifth region (RR5) of the first and second power supply patterns (F1, F2). The sixth width (W6) of the third and fourth conversion patterns (TP3, TP4) may be formed to have a value between the third width (W3) and the fourth width (W4). The lengths of the third and fourth conversion patterns (TP3, TP4) may be formed within a predetermined range based on 1 / 4 of the wavelength of the operating frequency.

[0123] Meanwhile, the flexible substrate of the relay device transmitting the wireless signal in this specification may be formed with a waveguide-shaped feeding structure. In this regard, Fig. 12 illustrates a cross-sectional view of the flexible substrate of the relay device formed with a waveguide-shaped feeding structure.

[0124] Referring to FIGS. 5 to 8 and 12, the transmission line (1300) can be implemented as a vertical connection portion (1300L2) formed vertically with a first metal pattern (1100) and a second metal pattern (1120). A first substrate (1010) on which the first metal pattern (1100) is formed and a second substrate (1020) on which the second metal pattern (1120) is formed can be connected through the flexible substrate (1300). The transmission line (1300) can be formed as a waveguide structure through a space between the first and second ground patterns (1110g, 1120g) and the vertical connection portion (1300L2). Since the transmission line (1300) of the waveguide structure is implemented within the substrate, it can be referred to as a substrate-integrated waveguide (SIW).

[0125] The flexible substrate (1300) may be configured to include first and second ground patterns (1110g, 1120g) and a vertical connection portion (1300L2). The first and second ground patterns (1110g, 1120g) may be formed on the front and back surfaces of the flexible substrate (1300). The vertical connection portion (1300L2) may be arranged between the first and second ground patterns (1110g, 1120g) and perpendicular to the first and second ground patterns (1110g, 1120g).

[0126] The waveguide structure formed by the vertical connection portion (1300L2) can be formed at one end and the other end of the flexible substrate (1300) inserted into the first and second substrates (1010, 1020) of FIG. 8. The strip line structure formed by the horizontal connection portion (1300L1) of FIGS. 6 and 8 can be formed at the center of the flexible substrate (1300).

[0127] The flexible substrate (1300) may be configured to include a plurality of vertical vias. The plurality of vertical vias of the flexible substrate (1300) may be formed as a plurality of vertical ground vias that vertically connect the first and second ground patterns (1110g, 1120g). The flexible substrate (1300) may be configured to include a first vertical via (VV1), a second vertical via (VV2), and a third vertical via (VV3).

[0128] The first vertical via (VV1) may be configured to vertically connect the center points (C1, C2) of the first and second ground patterns (1110g, 1120g). The second vertical via (VV2) may be configured to vertically connect the first points (P1a, P1b) on one side of the first and second ground patterns (1110g, 1120g). The third vertical via (VV3) may be configured to vertically connect the second points (P2a, P2b) on the other side of the first and second ground patterns (1110g, 1120g).

[0129] A first horizontal distance between the first vertical via (VV1) and the second vertical via (VV2) and a second horizontal distance between the first vertical via (VV1) and the third vertical via (VV3) can be set to be the same. A first polarized signal in one axis direction can be transmitted through a first waveguide region (WG1) between the first vertical via (VV1) and the second vertical via (VV2). A second polarized signal in another axis direction perpendicular to the one axis direction can be transmitted through a second waveguide region (WG2) between the first vertical via (VV1) and the third vertical via (VV3).

[0130] Accordingly, the first waveguide region (WG1) between the first vertical via (VV1) and the second vertical via (VV2) arranged on the flexible substrate (1300) and the second waveguide region (WG2) between the first vertical via (VV1) and the third vertical via (VV3) are formed in a symmetrical structure. Accordingly, the first and second signal characteristics (reflection loss, insertion loss) within the first waveguide region (WG1) and the second waveguide region (WG2) can be maintained at the same level or at a similar level within a predetermined range.

[0131] Meanwhile, a relay device transmitting a wireless signal according to the present specification may be implemented in an array structure. In this regard, Fig. 13a illustrates a relay device in which transmission lines are formed with equal lengths. Fig. 13b illustrates a relay device in which transmission lines are formed with different lengths.

