Printed circuit board assembly and electronic device comprising same

Abstract

An electronic device or a printed circuit board assembly, according to one embodiment of the present disclosure, may comprise: a printed circuit board having electronic components disposed thereon; a shield can disposed to shield the electronic components; a composite heat-dissipation structure disposed on the electronic components; and a shielding layer disposed on the composite heat-dissipation structure. In addition, the electronic device may comprise a display disposed on the shielding layer. Other various embodiments are possible.

Description

Printed circuit board assembly and electronic device including the same

[0001] Embodiments of the present disclosure relate to a printed circuit board assembly (PBA) including a heat dissipation structure and an electronic device including the same.

[0002] An electronic device may refer to (or include) a device that performs a specified function according to a program installed thereon, such as an electric product, an electronic notebook, a portable multimedia player, a mobile communication terminal, a tablet PC, a video / audio device, a desktop / laptop computer, or a vehicle navigation system. An electronic device may include a processor (e.g., an application processor (AP), a central processing unit (CPU)), memory (e.g., DRAM), and a printed circuit board (PCB) on which electronic components and peripheral circuits are arranged.

[0003] An electronic device may include shielding components (e.g., shielding members) for shielding noise (e.g., electromagnetic waves) generated from a processor, memory, and electronic components. The electronic device may include a heat dissipation structure for dissipating heat generated from the processor, memory, and electronic components. For example, the heat dissipation structure may include a heat dissipation material (e.g., a thermal interface material (TIM)), a heat spreading plate, and / or a heat spreading sheet.

[0004] The above-described material is provided solely as background information to aid in understanding the embodiments of the present disclosure. No determination has been made, and no claims are made, as to whether any of the above material constitutes prior art in connection with the present disclosure.

[0005] In order to shield noise (e.g., electromagnetic waves) generated from components of an electronic device, a metal frame (e.g., a metal plate) and a shield can surrounding the processor, memory, and electronic components may be applied. In order to dissipate heat generated from the processor, memory, and electronic components of the electronic device, a heat dissipation structure (e.g., a thermal dissipation material (TIM), a heat diffusion plate, a heat diffusion sheet) may be included.

[0006] Electronic devices incorporate processors, memory, and electronic components that consume a high amount of power per unit area (i.e., power density). These processors, memory, and electronic components, which consume a high amount of power per unit area, are placed on a limited-area printed circuit board (PCB), which can generate heat in the electronic devices. The increased heat generated by the electronic devices can degrade the performance and shorten the lifespan of the processors, memory, and electronic components. Furthermore, the increased heat generated can cause the temperature of the external surface of the electronic devices to rise, potentially causing discomfort and / or danger to the user.

[0007] Alumina (Al2O3), typically used as a material for heat-dissipating structures, can be used as a thermal interface material (TIM) for processors (e.g., application processors) as a non-conductive filler. As the power generated by processors (e.g., application processors) continues to increase, TIMs with higher thermal conductivity are required to effectively remove the high heat generated by these processors. Because high electrical conductivity also translates to high thermal conductivity, fillers with high electrical conductivity can be used as TIMs.

[0008] Conventional high-conductivity thermal interface materials (TIMs) contain a large amount of rigid conductive fillers. Excessive compression can cause deformation of other components in electronic devices, such as the display and support elements (e.g., the front metal) of a smartphone. Furthermore, various electronic components, such as passive components, PMICs, and ICs, are located around processors (e.g., application processors), and spreading of the conductive fillers can lead to short circuits.

[0009] Thermal interface materials (TIMs) must effectively transfer heat between electronic components by filling the space between them. However, rigid TIMs may not be able to fill the voids existing at the rough interfaces of electronic components that require heat dissipation. This results in parasitic heat resistance, which may prevent the full utilization of high thermal conductivity. Liquid TIMs or highly compressible solid TIMs can be used, but the low thermal conductivity of the materials included to ensure flexibility may prevent them from effectively dissipating heat generated by the processor (e.g., application processor).

[0010] Embodiments of the present disclosure can provide a printed circuit board assembly including a heat dissipation structure capable of efficiently dissipating heat generated from a heat-generating component (e.g., a processor, a memory), and an electronic device including the printed circuit board assembly.

[0011] Embodiments of the present disclosure can provide a printed circuit board assembly including a heat dissipation structure capable of delaying a DTM (dynamic thermal management) point at which a maximum temperature at which a performance limit of an electronic device is reached and lowering a temperature of a processor (application processor, GPU), and an electronic device including the printed circuit board assembly.

[0012] The technical challenges addressed in this document are not limited to the technical challenges mentioned above, and may be expanded upon without departing from the spirit and scope of the present disclosure. Additional technical challenges not mentioned herein will be readily apparent to those skilled in the art, as described below.

[0013] An electronic device according to one embodiment of the present disclosure may include a printed circuit board having electronic components arranged thereon. The electronic device may include a shield can arranged to shield the electronic components. The electronic device may include a composite heat dissipation structure arranged over the electronic components. The electronic device may include a shielding layer (e.g., a shielding film) arranged over the composite heat dissipation structure. The electronic device may include a display arranged over the shielding layer (e.g., a shielding film).

[0014] A printed circuit board assembly according to one embodiment of the present disclosure may include a printed circuit board on which electronic components are arranged. The printed circuit board assembly may include a shield can arranged to shield the electronic components. The printed circuit board assembly may include a composite heat dissipation structure arranged over the electronic components. The printed circuit board assembly may include a shielding layer (e.g., a shielding film) arranged over the composite heat dissipation structure.

[0015] A printed circuit board assembly including a heat dissipation structure of the present disclosure, and an electronic device including the printed circuit board assembly, can efficiently dissipate heat generated from a heat-generating component (e.g., a processor, a memory).

[0016] A printed circuit board assembly including a heat dissipation structure of the present disclosure, and an electronic device including the printed circuit board assembly, can delay a DTM (dynamic thermal management) point at which the maximum temperature at which the performance limit of the electronic device is performed is reached, and lower the temperature of a processor (application processor, GPU).

[0017] A printed circuit board assembly including a composite heat dissipation structure of the present disclosure, and an electronic device including the printed circuit board assembly, can prevent a short circuit from occurring by having a first heat dissipation structure (e.g., an insulating heat dissipation structure) disposed to cover at least a portion of an upper surface of heat-generating components (e.g., a processor, a memory), and a second heat dissipation structure (e.g., a conductive heat dissipation structure) disposed to cover at least a portion of an upper surface of the first heat dissipation structure (e.g., an insulating heat dissipation structure).

[0018] In a composite heat dissipation structure according to an embodiment of the present disclosure, the compression ratios of the first heat dissipation structure (e.g., an insulating heat dissipation structure) and the second heat dissipation structure (e.g., a conductive heat dissipation structure) are different from each other, so that defects due to compression can be prevented during the manufacturing process.

[0019] A composite heat dissipation structure according to an embodiment of the present disclosure can reduce thermal resistance at an interface between heat-generating components (e.g., processor, memory) and the composite heat dissipation structure by applying a compressible thermal interface material (TIM).

[0020] A printed circuit board assembly including a heat dissipation structure of the present disclosure, and an electronic device including the printed circuit board assembly, can improve heat dissipation performance of heat generated from a processor and memory in an environment where high heat generation of about 15 W is generated.

[0021] A printed circuit board assembly including a heat dissipation structure of the present disclosure, and an electronic device including the printed circuit board assembly, compare the DTM (dynamic thermal management) point in time and the GPU temperature at which the performance limit of the electronic device is reached, and, as a result, compared to comparative examples (#1, #2), by applying the heat dissipation structure (#3) of the present disclosure, the DTM point in time can be delayed by about 54 to 58 seconds, and the temperature of the processor can be lowered by about -5.8°C.

[0022] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0023] In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

[0024] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments of the present disclosure.

[0025] FIGS. 2A and 2B are front and rear views of a first state (e.g., unfolded stage) of an electronic device according to one embodiment of the present disclosure.

[0026] FIGS. 2C and 2D are front and rear views of a second state (e.g., folded state) of an electronic device according to one embodiment of the present disclosure.

[0027] FIG. 3A is a perspective view of a first side (e.g., a front side) of an electronic device according to one embodiment of the present disclosure.

[0028] FIG. 3b is a perspective view of a second side (e.g., a rear side) of an electronic device according to one embodiment of the present disclosure.

[0029] FIG. 4 is a drawing showing a printed circuit board assembly including a heat dissipation structure according to one embodiment of the present disclosure, and an electronic device including the printed circuit board assembly.

[0030] FIGS. 5 to 7 are drawings showing a method for forming a heat dissipation structure of the printed circuit board assembly illustrated in FIG. 4.

[0031] FIG. 8 is a drawing showing a method for forming a heat dissipation structure of the printed circuit board assembly illustrated in FIG. 4.

[0032] FIG. 9 is a drawing showing a printed circuit board assembly including a heat dissipation structure according to one embodiment of the present disclosure, and an electronic device including the printed circuit board assembly.

[0033] FIG. 10 is a drawing showing a printed circuit board assembly including a heat dissipation structure according to one embodiment of the present disclosure, and an electronic device including the printed circuit board assembly.

[0034] FIG. 11 is a drawing showing a printed circuit board assembly including a heat dissipation structure according to one embodiment of the present disclosure, and an electronic device including the printed circuit board assembly.

[0035] It should be noted that throughout the drawings, the same reference numbers are used to describe identical or similar elements, features and structures.

[0036] The following description, with reference to the accompanying drawings, is provided to facilitate a comprehensive understanding of various embodiments of the disclosure as defined by the claims and their equivalents. While it includes numerous specific details to aid understanding, these are to be considered merely illustrative. Accordingly, those skilled in the art will recognize that various changes and modifications can be made to the various embodiments described herein without departing from the scope and spirit of the disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and brevity.

[0037] The terms and words used in the following description and claims are not limited to their literary meanings and are merely used by the applicant to facilitate a clear and consistent understanding of this document. Therefore, it should be apparent to those skilled in the art that the following description of various embodiments of this document is provided for illustrative purposes only, and is not intended to limit this document as defined by the appended claims and their equivalents.

[0038] Singular forms should be understood to include plural referents unless the context clearly dictates otherwise. Thus, for example, a reference to "component surfaces" may include reference to one or more of such surfaces.

[0039] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0040] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0041] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0042] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0043] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0044] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0045] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0046] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0047] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0048] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0049] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0050] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0051] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0052] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0053] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0054] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0055] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0056] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0057] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0058] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0059] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0060] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0061] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0062] An electronic device according to an embodiment disclosed in this document may take various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. The electronic device according to an embodiment of this document is not limited to the aforementioned devices.

[0063] The embodiments of the present disclosure and the terminology used therein are not intended to limit the technical features described in this document to a specific embodiment, but should be understood to include various modifications, equivalents, or substitutes of the embodiment. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the item, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among the phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0064] The term "module" used in one embodiment of the present disclosure may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0065] An embodiment of the present disclosure may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0066] According to one embodiment, the method according to one embodiment disclosed in the present document may be provided as a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0067] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to one embodiment, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to one embodiment, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0068] According to one embodiment, the display module (160) may include a flexible display configured to be foldable or unfoldable.

[0069] According to one embodiment, the display module (160) may include a flexible display that is arranged to be slidable in a first direction (e.g., slidable in the x-axis direction) or slidable in a second direction (e.g., slidable in the y-axis direction) to provide a screen (e.g., a display screen).

[0070] According to one embodiment, the display module (160) may be referred to as a stretchable display, an expandable display, or a slide-in / out display.

[0071] According to one embodiment, the display module (160) may include a bar type or plate type display.

[0072] According to one embodiment, the processor (120), memory (130) and electronic components of the electronic device (101) of FIG. 1 may be arranged on a printed circuit board (PCB) or a printed circuit board assembly (PBA).

[0073] According to one embodiment, the electronic device (101) of FIG. 1 may include a heat dissipation structure (e.g., a composite heat dissipation structure (402) of FIG. 4) for dissipating heat generated from the processor (120), memory (130), and electronic components.

[0074] FIGS. 2A and 2B are front and rear views of a first state (e.g., unfolded state) of an electronic device according to an embodiment of the present disclosure. FIGS. 2C and 2D are front and rear views of a second state (e.g., folded state) of an electronic device according to an embodiment of the present disclosure.

[0075] Referring to FIGS. 2A to 2D , an electronic device (200) according to an embodiment of the present disclosure (e.g., the electronic device (101) of FIG. 1 , the electronic device (400) of FIG. 4 ) may include a pair of housings (210, 220) (e.g., a foldable housing structure) that are rotatably coupled about a folding axis (F) through at least one hinge device (e.g., a hinge module or a hinge structure) so as to be foldable with respect to each other, a first display (230) (e.g., a flexible display, a foldable display, or a main display) disposed through the pair of housings (210, 220), and / or a second display (235) (e.g., a sub-display) disposed through the second housing (220).

[0076] According to one embodiment, at least a portion of at least one hinge device may be arranged so as to be invisible from the outside through the first housing (210) and the second housing (220), and may be arranged so as to be invisible from the outside through the hinge housing (290) (e.g., hinge cover) that covers the foldable portion in a first state (e.g., unfolded state). In this document, the surface on which the first display (230) is arranged may be defined as the front surface of the electronic device (200). In this document, the surface opposite the front surface may be defined as the back surface of the electronic device (200). In addition, the surface surrounding the space between the front surface and the back surface may be defined as the side surface of the electronic device (200).

[0077] According to one embodiment, a pair of housings (210, 220) may include a first housing (210) and a second housing (220) that are foldably arranged relative to each other via at least one hinge device.

[0078] According to one embodiment, the pair of housings (210, 220) are not limited to the shapes and combinations shown in FIGS. 2a to 2d, and may be implemented by other shapes or combinations and / or combinations of parts.

[0079] According to one embodiment, the first housing (210) and the second housing (220) are arranged on both sides of the folding axis (F), have an overall symmetrical shape with respect to the folding axis (F), and can be folded to match each other.

[0080] According to one embodiment, the first housing (210) and the second housing (220) may be folded asymmetrically with respect to the folding axis (F).

[0081] According to one embodiment, the angle or distance between the first housing (210) and the second housing (220) may be different depending on whether the electronic device (200) is in a first state (e.g., unfolded stage), a second state (e.g., folded state), or a third state (e.g., intermediate state). For example, the electronic device (200) may sense whether it is in the first state (e.g., unfolded stage), the second state (e.g., folded state), or the third state (e.g., intermediate state) using a sensor module (e.g., sensor module (176) of FIG. 1). The electronic device (200) may sense the angle between the first housing (210) and the second housing (220) using a sensor module (e.g., sensor module (176) of FIG. 1).

[0082] According to one embodiment, the first housing (210) may be connected to at least one hinge device in a first state (e.g., an unfolded state) of the electronic device (200). The first housing (210) may include a first side member (213) arranged to face the front of the electronic device (200), a second side member (212) facing in an opposite direction of the first side member (211), and / or a first side member (213) enclosing at least a portion of a first space (2101) between the first side member (211) and the second side member (212).

