Light-emitting panel, light-emitting apparatus, and automobile

Abstract

A light-emitting panel, a light-emitting apparatus, and an automobile, which relate to the technical field of display. The light-emitting panel includes a display area and a border area surrounding the display area. In the border area, the light-emitting panel includes: a substrate; a first conductive layer disposed on one side of the substrate; one or more transparent conductive layers disposed on the side of the first conductive layer that faces away from the substrate, wherein each transparent conductive layer includes a plurality of transparent conductive patterns and one or more insulating patterns disposed between the plurality of transparent conductive patterns; and a second conductive layer disposed on the side of the one or more transparent conductive layers that is away from the substrate, wherein the second conductive layer is in communication with the first conductive layer by means of a plurality of transparent conductive patterns. Each of the insulating patterns includes a first surface and a second surface disposed opposite to each other, and the first surface is attached to the first conductive layer, and / or, the second surface is attached to the second conductive layer.

Description

Light-emitting panels, lighting devices, and automobiles

[0001] Cross-references to related applications

[0002] This application claims priority to Chinese Patent Application No. 2024108145106, filed on June 21, 2024, entitled "A Light-Emitting Panel, Light-Emitting Device and Automobile", the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of display technology, and more specifically, to a light-emitting panel, a light-emitting device, and an automobile. Background Technology

[0004] Organic light-emitting diode (OLED) display technology features self-illumination, wide viewing angle, wide color gamut, high contrast, thinness, foldability, flexibility, and portability, making it a major research direction in the display field. Currently, LED technology is the primary technology used in car taillights on the market.

[0005] However, for automotive lighting products using large-size passive matrix organic light-emitting diodes (PMOLED), the overlapping area of ​​the source / drain layer, anode layer, and cathode layer in the OLED panel is too large. During the anode process, snowflake discharge can occur in the overlapping area of ​​the anode layer and the source / drain layer, resulting in snowflake-like defects on the OLED panel.

[0006] Overview

[0007] This application provides a light-emitting panel, a light-emitting device, and an automobile, aiming to solve the problem of how to eliminate snowflake-like defects in OLED products.

[0008] A first aspect of this application provides a light-emitting panel, the light-emitting panel including a display area and a border area surrounding the display area, wherein the light-emitting panel includes:

[0009] substrate;

[0010] A first conductive layer is disposed on one side of the substrate;

[0011] One or more transparent conductive layers, the one or more transparent conductive layers being disposed on the side of the first conductive layer opposite to the substrate, and each of the one or more transparent conductive layers comprising a plurality of transparent conductive patterns, and one or more insulating patterns disposed between the plurality of transparent conductive patterns; and;

[0012] A second conductive layer is disposed on the side of the one or more transparent conductive layers facing away from the substrate, and the second conductive layer is connected to the first conductive layer through the plurality of transparent conductive patterns;

[0013] Each of the one or more insulating patterns includes a first surface and a second surface disposed opposite to each other, the first surface being disposed in conjunction with the first conductive layer, and / or the second surface being disposed in conjunction with the second conductive layer.

[0014] In one alternative embodiment, the one or more insulating patterns include a plurality of insulating patterns that are spaced apart from each other and arranged in an array along the row and column directions, with adjacent rows of insulating patterns aligned with each other or at least partially staggered in the column direction.

[0015] In one optional embodiment, the one or more transparent conductive layers include a plurality of transparent conductive layers stacked together, the plurality of transparent conductive layers including a first transparent conductive layer and a second transparent conductive layer disposed adjacent to each other, wherein the orthographic projection of a plurality of transparent conductive patterns in the first transparent conductive layer on the substrate overlaps with the orthographic projection of a plurality of transparent conductive patterns in the second transparent conductive layer on the substrate.

[0016] In one optional embodiment, the orthographic projection of the plurality of insulating patterns in the first transparent conductive layer onto the substrate is located within the orthographic projection range of the plurality of transparent conductive patterns in the second transparent conductive layer onto the substrate.

[0017] The orthographic projection of the plurality of insulating patterns in the second transparent conductive layer onto the substrate is located within the orthographic projection range of the plurality of transparent conductive patterns in the first transparent conductive layer onto the substrate.

[0018] In one optional embodiment, in the orthographic projection of the substrate, a plurality of insulating patterns of the first transparent conductive layer are disposed approximately centered within a plurality of transparent conductive patterns in the second transparent conductive layer, and a plurality of insulating patterns of the second transparent conductive layer are disposed approximately centered within a plurality of transparent conductive patterns in the first transparent conductive layer.

[0019] In one alternative embodiment, in the orthographic projection on the substrate, the area of ​​the plurality of transparent conductive patterns in the first transparent conductive layer is smaller than the area of ​​the plurality of insulating patterns in the first transparent conductive layer.

[0020] In the orthographic projection on the substrate, the area of ​​the plurality of transparent conductive patterns in the second transparent conductive layer is smaller than the area of ​​the plurality of insulating patterns in the second transparent conductive layer.

[0021] In one optional embodiment, the plurality of transparent conductive patterns in the first transparent conductive layer are a plurality of first sub-patterns arranged in an array along the row and column directions, with adjacent rows of first sub-patterns staggered in the column direction, and the gaps between adjacent first sub-patterns filled with insulating patterns of the first transparent conductive layer.

[0022] The multiple transparent conductive patterns in the second transparent conductive layer are multiple second sub-patterns arranged in an array along the row direction and the column direction. The second sub-patterns in two adjacent rows are aligned with each other in the column direction, and the gaps between adjacent second sub-patterns are filled with the insulating pattern of the second transparent conductive layer.

[0023] In one alternative embodiment, in both the row direction and the column direction, the orthographic projection of the first sub-pattern on the substrate overlaps with the orthographic projections of two adjacent second sub-patterns on the substrate.

[0024] In one alternative embodiment, in the orthographic projection of the substrate, in the row direction and the column direction, two adjacent second sub-patterns that overlap with the same first sub-pattern in the second transparent conductive layer are symmetrically arranged about the first sub-pattern.

[0025] In one optional embodiment, the first transparent conductive layer is disposed close to the second conductive layer, and a plurality of insulating patterns in the first transparent conductive layer are attached to the second conductive layer on one side surface close to the second conductive layer, and a plurality of insulating patterns in the second transparent conductive layer are attached to the first conductive layer on one side surface close to the first conductive layer.

[0026] In one alternative embodiment, in the orthographic projection of the substrate, there is a first gap between the plurality of insulating patterns in the adjacent first transparent conductive layer and the plurality of insulating patterns in the second transparent conductive layer.

[0027] In one alternative embodiment, the thickness of the insulating pattern along the first direction is less than or equal to the thickness of the transparent conductive layer along the first direction, where the first direction is the direction from the first conductive layer to the transparent conductive layer.

