Vehicle-mounted power supply apparatus, powertrain, and electric vehicle

Abstract

The present application provides a vehicle-mounted power supply apparatus, a powertrain, and an electric vehicle. The vehicle-mounted power supply apparatus comprises a housing, a radiator, and a circuit board. An accommodating cavity of the housing is used for accommodating the radiator, the circuit board, and a thermally conductive liquid. The circuit board is used for supporting a power conversion assembly. The power conversion assembly comprises a plurality of power transistors and at least one magnetic device. A cover plate, the radiator, the plurality of power transistors, the circuit board, and the at least one magnetic device are sequentially stacked in a first direction. The at least one magnetic device, the circuit board, the plurality of power transistors, and at least part of the radiator are immersed in the thermally conductive liquid. Along the first direction, the distance between the liquid level of the thermally conductive liquid and the bottom of a recess-shaped bottom housing is greater than the distance between the radiator and the bottom of the recess-shaped bottom housing. The radiator is at least partially immersed in the thermally conductive liquid and can directly absorb heat from the thermally conductive liquid, thereby accelerating the vertical circulation of the thermally conductive liquid. In addition, power transistors that generate larger amounts of heat are arranged adjacent to the radiator, improving the uniformity of heat dissipation of the vehicle-mounted power supply apparatus and enhancing cooling efficiency.

Description

Onboard power supply unit, powertrain and electric vehicle

[0001] This application claims priority to Chinese Patent Application No. 202411215954.4, filed on August 30, 2024, entitled "On-board power supply device, powertrain and electric vehicle", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of electric vehicle technology, and in particular to an on-board power supply device, powertrain, and electric vehicle. Background Technology

[0003] On-board chargers include multiple electrical components such as inductors, power transistors, fuses, and magnetic devices. These components generate significant heat during operation, requiring heat dissipation to maintain normal operation. Connecting the electrical components to the charger's housing using thermal gel or thermal pads, allowing the components to absorb heat through the housing, restricts the layout of the components within the housing, resulting in a dispersed arrangement that hinders miniaturization of the on-board power supply. Another method, using cooling channels at the bottom of the housing and immersing the electrical components in a cooling solution, suffers from limitations. Due to the thermal expansion and contraction properties of the cooling fluid, when the fluid temperature is high, it tends to flow to the top of the housing, hindering the cooling channels at the bottom from effectively dissipating heat. Furthermore, since power transistors are typically located near the top of the housing and generate significant heat, cooling channels at the bottom cannot meet their specific heat dissipation requirements, resulting in low cooling efficiency for the on-board charger. Summary of the Invention

[0004] This application provides an on-board power supply device, a powertrain, and an electric vehicle.

[0005] In a first aspect, this application provides an on-board power supply device for charging and discharging the power battery of an electric vehicle. The on-board power supply device includes a housing, a radiator, and a circuit board. The housing includes a grooved bottom shell and a cover plate. The grooved bottom shell and the cover plate are stacked along a first direction to form a receiving cavity. The receiving cavity is used to accommodate a radiator, a circuit board, and a heat-conducting fluid. The circuit board is used to carry a power conversion component for realizing power conversion. The power conversion component includes multiple power transistors and at least one magnetic device. The cover plate, the radiator, the multiple power transistors, the circuit board, and the at least one magnetic device are stacked sequentially along the first direction. The at least one magnetic device, the circuit board, the multiple power transistors, and at least a portion of the radiator are immersed in the heat-conducting fluid. The distance between the surface of the heat-conducting fluid and the bottom of the grooved bottom shell along the first direction is greater than the distance between the radiator and the bottom of the grooved bottom shell.

[0006] In this embodiment, the magnetic device, power transistor, and heat sink are stacked sequentially from bottom to top along a first direction. The heat-conducting fluid immerses the magnetic device, power transistor, and at least a portion of the heat sink, allowing the heat generated by the magnetic device and power transistor to be conducted to the heat sink via the heat-conducting fluid. The heat is then carried away by the coolant flowing within the heat sink, thereby achieving cooling. The fact that at least a portion of the heat sink is immersed in the heat-conducting fluid allows the heat sink to directly absorb the heat from the fluid, which is beneficial for improving the cooling efficiency of the vehicle power supply device.

[0007] In this embodiment, the heat sink and multiple power transistors are stacked along the first direction, bringing the power transistors with higher heat generation closer to the heat sink. This allows the heat sink to quickly absorb the heat from the power transistors through the heat-conducting fluid, improving the heat dissipation uniformity of the upper and lower parts inside the vehicle power supply device.

[0008] In this embodiment, based on the principle of thermal expansion and contraction, the heat-conducting fluid absorbs heat and flows upward along the first direction. By placing the radiator at the top, when the heat-conducting fluid expands and flows upward, the heat-conducting fluid at the top, which has a higher temperature, can be quickly cooled by the radiator, causing the heat-conducting fluid to sink. This accelerates the upward and downward convection speed of the heat-conducting fluid, making the heat dissipation and cooling effect of the vehicle power supply device uniform.

[0009] In this embodiment, the distance between the surface of the heat-conducting fluid along the first direction and the bottom of the trough-shaped bottom shell is greater than the distance between the radiator and the bottom of the trough-shaped bottom shell, so that the radiator can be at least partially immersed in the heat-conducting fluid. This allows the radiator to directly and partially absorb heat from the heat-conducting fluid, and the coolant inside the radiator quickly removes the heat from the heat-conducting fluid, thereby accelerating the heat dissipation rate of the heat-conducting fluid on the power transistor, magnetic components, and circuit board. This achieves uniform heat dissipation of the upper and lower heat-generating components of the vehicle power supply device and improves the cooling efficiency of the vehicle power supply device.

[0010] In one embodiment, the distance between the surface of the heat-conducting fluid along the first direction and a cover plate is less than the distance between a radiator and a cover plate.

[0011] In this embodiment, the distance between the liquid surface of the heat-conducting fluid and the cover plate along the first direction is smaller than the distance between the radiator and the cover plate, so that the heat-conducting fluid can completely cover the radiator. Each surface of the radiator shell can directly contact the heat-conducting fluid, increasing the heat dissipation area of ​​the radiator and the heat-conducting fluid. This makes it easier for the radiator to absorb the heat from the heat-conducting fluid with a higher temperature near the upper part of the receiving cavity along the first direction, accelerating the vertical convection of the heat-conducting fluid, improving the heat conduction efficiency of the radiator to the heat-conducting fluid, improving the heat dissipation uniformity of the upper and lower heating components of the vehicle power supply device, and thus improving the cooling efficiency of the vehicle power supply device.

[0012] In one embodiment, the distance between a circuit board and the surface of the heat-conducting liquid along the first direction is less than the distance between a circuit board and the bottom of a groove-shaped bottom shell.

[0013] In this embodiment, the distance between the circuit board and the surface of the heat-conducting liquid along the first direction is smaller than the distance between the circuit board and the bottom of the groove-shaped base shell. The larger distance between the circuit board and the bottom of the groove-shaped base shell allows for a larger space in the cavity below the circuit board along the first direction to accommodate the heat-conducting liquid and magnetic components. This results in a larger amount of heat-conducting liquid below the circuit board, enabling the heat-conducting liquid to quickly conduct heat from the magnetic components upwards, accelerating the transfer of heat generated by the magnetic components below to the heat sink, thereby increasing the convection rate of the heat-conducting liquid. The circuit board is used to fix multiple power transistors. The heat sink, multiple power transistors, and the circuit board are stacked sequentially along the first direction, with at least a portion of the heat sink immersed in the heat-conducting liquid. The smaller distance between the circuit board and the surface of the heat-conducting liquid along the first direction allows the power transistors to be positioned closer to the heat sink, facilitating faster absorption of heat conducted from the power transistors into the heat-conducting liquid by the heat sink, thus accelerating heat dissipation from the power transistors. The smaller distance between the circuit board and the surface of the heat-conducting liquid along the first direction compared to the distance between the circuit board and the bottom of the groove-shaped base shell allows for more uniform heat dissipation from the power transistors above and the magnetic components below along the first direction in the heat-conducting liquid.

[0014] In one embodiment, a circuit board includes a plurality of through holes extending through the circuit board along a first direction. Each through hole is used to allow heat transfer fluid to flow from one side of the circuit board to the other side. The minimum distance between a through hole and a power transistor along a direction perpendicular to the first direction is less than the length of the power transistor.

