Laser processing device

Abstract

A laser processing device, comprising a laser processing head and a frame, the laser processing head being detachably connected to the frame, and the frame being used for driving the laser processing head to move. The laser processing head comprises a laser emitter and a reflector set, the reflector set being arranged corresponding to the laser emitter so as to reflect a laser beam emitted by the laser emitter to a surface of a workpiece to be processed. During use of the laser processing head, the reflector set can be enabled depending on requirements to vertically reflect the laser beam emitted by the laser emitter to the surface of the workpiece, thus achieving a vertical cutting function of the laser processing device, avoiding angled cutting at the cut on the workpiece, and improving the aesthetics of the workpiece. In addition, the laser processing head is detachably connected to the frame, such that a user can remove and carry the laser processing head depending on actual requirements, which facilitates use by the user. Moreover, being detachable also enables the laser processing head to connect to different frames, thus meeting use requirements of a user in different scenarios.

Description

Laser processing equipment

[0001] This application claims priority to China Patent Application No. 202421701429.9, filed on July 17, 2024, entitled "Laser Processing Equipment", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This invention relates to the field of laser processing technology, and in particular to a laser processing device. Background Technology

[0003] Laser processing is a technique that uses a high-energy laser beam to cut, weld, engrave, and heat-treat materials or their surfaces. Compared to traditional mechanical processing, laser processing does not involve the processing head directly contacting the workpiece, thus reducing the risk of damage. Furthermore, the high energy and small spot size of the laser result in high processing efficiency.

[0004] Currently, there is a type of galvanometer engraving machine on the market that uses a laser beam for engraving. Its working principle is to incident a laser beam onto two galvanometers and use a computer to control the reflection angle of each galvanometer so that the laser beam is focused on the marking material and can move along the required path, thereby leaving a permanent mark on the surface of the material.

[0005] Existing galvanometer engraving machines can cut through materials by setting the speed low enough and the power high enough. However, because the machine adjusts the galvanometer angle in real time to reflect light, a slanted cut occurs, meaning the cut surface is tilted and the cut is unsightly. Summary of the Invention

[0006] One objective of this invention is to overcome the shortcomings of the prior art and provide a laser processing device. To solve the above-mentioned technical problems, this invention adopts the following technical solution:

[0007] A laser processing device includes a laser processing head and a frame, wherein the laser processing head is detachably connected to the frame, and the frame is used to drive the laser processing head to move;

[0008] The laser processing head includes a laser emitter and a reflector group, the reflector group being arranged correspondingly to the laser emitter to reflect the laser beam emitted by the laser emitter onto the surface of the workpiece to be processed;

[0009] The reflector assembly includes a first reflector and a second reflector. The first reflector rotates about a first axis, and the second reflector rotates about a second axis. The first axis and the second axis intersect.

[0010] In one embodiment, the rack includes a first mounting rack and a second mounting rack, wherein the first mounting rack is provided with a first mounting portion and the second mounting rack is provided with a second mounting portion;

[0011] The laser processing head is provided with a fixing part for detachably connecting to the first mounting part or the second mounting part;

[0012] The fixing part is provided with a trigger structure. When the laser processing head is installed to the first mounting frame through the fixing part, the trigger structure is in a first state; when the laser processing head is installed to the second mounting frame through the fixing part, the trigger structure is in a second state; the first state and the second state are different.

[0013] In one embodiment, the triggering structure is a tactile switch, which is disposed at the upper end of the fixing part, and the length of the mounting plate of the first mounting frame is greater than the length of the mounting plate of the second mounting frame;

[0014] When the laser processing head is mounted to the first mounting frame, the tactile switch is in contact with the mounting plate of the first mounting frame; when the laser processing head is mounted to the second mounting frame, the tactile switch is not in contact with the mounting plate of the second mounting frame.

[0015] In one embodiment, the fixing part is detachably connected to the first mounting frame or the second mounting frame by at least one of threaded connection, snap-fit ​​connection and magnetic connection.

[0016] In one embodiment, when the laser processing head is mounted on the first mounting frame, the reflector group directs the laser beam emitted by the laser emitter vertically onto the surface of the workpiece to be processed.

[0017] In one embodiment, the first mounting frame includes an X-axis track and a Y-axis track, which are perpendicular to each other.

