Armor apparatus, systems, and methods

Abstract

An armor apparatus according to which a first layer includes either a ceramic plate or a first titanium alloy, a plate backer connected to the first layer, and a second layer connected to the first layer and the plate backer, the second layer including a second titanium alloy; wherein the second layer is positioned between the first layer and the plate backer. In some example embodiments, one or each of the first layer and the second layer is produced by manufacturing a base Ti-6Al-4V ("Ti64") alloy, pressing the alloy into form; and sintering the pressed alloy using electric field assisted sintering (EFAS) and / or continuous electric field assisted sintering (CEFAS). In some example embodiments, the armor apparatus is wearable body armor, a main battle tank (MBT) armor apparatus, or a containment device adapted to surround, for example, at least a portion of a turbine engine.

Description

Attorney Docket No. 70803.3WO01Customer No. 27683ARMOR APPARATUS, SYSTEMS, AND METHODSCross-Reference to Related Applications

[0001] This application claims the benefit of the filing date of, and priority to, U.S. Application No. 63 / 635,688, filed April 18, 2024, the entire disclosure of which is hereby incorporated herein by reference.

[0002] This application also claims the benefit of the filing date of, and priority to, U.S. Application No. 63 / 651 ,531 , filed May 24, 2024, the entire disclosure of which is hereby incorporated herein by reference.Background

[0003] The present disclosure relates, in general, to armor, and more particularly, to hybrid armor systems and methods associated with same.

[0004] Many armor systems are too expensive, too heavy, do not stop all or a wide variety of threats, and are single-use with respect to some of the more potent armor- piercing types of ammunition.

[0005] Thus, it would be desirable to provide a stand-alone armor apparatus or system that (i) exhibits exceptional strength and durability to ensure maximal protection and operational life against a wide variety of threats, and multiple encounters with those threats, and (ii) is also lightweight to reduce the physical load on the user or vehicle and to promote long-term benefits and either the overall health and well-being of the user or the physical integrity and operational capability of the vehicle.Brief Description of the Drawings

[0006] Figure 1 is an illustration of an armor apparatus, according to one or more embodiments.

[0007] Figure 2 is an illustration of an enlarged cross-section (not to scale) of a portion of the armor apparatus of Figure 1 , including a ceramic plate layer and a plate backer layer, according to one or more embodiments.Attorney Docket No. 70803.3WO01Customer No. 27683

[0008] Figure 3 is a flow chart illustrating a method of manufacturing the armor apparatus of Figures 1 and 2, according to one or more embodiments.

[0009] Figure 4 is a diagrammatic (not to scale) side view of a containment device, according to one or more embodiments.

[0010] Figure 5 is a diagrammatic (not to scale) cross-sectional view of the containment device of Figure 4 according to a first embodiment, the cross-sectional view of Figure 5 being taken along line A-A of Figure 4.

[0011] Figure 6 is a diagrammatic (not to scale) cross-sectional view of the containment device of Figure 4 according to a second embodiment, the cross-sectional view of Figure 6 being taken along line A-A of Figure 4.

[0012] Figure 7 is a diagrammatic (not to scale) cross-sectional view of the containment device of Figure 4 according to a third embodiment, the cross-sectional view of Figure 7 being taken along line A-A of Figure 4.

[0013] Figure 8 illustrates a portion of a cross-section (not to scale) of the containment device of Figure 4, according to one or more embodiments.

[0014] Figure 9 illustrates a cross-section (not to scale) of at least a portion of an amor apparatus such as, for example, a main battle tank (MBT) armor apparatus, according to one or more embodiments.

[0015] Figure 10 illustrates a cross-section (not to scale) of at least a portion of an amor apparatus such as, for example, a lightweight titanium vehicle armor apparatus, according to one or more embodiments.

[0016] Figure 11 is a flow chart illustrating a method of manufacturing a titanium alloy layer of an armor apparatus, according to one or more embodiments.

[0017] Figure 12 is a flow chart illustrating a step of the method of Figure 1 1 , according to one or more embodiments.

[0018] Figure 13 is a flow chart illustrating another step of the method of Figure 11 , according to one or more embodiments.

[0019] Figure 14 is a flow chart illustrating a method of processing at least a portion of an armor apparatus, according to one or more embodiments.Attorney Docket No. 70803.3WO01Customer No. 27683

[0020] Figure 15 is a diagrammatic illustration of a computing node for implementing one or more embodiments of the present disclosure, according to one or more embodiments.Detailed Description

[0021] The following disclosure provides different embodiments or examples of systems, components, arrangements, devices, methods, steps, etc. Specific examples of systems, components, arrangements, devices, methods, and steps are described below. These specific examples are merely examples and are not intended to be limiting. In addition, the present disclosure may repeat reference numerals and / or letters in various examples. This repetition is for the purpose of clarity and does not in and of itself dictate a relationship between the various embodiments and / or configurations discussed.

[0022] Referring to Figure 1 , an armor apparatus according to one or more embodiments is generally referred to by the reference numeral 10. In several example embodiments, the armor apparatus 10 disclosed herein is a stand-alone plate that exhibits improved strength and durability relative to other armor plates, while also maintaining a lightweight design relative to other high-strength plates. In several example embodiments, the armor apparatus 10 of the present disclosure is also more effective at stopping a greater variety of threats as compared to armor plates of the prior art. In several example embodiments, the armor apparatus 10 of the present disclosure is also capable of withstanding multiple exposures to (or impacts from) even the most advanced threats, such as, for example, the M993 armor-piercing round, whereas other armor plates are single-use with respect to such threats, if capable of stopping them at all.

[0023] In several example embodiments, the armor apparatus 10 of the present disclosure includes a ceramic material that provides improved strength without compromising the lightweight design or wearability. In some cases, armor plates utilize a ceramic material, such as boron carbide (B4C) or silicon carbide (SiC), with each having associated advantages and disadvantages. Silicon carbide is a less expensive material with less production constraints and can be capable of withstanding multiple exposures to threats, including multiple gunshots. Silicon carbide, however, is a heavier materialAttorney Docket No. 70803.3WO01Customer No. 27683 that is less efficient compared to alternative materials and that has reduced performance against non-Tungsten ammunition.

[0024] Boron carbide is a lighter weight material relative to silicon carbide and, in many cases, is an efficient material for armor plates. Boron carbide also provides excellent protection against steel armor-piercing ammunition. Boron carbide, however, is more expensive, less available, and offers less protection against multiple exposures to threats.

[0025] Another disadvantage of boron carbide is its susceptibility to amorphization. When a plate constructed from boron carbide is exposed to a high velocity tungsten carbide projectile, or a very high velocity non-tungsten projectile (2950+ fps), the molecular structure of the boron carbide plate degrades in a predictably atypical fashion, which leads to an amorphous or glass state. In such a state, the boron carbide material is susceptible to microcracking along amorphous shear bands as well as single variant shear faults.

[0026] In order to realize the advantages of both silicon carbide and boron carbide, while also solving the issue of amorphization associated with boron carbide, several example embodiments of the armor apparatus 10 of the present disclosure utilize a ceramic material including boron carbide doped with silicon carbide.

[0027] In several example embodiments, there are a number of options for preparing the hybrid ceramic material, including hot pressing, reaction bonding (or ion implantation), and sintering. In one or more example embodiments, the boron carbide and silicon carbide hybrid ceramic material of the armor apparatus is subjected to hot pressing as this process yields the strongest, most resilient, and highest purity form of the material. In several example embodiments, hot pressing the boron carbide and silicon carbide hybrid forms the most uniform and optimal structure, which ensures a consistent contact surface for predictable energy dispersion. In several example embodiments, hot pressing also results in decreased crack propagation and decreased amorphization in the material as compared to preparation by the other processes. Overall, in several example embodiments, the hot-pressed boron carbide and silicon carbide hybrid provides the best overall strength of the armor apparatus 10; it is lighter than silicon carbide alone (3.2 psfAttorney Docket No. 70803.3WO01Customer No. 27683 vs 2.63 psf for 80:20), resolves the amorphization issue and shatter gap issue, and provides a greater capacity for withstanding multiple exposures to gunshots.

[0028] In several example embodiments, the reaction bonded material is less expensive than the hot-pressed material, but it is not as strong and yields inconsistent silicon carbide deposits. In several example embodiments, the sintered material is the least expensive form of the material, but it is also the weakest and contains the highest concentration of impurities.

[0029] In several example embodiments, the armor apparatus 10 of the present disclosure also includes a plate backer. In several example embodiments, plate backers are typically either non-ballistic or ballistic. In several example embodiments, non-ballistic plate backers are often made of foam and are primarily used for comfort rather than protection. In several example embodiments, ballistic plate backers are often made of an aramid or polyethylene and enhance protection by reducing backface and capturing any bullet fragments that may penetrate the plate. In several example embodiments, backface refers to the deformation of the backplate towards the user upon deflection or absorption of a projectile’s energy.

[0030] In one or more embodiments, the plate backer used in combination with the armor apparatus 10 disclosed herein is made of polyethylene. In some embodiments, the plate backer is Honeywell (Spectra Shield) 6166, which is a multi-layer polyethylene material that is subject to heat treating and that utilizes atypical high pressures to increase strength and durability while maintaining a low weight relative to its strength. In such embodiments, the high-pressure processing method increases the weight to strength ratio by at least 20 percent and provides consistent improvements to the ballistic limit of the plate backer. In one or more other embodiments, Honeywell (Spectra Shield) 6472 may be used as the plate backer. In still other embodiments, the plate backer may be made of carbon fiber nano tubes.