[0015] In this embodiment, multiple through holes penetrate the circuit board along the first direction, allowing the heat-conducting liquid on the upper and lower sides of the circuit board to convect through the through holes, thereby accelerating heat dissipation and achieving uniform heat dissipation of the vehicle power supply device. By opening multiple through holes on the circuit board, more positions are created where the heat-conducting liquid can convect vertically on both sides of the circuit board, thus improving the cooling efficiency of the vehicle power supply device.

[0016] In this embodiment, the minimum distance between the through hole and the power tube in the direction perpendicular to the first direction is less than the length of the power tube. The through hole is set close to the power tube so that the heat transfer fluid flowing out of the through hole can agitate the heat transfer fluid around the power tube, so that the heat transfer fluid that absorbs a large amount of heat from the power tube can convect and circulate more quickly, thereby accelerating the heat transfer effect, which is beneficial to the heat dissipation of the power tube and thus improving the cooling efficiency of the vehicle power supply device.

[0017] In one embodiment, at least a portion of the through-hole is stacked with a magnetic device along a first direction.

[0018] In this embodiment, at least a portion of the through-holes are stacked with the magnetic device along the first direction. Stacking the through-holes with the magnetic device allows the heat-conducting liquid to flow through the through-holes, thereby agitating the heat-conducting liquid filling the magnetic device and accelerating the flow speed of the heat-conducting liquid inside the magnetic device. This allows the heat of the heat-conducting liquid inside the magnetic device to be absorbed by the coolant of the radiator in a timely manner, thereby accelerating the heat conduction effect.

[0019] In one embodiment, at least a portion of the via is stacked with a power transistor along a first direction.

[0020] In this embodiment, at least a portion of the through-hole is stacked with the power transistor along the first direction. The through-hole allows the heat-conducting liquid on the upper and lower sides of the circuit board to convect, thereby agitating the flow of the heat-conducting liquid filling the gap between the power transistor and the circuit board, thus accelerating the heat conduction effect.

[0021] In one embodiment, a heat sink includes a surface facing a circuit board along a first direction. The surface is used to fix a plurality of heat dissipation teeth, which protrude towards the circuit board along the first direction. The plurality of heat dissipation teeth and the surface are immersed in a heat-conducting fluid. The height of at least one heat dissipation tooth along the first direction is less than or equal to the distance between the circuit board and the surface, and the height of at least one heat dissipation tooth along the first direction is greater than or equal to the distance between a power transistor and the surface.

[0022] In this embodiment, the heat sink includes a surface facing the circuit board in a first direction, and a plurality of heat dissipation teeth protruding towards the circuit board in the first direction. The plurality of heat dissipation teeth and the surface are immersed in a heat-conducting liquid. The heat dissipation teeth can increase the heat dissipation area of ​​the heat-conducting liquid, and the heat dissipation teeth can also increase the degree of turbulence between the heat-conducting liquid and the surface of the circuit board and the heat sink, thereby enhancing the heat conduction effect.

[0023] In this embodiment, the height of the heat dissipation teeth along the first direction is less than the distance between the circuit board and the surface, ensuring that both ends of the heat dissipation teeth do not simultaneously contact the circuit board and the heat sink. This allows the heat transfer fluid to flow through the gap between the tooth surface of the heat dissipation teeth and the circuit board, enabling convection of the heat transfer fluid in a direction perpendicular to the first direction, thus enhancing the heat dissipation effect. Furthermore, the fact that the height of the heat dissipation teeth along the first direction is less than the distance between the circuit board and the surface also prevents the heat dissipation teeth from exerting a downward force on the circuit board in the first direction, thus avoiding deformation of the circuit board.

[0024] In this embodiment, the height of the heat dissipation teeth along the first direction is greater than the distance between the power tube and the surface, so that the heat dissipation teeth can extend between the power tubes, thereby enhancing the flow effect of the heat-conducting fluid close to the power tube, and thus accelerating the heat conduction effect of the heat-conducting fluid on the power tube, thereby improving the cooling efficiency of the vehicle power supply device.

[0025] In one embodiment, the minimum distance between a heat dissipation fin and a power transistor along a direction perpendicular to the first direction is less than the length of the power transistor.

[0026] In this embodiment, the minimum distance between the heat dissipation teeth and the power tube in the direction perpendicular to the first direction is less than the length of the power tube. The heat of the heat-conducting liquid near the heat dissipation teeth can be better absorbed by the heat dissipation teeth. The heat dissipation teeth are set close to the power tube, which allows the heat dissipation teeth to absorb the heat generated by the power tube faster and in a shorter distance, thereby accelerating the heat conduction effect and improving the cooling efficiency of the vehicle power supply device.

[0027] In one embodiment, a magnetic device includes a magnetic core and a metal winding, wherein the magnetic core is used to wind the metal winding. The magnetic core includes a core hole for the flow of a heat-conducting fluid, and the core hole extends through the magnetic core along a first direction.

[0028] In this embodiment, the magnetic core includes a core hole for the flow of heat-conducting fluid, allowing the heat-conducting fluid to flow through the interior of the magnetic device, thereby increasing the contact area between the heat-conducting fluid and the magnetic device, enhancing the heat exchange effect of the heat-conducting fluid on the magnetic device, and improving the heat dissipation effect of the vehicle power supply device.

[0029] In this embodiment, the magnetic core hole penetrates the magnetic core along the first direction, and the metal winding surrounds the magnetic core hole. This allows the heat transfer fluid to pass through the magnetic core hole of the magnetic device when it flows vertically in the first direction within the grooved bottom shell. The magnetic core hole increases the space for vertical convection of the heat transfer fluid, thereby enhancing the convection of the heat transfer fluid around the metal winding of the magnetic device and the heat transfer efficiency of the heat transfer fluid to the magnetic device, thus improving the cooling efficiency of the vehicle power supply device.

[0030] In one embodiment, a metal winding is wound around a magnetic core multiple times, with a gap between adjacent turns of the metal winding along a first direction for the flow of heat-conducting fluid, and the gap along the first direction is greater than or equal to 0.3 mm.

[0031] In this embodiment, there is a gap between two adjacent turns of metal winding along the first direction, which can increase the surface area of ​​the metal winding exposed to the heat-conducting liquid. The gap is used for the flow of heat-conducting liquid, thereby allowing the metal winding of the magnetic device to have a larger contact area with the heat-conducting liquid, which is more conducive to the formation of convective heat transfer between the metal winding and the heat-conducting liquid, accelerating the cooling efficiency of the magnetic device, and thus improving the cooling efficiency of the vehicle power supply device.

[0032] In this embodiment, the gap along the first direction is greater than or equal to 0.3 mm, so that there is enough space between the two metal windings for the heat transfer fluid to flow, allowing the heat transfer fluid to penetrate into the interior of the metal windings, which is beneficial to improving the convective heat transfer effect of the heat transfer fluid and accelerating the cooling efficiency of the magnetic device.

[0033] In one embodiment, a heat sink includes a surface facing a circuit board along a first direction. A gap between at least one power transistor and the surface is used to fill a thermally conductive medium with a thermal conductivity greater than that of a heat-conducting liquid. One surface is used to fix an annular protrusion that protrudes towards the circuit board along the first direction. The annular protrusion surrounds the thermally conductive medium and serves to separate the thermally conductive medium from the heat-conducting liquid. The length of the annular protrusion along the first direction is greater than the length of the gap between the at least one power transistor and the surface.

[0034] In this embodiment, the surface faces the circuit board along the first direction, and the gap between the power transistor and the surface is used to fill the thermally conductive medium. The thermal conductivity of the thermally conductive medium is greater than that of the thermally conductive liquid, so that the heat of the power transistor can be absorbed not only by the thermally conductive liquid but also by the thermally conductive medium, thereby further improving the cooling effect of the power transistor.

[0035] In this embodiment, the annular protrusion protrudes towards the circuit board along the first direction. The annular protrusion is used to surround the heat-conducting medium and to separate the heat-conducting medium and the heat-conducting liquid. In order to avoid the heat-conducting medium and the heat-conducting liquid from dissolving each other, the annular protrusion is used to separate the heat-conducting medium and the heat-conducting liquid, which can extend the service life of the heat-conducting medium and also ensure the heat dissipation effect of the heat-conducting medium on the power tube.

[0036] In this embodiment, the gap between the power transistor and the surface is used to fill the heat-conducting medium. The length of the annular protrusion along the first direction is greater than the length of the gap between the power transistor and the surface, so that the annular protrusion completely surrounds the heat-conducting medium, preventing the heat-conducting medium from contacting the heat-conducting liquid. This avoids the compatibility between the heat-conducting medium and the heat-conducting liquid, extends the service life of the heat-conducting medium, and ensures the heat dissipation effect of the heat-conducting medium on the power transistor.