[0083] According to one embodiment, the second housing (220) may be connected to at least one hinge device in a first state (e.g., an unfolded state) of the electronic device (200). The second housing (220) may include a third face (221) arranged to face the front of the electronic device (200), a fourth face (222) facing in an opposite direction of the third face (221), and / or a second side member (223) surrounding at least a portion of a second space (2201) between the third face (221) and the fourth face (222).

[0084] According to one embodiment, the first side (211) may be at least partially oriented in substantially the same direction as the third side (221) in a first state (e.g., an unfolded state) and may face the third side (221) in a second state (e.g., a folded state).

[0085] According to one embodiment, the electronic device (200) may include a recess (201) formed to accommodate a first display (230) through a structural combination of a first housing (210) and a second housing (220).

[0086] In one embodiment, the recess (201) may have substantially the same size as the first display (230).

[0087] According to one embodiment, the first housing (210) may be coupled to a first side member (213) when the first display (230) is viewed from above. The first housing (210) may include a first protective frame (213a) (e.g., a first decorative member) that overlaps an edge of the first display (230) to cover the edge of the first display (230) so that it is not visible from the outside.

[0088] According to one embodiment, the first protective frame (213a) may be formed integrally with the first side member (213).

[0089] According to one embodiment, the second housing (220) may be coupled to a second side member (223) when the first display (230) is viewed from above. The second housing (220) may include a second protective frame (223a) that overlaps an edge of the first display (230) to cover the edge of the first display (230) so that it is not visible from the outside.

[0090] According to one embodiment, the second protective frame (223a) may be formed integrally with the second side member (223). In one embodiment, the first protective frame (213a) and the second protective frame (223a) may be omitted.

[0091] In one embodiment, a hinge housing (290) (e.g., a hinge cover) may be positioned between the first housing (210) and the second housing (220). The hinge housing (290) may be positioned to cover a portion of at least one hinge device (e.g., at least one hinge module).

[0092] According to one embodiment, the hinge housing (290) may be partially obscured by the first housing (210) and the second housing (220) or may be visually exposed to the outside, depending on the first state (e.g., unfolded state), the second state (e.g., folded state), or the third state (e.g., intermediate state) of the electronic device (200). For example, when the electronic device (200) is in the first state (e.g., unfolded state), at least a portion of the hinge housing (290) may be obscured by the first housing (210) and the second housing (220) and may be arranged so as to be substantially invisible from the outside.

[0093] According to one embodiment, when the electronic device (200) is in the second state (folded state), at least a portion of the hinge housing (290) may be positioned between the first housing (210) and the second housing (220) so as to be visible from the outside.

[0094] According to one embodiment, when the first housing (210) and the second housing (220) are in a third state (intermediate state) where they are folded at a certain angle, the hinge housing (290) may be positioned between the first housing (210) and the second housing (220) so as to be at least partially visible from the outside of the electronic device (200). For example, the area where the hinge housing (290) is exposed to the outside may be less than that in the completely folded state. According to one embodiment, the hinge housing (290) may include a curved surface.

[0095] According to one embodiment, when the electronic device (200) is in a first state (e.g., an unfolded state), the first housing (210) and the second housing (220) form an angle of about 180 degrees, and the first region (230a), the second region (230b), and the folding region (230c) of the first display (230) may form substantially the same plane. The first region (230a), the second region (230b), and the folding region (230c) of the first display (230) may be arranged to face substantially the same direction (e.g., the z-axis direction). As an example, when the electronic device (200) is in a first state (e.g., unfolded state), the first housing (210) may be rotated about 360 degrees with respect to the second housing (220) so that the second side (212) and the fourth side (222) face each other and may be folded in the opposite direction (e.g., out folding).

[0096] According to one embodiment, when the electronic device (200) is in the second state (folded state), the first side (211) of the first housing (210) and the third side (221) of the second housing (220) may be arranged to face each other. In this case, the first area (230a) and the second area (230b) of the first display (230) may be arranged to face each other while forming a narrow angle (e.g., in the range of 0 degrees to about 10 degrees) with each other through the folding area (230c). According to one embodiment, at least a portion of the folding area (230c) may be deformed into a curved shape having a predetermined curvature.

[0097] According to one embodiment, when the electronic device (200) is in the third state (intermediate state), the first housing (210) and the second housing (220) may be arranged at a certain angle with respect to each other. In this case, the first region (230a) and the second region (230b) of the first display (230) may form an angle that is larger than the second state (e.g., folded state) and smaller than the first state (e.g., unfolded state), and the curvature of the folding region (230c) may be smaller than the second state (folded state) and larger than the first state (e.g., unfolded state). In one embodiment, the first housing (210) and the second housing (220) may form an angle that can be stopped at a specified folding angle between the second state (e.g., folded state) and the third state (e.g., intermediate state) through at least one hinge device (e.g., free stop function). In one embodiment, the first housing (210) and the second housing (220) may be continuously operated while being pressed in an unfolding or folding direction based on a specified inflection angle through at least one hinge device.

[0098] According to one embodiment, the electronic device (200) may include at least one of a display (230, 235), an input device (215), audio output devices (227, 228), sensor modules (217a, 217b, 226), camera modules (216a, 216b, 225), a key input device (219), an indicator (not shown), or a connector port (229) disposed in the first housing (210) and / or the second housing (220). In one embodiment, the electronic device (200) may omit at least one of the components or may additionally include at least one other component.

[0099] According to one embodiment, at least one display (230, 235) may include a first display (230) (e.g., a flexible display) that is arranged to be supported by a third side (221) of a second housing (220) via at least one hinge device from a first side (211) of a first housing (210), and a second display (235) that is arranged to be at least partially visible from the outside through a fourth side (222) in an interior space of the second housing (220).

[0100] In one embodiment, the second display (235) may be positioned so as to be visible from the outside through the second surface (212) in the interior space of the first housing (210).

[0101] According to one embodiment, the first display (230) may be primarily used in a first state (e.g., unfolded state) of the electronic device (200). The second display (235) may also be used in the first state (e.g., unfolded state) of the electronic device (200).

[0102] According to one embodiment, the second display (235) may be primarily used in a second state (e.g., folded state) of the electronic device (200). The first display (230) may also be used in the second state (e.g., folded state) of the electronic device (200).

[0103] According to one embodiment, the electronic device (200) can control the first display (230) and / or the second display (235) to be usable based on the folding angles of the first housing (210) and the second housing (220) in the third state (e.g., intermediate state).

[0104] According to one embodiment, the first display (230) may be disposed in a receiving space formed by a pair of housings (210, 220). For example, the first display (200) may be disposed in a recess (201) formed by the pair of housings (210, 220), and may be disposed to occupy substantially most of the front surface of the electronic device (200) in a first state (e.g., an unfolded state). According to one embodiment, the first display (230) may include a flexible display in which at least a portion of the display may be transformed into a flat or curved surface.

[0105] According to one embodiment, the first display (230) may include a first area (230a) facing the first housing (210) and a second area (230b) facing the second housing (220). According to one embodiment, the first display (230) may include a folding area (230c) including a portion of the first area (230a) and a portion of the second area (230b) with respect to the folding axis (F).

[0106] According to one embodiment, at least a portion of the folding area (230c) may include an area corresponding to at least one hinge device.

[0107] According to one embodiment, the area division of the first display (230) is merely an exemplary physical division by a pair of housings (210, 220) and at least one hinge device, and substantially, the first display (230) can be displayed as a seamless, full screen through the pair of housings (210, 220) and at least one hinge device.

[0108] According to one embodiment, the first region (230a) and the second region (230b) may have an overall symmetrical shape with respect to the folding region (230c) or may have a partially asymmetrical shape.

[0109] According to one embodiment, the electronic device (200) may include a first rear cover (240) disposed on a second side (212) of a first housing (210) and a second rear cover (250) disposed on a fourth side (222) of a second housing (220). In one embodiment, at least a portion of the first rear cover (240) may be formed integrally with the first side member (213). In one embodiment, at least a portion of the second rear cover (250) may be formed integrally with the second side member (223).

[0110] In one embodiment, at least one of the first rear cover (240) and the second rear cover (250) may be formed of a substantially transparent plate (e.g., a glass plate including various coating layers, or a polymer plate) or an opaque plate. In one embodiment, the first rear cover (240) may be formed of an opaque plate, such as, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials.

[0111] According to one embodiment, the second rear cover (250) may be formed of a substantially transparent plate, such as glass or polymer. Accordingly, the second display (235) may be positioned so as to be visible from the outside through the second rear cover (250) in the internal space of the second housing (220).

[0112] In one embodiment, the input device (215) may include a microphone. In one embodiment, the input device (215) may include a plurality of microphones arranged to detect the direction of sound.

[0113] In one embodiment, the audio output devices (227, 228) may include speakers. In one embodiment, the audio output devices (227, 228) may include a call receiver (227) disposed through a fourth side (222) of the second housing (220) and an external speaker (228) disposed through at least a portion of a second side member (223) of the second housing (220).

[0114] In one embodiment, the input device (215), the audio output devices (227, 228), and the connector port (229) may be arranged in spaces of the first housing (210) and / or the second housing (220). The input device (215), the audio output devices (227, 228), and the connector port (229) may be exposed to the external environment through at least one hole formed in the first housing (210) and / or the second housing (220). In one embodiment, the holes formed in the first housing (210) and / or the second housing (220) may be used in common for the input device (215) and the audio output devices (227, 228). In one embodiment, the audio output devices (227, 228) may include a speaker (e.g., a piezo speaker) that operates without the hole formed in the first housing (210) and / or the second housing (220).

[0115] According to one embodiment, the camera modules (216a, 216b, 225) may include a first camera module (216a) disposed on a first side (211) of the first housing (210), a second camera module (216b) disposed on a second side (212) of the first housing (210), and / or a third camera module (225) disposed on a fourth side (222) of the second housing (220).

[0116] According to one embodiment, the electronic device (200) may include a flash (218) positioned near the second camera module (216b). According to one embodiment, the flash (218) may include, for example, a light emitting diode or a xenon lamp.

[0117] According to one embodiment, the camera modules (216a, 216b, 225) may include one or more lenses, image sensors, and / or image signal processors. In one embodiment, at least one of the camera modules (216a, 216b, 225) includes two or more lenses (e.g., wide-angle and telephoto lenses) and image sensors, and may be arranged together on either side of the first housing (210) and / or the second housing (220).

[0118] According to one embodiment, the sensor modules (217a, 217b, 226) (e.g., the sensor module (176) of FIG. 1) may generate electrical signals or data values ​​corresponding to an internal operating state of the electronic device (200) or an external environmental state.

[0119] According to one embodiment, the sensor modules (217a, 217b, 226) (e.g., sensor module (176) of FIG. 1) may include a first sensor module (217a) disposed on a first surface (211) of the first housing (210), a second sensor module (217b) disposed on a second surface (212) of the first housing (210), and / or a third sensor module (226) disposed on a fourth surface (222) of the second housing (220).

[0120] In one embodiment, the sensor modules (217a, 217b, 226) (e.g., sensor module (176) of FIG. 1) may include at least one of a gesture sensor, a gyro sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a light sensor, an ultrasonic sensor, a proximity sensor, a biometric sensor (e.g., an iris recognition sensor), a distance detection sensor (e.g., a time of flight (TOF) sensor, a light detection and ranging (LiDAR) sensor), a barometric pressure sensor, a magnetic sensor (e.g., a 6-axis sensor, a geomagnetic sensor), an acceleration sensor, a temperature sensor, a humidity sensor, and / or a fingerprint recognition sensor.

[0121] According to one embodiment, a processor of an electronic device (200) (e.g., processor (120) of FIG. 1) may operate sensor modules (217a, 217b, 226) (e.g., sensor module (176) of FIG. 1) to sense the illumination and / or IR intensity of the surroundings of the electronic device (200). The processor (120) may obtain information about the illumination and IR intensity of the surroundings of the electronic device (200).

[0122] According to one embodiment, the electronic device (200) may include at least one of a gesture sensor, a gyro sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a light sensor, an ultrasonic sensor, a proximity sensor, a biometric sensor (e.g., an iris recognition sensor), a distance detection sensor (e.g., a time of flight (TOF) sensor, a light detection and ranging (LiDAR) sensor), a barometric pressure sensor, a magnetic sensor (e.g., a 6-axis sensor, a geomagnetic sensor), an acceleration sensor, a temperature sensor, a humidity sensor, and / or a fingerprint recognition sensor, which are not shown.

[0123] In one embodiment, the fingerprint recognition sensor may be disposed through at least one of the first side member (213) of the first housing (210) and / or the second side member (223) of the second housing (220).

[0124] According to one embodiment, the key input device (219) may be arranged to be visually exposed to the outside through the first side member (213) of the first housing (210). In one embodiment, the key input device (219) may also be arranged to be visually exposed to the outside through the second side member (223) of the second housing (220). In one embodiment, the electronic device (200) may not include some or all of the key input devices (219), and the key input devices (219) that are not included may be implemented in another form, such as a soft key, on at least one display (230, 235). As one embodiment, the key input device (219) may be implemented using a pressure sensor included in at least one display (230, 235).

[0125] According to one embodiment, the connector port (229) may include a connector (e.g., a USB connector or an IF module (interface connector port module)) for transmitting and receiving power and / or data with an external electronic device. In one embodiment, the connector port (229) may also perform a function for transmitting and receiving audio signals with the external electronic device, or may further include a separate connector port (e.g., an ear jack hole) for performing a function for transmitting and receiving audio signals.

[0126] According to one embodiment, at least one of the camera modules (216a, 216b, 225), at least one of the sensor modules (217a, 217b, 226), and / or an indicator may be arranged to be visually exposed through at least one display (230, 235). For example, at least one of the camera modules (216a, 225), at least one of the sensor modules (217a, 226), and / or the indicator may be arranged in an interior space of at least one housing (210, 220), below an active area (display area) of at least one display (230, 235). At least one camera module (216a, 225), at least one sensor module (217a, 226) and / or an indicator may be positioned so as to be in contact with the external environment through a perforated opening or transparent area through a cover member (e.g., a window layer (not shown) of the first display (230) and / or a second rear cover (250)).

[0127] According to one embodiment, an area where at least one display (230, 235) and at least one camera module (216a, 225) face each other may be formed as a transparent area having a certain transmittance as part of an area displaying content.

[0128] In one embodiment, the transparent region may be formed to have a transmittance in the range of about 5% to about 20%. The transparent region may include an area overlapping an effective area (e.g., a field of view area) of at least one camera module (216a, 225) through which light passes to be imaged by the image sensor to create an image. For example, the transparent region of the display (230, 235) may include an area with a lower pixel density than the surrounding area. For example, the transparent region may replace an opening. For example, at least one camera module (216a, 225) may include an under-display camera (UDC) or an under-panel camera (UPC). In one embodiment, some camera modules or sensor modules (217a, 226) may be arranged to perform their functions without being visually exposed through the display. For example, the area facing the camera module (216a, 225) and / or sensor module (217a, 226) positioned under the display (230, 235) (e.g., display panel) may have an under display camera (UDC) structure, so that a perforated opening may not be necessary.