[0028] In one alternative embodiment, the orthographic projection shape of the insulating pattern on the substrate is a polygon, an arc, or a combination of polygons and arcs.

[0029] In one alternative implementation, the border area includes:

[0030] Binding area, the binding area being disposed on one side of the display area; and

[0031] The overlapping area is disposed on the three sides of the display area other than the bonding area, wherein the transparent conductive layer is disposed within the overlapping area.

[0032] In one optional embodiment, the display area includes a light-emitting device, which includes a first electrode, a light-emitting layer, and a second electrode stacked sequentially. The first electrode is disposed in the same layer as the transparent conductive layer and is made of the same material, and the second electrode is disposed in the same layer as the second conductive layer and is made of the same material.

[0033] A second aspect of this application provides a light-emitting device, the light-emitting device including the light-emitting panel described in any one of the first aspects.

[0034] A third aspect of this application provides an automobile, the automobile including the light-emitting device described in the second aspect, wherein the light-emitting device is the vehicle's headlight.

[0035] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, the following are specific embodiments of this application.

[0036] Brief description of the attached diagram

[0037] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0038] Figure 1 is a top view of the structure of a light-emitting panel according to an embodiment of this application;

[0039] Figure 2 is a schematic diagram of the A-A' cross-sectional structure of the frame area when a single transparent conductive layer is provided on the light-emitting panel according to an embodiment of this application;

[0040] Figure 3 is a schematic diagram of the orthographic projection of the insulating pattern on the substrate when a single transparent conductive layer is provided on the light-emitting panel according to an embodiment of this application.

[0041] Figure 4 is a schematic diagram of the hierarchical structure of the frame area A-A' section when a light-emitting panel is provided with multiple transparent conductive layers according to an embodiment of this application;

[0042] Figure 5 is a schematic diagram of the hierarchical structure of the A-A' section of the frame area of ​​the light-emitting panel when the thickness of the insulating pattern is less than that of the transparent conductive layer, according to an embodiment of this application.

[0043] Figure 6 is a schematic diagram of the orthographic projection of the insulating pattern on the substrate on a multilayer transparent conductive layer according to an embodiment of this application.

[0044] Figure 7 is a schematic diagram of the orthographic projection of the insulating pattern on the substrate on the multilayer transparent conductive layer according to another embodiment of this application;

[0045] Figure 8 is a schematic diagram of the orthographic projection of the insulating pattern on the substrate on the multilayer transparent conductive layer according to another embodiment of this application.

[0046] Figure 9 is a schematic diagram of the hierarchical structure of the B-B' section of the display area according to an embodiment of this application;

[0047] Figure 10 is a schematic diagram of the hierarchical structure of the first surface of the insulating pattern with the first conductive layer attached to it according to an embodiment of this application.

[0048] Figure 11 is a schematic diagram of the hierarchical structure of the second surface of the insulating pattern with the second conductive layer attached according to an embodiment of this application;

[0049] Figure 12 is a schematic diagram of the hierarchical structure of an insulating pattern respectively bonded to the second conductive layer and the first conductive layer according to an embodiment of this application;

[0050] Figure 13 is a schematic diagram of the layer structure of a light-emitting panel with a multilayer transparent conductive layer along the C-C' section according to an embodiment of this application;

[0051] Figure 14 is a schematic diagram of the orthographic projection of the first sub-pattern on the first transparent conductive layer on the substrate according to an embodiment of this application.

[0052] Figure 15 is a schematic diagram of the orthographic projection of the second sub-pattern on the second transparent conductive layer onto the substrate according to an embodiment of this application; and

[0053] Figure 16 is a schematic diagram of the orthographic projection arrangement of the first and second sub-patterns on the substrate according to an embodiment of this application.

[0054] Detailed description

[0055] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments of this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.

[0056] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0057] In the accompanying drawings, the size of constituent elements, the thickness of layers, or areas may sometimes be exaggerated for clarity. Therefore, any implementation of this disclosure is not necessarily limited to the dimensions shown in the drawings, and the shapes and sizes of the components in the drawings do not reflect true proportions. Furthermore, the drawings schematically illustrate ideal examples, and any implementation of this disclosure is not limited to the shapes or values ​​shown in the drawings.

[0058] Organic light-emitting diode (OLED) display technology features self-illumination, wide viewing angle, wide color gamut, high contrast, thinness, foldability, flexibility, and portability, making it a major research direction in the display field. Currently, LED technology is the primary technology used in car taillights on the market.

[0059] However, in related technologies, for automotive lighting products using large-size passive matrix organic light-emitting diodes (PMOLED), the overlap area of ​​the source / drain layer, anode layer, and cathode layer in the OLED panel is too large. During the deposition of the anode film layer, snowflake discharge occurs in the overlap area between the anode layer and the source / drain layer, resulting in snowflake-like defects on the OLED panel. The defect size is approximately 20μm to 600μm and is visually visible.

[0060] In view of this, this application proposes a light-emitting panel. Figure 1 shows a top view of the light-emitting panel according to an embodiment of this application. As shown in Figure 1, the light-emitting panel 1 includes: a display area 11; a border area 12, the border area surrounding the display area 11. Figure 2 shows a cross-sectional view of the border area A-A' of the light-emitting panel according to an embodiment of this application when a single transparent conductive layer is provided. As shown in Figure 2, within the border area 12, the light-emitting panel 1 includes: a substrate 101; a first conductive layer 102, the first conductive layer being disposed on one side of the substrate; a transparent conductive layer 103, the transparent conductive layer 103 being disposed on the side of the first conductive layer 102 facing away from the substrate 101; and a second conductive layer 104, the second conductive layer 104 being disposed on the side of the transparent conductive layer 103 facing away from the substrate 101.

[0061] In some optional embodiments, the substrate 101 can be a rigid substrate. Optionally, the material of the rigid substrate can include: glass, ultra-thin glass (UTG), polymethyl methacrylate (PMMA), silicon, etc. For example, when the light-emitting panel 1 is used in automotive headlights, the material of the substrate 101 can be glass. Optionally, the substrate 101 can also be a flexible substrate. When the substrate 101 is a flexible substrate, the light-emitting panel 1 is a flexible light-emitting panel. The material of the flexible substrate can include: polyethylene terephthalate (PET), polyethylene naphthalate (PEN), colorless polyimide (CPI), etc. It should be noted that the material of the substrate 101 can be determined according to actual conditions, and this application does not impose any limitations.