[0037] Secondly, this application provides a powertrain including an electric motor and an on-board power supply device as described in the first aspect, wherein the power conversion component of the on-board power supply device is also used to supply power to the electric motor.

[0038] In the vehicle-mounted power supply device of this application embodiment, at least a portion of the radiator is immersed in a heat-conducting fluid. The radiator can directly absorb heat from the heat-conducting fluid, which in turn absorbs heat generated by at least one magnetic device, circuit board, and multiple power transistors located below the radiator. The heat-conducting fluid expands and rises upon heating, directly contacting and cooling the radiator. After cooling, the heat-conducting fluid returns below the radiator to absorb heat from the magnetic device, circuit board, and multiple power transistors again, achieving a vertical circulation of the heat-conducting fluid. Furthermore, distributing the power transistors with higher heat generation close to the radiator satisfies the heat dissipation requirements of the high heat generation of the power transistors, ensuring uniform heat dissipation of the heat-generating components above and below the vehicle-mounted power supply device, improving the cooling efficiency of the vehicle-mounted power supply device, and thus improving the heat dissipation performance of the powertrain. Heat dissipation through the heat-conducting fluid and radiator also allows for less restriction on the layout of electrical components within the vehicle-mounted power supply device, enabling a more concentrated arrangement of electrical components, which is beneficial for the miniaturization of the vehicle-mounted power supply device, and consequently, the miniaturization of the powertrain.

[0039] Thirdly, this application provides an electric vehicle, which includes a body, a power battery, and a powertrain as described in the second aspect. The body is used to fix the power battery and the powertrain, and the on-board power supply device of the powertrain is used to charge and discharge the power battery of the electric vehicle.

[0040] The powertrain in this embodiment includes an on-board power supply unit. At least a portion of the radiator in the on-board power supply unit is immersed in a heat-conducting fluid. The radiator directly absorbs heat from the heat-conducting fluid. The heat-conducting fluid absorbs heat generated by at least one magnetic component, circuit board, and multiple power transistors located below the radiator. The heat-conducting fluid expands and rises upon heating, directly contacting the radiator for cooling. After cooling, the heat-conducting fluid returns below the radiator to absorb heat from the magnetic component, circuit board, and multiple power transistors again, achieving a vertical circulation of the heat-conducting fluid. Furthermore, distributing the power transistors with higher heat generation close to the radiator satisfies the heat dissipation requirements of the high-heat-generating power transistors, ensuring uniform heat dissipation of the heat-generating components above and below the on-board power supply unit, improving the cooling efficiency of the on-board power supply unit, and thus improving the heat dissipation performance of the powertrain and the overall vehicle performance. Heat dissipation through the heat-conducting fluid and radiator also allows for less restrictive layout of electrical components within the on-board power supply unit, enabling a more concentrated arrangement of electrical components, which is beneficial for the miniaturization of the on-board power supply unit, and consequently, the miniaturization of the powertrain, optimizing the overall vehicle layout. Attached Figure Description

[0041] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the embodiments of this application will be described below.

[0042] Figure 1 is a schematic diagram of the structure of the electric vehicle provided in an embodiment of this application;

[0043] Figure 2 is a schematic diagram of the powertrain provided in an embodiment of this application;

[0044] Figure 3 is a structural schematic diagram of the vehicle power supply device provided in an embodiment of this application;

[0045] Figure 4 is another structural schematic diagram of the vehicle power supply device provided in an embodiment of this application;

[0046] Figure 5 is a partial enlarged view of part M1 of the vehicle-mounted power supply device in Figure 3;

[0047] Figure 6 is a partial enlarged view of the M2 part of the vehicle power supply device in Figure 3;

[0048] Figure 7 is a partial enlarged view of the M3 part of the vehicle power supply device in Figure 3;

[0049] Figure 8 is a schematic diagram of the structure of the magnetic device provided in an embodiment of this application;

[0050] Figure 9 is another structural schematic diagram of the magnetic device provided in an embodiment of this application;

[0051] Figure 10 is another structural schematic diagram of the vehicle power supply device provided in an embodiment of this application;

[0052] Figure 11 is a structural schematic diagram of an on-board power supply device provided in another embodiment of this application;

[0053] Figure 12 is a partial structural schematic diagram of the shell provided in an embodiment of this application;

[0054] Figure 13 is a structural schematic diagram of an on-board power supply device provided in another embodiment of this application;

[0055] Figure 14 is a structural schematic diagram of an on-board power supply device provided in another embodiment of this application. Detailed Implementation

[0056] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0057] For ease of understanding, the English abbreviations and related technical terms used in the embodiments of this application will be explained and described below.

[0058] DC-DC: DC is an abbreviation for Direct Current. A DC-DC converter is a device that converts a DC power supply of one voltage level to a DC power supply of another voltage level. DC-DC converters are divided into two categories according to the voltage conversion relationship: boost converters and buck converters. For example, the DC-DC converter connected to a vehicle power supply system converts high-voltage DC power to low-voltage DC power.

[0059] Parallelism: This can be understood as basically parallel, not limited to absolute parallelism or a 180-degree angle. Angles less than or greater than 180 degrees that are not absolutely parallel due to factors such as assembly tolerances, design tolerances, and process tolerances are also considered basically parallel.

[0060] Perpendicular: This can be understood as basically perpendicular, not limited to absolutely perpendicular intersections or a 90-degree angle. Intersections that are not absolutely perpendicular, or angles less than or greater than 90 degrees, due to factors such as assembly tolerances, design tolerances, and process tolerances, are also considered basically perpendicular.

[0061] To enhance the convective heat dissipation performance and improve cooling efficiency of the heat transfer fluid in an on-board power supply device, this application provides an on-board power supply device for charging and discharging the power battery of an electric vehicle. The on-board power supply device includes a housing, a radiator, and a circuit board. The housing includes a grooved bottom shell and a cover plate. The grooved bottom shell and the cover plate are stacked along a first direction to form a receiving cavity, which accommodates the radiator, circuit board, and heat transfer fluid. The circuit board carries a power conversion component for power conversion. The power conversion component includes multiple power transistors and at least one magnetic device. The cover plate, radiator, multiple power transistors, circuit board, and at least one magnetic device are stacked sequentially along the first direction. At least one magnetic device, circuit board, multiple power transistors, and at least a portion of the radiator are immersed in the heat transfer fluid. The distance between the surface of the heat transfer fluid and the bottom of the grooved bottom shell along the first direction is greater than the distance between the radiator and the bottom of the grooved bottom shell. At least a portion of the radiator is immersed in the heat transfer fluid, allowing it to directly absorb heat from the fluid. The fluid absorbs heat generated by at least one magnetic component, circuit board, and multiple power transistors located below the radiator. As the fluid heats up, it expands and rises, directly contacting and cooling the radiator. After cooling, the fluid returns to the radiator to absorb heat from the magnetic component, circuit board, and multiple power transistors again, achieving a continuous circulation of the fluid. Furthermore, by distributing power transistors with high heat generation close to the radiator, the heat dissipation requirements of the high-heat-generating power transistors are met, ensuring uniform heat dissipation of the heat-generating components in the vehicle power supply device and improving the cooling efficiency of the device.

[0062] The vehicle power supply device provided in this application embodiment is applied to the powertrain, which is applied to an electric vehicle to improve the overall performance of the electric vehicle.

[0063] Figure 1 is a structural schematic diagram of the electric vehicle 1 provided in an embodiment of this application. Figure 2 is a structural schematic diagram of the powertrain 10 provided in an embodiment of this application.

[0064] In one embodiment, the electric vehicle 1 includes a powertrain 10, a body 20, a power battery 30, and wheels 40. As shown in FIG1, the powertrain 10 and the power battery 30 are fixed to the body 20. The powertrain 10 is used to receive power from the power battery 30 and to drive the wheels 40.

[0065] In this embodiment, electric vehicle 1 refers to a wheeled device driven or towed by a power unit. In this embodiment, power battery 30 can also be referred to as a battery pack or battery. In one embodiment, electric vehicle 1 includes an on-board power supply device 100. The on-board power supply device 100 is electrically connected to the power battery 30. In this embodiment, the on-board power supply device 100 is used to charge and discharge the power battery 30. In one embodiment, the on-board power supply device 100 is used to receive alternating current (AC) and convert it to direct current (DC) to charge the power battery 30. The AC power includes mains power or household AC power. In one embodiment, the on-board power supply device 100 receives high-voltage direct current (DC) and provides DC power to the power battery 30 for charging.

