Camera module and electronic device comprising same

Abstract

According to an embodiment of the present disclosure, a camera module may comprise an image sensor and a lens assembly including at least eight lenses aligned along the optical axis, and configured to focus or guide light incident from the outside of the camera module to the image sensor. In an embodiment, the at least eight lenses may comprise: a first lens disposed farthest from the image sensor, including a glass material, and having positive refractive power; a second lens disposed between the first lens and the image sensor and having refractive power; a third lens disposed between the second lens and the image sensor and having refractive power; a fourth lens disposed between the third lens and the image sensor and having refractive power; a fifth lens disposed between the fourth lens and the image sensor and having refractive power; a sixth lens disposed between the fifth lens and the image sensor and having refractive power; a seventh lens disposed between the sixth lens and the image sensor, including a convex sensor-side surface, and having refractive power; and an eighth lens disposed between the seventh lens and the image sensor, including a convex sensor-side surface, and having refractive power. Various other embodiments may also be possible.

Description

Camera module and electronic device including the same

[0001] Embodiments of the present disclosure relate to electronic devices, for example, to camera modules and / or electronic devices including the same.

[0002] Electronic devices may refer to devices that perform specified functions according to the programs installed on them, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio / video devices, desktop / laptop computers, and / or car navigation systems. For example, these electronic devices can output stored information as audio or video. As the integration of electronic devices increases and ultra-high-speed, high-capacity wireless communication becomes widespread, a single electronic device, such as a mobile communication terminal, can recently be equipped with various functions. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions for mobile banking, and / or functions such as schedule management or electronic wallets are being integrated into a single electronic device.

[0003] As digital camera technology developed, electronic devices equipped with compact, lightweight camera modules became commercially available. With camera modules integrated into electronic devices we typically carry with us (e.g., mobile terminals), users could conveniently utilize a variety of features, including not only taking photos and videos, but also video calling and / or augmented reality.

[0004] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0005] According to one embodiment of the present disclosure, a camera module may include an image sensor and a lens assembly configured to focus or guide light incident from outside the camera module onto the image sensor by including at least eight lenses aligned along an optical axis. In one embodiment, the at least eight lenses may include a first lens disposed farthest from the image sensor and including a glass material and having positive refractive power, a second lens disposed between the first lens and the image sensor and having positive or negative refractive power, a third lens disposed between the second lens and the image sensor and having positive or negative refractive power, a fourth lens disposed between the third lens and the image sensor and having positive or negative refractive power, a fifth lens disposed between the fourth lens and the image sensor and having positive or negative refractive power, a sixth lens disposed between the fifth lens and the image sensor and having positive or negative refractive power, a seventh lens disposed between the sixth lens and the image sensor and having a convex sensor-side surface and having positive or negative refractive power, and an eighth lens disposed between the seventh lens and the image sensor and having a convex sensor-side surface and having positive or negative refractive power.

[0006] According to one embodiment of the present disclosure, an electronic device may include a camera module, at least one processor, and a memory storing instructions configured to cause the electronic device to acquire an image of a subject using the camera module when executed by the at least one processor. In one embodiment, the camera module may include an image sensor, and a lens assembly including at least eight lenses aligned along an optical axis, the lens assembly configured to focus or guide light incident from outside the camera module onto the image sensor. In one embodiment, the at least eight lenses may include a first lens disposed farthest from the image sensor and including a glass material and having positive refractive power, a second lens disposed between the first lens and the image sensor and having positive or negative refractive power, a third lens disposed between the second lens and the image sensor and having positive or negative refractive power, a fourth lens disposed between the third lens and the image sensor and having positive or negative refractive power, a fifth lens disposed between the fourth lens and the image sensor and having positive or negative refractive power, a sixth lens disposed between the fifth lens and the image sensor and having positive or negative refractive power, a seventh lens disposed between the sixth lens and the image sensor and having a convex sensor-side surface and having positive or negative refractive power, and an eighth lens disposed between the seventh lens and the image sensor and having a convex sensor-side surface and having positive or negative refractive power.

[0007] The above-described aspects or other aspects, configurations and / or advantages of one embodiment of the present disclosure may be further clarified by the following detailed description taken in conjunction with the accompanying drawings.

[0008] FIG. 1 is a block diagram illustrating an electronic device within a network environment according to one embodiment of the present disclosure.

[0009] FIG. 2 is a perspective view showing the front of an electronic device according to one embodiment of the present disclosure.

[0010] FIG. 3 is a perspective view showing the rear side of the electronic device illustrated in FIG. 2 according to one embodiment of the present disclosure.

[0011] FIG. 4 is an exploded perspective view showing the front side of the electronic device illustrated in FIG. 2, according to one embodiment of the present disclosure.

[0012] FIG. 5 is an exploded perspective view showing the rear side of the electronic device illustrated in FIG. 2, according to one embodiment of the present disclosure.

[0013] FIG. 6 is a drawing showing a camera module and / or lens assembly according to one embodiment of the present disclosure.

[0014] FIG. 7 is a graph showing spherical aberration of the lens assembly of FIG. 6 according to one embodiment of the present disclosure.

[0015] FIG. 8 is a graph showing astigmatism of the lens assembly of FIG. 6 according to one embodiment of the present disclosure.

[0016] FIG. 9 is a graph showing the distortion ratio of the lens assembly of FIG. 6 according to one embodiment of the present disclosure.

[0017] FIG. 10 is a drawing showing a camera module and / or lens assembly according to one embodiment of the present disclosure.

[0018] FIG. 11 is a graph showing spherical aberration of the lens assembly of FIG. 10 according to one embodiment of the present disclosure.

[0019] FIG. 12 is a graph showing astigmatism of the lens assembly of FIG. 10 according to one embodiment of the present disclosure.

[0020] FIG. 13 is a graph showing the distortion ratio of the lens assembly of FIG. 10 according to one embodiment of the present disclosure.

[0021] FIG. 14 is a drawing showing a camera module and / or lens assembly according to one embodiment of the present disclosure.

[0022] FIG. 15 is a graph showing spherical aberration of the lens assembly of FIG. 14 according to one embodiment of the present disclosure.

[0023] FIG. 16 is a graph showing astigmatism of the lens assembly of FIG. 14 according to one embodiment of the present disclosure.

[0024] FIG. 17 is a graph showing the distortion ratio of the lens assembly of FIG. 14 according to one embodiment of the present disclosure.

[0025] Throughout the attached drawings, similar reference numbers may be assigned to similar parts, components and / or structures.

[0026] As electronic devices become increasingly smaller, the conditions for ensuring the optical performance of camera modules in these devices are becoming increasingly challenging. For example, while it is possible to capture subject images in low-light environments by increasing the number of pixels or increasing the brightness of the lens, it may be difficult to achieve this while also achieving a lens assembly of a size suitable for miniaturized electronic devices. When developing a lens assembly that combines with a large, high-resolution (e.g., approximately 50 million pixels or more) image sensor, it may be difficult to achieve a wide-angle characteristic of approximately 85 degrees while maintaining good aberration correction performance. Furthermore, while it may be easy to secure wide-angle performance suitable for high-resolution image sensors when implementing a lens assembly by combining approximately eight lenses, miniaturizing the lens assembly may be difficult.

[0027] One embodiment of the present disclosure is intended to at least resolve the above-described problems and / or disadvantages and at least provide the advantages described below, and can provide a camera module having wide-angle performance suitable for a high-performance and / or high-pixel image sensor and / or an electronic device including the same.

[0028] One embodiment of the present disclosure can provide a camera module having wide-angle performance and stabilized optical performance such as aberration correction, and / or an electronic device including the same.

[0029] One embodiment of the present disclosure can provide a miniaturized camera module and / or an electronic device including the same while having good optical performance.

[0030] The technical problems to be achieved in this document are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by a person having ordinary skill in the technical field to which the present disclosure belongs from the description below.

[0031] The following description of the accompanying drawings may provide an understanding of various exemplary implementations of the present disclosure, including the claims and their equivalents. While the exemplary embodiments disclosed in the following description include numerous specific details to aid understanding, they are to be considered as one example of various exemplary embodiments. Accordingly, those skilled in the art will appreciate that various modifications and variations of the various implementations described herein may be made without departing from the scope and spirit of the disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0032] The terms and words used in the following description and claims are not limited to their reference meanings and can be used to clearly and consistently describe one embodiment of the present disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various implementations of the disclosure is provided for illustrative purposes, not for the purpose of limiting the scope of the disclosure and its equivalents.

[0033] Unless the context clearly dictates otherwise, the singular forms of "a," "an," and "the" should be understood to include plural meanings. Thus, for example, "a component surface" could be understood to include one or more of the surfaces of the component.

[0034] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to one embodiment of the present disclosure. Referring to FIG. 1 , in the network environment (100), the electronic device (101) may communicate with the electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of the electronic device (104) or the server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In one embodiment, the electronic device (101) may have at least one of these components (e.g., the connection terminal (178)) omitted, or one or more other components added. In one embodiment, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0035] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor), or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0036] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0037] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0038] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0039] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0040] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0041] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0042] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0043] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0044] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) to an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0045] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0046] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0047] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0048] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0049] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0050] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0051] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0052] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In one embodiment, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0053] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first surface (e.g., a bottom surface) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second surface (e.g., a top surface or a side surface) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0054] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0055] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0056] Electronic devices according to embodiments of the present disclosure may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of the present disclosure are not limited to the aforementioned devices.

