Wearable electronic device

Abstract

A wearable electronic device is provided. The wearable electronic device may comprise: a first antenna structure disposed on an antenna carrier; a printed circuit board; a semiconductor packaging substrate packaged with the printed circuit board; a second antenna structure disposed on at least a part of the surface of the semiconductor packaging substrate; and a contact structure electrically connecting the first antenna structure and the second antenna structure.

Description

wearable electronic devices

[0001] Embodiments of the present disclosure relate to a wearable electronic device capable of improving antenna performance.

[0002] Typical wearable electronic devices may have an antenna pattern arranged on an antenna carrier. Since the antenna pattern is arranged solely on the antenna carrier, the antenna pattern area may be small, resulting in poor antenna performance. The narrow internal space of wearable electronic devices can make it difficult to secure a sufficient antenna pattern area. The small antenna pattern area can degrade antenna performance, resulting in degraded data transmission performance and audio interruption.

[0003] The above-described material is provided solely as background information to aid in understanding the embodiments of the present disclosure. No determination has been made, and no claims are made, as to whether any of the above material constitutes prior art in connection with the present disclosure.

[0004] As the functionality of wearable electronic devices (e.g., true wireless stereo (TWS) wireless earphones) becomes more advanced, they may include various sensor components, including high-performance speakers, multiple microphones (e.g., inner / outer mics), sensors for detecting various conditions or obtaining bio-signals (e.g., proximity sensors, electrode sensors, bio-sensors), and sensors for detecting touch (e.g., touch sensors).

[0005] To improve the wearing comfort of wearable electronic devices (e.g., TWS wireless earphones), the unit size (e.g., wireless earphone unit) is being miniaturized. In the case of small wearable electronic devices (e.g., TWS wireless earphones), the antenna pattern is arranged only on the antenna carrier, which results in a small antenna pattern area and thus low antenna performance.

[0006] In order to place various electronic components within a limited internal space of a wearable electronic device (e.g., TWS wireless earphones), a semiconductor packaging substrate (e.g., a SiP (system in package) substrate) may be applied to the wearable electronic device (e.g., TWS wireless earphones). When the antenna pattern is positioned close to the user's body, conformal metal shielding must be placed to eliminate noise, which may lower the RF (radio frequency) performance of the wearable electronic device (e.g., TWS wireless earphones). When a semiconductor packaging substrate (e.g., a SiP substrate) is applied to the wearable electronic device (e.g., TWS wireless earphones), the RF port of the main IC (integrated circuit) and the antenna area are separated by a long distance, which may cause path loss to the antenna (e.g., path loss may occur because the path to the antenna is long).

[0007] Aspects of the present invention aim to address at least the aforementioned problems and / or disadvantages, and to provide at least some of the advantages described below. Accordingly, the present invention can provide a wearable electronic device in which the antenna pattern is arranged on a semiconductor packaging substrate (e.g., a system in package (SiP) substrate) of the wearable electronic device, thereby increasing the area of ​​the antenna pattern and improving antenna performance.

[0008] Another aspect of the present invention provides a wearable electronic device capable of increasing the area of ​​the antenna pattern and improving antenna performance by arranging the antenna pattern on an antenna carrier and a semiconductor packaging substrate (e.g., SiP substrate) of the wearable electronic device.

[0009] Additional aspects are described in some of the description that follows, and some will be obvious from the description or may be learned through practice of the embodiments presented.

[0010] According to one aspect of the present invention, a wearable electronic device is provided. The wearable electronic device (TWS wireless earphone) may include a first antenna structure disposed on an antenna carrier, a printed circuit board, a semiconductor packaging substrate packaged with the printed circuit board, a second antenna structure disposed on at least a portion of a surface of the semiconductor packaging substrate, and a contact structure electrically connecting the first antenna structure and the second antenna structure.

[0011] A wearable electronic device (TWS wireless earphone) according to one embodiment of the present disclosure may include a printed circuit board, a semiconductor packaging substrate packaged with the printed circuit board, an antenna structure disposed on at least a portion of a surface of the semiconductor packaging substrate, and a contact structure electrically connecting the printed circuit board and the antenna structure.

[0012] According to one embodiment of the present disclosure, a wearable electronic device (TWS wireless earphone) may have a second antenna structure (e.g., a second antenna pattern) disposed on at least a portion of a second side (e.g., a back side) and / or a third side (e.g., a side) of a semiconductor packaging substrate (e.g., a SiP substrate), thereby increasing the area of ​​the entire antenna pattern of the wearable electronic device and improving antenna performance.

[0013] The present disclosure provides a wearable electronic device that can increase the area of ​​an antenna pattern and improve antenna performance by arranging an antenna pattern on an antenna carrier and a semiconductor packaging substrate (e.g., a SiP substrate).

[0014] Other aspects, advantages, and key features of the present invention will become apparent to those skilled in the art from the following detailed description taken in conjunction with the accompanying drawings. This description discloses various embodiments of the present invention.

[0015] The above aspects, features and other advantages of specific embodiments of the present invention will become more apparent from the following description taken in conjunction with the accompanying drawings.

[0016] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments of the present disclosure.

[0017] FIG. 2 is a diagram illustrating an electronic device including a wearable electronic device (e.g., TWS wireless earphones) and a cradle according to one embodiment of the present disclosure.

[0018] FIG. 3A is a block diagram of a wearable electronic device (e.g., TWS wireless earphones, first wireless earphone unit, left wireless earphone unit) according to one embodiment of the present disclosure.

[0019] FIG. 3b is a block diagram of a wearable electronic device (e.g., TWS wireless earphones, second wireless earphone unit, right wireless earphone unit) according to one embodiment of the present disclosure.

[0020] FIGS. 4 to 6 are diagrams illustrating a wearable electronic device (e.g., TWS wireless earphones, wireless earphone units) according to one embodiment of the present disclosure.

[0021] FIG. 7 is an exploded perspective view of a wearable electronic device (e.g., TWS wireless earphones, wireless earphone unit) according to one embodiment of the present disclosure.

[0022] FIG. 8 is a drawing showing an antenna carrier disposed on a stem part of a wearable electronic device (e.g., TWS wireless earphones, wireless earphone unit) according to one embodiment of the present disclosure and a first antenna structure (e.g., antenna pattern) disposed on the antenna carrier.

[0023] FIG. 9 is a drawing showing a printed circuit board and a semiconductor packaging board (e.g., SiP board) according to one embodiment of the present disclosure, showing electronic components arranged on a first surface (e.g., front surface) of the printed circuit board.

[0024] FIG. 10 is a drawing showing a printed circuit board and a semiconductor packaging substrate (e.g., SiP substrate) according to one embodiment of the present disclosure, and is a drawing showing a second side (e.g., back side) of the semiconductor packaging substrate (e.g., SiP substrate).

[0025] FIG. 11 is a drawing showing a printed circuit board and a semiconductor packaging substrate (e.g., SiP substrate) according to one embodiment of the present disclosure, and is a drawing showing a third surface (e.g., side surface) of the semiconductor packaging substrate (e.g., SiP substrate).

[0026] FIG. 12 is a drawing showing a wearable electronic device according to an embodiment of the present disclosure, wherein a first antenna structure is disposed on an antenna carrier and the antenna structure is disposed on a semiconductor packaging substrate (e.g., SiP substrate).

[0027] FIG. 13 is a drawing showing a first antenna structure disposed on an antenna carrier according to one embodiment of the present disclosure, and a second antenna structure disposed on an outer surface (e.g., a second side (back side), a third side (side side)) of a semiconductor packaging substrate (e.g., a SiP substrate).

[0028] FIG. 14 is a circuit diagram of a first antenna structure disposed on an antenna carrier of a wearable electronic device according to one embodiment of the present disclosure and a second antenna structure disposed on a semiconductor packaging substrate (e.g., SiP substrate).

[0029] FIG. 15 is a drawing showing a first antenna structure disposed on an antenna carrier according to one embodiment of the present disclosure, and a second antenna structure disposed on an outer surface (e.g., a second side (back side), a third side (side side)) of a semiconductor packaging substrate (e.g., a SiP substrate).

[0030] FIG. 16 is a circuit diagram of a first antenna structure disposed on an antenna carrier of a wearable electronic device according to one embodiment of the present disclosure and a second antenna structure disposed on a semiconductor packaging substrate (e.g., SiP substrate).

[0031] FIG. 17 is a drawing showing a first antenna structure disposed on an antenna carrier according to one embodiment of the present disclosure, and a second antenna structure disposed on an outer surface (e.g., a second side (back side), a third side (side side)) of a semiconductor packaging substrate (e.g., a SiP substrate).

[0032] FIG. 18 is a circuit diagram of a first antenna structure disposed on an antenna carrier of a wearable electronic device according to one embodiment of the present disclosure and a second antenna structure disposed on a semiconductor packaging substrate (e.g., SiP substrate).

[0033] FIG. 19 is a drawing showing a first antenna structure disposed on an antenna carrier according to one embodiment of the present disclosure, and a second antenna structure disposed on an outer surface (e.g., a second side (back side), a third side (side side)) of a semiconductor packaging substrate (e.g., a SiP substrate).

[0034] FIGS. 20 and 21 are drawings showing a second antenna structure, a contact structure, and a connection pattern electrically connecting the second antenna structure and the contact structure to an outer surface (e.g., a second side (back side), a third side (side side)) of a semiconductor packaging substrate (e.g., a SiP substrate) according to one embodiment of the present disclosure.

[0035] FIG. 22 is a drawing showing an antenna structure arranged on an outer surface (e.g., a second surface (back surface), a third surface (side surface)) of a semiconductor packaging substrate (e.g., a SiP substrate) according to one embodiment of the present disclosure.

[0036] FIG. 23 is a drawing showing an antenna structure arranged on an outer surface (e.g., a second surface (back surface), a third surface (side surface)) of a semiconductor packaging substrate (e.g., a SiP substrate) according to one embodiment of the present disclosure.

[0037] FIG. 24 is a drawing showing an antenna structure arranged on an outer surface (e.g., a second surface (back surface), a third surface (side surface)) of a semiconductor packaging substrate (e.g., a SiP substrate) according to one embodiment of the present disclosure.

[0038] FIG. 25 is a drawing showing an antenna structure arranged on an outer surface (e.g., a second surface (back surface), a third surface (side surface)) of a semiconductor packaging substrate (e.g., a SiP substrate) according to one embodiment of the present disclosure.

[0039] FIG. 26 is a drawing showing an antenna structure arranged on an outer surface (e.g., a second surface (back surface), a third surface (side surface)) of a semiconductor packaging substrate (e.g., a SiP substrate) according to one embodiment of the present disclosure.

[0040] FIG. 27 is a drawing showing an antenna structure arranged on an outer surface (e.g., a second surface (back surface), a third surface (side surface)) of a semiconductor packaging substrate (e.g., a SiP substrate) according to one embodiment of the present disclosure.

[0041] FIG. 28 is a drawing showing an antenna structure arranged on an outer surface (e.g., a second surface (back surface), a third surface (side surface)) of a semiconductor packaging substrate (e.g., a SiP substrate) according to one embodiment of the present disclosure.

[0042] FIG. 29 is a diagram comparing the performance of an antenna of a wearable electronic device of a comparative example with an antenna of a wearable electronic device according to an embodiment of the present disclosure (e.g., a wearable electronic device (400) of FIG. 4).

[0043] Throughout the drawings, the same reference numbers are used to indicate identical components.

[0044] The following description, with reference to the accompanying drawings, is provided to facilitate a comprehensive understanding of various embodiments of the disclosure as defined by the claims and their equivalents. While the following description includes numerous specific details to facilitate such understanding, these should be considered merely exemplary. Accordingly, those skilled in the art will recognize that various changes and modifications can be made to the various embodiments described herein without departing from the scope and spirit of the present disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and brevity.

[0045] The terms and words used in the following description and claims are not limited to their literary meanings, but are merely used by the applicant to ensure a clear and consistent understanding of the invention. Therefore, those skilled in the art will readily understand that the following description of various embodiments of the present invention is for illustrative purposes only and is not intended to limit the scope of the present invention, which is defined by the appended claims and their equivalents.

[0046] Singular forms should be understood to include plural referents unless the context clearly dictates otherwise. Thus, for example, a reference to "component surfaces" may include reference to one or more of such surfaces.

[0047] It should be understood that the blocks and combinations of flowcharts in each flowchart can be executed by one or more computer programs containing computer-executable instructions. One or more computer programs may be stored entirely in a single memory device, or the programs may be divided and each portion stored in multiple different memory devices.

[0048] Any of the functions or operations described herein may be processed by a single processor or a combination of multiple processors. The single processor or multiple processors are circuits that perform processing functions and may include circuits such as an application processor (AP, e.g., a central processing unit (CPU)), a communication processor (CP, e.g., a modem), a graphics processing unit (GPU), a neural processing unit (NPU) (e.g., an artificial intelligence (AI) chip), a wireless LAN (Wi-Fi) chip, a Bluetooth™ chip, a global positioning system (GPS) chip, a near-field communication (NFC) chip, a connection chip, a sensor controller, a touch controller, a fingerprint sensor controller, a display driver integrated circuit (IC), an audio codec chip, a universal serial bus (USB) controller, a camera controller, an image processing IC, a microprocessor unit (MPU), a system on a chip (SoC), an IC, and the like.

[0049] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0050] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an external electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an external electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the external electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0051] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0052] According to one embodiment, the auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., the display module (160), the sensor module (176), or the communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0053] According to one embodiment, the memory (130) may store various data used by at least one component (e.g., the processor (120) or the sensor module (176)) of the electronic device (101). The data may include, for example, software (e.g., the program (140)) and input data or output data for commands related thereto. The memory (130) may include a volatile memory (132) or a non-volatile memory (134).