[0018] The X-axis track is slidably connected to the Y-axis track, and the laser processing head is detachable and slidably mounted on the X-axis track.

[0019] In one embodiment, the first mounting frame further includes a Z-axis track, which is perpendicular to the X-axis track and the Y-axis track;

[0020] The laser processing head is detachably and slidably mounted on the Z-axis track, which is slidably mounted on the X-axis track.

[0021] In one embodiment, when the laser processing head is mounted on a second mounting frame, the reflector assembly is able to reflect the laser beam emitted by the laser emitter onto the surface of the workpiece to be processed at a predetermined angle.

[0022] In one embodiment, the second mounting frame includes a support frame and a worktable, one end of the support frame is connected to the worktable, and the laser processing head is detachably connected to the other end of the support frame, with the laser processing head positioned opposite to the worktable.

[0023] In one embodiment, the laser processing head is slidably mounted on the support frame, making the distance between the laser processing head and the worktable adjustable.

[0024] In one embodiment, a first reflector is disposed corresponding to a laser emitter and is used to reflect the laser beam emitted by the laser emitter to a second reflector at a predetermined angle. The second reflector is used to reflect the laser beam received from the first reflector to the workpiece at a predetermined angle.

[0025] In one embodiment, the reflector assembly further includes a first driving member and a second driving member. The first driving member is connected to the first reflector and is used to drive the first reflector to rotate about a first axis. The second driving member is connected to the second reflector and is used to drive the second reflector to rotate about a second axis.

[0026] As can be seen from the above technical solution, the present invention has at least the following advantages and positive effects:

[0027] In this invention, the laser processing head includes a laser emitter and a reflector assembly. The reflector assembly reflects the laser beam emitted by the laser emitter to the workpiece surface at a predetermined angle. In some scenarios, when material needs to be cut, the reflector assembly can vertically reflect the laser beam emitted by the laser emitter to the workpiece surface, thereby realizing the vertical cutting function of the laser processing equipment, avoiding the oblique cutting phenomenon of the workpiece, and improving the aesthetics of the workpiece.

[0028] Furthermore, by detachably connecting the laser processing head to the rack, users can remove and carry the laser processing head as needed, facilitating its use. This detachable design also allows it to be adapted for connection to different racks, meeting the needs of users in various scenarios. Attached Figure Description

[0029] Figure 1 is a schematic diagram of the structure of a laser processing device according to an embodiment of the present invention.

[0030] Figure 2 is a schematic diagram of the structure of a laser processing device according to another embodiment of the present invention.

[0031] Figure 3 is a schematic diagram of the internal structure of a laser processing head according to an embodiment of the present invention.

[0032] Figure 4 is an exploded view of the reflector assembly of the laser processing head shown in Figure 3.

[0033] Figure 5 is a schematic diagram of the connection between the laser processing head and the frame shown in Figure 1.

[0034] Figure 6 is a schematic diagram of the connection between the laser processing head and the frame shown in Figure 2.

[0035] The reference numerals in the attached drawings are explained as follows: 100-Laser processing head; 110-Laser emitter; 120-Reflector group; 121-First reflector; 122-Second reflector; 123-First drive component; 124-Second drive component; 125-Focusing lens; 126-Dust cover; 127-Light passage hole; 130-Fixing part; 140-Screw; 200-Frame; 210-First mounting frame; 211-X-axis track; 212-Y-axis track; 213-Z-axis track; 214-First mounting part; 220-Second mounting frame; 221-Support frame; 222-Worktable; 223-Second mounting part; 224-Through groove. Detailed Implementation

[0036] Typical embodiments embodying the features and advantages of the present invention will be described in detail in the following description. It should be understood that the present invention can have various variations in different embodiments without departing from the scope of the present invention, and the descriptions and illustrations herein are for illustrative purposes only and not intended to limit the present invention.

[0037] In the description of this application, it should be understood that, in the embodiments shown in the accompanying drawings, the indications of direction or positional relationships (such as up, down, left, right, front, and back) are merely for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. These descriptions are appropriate when these elements are in the positions shown in the accompanying drawings. If the description of the positions of these elements changes, these directional indications also change accordingly.

[0038] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.