[0057] The embodiments of the present disclosure and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to encompass various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly dictates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish the corresponding component from other corresponding components, and do not limit the corresponding components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as being “coupled” or “connected” to another component (e.g., a second component), with or without the terms “functionally” or “communicatively,” it is understood that the component can be connected to the other component directly (e.g., wired), wirelessly, or via a third component.

[0058] The term "module" used in the embodiments of the present disclosure may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0059] Embodiments of the present disclosure may be implemented as software (e.g., a program) including one or more instructions stored in a storage medium (e.g., built-in memory or external memory) readable by a machine (e.g., an electronic device). For example, a processor (e.g., a processor) of the machine (e.g., an electronic device) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, "non-transitory" only means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and this term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily in the storage medium.

[0060] According to one embodiment, a method according to the embodiment(s) of the present disclosure may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smartphones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0061] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to one embodiment, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to one embodiment, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0062] In the detailed description below, the longitudinal direction, the width direction, and / or the thickness direction of the electronic device may be mentioned, and the longitudinal direction may be defined as the 'Y-axis direction', the width direction as the 'X-axis direction', and / or the thickness direction as the 'Z-axis direction'. In one embodiment, with respect to the direction that a component is oriented, 'negative / positive (- / +)' may be mentioned together with the rectangular coordinate system illustrated in the drawings. For example, the front of the electronic device and / or the housing may be defined as the 'side facing the +Z direction', and the back side may be defined as the 'side facing the -Z direction'. In one embodiment, the side of the electronic device and / or the housing may include a region facing the +X direction, a region facing the +Y direction, a region facing the -X direction, and / or a region facing the -Y direction. In one embodiment, the 'X-axis direction' may mean both the '-X direction' and the '+X direction'. It should be noted that this is based on the rectangular coordinate system illustrated in the drawings for the sake of brevity of description, and that the description of these directions or components does not limit the embodiment(s) of the present disclosure. For example, depending on the design specifications of the electronic device or the user's usage habits, the orthogonal coordinate system may be defined differently from that in the present disclosure.

[0063] FIG. 2 is a perspective view showing the front side of an electronic device (200) (e.g., the electronic device (101) of FIG. 1) according to one embodiment of the present disclosure. FIG. 3 is a perspective view showing the rear side of the electronic device (200) illustrated in FIG. 2 according to one embodiment of the present disclosure.

[0064] Referring to FIGS. 2 and 3, an electronic device (200) according to one embodiment may include a housing (210) that includes a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) that surrounds a space between the first side (210A) and the second side (210B). In one embodiment (not shown), the housing (210) may refer to a structure that forms a portion of the first side (210A) of FIG. 2, the second side (210B), and the side surface (210C) of FIG. 3. According to one embodiment, the first side (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (210B) may be formed by a substantially opaque back plate (211). The rear plate (211) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (210C) may be formed by a side structure (or “side bezel structure”) (218) that is coupled to the front plate (202) and the rear plate (211) and comprises a metal and / or polymer. In one embodiment, the rear plate (211) and the side structure (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0065] Although not shown, the front plate (202) may include a seamlessly extending region(s) that curves toward the rear plate (211) at least along a portion of an edge. In one embodiment, the front plate (202) (or the rear plate (211)) may include only one of the curved extending regions toward the rear plate (211) (or the front plate (202)) at one edge of the first surface (210A). In some embodiments, the front plate (202) or the rear plate (211) may be substantially flat, in which case it may not include a curved extending region. When it includes a curved extending region, the thickness of the electronic device (200) in the portion that includes the curved extending region may be smaller than that of other portions.

[0066] According to one embodiment, the electronic device (200) may include at least one of a display (201), an audio module (203, 207, 214), a sensor module (204, 219), a camera module (205, 212, 213), a key input device (217), a light emitting element (206), and a connector hole (208, 209). In one embodiment, the electronic device (200) may omit at least one of the components (e.g., the key input device (217) or the light emitting element (206)) or may additionally include other components.

[0067] The display (201) may be exposed, for example, through a significant portion of the front plate (202). In one embodiment, at least a portion of the display (201) may be exposed through the front plate (202) forming the first surface (210A) or through a portion of a side surface (210C). In one embodiment, the corners of the display (201) may be formed to be substantially the same as the adjacent outer shape of the front plate (202). In one embodiment (not shown), in order to expand the area to which the display (201) is exposed, the gap between the outer shape of the display (201) and the outer shape of the front plate (202) may be formed to be substantially the same.

[0068] In one embodiment (not shown), a recess or opening may be formed in a portion of a screen display area of ​​the display (201), and at least one of an audio module (214), a sensor module (204), a camera module (205), and a light-emitting element (206) may be included that are aligned with the recess or opening. In one embodiment (not shown), at least one of an audio module (214), a sensor module (204), a camera module (205), a fingerprint sensor (not shown), and a light-emitting element (206) may be included on a back surface of the screen display area of ​​the display (201). In one embodiment (not shown), the display (201) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field-type stylus pen. In one embodiment, at least a portion of the sensor modules (204, 219) and / or at least a portion of the key input device (217) may be positioned in areas (or spaces) overlapping the display (201).

[0069] According to one embodiment, the audio module (203, 207, 214) may include a microphone hole (203) and a speaker hole (207, 214). The microphone hole (203) may have a microphone disposed therein for acquiring external sound, and in one embodiment, multiple microphones may be disposed so as to detect the direction of the sound. The speaker hole (207, 214) may include an external speaker hole (207) and a receiver hole (214) for calls. In one embodiment, the speaker hole (207, 214) and the microphone hole (203) may be implemented as a single hole, or a speaker may be included without the speaker hole (207, 214) (e.g., a piezo speaker).

[0070] According to one embodiment, the sensor modules (204, 219) may generate electrical signals or data values ​​corresponding to an internal operating state of the electronic device (200) or an external environmental state. The sensor modules (204, 219) may include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) and / or a fourth sensor module (e.g., a fingerprint sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on not only the first surface (210A) (e.g., the display (201)) of the housing (210), but also the second surface (210B) or the side surface (210C). The electronic device (200) may further include, for example, at least one of a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0071] According to one embodiment, the camera module (205, 212, 213) may include a first camera device (205) disposed on a first side (210A) of the electronic device (200), a second camera device (212) disposed on a second side (210B), and / or a flash (213). The camera devices (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. In one embodiment, the image signal processor may be implemented as a part of the processor (120) of FIG. 1. In one embodiment, the image signal processor may be implemented in a component disposed separately from the processor (120) of FIG. 1. For example, the electronic device (200) may include at least one processor, and when including a plurality of processors, the image signal processor may be mounted on a component separate from other processors. The flash (213) may include, for example, a light emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (200). In one embodiment, the flash (213) may emit infrared light, and the infrared light emitted by the flash (213) and reflected by an object may be received through the third sensor module (219). The electronic device (200) or the processor of the electronic device (200) may detect depth information of the object based on the time point at which the infrared light is received by the third sensor module (219).

[0072] In one embodiment, the key input device (217) may be disposed on a side surface (210C) of the housing (210). In one embodiment, the electronic device (200) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (201). In one embodiment, the key input device (217) may include a sensor module disposed on a second surface (210B) of the housing (210).

[0073] In one embodiment, the light-emitting element (206) may be disposed, for example, on the first surface (210A) of the housing (210). The light-emitting element (206) may provide, for example, status information of the electronic device (200) in the form of light. In one embodiment, the light-emitting element (206) may provide, for example, a light source that is linked to the operation of the camera module (205). The light-emitting element (206) may include, for example, an LED, an IR LED, and a xenon lamp.

[0074] According to one embodiment, the connector holes (208, 209) may include a first connector hole (208) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (e.g., an earphone jack) (209) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0075] FIG. 4 is an exploded perspective view showing the front side of the electronic device (200) illustrated in FIG. 2 according to one embodiment of the present disclosure. FIG. 5 is an exploded perspective view showing the back side of the electronic device (200) illustrated in FIG. 2 according to one embodiment of the present disclosure.

[0076] Referring to FIGS. 4 and 5, the electronic device (300) (e.g., the electronic device (200) of FIG. 2 or 3) may include a side structure (310), a first support member (311) (e.g., a bracket), a front plate (320) (e.g., the front plate (202) of FIG. 2), a display (330) (e.g., the display (201) of FIG. 2), a printed circuit board (or board assembly) (340), a battery (350), a second support member (360) (e.g., a rear case), an antenna, a camera assembly (307), and a rear plate (380) (e.g., the rear plate (211) of FIG. 3). In one embodiment, the electronic device (300) may omit at least one of the components (e.g., the first support member (311) or the second support member (360)) or may additionally include other components. At least one of the components of the electronic device (300) may be identical or similar to at least one of the components of the electronic device (200) of FIG. 2 or FIG. 3, and any overlapping description will be omitted below.