[0132] Referring to FIG. 13a, the relay device (1000) may include first radiators (1110, 1110-2, ..., 1110-N) of a first region (R1), second radiators (1120-1, 1120-2, ..., 1120-N) of a second region (R2), and transmission lines (1300-1, 1300-2, ..., 1300-N). The transmission lines (1300-1, 1300-2, ..., 1300-N) are formed with the same length, so that the beam steering angles of the first radiators (1100-1, 1110-2, ..., 1110-N) and the second radiators (1100-1, 1110-2, ..., 1110-N) can be formed to be the same as 0 degrees.

[0133] A first spacing (D1a) between adjacent first radiators (1100-1, 1110-2, ..., 1110-N) can be set to a range of 0.5 to 1 wavelength. A second spacing (D2a) between adjacent second radiators (1120-1, 1120-2, ..., 1120-N) can be set to a range of 0.5 to 1 wavelength. Here, the wavelength corresponds to a wavelength (λ0) in free space corresponding to a maximum frequency within an operating frequency band. The first spacing (D1a) and the second spacing (D2a) can be formed at the same spacing.

[0134] The first spacing (D1a) and the second spacing (D2a) may be set similarly to the spacing between adjacent radiators in the array antenna. If the first spacing (D1a) and the second spacing (D2a) are set to be smaller than 0.5 wavelength, performance degradation such as a decrease in array gain may occur due to interference between adjacent radiators. If the first spacing (D1a) and the second spacing (D2a) are larger than 1 wavelength, a grating lobe may occur, which may reduce the efficiency of the array antenna. In addition, as the spacing between the array antennas increases, the area occupied by the repeater increases, so it is necessary to efficiently utilize the performance of the repeater with a minimum space.

[0135] Referring to FIG. 13b, the relay device (1000) may include first radiators (1100-1, 1110-2, ..., 1110-N) of a first region (R1), second radiators (1100-1, 1110-2, ..., 1110-N) of a second region (R2), and transmission lines (1300b-1, 1300b-2, ..., 1300b-N). The transmission lines (1300b-1, 1300b-2, ..., 1300b-N) are formed with different lengths, so that the beam steering angles of the first radiators (1100-1, 1110-2, ..., 1110-N) and the second radiators (1100-1, 1110-2, ..., 1110-N) can be formed with different angles. The length difference between adjacent transmission lines (1300b-1, 1300b-2, ..., 1300b-N) can be formed to increase or decrease at a certain ratio.

[0136] When the direction in which the radio waves are received and the direction in which they are re-radiated by the relay device (1000) are set, the beam steering angle can be controlled by adjusting the lengths between adjacent transmission lines (1300b-1, 1300b-2, ..., 1300b-N) of the relay device (1000). Therefore, the lengths between the transmission lines (1300b-1, 1300b-2, ..., 1300b-N) perform the same role as the role of a phase shifter, enabling beam direction control. The maximum phase difference of the transmission lines (1300b-1, 1300b-2, ..., 1300b-N) used in the array structure of the relay device (1000) can be set to 360 degrees (1 wavelength). Due to the 360-degree periodicity, the beam steering angle does not increase any further even if the maximum phase difference between adjacent transmission lines (1300b-1, 1300b-2, ..., 1300b-N) increases beyond 360 degrees. In addition, as the length of the transmission lines (1300b-1, 1300b-2, ..., 1300b-N) increases, the insertion loss difference between adjacent transmission lines (1300b-1, 1300b-2, ..., 1300b-N) increases.

[0137] The transmission lines (1300-1, 1300-2, ..., 1300-N) of Fig. 13a and the transmission lines (1300b-1, 1300b-2, ..., 1300b-N) of Fig. 13b can be implemented as RF transmission lines of various shielding structures such as coaxial cables, strip lines, SIWs, and waveguides. Meanwhile, a virtual line connecting the first radiators (1100-1, 1110-2, ..., 1110-N) of the first region (R1) and the second radiators (1100-1, 1110-2, ..., 1110-N) of the second region (R2) can be set parallel to the axis (Y-axis) of the array structure.