[0129] According to one embodiment, the processor (e.g., the processor (120) of FIG. 1), the memory (e.g., the memory (130) of FIG. 1), and the electronic components of the electronic device (200) of FIGS. 2A and 2B may be arranged on a printed circuit board (PCB) or a printed circuit board assembly (PBA).

[0130] According to one embodiment, the electronic device (200) of FIGS. 2A and 2B may include a heat dissipation structure (e.g., composite heat dissipation structure (402) of FIG. 4) for dissipating heat generated from the processor (120), memory (130), and electronic components.

[0131] FIG. 3A is a perspective view of a first side (e.g., a front side) of an electronic device according to one embodiment of the present disclosure. FIG. 3B is a perspective view of a second side (e.g., a rear side) of an electronic device according to one embodiment of the present disclosure.

[0132] Referring to FIGS. 3A and 3B , an electronic device (300) according to an embodiment of the present disclosure (e.g., the electronic device (101) of FIG. 1 , the electronic device (400) of FIG. 4 ) may include a first side (or front side) (310A), a second side (or back side) (310B), and a housing (310). An electronic device (300) according to an embodiment of the present disclosure (e.g., the electronic device (101) of FIG. 1 , the electronic device (400) of FIG. 4 ) may include a display (301) (e.g., the display (410) of FIG. 4 ).

[0133] In one embodiment, the display (301) may be supported by a housing (310). For example, the display (310) may include a liquid crystal display (LCD) display, an organic light emitting diodes (OLED) display, or a micro LED display.

[0134] In one embodiment, the housing (310) may include a side surface (310C) that surrounds a space between the first surface (310A) and the second surface (310B). In one embodiment, the housing (310) may also refer to a structure that forms a portion of the first surface (310A), the second surface (310B), and the side surface (310C).

[0135] According to one embodiment, the first side (310A) may be formed by a front plate (302) that is at least partially substantially transparent (e.g., a glass plate including various coating layers, or a polymer plate).

[0136] According to one embodiment, the second side (310B) may be formed by a substantially opaque back plate (311). The back plate (311) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. However, the present invention is not limited thereto, and the back plate (311) may also be formed by transparent glass.

[0137] In one embodiment, the side (310C) may be formed by a side bezel structure (318) (or “side member”) that is coupled to the front plate (302) and the back plate (311) and comprises a metal and / or polymer. In one embodiment, the back plate (311) and the side bezel structure (318) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0138] According to one embodiment, the front plate (302) may include two first regions (310D) that extend seamlessly from the first side (310A) toward the rear plate (311). The two first regions (310D) may be positioned at both ends of a long edge of the front plate (302).

[0139] According to one embodiment, the back plate (311) may include two second regions (310E) that extend seamlessly from the second surface (310B) toward the front plate (302).

[0140] In one embodiment, the front plate (302) (or the rear plate (311)) may include only one of the first regions (310D) (or the second regions (310E)). In one embodiment, some of the first regions (310D) or the second regions (310E) may not be included.

[0141] In embodiments, when viewed from the side of the electronic device (300), the side bezel structure (318) may have a first thickness (or width) on a side that does not include the first regions (310D) or the second regions (310E) as described above. In embodiments, when viewed from the side of the electronic device (300), the side bezel structure (318) may have a second thickness (or width) that is thinner than the first thickness on a side that includes the first regions (310D) or the second regions (310E).

[0142] According to one embodiment, the electronic device (300) may include at least one of a display (301), an audio input device (303) (e.g., the input module (150) of FIG. 1, a microphone), an audio output device (307, 314) (e.g., the audio output module (155) of FIG. 1, a speaker) (e.g., an audio module), sensor modules (304, 319) (e.g., the sensor module (176) of FIG. 1), a camera module (305, 312) (e.g., the camera module (180) of FIG. 1), a flash (313), a key input device (317), an indicator (not shown), and connectors (308, 309). According to one embodiment, the electronic device (300) may omit at least one of the components (e.g., the key input device (317)) or may additionally include other components.

[0143] In one embodiment, the display (301) is visually visible through the upper portion of the front plate (302).

[0144] According to one embodiment, at least a portion of the display (301) may be visible through the front plate (302) forming the first surface (310A) and the first region (310D) of the side surface (310C).

[0145] According to one embodiment, at least a portion of the sensor modules (304, 319) and / or at least a portion of the key input device (317) may be disposed in the first area (310D) and / or the second area (310E).

[0146] According to one embodiment, the back surface of the screen display area of ​​the display (301) may include at least one of a first sensor module (304), camera modules (305, 312) (e.g., an image sensor), an audio output device (314) (e.g., an audio module), and a fingerprint sensor.

[0147] According to one embodiment, at least some of the sensor modules (304, 319) and / or at least some of the key input device (317) may be disposed in the first areas (310D) and / or the second areas (310E).

[0148] In one embodiment, the audio input device (303) may include a microphone. In one embodiment, the input device (303) may include a plurality of microphones arranged to detect the direction of sound.

[0149] According to one embodiment, the audio output device (307, 314) may include an audio output device (307) that operates as an external speaker and an audio output device (314) that operates as a call receiver.

[0150] In some embodiments, the acoustic input device (303) (e.g., microphone), the acoustic output device (307, 314), and the connectors (308, 309) may be arranged in the internal space of the electronic device (300). The acoustic input device (303) (e.g., microphone), the acoustic output device (307, 314), and the connectors (308, 309) may be exposed to the external environment through at least one hole formed in the housing (310). In some embodiments, the hole formed in the housing (310) may be used in common for the acoustic input device (303) (e.g., microphone) and the acoustic output device (307, 314). In some embodiments, the acoustic output device (307, 314) may include a speaker (e.g., piezo speaker) that operates without the hole formed in the housing (310).

[0151] According to one embodiment, the sensor modules (304, 319) (e.g., the sensor module (176) of FIG. 1) may generate electrical signals or data values ​​corresponding to an internal operating state of the electronic device (300) or an external environmental state. The sensor modules (304, 319) may include a first sensor module (304) (e.g., a proximity sensor) disposed on a first surface (310A) of the housing (310) and / or a second sensor module (319) (e.g., a heart rate monitor (HRM) sensor) disposed on a second surface (310B) of the housing (310) and / or a third sensor module (not shown) (e.g., a fingerprint sensor). For example, the fingerprint sensor may be disposed on the first surface (310A) (e.g., the display (301)) and / or the second surface (310B) of the housing (310).

[0152] The electronic device (300) may further include at least one of a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, and / or an illuminance sensor, which are not shown.

[0153] According to one embodiment, the camera modules (305, 312) may include a first camera module (305) disposed on a first side (310A) of the electronic device (300), and a second camera module (312) disposed on a second side (310B). A flash (313) may be disposed around the camera modules (305, 312). The camera modules (305, 312) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (313) may include, for example, a light-emitting diode or a xenon lamp.

[0154] According to one embodiment, the first camera module (305) may be arranged on the lower portion of the display panel of the display (301) in an under-display camera (UDC) manner. According to one embodiment, two or more lenses (wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (300). According to one embodiment, a plurality of first camera modules (305) may be arranged on a first side (e.g., a side on which a screen is displayed) of the electronic device (300) in an under-display camera (UDC) manner.

[0155] According to one embodiment, the key input device (317) may be disposed on a side surface (310C) of the housing (310). According to one embodiment, the electronic device (300) may not include some or all of the above-mentioned key input devices (317), and the key input devices (317) that are not included may be implemented in another form, such as a soft key, on the display (301). According to one embodiment, the key input device (317) may be implemented using a pressure sensor included in the display (301).

[0156] According to one embodiment, the connectors (308, 309) may include a first connector hole (308) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (309, or an earphone jack) that can accommodate a connector for transmitting and receiving audio signals with the external electronic device. The first connector hole (308) may include a port of a universal serial bus (USB) type A, USB type B, or USB type C. When the first connector hole (308) supports a USB type C, the electronic device (300, e.g., the electronic device (101) of FIG. 1, the electronic device (200) of FIG. 2A, or the electronic device (400) of FIG. 4)) may support USB power delivery (PD) charging.

[0157] According to one embodiment, some of the first camera modules (305, 312) and / or the first sensor module (304, 319) of the sensor modules (304, 319) may be arranged to be visually visible through the display (301).

[0158] According to one embodiment, when the first camera module (305) is arranged in an under display camera (UDC) manner, the first camera module (305) may not be visually visible to the outside.

[0159] According to one embodiment, the first camera module (305) may be arranged to overlap with the display area, and may also display a screen in the display area corresponding to the first camera module (305). The first sensor module (304) may also be arranged to perform its function without being visually exposed through the front plate (302) in the internal space of the electronic device (300).

[0160] According to one embodiment, the processor (e.g., the processor (120) of FIG. 1), the memory (e.g., the memory (130) of FIG. 1), and the electronic components of the electronic device (300) of FIG. 3 may be arranged on a printed circuit board (PCB) or a printed circuit board assembly (PBA).

[0161] According to one embodiment, the electronic device (300) of FIGS. 3A and 3B may include a heat dissipation structure (e.g., a composite heat dissipation structure (402) of FIG. 4) for dissipating heat generated from the processor (120), the memory (130), and the electronic components.

[0162] FIG. 4 is a drawing showing a printed circuit board assembly including a heat dissipation structure according to one embodiment of the present disclosure, and an electronic device including the printed circuit board assembly.

[0163] The electronic device (400) of FIG. 4 may include at least a portion of the electronic device (101) of FIG. 1. The electronic device (400) of FIG. 4 may include at least a portion of the electronic device (200) of FIGS. 2A and 2B. Referring to FIG. 4, the electronic device (400) according to one embodiment of the present disclosure may include at least a portion of the electronic device (300) of FIGS. 3A and 3B.

[0164] Referring to FIG. 4, an electronic device (400) according to one embodiment of the present disclosure may include a display (410) (e.g., a display module (160) of FIG. 1, a first display (230, flexible display) of FIG. 2A, a display (301) of FIG. 3A), a metal front (420) supporting the display (410), and a printed circuit board assembly (401). For example, the metal front (420) may include a heat diffusion member (e.g., a graphite sheet, a metal sheet (cu), a heat pipe, a vapor chamber).

[0165] According to one embodiment, a printed circuit board assembly (401) may include a shielding layer (430) (e.g., a shielding film, a shielding plate, a shielding sheet), an adhesive material layer (440) (e.g., an adhesive film, an adhesive plate, an adhesive sheet), a printed circuit board (450) (e.g., a PCB, a PBA), a shield can (460), a composite heat dissipation structure (402), heat-generating components (490), electronic components such as integrated circuits (496, ICs), and other electronic components (498) (e.g., peripheral circuit components, passive elements).

[0166] A shield can (460) may be arranged to shield electronic components. For example, the shield can (460) may be a metal / conductive structure arranged to at least partially surround the electronic components. For example, the shield can (460) may have a side that is perpendicular (or nearly perpendicular) to a surface of a printed circuit board (PCB) 450 having electronic components mounted thereon, such that the side surrounds an area of ​​the printed circuit board (450) having electronic components mounted thereon. The shield can (460) may have a top surface that is parallel (or nearly parallel) to a surface of the printed circuit board (450) having electronic components mounted thereon. An opening may be formed in the top surface. This opening may be covered by a shield layer (430) and / or an adhesive material layer (440) when the printed circuit board assembly (401) is assembled.

[0167] According to one embodiment, heat generating components (490), direct circuits (496), and electronic components (498) may be arranged on a printed circuit board (450).

[0168] According to one embodiment, the heat generating components (490) may include a memory (494) (e.g., memory (130) of FIG. 1, DRAM) and a processor (492) (e.g., processor (120) of FIG. 1). For example, the memory (494) and the processor (492) may be stacked and arranged on a printed circuit board (450).

[0169] [For example, a processor (492) may be placed on a printed circuit board (450), and a memory (494) may be stacked on the processor (492). However, the present invention is not limited thereto, and a memory (494) may be placed on a printed circuit board (450), and a processor (492) may be stacked on the memory (494).

[0170] For example, direct circuits (496) and electronic components (498) may be placed around the memory (494) and the processor (492).

[0171] For example, the memory (494) may include one or more of high bandwidth memory (HBM), dynamic random access memory (DRAM), static random access memory (SRAM), phase-change random access memory (PRAM), magnetic random access memory (MRAM), resistive random access memory (RRAM), flash memory, and / or electrically erasable programmable read-only memory (EEPROM).

[0172] For example, the processor (492) may include one or more of a main processor (e.g., a main processor (121, a central processing unit or application processor) of FIG. 1), an auxiliary processor (e.g., an auxiliary processor (123, a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) of FIG. 1), and / or a graphics processing unit (GPU).

[0173] According to one embodiment, to dissipate heat generated from heat generating components (490) (e.g., memory (494) and processor (492)), the composite heat dissipation structure (402) can be positioned to cover at least a portion of the heat generating components (490) (e.g., to cover at least a portion of the memory (494) and processor (492)).

[0174] In one embodiment, a shielding layer (430) (e.g., a shielding film) may be placed to cover the upper portion of the composite heat dissipation structure (402) and the shield can (460).

[0175] For example, the shielding layer (430) (e.g., shielding film) may include a material (e.g., metal) or alloy (e.g., CuSi) having high electrical and thermal conductivity. For example, the shielding layer (430) (e.g., shielding film) may include a material having high thermal conductivity, such as stainless steel, copper (Cu), nickel (Ni), silver (Ag), gold (Au), silicon (Si), or aluminum (Al). For example, the shielding layer (430) (e.g., shielding film) may include a composite material including a thermally conductive filler or a polymer.

[0176] For example, to attach a shielding layer (430) (e.g., a shielding film) to the upper portion of the composite heat dissipation structure (402) and the shielding can (460), an adhesive material layer (440) may be disposed between the upper portion of the composite heat dissipation structure (402) and the shielding can (460) and the shielding layer (430) (e.g., a shielding film). The upper portion may include a portion having a surface facing the same direction (or nearly the same direction) as a surface of a printed circuit board (450) on which electronic components are mounted. The upper portion may include a portion having a surface not facing (or not nearly facing) the surface of the printed circuit board (450) on which electronic components are mounted. For example, the adhesive material layer (440) may include a porous conductive adhesive material.

[0177] According to one embodiment, the composite heat dissipation structure (402) may include a first heat dissipation structure (470) (e.g., an electrically insulating heat dissipation structure, a first thermal interface material (TIM)), and a second heat dissipation structure (480) (e.g., a conductive heat dissipation structure, a second TIM).

[0178] For example, the first heat dissipation structure (470) (e.g., an insulating heat dissipation structure) may be positioned to cover the upper surfaces of at least a portion of the heat-generating components (490). The first heat dissipation structure (470) (e.g., an insulating heat dissipation structure) may be positioned to cover the upper surfaces of the memory (494) and the processor (492). The upper surface may include a surface facing in the same direction (or nearly the same direction) as a surface of a printed circuit board (450) on which electronic components are mounted. The upper surface may include a surface that is not facing (or nearly facing) the surface of the printed circuit board (450) on which electronic components are mounted.