[0077] According to one embodiment, the first support member (311) may be provided at least partially in a flat shape. In one embodiment, the first support member (311) may be disposed inside the electronic device (300) and connected to the side structure (310) or may be formed integrally with the side structure (310). The first support member (311) may be formed, for example, of a metallic material and / or a non-metallic (e.g., polymer) material together with the side structure (310). When formed at least partially of a metallic material, the side structure (310) or a portion of the first support member (311) may function as an antenna. The first support member (311) may have a display (330) coupled to one surface and a printed circuit board (340) coupled to the other surface. A processor, a memory, and / or an interface may be mounted on the printed circuit board (340). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0078] In one embodiment, the first support member (311) and the side structure (310) may be combined to be referred to as a front case or housing (301). In one embodiment, the housing (301) may be generally understood as a structure for accommodating, protecting, or arranging a printed circuit board (340) or a battery (350). In one embodiment, the housing (301) may be understood as including structures that can be visually or tactilely perceived by a user in the appearance of the electronic device (300), such as the side structure (310), the front plate (320), and / or the rear plate (380). For example, the housing (301) may be a structure that substantially forms or provides the appearance of the electronic device (300). In one embodiment, the 'front or rear surface of the housing (301)' may refer to the first surface (210A) of FIG. 2 or the second surface (210B) of FIG. 3. In one embodiment, the first support member (311) is positioned between the front plate (320) (e.g., the first side (210A) of FIG. 2) and the back plate (380) (e.g., the second side (210B) of FIG. 3) and may function as a structure for positioning electrical / electronic components such as a printed circuit board (340) or a camera assembly (307).

[0079] The memory may include, for example, volatile memory or non-volatile memory.

[0080] The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (300) to an external electronic device, for example, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0081] According to one embodiment, the second support member (360) may include, for example, an upper support member (360a) and a lower support member (360b). In one embodiment, the upper support member (360a) may be arranged to surround a printed circuit board (340) together with a portion of the first support member (311). A circuit device implemented in the form of an integrated circuit chip (e.g., a processor, a communication module, or a memory) or various electrical / electronic components may be arranged on the printed circuit board (340), and according to an embodiment, the printed circuit board (340) may be provided with an electromagnetic shielding environment from the upper support member (360a). In one embodiment, the lower support member (360b) may be utilized as a structure on which electrical / electronic components such as a speaker module, an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be arranged. In one embodiment, electrical / electronic components such as a speaker module, an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be arranged on an additional printed circuit board (not shown). In this case, the lower support member (360b) may be arranged to surround the additional printed circuit board together with another portion of the first support member (311). The speaker module or interface arranged on the additional printed circuit board (not shown) or the lower support member (360b) may be arranged corresponding to the audio module (207) or connector holes (208, 209) of FIG. 2.

[0082] According to one embodiment, the battery (350) is a device for supplying power to at least one component of the electronic device (300), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (350) may be disposed substantially on the same plane as, for example, the printed circuit board (340). The battery (350) may be disposed integrally within the electronic device (300), or may be disposed detachably from the electronic device (300).

[0083] Although not shown, the antenna may include a conductive pattern implemented on the surface of the second support member (360), for example, through a laser direct structuring process. In one embodiment, the antenna may include a printed circuit pattern formed on the surface of a thin film, and the thin film-type antenna may be disposed between the back plate (380) and the battery (350). The antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In one embodiment, another antenna structure may be formed by the side structure (310) and / or a portion or combination of the first support member (311).

[0084] In one embodiment, the camera assembly (307) can include at least one camera module, for example, at least one of the camera modules (212, 213) of FIG. 3. Within the electronic device (300), the camera assembly (307) can receive at least a portion of light incident through an optical hole or camera window (312, 313, 319). In one embodiment, the camera assembly (307) can be disposed on the first support member (311) at a location adjacent to the printed circuit board (340). In one embodiment, the camera module(s) of the camera assembly (307) can be generally aligned with one of the camera windows (312, 313, 319) and can be at least partially wrapped around the second support member (360) (e.g., the upper support member (360a)). When arranging the camera assembly (307) or the camera module (212, 213) of FIG. 3, the electronic device (300) or the first support member (311) may include a structure such as at least one support wall or elastic member to mount or fix the camera assembly (307).

[0085] The camera modules (205, 212, 213) of FIGS. 2 to 3 described above or the camera assembly (307) of FIG. 5 can be implemented by at least one of the camera modules (400, 500, 600) of FIGS. 6, 10, and / or 14 described below. Therefore, in the detailed description below, reference may be made to the electronic devices (200, 300) of the preceding embodiments, and it should be noted that reference numerals in the drawings may be given the same or omitted for configurations that can be easily understood through the preceding embodiments, and a detailed description thereof may also be omitted.

[0086] FIG. 6 is a diagram illustrating a camera module (400) and / or a lens assembly (LA) according to an embodiment of the present disclosure. FIG. 7 is a graph illustrating spherical aberration of the lens assembly (LA) of FIG. 6 according to an embodiment of the present disclosure. FIG. 8 is a graph illustrating astigmatism of the lens assembly (LA) of FIG. 6 according to an embodiment of the present disclosure. FIG. 9 is a graph illustrating a distortion ratio of the lens assembly (LA) of FIG. 6 according to an embodiment of the present disclosure.

[0087] FIG. 7 is a graph showing spherical aberration of a camera module (400) and / or a lens assembly (LA) according to one embodiment of the present disclosure, in which the horizontal axis represents a coefficient of longitudinal spherical aberration, the vertical axis represents a normalized distance from the optical axis, and the change in longitudinal spherical aberration according to the wavelength of light is shown. The longitudinal spherical aberration is shown for light having wavelengths of, for example, 656.3000 (NM, nanometer), 587.6000 (NM), 546.1000 (NM), 486.1000 (NM), and 435.8000 (NM), respectively. FIG. 8 is a graph showing astigmatism of a camera module (400) and / or a lens assembly (LA) according to an embodiment of the present disclosure, for light having a wavelength of 546.1000 nm, where 'X' or 'S' represents a sagittal plane with a solid line, and 'Y' or 'T' represents a tangential plane (or meridional plane) with a dotted line. FIG. 9 is a graph showing distortion of a camera module (400) and / or a lens assembly (LA) according to an embodiment of the present disclosure, for light having a wavelength of 546.1000 nm. The refractive index of the lens(es) mentioned in the embodiment described below may refer to the refractive index for light having a wavelength of approximately 587.6000 nm.

[0088] Referring to FIGS. 6 to 9, a camera module (400) according to one embodiment of the present disclosure may include an image sensor (I) and a lens assembly (LA). The lens assembly (LA) may include, for example, at least eight lenses (L1, L2, L3, L4, L5, L6, L7, L8).

[0089] According to one embodiment, the lenses (L1, L2, L3, L4, L5, L6, L7, L8) may be sequentially arranged along the optical axis (O) from the object (S) side toward the image sensor (I). For example, the lenses (L1, L2, L3, L4, L5, L6, L7, L8) may be arranged substantially aligned with the image sensor (I) along the optical axis (O). In the embodiment described below, the ordinal numbers, 'first', 'second', 'third', 'fourth', 'fifth', 'sixth', 'seventh', and 'eighth', assigned to the lenses (L1, L2, L3, L4, L5, L6, L7, L8) may refer to the order in which they are arranged in the direction from the object (S) side toward the image sensor (I). In one embodiment, in the camera module (400) and / or the lens assembly (LA), an aperture stop (or stop) may be positioned between the object-side surface (S2) of the first lens (L1) and the fourth lens (L4) (e.g., the object-side surface (S8) of the fourth lens (L4)). In the embodiment of FIG. 6, the aperture of the camera module (400) and / or the lens assembly (LA) may be understood to be positioned between the second lens (L2) and the third lens (L3).

[0090] According to one embodiment, an optical component such as an infrared cut filter (F) may be disposed between at least one of the eight lenses (L1, L2, L3, L4, L5, L6, L7, L8) and the image sensor (I). The infrared cut filter (F) may be disposed between the eighth lens (L8) and the image sensor (I). The infrared cut filter (F) may suppress or block light (e.g., infrared) of a wavelength that is not visible to the naked eye of a user but is detected by a photosensitive material of a film or the image sensor (I) from entering the image sensor (I). Depending on the intended use of the camera module (400), the infrared cut filter (F) may be replaced with a bandpass filter that transmits infrared and suppresses or blocks visible light. In one embodiment, the infrared cut filter (F) may be implemented by a coating material disposed on a surface of any one of the lenses (L1, L2, L3, L4, L5, L6, L7, L8).

[0091] In the detailed description below, the first lens (L1) may be referred to as “the first lens on the object (S) side” or “the lens arranged furthest from the image sensor (I)”, and the eighth lens (L8) may be referred to as “the first lens on the image sensor (I) side” or “the lens arranged closest to the image sensor (I)”. In one embodiment, “aligned along the optical axis (O)” may refer to that the optical axes of the respective lenses (L1, L2, L3, L4, L5, L6, L7, L8) or the optical axis of the image sensor (I) (e.g., the imaging plane (img)) are aligned to coincide with each other. The imaging plane (img) may receive or detect light aligned or focused by, for example, the lenses (L1, L2, L3, L4, L5, L6, L7, L8). For example, the imaging plane (img) can be understood as the active area of ​​the image sensor (I).

