Camera module and packaging method therefor, and electronic device

Abstract

The present application provides a camera module and a packaging method therefor, and an electronic device. The camera module comprises a circuit board, an image sensor, a package, and a lens assembly; the circuit board has a first region, a second region, and a third region which are sequentially connected, the second region surrounds the first region, and the third region surrounds the second region; the image sensor is fixed in the first region, a portion of the package is fixed in the second region, and a portion of the package is fixed to the edge of the image sensor; and a portion of the lens assembly is fixedly connected to the third region of the circuit board, and a portion of the lens assembly is fixedly connected to the package. In the present application, the package is arranged in the second region of the circuit board close to the center, so that the lens assembly can be directly connected to the circuit board, thereby avoiding increasing the height of the camera module due to the package, reducing the shoulder height of the camera module, and facilitating the miniaturization of the camera module.

Description

Camera module, packaging method thereof and electronic device

[0001] The present application claims priority to the Chinese patent application No. 202411233520.7, filed on September 3, 2024, and entitled "Camera module, packaging method thereof and electronic device", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] The present application relates to the technical field of camera modules, in particular to a camera module, a packaging method thereof and an electronic device. BACKGROUND

[0003] A camera module is an important module component of an electronic device (for example, a mobile phone, a tablet computer or a notebook computer). The camera module is usually packaged by a molding on chip (MOC) packaging process. Specifically, the entire surface of a circuit board is injection molded to form a packaging piece (molding), and then a lens assembly is bonded on the injection molding piece by an active alignment (AA) process to complete the packaging.

[0004] However, the packaging piece seriously affects the shoulder height of the camera module, which is not conducive to the miniaturization of the camera module. SUMMARY

[0005] The present application provides a camera module, a packaging method thereof and an electronic device. The camera module includes a circuit board, an image sensor, a packaging piece and a lens assembly. The packaging piece is arranged in the center region of the circuit board, so that the lens assembly can cover the packaging piece and be connected with the circuit board. The height of the camera module is not increased by the packaging piece, the back focal space of the camera module is reduced, the shoulder height of the camera module is reduced, and the miniaturization of the camera module is facilitated.

[0006] In a first aspect, the present application provides a camera module. The camera module includes a circuit board, an image sensor, a packaging piece and a lens assembly. The circuit board has a first region, a second region and a third region connected in sequence. The second region surrounds the first region, and the third region surrounds the second region. The image sensor is fixed to the first region, and a part of the packaging piece is fixed to the second region and a part is fixed to the edge of the image sensor. A part of the lens assembly is fixedly connected with the third region of the circuit board, and a part is fixedly connected with the packaging piece. The image sensor is located on the light exit side of the lens assembly.

[0007] In the present application, the package can be formed by directly injection molding on the circuit board, so that the package does not need to be fixed to the circuit board by adhesive or the like, and no avoiding structure is needed to avoid other structures on the circuit board, which is beneficial to the simplification and miniaturization of the package, thereby reducing the board area of the circuit board, and further beneficial to the overall miniaturization of the camera module.

[0008] In the present application, the package is located only in the part of the circuit board close to the center, so that the lens assembly can be directly connected to the area close to the edge of the circuit board, thereby enabling the package to be located inside the mounting space without occupying the overall thickness dimension of the camera module, and further reducing the overall thickness of the camera module, which is beneficial to the miniaturization of the camera module. In addition, since the lens assembly is directly connected to the circuit board, the distance between the lens and the image sensor in the lens assembly is reduced, thereby reducing the back focal space of the camera module.

[0009] In the present application, part of the package can be fixed to the second area, and part of the package can be fixed to the edge of the image sensor, so that the package can package the image sensor on the circuit board, and improve the mounting stability of the image sensor.

[0010] In the present application, the lens assembly can be connected to the part of the circuit board located in the third area, so that the lens assembly can avoid the package and be directly connected to the circuit board. Compared with the prior art of mounting the lens assembly on the package, the present implementation can avoid the package occupying the overall thickness dimension of the camera module, thereby reducing the shoulder height of the camera module, which is beneficial to the miniaturization of the camera module, and further beneficial to the thinness of the electronic device.

[0011] In some possible implementation manners, the camera module further includes a packaging adhesive, part of the packaging adhesive bonding the lens assembly and the circuit board, and part of the packaging adhesive bonding the lens assembly and the package.

[0012] In the present implementation, the packaging adhesive not only bonds the lens assembly and the part of the circuit board located in the third area, but also bonds the lens assembly and the package, thereby improving the bonding stability of the lens assembly and the overall packaging stability of the camera module. In addition, since the package is formed on the circuit board by injection molding, the package is fixedly connected to the circuit board, and therefore, the packaging adhesive, the lens assembly and the package are directly connected to each other, which enables the lens assembly to be stably fixed to the circuit board, and improves the structural stability of the camera module.

[0013] In some possible implementation manners, the lens assembly and the circuit board enclose the mounting space, and the image sensor and the package are located in the mounting space.

[0014] In some possible implementation manners, the edge of the packaging member is provided with a connecting material, the connecting material extends from the edge of the packaging member to the edge of the circuit board, and the lens assembly is further connected to the connecting material.

[0015] In the implementation manner, the connecting material can be reserved after the injection molding member is formed by injection molding, so as to reduce the process difficulty, shorten the process time, and reduce the process cost. The connecting material is connected to the edge of the packaging member and extends to the edge of the circuit board. Since the injection molding member is integrally formed by injection molding, the connecting material and the packaging member are in an integrated structure, which is beneficial to improving the connection strength of the packaging member and the circuit board. Alternatively, since the thickness of the connecting material is less than the thickness of the packaging member, the design depth of the second groove on the circuit board is reduced, the structural interference of the circuit board is reduced, and the cooperation and connection of the lens assembly and the circuit board are facilitated.

[0016] In some possible implementation manners, the lens assembly is provided with a first groove, an opening of the first groove faces the circuit board, and the connecting material is arranged in the first groove.

[0017] In the implementation manner, the lens assembly is provided with the first groove, so that after the lens assembly is mounted on the circuit board, the first groove can accommodate the connecting material to avoid interference of the connecting material with the installation of the lens assembly. Since the first groove is designed, the connecting material does not need to be removed after the injection molding member is formed by injection molding, the process difficulty is reduced, the process time is shortened, and the process cost is reduced.

[0018] The packaging glue can also bond the connecting material and the lens assembly. Specifically, the packaging glue bonds the inner wall of the first groove and the connecting material, which improves the stability of the lens assembly mounted on the circuit board and seals the first groove, thereby improving the packaging stability of the camera module.

[0019] In other possible implementation manners, the circuit board is provided with a second groove, an opening of the second groove faces the lens assembly, and the connecting material is arranged in the second groove.

[0020] In the implementation manner, the circuit board is provided with the second groove, so that after the lens assembly is mounted on the circuit board, the second groove can accommodate the connecting material to avoid interference of the connecting material with the installation of the lens assembly. Since the second groove is designed, the connecting material does not need to be removed after the injection molding member is formed by injection molding, the process difficulty is reduced, the process time is shortened, and the process cost is reduced.

[0021] The packaging glue can also bond the connecting material and the lens assembly. Specifically, the packaging glue can bond the surface of the connecting material exposed from the second groove and the lens assembly, which improves the stability of the lens assembly mounted on the circuit board and seals the second groove, thereby improving the packaging stability of the camera module.

[0022] The surface of the connecting material can be flush with the surface of the circuit board, so as to improve the surface flatness of the circuit board, thereby facilitating the mounting of the lens assembly on the circuit board.

[0023] In some possible implementation manners, the thickness of the connecting material is less than the thickness of the packaging member along the arrangement direction of the circuit board and the lens assembly.

[0024] In this implementation manner, the thickness of the connecting material is less than the thickness of the packaging member, which facilitates reducing the difficulty of removing the connecting material and improving the removal efficiency of the connecting material. Since the thickness of the connecting material is less than the thickness of the packaging member, the design depth of the first groove on the lens assembly can be reduced, so as to reduce the structural interference on the lens assembly, and facilitate the cooperative connection of the lens assembly and the circuit board.

[0025] In some possible implementation manners, the surface of the circuit board facing the lens assembly is provided with an insulating layer, and the insulating layer has a slot extending from the edge of the packaging member to the edge of the circuit board.

[0026] In this implementation manner, since the slot of the insulating layer is provided, the connecting material is located at the slot after the injection molding member is formed by injection molding. Since the insulating layer is removed at the slot, the metal part of the circuit board is exposed. Since the bonding force between the injection material and the metal is poor, the connecting material is easy to be removed at the slot, for example, the connecting material can be removed by mechanical external force, which reduces the difficulty of removing the connecting material and shortens the time spent for removing the connecting material, thereby reducing the production cost. In addition, since only part of the insulating layer on the surface of the circuit board is removed, the structure of the circuit board is not damaged, and the integrity of the circuit board can be ensured. In addition, since the connecting material is removed, no avoiding structure needs to be arranged on the lens assembly and the circuit board for the connecting material, the overall integrity of the camera module can be ensured, and the stability of the camera module packaging can be ensured.

[0027] In some possible implementation manners, the image sensor is electrically connected to the circuit board through a wire harness, and the packaging member wraps the wire harness.

[0028] In this implementation manner, the wire harness is wrapped by the packaging member, which facilitates protecting the wire harness from being affected by external erosion. In addition, the wire harness is fixed by the packaging member, which can prevent the wire harness from swinging and improve the stability of the electrical connection between the wire harness and the image sensor and the circuit board, thereby improving the quality of the electrical signal transmission.

[0029] In some possible implementation manners, the image sensor has an imaging area and a non-imaging area, the non-imaging area surrounds the imaging area, and the packaging member is connected to at least part of the image sensor in the non-imaging area.

[0030] In this implementation manner, the packaging member is connected to at least part of the image sensor in the non-imaging area, which can improve the packaging stability of the image sensor and reduce the influence of the packaging member on the imaging of the image sensor.

[0031] In some possible implementation manners, the circuit board comprises a board body and a reinforcing plate, the board body is mounted on the reinforcing plate, the board body has a first through hole, the reinforcing plate covers one side of the first through hole, the image sensor is located in the first through hole and mounted on the reinforcing plate, a gap is formed between an edge of the image sensor and an inner wall of the first through hole, one end of the wire harness is electrically connected to the image sensor, the wire harness passes through the gap, and the other end of the wire harness is electrically connected to the board body; and the part of the encapsulant fills in the gap to wrap the wire harness.

[0032] In the implementation manners, the image sensor is located in the first through hole, which is beneficial to the mounting stability of the image sensor and the protection of the image sensor. The gap is arranged to provide a mounting space for the image sensor, which is beneficial to the mounting of the image sensor. The wire harness is arranged to electrically connect the image sensor and the board body. The encapsulant fills in the gap, which is beneficial to improving the connection strength between the encapsulant and the image sensor and improving the encapsulation stability of the image sensor.

[0033] In some possible implementation manners, the encapsulant comprises a first sub-encapsulant and a second sub-encapsulant, the first sub-encapsulant is arranged close to the image sensor compared with the second sub-encapsulant, and the second sub-encapsulant covers at least part of the first sub-encapsulant; and the bending modulus of the first sub-encapsulant is less than the bending modulus of the second sub-encapsulant, so as to improve the warping problem and reduce the risk of warping of the image sensor caused by solidification of the first sub-encapsulant.

[0034] In some possible implementation manners, the molding shrinkage stress of the first sub-encapsulant is less than the molding shrinkage stress of the second sub-encapsulant, so as to reduce the shrinkage stress of the first sub-encapsulant in the solidification process of the image sensor, thereby reducing the risk of warping of the image sensor caused by solidification of the first sub-encapsulant.

[0035] In some possible implementation manners, the encapsulant comprises a first sub-encapsulant and a second sub-encapsulant, the first sub-encapsulant is arranged close to the image sensor compared with the second sub-encapsulant, and the second sub-encapsulant covers at least part of the first sub-encapsulant; and the optical reflectivity of the first sub-encapsulant is less than the optical reflectivity of the second sub-encapsulant, so as to reduce the risk of stray light generated by the first sub-encapsulant reflecting light, thereby reducing the imaging interference of stray light on the image sensor.

[0036] In some possible implementation manners, the encapsulant comprises a first sub-encapsulant and a second sub-encapsulant, the first sub-encapsulant is arranged close to the image sensor compared with the second sub-encapsulant, and the second sub-encapsulant covers at least part of the first sub-encapsulant; and the hardness of the second sub-encapsulant is greater than the hardness of the first sub-encapsulant, so as to ensure the overall structural strength of the encapsulant. In addition, the higher hardness of the second sub-encapsulant is beneficial to improving the anti-collision ability and better protecting the optical filter.

[0037] In some possible implementation manners, the material of the first sub-enclosure is a thermosetting plastic; and the material of the second sub-enclosure is a thermosetting plastic, so that the first sub-enclosure and the second sub-enclosure are formed by two times of injection molding in sequence.

[0038] In some possible implementation manners, the material of the first sub-enclosure is a thermosetting plastic; and the material of the second sub-enclosure is a metal, so that the hardness of the second sub-enclosure is higher than that of the first sub-enclosure, thereby enabling the anti-collision design of the optical filter.

[0039] In some possible implementation manners, the image sensor is electrically connected to the circuit board through a wire harness, the first sub-enclosure covers the periphery of the image sensor and is mounted on the circuit board, and the first sub-enclosure wraps the wire harness.

[0040] In the implementation manners, since the first sub-enclosure and the second sub-enclosure are formed by two times of injection molding in sequence, the first sub-enclosure is designed to cover the periphery of the image sensor and be mounted on the circuit board, so that the first sub-enclosure can stably encapsulate the image sensor, and the image sensor, the first sub-enclosure and the circuit board are connected to each other, thereby improving the overall stability and facilitating the formation of the second sub-enclosure by the second time of injection molding. In addition, the wire harness is wrapped by the first sub-enclosure after the first time of injection molding, so that the wire harness is protected from swinging in subsequent processes, thereby reducing the damage risk of the wire harness.