[0054] According to one embodiment, the program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0055] According to one embodiment, the input module (150) may receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0056] In one embodiment, the audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0057] In one embodiment, the display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0058] According to one embodiment, the audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), or output sound through the sound output module (155), or an external electronic device (e.g., an external electronic device (102)) (e.g., a speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0059] According to one embodiment, the sensor module (176) can detect an operating state (e.g., power or temperature) of the electronic device (101) or an external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0060] According to one embodiment, the interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the external electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0061] According to one embodiment, the connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., an external electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0062] In one embodiment, the haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that a user can perceive through a tactile or kinesthetic sense. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0063] In one embodiment, the camera module (180) can capture still images and moving images. In one embodiment, the camera module (180) can include one or more lenses, image sensors, image signal processors, or flashes.

[0064] According to one embodiment, the power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0065] In one embodiment, the battery (189) can power at least one component of the electronic device (101). In one embodiment, the battery (189) can include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0066] According to one embodiment, the communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., the external electronic device (102), the external electronic device (104), or the server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0067] According to one embodiment, the wireless communication module (192) can support a 5G network and next-generation communication technology after a 4G network, for example, NR access technology (new radio access technology). NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., an external electronic device (104)), or a network system (e.g., a second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0068] According to one embodiment, the antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and the external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0069] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0070] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0071] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0072] An electronic device according to an embodiment disclosed in this document may take various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. The electronic device according to an embodiment of this document is not limited to the aforementioned devices.

[0073] It should be understood that the embodiments of the present disclosure and the terminology used therein are not intended to limit the technical features described in this document to a specific embodiment, but include various modifications, equivalents, or substitutes of the embodiment. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the item, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among the phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish the corresponding component from other corresponding components and do not limit the corresponding components in any other respect (e.g., importance or order). When a component (e.g., a first) is referred to as "coupled" or "connected" to another (e.g., a second) component, with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0074] The term "module" used in one embodiment of the present disclosure may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0075] An embodiment of the present disclosure may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0076] According to one embodiment, the method according to one embodiment disclosed in the present document may be provided as a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0077] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to one embodiment, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to one embodiment, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0078] FIG. 2 is a diagram illustrating an electronic device including a wearable electronic device (e.g., TWS wireless earphones) and a cradle according to one embodiment of the present disclosure.

[0079] Referring to FIG. 2, according to one embodiment, an electronic device (300) (e.g., an electronic device (101) of FIG. 1, a smartphone, a smart watch, a tablet PC (personal computer), or a notebook PC), a cradle (210), and a plurality of wireless earphones (220) (e.g., TWS wireless earphones, wireless earphone units) may each be formed as an independent device.

[0080] According to one embodiment, it may be configured as one electronic device (e.g., a wearable electronic device) including a cradle (210) (e.g., a case) (e.g., a charging device) and a plurality of wireless earphones (220) (e.g., TWS wireless earphones, wireless earphone units).

[0081] According to one embodiment, an electronic device (300) (e.g., an electronic device (101) of FIG. 1, a smartphone, a smart watch, a tablet PC, or a notebook PC) may include a wireless communication module (310) (e.g., a wireless communication module (192) of FIG. 1), a processor (320) (e.g., a processor (120) of FIG. 1), and a memory (330) (e.g., a memory (130) of FIG. 1).

[0082] According to one embodiment, the electronic device (300) can communicate with an external electronic device (e.g., a wearable electronic device) via a Bluetooth and / or BLE (Bluetooth low energy) method through a wireless communication module (310). For example, the external electronic device can include a plurality of wireless earphones (220) (e.g., TWS wireless earphones, wireless earphone units) and / or a cradle (210). For example, the electronic device (300) can communicate with a plurality of wireless earphones (220) (e.g., TWS wireless earphones, wireless earphone units) and / or a cradle (210).

[0083] According to one embodiment, the processor (320) may execute a program (e.g., application software for controlling wireless earphones) and / or instructions stored in the memory (330) to control the wireless communication module (310) of the electronic device (300) connected to the processor (320) and / or at least one other component (e.g., hardware or software component).

[0084] For example, the processor (320) may perform various data processing or operations, and may store commands or data received from other components of the electronic device (300) (e.g., sensor module (176), wireless communication module (310)) in the memory (330). The processor (320) may process programs, data, and / or instructions stored in the memory (330), and store the processing results in the memory (330).

[0085] According to one embodiment, the memory (330) may store a program and / or data for controlling a plurality of wireless earphones (220) (e.g., TWS wireless earphones, wireless earphone units). For example, the program stored in the memory (330) may include application software for controlling wireless earphones (e.g., wearable application). For example, the memory (330) may store a program for controlling the operation of the cradle (210) and / or the plurality of wireless earphones (220) (e.g., TWS wireless earphones, wireless earphone units). For example, the program may include instructions for controlling the operation of the cradle (210) and / or the plurality of wireless earphones (220) (e.g., TWS wireless earphones, wireless earphone units).

[0086] According to one embodiment, a cradle (210) of a wearable electronic device may include a wireless communication module (212), a control unit (214) (e.g., a processor), a power supply unit (216), a wired communication module (218), and a battery (219).

[0087] For example, the wireless communication module (212) can support wireless communication between the cradle (210) and a plurality of wireless earphones (220) (e.g., TWS wireless earphones, wireless earphone units). For example, the control device (214) can control the operation of the wireless communication module (212), the power supply device (216), the wired communication module (218), and the plurality of wireless earphones (220) (e.g., TWS wireless earphones, wireless earphone units). For example, the power supply device (216) can supply power for charging the battery (219) and / or the plurality of wireless earphones (220) (e.g., TWS wireless earphones, wireless earphone units). For example, the wired communication module (218) can support wired communication between the cradle (210) and a plurality of wireless earphones (220) (e.g., TWS wireless earphones, wireless earphone units).

[0088] According to one embodiment, a plurality of wireless earphones (220) (e.g., TWS wireless earphones, wireless earphone units) may be arranged in the internal space of the cradle (210). For example, when a plurality of wireless earphones (220) (e.g., TWS wireless earphones, wireless earphone units) are positioned inside the cradle (210), the cradle (210) may charge the plurality of wireless earphones (220) (e.g., TWS wireless earphones, wireless earphone units) and communicate with the plurality of wireless earphones (220) (e.g., TWS wireless earphones, wireless earphone units).

[0089] According to one embodiment, the cradle (210) may include a wireless communication module (212), a control device (214), a power supply device (216), a wired communication module (218), a battery (219), and a power interface.

[0090] In some embodiments, the cradle (210) may include a coil for wireless charging. According to one embodiment, when direct current (DC) power is supplied from a travel adapter (TA) or a power supply, the cradle (210) may perform an operation of converting DC power into alternating current (AC) power and transmitting the power to a plurality of wireless earphones (220) (e.g., TWS wireless earphones, wireless earphone units) through a power supply device (216).

[0091] According to one embodiment, the cradle (210) and a plurality of wireless earphones (220) (e.g., TWS wireless earphones, wireless earphone units) may communicate in a wired communication manner through a wired communication module (218). The cradle (210) and a plurality of wireless earphones (220) (e.g., TWS wireless earphones, wireless earphone units) may communicate in a wireless communication manner (e.g., Bluetooth and / or Bluetooth Low Energy (BLE)) through a wireless communication module (212) (e.g., Bluetooth communication module and / or BLE communication module).

[0092] According to one embodiment, the cradle (210) and the electronic device (300) may communicate via Bluetooth or Bluetooth Low Energy (BLE). For example, when the first wireless earphone (222) and / or the second wireless earphone (224) are positioned outside the cradle (210) (or when the cover (cover of the housing) of the cradle (210) is opened), the Bluetooth (or Bluetooth Low Energy) communication of the first wireless earphone (222) and / or the second wireless earphone (224) is activated, and the first wireless earphone (222) and / or the second wireless earphone (224) may be paired with the electronic device (300) via Bluetooth communication.

[0093] According to one embodiment, the cradle (210) can be connected to an electronic device (300) via Bluetooth and / or BLE communication via a wireless communication module (212).

[0094] According to one embodiment, the electronic device (300) can control the operation of the cradle (210) using Bluetooth and / or BLE communication.

[0095] According to one embodiment, the control device (214) of the cradle (210) may include a processor and a memory storing instructions for causing the processor to perform operations.

[0096] For example, the processor of the control device (214) may execute a program stored in the memory of the control device (214) to control the wireless communication module (212), the power supply device (216), and / or the wired communication module (218). In addition, the processor of the control device (214) may control at least one other component (e.g., a hardware or software component) of the cradle (210). For example, the processor of the control device (214) may control the power supply device (216) and the wired communication module (218) to communicate with a plurality of wireless earphones (220). According to one embodiment, two or more of the power supply device (216), the wired communication module (218), and the control device (214) may be integrated into one.

[0097] For example, the memory of the control device (214) may store programs and / or data for controlling the cradle (210) and / or a plurality of wireless earphones (220). For example, the memory of the control device (214) may store instructions for controlling the operation of the cradle (210) and / or a plurality of wireless earphones (220).

[0098] According to one embodiment, the processor of the control device (214) can communicate with the first wireless earphone (222) via the wired communication module (218).

[0099] According to one embodiment, the processor of the control device (214) can communicate with the second wireless earphone (224) via the wired communication module (218).

[0100] According to one embodiment, when the first wireless earphone (222) and the second wireless earphone (224) wake up, the cradle (210) can activate the wireless communication module (212).

[0101] According to one embodiment, the electronic device (300) can perform a connection operation with the first wireless earphone (222) and / or the second wireless earphone (224) using the wireless communication module (310) after the first wireless earphone (222) and / or the second wireless earphone (224) wakes up.

[0102] According to one embodiment, the electronic device (300) can perform a connection operation with the first wireless earphone (222) and / or the second wireless earphone (224) using the wireless communication module (212) after the first wireless earphone (222) and / or the second wireless earphone (224) wakes up.

[0103] FIG. 3A is a block diagram of a wearable electronic device (e.g., TWS wireless earphones, a first wireless earphone unit, a left wireless earphone unit) according to an embodiment of the present disclosure. FIG. 3B is a block diagram of a wearable electronic device (e.g., TWS wireless earphones, a second wireless earphone unit, a right wireless earphone unit) according to an embodiment of the present disclosure.

[0104] Referring to FIGS. 2, 3a and 3b, a cradle (210) (e.g., a case) (e.g., a charging device) and a plurality of wireless earphones (220) (e.g., TWS wireless earphones, wireless earphone units) may be configured as one electronic device (e.g., a wearable electronic device).

[0105] An electronic device (e.g., a wearable electronic device) according to one embodiment of the present disclosure may include a cradle (210) (e.g., a case) (e.g., a charging device) and a plurality of wireless earphones (220) (e.g., TWS wireless earphones, wireless earphone units). According to one embodiment, the first wireless earphone (222) and the second wireless earphone (224) may be formed as a set of two, and each may include corresponding components. The first wireless earphone (222) and the second wireless earphone (224) may have all or some of the same components, and corresponding components may be collectively described.

[0106] In FIG. 3a, among a plurality of wireless earphones (220) (e.g., TWS wireless earphones, wireless earphone units), a first wireless earphone (222) (e.g., TWS wireless earphones, first wireless earphone unit, left wireless earphone unit) is described.

[0107] According to one embodiment, the cradle (210) can operate in conjunction with a plurality of wireless earphones (220) and an electronic device (e.g., the electronic device (101) of FIG. 1, the electronic device (300) of FIG. 2, a terminal).

[0108] According to one embodiment, a plurality of wireless earphones (220) can operate in conjunction with an electronic device (101, 300).

[0109] For example, at least one of the plurality of wireless earphones (220) may operate in conjunction with the cradle (210) and an external electronic device (101, 300), terminal). For another example, at least one of the plurality of wireless earphones (220) may operate in conjunction with the external electronic device (101, 300), terminal) regardless of the cradle (210). For another example, at least one of the plurality of wireless earphones (220) may operate in conjunction with the cradle (210) regardless of the external electronic device (101, 300), terminal).

[0110] According to one embodiment, the first wireless earphone (222) (e.g., TWS wireless earphone, first wireless earphone unit, left wireless earphone unit) may include a first processor (222a), a first audio output unit (222b) (e.g., speaker / receiver), a first microphone (222c), a first battery (222d), a first charging unit (222e), a first wireless communication circuit (222f) (e.g., wireless communication circuitry), a first antenna unit (222g), a first memory (222h), and / or a first sensor unit (222i) (e.g., a wearing detection sensor, a biometric sensor, a gyro sensor, a geomagnetic sensor, a GPS sensor, a body temperature detection sensor, a moisture detection sensor, an air pressure sensor, and / or a touch sensor).

[0111] According to one embodiment, the second wireless earphone (224) (e.g., TWS wireless earphone, second wireless earphone unit, right wireless earphone unit) may include a second processor (224a), a second audio output unit (224b) (e.g., speaker / receiver), a second microphone (224c), a second battery (224d), a second charging unit (224e), a second wireless communication circuit (224f) (e.g., wireless communication circuitry), a second antenna unit (224g), a second memory (224h), and / or a second sensor unit (224i) (e.g., a wearing detection sensor, a biometric sensor, a gyro sensor, a geomagnetic sensor, a GPS sensor, a body temperature detection sensor, a moisture detection sensor, an air pressure sensor, and / or a touch sensor).