[0092] In one embodiment, a processor (e.g., processor (120) of FIG. 1) or an image signal processor can acquire an image of a subject (e.g., object (S)) by detecting light focused or guided by a lens assembly (LA) using an image sensor (I) (e.g., imaging plane (img)). In one embodiment, the processor (e.g., processor (120) of FIG. 1) can perform a focus adjustment operation and / or a focal length adjustment operation by linearly moving at least one of the lenses (L1, L2, L3, L4, L5, L6, L7, L8) along the optical axis (O) with respect to the image sensor (I). In one embodiment, the processor (e.g., processor (120) of FIG. 1) can perform a shake correction operation by horizontally moving at least one of the lenses (L1, L2, L3, L4, L5, L6, L7, L8) or the image sensor (I) parallel to a plane perpendicular to the optical axis (O). In one embodiment, the processor may cause the electronic device to receive or detect external light using the image sensor (I) while performing focus adjustment and / or image stabilization operations by executing at least a portion of instruction(s) stored in a memory (e.g., memory (130) of FIG. 1). For example, the memory may store instruction(s) that cause the electronic device to receive at least a portion of light focused on the image sensor (I) and acquire an image of an object (S) based on the received light, and such instruction(s) may be executed by the processor(s).

[0093] In the embodiments described below, although some of the reference numbers given to the lens surfaces in the drawings are not directly mentioned, those skilled in the art will be able to easily understand the configuration of each lens (L1, L2, L3, L4, L5, L6, L7, L8) or the lens surfaces based on the lens data presented through the [Tables] described below. In examining various embodiments below, for the sake of brevity of the drawings, the reference numbers in the drawings for some of the object-side surface(s) and the sensor-side surface(s) of the lenses (L1, L2, L3, L4, L5, L6, L7, L8), optical components (e.g., infrared cut filter (F), or image sensor (I) (e.g., imaging surface (img))) may be omitted. The reference numbers for the lens surfaces, optical components, or imaging surfaces omitted in the drawings may apply to the configurations of different embodiments, and the lens data of each embodiment will be easily understood through the [Tables] described below.

[0094] In the detailed description of the embodiments of the present disclosure, the term "concave" or "convex" with respect to the object-side surface or the sensor-side surface of the lenses (L1, L2, L3, L4, L5, L6, L7, L8) may refer to the shape of the lens surface at a point intersecting the optical axis (O) or in a paraxial region intersecting the optical axis (O). The shape referred to as "concave" may refer to a shape in which the lens surface forms a curved surface in such a way that the lens thickness decreases as it approaches the optical axis (O) in the paraxial region. The shape referred to as "convex" may refer to a shape in which the lens surface forms a curved surface in such a way that the lens thickness increases as it approaches the optical axis (O) in the paraxial region.

[0095] In addition, in the detailed description below, values ​​for the radius (e.g., radius of curvature), effective focal length (f), OAL (overall length), TTL (total track length), air gap, thickness or image height of the image sensor (I) of the lenses (L1, L2, L3, L4, L5, L6, L7, L8) of the present disclosure may all have units of mm unless otherwise specified. 'OAL' is the distance from the object-side surface of the first lens on the object side to the sensor-side surface of the first lens on the image sensor side, and is measured from the optical axis (O), and 'TTL' is the distance from the top of the barrel on which the lenses are arranged or fixed to the imaging plane (img) of the image sensor (I), and may be measured parallel to the optical axis (O). Additionally, the radii, effective focal lengths, OALs, air gaps or thicknesses of the lenses (L1, L2, L3, L4, L5, L6, L7, L8) may be measured relative to the optical axis (O), and / or the image height of the image sensor (I) may be measured along a direction substantially perpendicular to the optical axis (O) from a point where the optical axis (O) intersects. In one embodiment, the maximum image height of the image sensor (I) may be half the diagonal length of the imaging plane (img).

[0096] According to one embodiment, among the lenses (L1, L2, L3, L4, L5, L6, L7, L8), the lens disposed first from the object (S) side, for example, the first lens (L1) disposed farthest from the image sensor (I), may have positive refractive power. In one embodiment, the first lens (L1) is made of a glass material and may include a convex object-side surface (S2) or a concave sensor-side surface (S3). In one embodiment, when the first lens (L1) is a glass lens, the lens assembly (LA) may be easily miniaturized while implementing a lens assembly (LA) having an angle of view of about 85 degrees or less or a low F-number (e.g., about 1.9 or less).

[0097] According to one embodiment, the first lens (L1) may be a lens having the smallest refractive index among the lenses (L1, L2, L3, L4, L5, L6, L7, L8). In one embodiment, the first lens (L1) may have an Abbe number of about 65 or more. In one embodiment, the Abbe number of the first lens (L1) may be about 75 or more. In one embodiment, the Abbe number of the first lens (L1) may be about 80 or more. In one embodiment, at least one of the lenses (L1, L2, L3, L4, L5, L6, L7, L8) other than the first lens (L1) may be a plastic lens. In one embodiment, the first lens (L1) may be a glass lens, and the remaining lenses (L2, L3, L4, L5, L6, L7, L8) may all be plastic lenses.

[0098] According to one embodiment, among the lenses (L1, L2, L3, L4, L5, L6, L7, L8), the second lens (L2) is disposed between the first lens (L1) and the image sensor (I) and may have positive refractive power or negative refractive power. In one embodiment, the second lens (L2) is a lens made of a glass material or a plastic material and may include a convex object-side surface (S4). In one embodiment, at least one of the object-side surface (S4) or the sensor-side surface (S5) of the second lens (L2) may be aspherical.

[0099] According to one embodiment, among the lenses (L1, L2, L3, L4, L5, L6, L7, L8), the third lens (L3) is positioned between the second lens (L2) and the image sensor (I) and may have positive or negative refractive power. In one embodiment, the third lens (L3) is a lens made of a glass material or a plastic material and may include a convex object-side surface (S6) or a concave sensor-side surface (S7). In one embodiment, at least one of the object-side surface (S6) or the sensor-side surface (S7) of the third lens (L3) may be aspherical.

[0100] According to one embodiment, among the lenses (L1, L2, L3, L4, L5, L6, L7, L8), the fourth lens (L4) is disposed between the third lens (L3) and the image sensor (I) and may have positive refractive power or negative refractive power. In one embodiment, the fourth lens (L4) may have negative refractive power. In one embodiment, the fourth lens (L4) is a lens made of a glass material or a plastic material and may include a concave object-side surface (S8) or a convex sensor-side surface (S9). In one embodiment, at least one of the object-side surface (S8) or the sensor-side surface (S9) of the fourth lens (L4) may be aspherical.

[0101] According to one embodiment, among the lenses (L1, L2, L3, L4, L5, L6, L7, L8), the fifth lens (L5) is disposed between the fourth lens (L4) and the image sensor (I) and may have positive refractive power or negative refractive power. In one embodiment, the fifth lens (L5) may have positive refractive power. In one embodiment, the fifth lens (L5) may be a lens made of a glass material or a plastic material. In one embodiment, at least one of the object-side surface (S10) or the sensor-side surface (S11) of the fifth lens (L5) may be aspherical.

[0102] According to one embodiment, among the lenses (L1, L2, L3, L4, L5, L6, L7, L8), the sixth lens (L6) is disposed between the fifth lens (L5) and the image sensor (I) and may have positive refractive power or negative refractive power. In one embodiment, the sixth lens (L6) may have negative refractive power. In one embodiment, the sixth lens (L6) may be a lens made of a glass material or a plastic material. In one embodiment, at least one of the object-side surface (S12) or the sensor-side surface (S13) of the sixth lens (L6) may be aspherical.

[0103] According to one embodiment, among the lenses (L1, L2, L3, L4, L5, L6, L7, L8), the seventh lens (L7) is disposed between the sixth lens (L6) and the image sensor (I) and may have positive refractive power or negative refractive power. In one embodiment, the seventh lens (L7) may have positive refractive power. In one embodiment, the seventh lens (L7) is a lens made of a glass material or a plastic material and may include a convex sensor-side surface (S15). In one embodiment, at least one of the object-side surface (S14) or the sensor-side surface (S15) of the seventh lens (L7) may be aspherical.

[0104] According to one embodiment, the eighth lens (L8) may refer to a lens that is arranged closest to the image sensor (I) among the lenses (L1, L2, L3, L4, L5, L6, L7, L8). In one embodiment, the eighth lens (L8) is arranged between the seventh lens (L7) and the image sensor (I) and may have positive refractive power or negative refractive power. In one embodiment, the eighth lens (L8) may have negative refractive power. In one embodiment, the eighth lens (L8) is a lens made of a glass material or a plastic material and may include a concave object-side surface (S16) or a convex sensor-side surface (S17). In one embodiment, at least one of the object-side surface (S16) or the sensor-side surface (S17) of the eighth lens (L8) may be aspherical.

[0105] In one embodiment, the infrared cut filter (F) may be disposed between the eighth lens (L8) and the image sensor (I). As previously mentioned, the infrared cut filter (F) may block light in a wavelength band that is not detectable by the naked eye of the user but is detected by the photosensitive material or the image sensor (I). In one embodiment, when the camera module (400) functions as a camera that detects light in an infrared wavelength band, the infrared cut filter (F) may be replaced with a bandpass filter, and / or may be implemented as a coating material disposed on a lens surface of any one of the lenses (L1, L2, L3, L4, L5, L6, L7, L8).

[0106] In one embodiment, the camera module (400) and / or the lens assembly (LA) may satisfy the conditions presented through the following [Mathematical Expression 1] regarding the F-number 'Fno', and / or the conditions presented through the following [Mathematical Expression 2] regarding the lens total length 'OAL' and the maximum height 'ImgH' of the image sensor.