[0041] In some possible implementation manners, the camera module further includes an optical filter, the optical filter is located on the object side of the image sensor and is arranged opposite to the image sensor, and the second sub-enclosure covers part of the first sub-enclosure, another part of the second sub-enclosure is mounted on the circuit board, and the optical filter is mounted on the second sub-enclosure.

[0042] In the implementation manners, the first sub-enclosure and the circuit board are connected through the second sub-enclosure, so that the connection strength between the overall enclosure and the circuit board is improved, thereby enhancing the structural stability of the enclosure and facilitating the stability of the image sensor and the optical filter. In addition, the optical filter is mounted on the second sub-enclosure, thereby facilitating the support stability of the optical filter.

[0043] In some possible implementation manners, the first sub-enclosure can include a first part, a second part and a third part, the first part of the first sub-enclosure can cover the periphery of the image sensor, the third part of the first sub-enclosure can be connected to the board body, the second part of the first sub-enclosure can be connected between the first part and the third part of the first sub-enclosure, and the second part of the first sub-enclosure can be filled in the gap between the image sensor and the board body.

[0044] The second sub-package can include a first portion and a second portion. The first portion of the second sub-package can cover a surface of the first sub-package facing away from the circuit board. The first portion of the second sub-package can have an L-shaped structure. The first portion of the second sub-package and the first sub-package can jointly form a boss for mounting the optical filter. The second portion of the second sub-package can be connected to the first portion of the second sub-package and connected to the board body.

[0045] In some possible implementation manners, the camera module further includes an optical filter. The optical filter is located on a subject side of the image sensor and is arranged opposite to the image sensor. The second sub-package is arranged in a stacked manner with the first sub-package. The second sub-package is arranged in a spaced manner with the circuit board. The optical filter is mounted on the second sub-package.

[0046] In the implementation manner, since the bending modulus and / or the forming shrinkage stress of the first sub-package are smaller than those of the second sub-package, by arranging the second sub-package in a spaced manner with the circuit board and directly connecting the image sensor and the board body through the first sub-package, the stress interference received by the image sensor can be reduced, and the warping risk of the image sensor is reduced. In addition, mounting the optical filter on the second sub-package is conducive to improving the support stability of the optical filter.

[0047] In some possible implementation manners, the camera module further includes an optical filter. The optical filter is located on a subject side of the image sensor and is arranged opposite to the image sensor. The optical filter is mounted on the first sub-package. Part of the second sub-package covers the first sub-package. Another part of the second sub-package is mounted on the circuit board.

[0048] In the implementation manner, since the optical reflectivity of the first sub-package is lower than that of the second sub-package, by mounting the optical filter on the first sub-package, the risk of production stray light near the optical filter can be reduced, the stray light problem can be improved, the optical filtering effect of the optical filter can be improved, and the imaging quality of the image sensor can be improved. In addition, by connecting the first sub-package and the circuit board through the second sub-package, the connection strength between the whole package and the circuit board can be improved, the structural stability of the package is improved, and the stability of the image sensor and the optical filter is improved.

[0049] The second sub-package can include a first portion and a second portion. The first portion of the second sub-package can cover part of a surface of the first sub-package facing away from the circuit board. The second portion of the second sub-package can be connected to the first portion of the second sub-package and connected to the board body.

[0050] The part of the first sub-package not covered by the second sub-package can form a boss for mounting the optical filter.

[0051] In some possible implementation manners, the camera module further includes a filter, the filter is located on the object side of the image sensor and is arranged opposite to the image sensor; the filter is mounted on the first sub-package, and the second sub-package is arranged in a stacked mode with the first sub-package and is arranged in a spaced mode with the circuit board.

[0052] In the implementation manner, since the optical reflectivity of the first sub-package is lower than that of the second sub-package, the filter is mounted on the first sub-package, the risk of production stray light near the filter is reduced, the stray light problem is improved, the filtering effect of the filter is improved, and the imaging quality of the image sensor is improved.

[0053] In the implementation manner, the part of the first sub-package that is not covered by the second sub-package can form a boss for mounting the filter.

[0054] In some possible implementation manners, the camera module further includes a filter, the filter is located on the object side of the image sensor and is arranged opposite to the image sensor; the package has a second through hole, the image sensor is located in the second through hole and is mounted on the circuit board, and the filter is located in the second through hole and is mounted on the package.

[0055] In the implementation manner, the filter is located on the object side of the image sensor and is arranged opposite to the image sensor, so as to filter light and improve the imaging quality of the image sensor. By arranging the filter in the second through hole, the filter can be protected by the package, and damage of the filter caused by collision can be prevented.

[0056] In some possible implementation manners, the package has a boss, the boss is arranged in a circumferential mode along the inner wall of the second through hole, the filter and the image sensor are mounted on opposite sides of the boss, and the boss covers the periphery of the image sensor.

[0057] In the implementation manner, the second through hole can be divided into a first sub-hole and a second sub-hole in communication with each other by the boss, the first sub-hole accommodates the image sensor, and the boss and the convex rib can jointly form an L-shaped limit for the image sensor, so as to further improve the packaging strength of the package for the image sensor and improve the packaging stability of the image sensor. The filter and the image sensor are mounted on opposite sides of the boss, so that the filter and the image sensor can be arranged in a spaced mode, and the boss can improve the consistency of the filter and the image sensor in the spaced mode, which simplifies the mounting of the filter and is beneficial to the filtering effect of the filter, so as to improve the imaging quality of the image sensor.

[0058] The boss can abut against a non-imaging area of the image sensor to reduce the risk of imaging interference to the image sensor.

[0059] In some possible implementation manners, the surface of the optical filter facing away from the circuit board is located in the second through hole.

[0060] In the implementation manner, the optical filter is located in the second through hole, so that the optical filter can be protected by the packaging member, and damage of the optical filter caused by collision can be avoided. The surface of the optical filter facing away from the circuit board can be located in the second through hole, that is, the optical filter is located in the second through hole as a whole, so that the packaging member can better protect the optical filter, and the risk of damage of the optical filter is further reduced.

[0061] The packaging member is provided with a relief groove, so that the relief groove can provide a mounting space for the optical filter, and the optical filter can be mounted and dismounted on the packaging member. In addition, the relief groove can also provide an overflow space. Specifically, the adhesive has fluidity before being solidified to form the third adhesive, and there is a risk of overflow of the adhesive after the optical filter is mounted on the boss. The relief groove can provide an overflow space for the adhesive. After the overflowed adhesive flows into the relief groove, the risk of overflow of the adhesive to the optical filter and the image sensor is reduced, and the risk of interference with the optical filter and imaging is further reduced.

[0062] In a second aspect, the present application provides a packaging method of a camera module. The packaging method comprises:

[0063] A circuit board is provided, which has a first region, a second region and a third region connected in sequence. The second region surrounds the first region, and the third region surrounds the second region.

[0064] An image sensor is mounted on the first region.

[0065] A packaging member is formed on the circuit board. Part of the packaging member is fixed to the second region, and part of the packaging member is fixed to the edge of the image sensor.

[0066] Part of the lens assembly is fixedly connected to the third region of the circuit board, and part of the lens assembly is connected to the packaging member. The image sensor is located on the light exit side of the lens assembly.

[0067] In the present application, the packaging member can be formed by direct injection on the circuit board, so that the packaging member does not need to be fixed to the circuit board by adhesive or the like, and does not need to be provided with a relief structure to avoid other structures on the circuit board. This is advantageous for simplifying and miniaturizing the packaging member, thereby reducing the area of the circuit board, and further facilitating the miniaturization of the camera module.

[0068] In the present application, the package is only located in the part of the circuit board close to the center, so that the lens assembly can be directly connected with the area close to the edge of the circuit board, so that the package can be located inside the mounting space, without occupying the overall thickness dimension of the camera module, thereby reducing the overall thickness of the camera module, and facilitating the miniaturization of the camera module. In addition, since the lens assembly is directly connected with the circuit board, the distance between the lens and the image sensor in the lens assembly is reduced, thereby reducing the back focal space of the camera module.

[0069] In the present application, part of the package can be fixed to the second area, and part can be fixed to the edge of the image sensor, so that the package can package the image sensor on the circuit board, and improve the installation stability of the image sensor.

[0070] In the present application, since the lens assembly can be connected with the part of the circuit board located in the third area, the lens assembly can avoid the package to realize direct connection with the circuit board. Compared with the prior art of mounting the lens assembly on the package, the present implementation can avoid the package occupying the overall thickness dimension of the camera module, thereby reducing the shoulder height of the camera module, facilitating the miniaturization of the camera module, and further facilitating the thinning of the electronic device.

[0071] In some possible implementation manners, the package is formed in the second area, including:

[0072] The soft gel is formed by injection molding, part of the soft gel covers the second area and the edge of the image sensor, and another part of the soft gel extends to the edge of the circuit board, and the soft gel is connected to the circuit board;

[0073] The soft gel is cured to form the package and the connecting material, part of the package is fixed to the second area, and part is fixed to the edge of the image sensor, and the connecting material extends from the edge of the package to the edge of the circuit board;

[0074] And, the connecting material is removed.

[0075] In the present implementation, since the connecting material is removed, no avoiding structure needs to be arranged for the connecting material on the lens assembly and the circuit board, the overall integrity of the camera module can be ensured, and the stability of the camera module packaging can be ensured.

[0076] In some possible implementation manners, the packaging method removes the connecting material by laser, or water jet, or ion beam polishing.

[0077] In some possible implementation manners, before the step of forming the package on the circuit board, the packaging method further includes:

[0078] Part of the insulating layer on the surface of the circuit board is removed to form a slot, and the slot extends from the edge of the second area to the edge of the circuit board;

[0079] The encapsulation method removes the connecting material by mechanical force.

[0080] In the present embodiment, the insulation layer is slotted so that the connecting material is located at the slot after the injection molding of the injection molded part. Since the insulation layer has been removed at the slot, the metal part of the circuit board is exposed. Since the bonding force between the injection material and the metal is poor, the connecting material is easily removed at the slot, for example, the connecting material can be removed by mechanical force, which reduces the difficulty of removing the connecting material, shortens the time spent on removing the connecting material, and reduces the production cost. In addition, since only part of the insulation layer on the surface of the circuit board is removed, the structure of the circuit board is not damaged, which ensures the integrity of the circuit board.

[0081] In some possible implementations, the encapsulation method for forming an encapsulation part on a circuit board comprises:

[0082] The first soft gel is formed by injection molding, part of the first soft gel covers the second area and the edge of the image sensor, another part of the first soft gel extends to the edge of the circuit board, and the first soft gel is connected to the circuit board;

[0083] The first soft gel is cured to form a first sub-encapsulation part and a first connecting material, part of the first sub-encapsulation part is fixed to the second area, and part of the first sub-encapsulation part is fixed to the edge of the image sensor, and the first connecting material extends from the edge of the first sub-encapsulation part to the edge of the circuit board;

[0084] The first connecting material is removed;

[0085] The second soft gel is formed by injection molding, part of the second soft gel covers and connects the first sub-encapsulation part, and another part of the second soft gel extends to the edge of the circuit board;

[0086] The second soft gel is cured to form a second sub-encapsulation part and a second connecting material, the second sub-encapsulation part covers at least part of the first sub-encapsulation part, and the second connecting material extends from the edge of the second sub-encapsulation part to the edge of the circuit board;

[0087] and the second connecting material is removed.

[0088] In the present embodiment, the first sub-encapsulation part and the second sub-encapsulation part are formed by two injection moldings, and the connecting material is processed for the two injection moldings. Since two injection moldings are adopted, the materials used for the two injection moldings can be different. Specifically, thermosetting plastics with different properties can be used to form the first soft gel and the second soft gel, respectively. The bending modulus of the first sub-encapsulation part is less than the bending modulus of the second sub-encapsulation part, and / or the shrinkage stress of the first soft gel when cured to form the first sub-encapsulation part is less than the shrinkage stress of the second soft gel when cured to form the second sub-encapsulation part, and / or the optical reflectivity of the first sub-encapsulation part is less than the optical reflectivity of the second sub-encapsulation part, and / or the hardness of the second sub-encapsulation part is greater than the hardness of the first sub-encapsulation part.

[0089] In some possible implementation manners, the encapsulation method adopts a thermosetting plastic to injection mold the first soft gel body, and adopts a thermosetting plastic to injection mold the second soft gel body.

[0090] In some possible implementation manners, the encapsulation method adopts thermosetting plastics with different properties to injection mold the first soft gel body and the second soft gel body respectively; and the bending modulus of the first sub-encapsulation member is less than the bending modulus of the second sub-encapsulation member, so as to improve the warping problem and reduce the risk of warping of the image sensor caused by solidification of the first sub-encapsulation member.

[0091] In some possible implementation manners, the solidification shrinkage stress of the first sub-encapsulation member formed by solidification of the first soft gel body is less than the solidification shrinkage stress of the second sub-encapsulation member formed by solidification of the second soft gel body, so as to reduce the solidification shrinkage stress of the first sub-encapsulation member in the imaging process, thereby reducing the risk of warping of the image sensor caused by solidification of the first sub-encapsulation member.

[0092] In some possible implementation manners, the optical reflectivity of the first sub-encapsulation member is less than the optical reflectivity of the second sub-encapsulation member, so as to reduce the risk of stray light caused by reflection of light by the first sub-encapsulation member, thereby reducing the imaging interference of stray light on the image sensor.

[0093] In some possible implementation manners, the hardness of the second sub-encapsulation member is greater than the hardness of the first sub-encapsulation member, so as to ensure the overall structural strength of the encapsulation member, and in addition, the higher hardness of the second sub-encapsulation member is conducive to improving the anti-collision capability and better protecting the optical filter.