[0138] Meanwhile, the first spacing (D1b) between adjacent first radiators (1100-1, 1110-2, ..., 1110-N) may be set to a range of 0.5 to 1 wavelength. The second spacing (D2b) between adjacent second radiators (1120-1, 1120-2, ..., 1120-N) may be set to a range of 0.5 to 1 wavelength. Here, the wavelength corresponds to a wavelength (λ0) in free space corresponding to a maximum frequency within an operating frequency band. The first spacing (D1b) and the second spacing (D2b) may be formed at the same spacing.

[0139] The first spacing (D1b) and the second spacing (D2b) may be set similarly to the spacing between adjacent radiators in the array antenna. If the first spacing (D1b) and the second spacing (D2b) are set to be smaller than 0.5 wavelength, interference between adjacent radiators may cause performance degradation such as a decrease in array gain. If the first spacing (D1b) and the second spacing (D2b) are larger than 1 wavelength, a grating lobe may occur, which may reduce the efficiency of the array antenna. In particular, the structure of Fig. 13b has a beam steering angle that is 0 degrees different from the vertical angle compared to the structure of Fig. 13a, and as the beam steering angle increases, the level of the grating lobe or side lobe may increase. In addition, as the spacing between the array antennas increases, the area occupied by the repeater increases, so it is necessary to efficiently utilize the performance of the repeater with a minimum space.

[0140] Meanwhile, a relay device transmitting a wireless signal according to the present specification may be placed on the inner side of an elevator door or a fire door, as shown in FIG. 2. In this regard, FIG. 14 illustrates structures in which a relay device may be placed on the inner side of an elevator door or a fire door.

[0141] Referring to FIG. 2(c) and FIG. 14(a), a relay device (1000) may be placed in a side area (SR1) inside an elevator door (30). Referring to FIG. 2(d) and FIG. 14(b), a relay device (1000) may be placed in an upper area (UR) and a side area (SR2) of a fire door (40).

[0142] Referring to FIGS. 2 and 14, the antenna of the relay device may be implemented with a dual polarization structure. In this regard, in indoor environments within buildings, a lot of scattering of radio waves occurs, and the direction of polarization may be rotated by reflection. Meanwhile, in environments other than LOS (Line-of-Sight), the probability of polarization mismatch occurring between the base station and the passive relay device is very high.

[0143] If there is an obstacle between the base station and the passive repeater, it is not known which polarization will arrive, so the outdoor antenna should also apply dual polarization to increase the reception probability. The deployable area of ​​the metal elevator door (30) can be formed by the side area (SR1) inside the door (30). The deployable area of ​​the metal fire door (40) can include the upper area (UR) and the side area (SR2) of the "ㄱ" shape. If the repeater supports single polarization, the polarization of the transmitted signal must be adjusted to match the polarization of the received signal.

[0144] However, when a relay device is placed on an elevator door (30) or a fire door (40), it is not easy to change the polarization of the radiator. Therefore, the relay device needs to be designed to support dual polarization.

[0145] In this regard, Figs. 15a and 15b illustrate the radiator structures of a relay device arranged on one side of the inside and the outside of a door. Fig. 15a illustrates the door arrangement structure of a relay device having a single radiator. Fig. 15b illustrates the door arrangement structure of a relay device having an array structure of multiple radiators. Meanwhile, Fig. 16a illustrates beam patterns by the radiator of the relay device of Fig. 15a. Fig. 16b illustrates beam patterns by the radiator of the relay device of Figs. 13b and 15b.

[0146] Referring to FIGS. 2, 14, and 15a, a relay device (1000) may be placed on an elevator door (30) or a fire door (40). A first metal pattern (1110) may be placed on one side of the door (30) or the fire door (40), and a second metal pattern (1120) may be placed on the other side of the door (30) or the fire door (40). A flexible substrate having a transmission line (1300L) formed thereon may be placed on the inner side of the door (30) or the fire door (40).

[0147] Referring to FIGS. 2, 14, and 15b, a relay device (1000) may be placed on an elevator door (30) or a fire door (40). First radiators (1110-1, 1110-2) may be placed on one side of the door (30) or the fire door (40), and second radiators (1120-1, 1120-2) may be placed on the other side of the door (30) or the fire door (40). A flexible substrate having transmission lines (1300-1, 1300-2) formed on the inner side of the door (30) or the fire door (40) may be placed.