[0107]

[0108]

[0109] According to one embodiment, the F-number, Fno, of the camera module (400) and / or the lens assembly (LA) may be 1.4 or greater. In one embodiment, the F-number, Fno, of the camera module (400) and / or the lens assembly (LA) may be 1.75 or greater. In one embodiment, the camera module (400) and / or the lens assembly (LA) may satisfy a condition that the calculated value of [Mathematical Formula 2] is 1.05 or greater. For example, the camera module (400) and / or the lens assembly (LA) may be miniaturized and provide bright optical performance by satisfying the conditions of [Mathematical Formula 1] and / or [Mathematical Formula 2].

[0110] In one embodiment, when the first lens (L1) is a glass lens and the sensor-side surface (S15) of the seventh lens (L7) and the sensor-side surface (S17) of the eighth lens (L8) have a convex shape, the camera module (400) and / or the lens assembly (LA) may have an angle of view of approximately 85 degrees and a low F-number (e.g., approximately 1.9 or less). In one embodiment, when the sensor-side surface (S15) of the seventh lens (L7) and the sensor-side surface (S17) of the eighth lens (L8) have a convex shape, miniaturization of the lens assembly (LA) may be facilitated and aberration control of the lens assembly (LA) may be facilitated. For example, the camera module (400) and / or the lens assembly (LA) may satisfy the condition presented through the following [Mathematical Expression 3] regarding the angle of view 'FOV.

[0111]

[0112] When the camera module (400) and / or lens assembly (LA) has an angle of view exceeding approximately 85 degrees, miniaturization may be facilitated, but distortion may increase, resulting in a deterioration in the quality of the acquired image.

[0113] In one embodiment, the camera module (400) and / or its lens assembly (LA) may have a focal length of approximately 7.357 mm, an F-number of approximately 1.79, and an overall lens length (OAL) of approximately 8.3 mm. In one embodiment, the half field of view (HFOV) of the lens assembly (LA) may be approximately 42.429 degrees. In one embodiment, the camera module (400) and / or its lens assembly (LA) may satisfy at least some of the above-described condition(s), and may be manufactured with the specifications exemplified in the following [Table 1].

[0114] Lens surface (Surf) Radius of curvature (Radius) Thickness (Thick) Focal length (EFL) Refractive index (nd) Abbe number (vd) objinfinityinfinityS1infinity0S2*2.71231.09167.00111.49581.5S3*10.70020.1412S4*9.00760.2340-17.4 5921.614425.93688S5*4.86760.4175stopinfinity-0.12S6*7.26060.405929.00121.5 3110255.92902S7*13.13750.4996S8*-19.22550.3994-59.24161.686718.4S9*-36.3563 0.2828S10*20.98370.308132.96681.56717337.4026S11*-181.12100.5967S12*5.8097 0.3400-52.60151.686718.4S13*4.89300.4670S14*5.94080.749510.35041.53110255.9 2902S15*-112.17581.1346S16*-2.72350.4800-5.14121.53110255.92902S17*-95.3177 0.0100S18infinity0.1100infiniy1.516864.2S19infinity0.7675imginfinity-0.0152

[0115] The symbol '*' written on the lens surface in [Table 1] is an example of an aspherical surface, and the aspherical surface coefficients of the lenses (L1, L2, L3, L4, L5, L6, L7, L8) are listed in [Table 2], [Table 3], [Table 4], and [Table 5] below, and the definition of an aspherical surface is as follows [Mathematical Formula 4].

[0116]

[0117] In [Mathematical Formula 4], "x" is the distance in the direction of the optical axis (O) from the point where the optical axis (O) passes on the lens surface, "y" is the distance from the optical axis (O) in the direction perpendicular to the optical axis (O), 'R' represents the radius of curvature at the vertex of the lens, 'K' represents the conic constant, and 'Ai' represents the aspherical coefficient, which can be written as 'A', 'B', 'C', 'D', 'E', 'F', 'G', 'H', 'J', 'K', 'L', 'M', 'N', and 'O' depending on the notation. In [Table 2], E+01 is 10 1 , E-02 is 10 -2 can represent. The radius of curvature (R) can represent, for example, a value indicating the degree of curvature at each point of a surface or curve.

[0118] 렌즈면(Surf)2_ASP3_ASP4_ASP5_ASP곡률반경(Radius)2.7123106910.700163389.007550114.867587701k(Conic)-0.023176541-3.82200395617.469940333.224200528A(4th) / C4-0.0076483330.001317279-0.04008914-0.009835533B(6th) / C5-0.0060832130.0018328740.0101144690.017895187C(8th) / C6-0.002556854-0.000574636-0.0028843530.001407895D(10th) / C7-0.0007945492.39E-05-0.000547050.000187182E(12th) / C8-0.000170944-0.000162543-0.000505908-0.000404391F(14th) / C9-4.06E-05-1.38E-05-7.52E-05-0.000189232G(16th) / C10-5.59E-06-8.00E-06-7.54E-06-6.94E-05H(18th) / C11-9.39E-069.12E-066.10E-06-1.00E-05J(20th) / C12-1.05E-06-7.22E-071.28E-061.13E-06K(22th) / C13-2.75E-069.36E-07-7.97E-083.52E-06L(24th) / C148.16E-07-3.52E-06-3.08E-062.46E-06M(26th) / C15-2.04E-06-2.29E-061.60E-062.25E-06N(28th) / C162.82E-0601.78E-06-2.22E-06O(30th) / C17-2.74E-060-8.43E-07-3.29E-06

[0119] 렌즈면(Surf)6_ASP7_ASP8_ASP9_ASP곡률반경(Radius)7.26062609813.1374788-19.22554037-36.35629852k(Conic)12.10566536-77.35318902-98.7808507328.2594756A(4th) / C4-0.088617236-0.03377967-0.247890417-0.358396034B(6th) / C50.0082704950.005474692-0.016834592-0.02048307C(8th) / C60.0041090840.003779961-0.002575093-0.002131233D(10th) / C70.0006351650.0004227-0.001108014-0.000880185E(12th) / C8-6.95E-05-0.000167843-0.000672662-0.000312326F(14th) / C9-0.000111572-0.000122902-0.0002641760.000153332G(16th) / C10-2.94E-05-5.66E-05-9.77E-050.000195434H(18th) / C11-1.43E-05-1.07E-05-2.65E-050.000138033J(20th) / C124.78E-06-8.64E-07-9.11E-068.18E-05K(22th) / C13-2.86E-066.22E-07-1.85E-065.39E-05L(24th) / C143.38E-06-3.41E-06-2.82E-062.68E-05M(26th) / C156.53E-0803.42E-061.73E-05N(28th) / C162.34E-0604.03E-069.03E-06O(30th) / C17-1.39E-0602.86E-066.39E-06

[0120] 렌즈면(Surf)10_ASP11_ASP12_ASP13_ASP곡률반경(Radius)20.98368676-181.12099615.8096517444.893049223k(Conic)-12.426178445.321099691.420355227-1A(4th) / C4-0.373816661-0.396105828-1.631430013-2.023740255B(6th) / C5-0.0518162270.0031754840.0289967650.241849537C(8th) / C6-0.0140942470.0062540130.039777278-0.003546847D(10th) / C7-0.0044438180.0042158060.0192828120.008248461E(12th) / C8-0.0017951690.000650091-0.002105233-0.00934048F(14th) / C9-0.000553445-0.000559326-0.0031141250.000278866G(16th) / C10-5.24E-05-0.000323672-0.004022034-0.003611904H(18th) / C119.33E-05-5.14E-05-0.0002946590.00127542J(20th) / C125.52E-05-9.49E-060.000592227-0.000312565K(22th) / C138.66E-056.00E-050.000277225-0.000154397L(24th) / C145.17E-051.03E-05-4.40E-051.42E-05M(26th) / C154.57E-05-1.95E-06-0.000214553-2.84E-05N(28th) / C161.18E-05-1.93E-05-6.58E-057.79E-05O(30th) / C171.36E-05-2.23E-062.79E-06-3.11E-05

[0121] 렌즈면(Surf)14_ASP15_ASP16_ASP17_ASP곡률반경(Radius)5.940837596-112.1758199-2.723522666-95.31770331k(Conic)00-1-1.002295132A(4th) / C4-2.63727992-1.4763352983.763450846-1.956825437B(6th) / C50.3807076060.2131822730.0168658180.523201125C(8th) / C60.0455565540.04592499-0.2398094630.030280475D(10th) / C70.023222308-0.001731480.099192852-0.04976143E(12th) / C8-0.0234365530.0123512760.00471329-0.012948941F(14th) / C9-0.013622683-0.013612416-0.043353252-0.015362915G(16th) / C100.0058348590.0049084320.034286160.017034418H(18th) / C110.0054226520.002315065-0.018673743-0.011105137J(20th) / C12-0.001183517-0.0019331680.0045111980.000994782K(22th) / C13-0.001554729-0.001179682-0.00012648-0.004188615L(24th) / C140.0004835370.000938146-0.000503810.000811777M(26th) / C150.0001330040.000109914-0.0001817020.000913182N(28th) / C164.30E-05-5.45E-050.0002784880.000380505O(30th) / C17-6.00E-052.91E-05-0.00025281-0.000457694

[0122] FIG. 10 is a diagram illustrating a camera module (500) and / or a lens assembly (LA) according to an embodiment of the present disclosure. FIG. 11 is a graph illustrating spherical aberration of the lens assembly (LA) of FIG. 10 according to an embodiment of the present disclosure. FIG. 12 is a graph illustrating astigmatism of the lens assembly (LA) of FIG. 10 according to an embodiment of the present disclosure. FIG. 13 is a graph illustrating a distortion rate of the lens assembly (LA) of FIG. 10 according to an embodiment of the present disclosure.