[0094] In some possible implementation manners, the encapsulation member is formed on the circuit board, comprising:

[0095] The soft gel body is injection molded, part of the soft gel body covers the second region and the edge of the image sensor, another part of the soft gel body extends to the edge of the circuit board, and the soft gel body is connected to the circuit board;

[0096] The soft gel body is solidified to form the encapsulation member and the connecting material, part of the encapsulation member is fixed to the second region, part of the encapsulation member is fixed to the edge of the image sensor, and the connecting material extends from the edge of the encapsulation member to the edge of the circuit board;

[0097] The lens assembly has a first groove, and part of the lens assembly is fixedly connected to the third region of the circuit board, comprising:

[0098] The first groove of the lens assembly is aligned with the connecting material;

[0099] The lens assembly is mounted on the third region of the circuit board, and the first groove accommodates the connecting material.

[0100] In the present implementation, the lens assembly is provided with the first groove, so that after the lens assembly is mounted on the circuit board, the first groove can accommodate the connecting material to avoid interference with the installation of the lens assembly. Due to the design of the first groove, the connecting material does not need to be removed after the injection molding of the injection molded part, which reduces the process difficulty, shortens the process time, and thus reduces the process cost.

[0101] In some possible implementations, the circuit board has a second groove extending from the edge of the second region to the edge of the circuit board, and the encapsulation is formed on the circuit board, including:

[0102] The soft gel is formed by injection molding, part of the soft gel covers the second region and the edge of the image sensor, and another part of the soft gel is located in the second groove, and the soft gel is connected to the circuit board;

[0103] And the soft gel is solidified to form the encapsulation and the connecting material, part of the encapsulation is fixed to the second region, and part of the encapsulation is fixed to the edge of the image sensor, and the connecting material is accommodated in the second groove.

[0104] In the present implementation, the circuit board is provided with the second groove, so that after the lens assembly is mounted on the circuit board, the second groove can accommodate the connecting material to avoid interference with the installation of the lens assembly. Due to the design of the second groove, the connecting material does not need to be removed after the injection molding of the injection molded part, which reduces the process difficulty, shortens the process time, and thus reduces the process cost.

[0105] In a third aspect, the present application provides an electronic device. The electronic device includes a housing and any of the camera modules as described above, and the camera module is mounted on the housing.

[0106] In the present application, the lens assembly can be connected to the part of the circuit board located in the third region, so that the lens assembly can avoid the encapsulation and directly connect to the circuit board. Compared with the prior art of mounting the lens assembly on the encapsulation, the present implementation can avoid the encapsulation occupying the overall thickness dimension of the camera module, thereby reducing the shoulder height of the camera module, facilitating the miniaturization of the camera module, and further facilitating the slimming of the electronic device. BRIEF DESCRIPTION OF DRAWINGS

[0107] FIG. 1A is a structural schematic diagram of an electronic device in some embodiments according to the present application;

[0108] FIG. 1B is a partially exploded structural schematic diagram of the electronic device shown in FIG. 1A;

[0109] FIG. 2 is a structural schematic diagram of a camera module in some embodiments of the electronic device shown in FIG. 1A;

[0110] FIG. 3 is a partially exploded schematic diagram of the camera module shown in FIG. 2 in some embodiments;

[0111] FIG. 4 is a schematic diagram of a partial structure of the camera module shown in FIG. 2, along line A-A, in some embodiments;

[0112] FIG. 5 is a schematic diagram of a structure of the board body in the camera module shown in FIG. 2, in some embodiments;

[0113] FIG. 6 is a schematic diagram of a structure of a circuit board including the board body shown in FIG. 5, in some embodiments;

[0114] FIG. 7 is an exploded schematic diagram of the circuit board shown in FIG. 6, in some embodiments;

[0115] FIG. 8 is a schematic diagram of a structure of the circuit board shown in FIG. 6, along line B-B, in some embodiments;

[0116] FIG. 9 is a schematic diagram of a structure of the circuit board shown in FIG. 6, with an image sensor mounted, in some embodiments;

[0117] FIG. 10 is a partial exploded schematic diagram of the structure shown in FIG. 9, in some embodiments;

[0118] FIG. 11 is a schematic diagram of a structure of the circuit board shown in FIG. 9, along line C-C, in some embodiments;

[0119] FIG. 12 is a schematic diagram of a structure of the structure shown in FIG. 9, forming a package, in some embodiments;

[0120] FIG. 13 is a partial exploded schematic diagram of the structure shown in FIG. 12, in some embodiments;

[0121] FIG. 14A is a schematic diagram of a structure of the package in the structure shown in FIG. 12, in some embodiments;

[0122] FIG. 14B is a schematic diagram of the package shown in FIG. 14A, from another perspective, in some embodiments;

[0123] FIG. 15 is a schematic diagram of a structure of the structure shown in FIG. 12, along line D-D, in some embodiments;

[0124] FIG. 16 is a schematic diagram of injection molding to form a package, in some embodiments;

[0125] FIG. 17 is a schematic diagram of a structure of the structure shown in FIG. 9, forming a package, in other embodiments;

[0126] FIG. 18 is a schematic diagram of a structure of the structure shown in FIG. 12, with a filter mounted, in some embodiments;

[0127] FIG. 19 is a partial exploded schematic diagram of the structure shown in FIG. 18, in some embodiments;

[0128] FIG. 20 is a schematic diagram of a structure of the structure shown in FIG. 18, along line E-E, in some embodiments;

[0129] Fig. 21A is a schematic view of the structure shown in Fig. 18 along line E-E in another embodiment;

[0130] Fig. 21B is a schematic view of the structure shown in Fig. 18 along line E-E in another embodiment;

[0131] Fig. 22A is a schematic view of the structure shown in Fig. 18 along line E-E in yet another embodiment;

[0132] Fig. 22B is a schematic view of the structure shown in Fig. 18 along line E-E in yet another embodiment;

[0133] Fig. 23A is a schematic view of the structure of the motor in the camera module shown in Fig. 2 in some embodiments;

[0134] Fig. 23B is a schematic view of the structure of the motor shown in Fig. 23A along line F-F in some embodiments;

[0135] Fig. 24 is a schematic view of the structure of the lens in the camera module shown in Fig. 2 in some embodiments;

[0136] Fig. 25 is a schematic view of the structure of the lens assembly formed by mounting the lens shown in Fig. 24 to the motor shown in Fig. 23A in some embodiments;

[0137] Fig. 26 is a schematic view of the structure of the lens assembly shown in Fig. 25 in some embodiments;

[0138] Fig. 27 is a schematic view of the structure of the lens assembly shown in Fig. 25 along line G-G in some embodiments;

[0139] Fig. 28 is a schematic view of the structure of the camera module shown in Fig. 2 in another embodiment;

[0140] Fig. 29 is a schematic view of the structure of the camera module shown in Fig. 2 along line A-A in another embodiment;

[0141] Fig. 30 is a schematic view of the structure of the camera module in the electronic device shown in Fig. 1A in another embodiment;

[0142] Fig. 31 is a schematic view of the structure of the camera module shown in Fig. 30 in some embodiments;

[0143] Fig. 32 is a schematic view of the structure of the camera module shown in Fig. 30 along line H-H in some embodiments;

[0144] Fig. 33 is a schematic view of the structure of the injection molding formed on the surface of the circuit board in the camera module shown in Fig. 30 in some embodiments;

[0145] Fig. 34 is a schematic view of the structure of the structure shown in Fig. 33 along line I-I in some embodiments;

[0146] FIG. 35 is a structural schematic diagram of the camera module in the electronic device shown in FIG. 1A in some embodiments;

[0147] FIG. 36 is a partially exploded structural schematic diagram of the camera module shown in FIG. 35 in some embodiments;

[0148] FIG. 37 is a structural schematic diagram of the camera module shown in FIG. 35 along line J-J in some embodiments;

[0149] FIG. 38 is a structural schematic diagram of the camera module shown in FIG. 35 in which a surface of a circuit board forms a molded part in some embodiments;

[0150] FIG. 39 is a partially exploded structural schematic diagram of the structure shown in FIG. 38 in some embodiments;

[0151] FIG. 40 is a structural schematic diagram of the structure shown in FIG. 38 along line K-K in some embodiments;

[0152] FIG. 41 is a flowchart of a packaging method of a camera module according to an embodiment of the present application;

[0153] FIG. 42 is a flowchart of forming a packaging part in the packaging method of the camera module shown in FIG. 41 in some embodiments;

[0154] FIG. 43 is a flowchart of processing a surface of a circuit board in the packaging method of the camera module shown in FIG. 41 in some embodiments;

[0155] FIG. 44 is a flowchart of forming a packaging part in the packaging method of the camera module shown in FIG. 41 in other embodiments;

[0156] FIG. 45 is a flowchart of forming a packaging part in the packaging method of the camera module shown in FIG. 41 in yet other embodiments;

[0157] FIG. 46 is a flowchart of connecting a lens assembly and a circuit board in the packaging method of the camera module shown in FIG. 41 in some embodiments;

[0158] FIG. 47 is a flowchart of forming a packaging part in the packaging method of the camera module shown in FIG. 41 in yet other embodiments. DETAILED DESCRIPTION

[0159] The embodiments of the present application will be described below with reference to the accompanying drawings.

[0160] In the description of the embodiments of the present application, it should be noted that unless specifically defined and limited otherwise, the terms "mount", "connect" should be interpreted broadly, for example, "connect" can be detachable connection, or can be non-detachable connection, can be direct connection, or can be indirect connection through intermediate medium. "Multiple" means at least two.

[0161] The orientation terms mentioned in the embodiments of the present application, such as "upper", "lower", "inner", "outer", "top", "bottom", "side" and the like, are only the directions of the drawings, therefore, the orientation terms used are for better and clearer illustration and understanding of the embodiments of the present application, and are not intended to indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0162] In the embodiments of the present application, the relative positional relationship mentioned, such as parallel, vertical, aligned and the like, are all relative to the current process level, and are not absolute strict limits, and a small amount of deviation is allowed, and approximate parallel, approximate vertical, approximate alignment and the like are all possible. For example, A is parallel to B, which means that A and B are parallel or approximately parallel, and the included angle between A and B can be between 0 degrees and 10 degrees. For example, A is perpendicular to B, which means that A and B are perpendicular or approximately perpendicular, and the included angle between A and B can be between 80 degrees and 100 degrees.

[0163] In the embodiments of the present application, the terms "first", "second", "third", "fourth" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features limited by "first", "second", "third", "fourth" can explicitly or implicitly include one or more of the features.

[0164] Please refer to FIG. 1A and FIG. 1B, FIG. 1A is a structural schematic diagram of an electronic device 100 in some embodiments provided by the present application; and FIG. 1B is a partially exploded structural schematic diagram of the electronic device 100 shown in FIG. 1A.

[0165] In some embodiments, the electronic device 100 can be a mobile phone, a tablet personal computer, a laptop computer, a smart screen, a personal digital assistant (PDA), a camera, a personal computer, a notebook computer, a vehicle-mounted device, a wearable device, augmented reality (AR) glasses, an AR helmet, virtual reality (VR) glasses, or a VR helmet, or the like device with a camera function. In the embodiment of FIG. 1A, the electronic device 100 is taken as an example of a mobile phone, and of course, other types of electronic devices 100 can also have a similar structure, which will not be described hereinafter.

[0166] It can be understood that FIGS. 1A and 1B only schematically show some components included in the electronic device 100, and the actual shape, actual size, actual position, and actual structure of these components are not limited by FIGS. 1A and 1B. The electronic device 100 can also include more or fewer components than FIGS. 1A and 1B.

[0167] In some embodiments, the electronic device 100 can include a camera module 10, a screen 20, and a housing 30. The screen 20 is used to display images, videos, and the like. The screen 20 can include a light-transmitting panel 201 and a display screen 202. The light-transmitting panel 201 and the display screen 202 are stacked and fixedly connected. The light-transmitting panel 201 is mainly used to protect and prevent dust from the display screen 202. The material of the light-transmitting panel 201 includes but is not limited to glass. The display screen 202 can be a flexible display screen or a rigid display screen. For example, the display screen 202 can be an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini organic light-emitting diode display screen, a micro organic light-emitting diode display screen, a micro organic light-emitting diode display screen, a quantum dot light emitting diode (QLED) display screen, a liquid crystal display (LCD), and the like.

[0168] The shell 30 is configured to protect the internal electronic components of the electronic device 100. The shell 30 can include a cover plate 301, a frame 302, and a camera decoration 303. The cover plate 301 is located on the side of the display screen 202 away from the light transmission panel 201 and is stacked with the light transmission panel 201 and the display screen 202. The frame 302 is fixed to the cover plate 301. The frame 302 can be fixed to the cover plate 301 by adhesive, for example. Alternatively, the frame 302 can be integrally formed with the cover plate 301, i.e., the frame 302 and the cover plate 301 form a whole structure. The frame 302 is located between the cover plate 301 and the light transmission panel 201. The light transmission panel 201 can be fixed to the frame 302 by adhesive. The light transmission panel 201, the cover plate 301, and the frame 302 form an internal accommodating space of the electronic device 100. The internal accommodating space accommodates the display screen 202. The cover plate 301 can be made of metal, plastic, glass, or the like. The cover plate 301 can be a single material plate or a plate body 11 structure formed by splicing multiple plates made of multiple materials.

[0169] The camera module 10 is configured to take photos and / or videos. The camera module 10 is installed in the shell 30 and located in the internal accommodating space of the electronic device 100, for example. The camera module 10 can be used as a rear camera. The light entrance surface of the camera module 10 faces the camera decoration 303, for example. The camera decoration 303 is configured to protect the camera module 10.

[0170] In some embodiments, the camera decoration 303 protrudes to the side of the cover plate 301 away from the light transmission panel 201. In this way, the camera decoration 303 can increase the space of the camera module 10 in the thickness direction of the electronic device 100. In other embodiments, the camera decoration 303 can be flush with the cover plate 301 or recessed into the internal accommodating space of the electronic device 100.

[0171] The camera decoration 303 is provided with a light transmission hole 3031. The light transmission hole 3031 allows light from the scene to enter the light entrance surface of the camera module 10. In other embodiments, the electronic device 100 can not include the camera decoration 303. In this case, the cover plate 301 is provided with the light transmission hole 3031 instead of the mounting hole. The light transmission hole 3031 allows light from the scene to enter the light entrance surface of the camera module 10.

