Device, information processing system, contact lens, video display system, and substrate bonding method

Abstract

Provided is a technique for improving safety of a living body by eliminating complex processes and a decrease in reliability and by sealing a material with low biocompatibility.　In a device provided with this technique, a first substrate having a flat surface, a first sealing layer, a bonding layer, a second sealing layer, and a second substrate having a flat surface are laminated in this order, the flat surface of the first substrate and the flat surface of the second substrate are disposed so as to face each other, and at least one functional layer is partially or entirely surrounded by the bonding layer.

Description

Device, information processing system, contact lens, image display system, and substrate bonding method

[0001] The technology according to the present disclosure (hereinafter also referred to as "the technology") relates to a device, an information processing system, a contact lens, and a method for bonding substrates.

[0002] In conventional techniques, various approaches have been taken to seal materials with low biocompatibility in devices that come into contact with living organisms. For example, Patent Documents 1 to 4 disclose structures for sealing materials with low biocompatibility.

[0003] International Publication No. 2019 / 054368 JP 2015-533227 A JP 2014-134796 A JP 2018-173645 A

[0004] However, in Patent Document 1, it is necessary to provide a recess in one of the substrates to seal the components inside, which may complicate the process. Also, since there is space around the components, there is a possibility that reliability may decrease due to gas expansion at high temperatures.

[0005] Furthermore, in Patent Documents 2 to 4, the components are sealed using biocompatible materials, but there is a possibility that low molecular weight components of the components may pass through polymeric materials such as sealants and contact lens materials.

[0006] Therefore, the main purpose of this technology is to improve safety for living organisms by eliminating the complicated process and reduced reliability and sealing materials with low biocompatibility.

[0007] The present technology provides a device including: a first substrate having a flat surface; a first sealing layer; a bonding layer; a second sealing layer; and a second substrate having a flat surface, stacked in this order; the flat surface of the first substrate and the flat surface of the second substrate are disposed opposite each other; and at least one functional layer is surrounded by the bonding layer. The bonding layer may be configured by stacking at least two bonding layers made of different materials. The bonding layer may be disposed around the periphery of at least one of the first sealing layer and the second sealing layer, and between the first substrate and the second substrate. The bonding layer may be disposed to extend to at least one end of the first substrate and the second substrate. The at least two functional layers, a first functional layer and a second functional layer, are surrounded by the bonding layer; and the first functional layer and the second functional layer may be made of different materials or have different functions. An inhibition layer may be disposed between the first functional layer and the second functional layer to inhibit chemical reactions between the first functional layer and the second functional layer. An insulating layer may be disposed between the first functional layer and the second functional layer to insulate the first functional layer and the second functional layer, an electromagnetic shielding layer may be disposed between the first functional layer and the second functional layer, or both. The bonding layer may be formed by stacking at least two bonding layers, i.e., a first bonding layer and a second bonding layer, made of different materials. Part or all of the first functional layer and the second functional layer may be surrounded by the bonding layer. The first functional layer and the second functional layer may be made of different materials or have different functions. An adhesive layer may be disposed around the periphery of at least one of the first sealing layer and the second sealing layer and between the first substrate and the second substrate. The adhesive layer may be disposed to an edge of at least one of the first substrate and the second substrate. The first sealing layer and the second sealing layer may be disposed up to an edge of at least one of the first substrate and the second substrate, and the substrate may further include a filling portion disposed on an outer periphery of the functional layer and filling a gap between the functional layer and the bonding layer.The first substrate, the second substrate, the first sealing layer, and the second sealing layer may comprise a biocompatible material. The functional layer may comprise at least one element selected from the group consisting of an optical element, a sensor element, a light-emitting element, a display element, and a semiconductor circuit, or at least one material selected from the group consisting of a battery material, a photopolymer material, and a semiconductor material. The bonding layer may be solid-state bonded. The device may have a thickness of 0.5 mm or less. The present technology also provides an information processing system including the device and an information processing device. The present technology also provides a contact lens comprising: a first substrate having a flat surface; a first sealing layer; a bonding layer; a second sealing layer; and a second substrate having a flat surface, stacked in this order; the flat surface of the first substrate and the flat surface of the second substrate are arranged opposite each other; and at least one functional layer is surrounded by the bonding layer. The present technology also provides an image display system including the contact lens and a projection device that projects image light onto the contact lens. The present technology also provides a method for bonding substrates, including: stacking a first sealing layer, a first bonding layer, and at least one functional layer in this order on a first substrate having a flat surface; stacking a second sealing layer and a second bonding layer in this order on a second substrate having a flat surface; and solid-state bonding the first bonding layer and the second bonding layer to seal the functional layer.

[0008] FIG. 12 is a schematic cross-sectional view showing an example of a configuration of a device 100 according to an embodiment of the present technology. FIG. 13 is a schematic cross-sectional view showing an example of a method for bonding substrates according to an embodiment of the present technology. FIG. 14 is a schematic cross-sectional view showing an example of a configuration of a device 100 according to an embodiment of the present technology. FIG. 15 is a schematic cross-sectional view showing a method for manufacturing the device 100 shown in FIG. 3. FIG. 16 is a schematic cross-sectional view showing an example of a configuration of the device 100 according to an embodiment of the present technology. FIG. 17 is a schematic cross-sectional view showing a method for manufacturing the device 100 according to an embodiment of the present technology. FIG. 18 is a schematic cross-sectional view showing a method for manufacturing the device 100 according to an embodiment of the present technology. FIG. 19 is a schematic cross-sectional view showing a method for manufacturing the device 100 according to an embodiment of the present technology. FIG. 16 is a schematic cross-sectional view showing a configuration example of a device 100 according to an embodiment of the present technology. FIG. 17 is a schematic cross-sectional view showing a method for manufacturing the device 100 according to an embodiment of the present technology. FIG. 19 is a schematic cross-sectional view showing a configuration example of a device 100 according to an embodiment of the present technology. FIG. 21 is a schematic cross-sectional view showing a method for manufacturing the device 100 according to an embodiment of the present technology. FIG. 23 is a schematic cross-sectional view showing a configuration example of a device 100 according to an embodiment of the present technology. FIG. 25 is a schematic cross-sectional view showing a configuration example of a device 100 according to an embodiment of the present technology. FIG. 28 is a schematic cross-sectional view showing a method for manufacturing the device 100 according to an embodiment of the present technology.Fig. 31 is a schematic plan view showing a configuration example of a device 100 according to an embodiment of the present technology. Fig. 32 is a schematic plan view showing a configuration example of a device 100 according to an embodiment of the present technology. Fig. 33 is a schematic cross-sectional view of the device 100 shown in Fig. 31. Fig. 34 is a schematic plan view showing a configuration example of a device 100 according to an embodiment of the present technology. Fig. 35 is a block diagram showing a configuration example of an information processing system 900 according to an embodiment of the present technology. Fig. 36 is a schematic view showing a configuration example of a video display system 1000 according to an embodiment of the present technology.

[0009] Hereinafter, preferred embodiments for implementing the present technology will be described with reference to the drawings. Note that the embodiment described below shows an example of a typical embodiment of the present technology, and does not limit the scope of the present technology. In addition, the present technology can be combined with any of the following examples and their modifications.

[0010] In the following description of the embodiments, configurations may be described using terms including "approximately," such as "approximately parallel" and "approximately perpendicular." For example, "approximately parallel" does not only mean completely parallel, but also means substantially parallel, i.e., including a state where the orientation is deviated from the completely parallel state by, for example, a few percent. The same applies to other terms including "approximately." Furthermore, each figure is a schematic diagram and is not necessarily an accurate depiction. The scale of the drawings has been exaggerated to make the features of the technology easier to understand. Therefore, it should be noted that the scale of the drawings and the scale of the actual device are not necessarily the same.

[0011] Unless otherwise specified, in the drawings, "top" means the top or upper side in the drawing, "bottom" means the bottom or lower side in the drawing, "left" means the left or left side in the drawing, and "right" means the right or right side in the drawing. Furthermore, in the drawings, the same or equivalent elements or members are given the same reference numerals, and redundant explanations will be omitted.