[0112] According to one embodiment, the first processor (222a) and / or the second processor (224a) may control the operation of the first wireless earphone (222) and / or the second wireless earphone (224). For example, the first processor (222a) and / or the second processor (224a) may include processing circuitry or control circuitry, such as a micro controller unit (MCU), a central processing unit (CPU), a sensor processor, a sensor hub, an application processor (AP), and / or a communication processor (CP). For example, the first processor (222a) and / or the second processor (224a) may control components included in the electronic device (101, 300) or the cradle (210) (e.g., the cradle (210) of FIG. 2) and perform various data processing or calculations.

[0113] For example, the first processor (222a) and / or the second processor (224a) may determine the wearing state of the first wireless earphone (222) and / or the second wireless earphone (224) based on sensor data (or sensing information) (e.g., proximity information, posture information, and / or touch information) obtained from a sensor circuit (e.g., the first sensor unit (222i) and / or the second sensor unit (224i).

[0114] For example, the first processor (222a) and / or the second processor (224a) may change the operation mode of the first wireless earphone (222) and / or the second wireless earphone (224) based on sensor data (or sensing information) obtained from a sensor circuit (e.g., the first sensor unit (222i) and / or the second sensor unit (224i), and control communication with the electronic device (101, 300), terminal).

[0115] For example, the first processor (222a) and / or the second processor (224a) may be controlled to execute an application (e.g., a music player) stored in the memory (130, 330) of the electronic device (101, 300) and output sound by playing audio / video data stored in the memory.

[0116] For example, the first processor (222a) and / or the second processor (224a) can seamlessly control the linkage operation with the cradle (210) and / or the external electronic device (101, 300) based on the wearing state of the first wireless earphone (222) and / or the second wireless earphone (224), the charging state of the first battery (222d) of the first wireless earphone (222) and / or the second battery (224d) of the second wireless earphone (224).

[0117] For example, the first wireless earphone (222) and the second wireless earphone (224) may include speakers. For example, the first wireless earphone (222) and / or the second wireless earphone (224) may output audio signals (e.g., sound) through the speakers of the first audio output unit (222b) and / or the second audio output unit (224b).

[0118] According to one embodiment, the first sound output unit (222b) and / or the second sound output unit (224b) can output a sound signal (or audio signal) received from an external electronic device (101, 300) or a sound signal (or audio signal) received from the cradle (210) to the outside (e.g., a user's ear).

[0119] According to one embodiment, the first sound output unit (222b) or the second sound output unit (224b) can output a sound signal executed by the first wireless earphone (222) or the second wireless earphone (224) to the outside (e.g., the user's ear).

[0120] For example, the first audio output unit (222b) and / or the second audio output unit (224b) may output audio data received from a wireless communication module (e.g., the wireless communication module (192) of FIG. 1, the wireless communication module (310) of FIG. 2) of the electronic device (101, 300) to the outside (e.g., the user's ears). For example, the first audio output unit (222b) or the second audio output unit (224b) may output audio data stored in a memory (e.g., the memory (130) of FIG. 1, the memory (330) of FIG. 2) of the electronic device (101, 300) to the outside (e.g., the user's ears). For example, the first audio output unit (222b) or the second audio output unit (224b) may output audio data stored in the first memory (222h) or the second memory (224h) to the outside (e.g., the user's ears).

[0121] In some embodiments, the first audio output unit (222b) and / or the second audio output unit (224b) may output audio signals related to various operations (or functions) performed in the electronic device (101, 300).

[0122] For example, the first wireless earphone (222) may include a first microphone (222c). The second wireless earphone (224) may include a second microphone (224c). For example, the first wireless earphone (222) and / or the second wireless earphone (224) may receive (or input) an audio signal (e.g., sound) from an external source through the first microphone (222c) and / or the second microphone (224c).

[0123] According to one embodiment, the first microphone (222c) and / or the second microphone (224c) can receive (or acquire) an acoustic signal (e.g., sound) from an external source (e.g., a user). The first microphone (222c) and / or the second microphone (224c) can receive the external acoustic signal and process it into electrical voice data. For example, various noise reduction algorithms can be implemented in the first microphone (222c) and / or the second microphone (224c) to remove noise generated in the process of receiving the external acoustic signal.

[0124] According to one embodiment, the first charging unit (222e) and / or the second charging unit (224e) can receive external power and / or internal power under the control of the first processor (222a) and / or the second processor (224a) to supply power necessary for the operation of each component, and can charge the first battery (222d) and / or the second battery (224d). For example, the first charging unit (222e) and / or the second charging unit (224e) can supply or cut off power (on / off) to the first wireless communication circuit (222f) and / or the second wireless communication circuit (224f) under the control of the first processor (222a) and / or the second processor (224a). For example, the first charging unit (222e) and / or the second charging unit (224e) can supply or cut off power (on / off) to the first sensor unit (222i) and / or the second sensor unit (224i) under the control of the first processor (222a) and / or the second processor (224a).

[0125] For example, the first charging unit (222e) and the second charging unit (224e) may include a power management integrated circuit (PMIC). For example, the first charging unit (222e) and the second charging unit (224e) may include a battery controlling / processing circuitry, a charging circuit (charger IC), and / or a boost circuit for controlling charging of the first battery (222d) and / or the second battery (224d).

[0126] For example, the first battery (222d) and / or the second battery (224d) may include a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0127] For example, the first wireless communication circuit (222f) of the first wireless earphone (222) and / or the second wireless communication circuit (224f) of the second wireless earphone (224) may include configurations identical or similar to the wireless communication module (192) of FIG. 1. For example, the first wireless communication circuit (222f) and the second wireless communication circuit (224f) may establish a wireless communication channel between each other and perform communication using the established communication channel. For example, the first wireless communication circuit (222f) and / or the second wireless communication circuit (224f) may include one or more communication circuits that enable wireless communication between the cradle (210) (e.g., the cradle (210) of FIG. 2). For example, the first wireless communication circuit (222f) and / or the second wireless communication circuit (224f) can establish a wireless communication channel with an external electronic device (101, 300) and perform communication using the established communication channel.

[0128] For example, the first wireless communication circuit (222f) and the second wireless communication circuit (224f) may be connected to each other using Bluetooth, Bluetooth low energy (BLE), Wi-Fi, ANT+ (adaptive network topology), LTE (long term evolution), 5G (5th generation mobile telecommunication), and / or NB-IoT (narrowband internet of things).

[0129] For example, the first wireless communication circuit (222f) and the second wireless communication circuit (224f) may be connected to an external electronic device (101, 300) using Bluetooth, Bluetooth Low Energy (BLE), Wi-Fi, ANT+, LTE, 5G, and / or NB-IoT.

[0130] In some embodiments, the first wireless communication circuit (222f) and the second wireless communication circuit (224f) may be connected to an access point (AP) or other network using Bluetooth, Bluetooth Low Energy (BLE), Wi-Fi, ANT+, LTE, 5G, and / or NB-IoT.

[0131] For example, the first wireless communication circuit (222f) and / or the second wireless communication circuit (224f) may transmit or receive various data through the first antenna unit (222g) and the second antenna by interworking with an external device (101, 300) or with each other to which they are connected (e.g., paired) via a designated network (e.g., a short-range communication network). According to an example, the first wireless communication circuit (222f) or the second wireless communication circuit (224f) may be maintained in a constantly on state, or may be turned on or off according to a preset operation or user input.

[0132] According to one embodiment, the first antenna unit (222g) and / or the second antenna unit (224g) can transmit signals or power to each other and / or to an external electronic device (101, 300), or receive power from an external source.

[0133] For example, the first antenna unit (222g) and / or the second antenna unit (224g) may include one or more antennas including a radiator formed of a conductor or conductive pattern formed on a substrate (e.g., a PCB). In some embodiments, in addition to the radiator, another component (e.g., an RFIC) may be additionally formed as part of the first antenna unit (222g) (or the second antenna).

[0134] According to one embodiment, the first sensor unit (222i) or the second sensor unit (224i) may include touch circuits (or touch sensors) arranged on a portion of the substrate inside the touch pad to detect a user's touch (or touch signal).

[0135] According to one embodiment, the first memory (222h) and / or the second memory (224h) may store one or more programs (or applications) and instructions executed by a processor of an external electronic device (101, 300) (e.g., the processor (120) of FIG. 1, the processor (320) of FIG. 3) and may temporarily and / or provisionally store data input / output from the electronic device (101, 300). The data input / output from the electronic device (101, 300) may include, for example, audio streaming, voice commands, mode settings, and / or status information. According to one embodiment, the first memory (222h) and / or the second memory (224h) may store data acquired in real time in a temporary storage device, and may store data determined to be stored in a long-term storage device.

[0136] According to one embodiment, the first sensor unit (222i) and / or the second sensor unit (224i) may be identical to or similar to the sensor module (176) of FIG. 1. According to one embodiment, the first sensor unit (222i) and / or the second sensor unit (224i) may include at least one sensor (e.g., an inertial sensor (e.g., an acceleration sensor, a geomagnetic sensor, a gyro sensor)) capable of detecting movement, impact intensity, and / or position of the electronic device (101, 300) and generating data used to determine the movement, impact intensity, and / or position.

[0137] For example, the first sensor unit (222i) (or the second sensor unit (224i)) may include at least one sensor (e.g., a wearing detection sensor) that can detect whether the first wireless earphone (222) (or the second wireless earphone (224)) is worn on the user's body and generate data used to determine whether it is worn or not.

[0138] For example, sensing data (or sensing information) based on the sensing results of the first sensor unit (222i) and / or the second sensor unit (224i) may be provided to the processor (120, 320) of the electronic device (101, 300).

[0139] According to one embodiment, the first sensor unit (222i) and / or the second sensor unit (224i) may include a touch circuit (or touch sensor) to detect a touch (or touch signal). For example, the touch circuit may include a capacitive touch sensor or a pressure-sensitive touch sensor, and may detect a single touch, a multi-touch, a surface touch, and / or a palm touch.

[0140] In various embodiments, the first wireless earphone (222) and / or the second wireless earphone (224) may communicate with an external electronic device (101, 300) (e.g., a smartphone and / or tablet PC).

[0141] According to one embodiment, an external electronic device (101, 300) may be connected to a wireless earphone that operates as a central (or primary, or main) among the first wireless earphone (222) and / or the second wireless earphone (224).

[0142] According to one embodiment, an external electronic device (101, 300) may be connected to the cradle (210).

[0143] For example, an external electronic device (101, 300) may be connected to each of the first wireless earphone (222) and the second wireless earphone (224) based on a multi-connection. For example, the first wireless earphone (222) and the second wireless earphone (224) may be paired with the external electronic device (101, 300) wirelessly (e.g., RF, BT, or BLE). For example, the first wireless earphone (222) and the second wireless earphone (224) may receive an audio signal related to a function executed in the connected external electronic device (101, 300) (e.g., music playback, phone call reception, alarm, or sound reception through a microphone of the external electronic device (101, 300)), convert the audio signal into sound, and output it to the outside.

[0144] For example, the settings and operating states of the first wireless earphone (222) and the second wireless earphone (224) can be changed through an external electronic device (101, 300). For example, the volume of the first wireless earphone (222) and the second wireless earphone (224) can be adjusted through the external electronic device (101, 300). In some embodiments, the first wireless earphone (222) and the second wireless earphone (224) can also set an operating mode through various sensors (e.g., an acceleration sensor, a gyro sensor, a biometric sensor, and / or a proximity sensor).

[0145] In a typical in-ear type earphone unit, an antenna pattern can be formed only on an antenna carrier. For example, a typical in-ear type earphone unit can electrically connect an antenna driving circuit arranged on a PCB (printed board assembly) and an antenna pattern (e.g., a laser direct structuring (LDS) pattern) formed on the antenna carrier using a contact structure (e.g., a C-clip). Since the antenna pattern is formed only on the antenna carrier, there are restrictions on forming the antenna pattern length and shape for 2.4 GHz (and possibly other bands).

[0146] As the functionality of wearable electronic devices (e.g., TWS wireless earphones) becomes more advanced, multiple electronic components are placed in a limited space, and the antenna pattern is placed on the antenna carrier, which may reduce the area of ​​the antenna pattern and lower antenna performance.

[0147] When wearing in-ear earphone units of typical wearable electronic devices, the distance between the user's body and the antenna pattern becomes close, and noise can degrade antenna performance. Applying conformal metal shielding to eliminate noise can also degrade the RF (radio frequency) performance of wearable electronic devices (e.g., TWS wireless earphones).

[0148] When a semiconductor packaging substrate (e.g., SiP substrate) is applied to a wearable electronic device (e.g., TWS wireless earphones), the RF port and antenna area of ​​the main IC (integrated circuit) may be separated by a long distance, which may cause path loss.

[0149] FIGS. 4 to 6 are diagrams illustrating a wearable electronic device (e.g., TWS wireless earphones, wireless earphone units) according to one embodiment of the present disclosure.

[0150] FIG. 4 is a front view of a wearable electronic device (400) (e.g., TWS wireless earphones, wireless earphone unit) according to one embodiment of the present disclosure.

[0151] FIG. 5 is a rear view of a wearable electronic device (400) (e.g., TWS wireless earphones, wireless earphone unit) according to one embodiment of the present disclosure.

[0152] FIG. 6 is a side view of a wearable electronic device (400) (e.g., TWS wireless earphones, wireless earphone unit) according to one embodiment of the present disclosure.

[0153] According to one embodiment, in FIGS. 4 to 6, (a) shows that an external case (410) is placed on a wearable electronic device (400) (e.g., TWS wireless earphones, wireless earphone unit). In FIGS. 4 to 6, (b) shows that an internal component (420) is placed on a wearable electronic device (400) (e.g., TWS wireless earphones, wireless earphone unit) with the external case (410) removed.

