Integrated PCB based rogowski coils and e-field sensors

Abstract

A multi-sensor integrated PCB-based electrical measurement apparatus for measuring currents and voltages of electrical power lines. Current is measured using Rogowski coil based current sensors that detect the magnetic field encircling the electric power line. Voltage is measured using patch PCB electric field sensors that detect the electric field emanating from the electric power line.

Description

Docket No. 34704.2304 (940-0176 WO01 )INTEGRATED PCB BASED ROGOWSKI COILS AND E-FIELD SENSORSCROSS-REFERENCE TO RELATED APPLICATIONS

[0001] The present application is being filed on May 16, 2025, as a PCT International Application and claims the benefit of U.S. Patent Application Ser. No. 63 / 654,262, filed on May 31 , 2024, the disclosure of which is hereby incorporated by reference in its entirety.FIELD

[0002] The present disclosure relates to measurement instruments, and in particular, apparatus and methods of indirectly measuring electrical parameters.BACKGROUND

[0003] Utility companies generally take measurements on medium voltage power lines. Conventional voltage sensors are installed in some of the medium voltage power lines to monitor the electrical voltage magnitudes of the lines. They measure the voltage and report the measurement information back to a central office. Conventional current sensors are also used to make measurements and report the current measurement information back to the central office. Conventional current sensors are designed and manufactured in a quite different manner than conventional voltage sensors.

[0004] Conventional current sensors for electrical power lines are based on different technologies and approaches than conventional voltage sensors. For example, a conventional current sensor typically makes a current measurement using a current transformer and a Hall Effect sensor. Conventional voltage sensors operate in a fundamentally different manner than this, and as such, are constructed with different component parts and in a different manner. The conventional voltage sensors used by129072354-vlutility companies typically use a resistive or capacitive voltage divider to step the voltage down before making a voltage measurement.

[0005] Because voltage sensors operate in a fundamentally different manner and are manufactured much differently than current sensors, utility companies using conventional devices must use two different devices — one for making voltage measurements and another for current measurements.SUMMARY

[0006] Various embodiments of the present disclosure provide an integrated PCB- based multi-sensor electrical measurement apparatus with a pair of structural PCB boards oriented parallel to a plane. Each of the structural PCB boards has a concave inner edge shaped to fit partially around an electrical power line once the multi-sensor electrical measurement apparatus is mounted on the power line.

[0007] The multi-sensor electrical measurement apparatus includes a number of voltage sensor boards oriented substantially perpendicular to the plane of the structural PCB boards. The voltage sensor PCB boards are structurally mounted between the two structural boards. Each of the voltage sensor PCB boards has a parallel plate charge induction type electric field sensor formed on its layers for determining voltage.

[0008] The multi-sensor electrical measurement apparatus includes a number of current sensor PCB boards, each of which is oriented substantially perpendicular to the pair of structural PCB boards, and substantially parallel to a direction of current flow in the electrical power line. The current sensor PCB boards include a Rogowski coil current sensor. A number of Rogowski loops are formed multiple layers of each of the current sensor boards.

[0009] The voltage sensor PCB boards and the current sensor PCB boards are oriented such that a line bisecting each board and intersecting the edges of the board connecting it to the structural two boards is parallel to the electrical power line once the apparatus is mounted on the electrical power line. Each PCB-based current sensor board may include multiple layers, and each of the layers typically includes a number of Rogowski loops. The apparatus includes traces on various layers to electrically connect229072354-vlcomponents on the layer. The apparatus also includes a number of vias to electrically connect a trace or component on one layer to another layer.

[0010] The PCB-based current sensor boards have a number of current board layers including a first current board layer with a first Rogowski loop and a second current board layer with a second Rogowski loop. Each of the layers of the current sensor boards and voltage sensor boards includes a number of layer traces configured to electrically connect components on a given layer. Each of the layers of the current sensor boards and voltage sensor boards also includes a number of vias to electrically connect components or traces of one layer with components or traces of another layer.

[0011] Each of the PCB-based current sensor boards includes multiple sets of Rogowski loops interconnected by vias and traces. Each of the PCB-based voltage sensor boards includes multiple conductive plate layers. The conductive plate layers are connected to voltage detection circuitry by vias and traces.