[0031] Referring Figure 2 with continuing reference to Figure 1 , an enlarged crosssection of a portion of the assembled armor apparatus 10, including the ceramic material and the plate backer, is shown (not to scale) and described according to one or more example embodiments. The boron carbide and silicon carbide ceramic plate isAttorney Docket No. 70803.3WO01Customer No. 27683 referenced generally by the reference numeral 12. In the embodiment shown, the ceramic plate is positioned between layers of a high modulus carbon thermoset prepreg, referenced generally by reference numerals 14 and 16, respectively. In several embodiments, the ceramic plate 12 is a hybrid ceramic plate. Each of the layers 14 and 16 of high modulus carbon thermoset prepreg is composed of an intermediate material formed from sheets of carbon fiber and impregnated with thermoset resin. In several embodiments, once heated, the prepreg layers 14 and 16 become exceptionally strong and provide excellent structural support on each side of the ceramic plate 12. In one or more embodiments, as illustrated in Figure 2, the prepreg layers 14 and 16 are positioned at the front and back, respectively, of the ceramic plate 12. In one or more embodiments, the prepreg layers 14 and 16 surround the ceramic plate 12 on all sides. In one or more embodiments, the ceramic plate 12 includes a hot pressed blend. In one or more embodiments, the ceramic plate 12 is an 80:20 Boron Carbide / Silicon Carbide plate. In one or more embodiments, the ceramic plate 12 is 80% Boron Carbide and 20% Silicon Carbide. In one or more embodiments, the ceramic plate 12 includes a hot pressed blend; in one or more embodiments, the ceramic plate 12 is a 90:10 Boron Carbide / Silicon Carbide plate. In one or more embodiments, the ceramic plate 12 is 90% Boron Carbide and 10% Silicon Carbide. In one or more embodiments, the ceramic plate 12 includes a hot pressed blend; in one or more embodiments, the ceramic plate 12 is a 70:30 Boron Carbide / Silicon Carbide plate. In one or more embodiments, the ceramic plate 12 is 70% Boron Carbide and 30% Silicon Carbide. In one or more embodiments, the ceramic plate 12 includes a non-hot rolled blend; in one or more embodiments, the ceramic plate 12 is a 30:70 Boron Carbide / Silicon Carbide plate. In one or more embodiments, the ceramic plate 12 is 30% Boron Carbide and 70% Silicon Carbide.

[0032] As further shown in Figure 2, a toughened thermoplastic epoxy resin T-link adhesive, referenced generally by reference numeral 18, is positioned between the ceramic plate 12 and a plate backer, which is referenced generally by the reference numeral 20. In embodiments where the high modulus carbon thermoset prepreg layers 14 and 16 are present, the adhesive layer 18 is positioned between the plate backer 20 and the prepreg layer 16 adjacent the plate backer 20. The adhesive layer 18 facilitatesAttorney Docket No. 70803.3WO01Customer No. 27683 unification of the ceramic plate 12 and the plate backer 20. In several example embodiments, the unification process involves using heat and pressure to ensure a stable bond between the ceramic plate 12 and the plate backer 20. The plate backer 20 is connected to the ceramic plate 12. In some embodiments, the plate backer 20 includes a rubber elastomer resin system. In some embodiments, the plate backer 20 includes a plurality of plies of unidirectional fiber in a rubber elastomer resin system. In some embodiments, the plate backer 20 is composed of Honeywell (Spectra Shield) 6166, which is a multi-layer polyethylene material that is subject to heat treating and that utilizes atypical high pressures to increase strength and durability while maintaining a low weight relative to its strength; in some embodiments, the high-pressure processing method increases the weight to strength ratio by at least 20 percent and provides consistent improvements to the ballistic limit of the plate backer. In one or more other embodiments, Honeywell (Spectra Shield) 6472 may be used as the material for the plate backer 20. In still other embodiments, the plate backer 20 may be made of carbon nanotubes. In still other embodiments, the plate backer 20 may be composed of carbon nanotubes and other materials including, but not limited to, the material described above including, but not limited to, the fiber and / or elastomer materials described above. In several embodiments, the plate backer 20 includes polyethylene and / or carbon nanotubes.

[0033] In one or more embodiments, an additional carbon fiber layer may completely surround the armor apparatus 10, including the unified ceramic plate 12 and the plate backer 20, to keep the entire package secured. In one or more embodiments, an additional foam layer may be added to the side of the plate backer 20 opposite the ceramic plate 12, and adjacent the user, to provide additional comfort and energy absorption. In one or more embodiments, an additional foam layer may be added to the side of the ceramic plate 12 opposite the plate backer 20 to provide additional comfort and energy absorption. In one or more embodiments, the armor plate 10 may be wrapped in ballistic nylon for additional durability. In one or more embodiments, foam is also used to facilitate protection of the plates from damage.

[0034] Table 1 below discloses various examples of experimental embodiments of the armor apparatus 10.Attorney Docket No. 70803.3WO01Customer No. 27683Table 1

[0035] Experimental testing was performed on the example experimental embodiments of Table 1 , including Silicon Carbide “E” in Table 1. The silicon carbide example experimental embodiment of the armor apparatus utilized hot pressed silicon carbide, Honeywell 6166 (ultra-high-molecular-weight polyethylene (LIHMWPE)) pressed under higher pressures, high modulus carbon thermoset prepreg, and toughened thermoplastic epoxy resin T-link adhesive. This embodiment of the armor apparatus was tested without pathfinder shoot packs (XSAPI) as a naked plate without foam. The silicon carbide plate stopped: a single shot of M33 ball 662 grain 50 cal. at 2850+ fps; six shots of BZ 7.62x39 API; three shots of B327.62x54R API; three shots of M855; three shots of M855A1 ; three shots of M995 (Tungsten 5.56); two-three shots of APM2 30.06; and one-two shots of M993 (Tungsten 7.62) hot conditioned or durability (drop tested). In several example experimental embodiments, testing was conducted by NTS. Regarding Silicon Carbide “E” in Table 1 , for its ceramic plate the experimental armor apparatus included, or was composed of, a Hot-Pressed Proprietary SiC-X38 ceramic material, which is available from CoorsTek, Inc. of Golden, Colorado.

[0036] In several example embodiments, one or more embodiments of the armor apparatus 10 stop 5.8mm rounds, 6.5mm rounds, 6.8mm NGSW rounds, and Tungsten 6.8mm or Saboted light armor penetrator SLAP rounds.

[0037] In one or more embodiments, complex microstructure layers may be incorporated into the armor apparatus 10 for increased energy dissipation. In one or more embodiments, non-Newtonian fluids may be incorporated into the armor apparatus 10 for improved endoergic efficacy. In one or more embodiments, carbon nanotube structuresAttorney Docket No. 70803.3WO01Customer No. 27683 may be incorporated into, or used as a replacement for, the plate backer 20 material. In one or more embodiments, other alternative endoergic backer materials may be used. In one or more embodiments, various polyethylene and rubber-based plate backer material layers may be used for improved hybrid strength.

[0038] In one or more embodiments, the armor apparatus 10 is adapted to be used as wearable body armor for a human user. In several example embodiments, the armor apparatus 10 may be shaped and sized to fit a variety of users and a variety of applications. For example, in one or more embodiments, the armor apparatus 10 may take the form of MSAP cut, SPEAR cut, or SWIMMER cut. MSAP cut armor plates are used for side protection; other cuts of plates are used for the lower abdomen, hips, groin, shoulders, arms, forearms, thighs, shins, etc. SPEAR cut and SWIMMER cut armor plates are typically chest plates, or chest and back plates. SWIMMER cut plates typically trim out more material in the upper corners near the shoulder to allow for more range of motion by the user and to allow for more ergonomic handling of a rifle. In one or more embodiments, the various plate cuts are offered in different sizes. For example, in one or more embodiments, the SPEAR cut armor plates are created in small, medium, medium-long, large, and extra-large sizes. For further example, in one or more embodiments, the SWIMMER cut armor plates are created in small, medium, large, and extra-large sizes. Various other shapes and sizes of the armor plate are contemplated and may be created depending on the requirements of the particular application or the particular user.

[0039] In one or more embodiments, the armor plate or apparatus 10 may be adapted for applications other than wearable body armor for human use. For example, in one or more embodiments, the armor plate or apparatus 10 may be adapted to be worn by animals, such as military and police dogs. For further example, in one or more other embodiments, the armor plate or apparatus may be adapted for use with vehicles and buildings.

[0040] Further testing was performed for the silicon carbide example experimental embodiment relative to SPEAR TSA Standards. The results are shown in Table 2 below.Attorney Docket No. 70803.3WO01Customer No. 27683Table 2

[0041] An example experimental embodiment of the boron carbide / silicon carbide hybrid ceramic armor plate or apparatus 10 was tested. For the example experimental embodiments, the ceramic plate 12 included, or was composed of, the Hot-Pressed Proprietary SiC-X38 ceramic material, which is available from CoorsTek, Inc. of Golden, Colorado. The test results are shown in Table 3 below.Table 3

[0042] In an embodiment, the armor apparatus 10 includes the ceramic plate 12, which corresponds to Hybrid “A” in Table 1 and thus is a 0.18-inch thick hybrid ceramic plate at 2.47 psf, composed of a hot pressed HC8X+ B4C / SiC blend, which blend is made by CoorsTek, Inc. of Golden, Colorado. The plate backer 20 is connected to the ceramic plate 12, and is either a 1.8-psf or 1.0-psf high-pressure-made backer, composed of Honeywell 6166 (ultra-high-molecular-weight polyethylene (LIHMWPE)) pressed underAttorney Docket No. 70803.3WO01Customer No. 27683 higher pressures. In several embodiments, such an embodiment of the armor apparatus may be rated as a NIJ RF2 plate.

[0043] In an embodiment, the armor apparatus 10 includes the ceramic plate 12, which corresponds to Hybrid “B” in Table 1 and thus is a 0.24-inch thick hybrid ceramic plate at 3.29 psf, composed of a hot pressed HC8X+ B4C / SiC blend, which blend is made by CoorsTek, Inc. of Golden, Colorado. The plate backer 20 is connected to the ceramic plate 12, and is a 1.8-psf high-pressure-made backer, composed of Honeywell 6166 (ultra-high-molecular-weight polyethylene (UHMWPE)) pressed under higher pressures.

