Electronic device comprising speaker

Abstract

According to various embodiments disclosed herein, an electronic device is provided, the electronic device comprising: a housing including a speaker hole; a speaker; a speaker housing positioned in the housing and surrounding at least a portion of the speaker, the speaker housing including a first opening configured to be connected to the speaker hole and a second opening facing a diaphragm of the speaker; and a sealing member disposed between the housing and the speaker housing so as to surround both the first opening and the second opening of the speaker housing.

Description

Electronic devices containing speakers

[0001] The present disclosure relates to an electronic device including a speaker.

[0002] The electronic device may include a speaker hole formed on the exterior of the electronic device and a speaker positioned inside the electronic device corresponding to the speaker hole.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above-described matters constitute prior art related to the present disclosure.

[0004] An electronic device may include a sound path extending from a speaker to a speaker hole. Sound waves generated from the speaker may propagate through the air within the sound path and be output to the outside of the electronic device through the speaker hole. The sound path may be designed to guide the sound waves generated from the speaker to the speaker hole and to reduce or prevent sound wave leakage. However, due to interference with multiple components within the electronic device or limited space within the electronic device, it may be difficult to implement a sound path that can secure acoustic performance for the speaker. In addition, it may be difficult to implement a sound path structure that provides (or forms) the sound path in a form that reduces or prevents sound wave leakage while also facilitating a slimmer electronic device.

[0005] Embodiments of the present disclosure provide an electronic device including a speaker that provides (or forms) a sound path that enables slimming of the electronic device while improving acoustic performance of the speaker.

[0006] Various embodiments of the present disclosure are provided to address or at least alleviate the above-mentioned problems.

[0007] The technical problems to be achieved in the present disclosure are not limited to the technical problems mentioned above, and other technical problems not mentioned can be understood by a person having ordinary skill in the technical field to which the present disclosure belongs from the description below.

[0008] According to various embodiments of the present disclosure, an electronic device is provided, comprising: an electronic device housing; a speaker; a speaker housing; and a sealing member. The housing includes a speaker hole. The speaker housing is positioned within the housing and can at least partially surround the speaker. The speaker housing includes a first opening configured to be connected to the speaker hole. The speaker housing includes a second opening facing a diaphragm of the speaker. A sealing member is disposed between the housing and the speaker housing so as to surround both the first opening and the second opening of the speaker housing.

[0009] An electronic device including a speaker according to various embodiments of the present disclosure can improve acoustic performance while reducing or preventing leakage of sound waves generated from the speaker, and can also provide (or form) a sound wave passage that enables slimming of the electronic device.

[0010] In addition, the effects that can be obtained or expected from various embodiments of the present disclosure are disclosed directly or implicitly in the detailed description of the embodiments of the present disclosure.

[0011] The above and other aspects, features, and advantages of the embodiments of the present disclosure will become more apparent from the following detailed description taken in conjunction with the accompanying drawings.

[0012] FIG. 1 is a drawing showing various aspects of an electronic device according to various embodiments of the present disclosure.

[0013] FIG. 2 is an exploded perspective view of a portion of an electronic device according to various embodiments of the present disclosure.

[0014] FIG. 3 is a perspective view of a portion of an electronic device according to various embodiments of the present disclosure.

[0015] FIG. 4 is a perspective view of a portion of an electronic device according to various embodiments of the present disclosure.

[0016] FIG. 5 is a perspective view of a portion of an electronic device according to various embodiments of the present disclosure.

[0017] FIG. 6 is a diagram illustrating a portion of an electronic device according to various embodiments of the present disclosure.

[0018] FIG. 7 is a diagram illustrating a portion of an electronic device according to various embodiments of the present disclosure.

[0019] FIG. 8 is a cross-sectional view of a portion of an electronic device taken along line AA' of FIG. 7, according to various embodiments of the present disclosure.

[0020] FIG. 9 is a cross-sectional view of a portion of an electronic device taken along line AA' of FIG. 7, according to various embodiments of the present disclosure.

[0021] FIG. 10 is a perspective view of a sealing member according to various embodiments of the present disclosure.

[0022] FIG. 11 is a perspective view of a portion of a case according to various embodiments of the present disclosure.

[0023] FIG. 12 is a cross-sectional view of a portion of an electronic device taken along line AA' of FIG. 7, according to various embodiments of the present disclosure.

[0024] FIG. 13 is a perspective view of a sound-transmitting member according to various embodiments of the present disclosure.

[0025] FIG. 14 is a perspective view of a portion of an electronic device according to various embodiments of the present disclosure.

[0026] FIG. 15 is a perspective view of a portion of an electronic device according to various embodiments of the present disclosure.

[0027] FIG. 16 is a cross-sectional view of a portion of an electronic device taken along line AA' of FIG. 7, according to various embodiments of the present disclosure.

[0028] FIG. 17 is a cross-sectional view of a portion of an electronic device taken along line AA' of FIG. 7, according to various embodiments of the present disclosure.

[0029] Hereinafter, various embodiments of the present disclosure will be described in more detail. The following description, with reference to the accompanying drawings, is provided to facilitate a comprehensive understanding of various embodiments of the present disclosure as defined by the claims and their equivalents. While numerous specific details are included herein to aid understanding, they are to be considered merely exemplary. Accordingly, those skilled in the art will recognize that various changes and modifications can be made to the various embodiments described herein without departing from the scope and spirit of the present disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and brevity.

[0030] The terms and words used in the following description and claims are not limited to their bibliographic meanings, but are merely used to ensure a clear and consistent understanding of the present disclosure by the inventors. Accordingly, it should be apparent to those skilled in the art that the following description of various embodiments of the present disclosure is provided for illustrative purposes only and is not intended to limit the present disclosure as defined by the appended claims and their equivalents.

[0031] The various embodiments of the present disclosure and the terminology used therein are not intended to limit the technical features described in the present disclosure to specific embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly dictates otherwise. In the present disclosure, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish the corresponding component from other corresponding components and do not limit the corresponding components in any other respect (e.g., importance or order). When one element (e.g., a first component) is referred to as being “coupled” or “connected” to another element (e.g., a second component), with or without the terms “functionally” or “communicatively,” the element may be connected to the other element, either directly or indirectly (e.g., through a third component).

[0032] Each component (e.g., a module or a program) of the above-described components may comprise a single or multiple entities. One or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each component of the multiple components in a manner identical to or similar to that performed by the corresponding component of the multiple components prior to integration.

[0033] In this specification, when the term "substantially" is used to define a structural component, the expression containing the term "substantially" is understood or interpreted to mean a technical characteristic produced within the technical tolerances of the method used to manufacture it. Furthermore, the expression containing the term "substantially" implies that a particular effect or result can be achieved within a specific tolerance, and that a person skilled in the art would know how to achieve that tolerance.

[0034] In this disclosure, the term “and / or” may be understood to include any combination of one or more of the associated configurations that may be defined.

[0035] In this disclosure, the expression "comprising" means that a particular effect or result can be achieved within a certain tolerance, and that a person skilled in the art knows how to achieve the tolerance. It should be understood that terms such as "comprises" or "have" indicate the presence of a feature, number, step, operation, component, part, or combination thereof described in this disclosure, but do not preclude the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0036] In the drawings of the present disclosure, the shapes, thicknesses, ratios, and / or dimensions of the components are only for the effective explanation of the technical contents and are not limited to the shapes, thicknesses, ratios, and / or dimensions shown.

[0037] In the present disclosure, “disposed on XX” may be understood as disposed adjacent to or substantially in contact with XX, coupled to XX, or included in XX.

[0038] In the present disclosure, “located on XX” may be understood as being located adjacent to or substantially in contact with XX, coupled to XX, or included in XX.

[0039] In the present disclosure, when a first component (or region, layer, portion, etc.) is referred to as being “on,” “connected to,” or “coupled to” a second component, it can be understood that it can be directly disposed, connected, or coupled to the second component, or that a third component can be disposed therebetween.

[0040] In the present disclosure, "ZZ between XX and YY" can be understood as ZZ being positioned in substantial contact with XX or YY, or ZZ being directly bonded to XX or YY. "ZZ between XX and YY" can be understood as ZZ being positioned between XX and YY with at least one other component between XX and ZZ, and / or at least one component between YY and ZZ interposed therebetween. "ZZ between XX and YY" can be understood as at least one other component between XX and ZZ connecting XX and ZZ, and / or at least one other component between YY and ZZ connecting YY and ZZ.

[0041] In this disclosure, unless otherwise specified, "conductivity" may be understood as "electrical conductivity," and "non-conductivity" may be understood as "electrical insulation." When contextual or thermal properties are mentioned, "conductivity" may be understood as "thermal conductivity."

[0042] FIG. 1 is a drawing showing various aspects of an electronic device (1) according to various embodiments of the present disclosure.

[0043] It is understood that the present disclosure encompasses and includes all combinations of the features and / or embodiments disclosed in connection with FIG. 1. All combinations of the features described below in connection with FIG. 1 may be considered to be encompassed by the present disclosure as specific examples.

[0044] In various embodiments of the present disclosure, the direction in which the front side (10A) of the electronic device (1) faces, or the direction in which the display area (or active area or screen area) of the electronic device (1) is visually visible, is defined as the positive direction of the z-coordinate axis. The direction in which the rear side (10B) of the electronic device (1) faces is defined as the negative direction of the z-coordinate axis.

[0045] Referring to FIG. 1, an electronic device (1) may include a housing (10) and a display module (101).

[0046] According to various embodiments, the housing (10) may provide (or form) at least a portion of the exterior appearance of the electronic device (1). The housing (10) may, for example, provide (or form) at least a portion of the front surface (10A) of the electronic device (1), the back surface (10B) of the electronic device (1), and / or the side surface (10C) of the electronic device (1). In various embodiments, the housing (10) may refer to a structure that provides at least a portion of the front surface (10A), the back surface (10B), and the side surface (10C).

[0047] According to various embodiments, the housing (10) may include a front plate (or front cover) (11) and a case (also called a first frame or housing frame) (12).

[0048] According to various embodiments, the front plate (11) may provide (or form) at least a portion of the front surface (10A) of the electronic device (1). The front plate (11) may be substantially transparent at least in part. The front plate (11) may include, for example, a glass plate or a polymer plate including various coating layers. In the present specification, when the term "substantially" is used to define a structural portion (structure or structural element), the expression including the term "substantially" is understood or interpreted as a technical feature produced within the technical tolerances of the method used to manufacture it.

[0049] In the present disclosure, 'when viewed from above the front plate (11)' can be understood as the same as 'when viewed in a direction perpendicular to the front plate (11)'. In the present disclosure, 'when viewed from above the front surface (10A) of the electronic device (1)' can be understood as the same as 'when viewed in a direction perpendicular to the front surface (10A) of the electronic device (1)'. In the present disclosure, 'when viewed from above the front surface (11)' and 'when viewed from above the front surface (10A) of the electronic device (1)' can be understood as the same. 'When viewed from above the front surface (11)' and 'when viewed from above the front surface (10A) of the electronic device (1)' can refer to, for example, when viewed in the negative direction of the z-coordinate axis.

[0050] According to various embodiments, the case (12) may provide (or form) at least a portion of the back (10B) and the side (10C) of the electronic device (1). The case (12) may be substantially opaque. The case (12) may include a metallic material and / or a non-metallic material (e.g., a polymer). The case (12) may include a back portion (13) and / or a side portion (14). The back portion (13) may provide (or form) at least a portion of the back (10B) of the electronic device (1). The side portion (14) may provide (or form) at least a portion of the side (10C) of the electronic device (1).