[0012] Various embodiments include an integrated PCB-based multi-sensor electrical measurement apparatus that has a first structural board oriented parallel to a plane. The first structural board has a first concave inner edge shaped to fit partially around an electrical power line. The apparatus also has a second structural board oriented parallel to the plane. The second structural board has a second concave inner edge shaped like the first concave inner edge.

[0013] The integrated PCB-based multi-sensor electrical measurement apparatus includes a voltage sensor board oriented substantially perpendicular to the plane. The voltage sensor board includes a first voltage board edge structurally connected to the first structural board and a second voltage board edge structurally connected to the second structural board. A parallel plate charge induction type electric field sensor is formed on the voltage sensor board.

[0014] The integrated PCB-based multi-sensor electrical measurement apparatus includes a current sensor board oriented substantially perpendicular to the plane and substantially perpendicular to the voltage sensor board. The current sensor board has a number of Rogowski loops formed on it which are part of a Rogowski coil current sensor.329072354-vl

[0015] Various embodiments of the integrated PCB-based multi-sensor electrical measurement apparatus include multiple voltage sensor boards, each of which is oriented substantially perpendicular to the plane and each is structurally connected between the first structural board and the second structural board. Each of the voltage sensor boards includes a parallel plate charge induction type electric field sensor.

[0016] Various embodiments of the integrated PCB-based multi-sensor electrical measurement apparatus include multiple current sensor boards which are each oriented substantially perpendicular to the plane. Each of the current sensor boards is structurally connected between the first structural board and the second structural board. Each of the current sensor boards includes a number of layers each have one or more sets of Rogowski loops.BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Various aspects and advantageous features of the present disclosure will become more apparent to those of ordinary skill when described in the detailed description of preferred embodiments and reference to the accompanying drawings, wherein:

[0018] FIG. 1 depicts integrated current and voltage sensors for power lines with details of the Rogowski coil current sensor shown, in accordance with various embodiments disclosed herein.

[0019] FIG. 2 depicts integrated current and voltage sensors for electrical power lines with details of the voltage sensor, in accordance with various embodiments disclosed herein.

[0020] FIG. 3 depicts a PCB-based integrated current and voltage sensor 301 for electrical power lines, in accordance with various embodiments disclosed herein.

[0021] FIGS. 4A-C depict current sensor PCB board layers, in accordance with various embodiments disclosed herein.

[0022] FIGS. 5A-C depict voltage sensor PCB board layers, in accordance with various embodiments disclosed herein.

[0023] FIGS. 6A-B depict structural PCB boards, in accordance with various embodiments disclosed herein.429072354-vlDETAILED DESCRIPTION

[0024] The various embodiments disclosed herein provide a single device that measures both the alternating current and alternating voltage of an electrical power line, and methods of using the device. FIG. 1 depicts a current sensor 100 and voltage sensor 150 integrated together in enclosure 101 for making both current and voltage measurements on electrical power lines 105. The current sensor 100 includes a Rogowski coil 160 for making current measurements in accordance with various embodiments disclosed herein, details of which are illustrated in FIG. 1.

[0025] One advantage of the non-invasive Rogowski coil-based current sensor 100 is that it provides accurate current readings. Another advantage of Rogowski coil current sensors 100 is that they are easy to install around the cable or power line 105 to be measured. Further, the manufacturing process for a current sensor 100 using a Rogowski coil 160 tends to be fairly straight forward. Printed circuit board (PCB) industrialization processes can be adapted to produce PCB-based Rogowski coils 160 having complex structures with strict tolerances leading to accurate and precise current measurements.

[0026] The various embodiments disclosed herein include a single mechanical structure with a single composited sensor that captures the current through its integrated Rogowski coil 160, and measures the electric field around the cable 105. In FIG. 1 , the enclosure 101 contains a voltage sensor 150, and a current sensor 100 with a Rogowski coil 160. The current sensor 100 is used to measure alternating current icin electrical power line 105 in the following manner. An alternating current, such as ic, passing through an electrical power line 105 or other conductor causes a corresponding alternating magnetic field with circular lines of magnetic flux Bm that encircle the electrical power line 105. The circular lines of magnetic flux Bm are oriented in the direction b, as shown in FIG. 1 , given the direction of the current ic, as is understood from the Curl Right-Hand Rule.