[0044] In an embodiment, the armor apparatus 10 includes the ceramic plate 12, which corresponds to Hybrid “C” in Table 1 and thus is a 0.29-inch thick hybrid ceramic plate at 3.98 psf, composed of a hot pressed HC8X+ B4C / SiC blend, which blend is made by CoorsTek, Inc. of Golden, Colorado. The plate backer 20 is connected to the ceramic plate 12, and is either a 1.8-psf or 1.5-psf high-pressure-made backer, composed of Honeywell 6166 (ultra-high-molecular-weight polyethylene (UHMWPE)) pressed under higher pressures.

[0045] In an embodiment, the armor apparatus 10 includes the ceramic plate 12, which corresponds to Hybrid “D” in Table 1 and thus is a 0.33-inch thick hybrid ceramic plate at 4.52 psf, composed of a hot pressed HC8X+ B4C / SiC blend, which blend is made by CoorsTek, Inc. of Golden, Colorado. The plate backer 20 is connected to the ceramic plate 12, and is either a 1.8-psf or 1.0-psf high-pressure-made backer, composed of Honeywell 6166 (ultra-high-molecular-weight polyethylene (UHMWPE)) pressed under higher pressures. In several embodiments, such an embodiment of the armor apparatus 10 may be rated as a NIJ RF3 plate.

[0046] In an embodiment, the armor apparatus 10 includes the ceramic plate 12, which corresponds to Silicon Carbide “E” in Table 1 and thus is a 0.37-inch thick ceramic plate at 6.17 psf, composed of the Hot-Pressed Proprietary SiC-X38 ceramic material, which is available from CoorsTek, Inc. of Golden, Colorado. The plate backer 20 is connected to the ceramic plate 12, and is a 1.8-psf high-pressure-made backer, composed of Honeywell 6166 (ultra-high-molecular-weight polyethylene (UHMWPE)) pressed under higher pressures. In several embodiments, such an embodiment of the armor apparatusAttorney Docket No. 70803.3WO01Customer No. 2768310 may be rated as a stand-alone XSAPI plate; in several embodiments, such an embodiment of the armor apparatus 10 does not need soft armor (e.g., soft armor underneath the embodiment of the apparatus) to meet criteria.

[0047] Referring to Figure 3, with continuing reference to Figures 1 and 2, a flow chart illustrating a method 22 of manufacturing the armor plate or apparatus 10 is provided in accordance with one or more embodiments. The method 22 includes steps 24, 26, 28, 30, 32, and 34. The step 24 includes manufacturing the hybrid ceramic plate 12 of the armor plate or apparatus 10; the step 24 includes doping boron carbide with silicone carbide. The step 26 includes positioning carbon fiber layers 14 and 16 on either side of the hybrid ceramic plate 12. The step 28 includes positioning the adhesive layer 18 between the hybrid ceramic plate 12 and the plate backer 20. The step 30 includes bonding, using heat and pressure, the hybrid ceramic plate 12 to the plate backer 20, wherein the adhesive layer 18 facilitates the bonding between the hybrid ceramic plate 12 and the plate backer 20. The step 32 includes positioning a foam layer on an external side of the plate backer 20 and / or an external side of the hybrid ceramic plate 12. The step 34 includes wrapping the entire armor apparatus 10, or at least the ceramic plate 12, the adhesive layer 18, and the plate backer 20, in ballistic nylon.

[0048] In several example embodiments, one or more of the steps 24, 26, 28, 30, 32, and 34 is, or are, omitted from the method 22, the method 22 includes one or more additional steps, one or more of the steps 24, 26, 28, 30, 32, and 34 includes one or more additional steps, or any combination thereof.

[0049] Referring to Figure 4, a diagrammatic (not to scale) side view of an armor apparatus / containment device is shown and generally referred to by the reference numeral 36, the armor apparatus / containment device 36 surrounding a plurality of blades 38 of a turbine engine (shown in Figure 5), the armor apparatus / containment device 36 including one or more of the embodiments described above, variations thereof, combinations in whole or in part thereof, or any combination thereof. In several example embodiments, Figure 4 illustrates a side view of an armor apparatus of the present disclosure, the armor apparatus being a containment device for a turbine engine. In several example embodiments, Figure 4 illustrates a containment device for a turbineAttorney Docket No. 70803.3WO01Customer No. 27683 engine, the containment device including one or more of the armor apparatus embodiments described above, variations thereof, combinations in whole or in part thereof, or any combination thereof. In operation, the armor apparatus / containment device 36 contains any of the blades 38 or other components that may break off the turbine engine of which the device is a part, protecting the turbine engine and structures connected thereto (e.g., aircraft structures).

[0050] Figure 5 illustrates a diagrammatic (not to scale) cross-sectional view of the armor apparatus / containment device 36 of Figure 4 according to a first embodiment, the cross-sectional view of Figure 5 being taken along line A-A of Figure 4. In one embodiment, the containment device 36 includes a plurality of layers or plates having cylindrical shapes and concentric / coaxial with each other, and connected together, the plurality of layers including the following layers listed from the radially inmost layer to the radially outmost layer:39) an inner layer of carbon fiber and / or carbon nanotubes (radially closest to the blades of the turbine engine of which the containment device is a part), a carbon fiber film or carbon nanotubes (radially closest to the blades of the turbine engine of which the containment device is a part), a carbon fiber film or carbon nanotubes, or any combination thereof;40) a layer of ceramic such as, for example, either B4C or B4C doped with other ceramics such as, for example, silicon carbide (SiC);42) a carbon fiber film or carbon nanotubes positioned radially between (40) and (44);44) an ultra-high-molecular-weight polyethylene (LIHMWPE) layer;46) a layer of carbon nanotubes;48) a layer of metal that is made of, or includes, magnesium honeycomb, magnesium foam, other material(s), a high strength aluminum, titanium, other material(s) with or without a honeycomb or similar design, or any combination thereof; and50) a layer of carbon fiber, carbon nanotubes, metal, or any combination thereof (radially farthest from the blades of the turbine engine of which the containment device is a part).

[0051] During operation, with continuing reference to Figure 5, one of the blades 38 of a turbine engine experiences a blade-off event and breaks off, and / or another componentAttorney Docket No. 70803.3WO01Customer No. 27683 of the turbine engine breaks off, and the blade or other component travels in a radially outward direction, initially striking layer (39) of the containment device of Figure 5, which devices contains the broken blade or other component.

[0052] In one or more embodiments, one or more of the layers illustrated in Figure 5 are omitted from the armor apparatus / containment device 36. In one or more embodiments, one or more layers are added to the armor apparatus / containment device 36 illustrated in Figure 5.

[0053] Figure 6 illustrates a diagrammatic (not to scale) cross-sectional view of the armor apparatus / containment device 36 of Figure 4 according to a second embodiment, the cross-sectional view of Figure 6 being taken along line A-A of Figure 4 and referred to as the containment device 36’. In one embodiment, the containment device 36’ includes a plurality of layers or plates having cylindrical shapes and concentric / coaxial with each other, and connected together, the plurality of layers including the following layers listed from the radially inmost layer to the radially outmost layer:52) an inner layer of carbon fiber and / or carbon nanotubes (radially closest to the blades of the turbine engine of which the containment device is a part);54) a layer of ceramic such as, for example, either B4C or B4C doped with other ceramics such as, for example, silicon carbide (SiC);56) a layer of carbon nanotubes;58) a layer of metal that is made of, or includes, magnesium honeycomb, magnesium foam, other material(s), a high strength aluminum, titanium, other material(s) with or without a honeycomb or similar design, or any combination thereof; and60) a layer of carbon fiber, carbon nanotubes, metal, or any combination thereof (radially farthest from the blades 38 of the turbine engine of which the containment device 36’ is a part).

[0054] In one embodiment, layer (58) is omitted from the device 36’ of Figure 6. In one embodiment, layer (60) is omitted from the device 36’ of Figure 6. In one embodiment, layers (58) and (60) are omitted from the device 36’ of Figure 6.

[0055] During operation, with continuing reference to Figure 6, one of the blades 38 of a turbine engine experiences a blade-off event and breaks off, and / or another componentAttorney Docket No. 70803.3WO01Customer No. 27683 of the turbine engine breaks off, and the blade or other component travels in a radially outward direction, initially striking layer (52) of the containment device of Figure 6, which devices contains the broken blade or other component.

[0056] In one or more embodiments, one or more of the layers illustrated in Figure 6 are omitted from the armor apparatus / containment device 36’. In one or more embodiments, one or more layers are added to the armor apparatus / containment device 36’ illustrated in Figure 6.

[0057] Figure 7 illustrates a diagrammatic (not to scale) cross-sectional view of the armor apparatus / containment device 36 of Figure 4 according to a third embodiment, the cross-sectional view of Figure 7 being taken along line A-A of Figure 4 and referred to as the containment device 36”. In one embodiment, the containment device 36” includes a plurality of layers or plates having cylindrical shapes and concentric / coaxial with each other, and connected together, the plurality of layers including the following layers listed from the radially inmost layer to the radially outmost layer:61 ) an inner layer of carbon fiber and / or carbon nanotubes (radially closest to the blades of the turbine engine of which the containment device is a part);62) a layer of ceramic such as, for example, either B4C or B4C doped with other ceramics such as, for example, silicon carbide (SiC);64) an ultra-high-molecular-weight polyethylene (LIHMWPE) layer; and66) a layer of carbon nanotubes.

[0058] In one embodiment, layer (58) from the embodiment of Figure 6 is included in the embodiment of Figure 7. In one embodiment, layer (60) from the embodiment of Figure 6 is included in the embodiment of Figure 7. In one embodiment, layers (58) and (60) from the embodiment of Figure 6 are included in the embodiment of Figure 7.

[0059] During operation, with continuing reference to Figure 7, one of the blades 38 of a turbine engine experiences a blade-off event and breaks off, and / or another component of the turbine engine breaks off, and the blade or other component travels in a radially outward direction, initially striking layer (60) of the containment device 36” of Figure 7, which devices contains the broken blade or other component.Attorney Docket No. 70803.3WO01Customer No. 27683

[0060] In one or more embodiments, one or more of the layers illustrated in Figure 7 are omitted from the armor apparatus / containment device 36”. In one or more embodiments, one or more layers are added to the armor apparatus / containment device 36” illustrated in Figure 7.