[0039] Please refer to Figures 1 to 4. The laser processing equipment of this embodiment includes a laser processing head 100 and a frame 200. The laser processing head 100 is detachably connected to the frame 200, and the frame 200 is used to drive the laser processing head 100 to move.

[0040] The laser processing head 100 includes a laser emitter 110 and a reflector group 120. The reflector group 120 is arranged corresponding to the laser emitter 110 to emit the laser beam emitted by the laser emitter 110 onto the surface of the workpiece to be processed.

[0041] In this embodiment, the laser processing head 100 includes a laser emitter 110 and a reflector group 120. The reflector group 120 can reflect the laser beam emitted by the laser emitter 110 to the workpiece surface at a predetermined angle. In some scenarios, when it is necessary to cut materials, the reflector group 120 can vertically reflect the laser beam emitted by the laser emitter 110 to the workpiece surface, thereby realizing the vertical cutting function during laser processing, avoiding the oblique cutting phenomenon of the workpiece, and improving the aesthetics of the workpiece.

[0042] Furthermore, by detachably connecting the laser processing head 100 to the frame 200, users can remove and carry the laser processing head 100 as needed, facilitating its use. Simultaneously, the detachable nature of the laser processing head 100 allows it to be adapted for connection to different frames 200, meeting the user's needs in various scenarios.

[0043] In the embodiments of this application, the laser processing head 100 includes a laser emitter 110 and a mirror assembly 120. The laser emitter 110 can be a semiconductor laser. Semiconductor lasers have the advantages of small size and small footprint, which facilitates the overall miniaturization design of the laser processing head 100.

[0044] Referring to Figure 4, in one embodiment of this application, the reflector group 120 includes a first reflector 121 and a second reflector 122. The first reflector 121 rotates about a first axis, and the second reflector 122 rotates about a second axis. The first axis and the second axis are perpendicular to each other.

[0045] The first reflector 121 is disposed corresponding to the laser emitter 110 and is used to reflect the laser beam emitted by the laser emitter 110 to the second reflector 122 at a predetermined angle. The second reflector 122 is used to reflect the laser beam received from the first reflector 121 to the workpiece at a predetermined angle.

[0046] By designing the first reflector 121 and the second reflector 122 as adjustable structures, the laser beam can be reflected onto the workpiece surface at a predetermined angle as needed. Specifically, by adjusting the angles of the first reflector 121 and the second reflector 122, the direction of the laser beam can be adjusted in both the vertical and horizontal directions, allowing the laser beam to act on the workpiece surface at different angles. For example, the laser beam can be emitted vertically onto the workpiece surface to achieve vertical cutting and avoid beveled cuts. Alternatively, the laser beam can be emitted at a predetermined angle onto the workpiece surface to achieve engraving functionality by acting on different positions on the workpiece.

[0047] Referring to Figure 4, in one embodiment, to facilitate adjustment of the angles of the first reflector 121 and the second reflector 122, the reflector assembly 120 further includes a first drive member 123 and a second drive member 124. The first drive member 123 is connected to the first reflector 121 and is used to drive the first reflector 121 to rotate about a first axis. The first drive member 123 can be a servo motor.

[0048] The second driving element 124 is connected to the second reflector 122 and is used to drive the second reflector 122 to rotate about the second axis. The second driving element 124 may be a servo motor.

[0049] In this embodiment, the first reflector 121 and the second reflector 122 are driven by the first driving member 123 and the second driving member 124 respectively, which makes it easy to adjust the angle of the first reflector 121 and the second reflector 122, thereby accurately adjusting the angle at which the laser beam is emitted to the surface of the workpiece, and realizing the cutting or engraving function of the equipment.

[0050] As shown in Figure 4, in one embodiment, the laser processing head 100 further includes a focusing lens 125, which is correspondingly arranged with the second reflecting mirror 122. The focusing lens 125 is used to receive the laser beam reflected by the second reflecting mirror 122 and focus it onto the workpiece. By setting the focusing lens 125, the laser beam can be focused, thereby improving the processing effect of the laser processing equipment.

[0051] To ensure the processing effect of the workpiece, it is necessary to ensure the intensity of the laser acting on the workpiece and to prevent dust from covering the reflector assembly 120 during use. Therefore, the laser processing head 100 also includes a dust cover 126. The focusing lens 125 is connected to the dust cover 126 and forms a dustproof chamber. The first reflector 121 and the second reflector 122 are disposed in the dustproof chamber.