[0179] For example, a second heat dissipation structure (480) (e.g., a conductive heat dissipation structure) may be positioned to cover at least a portion of the upper surface of a first heat dissipation structure (470) (e.g., an insulating heat dissipation structure).

[0180] The first heat dissipation structure (470) may be arranged to at least partially surround the second heat dissipation structure (480). For example, a groove may be formed on the upper surface of the first heat dissipation structure (470) (e.g., an insulating heat dissipation structure) to have a certain depth, and the second heat dissipation structure (480) (e.g., a conductive heat dissipation structure) may be arranged inside the groove formed on the upper surface of the first heat dissipation structure (470) (e.g., an insulating heat dissipation structure).

[0181] For example, the upper surface of the first heat dissipation structure (470) (e.g., an insulating heat dissipation structure) and the upper surface of the second heat dissipation structure (480) (e.g., a conductive heat dissipation structure) may be positioned to be in contact with the lower surface of the adhesive material layer (440). The lower surface may be a surface facing (or nearly facing) the surface of the printed circuit board (450) on which the electronic component is mounted.

[0182] In one embodiment, the first heat dissipation structure (470) (e.g., an insulating heat dissipation structure) and the second heat dissipation structure (480) (e.g., a conductive heat dissipation structure) of the composite heat dissipation structure (402) may have different compressibility. For example, the first heat dissipation structure (470) may have a higher compressibility than the second heat dissipation structure (480).

[0183] According to one embodiment, the first heat dissipation structure (470) (e.g., an insulating heat dissipation structure) may include a heat diffusion (thermal conductivity) member, thermal grease, heat dissipation paste, and heat diffusion (thermal conductivity) paste.

[0184] For example, the first heat dissipation structure (470) (e.g., an insulating heat dissipation structure) may include an adhesive material and an insulating thermal interface material (TIM). The first heat dissipation structure (470) (e.g., an insulating heat dissipation structure) may include a ceramic-based non-conductive filler (e.g., alumina, aluminum nitride, boron nitride).

[0185] For example, the first heat dissipation structure (470) (e.g., an insulated heat dissipation structure) may have a lower thermal conductivity than the second heat dissipation structure (480) (e.g., a conductive heat dissipation structure).

[0186] For example, the first heat dissipation structure (470) (e.g., an insulating heat dissipation structure) may have a thermal conductivity of 2 to 4 [W / mK].

[0187] For example, the first heat dissipation structure (470) (e.g., an insulating heat dissipation structure) may have a compressibility of 15 to 30% under a pressure condition of 10 to 20 [psi].

[0188] For example, the first heat dissipation structure (470) (e.g., an insulating heat dissipation structure) may have a thickness of 0.1 to 0.3 mm.

[0189] According to one embodiment, the second heat dissipation structure (480) (e.g., conductive heat dissipation structure) may include a heat diffusion (thermal conductivity) member, thermal grease, heat dissipation paste, and heat diffusion (thermal conductivity) paste.

[0190] For example, the second heat dissipation structure (480) (e.g., conductive heat dissipation structure) may include an adhesive material and a conductive thermal interface material (TIM). The second heat dissipation structure (480) (e.g., conductive heat dissipation structure) may include a carbon-based conductive filler (e.g., carbon nanotube, carbon fiber, graphene, graphite).

[0191] For example, the second heat dissipation structure (480) (e.g., electrically conductive heat dissipation structure) may have a thermal conductivity of 20 to 40 [W / mK].

[0192] For example, the second heat dissipation structure (480) (e.g., conductive heat dissipation structure) may have a compressibility of 0.1 to 15% under a pressure condition of 10 to 20 [psi].

[0193] For example, the second heat dissipation structure (480) (e.g., conductive heat dissipation structure) may have a thickness of 0.1 to 0.3 mm.

[0194] In one embodiment, as the power generated by processors (e.g., application processors) continues to increase, a thermal interface material (TIM) with higher thermal conductivity must be applied to effectively dissipate the high heat generated by the processor (e.g., application processor). Since high electrical conductivity also leads to high thermal conductivity, a filler with high electrical conductivity can be used as a thermal interface material (TIM).

[0195] According to one embodiment, in order to secure high thermal conductivity, a ceramic-based non-conductive filler (e.g., Alumina, Aluminum nitride, boron nitride) may be applied as a heat dissipation material (TIM) of the first heat dissipation structure (470) (e.g., an insulating heat dissipation structure).

[0196] According to one embodiment, in order to secure high thermal conductivity in the present disclosure, a carbon-based conductive filler (e.g., carbon fiber, graphite, carbon nanotube, graphene) may be applied as a heat dissipation material (TIM) of the second heat dissipation structure (480) (e.g., conductive heat dissipation structure).

[0197] According to one embodiment, in order to secure high thermal conductivity in the present disclosure, a metal-based conductive filler (e.g., aluminum, copper, silver) may be used as a heat dissipation material (TIM) of the second heat dissipation structure (480) (e.g., conductive heat dissipation structure).

[0198] According to one embodiment, in order to secure higher thermal conductivity, the present disclosure may apply a first heat dissipation structure (470) (e.g., an insulating heat dissipation structure) and a second heat dissipation structure (480) (e.g., a conductive heat dissipation structure) aligned in a vertical direction. Here, the vertical direction may be considered as a direction perpendicular to the surface of a printed circuit board (450) on which electronic components are mounted.

[0199] For example, in the present disclosure, in order to secure higher thermal conductivity, the filler included in the first heat dissipation structure (470) (e.g., an insulating heat dissipation structure) may be applied by aligning it in the vertical direction.

[0200] For example, in the present disclosure, in order to secure higher thermal conductivity, the filler included in the second heat dissipation structure (480) (e.g., conductive heat dissipation structure) may be applied by aligning it in the vertical direction.

[0201]

[0202] FIGS. 5 to 7 are drawings showing a method for forming a heat dissipation structure of the printed circuit board assembly illustrated in FIG. 4.

[0203] Referring to FIGS. 4 and 5 to 7, a first heat dissipation structure (470) (e.g., an insulating heat dissipation structure) may be positioned to cover the upper surfaces of at least a portion of the heat-generating components (490). For example, the first heat dissipation structure (470) (e.g., an insulating heat dissipation structure) may be positioned to cover the upper surfaces of both the memory (494) and the processor (492).

[0204] For example, during the manufacturing process, considering the amount by which the heat dissipation material (TIM) of the first heat dissipation structure (470) (e.g., the insulating heat dissipation structure) spreads due to pressure in the vertical direction (e.g., the z-axis direction), the first heat dissipation structure (470) (e.g., the insulating heat dissipation structure) may be arranged to have a relatively larger area (e.g., a relatively large planar area) than the area of ​​the second heat dissipation structure (480) (e.g., the conductive heat dissipation structure). A groove may be formed on the upper surface of the first heat dissipation structure (470) (e.g., the insulating heat dissipation structure) to have a certain depth. The second heat dissipation structure (480) (e.g., the conductive heat dissipation structure) may be arranged inside the groove formed on the upper surface of the first heat dissipation structure (470) (e.g., the insulating heat dissipation structure).

[0205] For example, a pressure may be applied vertically (e.g., in the z-axis direction) from the top of the shielding layer (430) (e.g., a shielding film, a shielding plate, a shielding sheet) to the processor (492). When the pressure is applied vertically (e.g., in the z-axis direction), air existing between the first heat dissipation structure (470) (e.g., an insulating heat dissipation structure) and the second heat dissipation structure (480) (e.g., a conductive heat dissipation structure) may escape due to the porous adhesive material. As the thickness of the first heat dissipation structure (470) (e.g., an insulating heat dissipation structure) is reduced by the pressure, the first heat dissipation structure (470) (e.g., an insulating heat dissipation structure) may spread in the plane direction, and the composite heat dissipation structure (402) and the adhesive material layer (440) may be adhered and sealed.

[0206] A printed circuit board assembly (401) including a heat dissipation structure (402) of the present disclosure, and an electronic device (400) including the printed circuit board assembly (401) can improve heat dissipation performance of heat generated from a processor (492) and a memory (494) in an environment where high heat generation of about 15 W is generated, as described in Table 2.

[0207] For example, as a result of comparing the DTM (dynamic thermal management) point at which the maximum temperature is reached and the GPU temperature, the DTM point can be delayed by about 54 to 58 seconds and the temperature of the processor (492) can be lowered by about -5.8°C by applying the heat dissipation structure (#3) of the present disclosure compared to the comparative examples (#1, #2).

[0208]

[0209] Conventional high-conductivity thermal interface materials (TIMs) contain a large amount of rigid conductive fillers, which can cause deformation of the smartphone's display and front metal if compressed excessively. Furthermore, various electronic components, such as passive components, PMICs, and ICs, are located around the processor (e.g., application processor), and spreading of the conductive fillers can lead to short circuits.

[0210] A printed circuit board assembly (401) including a composite heat dissipation structure (402) of the present disclosure, and an electronic device (400) including the printed circuit board assembly (401) can prevent a short circuit from occurring between electronic components by having a first heat dissipation structure (470) disposed to cover at least a portion of an upper surface of heat-generating components (490), and a second heat dissipation structure (480) (e.g., a conductive heat dissipation structure) disposed to cover at least a portion of an upper surface of the first heat dissipation structure (470) (e.g., an insulating heat dissipation structure).

[0211] In the composite heat dissipation structure (402) according to the embodiment of the present disclosure, the compression ratios of the first heat dissipation structure (470) (e.g., an insulating heat dissipation structure) and the second heat dissipation structure (480) (e.g., a conductive heat dissipation structure) are different from each other, so that defects due to compression can be prevented during the manufacturing process.

[0212] The composite heat dissipation structure (402) according to an embodiment of the present disclosure can reduce the thermal resistance at the interface between heat-generating components (490) (e.g., processor, memory) and the composite heat dissipation structure (402) by applying a compressible heat dissipation material (TIM).

[0213] For example, the first heat dissipation structure (470) (e.g., an insulating heat dissipation structure) may be formed to be thicker than the second heat dissipation structure (480) (e.g., a conductive heat dissipation structure). For example, the area of ​​the first heat dissipation structure (470) (e.g., an insulating heat dissipation structure) may be formed to be wider than the area of ​​the second heat dissipation structure (480) (e.g., a conductive heat dissipation structure).

[0214] FIG. 8 is a drawing showing a method for forming a heat dissipation structure of the printed circuit board assembly illustrated in FIG. 4.

[0215] Referring to FIG. 8, an electronic device (800) according to one embodiment of the present disclosure (e.g., the electronic device (400) of FIG. 4) may include a display (410) (e.g., the display module (160) of FIG. 1, the first display (230, flexible display) of FIG. 2A, the display (301) of FIG. 3A), a metal front (420) supporting the display (410), and a printed circuit board assembly (801) (e.g., the printed circuit board assembly (401) of FIG. 4).

[0216] According to one embodiment, the printed circuit board assembly (801) may include a shielding layer (430) (e.g., a shielding film, a shielding plate, a shielding sheet), an adhesive material layer (440) (e.g., an adhesive film, an adhesive plate, an adhesive sheet), a printed circuit board (450) (e.g., a PCB, a PBA), a shield can (460), a composite heat dissipation structure (802) (e.g., the composite heat dissipation structure (402) of FIG. 4), heat-generating components (490), an integrated circuit (496, an IC), and electronic components (498) (e.g., peripheral circuit components, passive elements).

[0217] According to one embodiment, electronic components (e.g., heat generating components (490), integrated circuits (496), and other electronic components (498)) may be arranged on a printed circuit board (450).

[0218] According to one embodiment, the heat generating components (490) may include a memory (494) (e.g., memory (130) of FIG. 1, DRAM) and a processor (492) (e.g., processor (120) of FIG. 1). For example, the memory (494) and the processor (492) may be stacked and arranged on a printed circuit board (450).

[0219] For example, a processor (492) may be placed on a printed circuit board (450), and a memory (494) may be stacked on the processor (492). However, the present invention is not limited thereto, and a memory (494) may be placed on a printed circuit board (450), and a processor (492) may be stacked on the memory (494).

[0220] For example, a direct circuit (496) and other electronic components (498) may be placed around the memory (494) and the processor (492).

[0221] According to one embodiment, to dissipate heat generated from heat generating components (490) (e.g., memory (494) and processor (492)), a composite heat dissipation structure (802) may be positioned to cover at least a portion of the heat generating components (490) (e.g., memory (494) and processor (492)).

[0222] In one embodiment, a shielding layer (430) (e.g., a shielding film) may be placed to cover the upper portion of the composite heat dissipation structure (802) and the shield can (460).

[0223] According to one embodiment, the composite heat dissipation structure (802) may include a first heat dissipation structure (870) (e.g., an insulating heat dissipation structure, a first thermal interface material (TIM)), and a second heat dissipation structure (880) (e.g., a conductive heat dissipation structure, a second TIM).

[0224] For example, the first heat dissipation structure (870) (e.g., an insulating heat dissipation structure) may be positioned to cover the upper surfaces of at least a portion of the heat-generating components (490). The first heat dissipation structure (870) (e.g., an insulating heat dissipation structure) may be positioned to cover the upper surfaces of the memory (494) and the processor (492). The upper surface may include a surface facing in the same direction (or nearly the same direction) as a surface of a printed circuit board (450) on which electronic components are mounted. The upper surface may include a surface that is not facing (or nearly facing) the surface of the printed circuit board (450) on which electronic components are mounted.

[0225] For example, a second heat dissipation structure (880) (e.g., a conductive heat dissipation structure) may be positioned to cover at least a portion of the upper surface of a first heat dissipation structure (870) (e.g., an insulating heat dissipation structure).

[0226] The first heat dissipation structure (870) may be arranged to at least partially surround the second heat dissipation structure (880). For example, a groove may be formed on the upper surface of the first heat dissipation structure (870) (e.g., an insulating heat dissipation structure) to have a certain depth, and the second heat dissipation structure (880) (e.g., a conductive heat dissipation structure) may be arranged inside the groove formed on the upper surface of the first heat dissipation structure (870) (e.g., an insulating heat dissipation structure).

[0227] For example, the upper surface of the first heat dissipation structure (870) (e.g., an insulating heat dissipation structure) and the upper surface of the second heat dissipation structure (880) (e.g., a conductive heat dissipation structure) may be positioned to be in contact with the lower surface of the adhesive material layer (440). The lower surface may be a surface facing (or nearly facing) the surface of the printed circuit board (450) on which the electronic component is mounted.

[0228] In one embodiment, the first heat dissipation structure (870) (e.g., an insulating heat dissipation structure) and the second heat dissipation structure (880) (e.g., a conductive heat dissipation structure) of the composite heat dissipation structure (802) may have different compressibility. For example, the first heat dissipation structure (870) may have a higher compressibility than the second heat dissipation structure (880).

[0229] According to one embodiment, the first heat dissipation structure (870) (e.g., an insulating heat dissipation structure) may include a heat diffusion (thermal conductive) member, thermal grease, heat dissipation paste, and heat diffusion (thermal conductive) paste.