[0061] Figure 8 illustrates a portion of a cross-section of the device 36 of Figure 4 referred to as the containment device 36”’, according to one or more embodiments. As shown in Figure 8, the containment device 36”’ includes a plurality of layers or plates having cylindrical shapes and concentric / coaxial with each other, and connected together, the plurality of layers including the following layers listed from the radially inmost layer to the radially outmost layer:68) carbon film or carbon nanotube layer;70) a layer of ceramic such as, for example, either B4C or B4C doped with other ceramics such as, for example, silicon carbide (SiC);72) carbon film or carbon nanotube layer;74) ultra-high-molecular-weight polyethylene (UHMWPE);76) relatively thick carbon nanotube layer;78) a layer of magnesium foam / honeycomb, aluminum, or titanium; and80) a solid steel backer, or steel alloy, or aluminum layer.

[0062] In several example embodiments, in any of the embodiments described above in which the layers are cylindrical in shape, the layers instead are flat in shape, that is, flat plates instead of cylindrical in shape. Vice versa, in several example embodiments, in any of the embodiments described above in which the layers are flat in shape, the layers instead are cylindrical in shape, that is, cylindrical in shape instead of flat plates.

[0063] In several example embodiments, in any of the embodiments described above in which the layers are cylindrical in shape, the layers instead are flat in shape or have other shape(s). In several example embodiments, in any of the embodiments described above in which the layers are flat in shape, the layers instead are cylindrical in shape or have other shape(s).

[0064] During operation, with continuing reference to Figure 8, one of the blades 38 of a turbine engine experiences a blade-off event and breaks off, and / or another componentAttorney Docket No. 70803.3WO01Customer No. 27683 of the turbine engine breaks off, and the blade or other component travels in a radially outward direction, initially striking layer (68) of the containment device 36” of Figure 7, which devices contains the broken blade or other component.

[0065] In one or more embodiments, one or more of the layers illustrated in Figure 7 are omitted from the armor apparatus / containment device 36”’. In one or more embodiments, one or more layers are added to the armor apparatus / containment device 36’” illustrated in Figure 8.

[0066] Figure 9 illustrates a cross-section (not to scale) of at least a portion of an amor apparatus such as, for example, a main battle tank (MBT) armor apparatus 82, according to one or more embodiments. The MBT armor apparatus 82 includes an outer layer 84 including a titanium alloy; in several example embodiments, the outer layer 84 includes titanium carbide (TiC) and / or titanium boride (TiB); in several example embodiments, the outer layer 84 includes a Ti-6AI-4V (“Ti64”) alloy; in several example embodiments, the outer layer 84 includes a doped Ti64 alloy; in several example embodiments, the outer layer 84 includes a TiC-doped Ti64 alloy; in several example embodiments, the outer layer 84 includes a TiB-doped Ti64 alloy. The MBT armor apparatus 82 further includes a ceramic layer such as, for example, a doped layer 86 of tungsten tetraboride (WB4), which is positioned between the layer 84 and, optionally, a carbon nanotube layer 88. The MBT armor apparatus 82 further includes another ceramic layer such as, for example, a doped layer 90 of boron carbide (B4C) and / or silicon carbide (SiC), which is positioned between the carbon nanotube layer 88 and, optionally, a carbon nanotube layer 92. The MBT armor apparatus 82 further includes an energy-absorbing layer 94, which is positioned between the carbon nanotube layer 92 and a titanium layer 96 including a titanium alloy.

[0067] In several example embodiments, the energy-absorbing layer 94 includes rubber, elastomers, specific polymers, or any combination thereof. In several example embodiments, the energy-absorbing layer 94 operates to assist in the dissipation of energy from any projectile striking the armor apparatus 82; by reducing the energy, in a manner similar to a dampener or shock absorber, the energy-absorbing layer 94 reduces stress and assists in the prevention of failure of component(s) of the armor apparatus 82Attorney Docket No. 70803.3WO01Customer No. 27683 positioned behind the energy-absorbing layer 94. In several example embodiments, the layer 94 decreases respective penetrations of spall fragments and plays a role in absorbing shockwaves, preventing crack propagation, and generally dissipating energy throughout the structure of the armor apparatus 82.

[0068] In several example embodiments, the titanium layer 96 includes titanium carbide (TiC) and / or titanium boride (TiB); in several example embodiments, the layer 96 includes a Ti-6AI-4V (“Ti64”) alloy; in several example embodiments, the layer 96 includes a TiC- doped Ti64 alloy; in several example embodiments, the layer 96 includes a TiB-doped Ti64 alloy.

[0069] With continuing reference to Figure 9, the MBT armor apparatus 82 further includes a ductile titanium layer 98; in several example embodiments, the ductile titanium layer 98 includes a ductile Ti64 alloy. In several example embodiments, the ductile titanium layer 98 is not doped and its ductility is greater than the ductility of the titanium layer 96; the titanium layer 96 is doped and is substantially harder than the ductile titanium layer 98. In operation, in several example embodiments, the harder and more brittle titanium layer 96 defeats incoming projectiles striking the armor apparatus 82, and the ductile titanium layer 98 absorbs energy from the projectile strikes.

[0070] An inner spall shield layer 100 is positioned so that the ductile titanium layer 98 is positioned between the titanium alloy layer 96 and the spall shield layer 100. In several example embodiments, the spall shield layer 100 includes ultra-high-molecular-weight polyethylene (UHMWPE).

[0071] During operation, in several example embodiments, the armor apparatus 82 is installed on a tank, such as on one or more front sections of a tank, and / or wrapped around a barrel insert of a tank; accordingly, in several example embodiments, the armor apparatus 82 functions as an MBT armor apparatus, protecting the tank against threats that, of the layers shown in Figure 9, initially engage the layer 84.

[0072] In several example embodiments, the multi-layer composite armor apparatus 82, an example embodiment of which is illustrated in Figure 9, utilizes several innovative materials, such as an optimized Lanthanum doped tungsten tetraboride armor (e.g., the doped layer 86). With respect to the doped layer 86, the doping increases the strengthAttorney Docket No. 70803.3WO01Customer No. 27683 of WB4 and changes the ductility. In several example embodiments, the doped layer 86 of tungsten tetraboride (WB4) may be doped with, or otherwise utilize, Lanthanum (La) and / or other Lanthanide (Ln3+) elements including, but not limited to, Yttrium (Y), Gadolinium (Gd), Terbium (Tb), Dysprosium (Dy), Holmium (Ho), Erbium (Er), or any combination thereof, as well as fourth-period elements such as, for example, Titanium (Ti), Vanadium (V), Chromium (Cr), Magnesium (Mg), or any combination thereof. In several example embodiments, the WB4 alloy of the layer 86 may be doped with Scandium (Sc) and / or Zirconium (Zr); in several example embodiments, these superhard variants of WB4 are customized for the application in which the armor apparatus 82 is to be implemented.

[0073] In several example embodiments, the outer layer 84 is omitted from the armor apparatus 82. In several example embodiments, the outer layer 84 is omitted from the armor apparatus 82 and the outer layer of the armor apparatus is then a ceramic, that is, the doped layer 86 of tungsten tetraboride (WB4); in such example embodiments, the doped layer 86 is no longer positioned between the layer 84 and the doped layer 90 of boron carbide (B4C) and / or silicon carbide (SiC), or optionally the carbon nanotube layer 88, because the layer 84 is omitted from the armor apparatus 82; in several example embodiments in which the outer layer 84 is omitted from the armor apparatus, the armor apparatus 82 nevertheless operates in a manner substantially similar to the abovedescribed operation of the armor apparatus 82.

[0074] In several example embodiments, one or more components of the MBT armor apparatus 82 illustrated in Figure 9 may be omitted (either instead of omitting the outer layer 84 or in addition to omitting the outer layer 84). In several example embodiments, one or more components may be added to the MBT armor apparatus 82 illustrated in Figure 9, or any combination thereof. In several example embodiments, one or more components of the MBT armor apparatus 82 illustrated in Figure 9 may be omitted (either instead of omitting the outer layer 84 or in addition to omitting the outer layer 84), one or more components may be added to the MBT armor apparatus 82 illustrated in Figure 9, or any combination thereof.Attorney Docket No. 70803.3WO01Customer No. 27683

[0075] Figure 10 illustrates a cross-section (not to scale) of at least a portion of an amor apparatus such as, for example, a lightweight titanium vehicle armor apparatus 102, according to one or more embodiments. The lightweight titanium vehicle armor apparatus 102 includes an outer layer 104 including a titanium alloy; in several example embodiments, the outer layer 104 includes titanium carbide (TiC) and / or titanium boride (TiB); in several example embodiments, the outer layer 104 is composed of Ti-6AI-4V (“Ti64”); in several example embodiments, the outer layer 104 includes a TiC-doped Ti64 alloy; in several example embodiments, the outer layer 104 includes a TiB-doped Ti64 alloy. The lightweight titanium vehicle armor apparatus 102 further includes a ductile titanium layer 106; in several example embodiments, the ductile titanium layer 106 includes a ductile Ti64 alloy, which is positioned between the outer layer 104 and a spall shield layer 108. In several example embodiments, the spall shield layer 108 includes ultra-high-molecular-weight polyethylene (UHMWPE).

[0076] During operation, in several example embodiments, the armor apparatus 102 is installed on a tank, such as on one or more front sections of a tank, and / or wrapped around a barrel insert of a tank; accordingly, in several example embodiments, the armor apparatus 102 functions as vehicle amor, protecting the tank against threats that, of the layers shown in Figure 10, initially engage the layer 104.

[0077] In several example embodiments, one or more components of the armor apparatus 102 illustrated in Figure 10 may be omitted, one or more components may be added to the armor apparatus 102 illustrated in Figure 10, or any combination thereof.