[0052] It is understandable that, in order to ensure that the first driving member 123 and the second driving member 124 can smoothly drive the first reflector 121 and the second reflector 122, the dust cover 126 is also provided with a first through hole and a second through hole. The first driving member 123 passes through the first through hole and is connected to the first reflector 121, and the second driving member 124 passes through the second through hole and is connected to the second reflector 122.

[0053] Referring to Figure 3, in one embodiment, a light-transmitting hole 127 may be provided on the dust cover 126, and the light-transmitting hole 127 is arranged correspondingly to the laser emitter 110. The light-transmitting hole 127 is used to allow the laser emitter 110 to emit a laser beam to the first reflector 121. By providing a light-transmitting hole 127 on the dust cover 126, it can be ensured that the laser beam emitted by the laser emitter 110 can be smoothly emitted to the first reflector 121.

[0054] In the embodiments of this application, the laser processing head 100 is detachably connected to the frame 200. As shown in Figures 1 and 5, the frame 200 is a first mounting frame 210, and the first mounting frame 210 is provided with a first mounting part 214.

[0055] Alternatively, as shown in Figures 2 and 6, the frame 200 is a second mounting frame 220, and the second mounting frame 220 is provided with a second mounting part 223.

[0056] The laser processing head 100 is provided with a fixing part 130 for mounting to be adapted to the first mounting part 214 or the second mounting part 223. For example, the fixing part 130 may be a fixing plate provided on the housing of the laser processing head 100. The fixing plate may be provided with fixing through holes.

[0057] As shown in Figure 5, the first mounting part 214 can be a mounting plate disposed on the first mounting frame 210. The mounting plate may have mounting holes corresponding to the fixing through holes. By using fasteners such as screws 140 to pass through the fixing through holes and tighten them into the mounting holes, the laser processing head 100 can be detachably fixed to the first mounting frame 210.

[0058] As shown in Figure 6, the second mounting part 223 can be a connecting plate disposed on the second mounting frame 220. The connecting plate may have connecting holes corresponding to the fixing through holes. By using fasteners such as screws 140 to pass through the fixing through holes and tighten them into the connecting holes, the laser processing head 100 can be detachably fixed to the second mounting frame 220.

[0059] In this embodiment, by providing a fixing part 130 on the laser processing head 100, and by providing a first mounting part 214 and a second mounting part 223 adapted to be fixedly mounted to the fixing part 130 on the first mounting frame 210 and the second mounting frame 220 respectively, the laser processing head 100 can be more easily mounted onto the first mounting frame 210 or the second mounting frame 220. This facilitates the installation and removal of the laser processing head 100, allowing it to be used with different frames 200.

[0060] It is understandable that the fixing part 130, the first mounting part 214, and the second mounting part 223 can also be other adaptable detachable connection structures. The detachable connection between the fixing part 130 and the first mounting part 214 can also be a snap-fit ​​connection, a magnetic connection, etc. Similarly, the detachable connection between the fixing part 130 and the second mounting part 223 can also be a snap-fit ​​connection, a magnetic connection, etc.

[0061] In one embodiment of this application, the fixing part 130 may be provided with a trigger structure. When the laser processing head 100 is mounted to the first mounting frame 210 through the fixing part 130, the trigger structure is in a first state. When the laser processing head 100 is mounted to the second mounting frame 220 through the fixing part 130, the trigger structure is in a second state. The first state and the second state are different.

[0062] Specifically, the triggering structure can be a tactile switch. When the laser processing head 100 is mounted to the first mounting frame 210 via the fixing part 130, the tactile switch can be triggered. When the laser processing head 100 is mounted to the second mounting frame 220 via the fixing part 130, the tactile switch is not triggered. Thus, whether the laser processing head 100 is mounted on the first mounting frame 210 or the second mounting frame 220 can be determined by whether the tactile switch is triggered.

[0063] Referring to Figure 5, the tactile switch can be fixed to the upper end of the fixing part 130. The mounting plate can be a relatively long plate, so that when the laser processing head 100 is mounted to the first mounting frame 210, the tactile switch comes into contact with the upper part of the mounting plate and is triggered. As shown in Figure 6, the fixing plate can be a relatively short plate, so that when the laser processing head 100 is mounted to the second mounting frame 220, the tactile switch cannot come into contact with the fixing plate, and therefore the tactile switch will not be triggered.