[0062] In this embodiment, the transparent conductive layer 103 includes a plurality of transparent conductive patterns 201. The first conductive layer 102 and the second conductive layer 104 are electrically connected through the plurality of transparent conductive patterns 201 in the transparent conductive layer 103. Because the side of the transparent conductive layer 103 closest to the first conductive layer 102 overlaps with the entire surface of the first conductive layer 102, and the side of the transparent conductive layer 103 closest to the second conductive layer 104 overlaps with the entire surface of the second conductive layer 104, the overlap area is too large during the fabrication of the light-emitting panel. This results in a snowflake discharge phenomenon on the surface of the first conductive layer 102 during the formation of the transparent conductive layer, causing snowflake-shaped defects in the frame area 12 of the light-emitting panel. Therefore, in this embodiment of the application, as shown in FIG2, the transparent conductive layer 103 is further provided with one or more insulating patterns 202. The one or more insulating patterns 202 fill the gaps between the multiple transparent conductive patterns. By providing the one or more insulating patterns 202, the overlap area between the transparent conductive layer 103 and the first conductive layer 102 and the second conductive layer 104 located on both sides of the transparent conductive layer 103 can be reduced, thereby effectively eliminating the snowflake discharge phenomenon generated in the frame area 12.

[0063] In this embodiment of the application, each insulating pattern 202 in the one or more insulating patterns includes a first surface and a second surface disposed opposite to each other. The first surface is disposed in conjunction with the first conductive layer 102, and / or the second surface is disposed in conjunction with the second conductive layer 104. Specifically, FIG10 shows a schematic diagram of the hierarchical structure of the first surface of the insulating pattern in an embodiment of the present application being in conjunction with the first conductive layer, and FIG11 shows a schematic diagram of the hierarchical structure of the second surface of the insulating pattern in an embodiment of the present application being in conjunction with the second conductive layer. As shown in Figures 10 and 11, the insulating pattern 202 can be configured with only its first surface attached to the first conductive layer 102, or the insulating pattern 202 can be configured with only its second surface attached to the second conductive layer 104. In this case, the thickness of the insulating pattern 202 along the first direction is less than the thickness of the transparent conductive layer along the first direction, where the first direction is the direction from the first conductive layer 102 to the transparent conductive layer 103. As shown in Figure 2, the insulating pattern 202 can be configured with its first surface attached to the first conductive layer 102 and its second surface attached to the second conductive layer 104. In this case, the two sides of the insulating pattern 202 are flush with the two side surfaces of the transparent conductive layer 103.

[0064] In some optional embodiments, there are multiple insulating patterns 202. Figure 12 shows a schematic diagram of the hierarchical structure of insulating patterns respectively bonded to the second conductive layer and the first conductive layer according to an embodiment of this application. As shown in Figure 12, the first surface and the second surface of the multiple insulating patterns 202 can be different. That is, some of the multiple insulating patterns 202 can have only the first surface bonded to the first conductive layer 102, and some can have only the second surface bonded to the second conductive layer. It is easy to understand that some of the multiple insulating patterns 202 can also have the first surface bonded to the first conductive layer 102 while the second surface is bonded to the second conductive layer 104. It should be noted that the bonding situation of the insulating patterns 202 described above is only a part of the optional implementation methods. The multiple insulating patterns 202 with the three bonding methods given in the embodiments of this application can be freely combined and are not limited to the above embodiments.

[0065] In some optional embodiments, FIG3 shows a schematic diagram of the orthographic projection arrangement of insulating patterns on a substrate when a single transparent conductive layer is provided on a light-emitting panel according to an embodiment of this application. As shown in FIG3, the plurality of insulating patterns 202 are arranged separately from each other. Since the insulating patterns 202 fill the gaps between the transparent conductive patterns 201 in the transparent conductive layer 103, the transparent conductive patterns 201 and the insulating patterns 202 are arranged at intervals. In this embodiment, the surface of the first conductive layer 102 near the transparent conductive layer 103 is bonded to the transparent conductive pattern 201 on the transparent conductive layer 103, forming an electrical connection between the first conductive layer 102 and the transparent conductive layer 103; the surface of the second conductive layer 104 near the transparent conductive layer 103 is bonded to the transparent conductive pattern 201 on the transparent conductive layer 103, forming an electrical connection between the second conductive layer 104 and the transparent conductive layer 103. Because of the provision of the plurality of insulating patterns 202, the sum of the projected areas of the plurality of transparent conductive patterns 201 on the substrate 101 is less than the projected area of ​​the transparent conductive layer 103 on the substrate 101. This reduces the overlap area when the first conductive layer 102 and the second conductive layer 104 overlap the entire surface of the transparent conductive layer 103, thus preventing snowflake discharge. Optionally, as shown in FIG3, the plurality of insulating patterns 202 are arranged in an array along the row and column directions, with adjacent rows of insulating patterns aligned with each other or at least partially staggered in the column direction; the plurality of transparent conductive patterns 201 are arranged in an array along the row and column directions. It should be noted that the transparent conductive pattern 201 shown in FIG3 is a transparent conductive pattern between two adjacent insulating patterns 202 along the column direction. In addition, the transparent conductive pattern can also be a transparent conductive pattern between two adjacent insulating patterns 202 along the row direction. Taking the transparent conductive pattern shown in FIG3 as an example, the area between two adjacent columns of insulating patterns 202 (or two adjacent columns of transparent conductive patterns 201) is also a transparent conductive area of ​​the same material as the transparent conductive pattern 201. That is, the transparent conductive pattern shown in the embodiment of this application is a virtual area used to define the position of the insulating pattern 202. The actual transparent conductive material in the transparent conductive layer 103 is not only the transparent conductive patterns 201 that are separated from each other, but refers to the material of other areas in the transparent conductive layer 103 besides the insulating patterns 202.

[0066] Although the plurality of insulating patterns 202 are provided in the transparent conductive layer 103 to reduce the overlap area between the transparent conductive layer 103 and the first conductive layer 102 and the second conductive layer 104, for a large-sized light-emitting panel 1, a small overlap area will lead to a larger device supply voltage of the light-emitting panel 1. Therefore, in order to eliminate snowflake discharge while further ensuring sufficient overlap area between the transparent conductive layer 103 and the first conductive layer 102 and the second conductive layer 104, thereby reducing the device supply voltage, in this embodiment of the application, the light-emitting panel 1 includes a plurality of transparent conductive layers 103 stacked together, wherein different transparent conductive layers 103 overlap with the first conductive layer 102 and the second conductive layer 104 respectively, so as to ensure that the sum of the overlap areas of different transparent conductive layers 103 and the respective overlapped first conductive layer 102 and second conductive layer 104 is greater than or equal to the overlap area of ​​the orthographic projection of the transparent conductive layer 103 on the substrate 101 and the orthographic projection of the first conductive layer 102 and the second conductive layer 104 on the substrate 101.