[0027] The Rogowski coil 160 includes a conductor 103 formed in a large loop — large enough for the electrical power line 105 to pass through the large loop 103 as shown in FIG. 1 . At the end of the large loop the conductor 103 is doubled back and curled around itself to form a number of smaller loops 107 around the large loop. The529072354-vlloops 107 may be called Rogowski loops. The electrical power line 105, which passes through the large loop, carries an alternating current icwhich in turn produces circular lines of magnetic flux Bmaround itself. Some of the magnetic flux lines Bmpass through the small loops 107 of the Rogowski coil 160. This induces a small voltage v(t) across the terminals of the Rogowski coil 160 which are electrically connected to current measurement circuitry 109.

[0028] The current measurement circuitry 109 may include a lossy integrator circuit that outputs a voltage Vout which is proportional to the AC current passing through electrical power line 105. Other current measurement circuitry known to those of ordinary skill in the art may be used in the current measurement circuitry 109. In this way the induced voltage v(t) which is proportional to the AC current passing through electrical power line 105 is measured by current measurement circuitry 109 of the current sensor 100.

[0029] FIG. 2 depicts enclosure 201 containing an integrated current sensor 200 and voltage sensor 250 for electrical power lines, in accordance with various embodiments disclosed herein. FIG. 2 illustrates details of the voltage sensor 250. The present inventors recognized that electric field measurements taken near electrical power lines are very useful for making indirect and non-invasive voltage measurements of the power lines. Although the conventional thought is that e-field voltage sensors don't generally have the precision of voltage divider based sensors, the present inventors appreciate the usefulness of integrating an e-field voltage sensor with a current sensor within the same enclosure. The in-field installation of such an integrated current / voltage sensor is much easier and cost effective than the installation of a voltage divider-based voltage sensor. The voltage sensor 250 may be implemented as a PCB-based patch e- field voltage sensor.

[0030] The voltage sensor 250 of FIG. 2 includes a parallel plate charge induction type sensor. The electric field from an electrical power line emanates outward from the line in the direction e shown for electrical power line 105 of FIG. 1 . The electric field has a magnitude closely related to voltage and useful for determining an approximation of the voltage level. Turning to FIG. 2, the conductive plates 211 -212 in voltage sensor 250 are oriented perpendicular to the e-field emanating from the electrical power lines.629072354-vlIn the presence of an e-field each of the conductive plates 211 -212 induces an electric charge, putting it at a potential voltage that is dependent upon the e-field magnitude at the conductive plate 211 -212, and thus, its distance from the power line. The charge on conductive plates 211-212 creates a voltage Ve between conductive plates 211 -212. Voltage detection circuitry 213 detects the voltage Ve between conductive plates 211- 212. This allows monitoring of the e-field which changes in response to the AC voltage of the electrical power line. The conductive plates 211 -212 typically consist of copper formed on the PCB board containing the circuitry of voltage sensor 250, but may be made of any suitable conductive material known to those of ordinary skill in the art.

[0031] The electric field measurement may be achieved using a single voltage sensor 250 measuring the voltage difference between two points of the space near the electrical power line. But using only a single voltage sensor 250 could result in inaccuracies due to interference in the e-field from electromagnetic radiation, other power lines or other sources of EMF. To avoid inaccuracies multiple voltage sensors 250 are positioned around the electrical power line. Their respective detected voltages may be averaged to offset inaccuracies introduced by outside sources of EMF.

[0032] FIG. 3 depicts a PCB-based integrated current and voltage sensor 301 for electrical power lines, in accordance with various embodiments disclosed herein. The present inventors recognized a number of advantages to be realized in integrating the current sensor and voltage sensor for power lines. For example, placing both sensors in the same mechanical structure with a single enclosure requires less space and weight than having a separate sensor device for each measurement hanging on the electrical power line. The integrated current / voltage sensor reduces the size of the measure solutions considerably.

[0033] PCB-based integrated current and voltage sensor 301 includes, PCB-based Rogowski coil current sensor boards 300, PCB-based e-field voltage sensor boards 350 and structural PCB boards 311 -314. The PCB-based integrated current and voltage sensor 301 embodiment depicted in FIG. 3 includes two C-shaped semicircular halves that mount around an electrical power line. These structural PCB boards 311 -314 are approximately semicircular so that the concave inner edge fits around an electrical729072354-vlpower line. The structural PCB boards 311-314 support the current sensor boards 300 and the voltage sensor boards 350, providing structural integrity to the device.