[0064] Alternatively, the triggering structure can be a sensor, such as a pressure sensor. When the laser processing head 100 is mounted to the first mounting frame 210 via the fixing part 130, the sensor can output a first signal. When the laser processing head 100 is mounted to the second mounting frame 220 via the fixing part 130, the sensor can output a second signal. The first signal is different from the second signal. Therefore, the signal output by the sensor can be used to determine whether the laser processing head 100 is mounted on the first mounting frame 210 or the second mounting frame 220.

[0065] In this embodiment, by setting a trigger structure, the installation state of the laser processing head 100 can be accurately determined. Therefore, depending on the installation state of the laser processing head 100, the movement of its internal reflector group 120 can be controlled accordingly, causing the laser beam to exit vertically or at other preset angles. Thus, the laser processing equipment can automatically enter a vertically exiting cutting processing mode or an automatically exiting engraving processing mode with a predetermined angle of light when the laser processing head 100 is installed on different frames.

[0066] Referring to Figure 1, in one embodiment, when the laser processing head 100 is mounted on the first mounting frame 210, the reflector group 120 vertically projects the laser beam emitted by the laser emitter 110 onto the surface of the workpiece to be processed. In this case, the laser processing head 100 is suitable for vertical cutting of materials, avoiding oblique cuts.

[0067] As shown in Figure 1, the first mounting frame 210 can be a large frame with a large volume. The first mounting frame 210 can move the laser processing head 100 along a predetermined track to achieve large-format marking and vertical cutting functions. Since the first mounting frame 210 can drive the laser processing head 100 to move along the predetermined track to process different positions of the workpiece, when vertical cutting is required, the reflector group 120 inside the laser processing head 100 can be kept in a position that allows the laser beam to be emitted vertically, ensuring that the laser processing head 100 always emits light vertically during the processing. Since there is no need to adjust the angle of the first reflector 121 and the second reflector 122 in real time during the processing, the laser beam emitted by the laser processing head 100 can be ensured to act vertically on the workpiece surface, effectively avoiding the phenomenon of oblique cutting of the workpiece surface.

[0068] Referring to Figure 1, in one embodiment, the first mounting frame 210 includes an X-axis track 211 and a Y-axis track 212, which are perpendicular to each other. The X-axis track 211 is slidably connected to the Y-axis track 212, and the laser processing head 100 is detachably and slidably mounted on the X-axis track 211. There may be two Y-axis tracks 212. The two ends of the X-axis track 211 are respectively slidably mounted on the two Y-axis tracks 212.

[0069] In this embodiment, the laser processing head 100 is slidably mounted on the X-axis rail 211, which is slidably mounted on the Y-axis rail 212, so that the laser processing head 100 can reach various positions within the processing range covered by the first mounting frame 210 in the X-axis and Y-axis directions, thereby realizing vertical cutting processing of different positions of the workpiece located within the processing range.

[0070] In the embodiments of this application, the Y-axis track 212 may be a linear displacement stage arranged along the Y-axis direction, and the end of the X-axis track 211 is fixedly installed on the slide of the linear displacement stage.

[0071] The X-axis track 211 can be a linear displacement stage arranged along the X-axis direction, and the first mounting part 214 is fixedly mounted on the slide of the linear displacement stage. As shown in Figure 5, when the laser processing head 100 is connected to the first mounting part 214 through the fixing part 130, the purpose of moving the laser processing head 100 along the X-axis and Y-axis directions can be realized.

[0072] Referring to Figure 5, in one embodiment, the first mounting frame 210 further includes a Z-axis rail 213, which is perpendicular to the X-axis rail 211 and the Y-axis rail 212. The laser processing head 100 is detachably and slidably mounted on the Z-axis rail 213, which is slidably mounted on the X-axis rail 211.

[0073] In this embodiment, by setting the Z-axis track 213, the laser processing head 100 can move up and down along the Z-axis direction, which makes it easy to move the laser processing head 100 up and down according to actual needs, so as to adapt to the workpieces to be processed with different thicknesses for focusing.