[0172] In some embodiments, the camera module 10 can also be used as a front camera. For example, the light entrance surface of the camera module 10 faces the light-transmitting panel 201. The display screen 202 is provided with a light path avoiding hole. The light path avoiding hole allows the scene light to pass through the light-transmitting panel 201 and then enter the light entrance surface of the camera module 10. In some other embodiments, the electronic device 100 can further include one or more other camera modules (not shown in the figure), which are not strictly limited in the embodiments of the present application.

[0173] In some embodiments, as shown in FIG. 1B, the electronic device 100 can further include a circuit assembly 40 and an image processor 50, which are located in the internal accommodation space of the electronic device 100. The image processor 50 is fixed to the circuit assembly 40 and electrically connected to the circuit assembly 40. The image processor 50 is in communication connection with the camera module 10. The image processor 50 is configured to acquire image data from the camera module 10 and process the image data. The communication connection between the camera module 10 and the image processor 50 can include data transmission through electrical connection such as wiring, or data transmission through coupling. It can be understood that the camera module 10 and the image processor 50 can also be in communication connection through other data transmission modes.

[0174] In some embodiments, the electronic device 100 can further include an analog-to-digital converter (also referred to as an A / D converter, not shown in the figure). The analog-to-digital converter is connected between the camera module 10 and the image processor 50. The analog-to-digital converter is configured to convert the signal generated by the camera module 10 into a digital image signal and transmit the digital image signal to the image processor 50. The digital image signal is processed by the image processor 50, and finally displayed on the screen 20.

[0175] In some embodiments, the electronic device 100 can further include a storage (not shown in the figure). The storage is in communication connection with the image processor 50. After the image processor 50 processes the image digital signal, the image is transmitted to the storage, so that the image can be found from the storage at any time when it is needed to view the image in the future and displayed on the screen 20. In some embodiments, the image processor 50 can also compress the processed image digital signal and store it in the storage, so as to save the storage space.

[0176] In some other embodiments, the electronic device 100 can also not include the screen 20.

[0177] It can be understood that the mounting position of the camera module 10 of the electronic device 100 shown in FIGS. 1A and 1B is merely illustrative, and the application does not strictly limit the mounting position of the camera module 10. In some other embodiments, the camera module 10 can also be mounted at other positions of the electronic device 100, for example, the camera module 10 can be mounted at the upper middle or upper right corner of the back of the electronic device 100. In some other embodiments, the electronic device 100 can include a terminal body and an auxiliary component capable of rotating, moving or detaching relative to the terminal body, and the camera module 10 can also be arranged on the auxiliary component.

[0178] Please refer to FIGS. 2 to 4, FIG. 2 is a structural schematic diagram of the camera module 10 in the electronic device 100 shown in FIG. 1A in some embodiments; FIG. 3 is a partially exploded schematic diagram of the camera module 10 shown in FIG. 2 in some embodiments; and FIG. 4 is a partially structural schematic diagram of the camera module 10 shown in FIG. 2 along the line A-A in some embodiments.

[0179] In some embodiments, the camera module 10 can include a circuit board 1, an image sensor 2, a packaging member 3A, a filter 4 and a lens assembly 5.

[0180] For example, the circuit board 1 can include a board body 11 and a reinforcing plate 12. The board body 11 can be mounted on the reinforcing plate 12, and the reinforcing plate 12 provides structural support for the board body 11, thereby enhancing the overall structural strength of the circuit board 1.

[0181] For example, the board body 11 can be mounted on the reinforcing plate 12 by a first adhesive 6.

[0182] For example, the board body 11 can be a flexible printed circuit (FPC), a printed circuit board (PCB) or the like.

[0183] For example, the image sensor 2 can be mounted on the circuit board 1 by a second adhesive 7.

[0184] For example, the packaging member 3A can be mounted on the circuit board 1. For example, the packaging member 3A can be formed by directly injection molding on the circuit board 1 to be connected to the circuit board 1.

[0185] In the present embodiment, since the packaging member 3A can be formed by directly injection molding on the circuit board 1, the packaging member 3A does not need to be fixed to the circuit board 1 by an adhesive or the like, and does not need to be provided with a structure to avoid other structures on the circuit board 1, which is beneficial to the simplification and miniaturization of the packaging member 3A, thereby reducing the board area of the circuit board 1, and further beneficial to the overall miniaturization of the camera module 10.

[0186] The encapsulating member 3A can be formed by injection molding only on a portion of the circuit board 1 close to the center, so that the encapsulating member 3A does not cover the area of the circuit board 1 close to the edge.

[0187] For example, the filter 4 can be mounted on the encapsulating member 3A by the third adhesive 8, and the filter 4 is located on the object side of the image sensor 2 and is arranged opposite to the image sensor 2 to filter light and improve the imaging quality of the image sensor 2. It should be noted that the filter 4 is arranged opposite to the image sensor 2 means that the orthographic projection of the filter 4 on the circuit board 1 covers at least part of the image sensor 2.

[0188] For example, the lens assembly 5 can be adhered to the circuit board 1 by the encapsulating adhesive 9. The lens assembly 5 can enclose the image sensor 2, the encapsulating member 3A and the filter 4 to form an installation space 101, and the image sensor 2 is located on the light exit side of the lens assembly 5.

[0189] The lens assembly 5 can include a lens 51 and a motor 52, the lens 51 can be mounted in the motor 52, and the motor 52 can be used to drive the lens 51 to move in and out to realize zooming, focusing and other functions. In other embodiments, the lens assembly 5 can not include the motor 52, and the lens assembly 5 can include the lens 51 and a housing, and the lens 51 is mounted on the housing.

[0190] In this embodiment, since the encapsulating member 3A is only located on a portion of the circuit board 1 close to the center, the lens assembly 5 can be directly connected to the area of the circuit board 1 close to the edge, so that the encapsulating member 3A can be located inside the installation space 101, without occupying the overall thickness dimension of the camera module 10, thereby reducing the overall thickness of the camera module 10, and facilitating the miniaturization of the camera module 10. In addition, since the lens assembly 5 is directly connected to the circuit board 1, the distance between the lens 51 in the lens assembly 5 and the image sensor 2 is reduced, thereby reducing the back focal space of the camera module 10.

[0191] It should be noted that in other embodiments, the camera module 10 can include more or fewer structures. For example, the camera module 10 can not include the filter.

[0192] Please refer to FIG. 5, which is a structural schematic diagram of the board body 11 in the camera module 10 shown in FIG. 2 in some embodiments.

[0193] In some embodiments, the board body 11 can have a first through hole 111, and the first through hole 111 can penetrate the board body 11 along the thickness direction of the board body 11.

[0194] Please refer to FIG. 6 to FIG. 8, FIG. 6 is a structural schematic diagram of the circuit board 1 including the board body 11 shown in FIG. 5 in some embodiments; FIG. 7 is an exploded schematic diagram of the circuit board 1 shown in FIG. 6 in some embodiments; and FIG. 8 is a structural schematic diagram of the circuit board 1 shown in FIG. 6 along the line B-B in some embodiments.

[0195] In some embodiments, the reinforcing plate 12 can cover one side of the first through hole 111 to form the mounting groove 13 of the circuit board 1. In this case, the first adhesive 6 can have a through hole communicating with the first through hole 111, so that the part of the reinforcing plate 12 exposed through the first through hole 111 is free of the first adhesive 6. It should be noted that in the process of bonding the reinforcing plate 12 and the board body 11 by the first adhesive 6, a small amount of adhesive can overflow and be exposed through the first through hole 111.

[0196] In some embodiments, the circuit board 1 can have a first region 1a, a second region 1b and a third region 1c connected in sequence, the second region 1b can surround the first region 1a, and the third region 1c can surround the second region 1b. In other words, the circuit board 1 can be divided into three regions from the center to the edge, the part of the circuit board 1 at the center is the first region 1a, the part of the circuit board 1 at the edge is the third region 1c, and the part between the first region 1a and the third region 1c is the second region 1b.

[0197] For example, the first region 1a can be at the mounting groove 13 of the circuit board 1, and the edge of the mounting groove 13 can be the boundary between the first region 1a and the second region 1b. In FIG. 6, the dashed line schematically shows the boundary between the second region 1b and the third region 1c. It can be understood that in other embodiments, the boundary between the second region 1b and the third region 1c can also be located at other positions.

[0198] Please refer to FIG. 9 to FIG. 11, FIG. 9 is a structural schematic diagram of the circuit board 1 shown in FIG. 6 after the image sensor 2 is mounted in some embodiments; FIG. 10 is a partially exploded schematic diagram of the structure shown in FIG. 9 in some embodiments; and FIG. 11 is a structural schematic diagram of the circuit board 1 shown in FIG. 9 along the line C-C in some embodiments.

[0199] In some embodiments, the image sensor 2 can be mounted in the first region 1a.

[0200] For example, the image sensor 2 can be mounted in the first through hole 111 (i.e., mounted in the mounting groove 13), and the image sensor 2 can be bonded to the reinforcing plate 12 by the second adhesive 7 to fix the image sensor 2. In this embodiment, the image sensor 2 is located in the first through hole 111, which is beneficial to the mounting stability of the image sensor 2 and is beneficial to the protection of the image sensor 2.

[0201] The image sensor 2 can be connected to the board body 11 through a wire harness 21 to electrically connect the image sensor 2 and the board body 11, so as to realize the electrical signal intercommunication between the image sensor 2 and the board body 11.

[0202] The image sensor 2 can be connected to the board body 11 through a wire harness 21 to electrically connect the image sensor 2 and the board body 11, so as to realize the electrical signal intercommunication between the image sensor 2 and the board body 11.

[0203] The wire harness 21 electrically connecting the image sensor 2 and the board body 11 is also called a gold wire.

[0204] It should be noted that the number of the wire harness 21 connecting the image sensor 2 and the board body 11 in FIG. 11 is only illustrative, and the number of the wire harness 21 and the connection mode of the wire harness 21 are not limited.

[0205] Please refer to FIG. 12 and FIG. 13, FIG. 12 is a structure schematic diagram of the structure shown in FIG. 9 forming a package 3A in some embodiments; and FIG. 13 is a partially exploded schematic diagram of the structure shown in FIG. 12 in some embodiments.

[0206] In some embodiments, the package 3A can be mounted on the second area 1b, so that the package 3A can be arranged around the image sensor 2. It should be noted that the dashed line in FIG. 13 schematically shows the boundary between the second area 1b and the third area 1c, and in other embodiments, the boundary between the second area 1b and the third area 1c can also be located at other positions.

[0207] In some embodiments, a part of the package 3A can be fixed on the second area 1b, and a part can be fixed on the edge of the image sensor 2, so that the package 3A can package the image sensor 2 on the circuit board 1, and improve the mounting stability of the image sensor 2.

[0208] For example, the image sensor 2 can include an imaging area 2a and a non-imaging area 2b, the non-imaging area 2b can surround the imaging area 2a, and the package 3A can connect at least part of the image sensor 2 located in the non-imaging area 2b.

[0209] In this embodiment, by connecting at least part of the image sensor 2 located in the non-imaging area 2b through the package 3A, the packaging stability of the image sensor 2 can be improved, and the influence of the package 3A on the imaging of the image sensor 2 can be reduced.

[0210] It should be noted that the cross mark in FIGS. 12 and 13 schematically indicates the imaging area 2a of the image sensor 2.

[0211] Please refer to FIGS. 14A-15, FIG. 14A is a schematic structural view of the package 3A in the structure shown in FIG. 12 in some embodiments; FIG. 14B is a schematic structural view of the package 3A shown in FIG. 14A from another perspective; and FIG. 15 is a schematic structural view of the structure along the line D-D shown in FIG. 12 in some embodiments.

[0212] In some embodiments, the package 3A can have a second through hole 31, which can penetrate through the package 3A along the thickness direction of the package 3A.

[0213] In some embodiments, the package 3A can be partially filled in the gap 14 to wrap the wire harness 21.

[0214] In the present embodiment, by filling the package 3A in the gap 14, the connection strength between the package 3A and the image sensor 2 can be improved, which is conducive to improving the packaging stability of the image sensor 2. By wrapping the wire harness 21 with the package 3A, the wire harness 21 can be protected from external erosion, and by fixing the wire harness 21 with the package 3A, the wire harness 21 can be prevented from swinging, which improves the stability of the electrical connection between the wire harness 21 and the image sensor 2 and the board body 11, and is conducive to improving the quality of electrical signal transmission.

[0215] For example, the package 3A can have a protruding rib 32, which can be protruding towards the direction of the circuit board 1 and filled in the gap 14.

[0216] For example, the package 3A can have a boss 33, which can be arranged circumferentially along the inner wall of the second through hole 31.

[0217] In the present embodiment, the boss 33 can separate the second through hole 31 into the first sub-hole 311 and the second sub-hole 312 in communication, and the first sub-hole 311 accommodates the image sensor 2. The boss 33 and the protruding rib 32 can jointly form an L-shaped limit for the image sensor 2 to further improve the packaging strength of the package 3A for the image sensor 2 and improve the packaging stability of the image sensor 2.

[0218] The boss 33 can abut to the non-imaging area 2b of the image sensor 2 to reduce the risk of imaging interference to the image sensor 2.

[0219] For example, the package 3A can have an avoiding groove 34, which is arranged on the side surface of the package 3A facing away from the circuit board 1, and the avoiding groove 34 is in communication with the second through hole 31.

[0220] The avoiding groove 34 can be partially located in the boss 33.

[0221] Please refer to FIG. 12 and FIG. 16, FIG. 16 is a schematic diagram of forming the encapsulant 3A by injection molding in some embodiments. It should be noted that the dashed line with an arrow in FIG. 16 represents the flow of the injection molding material.

[0222] In some embodiments, by cooperating with the circuit board 1 through an injection molding module (not shown in the figure), an injection molding flow channel 200 can be formed on the surface of the circuit board 1. The injection molding flow channel 200 can include a feeding port 2001, and the injection molding material can fill the injection molding flow channel 200 through the feeding port 2001 and solidify to form the injection molding piece 3 in the injection molding flow channel 200. The injection molding piece 3 can include the encapsulant 3A and the connecting material 3B, and the connecting material 3B can be removed to leave only the encapsulant 3A, such as the structure shown in FIG. 12.