[0067] In some optional embodiments, FIG4 shows a schematic diagram of the hierarchical structure of the frame area A-A' section when a light-emitting panel with multiple transparent conductive layers is provided according to an embodiment of this application. As shown in FIG4, the plurality of transparent conductive layers 103 include a first transparent conductive layer 1031 and a second transparent conductive layer 1032 disposed adjacently, with the first transparent conductive layer 1031 disposed between the second transparent conductive layer 1032 and the first conductive layer 102. In the embodiment of this application, the orthographic projection of the plurality of transparent conductive patterns 201 in the first transparent conductive layer 1031 on the substrate 101 overlaps with the orthographic projection of the plurality of transparent conductive patterns 201 in the second transparent conductive layer 1032 on the substrate 101, so that the first transparent conductive layer 1031 and the second transparent conductive layer 1032 are connected through the plurality of transparent conductive patterns in the overlapping area, thereby further connecting the first conductive layer 102 and the second conductive layer 104.

[0068] In some optional embodiments, in order to ensure a large overlap area between the first transparent conductive layer 1031 and the second transparent conductive layer 1032 and the first conductive layer 102 and the second conductive layer 104, respectively, while setting the insulating patterns 202, in this embodiment, a plurality of insulating patterns 202 in the first transparent conductive layer 1031 are correspondingly arranged with a plurality of transparent conductive patterns 201 in the second transparent conductive layer 1032, and a plurality of insulating patterns 202 in the second transparent conductive layer 1032 are correspondingly arranged with a plurality of transparent conductive patterns 201 in the first transparent conductive layer 1031. Due to this structure, the plurality of insulating patterns 202 in the first transparent conductive layer 1031 and the second transparent conductive layer 1032 are staggered, ensuring communication between the first transparent conductive layer 1031 and the second transparent conductive layer. Meanwhile, the overlap area between the plurality of transparent conductive layers 103 and the first conductive layer 102 and the second conductive layer 104 includes the sum of the area of ​​the transparent conductive pattern 201 on the surface of the first transparent conductive layer 1031 near the first conductive layer 102 and the area of ​​the transparent conductive pattern 201 on the surface of the second transparent conductive layer 1032 near the second conductive layer 104. This ensures that in the light-emitting panel, both the poor snowflake discharge is eliminated by the insulating pattern 202 and a large overlap area is guaranteed.

[0069] Specifically, the orthographic projection of the insulating pattern 202 in the first transparent conductive layer 1031 onto the substrate 101 is located within the orthographic projection range of the transparent conductive pattern 201 in the second transparent conductive layer 1032 onto the substrate 101, so that the insulating pattern 202 in the first transparent conductive layer 1031 is surrounded by the transparent conductive pattern 201 in the first transparent conductive layer 1031. The transparent conductive pattern 201 in the second transparent conductive layer 1032, which corresponds to the transparent conductive pattern 201 in the first transparent conductive layer 1031, can achieve a current path between transparent conductive layers through the region of the transparent conductive pattern 201 surrounding the insulating pattern 202 in the first transparent conductive layer 1031, effectively preventing the insulating pattern 202 in the first transparent conductive layer 1031 from causing unnecessary obstruction to the connection between transparent conductive layers. On the other hand, the orthographic projection of the insulating pattern 202 in the second transparent conductive layer 1032 onto the substrate 101 is located within the orthographic projection range of the transparent conductive pattern 201 in the first transparent conductive layer 1031 onto the substrate 101, so that the insulating pattern 202 in the second transparent conductive layer 1032 is surrounded by the transparent conductive pattern 201 in the second transparent conductive layer 1032. The transparent conductive pattern 201 in the first transparent conductive layer 1031, which corresponds to the transparent conductive pattern 201 in the second transparent conductive layer 1032, can achieve a current path between transparent conductive layers through the region of the transparent conductive pattern 201 surrounding the insulating pattern 202 in the second transparent conductive layer 1032, effectively preventing the insulating pattern 202 in the second transparent conductive layer 1032 from causing unnecessary obstruction to the connection between transparent conductive layers.

[0070] In some alternative embodiments, in the orthographic projection of the substrate 101, the insulating pattern 202 of the first transparent conductive layer 1031 is disposed approximately centered within the range of the transparent conductive pattern 201 in the second transparent conductive layer 1032, and the insulating pattern 202 of the second transparent conductive layer 1032 is disposed approximately centered within the range of the transparent conductive pattern 201 in the first transparent conductive layer 1031.

[0071] In some optional embodiments, in the orthographic projection of the substrate 101, a first gap exists between the insulating patterns 202 in adjacent first transparent conductive layers 1031 and second transparent conductive layers 1032. The first gap is filled with transparent conductive patterns 201 surrounding the insulating patterns 202, and the first transparent conductive layer 1031 and the second transparent conductive layer 1032 are interconnected through the transparent conductive patterns 201 located within the first gap. Optionally, to maximize the connectivity between the first transparent conductive layer 1031 and the second transparent conductive layer 1032, the width of the first gap is greater than or equal to 30 micrometers.

[0072] In this embodiment, by setting a first transparent conductive layer 1031 and a second transparent conductive layer 1032 with staggered insulating patterns 202, snowflake discharge defects are eliminated based on the insulating patterns 202, and the first transparent conductive layer 1031 and the second transparent conductive layer 1032 are connected through the transparent conductive patterns 201 surrounding the insulating patterns 202. On the other hand, based on the stacked first transparent conductive layer 1031 and the second transparent conductive layer 1032, without increasing the orthogonal projection area of ​​the transparent conductive layer on the substrate 101, the overlap area is expanded to the sum of the areas of the staggered transparent conductive patterns of the two transparent conductive layers 103 near the surfaces of the first conductive layer 102 and the second conductive layer 104, so that the effective overlap area of ​​the transparent conductive layers 103 does not decrease, which can effectively reduce the device power supply voltage and ensure the performance of the large-size light-emitting panel.

[0073] It should be noted that, in this embodiment, the plurality of transparent conductive layers 103 may further include a plurality of third transparent conductive layers. These third transparent conductive layers are disposed between the first transparent conductive layer 1031 and the second transparent conductive layer 1032. Each of the plurality of third transparent conductive layers includes a plurality of transparent conductive patterns, which are used to connect adjacent transparent conductive layers. Optionally, each third transparent conductive layer may or may not have an insulating pattern. When an insulating pattern is provided in the third transparent conductive layer, the transparent conductive patterns in the third transparent conductive layer are at least partially connected to the transparent conductive patterns of the adjacent transparent conductive layers.

[0074] In this embodiment of the application, in the orthographic projection of the substrate 101, the insulating patterns 202 in the second transparent conductive layer 1032 are spaced apart between two adjacent insulating patterns 202 in the first transparent conductive layer 1031. In some optional embodiments, FIG6 shows a schematic diagram of the orthographic projection arrangement of insulating patterns on a multilayer transparent conductive layer on the substrate according to an embodiment of the present application. As shown in FIG6, along the row direction and the column direction, the insulating patterns 202-1 in the second transparent conductive layer are spaced apart between two adjacent insulating patterns 202-1 in the first transparent conductive layer. That is, in the orthographic projection of the substrate 101, each insulating pattern 202-2 in the second transparent conductive layer is an insulating pattern 202-1 in the first transparent conductive layer on both sides (the upper and lower sides in FIG6) along the row direction and on both sides (the left and right sides in FIG6) along the column direction.