[0074] In this embodiment, the Z-axis track 213 can be a linear displacement stage arranged along the Z-axis direction, and the first mounting part 214 is fixedly mounted on the slide of the linear displacement stage. The Z-axis track 213 is fixed to the slide of the X-axis track 211. When the laser processing head 100 is connected to the first mounting part 214 through the fixing part 130, the purpose of moving the laser processing head 100 along the Z-axis direction can be achieved.

[0075] Referring to Figure 2, in one embodiment, when the laser processing head 100 is mounted on the second mounting frame 220, the reflector assembly 120 can reflect the laser beam emitted by the laser emitter 110 to the surface of the workpiece to be processed at a predetermined angle. Specifically, the second mounting frame 220 can be a small, portable frame. The second mounting frame 220 makes the laser processing head 100 easy to carry and use, making it suitable for laser processing and engraving in various outdoor scenarios.

[0076] Referring to Figure 2, in one embodiment, the second mounting frame 220 includes a support frame 221 and a worktable 222. One end of the support frame 221 is connected to the worktable 222, and the laser processing head 100 is detachably connected to the other end of the support frame 221. The laser processing head 100 is disposed opposite to the worktable 222.

[0077] In this embodiment, the worktable 222 is used to support the workpiece to be processed. The support frame 221 can be integrally formed with the worktable 222, or the support frame 221 can be fixedly connected to the worktable 222 by screws.

[0078] The laser processing head 100 is detachably connected to the support frame 221, and the laser processing head 100 is disposed opposite to the worktable 222. Specifically, as shown in FIG6, the second mounting part 223 may be disposed at the end of the support frame 221 away from the worktable 222. The laser processing head 100 is detachably connected to the support frame 221 through the detachable connection between the fixing part 130 and the second mounting part 223.

[0079] Referring to Figure 6, in one embodiment, the laser processing head 100 is slidably mounted on the support frame 221, making the distance between the laser processing head 100 and the worktable 222 adjustable. In this embodiment, by setting the laser processing head 100 to be slidable relative to the support frame 221, it is convenient to move the laser processing head 100 up and down as needed to adapt to workpieces of different thicknesses for focusing.

[0080] For example, the second mounting part 223 is slidably mounted on the support frame 221. When the fixing part 130 is fixedly mounted on the second mounting part 223, the laser processing head 100 can move up and down relative to the support frame 221.

[0081] As shown in Figure 6, a long, narrow through slot 224 may be provided on the support frame 221. A slider that is slidably connected to the long, narrow through slot 224 may be provided on the second mounting part 223. Furthermore, the support frame 221 may also be provided with a driving part for driving the slider to slide. The driving part may be a linear electric cylinder, a pneumatic cylinder, or an electric telescopic rod, etc.

[0082] When the laser processing equipment of this embodiment is in use, it automatically enters the cutting processing mode when the trigger structure detects that the laser processing head 100 is installed on the first mounting frame 210. In the cutting processing mode, the reflector group 120 is always positioned so that the laser beam is emitted perpendicularly to the surface of the workpiece, without the need for additional adjustment of the angles of each lens. Furthermore, during processing, the position of the laser processing head 100 can be adjusted via the X-axis track 211, Y-axis track 212, and Z-axis track 213 to achieve cutting processing at different positions on the workpiece.

[0083] When the laser processing equipment detects that the laser processing head 100 is installed on the second mounting frame 220 via the trigger structure, it can automatically enter the engraving processing mode. In the engraving processing mode, the laser processing head 100 is fixed relative to the support frame 221. At this time, the first driving member 123 and the second driving member 124 can drive the first reflecting mirror 121 and the second reflecting mirror 122 to move respectively, so that the laser beam acts on the workpiece at a predetermined angle, thereby realizing rapid engraving of the workpiece.

[0084] Of course, it is understandable that when the laser processing head 100 is installed on the first mounting frame 210, it can also emit a laser beam at a predetermined angle to achieve engraving on the workpiece.

[0085] When the laser processing head 100 is installed on the second mounting frame 220, it can also emit a laser beam at a vertical angle to cut the workpiece.

[0086] The above embodiments are merely illustrative examples of structures. The structures in each embodiment are not fixed combinations. In the absence of structural conflicts, the structures in multiple embodiments can be arbitrarily combined and used.