[0123] The camera module (500) and / or its lens assembly (LA) of FIG. 10 may have a focal length of approximately 7.303 mm, an F-number of approximately 1.85, and a lens length of approximately 8.4 mm. In one embodiment, the half-angle of view of the lens assembly (LA) may be approximately 42.25 degrees. In one embodiment, the camera module (500) and / or its lens assembly (LA) may include a stop disposed between the first lens (L1) and the second lens (L2). In one embodiment, the camera module (500) and / or its lens assembly (LA) may satisfy at least some of the above-described condition(s), may be manufactured with the specifications exemplified in the following [Table 6], and may have aspheric coefficients of [Table 7], [Table 8], [Table 9], and [Table 10].

[0124] Lens surface (Surf)Radius of curvature (Radius)Thickness (Thick)Focal length (EFL)Refractive index (nd)Abbe number (vd)objinfinityinfinityS1infinity0S2*2.73351.07148.10401.49581.5S3*7.41790.1684stopinfinity0.03S4*63. 82700.389334.81361.53110255.92902S5*-27.03470.0303S6*7.12750.2700-25.84281. 686718.4S7*5.02410.6094S8*-11.75990.4689-102.53771.56717337.4026S9*-8.22200. 0844S10*13.83280.434444.94931.53110255.92902S11*31.32380.4762S12*-17.56470. 3497-54.09881.56717337.4026S13*-41.03570.3081S14*5.16900.48978.40981.5311025 5.92902S15*-39.95301.5998S16*-2.34660.6700-4.71701.53110255.92902S17*-28.88 640.1000S18infinity0.1100infiniy1.516864.2S19infinity0.7200imginfinity0.0200

[0125] 렌즈면(Surf)2_ASP3_ASP4_ASP5_ASP곡률반경(Radius)2.733477.41790863.82703-27.0347k(Conic)00-43.98264.221426A(4th) / C4-0.90032-0.330450.0492920.303886B(6th) / C5-0.218880.144948-0.1633-0.04304C(8th) / C60.0689360.005405-0.16761-0.01035D(10th) / C70.0573-2.85E-020.0531840.017871E(12th) / C8-0.01226-0.012850.0758850.014476F(14th) / C9-2.73E-022.60E-03-2.01E-03-0.00931G(16th) / C10-1.01E-028.75E-03-3.72E-02-1.58E-02H(18th) / C113.49E-037.75E-03-1.32E-025.93E-03J(20th) / C127.25E-033.56E-031.08E-021.82E-02K(22th) / C137.89E-03-1.04E-039.55E-039.69E-03L(24th) / C147.13E-03-3.25E-035.53E-049.85E-04M(26th) / C154.78E-03-2.56E-03-2.58E-037.41E-04N(28th) / C162.04E-03-0.00103-1.45E-032.12E-03O(30th) / C174.55E-04-0.00018-2.91E-048.14E-04

[0126] 렌즈면(Surf)6_ASP7_ASP8_ASP9_ASP곡률반경(Radius)7.1274995.024115-11.75991.960934k(Conic)1.9617946.25186437.8394715.20705A(4th) / C40.0443330.49976-0.2835-0.19186B(6th) / C50.1024520.4167420.057489-0.03574C(8th) / C6-0.02416-0.053430.0164340.004707D(10th) / C7-0.02475-0.04016-0.01116-0.00258E(12th) / C82.88E-03-0.004090.0010160.000901F(14th) / C90.0124790.007296-0.00134-0.0018G(16th) / C109.82E-031.07E-02-1.60E-030.000154H(18th) / C113.01E-03-5.29E-048.81E-04-0.00031J(20th) / C12-1.79E-03-8.02E-03-3.54E-046.61E-05K(22th) / C13-2.88E-03-4.79E-03-1.09E-03-7.20E-05L(24th) / C14-1.72E-03-9.54E-041.31E-031.36E-05M(26th) / C15-5.04E-04-0.000152.65E-03-1.47E-05N(28th) / C16-2.54E-05-0.00011.58E-03-9.32E-07O(30th) / C172.49E-053.88E-073.42E-04-1.00E-06

[0127] 렌즈면(Surf)10_ASP11_ASP12_ASP13_ASP곡률반경(Radius)13.8328231.32377-17.5647-41.0357k(Conic)-38.423899-0.0191765.36607A(4th) / C4-2.45432-1.02287-0.22562-0.37339B(6th) / C50.3288220.0861350.0864060.283858C(8th) / C60.1726170.123498-0.01741-0.1141D(10th) / C7-0.132560.008363-0.02165-0.0125E(12th) / C8-0.03927-0.012730.0382710.036751F(14th) / C90.037378-0.01557-0.01373-0.02146G(16th) / C102.23E-020.001318-0.00419-0.00448H(18th) / C11-1.84E-025.29E-030.0037720.00035J(20th) / C12-1.75E-023.63E-030.002418-0.0006K(22th) / C13-3.44E-03-1.37E-03-0.00136-0.00413L(24th) / C141.22E-02-3.83E-036.15E-04-2.44E-05M(26th) / C159.82E-03-3.41E-033.37E-05-4.54E-04N(28th) / C162.48E-03-1.57E-03-2.24E-04-4.52E-04O(30th) / C17-5.88E-04-3.59E-04-2.20E-04-2.90E-04

[0128] Lens surface (Surf) 14_ASP 15_ASP 16_ASP 17_ASP Radius of curvature (Radius) 5.169044-39.953-2.34659-28.8864 k (Conic) -0.121584 2.01236-0.85529-61.3018 A (4th) / C 4 1.917488-2.73252 1.51989-5.716 B (6th) / C 5 4.987625-0.55 810.292441-6.83427C(8th) / C60.316547-0.47071-0.00561-7.28427D(10th) / C7-0.415720.247848-0. 084580.680266E(12th) / C8-0.130720.3329020.0252142.121399F(14th) / C90.0978120.1169130.008609 0.183926G(16th) / C100.1531830.117784-0.00061-0.44839H(18th) / C11-0.08879-0.13858-0.00501-0 .78011J(20th) / C12-0.06075-0.084180.001555-0.36042K(22th) / C130.07175-0.059730.0007510.799 289L(24th) / C140.085896-0.0563-0.000360.881698M(26th) / C15-0.01584-0.03614-0.00011-0.03214 N(28th) / C16-5.25E-02-2.25E-038.83E-05-0.38218O(30th) / C17-2.15E-024.69E-03-1.40E-05-0.1569

[0129] FIG. 14 is a diagram illustrating a camera module (600) and / or a lens assembly (LA) according to an embodiment of the present disclosure. FIG. 15 is a graph illustrating spherical aberration of the lens assembly (LA) of FIG. 14 according to an embodiment of the present disclosure. FIG. 16 is a graph illustrating astigmatism of the lens assembly (LA) of FIG. 14 according to an embodiment of the present disclosure. FIG. 17 is a graph illustrating a distortion rate of the lens assembly (LA) of FIG. 14 according to an embodiment of the present disclosure.

[0130] The camera module (600) and / or its lens assembly (LA) of FIG. 14 may have a focal length of approximately 7.37 mm, an F-number of approximately 1.90, and a lens length of approximately 8.2 mm. In one embodiment, the half-angle of view of the lens assembly (LA) may be approximately 42.44 degrees. In one embodiment, the camera module (600) and / or its lens assembly (LA) may include a stop disposed between the second lens (L2) and the third lens (L3). In one embodiment, the stop may be understood to be disposed on the object-side surface (S6) of the third lens (L3). In one embodiment, the camera module (600) and / or its lens assembly (LA) may satisfy at least some of the above-described condition(s), may be manufactured with the specifications exemplified in [Table 11] below, and may have aspheric coefficients in [Table 12], [Table 13], [Table 14], and [Table 15].