[0012] The description will be given in the following order: 1. First Embodiment of the Present Technology (Device Example 1) (1) Overall Configuration (2) Substrate (3) Sealing Layer (4) Bonding Layer (5) Functional Layer (6) Water Vapor Permeability (7) Manufacturing Method 2. Second Embodiment of the Present Technology (Device Example 2) 3. Third Embodiment of the Present Technology (Device Example 3) 4. Fourth Embodiment of the Present Technology (Device Example 4) 5. Fifth Embodiment of the Present Technology (Device Example 5) 6. Sixth Embodiment of the Present Technology (Device Example 6) 7. Seventh Embodiment of the Present Technology (Device Example 7) 8. Eighth Embodiment of the Present Technology (Device Example 8) 9. Ninth Embodiment of the Present Technology (Device Example 9) 10. Tenth Embodiment of the Present Technology (Device Example 10) 11. Eleventh Embodiment of the Present Technology (Device Example 11) 12. Twelfth Embodiment of the Present Technology (Device Example 12) 13. Thirteenth Embodiment of the Present Technology (Device Example 13) 14. 14. Fourteenth embodiment of the present technology (device example 14) 15. Fifteenth embodiment of the present technology (device example 15) 16. Sixteenth embodiment of the present technology (contact lens example) 17. Seventeenth embodiment of the present technology (information processing system example) 18. Eighteenth embodiment of the present technology (video display system example)

[0013] [1. First Embodiment of the Present Technology (Device Example 1)] [(1) Overall Configuration] The present technology is mainly applied to devices that come into contact with a living body. The present technology relates to a device having a structure that makes it difficult for a material with low biocompatibility to leak. Specifically, the present technology provides a device in which a first substrate having a flat surface, a first sealing layer, a bonding layer, a second sealing layer, and a second substrate having a flat surface are stacked in this order, the flat surface of the first substrate and the flat surface of the second substrate are arranged opposite each other, and at least one functional layer is partially or entirely surrounded by the bonding layer.

[0014] A configuration example of this device will be described with reference to Fig. 1. Fig. 1 is a schematic cross-sectional view showing a configuration example of a device 100 according to an embodiment of the present technology.

[0015] As shown in FIG. 1, device 100 includes a first substrate 11, a first sealing layer 21, a bonding layer 3, a second sealing layer 22, and a second substrate 12 stacked in this order.

[0016] The first substrate 11 and the second substrate 12 have flat surfaces 111 and 121, respectively, but may have irregularities formed on parts of the surfaces 111 and 121 due to reasons related to the manufacturing process. Fine irregularities may be formed during the processing and treatment of the substrates. For example, these irregularities may be caused by minute surface changes that occur during processes such as cutting, polishing, and etching of the substrate material, or by shrinkage or expansion due to the properties of the material itself.

[0017] The first sealing layer 21, the bonding layer 3, and the second sealing layer 22 are each a thin film. The thickness and surface roughness of each layer can be selected as desired depending on the intended use of the device 100.

[0018] The flat surface 111 of the first substrate 11 and the flat surface 121 of the second substrate 12 are disposed opposite to each other. The entire functional layer 4 is surrounded by the bonding layer 3. In other words, the functional layer 4 is sealed inside the bonding layer 3. Note that, as will be described later, a portion of the functional layer 4 may be surrounded by the bonding layer 3.

[0019] The functional layer 4 may contain a material with low biocompatibility. The low-molecular-weight compound contained in the functional layer 4 is a low-molecular-weight compound present in the functional layer. This compound is not particularly limited, but is expected to be a material whose biocompatibility has not been confirmed in animal experiments or human experiments.

[0020] By sealing the functional layer 4 with the bonding layer 3, the first sealing layer 21 and the second sealing layer 22 can prevent low-molecular-weight components with low biocompatibility from leaking out. Therefore, this technology can improve safety for living organisms.

[0021] In particular, it is preferable that the first substrate 11, the second substrate 12, the first sealing layer 21, and the second sealing layer 22 each contain a biocompatible material. Specific examples of such materials will be described later. Biocompatible materials are materials that are unlikely to cause adverse reactions in the human body and are widely used in medical applications. By using biocompatible materials, the impact of the device on the human body can be minimized and safety and effectiveness can be maximized.

[0022] The device 100 can have a thickness of 0.5 mm or less. The distance from the functional layer 4 to the surface of the device 100 is also affected by the gas permeability of the compound or composition that constitutes the device 100 and the position of the functional layer 4 within the device 100. This distance can be designed to be, for example, 1.0 μm or more, 100 μm or more, 1.0 mm or more, etc.

[0023] Such thin devices offer significant advantages in a variety of medical and industrial applications. For example, thin devices are ideal for medical implants and wearable devices because they reduce strain on the patient's body and improve comfort. Thinness also increases flexibility, allowing them to easily adapt to curved surfaces, such as the eyeball, and tight spaces, contributing to the miniaturization of electronic devices and the design of complex devices.

[0024] Furthermore, thinner devices also enable cost savings and material efficiency in the manufacturing process, making them more economical to manufacture, even for mass-produced consumer products and disposable medical devices. Thinner devices are also lighter, reducing transportation costs and simplifying handling.

[0025] [(2) Substrate] The first substrate 11 and the second substrate 12 are each layers that ensure the strength of the entire device 100 depending on the intended use of the device 100. There are no particular restrictions on the materials that form the first substrate 11 and the second substrate 12 as long as they can ensure strength. However, when the device 100 is used as a contact lens, it is preferable that the materials that form the first substrate 11 and the second substrate 12 have high light transmittance and high water vapor permeability.

[0026] Specific examples of materials include silicon-containing methacrylate (SiMA), fluorine-containing methacrylate (FMA), poly-2-hydroxyethyl methacrylate (P-HEMA), and silicone hydrogels (TRIS, SiGMA, etc.). These materials are often used as contact lens substrates. Polymer compounds such as polycarbonate resins, polyester resins, and cellulose resins can also be suitably used for substrates.

[0027] The first substrate 11 and the second substrate 12 may each be a layer made of a single compound or a layer made of a composition containing multiple compounds. When the first substrate 11 and the second substrate 12 each contain two or more compounds, the compounds may be mixed, copolymerized, or stacked to form a laminate film. The same applies to the first sealing layer 21, the second sealing layer 22, and the bonding layer 3 described below.

[0028] The thickness of each of the first substrate 11 and the second substrate 12 can be appropriately selected depending on the intended use of the device 100. When the device 100 is used as a contact lens, a preferable thickness is required from the viewpoint of the transparency and rigidity of the device 100.

[0029] (3) Sealing Layer As the material for first sealing layer 21 and second sealing layer 22, inorganic materials such as silicon oxide (SiO 2 ), titanium oxide (TiO 2 ), aluminum oxide (Al 2 O 3 ), and silicon nitride (SiN x ) can be suitably used.

[0030] In addition, the following materials are also suitable as materials for the first sealing layer 21 and the second sealing layer 22. For example, zirconium oxide, indium oxide, tin oxide, yttrium oxide, niobium oxide, tantalum oxide, hafnium oxide, indium oxide (In2O3), aluminum nitride, tantalum nitride, zirconium nitride, hafnium nitride, tungsten nitride, vanadium nitride, tungsten silicide nitride, titanium silicon nitride, zirconium silicate, zirconium barium oxide, zirconium hafnium oxide, Examples of suitable materials include inorganic materials such as indium tin oxide (ITO), stannous tin oxide (STO), and aluminum-doped tin oxide (ATO).

[0031] Alternatively, polymer compounds such as polyacrylic acid (PAA), hydrocarbon materials, and carbon materials can also be suitably used as materials for first sealing layer 21 and second sealing layer 22 .

[0032] (4) Bonding Layer The bonding layer 3 is formed by solid-state bonding a first bonding layer (see FIG. 2, described later) laminated on the first sealing layer 21 and a second bonding layer (see FIG. 2, described later) laminated on the second sealing layer 22. Solid-state bonding is a method in which the materials to be bonded are bonded in solid form without becoming liquid. In solid-state bonding, the materials are brought into contact with each other and subjected to high temperature or pressure, which causes atomic-level interaction at the bonding interface, thereby achieving bonding. The interface between the first bonding layer and the second bonding layer disappears as a result of solid-state bonding.

[0033] Solid-state bonding includes atomic diffusion bonding (ADB) and surface activated bonding (SAB). Other solid-state bonding methods include ultrasonic bonding and friction stir welding. These methods enable high-strength bonding while maintaining the properties of the materials. Furthermore, atomic diffusion bonding and surface activated bonding can be performed at room temperature. The Japanese Industrial Standards (JIS) defines "room temperature" as the range of 5°C to 35°C (JIS Z 8703).

[0034] Atomic diffusion bonding (ADB) is a bonding method that utilizes atomic diffusion on the surface of materials. In this method, the materials to be bonded are heated to high temperatures or placed in an ultra-high vacuum environment, causing the atoms on the surfaces to diffuse and bond with each other. This fuses the bonding interface at the atomic level, resulting in a strong bond.

[0035] In particular, devices such as the BC7000 atomic diffusion bonding device manufactured by Canon Anelva Corp. are capable of bonding at room temperature. This device optimizes the metal film and adjusts its thickness in an ultra-high vacuum environment, achieving high-strength bonding without applying pressure.

[0036] Surface activated bonding (SAB) is a method for achieving high-strength bonding at room temperature by activating the surfaces of materials. In this method, the surfaces of the materials to be bonded are activated using ion beam or plasma treatment, and then the materials are brought into contact with each other to bond them. The activation process removes oxide layers and contaminants from the surfaces, allowing the clean surfaces to come into direct contact with each other. This allows for strong bonding even at room temperature. Furthermore, the atomic forces between the activated surfaces increase the bond strength, which may eliminate the need for additional pressure or high-temperature treatment.