[0034] Once the PCB-based integrated current and voltage sensor 301 is mounted on an electrical power line the inner edge sits closest to the power line and the outer edge is positioned furthest away. Upon being fitted together the concave inner edges of the two halves form a circular hole larger than the electrical power line to be measured. In other implementations the structural PCB boards 311 -314 may take other shapes such as that of a right triangle so as to create a square hole that fits around the electrical power line. However, the semicircular structural PCB boards 311-314 are advantageous in that they allow the PCB-based Rogowski coil current sensor boards 300 to be positioned close to the surface of the electrical power line all the way around. The outer edge — the convex edge — of the C-shaped structural PCB boards 311-314 has a portion that extends outward for connectors, circuitry or other components. This can be seen more clearly in FIGS. 6A-B. The outer edge may be implemented in any shape to accommodate addition circuitry, connectors, or other components, or to enhance the structural integrity of the device.

[0035] A number of PCB-based Rogowski coil current sensor boards 300 are mounted between structural PCB boards 311-312 (the bottom half in FIG. 3) and also between PCB boards 313-314 (the top half). Each of the PCB-based Rogowski coil current sensor boards 300 may have multiple layers with a number of components on each layer. Details of layers of a PCB-based current sensor 300 implementation are depicted in FIGS. 4A-C.

[0036] The PCB-based Rogowski coil current sensor boards 300 are oriented in-line with the electrical power line, and sit on their edges extending outward from the electrical power line, like fins. A line 317 bisecting the center axis of each Rogowski coil current sensor board 300, and intersecting the edges connecting it between two of the structural PCB boards 311 -314, is parallel to the direction 321 of the electrical power line and perpendicular to the structural PCB boards 311 -314 between which it is mounted. This orientation allows the Rogowski coil loops to catch magnetic flux Bm circling the electrical power line.829072354-vl

[0037] Each PCB-based Rogowski coil current sensor board 300 may have multiple layers of circuitry. Each layer may have many Rogowski coil loops. The Rogowski coil loops are electrically connected in series to be the electrical equivalent of the Rogowski coil depicted in FIG. 1. The Rogowski coil loops are electrically connected by traces on the PCB boards, vias (sometimes called via holes) and connectors between the Rogowski coil current sensor boards 300 and the structural PCB boards 311 -312.Thus, each Rogowski coil current sensor board 300 may have 100, or 200 or more loops on it. The Rogowski coil loops on adjacent layers of a given current sensor board 300 are connected by vias between the layers. Adjacent Rogowski coil current sensor boards 300 are electrically connected by connectors and traces on the structural PCB boards 311 -314 on which the current sensor boards 300 are mounted.

[0038] A number of PCB-based e-field voltage sensor boards 350 are mounted between structural PCB boards 311 -312 and also between PCB boards 313-314. Each of the PCB-based e-field voltage sensor boards 350 may have multiple layers with a number of components on each layer. Details of the layers of a PCB-based patch e- field voltage sensor implementation are depicted in FIGS. 5A-C.

[0039] The PCB-based e-field voltage sensor boards 350 are oriented in-line with the electrical power line, with their flat surface oriented flat with respect to the outer surface of the electrical power line. A line 319 bisecting a center axis of each e-field voltage sensor board 350, and intersecting the edges connecting it between two of the structural PCB boards 311 -314, is parallel to the direction 321 of the electrical power line and perpendicular to the structural PCB boards 311 -314 between which it is mounted. This orientation allows the e-field to emanate outward from the electrical power line and strike the surface of the conductive plates contained in the PCB-based e-field voltage sensor boards 350.

[0040] Another advantage is that at least part of the mechanical structure of the sensors can be reused. For example, the structural boards 311 -314 used to structure and hold the PCB-based Rogowski coil current sensor boards 300, are also used in the various embodiments to position the PCB-based e-field voltage sensor boards 350. Mechanical stability of the sensor solution is also advantageous. Since both solutions are intertwined creating a single mechanical structure, this mechanical structure is more929072354-vlrobust than conventional solutions in which both sensors are separated. The various embodiments are also easy to open and close around the power line cable. The mechanical structure may be implemented in two halves 370 and 371 . This makes it easy and convenient to close the structure around the cable.