[0131] Lens surface (Surf) Radius of curvature (Radius) Thickness (Thick) Focal length (EFL) Refractive index (nd) Abbe number (vd) objinfinityinfinityS1infinity0S2*2.61921.03816.99011.49581.5S3*9.27600.1317S4*8.21480.2342- 18.09791.614425.93688S5*4.69090.3521S6*6.82570.349730.22451.53110255.929 02S7*11.42470.4985S8*-19.83470.4031-68.78761.686718.4S9*-34.16790.2842S10 *-4.47840.288830.62301.56717337.4026S11*-8.54290.6309S12*-6.71410.3200-5 6.20481.686718.4S13*-9.57300.4985S14*-8.57920.732510.67141.53110255.9290 2S15*-7.08661.0476S16*-9.26980.4892-5.11811.53110255.92902S17*-10.17810. 0104S18infinity0.1100infiniy1.516864.2S19infinity0.7905imginfinity-0.0100

[0132] 렌즈면(Surf)2_ASP3_ASP4_ASP5_ASP곡률반경(Radius)2.6192039.2760088.2148434.690924k(Conic)-0.01707-6.6005116.817834.044056A(4th) / C43.04E-050.000756-0.039620.00067B(6th) / C5-0.003490.003430.0078730.014073C(8th) / C6-0.00105-0.00063-0.00359-2.72E-05D(10th) / C7-0.00041-7.23E-05-0.00069-0.00022E(12th) / C8-4.66E-06-0.00012-0.00044-0.00033F(14th) / C9-5.73E-05-1.52E-05-8.14E-05-0.00013G(16th) / C101.86E-05-7.84E-06-2.61E-05-4.99E-05H(18th) / C11-1.70E-05-3.32E-063.10E-06-1.26E-05J(20th) / C121.23E-051.48E-054.41E-064.14E-06K(22th) / C13-1.17E-055.12E-06-9.11E-07-1.65E-06L(24th) / C149.83E-062.92E-06-2.04E-062.02E-06M(26th) / C15-5.06E-06-3.69E-062.30E-061.76E-07N(28th) / C166.08E-060-2.95E-063.18E-07O(30th) / C17-6.62E-060-4.20E-06-2.17E-06

[0133] 렌즈면(Surf)6_ASP7_ASP8_ASP9_ASP곡률반경(Radius)6.82568911.42469-19.8347-34.1679k(Conic)11.68376-70.1337-69.432699A(4th) / C4-0.08304-0.03712-0.23124-0.35233B(6th) / C50.0055630.003629-0.02049-0.026C(8th) / C60.0023990.003643-0.00291-0.00358D(10th) / C70.0004420.000603-0.00125-0.00135E(12th) / C8-7.60E-05-3.31E-05-0.00058-0.0005F(14th) / C9-4.05E-05-6.37E-05-0.00035.52E-05G(16th) / C10-3.06E-05-4.48E-05-6.60E-050.000215H(18th) / C113.02E-06-4.14E-06-4.01E-050.000147J(20th) / C12-9.24E-06-5.88E-062.41E-061.07E-04K(22th) / C132.23E-06-1.98E-06-3.49E-066.99E-05L(24th) / C14-5.07E-06-5.18E-062.17E-064.17E-05M(26th) / C152.40E-0605.45E-062.83E-05N(28th) / C165.30E-0708.82E-061.73E-05O(30th) / C171.32E-060.00E+002.32E-061.54E-05

[0134] 렌즈면(Surf)10_ASP11_ASP12_ASP13_ASP곡률반경(Radius)-4.4784-331.8155.8813754.998023k(Conic)-11.6535.5676161.3694941.29666A(4th) / C40.985455-0.3851-1.60326-2.61495B(6th) / C5-0.214360.0005770.030550.023986C(8th) / C60.0891630.0046740.04059-0.11148D(10th) / C7-0.024180.0036090.01867-0.06903E(12th) / C80.0021450.000828-0.00173-0.06565F(14th) / C90.007779-0.0004-0.0031-0.04532G(16th) / C10-9.12E-03-0.00018-0.00396-0.0395H(18th) / C117.16E-03-1.42E-04-0.00038-0.0276J(20th) / C12-5.21E-03-3.63E-050.000666-0.02274K(22th) / C133.57E-036.18E-050.000198-0.01762L(24th) / C14-2.10E-033.27E-052.93E-05-1.26E-02M(26th) / C151.04E-03-3.79E-06-2.65E-04-8.93E-03N(28th) / C16-3.93E-04-2.66E-06-4.65E-05-5.56E-03O(30th) / C171.71E-04-1.88E-061.42E-06-2.79E-03

[0135] 렌즈면(Surf)14_ASP15_ASP16_ASP17_ASP곡률반경(Radius)6.165552-102.652-2.35115-15.8584k(Conic)00-1-1.14547A(4th) / C4-2.56751-1.457214.73217-0.85262B(6th) / C50.3710380.20235-0.261110.297863C(8th) / C60.0503820.067175-0.128790.107361D(10th) / C70.02059-0.009470.038699-0.11628E(12th) / C8-0.02080.0152450.0426480.023098F(14th) / C9-0.01488-0.01714-0.062-0.02375G(16th) / C100.0062410.0070540.0450860.028007H(18th) / C110.0046870.001271-0.02659-0.01975J(20th) / C12-0.00066-0.001550.008150.001518K(22th) / C13-0.0017-0.00168-0.00235-0.00814L(24th) / C140.0008610.0015730.0013090.003111M(26th) / C15-0.00015-6.32E-06-0.001420.001642N(28th) / C161.74E-05-1.22E-041.04E-030.000985O(30th) / C172.26E-061.13E-04-6.90E-04-0.00098

[0136] The calculated values ​​of the [mathematical formulas] for the above-described camera module (400, 500, 600) and / or the lens assembly (LA) are described in [Table 16] below. As described in [Table 16], the camera module (400, 500, 600) and / or the lens assembly (LA) according to the embodiment(s) of the present disclosure can satisfy at least some of the above-described conditions including the [mathematical formulas]. For example, the camera module (400, 500, 600) and / or the lens assembly (LA) according to the embodiment(s) of the present disclosure can be miniaturized while having an angle of view of about 85 degrees or less and an F-number of about 1.9 or less.

[0137] Embodiment 10 of Fig. 6 Embodiment 14 of Fig. 11.79 1.85 1.90 Mathematical formula 21.186 1.21.17 OAL8.38.48.2 Mathematical formula 384.85 884.50 84.88

[0138] As described above, the camera module (400, 500, 600) and / or electronic device (101, 102, 104, 200, 300) according to the embodiment(s) of the present disclosure can provide wide-angle performance suitable for a high-performance and / or high-pixel image sensor (I), while optical performance such as aberration correction can be stabilized. In one embodiment, the camera module and / or electronic device can be easily miniaturized while providing an angle of view performance of approximately 85 degrees.

[0139] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure pertains from the description of the above-described embodiment(s).

[0140] According to one embodiment of the present disclosure, a camera module (e.g., a camera module (205, 212, 213) of FIGS. 2 to 3, a camera assembly (307) of FIGS. 4 to 5, a camera module (400, 500, 600) of FIGS. 6, 10, and / or 14) comprises an image sensor (e.g., an image sensor (I) of FIGS. 6, 10, and / or 14), and at least eight lenses (e.g., lenses (L1, L2, L3, L4, L5, L6, L7, L8) of FIGS. 6, 10, and / or 14) aligned along an optical axis (e.g., an optical axis (O) of FIGS. 6, 10, and / or 14)) configured to focus or guide light incident from outside the camera module onto the image sensor. and / or the lens assembly (LA) of FIG. 14.In one embodiment, the at least eight lenses include a first lens (e.g., a first lens (L1) of FIG. 6, FIG. 10, and / or FIG. 14) disposed farthest from the image sensor and comprising a glass material and having positive refractive power, a second lens (e.g., a second lens (L2) of FIG. 6, FIG. 10, and / or FIG. 14) disposed between the first lens and the image sensor and having positive or negative refractive power, a third lens (e.g., a third lens (L3) of FIG. 6, FIG. 10, and / or FIG. 14) disposed between the second lens and the image sensor and having positive or negative refractive power, a fourth lens (e.g., a fourth lens (L4) of FIG. 6, FIG. 10, and / or FIG. 14) disposed between the third lens and the image sensor and having positive or negative refractive power, and a fourth lens (L5) disposed between the fourth lens and the image sensor. The fifth lens may be disposed and have positive or negative refractive power (e.g., the fifth lens (L5) of FIG. 6, FIG. 10, and / or FIG. 14), a sixth lens disposed between the fifth lens and the image sensor and having positive or negative refractive power (e.g., the sixth lens (L6) of FIG. 6, FIG. 10, and / or FIG. 14), a seventh lens disposed between the sixth lens and the image sensor and having a convex sensor-side surface and having positive or negative refractive power (e.g., the seventh lens (L7) of FIG. 6, FIG. 10, and / or FIG. 14), and an eighth lens disposed between the seventh lens and the image sensor and having a convex sensor-side surface and having positive or negative refractive power (e.g., the eighth lens (L8) of FIG. 6, FIG. 10, and / or FIG. 14).

[0141] In one embodiment, the first lens may have an Abbe number of 65 or greater.

[0142] According to one embodiment, the lens assembly and / or camera module as described above may further include an aperture (e.g., the aperture stop of FIG. 6, FIG. 10, and / or FIG. 14) disposed between the object-side surface of the first lens and the object-side surface of the fourth lens.

[0143] According to one embodiment, at least one of the second lens, the third lens, the fourth lens, the fifth lens, the sixth lens, the seventh lens, or the eighth lens may include an aspherical object-side surface or an aspherical sensor-side surface.

[0144] According to one embodiment, the lens assembly may satisfy [Conditional Expression 1; Fno <= 1.9] and [Conditional Expression 2; OAL / ImgH <= 1.2]. In one embodiment, 'Fno' described in the [Conditional Expression](s) is the F-number of the camera module or the lens assembly, 'OAL' is the distance measured from the object-side surface of the first lens to the sensor-side surface of the eighth lens on the optical axis, and 'ImgH' may be the maximum height of the image sensor.

[0145] In one embodiment, the F-number of the lens assembly may be 1.4 or greater.