[0223] For example, the connecting material 3B can be removed by laser, water jet, ion beam, or the like to improve the flatness of the surface of the circuit board 1 without the encapsulant 3A.

[0224] For example, the thickness of the connecting material 3B is less than the thickness of the encapsulant 3A, which is beneficial to reduce the difficulty of removing the connecting material 3B and improve the efficiency of removing the connecting material 3B.

[0225] For example, the injection molding flow channel 200 on the surface of the circuit board 1 can include a plurality of feeding ports 2001, and the same number of connecting materials 3B as the feeding ports 2001 can be formed correspondingly.

[0226] For example, the injection molding flow channel 200 on the surface of the circuit board 1 can also include one or more discharging ports 2002, and the same number of connecting materials 3B as the discharging ports 2002 will also be formed correspondingly, that is, the total number of the connecting materials 3B is equal to the number of the feeding ports 2001 plus the number of the discharging ports 2002.

[0227] In some embodiments, by cooperating with the circuit substrate 300 through an injection molding module (not shown in the figure), a plurality of injection molding flow channels 200 can be formed on the surface of the circuit substrate 300. Each injection molding flow channel 200 includes a feeding port 2001, and the injection molding material can fill the plurality of injection molding flow channels 200 at one time and solidify to form a plurality of injection molding pieces 3 in the injection molding flow channels 200. By cutting the circuit substrate 300, a plurality of circuit boards 1 can be formed, and each circuit board 1 corresponds to one injection molding piece 3.

[0228] In this embodiment, a plurality of injection molding pieces 3 are formed at one time, which is beneficial to improve the injection molding efficiency, shorten the encapsulation time of the camera module 10, and thus reduce the production cost.

[0229] Please refer to FIG. 16 and FIG. 17, FIG. 17 is a structure schematic diagram of forming the encapsulant 3A in another structure shown in FIG. 9.

[0230] In some embodiments, the surface of the circuit board 1 can be provided with an insulating layer 15, and the insulating layer 15 has a slot 151 extending from the edge of the package 3A to the edge of the circuit board 1, i.e., the slot 151 extends from the boundary between the second region 1b and the third region 1c to the edge of the circuit board 1. The feeding port 2001 can be communicated with the slot 151 and feed from the slot 151.

[0231] In the present embodiment, the slot 151 of the insulating layer 15 is provided so that the feeding material 3B is located at the slot 151 after the injection molding of the injection molding piece 3. Since the insulating layer 15 has been removed at the slot 151, the metal part of the circuit board 1 is exposed, and since the bonding force between the injection molding material and the metal is poor, the feeding material 3B is easy to remove at the slot 151, for example, the feeding material 3B can be removed by mechanical external force, which reduces the difficulty of removing the feeding material 3B, shortens the time spent on removing the feeding material 3B, and reduces the production cost. In addition, since only part of the insulating layer 15 on the surface of the circuit board 1 is removed, the structure of the circuit board 1 is not damaged, and the integrity of the circuit board 1 can be ensured.

[0232] It should be noted that the thickness of the insulating layer 15 on the surface of the circuit board 1 cannot be identified by the naked eye, and therefore the depth of the slot 151 cannot be observed by the naked eye. In order to facilitate observation, the slot 151 is enlarged in FIG. 17, and the specific depth of the slot 151 is not shown. In FIG. 17, the insulating layer 15 is schematically shown by using grid lines, and the slot 151 can be obtained by partially scraping the insulating layer 15.

[0233] Please refer to FIGS. 18-20, FIG. 18 is a schematic diagram of the structure shown in FIG. 12 after the optical filter 4 is installed in some embodiments; FIG. 19 is a partially exploded schematic diagram of the structure shown in FIG. 18; and FIG. 20 is a schematic diagram of the structure shown in FIG. 18 along the line E-E in some embodiments.

[0234] In some embodiments, the optical filter 4 can be located in the second through hole 31 and installed on the package 3A.

[0235] In the present embodiment, by providing that the optical filter 4 is located in the second through hole 31, the optical filter 4 can be protected by the package 3A, and damage to the optical filter 4 caused by impact can be prevented.

[0236] For example, the surface of the optical filter 4 facing away from the surface of the circuit board 1 can be located in the second through hole 31, i.e., the optical filter 4 is located in the second through hole 31 as a whole, so that the package 3A can better protect the optical filter 4 and further reduce the risk of damage to the optical filter 4.

[0237] For example, the optical filter 4 can be installed on the boss 33, which can improve the stability of the installation of the optical filter 4 on the package 3A.

[0238] The filter 4 and the image sensor 2 are installed on opposite sides of the boss 33, so that the filter 4 and the image sensor 2 can be spaced apart, and the boss 33 can improve the consistency of the spacing of the filter 4 and the image sensor 2, which simplifies the installation of the filter 4 and is conducive to the filtering effect of the filter 4, thereby improving the imaging quality of the image sensor 2.

[0239] For example, the third adhesive 8 can be attached to the surface of the boss 33 away from the circuit board 1 to attach the filter 4 to the boss 33.

[0240] The third adhesive 8 can have a notch 81, and the notch 81 corresponds to the relief groove 34. It should be noted that the notch 81 corresponds to the relief groove 34, which means that the orthographic projection of the notch 81 on the boss 33 at least partially falls within the relief groove 34.

[0241] In this embodiment, the package 3A is provided with a relief groove 34, so that the relief groove 34 can provide mounting space for the filter 4, which is conducive to the installation and removal of the filter 4 on the package 3A. In addition, the relief groove 34 can also provide overflow space. Specifically, during the mounting of the filter 4, the adhesive has fluidity before it solidifies to form the third adhesive 8. After the filter 4 is mounted on the boss 33, the adhesive has the risk of overflowing after being extruded. By providing the relief groove 34, the adhesive can be provided with overflow space. After the overflowing adhesive flows into the relief groove 34, the risk of the adhesive overflowing to the filter 4 and the image sensor 2 can be reduced, thereby reducing the risk of interference with the filtering and imaging.

[0242] Please refer to FIG. 21A, which is a schematic view of the structure along line E-E in some other embodiments.

[0243] In some embodiments, the package 3A can include a first sub-package 35 and a second sub-package 36. Compared with the second sub-package 36, the first sub-package 35 can be arranged close to the image sensor 2, and the second sub-package 36 covers at least part of the first sub-package 35.

[0244] For example, the bending modulus of the first sub-package 35 can be less than the bending modulus of the second sub-package 36, so as to improve the warping problem and reduce the risk of warping of the image sensor 2 caused by solidification of the first sub-package 35.

[0245] The bending modulus of the first sub-package 35 at room temperature can be in the range of 1000 kgf / mm 2 to 3000 kgf / mm 2 , for example, the bending modulus of the first sub-package 35 at room temperature can be but is not limited to 1000 kgf / mm2 , or 1400 kgf / mm 2 , or 1800 kgf / mm 2 , or 2200 kgf / mm 2 , or 2600 kgf / mm 2 , or 3000 kgf / mm 2 , or 1000 kgf / mm 2 to 3000 kgf / mm 2 other values between.

[0246] Exemplarily, the molding shrinkage stress of the first sub-encapsulant 35 can be less than that of the second sub-encapsulant 36, so as to reduce the shrinkage stress of the first sub-encapsulant 35 during the curing imaging process, thereby reducing the risk of the first sub-encapsulant 35 curing causing the image sensor 2 to warp.

[0247] Exemplarily, the molding shrinkage rate of the first sub-encapsulant 35 can be less than 0.5%, for example, the imaging shrinkage rate of the first sub-encapsulant 35 can be 0.48%, or 0.45%, or 0.40%, or 0.38%, or 0.32%, or 0.2%, or other values less than 0.5%.

[0248] Exemplarily, the optical reflectivity of the first sub-encapsulant 35 can be less than that of the second sub-encapsulant 36, so as to reduce the risk of the first sub-encapsulant 35 reflecting light to generate stray light, thereby reducing the imaging interference of the stray light to the image sensor 2.

[0249] Exemplarily, the optical reflectivity of the first sub-encapsulant 35 can be less than 5%, for example, the optical reflectivity of the first sub-encapsulant 35 can be 4.8%, or 4.5%, or 4%, or 3.8%, or 3.2%, or 2%, or other values less than 5%.

[0250] Exemplarily, the hardness of the second sub-encapsulant 36 can be greater than that of the first sub-encapsulant 35, so as to ensure the overall structural strength of the encapsulant 3A, in addition, the higher hardness of the second sub-encapsulant 36 is conducive to improving the anti-collision ability, and better protecting the optical filter 4.

[0251] Exemplarily, the material of the first sub-encapsulant 35 can be thermosetting plastic, and the material of the second sub-encapsulant 36 can be thermosetting plastic. Wherein, the first sub-encapsulant 35 and the second sub-encapsulant 36 are formed by two times of injection molding in sequence, that is, in the embodiment, the encapsulant 3A is a double-layer structure, and the section can see the boundary line between the first sub-encapsulant 35 and the second sub-encapsulant 36.

[0252] The thermosetting plastic is a composite material composed of an epoxy resin matrix, fillers, and regulating additives. The physical properties of the thermosetting plastic can be changed by regulating the composition and ratio of the components. The thermosetting plastic used in the first sub-mount 35 and the thermosetting plastic used in the second sub-mount 36 can have different compositions and ratios, so as to have different physical properties.

[0253] For example, compared with the thermosetting plastic used in the second sub-mount 36, the fillers in the thermosetting plastic used in the first sub-mount 35 can have a higher proportion of talc, and / or carbon fibers, and / or silica powder, so that the first sub-mount 35 can have a lower bending modulus and a lower molding shrinkage stress than the second sub-mount 36.

[0254] For example, compared with the thermosetting plastic used in the second sub-mount 36, the fillers in the thermosetting plastic used in the first sub-mount 35 can have a higher proportion of rare earth oxides (such as Sm2O3), and / or graphene, so that the first sub-mount 35 can have a lower optical reflectivity than the second sub-mount 36.

[0255] For example, compared with the thermosetting plastic used in the first sub-mount 35, the fillers in the thermosetting plastic used in the second sub-mount 36 can have a higher proportion of aluminum oxide, and / or silicates, so that the second sub-mount 36 can have a higher hardness than the first sub-mount 35.

[0256] It should be noted that the above design of the first sub-mount 35 and the second sub-mount 36 is only illustrative. Other filler designs or designs of regulating additives can also be used to make the first sub-mount 35 and the second sub-mount 36 have different physical properties.

[0257] In some other embodiments, the material of the first sub-mount 35 can be a thermosetting plastic, and the material of the second sub-mount 36 can be a metal, so that the second sub-mount 36 has a higher hardness than the first sub-mount 35, thereby enabling the anti-collision design of the optical filter 4.

[0258] In some embodiments, the first sub-mount 35 can cover the periphery of the image sensor 2 and be mounted on the circuit board 1. The first sub-mount 35 can wrap the wire harness 21.

[0259] In the embodiment, since the package 3A is formed by two times of injection molding to sequentially form the first sub-package 35 and the second sub-package 36, the first sub-package 35 is designed to cover the periphery of the image sensor 2 and is mounted on the circuit board 1, so that the first sub-package 35 can stably package the image sensor 2, and the connection between the image sensor 2, the first sub-package 35 and the circuit board 1 is formed, the overall stability is improved, and the second time of injection molding to form the second sub-package 36 is facilitated. In addition, the wire harness 21 is wrapped by the first sub-package 35, so that the wire harness 21 is wrapped and protected after the first time of injection molding, thereby preventing the wire harness 21 from swinging in the subsequent process, and the damage risk of the wire harness 21 is reduced.

[0260] For example, part of the second sub-package 36 can cover the first sub-package 35, another part of the second sub-package 36 can be mounted on the circuit board 1, and the optical filter 4 can be mounted on the second sub-package 36.

[0261] In the embodiment, the first sub-package 35 and the circuit board 1 are connected by the second sub-package 36, the connection strength between the overall package 3A and the circuit board 1 is strengthened, the structural stability of the package 3A is enhanced, and the stability of the image sensor 2 and the optical filter 4 is improved. In addition, the optical filter 4 is mounted on the second sub-package 36, and the support stability of the optical filter 4 is improved.

[0262] The first sub-package 35 can include a first part 35a, a second part 35b and a third part 35c, the first part 35a of the first sub-package 35 can cover the periphery of the image sensor 2, the third part 35c of the first sub-package 35 can be connected to the board body 11, the second part 35b of the first sub-package 35 can be connected between the first part 35a and the third part 35c of the first sub-package 35, and the second part 35b of the first sub-package 35 can be filled in the gap 14 between the image sensor 2 and the board body 11.

[0263] The second sub-package 36 can include a first part 36a and a second part 36b, the first part 36a of the second sub-package 36 can cover the surface of the first sub-package 35 away from the circuit board 1, the first part 36a of the second sub-package 36 has an L-shaped structure, and the first part 36a of the second sub-package 36 and the first sub-package 35 can jointly form a boss 33 to mount the optical filter 4. The second part 36b of the second sub-package 36 can be connected to the first part 36a of the second sub-package 36 and the board body 11.

[0264] It should be noted that the demarcation line of the first portion 35a, the second portion 35b and the third portion 35c of the first sub-mount 35 is schematically shown by the dashed line in FIG. 21A, and in other embodiments, the demarcation line of the first portion 35a, the second portion 35b and the third portion 35c of the first sub-mount 35 can be located at other positions.

[0265] Please refer to FIGS. 21B-22B, FIG. 21B is a schematic view of the structure shown in FIG. 18 along line E-E in some other embodiments; FIG. 22A is a schematic view of the structure shown in FIG. 18 along line E-E in some other embodiments; and FIG. 22B is a schematic view of the structure shown in FIG. 18 along line E-E in some other embodiments. It should be noted that the package 3A shown in FIGS. 21B-22B can include most of the features of the package 3A shown in FIG. 21A, and the same features will not be described here.