[0154] FIG. 7 is an exploded perspective view of a wearable electronic device (e.g., TWS wireless earphones, wireless earphone unit) according to one embodiment of the present disclosure.

[0155] Referring to FIGS. 4 to 7, a wearable electronic device (400) (e.g., TWS wireless earphones, wireless earphone unit) according to one embodiment of the present disclosure may include an outer case (410) and an internal component part (420). For example, the internal component part (420) may be placed in an internal space formed by the outer case (410).

[0156] According to one embodiment, the outer case (410) may include a rear case (411) and a front case (412) (e.g., a stem part case). For example, the internal component part (420) may include a speaker (427), a battery (426), an antenna pattern (425), an antenna carrier (424), a flexible printed circuit board (FPCB: flexible printed circuit board) (421), a printed circuit board (PCB: printed circuit board) (423) (e.g., the printed circuit board (840) of FIGS. 8 and 9), and a semiconductor packaging substrate (SiP (system in package) substrate) (422) (e.g., the semiconductor packaging substrate (850) of FIGS. 8 and 9).

[0157] According to one embodiment, in order to place various electronic components within a limited internal space of a wearable electronic device (400) (e.g., TWS wireless earphones), a semiconductor packaging substrate (422, 850) (e.g., SiP (system in package) substrate) may be applied to the wearable electronic device (e.g., TWS wireless earphones).

[0158] For example, a wearable electronic device (400) (e.g., TWS wireless earphones, wireless earphone units) according to one embodiment of the present disclosure may include an antenna structure (e.g., an antenna pattern). For example, the antenna structure (e.g., an antenna pattern) may include a first antenna structure (425, a first antenna pattern) (e.g., the first antenna structure (1220) of FIG. 12 ) and a second antenna structure (1250, a second antenna pattern) (e.g., the second antenna structure (1250) of FIG. 12 ). The first antenna structure (425, 1220, a first antenna pattern) may be disposed on at least a portion of an antenna carrier (424). The second antenna structure (1250, a second antenna pattern) may be disposed on at least a portion of a semiconductor packaging substrate (424, 850) (e.g., a SiP substrate).

[0159] For example, a printed circuit board (423, PCB) may be packaged and electrically connected to a semiconductor packaging substrate (422, SiP). For example, a flexible circuit board (421, FPCB) may be electrically connected to a printed circuit board (423, PCB) and a semiconductor packaging substrate (422, SiP).

[0160] For example, the first antenna structure (425, 1220, first antenna pattern) may be electrically connected to at least one of a flexible circuit board (421, FPCB), a printed circuit board (423, PCB), and a semiconductor packaging substrate (422, SiP). For example, the second antenna structure (1250, second antenna pattern) may be electrically connected to at least one of a flexible circuit board (421, FPCB) and a printed circuit board (423, PCB).

[0161] The RF (radio frequency) function of a wearable electronic device (400) (e.g., TWS wireless earphones) according to one embodiment of the present disclosure may be provided through an RF (radio frequency) port of a main integrated circuit (IC) disposed on a printed circuit board (PCB) (423). The wearable electronic device (e.g., TWS wireless earphones) may provide an antenna function by including a filter, a matching, a switch, a contact structure (e.g., a C-clip), a first antenna structure (425, 1220, a first antenna pattern), and a second antenna structure (1250, a second antenna pattern).

[0162] FIG. 8 is a drawing (800) showing an antenna carrier disposed in a stem part of a wearable electronic device (e.g., TWS wireless earphones, wireless earphone unit) according to one embodiment of the present disclosure and a first antenna structure (e.g., first antenna pattern) disposed in the antenna carrier.

[0163] Referring to FIGS. 4 to 8, a wearable electronic device (400) (e.g., TWS wireless earphones) according to an embodiment of the present disclosure may have an earphone unit formed in a stem type. For example, a wearable electronic device (400) (e.g., TWS wireless earphones) according to an embodiment of the present disclosure may include an antenna carrier (810), a contact structure (830, C-clip), a printed circuit board (840), and a semiconductor packaging substrate (850, SiP substrate). For example, the contact structure (830) may include various contact structures (e.g., contact patterns) other than a C-clip.

[0164] For example, an antenna carrier (810) may be disposed on a stem portion of a wearable electronic device (400) (e.g., TWS wireless earphones). A first antenna structure (425, first antenna pattern) (e.g., first antenna structure (1220) of FIG. 12) may be disposed on at least a portion of the antenna carrier (810) of the wearable electronic device (400) (e.g., TWS wireless earphones).

[0165] For example, a semiconductor packaging substrate (850, SiP substrate) may be placed on a stem portion of a wearable electronic device (400) (e.g., TWS wireless earphones). A second antenna structure (e.g., the second antenna structure (1250) of FIG. 12) may be placed on at least a portion of the semiconductor packaging substrate (850, SiP substrate).

[0166] According to one embodiment of the present disclosure, a wearable electronic device (400) (e.g., TWS wireless earphones) has a first antenna structure (425, first antenna pattern) (e.g., first antenna structure (1220) of FIG. 12) and a second antenna structure (e.g., second antenna structure (1250) of FIG. 12) disposed in a stem portion, so that a distance (e.g., gap) between a user's body and the antenna structures (1220, 1250, antenna patterns) can be relatively increased compared to an in-ear type. As the distance (e.g., gap) between a user's body and the antenna structures (1220, 1250, antenna patterns) increases, noise can be reduced and antenna performance can be improved.

[0167] A wearable electronic device (400) (e.g., TWS wireless earphones) according to one embodiment of the present disclosure can reduce noise and improve antenna performance without conformal metal shielding applied to in-ear type wireless earphones by forming antenna structures (1220, 1250, antenna patterns) to be resistant to noise.

[0168] FIG. 9 is a drawing showing a printed circuit board and a semiconductor packaging board (e.g., a SiP board), and showing electronic components arranged on a first side (e.g., a front side) of the printed circuit board. FIG. 10 is a drawing showing a printed circuit board and a semiconductor packaging board (e.g., a SiP board), and showing a second side (e.g., a back side) of the semiconductor packaging board (e.g., a SiP board). FIG. 11 is a drawing showing a printed circuit board and a semiconductor packaging board (e.g., a SiP board), and showing a third side (e.g., a side) of the semiconductor packaging board (e.g., a SiP board).

[0169] Referring to FIGS. 8 to 11, according to one embodiment, an interposer substrate (910), electronic components (912), and a contact structure (830, C-clip) may be disposed on a first surface (841) (e.g., a front surface) of a printed circuit board (840). For example, other electronic components (e.g., a touch sensor circuit) of a wearable electronic device (e.g., a wearable electronic device (400) of FIG. 4, TWS wireless earphones) may be electrically connected to the printed circuit board (840) using the interposer substrate (910). For example, the electronic components (912) may include a control circuit (e.g., a processor), a memory, a 6-axis sensor, and a power circuit.

[0170] According to one embodiment, a semiconductor packaging substrate (850, SiP substrate) may include a first surface (e.g., a front surface), a second surface (902) (e.g., a back surface), and a third surface (903) (e.g., a side surface). The second surface (902) (e.g., a back surface) may be disposed on a surface opposite the first surface (e.g., the front surface). The third surface (903) (e.g., a side surface) may be disposed between the first surface (e.g., the front surface) and the second surface (902) (e.g., the back surface). FIG. 12 is a drawing illustrating a wearable electronic device according to one embodiment of the present disclosure, in which a first antenna structure is disposed on an antenna carrier and an antenna structure is disposed on a semiconductor packaging substrate (e.g., a SiP substrate).

[0171] Referring to FIG. 12, according to one embodiment, a first antenna structure (1220, first antenna pattern) (e.g., antenna structure (425) of FIG. 8) may be disposed on at least a portion of an antenna carrier (1210) (e.g., antenna carrier (810) of FIG. 8) using a contact structure (830, C-clip). A second antenna structure (1250, second antenna pattern) may be disposed on at least a portion of a semiconductor packaging substrate (850, SiP substrate). For example, the first antenna structure (1220, first antenna pattern) and the second antenna structure (1250, second antenna pattern) may be electrically connected by a contact structure (1260).

[0172] Referring to FIGS. 9 to 12, a semiconductor packaging substrate (850, SiP substrate) may include a first surface (e.g., front surface), a second surface (902) (e.g., back surface), and a third surface (903) (e.g., side surface). The second surface (902) (e.g., back surface) may be disposed on an opposite surface of the first surface (e.g., front surface). The third surface (903) (e.g., side surface) may be disposed between the first surface (e.g., front surface) and the second surface (902) (e.g., back surface).

[0173] For example, the first side (e.g., front side) of the semiconductor packaging substrate (850, SiP substrate) and the second side (e.g., back side) of the printed circuit board (850) may be arranged to be in contact. The first side (e.g., front side) of the semiconductor packaging substrate (850, SiP substrate) and the second side (e.g., back side) of the printed circuit board (850) may be bonded by an adhesive material.

[0174] According to one embodiment, a second antenna structure (e.g., the second antenna structure (1250) of FIG. 12) may be disposed on at least one of a second side (902) (e.g., a back side) and a third side (903) (e.g., a side side) of a semiconductor packaging substrate (850, SiP substrate).

[0175] For example, a second antenna structure (1250) (e.g., a second antenna pattern) may be disposed on all or part of a second surface (902) (e.g., a back surface) of a semiconductor packaging substrate (850, SiP substrate).

[0176] For example, a second antenna structure (1250) (e.g., a second antenna pattern) may be arranged on all or part of a third surface (903) (e.g., a side) of a semiconductor packaging substrate (850, SiP substrate).

[0177] For example, a second antenna structure (1250) (e.g., a second antenna pattern) may be disposed on at least a portion of the second side (902, back side) and the third side (903) (e.g., side side) of a semiconductor packaging substrate (850, SiP substrate). For example, the permittivity of the molding material of the semiconductor packaging substrate (850, SiP substrate) may not affect the antenna performance. The second antenna structure (1250) (e.g., a second antenna pattern) may be formed on at least a portion of the second side (902) (e.g., back side) and the third side (903) (e.g., side side) of the semiconductor packaging substrate (850, SiP substrate) by a conformal coating method.

[0178] For example, if a second antenna structure (1250) (e.g., a second antenna pattern) is formed on at least one of the second side (902) (e.g., a back side) and the third side (903) (e.g., a side) of a semiconductor packaging substrate (850, SiP substrate), the area of ​​the antenna region can be increased by about 100 mm².

[0179] According to one embodiment of the present disclosure, a wearable electronic device (e.g., a wearable electronic device (400) of FIG. 4, TWS wireless earphones) may have a second antenna structure (1250) (e.g., a second antenna pattern) disposed on at least a portion of a second side (902) (e.g., a back side) and / or a third side (903) (e.g., a side) of a semiconductor packaging substrate (850, SiP substrate), thereby increasing the area of ​​the entire antenna pattern of the wearable electronic device (400) and improving antenna performance.

[0180] The antenna pattern must be fill-cut in the antenna area to maximize the radiation effect. In a wearable electronic device according to an embodiment of the present disclosure (e.g., the wearable electronic device (400) of FIG. 4), noise generated from electronic components (e.g., main ICs) placed on a semiconductor packaging substrate (850, SiP substrate) and a printed circuit board (840, PCB) may not affect the antenna area even without applying a metal shield.

[0181] FIG. 13 is a drawing (1300) showing a first antenna structure disposed on an antenna carrier and a second antenna structure disposed on an outer surface (e.g., a second side (back side), a third side (side side)) of a semiconductor packaging substrate (e.g., a SiP substrate). FIG. 14 is a circuit diagram (1400) of a first antenna structure disposed on an antenna carrier of a wearable electronic device according to one embodiment of the present disclosure and a second antenna structure disposed on a semiconductor packaging substrate (e.g., a SiP substrate).

[0182] Referring to FIGS. 13 and 14, a wearable electronic device according to an embodiment of the present disclosure (e.g., the wearable electronic device (400) of FIG. 4) includes an antenna carrier (1310) (e.g., the antenna carrier (1210) of FIG. 12), a printed circuit board (1330, PCB) (e.g., the printed circuit board (840) of FIG. 12), a semiconductor packaging substrate (1340, SiP substrate) (e.g., the semiconductor packaging substrate (850) of FIG. 12), a first antenna structure (1320, first antenna pattern) (e.g., the first antenna structure (1220) of FIG. 12), a second antenna structure (1350, second antenna pattern) (e.g., the second antenna structure (1250) of FIG. 12), and a contact structure (1360, C-clip) (e.g., the contact structure (1260) of FIG. 12). May include.

[0183] According to one embodiment, a first side (1341) (e.g., front side) of a semiconductor packaging substrate (1340, SiP substrate) and a second side (1332) (e.g., back side) of a printed circuit board (1330) may be arranged to be in contact with each other. The first side (1341) (e.g., front side) of the semiconductor packaging substrate (1340, SiP substrate) and the second side (1332) (e.g., back side) of the printed circuit board (1330) may be bonded by an adhesive material. For example, electronic components may be arranged on the first side (1331) (e.g., front side) and the second side (1332) (e.g., back side) of the printed circuit board (1330).

[0184] According to one embodiment, a first antenna structure (1320, first antenna pattern) (e.g., first antenna structure (1220) of FIG. 12) may be disposed on an antenna carrier (1310) (e.g., antenna carrier (1210) of FIG. 12). For example, the first antenna structure (1320, first antenna pattern) disposed on the antenna carrier (1310) may include a conductive pattern for forming a main feed.

[0185] According to one embodiment, a second antenna structure (1350, second antenna pattern) may be disposed on an outer surface (e.g., second side (back side), third side (side side)) of a semiconductor packaging substrate (1340, SiP substrate).