[0066] In one embodiment, the powertrain 10 of the electric vehicle 1 includes an on-board power supply device 100, a motor 200, and a reducer 300.

[0067] In this embodiment, the on-board power supply device 100 is also used to drive the motor 200. As shown in Figures 1 and 2, the on-board power supply device 100 and the motor 200 are electrically connected. The on-board power supply device 100 receives high-voltage direct current (DC) power from the power battery 30 and converts it into high-voltage alternating current (AC) power, which is then supplied to the motor 200 to drive it to rotate. The motor 200 is connected to the reducer 300, and the motor 200 drives the reducer 300 to rotate.

[0068] In this embodiment, the motor 200 includes a motor shaft (not shown), a motor stator (not shown), and a motor rotor (not shown). The reducer 300 includes a gear assembly (not shown), an input shaft (not shown), and an output shaft (not shown). The motor rotor in the motor 200 is fixedly mounted on the motor shaft. The motor stator, upon receiving alternating current, drives the motor rotor to rotate, thereby causing the motor shaft to rotate. The motor shaft of the motor 200 is used for a transmission connection with the input shaft of the reducer 300. The input shaft receives the power transmitted from the motor shaft of the motor 200 and transmits the power to the output shaft via the gear assembly. The output shaft is connected to the wheels, thereby driving the wheels 40 of the electric vehicle 1.

[0069] In one embodiment, the on-board power supply device 100 includes a motor controller and at least one of an on-board charging device, a power distribution device, an energy storage converter, and a DC-DC converter.

[0070] The full name of the motor controller is Motor Control Unit, abbreviated as MCU. In one embodiment, the motor controller is used to receive DC power from the power battery 30 and convert the DC power into AC power to transmit to the stator windings of the motor 200 to drive the motor 200 to run.

[0071] The English name for an on-board charger is On-Board Charger, abbreviated as OBC. In one embodiment, the on-board charger is used to convert AC power from the power grid into DC power or directly transmit DC power to charge the power battery 30 or to supply power to the vehicle's load.

[0072] The English name for an energy storage converter is Power Conversion System, abbreviated as PCS. In one embodiment, the energy storage converter is used to control the charging and discharging process of the power battery 30, performing AC-DC conversion, and can directly supply power to AC loads in the absence of a power grid.

[0073] The English name for a power distribution unit is Power Distribution Unit, abbreviated as PDU. In this embodiment, the power distribution unit is also referred to as a high-voltage distribution box. In one embodiment, the power distribution unit is responsible for the power distribution and management in the high-voltage system of the electric vehicle 1, providing functions such as charging and discharging control, high-voltage component power-on control, circuit overload and short-circuit protection, high-voltage sampling, and low-voltage control for the entire vehicle, protecting and monitoring the operation of the high-voltage system. In one embodiment, the electrical components of the on-board power supply unit 100 generate heat during operation. To ensure the normal operation of the electrical components within the on-board power supply unit 100, cooling and heat dissipation of the electrical components are usually required. These electrical components include power transistors 151, magnetic devices 152, capacitors 153, inductors 154, fuses 155, etc.

[0074] Using thermal interface materials to connect electrical components to the housing of the vehicle power supply unit for heat dissipation restricts the layout of electrical components within the housing, resulting in a dispersed arrangement that hinders the miniaturization of the vehicle power supply unit. Alternatively, cooling water channels are located at the bottom of the housing, and the electrical components are immersed in a heat-conducting liquid within the housing for heat dissipation. When the immersion liquid temperature is high, it expands due to heat and tends to flow to the upper part of the housing. The cooling water channels at the bottom of the housing cannot quickly dissipate heat from the upper heat-conducting liquid, resulting in slow heat dissipation. Furthermore, power transistors are typically located near the upper part of the housing, where they generate a large amount of heat. The water channels at the bottom of the housing cannot meet the specific heat dissipation requirements of the power transistors, leading to uneven overall heat dissipation and low cooling efficiency of the vehicle power supply unit.

[0075] In this embodiment, the heat sink is placed above the slotted housing of the vehicle power supply device. At least part of the heat sink is immersed in the heat transfer fluid. The heat sink can directly absorb the heat in the heat transfer fluid, and the heat transfer fluid can also directly contact the heat sink when it expands and rises due to heat, thereby accelerating the cooling efficiency. The distance between the heat sink and the power tube is small, which can also meet the heat dissipation requirements of the large heat generated by the power tube, realize the heat dissipation uniformity of the upper and lower heat-generating devices of the vehicle power supply device, and improve the cooling efficiency of the vehicle power supply device.

[0076] Figure 3 is a structural schematic diagram of the vehicle power supply device 100 provided in an embodiment of this application.

[0077] In one embodiment, an on-board power supply device 100 includes a housing 110, a heat sink 120, and a circuit board 130, as shown in FIG3. The housing 110 includes a groove-shaped bottom shell 111 and a cover plate 112. The groove-shaped bottom shell 111 and the cover plate 112 are stacked along a first direction Z and form a receiving cavity 113. The receiving cavity 113 is used to accommodate the heat sink 120, the circuit board 130, and the heat-conducting fluid 140. The circuit board 130 is used to carry a power conversion component 150. The power conversion component 150 is used to realize power conversion, including the conversion between AC and DC, the conversion between high voltage DC and low voltage DC, etc. The power conversion component 150 includes a plurality of power transistors 151 and at least one magnetic device 152. In this configuration, the cover plate 112, the heat sink 120, multiple power transistors 151, the circuit board 130, and at least one magnetic device 152 are stacked sequentially along the first direction Z. At least one magnetic device 152, the circuit board 130, multiple power transistors 151, and at least part of the heat sink 120 are immersed in the heat-conducting liquid 140. The distance between the liquid surface of the heat-conducting liquid 140 and the bottom 111a of the trough-shaped bottom shell 111 along the first direction Z is greater than the distance between the heat sink 120 and the bottom 111a of the trough-shaped bottom shell 111.

[0078] In this embodiment, the magnetic device 152, power transistor 151, and heat sink 120 are stacked sequentially from bottom to top along the first direction Z. A heat-conducting fluid 140 immerses the magnetic device 152, power transistor 151, and at least a portion of the heat sink 120, allowing the heat generated by the magnetic device 152 and power transistor 151 to be conducted to the heat sink 120 via the heat-conducting fluid 140. The heat is then carried away by the coolant flowing within the heat sink 120, thereby achieving cooling. The fact that at least a portion of the heat sink 120 is immersed in the heat-conducting fluid 140 allows the heat sink 120 to directly absorb the heat from the heat-conducting fluid 140, which is beneficial for improving the cooling efficiency of the vehicle power supply device 100.

[0079] In this embodiment, the heat sink 120 and multiple power transistors 151 are stacked along the first direction Z, so that the power transistors 151 with larger heat generation are closer to the heat sink 120, so that the heat sink 120 can quickly absorb the heat of the power transistors 151 through the heat transfer fluid 140.

[0080] In this embodiment, according to the principle of thermal expansion and contraction, the heat-conducting fluid 140 absorbs heat and flows upward along the first direction Z. By placing the radiator 120 above, when the heat-conducting fluid 140 expands and flows upward, the heat-conducting fluid 140 at the higher temperature above can be quickly cooled by the radiator 120, causing the heat-conducting fluid 140 to sink, thereby accelerating the upward and downward convection speed of the heat-conducting fluid 140 and making the heat dissipation and cooling effect of the vehicle power supply device 100 uniform.

[0081] In this embodiment of the application, as shown in FIG3, the distance between the liquid surface of the heat-conducting liquid 140 along the first direction Z and the bottom 111a of the tank-shaped bottom shell 111 is denoted as L1, and the distance between the radiator 120 and the bottom 111a of the tank-shaped bottom shell 111 is denoted as L2, where L1 > L2, so that the radiator 120 can be at least partially immersed in the heat-conducting liquid 140, thereby allowing the radiator 120 to directly and partially absorb the heat in the heat-conducting liquid 140. The heat in the heat-conducting liquid 140 is quickly carried away by the coolant in the radiator 120, thereby accelerating the heat dissipation rate of the heat-conducting liquid 140 on the power tube 151, magnetic device 152 and circuit board 130, realizing the heat dissipation uniformity of the upper and lower heat-generating devices of the vehicle power supply device 100, and improving the cooling efficiency of the vehicle power supply device 100.

[0082] Figure 4 is another structural schematic diagram of the vehicle power supply device 100 provided in the embodiment of this application.