[0266] In some embodiments (see FIG. 21B), the second sub-mount 36 and the first sub-mount 35 can be stacked, the second sub-mount 36 can be spaced apart from the circuit board 1, and the optical filter 4 can be mounted on the second sub-mount 36.

[0267] In the present embodiment, since the bending modulus and / or the molding shrinkage stress of the first sub-mount 35 is smaller than that of the second sub-mount 36, by spacing the second sub-mount 36 from the circuit board 1, the first sub-mount 35 directly connecting the image sensor 2 and the board body 11 can reduce the stress interference received by the image sensor 2, thereby reducing the risk of warping of the image sensor 2. In addition, mounting the optical filter 4 on the second sub-mount 36 is conducive to improving the support stability of the optical filter 4.

[0268] In some embodiments, the second sub-mount 36 can cover the surface of the first sub-mount 35 facing away from the circuit board 1, the first portion 36a of the second sub-mount 36 has an L-shaped structure, and the second sub-mount 36 and the first sub-mount 35 can jointly form a boss 33 to mount the optical filter 4.

[0269] It should be noted that the demarcation line of the first portion 35a, the second portion 35b and the third portion 35c of the first sub-mount 35 is schematically shown by the dashed line in FIG. 21B, and in other embodiments, the demarcation line of the first portion 35a, the second portion 35b and the third portion 35c of the first sub-mount 35 can be located at other positions.

[0270] In some other embodiments (see FIG. 22A), the optical filter 4 can be mounted on the first sub-package 35, and the second sub-package 36 can cover part of the first sub-package 35, and another part of the second sub-package 36 can be mounted on the circuit board 1.

[0271] In the present embodiment, since the optical reflectivity of the first sub-package 35 is lower than that of the second sub-package 36, the risk of production stray light near the optical filter 4 can be reduced by mounting the optical filter 4 on the first sub-package 35, thereby facilitating the improvement of the stray light problem, the improvement of the filtering effect of the optical filter 4, and the improvement of the imaging quality of the image sensor 2. In addition, the connection strength between the whole package 3A and the circuit board 1 can be enhanced by connecting the first sub-package 35 and the circuit board 1 through the second sub-package 36, thereby enhancing the structural stability of the package 3A and facilitating the improvement of the stability of the image sensor 2 and the optical filter 4.

[0272] In some embodiments, the second sub-package 36 can include a first part 36a and a second part 36b, the first part 36a of the second sub-package 36 can cover part of the surface of the first sub-package 35 facing away from the circuit board 1, and the second part 36b of the second sub-package 36 can connect the first part 36a of the second sub-package 36 and the board body 11.

[0273] In some embodiments, the part of the first sub-package 35 not covered by the second sub-package 36 can constitute a boss 33 for mounting the optical filter 4.

[0274] It should be noted that the dashed lines in FIG. 22A schematically represent the boundaries of the first part 35a, the second part 35b, and the third part 35c of the first sub-package 35, and in other embodiments, the boundaries of the first part 35a, the second part 35b, and the third part 35c of the first sub-package 35 can also be located at other positions. The dashed lines in FIG. 22A schematically represent the boundaries of the first part 36a and the second part 36b of the second sub-package 36, and in other embodiments, the boundaries of the first part 36a and the second part 36b of the second sub-package 36 can also be located at other positions.

[0275] In some other embodiments (see FIG. 22B), the optical filter 4 can be mounted on the first sub-package 35, and the second sub-package 36 can be arranged in a stack with the first sub-package 35, and the second sub-package 36 can be arranged in a spaced manner with the circuit board 1.

[0276] In the embodiment, since the optical reflectivity of the first sub-mount 35 is lower than that of the second sub-mount 36, the filter 4 is carried by the first sub-mount 35, which can reduce the risk of production stray light near the filter 4, thereby improving the stray light problem, improving the filtering effect of the filter 4, and further improving the imaging quality of the image sensor 2. Since the bending modulus and / or the molding shrinkage stress of the first sub-mount 35 is smaller than that of the second sub-mount 36, the second sub-mount 36 is arranged to be spaced apart from the circuit board 1, and the first sub-mount 35 directly connects the image sensor 2 and the board body 11, which can reduce the stress interference received by the image sensor 2, thereby reducing the warping risk of the image sensor 2.

[0277] In the embodiment, the part of the first sub-mount 35 not covered by the second sub-mount 36 can constitute a boss 33 for mounting the filter 4.

[0278] It should be noted that the dashed lines in FIG. 22B schematically show the boundaries of the first part 35a, the second part 35b and the third part 35c of the first sub-mount 35, and in other embodiments, the boundaries of the first part 35a, the second part 35b and the third part 35c of the first sub-mount 35 can also be located at other positions.

[0279] Please refer to FIG. 23A and FIG. 23B, FIG. 23A is a structural schematic diagram of the motor 52 in the camera module 10 shown in FIG. 2 in some embodiments; and FIG. 23B is a structural schematic diagram of the motor 52 shown in FIG. 23A along the line F-F in some embodiments.

[0280] In some embodiments, the motor 52 can have a mounting hole 521. The motor 52 can have a first face 522 and a second face 523 arranged opposite to each other, and the mounting hole 521 penetrates the first face 522 and the second face 523. The opening size of the mounting hole 521 located at the first face 522 is smaller than the size of the mounting hole 521 located at the second face 523.

[0281] Please refer to FIG. 3 and FIG. 24, FIG. 24 is a structural schematic diagram of the lens 51 in the camera module 10 shown in FIG. 2 in some embodiments.

[0282] In some embodiments, the lens 51 can have a square structure. Specifically, the lens 51 can include a lens group and a lens barrel, and the lens group is mounted in the lens barrel, and the cross section of the lens barrel perpendicular to the optical axis of the lens group has a square structure. It should be noted that the square structure refers to a general outline approximately square, and is not limited to a square.

[0283] In the embodiment, by arranging the lens 51 to have a square structure, which is equivalent to cutting the four edges of the traditional cylindrical lens 51 to form a square structure, thereby reducing the lateral size of the lens 51. In the embodiment, by arranging the lens 51 to have a square structure, which is equivalent to cutting the four edges of the traditional cylindrical lens 51 to form a square structure, thereby reducing the lateral size of the lens 51.

[0284] Please refer to FIG. 25 to FIG. 27, FIG. 25 is a structural schematic diagram of the lens assembly 5 formed by the lens 51 shown in FIG. 23A and the motor 52 shown in FIG. 24; FIG. 26 is a partially structural exploded schematic diagram of the lens assembly 5 shown in FIG. 25 in some embodiments; and FIG. 27 is a structural schematic diagram of the lens assembly 5 shown in FIG. 25 along the line G-G in some embodiments.

[0285] In some embodiments, the lens 51 can be mounted in the mounting hole 521 and connected to the motor 52.

[0286] In the present embodiment, since the lens 51 is arranged in a square structure, the lateral dimension of the lens 51 is reduced, thereby improving the space utilization of the mounting hole 521 and facilitating the miniaturization of the motor 52.

[0287] In the present embodiment, the lens 51 can be exposed through the opening of the first surface 522 via the mounting hole 521 for receiving light.

[0288] Please refer to FIG. 2, FIG. 4 and FIG. 28, FIG. 28 is a partially structural exploded schematic diagram of the camera module 10 shown in FIG. 2 in another embodiment. It should be noted that the camera module 10 shown in FIG. 28 is different from the camera module 10 shown in FIG. 3 in the way of structural decomposition, and the camera module 10 in the embodiment shown in FIG. 28 can be the same camera module 10 as that in the embodiment shown in FIG. 3.

[0289] In some embodiments, the lens assembly 5 can be connected to the part of the circuit board 1 located in the third area 1c, and the lens assembly 5 and the circuit board 1 can enclose the mounting space 101 to accommodate the image sensor 2, the package 3A and the filter 4. In this embodiment, the encapsulation adhesive 9 is used to bond the lens assembly 5 and the circuit board 1.

[0290] In the present embodiment, since the lens assembly 5 can be connected to the part of the circuit board 1 located in the third area 1c, the lens assembly 5 can avoid the package 3A and directly connect to the circuit board 1. Compared with the prior art in which the lens assembly 5 is mounted on the package 3A, the present embodiment can avoid the package 3A occupying the overall thickness dimension of the camera module 10, thereby reducing the shoulder height of the camera module 10, facilitating the miniaturization of the camera module 10, and further facilitating the slimming of the electronic device 100. In addition, since the connecting material 3B is removed, there is no need to set a avoiding structure for the connecting material on the lens assembly 5 and the circuit board 1, which can ensure the overall integrity of the camera module 10 and facilitate the stability of the camera module 10.

[0291] In some embodiments, a dustproof adhesive (not shown in the figure) can be arranged in the mounting space 101 to play a dustproof role and protect the internal components of the camera module 10.

[0292] For example, the dustproof glue can be arranged on the surface of the packaging member 3A, the inner wall surface of the lens assembly 5, the surface of the circuit board 1, the surface edge of the filter 4, or the like.

[0293] The dustproof glue can also have a low reflectivity to improve stray light and reduce the risk of stray light interfering with imaging. The optical reflectivity of the dustproof glue can be less than 5%, for example, the optical reflectivity of the dustproof glue can be 4.8%, or 4.5%, or 4%, or 3.8%, or 3.2%, or 2%, or other values less than 5%.

[0294] Referring to FIG. 29, FIG. 29 is a partial structural schematic view of the camera module 10 shown in FIG. 2 along line A-A in another embodiment. It should be noted that the camera module 10 shown in FIG. 29 can include most of the features of the camera module 10 shown in FIG. 4, and the same features will not be described here.

[0295] In some embodiments, the packaging glue 9 can also bond the lens assembly 5 and the packaging member 3A.

[0296] In this embodiment, the packaging glue 9 not only bonds the lens assembly 5 and the part of the circuit board 1 located in the third region 1c, but also bonds the lens assembly 5 and the packaging member 3A, thereby improving the bonding stability of the lens assembly 5 and facilitating the stability of the overall packaging of the camera module 10. In addition, since the packaging member 3A is formed on the circuit board 1 by injection molding, the packaging member 3A is fixedly connected to the circuit board 1, and therefore, there is a direct connection relationship between the packaging glue 9, the lens assembly 5, and the packaging member 3A, which enables the lens assembly 5 to be stably fixed on the circuit board 1, thereby improving the structural stability of the camera module 10.

[0297] It should be noted that the packaging member 3A of the embodiments shown in FIGS. 21A-23B can adopt the packaging manner of the embodiment shown in FIG. 4, and the packaging member 3A and the lens assembly 5 are not bonded by the packaging glue 9. The packaging member 3A of the embodiments shown in FIGS. 21A-23B can also adopt the packaging manner of the embodiment shown in FIG. 29, and the packaging member 3A and the lens assembly 5 are bonded by the packaging glue 9, which is not limited herein.

[0298] Referring to FIGS. 30-32, FIG. 30 is a structural schematic view of the camera module 10 in the electronic device 100 shown in FIG. 1A in another embodiment; FIG. 31 is a partial structural exploded schematic view of the camera module 10 shown in FIG. 30 in some embodiments; and FIG. 32 is a structural schematic view of the camera module 10 shown in FIG. 30 along line H-H in some embodiments. It should be noted that the camera module 10 shown in FIG. 30 can include most of the features of the module shown in FIG. 2, and the same features will not be described here.

[0299] In some embodiments, the edge of the packaging member 3A can be provided with a connecting material 3B extending from the edge of the packaging member 3A to the edge of the circuit board 1, and the lens assembly 5 is also connected to the connecting material 3B.

[0300] In the present embodiment, after the injection molding member 3 is formed by injection molding, the connecting material 3B can be retained to reduce the process difficulty, shorten the process time, and thus reduce the process cost.

[0301] For example, the lens assembly 5 can be provided with a first groove 53, and the opening of the first groove 53 faces the circuit board 1, and the connecting material 3B is arranged in the first groove 53.

[0302] In the present embodiment, since the lens assembly 5 is provided with the first groove 53, after the lens assembly 5 is mounted on the circuit board 1, the first groove 53 can accommodate the connecting material 3B to avoid interference with the mounting of the lens assembly 5. Due to the design of the first groove 53, after the injection molding member 3 is formed by injection molding, the connecting material 3B does not need to be removed, which reduces the process difficulty, shortens the process time, and thus reduces the process cost.

[0303] In the present embodiment, the packaging glue 9 can also bond the connecting material 3B and the lens assembly 5. Specifically, the packaging glue 9 bonds the inner wall of the first groove 53 and the connecting material 3B, which not only improves the stability of the lens assembly 5 mounted on the circuit board 1, but also seals the first groove 53, which is conducive to improving the packaging stability of the camera module 10.

[0304] Please refer to FIGS. 32 to 34, FIG. 33 is a structure schematic diagram of the circuit board 1 surface formed with the injection molding member 3 in some embodiments of the camera module 10 shown in FIG. 30; and FIG. 34 is a structure schematic diagram of the structure shown in FIG. 33 along the line I-I in some embodiments. It should be noted that the packaging member 3A shown in FIGS. 33 and 34 can include most of the features of the packaging member 3A in FIGS. 2 to 29, and the same features will not be described here.

[0305] In the present embodiment, according to the injection molding mode shown in FIG. 16, the injection molding material can form the injection molding member 3 after solidification on the surface of the circuit board 1. The connecting material 3B is connected to the edge of the packaging member 3A and extends to the edge of the circuit board 1. Since the injection molding member 3 is formed by one-step injection molding, the connecting material 3B and the packaging member 3A are integrated, which is conducive to improving the connection strength of the packaging member 3A and the circuit board 1.

[0306] In the present embodiment, since the thickness of the connecting material 3B is less than the thickness of the packaging member 3A, it is conducive to reducing the design depth of the first groove 53 on the lens assembly 5, reducing the structural interference with the lens assembly 5, and facilitating the cooperation and connection of the lens assembly 5 and the circuit board 1.