[0186] According to one embodiment, a first antenna structure (1320, first antenna pattern) and a second antenna structure (1350, second antenna pattern) may be electrically connected by a contact structure (1360, C-clip) disposed on a printed circuit board (1330, PCB).

[0187] For example, the second antenna structure (1350, second antenna pattern) may be disposed on a second side (1342) (e.g., a back side) of an outer surface of a semiconductor packaging substrate (1340, SiP substrate). For example, the second antenna structure (1350, second antenna pattern) may be disposed on at least a portion of the second side (1342, e.g., a back side) of the semiconductor packaging substrate (1340, SiP substrate). For example, the second antenna structure (1350, second antenna pattern) may not be disposed on a third side (1343) (e.g., a side side) of the semiconductor packaging substrate (1340, SiP substrate).

[0188] For example, the second antenna structure (1350, second antenna pattern) may include a conductive pattern for adjusting the length of the first antenna pattern (1320) (e.g., adjusting the length of the main feeding).

[0189] According to one embodiment of the present disclosure, a wearable electronic device (400, TWS wireless earphone) can improve antenna performance by increasing the area of ​​the entire antenna pattern of the wearable electronic device (400) by arranging a second antenna structure (1350, second antenna pattern) (e.g., main feed) on a second side (1342) (e.g., back side) among the outer surfaces of a semiconductor packaging substrate (1340, SiP substrate).

[0190] FIG. 15 is a drawing (1500) showing a first antenna structure disposed on an antenna carrier and a second antenna structure disposed on an outer surface (e.g., a second side (back side), a third side (side side)) of a semiconductor packaging substrate (e.g., a SiP substrate). FIG. 16 is a circuit diagram (1600) of a first antenna structure disposed on an antenna carrier of a wearable electronic device according to one embodiment of the present disclosure and a second antenna structure disposed on a semiconductor packaging substrate (e.g., a SiP substrate).

[0191] Referring to FIGS. 15 and 16, a wearable electronic device according to an embodiment of the present disclosure (e.g., the wearable electronic device (400) of FIG. 4) includes an antenna carrier (1510) (e.g., the antenna carrier (1210) of FIG. 12), a printed circuit board (1530, PCB) (e.g., the printed circuit board (840) of FIG. 12), a semiconductor packaging substrate (1540, SiP substrate) (e.g., the semiconductor packaging substrate (850) of FIG. 12), a first antenna structure (1520, first antenna pattern) (e.g., the first antenna structure (1220) of FIG. 12), a second antenna structure (1570, second antenna pattern) (e.g., the second antenna structure (1250) of FIG. 12), and a contact structure (1560, C-clip) (e.g., the contact structure (1260) of FIG. 12). May include.

[0192] According to one embodiment, a first side (1541) (e.g., front side) of a semiconductor packaging substrate (1540, SiP substrate) and a second side (e.g., back side) of a printed circuit board (1530) may be arranged to be in contact. The first side (1541) (e.g., front side) of the semiconductor packaging substrate (1540, SiP substrate) and the second side (e.g., back side) of the printed circuit board (1530) may be bonded by an adhesive material. For example, electronic components may be arranged on the first side (1531) (e.g., front side) and the second side (1532) (e.g., back side) of the printed circuit board (1530).

[0193] According to one embodiment, a first antenna structure (1520, first antenna pattern) (e.g., first antenna structure (1220) of FIG. 12) may be disposed on an antenna carrier (1510) (e.g., antenna carrier (1210) of FIG. 12). For example, the first antenna structure (1520, first antenna pattern) disposed on the antenna carrier (1510) may include a conductive pattern for forming a main feed.

[0194] According to one embodiment, a second antenna structure (1570, second antenna pattern) may be disposed on an outer surface (e.g., second side (back side), third side (side side)) of a semiconductor packaging substrate (1540, SiP substrate).

[0195] According to one embodiment, a second antenna structure (1570, second antenna pattern) and a printed circuit board (1530) may be electrically connected by a contact structure (1560, C-clip) disposed on the printed circuit board (1530, PCB).

[0196] For example, the second antenna structure (1570, second antenna pattern) may be disposed on a second side (1542) (e.g., a back side) among the outer surfaces of the semiconductor packaging substrate (1540, SiP substrate). The second antenna structure (1570, second antenna pattern) may be disposed on at least a portion of the second side (1542) (e.g., a back side) of the semiconductor packaging substrate (1540, SiP substrate). For example, the second antenna structure (1570, second antenna pattern) may not be disposed on a third side (1543) (e.g., a side surface) of the semiconductor packaging substrate (1540, SiP substrate).

[0197] For example, the second antenna structure (1570, second antenna pattern) may include a conductive pattern to form a shorting feed of the antenna.

[0198] According to one embodiment of the present disclosure, a wearable electronic device (400, TWS wireless earphone) can improve antenna performance by increasing the area of ​​the entire antenna pattern of the wearable electronic device (400) by arranging a second antenna structure (1570, second antenna pattern) (e.g., shorting feed) on a second side (1542) (e.g., back side) among the outer surfaces of a semiconductor packaging substrate (1540, SiP substrate).

[0199] FIG. 17 is a drawing (1700) showing a first antenna structure disposed on an antenna carrier and a second antenna structure disposed on an outer surface (e.g., a second side (back side), a third side (side side)) of a semiconductor packaging substrate (e.g., a SiP substrate). FIG. 18 is a circuit diagram (1800) of a first antenna structure disposed on an antenna carrier of a wearable electronic device according to one embodiment of the present disclosure and a second antenna structure disposed on a semiconductor packaging substrate (e.g., a SiP substrate).

[0200] Referring to FIGS. 17 and 18, a wearable electronic device according to an embodiment of the present disclosure (e.g., a wearable electronic device (400) of FIG. 4) includes an antenna carrier (1710) (e.g., an antenna carrier (1210) of FIG. 12), a printed circuit board (1730, PCB) (e.g., a printed circuit board (840) of FIG. 12), a semiconductor packaging substrate (1740, SiP substrate) (e.g., a semiconductor packaging substrate (850) of FIG. 12), a first antenna structure (1720, a first antenna pattern) (e.g., a first antenna structure (1220) of FIG. 12), a second antenna structure (1780, a second antenna pattern) (e.g., a second antenna structure (1250) of FIG. 12), and a contact structure (1760, C-clip) (e.g., a contact structure (1260) of FIG. 12). May include.

[0201] According to one embodiment, a first side (1741) (e.g., front side) of a semiconductor packaging substrate (1740, SiP substrate) and a second side (e.g., back side) of a printed circuit board (1730) may be arranged to be in contact. The first side (1741) (e.g., front side) of the semiconductor packaging substrate (1740, SiP substrate) and the second side (e.g., back side) of the printed circuit board (1730) may be bonded by an adhesive material. For example, electronic components may be arranged on the first side (1731) (e.g., front side) and the second side (1732) (e.g., back side) of the printed circuit board (1730).

[0202] According to one embodiment, a first antenna structure (1720, first antenna pattern) (e.g., first antenna structure (1220) of FIG. 12) may be disposed on an antenna carrier (1710) (e.g., antenna carrier (1210) of FIG. 12). For example, the first antenna structure (1720, first antenna pattern) disposed on the antenna carrier (1710) may include a conductive pattern for forming a main feed.

[0203] According to one embodiment, a second antenna structure (1780, second antenna pattern) may be disposed on an outer surface (e.g., second side (back side), third side (side side)) of a semiconductor packaging substrate (1740, SiP substrate).

[0204] According to one embodiment, a second antenna structure (1780, second antenna pattern) and a printed circuit board (1730) may be electrically connected by a contact structure (1760, C-clip) disposed on the printed circuit board (1730, PCB).

[0205] For example, the second antenna structure (1780, second antenna pattern) may be disposed on a second side (1742) (e.g., a back side) of an outer surface of a semiconductor packaging substrate (1840, SiP substrate). The second antenna structure (1780, second antenna pattern) may be disposed on at least a portion of the second side (1742) (e.g., a back side) of the semiconductor packaging substrate (1540, SiP substrate). For example, the second antenna structure (1780, second antenna pattern) may not be disposed on a third side (1743) (e.g., a side surface) of the semiconductor packaging substrate (1740, SiP substrate).

[0206] For example, the second antenna structure (1780, second antenna pattern) may include a conductive pattern for forming an antenna ground.

[0207] According to one embodiment of the present disclosure, a wearable electronic device (400, TWS wireless earphone) can improve antenna performance by increasing the area of ​​the entire antenna pattern of the wearable electronic device (400) by arranging a second antenna structure (1780, second antenna pattern) (e.g., antenna ground) on a second surface (1742) (e.g., back surface) among the outer surfaces of a semiconductor packaging substrate (1740, SiP substrate).

[0208] FIG. 19 is a drawing (1900) showing a first antenna structure disposed on an antenna carrier, and a second antenna structure disposed on an outer surface (e.g., a second side (back surface), a third side (side surface)) of a semiconductor packaging substrate (e.g., a SiP substrate). FIGS. 20 and 21 are drawings (2000) showing a second antenna structure, a contact structure, and a connection pattern electrically connecting the second antenna structure and the contact structure on an outer surface (e.g., a second side (back surface), a third side (side surface)) of a semiconductor packaging substrate (e.g., a SiP substrate).

[0209] Referring to FIGS. 19 to 21, a wearable electronic device (e.g., a wearable electronic device (400) of FIG. 4) according to an embodiment of the present disclosure includes an antenna carrier (e.g., an antenna carrier (1210) of FIG. 12), a printed circuit board (1930, PCB) (e.g., a printed circuit board (840) of FIG. 12), a semiconductor packaging substrate (1940, SiP substrate) (e.g., a semiconductor packaging substrate (850) of FIG. 12), a first antenna structure (first antenna pattern) (e.g., the first antenna structure (1220) of FIG. 12, the first antenna structure (1720) of FIG. 17), a second antenna structure (1980, a second antenna pattern) (e.g., the second antenna structure (1250) of FIG. 12), a contact structure (1960, C-clip) (e.g., a contact of FIG. 12). It may include a structure (1260).

[0210] According to one embodiment, a first side (e.g., front side) of a semiconductor packaging substrate (1940, SiP substrate) and a second side (e.g., back side) of a printed circuit board (1930) may be arranged to be in contact. The first side (e.g., front side) of the semiconductor packaging substrate (1940, SiP substrate) and the second side (e.g., back side) of the printed circuit board (1930) may be bonded by an adhesive material.

[0211] According to one embodiment, a second antenna structure (1980, a second antenna pattern) may be disposed on an outer surface (e.g., a second side (back side), a third side (side side)) of a semiconductor packaging substrate (1940, a SiP substrate). For example, the second antenna structure (1980, a second antenna pattern) may be disposed on all or a portion of the second side (1942) (e.g., a back side) of the semiconductor packaging substrate (1940, a SiP substrate). For example, the second antenna structure (1980, a second antenna pattern) may be disposed on all or a portion of the third side (1943) (e.g., a side side) of the semiconductor packaging substrate (1940, a SiP substrate).

[0212] According to one embodiment, a second antenna structure (1980, second antenna pattern) and a printed circuit board (1930) may be electrically connected by a contact structure (1960, C-clip) disposed on the printed circuit board (1930, PCB).

[0213] For example, a second antenna structure (1980, second antenna pattern) may be arranged on at least a portion of a second side (1942) (e.g., a back side) and a third side (1943) (e.g., a side) of an outer surface of a semiconductor packaging substrate (1940, SiP substrate).

[0214] For example, the second antenna structure (1980, second antenna pattern) may include a conductive pattern for forming an antenna ground.

[0215] For example, two antenna structures (1980, second antenna pattern) may be arranged to form an antenna ground on all or at least a portion of a second side (1942) (e.g., back side) and a third side (1943) (e.g., side) of a semiconductor packaging substrate (1940, SiP substrate).

[0216] According to one embodiment, a connection pattern (1982) may be arranged to electrically connect an antenna structure (1980, second antenna pattern) and a contact structure (1960, C-clip) formed on all or at least a portion of a second side (1942) (e.g., back side) and a third side (1943) (e.g., side) of a semiconductor packaging substrate (1940, SiP substrate).

[0217] For example, the connection pattern (1982) may be arranged on at least a portion of a printed circuit board (1930, PCB) and at least a portion of a semiconductor packaging substrate (1940, SiP substrate).

[0218] For example, a connection pattern (1982) may be arranged on a second surface (1942) (e.g., a back surface) of a semiconductor packaging substrate (1940, SiP substrate).

[0219] For example, a connection pattern (1982) may be arranged on a third side (1943) (e.g., a side) of a semiconductor packaging substrate (1940, SiP substrate).

[0220] For example, a connection pattern (1982) may be arranged on a second side (1942) (e.g., a back side) and a third side (1943) (e.g., a side) of a semiconductor packaging substrate (1940, SiP substrate).

[0221] According to one embodiment of the present disclosure, a wearable electronic device (400, TWS wireless earphone) can improve antenna performance by increasing the area of ​​the entire antenna pattern of the wearable electronic device (400) by arranging a second antenna structure (1980, second antenna pattern) (e.g., antenna ground) on all or part of a second side (1942) (e.g., back side) and a third side (1943) (e.g., side) among the outer surfaces of a semiconductor packaging substrate (1940, SiP substrate).

[0222] FIG. 22 is a drawing (2200) showing an antenna structure arranged on an outer surface (e.g., a second surface (back surface), a third surface (side surface)) of a semiconductor packaging substrate (e.g., a SiP substrate).