[0087] Although the invention has been described with reference to several typical embodiments, it should be understood that the terminology used is illustrative and exemplary, and not restrictive. Since the invention can be embodied in many forms without departing from the spirit or essence of the invention, it should be understood that the above embodiments are not limited to any of the foregoing details, but should be interpreted broadly within the spirit and scope defined by the appended claims. Therefore, all variations and modifications falling within the scope of the claims or their equivalents should be covered by the appended claims.

Claims

1. Laser processing apparatus, characterized in that, The laser processing head is detachably connected to the frame, and the frame is used to drive the laser processing head to move; The laser processing head comprises a laser emitter and a mirror group, and the mirror group is correspondingly arranged with the laser emitter to reflect the laser beam emitted by the laser emitter to the surface of the workpiece to be processed; The mirror group comprises a first mirror and a second mirror, the first mirror rotates around a first axis, and the second mirror rotates around a second axis, and the first axis and the second axis intersect.

2. The laser processing apparatus according to claim 1, characterized by, The frame comprises a first mounting frame and a second mounting frame, the first mounting frame is provided with a first mounting portion, and the second mounting frame is provided with a second mounting portion; The laser processing head is provided with a fixing portion for detachable connection with the first mounting portion or the second mounting portion; The fixing portion is provided with a trigger structure, when the laser processing head is mounted to the first mounting frame through the fixing portion, the trigger structure is in a first state, when the laser processing head is mounted to the second mounting frame through the fixing portion, the trigger structure is in a second state, and the first state is different from the second state.

3. The laser processing apparatus according to claim 2, characterized by The trigger structure is a micro switch, the micro switch is arranged at the upper end of the fixing portion, the length of the mounting plate of the first mounting frame is greater than the length of the mounting plate of the second mounting frame; When the laser processing head is mounted to the first mounting frame, the micro switch is in contact with the mounting plate of the first mounting frame, and when the laser processing head is mounted to the second mounting frame, the micro switch is not in contact with the mounting plate of the second mounting frame.

4. The laser processing apparatus according to claim 3, characterized by The fixing portion is directly detachably connected with the first mounting frame or the second mounting frame in at least one of the following connection modes: threaded connection, buckle connection and magnetic attraction connection.

5. The laser processing apparatus according to claim 2, characterized by When the laser processing head is mounted on the first mounting frame, the mirror group vertically emits the laser beam emitted by the laser emitter to the surface of the workpiece to be processed.

6. The laser processing apparatus according to claim 2, characterized by The first mounting frame comprises an X-axis rail and a Y-axis rail, and the X-axis rail and the Y-axis rail are perpendicular to each other; The X-axis rail is slidably connected to the Y-axis rail, and the laser processing head is detachably and slidably arranged on the X-axis rail.

7. The laser processing apparatus according to claim 6, characterized by The first mounting frame further comprises a Z-axis rail, and the Z-axis rail is perpendicular to the X-axis rail and the Y-axis rail; The laser processing head is detachably and slidably arranged on the Z-axis rail, and the Z-axis rail is slidably arranged on the X-axis rail.

8. The laser processing apparatus according to claim 2, characterized by When the laser processing head is mounted on the second mounting frame, the mirror group can reflect the laser beam emitted by the laser emitter to the surface of the workpiece to be processed at a predetermined angle.

9. The laser processing apparatus according to claim 2, characterized by The second mounting frame comprises a support frame and a workbench, one end of the support frame is connected with the workbench, the laser processing head is detachably connected to the other end of the support frame, and the laser processing head is arranged opposite to the workbench.

10. The laser processing apparatus according to claim 9, characterized by The laser processing head is slidably arranged on the support frame, so that the distance between the laser processing head and the worktable is adjustable.

11. The laser processing apparatus according to claim 1, characterized in that, The first reflector is correspondingly arranged with the laser emitter, and is used for reflecting the laser beam emitted by the laser emitter to the second reflector at a predetermined angle, and the second reflector is used for reflecting the laser beam received from the first reflector to the workpiece at a predetermined angle.

12. The laser processing apparatus according to claim 11, characterized by The reflector group further comprises a first driving member and a second driving member, the first driving member is connected with the first reflector and is used for driving the first reflector to rotate around the first axis, and the second driving member is connected with the second reflector and is used for driving the second reflector to rotate around the second axis.

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