[0037] In addition to the above-mentioned atomic diffusion bonding and surface activated bonding, solid-state bonding also includes ultrasonic bonding and friction stir welding. Ultrasonic bonding is a method of joining materials by using high-frequency ultrasonic vibrations to generate frictional heat at the joining interface. The joining temperature is relatively low, making it suitable for joining dissimilar materials. Friction stir welding is a method of pressing a rotating tool against the joining area to generate frictional heat, which puts the materials into a plastic state and joins them while stirring. This method allows for high-quality joining with little material deformation or internal defects.

[0038] Thus, solid-state bonding allows bonding at room temperature. This bonding at room temperature is particularly important for the functional layer 4. As will be described in detail later, the functional layer 4 may be susceptible to high temperatures, so bonding at room temperature is preferable. This allows for high-strength bonding without impairing the functionality of the functional layer 4. Furthermore, bonding at high temperatures carries the risk of melting or altering the substrate. Furthermore, using a low vacuum during the solid-state bonding process prevents the inclusion of air bubbles and suppresses the generation of voids. This improves the quality and reliability of the bonding layer.

[0039] Solid-state bonding creates atomic-level interactions at the bonding interface, resulting in the virtual disappearance of the interface and the formation of a unified structure, which allows the bonded area to exhibit high resistance to mechanical loads.

[0040] In solid-state bonding, the materials do not become liquid, so the original material properties can be maintained during bonding, enabling high-quality bonding even between materials with different thermal expansion coefficients.

[0041] Solid-state bonding is performed in a high vacuum or inert gas environment to prevent oxidation and contamination of the bonding interface, achieving high reliability.

[0042] Solid-state bonding can bond a variety of materials, including metals, ceramics, and polymers, and is applicable to a wide range of applications. ２ ) and titanium oxide (TiO ２ Inorganic materials such as titanium (Ti), aluminum (Al), gold (Au), silver (Ag), copper (Cu), and tungsten (W) can also be suitably used.

[0043] Other suitable materials include semiconductor materials such as silicon (Si), gallium arsenide (GaAs), indium phosphide (InP), gallium nitride (GaN), silicon carbide (SiC), or alumina (Al ２ O ３ ), zirconia (ZrO ２ ), silicon nitride (Si ３ N ４ ), barium titanate (BaTiO ３ ), zirconium titanate (ZrTiO ４ Alternatively, carbon-based materials such as graphite (C), Kevlar (registered trademark), glass fiber reinforced plastic (GFRP), and polyester (PET) may be used.

[0044] [(5) Functional Layer] The functional layer 4 is a layer provided to impart any function depending on the use or purpose of the device 100. Examples of functional layers include a photosensitive layer, a semiconductor layer, a bioreactive layer containing a compound that reacts with a substance in a living body, and electrical wiring. The functional layer 4 may include at least one element selected from the group consisting of an optical element, a sensor element, a light-emitting element, a display element, and a semiconductor circuit, or at least one material selected from the group consisting of a battery material, a photopolymer material, and a semiconductor material.

[0045] Optical elements are components used to control and adjust light, and include lenses, prisms, mirrors, diffractive elements, metamaterials, etc. They are used in ophthalmic examination equipment and treatment devices. Optical elements require high transparency and precise light control, so they can be made from glass or plastic materials.

[0046] Sensor elements are devices that detect environmental changes and output that information as an electrical signal. These include blood glucose level sensors and thermometers that are attached to the skin, and elements that chemically, optically, and electrically analyze blood glucose levels and stress levels from tears. These sensors can be used as medical devices to monitor the condition of patients.

[0047] A light-emitting element is a component that emits light when a current is passed through it, and can be used as a light source. The light-emitting element may be, for example, a light-emitting diode (LED).

[0048] A display element is a component that displays information such as text and graphics in the user's field of vision. A display element is composed of a pixel array in which light-emitting elements are regularly arranged, and a semiconductor circuit that controls each pixel. This semiconductor circuit is an electronic circuit made of semiconductor materials and is composed of elements such as integrated circuits (ICs) and transistors.

[0049] Battery materials are materials for storing and supplying energy, and include lithium-ion batteries and solid-state batteries. These can be used as power sources for light-emitting elements and display elements. Alternatively, battery materials can be used in devices such as implanted pacemakers and medical patches attached to the skin. Battery materials are required to have high energy density, long life, and safety.

[0050] Photopolymer materials are resins that are hardened by light and can be used as cover materials for in vivo sensors. Photopolymer materials have the ability to be molded into precise shapes, allowing for the high-precision production of parts with complex structures.

[0051] Semiconductor materials are electrically conductive materials, including silicon and gallium arsenide. They can be used as materials for light-emitting elements, display elements, and semiconductor circuits. Semiconductor materials are also used in devices implanted in the body and biosensors that contact the skin. Semiconductor materials are important for detecting and processing weak signals within the body. Semiconductor materials also include elements related to light-emitting materials and electronic circuits. Specifically, they include electronic elements such as antennas, circuits, display elements, and signal processing elements.

[0052] This device 100 can be configured as a highly functional device suitable for various uses that come into contact with a living body by using the above-described functional layer 4. Some specific uses are shown below.

[0053] By incorporating optical elements and sensor elements, precision medical devices such as ophthalmic examination equipment, endoscopes, and skin-attached blood glucose level sensors can be constructed. In addition, by using battery materials, implant devices that can be used continuously for long periods of time can be realized.

[0054] Semiconductor and battery materials can be used to construct long-term implantable devices, such as pacemakers and neurostimulators, which can be used to monitor vital signs and for treatment.

[0055] Photopolymer materials and sensor elements can be used to construct skin-worn monitoring and therapeutic devices, such as blood glucose monitoring patches and temperature sensors.

[0056] The device 100 can be used as a contact lens by using optical elements and photopolymer materials. For example, the photopolymer material functions as an optical element that acts on incident light using a diffraction grating that records interference fringes of light generated by laser light, and the device 100 can appropriately guide image light from a projection optical system into the eyeball.

[0057] It is to be noted that the application examples are not limited to these, and other application examples may also be possible. The device 100 of the present technology is expected to be utilized in various medical fields, and to contribute to improving the therapeutic effects and quality of life of patients.

[0058] (6) Water Vapor Permeability When the device 100 is used as, for example, a contact lens, water vapor permeability is an important factor. High water vapor permeability makes it difficult to wear the device for a long period of time and may have adverse effects on the eyeball.

[0059] Water vapor permeability indicates the amount of water vapor that passes through a specific area in a certain time. The unit is g / m 2 ・24h. The general measurement conditions are a thickness of 25 μm (= 25 × 10 -6 mm), area 1m 2 These parameters depend on the distance the water vapor travels and the area it contacts.

[0060] In the structure of the device 100 of the present technology, when the thickness is 1 to 2 mm, the general measurement condition is 25×10 -6 4 to 2 x 10 for mm -4 This thickness corresponds to a distance of 1 to 2 mm from the end of the functional layer 4 to the outermost periphery of the device 100 when the diameter of the device 100 is 10 mm and the diameter of the functional layer 4 is 6 mm.

[0061] The contact area is (6 to 60) x 10 -6 πm 2 and the general measurement conditions are an area of ​​1 m 2 (6 to 60) x 10 -6 The contact area is calculated from the adhesive layer thickness of 1 to 10 μm and the outer circumference of 6π mm. From these calculation results, the water vapor permeability under the measurement conditions of this technology is (minimum 1.2 to maximum 24)π×10 -9 It will be about twice as much.

[0062] The thickness of contact lenses in the prior art must be 0.2 mm or less, and because the functional layer located at the center of the contact lens is sandwiched between two substrates, the thickness of the substrates must be half that, approximately 0.1 mm. In addition, the area of ​​the prior art is φ6π mm, and the product of thickness and area is 0.6π.

[0063] Here, since the conventional technology does not have a sufficient effect of sealing small molecules in the substrate, the influence is determined by the thickness and area of ​​the functional layer, which is the distance that the functional layer comes into contact with the human body through the contact lens structure. The water vapor permeability of the structure of the device 100 of the present technology is about 10 times higher than that of the conventional technology. -8 It turns out to be twice as small.

[0064] For example, the water vapor permeability of PVA (polyvinyl alcohol) is 1,100 g / m 2 24h. In the structure of the prior art, the water vapor permeability is calculated based on this value to be 1.65g / m 2 ・24h (= 1,100 / (thickness 4 times x area 6π x 10 -3 2 times).

[0065] On the other hand, in the structure of the device 100 of the present technology, the water vapor permeability is (4 to 80) × 10 -6 g / m 2 From this result, even if the structure of the device 100 of the present technology is used for 365 days continuously, the -3 ~2.8 x 10 -2 g / m 2 ・In the year, it was shown to be 100 to 1,000 times more effective than conventional technology.

[0066] [(7) Manufacturing Method] The above-mentioned device 100 can be manufactured by a method for bonding substrates, including stacking a first sealing layer, a first bonding layer, and at least one functional layer in this order on a first substrate having a flat surface, stacking a second sealing layer and a second bonding layer in this order on a second substrate having a flat surface, and solid-state bonding the first bonding layer and the second bonding layer to seal the functional layer.