[0223] Referring to FIG. 22, a wearable electronic device according to an embodiment of the present disclosure (e.g., the wearable electronic device (400) of FIG. 4) may include a support structure (2210), a printed circuit board (PCB) (e.g., the printed circuit board (840) of FIG. 12), a semiconductor packaging substrate (SiP substrate) (2240) (e.g., the semiconductor packaging substrate (850) of FIG. 12), an antenna structure (antenna pattern) (2250), and a contact structure (C-clip) (2260) (e.g., the contact structure (1260) of FIG. 12).

[0224] For example, the support structure (2210) forms a space in which a printed circuit board (2230, PCB) and a semiconductor packaging substrate (2240, SiP substrate) are placed, and the printed circuit board (2230, PCB) and the semiconductor packaging substrate (2240, SiP substrate) can be placed in the space formed by the support structure (2210). The support structure (2210) can absorb external impact applied to the printed circuit board (2230, PCB) and the semiconductor packaging substrate (2240, SiP substrate), thereby protecting the printed circuit board (2230, PCB) and the semiconductor packaging substrate (2240, SiP substrate).

[0225] According to one embodiment, a first side (e.g., front side) of a semiconductor packaging substrate (2240, SiP substrate) and a second side (e.g., back side) of a printed circuit board (2230) may be arranged to be in contact. The first side (e.g., front side) of the semiconductor packaging substrate (2240, SiP substrate) and the second side (e.g., back side) of the printed circuit board (2230) may be bonded by an adhesive material.

[0226] According to one embodiment, an antenna structure (2250, antenna pattern) may be disposed on an outer surface (e.g., a second side (back side), a third side (side side)) of a semiconductor packaging substrate (2240, SiP substrate).

[0227] According to one embodiment, an antenna structure (2250, antenna pattern) may be electrically connected to a printed circuit board (2230, PCB) by a contact structure (2260, C-clip) disposed on the printed circuit board (2230, PCB).

[0228] For example, the antenna structure (2250, antenna pattern) may be disposed on a second surface (2242) (e.g., a back surface) among the outer surfaces of the semiconductor packaging substrate (2240, SiP substrate). The antenna structure (2250, antenna pattern) may be disposed on at least a portion of the second surface (2242) (e.g., a back surface) of the semiconductor packaging substrate (2240, SiP substrate).

[0229] For example, the antenna structure (2250, antenna pattern) may include a conductive pattern to form a main feed of the antenna.

[0230] According to one embodiment of the present disclosure, a wearable electronic device (400, TWS wireless earphone) can improve antenna performance by increasing the area of ​​the entire antenna pattern of the wearable electronic device (400) by arranging an antenna structure (2250, antenna pattern) (e.g., main feed) on a second surface (2242) (e.g., back surface) among the outer surfaces of a semiconductor packaging substrate (2240, SiP substrate).

[0231] FIG. 23 is a drawing (2300) showing an antenna structure arranged on an outer surface (e.g., a second surface (back surface), a third surface (side surface)) of a semiconductor packaging substrate (e.g., a SiP substrate).

[0232] Referring to FIG. 23, a wearable electronic device according to an embodiment of the present disclosure (e.g., the wearable electronic device (400) of FIG. 4) may include a support structure (2310), a printed circuit board (PCB) (e.g., the printed circuit board (840) of FIG. 12), a semiconductor packaging substrate (SiP substrate) (2340) (e.g., the semiconductor packaging substrate (850) of FIG. 12), an antenna structure (2350) (e.g., an antenna pattern), and a contact structure (C-clip) (2360) (e.g., the contact structure (1260) of FIG. 12).

[0233] For example, the support structure (2310) forms a space in which a printed circuit board (2330, PCB) and a semiconductor packaging substrate (2340, SiP substrate) are placed, and the printed circuit board (2330, PCB) and the semiconductor packaging substrate (2340, SiP substrate) can be placed in the space formed by the support structure (2310). The support structure (2310) can absorb external impact applied to the printed circuit board (2330, PCB) and the semiconductor packaging substrate (2340, SiP substrate), thereby protecting the printed circuit board (2330, PCB) and the semiconductor packaging substrate (2340, SiP substrate).

[0234] According to one embodiment, a first side (e.g., front side) of a semiconductor packaging substrate (2340, SiP substrate) and a second side (e.g., back side) of a printed circuit board (2330) may be arranged to be in contact. The first side (e.g., front side) of the semiconductor packaging substrate (2340, SiP substrate) and the second side (e.g., back side) of the printed circuit board (2330) may be bonded by an adhesive material.

[0235] According to one embodiment, an antenna structure (2350) (e.g., an antenna pattern) may be disposed on an outer surface (e.g., a second side (back side), a third side (side side)) of a semiconductor packaging substrate (2340, SiP substrate).

[0236] According to one embodiment, an antenna structure (2350) (e.g., an antenna pattern) may be electrically connected to a printed circuit board (2330, PCB) by a contact structure (2360, C-clip) disposed on the printed circuit board (2330, PCB).

[0237] For example, the antenna structure (2350) (e.g., antenna pattern) may be disposed on a second surface (2342) (e.g., back surface) among the outer surfaces of the semiconductor packaging substrate (2340, SiP substrate). The antenna structure (2350) (e.g., antenna pattern) may be disposed on at least a portion of the second surface (2342) (e.g., back surface) of the semiconductor packaging substrate (2340, SiP substrate).

[0238] For example, the antenna structure (2350) (e.g., antenna pattern) may include a first conductive pattern for forming a main feed (2351) of the antenna, and a second conductive pattern for forming a shorting feed (2352).

[0239] For example, the contact structure (2360, C-clip) may include a first contact portion (2362) electrically connecting a first conductive pattern to form a main feed (2351, main feed) of the antenna and a printed circuit board (2330).

[0240] For example, the contact structure (2360, C-clip) may include a second contact portion (2364) electrically connecting a second conductive pattern to form a shorting feed (2352, shorting feed) of the antenna and a printed circuit board (2330).

[0241] According to one embodiment of the present disclosure, a wearable electronic device (400, TWS wireless earphone) can improve antenna performance by increasing the area of ​​the entire antenna pattern of the wearable electronic device (400) by arranging an antenna structure (2350) (e.g., a main feed and a shorting feed) on a second surface (2342) (e.g., a back surface) among the outer surfaces of a semiconductor packaging substrate (2340, SiP substrate).

[0242] FIG. 24 is a drawing (2400) showing an antenna structure arranged on an outer surface (e.g., a second surface (back surface), a third surface (side surface)) of a semiconductor packaging substrate (e.g., a SiP substrate).

[0243] Referring to FIG. 24, a wearable electronic device according to an embodiment of the present disclosure (e.g., the wearable electronic device (400) of FIG. 4) may include a support structure (2410), a printed circuit board (PCB) (e.g., the printed circuit board (840) of FIG. 12), a semiconductor packaging substrate (SiP substrate) (2440) (e.g., the semiconductor packaging substrate (850) of FIG. 12), an antenna structure (2450) (e.g., an antenna pattern), and a contact structure (C-clip) (2460) (e.g., the contact structure (1260) of FIG. 12).

[0244] For example, the support structure (2410) forms a space in which a printed circuit board (2430, PCB) and a semiconductor packaging substrate (2440, SiP substrate) are placed, and the printed circuit board (2430, PCB) and the semiconductor packaging substrate (2440, SiP substrate) can be placed in the space formed by the support structure (2410). The support structure (2410) can absorb external impact applied to the printed circuit board (2430, PCB) and the semiconductor packaging substrate (2440, SiP substrate), thereby protecting the printed circuit board (2430, PCB) and the semiconductor packaging substrate (2440, SiP substrate).

[0245] According to one embodiment, a first side (e.g., front side) of a semiconductor packaging substrate (2440, SiP substrate) and a second side (e.g., back side) of a printed circuit board (2430) may be arranged to be in contact. The first side (e.g., front side) of the semiconductor packaging substrate (2440, SiP substrate) and the second side (e.g., back side) of the printed circuit board (2430) may be bonded by an adhesive material.

[0246] According to one embodiment, an antenna structure (2450) (e.g., an antenna pattern) may be disposed on an outer surface (e.g., a second side (back side), a third side (side side)) of a semiconductor packaging substrate (2440, SiP substrate).

[0247] According to one embodiment, an antenna structure (2450) (e.g., an antenna pattern) may be electrically connected to a printed circuit board (2430, PCB) by a contact structure (2460, C-clip) disposed on the printed circuit board (2430, PCB).

[0248] For example, the antenna structure (2450) (e.g., antenna pattern) may be disposed on a second surface (2442) (e.g., back surface) among the outer surfaces of the semiconductor packaging substrate (2440, SiP substrate). The antenna structure (2450) (e.g., antenna pattern) may be disposed on at least a portion of the second surface (2442) (e.g., back surface) of the semiconductor packaging substrate (2440, SiP substrate).

[0249] For example, the antenna structure (2450) (e.g., antenna pattern) may include a first conductive pattern for forming a main feed (2451) of the antenna, and a second conductive pattern for forming a ground (2452).

[0250] For example, the contact structure (2460, C-clip) may include a first contact portion (2462) electrically connecting a first conductive pattern to form a main feed (2451, main feed) of the antenna and a printed circuit board (2430).

[0251] For example, the contact structure (2460, C-clip) may include a second contact portion (2464) electrically connecting a second conductive pattern to form an antenna ground (2452) and a printed circuit board (2430).

[0252] According to one embodiment of the present disclosure, a wearable electronic device (400, TWS wireless earphone) can improve antenna performance by increasing the area of ​​the entire antenna pattern of the wearable electronic device (400) by arranging an antenna structure (2450) (e.g., main feed and ground) on a second surface (2442) (e.g., back surface) among the outer surfaces of a semiconductor packaging substrate (2440, SiP substrate).

[0253] FIG. 25 is a drawing (2500) showing an antenna structure arranged on an outer surface (e.g., a second surface (back surface), a third surface (side surface)) of a semiconductor packaging substrate (e.g., a SiP substrate).

[0254] Referring to FIG. 25, a wearable electronic device according to an embodiment of the present disclosure (e.g., the wearable electronic device (400) of FIG. 4) may include a support structure (2510), a printed circuit board (PCB) (e.g., the printed circuit board (840) of FIG. 12), a semiconductor packaging substrate (SiP substrate) (2540) (e.g., the semiconductor packaging substrate (850) of FIG. 12), an antenna structure (2450) (e.g., an antenna pattern), and a contact structure (C-clip) (2560) (e.g., the contact structure (1260) of FIG. 12).

[0255] For example, the support structure (2510) forms a space in which a printed circuit board (2530, PCB) and a semiconductor packaging substrate (2540, SiP substrate) are placed, and the printed circuit board (2530, PCB) and the semiconductor packaging substrate (2540, SiP substrate) can be placed in the space formed by the support structure (2510). The support structure (2510) can absorb external impact applied to the printed circuit board (2530, PCB) and the semiconductor packaging substrate (2540, SiP substrate), thereby protecting the printed circuit board (2530, PCB) and the semiconductor packaging substrate (2540, SiP substrate).

[0256] According to one embodiment, a first side (e.g., front side) of a semiconductor packaging substrate (2540, SiP substrate) and a second side (e.g., back side) of a printed circuit board (2530) may be arranged to be in contact. The first side (e.g., front side) of the semiconductor packaging substrate (2540, SiP substrate) and the second side (e.g., back side) of the printed circuit board (2530) may be bonded by an adhesive material.

[0257] According to one embodiment, an antenna structure (2550) (e.g., an antenna pattern) may be disposed on an outer surface (e.g., a second side (back side), a third side (side side)) of a semiconductor packaging substrate (2540, SiP substrate).

[0258] According to one embodiment, an antenna structure (2550) (e.g., an antenna pattern) may be electrically connected to a printed circuit board (2530, PCB) by a contact structure (2560, C-clip) disposed on the printed circuit board (2530, PCB).

[0259] For example, the antenna structure (2550) (e.g., antenna pattern) may be disposed on a second surface (2542) (e.g., back surface) among the outer surfaces of the semiconductor packaging substrate (2540, SiP substrate). The antenna structure (2550) (e.g., antenna pattern) may be disposed on at least a portion of the second surface (2542) (e.g., back surface) of the semiconductor packaging substrate (2540, SiP substrate).

[0260] For example, the antenna structure (2550) (e.g., antenna pattern) may include a first conductive pattern for forming a main feed (2551) of the antenna, a second conductive pattern for forming a shorting feed (2552), and a third conductive pattern for forming a ground (2553).

[0261] For example, the contact structure (2560, C-clip) may include a first contact portion (2562) electrically connecting a first conductive pattern to form a main feed (2551, main feed) of the antenna and a printed circuit board (2530).

[0262] For example, the contact structure (2560, C-clip) may include a second contact portion (2564) electrically connecting a second conductive pattern to form a shorting feed (2552) of the antenna and a printed circuit board (2530).

[0263] For example, the contact structure (2560, C-clip) may include a third contact portion (2566) that electrically connects a third conductive pattern to form an antenna ground (2553) and a printed circuit board (2530).

[0264] According to one embodiment of the present disclosure, a wearable electronic device (400, TWS wireless earphone) can improve antenna performance by increasing the area of ​​the overall antenna pattern of the wearable electronic device (400) by arranging an antenna structure (2550) (e.g., main feed, shorting feed, and ground) on a second surface (2542) (e.g., back surface) among the outer surfaces of a semiconductor packaging substrate (2540, SiP substrate).

[0265] FIG. 26 is a drawing (2600) showing an antenna structure arranged on an outer surface (e.g., a second surface (back surface), a third surface (side surface)) of a semiconductor packaging substrate (e.g., a SiP substrate).