[0051] In the present disclosure, 'when viewed from above on the rear part (13) of the case (12)' can be understood as the same as 'when viewed in a direction perpendicular to the rear part (13) of the case (12)'. In the present disclosure, 'when viewed from above on the rear part (10B) of the electronic device (1)' can be understood as the same as 'when viewed in a direction perpendicular to the rear part (10B) of the electronic device (1)'. In the present disclosure, 'when viewed from above on the rear part (13) of the case (12)' and 'when viewed from above on the rear part (10B) of the electronic device (1)' can be understood as the same. 'When viewed from above on the rear part (13) of the case (12)' and 'when viewed from above on the rear part (10B) of the electronic device (1)' can refer to, for example, when viewed in the negative direction of the z-coordinate axis.

[0052] According to various embodiments, the case (12) may be provided (or formed) as a combination of a metal part (or metal portion) (also referred to as a metal structure, conductor, or conductive structure) (not shown separately) and a non-metal part (or non-metal portion) (also referred to as a non-metal structure, non-conductor, or non-conductive structure) (not shown separately). For example, a part of the metal part may provide a part of the rear part (13), and another part of the metal part may provide (or form) a part of the side part (14). The metal part may be provided (or formed) as, for example, an integrated or single structure (e.g., a single continuous structure or a complete structure). For example, a part of the non-metal part may provide a part of the rear part (13), and another part of the non-metal part may provide (or form) a part of the side part (14). The non-metallic portion may be provided (or formed) as, for example, an integral or single structure (e.g., a single continuous structure or a complete structure).

[0053] According to various embodiments, although not separately illustrated, a rear plate (also referred to as a rear cover) corresponding to the rear portion (13) and a side member (also referred to as a side bezel, a side bezel structure, or a side) corresponding to the side portion (14) may be provided (or formed) in place of the case (12). The rear plate may be substantially opaque and may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel, or magnesium), or a combination of at least two of the foregoing materials.

[0054] According to various embodiments, at least some of the elements constituting the housing (10) of the present disclosure (e.g., the rear portion and the side portion) may mean each area of ​​one integrally formed housing (10) or may mean each housing of a plurality of separately formed housings.

[0055] According to various embodiments, the side portion (14) may include a first side portion (also referred to as a first side, a first sidewall, or a first sidewall portion, a first bezel, or a first bezel portion) (141), a second side portion (also referred to as a second side, a second sidewall, or a second sidewall portion, a second bezel, or a second bezel portion) (142), a third side portion (also referred to as a third side, a third sidewall, or a third sidewall portion, a third bezel, or a third bezel portion) (143), and / or a fourth side portion (also referred to as a fourth side, a fourth sidewall, or a fourth sidewall portion, a fourth bezel, or a fourth bezel portion) (144). When viewed from above on the front surface (10A) of the electronic device (1), the first side surface (141) and the second side surface (142) may extend in a direction parallel to the y-coordinate axis and may be spaced apart from each other in a direction parallel to the x-coordinate axis. The first side surface (141) may provide (or form) a first side surface corresponding to the negative direction of the x-coordinate axis among the side surfaces (10C) of the electronic device (1). The second side surface (142) may provide (or form) a second side surface corresponding to the positive direction of the x-coordinate axis among the side surfaces (10C) of the electronic device (1). When viewed from above on the front surface (10A) of the electronic device (1), the third side surface (143) and the fourth side surface (144) may extend in a direction parallel to the x-coordinate axis and may be spaced apart from each other in a direction parallel to the y-coordinate axis. The third side portion (143) can provide (or form) a third side corresponding to the positive direction of the y-coordinate axis among the side portions (10C) of the electronic device (1). The fourth side portion (144) can provide (or form) a fourth side corresponding to the negative direction of the y-coordinate axis among the side portions (10C) of the electronic device (1).The side portion (14) may include a smooth curved first corner (C1) between the first side portion (141) and the third side portion (143), a smooth curved second corner (C2) between the first side portion (141) and the fourth side portion (144), a smooth curved third corner (C3) between the second side portion (142) and the third side portion (143), and / or a smooth curved fourth corner (C4) between the second side portion (142) and the fourth side portion (144).

[0056] According to various embodiments, a display module (referred to as a display) (101) is housed in a housing (10), and a display area (also referred to as an active area or screen area) of the display module (101) is visually visible (or visually exposed) through a front plate (11).

[0057] According to various embodiments, the display module (101) may be positioned between the front plate (11) and the rear portion (13) of the case (12). The display module (101) may be coupled to the front plate (11) (see FIG. 1) via an optically clear adhesive layer (or optically clear adhesive layer) (not shown separately). The optically clear adhesive layer may include an optically clear adhesive material such as, for example, an optically clear adhesive (OCA), an optically clear resin (OCR), or a super view resin (SVR).

[0058] According to various embodiments, the front plate (11) may include a bezel area (also referred to as a screen bezel area) (B). The bezel area (B) may not overlap with the display area of ​​the display module (101) when viewed from above the front surface (10A) of the electronic device (1). The bezel area (B) may be provided (or formed) in a shape (e.g., a rectangular ring or loop shape) that surrounds the display area when viewed from above the front surface (10A). The bezel area (B) may be substantially opaque. The bezel area (B) may be provided (or formed) by, for example, an opaque material coated or colored on the front plate (11). The bezel area (B) may include a first bezel area (B1), a second bezel area (B2), a third bezel area (B3), and / or a fourth bezel area (B4). The first bezel area (B1) may be positioned adjacent to the first side portion (141) corresponding to the first side portion (141). The second bezel area (B2) may be positioned adjacent to the second side portion (142) corresponding to the second side portion (142). The third bezel area (B3) may be positioned adjacent to the third side portion (143) corresponding to the third side portion (143). The fourth bezel area (B4) may be positioned adjacent to the fourth side portion (144) corresponding to the fourth side portion (144).

[0059] According to various embodiments, the display module (101) may include a display panel (not shown separately). The display panel may include a plurality of pixels implemented with light-emitting elements such as organic light emitting diodes (OLEDs) or micro LEDs. The display panel may include at least one thin film transistor (TFT) configured to control current to the plurality of pixels to turn the plurality of pixels on or off, or adjust the brightness of the plurality of pixels.

[0060] According to various embodiments, the display module (101) may include a touch sensing circuit (e.g., a touch sensor or a touch panel) (not shown separately). The touch sensing circuit may be implemented as a transparent conductive layer (or film) based on various conductive materials such as indium tin oxide (ITO).

[0061] According to various embodiments, the display module (101) may include an electromagnetic induction panel (not shown separately). The electromagnetic induction panel may include, for example, a digitizer that detects a magnetic field-type pen input device (107). The electromagnetic induction panel may include a plurality of electrode patterns. When an alternating current is supplied to the electromagnetic induction panel, an electromagnetic field may be formed by the plurality of electrode patterns. When the pen tip of the pen input device (107) is brought close to the front surface (10A) of the electronic device (1), a current may flow through a coil included in the pen input device (107) due to electromagnetic induction. The pen input device (107) may generate a signal (e.g., a radio frequency signal) (e.g., a position signal, a pressure signal, and / or an angle signal) related to a user input using energy supplied from the electromagnetic induction panel and transmit the signal to the electromagnetic induction panel. In various embodiments, the electromagnetic induction panel may be defined as a separate element disposed in the display module (101).

[0062] According to various embodiments, the electronic device (1) may include a first camera module (102), a second camera module (103), and / or a third camera module (104). The first camera module (102), the second camera module (103), and / or the third camera module (104) may include one or more lenses, image sensor(s), and / or image signal processor (ISP).

[0063] According to various embodiments, a first camera module (referred to as a front camera module) (102) may be accommodated in a housing (10) corresponding to the front side (10A) of the electronic device (1). External light may pass through the front plate (11) to reach the first camera module (102).

[0064] According to various embodiments, the first camera module (102) may be accommodated in the housing (10) corresponding to the third bezel area (B3) of the front plate (11). The front plate (11) may include a first front transparent area (also referred to as a first front light-transmitting area) positioned in the third bezel area (B3). External light may pass through the first front transparent area to reach the first camera module (102).

[0065] According to various embodiments, although not separately illustrated, the display area of ​​the display module (101) may be implemented as large as possible so that the bezel area (B) may be reduced or substantially omitted, unlike the illustrated example. The first camera module (102) may overlap the display area of ​​the display module (101) when viewed from above on the front side (10A) of the electronic device (1). The first camera module (102) may be positioned on the back side of the display area or below or beneath the display area. When viewed from the outside of the electronic device (1), the first camera module (102) or the position of the first camera module (102) may be substantially visually indistinguishable (or invisible). The first camera module (102) may include, for example, a hidden display rear camera (e.g., an under display camera (UDC)). External light may pass through the front plate (11) and the display area to reach the first camera module (102).

[0066] According to various embodiments, when the first camera module (102) is implemented as a hidden display rear camera, the first camera module (102) may be positioned in alignment with or at least partially inserted into an opening (not separately illustrated) provided in a display area of ​​the display module (101). External light may pass through the opening of the front plate (11) and the display area to reach the first camera module (102). The opening of the display area aligned with or overlapping the first camera module (102) may be provided in the form of a hole (e.g., a through hole). In various embodiments, when viewed from above on the front side (10A) of the electronic device (1), the opening of the display area aligned with or overlapping the first camera module (102) may be provided as a notch (not separately illustrated).

[0067] According to various embodiments, when the first camera module (102) is implemented as a hidden display rear camera, the first camera module (102) may be aligned and positioned in a recess (not shown separately) provided on the rear surface of the display area or may be at least partially inserted into the recess.

[0068] According to various embodiments, although not separately illustrated, when the first camera module (102) is implemented as a hidden display rear camera, a portion of the display area of ​​the display module (101) that at least partially overlaps with the first camera module (102) may include a different pixel structure and / or wiring structure than other portions. The pixel structure and / or wiring structure provided in the portion of the display area that at least partially overlaps with the first camera module (102) may be implemented so as to reduce light loss between the outside of the electronic device (1) and the first camera module (102). The portion of the display area that at least partially overlaps with the first camera module (102) may have, for example, a different pixel density (e.g., number of pixels per unit area) than other portions. For example, the portion of the display area that at least partially overlaps with the first camera module (102) may not substantially include a plurality of pixels.

[0069] According to various embodiments, a second camera module (also referred to as a first rear camera module) (103) and a third camera module (also referred to as a second rear camera module) (104) may be provided corresponding to the rear side (10B) of the electronic device (1). The position or number of the rear camera modules is not limited to the illustrated example.

[0070] According to various embodiments, the second camera module (103) is positioned corresponding to a first camera hole provided (or formed) in the rear portion (13) of the case (12) and can be visually seen from the outside of the electronic device (1) through the first camera hole. The third camera module (104) is positioned corresponding to a second camera hole provided (or formed) in the rear portion (13) of the case (12) and can be visually seen from the outside of the electronic device (1) through the second camera hole. In various embodiments, the rear portion (13) of the case (12) may include a first rear transparent area (also referred to as a first rear light-transmitting area) replacing the first camera hole and / or a second rear transparent area (also referred to as a second rear light-transmitting area) replacing the second camera hole.

[0071] According to various embodiments, the second camera module (103) and / or the third camera module (104) may include a wide-angle camera module, a telephoto camera module, a color camera module, a monochrome camera module, or an IR camera (e.g., a time of flight (TOF) camera, a structured light camera) module.