[0075] In some alternative embodiments, FIG7 shows a schematic diagram of the orthographic projection arrangement of insulating patterns on a multilayer transparent conductive layer on a substrate according to another embodiment of this application. As shown in FIG7, along the column direction, the insulating pattern 202-1 in each column of the first transparent conductive layer is located between the insulating patterns 202-2 in each column of the second transparent conductive layer, and the insulating patterns 202-2 in the second transparent conductive layer are spaced apart between two adjacent insulating patterns 202-1 in the first transparent conductive layer. That is, in the orthographic projection of the substrate 101, the insulating patterns 202-2 in each second transparent conductive layer are the insulating patterns 202-1 in the first transparent conductive layer on both sides (the upper and lower sides in FIG7) along the column direction. Optionally, when insulating patterns 202-1 in the first transparent conductive layer are spaced apart from each other along the column direction, the insulating patterns 202-1 in the first transparent conductive layer and the insulating patterns 202-2 in the second transparent conductive layer are aligned or staggered along the column direction. The alignment means that the central axis of the insulating patterns 202-1 and 202-2 along the column direction coincides, and the staggered arrangement means that the central axis of the insulating patterns 202-1 and 202-2 along the column direction is parallel to each other.

[0076] In some optional embodiments, FIG8 shows a schematic diagram of the orthographic projection arrangement of insulating patterns on a substrate on a multilayer transparent conductive layer according to another embodiment of this application. As shown in FIG8, along the row direction, the insulating pattern 202-1 in the first transparent conductive layer in each row is located between the insulating patterns 202-2 in the second transparent conductive layer in each row. The insulating patterns 202-2 in the second transparent conductive layer are spaced apart between two adjacent insulating patterns 202-1 in the first transparent conductive layer. That is, in the orthographic projection of the substrate 101, the insulating patterns 202-2 in the second transparent conductive layer on both sides (left and right sides in FIG8) along the row direction are the insulating patterns 202-1 in the first transparent conductive layer. Optionally, when the insulating patterns 202-2 in the second transparent conductive layer are spaced apart between two adjacent insulating patterns 202-1 in the first transparent conductive layer along the row direction, the insulating patterns 202-1 in the first transparent conductive layer and the insulating patterns 202-2 in the second transparent conductive layer are aligned or staggered along the row direction.

[0077] In some optional embodiments, in order to ensure that the insulating pattern 202 in the first transparent conductive layer 1031 effectively reduces the overlap area between the first conductive layer 102 and the first transparent conductive layer 1031, and that the insulating pattern 202 in the second transparent conductive layer 1032 effectively reduces the overlap area between the second conductive layer 104 and the second transparent conductive layer 1032, in this embodiment, the insulating pattern 202 in the first transparent conductive layer 1031 is attached to the second conductive layer 104 on the side surface near the second conductive layer 104, and the insulating pattern 202 in the second transparent conductive layer 1032 is attached to the first conductive layer 102 on the side surface near the first conductive layer 102.

[0078] Optionally, since the surfaces of the insulating patterns 202 in the plurality of transparent conductive layers 103 are respectively attached to one side surface of the first conductive layer 102 or the second conductive layer 104 that are adjacent to each other, the overlapping area of ​​the insulating patterns 202 with the first conductive layer 102 and the second conductive layer 104 can be reduced. Therefore, in this embodiment of the application, as shown in FIG1, the thickness of the insulating pattern 202 along the first direction can be equal to the thickness of the transparent conductive layer along the first direction. In this case, the two sides of the insulating pattern 202 are flush with the two side surfaces of the transparent conductive layer 103, respectively. Alternatively, the thickness of the insulating pattern 202 along the first direction can also be less than the thickness of the transparent conductive layer along the first direction. FIG5 shows a schematic diagram of the hierarchical structure of the A-A' section of the frame area of ​​the light-emitting panel when the thickness of the insulating pattern is less than that of the transparent conductive layer according to an embodiment of the present application. As shown in Figure 5, in this case, the insulating pattern 202 is flush with the surface of the transparent conductive layer 103 and the first conductive layer 102 or the second conductive layer 104 on one side, and the other surface of the insulating pattern 202 is located inside the transparent conductive layer 103.

[0079] In some alternative embodiments, the orthographic projection shape of the insulating pattern 202 on the substrate 101 is a polygon, an arc, or a combination of polygons and arcs. For example, the orthographic projection shape of the insulating pattern 202 on the substrate 101 is a square.

[0080] In some optional embodiments, the insulating pattern 202 has a dimension greater than or equal to 10 micrometers and less than or equal to 20 micrometers along the row direction and / or the column direction. Optionally, the orthographic projection shape of the insulating pattern 202 on the substrate 101 is square, and the dimension of the insulating pattern 202 along the row direction and / or the column direction is 14 micrometers.

[0081] In some optional embodiments, in the orthographic projection on the substrate 101, the area of ​​the plurality of transparent conductive patterns 201 in the first transparent conductive layer 1031 is smaller than the area of ​​the plurality of insulating patterns 202 in the first transparent conductive layer 1031, and the plurality of transparent conductive patterns 201 in the first transparent conductive layer 1031 are dispersed in the plurality of insulating patterns 202 of the first transparent conductive layer 1031; in the orthographic projection on the substrate 101, the area of ​​the plurality of transparent conductive patterns 201 in the second transparent conductive layer 1032 is smaller than the area of ​​the plurality of insulating patterns 202 in the second transparent conductive layer 1032, and the plurality of transparent conductive patterns 201 in the second transparent conductive layer 1032 are dispersed in the plurality of insulating patterns 202 of the second transparent conductive layer 1032, and the two transparent conductive layers are electrically connected through the plurality of transparent conductive patterns 201 dispersed in the plurality of insulating patterns 202.

[0082] In one embodiment, FIG13 shows a schematic diagram of the layered structure of a light-emitting panel with a multilayer transparent conductive layer according to an embodiment of the present application along a cross section C-C'. As shown in FIG13, the plurality of transparent conductive patterns 201 in the first transparent conductive layer 1031 and the second transparent conductive layer 1032 can be island patterns surrounded by the plurality of insulating patterns 202. The plurality of transparent conductive patterns 201 are arranged in an array along the row direction and the column direction in both the first transparent conductive layer 1031 and the second transparent conductive layer 1032. At this time, the plurality of insulating patterns 202 are insulating patterns between two adjacent transparent conductive patterns 201 along the column direction. The area between two adjacent columns of transparent conductive patterns is also an insulating area of ​​the same material as the insulating pattern 202. That is to say, in the first transparent conductive layer 1031 and the second transparent conductive layer 1032, the plurality of insulating patterns 202 are other areas of material besides the plurality of transparent conductive patterns 201.