[0148] Referring to FIGS. 2, 4 to 8, and 13a to 15b, the first metal pattern (1110) can form first radiators (1110-1, 1110-2, ..., 1110-N) spaced apart at a first interval on a second axis perpendicular to one axis of the first surface of the structure (30, 40). The second metal pattern (1120) can form second radiators (1120-1, 1120-2, ..., 1120-N) spaced apart at a second interval equal to the first interval on a second axis perpendicular to one axis of the second surface of the structure (30, 40). The transmission line (1300L) may include a plurality of transmission lines (1300-1, 1300-2, ..., 1300-N) configured to connect each of the first radiators (1110-1, 1110-2, ..., 1110-N) and each of the second radiators (1120-1, 1120-2, ..., 1120-N).

[0149] Each of the first radiators (1110-1, 1110-2, ..., 1110-N), each of the second radiators (1120-1, 1120-2, ..., 1120-N), and each of the transmission lines (1300-1, 1300-2, ..., 1300-N) may form a respective sub-module. Each of the sub-modules may be expanded and arranged in multiple units spaced apart from each other by a first interval on the other axis of the structure (30, 40).

[0150] Referring to FIGS. 15A and 16A, a first beam pattern (BP1) may be formed in a first region (R1) of a door (30) or a fire door (40) on which a first metal pattern (1110) is arranged. A second beam pattern (BP2) may be formed in a second region (R2) of a door (30) or a fire door (40) on which a second metal pattern (1120) is arranged.

[0151] Referring to FIGS. 13b, 15b, and 16b, a third beam pattern (BP3) may be formed in a first region (R1) of a door (30) or a fire door (40) in which first radiators (1110-1, ..., 1110-N) are arranged. A fourth beam pattern (BP4) may be formed in a second region (R2) of a door (30) or a fire door (40) in which second radiators (1120-1, ..., 1120-N) are arranged.

[0152] The beam width of the first beam pattern (BP1b) of the first radiators (1110-1, ..., 1110-N) may be formed to be narrower than the beam width of the first beam pattern (BP1) of a single radiator. The beam width of the second beam pattern (BP2b) of the second radiators (1120-1, ..., 1120-N) may be formed to be narrower than the beam width of the second beam pattern (BP2) of a single radiator. The beam direction of the third beam pattern (BP3) may be changed in the upper and lower directions in the Y-axis direction by varying the lengths of the transmission lines or by using a phase shifter. The beam direction of the fourth beam pattern (BP4) may be changed in the upper and lower directions in the Y-axis direction by varying the lengths of the transmission lines or by using a phase shifter.

[0153] Referring to FIGS. 5, 13b, 15b, and 16b, the first metal pattern (1120) may form first radiators (1110-1, ..., 1110-N) that are spaced apart in the other axis (Y-axis) direction perpendicular to the first axis direction. The second metal pattern (1120) may form second radiators (1120-1, ..., 1120-N) that are spaced apart in the other axis (Y-axis) direction. The transmission line may include a plurality of transmission lines (1300b-1, ..., 1300b-N) configured to connect each of the second radiators (1120-1, ..., 1120-N) of the first radiators (1110-1, ..., 1110-N).

[0154] The door (30) or the fire door (40) forms a structure (30, 40) in which a relay device is arranged. The structure (30, 40) may form a door (30) or a fire door (40) made of a metal material. The first radiators (1110-1, ..., 1110-N) may be arranged on the front surface of the door (30) or the fire door (40). The second radiators (1120-1, ..., 1120-N) may be arranged on the rear surface of the door (30) or the fire door (40). The areas in which the first radiators (1110-1, ..., 1110-N) are arranged may correspond to the areas in which the second radiators (1120-1, ..., 1120-N) are arranged. The positions on the first surface of the structure (30, 40) where the first radiators (1110-1, ..., 1110-N) are arranged may correspond to the positions on the second surface of the structure (30, 40) where the second radiators (1120-1, ..., 1120-N) are arranged. Accordingly, even if either the front or the back surface of the door (30) or the fire door (40) corresponds to a shaded area, a wireless signal can be stably transmitted through the radiators arranged on the same area.