[0266] Referring to FIG. 26, a wearable electronic device according to an embodiment of the present disclosure (e.g., the wearable electronic device (400) of FIG. 4) may include a support structure (2610), a printed circuit board (PCB) (e.g., the printed circuit board (840) of FIG. 12), a semiconductor packaging substrate (SiP substrate) (2640) (e.g., the semiconductor packaging substrate (850) of FIG. 12), an antenna structure (2650) (e.g., an antenna pattern), and a contact structure (C-clip) (2660) (e.g., the contact structure (1260) of FIG. 12).

[0267] For example, the support structure (2610) forms a space in which a printed circuit board (2630, PCB) and a semiconductor packaging substrate (2640, SiP substrate) are placed, and the printed circuit board (2630, PCB) and the semiconductor packaging substrate (2640, SiP substrate) can be placed in the space formed by the support structure (2610). The support structure (2610) can absorb external impact applied to the printed circuit board (2630, PCB) and the semiconductor packaging substrate (2640, SiP substrate), thereby protecting the printed circuit board (2630, PCB) and the semiconductor packaging substrate (2640, SiP substrate).

[0268] According to one embodiment, a first side (e.g., front side) of a semiconductor packaging substrate (2640, SiP substrate) and a second side (e.g., back side) of a printed circuit board (2630) may be arranged to be in contact. The first side (e.g., front side) of the semiconductor packaging substrate (2640, SiP substrate) and the second side (e.g., back side) of the printed circuit board (2630) may be bonded by an adhesive material.

[0269] According to one embodiment, an antenna structure (2650) (e.g., an antenna pattern) may be disposed on an outer surface (e.g., a second side (2642) (e.g., a back side) and a third side (2643) (e.g., a side side)) of a semiconductor packaging substrate (2640, SiP substrate).

[0270] According to one embodiment, an antenna structure (2650) (e.g., an antenna pattern) may be electrically connected to a printed circuit board (2630, PCB) by a contact structure (2660, C-clip) disposed on the printed circuit board (2630, PCB).

[0271] For example, the antenna structure (2650) (e.g., antenna pattern) may be disposed on a second surface (2642) (e.g., back surface) and a third surface (2643) (e.g., side surface) of an outer surface of a semiconductor packaging substrate (2640, SiP substrate). The antenna structure (2650) (e.g., antenna pattern) may be disposed on a portion of the second surface (2642) (e.g., back surface) and the third surface (2643) (e.g., side surface) of a semiconductor packaging substrate (2540, SiP substrate).

[0272] For example, the antenna structure (2650) (e.g., antenna pattern) may include a conductive pattern for forming a main feed of the antenna, a conductive pattern for forming a shorting feed, and / or a conductive pattern for forming a ground.

[0273] For example, a contact structure (2660, C-clip) can electrically connect a first conductive pattern to form a main feed of the antenna and a printed circuit board (2630).

[0274] For example, a contact structure (2660, C-clip) can electrically connect a conductive pattern to form a shorting feed of an antenna and a printed circuit board (2630).

[0275] For example, a contact structure (2660, C-clip) can electrically connect a conductive pattern to form an antenna ground and a printed circuit board (2630).

[0276] According to one embodiment of the present disclosure, a wearable electronic device (400, TWS wireless earphone) can improve antenna performance by increasing the area of ​​the overall antenna pattern of the wearable electronic device (400) by arranging an antenna structure (2650) (e.g., a main feed, a shorting feed, and a ground) on a second side (2642) (e.g., a back side) and a third side (2643) (e.g., a side) among the outer surfaces of a semiconductor packaging substrate (2640, SiP substrate).

[0277] FIG. 27 is a drawing (2700) showing an antenna structure arranged on an outer surface (e.g., a second surface (back surface), a third surface (side surface)) of a semiconductor packaging substrate (e.g., a SiP substrate).

[0278] Referring to FIG. 27, a wearable electronic device according to an embodiment of the present disclosure (e.g., the wearable electronic device (400) of FIG. 4) may include a support structure (2710), a printed circuit board (PCB) (e.g., the printed circuit board (840) of FIG. 12), a semiconductor packaging substrate (SiP substrate) (2740) (e.g., the semiconductor packaging substrate (850) of FIG. 12), an antenna structure (2750) (e.g., an antenna pattern), and a contact structure (C-clip) (2760) (e.g., the contact structure (1260) of FIG. 12).

[0279] For example, the support structure (2710) forms a space in which a printed circuit board (2730, PCB) and a semiconductor packaging substrate (2740, SiP substrate) are placed, and the printed circuit board (2730, PCB) and the semiconductor packaging substrate (2740, SiP substrate) can be placed in the space formed by the support structure (2710). The support structure (2710) can absorb external impact applied to the printed circuit board (2730, PCB) and the semiconductor packaging substrate (2740, SiP substrate), thereby protecting the printed circuit board (2730, PCB) and the semiconductor packaging substrate (2740, SiP substrate).

[0280] According to one embodiment, a first side (e.g., front side) of a semiconductor packaging substrate (2740, SiP substrate) and a second side (e.g., back side) of a printed circuit board (2730) may be arranged to be in contact. The first side (e.g., front side) of the semiconductor packaging substrate (2740, SiP substrate) and the second side (e.g., back side) of the printed circuit board (2730) may be bonded by an adhesive material.

[0281] According to one embodiment, an antenna structure (2750) (e.g., an antenna pattern) may be disposed on an outer surface (e.g., a second side (2742) (e.g., a back side) and a third side (2743) (e.g., a side side)) of a semiconductor packaging substrate (2740, SiP substrate).

[0282] According to one embodiment, an antenna structure (2750) (e.g., an antenna pattern) may be electrically connected to a printed circuit board (2730, PCB) by a contact structure (2760, C-clip) disposed on the printed circuit board (2730, PCB).

[0283] For example, the antenna structure (2750) (e.g., antenna pattern) may be disposed on a second surface (2742) (e.g., back surface) and a third surface (2743) (e.g., side surface) among the outer surfaces of the semiconductor packaging substrate (2740, SiP substrate). The antenna structure (2750) (e.g., antenna pattern) may be disposed on the entire surface of the second surface (2742) (e.g., back surface) and the third surface (2743) (e.g., side surface) of the semiconductor packaging substrate (2740, SiP substrate).

[0284] For example, the antenna structure (2750) (e.g., antenna pattern) may include a conductive pattern for forming a main feed of the antenna, a conductive pattern for forming a shorting feed, and / or a conductive pattern for forming a ground.

[0285] For example, a contact structure (2760, C-clip) can electrically connect a first conductive pattern to form a main feed of the antenna and a printed circuit board (2730).

[0286] For example, a contact structure (2760, C-clip) can electrically connect a conductive pattern to form a shorting feed of an antenna and a printed circuit board (2730).

[0287] For example, a contact structure (2760, C-clip) can electrically connect a conductive pattern to form an antenna ground and a printed circuit board (2730).

[0288] According to one embodiment of the present disclosure, a wearable electronic device (400, TWS wireless earphone) can improve antenna performance by increasing the area of ​​the overall antenna pattern of the wearable electronic device (400) by arranging an antenna structure (2750) (e.g., a main feed, a shorting feed, and a ground) on a second side (2742) (e.g., a back side) and a third side (2743) (e.g., a side) among the outer surfaces of a semiconductor packaging substrate (2740, SiP substrate).

[0289] FIG. 28 is a drawing (2800) showing an antenna structure arranged on an outer surface (e.g., a second surface (back surface), a third surface (side surface)) of a semiconductor packaging substrate (e.g., a SiP substrate).

[0290] Referring to FIG. 28, a wearable electronic device according to an embodiment of the present disclosure (e.g., the wearable electronic device (400) of FIG. 4) may include a support structure (2810), a printed circuit board (PCB) (e.g., the printed circuit board (840) of FIG. 12), a semiconductor packaging substrate (SiP substrate) (2840) (e.g., the semiconductor packaging substrate (850) of FIG. 12), an antenna structure (2850, antenna pattern), and a contact structure (C-clip) (2860) (e.g., the contact structure (1260) of FIG. 12).

[0291] For example, the support structure (2810) forms a space in which a printed circuit board (2830, PCB) and a semiconductor packaging substrate (2840, SiP substrate) are placed, and the printed circuit board (2830, PCB) and the semiconductor packaging substrate (2840, SiP substrate) can be placed in the space formed by the support structure (2810). The support structure (2810) can absorb external impact applied to the printed circuit board (2830, PCB) and the semiconductor packaging substrate (2840, SiP substrate), thereby protecting the printed circuit board (2830, PCB) and the semiconductor packaging substrate (2840, SiP substrate).

[0292] According to one embodiment, a first side (e.g., front side) of a semiconductor packaging substrate (2840, SiP substrate) and a second side (e.g., back side) of a printed circuit board (2830) may be arranged to be in contact. The first side (e.g., front side) of the semiconductor packaging substrate (2840, SiP substrate) and the second side (e.g., back side) of the printed circuit board (2830) may be bonded by an adhesive material.

[0293] According to one embodiment, an antenna structure (2850, antenna pattern) may be disposed on an outer surface (e.g., a second side (back side), a third side (side side)) of a semiconductor packaging substrate (2840, SiP substrate).

[0294] According to one embodiment, an antenna structure (2850, antenna pattern) may be electrically connected to a printed circuit board (2830, PCB) by a contact structure (2860, C-clip) disposed on the printed circuit board (2830, PCB).

[0295] For example, the antenna structure (2850, antenna pattern) may be disposed on a second surface (2842) (e.g., a back surface) among the outer surfaces of the semiconductor packaging substrate (2840, SiP substrate). The antenna structure (2850, antenna pattern) may be disposed on at least a portion of the second surface (2842) (e.g., a back surface) of the semiconductor packaging substrate (2840, SiP substrate).

[0296] For example, the antenna structure (2850, antenna pattern) may include a conductive pattern to form a loop antenna.

[0297] According to another embodiment, the antenna structure (2850, antenna pattern) may be disposed on a third surface (side surface) among the outer surfaces of the semiconductor packaging substrate (2840, SiP substrate). The antenna structure (2850, antenna pattern) may be disposed on at least a portion of the third surface (side surface) of the semiconductor packaging substrate (2840, SiP substrate).

[0298] According to another embodiment, the antenna structure (2850, antenna pattern) may be disposed on a second side (2842) (e.g., a back side) and a third side (a side side) among the outer surfaces of the semiconductor packaging plate (2840, SiP substrate). The antenna structure (2850, antenna pattern) may be disposed on at least a portion of the second side (2842) (e.g., a back side) and the third side (a side side) of the semiconductor packaging plate (2840, SiP substrate).

[0299] According to one embodiment of the present disclosure, a wearable electronic device (400, TWS wireless earphone) can improve antenna performance by increasing the area of ​​the entire antenna pattern of the wearable electronic device (400) by arranging an antenna structure (2850, loop antenna pattern) on at least one of a second surface (2842) (e.g., a back surface) and a third surface (a side surface) among the outer surfaces of a semiconductor packaging substrate (2840, SiP substrate).

[0300] FIG. 29 is a diagram comparing the performance of an antenna of a wearable electronic device of a comparative example with an antenna of a wearable electronic device according to an embodiment of the present disclosure (e.g., a wearable electronic device (400) of FIG. 4).

[0301] Referring to FIG. 29, for example, a wearable electronic device (400) according to an embodiment of the present disclosure may improve the performance of an antenna compared to a wearable electronic device of a comparative example by arranging an antenna pattern on a surface (e.g., a back surface and / or a side surface) of a semiconductor packaging substrate (SiP substrate). In FIG. 29, for example, the performance (2910) of an antenna in which an antenna pattern is arranged on an antenna carrier is compared with the performance (2920) of an antenna according to an embodiment of the present disclosure.

[0302] Comparing the performance (2910) of the antenna of the comparative example and the performance (2920) of the antenna of the wearable electronic device (400) according to the embodiment of the present disclosure, the performance of the antenna can be improved by arranging the antenna pattern on the surface (e.g., the back and / or the side) of the semiconductor packaging substrate (SiP substrate). The wearable electronic device (400) according to the embodiment of the present disclosure can optimize the antenna performance of the corresponding frequency band by using the antenna pattern arranged on the surface (e.g., the back and / or the side) of the semiconductor packaging substrate (SiP substrate), thereby improving the maximum radiation performance of the antenna. For example, the average total radiation power (TRP) of the antenna of the wearable electronic device of the comparative example can be about -8.63. The average TRP of the antenna of the wearable electronic device (400) according to an embodiment of the present disclosure can be about -5.84. A wearable electronic device (400) according to one embodiment of the present disclosure can improve the performance of an antenna by about 2.79 dB compared to a wearable electronic device of a comparative example.

[0303] The present disclosure provides a wearable electronic device that can increase the area of ​​an antenna pattern and improve antenna performance by arranging an antenna pattern on a semiconductor packaging substrate (e.g., a SiP substrate).

[0304] The present disclosure provides a wearable electronic device that can increase the area of ​​an antenna pattern and improve antenna performance by arranging an antenna pattern on an antenna carrier and a semiconductor packaging substrate (e.g., a SiP substrate).