[0083] In one embodiment, as shown in FIG4, the distance between the liquid surface of the heat-conducting liquid 140 along the first direction Z and the cover plate 112 is smaller than the distance between the radiator 120 and the cover plate 112.

[0084] In this embodiment, the distance between the liquid surface of the heat-conducting liquid 140 along the first direction Z and the cover plate 112 is denoted as L3, and the distance between the radiator 120 and the cover plate 112 is denoted as L4, where L3 < L4. This allows the heat-conducting liquid 140 to completely cover the radiator 120, and each surface of the housing 110 of the radiator 120 can directly contact the heat-conducting liquid 140. This increases the heat dissipation area of ​​the radiator 120 and the heat-conducting liquid 140, which is more conducive to the radiator 120 absorbing the heat from the heat-conducting liquid 140 with a higher temperature near the upper part of the receiving cavity 113 along the first direction Z. This accelerates the vertical convection of the heat-conducting liquid 140, improves the heat conduction efficiency of the radiator 120 to the heat-conducting liquid 140, improves the heat dissipation uniformity of the upper and lower heating devices of the vehicle power supply device 100, and thus improves the cooling efficiency of the vehicle power supply device 100.

[0085] In one embodiment, as shown in FIG3, the distance between the circuit board 130 and the liquid surface of the heat-conducting liquid 140 along the first direction Z is less than the distance between the circuit board 130 and the bottom 111a of the groove-shaped bottom shell 111.

[0086] In this embodiment, the distance between the circuit board 130 and the surface of the heat-conducting liquid 140 along the first direction Z is denoted as L5, and the distance between the circuit board 130 and the bottom 111a of the groove-shaped bottom shell 111 is denoted as L6. L5 < L6, and L6 is larger, so that the portion of the receiving cavity 113 below the circuit board 130 along the first direction Z has a larger space to accommodate the heat-conducting liquid 140 and the magnetic device 152, so that there is more heat-conducting liquid 140 below the circuit board 130, so that the heat-conducting liquid 140 can quickly conduct the heat of the magnetic device 152 to the top, accelerate the speed at which the heat generated by the magnetic device 152 below is conducted to the heat sink 120, and thus improve the convection rate of the heat-conducting liquid 140. Circuit board 130 is used to fix multiple power transistors 151. Heat sink 120, multiple power transistors 151, and circuit board 130 are stacked sequentially along the first direction Z. At least part of heat sink 120 is immersed in heat-conducting fluid 140. The smaller L5 allows the power transistors 151 to be placed closer to the heat sink 120, which helps the heat sink 120 to absorb the heat conducted from the power transistors 151 to the heat-conducting fluid 140 more quickly, thus accelerating the heat dissipation of the power transistors 151. L5 < L6 allows for more uniform heat dissipation in the heat-conducting fluid 140 between the power transistors 151 above and the magnetic device 152 below along the first direction Z of circuit board 130.

[0087] Figure 5 is a partial enlarged view of the M1 part of the vehicle-mounted power supply device 100 in Figure 3.

[0088] In one embodiment, the circuit board 130 includes a plurality of through holes 131, as shown in FIG3. The plurality of through holes 131 extend through the circuit board 130 along a first direction Z. Each through hole 131 is used to allow heat-conducting fluid 140 to flow from one side of the circuit board 130 to the other side. As shown in FIG5, along a direction X perpendicular to the first direction Z, the minimum distance between a through hole 131 and a power transistor 151 is less than the length of the power transistor 151.

[0089] In this embodiment, multiple through holes 131 penetrate the circuit board 130 along the first direction Z, allowing the heat-conducting liquid 140 on the upper and lower sides of the circuit board 130 to convect through the through holes 131, thereby accelerating heat dissipation and achieving uniform heat dissipation of the vehicle power supply device 100. By opening multiple through holes 131 on the circuit board 130, more positions are provided for the heat-conducting liquid 140 to convect vertically on both sides of the circuit board 130, thus improving the cooling efficiency of the vehicle power supply device 100.

[0090] In this embodiment of the application, as shown in FIG5, the minimum distance between the through hole 131 in the direction perpendicular to the first direction Z and the power tube 151 is denoted as L7, and the length of the power tube 151 is denoted as L8, where L7 < L8. The through hole 131 is set close to the power tube 151 so that the heat-conducting liquid 140 flowing out of the through hole 131 can agitate the heat-conducting liquid 140 around the power tube 151, so that the heat-conducting liquid 140 absorbing a large amount of heat from the power tube 151 can convect and circulate more quickly, thereby accelerating the heat conduction effect, which is beneficial to the heat dissipation of the power tube 151, and thus improving the cooling efficiency of the vehicle power supply device 100.

[0091] Figure 6 is a partial enlarged view of the M2 part of the vehicle-mounted power supply device 100 in Figure 3.

[0092] In one embodiment, as shown in Figures 3 and 6, at least a portion of the through-hole 131 is stacked with the magnetic device 152 along the first direction Z.

[0093] In this embodiment, at least a portion of the through-hole 131 is stacked with the magnetic device 152 along the first direction Z. The stacking of the through-hole 131 and the magnetic device 152 allows the heat-conducting liquid 140 to flow through the through-hole 131, thereby agitating the heat-conducting liquid 140 filled inside the magnetic device 152 and accelerating the flow speed of the heat-conducting liquid 140 inside the magnetic device 152. This allows the heat of the heat-conducting liquid 140 inside the magnetic device 152 to be absorbed by the coolant of the radiator 120 in a timely manner, thereby accelerating the heat conduction effect.

[0094] Wherein, at least a portion of the through-hole 131 and the magnetic device 152 are stacked along the first direction Z, meaning that the area enclosed by at least a portion of the through-hole 131 and the projection of the magnetic device 152 along the first direction Z on the circuit board 130 are at least partially stacked.

[0095] Figure 7 is a partial enlarged view of the M3 part of the vehicle-mounted power supply device 100 in Figure 3.

[0096] In one embodiment, as shown in Figures 3 and 7, at least a portion of the through-hole 131 is stacked with the power transistor 151 along the first direction Z.

[0097] In this embodiment of the application, at least part of the through hole 131 is stacked with the power tube 151 along the first direction Z. The heat conduction liquid 140 on the upper and lower sides of the circuit board 130 is convection through the through hole 131, so that the heat conduction liquid 140 around the through hole 131 can stir the flow of the heat conduction liquid 140 filling the gap between the power tube 151 and the circuit board 130, thereby accelerating the heat conduction effect.

[0098] Wherein, at least part of the through hole 131 and the power transistor 151 are stacked along the first direction Z, meaning that the area enclosed by the through hole 131 at least partially overlaps with the projection of the power transistor 151 on the circuit board 130 along the first direction Z.

[0099] In one embodiment, as shown in FIG7, at least a portion of the through-hole 131 is aligned with at least a portion of the power transistor 151 along the first direction Z.

[0100] In this embodiment of the application, along the first direction Z, at least part of the through hole 131 is aligned with the power tube 151, so that the heat-conducting liquid 140 flowing from the through hole 131 from the lower side of the circuit board 130 to the upper side of the circuit board 130 can directly agitate the heat-conducting liquid 140 close to the power tube 151, thereby accelerating the flow of the heat-conducting liquid 140 around the power tube 151, accelerating the heat conduction effect, and thus improving the cooling efficiency of the vehicle power supply device 100.

[0101] Wherein, at least a portion of the through-hole 131 is aligned with at least a portion of the power transistor 151, meaning that the area enclosed by the through-hole 131 at least partially overlaps with the projection of the power transistor 151 onto the circuit board 130 along the first direction Z.

[0102] In one embodiment, as shown in FIG6, the diameter of at least one through hole 131 is smaller than the distance between the circuit board 130 and the heat sink 120 along the first direction Z.

[0103] In this embodiment, the aperture of the through hole 131 is denoted as L9, and the distance between the circuit board 130 and the heat sink 120 along the first direction Z is denoted as L10, where L9 < L10. This allows the heat-conducting fluid 140 passing through the through hole 131 to flow from both sides of the circuit board 130 and the heat sink 120, which have a larger distance between them, preventing the heat-conducting fluid 140 flowing out of the through hole 131 from returning into the through hole 131. The smaller aperture of the through hole 131 also allows the higher-temperature heat-conducting fluid 140 to pass through the through hole 131 more concentratedly, which is more conducive to forming a larger local temperature difference and increasing the flow rate of the heat-conducting fluid 140 through the through hole 131. This accelerates the heat conduction effect of the heat-conducting fluid 140 around the through hole 131, thereby improving the cooling efficiency of the vehicle power supply device 100.