[0155] A first beam pattern (BP1) formed through the first radiators (1110-1, ..., 1110-N) may be formed to have a narrower beam width in the other axis (Y-axis) direction than in the one axis (X-axis) direction. A second beam pattern (BP2b) formed through the second radiators (1120-1, ..., 1120-N) may be formed to have a narrower beam width in the other axis (Y-axis) direction than in the one axis (X-axis) direction. A first spacing between the first radiators (1110-1, ..., 1110-N) adjacent to each other on the other axis (Y-axis) may be a value between 0.5 and 1 wavelength based on a wavelength corresponding to a maximum frequency within an operating frequency band. The second spacing of the adjacent second radiators (1120-1, ..., 1120-N) on the other axis (Y-axis) may be a value between 0.5 and 1 wavelength based on the wavelength corresponding to the maximum frequency within the operating frequency band.

[0156] Meanwhile, in a relay device transmitting a wireless signal according to the present specification, the transmission line may be implemented as a coaxial cable (1300C). In this regard, FIGS. 17 and 18 illustrate a relay device including first and second metal patterns on first and second substrates connected by a coaxial cable.

[0157] Fig. 17 is a perspective view of a relay device including first and second metal patterns on first and second substrates connected by a coaxial cable. Fig. 18 is a side view of a relay device including first and second metal patterns on first and second substrates connected by a coaxial cable.

[0158] Referring to FIGS. 17 and 18, the relay device (1000) may include a first substrate (1010) having a first metal pattern (1120) arranged thereon, a second substrate (1020) having a second metal pattern (1120) arranged thereon, and a coaxial cable (1300C) connecting the first and second metal patterns (1110, 1120). The coaxial cable (1300C) may form a vertical connection portion that vertically connects the first metal pattern (1110) and the second metal pattern (1120).

[0159] A first substrate (1010) having a first metal pattern (1120) arranged thereon may be arranged on one side of a door (30) or a fire door (40). A second substrate (1020) having a second metal pattern (1120) arranged thereon may be arranged on the other side of a door (30) or a fire door (40).

[0160] The above describes a relay device for transmitting wireless signals according to this specification. Below, the technical effects of the relay device for transmitting wireless signals according to this specification are described.

[0161] According to an embodiment of the present disclosure, by utilizing an antenna supporting dual polarization in a relay device, it is possible to prevent degradation of signal transmission characteristics due to polarization mismatch in an indoor environment.

[0162] According to an embodiment of the present disclosure, by utilizing an array antenna having radiators in an array structure in a relay device, the probability of signal reception in a shadow area can be increased.

[0163] According to an embodiment of the present disclosure, the modular structure allows for easy adjustment of the number of repeaters, and allows for adjustment of the gain of the repeater according to the adjustment of the number of repeaters, thereby enabling adaptation to various radio environments.

[0164] Further scope of the applicability of this disclosure will become apparent from the detailed description below. However, since various changes and modifications within the spirit and scope of this disclosure will become apparent to those skilled in the art, it should be understood that the detailed description and specific embodiments, such as the preferred embodiments of this disclosure, are given by way of example only. The detailed description should not be construed as limiting in any respect but rather as illustrative. The scope of this disclosure should be determined by a reasonable interpretation of the appended claims, and all changes coming within the scope of equivalents of this disclosure are intended to be embraced therein.

Claims

1. In the relay device, A first substrate having a first metal pattern arranged on one side thereof, the first metal pattern configured to receive a signal; A second substrate having a second metal pattern arranged on one surface corresponding to the first metal pattern; and A flexible substrate having one end connected to the first substrate, the other end connected to the second substrate, and having a transmission line on one surface, A relay device, wherein the first substrate, the second substrate, and the flexible substrate are arranged as an integrated module formed integrally to surround the first side, the second side, and the side between the first side and the second side of the structure to which the relay device is attached.