[0067] The method for forming layers used in manufacturing the device 100 is not particularly limited, and known methods can be suitably used. Layer formation refers to, for example, film formation or lamination, and specific methods include coating. Coating methods include jet, spray, dip, and spin coating. These coating methods can use known techniques, and jet coating includes air atomization processes, ultrasonic atomization processes, piezoelectric jet printing processes, thermal jet printing processes, and the like.

[0068] This bonding method will be described with reference to Fig. 2. Fig. 2 is a schematic cross-sectional view showing an example of a method for bonding substrates according to an embodiment of the present technology. Note that the order of each step is not particularly limited.

[0069] First, as shown in Fig. 2A, a first substrate 11 having a flat surface is placed. This first substrate 11 is made of a biocompatible material, and the smoothness of the substrate surface is important for achieving high-precision lamination and bonding in subsequent processes.

[0070] 2B, a first sealing layer 21 is laminated on the first substrate 11. This first sealing layer 21 is made of a biocompatible inorganic material or the like, and is laminated uniformly using a thin film deposition technique. The sealing layer is preferably formed by deposition, sputtering, or the like.

[0071] 2C , first bonding layer 3 is laminated on first sealing layer 21. Bonding layer 3 is preferably formed to have a surface roughness (Ra) of 1 nm or less, for example. A material suitable for achieving strong bonding at the atomic level is selected for first bonding layer 3.

[0072] 2D , at least one functional layer 4 is laminated on the first bonding layer 3. That is, the first sealing layer 21, the first bonding layer 3, and at least one functional layer 4 are laminated in this order on the first substrate 11 having a flat surface.

[0073] This functional layer 4 performs a specific function of the device and includes at least one element selected from the group consisting of an optical element, a sensor element, a light-emitting element, a display element, and a semiconductor circuit. Alternatively, this functional layer 4 includes at least one material selected from the group consisting of a battery material, a photopolymer material, and a semiconductor material. The functional layer 4 is preferably formed using a coating technique such as spin coating or spray coating. This allows for a highly accurate and uniform film thickness, maximizing the device's performance.

[0074] 2E, a second substrate 12 having a flat surface is placed. Like the first substrate 11, the second substrate 12 is also made of a biocompatible material.

[0075] 2F, a second sealing layer 22 is laminated on the second substrate 12. This second sealing layer 22 is also made of a biocompatible material similar to that of the first sealing layer 21, and is laminated uniformly to ensure long-term stability of the device. The sealing layer is preferably formed by deposition, sputtering, or the like.

[0076] 2G, second bonding layer 3 is laminated on second sealing layer 22. That is, second sealing layer 22 and second bonding layer 3 are laminated in this order on second substrate 12 having a flat surface. Like first bonding layer 3, second bonding layer 3 is also made of a material suitable for achieving strong bonding.

[0077] Next, as shown in Fig. 2H, the flat surface of the first substrate 11 and the flat surface of the second substrate 12 are arranged to face each other. At this time, it is important that the substrates are aligned with each other, and they are arranged with high precision so that there is no slight misalignment or tilt.

[0078] Next, as shown in Figure 2I, the first and second bonding layers 3 and 3 are solid-state bonded to seal the functional layer 4. This essentially eliminates the bonding interface, forming an integrated structure. This bonding provides the entire device with high mechanical strength and reliability.

[0079] This technology can eliminate complicated processes and reduced reliability, and can enhance safety for living organisms by sealing materials with low biocompatibility.

[0080] The above description of the device according to the first embodiment of the present technology can be applied to other embodiments of the present technology unless there is a particular technical contradiction.

[0081] [2. Second Embodiment of the Present Technology (Device Example 2)] In a device according to an embodiment of the present technology, the bonding layer may be configured by stacking at least two bonding layers made of different materials. This will be described with reference to Fig. 3. Fig. 3 is a schematic cross-sectional view showing a configuration example of a device 100 according to an embodiment of the present technology.

[0082] 3, the bonding layer is configured by stacking at least two bonding layers (first bonding layer 31 and second bonding layer 32) made of different materials. The second bonding layer 32 is made of a different material from that of the first bonding layer 31. The materials used for the first bonding layer 31 and the second bonding layer 32 can be appropriately selected from the examples of materials given in the description of the first embodiment. The number of layers constituting the bonding layer is not particularly limited.

[0083] This configuration can improve the ease of bonding and the bonding strength. Furthermore, by using a material that has high wettability with the functional layer 4 for the bonding layer, it is possible to reduce unevenness in the thickness of the functional layer 4 when the functional layer 4 is laminated (e.g., coated). This will be explained with reference to Fig. 4. Fig. 4 is a schematic cross-sectional view showing a method for manufacturing the device 100 shown in Fig. 3.

[0084] 4, the second bonding layer 32 is laminated on the second sealing layer 22. The first bonding layer 31 and the functional layer 4 are laminated on the first sealing layer 21.

[0085] It is preferable that the first bonding layer 31 be made of a material that has high wettability when the functional layer 4 is applied. This makes it less likely for the material to be repelled during application, making it possible to form the functional layer 4 with a uniform thickness. For example, by selecting a material that emphasizes application performance for the first bonding layer 31 and a material that emphasizes bonding strength for the second bonding layer 32, application of the functional layer 4 becomes easier and thickness unevenness is reduced.

[0086] Furthermore, it is preferable to select materials that can improve ease of bonding and bonding strength for the first bonding layer 31 and the second bonding layer 32. This improves the bonding strength of the first bonding layer 31 and the second bonding layer 32.

[0087] The above description of the device according to the second embodiment of the present technology can be applied to other embodiments of the present technology unless there is a particular technical contradiction.

[0088] [3. Third Embodiment of the Present Technology (Device Example 3)] In a device according to an embodiment of the present technology, a bonding layer may be disposed on the outer periphery of at least one of the first sealing layer and the second sealing layer, and between the first substrate and the second substrate. This will be described with reference to Fig. 5. Fig. 5 is a schematic cross-sectional view showing a configuration example of a device 100 according to an embodiment of the present technology.

[0089] 5 , the bonding layer 3 is disposed on the outer periphery of at least one of the first sealing layer 21 and the second sealing layer 22, and between the first substrate 11 and the second substrate 12. In this configuration example, the bonding layer 3 is disposed on the outer periphery of both the first sealing layer 21 and the second sealing layer 22, but the bonding layer 3 may be disposed on the outer periphery of only one of the first sealing layer 21 and the second sealing layer 22.

[0090] In order to more firmly seal the functional layer 4, it is preferable to provide the sealing layers (first sealing layer 21 and second sealing layer 22) up to the vicinity of the edges of the substrates (first substrate 11 and second substrate 12). However, when device 100 is used as, for example, a contact lens, it is necessary to ensure high oxygen permeability, so it may not be possible to provide a sealing layer with low oxygen permeability up to the outermost periphery of device 100.

[0091] In such a case, the bonding layer 3 can be provided over a wider area than the sealing layers (first sealing layer 21 and second sealing layer 22). Specifically, the bonding layer 3 can be provided up to the vicinity of the edge of the substrate. This can ensure high oxygen permeability while preventing the edge of the substrate from becoming unstable and improving the stability of the entire device 100.

[0092] Fig. 6 is a schematic cross-sectional view showing a method for manufacturing the device 100 shown in Fig. 5. As shown in Fig. 6, a bonding layer 3 is laminated on each of the first sealing layer 21 and the second sealing layer 22. At this time, the bonding layer 3 is disposed on the outer periphery of at least one of the first sealing layer 21 and the second sealing layer 22, and between the first substrate 11 and the second substrate 12. Thereafter, the bonding layers 3 are bonded to each other.

[0093] The above description of the device according to the third embodiment of the present technology can be applied to other embodiments of the present technology unless there is a particular technical contradiction.

[0094] [4. Fourth Embodiment of the Present Technology (Device Example 4)] In a device according to an embodiment of the present technology, the bonding layer may be disposed up to an end of at least one of the first substrate and the second substrate. This will be described with reference to Fig. 7. Fig. 7 is a schematic cross-sectional view showing a configuration example of a device 100 according to an embodiment of the present technology.

[0095] 7 , the bonding layer 3 is disposed on the outer periphery of at least one of the first sealing layer 21 and the second sealing layer 22, and between the first substrate 11 and the second substrate 12. Furthermore, the bonding layer 3 is disposed up to the edge of at least one of the first substrate 11 and the second substrate 12. With this configuration, the edges of the substrates are more stable than in the device according to the third embodiment, and the stability of the entire device 100 can be improved.

[0096] In this configuration example, the bonding layer 3 is arranged on both ends of the first substrate 11 and the second substrate 12, but the bonding layer 3 may be arranged on only one end of the first substrate 11 or the second substrate 12.