[0230] For example, the first heat dissipation structure (870) (e.g., an insulating heat dissipation structure) may include an adhesive material and an insulating thermal interface material (TIM). The first heat dissipation structure (870) (e.g., an electrically insulating heat dissipation structure) may include a ceramic-based non-conductive filler (e.g., alumina, aluminum nitride, boron nitride).

[0231] For example, the first heat dissipation structure (870) (e.g., an insulated heat dissipation structure) may have a lower thermal conductivity than the second heat dissipation structure (880) (e.g., a conductive heat dissipation structure).

[0232] For example, the first heat dissipation structure (870) (e.g., an insulating heat dissipation structure) may have a thermal conductivity of 2 to 4 [W / mK].

[0233] For example, the first heat dissipation structure (870) (e.g., an insulating heat dissipation structure) may have a compressibility of 15 to 30% under a pressure condition of 10 to 20 [psi].

[0234] For example, the first heat dissipation structure (870) (e.g., an insulating heat dissipation structure) may have a thickness of 0.1 to 0.3 mm.

[0235] According to one embodiment, the second heat dissipation structure (880) (e.g., conductive heat dissipation structure) may include a heat spreading (heat conducting) member, thermal grease, heat spreading paste, and heat spreading (heat conducting) paste.

[0236] For example, the second heat dissipation structure (880) (e.g., electrically conductive heat dissipation structure) may include an adhesive material and a conductive thermal interface material (TIM). The second heat dissipation structure (880) (e.g., conductive heat dissipation structure) may include a carbon-based conductive filler (e.g., carbon nanotube, carbon fiber, graphene, graphite).

[0237] For example, the second heat dissipation structure (880) (e.g., conductive heat dissipation structure) may have a thermal conductivity of 20 to 40 [W / mK].

[0238] For example, the second heat dissipation structure (880) (e.g., conductive heat dissipation structure) may have a compressibility of 0.1 to 15% under a pressure condition of 10 to 20 [psi].

[0239] For example, the second heat dissipation structure (880) (e.g., conductive heat dissipation structure) may have a thickness of 0.1 to 0.3 mm.

[0240] In one embodiment, as the power generated by processors (e.g., application processors) continues to increase, thermally conductive materials (TIMs) with higher thermal conductivity must be applied to effectively dissipate the high heat generated by the processors (e.g., application processors). Since high electrical conductivity also leads to high thermal conductivity, recently, fillers with high electrical conductivity have been used as TIMs.

[0241] According to one embodiment, in order to secure high thermal conductivity, a ceramic-based non-conductive filler (e.g., Alumina, Aluminum nitride, boron nitride) may be applied as a heat dissipation material (TIM) of the first heat dissipation structure (870) (e.g., an insulating heat dissipation structure).

[0242] According to one embodiment, in order to secure high thermal conductivity, a carbon-based conductive filler (e.g., carbon fiber, graphite, carbon nanotube, graphene) may be applied as a heat dissipation material (TIM) of the second heat dissipation structure (880) (e.g., conductive heat dissipation structure).

[0243] According to one embodiment, in order to secure high thermal conductivity in the present disclosure, a metal-based conductive filler (e.g., aluminum, copper, silver) may be used as a heat dissipation material (TIM) of the second heat dissipation structure (880) (e.g., conductive heat dissipation structure).

[0244] According to one embodiment, in order to secure higher thermal conductivity, the present disclosure may apply a first heat dissipation structure (870) (e.g., an insulating heat dissipation structure) and a second heat dissipation structure (880) (e.g., a conductive heat dissipation structure) aligned in a vertical direction.

[0245] For example, in the present disclosure, in order to secure higher thermal conductivity, the filler included in the first heat dissipation structure (870) (e.g., an insulating heat dissipation structure) may be applied by aligning it in the vertical direction. The vertical direction may be considered as a direction perpendicular to the surface of the printed circuit board (450) on which the electronic component is mounted.

[0246] For example, in the present disclosure, in order to secure higher thermal conductivity, the filler included in the second heat dissipation structure (880) (e.g., conductive heat dissipation structure) may be applied by aligning it in the vertical direction.

[0247] In one embodiment, at least a portion of the first heat dissipation structure (870) (e.g., an insulating heat dissipation structure) may include (e.g., formed or configured) an air outlet (810) (air passage) to allow air present within the first heat dissipation structure (870) (e.g., an insulating heat dissipation structure) to escape to the outside. For example, the first heat dissipation structure (870) may surround or seal an area excluding one or more air outlets (810) around the perimeter. The area may be, for example, a groove formed in an upper surface of the first heat dissipation structure (870) to accommodate a second heat dissipation structure (880).

[0248] For example, pressure may be applied to the first heat dissipation structure (870) (e.g., an insulating heat dissipation structure) and the second heat dissipation structure (880) (e.g., a conductive heat dissipation structure) in a vertical direction (e.g., a z-axis direction or a direction perpendicular to the surface of the printed circuit board (450) on which the electronic components are mounted). For example, the pressure may be applied when the printed circuit board assembly (801) is assembled or mounted on the electronic device (800). When pressure is applied, the first heat dissipation structure (870) (e.g., an insulating heat dissipation structure) is compressed, causing air to be discharged to the outside, and the air exhaust port (810, air path) to close. When pressure is applied in a vertical direction (e.g., z-axis direction), air existing between the first heat dissipation structure (870) (e.g., insulating heat dissipation structure) and the second heat dissipation structure (880) (e.g., conductive heat dissipation structure) is released, and the composite heat dissipation structure (802) and the adhesive material layer (440) can be bonded and sealed.

[0249] A printed circuit board assembly (801) including a composite heat dissipation structure (802) of the present disclosure, and an electronic device (800) including the printed circuit board assembly (801) can prevent a short circuit from occurring by having a first heat dissipation structure (870) disposed to cover at least a portion of an upper surface of heat-generating components (490), and a second heat dissipation structure (880) (e.g., a conductive heat dissipation structure) disposed to cover at least a portion of an upper surface of the first heat dissipation structure (870) (e.g., an insulating heat dissipation structure).

[0250] The composite heat dissipation structure (802) according to the embodiment of the present disclosure can prevent defects due to compression during the manufacturing process since the compression ratios of the first heat dissipation structure (870) (e.g., an insulating heat dissipation structure) and the second heat dissipation structure (880) (e.g., a conductive heat dissipation structure) are different from each other.

[0251] The composite heat dissipation structure (802) according to an embodiment of the present disclosure can reduce the thermal resistance at the interface between heat-generating components (490) (e.g., processor, memory) and the composite heat dissipation structure (802) by applying a compressible heat dissipation material (TIM).

[0252] FIG. 9 is a drawing showing a printed circuit board assembly including a heat dissipation structure according to one embodiment of the present disclosure, and an electronic device including the printed circuit board assembly.

[0253] Referring to FIG. 9, an electronic device (900) according to one embodiment of the present disclosure (e.g., the electronic device (400) of FIG. 4) may include a display (410) (e.g., the display module (160) of FIG. 1, the first display (230, flexible display) of FIG. 2A, the display (301) of FIG. 3A), a metal front (420) supporting the display (410), and a printed circuit board assembly (901) (e.g., the printed circuit board assembly (401) of FIG. 4).

[0254] According to one embodiment, a printed circuit board assembly (901) may include a shielding layer (430) (e.g., a shielding film, a shielding plate, a shielding sheet), an adhesive material layer (440) (e.g., an adhesive film, an adhesive plate, an adhesive sheet), a printed circuit board (450) (e.g., a PCB, a PBA), a shield can (460), a composite heat dissipation structure (902) (e.g., the composite heat dissipation structure (402) of FIG. 4), heat-generating components (490), electronic components such as integrated circuits (496, ICs), and other electronic components (498) (e.g., peripheral circuit components, passive elements).

[0255] According to one embodiment, heat generating components (490), electronic components such as direct circuits (496), and other electronic components (498) may be arranged on a printed circuit board (450).

[0256] According to one embodiment, the heat generating components (490) may include a memory (494) (e.g., memory (130) of FIG. 1, DRAM) and a processor (492) (e.g., processor (120) of FIG. 1). For example, the memory (494) and the processor (492) may be stacked and arranged on a printed circuit board (450).

[0257] For example, a processor (492) may be placed on a printed circuit board (450), and a memory (494) may be stacked on the processor (492). However, the present invention is not limited thereto, and a memory (494) may be placed on a printed circuit board (450), and a processor (492) may be stacked on the memory (494).

[0258] For example, a direct circuit (496) and other electronic components (498) may be placed around the memory (494) and the processor (492).

[0259] According to one embodiment, to dissipate heat generated from heat-generating components (490) (e.g., memory (494) and processor (492)), a composite heat-dissipating structure (902) may be positioned to cover at least a portion of the heat-generating components (490) (e.g., memory (494) and processor (492)).

[0260] In one embodiment, a shielding layer (430) (e.g., a shielding film) may be placed to cover the upper portion of the composite heat dissipation structure (902) and the shield can (460).

[0261] According to one embodiment, the composite heat dissipation structure (902) may include a first heat dissipation structure (970) (e.g., an insulating heat dissipation structure, a first thermal interface material (TIM)), and a second heat dissipation structure (980) (e.g., a conductive heat dissipation structure, a second TIM).

[0262] For example, the first heat dissipation structure (970) (e.g., an insulating heat dissipation structure) may be positioned to cover the upper surfaces of at least a portion of the heat-generating components (490). The first heat dissipation structure (970) (e.g., an insulating heat dissipation structure) may be positioned to cover the upper surfaces of the memory (494) and the processor (492). The upper surface may include a surface facing in the same direction (or nearly the same direction) as a surface of a printed circuit board (450) on which electronic components are mounted. The upper surface may include a surface that is not facing (or nearly facing) the surface of the printed circuit board (450) on which electronic components are mounted.

[0263] For example, a first heat dissipation structure (970) (e.g., an insulating heat dissipation structure) may be positioned to fill a portion of the shield can (460) excluding the second heat dissipation structure (980) (e.g., a conductive heat dissipation structure, a second TIM), the processor (492), the memory (494), the integrated circuit (496), and the electronic components (498). For example, the first heat dissipation structure (970) (e.g., an insulating heat dissipation structure) may be positioned to cover the upper surfaces of the processor (492), the memory (494), the integrated circuit (496), and the electronic components (498). For example, the first heat dissipation structure (970) (e.g., an insulating heat dissipation structure) may be positioned to surround the lower surface and side surfaces of the second heat dissipation structure (980) (e.g., a conductive heat dissipation structure, a second TIM). The lower surface may be a surface facing (or nearly facing) the surface of a printed circuit board (450) on which electronic components are mounted.

[0264] For example, a second heat dissipation structure (980) (e.g., a conductive heat dissipation structure) may be positioned to cover at least a portion of the upper surface of a first heat dissipation structure (970) (e.g., an insulating heat dissipation structure).

[0265] The first heat dissipation structure (470) may be arranged to at least partially surround the second heat dissipation structure (480). For example, a groove may be formed on the upper surface of the first heat dissipation structure (970) (e.g., an insulating heat dissipation structure) to have a certain depth, and the second heat dissipation structure (980) (e.g., a conductive heat dissipation structure) may be arranged inside the groove formed on the upper surface of the first heat dissipation structure (970) (e.g., an insulating heat dissipation structure).

[0266] For example, the upper surface of the first heat dissipation structure (970) (e.g., an insulating heat dissipation structure) and the upper surface of the second heat dissipation structure (980) (e.g., a conductive heat dissipation structure) may be arranged to be in contact with the lower surface of the adhesive material layer (440).

[0267] In one embodiment, the first heat dissipation structure (970) (e.g., an insulating heat dissipation structure) and the second heat dissipation structure (980) (e.g., a conductive heat dissipation structure) of the composite heat dissipation structure (902) can have different compressibility. The first heat dissipation structure (970) can have a higher compressibility than the second heat dissipation structure (980).

[0268] According to one embodiment, the first heat dissipation structure (970) (e.g., an insulating heat dissipation structure) may include a heat diffusion (thermal conductive) member, thermal grease, heat dissipation paste, and heat diffusion (thermal conductive) paste.

[0269] For example, the first heat dissipation structure (970) (e.g., an insulating heat dissipation structure) may include an adhesive material and an insulating thermal interface material (TIM). The first heat dissipation structure (970) (e.g., an insulating heat dissipation structure) may include a ceramic-based non-conductive filler (e.g., alumina, aluminum nitride, boron nitride).

[0270] For example, the first heat dissipation structure (970) (e.g., an insulated heat dissipation structure) may have a lower thermal conductivity than the second heat dissipation structure (980) (e.g., a conductive heat dissipation structure).

[0271] For example, the first heat dissipation structure (970) (e.g., an insulating heat dissipation structure) may have a thermal conductivity of 2 to 4 [W / mK].

[0272] For example, the first heat dissipation structure (970) (e.g., an insulating heat dissipation structure) may have a compressibility of 15 to 30% under a pressure condition of 10 to 20 [psi].

[0273] For example, the first heat dissipation structure (970) (e.g., an insulating heat dissipation structure) may have a thickness of 0.1 to 0.3 mm.

[0274] According to one embodiment, the second heat dissipation structure (980) (e.g., a conductive heat dissipation structure) may include a heat spreading (heat conducting) member, thermal grease, heat spreading paste, and heat spreading (heat conducting) paste.

[0275] For example, the second heat dissipation structure (980) (e.g., electrically conductive heat dissipation structure) may include an adhesive material and a conductive thermal interface material (TIM). The second heat dissipation structure (980) (e.g., conductive heat dissipation structure) may include a carbon-based conductive filler (e.g., carbon nanotube, carbon fiber, graphene, graphite).

[0276] For example, the second heat dissipation structure (980) (e.g., conductive heat dissipation structure) may have a thermal conductivity of 20 to 40 [W / mK].

[0277] For example, the second heat dissipation structure (980) (e.g., conductive heat dissipation structure) may have a compressibility of 0.1 to 15% under a pressure condition of 10 to 20 [psi].

[0278] For example, the second heat dissipation structure (980) (e.g., conductive heat dissipation structure) may have a thickness of 0.1 to 0.3 mm.

[0279] In one embodiment, as the power generated by processors (e.g., application processors) continues to increase, a thermal interface material (TIM) with higher thermal conductivity must be applied to effectively dissipate the high heat generated by the processor (e.g., application processor). Since high electrical conductivity also leads to high thermal conductivity, a filler with high electrical conductivity can be used as a thermal interface material (TIM).

[0280] According to one embodiment, in order to secure high thermal conductivity, a ceramic-based non-conductive filler (e.g., Alumina, Aluminum nitride, boron nitride) may be applied as a heat dissipation material (TIM) of the first heat dissipation structure (970) (e.g., an insulating heat dissipation structure).

[0281] According to one embodiment, in order to secure high thermal conductivity in the present disclosure, a carbon-based conductive filler (e.g., carbon fiber, graphite, carbon nanotube, graphene) may be applied as a heat dissipation material (TIM) of the second heat dissipation structure (980) (e.g., conductive heat dissipation structure).