[0041] A further advantage of the various embodiments is that implementing the current and voltage sensor electronics on a PCB allows the possibility of providing for signal processing or connectivity on the same PCB. Since the sensor solution is PCB based, placing additional connectors for signal extraction, or even some signal conditioning, may be more straightforward than if the current sensor and voltage sensor were not PCB based.

[0042] The present inventors recognized that the e-field surrounding the power line is rich with information that remains untapped by conventional sensors. Conventional devices traditionally measure the electric field with only a single board, positioned at one place on the electrical power line. Thus, the conventional devices typically only measure the e-field in a single position. However, the PCB-based implementation 301 disclosed herein measures the e-field using multiple e-field voltage sensor boards 350 positioned around the electrical power line, as illustrated in FIG. 3. In this way the various embodiments disclosed herein make it possible to measure the e-field all around the cable to provide a more accurate voltage measurement that is less susceptible to outside EMF interference. The various embodiments can also provide groups of boards joined in different ADC channels, so that the processor can analyze the strength and direction of the electric field around the cable for measurement quality purposes.

[0043] Some embodiments include a number of sets of integrated Rogowski coil windings so as to provide multiple separate Rogowski coils each having a different gain. FIG. 3 depicts the integrated current and voltage sensor 301 implemented in two C- shaped sections that fit around an electrical power line. However, some embodiments may be implemented to have more than two sections that fit together around the electrical power line — e.g., three sections, four sections, or more.

[0044] FIGS. 4A-C depict current sensor PCB board layers — e.g., layers of current sensor boards 300, in accordance with various embodiments disclosed herein. Each1029072354-vllayer includes a number of vias to electrically connect a trace or component on one layer to another layer of a given current sensor board 300. Some of the vias may be pass-through vias that electrically connect two components (or traces) on non-adjacent layers. FIG. 4A is a bottom solder resist layer with copper pads configured to accept a solder connection to a trace, a wire or a component. FIG. 4B is the bottom Rogowski loop layer and FIG. 4C is inner Rogowski loop layer 6.

[0045] FIGS. 4B-C both include multiple Rogowski loops that are similar, in an electrical sense, to Rogowski loops 107 of FIG. 1 . The current sensor PCB board layers of FIGS. 4A-C are oriented with their central axis 317 parallel to the electrical power line being measured, that is, parallel to direction 321 which is also shown in FIG. 3. The axis 318, which is perpendicular to axis 317, is oriented to extend outward from the electrical power line being measured. The axis 380 is parallel to the structural boards 311 -314 of FIG. 3.

[0046] FIGS. 5A-C depict voltage sensor PCB board layers — e.g., layers of voltage sensor boards 350, in accordance with various embodiments disclosed herein. As with the current sensor layers, each layer of the voltage sensor boards includes a number of vias to electrically connect a trace or component on one layer to another layer of a given voltage sensor board 350. Some of the vias may be pass-through vias that electrically connect two components (or traces) on non-adjacent layers. FIGS. 5A-C depict different layers of a voltage sensor board 350. FIG. 5A is the top copper layer. FIG. 5B is an inner copper layer. FIG. 5C is the bottom copper layer. The illustrated embodiments discuss copper as a conductor on the various layers. In various other implementations other conductive metals may be used, as is known by those of ordinary skill in the art.

[0047] The voltage sensor PCB board layers of FIGS. 5A-C are oriented with their central axis 319 parallel to the electrical power line being measured, that is, parallel to direction 321 . The axis 320 is perpendicular to axis 319, and is also perpendicular to a line extending outward from the electrical power line being measured. The axis 320 is parallel to the structural boards 311-314 of FIG. 3.

[0048] FIGS. 6A-B depict structural PCB boards 313-314, in accordance with various embodiments disclosed herein. PCB boards 311 -312 are similar to PCB boards 313-1129072354-vl314 shown in the figure. The implementation of structural PCB boards 313-314 depicted in the figure are approximately C-shaped, or semicircular, with concave inner edges 323 and 325 that fits around an electrical power line. The structural PCB boards 313-314 support current sensor boards 300, voltage sensor boards 350 and other components, and also provide electrical connections between the boards and various components. Structural PCB boards 313-314 (and also boards 311-312) have a portion that extends outward for connectors, circuitry or other components.