[0078] Referring to Figure 11 with continuing reference to Figures 9 and 10, among other figures, a method of manufacturing a titanium alloy layer is generally referred to by the reference numeral 110. In several example embodiments, the method 1 10 is carried out or executed to manufacture, at least in part, one or more of the outer layer 84, the layer 96, and the ductile titanium layer 98, of the armor apparatus 82. In several example embodiments, the method 1 10 is carried out or executed to manufacture, at least in part, one or both of the outer layer 104, and the ductile titanium layer 106, of the armor apparatus 102.Attorney Docket No. 70803.3WO01Customer No. 27683

[0079] As shown in Figure 11 , in several example embodiments, the method 1 10 includes manufacturing the base Ti-6AI-4V (“Ti64”) alloy at step 1 12, mixing the base alloy with titanium carbide (TiC) and / or titanium boride (TiB) at step 1 14, die pressing the mixed alloy into form at step 116, and sintering the die-pressed alloy at step 1 18.

[0080] Referring to Figure 12 with continuing reference to Figures 9, 10, and 1 1 , in several example embodiments, the step 112 includes providing titanium input(s) at step 1 12a, and mixing the provided titanium input(s)with 60AI-40V by weight, at step 112b, to make the base Ti-6AI-4V (“Ti64”) alloy. In several example embodiments, the titanium inputs provided at the step 112a include titanium hydride (TiH2); in several example embodiments, the titanium inputs provided at the step 1 12a include titanium hydride (TiH2) sponge crush; in several example embodiments, at the step 112b the TiH2 sponge crush is mixed with 60AI-40V by weight to make the base Ti-6AI-4V (“Ti64”) alloy.

[0081] At the step 114 of the method 1 10, in several example embodiments, the base Ti64 alloy is mixed with titanium carbide (TiC) and / or titanium boride (TiB) up to 40% by weight; the final weight amount of the titanium carbide (TiC) and / or titanium boride (TiB) mixed at the step 1 14 is determined by the constraint of satisfying the desired properties of the alloy to be completed by the execution of the method 110, including desired hardness and desired ductility of the alloy; in several example embodiments, the hardness increases up to 40% of the TiB or TiC addition by weight.

[0082] In several example embodiments, the step 1 14 of mixing the base Ti64 alloy with TiB / Tic is omitted from the method 1 10.

[0083] In several example embodiments, before, during, or after the step 112, blended elemental power metallurgy (BEPM) is utilized before the step 116, to process the mixed alloy before it is die-pressed. In several example embodiments, before, during, or after the step 1 14, blended elemental power metallurgy (BEPM) is utilized before the step 1 16, to process the mixed alloy before it is die-pressed. In several example embodiments, before, during, or after the step 112 and / or the step 1 14, blended elemental power metallurgy (BEPM) is utilized before the step 116, to process the mixed alloy before it is die-pressed.Attorney Docket No. 70803.3WO01Customer No. 27683

[0084] At the step 1 16 of the method 110, in several example embodiments, the mixed alloy is die-pressed into form; in several example embodiments, the mixed alloy is hot pressed at the step 1 16, and / or the step 1 16 is carried out using a hot press. In several example embodiments, the alloy is not mixed at the step 114 and thus the alloy manufactured at the step 1 12 is die-pressed into form at the step 1 16. In several example embodiments, the mixed alloy with or without the additional TiB / TiC is die-pressed into form at the step 116. In several example embodiments, at the step 1 16 is not die-pressed but pressed (i.e., compressed or compacted) using a technique that is different from, or a variant of, die pressing such as, for example, hot isostatic pressing.

[0085] Referring to Figure 13 with continuing reference to Figures 9, 10, 1 1 , and 12, in several example embodiments, the step 118 of the method 102 includes either sintering the die-pressed alloy using an electric field assisted sintering (EFAS) system at step 1 18a, or sintering the die-pressed alloy using a continuous electric field assisted sintering (CEFAS) system at step 1 18b. In several example embodiments, the step 118 includes the step 1 18a, the step 1 18b, or both the step 1 18a and the step 118b; in several example embodiments, the step 1 18b includes passing electric current through conductive rollers, sintering powders as they are squeezed between the conductive rollers, thereby sintering the pressed alloy at the step 1 18b. In several example embodiments, the step 1 18a of the step 118 of the method 110 includes electric field assisted sintering; in several example embodiments, the step 1 18a includes spark plasma sintering (SPS), direct current sintering (DCS), flash sintering (FS), or any combination thereof. In several example embodiments, a CEFAS system is considered a type of EFAS system so executing the step 118b is an example of executing both of the steps 1 18a and 1 18b.

[0086] In several example embodiments, the armor apparatus 82 is wrapped around a barrel insert of a tank, and / or utilized for warheads, projectiles, drones, etc. Likewise, in several example embodiments, the armor apparatus 102 is wrapped around a barrel insert of a tank, and / or utilized for warheads, projectiles, drones, etc. In several example embodiments, conducting electric field assisted sintering (EFAS) on the die-pressed alloy at the step 1 18a simplifies manufacturing of complex warhead geometries utilizing the armor apparatus 82 or 102, or component(s) thereof, making the production process moreAttorney Docket No. 70803.3WO01Customer No. 27683 efficient; the hardened material can also be leveraged for payloads, optimizing shrapnel or fragmentation effects.

[0087] Referring to Figure 14 with continuing reference to Figures 9 and 10, among other figures, a method is generally referred to by the reference numeral 120. In several example embodiments, the method 120 is carried out or executed to process, at least in part, at least a portion of the armor apparatus 82. In several example embodiments, the method 120 is carried out or executed to process at least the combination of: the outer layer 84, which includes a doped Ti64 alloy; the doped layer 86 of tungsten tetraboride (WB4); and the doped layer 90 of boron carbide (B4C) and / or silicon carbide (SiC). As shown in Figure 14, the method 120 includes a step 122, which includes simultaneously pressing (i) the outer layer 84 including the doped Ti64 alloy, (ii) the doped layer 86 of tungsten tetraboride (WB4), and (iii) the doped layer 90 of boron carbide (B4C) and / or silicon carbide (SiC). In several example embodiments, at the step 122, the outer layer 84, the doped layer 86, and the doped layer 90 are all made in one pressing. As shown in Figure 14, the method 120 further includes a step 124, which includes using EFAS at step 124a and / or CEFAS at step 124b to sinter the layers 84, 86, and 90 at the same time, simultaneously. In several example embodiments, the heat from the sintering at the step 124 bonds the different materials of the layers 84, 86, and 90 simultaneously pressed at the one pressing at the step 122. In several example embodiments, the steps 122 and 124 are carried out or executed simultaneously. In several example embodiments, the sintering step 124, with EFAS at the step 124a and / or CEFAS at the step 124b, is carried out or executed during the simultaneous pressing of the step 122. In several example embodiments, the sintering step 124, with EFAS at the step 124a and / or CEFAS at the step 124b, is carried out or executed after the simultaneous pressing of the step 122. In several example embodiments, the sintering step 124, with EFAS at the step 124a and / or CEFAS at the step 124b, is carried out or executed during and after the simultaneous pressing of the step 122. In several example embodiments, the sintering step 124, with EFAS at the step 124a and / or CEFAS at the step 124b, is carried out or executed before and / or during the simultaneous pressing of the step 122. In several example embodiments, the sintering step 124, with EFAS at the step 124a and / or CEFAS at theAttorney Docket No. 70803.3WO01Customer No. 27683 step 124b, is carried out or executed before, during, or after the simultaneous pressing of the step 122, or any combination of two or more of before, during, after. In several example embodiments, the sintering step 124 includes both of the steps 124a and 124b. In several example embodiments, the sintering step 124 includes the step 124a but not the step 124b. In several example embodiments, the sintering step 124 includes the step 124b but not the step 124a. In several example embodiments, a CEFAS system is considered a type of EFAS system so executing the step 124b is an example of executing both of the steps 124a and 124b.

[0088] In or more embodiments, as illustrated in Figure 15 with continuing reference to Figures 1 , 2, 3, 4, 5, 6, 7, 8, 9, 10, 11 , 12, 13, and 14, a computing node 1000 for implementing one or more of the above-described embodiments, and / or any combination thereof, is depicted. The node 1000 includes a microprocessor 1000a, an input device 1000b, a storage device 1000c, a video controller 1000d, a system memory 1000e, a display 10OOf, and a communication device 1000g all interconnected by one or more buses 1000h. In one or more embodiments, the storage device 1000c may include a floppy drive, hard drive, CD-ROM, optical drive, any other form of storage device or any combination thereof. In one or more embodiments, the storage device 1000c may include, and / or be capable of receiving, a floppy disk, CD-ROM, DVD-ROM, or any other form of computer-readable medium that may contain executable instructions. In one or more embodiments, the communication device 1000g may include a modem, network card, or any other device to enable the node 1000 to communicate with other nodes. In one or more embodiments, any node represents a plurality of interconnected (whether by intranet or Internet) computer systems, including without limitation, personal computers, mainframes, PDAs, smartphones and cell phones; in one or more embodiments, one or more of the components of any of the above-described embodiments include at least the node and / or components thereof, and / or one or more nodes that are substantially similar to the node and / or components thereof. In one or more embodiments, one or more of the above-described components of the node and / or the above-described embodiments include respective pluralities of same components.Attorney Docket No. 70803.3WO01Customer No. 27683

[0089] In one or more embodiments, one or more of the components of any of the above-described embodiments include at least the node 1000 and / or components thereof, and / or one or more nodes that are substantially similar to the node 1000 and / or components thereof. In one or more embodiments, one or more of the above-described components of the node 1000 and / or the above-described embodiments include respective pluralities of same components.

[0090] In one or more embodiments, a computer system includes at least hardware capable of executing machine readable instructions, as well as the software for executing acts (typically machine-readable instructions) that produce a desired result. In one or more embodiments, a computer system includes hybrids of hardware and software, as well as computer sub-systems. In one or more embodiments, hardware generally includes at least processor-capable platforms, such as client-machines (also known as personal computers or servers), and hand-held processing devices (such as smart phones, tablet computers, personal digital assistants (PDAs), or personal computing devices (PCDs), for example). In one or more embodiments, hardware may include any physical device that is capable of storing machine-readable instructions, such as memory or other data storage devices. In one or more embodiments, other forms of hardware include hardware sub-systems, including transfer devices such as modems, modem cards, ports, and port cards, for example.