[0104] In one embodiment, as shown in FIG6, the diameter of at least one through hole 131 is greater than the distance between the circuit board 130 and the heat sink 120 along the first direction Z.

[0105] In this embodiment, the larger diameter of at least one through hole 131 allows for a larger flow rate of the heat-conducting liquid flowing through the through hole 131, which facilitates the convection of the heat-conducting liquid on the upper and lower sides of the circuit board 130 through the through hole 131, thereby accelerating the heat conduction effect of the heat-conducting liquid 140 around the through hole 131 and improving the cooling efficiency of the vehicle power supply device 100.

[0106] In one embodiment, the heat sink 120 includes a surface 121, as shown in FIG3, facing the circuit board 130 along a first direction Z. The surface 121 is used to fix a plurality of heat dissipation teeth 170, which protrude along the first direction Z towards the circuit board 130. The plurality of heat dissipation teeth 170 and the surface 121 are immersed in a heat-conducting liquid 140. As shown in FIG5, the height of at least one heat dissipation tooth 170 along the first direction Z is less than the distance between the circuit board 130 and the surface 121, and the height of at least one heat dissipation tooth 170 along the first direction Z is greater than the distance between a power transistor 151 and the surface 121.

[0107] In this embodiment, the heat sink 120 includes a surface 121 facing the circuit board 130 along the first direction Z. A plurality of heat dissipation teeth 170 protrude along the first direction Z towards the circuit board 130. The plurality of heat dissipation teeth 170 and the surface 121 are immersed in the heat-conducting liquid 140. The heat dissipation teeth 170 can increase the heat dissipation area of ​​the heat-conducting liquid 140. The heat dissipation teeth 170 can also increase the degree of turbulence between the circuit board 130 and the surface 121 of the heat sink 120, thereby enhancing the heat conduction effect.

[0108] In this embodiment, as shown in FIG5, the height of the heat dissipation tooth 170 along the first direction Z is denoted as L11, and the distance between the circuit board 130 and the surface 121 is L12, where L11 < L12. This ensures that the two ends of the heat dissipation tooth 170 do not simultaneously contact the circuit board 130 and the heat sink 120, allowing the heat-conducting fluid 140 to flow through the gap between the tooth surface of the heat dissipation tooth 170 and the circuit board 130. This enables the heat-conducting fluid 140 to convect along the direction X perpendicular to the first direction Z, thereby enhancing the heat dissipation effect. L11 < L12 also prevents the heat dissipation tooth 170 from exerting a downward force along the first direction Z on the circuit board 130, thus avoiding deformation of the circuit board 130.

[0109] In this embodiment of the application, as shown in FIG5, the height of the heat dissipation tooth 170 along the first direction Z is L11, and the distance between the power tube 151 and the surface 121 is denoted as L13. L11>L13, so that the heat dissipation tooth 170 can extend to the power tube 151, thereby enhancing the flow effect of the heat-conducting liquid 140 close to the power tube 151, thereby accelerating the heat conduction effect of the heat-conducting liquid 140 on the power tube 151, thereby improving the cooling efficiency of the vehicle power supply device 100.

[0110] In one embodiment, as shown in FIG5, the height of at least one heat dissipation tooth 170 along the first direction Z is equal to the distance between the circuit board 130 and the surface 121.

[0111] In one embodiment, as shown in FIG5, the height of at least one heat dissipation tooth 170 along the first direction Z is equal to the distance between a power tube 151 and the surface 121.

[0112] In one embodiment, as shown in FIG5, at least a portion of the through-hole 131 along the first direction Z is aligned with or overlapped with at least a portion of the heat dissipation fins 170. This allows the coolant flowing upward from below the circuit board 130 through the through-hole 131 to directly contact the heat dissipation fins 170, enabling some of the heat from the high-temperature heat-conducting fluid 140 to be absorbed by the heat dissipation fins 170, thus accelerating the heat conduction effect. Furthermore, the heat-conducting fluid 140 can flow from both sides of the heat dissipation fins 170 (as shown by the dashed arrows in FIG5) under the obstruction of the heat dissipation fins 170, thereby driving the heat-conducting fluid 140 to form a circulation and accelerating the heat conduction efficiency.

[0113] Wherein, the alignment or overlap of at least a portion of the heat dissipation teeth 170 with at least a portion of the through holes 131 along the first direction Z means that the area enclosed by the through holes 131 at least partially overlaps with the projection of the heat dissipation teeth 170 on the circuit board 130 along the first direction Z.

[0114] In one embodiment, as shown in FIG5, the minimum distance between the heat dissipation tooth 170 in the direction X perpendicular to the first direction Z and the power tube 151 is less than the length of the power tube 151.

[0115] In this embodiment, the minimum distance between the heat dissipation tooth 170 and the power tube 151 along the direction X perpendicular to the first direction Z is denoted as L14, and the length of the power tube 151 is L8, where L14 < L8. The heat of the heat-conducting fluid 140 near the heat dissipation tooth 170 can be better absorbed by the heat dissipation tooth 170. The heat dissipation tooth 170 is set close to the power tube 151, which allows the heat dissipation tooth 170 to absorb the heat generated by the power tube 151 faster and over a shorter distance, thereby accelerating the heat conduction effect and improving the cooling efficiency of the vehicle power supply device 100.

[0116] Figure 8 is a schematic diagram of the structure of the magnetic device 152 provided in the embodiment of this application.

[0117] In one embodiment, as shown in FIG8, the magnetic device 152 includes a magnetic core 1521 and a metal winding 1523, wherein the magnetic core 1521 is used to wind the metal winding 1523. As shown in FIG3 and FIG8, the magnetic core 1521 includes a magnetic core hole 1522 for the flow of heat-conducting fluid 140, and the magnetic core hole 1522 extends through the magnetic core 1521 along a first direction Z.

[0118] In this embodiment, the magnetic core 1521 includes a magnetic core hole 1522, which is used for the flow of the heat-conducting liquid 140, so that the heat-conducting liquid 140 can flow through the interior of the magnetic device 152, thereby increasing the contact area between the heat-conducting liquid 140 and the magnetic device 152, which can enhance the heat exchange effect of the heat-conducting liquid 140 on the magnetic device 152 and improve the heat dissipation effect of the vehicle power supply device 100.

[0119] In this embodiment, the magnetic core hole 1522 penetrates the magnetic core 1521 along the first direction Z, and the metal winding 1523 surrounds the magnetic core hole 1522. This allows the heat-conducting liquid 140 to pass through the magnetic core hole 1522 of the magnetic device 152 when it flows vertically along the first direction Z in the grooved bottom shell 111. The magnetic core hole 1522 increases the space for vertical convection of the heat-conducting liquid 140, thereby enhancing the convection of the heat-conducting liquid 140 around the metal winding 1523 of the magnetic device 152 and the heat conduction efficiency of the heat-conducting liquid 140 to the magnetic device 152, thereby improving the cooling efficiency of the vehicle power supply device 100.

[0120] In one embodiment, the core hole 1522 of the magnetic device 152 is aligned with at least a portion of the through hole 131 of the circuit board 130 along a first direction Z. This allows the heat-conducting fluid 140 flowing upward from the grooved bottom shell 111 to pass through the core hole 1522 of the magnetic device 152 and the through hole 131 of the circuit board 130 along the first direction Z, directly reaching the heat sink 120. This allows the heat of the heat-conducting fluid 140 to be quickly absorbed by the heat sink 120, thereby accelerating the circulation of the heat-conducting fluid 140 within the grooved bottom shell 111 and improving the heat conduction efficiency.

[0121] The alignment of the magnetic core hole 1522 of the magnetic device 152 with at least a portion of the through hole 131 of the circuit board 130 along the first direction Z means that the projection of the area enclosed by the magnetic core hole 1522 and at least a portion of the through hole 131 along the first direction Z onto the circuit board 130 is at least partially overlapping.

[0122] Figure 9 is another structural schematic diagram of the magnetic device 152 provided in the embodiment of this application.

[0123] In one embodiment, the magnetic device 152 includes two winding posts 1524, a center post 1525, and two end plates 1526, as shown in Figures 3 and 9. The two winding posts 1524 and the center post 1525 are fixed between the two end plates 1526, and two metal windings 1523 are wound around the two winding posts 1524. At least one of the two winding posts 1524 and the center post 1525 has an opening 1527 for the flow of heat-conducting fluid 140.