[0049] Once the PCB-based integrated current and voltage sensor 301 is mounted on an electrical power line the inner edges 327 fit closely (e.g., within 0.5 inch) the electrical power line. The outer edges of PCB boards 313-314 are positioned furthest away from the electrical power line. Upon being fitted together the concave inner edges 323 and 325 of PCB boards 313-314 and the concave inner edges of PCB boards 311 - 312 form circular holes that are at least slightly larger than the electrical power line to be measured.

[0050] The phrase “substantially perpendicular” is defined to mean an angle within perpendicular (i.e. , 90 degrees) + / - 15 degrees. For example, a voltage sensor board that is oriented substantially perpendicular to a plane may be set at an angle of anywhere from 75 to 105 degrees from the plane (90 + / - 15 degrees). The phrase “substantially parallel” is defined to mean an orientation parallel (i.e., at an angle 0 degrees from) + / - 15 degrees. The phrase “approximately perpendicular” is defined to mean perpendicular + / - 5 degrees. The phrase “approximately parallel” is defined to mean perpendicular + / - 5 degrees.

[0051] One of ordinary skill will appreciate that the exact dimensions and materials are not critical to the disclosure and all suitable variations should be deemed to be within the scope of the disclosure if deemed suitable for carrying out the objects of the disclosure. The phrase “structurally connected” means that two items are physically connected to each other. For example, two bricks may be structurally connected by applying a layer of mortar in between them. Also, a nut may be structurally connected to a bolt by tightening it down onto the bolt. Two components are “electrically connected” if there is a conductive path between them. In some instances, two items1229072354-vlmay be electrically connected via one or more components, e.g., capacitors, resistors, PCB vias, PCB traces, or the like.

[0052] The phrase “PCB-based” is used herein to mean that a circuit or electronic device has a majority of its components implemented on one or more PCB boards. The PCB board(s) may contain some components that are deposited on the boards (or deposited / etched on) and other components that are soldered on or otherwise electrically and structurally connected to the board(s).

[0053] One of ordinary skill in the art will also readily appreciate that it is well within the ability of the ordinarily skilled artisan to modify one or more of the constituent parts for carrying out the various embodiments of the disclosure. Once armed with the present specification, routine experimentation is all that is needed to determine adjustments and modifications that will carry out the present disclosure.

[0054] The above embodiments are for illustrative purposes and are not intended to limit the scope of the disclosure or the adaptation of the features described herein to particular optical voltage sensing systems or electro-optic crystal assemblies. Those skilled in the art will also appreciate that various adaptations and modifications of the above-described preferred embodiments can be configured without departing from the scope and spirit of the disclosure. Therefore, it is to be understood that, within the scope of the appended claims, the invention may be practiced other than as specifically described.1329072354-vl

Claims

CLAIMSWhat is claimed is:1 . An integrated PCB-based multi-sensor electrical measurement apparatus configured to measure current and voltage of an electrical power line, the apparatus comprising: a structural board oriented parallel to a plane and having a concave inner edge and an outer edge, wherein the concave inner edge is shaped to fit partially around the electrical power line; a voltage sensor board oriented substantially perpendicular to the plane, the voltage sensor board including first and second voltage board edges, the first voltage board edge being structurally connected to the structural board; a parallel plate charge induction type electric field sensor formed on the voltage sensor board; a current sensor board oriented substantially perpendicular to the plane and substantially parallel to a direction of current flow in the electrical power line; and a Rogowski coil current sensor including a first Rogowski loop formed on the current sensor board.

2. The apparatus according to claim 1 , wherein a line bisecting the voltage sensor board and intersecting the first voltage board edge is parallel to the electrical power line upon mounting the integrated PCB-based multi-sensor electrical measurement apparatus on the electrical power line.

3. The apparatus according to claim 1 or 2, wherein the structural board is a first PCB- based structural board, the voltage sensor board is a PCB-based voltage sensor board and the current sensor board is a PCB-based current sensor board, the apparatus further comprising: a second PCB-based structural board oriented substantially parallel to the first PCB-based structural board.1429072354-vl4. The apparatus according to any of claims 1 to 3, wherein the PCB-based current sensor board comprises: a plurality of current board layers comprising a first current board layer including the first Rogowski loop and a second current board layer including a second Rogowski loop.

