High performance polymer based satellite deployer

Abstract

The present disclosure relates to a satellite deployer (100) made of a high performance polymer (HPP), said deployer (100) comprising an outer structure (102), a lid (104), and at least one access panel (106), wherein at least one satellite (108) is configured within the outer structure (102), said at least one satellite (108) being operatively coupled with an ejector plate (110) to enable said at least one satellite (108) to be launched from said deployer (100). The satellite deployer of the present disclosure has lighter weight, cost effective and a long shelf life.

Description

[0001] HIGH PERFORMANCE POLYMER BASED SATELLITE DEPLOYER

[0002] FIELD OF INVENTION

[0003]

[0001] The present disclosure relates to the field of aerospace engineering. Particularly, the present disclosure relates to a satellite deployer made of a high performance polymer (HPP).

[0004] BACKGROUND OF THE INVENTION

[0005]

[0002] Background description includes information that may be useful in understanding the present invention. It is not an admission that any of the information provided herein is prior art or relevant to the presently claimed invention or that any publication specifically or implicitly referenced is prior art.

[0006]

[0003] In the past years, the number of satellite launched to orbit was very few but the scenario has been changed now. Around 300 to 400 satellites are launched every year now and this number will be increasing day by day.

[0007]

[0004] Metal satellite deployers began to gain prominence in the 1960s and 1970s, when early space missions utilized metal components for their durability and strength. Initially, these deployers were simple, often spring-loaded systems designed to eject satellites into orbit. As technology progressed, metal deployers evolved to incorporate more sophisticated mechanisms, including pyrotechnics and precise control systems. The use of metals like aluminum allowed for robust, reliable structures that could withstand the rigors of space launch and deployment. Metal satellite deployers, while robust and widely used but have several drawbacks also. Metals often have higher coefficients of thermal expansion. The metal deployers have higher weight. Metals are susceptible to corrosion and oxidation so these deployers can also not be stored for a longer period of time in the shelves. Metals have high thermal conductivity, which can lead to rapid heat transfer and potential thermal stresses. This can be problematic in space missions where thermal control is critical. Fabricating metal deployers, especially those with complex geometries or precision requirements, can be challenging and costly. The manufacturing processes can involve extensive machining and finishing, adding to the overall cost. Repeated mechanical stress or vibrations during launch and deployment can lead to metal fatigue. This can result in failure if the metal is not properly designed or if it undergoes repeated stress cycles. Metals are even less flexible.

[0008]

[0005] US11,814,194 B2 discloses a satellite deployer including a dispenser body defining an interior cavity configured to receive a payload; and a composite guide rail comprising a groove configured to receive at least a portion of a payload, the composite guide rail having an orientation that substantially aligns a longitudinal axis of the groove with an ejection axis of the dispenser. The deployer of US11,814,194 B2 is made of aluminium.

[0009]

[0006] In view of the above, there is a need to develop a novel satellite deployer which will be more light weight, more readily available in shelves and cost-effective.

[0010] OBJECTS OF THE INVENTION

[0011]

[0007] The primary objective of the present disclosure is to provide a satellite deployer made of a high performance polymer (HPP).

[0012]

[0008] Another objective of the present disclosure is to provide a light weight satellite deployer.

[0013]

[0009] Another objective of the present disclosure is to develop a cost effective satellite deployer.

[0014]

[0010] Still another objective of the present disclosure is to develop a long shelf life satellite deployer.

[0015] [OH] Yet another objective of the present disclosure is to develop mass manufacturable satellite deployer with low manufacturing lead times.

[0016] SUMMARY OF THE INVENTION

[0017]

[0012] This summary is provided to introduce a selection of concepts in a simplified form that are further described below in Detailed Description section. This summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.

[0018]

[0013] The present disclosure relates to the field of aerospace engineering. Particularly, the present disclosure relates to a satellite deployer made of a high performance polymer (HPP).

[0019]

[0014] An aspect of the present disclosure relates to a satellite deployer (100) made of a high performance polymer (HPP), said deployer (100) comprising an outer structure (102), a lid (104), and at least one access panel (106), wherein at least one satellite (108) is configured within the outer structure (102), said at least one satellite (108) being operatively coupled with an ejector plate (110) to enable said at least one satellite (108) to be launched from said deployer (100).