[0124] In this embodiment, openings 1527 are made in the winding post 1524 and the middle post 1525 of the magnetic device 152 for the flow of the heat-conducting liquid 140, so that the heat-conducting liquid 140 can be convected in the openings 1527, thereby enhancing the heat conduction effect of the heat-conducting liquid 140 on the magnetic device 152 and improving the heat conduction efficiency.

[0125] In one embodiment, the opening 1527 of at least one of the two winding posts 1524 and the center post 1525 is aligned with at least a portion of the through hole 131 of the circuit board 130 along a first direction Z. This allows the heat-conducting fluid 140 flowing upward from the grooved bottom shell 111 to pass through the opening 1527 and the through hole 131 of the circuit board 130 along the first direction Z, directly reaching the heat sink 120. This allows the heat of the heat-conducting fluid 140 to be quickly absorbed by the heat sink 120, thereby accelerating the circulation of the heat-conducting fluid 140 within the grooved bottom shell 111 and improving the heat conduction efficiency.

[0126] The alignment of the opening 1527 with at least a portion of the through hole 131 of the circuit board 130 along the first direction Z means that the area enclosed by the projection of the opening 1527 and the through hole 131 along the first direction X on the circuit board 130 at least partially overlaps.

[0127] In one embodiment, the axis of the core hole 1522 in the core 1521 is perpendicular to the first direction X. When the core 1521 can only be mounted horizontally on the circuit board 130 to meet the internal installation requirements of the vehicle power supply device 100, the axis of the core hole 1522 in the core 1521 can be perpendicular to the first direction X, or the axis of the core hole 1522 in the core 1521 can be parallel to the circuit board 130, so that the core hole 1522 can flow the heat-conducting liquid 140 in a direction parallel to the circuit board 130, thereby increasing the agitation of the heat-conducting liquid 140 and improving the heat dissipation uniformity.

[0128] In one embodiment, a metal winding 1523 is wound around a magnetic core 1521 multiple times, as shown in Figures 3 and 8. There is a gap between two adjacent turns of the metal winding 152a along the first direction Z, which is used for the flow of heat-conducting fluid 140. The gap along the first direction Z is greater than or equal to 0.3 mm.

[0129] In this embodiment, there is a gap between two adjacent turns of metal winding 152a along the first direction Z, which can increase the surface area of ​​the metal winding 1523 exposed to the heat-conducting liquid 140. The gap is used for the flow of the heat-conducting liquid 140, thereby allowing the metal winding 1523 of the magnetic device 152 to have a larger contact area with the heat-conducting liquid 140. This is more conducive to the formation of convective heat transfer between the metal winding 1523 and the heat-conducting liquid 140, accelerating the cooling efficiency of the magnetic device 152, and thus improving the cooling efficiency of the vehicle power supply device 100.

[0130] In this embodiment, the gap along the first direction Z is greater than or equal to 0.3 mm, so that there is enough space between the two turns of metal winding 152a for the heat transfer fluid 140 to flow, so that the heat transfer fluid 140 can penetrate into the interior of the metal winding 1523, which is beneficial to improving the convective heat transfer effect of the heat transfer fluid 140 and accelerating the cooling efficiency of the magnetic device 152.

[0131] In one embodiment, as shown in FIG8, the gap length between two adjacent turns of metal winding 152a along the first direction Z is 0.5mm.

[0132] In one embodiment, the axial direction of the magnetic device 152 is parallel to the direction X perpendicular to the first direction Z. Along the direction X perpendicular to the first direction Z, there is a gap between the two turns of metal winding 152a, and at least a portion of the gap is aligned with at least a portion of the through hole 131 of the circuit board 130 along the first direction Z.

[0133] Wherein, "at least part of the gap is aligned with at least part of the through hole 131 of the circuit board 130 along the first direction Z" means that at least part of the gap and the area enclosed by the projection of the through hole 131 along the first direction Z on the circuit board 130 at least partially overlap.

[0134] In one embodiment, as shown in FIG3, the magnetic device 152 is spaced apart from the peripheral wall 111b of the groove-shaped bottom shell 111 by a distance greater than 1.5mm. This facilitates the flow of the heat transfer fluid 140 along the peripheral wall 111b of the groove-shaped bottom shell 111, further facilitates the absorption of heat generated by the magnetic device 152 by the heat transfer fluid 140, and also facilitates the circulation of the heat transfer fluid 140 within the groove-shaped bottom shell 111, thereby increasing the heat exchange rate of the heat transfer fluid 140 and improving the cooling efficiency of the vehicle power supply device 100.

[0135] In one embodiment, as shown in FIG3, the magnetic device 152 is spaced apart from the groove peripheral wall 111b of the groove bottom shell 111 by a distance of 2mm.

[0136] Figure 10 is another structural schematic diagram of the vehicle power supply device 100 provided in the embodiment of this application.

[0137] In one embodiment, the heat sink 120 includes a surface 121, as shown in FIG10, facing the circuit board 130 along a first direction Z. A gap between at least one power transistor 151 and the surface 121 is used to fill a thermally conductive medium 160, the thermal conductivity of which is greater than that of the thermally conductive liquid 140. The surface 121 is used to fix an annular protrusion 180, which protrudes along the first direction Z towards the circuit board 130. The annular protrusion 180 surrounds the thermally conductive medium 160 and separates the thermally conductive medium 160 from the thermally conductive liquid 140. The length of the annular protrusion 180 along the first direction Z is greater than the length of the gap between the at least one power transistor 151 and the surface 121.

[0138] In this embodiment, a surface 121 faces the circuit board 130 along the first direction Z. The gap between at least one power tube 151 and the surface 121 is filled with a thermally conductive medium 160. The thermal conductivity of the thermally conductive medium 160 is greater than that of the thermally conductive liquid 140, so that the heat of the power tube 151 can be absorbed not only by the thermally conductive liquid 140 but also by the thermally conductive medium 160, thereby further improving the cooling effect of the power tube 151.

[0139] In this embodiment, the annular protrusion 180 protrudes towards the circuit board 130 along the first direction Z. The annular protrusion 180 is used to surround the heat-conducting medium 160 and to separate the heat-conducting medium 160 and the heat-conducting liquid 140. In order to avoid the heat-conducting medium 160 and the heat-conducting liquid 140 from dissolving, the annular protrusion 180 is used to separate the heat-conducting medium 160 and the heat-conducting liquid 140, which can extend the service life of the heat-conducting medium 160 and also ensure the heat dissipation effect of the heat-conducting medium 160 on the power tube 151.

[0140] In this embodiment, the length of the annular protrusion 180 along the first direction Z is denoted as L14, and the length of the gap between the power tube 151 and the surface 121 is L13. The gap between the power tube 151 and the surface 121 is used to fill the heat-conducting medium 160. Since L14 > L13, the annular protrusion 180 can completely surround the heat-conducting medium 160, so that the heat-conducting medium 160 does not come into contact with the heat-conducting liquid 140. This can prevent the heat-conducting medium 160 from being incompatible with the heat-conducting liquid 140, extend the service life of the heat-conducting medium 160, and ensure the heat dissipation effect of the heat-conducting medium 160 on the power tube 151.

[0141] In a further embodiment, the length of the annular protrusion 180 along the first direction Z is equal to the length of the gap between the power tube 151 and the surface 121. The annular protrusion 180 can just isolate the heat-conducting medium 160 from the heat-conducting liquid 140, thus avoiding the incompatibility between the heat-conducting medium 160 and the heat-conducting liquid 140.

[0142] Figure 11 is a structural schematic diagram of an on-board power supply device 100 provided in another embodiment of this application.

[0143] In one embodiment, as shown in FIG11, the length of the annular protrusion 180 along the first direction Z is equal to the length of the gap between the heat sink 120 and the circuit board 130. The annular protrusion 180 is used to surround the heat-conducting medium 160 and the power tube 151 and to separate the heat-conducting medium 160, the power tube 151 and the heat-conducting liquid 140.

[0144] In one embodiment, the power transistor 151 and the heat sink 120 are thermally connected through a thermally conductive medium 160, which may be a thermally conductive gel, a thermally conductive pad, a thermally conductive silicone grease, etc.

[0145] In one embodiment, the power transistor 151 is thermally connected to the heat sink 120 by welding or sintering, so that the heat sink 120 can directly dissipate heat from the power transistor 151.

[0146] In one embodiment, the vehicle power supply device 100 further includes a capacitor 153, an inductor 154, and a fuse 155. As shown in FIG3, along the first direction Z, the capacitor 153 is located between at least one of the inductor 154, the fuse 155, and the magnetic device 152 and the circuit board 130. Parts of the capacitor 153 are stacked with the inductor 154, some with the fuse 155, and some with the magnetic device 152, which can increase the space utilization of the slot-shaped base 111, thereby reducing the size of the vehicle power supply device 100.