5. The apparatus according to claim 4, wherein the first current board layer comprises a first plurality of Rogowski loops including the first Rogowski loop; and wherein the second current board layer comprises a second plurality of Rogowski loops including the second Rogowski loop.

6. The apparatus according to claims 4 or 5, further comprising: a plurality of layer traces configured to electrically connect components on a given layer among the plurality of current board layers, the plurality of layer traces including a first layer trace on the first current board layer and a second layer trace on the second current board layer; and a plurality of vias configured to electrically connect the first layer trace and the second layer trace, the plurality of vias including a first via and a second via.

7. The apparatus according to claim 6, wherein the first Rogowski loop on the first current board layer is electrically connected by said first via to the second Rogowski loop on the second current board layer.

8. The apparatus according to any one of claims 4 to 7, wherein the PCB-based current sensor board is a first PCB-based current sensor board, the apparatus further comprising: a plurality of the PCB-based current sensor boards including the first PCB-based current sensor board and a second PCB-based current sensor board.

9. The apparatus according to claims 5 to 8, wherein each of the plurality of the PCB- based current sensor boards comprises a plurality of Rogowski loops including the first1529072354-vland second pluralities of Rogowski loops on the first PCB-based current sensor board and a third plurality of Rogowski loops on the second PCB-based current sensor board.

10. The apparatus according to any one of claims 3 to 9, wherein the PCB-based voltage sensor board comprises: a plurality of voltage board layers including a first conductive plate layer and a second conductive plate layer of the parallel plate charge induction type electric field sensing sensor.11 . The apparatus according to any one of claims 3 to 10, wherein the PCB-based voltage sensor board is a first PCB-based voltage sensor board, the apparatus further comprising: a plurality of PCB-based voltage sensor boards including the first PCB-based voltage sensor board and a second PCB-based voltage sensor board.

12. The apparatus according to any one of claims 3 to 11 , wherein the first PCB-based current sensor board and the second PCB-based current sensor board are each mounted between the first and second PCB-based structural boards; and wherein the PCB-based current sensor board and the second PCB-based current sensor board are each oriented substantially perpendicular to the second PCB-based structural board.

13. The apparatus according to claim any one of claims 3 to 12, wherein the first PCB-based voltage sensor board and the second PCB-based voltage sensor board are each mounted between the first and second PCB-based structural boards; and wherein the first PCB-based voltage sensor board and the second PCB-based voltage sensor board are each oriented substantially perpendicular to the second PCB- based structural board.1629072354-vl14. An integrated PCB-based multi-sensor electrical measurement apparatus comprising: a first structural board oriented parallel to a plane and having a first concave inner edge, wherein the first concave inner edge is shaped to fit partially around an electrical power line; a second structural board oriented parallel to the plane and having a second concave inner edge shaped like the first concave inner edge; a voltage sensor board oriented substantially perpendicular to the plane, the voltage sensor board including a first voltage board edge structurally connected to the first structural board and a second voltage board edge structurally connected to the second structural board; a parallel plate charge induction type electric field sensor formed on the voltage sensor board; a current sensor board oriented substantially perpendicular to the plane and substantially perpendicular to the voltage sensor board; and a Rogowski coil current sensor including a plurality of Rogowski loops formed on the current sensor board.

15. The apparatus according to claim 14, further comprising: a plurality of voltage sensor boards each oriented substantially perpendicular to the plane and each being structurally connected between the first structural board and the second structural board.

16. The apparatus according to claim 15, wherein each of the plurality of voltage sensor boards comprises a parallel plate charge induction type electric field sensor.

17. The apparatus according to claims 15 or 16, wherein the plurality of Rogowski loops is a first plurality of Rogowski loops, the apparatus further comprising: a plurality of current sensor boards each oriented substantially perpendicular to the plane and each being structurally connected between the first structural board and the second structural board.1729072354-vl18. The apparatus according to claim 17, wherein each of the plurality of current sensor boards comprises a plurality of Rogowski loops, a first current sensor board comprising the first plurality of Rogowski loops and a second current sensor board comprising a second plurality of Rogowski loops.1829072354-vl

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