[0072] According to various embodiments, the second camera module (103) and / or the third camera module (104) may have different properties (e.g., field of view) or functions.

[0073] According to various embodiments, the second camera module (103) and / or the third camera module (104) may provide different angles of view (or lenses with different angles of view). The electronic device (1) may selectively use the angles of view of the second camera module (103) and / or the third camera module (104) based on a user's selection regarding the angles of view.

[0074] According to various embodiments, the electronic device (1) may include a first light-emitting module (105) positioned corresponding to the rear surface (10B) of the electronic device (1). The first light-emitting module (105) may be positioned corresponding to a flash hole or a light-transmitting area provided (or formed) in the rear surface (13) of the case (12), for example. The first light-emitting module (105) may include a light source for the second camera module (103) and / or the third camera module (104). The first light-emitting module (105) may include, but is not limited to, a light emitting diode (LED), an IR LED, or a xenon lamp.

[0075] According to various embodiments, although not separately illustrated, the electronic device (1) may include a second light-emitting module (e.g., an LED, an IR LED, or a xenon lamp) accommodated in a housing (10) corresponding to the front surface (10A) of the electronic device (1). The second light-emitting module may provide status information of the electronic device (1) in the form of light and / or provide a light source that is linked to the operation of the first camera module (102).

[0076] According to various embodiments, the electronic device (1) may include a sensor module (106) positioned corresponding to the front surface (10A) of the electronic device (1). In various embodiments, the sensor module (106) may include an optical sensor (e.g., a proximity sensor or an illuminance sensor). The sensor module (106) may be accommodated in the housing (10), for example, corresponding to the third bezel area (B3) of the front plate (11). The front plate (11) may include a second front transparent area (also referred to as a second front light-transmitting area) positioned in the third bezel area (B3). External light may pass through the second front transparent area to reach the sensor module (106).

[0077] According to various embodiments, the sensor module (106) may overlap the display area when viewed from above the front side (10A) of the electronic device (1), in at least some identical or similar manner to the example where the first camera module (102) overlaps the display area of ​​the display module (101). The sensor module (106) may be positioned on the back side of the display area or below or beneath the display area. When viewed from the outside of the electronic device (1), the sensor module (106), or the position of the sensor module (106), may be substantially invisible or indistinguishable.

[0078] According to various embodiments, although not separately illustrated, the electronic device (1) may include at least one other sensor module provided in various other locations. The electronic device (1) may include, for example, an optical, electrostatic, or ultrasonic biometric sensor module (e.g., a fingerprint recognition sensor module). In various embodiments, the biometric sensor module may overlap the display area when viewed from above the front surface (10A) of the electronic device (1), in a manner at least partially identical or similar to the example in which the first camera module (102) overlaps the display area of ​​the display module (101).

[0079] According to various embodiments, the electronic device (1) may include one or more acoustic input modules. The electronic device (1) may include, for example, a first acoustic input module, a second acoustic input module, and / or a third acoustic input module. The first acoustic input module includes a first microphone (also referred to as a first microphone), and the first microphone may be accommodated in the housing (10) corresponding to a first microphone hole (MH1) provided (or formed) in, for example, a first side portion (141). The second acoustic input module includes a second microphone (also referred to as a second microphone), and the second microphone may be accommodated in the housing (10) corresponding to a second microphone hole (MH2) provided (or formed) in, for example, a third side portion (143). The third sound input module includes a third microphone (also referred to as a third microphone), and the third microphone can be accommodated in the housing (10) corresponding to a third microphone hole (MH3) provided (or formed) in, for example, the third side portion (143). The position or number of the microphone and the microphone holes corresponding to the microphone are not limited to the illustrated example. In various embodiments, the electronic device (1) can perform noise-cancelling through one or more microphones. In various embodiments, the electronic device (1) can be configured to detect the direction of a sound outside the electronic device (1) through a plurality of microphones.

[0080] According to various embodiments, the electronic device (1) may include one or more audio output modules. The electronic device (1) may include, for example, a first audio output module, a second audio output module, a third audio output module, and / or a fourth audio output module. The first audio output module includes a first speaker, and the first speaker (not shown separately) may be accommodated in the housing (10) corresponding to, for example, a first speaker hole (SH1) provided (or formed) in the first side portion (141). The second audio output module includes a second speaker (e.g., a speaker (21) of FIG. 2), and the second speaker can be accommodated in the housing (10) corresponding to a second speaker hole (SH2) provided (or formed) in the first side portion (141), for example. The third audio output module includes a third speaker (not shown separately), and the third speaker can be accommodated in the housing (10) corresponding to a third speaker hole (SH3) provided (or formed) in the second side portion (142), for example. The fourth audio output module includes a fourth speaker (not shown separately), and the fourth speaker can be accommodated in the housing (10) corresponding to a fourth speaker hole (SH4) provided (or formed) in the second side portion (142), for example. In various embodiments, the first speaker hole (SH1), the second speaker hole (SH2), and the third speaker The hole (SH3) and / or the fourth speaker hole (SH4) may include a plurality of holes arranged in a direction parallel to the y-coordinate axis. The positions or number of speaker modules and speaker holes corresponding to the speaker modules are not limited to the examples illustrated.

[0081] According to various embodiments, the electronic device (1) may include a key input module. The key input module may include, for example, a first key (also referred to as a first side key) (K1), a second key (also referred to as a second side key) (K2), and / or a key signal generation unit (also referred to as a key signal generation circuit) (not separately illustrated). For example, the first key (K1) may be positioned in a first key hole (e.g., the first key hole (KH1) of FIG. 3) provided (or formed) in the third side portion (143), and the second key (K2) may be positioned in a second key hole provided (or formed) in the third side portion (143). The key signal generation unit may be accommodated in the housing (10). The key signal generation unit can generate a first key signal corresponding to a press or touch of a first key (K1) and a second key signal corresponding to a press or touch of a second key (K2). The location or number of the key input module or keys is not limited to the illustrated example.

[0082] According to various embodiments, the electronic device (1) may include one or more connection terminals. The electronic device (1) may include, for example, a first connection terminal and / or a second connection terminal. The first connection terminal includes a first connector (108), and the first connector (108) may be accommodated in the housing (10) corresponding to a first connector hole (145) provided (or formed) in, for example, the second side portion (142). The electronic device (1) may transmit and / or receive power and / or data to and from an external electronic device electrically connected to the first connector (108). In various embodiments, the first connector (108) may include a universal serial bus (USB) connector or a high-definition multimedia interface (HDMI) connector. The position or number of the first connector hole (145) and the corresponding first connector (108) are not limited to the illustrated example. The second connection terminal includes a second connector (not shown separately), and the second connector can be accommodated in the housing (10) corresponding to a second connector hole (146) provided (or formed) in, for example, the third side portion (143). A tray in which an external storage medium (e.g., a SIM card, a USIM (universal SIM) card, a CF (compact flash), a MMC (multi-media card), a SMC (smart media card), an SD (secure disk), or a MS (memory stick)) is placed is inserted into the second connector (e.g., a socket), and the external storage medium can be electrically connected to the second connector. The position or number of the second connector hole (146) and the second connector corresponding thereto are not limited to the illustrated example.

[0083] According to various embodiments, a pen input device (107) (e.g., a stylus pen) may be attached to and detached from the housing (10). The pen input device (107) may be attached to, for example, the rear surface (10B) of the electronic device (1). In various embodiments, the pen input device (107) may be attached to and detached from the side surface (10C) or the front surface (10A) of the electronic device (1). The pen input device (107) may be attached to the housing (10) through an attractive force between magnetic materials, but is not limited thereto, and may be disposed in the housing (10) through various other methods, such as being inserted into the interior of the housing (10). The pen input device (107) may be implemented by an electromagnetic induction method (e.g., an electro-magnetic resonance (EMR) method). The pen input device (107) may include a resonant circuit and may be implemented to interact with an electromagnetic induction panel (not shown separately) included in the electronic device (1).

[0084] FIG. 2 is an exploded perspective view of a portion of an electronic device (1) according to various embodiments of the present disclosure.

[0085] FIG. 3 is a perspective view of a portion of an electronic device (1) according to various embodiments of the present disclosure.

[0086] FIG. 4 is a perspective view of a portion of an electronic device (1) according to various embodiments of the present disclosure.

[0087] FIG. 5 is a perspective view of a portion of an electronic device (1) according to various embodiments of the present disclosure.

[0088] FIG. 6 is a drawing showing a part of an electronic device (1) according to various embodiments of the present disclosure.

[0089] FIG. 7 is a drawing showing a part of an electronic device (1) according to various embodiments of the present disclosure.

[0090] FIG. 8 is a cross-sectional view of a portion of an electronic device (1) taken along line AA' of FIG. 7 according to various embodiments of the present disclosure.

[0091] FIG. 9 is a cross-sectional view of a portion of an electronic device (1) taken along line AA' of FIG. 7 according to various embodiments of the present disclosure.

[0092] It is to be understood that the present disclosure encompasses and includes all combinations of the features and / or embodiments disclosed with respect to FIGS. 2, 3, 4, 5, 6, 7, 8, and 9. All combinations of the features described below with respect to FIGS. 2, 3, 4, 5, 6, 7, 8, and 9 may be considered to be encompassed by the present disclosure as specific examples.

[0093] Referring to FIGS. 2, 3, 4, 5, 6, 7, 8, and 9, the electronic device (1) may include a front plate (11) (see FIG. 8) and a case (12) (see FIGS. 2, 3, and 8). The electronic device (1) may include a display module (101) (see FIG. 8). The electronic device (1) may include a speaker assembly (2). The electronic device (1) may include a sealing member (3) (see FIGS. 2, 4, 5, 6, and 8).

[0094] According to various embodiments, the case (12) may include a rear portion (13) and a side portion (14) of the electronic device (1). The case (12) may have recesses in the rear portion (13) and the side portion (14) in which electrical elements, such as a display module (101) and a speaker assembly (2), or other structural elements, may be positioned.

[0095] According to various embodiments, the speaker assembly (2) may be positioned in the space between the front plate (11) and the case (12). The speaker assembly (2) may be placed or coupled to the case (12).

[0096] According to various embodiments, the electronic device (1) may include an internal support (also called an internal support member, an internal support, or a bracket) (not shown) positioned at least partially between the rear portion (13) of the case (12) and the display module (101). The internal support may be connected to the rear portion (13) and / or the side portion (14) of the case (12), or may extend from the rear portion (13) and / or the side portion (14) of the case (12). The internal support may include, for example, at least one conductive portion and / or at least one non-conductive portion. In various embodiments, the internal support may be defined as a part of the case (12). In various embodiments, at least one electrical element, such as the display module (101), may be positioned or coupled to the internal support between the front plate (11) and the internal support, or may be supported by the internal support. In various embodiments, at least one electrical element (not shown separately), such as a printed circuit board (PCB) having electronic components such as a processor, a communication module, and a power management module, may be disposed or coupled to the internal support between the rear portion (13) of the case (12) and the internal support, or may be supported by the internal support. In various embodiments, a speaker assembly (2) may be disposed or coupled to the internal support between the display module (101) and the internal support.

[0097] According to various embodiments, at least a portion of the speaker assembly (2) may be positioned between the display module (101) and the rear portion (13) of the case (12).

[0098] According to various embodiments, the speaker assembly (2) may include a speaker (21), an electrical connecting member (22), and a speaker housing (23).

[0099] According to various embodiments, the speaker (21) may be configured to convert an audio signal into sound waves. The speaker (21) may be disposed inside a speaker housing (22).