[0307] Please refer to FIGS. 35-37. FIG. 35 is a structural schematic diagram of the camera module 10 in the electronic device 100 shown in FIG. 1A in some embodiments. FIG. 36 is a partially exploded schematic diagram of the camera module 10 shown in FIG. 35 in some embodiments. FIG. 37 is a structural schematic diagram of the camera module 10 shown in FIG. 35 along line J-J in some embodiments. It should be noted that the camera module 10 shown in FIG. 35 can include most of the features of the module shown in FIG. 2, and the same features will not be described here.

[0308] In some embodiments, the circuit board 1 can be provided with a second groove 16, and the opening of the second groove 16 faces the lens assembly 5. The connecting material 3B is arranged in the second groove 16.

[0309] In the present embodiment, since the circuit board 1 is provided with the second groove 16, after the lens assembly 5 is mounted on the circuit board 1, the second groove 16 can accommodate the connecting material 3B, so as to avoid the connecting material 3B interfering with the mounting of the assembly. Due to the design of the second groove 16, after the injection molding forms the injection molding piece 3, the connecting material 3B does not need to be removed, which reduces the process difficulty, shortens the process time, and thus reduces the process cost.

[0310] For example, the encapsulation glue 9 can also bond the connecting material 3B and the lens assembly 5. Specifically, the encapsulation glue 9 can bond the surface of the connecting material 3B exposed from the second groove 16 and the lens assembly 5, which not only improves the stability of the mounting of the lens assembly 5 on the circuit board 1, but also seals the second groove 16, which is conducive to improving the packaging stability of the camera module 10.

[0311] In the present embodiment, the surface of the connecting material 3B can be flush with the surface of the circuit board 1, so as to improve the flatness of the surface of the circuit board 1, and thus facilitate the mounting of the lens assembly 5 on the circuit board 1.

[0312] Please refer to FIGS. 38-40. FIG. 38 is a structural schematic diagram of the injection molding piece 3 formed on the surface of the circuit board 1 in the camera module 10 shown in FIG. 35 in some embodiments. FIG. 39 is a partially exploded schematic diagram of the structure shown in FIG. 38 in some embodiments. FIG. 40 is a structural schematic diagram of the structure shown in FIG. 38 along line K-K in some embodiments. It should be noted that the encapsulation piece 3A shown in FIGS. 38-40 can include most of the features of the encapsulation piece 3A in FIGS. 2-29, and the same features will not be described here.

[0313] In the present embodiment, according to the injection molding mode shown in FIG. 16, the injection material can form the encapsulation piece 3A after solidification on the surface of the circuit board 1, and the injection material can form the connecting material 3B after solidification in the second groove 16. The connecting material 3B is connected to the edge of the encapsulation piece 3A and extends to the edge of the circuit board 1. Since the injection molding piece 3 is integrally formed by injection molding, the connecting material 3B and the encapsulation piece 3A are in an integrated structure, which is conducive to improving the connection strength of the encapsulation piece 3A and the circuit board 1.

[0314] In the embodiment, since the thickness of the connecting material 3B is less than the thickness of the packaging member 3A, the design depth of the second groove 16 on the circuit board 1 is reduced, the structural interference to the circuit board 1 is reduced, and the lens assembly 5 is facilitated to be connected to the circuit board 1.

[0315] Next, the packaging method of the camera module 10 provided in the above embodiments is introduced.

[0316] Please refer to FIG. 41, which is a flowchart of the packaging method of the camera module 10 provided in an embodiment of the present application.

[0317] In some embodiments, the packaging method of the camera module 10 can include steps S10, S20, S30 and S40.

[0318] S10, providing a circuit board 1.

[0319] The circuit board 1 has a first region la, a second region lb and a third region lc connected in sequence, the second region lb surrounds the first region la, and the third region lc surrounds the second region lb.

[0320] In the embodiment, the circuit board 1 can be divided into three regions from the center to the edge, the part of the circuit board 1 at the center is the first region la, the part of the circuit board 1 at the edge is the third region lc, and the part between the first region la and the third region lc is the second region lb. For details, refer to FIG. 6.

[0321] S20, mounting an image sensor 2 to the first region la.

[0322] In the embodiment, the image sensor 2 can be mounted in the first through hole 111 of the board body 11, and the image sensor 2 is adhered to the reinforcing plate 12 by the second adhesive 7. For details, refer to FIG. 9 and FIG. 10. It should be noted that after the image sensor 2 is mounted, the wire harness 21 is used to electrically connect the image sensor 2 and the circuit board 1.

[0323] S30, forming a packaging member 3A on the circuit board 1.

[0324] In the embodiment, a part of the packaging member 3A is fixed to the second region lb, and a part is fixed to the edge of the image sensor 2 to package the image sensor 2. For details, refer to FIG. 12 to FIG. 15.

[0325] S40, fixedly connecting a part of the lens assembly 5 to the third region lc of the circuit board 1, and fixedly connecting a part of the lens assembly 5 to the packaging member 3A.

[0326] The lens assembly 5 and the circuit board 1 enclose the mounting space 101 to accommodate the image sensor 2, the package 3A and the filter 4.

[0327] In the embodiment, the lens assembly 5 and the circuit board 1 are connected by the encapsulation glue 9, and the lens assembly 5 and the package 3A are bonded by the encapsulation glue 9, so that the encapsulation of the camera module 10 is completed, and the encapsulation strength of the camera module 10 is improved. For details, refer to FIGS. 2, 4 and 29.

[0328] In other embodiments, the lens assembly 5 and the circuit board 1 can be connected by the encapsulation glue 9 only, so that the encapsulation of the camera module 10 is completed. For details, refer to FIGS. 2, 4 and 28.

[0329] In other embodiments, between steps S30 and S40, the filter 4 can be mounted on the package 3A, so that the filter 4 is arranged opposite to the image sensor 2. For details, refer to FIGS. 18 to 20.

[0330] Please refer to FIG. 42, which is a flowchart of forming the package 3A in some embodiments in the encapsulation method of the camera module 10 shown in FIG. 41.

[0331] In some embodiments, step S30 can include steps S311, S312 and S313.

[0332] S311, injection molding to form a soft glue body.

[0333] Part of the soft glue body covers the second area 1b and the edge of the image sensor 2, another part of the soft glue body extends to the edge of the circuit board 1, and the soft glue body is connected to the circuit board 1.

[0334] In the embodiment, an injection molding module (not shown) can be used in cooperation with the circuit board 1 to form an injection molding flow channel 200 on the surface of the circuit board 1. The injection molding flow channel 200 can include a feeding port 2001, and the injection molding material can flow into the injection molding flow channel 200 through the feeding port 2001 to fill the injection molding flow channel 200, thereby forming the soft glue body. For details, refer to FIG. 16.

[0335] S312, curing the soft glue body to form the package 3A and the connecting material 3B.

[0336] Part of the package 3A is fixed to the second area 1b, and part of the package 3A is fixed to the edge of the image sensor 2. The connecting material 3B extends from the edge of the package 3A to the edge of the circuit board 1.

[0337] In the embodiment, the soft gel can be solidified to form the injection molding part 3, which includes the packaging part 3A and the connecting part 3B. The packaging part 3A is used to package the image sensor 2 and provide support for the optical filter 4. The connecting part 3B extends from the edge of the packaging part 3A to the edge of the circuit board 1. For details, refer to FIG. 33 and FIG. 34.

[0338] S313, removing the connecting part 3B.

[0339] In the embodiment, the connecting part 3B can be removed by laser, water jet, or ion beam polishing, so that only the packaging part 3A remains on the surface of the circuit board 1. For details, refer to FIG. 12 to FIG. 15.

[0340] For details, refer to FIG. 43, which is a flowchart of processing the surface of the circuit board 1 in the packaging method of the camera module 10 shown in FIG. 41 in some embodiments.

[0341] In some embodiments, before step S30, the packaging method can further include step S101.

[0342] S101, removing part of the insulating layer 15 on the surface of the circuit board 1 to form a slot 151. The slot 151 extends from the edge of the second area 1b to the edge of the circuit board 1.

[0343] In the embodiment, the slot 151 is formed by removing part of the insulating layer 15, so that the metal part of the circuit board 1 is exposed. Since the bonding force between the injection molding material and the metal is poor, the connecting part 3B is easy to remove at the slot 151, for example, it can be removed by mechanical force, which reduces the difficulty of removing the connecting part 3B. For details, refer to FIG. 17.

[0344] For details, refer to FIG. 44, which is a flowchart of forming the packaging part 3A in the packaging method of the camera module 10 shown in FIG. 41 in some other embodiments.

[0345] In some embodiments, step S30 can include steps S321, S322, S323, S324, S325, and S326.

[0346] S321, injection molding to form a first soft gel. Part of the first soft gel covers the second area 1b and the edge of the image sensor 2. Another part of the first soft gel extends to the edge of the circuit board 1. The first soft gel is connected to the circuit board 1.

[0347] S322, solidifying the first soft gel to form a first sub-packaging part 35 and a first connecting part. Part of the first sub-packaging part 35 is fixed to the second area 1b, and part of the first sub-packaging part 35 is fixed to the edge of the image sensor 2. The first connecting part extends from the edge of the first sub-packaging part 35 to the edge of the circuit board 1.

[0348] S323, removing the first connecting material.

[0349] S324, forming a second soft body by injection molding, a part of the second soft body covering and connecting the first sub-mount 35, and another part of the second soft body extending to the edge of the circuit board 1.

[0350] S325, curing the second soft body to form a second sub-mount 36 covering at least part of the first sub-mount 35 and a second connecting material extending from the edge of the second sub-mount 36 to the edge of the circuit board 1.

[0351] S326, removing the second connecting material.

[0352] In the embodiment, the first sub-mount 35 and the second sub-mount 36 are formed by two times of injection molding respectively, and the connecting material 3B processing is performed for the two times of injection molding. Since the two times of injection molding are adopted, the materials used in the two times of injection molding can be different, specifically, the thermosetting plastic with different properties can be used to form the first soft body and the second soft body by injection molding respectively, wherein the bending modulus of the first sub-mount 35 is less than the bending modulus of the second sub-mount 36, and / or the shrinkage stress of the first soft body curing to form the first sub-mount 35 is less than the shrinkage stress of the second soft body curing to form the second sub-mount 36, and / or the optical reflectivity of the first sub-mount 35 is less than the optical reflectivity of the second sub-mount 36, and / or the hardness of the second sub-mount 36 is greater than the hardness of the first sub-mount 35. For details, please refer to FIGS. 21A to 22B.

[0353] In other embodiments, after the step S325 is completed, the step S326 can not be performed to retain the second connecting material, and on this basis, the first recess 53 provided on the lens assembly 5 can be matched with the second connecting material to reduce the connecting material 3B processing process, thereby reducing the process difficulty. For details, please refer to FIGS. 32 to 34.

[0354] In yet other embodiments, the above steps can not include the step S323 and the step S326, specifically, the second recess 16 can be provided on the circuit board 1 to accommodate the first connecting material formed by the first time of injection molding, and in the second time of injection molding, the second connecting material can be formed on the first connecting material, and the first recess 53 provided on the lens assembly 5 can be matched with the second connecting material to further reduce the connecting material 3B processing process, thereby reducing the process difficulty.

[0355] In other embodiments, the feeding port 2001 of the first time of injection molding can be different from the feeding port 2001 of the second time of injection molding, so that the positions of the first connecting material 3B and the second connecting material 3B formed are different, and the first connecting material and / or the second connecting material can be selected to be removed or not to be subjected to the connecting material 3B processing.

[0356] It should be noted that in the step of removing the continuous material 3B, the processing method of the continuous material 3B in the combination of the step S313 and the step S101 can be used.

[0357] Please refer to FIG. 45 and FIG. 46, FIG. 45 is a flow diagram of forming the package 3A in some embodiments in the packaging method of the camera module 10 shown in FIG. 41, and FIG. 46 is a flow diagram of connecting the lens assembly 5 and the circuit board 1 in some embodiments in the packaging method of the camera module 10 shown in FIG. 41.

[0358] In some embodiments, the step S30 can include steps S331 and S332.

[0359] S331, forming a soft gel by injection molding, part of the soft gel covers the second area 1b and the edge of the image sensor 2, another part of the soft gel extends to the edge of the circuit board 1, and the soft gel is connected to the circuit board 1.

[0360] S332, curing the soft gel to form the package 3A and the continuous material 3B, part of the package 3A is fixed to the second area 1b, and part of the package 3A is fixed to the edge of the image sensor 2, and the continuous material 3B extends from the edge of the package 3A to the edge of the circuit board 1.

[0361] In this embodiment, after forming the injection molding piece 3 by injection molding, the continuous material 3B is not processed, and accordingly, the lens assembly 5 can have the first groove 53, and the step S40 can include steps S41 and S42.

[0362] S41, aligning the first groove 53 of the lens assembly 5 with the continuous material 3B.

[0363] S42, mounting the lens assembly 5 on the third area 1c of the circuit board 1, and the first groove 53 accommodates the continuous material 3B.

[0364] In this embodiment, by providing the first groove 53 on the lens assembly 5, after the lens assembly 5 is mounted on the circuit board 1, the first groove 53 can accommodate the continuous material 3B to avoid the continuous material 3B interfering with the mounting of the lens assembly 5. Due to the design of the first groove 53, after forming the injection molding piece 3 by injection molding, the continuous material 3B does not need to be removed, which reduces the process difficulty, is beneficial to shorten the process time, and thus reduces the process cost. For details, please refer to FIG. 30 to FIG. 34.

[0365] Please refer to FIG. 47, FIG. 47 is a flow diagram of forming the package 3A in some embodiments in the packaging method of the camera module 10 shown in FIG. 41.

[0366] In some embodiments, the circuit board 1 can have the second groove 16 extending from the edge of the second area 1b to the edge of the circuit board 1, and the step S30 can include steps S341 and S342.

[0367] S341, forming the soft glue body by injection molding, part of the soft glue body covers the second area 1b and the edge of the image sensor 2, another part of the soft glue body is located in the second groove 16, and the soft glue body is connected to the circuit board 1.

[0368] S342, curing the soft glue body to form the encapsulation 3A and the connecting material 3B, part of the encapsulation 3A is fixed to the second area 1b, and part of the encapsulation 3A is fixed to the edge of the image sensor 2, and the connecting material 3B is accommodated in the second groove 16.