[0091] In one or more embodiments, software includes any machine code stored in any memory medium, such as RAM or ROM, and machine code stored on other devices (such as floppy disks, flash memory, or a CD-ROM, for example). In one or more embodiments, software may include source or object code. In one or more embodiments, software encompasses any set of instructions capable of being executed on a node such as, for example, on a client machine or server. In one or more embodiments, combinations of software and hardware could also be used for providing enhanced functionality and performance for certain embodiments of the present disclosure. In one or more embodiments, software functions may be directly manufactured into a silicon chip. Accordingly, combinations of hardware and software are also included within the definition of a computer system and are thus envisioned by the present disclosure asAttorney Docket No. 70803.3WO01Customer No. 27683 possible equivalent structures and equivalent methods. In one or more embodiments, computer readable mediums include, for example, passive data storage, such as a random-access memory (RAM) as well as semi-permanent data storage such as a compact disk read only memory (CD-ROM). One or more embodiments of the present disclosure may be embodied in the RAM of a computer to transform a standard computer into a new specific computing machine. In one or more embodiments, data structures are defined organizations of data that may enable one or more embodiments of the present disclosure. In one or more embodiments, data structure may provide an organization of data, or an organization of executable code. In one or more embodiments, any networks and / or one or more portions thereof, may be designed to work on any specific architecture. In one or more embodiments, one or more portions of any networks may be executed on a single computer, local area networks, client-server networks, wide area networks, internets, hand-held and other portable and wireless devices and networks. In one or more embodiments, database may be any standard or proprietary database software. In one or more embodiments, the database may have fields, records, data, and other database elements that may be associated through database specific software. In one or more embodiments, data may be mapped. In one or more embodiments, mapping is the process of associating one data entry with another data entry. In one or more embodiments, the data contained in the location of a character file can be mapped to a field in a second table. In one or more embodiments, the physical location of the database is not limiting, and the database may be distributed. In one or more embodiments, the database may exist remotely from the server, and run on a separate platform. In one or more embodiments, the database may be accessible across the Internet. In one or more embodiments, more than one database may be implemented.

[0092] In one or more embodiments, a plurality of instructions stored on a non-transitory computer readable medium may be executed by one or more processors to cause the one or more processors to carry out, implement, or produce, in whole or in part, one or more of the above-described embodiments, and / or any combination thereof, including, for example, the above-described methods / or one or more steps thereof, the system 10 and / or one or more components thereof, or any combination thereof. In one or moreAttorney Docket No. 70803.3WO01Customer No. 27683 embodiments, such one or more processors may be or include one or more of the microprocessor 1000a, one or more other processors, one or more other controllers, any processor(s) that are part of the components of the above-described embodiments, and / or any combination thereof, and such a non-transitory computer readable medium may be distributed among one or more components of the above-described systems. In one or more embodiments, such one or more processors may execute the plurality of instructions stored on the non-transitory computer readable medium in connection with a 3D printing system including a three-dimensional (3D) printer to, for example, produce one or more of the above-described components; in one or more embodiments, such a 3D printing system includes the 3D printer and the node 1000, which: may be integrated with, or part of, the 3D printer; may be operably coupled to the 3D printer; may include the one or more processors and / or the non-transitory computer readable medium; or any combination thereof. In one or more embodiments, such one or more processors may execute the plurality of instructions stored on the non-transitory computer readable medium to implement or carry out one or more method steps; in one or more embodiments, such one or more processors and / or the non-transitory computer readable medium may be part of the node 1000. In one or more embodiments, such one or more processors may execute the plurality of instructions in connection with a virtual computer system. In one or more embodiments, such a plurality of instructions may communicate directly with the one or more processors, and / or may interact with one or more operating systems, middleware, firmware, other applications, and / or any combination thereof, to cause the one or more processors to execute the instructions.

[0093] The present disclosure introduces an armor apparatus that includes: a first layer including a ceramic and / or a first titanium alloy; a plate backer connected to the first layer; and a second layer connected to the first layer and the plate backer, the second layer including a second titanium alloy; wherein the second layer is positioned between the first layer and the plate backer. In an example embodiment, the first layer includes the first titanium alloy, and wherein the armor apparatus further includes: a doped layer of tungsten tetraboride (WB4) positioned between the first layer including the first titanium alloy and the second layer including the second titanium alloy; a doped layer of boronAttorney Docket No. 70803.3WO01Customer No. 27683 carbide (B4C) and / or silicon carbide (SiC) positioned between the doped layer of tungsten tetraboride (WB4) and the second layer including the second titanium alloy; and a third layer including a third titanium alloy and positioned between the doped layer of boron carbide (B4C) and / or silicon carbide (SiC) and the second layer including the second titanium alloy. In an example embodiment, the first titanium alloy of the first layer includes titanium (Ti), aluminum (Al), and Vanadium (V), and the first titanium alloy is Ti-6AI-4V (“Ti64”); wherein the first titanium alloy (“Ti64”) is doped with titanium carbide (TiC) and / or titanium boride (TiB); wherein the tungsten tetraboride (WB4) is doped with one or more of the following: Lanthanum (La), Yttrium (Y), Gadolinium (Gd), Terbium (Tb), Dysprosium (Dy), Holmium (Ho), Erbium (Er), Titanium (Ti), Vanadium (V), Chromium (Cr), Magnesium (Mg), Scandium (Sc), Zirconium (Zr); wherein the second titanium alloy of the second layer, which is positioned between the first layer and the plate backer, includes a TL6AI-4V (“Ti64”) alloy; wherein the third layer, which is positioned between the doped layer of boron carbide (B4C) and / or silicon carbide (SiC) and the second layer including the second titanium alloy, includes titanium carbide (TiC) and / or titanium boride (TiB); wherein the third layer includes a TiC-doped Ti-6AI-4V (“Ti64”) alloy and / or a TiB-doped Ti-6AI-4V (“Ti64”) alloy; wherein the plate backer includes a spall shield layer; and wherein the spall shield layer includes ultra-high-molecular-weight polyethylene (UHMWPE). In an example embodiment, one or more of the first layer including the first titanium alloy, the second layer including the second titanium alloy, and the third layer including the third titanium alloy, is or are manufactured by a method, the method including: manufacturing a base Ti-6AI-4V (“Ti64”) alloy, including mixing titanium input(s) with 60AI-40V by weight, the titanium input(s) including titanium hydride (TiH2); mixing the base Ti-6AI-4V (“Ti64”) alloy with titanium carbide (TiC) and / or titanium boride (TiB), up to 40% by weight, to produce a mixed alloy; pressing the mixed alloy into form; and sintering the pressed alloy using electric field assisted sintering (EFAS) and / or continuous electric field assisted sintering (CEFAS). In an example embodiment, the armor apparatus is a main battle tank (MBT) armor apparatus; and wherein the first layer, the second layer, the plate backer, the third layer, the doped layer of tungsten tetraboride (WB4), and the doped layer of boron carbide (B4C) and / or silicon carbide (SiC), areAttorney Docket No. 70803.3WO01Customer No. 27683 configured to be connected to, or part of, a battle tank. In an example embodiment, the amor apparatus includes: a first carbon nanotube layer positioned between the doped layer of tungsten tetraboride (WB4) and the doped layer of boron carbide (B4C) and / or silicon carbide (SiC); and / or a second carbon nanotube layer positioned between the doped layer of boron carbide (B4C) and / or silicon carbide (SiC) and the third layer, which includes the TiC-doped Ti-6AI-4V (“Ti64”) alloy and / or the TiB-doped Ti-6AI-4V (“Ti64”) alloy, so that the doped layer of boron carbide (B4C) and / or silicon carbide (SiC) is positioned between the first and second carbon nanotube layers. In an example embodiment, the armor apparatus includes: another layer positioned between the doped layer of boron carbide (B4C) and / or silicon carbide (SiC) and the third layer including the TiC-doped Ti-6AI-4V (“Ti64”) alloy and / or the TiB-doped Ti-6AI-4V (“Ti64”) alloy; wherein the doped layer of tungsten tetraboride (WB4) is positioned between the first layer and the doped layer of boron carbide (B4C) and / or silicon carbide (SiC); wherein the doped layer of boron carbide (B4C) and / or silicon carbide (SiC) is positioned between the doped layer of tungsten tetraboride (WB4) and the another layer; wherein the third layer is positioned between the another layer and the second layer; and wherein the second layer is positioned between the third layer and the plate backer including the spall shield layer. In an example embodiment, the first layer includes the first titanium alloy; wherein the first titanium alloy of the first layer includes titanium (Ti), aluminum (Al), and Vanadium (V), and the first titanium alloy is Ti-6AI-4V (“Ti64”); wherein the first titanium alloy (“Ti64”) is doped with titanium carbide (TiC) and / or titanium boride (TiB); and wherein the armor apparatus further includes: a doped layer of tungsten tetraboride (WB4) positioned between the first layer including the first titanium alloy and the second layer including the second titanium alloy; and a doped layer of boron carbide (B4C) and / or silicon carbide (SiC) positioned between the doped layer of tungsten tetraboride (WB4) and the second layer including the second titanium alloy. In an example embodiment, a combination of at least a portion of the armor apparatus is manufactured by a method wherein the combination is a combination of at least the following: the first layer including the first titanium alloy (“Ti64”) doped with titanium carbide (TiC) and / or titanium boride (TiB); the doped layer of tungsten tetraboride (WB4); and the doped layer of boron carbide (B4C)Attorney Docket No. 70803.3WO01Customer No. 27683 and / or silicon carbide (SiC); and wherein the method, by which the combination is manufactured, includes: simultaneously pressing the combination of at least the first layer including the first titanium alloy (“Ti64”) doped with titanium carbide (TiC) and / or titanium boride (Ti B) , the doped layer of tungsten tetraboride (WB4), and the doped layer of boron carbide (B4C) and / or silicon carbide (SiC); and sintering the simultaneous pressed combination of at least the first layer including the first titanium alloy (“TI64”) doped with titanium carbide TiC) and / or titanium boride (TiB), the doped layer of tungsten tetraboride (WB4), and the doped layer of boron carbide (B4C) and / or silicon carbide (SiC). In an example embodiment, sintering the simultaneous pressed combination includes sintering the simultaneous pressed combination using an electric field assisted sintering (EFAS) system; and / or sintering the simultaneous pressed combination using a continuous electric field assisted sintering (CEFAS) system. In an example embodiment, the first layer includes the ceramic, which includes a doped layer of tungsten tetraboride (WB4); wherein the armor apparatus further includes: a doped layer of boron carbide (B4C) and / or silicon carbide (SiC) positioned between the doped layer of tungsten tetraboride (WB4) and the second layer including the second titanium alloy; and a third layer including a third titanium alloy and positioned between the doped layer of boron carbide (B4C) and / or silicon carbide (SiC) and the second layer including the second titanium alloy; wherein the tungsten tetraboride (WB4) is doped with one or more of the following: Lanthanum (La), Yttrium (Y), Gadolinium (Gd), Terbium (Tb), Dysprosium (Dy), Holmium (Ho), Erbium (Er), Titanium (Ti), Vanadium (V), Chromium (Cr), Magnesium (Mg), Scandium (Sc), Zirconium (Zr); wherein the second titanium alloy of the second layer, which is positioned between the first layer and the plate backer, includes a Ti-6AI-4V (“Ti64”) alloy; wherein the third layer, which is positioned between the doped layer of boron carbide (B4C) and / or silicon carbide (SiC) and the second layer including the second titanium alloy, includes titanium carbide (TiC) and / or titanium boride (TiB); wherein the third layer includes a TiC-doped Ti-6AI-4V (“Ti64”) alloy and / or a TiB-doped Ti-6AI-4V (“Ti64”) alloy. In an example embodiment, the plate backer includes a spall shield layer; wherein the spall shield layer includes ultra-high-molecular-weight polyethylene (UHMWPE); and wherein the armor apparatus further includes: a firstAttorney Docket No. 70803.3WO01Customer No. 27683 carbon nanotube layer positioned between the doped layer of tungsten tetraboride (WB4) and the doped layer of boron carbide (B4C) and / or silicon carbide (SiC); and / or a second carbon nanotube layer positioned between the doped layer of boron carbide (B4C) and / or silicon carbide (SiC) and the third layer, which includes the TiC-doped Ti-6AI-4V (“Ti64”) alloy and / or the TiB-doped Ti-6AI-4V (“Ti64”) alloy, so that the doped layer of boron carbide (B4C) and / or silicon carbide (SiC) is positioned between the first and second carbon nanotube layers. In an example embodiment, the first layer includes the first titanium alloy; wherein the first layer has a first ductility, and the second layer has a second ductility; and wherein the second ductility is greater than the first ductility. In an example embodiment, the first layer includes the first titanium alloy; wherein the first titanium alloy includes titanium (Ti), aluminum (Al), and Vanadium (V), and the first titanium alloy is Ti-6AI-4V (“Ti64”); and wherein the first titanium alloy (“Ti64”) is doped with titanium carbide (TiC) and / or titanium boride (TiB). In an example embodiment, the plate backer is a spall shield layer; and wherein the spall shield layer includes ultra-high- molecular-weight polyethylene (UHMWPE). In an example embodiment, the armor apparatus is a main battle tank (MBT) armor apparatus; and wherein the first layer, the second layer, and the plate backer are configured to be connected to, or part of, a battle tank. In an example embodiment, the first layer, the second layer, and the plate backer are configured to be wrapped around a barrel insert of the battle tank. In an example embodiment, the first layer includes the first titanium alloy; wherein each of the first and second titanium alloys includes titanium (Ti), aluminum (Al), and Vanadium (V), and each of the first and second titanium alloys is Ti-6AI-4V (“Ti64”); wherein the first titanium alloy (“TI64”) is doped with titanium carbide (TiC) and / or titanium boride (TiB); wherein the plate backer includes a spall shield layer; and wherein the spall shield layer includes ultra-high- molecular-weight polyethylene (UHMWPE). In an example embodiment, the first layer includes the first titanium alloy, and wherein the armor apparatus further includes: a ceramic layer; wherein the ceramic layer is positioned between the first and second layers; and wherein the second layer is positioned between the ceramic layer and the plate backer. In an example embodiment, the ceramic layer is a doped layer of tungsten tetraboride (WB4). In an example embodiment, the tungsten tetraboride (WB4) is dopedAttorney Docket No. 70803.3WO01Customer No. 27683 with one or more of the following: Lanthanum (La), Yttrium (Y), Gadolinium (Gd), Terbium (Tb), Dysprosium (Dy), Holmium (Ho), Erbium (Er), Titanium (Ti), Vanadium (V), Chromium (Cr), Magnesium (Mg), Scandium (Sc), Zirconium (Zr). In an example embodiment, the armor apparatus includes another ceramic layer positioned between the ceramic layer and the second layer; wherein the another ceramic layer is a doped layer of boron carbide (B4C) and / or silicon carbide (SiC). In an example embodiment, the first layer including the first titanium alloy is manufactured by: manufacturing a base Ti-6AI-4V (“Ti64”) alloy, including mixing titanium input(s) with 60AI-40V by weight, the titanium input(s) including titanium hydride (TiH2); mixing the base Ti-6AI-4V (“Ti64”) alloy with titanium carbide (TiC) and / or titanium boride (TiB), up to 40% by weight, to produce a mixed alloy; pressing the mixed alloy into form; and sintering the pressed alloy using electric field assisted sintering (EFAS) and / or continuous electric field assisted sintering (CEFAS). In an example embodiment, the armor apparatus is a containment device; and wherein the first layer, the second layer, and the plate backer are concentric with each other. In an example embodiment, the concentric first layer, second layer, and plate backer are adapted to surround at least a portion of a turbine engine.