[0100] According to various embodiments, the speaker (21) (see FIG. 8) may include a magnetic circuit unit (81), a coil structure (82), a diaphragm (83), and a support structure (84). The magnetic circuit unit (81) may form a fixed magnetic field (also referred to as a permanent magnetic field). The magnetic circuit unit (81) may include an inner magnet (811) and an outer magnet (812). The outer magnet (812) may surround the inner magnet (811) when viewed from above the rear surface (10B) of the electronic device (1). The inner magnet (811) and the outer magnet (812) may be spaced apart from each other. The inner magnet (811) and the outer magnet (812) may include a permanent magnet (e.g., a neodymium magnet, an alnico magnet, or a ferrite magnet) that participates in the magnetic field strength of the speaker (21). The magnetic circuit (81) may include a magnetic conductor (e.g., a yoke) (814). The magnetic conductor (814) may include, for example, a plate including a magnetic material. The magnetic conductor (814) may form a magnetic circuit or magnetic path that controls the flow of a magnetic field formed from a magnet (812) and enhances the strength of the magnetic field. The magnetic conductor (814) may control the flow of a magnetic field formed from a magnet (812) to concentrate a magnetic force on the coil structure (82). The magnetic conductor (814) may at least play a role in controlling the flow of a magnetic field formed from a magnet (812) to enhance the strength of the magnetic field and / or to concentrate a magnetic force on the coil structure (82). The coil structure (82) may include a coil support member (e.g., a coil former) and a coil wound around the coil support member. When an audio signal in the form of a current (e.g., alternating current) flows through the coil structure (82), a magnetic force can be generated that is guided toward the central axis around which the coil is wound.Due to the interaction between the induced magnetic force and the fixed magnetic field (e.g., Fleming's left-hand rule), the coil structure (82) can move in the direction of the central axis, and the diaphragm (83) connected to the coil structure (82) can vibrate the air due to the movement of the coil structure (82). The support structure (84) can support the magnetic circuit unit (81) and the diaphragm (83).

[0101] According to various embodiments, the diaphragm (83) of the speaker (21) may face the rear portion (13) of the case (12). The speaker (21) may generate sound waves toward the rear portion (13) of the case (12).

[0102] According to various embodiments, the electrical connection member (22) may extend from one end (221) to the other end (222). One end (221) of the electrical connection member (22) may be connected to the speaker (21). One end (221) of the electrical connection member (22) may be electrically connected to a coil (not shown separately) of the speaker (21). A connector (223) may be arranged at the other end (222) of the electrical connection member (22). In various embodiments, the connector (223) may be electrically connected to a PCB (not shown separately) located at least partially between the display module (101) and the rear portion (13) of the case (12). An audio signal may be provided to the speaker (21) through the electrical connection member (22). The electrical connecting member (22) may include, for example, a flexible printed circuit board (FPCB) (also called a speaker FPCB).

[0103] According to various embodiments, the speaker housing (23) may be positioned at least partially between the display module (101) and the case (12). In various embodiments, the speaker housing (23) may be disposed or coupled to the case (12). The speaker housing (23) may be coupled to the case (12) through mechanical fastening, such as screw fastening (not shown separately). The speaker housing (23) may be coupled to the case (12) through, for example, an adhesive material (or adhesive material) (e.g., double-sided tape).

[0104] According to various embodiments, the electrical connection member (22) may pass through a hole (not shown separately) provided (or formed) in the speaker housing (23), and a portion of the electrical connection member (22) may be positioned outside the speaker housing (23) for electrical connection with a PCB (not shown separately).

[0105] According to various embodiments, the speaker housing (23) may be coupled with the case (12) to provide (or form) a sound wave passage (9) (see FIG. 9) for the speaker (21). The speaker housing (23) may provide (or form) a portion of an inner wall of the passage (also referred to as a passage inner surface) that defines (or forms) the sound wave passage (9). A portion of the case (12) (e.g., a portion of the rear portion (13) of the case (12)) may provide a portion of the inner wall of the passage that defines (or forms) the sound wave passage (9). The speaker (21) may be disposed within the speaker housing (23) to generate sound waves into the sound wave passage (9). Sound waves generated by the vibration of the diaphragm (83) (see Fig. 8) of the speaker (21) can be propagated in the air within the sound wave passage (9) and output to the outside of the electronic device (1) through the second speaker hole (SH2) provided (or formed) in the side portion (14) of the case (12). The sound wave passage (9) can guide the propagation of sound waves so that the sound waves generated from the speaker (21) can propagate to the second speaker hole (SH2) of the case (12) without leakage.

[0106] According to various embodiments, the speaker housing (23) may include a non-metallic frame (also referred to as a second frame or speaker frame) (231) and a metal plate (232) disposed or coupled to the non-metallic frame (231). The non-metallic frame (231) may be a structural element designed to withstand a load. The exterior of the speaker housing (23) may be provided (or formed) by the combination of the non-metallic frame (231) and the metal plate (232). In various embodiments, without being limited to the non-metallic frame (231), a metal frame, or a frame including a non-metallic portion and a metal portion may be provided (or formed).

[0107] According to various embodiments, the non-metallic frame (231) of the speaker housing (23) may include a first opening (2301) (see FIGS. 4, 5, 6, and 8). The first opening (2301) may be a sound wave output port of the sound wave passage (9). The first opening (2301) may be connected to a second speaker hole (SH2) provided (or formed) in a side portion (14) of the case (12). The first opening (2301) may be formed in the non-metallic frame (231) so as to face the second speaker hole (SH2) of the case (12). When the speaker (21) outputs an audio signal received through an electrical connection member (22), sound waves generated by the vibration of the diaphragm (83) (see FIG. 8) of the speaker (21) are propagated in the air within the sound wave passage (9) and can be output outside the electronic device (1) through the first opening (2301) of the non-metal frame (231) and the second speaker hole (SH2) of the case (12).

[0108] According to various embodiments, the non-metallic frame (231) of the speaker housing (23) may include a second opening (2302) (see FIGS. 2, 4, 5, 6, and 8). The second opening (2302) may be formed in the non-metallic frame (231) so as to face the rear portion (13) of the case (12). The second opening (2302) may overlap the rear portion (13) of the case (12) when viewed from above the front surface (10A) of the electronic device (1).

[0109] According to various embodiments, a portion of the rear portion (13) of the case (12) (hereinafter referred to as the opening counterpart (131)) may be configured to block the second opening (2302) of the non-metallic frame (231). The opening counterpart (131) of the case (12) may reduce or prevent sound waves generated by the speaker (21) from leaking out of the sound wave passage (9) through the second opening (2302). The opening counterpart (131) of the case (12) may provide (or form) a portion of the passage inner wall that defines (or forms) the sound wave passage (9).

[0110] According to various embodiments, the opening counterpart (131) of the case (12) may include a plane (131A) that faces in a direction substantially parallel to the direction in which the front surface (10A) of the electronic device (1) faces, through the second opening (2302) of the non-metallic frame (231). The plane (131A) of the opening counterpart (131) may provide (or form) a portion of a passage inner wall (also referred to as a passage inner surface) that defines (or forms) the sound wave passage (9). The plane (131A) of the opening counterpart (131) may be, for example, substantially parallel to the front surface (10A) or the rear surface (10B) of the electronic device (1). In various embodiments, the opening counterpart (131), although not separately illustrated, is not limited to the plane (131A) and may include an inclined surface, a curved surface, a bent surface, or a combination thereof.

[0111] According to various embodiments, when viewed from above on the rear surface (10B) of the electronic device (1), the second opening (2302) of the non-metallic frame (231) may overlap with the speaker (21). The opening corresponding portion (131) of the case (12) may be spaced apart from the speaker (21) in the direction toward which the rear surface (10B) of the electronic device (1) faces. Sound waves generated from the speaker (21) may be output toward the opening corresponding portion (131) of the case (12) through the second opening (2302).

[0112] According to various embodiments, the opening corresponding portion (131) of the case (12) may be implemented to have a vibration-proof strength capable of reducing vibration with respect to sound waves generated from the speaker (21). The opening corresponding portion (131) of the case (12) may include a part of a non-metallic portion (not separately illustrated) included in the case (12). The opening corresponding portion (131) of the case (12) may include a part of a metal portion (not separately illustrated) included in the case (12).

[0113] According to various embodiments, although not shown separately, the electronic device (1) may include a thin metal sheet (or metal film) at least partially disposed or coupled to the opening corresponding portion (131) of the case (12). The metal sheet may overlap the speaker (21) and the second opening (2302) of the non-metal frame (231) when viewed from above the front surface (10A) of the electronic device (1). The metal sheet may be configured to reinforce the dustproof strength.

[0114] According to various embodiments, although not shown separately, the opening corresponding portion (131) of the case (12) may protrude relatively to the surrounding area of ​​the opening corresponding portion (131) so as to be inserted into the second opening (2302).

[0115] According to various embodiments, although not shown separately, the opening corresponding portion (131) of the case (12) may be provided (or formed) as a fine-shaped recess in the direction in which the rear surface (10B) of the electronic device (1) faces.

[0116] According to various embodiments, the opening counterpart (131) of the case (12) provides (or forms) a portion of the inner wall of the passage defining (or forming) the sound wave passage (9) through the second opening (2302) of the non-metallic frame (231), which may expand the volume of the sound wave passage (9) (e.g., width in the direction toward the front (10A) or the rear (10B) of the electronic device (1)) compared to an example in which the non-metallic frame (231) is implemented without the second opening (2302) or includes an additional member (e.g., a non-metallic or metal plate) that blocks the second opening (2302). The expansion of the volume of the sound wave passage (9) due to the opening corresponding portion (131) of the case (12) providing a part of the inner wall of the passage defining the sound wave passage (9) through the second opening (2302) of the non-metallic frame (231) can reduce the sound speed and thereby reduce the pressure inside the sound wave passage (9), thereby reducing the pressure difference between the inside of the sound wave passage (9) and the outside of the sound wave passage (9), thereby reducing the occurrence of unwanted vibrations.

[0117] According to various embodiments, the opening counterpart (131) of the case (12) provides (or forms) a portion of the inner wall of the passage defining the sound wave passage (9) through the second opening (2302) of the speaker housing (23), which allows the combination of the case (12) and the non-metallic frame (231) to have a slim structure, as compared to an example where the non-metallic frame (231) is implemented without the second opening (2302) or includes an additional member (e.g., a non-metallic or metal plate) that blocks the second opening (2302).

[0118] According to various embodiments, referring to FIG. 9, a first thickness (T1) of a passage section between a speaker (21) and a rear portion (13) of a case (12) in a sound wave passage (9) in a direction parallel to the direction in which the front (10A) or the rear (10B) of the electronic device (1) faces may be about 0.50 mm to about 1.00 mm.

[0119] According to various embodiments, referring to FIG. 9, the second thickness (T2) from the metal plate (232) to the rear portion (13) of the case (12) in a direction parallel to the direction in which the front (10A) or the rear portion (10B) of the electronic device (1) faces may be about 3.2 mm to about 4.0 mm.

[0120] According to various embodiments, the non-metallic frame (231) of the speaker housing (23) may include a third opening (2303) (see FIGS. 3, 7, and 8). The third opening (2303) may be formed in the non-metallic frame (231) so as to face the display module (101). The third opening (2303) may overlap the speaker (21) when viewed from above on the front side (10A) of the electronic device (1).

[0121] According to various embodiments, the speaker (21) may be positioned at least partially between the second opening (2302) of the non-metallic frame (231) and the third opening (2303) of the non-metallic frame (231).