[0282] According to one embodiment, in order to secure high thermal conductivity in the present disclosure, a metal-based conductive filler (e.g., aluminum, copper, silver) may be used as a heat dissipation material (TIM) of the second heat dissipation structure (980) (e.g., conductive heat dissipation structure).

[0283] According to one embodiment, in order to secure higher thermal conductivity, the present disclosure may apply a first heat dissipation structure (970) (e.g., an insulating heat dissipation structure) and a second heat dissipation structure (980) (e.g., a conductive heat dissipation structure) aligned in a vertical direction. The vertical direction may be considered a direction perpendicular to the surface of a printed circuit board (450) on which electronic components are mounted.

[0284] For example, in the present disclosure, in order to secure higher thermal conductivity, the filler included in the first heat dissipation structure (970) (e.g., an insulating heat dissipation structure) may be applied by aligning it in the vertical direction.

[0285] For example, in the present disclosure, in order to secure higher thermal conductivity, the filler included in the second heat dissipation structure (980) (e.g., conductive heat dissipation structure) may be applied by aligning it in the vertical direction.

[0286] A printed circuit board assembly (901) including a composite heat dissipation structure (902) of the present disclosure, and an electronic device (900) including the printed circuit board assembly (901) can prevent a short circuit from occurring between electronic components by having a first heat dissipation structure (970) disposed to cover at least a portion of an upper surface of heat-generating components (490), and a second heat dissipation structure (980) (e.g., a conductive heat dissipation structure) disposed to cover at least a portion of an upper surface of the first heat dissipation structure (970) (e.g., an insulating heat dissipation structure).

[0287] The composite heat dissipation structure (902) according to the embodiment of the present disclosure can prevent defects due to compression during the manufacturing process since the compression ratios of the first heat dissipation structure (970) (e.g., an insulating heat dissipation structure) and the second heat dissipation structure (980) (e.g., a conductive heat dissipation structure) are different from each other.

[0288] The composite heat dissipation structure (902) according to an embodiment of the present disclosure can reduce thermal resistance at the interface between heat-generating components (e.g., processor, memory) and the composite heat dissipation structure by applying a compressible heat dissipation material (TIM).

[0289] FIG. 10 is a drawing showing a printed circuit board assembly including a heat dissipation structure according to one embodiment of the present disclosure, and an electronic device including the printed circuit board assembly.

[0290] Referring to FIG. 10, an electronic device (1000) according to one embodiment of the present disclosure (e.g., the electronic device (400) of FIG. 4) may include a display (410) (e.g., the display module (160) of FIG. 1, the first display (230, flexible display) of FIG. 2A, the display (301) of FIG. 3A), a metal front (420) supporting the display (410), and a printed circuit board assembly (1001) (e.g., the printed circuit board assembly (401) of FIG. 4).

[0291] According to one embodiment, a printed circuit board assembly (1001) may include a shielding layer (430) (e.g., a shielding film, a shielding plate, a shielding sheet), an adhesive material layer (440) (e.g., an adhesive film, an adhesive plate, an adhesive sheet), a printed circuit board (450) (e.g., a PCB, a PBA), a shield can (460), a composite heat dissipation structure (1002) (e.g., the composite heat dissipation structure (402) of FIG. 4), heat-generating components (490), electronic components such as integrated circuits (496, ICs), and other electronic components (498) (e.g., peripheral circuit components, passive elements).

[0292] According to one embodiment, electronic components (e.g., heat generating components (490), electronic components such as direct circuits (496), and other electronic components (498)) may be arranged on a printed circuit board (450).

[0293] According to one embodiment, the heat generating components (490) may include a memory (494) (e.g., memory (130) of FIG. 1, DRAM) and a processor (492) (e.g., processor (120) of FIG. 1). For example, the memory (494) and the processor (492) may be stacked and arranged on a printed circuit board (450).

[0294] For example, a processor (492) may be placed on a printed circuit board (450), and a memory (494) may be stacked on the processor (492). However, the present invention is not limited thereto, and a memory (494) may be placed on a printed circuit board (450), and a processor (492) may be stacked on the memory (494).

[0295] For example, direct circuits (496) and electronic components (498) may be placed around the memory (494) and the processor (492).

[0296] According to one embodiment, to dissipate heat generated from heat-generating components (490) (e.g., memory (494) and processor (492)), a composite heat-dissipating structure (1002) may be positioned to cover at least a portion of the heat-generating components (490) (e.g., memory (494) and processor (492)).

[0297] In one embodiment, a shielding layer (430) (e.g., a shielding film) may be placed to cover the upper portion of the composite heat dissipation structure (1002) and the shield can (460).

[0298] According to one embodiment, the composite heat dissipation structure (1002) may include a first heat dissipation structure (1070) (e.g., an insulating heat dissipation structure, a first thermal interface material (TIM)), and a second heat dissipation structure (1080) (e.g., an electrically conductive heat dissipation structure, a second TIM).

[0299] For example, the second heat dissipation structure (1080) (e.g., a conductive heat dissipation structure) may be positioned to cover at least a portion of the upper surface of the heat-generating components (490). The second heat dissipation structure (1080) (e.g., a conductive heat dissipation structure) may be positioned to cover at least a portion of the upper surface of the memory (494). The upper surface may include a surface facing in the same direction (or nearly the same direction) as a surface of the printed circuit board (450) on which the electronic components are mounted. The upper surface may include a surface that does not face (or nearly faces) the surface of the printed circuit board (450) on which the electronic components are mounted.

[0300] For example, an adhesive layer (1090) may be placed between the upper surface of the memory (494) and the lower surface of the second heat dissipation structure (1080) (e.g., conductive heat dissipation structure). However, the present invention is not limited thereto, and the upper surface of the memory (494) and the lower surface of the second heat dissipation structure (1080) (e.g., conductive heat dissipation structure) may be formed to be in contact with each other without the adhesive layer (1090).

[0301] For example, the first heat dissipation structure (1070) (e.g., an insulating heat dissipation structure) may be positioned to surround the second heat dissipation structure (1080) (e.g., a conductive heat dissipation structure). For example, the first heat dissipation structure (1070) (e.g., an insulating heat dissipation structure) may be positioned to cover an upper surface of the second heat dissipation structure (1080) (e.g., a conductive heat dissipation structure). For example, at least a portion of the first heat dissipation structure (1070) may be positioned between the second heat dissipation structure (1080) and the shield layer (430) / adhesive material (440). The first heat dissipation structure (1070) (e.g., an insulating heat dissipation structure) may be positioned to cover the processor (492) and the memory (494). For example, a first heat dissipation structure (1070) (e.g., an insulating heat dissipation structure) may be positioned to cover the upper surfaces of the processor (492) and the memory (494).

[0302] For example, a second heat dissipation structure (1080) (e.g., a conductive heat dissipation structure) may be sealed by a first heat dissipation structure (1070) (e.g., an insulating heat dissipation structure), and the first heat dissipation structure (1070) (e.g., an insulating heat dissipation structure) may be positioned to cover the processor (492) and the memory (494). For example, the first heat dissipation structure (1070) (e.g., an insulating heat dissipation structure) may be positioned to cover the upper surfaces of the processor (492) and the memory (494).

[0303] In one embodiment, the first heat dissipation structure (1070) (e.g., an insulating heat dissipation structure) and the second heat dissipation structure (1080) (e.g., a conductive heat dissipation structure) of the composite heat dissipation structure (1002) may have different compressibility. For example, the first heat dissipation structure (1070) may have a higher compressibility than the second heat dissipation structure (1080).

[0304] According to one embodiment, the first heat dissipation structure (1070) (e.g., an insulating heat dissipation structure) may include a heat diffusion (thermal conductivity) member, thermal grease, heat dissipation paste, and heat diffusion (thermal conductivity) paste.

[0305] For example, the first heat dissipation structure (1070) (e.g., an insulating heat dissipation structure) may include an adhesive material and an insulating thermal interface material (TIM). The first heat dissipation structure (1070) (e.g., an insulating heat dissipation structure) may include a ceramic-based non-conductive filler (e.g., alumina, aluminum nitride, boron nitride).

[0306] For example, the first heat dissipation structure (1070) (e.g., an insulated heat dissipation structure) may have a lower thermal conductivity than the second heat dissipation structure (1080) (e.g., a conductive heat dissipation structure).

[0307] For example, the first heat dissipation structure (1070) (e.g., an insulating heat dissipation structure) may have a thermal conductivity of 2 to 4 [W / mK].

[0308] For example, the first heat dissipation structure (1070) (e.g., an insulating heat dissipation structure) may have a compressibility of 15 to 30% under a pressure condition of 10 to 20 [psi].

[0309] For example, the first heat dissipation structure (1070) (e.g., an insulating heat dissipation structure) may have a thickness of 0.1 to 0.3 mm.

[0310] According to one embodiment, the second heat dissipation structure (1080) (e.g., a conductive heat dissipation structure) may include a heat spreading (heat conducting) member, thermal grease, heat spreading paste, and heat spreading (heat conducting) paste.

[0311] For example, the second heat dissipation structure (1080) (e.g., a conductive heat dissipation structure) may include an adhesive material and a conductive thermal interface material (TIM). The second heat dissipation structure (1080) (e.g., an electrically conductive heat dissipation structure) may include a carbon-based conductive filler (e.g., carbon nanotubes, carbon fibers, graphene, graphite).

[0312] For example, the second heat dissipation structure (1080) (e.g., conductive heat dissipation structure) may have a thermal conductivity of 20 to 40 [W / mK].

[0313] For example, the second heat dissipation structure (1080) (e.g., conductive heat dissipation structure) may have a compressibility of 0.1 to 15% under a pressure condition of 10 to 20 [psi].

[0314] For example, the second heat dissipation structure (1080) (e.g., conductive heat dissipation structure) may have a thickness of 0.1 to 0.3 mm.

[0315] In one embodiment, as the power generated by processors (e.g., application processors) continues to increase, a thermal interface material (TIM) with higher thermal conductivity must be applied to effectively dissipate the high heat generated by the processor (e.g., application processor). Since high electrical conductivity also leads to high thermal conductivity, a filler with high electrical conductivity can be used as a thermal interface material (TIM).

[0316] According to one embodiment, in order to secure high thermal conductivity, a ceramic-based non-conductive filler (e.g., Alumina, Aluminum nitride, boron nitride) may be applied as a heat dissipation material (TIM) of the first heat dissipation structure (1070) (e.g., an insulating heat dissipation structure).

[0317] According to one embodiment, in order to secure high thermal conductivity, a carbon-based conductive filler (e.g., carbon fiber, graphite, carbon nanotube, graphene) may be applied as a heat dissipation material (TIM) of the second heat dissipation structure (1080) (e.g., conductive heat dissipation structure).

[0318] According to one embodiment, in order to secure high thermal conductivity in the present disclosure, a metal-based conductive filler (e.g., aluminum, copper, silver) may be used as a heat dissipation material (TIM) of the second heat dissipation structure (1080) (e.g., conductive heat dissipation structure).

[0319] According to one embodiment, in order to secure higher thermal conductivity, the present disclosure may apply a first heat dissipation structure (1070) (e.g., an insulating heat dissipation structure) and a second heat dissipation structure (1080) (e.g., a conductive heat dissipation structure) aligned in a vertical direction. The vertical direction may be considered a direction perpendicular to the surface of a printed circuit board (450) on which electronic components are mounted.

[0320] For example, in the present disclosure, in order to secure higher thermal conductivity, the filler included in the first heat dissipation structure (1070) (e.g., an insulating heat dissipation structure) may be applied by aligning it in the vertical direction.

[0321] For example, in the present disclosure, in order to secure higher thermal conductivity, the filler included in the second heat dissipation structure (1080) (e.g., conductive heat dissipation structure) may be applied by aligning it in the vertical direction.

[0322] In the composite heat dissipation structure (1002) according to the embodiment of the present disclosure, the compression ratios of the first heat dissipation structure (1070) (e.g., an insulating heat dissipation structure) and the second heat dissipation structure (1080) (e.g., a conductive heat dissipation structure) are different from each other, so that defects due to compression can be prevented during the manufacturing process.

[0323] The composite heat dissipation structure (1002) according to an embodiment of the present disclosure can reduce the thermal resistance at the interface between heat-generating components (490) (e.g., processor, memory) and the composite heat dissipation structure (1002) by applying a compressible heat dissipation material (TIM).

[0324] FIG. 11 is a drawing showing a printed circuit board assembly including a heat dissipation structure according to one embodiment of the present disclosure, and an electronic device including the printed circuit board assembly.

[0325] Referring to FIG. 11, an electronic device (1100) according to an embodiment of the present disclosure (e.g., the electronic device (400) of FIG. 4) may include a display (410) (e.g., the display module (160) of FIG. 1, the first display (230, flexible display) of FIG. 2A, the display (301) of FIG. 3A), a metal front (420) supporting the display (410), and a printed circuit board assembly (1101) (e.g., the printed circuit board assembly (401) of FIG. 4).

[0326] According to one embodiment, a printed circuit board assembly (1101) may include a shielding layer (430) (e.g., a shielding film, a shielding plate, a shielding sheet), an adhesive material layer (440) (e.g., an adhesive film, an adhesive plate, an adhesive sheet), a printed circuit board (450) (e.g., a PCB, a PBA), a shield can (460), a composite heat dissipation structure (1102) (e.g., the composite heat dissipation structure (402) of FIG. 4), heat-generating components (490), an integrated circuit (496, an IC), and electronic components (498) (e.g., peripheral circuit components, passive elements).

[0327] According to one embodiment, electronic components (e.g., electronic components such as heat generating components (490), direct circuits (496)) and other electronic components (498) may be arranged on a printed circuit board (450).

[0328] According to one embodiment, the heat generating components (490) may include a memory (494) (e.g., memory (130) of FIG. 1, DRAM) and a processor (492) (e.g., processor (120) of FIG. 1). For example, the memory (494) and the processor (492) may be stacked and arranged on a printed circuit board (450).

[0329] For example, a processor (492) may be placed on a printed circuit board (450), and a memory (494) may be stacked on the processor (492). However, the present invention is not limited thereto, and a memory (494) may be placed on a printed circuit board (450), and a processor (492) may be stacked on the memory (494).

[0330] For example, direct circuits (496) and electronic components (498) may be placed around the memory (494) and the processor (492).

[0331] According to one embodiment, to dissipate heat generated in the memory (494) and the processor (492), the composite heat dissipation structure (1102) may be positioned to cover at least a portion of the memory (494) and the processor (492).

[0332] In one embodiment, a shielding layer (430) (e.g., a shielding film) may be placed to cover the upper portion of the composite heat dissipation structure (1102) and the shield can (460).

[0333] According to one embodiment, the composite heat dissipation structure (1102) can include a first heat dissipation structure (1170) (e.g., an electrically insulating heat dissipation structure, a first thermal interface material (TIM)), and a second heat dissipation structure (1180) (e.g., an electrically conductive heat dissipation structure, a second TIM).