[0305] A wearable electronic device according to one embodiment of the present disclosure (e.g., a wearable electronic device (400) of FIGS. 4 to 6) comprises a first antenna structure (e.g., a first antenna structure (1220) of FIG. 12, a first antenna structure (1320) of FIG. 13, a first antenna structure (1520) of FIG. 15, a first antenna structure (1720) of FIG. 17) disposed on an antenna carrier (e.g., an antenna carrier (810) of FIG. 8, an antenna carrier (1310) of FIG. 13, an antenna carrier (1510) of FIG. 15, an antenna carrier (1710) of FIG. 17)), a printed circuit board (e.g., a printed circuit board (1230) of FIG. 12, a printed circuit board (1330) of FIG. 13, a printed circuit board (1530) of FIG. 15, a printed circuit board (17) of FIG. A printed circuit board (1730), a printed circuit board (1930) of FIG. 19), a semiconductor packaging substrate (e.g., a semiconductor packaging substrate (850) of FIG. 8, a semiconductor packaging substrate (1340) of FIG. 13, a semiconductor packaging substrate (1540) of FIG. 15, a semiconductor packaging substrate (1740) of FIG. 17, a semiconductor packaging substrate (1940) of FIG. 19) packaged with the printed circuit board (1230, 1330, 1530, 1730, 1930), a second antenna structure (e.g., a second antenna structure (1250) of FIG. 12, a second antenna structure (1350) of FIG. 13, a second antenna structure (1540) of FIG. 15) disposed on at least a part of the surface of the semiconductor packaging substrate (850, 1340, 1540, 1740, 1940) The antenna structure (1570), the second antenna structure (1780) of FIG. 17, the second antenna structure (1980) of FIG. 19), and a contact structure (e.g., the contact structure (1260) of FIG. 12, the contact structure (1360) of FIG. 13, the contact structure (1560) of FIG. 15, the contact structure (1760) of FIG. 17, the contact structure (1960) of FIG. 19) electrically connecting the first antenna structure (1220, 1320, 1520, 1720) and the second antenna structure (1250, 1350, 1570, 1780, 1980) may be included.

[0306] According to one embodiment, a processor, memory, and electronic components may be arranged on a first surface (e.g., front surface) of the printed circuit board (1230, 1330, 1530, 1730, 1930). At least a portion of the second antenna structure (1250, 1350, 1570, 1780, 1980) may be arranged on a second surface (e.g., back surface) of the semiconductor packaging substrate (850, 1340, 1540, 1740, 1940) opposite the first surface (e.g., front surface).

[0307] According to one embodiment, at least a portion of the second antenna structure (1250, 1350, 1570, 1780, 1980) may be disposed on a third surface (e.g., a side surface) positioned perpendicular to the first surface (e.g., a front surface) and the second surface (e.g., a back surface) of the semiconductor packaging substrate (850, 1340, 1540, 1740, 1940).

[0308] According to one embodiment, the antenna pattern of the second antenna structure (1250, 1350, 1570, 1780, 1980) may be arranged on at least one of the second side (e.g., back side) and the third side (e.g., side) of the semiconductor packaging substrate (850, 1340, 1540, 1740, 1940).

[0309] According to one embodiment, a main feed of the second antenna structure (1250, 1350, 1570, 1780, 1980) may be formed on at least a portion of the surface of the semiconductor packaging substrate (850, 1340, 1540, 1740, 1940).

[0310] According to one embodiment, a shorting feed of the second antenna structure (1250, 1350, 1570, 1780, 1980) may be formed on at least a portion of the surface of the semiconductor packaging substrate (850, 1340, 1540, 1740, 1940).

[0311] According to one embodiment, the antenna ground of the second antenna structure (1250, 1350, 1570, 1780, 1980) may be formed on at least a portion of the surface of the semiconductor packaging substrate (850, 1340, 1540, 1740, 1940).

[0312] According to one embodiment, the antenna ground of the second antenna structure (1250, 1350, 1570, 1780, 1980) may be formed on all or part of the back surface of the semiconductor packaging substrate (850, 1340, 1540, 1740, 1940).

[0313] According to one embodiment, the antenna ground of the second antenna structure (1250, 1350, 1570, 1780, 1980) may be formed on all or part of a side surface of the semiconductor packaging substrate (850, 1340, 1540, 1740, 1940).

[0314] In one embodiment, the antenna pattern may include a loop antenna pattern.

[0315] A wearable electronic device (400) according to one embodiment of the present disclosure comprises: a printed circuit board (2230, 2330, 2430, 2530, 2630, 2730, 2830), a semiconductor packaging substrate (2240, 2340, 2440, 2540, 2640, 2740, 2840) packaged with the printed circuit board (2230, 2330, 2430, 2530, 2630, 2730, 2830), and an antenna structure (2250, 2350, 2450, 2440, 2540, 2640, 2740, 2840) disposed on at least a portion of a surface of the semiconductor packaging substrate (2240, 2340, 2440, 2540, 2640, 2740, 2840). 2550, 2560, 2750, 2850), and a contact structure (2250, 2350, 2450, 2550, 2560, 2750, 2850) electrically connecting the printed circuit board (2230, 2330, 2430, 2530, 2630, 2730, 2830) and the antenna structure.

[0316] According to one embodiment, a processor, memory, and electronic components may be arranged on a first surface (e.g., a front surface) of the printed circuit board (2230, 2330, 2430, 2530, 2630, 2730, 2830). At least a portion of the antenna structure may be arranged on a second surface (e.g., a back surface) of the semiconductor packaging substrate (2240, 2340, 2440, 2540, 2640, 2740, 2840) opposite the first surface (e.g., a front surface).

[0317] According to one embodiment, at least a portion of the antenna structure may be disposed on a third surface (e.g., a side surface) positioned perpendicular to the first surface (e.g., a front surface) and the second surface (e.g., a back surface) of the semiconductor packaging substrate (2240, 2340, 2440, 2540, 2640, 2740, 2840).

[0318] According to one embodiment, the antenna pattern of the antenna structure may be arranged on at least one of the second side (e.g., back side) and the third side (e.g., side) of the semiconductor packaging substrate (2240, 2340, 2440, 2540, 2640, 2740, 2840).

[0319] According to one embodiment, a main feed of the antenna structure may be formed on at least a portion of a surface of the semiconductor packaging substrate (2240, 2340, 2440, 2540, 2640, 2740, 2840).

[0320] According to one embodiment, a shorting feed of the antenna structure may be formed on at least a portion of a surface of the semiconductor packaging substrate (2240, 2340, 2440, 2540, 2640, 2740, 2840).

[0321] According to one embodiment, the antenna ground of the second antenna structure (1250, 1350, 1570, 1780, 1980) may be formed on at least a portion of the surface of the semiconductor packaging substrate (2240, 2340, 2440, 2540, 2640, 2740, 2840).

[0322] According to one embodiment, the antenna ground of the antenna structure may be formed on all or part of the back surface of the semiconductor packaging substrate (2240, 2340, 2440, 2540, 2640, 2740, 2840).

[0323] According to one embodiment, the antenna ground of the antenna structure may be formed on all or part of a side surface of the semiconductor packaging substrate (2240, 2340, 2440, 2540, 2640, 2740, 2840).

[0324] In one embodiment, the antenna pattern may include a loop antenna pattern.

[0325] A wearable electronic device (TWS wireless earphone) according to one embodiment of the present disclosure may include a first antenna structure disposed on an antenna carrier, a second antenna structure disposed on at least a portion of a surface of a semiconductor packaging substrate, and a contact structure electrically connecting the first antenna structure and the second antenna structure.

[0326] According to one embodiment of the present disclosure, a wearable electronic device (TWS wireless earphone) may have a second antenna structure (e.g., a second antenna pattern) disposed on at least a portion of a second side (e.g., a back side) and / or a third side (e.g., a side) of a semiconductor packaging substrate, thereby increasing the area of ​​the entire antenna pattern of the wearable electronic device and improving antenna performance.

[0327] The present disclosure provides a wearable electronic device that can increase the area of ​​an antenna pattern and improve antenna performance by arranging an antenna pattern on an antenna carrier and a semiconductor packaging substrate (e.g., a SiP substrate).

[0328] Such software may be stored on a non-transitory computer-readable storage medium. The non-transitory computer-readable storage medium may store one or more computer programs (software modules). These computer programs, when executed by a processor of one or more electronic devices, contain computer-executable instructions that cause the electronic devices to perform the methods of the present invention.

[0329] Such software may be stored in a volatile or non-volatile storage medium. For example, it may be in the form of a storage device such as read-only memory (ROM), whether or not erasable or rewritable, or it may be in the form of a random access memory (RAM), a memory chip, device, or integrated circuit, or it may be an optical or magnetically readable medium such as a compact disc (CD), a digital video disc (DVD), a magnetic disk, or a magnetic tape. It will be appreciated that such storage devices and storage media are various embodiments of non-transitory machine-readable storage means suitable for storing a computer program comprising instructions that, when executed, implement various embodiments of the present invention. Accordingly, various embodiments may provide a program comprising code for implementing a device or method as recited in any of the claims of this specification, and a non-transitory machine-readable storage means for storing such a program.

[0330] While the present invention has been described and illustrated with reference to various embodiments, it will be apparent to those skilled in the art that various changes in form and detail may be made without departing from the spirit and scope of the invention. The scope of the invention is defined by the appended claims and their equivalents.

Claims

1. In a wearable electronic device (400), A first antenna structure (1220, 1320, 1520, 1720) disposed on an antenna carrier (antenna carrier, 810, 1310, 1510, 1710); Printed circuit boards (1230, 1330, 1530, 1730, 1930); A semiconductor packaging substrate (850, 1340, 1540, 1740, 1940) packaged with the above printed circuit board (1230, 1330, 1530, 1730, 1930); A second antenna structure (1250, 1350, 1570, 1780, 1980) disposed on at least a portion of the surface of the semiconductor packaging substrate (850, 1340, 1540, 1740, 1940); and A contact structure (1260, 1360, 1560, 1760, 1960) electrically connecting the first antenna structure (1220, 1320, 1520, 1720) and the second antenna structure (1250, 1350, 1570, 1780, 1980); Wearable electronic device (400).

2. In paragraph 1, On the first side of the above printed circuit board (1230, 1330, 1530, 1730, 1930), a processor, memory and electronic components are arranged. At least a part of the second antenna structure (1250, 1350, 1570, 1780, 1980) is arranged on a second surface opposite to the first surface of the semiconductor packaging substrate (850, 1340, 1540, 1740, 1940). Wearable electronic device (400).

3. In paragraph 2, At least a part of the second antenna structure (1250, 1350, 1570, 1780, 1980) is arranged on a third surface positioned in a direction perpendicular to the first surface and the second surface of the semiconductor packaging substrate (850, 1340, 1540, 1740, 1940). Wearable electronic device (400).

4. In paragraph 2 or paragraph 3, The antenna pattern of the second antenna structure (1250, 1350, 1570, 1780, 1980) is arranged on at least one of the second side and the third side of the semiconductor packaging substrate (850, 1340, 1540, 1740, 1940). Wearable electronic device (400).

5. In paragraph 4, The main feed of the second antenna structure (1250, 1350, 1570, 1780, 1980) is formed on at least a portion of the surface of the semiconductor packaging substrate (850, 1340, 1540, 1740, 1940). Wearable electronic device (400).

6. In paragraph 4, A shorting feed of the second antenna structure (1250, 1350, 1570, 1780, 1980) is formed on at least a portion of the surface of the semiconductor packaging substrate (850, 1340, 1540, 1740, 1940). Wearable electronic device (400).

7. In paragraph 4, The antenna ground of the second antenna structure (1250, 1350, 1570, 1780, 1980) is formed on at least a portion of the surface of the semiconductor packaging substrate (850, 1340, 1540, 1740, 1940). Wearable electronic device (400).

8. In paragraph 7, The antenna ground of the second antenna structure (1250, 1350, 1570, 1780, 1980) is formed on all or part of the back surface of the semiconductor packaging substrate (850, 1340, 1540, 1740, 1940). Wearable electronic device (400).

9. In paragraph 7, The antenna ground of the second antenna structure (1250, 1350, 1570, 1780, 1980) is formed on all or part of the side surface of the semiconductor packaging substrate (850, 1340, 1540, 1740, 1940). Wearable electronic device (400).

10. In paragraph 4, The above antenna pattern includes a loop antenna pattern, Wearable electronic device (400).

11. In a wearable electronic device (400), Printed circuit boards (2230, 2330, 2430, 2530, 2630, 2730, 2830); The above printed circuit board (2230, 2330, 2430, 2530, 2630, 2730, 2830) and the semiconductor packaging substrate (2240, 2340, 2440, 2540, 2640, 2740, 2840) packaged; An antenna structure (2250, 2350, 2450, 2550, 2560, 2750, 2850) disposed on at least a portion of the surface of the semiconductor packaging substrate (2240, 2340, 2440, 2540, 2640, 2740, 2840); and A contact structure (2250, 2350, 2450, 2550, 2560, 2750, 2850) electrically connecting the printed circuit board (2230, 2330, 2430, 2530, 2630, 2730, 2830) and the antenna structure; Wearable electronic device (400).

12. In paragraph 11, On the first side of the above printed circuit board (2230, 2330, 2430, 2530, 2630, 2730, 2830), a processor, memory and electronic components are arranged. At least a part of the antenna structure is arranged on a second surface opposite to the first surface of the semiconductor packaging substrate (2240, 2340, 2440, 2540, 2640, 2740, 2840). Wearable electronic device (400).

13. In paragraph 12, At least a part of the antenna structure is arranged on a third surface positioned in a direction perpendicular to the first surface and the second surface of the semiconductor packaging substrate (2240, 2340, 2440, 2540, 2640, 2740, 2840). Wearable electronic device (400).

14. In paragraph 12 or 13, The antenna pattern of the antenna structure is arranged on at least one of the second side and the third side of the semiconductor packaging substrate (2240, 2340, 2440, 2540, 2640, 2740, 2840). Wearable electronic device (400).

15. In paragraph 14, The main feed of the antenna structure is formed on at least a portion of the surface of the semiconductor packaging substrate (2240, 2340, 2440, 2540, 2640, 2740, 2840). Wearable electronic device (400).

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