[0094] The present disclosure also introduces an armor apparatus, the armor apparatus including a ceramic plate, and a plate backer connected to the ceramic plate. In an embodiment, the ceramic plate includes boron carbide and silicon carbide. In an embodiment, the boron carbide is doped with the silicon carbide. In an embodiment, the plate backer includes polyethylene. In an embodiment, the plate backer includes carbon nanotubes. In an embodiment, the armor apparatus includes an adhesive layer positioned between the ceramic plate and the plate backer; wherein the ceramic plate and the plate backer are bonded together via the adhesive layer. In an embodiment, the adhesive layer is a thermoplastic epoxy resin. In an embodiment, the armor apparatus includes a carbon fiber layer positioned on each side of the ceramic plate. In an embodiment, the carbon fiber layer is high modulus carbon thermoset prepreg. In an embodiment, the armor apparatus includes a foam layer positioned on an external side of the ceramic plate and / or an external side of the plate backer. In an embodiment, the armor apparatus includes ballistic nylon surrounding at least the ceramic plate, the plateAttorney Docket No. 70803.3WO01Customer No. 27683 backer, the adhesive layer, and the carbon fiber layer; in an embodiment, instead of ballistic nylon, the armor apparatus includes a spray-on polyurea coating; in an embodiment, in addition to ballistic nylon, the armor apparatus includes a spray-on polyurea coating.

[0095] The present disclosure also introduces a method of manufacturing an armor apparatus, the method including producing a ceramic plate, including doping boron carbide with silicon carbide; positioning an adhesive layer between the ceramic plate and a plate backer; and bonding, using heat and pressure, the ceramic plate and the plate backer; wherein the adhesive layer facilitates the bonding between the ceramic plate and the plate backer. In an embodiment, the plate backer includes polyethylene. In an embodiment, the plate backer includes carbon nanotubes. In an embodiment, the method includes positioning a carbon fiber layer on each side of the ceramic plate. In an embodiment, the carbon fiber layer is a high modulus carbon thermoset prepreg. In an embodiment, the method includes positioning a foam layer on an external side of the plate backer and / or on an external side of the ceramic plate. In an embodiment, the method includes wrapping, in ballistic nylon, at least the ceramic plate, the plate backer, the adhesive layer, and the carbon fiber layer.

[0096] The present disclosure also introduces an apparatus, which apparatus has been described according to one or more aspects of the present disclosure.

[0097] The present disclosure also introduces a system, which system has been described according to one or more aspects of the present disclosure.

[0098] The present disclosure also introduces a method, which method has been described according to one or more aspects of the present disclosure.

[0099] The present disclosure also introduces an assembly, which assembly has been described according to one or more aspects of the present disclosure.

[0100] The present disclosure also introduces a kit, which kit has been described according to one or more aspects of the present disclosure.

[0101] It is understood that variations may be made in the foregoing without departing from the scope of the present disclosure.Attorney Docket No. 70803.3WO01Customer No. 27683

[0102] In several embodiments, the elements and teachings of the various embodiments may be combined in whole or in part in some or all of the embodiments. In addition, one or more of the elements and teachings of the various embodiments may be omitted, at least in part, and / or combined, at least in part, with one or more of the other elements and teachings of the various embodiments.

[0103] Any spatial references, such as, for example, “upper,” “lower,” “above,” “below,” “between,” “bottom,” “vertical,” “horizontal,” “angular,” “upwards,” “downwards,” “side-to- side,” “left-to-right,” “right-to-left,” “top-to-bottom,” “bottom-to-top,” “top,” “bottom,” “bottom-up,” “top-down,” etc., are for the purpose of illustration only and do not limit the specific orientation or location of the structure described above.

[0104] In several embodiments, while different steps, processes, and procedures are described as appearing as distinct acts, one or more of the steps, one or more of the processes, and / or one or more of the procedures may also be performed in different orders, simultaneously and / or sequentially. In several embodiments, the steps, processes, and / or procedures may be merged into one or more steps, processes and / or procedures.

[0105] In several embodiments, one or more of the operational steps in each embodiment may be omitted. Moreover, in some instances, some features of the present disclosure may be employed without a corresponding use of the other features. Moreover, one or more of the embodiments disclosed above, or variations thereof, may be combined in whole or in part with any one or more of the other embodiments described above, or variations thereof.