[0122] According to various embodiments, the metal plate (232) may be placed or coupled to the non-metal frame (231) to block the third opening (2303). The metal plate (232) may be coupled to the non-metal frame (231) via, for example, an adhesive material (or adhesive material) (e.g., double-sided tape) (not shown) disposed between the metal plate (232) and the non-metal frame (231). The metal plate (232) may be coupled to the non-metal frame (231) via, for example, a mechanical fastening such as a screw fastening. The metal plate (232) may reduce or prevent sound waves generated from the speaker (21) from leaking out of the sound wave passage (9) through the third opening (2303). The third opening (2303) may allow the combination of the non-metal frame (231) and the metal plate (232) to have a slim structure.

[0123] According to various embodiments, the speaker (21) may be positioned at least partially between the opening counterpart (131) of the case (12) that blocks the second opening (2302) of the non-metallic frame (231) and the metal plate (232) that blocks the third opening (2303) of the non-metallic frame (231).

[0124] According to various embodiments, the speaker (21) may be positioned closer to the metal frame (232) than to the opening counterpart (131) of the case (12). The distance that the speaker (21) is spaced apart from the opening counterpart (131) of the case (12) that blocks the second opening (2302) of the non-metal frame (231) in the direction toward which the front (10A) of the electronic device (1) faces may be greater than the distance that the speaker (21) is spaced apart from the metal plate (232) that blocks the third opening (2303) of the non-metal frame (231) in the direction toward which the rear (10B) of the electronic device (1) faces.

[0125] According to various embodiments, the metal plate (232) may provide (or form) a portion of an inner wall (or inner surface) that defines (or forms) a resonant space (e.g., resonant space (86) of FIG. 8) for the speaker (21). The metal plate (232) may be a thin plate for slimming the speaker assembly (2), and may have vibration-proof strength that can reduce vibrations against sound waves generated from the speaker (21).

[0126] According to various embodiments, the third opening (2303) of the non-metallic frame (231) corresponding to the metal plate (232) may be omitted. For example, the non-metallic frame (231) may be expanded to further include a portion supporting the metal plate (232) or attached to the metal plate (232) corresponding to the omission of the third opening (2303), and the metal plate (232) may be provided (or formed) thinner than the example including the third opening (2303).

[0127] According to various embodiments, the metal plate (232) may be positioned at least partially between the display module (101) and the speaker (21). When viewed from above the front side (10A) of the electronic device (1), the metal plate (232) may overlap the speaker (21).

[0128] According to various embodiments, the metal plate (232) can reduce or prevent electromagnetic interference (EMI) to the speaker (21). The metal plate (232) can reduce or prevent magnetic force from the speaker (21) from being transmitted or moved outside the speaker assembly (2). The metal plate (232) can include an electromagnetic shielding material or an electromagnetic absorbing material.

[0129] According to various embodiments, the metal plate (232) may be positioned between the magnetic conductor (814) of the speaker (21) (see FIG. 8) and the display module (101).

[0130] According to various embodiments, the metal plate (232) can reduce or prevent electromagnetic influence (e.g., electromagnetic interference (EMI)) of the speaker (21) on the display module (101). The metal plate (232) can reduce or prevent performance degradation of the display module (101) caused by the speaker (21). The metal plate (232) can reduce or prevent the magnetic force of the speaker (21) from being transmitted or moved to the display module (101).

[0131] According to various embodiments, the metal plate (232) may be positioned at least partially between an electromagnetic induction panel (not shown separately) included or arranged in the display module (101) and the speaker (21). When viewed from above the front surface (10A) of the electronic device (1), the metal plate (232) may overlap the electromagnetic induction panel and the speaker (21). The metal plate (232) may reduce or prevent electromagnetic influence (e.g., EMI) from the speaker (21) to the electromagnetic induction panel. The metal plate (232) may reduce or prevent a magnetic force from the speaker (21) from being transmitted or moved to the electromagnetic induction panel, thereby reducing or preventing degradation in the performance of the electromagnetic induction panel.

[0132] According to various embodiments, the metal plate (232) may include various metallic materials capable of shielding magnetic forces. The metal plate (232) may include, for example, SPCC (steel plate cold commercial), but is not limited thereto.

[0133] According to various embodiments, the metal plate (232) may be in an electrically floating state. The metal plate (232) may be electrically and physically isolated from the conductor surrounding the metal plate (232).

[0134] According to various embodiments, the metal plate (232) may be electrically connected to a ground area of ​​a PCB (not shown separately) included in the electronic device (1) and may become part of the ground structure of the electronic device (1).

[0135] According to various embodiments, the metal plate (232) may face a metal sheet (e.g., a copper sheet) for electromagnetic shielding that forms at least a portion of the back surface of the display module (101). In various embodiments, the metal plate (232) may be electrically connected to the metal sheet of the display module (101) through a conductive adhesive material or a flexible conductive member disposed between the metal plate (232) and the display module (101) and the metal sheet, thereby becoming a part of the ground structure of the electronic device (1).

[0136] According to various embodiments, the non-metallic frame (231) of the speaker housing (23) may include a first non-metallic frame (2311) and a second non-metallic frame (2312). The first non-metallic frame (2311) and the second non-metallic frame (2312) may be coupled to each other through mechanical fastening (not shown separately), such as snap-fit ​​fastening or screw fastening. The snap-fit ​​fastening may be, for example, a fastening structure that resiliently couples interlocking elements of the first non-metallic frame (2311) and the second non-metallic frame (2312). The first non-metallic frame (2311) and the second non-metallic frame (2312) may be coupled to each other through, for example, bonding.

[0137] According to various embodiments, the first non-metallic frame (2311) may include a first structure (710) (see FIGS. 4 and 5) to provide (or form) a first opening (2301). The first structure (710) may include, for example, a first portion (711) (see FIGS. 2, 3, 4, 5, 6, 7, and 8), a second portion (712) (see FIGS. 4, 5, 6, 7, and 8), a third portion (713) (see FIGS. 4 and 5), and a fourth portion (714) (see FIGS. 4 and 5). The first portion (711) may be positioned closer to the front surface (10A) of the electronic device (1) than the second portion (712). The second part (712) may be positioned closer to the rear surface (10B) of the electronic device (1) than the first part (711). The first part (711) and the second part (712) may be spaced apart from each other. The third part (713) may connect or extend one end of the first part (711) and one end of the second part (712). The fourth part (714) may connect or extend the other end of the first part (711) and the other end of the second part (712). The third part (713) and the fourth part (714) may overlap in a direction parallel to the y-coordinate axis. The third part (713) may be, for example, a first wall perpendicular to the direction parallel to the y-coordinate axis. The fourth portion (714) may be, for example, a second wall perpendicular to a direction parallel to the y-coordinate axis. The first opening (2301) may include a space between the first portion (711), the second portion (712), the third portion (713), and the fourth portion (714). The first portion (711), the second portion (712), the third portion (713), and the fourth portion (714) may form an annular structure, and the first opening (2301) may include a space surrounded by the annular structure. The first opening (2301) may be provided (or formed) in a shape corresponding to a second speaker hole (SH2) including a plurality of holes.

[0138] According to various embodiments, when viewed from above on the front (10A) or the rear (10B) of the electronic device (1), the first portion (711) and the second portion (712) included in the first structure (710) of the first non-metallic frame (2311) may overlap. When viewed from above on the front (10A) or the rear (10B) of the electronic device (1), the first portion (711) may have a first width in a direction in which the first side portion (141) of the case (12) (see FIGS. 2, 3, and 8) extends (e.g., in a direction parallel to the y-coordinate axis). When viewed from above on the front (10A) or the rear (10B) of the electronic device (1), the first portion (711) may have a second width in a direction in which the fourth side portion (144) of the case (12) (see FIGS. 2 and 3) extends (e.g., in a direction parallel to the x-coordinate axis). The first portion (711) may be provided (or formed) in a form in which the first width is relatively larger than the second width. When viewed from above on the front (10A) or the rear (10B) of the electronic device (1), the second portion (712) may have a third width in a direction in which the first side portion (141) of the case (12) (see FIGS. 2 and 3) extends (e.g., in a direction parallel to the y-coordinate axis). When viewed from above on the front (10A) or the rear (10B) of the electronic device (1), the second portion (712) may have a fourth width in a direction in which the fourth side portion (144) of the case (12) (see FIGS. 2 and 3) extends (e.g., in a direction parallel to the x-coordinate axis). The second portion (712) may be provided (or formed) in a form in which the third width is relatively larger than the fourth width. In various embodiments, the first width of the first portion (711) may be substantially the same as the third width of the second portion (712) and may extend from the third portion (713) to the fourth portion (714). In various embodiments, the second width of the first portion (711) may be larger than the fourth width of the second portion (712).

[0139] According to various embodiments, the first portion (711) included in the first structure (710) of the first non-metallic frame (2311) may extend from a first end (7111) (see FIG. 8) located toward the first side portion (141) of the case (12) to a second end (7112) located between the metal plate (22) and the rear portion (13) of the case (12). In various embodiments, the second end (7112) of the first portion (711) may be configured to support the speaker (21). The second end (7112) of the first portion (711) may be in close contact with the speaker (21) to reduce or prevent sound waves generated from the speaker (21) from leaking from the sound wave passage (9).

[0140] According to various embodiments, the shape of the first opening (2301) provided by the first structure (710) may vary depending on the relative position in the direction parallel to the x-coordinate axis between the first part (711) of the first non-metallic frame (2311) and the second part (712) of the first non-metallic frame (2311) when viewed from above on the front (10A) or the back (10B) of the electronic device (1). For example, when viewed from above on the front (10A) or the rear (10B) of the electronic device (1), as the second portion (712) overlaps the first portion (711) and is positioned further from the first side portion (141) of the case (12), the slope (e.g., the ratio of the z-coordinate value to the x-coordinate value increase in FIG. 8) of the opening surface (23011) (see FIG. 8) that the first opening (2301) has on the side facing the second speaker hole (SH2) of the case (12) increases, and the area of ​​the opening surface (23011) may decrease. For example, when viewed from above on the front (10A) or the rear (10B) of the electronic device (1), as the second portion (712) overlaps the first portion (711) and is positioned closer to the first side portion (141) of the case (12), the slope of the opening surface (23011) that the first opening (2301) has on the side facing the second speaker hole (SH2) of the case (12) (e.g., the ratio of the increase in the z-coordinate value to the increase in the x-coordinate value in FIG. 8) may decrease, and the area of ​​the opening surface (23011) may increase. The first side portion (141) of the case (12) may be implemented in a form that has a second speaker hole (SH2) corresponding to the opening surface (23011) of the first opening (2301).

[0141] According to various embodiments, depending on the shape of the first opening (2301), a portion of the first side portion (141) forming the second speaker hole (SH2) may extend to the rear portion (13) so as to overlap with the rear portion (13) of the case (12) when viewed from above the front (10A) of the electronic device (1).

[0142] According to various embodiments, the first structure (710) of the first non-metallic frame (2311) may include a fifth portion (715) (see FIGS. 4, 5, and 6) and / or a sixth portion (716) (see FIGS. 4, 5, and 6) positioned between the third portion (713) and the fourth portion (714). The fifth portion (715) may be a first support wall that connects or extends the first portion (711) and the second portion (712) and is perpendicular to the direction parallel to the y-coordinate axis. The sixth portion (716) may be a second support wall that connects or extends the first portion (711) and the second portion (712) and is perpendicular to the direction parallel to the y-coordinate axis. The fifth portion (715) and the sixth portion (716) can support the first portion (711) and the second portion (712) so that a separation distance between the first portion (711) and the second portion (712) can be maintained. In various embodiments, the first opening (2301) can include three openings by the fifth portion (715) and the sixth portion (716). The number of support walls supporting the first portion (711) and the second portion (712) is not limited to the illustrated example.