[0097] 8 is a schematic cross-sectional view showing a method for manufacturing the device 100 shown in FIG. 8. As shown in FIG. 8, a bonding layer 3 is laminated on each of the first sealing layer 21 and the second sealing layer 22. At this time, the bonding layer 3 is disposed on the outer periphery of at least one of the first sealing layer 21 and the second sealing layer 22, and between the first substrate 11 and the second substrate 12. Furthermore, the bonding layer 3 is disposed up to the end of at least one of the first substrate 11 and the second substrate 12. Thereafter, the bonding layers 3 are bonded to each other.

[0098] The above description of the device according to the fourth embodiment of the present technology can be applied to other embodiments of the present technology unless there is a particular technical contradiction.

[0099] [5. Fifth Embodiment of the Present Technology (Device Example 5)] In a device according to an embodiment of the present technology, at least two of the functional layers, that is, a first functional layer and a second functional layer, are partially or entirely surrounded by the bonding layer, and the first functional layer and the second functional layer may be made of different materials or have different functions. This will be described with reference to FIG. 9. FIG. 9 is a schematic cross-sectional view showing a configuration example of a device 100 according to an embodiment of the present technology.

[0100] 9 , the at least two functional layers, that is, the first functional layer 41 and the second functional layer 42, are entirely surrounded by the bonding layer 3. Note that the first functional layer 41 and the second functional layer 42 may be partially surrounded by the bonding layer 3.

[0101] The first functional layer 41 and the second functional layer 42 may be made of different materials or have different functions. For example, the first functional layer 41 may be configured as a photosensitive layer, and the second functional layer 42 may be configured as an electronic element. By stacking layers having different materials or functions in this manner, a multifunctional device can be realized. The materials and functions can be appropriately selected from the examples of materials and functions described in the first embodiment. The number of layers constituting the functional layer is not particularly limited.

[0102] Furthermore, there are no particular limitations on the arrangement of the first functional layer 41 and the second functional layer 42. In this configuration example, the first functional layer 41 and the second functional layer 42 are stacked in the thickness direction, but, for example, the first functional layer 41 and the second functional layer 42 may be arranged in parallel in the planar direction (the direction perpendicular to the thickness direction).

[0103] 10 is a schematic cross-sectional view showing a method for manufacturing the device 100 shown in Fig. 9. As shown in Fig. 10, a first sealing layer 21, a first bonding layer 3, and a first functional layer 41 are laminated in this order on a first substrate 11. A second sealing layer 22, a second bonding layer 3, and a second functional layer 42 are laminated in this order on a second substrate 12. Thereafter, the first bonding layer 3 and the second bonding layer 42 are bonded to each other.

[0104] Although not shown in the figure, for example, the first sealing layer 21, the first bonding layer 3, the first functional layer 41, and the second functional layer 42 may be laminated in this order on the first substrate 11, and the first bonding layer 3 and the second bonding layer 42 may be solid-phased together.

[0105] The above description of the device according to the fifth embodiment of the present technology can be applied to other embodiments of the present technology unless there is a particular technical contradiction.

[0106] [6. Sixth Embodiment of the Present Technology (Device Example 6)] When a device according to an embodiment of the present technology encapsulates at least two functional layers, one or more layers may be disposed between these functional layers. For example, this device may have an inhibitor layer disposed between the first functional layer and the second functional layer to inhibit a chemical reaction between the first functional layer and the second functional layer. This will be described with reference to FIG. 11. FIG. 11 is a schematic cross-sectional view showing a configuration example of a device 100 according to an embodiment of the present technology.

[0107] 11 , an inhibiting layer 51 that inhibits chemical reactions between the first functional layer 41 and the second functional layer 42 is disposed between the first functional layer 41 and the second functional layer 42. This inhibiting layer 51 functions, for example, as a barrier, and prevents physical contact between the two functional layers. This functional layer 51 also prevents interactions between the materials of the two functional layers, enabling stable performance to be maintained.

[0108] In particular, when the first functional layer 41 and the second functional layer 42 are made of a photopolymer material, if these functional layers are made of the same type of material, a chemical reaction may occur. For this reason, it is necessary to select a material that is less likely to react with these functional layers and provide the suppression layer 51.

[0109] The material of the suppression layer 51 may be, for example, one or more compounds selected from polyvinyl alcohol, polyethylene glycol (PEG), polyethylene oxide (PEO), polyacrylamide (PAM), carboxymethyl cellulose (CMC), resol-type phenolic resin, methylolated urea resin, methylolated melamine resin, and polyethylene.

[0110] Alternatively, the material of the suppression layer 51 can be appropriately selected from the examples of materials given in the description of the first sealing layer 21 and the second sealing layer 22 in the first embodiment.

[0111] Although not shown in the figure, when the first functional layer 41 and the second functional layer 42 are arranged parallel to each other in the planar direction (the direction perpendicular to the thickness direction), the suppression layer 51 may be arranged between the two functional layers.

[0112] Fig. 12 is a schematic cross-sectional view showing a method for manufacturing the device 100 shown in Fig. 11. As shown in Fig. 12, a first sealing layer 21, a first bonding layer 3, a first functional layer 41, an inhibiting layer 51, and a second functional layer 42 are stacked in this order on a first substrate 11. A second sealing layer 22 and a second bonding layer 3 are stacked in this order on a second substrate 12. Thereafter, the first bonding layer 3 and the second bonding layer 3 are bonded to each other.

[0113] The order of lamination is not particularly limited. For example, the second functional layer 42 may be laminated on the second bonding layer 3, and the first bonding layer 3 and the second bonding layer 3 may be bonded to each other.

[0114] The above description of the device according to the sixth embodiment of the present technology can be applied to other embodiments of the present technology unless there is a particular technical contradiction.

[0115] [7. Seventh Embodiment of the Present Technology (Device Example 7)] In a device according to an embodiment of the present technology, an insulating layer that insulates the first functional layer from the second functional layer may be disposed between the first functional layer and the second functional layer. This will be described with reference to Fig. 13. Fig. 13 is a schematic cross-sectional view showing a configuration example of a device 100 according to an embodiment of the present technology.

[0116] 13 , an insulating layer 52 that insulates the first functional layer 41 from the second functional layer 42 is disposed between the first functional layer 41 and the second functional layer 42. This insulating layer 52 prevents electrical interference between the two functional layers and can stabilize the performance of each functional layer.

[0117] The insulating layer 52 may be made of glass, ceramic (alumina, zirconia, etc.), plastic (polyethylene, polypropylene, polycarbonate), rubber (silicone rubber), or the like.

[0118] Although not shown in the figure, when the first functional layer 41 and the second functional layer 42 are arranged parallel to each other in the planar direction (the direction perpendicular to the thickness direction), the insulating layer 52 may be arranged between the two functional layers.

[0119] Fig. 14 is a schematic cross-sectional view showing a method for manufacturing the device 100 shown in Fig. 13. As shown in Fig. 14, a first sealing layer 21, a first bonding layer 3, a first functional layer 41, an insulating layer 52, and a second functional layer 42 are laminated in this order on a first substrate 11. A second sealing layer 22 and a second bonding layer 3 are laminated in this order on a second substrate 12. Thereafter, the first bonding layer 3 and the second bonding layer 3 are bonded to each other.

[0120] The order of stacking is not particularly limited. For example, the second functional layer 42 may be stacked on the second bonding layer 32, and the first bonding layer 31 and the second bonding layer 32 may be solid-state bonded to each other.

[0121] The above description of the device according to the seventh embodiment of the present technology can be applied to other embodiments of the present technology unless there is a particular technical contradiction. For example, an inhibition layer 51 and an insulating layer 52 may be disposed between the two functional layers.

[0122] [8. Eighth Embodiment of the Present Technology (Device Example 8)] In a device according to an embodiment of the present technology, an electromagnetic shielding layer that reduces electromagnetic interference between the first functional layer and the second functional layer may be disposed between the first functional layer and the second functional layer. This will be described with reference to Fig. 15. Fig. 15 is a schematic cross-sectional view showing a configuration example of a device 100 according to an embodiment of the present technology.

[0123] 15 , an electromagnetic shielding layer 53 that reduces electromagnetic interference between the first functional layer 41 and the second functional layer 42 is disposed between the first functional layer 41 and the second functional layer 42. This electromagnetic shielding layer 53 prevents electromagnetic interference between the two functional layers and can stabilize the performance of each functional layer.

[0124] Materials for the electromagnetic shielding layer 53 include metals, electromagnetic wave absorbing materials, and electromagnetic wave reflecting materials. Metals with high electrical conductivity, such as copper and aluminum, are preferred. These metals have high electrical conductivity and exhibit a shielding effect by reflecting electromagnetic waves. Electromagnetic wave absorbing materials can be ferrite materials, carbon nanotubes, and the like. These materials exhibit a shielding effect by absorbing electromagnetic waves and dissipating the energy as heat. Electromagnetic wave reflecting materials can be metallized films, metal meshes, and the like. These materials exhibit a shielding effect by reflecting electromagnetic waves and blocking their propagation.

[0125] Although not shown in the figure, when the first functional layer 41 and the second functional layer 42 are arranged parallel to each other in the planar direction (the direction perpendicular to the thickness direction), the electromagnetic shielding layer 53 may be arranged between the two functional layers.