[0083] Specifically, Figure 14 shows a schematic diagram of the orthographic projection of the first sub-pattern on the first transparent conductive layer according to an embodiment of this application onto the substrate. As shown in Figure 14, the plurality of transparent conductive patterns 201 in the first transparent conductive layer 1031 are a plurality of first sub-patterns 201-1 arranged in an array along the row direction and the column direction. Adjacent rows of first sub-patterns 201-1 are staggered in the column direction, and the gaps between adjacent first sub-patterns 201-1 are filled with insulating patterns 202 of the first transparent conductive layer 1031. Figure 15 shows a schematic diagram of the orthographic projection of the second sub-pattern on the second transparent conductive layer according to an embodiment of this application onto the substrate. As shown in Figure 15, the plurality of transparent conductive patterns 201 in the second transparent conductive layer 1032 are a plurality of second sub-patterns 201-2 arranged in an array along the row direction and the column direction. Adjacent rows of second sub-patterns 201-2 are aligned with each other in the column direction, and the gaps between adjacent second sub-patterns 201-2 are filled with insulating patterns 202 of the second transparent conductive layer 1032.

[0084] Optionally, Figure 16 shows a schematic diagram of the orthographic arrangement of the first sub-pattern and the second sub-pattern on the substrate according to an embodiment of this application. As shown in Figure 16, the gap width of the first sub-pattern 201-1 is greater than the gap width of the second sub-pattern 201-2; in the row direction and the column direction, the orthographic projection of the first sub-pattern 201-1 on the substrate 101 overlaps with the orthographic projections of two adjacent second sub-patterns 201-2 on the substrate 101, ensuring that an electrical connection is formed between the first transparent conductive layer 1031 and the second transparent conductive layer 1032 through the overlapping first sub-patterns 201-1 and the second sub-patterns 201-2, thereby forming a conductive path between the first conductive layer 102 and the second conductive layer 104.

[0085] Alternatively, as shown in FIG13, in the orthographic projection of the substrate, in the row direction and the column direction, two adjacent second sub-patterns 201-2 that overlap with the same first sub-pattern 201-1 in the second transparent conductive layer 1032 are symmetrically arranged with respect to the first sub-pattern 201-1.

[0086] It should be noted that the two sides of the first sub-pattern 201-1 are flush with the two side surfaces of the first transparent conductive layer 1031, so as to ensure that the first sub-pattern 201-1 conducts the first conductive layer 102 and the second transparent conductive layer 1032 on both sides; the two sides of the second sub-pattern 201-2 are flush with the two side surfaces of the second transparent conductive layer 1032, so as to ensure that the second sub-pattern 201-2 conducts the second conductive layer 104 and the first transparent conductive layer 1031 on both sides.

[0087] In some optional embodiments, the first sub-pattern 201-1 and the second sub-pattern 201-2 have the same shape, and the orthographic projection shape of the first sub-pattern 201-1 and the second sub-pattern 201-2 on the substrate 101 is a polygon, an arc, or a combination of a polygon and an arc. For example, the orthographic projection shape of the first sub-pattern 201-1 and the second sub-pattern 201-2 on the substrate 101 is a square.

[0088] In some optional embodiments, the first sub-pattern 201-1 and the second sub-pattern 201-2 have the same size, and the size of the first sub-pattern 201-1 and the second sub-pattern 201-2 along the row direction and / or the column direction is greater than or equal to 10 micrometers and less than or equal to 20 micrometers. Optionally, the orthographic projection shape of the first sub-pattern 201-1 and the second sub-pattern 201-2 on the substrate 101 is a square, and the size of the first sub-pattern 201-1 and the second sub-pattern 201-2 along the row direction and / or the column direction is 14 micrometers.

[0089] In some optional embodiments, the transparent conductive pattern 201 of the transparent conductive layer 103 (including the first transparent conductive layer 1031, the second transparent conductive layer 1032, and the third transparent conductive layer) can be made of a transparent conductive oxide film, which may include at least one of the following: indium tin oxide (ITO), indium zinc oxide (IZO), etc. The insulating pattern 202 of the transparent conductive layer 103 can be made of an inorganic insulating material, for example, silicon nitride (SiN). x ), silicon dioxide (SiO2) or other suitable materials.

[0090] In this embodiment of the application, as shown in FIG1, the frame area 12 includes: a bonding area 122, which is disposed on one side of the display area 11, and a bonding pin is disposed within the bonding area 122 for bonding and connecting a flexible printed circuit (FPC); and an overlap area 121, which is disposed on the other three sides of the display area 11 excluding the bonding area 122, wherein the transparent conductive layer 103 is disposed within the overlap area 121. In some optional embodiments, the light-emitting panel 1 further includes a sealing adhesive layer 3 surrounding the overlap area 121, which is used to encapsulate and protect the edge of the light-emitting panel 1. Three sides of the sealing adhesive layer 3 are disposed on the periphery of the overlap area 121 away from the display area 11, and one side other than the three sides corresponding to the overlap area 121 is disposed between the display area 11 and the bonding area 122.

[0091] In some optional embodiments, within the frame area 12, the light-emitting panel 1 further includes: a buffer layer 105, a pixel definition layer (PDL) 106, a protective layer 107, and a cover plate 108. The buffer layer 105 is disposed between the substrate 101 and the first conductive layer 102. The buffer layer 105 can be a single-layer structure or a multi-layer structure. The material of the buffer layer 105 may include at least one of the following: silicon nitride (SiN). x ), silicon dioxide (SiO2) or other suitable materials.

[0092] In this embodiment, the pixel defining layer 106 and the protective layer 107 are disposed on the same layer as the transparent conductive layer 103, and are both disposed on the side of the first conductive layer 102 away from the substrate 101. When the transparent conductive layer 103 comprises multiple stacked transparent conductive layers, the pixel defining layer 106 and the protective layer 107 are both disposed on the same layer as the first transparent conductive layer 1031. The pixel defining layer 106 is disposed between the protective layer 107 and the transparent conductive layer 103, serving to isolate and protect the hierarchical structure within the display area 11 and the border area 12. The sealing adhesive layer 3 is disposed on the side of the protective layer 107 away from the substrate 101, and the cover plate 108 is disposed on the side of the second conductive layer 104 and the sealing adhesive layer 3 away from the substrate 101. The material of the cover plate 108 can be glass or other suitable cover plate materials.