[0143] According to various embodiments, when viewed from above on the front side (10A) of the electronic device (1), the first portion (711) of the first non-metallic frame (2311) may protrude toward the first side portion (141) of the case (12) with respect to the second non-metallic frame (2312) and may be disposed on the first side portion (141) of the case (12). The speaker housing (23) may include a front surface of the speaker housing (23) that is substantially or at least partially directed toward the display module (101) (FIG. 1) or the front side (10A) of the electronic device (1). The front surface of the speaker housing (23) may include, for example, a first portion surface by the first portion (711) of the first non-metallic frame (2311), a second portion surface by the second non-metallic frame (2312), and a third portion surface by the metal plate (232).

[0144] According to various embodiments, the first non-metallic frame (2311) may include a second structure (720) extending from the first structure (710) (see FIGS. 2, 3, 4, 5, 6, and 8). The second structure (720) may include a first planar portion (721) (see FIGS. 2, 4, and 5) and a first side wall portion (722) extending from the first planar portion (721) (see FIGS. 2, 3, 4, 5, and 6). The first planar portion (721) may face the rear portion (13) of the case (12). The first side wall portion (722) may be configured to couple with the second non-metallic frame (2312).

[0145] According to various embodiments, the second opening (2302) may be provided (or formed) by the second portion (712) of the first structure (710) and the first planar portion (721) of the second structure (720). The second portion (712) of the first structure (710) may be understood as a boundary between the first opening (2301) and the second opening (2302).

[0146] According to various embodiments, the second non-metallic frame (2312) may include a second planar portion (731) (see FIGS. 2, 3, and 7) and a second side wall portion (732) (see FIGS. 2, 3, 4, and 5) extending from the second planar portion (731). The second planar portion (731) may face the display module (1010). The second side wall portion (732) may be configured to be coupled with the first non-metallic frame (2311). The first side wall portion (722) included in the second structure (720) of the first non-metallic frame (2311) and the second side wall portion (732) of the second non-metallic frame (2312) may be coupled. When viewed from above on the rear surface (10B) of the electronic device (1), the first planar portion (721) included in the second structure (720) of the first non-metallic frame (2311) may overlap with the second planar portion (731) of the second non-metallic frame (2312). The first planar portion (721) of the first non-metallic frame (2311) and the second planar portion (731) of the second non-metallic frame (2312) may be spaced apart from each other in parallel.

[0147] According to various embodiments, the third opening (2303) of the non-metallic frame (231) may be provided (or formed) by a combination of the first structure (710) of the first non-metallic frame (2311) and the second planar portion (731) of the second non-metallic frame (2312). When viewed from above on the front surface (10A) of the electronic device (1), the first structure (710) of the first non-metallic frame (2311) may include a first notch (N1) (see FIG. 7), and the second planar portion (731) of the second non-metallic frame (2312) may include a second notch (N2) (see FIGS. 2 and 7) that is recessed in the opposite direction to the first notch (N1). A third opening (2303) can be formed by a combination of the first notch (N1) and the second notch (N2).

[0148] According to various embodiments, a sealing member (3) (see FIGS. 2, 4, 5, 6, and 8) may be disposed between the speaker housing (23) and the case (12). The sealing member (3) may be provided (or formed) in an annular (or loop-shaped) shape surrounding both the first opening (2301) and the second opening (2302) of the speaker housing (23) between the speaker housing (23) and the case (12). The sealing member (3) may include an elastic member or a flexible member. The sealing member (3) may include, for example, rubber, but is not limited thereto. When the speaker housing (23) is coupled to the case (12), the sealing member (3) may be resiliently disposed between the speaker housing (23) and the case (12).

[0149] According to various embodiments, the sealing member (3) may be disposed between the first non-metal frame (2311) and the case (12). Based on the second part (712) of the first structure (710) of the first non-metal frame (2311), the sealing member (3) may include a first sealing portion (31) (see FIGS. 4, 5, and 6) and a second sealing portion (32) (see FIGS. 4, 5, and 6). The first sealing portion (31) of the sealing member (3) and the second part (712) of the first non-metal frame (2311) form an annular shape surrounding the first opening (2301) of the first non-metal frame (2311) and the second speaker hole (SH2) of the case (12) between the first non-metal frame (2311) and the case (12), so that sound waves generated from the speaker (21) can be propagated from the first opening (2301) to the second speaker hole (SH2) substantially without leakage, thereby sealing the space between the first non-metal frame (2311) and the case (12). The second sealing portion (32) of the sealing member (3) and the second part (712) of the first non-metal frame (2311) form an annular shape surrounding the second opening (2302) of the first non-metal frame (2311) between the first non-metal frame (2311) and the case (12), thereby reducing or preventing sound waves generated from the speaker (21) from leaking between the first non-metal frame (2311) and the case (12) through the second opening (2302).

[0150] According to various embodiments, the first sealing portion (31) of the sealing member (3) may be disposed substantially flat between the first non-metallic frame (2311) and the case (12). The second sealing portion (32) of the sealing member (3) may be disposed substantially flat between the first non-metallic frame (2311) and the case (12). The second sealing portion (32) may be disposed substantially parallel to the rear surface (13) of the electronic device (1), for example. In various embodiments, the first sealing portion (31) and the second sealing portion (32) may form an obtuse angle.

[0151] According to various embodiments, the sealing member (3) may be coupled to the first non-metal frame (2311) via an adhesive material (or adhesive material) (e.g., adhesive material (1210) of FIG. 12) disposed between the sealing member (3) and the first non-metal frame (2311). In various embodiments, the sealing member (3) may be coupled to the case (12) via an adhesive material (or adhesive material) (not separately illustrated) disposed between the sealing member (3) and the case (12).

[0152] According to various embodiments, the non-metallic frame (231) may include first screw fastening portions (501, 502, 503, 504) (see FIGS. 2, 3, 4, 5, 6, and 7) for screw fastening the non-metallic frame (231) and the rear portion (13) of the case (12). The plurality of screw fastening portions (501, 502, 503, 504) may include screw holes corresponding to screws (not shown separately). In various embodiments, the plurality of screw fastening portions (501, 502, 503, 504) may be included in the first non-metallic frame (231). The plurality of screw fastening portions (501, 502, 503, 504) may be arranged in a rectangular vertex shape with the metal plate (232) (or speaker (21)) interposed therebetween, for example, when viewed from above on the front surface (10A) of the electronic device (1). In various embodiments, the first screw fastening portion (501) and the second screw fastening portion (502) may be positioned on both sides with the first structure (710) of the first non-metal frame (2311) interposed therebetween. The first screw fastening portion (501) and the second screw fastening portion (502) may be arranged in a direction parallel to the y-coordinate axis when viewed from above on the front surface (10A) of the electronic device (1). The third screw fastening portion (503) may be positioned spaced apart from the first screw fastening portion (501) in the positive direction of the x-coordinate axis when viewed from above on the front surface (10A) of the electronic device (1). The fourth screw fastening portion (504) may be positioned spaced apart from the second screw fastening portion (502) in the positive direction of the x-coordinate axis when viewed from above on the front surface (10A) of the electronic device (1). The third screw fastening portion (503) and the fourth screw fastening portion (504) may be arranged in a direction parallel to the y-coordinate axis when viewed from above on the front surface (10A) of the electronic device (1).In various embodiments, the third screw fastening portion (503) may protrude from the first flat portion (721) (see FIG. 2) of the first non-metallic frame (2311) and may be inserted into the first through hole of the second flat portion (731) (see FIG. 3) of the second non-metallic frame (2312). In various embodiments, the fourth screw fastening portion (504) may protrude from the first flat portion (721) (see FIG. 2) of the first non-metallic frame (2311) and may be inserted into the second through hole of the second flat portion (731) (see FIG. 3) of the second non-metallic frame (2312).

[0153] According to various embodiments, when the speaker assembly (2) and the case (12) are screw-fastened through a plurality of screw fastening portions (501, 502, 503, 504), the sealing member (3) can be resiliently positioned between the speaker housing (23) and the case (12). The plurality of screw fastening portions (501, 502, 503, 504) can be positioned so as to substantially evenly press the entire sealing member (3).

[0154] According to various embodiments, the first non-metal frame (2311) may include a first support surface (not shown separately) that supports the sealing member (3). The case (12) may include a second support surface (not shown separately) that supports the sealing member (3). The first and second support surfaces may be disposed on opposite sides with the sealing member (3) interposed therebetween, and may be provided (or formed) in an annular shape along the sealing member (3). In various embodiments, the sealing member (3) may have a constant thickness or a constant cross-sectional shape along the annular shape, and the first support surface of the first non-metal frame (2311) and the second support surface of the case (12) may be implemented so as to substantially evenly press the entire sealing member (3).

[0155] According to various embodiments, the sealing member (3) is arranged in an annular (or loop-shaped) shape surrounding both the first opening (2301) and the second opening (2302) of the speaker housing (23) between the speaker housing (23) and the case (12), which may be advantageous for expanding the sound wave passage (9) while allowing the combination of the speaker assembly (2) and the case (12) to have a slim structure. The expanding volume of the sound wave passage (9) can reduce the pressure within the sound wave passage (9) by lowering the speed of sound, thereby reducing the pressure difference between the inside of the sound wave passage (9) and the outside of the sound wave passage (9), thereby reducing the occurrence of unwanted vibrations.

[0156] According to various embodiments, the speaker assembly (2) may include a sound-transmitting member (24) (see FIGS. 2, 4, 5, and 8). The sound-transmitting member (24) may be disposed on a first structure (710) of a first non-metallic frame (2311). The sound-transmitting member (24) may be supported by a first portion (711), a second portion (712), a third portion (713), and a fourth portion (714) of the first structure (710). A fifth portion (715) and a sixth portion (716) of the first structure (71) may support the sound-transmitting member (24). Sound waves generated by the speaker (21) may be output outside the electronic device (1) through the sound-transmitting member (24). The sound-permeable member (24) may include, but is not limited to, a porous member or a mesh member, for example. The sound-permeable member (24) can reduce or prevent external foreign substances, such as dust or moisture, from entering the interior of the speaker assembly (2) through the first opening (2301).

[0157] According to various embodiments, the sound-permeable member (24) may be coupled to the first structure (71) via an adhesive material (or bonding material) (not shown separately) disposed between the sound-permeable member (24) and the first structure (710) of the first non-metallic frame (2311).

[0158] According to various embodiments, the case (12) may include a support (e.g., a protrusion) (85) (see FIG. 8) configured to support the sound-transmitting member (24). For example, a portion of the sound-transmitting member (24) may be disposed between the second portion (712) of the first non-metallic frame (2311) and the support portion (85) of the case (12). The second portion (712) of the first non-metallic frame (2311) and the support portion (85) of the case (12) may restrict movement of a portion of the sound-transmitting member (24). The support portion (85) may reduce or prevent the sound-transmitting member (24) from being pushed by an external force.