[0126] Fig. 16 is a schematic cross-sectional view showing a method for manufacturing the device 100 shown in Fig. 15. As shown in Fig. 16, a first sealing layer 21, a first bonding layer 31, a first functional layer 41, an electromagnetic shielding layer 53, and a second functional layer 42 are stacked in this order on a first substrate 11. A second sealing layer 22 and a second bonding layer 32 are stacked in this order on a second substrate 12. Thereafter, the first bonding layer 31 and the second bonding layer 32 are solid-state bonded to each other.

[0127] The order of stacking is not particularly limited. For example, the second functional layer 42 may be stacked on the second bonding layer 32, and the first bonding layer 31 and the second bonding layer 32 may be solid-state bonded to each other.

[0128] The above description of the device according to the eighth embodiment of the present technology can be applied to other embodiments of the present technology unless there is a particular technical contradiction. For example, both the insulating layer 52 and the electromagnetic shielding layer 53 may be disposed between the first functional layer 41 and the second functional layer 42.

[0129] [9. Ninth Embodiment of the Present Technology (Device Example 9)] In a device according to an embodiment of the present technology, the bonding layer is configured by stacking at least two bonding layers, a first bonding layer and a second bonding layer, which are made of different materials, and the at least two functional layers, a first functional layer and a second functional layer, are sealed inside the bonding layer, and the first functional layer and the second functional layer may be made of different materials or have different functions. This will be described with reference to FIG. 17. FIG. 17 is a schematic cross-sectional view showing a configuration example of a device 100 according to an embodiment of the present technology.

[0130] 17 , the bonding layer is configured by stacking at least two bonding layers made of different materials, namely, first bonding layer 31 and second bonding layer 32. As will be described in detail later, by using different materials in this way, it is possible to optimize the characteristics of each layer and improve the bonding strength.

[0131] The first functional layer 41 and the second functional layer 42 are entirely surrounded by the bonding layer. The first functional layer 41 and the second functional layer 42 are made of different materials or have different functions.

[0132] Fig. 18 is a schematic cross-sectional view showing a method for manufacturing the device 100 shown in Fig. 17. As shown in Fig. 18, a first sealing layer 21, a first bonding layer 31, a first functional layer 41, and a second functional layer 42 are laminated in this order on a first substrate 11. A second sealing layer 22 and a second bonding layer 32 are laminated in this order on a second substrate 12. Thereafter, the first bonding layer 31 and the second bonding layer 32 are solid-state bonded to each other.

[0133] In this embodiment, it is preferable to select a material for the bonding layer that has a high affinity with each functional layer. It is preferable to use a material that has high wettability when the first functional layer 41 is laminated (e.g., coated) for the first bonding layer 31, and to use a material that has a high affinity with the second functional layer 42 for the second bonding layer 32. This makes it possible to reduce unevenness in the thickness of each functional layer.

[0134] Furthermore, it is preferable to select materials for the first bonding layer 31 and the second bonding layer 32 that are easy to bond and can increase the bonding strength.

[0135] The materials used for the first bonding layer 31 and the second bonding layer 32 can be appropriately selected from the examples of materials given in the description of the first embodiment.

[0136] The above description of the device according to the ninth embodiment of the present technology can be applied to other embodiments of the present technology unless there is a particular technical contradiction. For example, an inhibition layer 51 or the like may be disposed between the two functional layers.

[0137] [10. Tenth Embodiment of the Present Technology (Device Example 10)] A device according to an embodiment of the present technology may further include an adhesive layer. The adhesive layer may be disposed around the periphery of at least one of the first sealing layer and the second sealing layer, and between the first substrate and the second substrate. This will be described with reference to FIG. 19 . FIG. 19 is a schematic cross-sectional view showing a configuration example of a device 100 according to an embodiment of the present technology.

[0138] 19 , an adhesive layer 54 is disposed around the periphery of at least one of the first sealing layer 21 and the second sealing layer 22, and between the first substrate 11 and the second substrate 12. This adhesive layer 54 prevents the edges of the substrates from becoming unstable, and can improve the stability of the entire device 100.

[0139] The material of the adhesive layer 54 can be selected to suit the characteristics of the surface of the component to be adhered. Furthermore, in consideration of safety to living organisms, it is preferable that the material of the adhesive layer 54 be biocompatible. Examples of materials that have been confirmed to be biocompatible include, but are not limited to, parylene and polyimide. The adhesive layer 54 may be a layer made of a single compound or a layer made of a composition containing multiple compounds.

[0140] In this configuration example, the adhesive layer 54 is arranged on the outer periphery of both the first sealing layer 21 and the second sealing layer 22, but the adhesive layer 54 may be arranged on the outer periphery of only one of the first sealing layer 21 and the second sealing layer 22.

[0141] Fig. 20 is a schematic cross-sectional view showing a method for manufacturing the device 100 shown in Fig. 19. As shown in Fig. 20, a bonding layer 3 is laminated on each of the first sealing layer 21 and the second sealing layer 22. At this time, an adhesive layer 54 is disposed around the periphery of at least one of the first sealing layer 21 and the second sealing layer 22, and between the first substrate 11 and the second substrate 12. Thereafter, the bonding layers 3 are bonded together.

[0142] The above description of the device according to the tenth embodiment of the present technology can be applied to other embodiments of the present technology unless there is a particular technical contradiction.

[0143] [11. Eleventh Embodiment of the Present Technology (Device Example 11)] In a device according to an embodiment of the present technology, the adhesive layer may be disposed up to an end of at least one of the first substrate and the second substrate. This will be described with reference to Fig. 21. Fig. 21 is a schematic cross-sectional view showing a configuration example of a device 100 according to an embodiment of the present technology.

[0144] 21 , an adhesive layer 54 is disposed around the periphery of at least one of the first sealing layer 21 and the second sealing layer 22, and between the first substrate 11 and the second substrate 12. Furthermore, the adhesive layer 54 is disposed up to the edge of at least one of the first substrate 11 and the second substrate 12. With this configuration, the edges of the substrates are more stable than in the device according to the tenth embodiment, and the stability of the entire device 100 can be improved.

[0145] In this configuration example, adhesive layers 54 are arranged on both ends of the first substrate 11 and the second substrate 12, but adhesive layers 54 may also be arranged on only one end of the first substrate 11 or the second substrate 12.

[0146] 22 is a schematic cross-sectional view showing a method for manufacturing the device 100 shown in FIG. 21. As shown in FIG. 22, a bonding layer 3 is laminated on each of the first sealing layer 21 and the second sealing layer 22. At this time, an adhesive layer 54 is disposed on the outer periphery of at least one of the first sealing layer 21 and the second sealing layer 22, and between the first substrate 11 and the second substrate 12. Furthermore, the adhesive layer 54 is disposed up to the end of at least one of the first substrate 11 and the second substrate 12. Thereafter, the bonding layers 3 are bonded to each other.

[0147] The above description of the device according to the eleventh embodiment of the present technology can be applied to other embodiments of the present technology unless there is a particular technical contradiction.

[0148] [12. Twelfth Embodiment of the Present Technology (Device Example 12)] The first sealing layer 21 and the second sealing layer 22 are used to prevent leakage of components with low biocompatibility contained in the functional layer 4. However, the first sealing layer 21 and the second sealing layer 22 may have low oxygen permeability, making oxygen permeability an important factor, particularly for contact lenses. Low oxygen permeability makes it difficult to wear the lenses for long periods of time and may have adverse effects on the eyeball. The oxygen permeability (Dk / L value) is preferably 24.1 or higher.

[0149] For this reason, a material with high oxygen permeability may be used for the first sealing layer 21 and the second sealing layer 22. By using a material with high oxygen permeability, it is possible to ensure oxygen supply while maintaining the sealing function. When such a material with high oxygen permeability is used, in a device according to an embodiment of the present technology, the first sealing layer and the second sealing layer may be disposed up to the end of at least one of the first substrate and the second substrate. This will be described with reference to FIG. 23 . FIG. 23 is a schematic cross-sectional view showing a configuration example of a device 100 according to an embodiment of the present technology.

[0150] As shown in FIG. 23, the first sealing layer 21 and the second sealing layer 22 are disposed up to the edge of at least one of the first substrate 11 and the second substrate 12 .

[0151] It is preferable that the first sealing layer 21 and the second sealing layer 22 are made of a material with high oxygen permeability.

[0152] In this configuration example, the first sealing layer 21 and the second sealing layer 22 are arranged to the ends of both the first substrate 11 and the second substrate 12, but they may also be arranged to the end of one of the first substrate 11 and the second substrate 12.

[0153] Fig. 24 is a schematic cross-sectional view showing a method for manufacturing the device 100 shown in Fig. 23. As shown in Fig. 24, a first sealing layer 21 is laminated on the first substrate 11, and a second sealing layer 22 is laminated on the second substrate 12. The first sealing layer 21 and the second sealing layer 22 are disposed up to at least one end of the first substrate 11 and the second substrate 12.

[0154] Thereafter, the bonding layer 3 and the functional layer 4 are laminated, and the bonding layer 3 is bonded.