[0147] In one embodiment, the power transistor 151, magnetic device 152, capacitor 153, inductor 154 and fuse 155 are fixed to the slotted bottom shell 111 by laser welding, which is simple to assemble and firmly fixed.

[0148] In one embodiment, as shown in FIG3, the cover plate 112 and the grooved bottom shell 111 are sealed and fixed by a sealing ring and anti-loosening screws, so that the heat transfer fluid 140 will not leak out of the housing 110 of the vehicle power supply device 100 and affect other components in the powertrain 10.

[0149] In one embodiment, the housing 110 further includes a waterproof and breathable membrane. The heat-conducting fluid 140 within the grooved bottom housing 111 will increase in temperature due to absorbing heat from the power conversion component 150, and will also decrease in temperature due to absorbing heat from the radiator 120. The entire housing 110 is filled with heat-conducting fluid 140. The thermal expansion and contraction of the heat-conducting fluid 140 will compress the housing 110, making it prone to deformation. This is detrimental to the structural strength and stability of the vehicle power supply device 100. The waterproof and breathable membrane can reduce the impact of the thermal expansion and contraction of the heat-conducting fluid 140 on the housing 110.

[0150] Figure 12 is a partial structural schematic diagram of the housing 110 provided in an embodiment of this application.

[0151] In one embodiment, the housing 110 includes a liquid storage structure 114, as shown in Figures 3 and 12. The liquid storage structure 114 protrudes outward from the receiving cavity 113. The liquid storage structure 114 can accommodate the heat-conducting liquid 140 after absorbing heat and expanding, so that the heat-conducting liquid 140 after absorbing heat and expanding will not excessively compress the housing 110, thereby reducing the impact of thermal expansion and contraction of the heat-conducting liquid 140 on the housing 110.

[0152] Figure 13 is a structural schematic diagram of an on-board power supply device 100 provided in another embodiment of this application.

[0153] In one embodiment, coolant channels 116 are provided in the bottom 111a and peripheral wall 111b of the groove-shaped bottom shell 111, forming a double-layer planar water channel with the radiator 120, which further improves the efficiency of the coolant in the vehicle power supply device 100 in absorbing the heat of the heat transfer fluid 140 and improves the cooling efficiency of the vehicle power supply device 100.

[0154] In one embodiment, a coolant flow channel 116 may be provided in any side wall of the groove peripheral wall 111b or in the groove bottom 111a of the groove-shaped bottom shell 111.

[0155] Figure 14 is a structural schematic diagram of an on-board power supply device 100 provided in another embodiment of this application.

[0156] In one embodiment, the vehicle power supply device 100 includes two circuit boards 130, as shown in FIG14. The two circuit boards 130 are arranged at intervals along a first direction Z. Each circuit board 130 is used to carry some electrical components. The power transistor 151 is fixed to the radiator 120 through a heat-conducting medium 160. Coolant channels 116 are provided in the grooved bottom shell 111 and cover plate 112 of the vehicle power supply device 100, forming a three-layer planar water channel with the radiator 120, which further improves the efficiency of the coolant in the vehicle power supply device 100 in absorbing heat from the heat-conducting fluid 140, thereby improving the cooling efficiency of the vehicle power supply device 100.

[0157] In one embodiment, a coolant flow channel 116 is provided in either the cover plate 112 of the vehicle power supply device 100 or the side wall of the groove peripheral wall 111b of the groove bottom shell 111.

[0158] In one embodiment, the inlet and outlet of the radiator 120 are connected to the housing 110, and the housing 110 communicates with an external cooling module, thereby realizing the circulation of coolant within the radiator 120. To prevent leakage from the inlet and outlet of the radiator 120 into the heat transfer fluid 140, the gap between the inlet and outlet of the radiator 120 and the housing 110 is sealed by a sealing ring or sealant.

[0159] The vehicle power supply device, powertrain, and electric vehicle provided in the embodiments of this application have been described in detail above. Specific examples have been used to illustrate the principles and embodiments of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in specific embodiments and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A vehicle-mounted power supply device, characterized in that, The on-board power supply device is used to charge and discharge the power battery of an electric vehicle. The on-board power supply device includes a housing, a radiator, and a circuit board. The housing includes a grooved bottom shell and a cover plate. The grooved bottom shell and the cover plate are stacked along a first direction to form a receiving cavity. The receiving cavity is used to house the radiator, the circuit board, and a heat-conducting fluid. The circuit board is used to carry a power conversion component. The power conversion component is used to realize power conversion. The power conversion component includes multiple power transistors and at least one magnetic device, wherein: The cover plate, the heat sink, the plurality of power transistors, the circuit board, and the at least one magnetic device are stacked sequentially along the first direction. The at least one magnetic device, the circuit board, the plurality of power transistors, and at least a portion of the heat sink are immersed in the heat-conducting liquid. The distance between the surface of the heat-conducting liquid and the bottom of the groove-shaped bottom shell along the first direction is greater than the distance between the heat sink and the bottom of the groove-shaped bottom shell.

2. The vehicle-mounted power supply device according to claim 1, characterized in that, The distance between the surface of the heat-conducting fluid and the cover plate along the first direction is less than the distance between the radiator and the cover plate.

3. The vehicle-mounted power supply device according to claim 1 or 2, characterized in that, The distance between the circuit board and the surface of the heat-conducting liquid along the first direction is less than the distance between the circuit board and the bottom of the groove-shaped bottom shell.

4. The vehicle-mounted power supply device according to any one of claims 1-3, characterized in that, The circuit board includes a plurality of through holes extending through the circuit board along the first direction. Each through hole is used to allow the heat-conducting fluid to flow from one side of the circuit board to the other side, wherein: The minimum distance between a through hole and a power transistor along a direction perpendicular to the first direction is less than the length of the power transistor.

5. The vehicle-mounted power supply device according to claim 4, characterized in that, At least a portion of the through-hole is stacked with one of the magnetic devices along the first direction.

6. The vehicle-mounted power supply device according to claim 4, characterized in that, At least a portion of the via is stacked with one of the power transistors along the first direction.

7. The vehicle-mounted power supply device according to any one of claims 1-6, characterized in that, The heat sink includes a surface facing the circuit board along the first direction. The surface is used to fix a plurality of heat dissipation teeth, which protrude towards the circuit board along the first direction. The plurality of heat dissipation teeth and the surface are immersed in the heat-conducting fluid, wherein: The height of at least one heat dissipation tooth along the first direction is less than or equal to the distance between the circuit board and the surface, and the height of at least one heat dissipation tooth along the first direction is greater than or equal to the distance between the power transistor and the surface.

8. The vehicle-mounted power supply device according to claim 7, characterized in that, The minimum distance between a heat dissipation tooth and a power transistor along a direction perpendicular to the first direction is less than the length of the power transistor.

9. The vehicle-mounted power supply device according to any one of claims 1-8, characterized in that, A magnetic device includes a magnetic core and a metal winding, wherein the magnetic core is used to wind the metal winding, wherein: The magnetic core includes a core hole for the flow of the heat-conducting fluid, and the core hole extends through the magnetic core along the first direction.

10. The vehicle-mounted power supply device according to claim 9, characterized in that, The metal winding is wound around the magnetic core multiple times, and there is a gap between two adjacent turns of the metal winding along the first direction. The gap is used to allow the heat-conducting fluid to flow. The gap along the first direction is greater than or equal to 0.3 mm.

11. The vehicle-mounted power supply device according to any one of claims 1-10, characterized in that, The heat sink includes a surface facing the circuit board along the first direction, and the gap between the at least one power transistor and the surface is filled with a thermally conductive medium, the thermal conductivity of which is greater than that of the heat-conducting liquid, wherein: The surface is used to fix an annular protrusion, the annular protrusion protrudes toward the circuit board protrusion along the first direction, and the annular protrusion is used to surround the thermally conductive medium and to separate the thermally conductive medium and the thermally conductive liquid; The length of the annular protrusion along the first direction is greater than the length of the gap between the at least one power transistor and the surface.

12. A powertrain, characterized in that, The powertrain includes an electric motor and an on-board power supply device as described in any one of claims 1-11, wherein the power conversion component of the on-board power supply device is used to supply power to the electric motor.

13. An electric vehicle, characterized in that, The electric vehicle includes a body, a power battery, and a powertrain as described in claim 12. The body is used to fix the power battery and the powertrain, and the on-board power supply device of the powertrain is used to charge and discharge the power battery of the electric vehicle.

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