[0334] For example, the second heat dissipation structure (1180) (e.g., a conductive heat dissipation structure) may be positioned to cover at least a portion of the upper surface of the heat-generating components (490). The second heat dissipation structure (1180) (e.g., a conductive heat dissipation structure) may be positioned to cover at least a portion of the upper surface of the memory (494). The upper surface may include a surface facing in the same direction (or nearly the same direction) as a surface of the printed circuit board (450) on which the electronic components are mounted. The upper surface may include a surface that does not face (or nearly faces) the surface of the printed circuit board (450) on which the electronic components are mounted.

[0335] For example, an adhesive layer (1190) may be disposed between the upper surface of the memory (494) and the lower surface of the second heat dissipation structure (1180) (e.g., a conductive heat dissipation structure). However, the present invention is not limited thereto, and the upper surface of the memory (494) and the lower surface of the second heat dissipation structure (1180) (e.g., a conductive heat dissipation structure) may be formed to be in contact with each other without the adhesive layer (1190). The lower surface may be a surface facing (or nearly facing) the surface of the printed circuit board (450) on which electronic components are mounted.

[0336] For example, the first heat dissipation structure (1170) (e.g., an insulating heat dissipation structure) may be positioned to at least partially surround the second heat dissipation structure (1180) (e.g., a conductive heat dissipation structure). For example, the first heat dissipation structure (1170) (e.g., an insulating heat dissipation structure) may be positioned to cover an upper surface of the second heat dissipation structure (1180) (e.g., a conductive heat dissipation structure). For example, at least a portion of the first heat dissipation structure (1170) may be positioned between the second heat dissipation structure (1180) and the shield layer (430) / adhesive material (440). The first heat dissipation structure (1170) (e.g., an insulating heat dissipation structure) may be positioned to cover the processor (492) and the memory (494). For example, a first heat dissipation structure (1170) (e.g., an insulating heat dissipation structure) may be positioned to cover the upper surfaces of the processor (492) and the memory (494).

[0337] For example, the first heat dissipation structure (1170) (e.g., an insulating heat dissipation structure) may be positioned to cover the upper surface of the direct circuit (496) and electronic components (498).

[0338] For example, a first heat dissipation structure (1170) (e.g., an insulating heat dissipation structure) may be positioned inside the shield can (460) to fill a portion excluding the second heat dissipation structure (1180) (e.g., a conductive heat dissipation structure), the processor (492), the memory (494), the integrated circuit (496), and the electronic components (498). For example, the second heat dissipation structure (1080) (e.g., a conductive heat dissipation structure) may be sealed by the first heat dissipation structure (1170) (e.g., an insulating heat dissipation structure). A first heat dissipation structure (1170) (e.g., an insulating heat dissipation structure) is arranged to cover the processor (492), the memory (494), the integrated circuit (496), and the electronic components (498), so that a short circuit can be prevented from occurring between the processor (492), the memory (494), the integrated circuit (496), and the electronic components (498) by the first heat dissipation structure (1170) (e.g., an insulating heat dissipation structure).

[0339] For example, a second heat dissipation structure (1180) (e.g., a conductive heat dissipation structure) is sealed by a first heat dissipation structure (1170) (e.g., an insulating heat dissipation structure), and the first heat dissipation structure (1170) (e.g., an insulating heat dissipation structure) is arranged to cover the upper surface of the direct circuit (496) and the electronic components (498), so that a short circuit can be prevented from occurring between the processor (492), the memory (494), the direct circuit (496), and the electronic components (498) by the second heat dissipation structure (1180) (e.g., a conductive heat dissipation structure).

[0340] In one embodiment, the first heat dissipation structure (1170) (e.g., an insulating heat dissipation structure) and the second heat dissipation structure (1180) (e.g., a conductive heat dissipation structure) of the composite heat dissipation structure (1102) may have different compressibility. For example, the first heat dissipation structure (1170) may have a higher compressibility than the second heat dissipation structure (1180).

[0341] According to one embodiment, the first heat dissipation structure (1170) (e.g., an electrically insulating heat dissipation structure) may include a heat spreading (heat conducting) member, thermal grease, heat spreading paste, and heat spreading (heat conducting) paste.

[0342] For example, the first heat dissipation structure (1170) (e.g., an electrically insulating heat dissipation structure) may include an adhesive material and an insulating thermal interface material (TIM). The first heat dissipation structure (1170) (e.g., an insulating heat dissipation structure) may include a ceramic-based non-conductive filler (e.g., alumina, aluminum nitride, boron nitride).

[0343] For example, the first heat dissipation structure (1170) (e.g., an insulated heat dissipation structure) may have a lower thermal conductivity than the second heat dissipation structure (1180) (e.g., a conductive heat dissipation structure).

[0344] For example, the first heat dissipation structure (1170) (e.g., an insulating heat dissipation structure) may have a thermal conductivity of 2 to 4 [W / mK].

[0345] For example, the first heat dissipation structure (1170) (e.g., an insulating heat dissipation structure) may have a compressibility of 15 to 30% under a pressure condition of 10 to 20 [psi].

[0346] For example, the first heat dissipation structure (1170) (e.g., an insulating heat dissipation structure) may have a thickness of 0.1 to 0.3 mm.

[0347] According to one embodiment, the second heat dissipation structure (1180) (e.g., a conductive heat dissipation structure) may include a heat spreading (heat conducting) member, thermal grease, heat spreading paste, and heat spreading (heat conducting) paste.

[0348] For example, the second heat dissipation structure (1180) (e.g., an electrically conductive heat dissipation structure) may include an adhesive material and a conductive thermal interface material (TIM). The second heat dissipation structure (1180) (e.g., a conductive heat dissipation structure) may include a carbon-based conductive filler (e.g., carbon nanotubes, carbon fibers, graphene, graphite).

[0349] For example, the second heat dissipation structure (1180) (e.g., conductive heat dissipation structure) may have a thermal conductivity of 20 to 40 [W / mK].

[0350] For example, the second heat dissipation structure (1180) (e.g., conductive heat dissipation structure) may have a compressibility of 0.1 to 15% under a pressure condition of 10 to 20 [psi].

[0351] For example, the second heat dissipation structure (1180) (e.g., conductive heat dissipation structure) may have a thickness of 0.1 to 0.2 mm.

[0352] In one embodiment, as the power generated by processors (e.g., application processors) continues to increase, thermally conductive materials (TIMs) with higher thermal conductivity must be applied to effectively dissipate the high heat generated by the processors (e.g., application processors). Since high electrical conductivity also leads to high thermal conductivity, recently, fillers with high electrical conductivity have been used as TIMs.

[0353] According to one embodiment, in order to secure high thermal conductivity in the present disclosure, a ceramic-based non-conductive filler (e.g., Alumina, Aluminum nitride, boron nitride) described in Table 1 may be applied as a heat dissipation material (TIM) of the first heat dissipation structure (1170) (e.g., an insulating heat dissipation structure).

[0354] According to one embodiment, in order to secure high thermal conductivity in the present disclosure, a carbon-based conductive filler (e.g., carbon fiber, graphite, carbon nanotube, graphene) described in Table 1 may be applied as a heat dissipation material (TIM) of the second heat dissipation structure (1180) (e.g., conductive heat dissipation structure).

[0355] According to one embodiment, in order to secure high thermal conductivity in the present disclosure, a metal-based conductive filler (e.g., aluminum, copper, silver) described in Table 1 may be used as a heat dissipation material (TIM) of the second heat dissipation structure (1180) (e.g., conductive heat dissipation structure).

[0356] According to one embodiment, in order to secure higher thermal conductivity, the present disclosure may apply a first heat dissipation structure (1170) (e.g., an insulating heat dissipation structure) and a second heat dissipation structure (1180) (e.g., a conductive heat dissipation structure) aligned in a vertical direction.

[0357] For example, in the present disclosure, in order to secure higher thermal conductivity, the filler included in the first heat dissipation structure (1170) (e.g., an insulating heat dissipation structure) may be applied by aligning it in the vertical direction. The vertical direction may be considered as a direction perpendicular to the surface of the printed circuit board (450) on which the electronic component is mounted.

[0358] For example, in the present disclosure, in order to secure higher thermal conductivity, the filler included in the second heat dissipation structure (1180) (e.g., conductive heat dissipation structure) may be applied by aligning it in the vertical direction.

[0359] In the composite heat dissipation structure (1102) according to the embodiment of the present disclosure, the compression ratios of the first heat dissipation structure (1170) (e.g., an insulating heat dissipation structure) and the second heat dissipation structure (1180) (e.g., a conductive heat dissipation structure) are different from each other, so that defects due to compression can be prevented during the manufacturing process.

[0360] The composite heat dissipation structure (1102) according to an embodiment of the present disclosure can reduce thermal resistance at the interface between heat-generating components (490) (e.g., processor, memory) and the composite heat dissipation structure (1102) by applying a compressible heat dissipation material (TIM).

[0361] An electronic device according to one embodiment of the present disclosure (e.g., an electronic device (400) of FIG. 4) comprises: a printed circuit board (450) on which electronic components (e.g., a processor (492), a memory (494), an integrated circuit (496), and electronic components (498) of FIG. 4) are arranged; a shield can (e.g., a shield-can (460) of FIG. 4) arranged to shield the electronic components (492, 494, 496, 498); a composite heat dissipation structure (e.g., a composite heat dissipation structure (402) of FIG. 4, a composite heat dissipation structure (802) of FIG. 8, a composite heat dissipation structure (902) of FIG. 9, a composite heat dissipation structure (1002) of FIG. 10, a composite heat dissipation structure (1102) of FIG. 11) arranged on top of the electronic components (492, 494, 496, 498); It may include a shielding film (e.g., shielding layer (430) of FIG. 4) placed on top of the above composite heat dissipation structure (402, 802, 902, 1002, 1102), and a display (e.g., display (410) of FIG. 4) placed on the shielding layer (430).

[0362] According to one embodiment, the composite heat dissipation structure (402, 802, 902, 1002, 1102) may include a first heat dissipation structure (470, 870, 970, 1070, 1170) including an insulating and compressible material, and a second heat dissipation structure (480, 880, 980, 1080, 1180) including a conductive material.

[0363] According to one embodiment, the first heat dissipation structure (470, 870, 970, 1070, 1170) may include a ceramic-based filler.

[0364] According to one embodiment, the first heat dissipation structure (470, 870, 970, 1070, 1170) may have a thermal conductivity of 2 to 4 W / mK, a compressibility of 15 to 30% at a pressure of 10 to 20 [psi], and a thickness of 0.1 to 0.3 mm.

[0365] In one embodiment, the second heat dissipation structure (480, 880, 980, 1080, 1180) may include a carbon-based conductive filler.

[0366] According to one embodiment, the second heat dissipation structure (480, 880, 980, 1080, 1180) may have a thermal conductivity of 20 to 40 W / mK, a compressibility of 0.1 to 15% at a pressure of 10 to 20 [psi], and a thickness of 0.1 to 0.3 mm.

[0367] In one embodiment, a porous conductive adhesive material (440) may be placed on the bottom of the shielding layer (430).

[0368] According to one embodiment, the first heat dissipation structure (470, 870, 970, 1070, 1170) may be disposed on top of the electronic components (492, 494, 496, 498). The second heat dissipation structure (480, 880, 980, 1080, 1180) may be disposed on top of the first heat dissipation structure (470, 870, 970, 1070, 1170). The shielding layer (430) (e.g., a shielding film) may be disposed on top of the second heat dissipation structure (480, 880, 980, 1080, 1180).

[0369] According to one embodiment, the second heat dissipation structure (480, 880, 980, 1080, 1180) may be disposed on top of the electronic components (492, 494, 496, 498). The first heat dissipation structure (470, 870, 970, 1070, 1170) may be disposed on top of the second heat dissipation structure (480, 880, 980, 1080, 1180). The shielding layer (430) (e.g., a shielding film) may be disposed on top of the first heat dissipation structure (470, 870, 970, 1070, 1170).

[0370] In one embodiment, at least a portion of the composite heat dissipation structure (402, 802, 902, 1002, 1102) may be positioned to cover the upper portions of some of the electronic components (492, 494, 496, 498).

[0371] In one embodiment, at least a portion of the composite heat dissipation structure (402, 802, 902, 1002, 1102) may be positioned to cover the upper portion of the entire electronic components (492, 494, 496, 498).

[0372] A printed circuit board assembly according to one embodiment of the present disclosure (e.g., a printed circuit board assembly (401) of FIG. 4, a printed circuit board assembly (801) of FIG. 8, a printed circuit board assembly (901) of FIG. 9, a printed circuit board assembly (1001) of FIG. 10, a printed circuit board assembly (1101) of FIG. 11) comprises: a printed circuit board (450) on which electronic components (492, 494, 496, 498) are arranged; a shield-can (460, shield-can) arranged to shield the electronic components (492, 494, 496, 498); a composite heat dissipation structure (402, 802, 902, 1002, 1102) arranged on top of the electronic components (492, 494, 496, 498); and the composite heat dissipation A shielding layer (430) (e.g., a shielding film) may be included that is placed on top of the structure (402, 802, 902, 1002, 1102).

[0373] According to one embodiment, the composite heat dissipation structure (402, 802, 902, 1002, 1102) may include a first heat dissipation structure (470, 870, 970, 1070, 1170) comprising an insulating and compressible material, and a second heat dissipation structure (480, 880, 980, 1080, 1180) comprising a conductive material.

[0374] In one embodiment, the first heat dissipation structure (470, 870, 970, 1070, 1170) may include a ceramic-based conductive filler. The first heat dissipation structure (470, 870, 970, 1070, 1170) may have a thermal conductivity of 2 to 4 W / mK, a compressibility of 15 to 30% at a pressure of 10 to 20 [psi], and a thickness of 0.1 to 0.3 mm.

[0375] In one embodiment, the second heat dissipation structure (480, 880, 980, 1080, 1180) may include a carbon-based conductive filler. The second heat dissipation structure (480, 880, 980, 1080, 1180) may have a thermal conductivity of 20 to 40 W / mK, a compressibility of 0.1 to 15% at a pressure of 10 to 20 [psi], and a thickness of 0.1 to 0.3 mm.

[0376] According to one embodiment, the first heat dissipation structure (470, 870, 970, 1070, 1170) may include a ceramic-based filler.

[0377] In one embodiment, the second heat dissipation structure (480, 880, 980, 1080, 1180) may include a carbon-based conductive filler.

[0378] According to one embodiment, the second heat dissipation structure (480, 880, 980, 1080, 1180) may be disposed on top of the electronic components (492, 494, 496, 498). The first heat dissipation structure (470, 870, 970, 1070, 1170) may be disposed on top of the second heat dissipation structure (480, 880, 980, 1080, 1180). The shielding layer (430) (e.g., a shielding film) may be disposed on top of the first heat dissipation structure (470, 870, 970, 1070, 1170).

[0379] In one embodiment, at least a portion of the composite heat dissipation structure (402, 802, 902, 1002, 1102) may be positioned to cover the upper portions of some of the electronic components (492, 494, 496, 498).

[0380] In one embodiment, at least a portion of the composite heat dissipation structure (402, 802, 902, 1002, 1102) may be positioned to cover the upper portion of the entire electronic components (492, 494, 496, 498).