[0155] The above description of the device according to the twelfth embodiment of the present technology can be applied to other embodiments of the present technology unless there is a particular technical contradiction.

[0156] [13. Thirteenth Embodiment of the Present Technology (Device Example 13)] A device according to an embodiment of the present technology may further include a filling portion disposed on the outer periphery of the functional layer and filling a gap between the functional layer and the bonding layer. This will be described with reference to Fig. 25. Fig. 25 is a schematic cross-sectional view showing a configuration example of a device 100 according to an embodiment of the present technology.

[0157] 25 , the device 100 according to an embodiment of the present technology further includes a filling portion 55 that is disposed on the outer periphery of the functional layer 4 and fills the gap between the functional layer 4 and the bonding layer 3. The filling portion 55 serves to completely fill the gap between the functional layer 4 and the bonding layer 3, and has the effect of preventing air bubbles from being mixed into the gap when solid-state bonding is performed in an ultra-high vacuum environment.

[0158] This device 100 can be used as, for example, a contact lens, and therefore, flexible materials are used for the substrates (first substrate 11 and second substrate 12), the sealing layers (first sealing layer 21 and second sealing layer 22), and the bonding layer 3.

[0159] On the other hand, the functional layer 4 may contain hard components such as electronic circuits. In this case, when solid-state bonding is performed in an ultra-high vacuum environment, the bonding layer 3 may not be able to follow the shape of the functional layer 4, and a gap may occur between the functional layer 4 and the bonding layer 3. This filling portion 55 fills this gap and plays a role in preventing the inclusion of air bubbles during solid-state bonding.

[0160] It is preferable to use, for example, a gel-like material as the material of the filling portion 55. By using a flexible material such as a gel-like material, the filling portion 55 can fill the gap between the functional layer 4 and the bonding layer 3.

[0161] 26 is a schematic cross-sectional view showing a method for manufacturing the device 100 shown in FIG. 25. As shown in FIG. 26, a first sealing layer 21 and a first bonding layer 3 are laminated in this order on a first substrate 11. A second sealing layer 22 and a second bonding layer 3 are laminated in this order on a second substrate 12. A filling portion 55 is disposed on the outer periphery of the functional layer 4. The bonding layers 3 are then bonded to each other.

[0162] The above description of the device according to the thirteenth embodiment of the present technology can be applied to other embodiments of the present technology unless there is a particular technical contradiction.

[0163] 14. Fourteenth Embodiment of the Present Technology (Fourteenth Device Example)] Another sealing structure using a sealing layer will be described with reference to Fig. 27. Fig. 27 is a schematic cross-sectional view showing a configuration example of a device 100 according to an embodiment of the present technology.

[0164] 27 , a device 100 according to an embodiment of the present technology includes a plurality of functional layers disposed on a first substrate 11 and a second substrate 12. In this configuration example, the device 100 includes a first functional layer 4-1 and a second functional layer 4-2. The first functional layer 4-1 and the second functional layer 4-2 are disposed side by side in the planar direction of the device 100.

[0165] Portions of the first functional layer 4-1 and the second functional layer 4-2 are surrounded by the bonding layer 3. At this time, sealing layers 22-1 and 22-2 are independently disposed corresponding to the functional layers 4-1 and 4-2. The sealing layer 22-1 is disposed between the first functional layer 4-1 and each of the first substrate 11 and the second substrate 12. The sealing layer 22-2 is disposed between the second functional layer 4-2 and each of the first substrate 11 and the second substrate 12.

[0166] The diameter of the sealing layer 22-1 is preferably larger than the diameter of the first functional layer 4-1, and the diameter of the sealing layer 22-2 is preferably larger than the diameter of the second functional layer 4-2.

[0167] With this configuration, even if the sealing layer has a low oxygen permeability, the area of ​​the sealing layer can be reduced to increase the oxygen permeability, and the sealing layer can also prevent low-molecular-weight components with low biocompatibility from leaking out of the functional layer.

[0168] The above description of the device according to the fourteenth embodiment of the present technology can be applied to other embodiments of the present technology unless there is a particular technical contradiction.

[0169] 15. Fifteenth Embodiment of the Present Technology (Device Example 15) A device according to an embodiment of the present technology will be described with reference to Fig. 28. Fig. 28 is a schematic cross-sectional view showing a configuration example of a device 100 according to an embodiment of the present technology.

[0170] 28 , a portion of the functional layer 4 is surrounded by the bonding layer 3. A portion of the functional layer 4 is in contact with the first sealing layer 21.

[0171] A method for manufacturing the device 100 having this configuration will be described with reference to Fig. 29. Fig. 29 is a schematic cross-sectional view showing a method for manufacturing the device 100 shown in Fig. 28.

[0172] 29 , the bonding layer 3 is laminated on the second sealing layer 22. The bonding layer 3 and the functional layer 4 are laminated on the first sealing layer 21. A portion of the functional layer 4 is surrounded by the bonding layer 3. Then, the bonding layers 3 are bonded to each other.

[0173] The above description of the device according to the fifteenth embodiment of the present technology can be applied to other embodiments of the present technology unless there is a particular technical contradiction.

[0174] [16. Sixteenth Embodiment of the Present Technology (Example of Contact Lens)] The devices according to the first to fifteenth embodiments can be used as a contact lens. That is, the present technology provides a contact lens in which a first substrate having a flat surface, a first sealing layer, a bonding layer, a second sealing layer, and a second substrate having a flat surface are stacked in this order, the flat surface of the first substrate and the flat surface of the second substrate are arranged opposite each other, and at least one functional layer is sealed inside the bonding layer.

[0175] Note that the device according to an embodiment of the present technology may be used in eyeglass lenses, cameras, and the like, in addition to contact lenses.

[0176] When a device according to an embodiment of the present technology is used as a contact lens, the functional layer may be disposed in the vicinity of the pupil. This will be described with reference to Fig. 30. Fig. 30 is a schematic plan view showing a configuration example of a device 100 according to an embodiment of the present technology.

[0177] 30 , when the device 100 is placed in the eyeball, the functional layer 4 can be placed near the pupil E. The functional layer 4 includes optical elements and the like, and can appropriately guide incident image light into the eyeball (for example, the retina). Note that the size of the functional layer 4 may be the same as the pupil E, or may be smaller or larger than the pupil E.

[0178] 31 is a schematic plan view showing a configuration example of a device 100 according to an embodiment of the present technology. As shown in Fig. 31 , two functional layers, a first functional layer 4-1 and a second functional layer 4-2, are sealed inside the device 100. The first functional layer 4-1 is disposed near the pupil E, and the second functional layer 4-2 is disposed in a peripheral portion outside the pupil E.

[0179] The first functional layer 4-1 and the second functional layer 4-2 may be made of the same material or have different functions. For example, the first functional layer 4-1 may include an optical element that guides image light into the eyeball, and the second functional layer 4-2 may include a sensor element that analyzes blood sugar levels and the like from tears.

[0180] Fig. 32 is a schematic cross-sectional view of the device 100 shown in Fig. 31. As shown in Fig. 32, the first functional layer 4-1 and the second functional layer 4-2 are arranged side by side in the planar direction of the device 100 (the left-right direction in the figure).

[0181] 33 is a schematic plan view showing a configuration example of a device 100 according to an embodiment of the present technology. As shown in FIG. 33 , two functional layers, a first functional layer 4-1 and a second functional layer 4-2, are each disposed inside the pupil E. The first functional layer 4-1 is disposed near the center of the pupil E, and the second functional layer 4-2 is disposed in the peripheral portion of the pupil E.

[0182] The above description of the contact lens according to the sixteenth embodiment of the present technology can be applied to other embodiments of the present technology unless there is a particular technical contradiction.

[0183] [17. Seventeenth Embodiment of the Present Technology (Example of Information Processing System)] The present technology provides an information processing system including a device according to any one of the first to fifteenth embodiments and an information processing device. A configuration example of this information processing system will be described with reference to Fig. 34. Fig. 34 is a block diagram showing a configuration example of an information processing system 900 according to an embodiment of the present technology.

[0184] 34 , the information processing system 900 includes a device 100 and an information processing device 200. The device 100 and the information processing device 200 can each be configured appropriately depending on the purpose of the system. For example, if the device 100 is a medical device that is attached to the skin, the information processing device 200 can monitor biological information acquired by the device 100.

[0185] The above description of the information processing system according to the seventeenth embodiment of the present technology can be applied to other embodiments of the present technology unless there is a particular technical contradiction.

[0186] [18. Eighteenth Embodiment of the Present Technology (Example of Image Display System)] The present technology provides an image display system including the above-described contact lens and a projection device that projects image light onto the contact lens. A configuration example of this image display system will be described with reference to Fig. 35 . Fig. 35 is a schematic diagram showing a configuration example of an image display system 1000 according to an embodiment of the present technology.