[0159] According to various embodiments, the sound-transmitting member (24) being supported by the first portion (711), the second portion (712), the third portion (713), and the fourth portion (714) of the first structure (710) of the first non-metallic frame (2311) may be understood as arranging the sound-transmitting member (24) within the first opening (2301). Arranging the sound-transmitting member (24) within the first opening (2301) may reduce the length of the sound passage (9), thereby reducing or preventing acoustic loss, compared to an example (not shown) of arranging the sound-transmitting member between the first structure (710) of the first non-metallic frame (2311) and the case (12). Placing the sound-transmitting member (24) within the first opening (2301) can reduce the bending portion of the sound passage (9) and improve straightening, compared to an example (not separately illustrated) of arranging the sound-transmitting member between the first structure (710) of the first non-metallic frame (2311) and the case (12). Placing the sound-transmitting member (24) within the first opening (2301) can reduce the bending portion of the sound passage (9) and improve straightening, compared to an example (not separately illustrated) of arranging the sound-transmitting member between the first structure (710) of the first non-metallic frame (2311) and the case (12). Straightening the sound passage (9) can not only reduce sound loss, but also facilitate the discharge of moisture that has entered the interior of the speaker assembly (2) to the outside of the speaker assembly (2).

[0160] According to various embodiments, placing the sound-permeable member (24) within the first opening (2301) can expand the volume of the sound passage (9) (e.g., width in the direction toward the front (10A) or the rear (10B) of the electronic device (1)) compared to an example (not separately illustrated) of placing the sound-permeable member between the first structure (710) of the first non-metallic frame (2311) and the case (12). The expansion of the volume of the sound passage (9) can reduce the pressure within the sound passage (9) by lowering the speed of sound, thereby reducing the pressure difference between the inside of the sound passage (9) and the outside of the sound passage (9), thereby reducing the occurrence of unwanted vibrations.

[0161] According to various embodiments, the speaker assembly (2) may include a resonance space (or an enclosure providing a resonance space) (86) (see FIG. 8) for the speaker (21). The resonance space (86) is configured to improve the quality of sound waves output through the speaker (21). The resonance space (86) may, for example, enrich mid-bass sounds. In various embodiments, the resonance space (86) may be separated from the sound wave passage (9). In various embodiments, the resonance space (86) may be provided (or formed) by a combination of a first non-metallic frame (2311) and a second non-metallic frame (2312). In various embodiments, the metal plate (232) may provide (or form) a portion of an inner wall (or inner surface) that defines (or forms) the resonance space (e.g., the resonance space (86) of FIG. 8).

[0162] According to various embodiments, the speaker assembly (2) may include an air permeable member (25) (see FIGS. 3 and 7). The air permeable member (25) may be disposed in a fourth opening (2304) (see FIGS. 2, 3, and 7) provided (or formed) in the speaker housing (23). The fourth opening (2304) may be an air vent that allows air to flow between the interior of the speaker assembly (2) and the exterior of the speaker assembly (2). In various embodiments, the fourth opening (2304) may be formed in the second flat portion (731) (see FIG. 2) of the second non-metallic frame (2312), but is not limited thereto. Air may flow through the air permeable member (25) disposed in the fourth opening (2304). The air permeable member (25) can reduce or prevent external foreign substances such as dust or moisture from entering the internal space of the speaker housing (23) through the fourth opening (2304). The air permeable member (25) may include, but is not limited to, a porous member or a mesh member, for example. The fourth opening (2304) (e.g., an air vent) can improve the quality of sound output through the speaker (21). The fourth opening (2304) can enable rich sound transmission through the speaker (21). The fourth opening (2304) can, for example, enrich mid-low range sounds. Although not illustrated separately, the location or number of air vents is not limited to the illustrated example and may vary.

[0163] According to various embodiments, although not shown separately, the speaker assembly and case (12) corresponding to the first speaker hole (SH1) (see FIG. 1) may be implemented in a manner substantially identical to or at least partially similar to the speaker assembly (2) and case (12) corresponding to the second speaker hole (SH2).

[0164] According to various embodiments, although not shown separately, the speaker assembly and case (12) corresponding to the third speaker hole (SH3) (see FIG. 1) may be implemented in a manner substantially identical to or at least partially similar to the speaker assembly (2) and case (12) corresponding to the second speaker hole (SH2).

[0165] According to various embodiments, although not shown separately, the speaker assembly and case (12) corresponding to the fourth speaker hole (SH4) (see FIG. 1) may be implemented in a manner substantially identical to or at least partially similar to the speaker assembly (2) and case (12) corresponding to the second speaker hole (SH2).

[0166] FIG. 10 is a perspective view of a sealing member (3) according to various embodiments of the present disclosure.

[0167] FIG. 11 is a perspective view of a portion of a case (12) according to various embodiments of the present disclosure.

[0168] It is understood that the present disclosure encompasses and includes all combinations of the features and / or embodiments disclosed with respect to FIGS. 9, 10, and 11. All combinations of the features described below with respect to FIGS. 9, 10, and 11 may be considered to be encompassed by the present disclosure as specific examples.

[0169] Referring to FIG. 10, the sealing member (3) may include a plurality of bending portions (1001, 1002, 1003, 1004, 1005, 1006). The plurality of bending portions (1001, 1002, 1003, 1004, 1005, 1006) may be formed in a smooth curved shape. The formation of the plurality of bending portions (1001, 1002, 1003, 1004, 1005, 1006) in a smooth curved shape can improve the stability of the sealing member (3) between the speaker assembly (2) (see FIG. 2) and the case (12) while forming a sealing property between the speaker assembly (2) (see FIG. 2) and the case (12) compared to a bending portion having a bent shape.

[0170] Referring to FIG. 11, the case (12) may include an annular recess (1100) in which a sealing member (3) may be placed. When the speaker assembly (2) (see FIG. 2) is coupled to the case (12), the recess (1100) may improve the stability of the sealing member (3) between the speaker assembly (2) (see FIG. 2) and the case (12) while forming a sealing between the speaker assembly (2) (see FIG. 2) and the case (12).

[0171] FIG. 12 is a cross-sectional view of a portion of an electronic device (1) taken along line AA' of FIG. 7 according to various embodiments of the present disclosure.

[0172] It is understood that the present disclosure encompasses and includes all combinations of the features and / or embodiments disclosed in connection with FIG. 12. All combinations of the features described below in connection with FIG. 12 may be considered to be encompassed by the present disclosure as specific examples.

[0173] Referring to FIG. 12, the electronic device (1) may include a first non-metal frame (2311), a case (12), and a sealing member (3) disposed between the first non-metal frame (2311) and the case (12).

[0174] According to various embodiments, the sealing member (3) can be coupled to the first non-metal frame (2311) via an adhesive material (or bonding material) (1210) disposed between the sealing member (3) and the first non-metal frame (2311). When the speaker assembly (2) (see FIG. 2) with the sealing member (3) attached to the first non-metal frame (2311) is coupled to the case (12), the sealing member (3) can be resiliently disposed between the speaker assembly (2) and the case (12).

[0175] According to various embodiments, the case (12) may include a protrusion (1220), and the sealing member (3) may include a recess (or groove) (1230) corresponding to the protrusion (1220). The protrusion (1220) of the case (12) and the recess (1230) of the sealing member (3) may be arranged in an annular shape. When the speaker assembly (2) (see FIG. 2) in which the sealing member (3) is attached to the first non-metallic frame (2311) is coupled to the case (12), the protrusion (1220) of the case (12) may be inserted into the recess (1230) of the sealing member (3). The protrusion (1200) and the recess (1230) can improve the sealing member (3) being placed between the first non-metal frame (2311) and the case (12) while forming a sealing between the first non-metal frame (2311) and the case (12).

[0176] FIG. 13 is a perspective view of a sound-permeable member (24) according to various embodiments of the present disclosure.

[0177] FIG. 14 is a perspective view of a portion of an electronic device (1) according to various embodiments of the present disclosure.

[0178] FIG. 15 is a perspective view of a portion of an electronic device (1) according to various embodiments of the present disclosure.

[0179] FIG. 16 is a cross-sectional view of a portion of an electronic device (1) taken along line AA' of FIG. 7 according to various embodiments of the present disclosure.

[0180] It is understood that the present disclosure encompasses and includes all combinations of the features and / or embodiments disclosed in connection with FIGS. 13, 14, 15, and 16. All combinations of the features described below in connection with FIGS. 13, 14, 15, and 16 may be considered to be encompassed by the present disclosure as specific examples.

[0181] Referring to FIGS. 13, 14, 15, and 16, the electronic device (1) may include a front plate (11) and a case (12). The electronic device (1) may include a display module (101). The electronic device (1) may include a speaker (21), an electrical connection member (22), a first non-metal frame (2311), a second non-metal frame (2312), and a metal plate (232). The electronic device (1) may include a sound-permeable member (24). The electronic device (1) may include a sealing member (3). The description given above with reference to the drawings for at least one component may not be repeated.

[0182] According to various embodiments, the first non-metallic frame (2311) may include a first portion (711), a third portion (713), and a fourth portion (714). The first non-metallic frame (2311) may include a fifth portion (715) and / or a sixth portion (716). The first non-metallic frame (2311) may include a first screw fastening portion (501) and / or a second screw fastening portion (502). In various embodiments, the first non-metallic frame (2311) may omit the second portion (712) of the embodiments of FIGS. 4 and 5, and may include a guide (1400) configured to allow the sound-transmitting member (24) to be inserted therein.

[0183] According to various embodiments, the sound-transmitting member (24) may include a sound-transmitting element (241) and a support member (242). The sound-transmitting element (241) may be formed of, for example, a porous material or a mesh, but is not limited thereto. The sound-transmitting element (241) may be coupled to the support member (242), and the support member (242) may support the sound-transmitting element (241).

[0184] According to various embodiments, the support member (242) may include a rim (2421) surrounding a perimeter of the acoustically transparent element (241), and one or more supports (2422, 2423) disposed across an opening of the rim (2421). The rim (2421) may be, for example, a rectangular rim. The support member (242) may include one or more openings between the rim (2421) and the one or more supports (2422, 2423). The acoustically transparent element (241) may be coupled to the support member (242) so as to be disposed in the one or more openings.

[0185] According to various embodiments, the support member (242) can be formed through molding. The support member (242) can be coupled to the sound-permeable element (241), for example, through insert injection molding. The support member (242) coupled to the sound-permeable element (241) can be formed by positioning the sound-permeable element (241) inside a mold, injecting a molding liquid (e.g., molten resin) of a non-metal (e.g., polymer) into the mold, cooling the injected molding liquid, and taking out the molded product from the mold.

[0186] According to various embodiments, the sound-permeable member (24) can be inserted into the guide (1400) of the first non-metallic frame (2311). In various embodiments, the fifth portion (715) and the sixth portion (716) of the first non-metallic frame (2311) can support one or more supports (2422, 2423) of the sound-permeable member (24).

[0187] According to various embodiments, a portion (24211) of a rim (2421) included in a support member (242) of a sound-permeable member (24) can be a boundary between a first opening (2301) and a second opening (2302), such as the second portion (712) of the embodiments of FIGS. 4 and 5. A portion (24211) of a rim (2421) can be a boundary between a first sealing portion (31) (see FIGS. 4, 5, and 6) and a second sealing portion (32) (see FIGS. 4, 5, and 6) of a sealing member (3), such as the second portion (712) of the embodiments of FIGS. 4 and 5.

[0188] According to various embodiments, a portion (24211) of the rim (2421) may be inserted into a groove or recess formed in the case (12) to reduce or prevent sound waves generated from the speaker (21) from leaking between the portion (24211) of the rim (242) and the case (12).

[0189] FIG. 17 is a cross-sectional view of a portion of an electronic device (1) taken along line AA' of FIG. 7 according to various embodiments of the present disclosure.