[0369] In the embodiment, since the circuit board 1 is provided with the second groove 16, after the lens assembly 5 is mounted on the circuit board 1, the second groove 16 can accommodate the connecting material 3B to avoid the connecting material 3B interfering with the assembly installation. Due to the design of the second groove 16, the connecting material 3B does not need to be removed after the injection molding forms the injection molding part 3, which reduces the process difficulty, shortens the process time, and reduces the process cost.

[0370] It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict, and any combination of the features in different embodiments is also within the protection scope of the present application, that is, the above-described multiple embodiments can also be combined according to actual needs.

[0371] It should be noted that all the above-mentioned drawings are exemplary drawings of the present application, and do not represent the actual size of the product. The size ratio relationship between the components in the drawings is not limited to the actual product of the present application.

[0372] The above is only part of the embodiments and implementation manners of the present application, and the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of changes or replacements within the technical range disclosed in the present application, which should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. An image capturing module (10), characterized by, The camera module (10) comprises a circuit board (1), an image sensor (2), a package (3A) and a lens assembly (5); The circuit board (1) has a first region (1a), a second region (1b) and a third region (1c) connected in sequence, the second region (1b) surrounds the first region (1a), and the third region (1c) surrounds the second region (1b); The image sensor (2) is fixed to the first region (1a), and a part of the package (3A) is fixed to the second region (1b) and a part is fixed to the edge of the image sensor (2); A part of the lens assembly (5) is fixedly connected with the third region (1c) of the circuit board (1), and a part is fixedly connected with the package (3A), and the image sensor (2) is located on the light-emitting side of the lens assembly (5).

2. The camera module (10) according to claim 1, characterized in that The camera module (10) further comprises a package adhesive (9), a part of the package adhesive (9) bonding the lens assembly (5) and the circuit board (1), and a part bonding the lens assembly (5) and the package (3A).

3. The camera module (10) according to claim 1 or 2, characterized in that The lens assembly (5) and the circuit board (1) enclose to form a mounting space (101), and the image sensor (2) and the package (3A) are located in the mounting space (101).

4. The camera module (10) according to any one of claims 1 to 3, characterized in that An edge of the package (3A) is provided with a connecting material (3B), the connecting material (3B) extends from the edge of the package (3A) to the edge of the circuit board (1), and the lens assembly (5) is further connected with the connecting material (3B).

5. The camera module (10) according to claim 4, characterized in that The lens assembly (5) is provided with a first groove (53), an opening of the first groove (53) faces the circuit board (1), and the connecting material (3B) is arranged in the first groove (53); Alternatively, the circuit board (1) is provided with a second groove (16), an opening of the second groove (16) faces the lens assembly (5), and the connecting material (3B) is arranged in the second groove (16).

6. The camera module (10) according to claim 4 or 5, characterized in that In the arrangement direction of the circuit board (1) and the lens assembly (5), the thickness of the connecting material (3B) is less than the thickness of the package (3A).

7. The camera module (10) according to any one of claims 1 to 3, characterized in that A surface of the circuit board (1) facing the lens assembly (5) is provided with an insulating layer (15), the insulating layer (15) has a slot (151) extending from the edge of the package (3A) to the edge of the circuit board (1).

8. The camera module (10) according to any one of claims 1 to 7, characterized in that The image sensor (2) is electrically connected to the circuit board (1) through a wire harness (21), and the package (3A) wraps the wire harness (21).

9. The camera module (10) as claimed in claim 8, characterized in that The image sensor (2) has an imaging area (2a) and a non-imaging area (2b), the non-imaging area (2b) surrounds the imaging area (2a), and the package (3A) is connected to at least part of the non-imaging area (2b) of the image sensor (2).

10. The camera module (10) according to claim 8 or 9, characterized in that The circuit board (1) comprises a board body (11) and a reinforcing plate (12), the board body (11) is mounted on the reinforcing plate (12), the board body (11) has a first through hole (111), the reinforcing plate (12) covers one side of the first through hole (111), the image sensor (2) is located in the first through hole (111) and mounted on the reinforcing plate (12), there is a gap (14) between the edge of the image sensor (2) and the inner wall of the first through hole (111), one end of the wire harness (21) is electrically connected to the image sensor (2), the wire harness (21) passes through the gap (14), and the other end of the wire harness (21) is electrically connected to the board body (11); Part of the package (3A) is filled in the gap (14) to wrap the wire harness (21).

11. The camera module (10) according to any one of claims 1 to 10, characterized in that The package (3A) comprises a first sub-package (35) and a second sub-package (36), compared with the second sub-package (36), the first sub-package (35) is arranged close to the image sensor (2), and the second sub-package (36) covers at least part of the first sub-package (35). The bending modulus of the first sub-package (35) is smaller than that of the second sub-package (36), and / or the forming shrinkage stress of the first sub-package (35) is smaller than that of the second sub-package (36).

12. The camera module (10) according to any one of claims 1 to 10, characterized in that The package (3A) comprises a first sub-package (35) and a second sub-package (36), compared with the second sub-package (36), the first sub-package (35) is arranged close to the image sensor (2), and the second sub-package (36) covers at least part of the first sub-package (35). The optical reflectivity of the first sub-package (35) is smaller than that of the second sub-package (36).

13. The camera module (10) according to any one of claims 1 to 10, characterized in that The package (3A) comprises a first sub-package (35) and a second sub-package (36), compared with the second sub-package (36), the first sub-package (35) is arranged close to the image sensor (2), and the second sub-package (36) covers at least part of the first sub-package (35). The hardness of the second sub-package (36) is greater than that of the first sub-package (35).

14. The camera module (10) according to any one of claims 11 to 13, characterized in that The material of the first sub-package (35) is thermosetting plastic; The material of the second sub-package (36) is thermosetting plastic, or the material of the second sub-package (36) is metal.

15. The camera module (10) according to any one of claims 11 to 14, characterized in that The image sensor (2) is electrically connected to the circuit board (1) through the wire harness (21), the first sub-package (35) covers the periphery of the image sensor (2) and is mounted on the circuit board (1), and the first sub-package (35) wraps the wire harness (21).

16. The camera module (10) of claim 15, characterized in that The camera module (10) further comprises an optical filter (4), the optical filter (4) is located on the object side of the image sensor (2) and is arranged opposite to the image sensor (2). Part of the second sub-package (36) covers the first sub-package (35), another part of the second sub-package (36) is mounted on the circuit board (1), and the optical filter (4) is mounted on the second sub-package (36).

17. The camera module (10) as claimed in claim 15, characterized in that The camera module (10) further comprises an optical filter (4), wherein the optical filter (4) is located on the object side of the image sensor (2) and is arranged opposite to the image sensor (2). The second sub-package (36) is arranged in a stack with the first sub-package (35), and the second sub-package (36) is arranged in a spaced manner with the circuit board (1), and the optical filter (4) is mounted on the second sub-package (36).

18. The camera module (10) as claimed in claim 15, characterized in that The camera module (10) further comprises an optical filter (4), wherein the optical filter (4) is located on the object side of the image sensor (2) and is arranged opposite to the image sensor (2). The optical filter (4) is mounted on the first sub-package (35), part of the second sub-package (36) covers the first sub-package (35), and another part of the second sub-package (36) is mounted on the circuit board (1).

19. The camera module (10) as claimed in claim 15, characterized in that The camera module (10) further comprises an optical filter (4), wherein the optical filter (4) is located on the object side of the image sensor (2) and is arranged opposite to the image sensor (2). The optical filter (4) is mounted on the first sub-package (35), the second sub-package (36) is arranged in a stack with the first sub-package (35), and the second sub-package (36) is arranged in a spaced manner with the circuit board (1).

20. The camera module (10) according to any one of claims 1 to 19, characterized in that The camera module (10) further comprises an optical filter (4), wherein the optical filter (4) is located on the object side of the image sensor (2) and is arranged opposite to the image sensor (2). The package (3A) has a second through hole (31), the image sensor (2) is located in the second through hole (31) and is mounted on the circuit board (1), and the optical filter (4) is located in the second through hole (31) and is mounted on the package (3A).

21. The camera module (10) of claim 20, characterized in that The package (3A) has a boss (33) arranged in a circumferential direction along an inner wall of the second through hole (31), the optical filter (4) and the image sensor (2) are mounted on opposite sides of the boss (33), and the boss (33) covers a peripheral edge of the image sensor (2).

22. The camera module (10) according to claim 20 or 21, characterized in that The surface of the optical filter (4) facing away from the circuit board (1) is located in the second through hole (31).

23. A packaging method of a camera module (10), characterized by, Comprise: A circuit board (1) is provided, which has a first region (1a), a second region (1b) and a third region (1c) connected in sequence, the second region (1b) surrounds the first region (1a), and the third region (1c) surrounds the second region (1b); An image sensor (2) is attached to the first region (1a); An image sensor (2) is attached to the first region (1a); Forming a package (3A) on the circuit board (1), a part of the package (3A) is fixed to the second area (1b), and a part is fixed to the edge of the image sensor (2); And a part of the lens assembly (5) is fixedly connected with the third area (1c) of the circuit board (1), and a part is connected with the package (3A), and the image sensor (2) is located on the light emitting side of the lens assembly (5).

24. The packaging method of claim 23, wherein, The package (3A) formed on the second area (1b) comprises: Injection molding to form a soft gel, part of the soft gel covers the second area (1b) and the edge of the image sensor (2), and another part of the soft gel extends to the edge of the circuit board (1), and the soft gel is connected to the circuit board (1); Curing the soft gel to form the package (3A) and the connecting material (3B), a part of the package (3A) is fixed to the second area (1b), and a part is fixed to the edge of the image sensor (2), and the connecting material (3B) extends from the edge of the package (3A) to the edge of the circuit board (1); And removing the connecting material (3B).

25. The packaging method of claim 24, wherein, The package method removes the connecting material (3B) by laser, or water jet, or ion beam polishing.

26. The packaging method of claim 24, wherein, Before the step of forming the package (3A) on the circuit board (1), the package method further comprises: Removing part of the insulating layer (15) on the surface of the circuit board (1) to form a slot (151), the slot (151) extends from the edge of the second area (1b) to the edge of the circuit board (1); The package method removes the connecting material (3B) by mechanical external force.

27. The packaging method of any one of claims 24 to 26, wherein, The package (3A) formed on the circuit board (1) comprises: Injection molding to form a first soft gel, part of the first soft gel covers the second area (1b) and the edge of the image sensor (2), and another part of the first soft gel extends to the edge of the circuit board (1), and the first soft gel is connected to the circuit board (1); Curing the first soft gel to form a first sub-package (35) and a first connecting material, a part of the first sub-package (35) is fixed to the second area (1b), and a part is fixed to the edge of the image sensor (2), and the first connecting material extends from the edge of the first sub-package (35) to the edge of the circuit board (1); Removing the first connecting material; Injection molding to form a second soft gel, part of the second soft gel covers and connects the first sub-package (35), and another part of the second soft gel extends to the edge of the circuit board (1); Curing the second soft gel to form a second sub-package (36) and a second connecting material, the second sub-package (36) covers at least part of the first sub-package (35), and the second connecting material extends from the edge of the second sub-package (36) to the edge of the circuit board (1); And removing the second connecting material.

28. The packaging method of claim 27, wherein, The encapsulation method adopts a thermosetting plastic to injection mold the first soft gel body, and adopts a thermosetting plastic to injection mold the second soft gel body.

29. The packaging method of claim 28, wherein, The encapsulation method adopts thermosetting plastics with different properties to injection mold the first soft gel body and the second soft gel body respectively; wherein, The bending modulus of the first sub-encapsulation member (35) is less than the bending modulus of the second sub-encapsulation member (36); And / or, the shrinkage stress of the first soft gel body solidified to form the first sub-encapsulation member (35) is less than the shrinkage stress of the second soft gel body solidified to form the second sub-encapsulation member (36); And / or, the optical reflectivity of the first sub-encapsulation member (35) is less than the optical reflectivity of the second sub-encapsulation member (36); And / or, the hardness of the second sub-encapsulation member (36) is greater than the hardness of the first sub-encapsulation member (35).

30. The packaging method of claim 23, wherein, The encapsulation member (3A) formed on the circuit board (1) comprises: Injection molding a soft gel body, part of the soft gel body covers the second area (1b) and the edge of the image sensor (2), another part of the soft gel body extends to the edge of the circuit board (1), and the soft gel body is connected to the circuit board (1); And, solidifying the soft gel body to form the encapsulation member (3A) and the connecting material (3B), part of the encapsulation member (3A) is fixed to the second area (1b), part of the encapsulation member (3A) is fixed to the edge of the image sensor (2), and the connecting material (3B) extends from the edge of the encapsulation member (3A) to the edge of the circuit board (1); The lens assembly (5) has a first groove (53), and the part of the lens assembly (5) is fixedly connected with the third area (1c) of the circuit board (1) by the following steps: Aligning the first groove (53) of the lens assembly (5) with the connecting material (3B); And, mounting the lens assembly (5) on the third area (1c) of the circuit board (1), and the first groove (53) accommodates the connecting material (3B).

31. The packaging method of claim 23, wherein, The circuit board (1) has a second groove (16) extending from the edge of the second area (1b) to the edge of the circuit board (1), and the encapsulation member (3A) formed on the circuit board (1) comprises: Injection molding a soft gel body, part of the soft gel body covers the second area (1b) and the edge of the image sensor (2), another part of the soft gel body is located in the second groove (16), and the soft gel body is connected to the circuit board (1); And, solidifying the soft gel body to form the encapsulation member (3A) and the connecting material (3B), part of the encapsulation member (3A) is fixed to the second area (1b), part of the encapsulation member (3A) is fixed to the edge of the image sensor (2), and the connecting material (3B) is accommodated in the second groove (16).

32. An electronic device (100), characterized by The electronic device (100) comprises a housing (30) and the camera module (10) according to any one of claims 1 to 22, and the camera module (10) is mounted on the housing (30).

Images