[0381] As a first example, an electronic device (e.g., 400) is provided, which includes a printed circuit board (e.g., 450) having electronic components (e.g., 492, 494, 496, 498) mounted thereon; a shield can (e.g., 460) positioned to shield the electronic components (e.g., 492, 494, 496, 498); a composite heat dissipation structure (e.g., 402, 802, 902, 1002, 1102) positioned over the electronic components; a shield film (e.g., 430) positioned over the composite heat dissipation structure; and a display (e.g., 410) positioned over the shield film.

[0382] As a second example, in the electronic device of the first example, the composite heat dissipation structure includes a first heat dissipation structure (e.g., 470, 870, 970, 1070, 1170) made of an insulating and compressible material, and a second heat dissipation structure (e.g., 480, 880, 980, 1080, 1180) made of a conductive material.

[0383] As a third example, in the electronic device of the second example, the first heat dissipation structure includes a ceramic-based filler.

[0384] As a fourth example, in the electronic device of the third example, the first heat dissipating structure has a thermal conductivity of 24 W / mK, a compressibility of 15% to 30% at a pressure of 10 to 20 psi, and a thickness of 0.1 to 0.3 mm.

[0385] As a fifth example, in the electronic device of the second example, the second heat dissipation structure includes a carbon-based conductive filler.

[0386] As a sixth example, in the electronic device of the fifth example, the second heat dissipation structure has a thermal conductivity of 20 to 40 W / mK, a compressibility of 0.1% to 15% at a pressure of 10 to 20 psi, and a thickness of 0.1 to 0.3 mm.

[0387] In a seventh example, in the electronic device of the second example, a porous conductive adhesive material (e.g., 440) is disposed on the lower surface of the shield film.

[0388] In an eighth example, in the electronic device of the second example, a first heat dissipation structure is disposed over the electronic component, a second heat dissipation structure is disposed over the first heat dissipation structure, and a shield film is disposed over the second heat dissipation structure.

[0389] In a ninth example, in the electronic device of the second example, a second heat dissipation structure is disposed over the electronic component, a first heat dissipation structure is disposed over the second heat dissipation structure, and a shield film is disposed over the first heat dissipation structure.

[0390] In a tenth example, in the electronic device of the second example, at least a portion of the composite heat dissipation structure is arranged to cover an upper portion of some electronic component.

[0391] In an eleventh example, in the electronic device of the second example, at least a portion of the composite heat dissipation structure is arranged to cover the upper portion of all electronic components.

[0392] As a twelfth example, a printed circuit board assembly (e.g., 401, 801, 901, 1001, 1101) is provided, which includes a printed circuit board (e.g., 450) having electronic components (e.g., 492, 494, 496, 498) mounted thereon; a shield can (e.g., 460) positioned to shield the electronic components; a composite heat dissipation structure (e.g., 402, 802, 902, 1002, 1102) positioned over the electronic components; and a shield film (e.g., 430) positioned over the composite heat dissipation structure.

[0393] In a thirteenth example, in the electronic device of the twelfth example, the composite heat dissipation structure includes a first heat dissipation structure (e.g., 470, 870, 970, 1070, 1170) made of an insulating and compressible material and a second heat dissipation structure (e.g., 480, 880, 980, 1080, 1180) made of a conductive material.

[0394] In a fourteenth example, in the electronic device of example 13, the first heat dissipating structure comprises a ceramic-based filler and has a thermal conductivity of 2 to 4 W / mK, a compressibility of 15% to 30% at a pressure of 10 to 20 psi, and a thickness of 0.1 to 0.3 mm.

[0395] In a fifteenth example, in the electronic device of example 13, the second heat dissipation structure comprises a carbon-based conductive filler and has a thermal conductivity of 20 to 40 W / mK, a compressibility of 0.1% to 15% at a pressure of 10 to 20 psi, and a thickness of 0.1 to 0.3 mm.

[0396] In a sixteenth example, in the electronic device of the thirteenth example, the first heat dissipating structure includes a ceramic-based filler.

[0397] In a seventeenth example, in the electronic device of the thirteenth example, the second heat dissipation structure includes a carbon-based conductive filler.

[0398] In an eighteenth example, in the electronic device of the thirteenth example, a second heat dissipation structure is disposed over the electronic component, a first heat dissipation structure is disposed over the second heat dissipation structure, and a shield film is disposed over the first heat dissipation structure.

[0399] In a nineteenth example, in the electronic device of example 13, at least a portion of the composite heat dissipation structure is arranged to cover an upper portion of some electronic component.

[0400] In the twentieth example, in the electronic device of the thirteenth example, at least a portion of the composite heat dissipation structure is arranged to cover the upper portion of all electronic components.

[0401] As a twenty-first example, a printed circuit board assembly (e.g., 401, 801, 901, 1001, 1101) is provided, which includes a printed circuit board (e.g., 450) having electronic components (e.g., 492, 494, 496, 498) mounted thereon; a shield can (e.g., 460) positioned to shield the electronic components; a composite heat dissipation structure (e.g., 402, 802, 902, 1002, 1102) positioned over the electronic components; and a shield layer (e.g., 430) positioned over the composite heat dissipation structure.

[0402] In a twenty-second example, in the printed circuit board assembly of example 21, the composite heat dissipation structure includes a first heat dissipation structure (e.g., 470, 870, 970, 1070, 1170) made of an insulating and compressible material and a second heat dissipation structure (e.g., 480, 880, 980, 1080, 1180) made of a conductive material.

[0403] In a twenty-third example, in the printed circuit board assembly of example 22, the first heat dissipation structure has a higher compressibility than the second heat dissipation structure.

[0404] In a twenty-fourth example, in the printed circuit board assembly of example 22 or example 23, the first heat dissipation structure has a lower thermal conductivity than the second heat dissipation structure.

[0405] In a twenty-fifth example, in the printed circuit board assembly of any one of examples 22 to 24, the first heat dissipating structure comprises a ceramic-based filler.

[0406] In a twenty-sixth example, in the printed circuit board assembly of any one of examples 22 to 25, the first heat dissipation structure has a thermal conductivity of 2 to 4 W / mK, a compressibility of 15 to 30% at a pressure of 10 to 20 psi, and a thickness of 0.1 to 0.3 mm.

[0407] In a twenty-seventh example, in the printed circuit board assembly of any one of examples 22 to 26, the second heat dissipation structure comprises a carbon-based conductive filler.

[0408] In a twenty-eighth example, in the printed circuit board assembly of any one of examples 22 to 27, the second heat dissipation structure has a thermal conductivity of 20 to 40 W / mK, a compressibility of 0.1% to 15% at a pressure of 10 to 20 psi, and a thickness of 0.1 to 0.3 mm.

[0409] In a twenty-ninth example, in the printed circuit board assembly of any one of examples 22 to 28, a porous conductive adhesive material (e.g., 440) is disposed on a lower surface of the shield layer.

[0410] In a thirtieth example, in the printed circuit board assembly of any one of examples 22 to 29, a first heat dissipation structure is disposed over the electronic component, a second heat dissipation structure is disposed over the first heat dissipation structure, and a shield layer is disposed over the second heat dissipation structure.

[0411] In a thirty-first example, in the printed circuit board assembly of any one of examples 22 to 29, a second heat dissipation structure is disposed over the electronic component, a first heat dissipation structure is disposed over the second heat dissipation structure, and a shield layer is disposed over the first heat dissipation structure.

[0412] In a thirty-second example, in the printed circuit board assembly of any one of examples 22 to 31, the first heat dissipation structure is arranged to at least partially surround the second heat dissipation structure.

[0413] In a thirty-third example, in the printed circuit board assembly of any one of examples 22 to 32, the first heat dissipation structure has an air exhaust port (e.g., 810) formed therein, and the air exhaust port is configured such that when pressure is applied in a direction perpendicular to the surface of the printed circuit board on which the electronic component is mounted, air existing in an area surrounded by the first heat dissipation structure is exhausted through the air exhaust port, and then the air exhaust port is closed.

[0414] In a thirty-fourth example, in the printed circuit board assembly of any one of examples 21 to 33, at least a portion of the composite heat dissipation structure is positioned to cover the upper portions of some of the electronic components, or at least a portion of the composite heat dissipation structure is positioned to cover the upper portions of all of the electronic components.

[0415] In a thirty-fifth example, an electronic device (e.g., 400) is provided comprising a printed circuit board assembly of any one of examples 21 to 34, wherein the electronic device (400) comprises a display (e.g., 410) disposed on a shield layer.

[0416] A printed circuit board assembly including a composite heat dissipation structure of the present disclosure, and an electronic device including the printed circuit board assembly, can prevent a short circuit from occurring by having a first heat dissipation structure (e.g., an insulating heat dissipation structure) disposed to cover at least a portion of an upper surface of heat-generating components (e.g., a processor, a memory), and a second heat dissipation structure (e.g., a conductive heat dissipation structure) disposed to cover at least a portion of an upper surface of the first heat dissipation structure (e.g., an insulating heat dissipation structure).

[0417] In a composite heat dissipation structure according to an embodiment of the present disclosure, the compression ratios of the first heat dissipation structure (e.g., an insulating heat dissipation structure) and the second heat dissipation structure (e.g., a conductive heat dissipation structure) are different from each other, so that defects due to compression can be prevented during the manufacturing process.

[0418] A composite heat dissipation structure according to an embodiment of the present disclosure can reduce thermal resistance at an interface between heat-generating components (e.g., processor, memory) and the composite heat dissipation structure by applying a compressible thermal interface material (TIM).

[0419] A printed circuit board assembly including a heat dissipation structure of the present disclosure, and an electronic device including the printed circuit board assembly, can improve heat dissipation performance of heat generated from a processor and memory in an environment where high heat generation of about 15 W is generated.

[0420] For example, when comparing the DTM (dynamic thermal management) point at which the maximum temperature is reached and the GPU temperature, the DTM point can be delayed by about 54 to 58 seconds and the temperature of the processor can be lowered by about -5.8°C by applying the heat dissipation structure (#3) of the present disclosure compared to the comparative examples (#1, #2).

[0421] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the technical field to which the present disclosure belongs from the description below.

Claims

1. A printed circuit board (450) on which electronic components (492, 494, 496, 498) are arranged; A shield-can (460) arranged to shield the above electronic components (492, 494, 496, 498); A composite heat dissipation structure (402, 802, 902, 1002, 1102) placed on top of the above electronic components (492, 494, 496, 498); and A shielding film (430) disposed on the upper portion of the above composite heat dissipation structure (402, 802, 902, 1002, 1102); Printed circuit board assembly (401, 801, 901, 1001, 1101).

2. In paragraph 1, The above composite heat dissipation structure (402, 802, 902, 1002, 1102) is A first heat dissipation structure (470, 870, 970, 1070, 1170) comprising an insulating and compressible material; and A second heat dissipation structure (480, 880, 980, 1080, 1180) comprising a conductive material; Printed circuit board assembly (401, 801, 901, 1001, 1101).

3. In paragraph 2, The first heat-radiating structure (470, 870, 970, 1070, 1170) has a higher compressibility than the second heat-radiating structure (480, 880, 980, 1080, 1180). Printed circuit board assembly (401, 801, 901, 1001, 1101).

4. In paragraph 2 or 3, The first heat dissipation structure (470, 870, 970, 1070, 1170) has a lower thermal conductivity than the second heat dissipation structure (480, 880, 980, 1080, 1180). Printed circuit board assembly (401, 801, 901, 1001, 1101).

5. In any one of paragraphs 2 to 4, The above first heat dissipation structure (470, 870, 970, 1070, 1170) includes a ceramic-based filler. Printed circuit board assembly (401, 801, 901, 1001, 1101).

6. In any one of paragraphs 2 to 5, The above first heat dissipation structure (470, 870, 970, 1070, 1170) is The thermal conductivity is 2 to 4 W / mK, the compressibility is 15 to 30% at 10 to 20 [psi] pressure, and the thickness is 0.1 to 0.3 mm. Printed circuit board assembly (401, 801, 901, 1001, 1101).

7. In any one of paragraphs 2 to 6, The above second heat dissipation structure (480, 880, 980, 1080, 1180) includes a carbon-based conductive filler. Printed circuit board assembly (401, 801, 901, 1001, 1101).

8. In any one of paragraphs 2 to 7, The above second heat dissipation structure (480, 880, 980, 1080, 1180) is The thermal conductivity is 20 to 40 W / mK, the compressibility is 0.1 to 15% at 10 to 20 [psi] pressure, and the thickness is 0.1 to 0.3 mm. Printed circuit board assembly (401, 801, 901, 1001, 1101).

9. In any one of paragraphs 2 to 8, A porous conductive adhesive material (440) is placed on the lower side of the above shielding film (430). Printed circuit board assembly (401, 801, 901, 1001, 1101).

10. In any one of paragraphs 2 to 9, The first heat dissipation structure (470, 870, 970, 1070, 1170) is placed on top of the electronic components (492, 494, 496, 498), The second heat dissipation structure (480, 880, 980, 1080, 1180) is arranged on top of the first heat dissipation structure (470, 870, 970, 1070, 1170), The shielding film (430) is placed on the upper part of the second heat dissipation structure (480, 880, 980, 1080, 1180). Printed circuit board assembly (401, 801, 901, 1001, 1101).

11. In any one of paragraphs 2 to 9, The second heat dissipation structure (480, 880, 980, 1080, 1180) is placed on top of the electronic components (492, 494, 496, 498), The first heat dissipation structure (470, 870, 970, 1070, 1170) is arranged on top of the second heat dissipation structure (480, 880, 980, 1080, 1180), The shielding film (430) is placed on the upper part of the first heat dissipation structure (470, 870, 970, 1070, 1170). Printed circuit board assembly (401, 801, 901, 1001, 1101).

12. In any one of paragraphs 2 to 11, The first heat dissipation structure (470, 870, 970, 1070, 1170) is arranged to at least partially surround the second heat dissipation structure (480, 880, 980, 1080, 1180). Printed circuit board assembly (401, 801, 901, 1001, 1101).

13. In any one of paragraphs 2 to 12, The first heat dissipation structure (470, 870, 970, 1070, 1170) has an air exhaust port (810) formed therein. The above air outlet (810) is configured so that when pressure is applied in a direction perpendicular to the surface of the printed circuit board (450) on which electronic components (492, 494, 496, 498) are mounted, air existing in an area surrounded by the first heat dissipation structure (470, 870, 970, 1070, 1170) is discharged through the air outlet (810), and then the air outlet (810) is closed. Printed circuit board assembly (401, 801, 901, 1001, 1101).

14. In any one of paragraphs 1 to 13, At least a portion of the composite heat dissipation structure (402, 802, 902, 1002, 1102) is arranged to cover the upper portion of some electronic component (492, 494, 496, 498), or At least a portion of the composite heat dissipation structure (402, 802, 902, 1002, 1102) is arranged to cover the upper portion of all electronic components (492, 494, 496, 498). Printed circuit board assembly (401, 801, 901, 1001, 1101).

15. In an electronic device (400) including a printed circuit board assembly (401, 801, 901, 1001, 1101) of any one of claims 1 to 13, The electronic device (400) includes a display (410) disposed on a shield layer (430).

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