2. In paragraph 1, The first metal pattern forms first radiators spaced apart by a first interval on a second axis perpendicular to one axis of the first surface, The second metal pattern forms second radiators spaced apart at a second interval equal to the first interval on a second axis perpendicular to one axis of the second surface, The transmission line includes a plurality of transmission lines configured to connect each of the first radiators and each of the second radiators, Each of the first radiators, each of the second radiators and each of the transmission lines forms a respective sub module, A relay device in which each of the above sub-modules is arranged in a plurality of expanded units spaced apart from each other by the first interval on the other axis of the above structure.

3. In paragraph 2, The first spacing of the first radiators adjacent to the other axis and the second spacing of the second radiators are values ​​between 0.5 and 1 wavelength based on the wavelength corresponding to the maximum frequency within the operating frequency band, The first beam pattern formed through the first radiators has a beam width that is narrower in the other axis direction than in the one axis direction, A relay device, wherein the second beam pattern formed through the second radiators has a beam width that is narrower in the other axis direction than in the one axis direction.

4. In paragraph 2, The above structure forms a door made of metal material, The first radiators are arranged on the front surface of the door, and the second radiators are arranged on the rear surface of the door. A relay device, wherein the positions on the first surface where the first radiators are arranged correspond to the positions on the second surface where the second radiators are arranged.

5. In paragraph 1, A relay device in which the transmission line of the flexible substrate is arranged to extend to an inner region of the first substrate where the first metal pattern is formed, and is arranged to extend to an inner region of the second substrate where the second metal pattern is formed.

6. In paragraph 1, The signal received in the first region through the first metal pattern is transmitted to a second region different from the first region through the transmission line and the second metal pattern, A second signal received in the second region through the second metal pattern is transmitted to the first region through the transmission line and the first metal pattern, A relay device, wherein the first region is a region in the front direction where the first metal pattern is arranged, and the second region is a region in the front direction where the second metal pattern is arranged.

7. In paragraph 1, The above transmission line is implemented as a horizontal connection portion that horizontally connects the first metal pattern and the second metal pattern, The above flexible substrate is, First and second ground patterns formed on the front and back surfaces; and A relay device comprising the horizontal connecting portion arranged parallel to the first and second ground patterns between the first and second ground patterns.

8. In paragraph 7, The above horizontal connecting part, A first feed pattern configured to transmit a first polarized signal in the direction of one axis; and A relay device comprising a second feed pattern arranged parallel to and spaced apart from the first feed pattern so that a second polarized signal in a direction perpendicular to the direction of the first axis is transmitted.

9. In paragraph 8, The first substrate includes a first vertical connection via that vertically connects a first point of the first metal pattern and the first power supply pattern, and a second vertical connection via that vertically connects a second point of the first metal pattern and the second power supply pattern. A relay device, wherein the second substrate includes a third vertical connection via that vertically connects a third point of the second metal pattern and the first power supply pattern, and a fourth vertical connection via that vertically connects a fourth point of the second metal pattern and the second power supply pattern.

10. In paragraph 8, The above first substrate, A first ground layer disposed on the back surface of the first substrate; A first signal pattern layer arranged in an upper region in the Z-axis direction of the first ground layer; A second ground layer disposed in the upper region in the Z-axis direction of the first signal pattern layer; and A first antenna layer having the first metal pattern arranged in the upper region in the Z-axis direction of the second ground layer, A relay device, wherein a first dielectric layer is disposed between the first ground layer and the first signal pattern layer, a second dielectric layer is disposed between the first signal pattern layer and the second ground layer, and a third dielectric layer is disposed between the second ground layer and the first antenna layer.

11. In paragraph 10, The above second substrate, A third ground layer disposed on the back surface of the second substrate; A second signal pattern layer arranged in the upper region in the Z-axis direction of the third ground layer; A fourth ground layer disposed in the upper region in the Z-axis direction of the second signal pattern layer; and A second antenna layer having the second metal pattern arranged in the upper region in the Z-axis direction of the fourth ground layer, A relay device, wherein a fourth dielectric layer is disposed between the third ground layer and the second signal pattern layer, a fifth dielectric layer is disposed between the second signal pattern layer and the fourth ground layer, and a sixth dielectric layer is disposed between the fourth ground layer and the second antenna layer.