[0093] In this embodiment of the application, Figure 9 shows a schematic diagram of the hierarchical structure of the display area B-B' section according to an embodiment of the application. As shown in Figure 9, the display area 11 includes at least one light-emitting device, which includes a first electrode 301, a light-emitting layer 303, and a second electrode 302 stacked sequentially. The first electrode 301 is disposed in the same layer as the transparent conductive layer 103 and is made of the same material, and the second electrode 302 is disposed in the same layer as the second conductive layer 104 and is made of the same material.

[0094] It should be noted that the actual size, shape, and arrangement of the light-emitting devices can be determined according to the actual application scenario of the light-emitting panel 1, and this application does not impose any limitations on them. For example, when the light-emitting panel 1 is applied to a lighting scenario, the light-emitting layer 303 of the light-emitting devices can be set as a single layer. In this case, the light-emitting panel 1 is lit when the light-emitting devices are in the on state; the light-emitting panel 1 is off when the light-emitting devices are in the off state. When the light-emitting panel 1 is applied to a lighting scenario, the light-emitting panel 1 includes multiple light-emitting devices, and the light-emitting layer 303 of each light-emitting device can also be set in sections. The switching of each light-emitting device is independent of each other. In this case, different light-emitting devices can be configured to be independently controlled for lighting, thereby achieving some special lighting effects. For example, the light-emitting panel 1 can be controlled to display a preset lighting pattern. Furthermore, the light emission colors of the aforementioned multiple light-emitting devices can be the same or different. The specific light emission color of each light-emitting device can be set differently according to the lighting requirements of the actual application scenario. For example, when applied to the taillights of automobiles, each light-emitting device on the light-emitting panel can emit red light; in other application scenarios, some of the light-emitting devices on the light-emitting panel 1 can emit red light, while other light-emitting devices can emit white light.

[0095] In some optional embodiments, the display area 11 may include multiple light-emitting areas. The shape, size, arrangement, number of light-emitting devices included, and light-emitting color of the multiple light-emitting areas can be set according to the needs of the actual application scenario, and this embodiment does not impose any limitations. For example, the shape of the multiple light-emitting areas in the display area 11 can be a polygon (such as a triangle, rectangle, rhombus, regular pentagon, or regular hexagon, etc.), an arc (such as a circle, ellipse, etc.), or a combination of polygons and arcs, etc., and this embodiment does not impose any limitations on this.

[0096] In some optional embodiments, the light-emitting panel can be applied to a display device. The display area 11 may include multiple pixel units arranged in an array. Each pixel unit includes multiple sub-pixels, and each sub-pixel can display a single color. For example, each pixel unit includes RGB sub-pixels, with red sub-pixels displaying red, green sub-pixels displaying green, and blue sub-pixels displaying blue. The grayscale brightness of the sub-pixels of different colors in each pixel unit can be adjusted. Multiple colors can be displayed through color combination and superposition, thereby achieving full-color display of the light-emitting panel 1 through line-by-line scanning. For example, the red sub-pixel may include a light-emitting device for emitting red light, the green sub-pixel may include a light-emitting device for emitting green light, and the blue sub-pixel may include a light-emitting device for emitting red light.

[0097] It should be noted that the light-emitting device of the light-emitting panel 1 can be an organic light-emitting diode (OLED) or a quantum dot organic light-emitting diode (QLED), and this application embodiment does not limit this. Taking the light-emitting panel 1 using an OLED light-emitting device as an example, when the light-emitting panel 1 is applied to a lighting device, a passive matrix organic light-emitting diode (PMOLED) can be used; when the light-emitting panel 1 is applied to a display device, an active-matrix organic light-emitting diode (AMOLED) can be used.

[0098] In some optional embodiments, the first electrode 301 is the anode, and the second electrode 302 is the cathode. The material of the first electrode 301 can be a transparent conductive oxide thin film, and the material of the second electrode 302 can be a metal film layer, or a laminated composite structure of transparent conductive oxide thin film / metal film layer / transparent conductive oxide thin film. The transparent conductive oxide thin film may include at least one of the following: indium tin oxide (ITO), indium zinc oxide (IZO), etc.; the material of the metal film layer may include at least one of the following: gold (Au), silver (Ag), nickel (Ni), and platinum (Pt), etc. Exemplarily, in some specific application scenarios, the material of the first electrode may be an ITO thin film, and the material of the second electrode may be silver (Ag).

[0099] In some optional embodiments, the light-emitting layer 303 includes a plurality of stacked light-emitting functional sub-layers and an emitting layer (EML). Exemplarily, the light-emitting functional sub-layer may include at least one of the following: a hole injection layer (HIL), a hole transport layer (HTL), and an electron block layer (EBL), wherein the hole injection layer, the hole transport layer, and the electron block layer are sequentially stacked between the anode and the light-emitting sub-layer along the direction from the anode to the light-emitting sub-layer; or the electron injection layer (EIL), the electron transport layer (ETL), and the hole block layer (HBL) are sequentially stacked between the cathode and the light-emitting sub-layer along the direction from the cathode to the light-emitting sub-layer. It should be noted that some or all of the above-mentioned light-emitting functional sub-layers may be provided according to actual needs, and this embodiment of the application does not impose any limitations.

[0100] This application provides a light-emitting panel, comprising a display area and a border area surrounding the display area. Within the border area, the light-emitting panel includes: a substrate; a first conductive layer disposed on one side of the substrate; one or more transparent conductive layers disposed on the side of the first conductive layer facing away from the substrate, each of the one or more transparent conductive layers including multiple transparent conductive patterns and one or more insulating patterns disposed between the multiple transparent conductive patterns; and a second conductive layer disposed on the side of the one or more transparent conductive layers facing away from the substrate, the second conductive layer being connected to the first conductive layer through the multiple transparent conductive patterns; wherein each of the one or more insulating patterns includes a first surface and a second surface disposed opposite to each other, the first surface being attached to the first conductive layer, and / or the second surface being attached to the second conductive layer. This application, by providing insulating patterns located within the transparent conductive layer, i.e., connecting the first and second conductive layers through the transparent conductive layer with insulating patterns, effectively reduces the exposed metal film area, decreases the probability of snowflake discharge during the deposition of the transparent conductive layer, and eliminates snowflake-like appearance defects in the light-emitting panel.

[0101] Based on the same inventive concept, this application discloses a light-emitting device, which includes the light-emitting panel described in the embodiments of this application. The specific structure and technical effects of the light-emitting panel have been described in detail above, and therefore will not be repeated here. The light-emitting device has a technical effect corresponding to the beneficial effects of the light-emitting panel described in the embodiments of this application, namely, the effect of eliminating snowflake-like display defects.

[0102] Based on the same inventive concept, this application discloses an automobile, which includes the light-emitting device described in this application embodiment. The light-emitting device is the automobile's headlight, and exemplarily, the headlight can be the automobile's taillight, and the taillight is relatively large (greater than or equal to 7 inches). The automobile has technical effects corresponding to the beneficial effects of the light-emitting device described in this application embodiment.