[0106] Although several embodiments have been described in detail above, the embodiments described are illustrative only and are not limiting, and those skilled in the art will readily appreciate that many other modifications, changes and / or substitutions are possible in the embodiments without materially departing from the novel teachings and advantages of the present disclosure. Accordingly, all such modifications, changes, and / or substitutions are intended to be included within the scope of this disclosure as defined in the following claims. In the claims, any means-plus-function clauses are intended to cover the structures described herein as performing the recited function andAttorney Docket No. 70803.3WO01Customer No. 27683 not only structural equivalents, but also equivalent structures. Moreover, it is the express intention of the applicant not to invoke 35 U.S.C. § 1 12(f) for any limitations of any of the claims herein, except for those in which the claim expressly uses the word “means” together with an associated function.

Claims

Attorney Docket No. 70803.3WO01Customer No. 27683ClaimsWhat is claimed is:1 . An armor apparatus, comprising: a first layer including a ceramic and / or a first titanium alloy; a plate backer connected to the first layer; and a second layer connected to the first layer and the plate backer, the second layer including a second titanium alloy; wherein the second layer is positioned between the first layer and the plate backer.

2. The armor apparatus of claim 1 , wherein the first layer includes the first titanium alloy; and wherein the armor apparatus further comprises: a doped layer of tungsten tetraboride (WB4) positioned between the first layer including the first titanium alloy and the second layer including the second titanium alloy; a doped layer of boron carbide (B4C) and / or silicon carbide (SiC) positioned between the doped layer of tungsten tetraboride (WB4) and the second layer including the second titanium alloy; and a third layer including a third titanium alloy and positioned between the doped layer of boron carbide (B4C) and / or silicon carbide (SiC) and the second layer including the second titanium alloy.

3. The armor apparatus of claim 2, wherein the first titanium alloy of the first layer includes titanium (Ti), aluminum (Al), and Vanadium (V), and the first titanium alloy is Ti-6AI-4V (“Ti64”); wherein the first titanium alloy (“Ti64”) is doped with titanium carbide (TiC) and / or titanium boride (TiB);Attorney Docket No. 70803.3WO01Customer No. 27683 wherein the tungsten tetraboride (WB4) is doped with one or more of the following: Lanthanum (La), Yttrium (Y), Gadolinium (Gd), Terbium (Tb), Dysprosium (Dy), Holmium (Ho), Erbium (Er), Titanium (Ti), Vanadium (V), Chromium (Cr), Magnesium (Mg), Scandium (Sc), Zirconium (Zr); wherein the second titanium alloy of the second layer, which is positioned between the first layer and the plate backer, includes a Ti-6AI-4V (“TI64”) alloy; wherein the third layer, which is positioned between the doped layer of boron carbide (B4C) and / or silicon carbide (SiC) and the second layer including the second titanium alloy, includes titanium carbide (TiC) and / or titanium boride (TiB); wherein the third layer includes a TiC-doped Ti-6AI-4V (“Ti64”) alloy and / or a TiB- doped Ti-6AI-4V (“Ti64”) alloy; wherein the plate backer includes a spall shield layer; and wherein the spall shield layer includes ultra-high-molecular-weight polyethylene (UHMWPE).

4. The armor apparatus of claim 3, wherein one or more of the first layer including the first titanium alloy, the second layer including the second titanium alloy, and the third layer including the third titanium alloy, is or are manufactured by a method, the method comprising: manufacturing a base Ti-6AI-4V (“Ti64”) alloy, comprising mixing titanium input(s) with 60AI-40V by weight, the titanium input(s) including titanium hydride (TiH2); mixing the base Ti-6AI-4V (“Ti64”) alloy with titanium carbide (TiC) and / or titanium boride (TiB), up to 40% by weight, to produce a mixed alloy; pressing the mixed alloy into form; and sintering the pressed alloy using electric field assisted sintering (EFAS) and / or continuous electric field assisted sintering (CEFAS).Attorney Docket No. 70803.3WO01Customer No. 276835. The amor apparatus of claim 3, wherein the armor apparatus is a main battle tank (MBT) armor apparatus; and wherein the first layer, the second layer, the plate backer, the third layer, the doped layer of tungsten tetraboride (WB4), and the doped layer of boron carbide (B4C) and / or silicon carbide (SiC), are configured to be connected to, or part of, a battle tank.

6. The armor apparatus of claim 3, further comprising: a first carbon nanotube layer positioned between the doped layer of tungsten tetraboride (WB4) and the doped layer of boron carbide (B4C) and / or silicon carbide (SiC); and / or a second carbon nanotube layer positioned between the doped layer of boron carbide (B4C) and / or silicon carbide (SiC) and the third layer, which includes the TiC-doped TI-6AI-4V (“TI64”) alloy and / or the TiB-doped Ti- 6AI-4V (“Ti64”) alloy, so that the doped layer of boron carbide (B4C) and / or silicon carbide (SiC) is positioned between the first and second carbon nanotube layers.

7. The armor apparatus of claim 3, further comprising: another layer positioned between the doped layer of boron carbide (B4C) and / or silicon carbide (SiC) and the third layer including the TiC-doped Ti-6AI-4V (“Ti64”) alloy and / or the TiB-doped Ti-6AI-4V (“Ti64”) alloy; wherein the doped layer of tungsten tetraboride (WB4) is positioned between the first layer and the doped layer of boron carbide (B4C) and / or silicon carbide (SiC); wherein the doped layer of boron carbide (B4C) and / or silicon carbide (SiC) is positioned between the doped layer of tungsten tetraboride (WB4) and the another layer; wherein the third layer is positioned between the another layer and the second layer; andAttorney Docket No. 70803.3WO01Customer No. 27683 wherein the second layer is positioned between the third layer and the plate backer including the spall shield layer.

8. The armor apparatus of claim 1 , wherein the first layer includes the first titanium alloy; wherein the first titanium alloy of the first layer includes titanium (Ti), aluminum (Al), and Vanadium (V), and the first titanium alloy is Ti-6AI-4V (“Ti64”); wherein the first titanium alloy (“Ti64”) is doped with titanium carbide (TiC) and / or titanium boride (TiB); and wherein the armor apparatus further comprises: a doped layer of tungsten tetraboride (WB4) positioned between the first layer including the first titanium alloy and the second layer including the second titanium alloy; and a doped layer of boron carbide (B4C) and / or silicon carbide (SiC) positioned between the doped layer of tungsten tetraboride (WB4) and the second layer including the second titanium alloy.9 The armor apparatus of claim 8, wherein a combination of at least a portion of the armor apparatus is manufactured by a method; wherein the combination is a combination of at least the following: the first layer including the first titanium alloy (“Ti64”) doped with titanium carbide (TiC) and / or titanium boride (TiB); the doped layer of tungsten tetraboride (WB4); and the doped layer of boron carbide (B4C) and / or silicon carbide (SiC); and wherein the method, by which the combination is manufactured, comprises: simultaneously pressing the combination of at least the first layer including the first titanium alloy (“Ti64”) doped with titanium carbide (TiC) and / or titanium boride (TiB), the doped layer of tungsten tetraborideAttorney Docket No. 70803.3WO01Customer No. 27683(WB4), and the doped layer of boron carbide (B4C) and / or silicon carbide (SiC); and sintering the simultaneous pressed combination of at least the first layer including the first titanium alloy (“Ti64”) doped with titanium carbide (TiC) and / or titanium boride (TiB), the doped layer of tungsten tetraboride (WB4), and the doped layer of boron carbide (B4C) and / or silicon carbide (SiC).

10. The armor apparatus of claim 9, wherein sintering the simultaneous pressed combination comprises: sintering the simultaneous pressed combination using an electric field assisted sintering (EFAS) system; and / or sintering the simultaneous pressed combination using a continuous electric field assisted sintering (CEFAS) system.1 1 . The armor apparatus of claim 1 , wherein the first layer includes the ceramic, which comprises a doped layer of tungsten tetraboride (WB4); wherein the armor apparatus further comprises: a doped layer of boron carbide (B4C) and / or silicon carbide (SiC) positioned between the doped layer of tungsten tetraboride (WB4) and the second layer including the second titanium alloy; and a third layer including a third titanium alloy and positioned between the doped layer of boron carbide (B4C) and / or silicon carbide (SiC) and the second layer including the second titanium alloy; wherein the tungsten tetraboride (WB4) is doped with one or more of the following: Lanthanum (La), Yttrium (Y), Gadolinium (Gd), Terbium (Tb), Dysprosium (Dy), Holmium (Ho), Erbium (Er), Titanium (Ti), Vanadium (V), Chromium (Cr), Magnesium (Mg), Scandium (Sc), Zirconium (Zr);Attorney Docket No. 70803.3WO01Customer No. 27683 wherein the second titanium alloy of the second layer, which is positioned between the first layer and the plate backer, includes a Ti-6AI-4V (“Ti64”) alloy; wherein the third layer, which is positioned between the doped layer of boron carbide (B4C) and / or silicon carbide (SiC) and the second layer including the second titanium alloy, includes titanium carbide (TiC) and / or titanium boride (TiB); wherein the third layer includes a TiC-doped Ti-6AI-4V (“Ti64”) alloy and / or a TiB- doped Ti-6AI-4V (“Ti64”) alloy.

12. The armor apparatus of claim 11 , wherein the plate backer includes a spall shield layer; wherein the spall shield layer includes ultra-high-molecular-weight polyethylene (UHMWPE); and wherein the armor apparatus further comprises: a first carbon nanotube layer positioned between the doped layer of tungsten tetraboride (WB4) and the doped layer of boron carbide (B4C) and / or silicon carbide (SiC); and / or a second carbon nanotube layer positioned between the doped layer of boron carbide (B4C) and / or silicon carbide (SiC) and the third layer, which includes the TiC-doped Ti-6AI-4V (“Ti64”) alloy and / or the TiB-doped Ti-6AI-4V (“Ti64”) alloy, so that the doped layer of boron carbide (B4C) and / or silicon carbide (SiC) is positioned between the first and second carbon nanotube layers.

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