12. In paragraph 11, The first substrate further includes a first ground via vertically connecting the first ground layer and the second ground layer, and first and second vertical connection vias connecting the first metal pattern and the first signal pattern layer, The second substrate further includes a second ground via vertically connecting the third ground layer and the fourth ground layer, and third and fourth vertical connection vias connecting the second metal pattern and the second signal pattern layer. The first and second power supply patterns of the flexible substrate are arranged to extend to the first signal pattern layer of the first substrate, A relay device, wherein the first and second power supply patterns of the flexible substrate are arranged to extend to the second signal pattern layer of the second substrate.

13. In paragraph 11, The first metal pattern and the second metal pattern are arranged in a direction rotated by a first angle with respect to the X-axis, The first metal pattern and the second metal pattern are formed as square patches having first to fourth sides, A relay device wherein the first and second power supply patterns are arranged parallel to the Y-axis.

14. In paragraph 13, The first substrate further includes first and second parasitic patterns arranged parallel to a first side and a second side opposite to the first side of the first metal pattern, and third and fourth parasitic patches arranged parallel to a third side and a fourth side opposite to the third side, The second substrate further includes fifth and sixth parasitic patterns arranged parallel to the first side and the second side opposite the first side of the second metal pattern, and seventh and eighth parasitic patches arranged parallel to the third side and the fourth side opposite the third side, The first and third parasitic patches are formed with a first length and a first width, and the second and fourth parasitic patches are formed with a second length and a second width, A relay device, wherein the fifth and seventh parasitic patches are formed with the first length and the first width, and the sixth and eighth parasitic patches are formed with the second length and the second width.

15. In paragraph 8, The first and second ground patterns of the flexible substrate include metal mesh lines formed in a first axis and a second axis direction perpendicular to the first axis, Among the above metal mesh lines, a dielectric region is formed between adjacent metal mesh lines from which the metal pattern is removed, A relay device in which the spacing between the adjacent metal mesh lines is formed within a predetermined range based on 3.6 mm.

16. In paragraph 15, The third width of the first and second power supply patterns of the flexible substrate is formed with a characteristic impedance of less than 50 ohm within a predetermined range based on 100 um, A relay device, wherein the fourth width of the first and second power supply patterns formed on the first and second signal pattern layers of the first and second substrates is smaller than the third width and is formed with an impedance of 50 ohm.

17. In paragraph 8, The above flexible substrate is, A first vertical via configured to vertically connect the first and second ground patterns between the first horizontal connecting portion and the second horizontal connecting portion; a second vertical via configured to vertically connect the first and second ground patterns, spaced apart from the end of the first horizontal connecting portion; and Further comprising a third vertical via configured to vertically connect the first and second ground patterns, spaced apart from the end of the second horizontal connecting portion; A relay device, wherein a first horizontal distance between the first vertical via and the second vertical via and a second horizontal distance between the first vertical via and the third vertical via are set to be the same.

18. In paragraph 7, The above transmission line is implemented as a vertical connection portion formed perpendicular to the first metal pattern and the second metal pattern, The first substrate and the second substrate are connected through a flexible substrate, The above flexible substrate is, First and second ground patterns formed on the front and back surfaces; and A relay device comprising a vertical connecting portion arranged vertically between the first and second ground patterns.

19. In paragraph 18, The above vertical connection part, A first vertical via configured to vertically connect the center points of the first and second ground patterns; a second vertical via configured to vertically connect first points on one side of the first and second ground patterns; and A third vertical via configured to vertically connect second points on the other side of the first and second ground patterns, A relay device, wherein a first horizontal distance between the first vertical via and the second vertical via and a second horizontal distance between the first vertical via and the third vertical via are set to be the same.

20. In paragraph 17, A first polarized signal in the uniaxial direction is transmitted through a first waveguide region between the first vertical via and the second vertical via, A relay device in which a second polarized signal in a direction perpendicular to the above-mentioned one-axis direction is transmitted through a second waveguide region between the first vertical via and the third vertical via.

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