[0187] 35 , the image display system 1000 includes a contact lens 100 and a projection device 200. In this configuration example, a contact lens is shown as an example of the device 100, and a projection device is shown as an example of the information processing device 200. Image light projected from the projection device 200 is incident on the contact lens 100. A functional layer provided on the contact lens 100 diffracts the incident image light and guides it into the eyeball, allowing the user U to view an image, etc.

[0188] This image display system 1000 may be an image projection type or a retinal direct imaging type image display system. The projection device 200 generates an image signal and emits image light based on the image signal. In the case of an image projection type image display system, the image light from the projection device 200 is focused on the user's retina, while in the case of a retinal direct imaging type image display system, the image light is directly projected onto the user's retina, providing a clear image. Here, the configuration of the projection device 200 may differ between the image projection type and the retinal direct imaging type.

[0189] The video display system 1000 of the present technology can be widely used in the medical, entertainment, and industrial fields, for example, as a medical support system for providing real-time patient data to doctors during surgery, or as a device for providing entertainment content such as games and movies.

[0190] Furthermore, the image display system 1000 may be designed to be lightweight, highly portable, and durable for extended use, thereby reducing the burden on the user and providing a comfortable user experience.

[0191] The above description of the video display system according to the eighteenth embodiment of the present technology can be applied to other embodiments of the present technology unless there is a particular technical contradiction.

[0192] It should be noted that the embodiments of the present technology are not limited to the above-described embodiments, and various modifications are possible within the scope of the present technology. The specific numerical values, shapes, materials (including compositions), etc. described in each embodiment are merely examples, and the present technology is not limited to these.

[0193] The present technology can also be configured as follows. [1] A device comprising: a first substrate having a flat surface; a first sealing layer; a bonding layer; a second sealing layer; and a second substrate having a flat surface, stacked in this order; the flat surface of the first substrate and the flat surface of the second substrate are disposed opposite each other; and at least one functional layer is partially or entirely surrounded by the bonding layer. [2] The device described in [1], wherein the bonding layer is configured by stacking at least two bonding layers made of different materials. [3] The device described in [1] or [2], wherein the bonding layer is disposed around the periphery of at least one of the first sealing layer and the second sealing layer, and between the first substrate and the second substrate. [4] The device described in [3], wherein the bonding layer is disposed up to an edge of at least one of the first substrate and the second substrate. [5] The device according to any one of [1] to [4], wherein at least two of the functional layers, a first functional layer and a second functional layer, are partly or entirely surrounded by the bonding layer, and the first functional layer and the second functional layer are made of different materials or have different functions. [6] The device according to [5], wherein an inhibition layer that inhibits chemical reaction between the first functional layer and the second functional layer is disposed between the first functional layer and the second functional layer. [7] The device according to [5] or [6], wherein an insulating layer that insulates the first functional layer and the second functional layer, an electromagnetic shielding layer that reduces electromagnetic interference between the first functional layer and the second functional layer, or both of these are disposed between the first functional layer and the second functional layer. [8] The device described in any one of [1] to [7], wherein the bonding layer is constructed by stacking at least two bonding layers, a first bonding layer and a second bonding layer, which are made of different materials, and the first functional layer and the second functional layer, which are at least two functional layers, are partially or entirely surrounded by the bonding layer, and the first functional layer and the second functional layer are made of different materials or have different functions.[9] The device according to any one of [1] to [8], wherein an adhesive layer is disposed around the periphery of at least one of the first sealing layer and the second sealing layer, and between the first substrate and the second substrate.

[10] The device according to [9], wherein the adhesive layer is disposed to extend to at least one edge of the first substrate and the second substrate.

[11] The device according to any one of [1] to

[10] , wherein the first sealing layer and the second sealing layer are disposed to at least one edge of the first substrate and the second substrate.

[12] The device according to any one of [1] to

[11] , further comprising a filling portion disposed around the periphery of the functional layer, filling a gap between the functional layer and the bonding layer.

[13] The device according to any one of [1] to

[12] , wherein the first substrate, the second substrate, the first sealing layer, and the second sealing layer contain a biocompatible material.

[14] The device according to any one of [1] to

[13] , wherein the functional layer includes at least one element selected from the group consisting of an optical element, a sensor element, a light-emitting element, a display element, and a semiconductor circuit, or at least one material selected from the group consisting of a battery material, a photopolymer material, and a semiconductor material.

[15] The bonding layer is solid-state bonded. The device according to any one of [1] to

[14] .

[16] The device according to any one of [1] to

[15] , wherein the thickness is 0.5 mm or less.

[17] An information processing system comprising the device according to any one of [1] to

[16] and an information processing device.

[18] A contact lens comprising: a first substrate having a flat surface; a first sealing layer; a bonding layer; a second sealing layer; and a second substrate having a flat surface, stacked in this order; the flat surface of the first substrate and the flat surface of the second substrate are disposed opposite each other; and at least one functional layer is surrounded by the bonding layer.

[19] An image display system comprising: the contact lens according to

[18] ; and a projection device that projects image light onto the contact lens.

[20] A method for bonding substrates, comprising: stacking a first sealing layer, a first bonding layer, and at least one functional layer in this order on a first substrate having a flat surface; stacking a second sealing layer and a second bonding layer in this order on a second substrate having a flat surface; and solid-state bonding the first bonding layer and the second bonding layer to seal the functional layer.

[0194] REFERENCE SIGNS LIST 11 First substrate 12 Second substrate 21 First sealing layer 22 Second sealing layer 3 Bonding layer 31 First bonding layer 32 Second bonding layer 4 Functional layer 41 First functional layer 42 Second functional layer 51 Suppression layer 52 Insulation layer 53 Electromagnetic shielding layer 54 Adhesive layer 55 Filling portion 100 Device 200 Information processing device 900 Information processing system 1000 Video display system

Claims

1. A device comprising: a first substrate having a flat surface; a first sealing layer; a bonding layer; a second sealing layer; and a second substrate having a flat surface, stacked in this order; the flat surfaces of the first substrate and the second substrate are arranged opposite each other; and at least one functional layer is partially or entirely surrounded by the bonding layer.

2. The device according to claim 1, wherein the bonding layer is configured by laminating at least two bonding layers made of different materials.

3. The device of claim 1, wherein the bonding layer is disposed around the periphery of at least one of the first sealing layer and the second sealing layer, and between the first substrate and the second substrate.

4. The device according to claim 3, wherein the bonding layer is disposed up to an edge of at least one of the first substrate and the second substrate.

5. The device according to claim 1, wherein at least two of the functional layers, namely a first functional layer and a second functional layer, are partially or entirely surrounded by the bonding layer, and the first functional layer and the second functional layer are made of different materials or have different functions.

6. The device according to claim 5, wherein an inhibiting layer that inhibits chemical reaction between the first functional layer and the second functional layer is disposed between the first functional layer and the second functional layer.

7. The device of claim 5, wherein an insulating layer that insulates the first functional layer from the second functional layer, an electromagnetic shielding layer that reduces electromagnetic interference between the first functional layer and the second functional layer, or both of these are disposed between the first functional layer and the second functional layer.

8. The device described in claim 1, wherein the bonding layer is constructed by stacking at least two bonding layers, a first bonding layer and a second bonding layer, which are made of different materials, and the first functional layer and the second functional layer, which are made of at least two functional layers, are partially or entirely surrounded by the bonding layer, and the first functional layer and the second functional layer are made of different materials or have different functions.

9. The device of claim 1, wherein an adhesive layer is disposed around the periphery of at least one of the first encapsulation layer and the second encapsulation layer and between the first substrate and the second substrate.

10. The device of claim 9, wherein the adhesive layer extends to at least one edge of the first substrate and the second substrate.

11. The device of claim 1, wherein the first and second encapsulation layers extend to at least one edge of the first and second substrates.

12. The device according to claim 1, further comprising a filling portion disposed on the outer periphery of the functional layer and filling a gap between the functional layer and the bonding layer.

13. The device of claim 1, wherein the first substrate, the second substrate, the first encapsulation layer, and the second encapsulation layer comprise a biocompatible material.

14. The device of claim 1, wherein the functional layer includes at least one of an optical element, a sensor element, a light-emitting element, a display element, and a semiconductor circuit, or at least one of a battery material, a photopolymer material, and a semiconductor material.

15. The device of claim 1, wherein the bonding layer is solid state bonded.

16. The device of claim 1, having a thickness of 0.5 mm or less.

17. An information processing system comprising the device according to claim 1 and an information processing device.

18. A contact lens comprising: a first substrate having a flat surface; a first sealing layer; a bonding layer; a second sealing layer; and a second substrate having a flat surface, stacked in this order; the flat surfaces of the first substrate and the second substrate are arranged opposite each other; and at least one functional layer is partially or entirely surrounded by the bonding layer.

19. An image display system comprising: the contact lens according to claim 18; and a projection device that projects image light onto the contact lens.

20. A method for bonding substrates, comprising: stacking a first sealing layer, a first bonding layer, and at least one functional layer in this order on a first substrate having a flat surface; stacking a second sealing layer and a second bonding layer in this order on a second substrate having a flat surface; and solid-state bonding the first bonding layer and the second bonding layer to seal the functional layer.

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