[0190] It is understood that the present disclosure encompasses and includes all combinations of the features and / or embodiments disclosed in connection with FIG. 17. All combinations of the features described below in connection with FIG. 17 may be considered to be encompassed by the present disclosure as specific examples.

[0191] Referring to FIG. 17, the electronic device (1) may include a front plate (11) and a case (12). The electronic device (1) may include a display module (101). The electronic device (1) may include a speaker (21), an electrical connection member (22), a first non-metal frame (2311), a second non-metal frame (2312), and a metal plate (232). The electronic device (1) may include a sound-permeable member (24). The electronic device (1) may include a sealing member (3). The description given above with reference to the drawings for at least one component may not be repeated.

[0192] According to various embodiments, the example of FIG. 17 may be such that, compared to the example of FIG. 8, the first part (711) of the first non-metal frame (2311) is reduced in a direction parallel to the x-coordinate axis, thereby reducing the length of the sound wave passage (9).

[0193] According to various embodiments, although not separately illustrated, the technical features of the present disclosure may be applied to electronic devices of other external shapes (e.g., a bar type electronic device, a foldable electronic device, a slidable electronic device, a stretchable electronic device, or a rollable electronic device) that are not limited to a plate type electronic device (1). In various embodiments, although not separately illustrated, the technical features of the present disclosure may be applied to a laptop (also referred to as a laptop computer) (e.g., a laptop-type foldable electronic device). In various embodiments, although not separately illustrated, the technical features of the present disclosure may be applied to an electronic device including a flexible display. For example, a foldable electronic device, a slidable electronic device, a stretchable electronic device, or a rollable electronic device may include a flexible display configured to be bent and arranged according to a deformation state of the electronic device. In various embodiments, although not specifically illustrated, the technical features of the present disclosure may be applied to wearable electronic devices. The types of electronic devices that incorporate the technical features of the present disclosure may also vary.

[0194] According to various embodiments, an electronic device including the technical features of the present disclosure may include a first housing and a second housing. For example, in a foldable electronic device, the first housing and the second housing may be rotatably connected via a hinge portion (also referred to as a hinge assembly) including at least one hinge. For example, in a slideable electronic device, a stretchable electronic device, or a rollable electronic device, the first housing and the second housing may be slidably arranged relative to each other. One of the plurality of speaker assemblies may be positioned in the first housing, and another of the plurality of speaker assemblies may be positioned in the second housing.

[0195] According to various embodiments of the present disclosure, an electronic device (e.g., electronic device (1)) includes a housing (e.g., housing (10)), a speaker (e.g., speaker (21)), a speaker housing (e.g., speaker housing (23)), and a sealing member (e.g., sealing member (3)). The housing includes a speaker hole (e.g., second speaker hole (SH2)). The speaker housing is positioned within the housing and at least partially surrounds the speaker. The speaker housing includes a first opening (e.g., first opening (2301)) configured to be connected to the speaker hole. The speaker housing includes a second opening (e.g., second opening (2302)) facing a diaphragm (e.g., diaphragm (83)) of the speaker. The sealing member is disposed between the housing and the speaker housing so as to surround both the first opening and the second opening of the speaker housing.

[0196] According to various embodiments of the present disclosure, a housing (e.g., housing (10)) may form a portion of a sound wave passage (e.g., sound wave passage (9)) extending from a speaker (e.g., speaker (21)) to a first opening (e.g., first opening (2301)) of the speaker housing through a second opening (e.g., second opening (2302)) of the speaker housing (e.g., speaker housing (23)).

[0197] According to various embodiments of the present disclosure, a portion of the housing (10) forming a portion of the sound wave passage (9) may include a recess.

[0198] According to various embodiments of the present disclosure, a portion of the housing (10) forming a portion of the sound wave passage (9) may be configured to be inserted into a second opening (2302) of the speaker housing (10).

[0199] According to various embodiments of the present disclosure, the electronic device (1) may further include a sound-permeable member (24) positioned within a first opening (2301) of the speaker housing (23).

[0200] According to various embodiments of the present disclosure, the speaker housing (23) may include a boundary (e.g., a second portion (712)) between a first opening (2301) and a second opening (2302). The boundary may be configured to support a sound-permeable member (24).

[0201] According to various embodiments of the present disclosure, the housing (10) may include a protrusion (e.g., a support portion (85)) corresponding to a boundary portion (e.g., a second portion (712)). A portion of the sound-permeable member (24) may be disposed between the boundary portion of the speaker housing (23) and the protrusion of the housing (10).

[0202] According to various embodiments of the present disclosure, the speaker housing (23) may include a boundary (e.g., a second portion (712)) between a first opening (2301) and a second opening (2302). The boundary may be configured to be supported by the housing (10).

[0203] According to various embodiments of the present disclosure, the sealing member (3) may include a first sealing portion (31) and a second sealing portion (32) based on a boundary portion (e.g., a second portion (712)) of the speaker housing (23). The first sealing portion (31) and the boundary portion may form an annular shape surrounding a first opening (2301) between the housing (10) and the speaker housing (23). The second sealing portion (32) and the boundary portion may form an annular shape surrounding a second opening (2302) between the housing (10) and the speaker housing (23).

[0204] According to various embodiments of the present disclosure, the first sealing portion (31) and the second sealing portion (32) may be disposed flatly between the housing (10) and the speaker housing (23). The first sealing portion (31) and the second sealing portion (32) may form an obtuse angle.

[0205] According to various embodiments of the present disclosure, the speaker housing (23) may further include a third opening (2303) and a metal plate (232) of magnetic shielding material disposed in the third opening (2303). The speaker (21) may be positioned between the second opening (2302) and the third opening (2303).

[0206] According to various embodiments of the present disclosure, the housing (10) may include a rear portion (13) forming at least a portion of the rear portion (10B) of the electronic device (1), and a side portion (14) forming at least a portion of the side portion (10C) of the electronic device (1). A speaker hole (e.g., a second speaker hole (SH2)) may be formed in the side portion (14). The rear portion (13) of the housing (10) may face the diaphragm (83) of the speaker (21) through the second opening (2302) of the speaker housing (23). The rear portion (13) of the housing (10) may form a portion of a sound wave passage (9) extending from the speaker (21) to the first opening (2301) of the speaker housing (10) through the second opening (2302) of the speaker housing (23).

[0207] According to various embodiments of the present disclosure, the speaker housing (23) may include a non-metallic frame (231) forming a first opening (2301) and a second opening (2302). The rear portion (13) of the housing (10) may include a metal portion that at least partially forms a portion of the sound wave passage (9).

[0208] According to various embodiments of the present disclosure, a sealing member (3) may be attached to a speaker housing (23). The housing (10) may include an annular recess (1100) configured to support the sealing member (3).

[0209] According to various embodiments of the present disclosure, the sealing member (3) may be attached to the speaker housing (23). The housing (10) may include a protrusion (1220) configured to be inserted into an annular recess (1230) formed in the sealing member (3).

[0210] The embodiments disclosed in this disclosure and the drawings are merely examples to more easily explain the technical content and to help understand the present disclosure, and are not intended to limit the scope of the present disclosure. Therefore, it should be understood that the scope of the various embodiments of the present disclosure includes various modifications or variations in addition to the embodiments disclosed herein. Additionally, it should be understood that any embodiment(s) described herein can be used in conjunction with any other embodiment(s) described herein. For example, although the present disclosure is presented in a form that provides multiple embodiments each defining multiple features, it is emphasized that some of these embodiments may be connected only by reference to the same drawing or drawings. The present disclosure should be understood to include all combinations of these embodiments, unless there is an apparent contradiction between two (or more) embodiments. For example, if features are presented as optional in the present disclosure, all combinations of such optional features are included in the present disclosure.

Claims

In an electronic device (1), Housing (10) including speaker hole (SH2); Speaker (21); A speaker housing (23) positioned within the housing (10) and at least partially surrounding the speaker (21), A first opening (2301) configured to be connected to the above speaker hole (SH2), and A speaker housing (23) including a second opening (2302) facing the diaphragm (83) of the speaker (21); and An electronic device comprising a sealing member (3) disposed between the speaker housing (23) and the housing (10) so as to surround both the first opening (2301) and the second opening (2302) of the speaker housing (23). In the first paragraph, An electronic device in which the housing (10) forms a part of a sound wave passage (9) extending from the speaker (21) to the first opening (2301) of the speaker housing (10) through the second opening (2302) of the speaker housing (23). In the second paragraph, An electronic device in which a portion of the housing (10) forming a portion of the sound wave passage (9) includes a recess. In the second paragraph, An electronic device in which a portion of the housing (10) forming a portion of the sound wave passage (9) is configured to be inserted into the second opening (2302) of the speaker housing (10). In the first paragraph, An electronic device further comprising a sound-permeable member (24) positioned within the first opening (2301) of the speaker housing (23). In paragraph 5, The above speaker housing (23) includes a boundary (712) between the first opening (2301) and the second opening (2302), The above boundary portion (712) is an electronic device configured to support the sound wave permeable member (24). In paragraph 6, The above housing (10) includes a protrusion (85) corresponding to the boundary (712), and An electronic device in which a portion of the sound wave permeable member (24) is disposed between the boundary portion (712) of the speaker housing (23) and the protrusion (85) of the housing (10). In the first paragraph, The above speaker housing (23) includes a boundary (712) between the first opening (2301) and the second opening (2302), An electronic device in which the above boundary portion (712) is configured to be supported by the above housing (10). In paragraph 8, The above sealing member (3) includes a first sealing portion (31) and a second sealing portion (32) based on the boundary portion (712) of the speaker housing (23), The first sealing portion (31) and the boundary portion (712) form an annular shape surrounding the first opening (2301) between the housing (10) and the speaker housing (23), and An electronic device in which the second sealing portion (32) and the boundary portion (712) form an annular shape surrounding the second opening (2302) between the housing (10) and the speaker housing (23). In paragraph 9, The first sealing portion (31) and the second sealing portion (32) are placed flat between the housing (10) and the speaker housing (23), and An electronic device in which the first sealing portion (31) and the second sealing portion (32) form an obtuse angle. In the first paragraph, The above speaker housing (23) further includes a third opening (2303), and a metal plate (232) of magnetic shielding material arranged in the third opening (2303), The above speaker (21) is an electronic device located between the second opening (2302) and the third opening (2303). In the first paragraph, The housing (10) includes a rear portion (13) that forms at least a portion of the rear portion (10B) of the electronic device (1), and a side portion (14) that forms at least a portion of the side portion (10C) of the electronic device (1). The above speaker hole (SH2) is formed in the side portion (14), The rear part (13) of the above housing (10) is Facing the diaphragm (83) of the speaker (21) through the second opening (2302) of the speaker housing (23), An electronic device forming a portion of a sound wave passage (9) extending from the speaker (21) to the first opening (2301) of the speaker housing (10) through the second opening (2302) of the speaker housing (23). In paragraph 12, The above speaker housing (23) includes a non-metallic frame (231) forming the first opening (2301) and the second opening (2302), and An electronic device in which the rear portion (13) of the housing (10) includes a metal portion that at least partially forms a portion of the sound wave passage (9). In the first paragraph, The above sealing member (3) is attached to the speaker housing (23), and An electronic device in which the housing (10) includes an annular recess (1100) configured to support the sealing member (3). In the first paragraph, The above sealing member (3) is attached to the speaker housing (23), and An electronic device in which the housing (10) includes a protrusion (1220) configured to be inserted into an annular recess (1230) formed in the sealing member (3).

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