[0146] According to one embodiment, the lens assembly can satisfy a condition in which the output value of [Conditional Expression 2] is 1.05 or greater.

[0147] In one embodiment, the fourth lens may have negative refractive power, the fifth lens may have positive refractive power, the sixth lens may have negative refractive power, the seventh lens may have positive refractive power, and the eighth lens may have negative refractive power.

[0148] In one embodiment, at least one of the second lens, the third lens, the fourth lens, the fifth lens, the sixth lens, the seventh lens, or the eighth lens may be a plastic lens.

[0149] According to one embodiment, the first lens among the at least eight lenses may have the smallest refractive index.

[0150] According to one embodiment of the present disclosure, an electronic device (e.g., an electronic device (101, 200, 300) of FIGS. 1 to 5) may include a camera module (e.g., a camera module (205, 212, 213) of FIGS. 2 to 3, a camera assembly (307) of FIGS. 4 to 5, a camera module (400, 500, 600) of FIGS. 6, 10, 14, 18, 22, 26 and / or 30), at least one processor (e.g., a processor (120) of FIG. 1), and a memory (e.g., a memory (130) of FIG. 1) storing instructions that, when executed by the at least one processor, cause the electronic device to acquire an image of a subject using the camera module. In one embodiment, the camera module may include an image sensor (e.g., an image sensor (I) of FIG. 6, FIG. 10, and / or FIG. 14), and at least eight lenses (e.g., lenses L1, L2, L3, L4, L5, L6, L7, L8 of FIG. 6, FIG. 10, and / or FIG. 14) aligned along an optical axis (e.g., an optical axis O of FIG. 6, FIG. 10, and / or FIG. 14), and a lens assembly (e.g., a lens assembly (LA) of FIG. 6, FIG. 10, and / or FIG. 14) configured to focus or guide light incident from outside the camera module onto the image sensor.In one embodiment, the at least eight lenses include a first lens (e.g., a first lens (L1) of FIG. 6, FIG. 10, and / or FIG. 14) disposed farthest from the image sensor and comprising a glass material and having positive refractive power, a second lens (e.g., a second lens (L2) of FIG. 6, FIG. 10, and / or FIG. 14) disposed between the first lens and the image sensor and having positive or negative refractive power, a third lens (e.g., a third lens (L3) of FIG. 6, FIG. 10, and / or FIG. 14) disposed between the second lens and the image sensor and having positive or negative refractive power, a fourth lens (e.g., a fourth lens (L4) of FIG. 6, FIG. 10, and / or FIG. 14) disposed between the third lens and the image sensor and having positive or negative refractive power, and a fourth lens (L5) disposed between the fourth lens and the image sensor. The fifth lens may be disposed and have positive or negative refractive power (e.g., the fifth lens (L5) of FIG. 6, FIG. 10, and / or FIG. 14), a sixth lens disposed between the fifth lens and the image sensor and having positive or negative refractive power (e.g., the sixth lens (L6) of FIG. 6, FIG. 10, and / or FIG. 14), a seventh lens disposed between the sixth lens and the image sensor and having a convex sensor-side surface and having positive or negative refractive power (e.g., the seventh lens (L7) of FIG. 6, FIG. 10, and / or FIG. 14), and an eighth lens disposed between the seventh lens and the image sensor and having a convex sensor-side surface and having positive or negative refractive power (e.g., the eighth lens (L8) of FIG. 6, FIG. 10, and / or FIG. 14).

[0151] In one embodiment, the first lens may have an Abbe number of 65 or greater.

[0152] According to one embodiment, the lens assembly, camera module and / or electronic device as described above may further include an aperture (e.g., the aperture stop of FIGS. 6, 10, and / or 14) disposed between the object-side surface of the first lens and the object-side surface of the fourth lens.

[0153] According to one embodiment, at least one of the second lens, the third lens, the fourth lens, the fifth lens, the sixth lens, the seventh lens, or the eighth lens may include an aspherical object-side surface or an aspherical sensor-side surface.

[0154] According to one embodiment, the lens assembly may satisfy [Conditional Expression 1; Fno <= 1.9] and [Conditional Expression 2; OAL / ImgH <= 1.2]. In one embodiment, 'Fno' described in the [Conditional Expression](s) is the F-number of the camera module or the lens assembly, 'OAL' is the distance measured from the object-side surface of the first lens to the sensor-side surface of the eighth lens on the optical axis, and 'ImgH' may be the maximum height of the image sensor.

[0155] In one embodiment, the F-number of the lens assembly may be 1.4 or greater.

[0156] According to one embodiment, the lens assembly can satisfy a condition in which the output value of [Conditional Expression 2] is 1.05 or greater.

[0157] In one embodiment, at least one of the second lens, the third lens, the fourth lens, the fifth lens, the sixth lens, the seventh lens, or the eighth lens may be a plastic lens.

[0158] According to one embodiment, the memory may store instructions that, when executed by the at least one processor, cause the electronic device to perform a focus adjustment operation by moving at least one of the at least eight lenses in the optical axis direction.

[0159] According to one embodiment, the memory may store instructions that, when executed by the at least one processor, cause the electronic device to perform a shake correction operation by moving at least one of the at least eight lenses in a direction parallel to a plane perpendicular to the optical axis.

[0160] While the present disclosure has been described by way of example and specific embodiment, it should be understood that the specific embodiment is intended to be illustrative and not limiting of the present disclosure. It will be apparent to those skilled in the art that various changes in form and specific configuration may be made without departing from the overall scope of the present disclosure, including the appended claims and their equivalents. For example, the materials of the lenses and the more specific shapes of the lenses may be varied or combined in various ways, as long as the camera module and / or lens assembly satisfy at least some of the conditions described above.

Claims

1. In the camera module (180; 280; 205; 212; 213; 400; 500; 600), Image sensor (I); and A lens assembly (LA) including at least eight lenses (L1, L2, L3, L4, L5, L6, L7, L8) aligned along an optical axis (O) and configured to focus or guide light incident from outside the camera module to the image sensor, At least 8 lenses above, A first lens (L1) disposed furthest from the image sensor and having positive refractive power and including a glass material; A second lens (L2) disposed between the first lens and the image sensor and having positive refractive power or negative refractive power; A third lens (L3) disposed between the second lens and the image sensor and having positive or negative refractive power; A fourth lens (L4) disposed between the third lens and the image sensor and having positive or negative refractive power; A fifth lens (L5) disposed between the fourth lens and the image sensor and having positive or negative refractive power; A sixth lens (L6) disposed between the fifth lens and the image sensor and having positive or negative refractive power; A seventh lens (L7) disposed between the sixth lens and the image sensor, and having a convex sensor-side surface and having positive or negative refractive power; and A camera module including an eighth lens (L8) disposed between the seventh lens and the image sensor and having a convex sensor-side surface and having positive or negative refractive power.

2. In the first paragraph, the camera module has an Abbe number of 65 or more.

3. In any one of paragraphs 1 to 2, A camera module further comprising an aperture (stop) positioned between the object-side surface of the first lens and the object-side surface of the fourth lens.

4. A camera module according to any one of claims 1 to 3, wherein at least one of the second lens, the third lens, the fourth lens, the fifth lens, the sixth lens, the seventh lens, or the eighth lens comprises an aspherical object-side surface or an aspherical sensor-side surface.

5. A camera module according to any one of claims 1 to 4, wherein the lens assembly satisfies the following [Conditional Expression 1] and [Conditional Expression 2]. [Condition 1] Fno <= 1.9 [Condition 2] OAL / ImgH <= 1.2 (Here, 'Fno' is the F-number of the camera module or the lens assembly, 'OAL' is the distance measured from the object-side surface of the first lens to the sensor-side surface of the eighth lens on the optical axis, and 'ImgH' is the maximum height of the image sensor.) 6. A camera module in accordance with claim 5, wherein the F-number of the lens assembly is 1.4 or more.

7. A camera module according to any one of clauses 5 to 6, wherein the lens assembly satisfies the condition that the calculated value of [Conditional Expression 2] is 1.05 or greater.

8. A camera module according to any one of claims 1 to 7, wherein the fourth lens has negative refractive power, the fifth lens has positive refractive power, the sixth lens has negative refractive power, the seventh lens has positive refractive power, and the eighth lens has negative refractive power.

9. A camera module according to any one of claims 1 to 8, wherein at least one of the second lens, the third lens, the fourth lens, the fifth lens, the sixth lens, the seventh lens, or the eighth lens is a plastic lens.

10. A camera module according to any one of claims 1 to 9, wherein the first lens among the at least eight lenses has the smallest refractive index.

11. In electronic devices (101; 102; 104; 200; 300), A camera module (180; 280; 205; 212; 213; 400; 500; 600) according to any one of claims 1 to 10; At least one processor (120); and An electronic device including a memory (130) having stored therein commands set to cause the electronic device to acquire a subject image using the camera module when executed by at least one processor.

12. In the 11th paragraph, the memory stores instructions that, when executed by the at least one processor, cause the electronic device to perform a focus adjustment operation by moving at least one of the at least eight lenses in the optical axis direction.

13. An electronic device according to any one of claims 11 to 12, wherein the memory stores instructions that, when executed by the at least one processor, cause the electronic device to perform a shake correction operation by moving at least one of the at least eight lenses in a direction parallel to a plane perpendicular to the optical axis.

Images