[0103] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0104] In the description of this specification, it should be understood that the terms "center", "thickness", "upper", "lower", "front", "rear", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0105] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0106] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0107] The foregoing application provides many different implementations or examples for carrying out different structures of this application. To simplify this application, the components and arrangements of specific examples are described above. Of course, these are merely examples and are not intended to limit this application. Furthermore, reference numerals and / or reference letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various implementations and / or arrangements discussed.

[0108] The terms "an embodiment," "embodiment," or "one or more embodiments" as used herein mean that a particular feature, structure, or characteristic described in connection with an embodiment is included in at least one embodiment of this application. Furthermore, please note that the examples of the phrase "in one embodiment" do not necessarily all refer to the same embodiment.

[0109] Numerous specific details are set forth in the specification provided herein. However, it will be understood that embodiments of this application may be practiced without these specific details. In some instances, well-known methods, structures, and techniques have not been shown in detail so as not to obscure the understanding of this specification.

[0110] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or terminal device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or terminal device. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or terminal device that includes said element.

[0111] The light-emitting panel, light-emitting device, and automobile provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A light-emitting panel, wherein, The light-emitting panel includes a display area and a border area surrounding the display area, wherein the light-emitting panel includes: substrate; A first conductive layer is disposed on one side of the substrate; One or more transparent conductive layers are disposed on the side of the first conductive layer opposite to the substrate, and each of the one or more transparent conductive layers includes a plurality of transparent conductive patterns and one or more insulating patterns disposed between the plurality of transparent conductive patterns; and A second conductive layer is disposed on the side of the one or more transparent conductive layers facing away from the substrate, and the second conductive layer is connected to the first conductive layer through the plurality of transparent conductive patterns; Each of the one or more insulating patterns includes a first surface and a second surface disposed opposite to each other, the first surface being disposed in conjunction with the first conductive layer, and / or the second surface being disposed in conjunction with the second conductive layer.

2. The light-emitting panel according to claim 1, wherein, The one or more insulating patterns include multiple insulating patterns that are spaced apart from each other and arranged in an array along the row and column directions. Adjacent rows of insulating patterns are aligned with each other or at least partially staggered in the column direction.

3. The light-emitting panel according to claim 1, wherein, The one or more transparent conductive layers include multiple transparent conductive layers stacked together. The multiple transparent conductive layers include a first transparent conductive layer and a second transparent conductive layer disposed adjacent to each other. The orthographic projection of multiple transparent conductive patterns in the first transparent conductive layer on the substrate overlaps with the orthographic projection of multiple transparent conductive patterns in the second transparent conductive layer on the substrate.

4. The light-emitting panel according to claim 3, wherein, The orthographic projection of the plurality of insulating patterns in the first transparent conductive layer onto the substrate is located within the orthographic projection range of the plurality of transparent conductive patterns in the second transparent conductive layer onto the substrate; The orthographic projection of the plurality of insulating patterns in the second transparent conductive layer onto the substrate is located within the orthographic projection range of the plurality of transparent conductive patterns in the first transparent conductive layer onto the substrate.

5. The light-emitting panel according to claim 4, wherein, In the orthographic projection of the substrate, a plurality of insulating patterns of the first transparent conductive layer are disposed approximately centered within a plurality of transparent conductive patterns in the second transparent conductive layer, and a plurality of insulating patterns of the second transparent conductive layer are disposed approximately centered within a plurality of transparent conductive patterns in the first transparent conductive layer.

6. The light-emitting panel according to claim 3, wherein, In the orthographic projection on the substrate, the area of ​​the plurality of transparent conductive patterns in the first transparent conductive layer is smaller than the area of ​​the plurality of insulating patterns in the first transparent conductive layer. In the orthographic projection on the substrate, the area of ​​the plurality of transparent conductive patterns in the second transparent conductive layer is smaller than the area of ​​the plurality of insulating patterns in the second transparent conductive layer.

7. The light-emitting panel according to claim 6, wherein, The first transparent conductive layer has multiple transparent conductive patterns that are multiple first sub-patterns arranged in an array along the row and column directions. The first sub-patterns in two adjacent rows are staggered in the column direction, and the gaps between adjacent first sub-patterns are filled with insulating patterns of the first transparent conductive layer. The multiple transparent conductive patterns in the second transparent conductive layer are multiple second sub-patterns arranged in an array along the row direction and the column direction. The second sub-patterns in two adjacent rows are aligned with each other in the column direction, and the gaps between adjacent second sub-patterns are filled with the insulating pattern of the second transparent conductive layer.

8. The light-emitting panel according to claim 7, wherein, In the row direction and the column direction, the orthographic projection of the first sub-pattern on the substrate overlaps with the orthographic projections of two adjacent second sub-patterns on the substrate.

9. The light-emitting panel according to claim 7, wherein, In the orthographic projection of the substrate, in the row direction and the column direction, two adjacent second sub-patterns that overlap with the same first sub-pattern in the second transparent conductive layer are symmetrically arranged about the first sub-pattern.

10. The light-emitting panel according to claim 3, wherein, The first transparent conductive layer is disposed close to the second conductive layer, and the surface of the first transparent conductive layer with multiple insulating patterns close to the second conductive layer is attached to the second conductive layer, and the surface of the second transparent conductive layer with multiple insulating patterns close to the first conductive layer is attached to the first conductive layer.

11. The light-emitting panel according to claim 3, wherein, In the orthographic projection of the substrate, there is a first gap between the plurality of insulating patterns in the first transparent conductive layer and the plurality of insulating patterns in the second transparent conductive layer.

12. The light-emitting panel according to claim 1, wherein, The thickness of the insulating pattern along the first direction is less than or equal to the thickness of the transparent conductive layer along the first direction, where the first direction is the direction from the first conductive layer to the transparent conductive layer.

13. The light-emitting panel according to claim 1, wherein, The orthographic projection of the insulating pattern onto the substrate is a polygon, an arc, or a combination of polygons and arcs.

14. The light-emitting panel according to claim 1, wherein, The border area includes: Binding area, the binding area being disposed on one side of the display area; and The overlapping area is disposed on the three sides of the display area other than the bonding area, wherein the transparent conductive layer is disposed within the overlapping area.

15. The light-emitting panel according to claim 1, wherein, The display area includes a light-emitting device, which includes a first electrode, a light-emitting layer, and a second electrode stacked sequentially. The first electrode and the transparent conductive layer are disposed in the same layer and are made of the same material, and the second electrode and the second conductive layer are disposed in the same layer and are made of the same material.

16. A light-emitting device comprising a light-emitting panel as described in any one of claims 1 to 15.

17. A vehicle comprising the light-emitting device as claimed in claim 16, wherein, The light-emitting device is the vehicle's headlight.

Images