[0020]

[0015] Various objects, features, aspects, and advantages of the present disclosure will become more apparent from the following detailed description of preferred embodiments, along with the accompanying drawing figures in which numerals represent features. BRIEF DESCRIPTION OF THE DRAWINGS

[0021]

[0016] The following drawings form part of the present specification and are included to further illustrate aspects of the present invention. The disclosure may be better understood by reference to the drawings in combination with the detailed description of the specific embodiments presented herein.

[0022]

[0017] Figure 1 illustrates different types CubeSat deployers made of high performance polymer (HPP).

[0023]

[0018] Figure 2 illustrates design architecture of the deployer (A) exploded view of 12U deployer in 4x3U configuration, (B) exploded view of 3U deployer.

[0024]

[0019] Figure 3 illustrates design of the deployer lid.

[0025]

[0020] Figure 4 illustrates (A) call out view of rail interface and Z-axis view of deployer with CubeSat (B) Spring options.

[0026]

[0021] Figure 5 illustrates modularity of the deployers.

[0027]

[0022] Figure 6 illustrates flexible mounting options (A) a payload adapter (116), and (B) a deck (118).

[0028]

[0023] Figure 7 illustrates (A) Electronics mounted on top surface of deployer (B) Electronics mounted inside the deployer under ejector plate and (C) connectors

[0024] Figure 8 illustrates a graph of weight reduction.

[0029]

[0025] Figure 9 illustrates a graph of deployer manufacturing cost reduction.

[0030]

[0026] Figure 10 illustrates a graph of launch cost savings.

[0031] DETAILED DESCRIPTION OF THE INVENTION

[0032]

[0027] The following is a detailed description of the embodiments of the disclosure. The embodiments are in such detail as to clearly communicate the disclosure. However, the amount of detail offered is not intended to limit the anticipated variations of embodiments; on the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the present disclosure as defined by the appended claims.

[0033]

[0028] All publications herein are incorporated by reference to the same extent as if each individual publication or patent application were specifically and individually indicated to be incorporated by reference. Where a definition or use of a term in an incorporated reference is inconsistent or contrary to the definition of that term provided herein, the definition of that term provided herein applies and the definition of that term in the reference does not apply.

[0029] Reference throughout this specification to “one embodiment” or “an embodiment” means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment. Thus, the appearances of the phrases “in one embodiment” or “in an embodiment” in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0034]

[0030] In some embodiments, numbers have been used for quantifying weights, percentages, ratios, and so forth, to describe and claim certain embodiments of the invention and are to be understood as being modified in some instances by the term “about.” Accordingly, in some embodiments, the numerical parameters set forth in the written description and attached claims are approximations that can vary depending upon the desired properties sought to be obtained by a particular embodiment. In some embodiments, the numerical parameters should be construed in light of the number of reported significant digits and by applying ordinary rounding techniques. Notwithstanding that the numerical ranges and parameters setting forth the broad scope of some embodiments of the invention are approximations, the numerical values set forth in the specific examples are reported as precisely as practicable.

[0035]

[0031] The numerical values presented in some embodiments of the invention may contain certain errors necessarily resulting from the standard deviation found in their respective testing measurements.

[0036]

[0032] Unless the context requires otherwise, throughout the specification which follows, the word “comprise” and variations thereof, such as “comprises” and “comprising” are to be construed in an open, inclusive sense that is as “including, but not limited to.”

[0037]

[0033] As used in the description herein and throughout the claims that follow, the meaning of “a,” “an,” and “the” includes plural reference unless the context clearly dictates otherwise. Also, as used in the description herein, the meaning of “in” includes “in” and “on” unless the context clearly dictates otherwise.

[0038]

[0034] The recitation of ranges of values herein is merely intended to serve as a shorthand method of referring individually to each value falling within the range. Unless otherwise indicated herein, each individual value is incorporated into the specification as if it were individually recited herein. Furthermore, the ranges defined throughout the specification include the end values as well, i.e., a range of 1 to 10 implies that both 1 and 10 are included in the range. For the avoidance of doubt, the applicant shall be entitled to any equivalents according to applicable law.

[0039]

[0035] All methods described herein can be performed in a suitable order unless otherwise indicated herein or otherwise clearly contradicted by context. The use of any and all examples or exemplary language (e.g., “such as”) provided with respect to certain embodiments herein is intended merely to better illuminate the invention and does not pose a limitation on the scope of the invention otherwise claimed. No language in the specification should be construed as indicating any non-claimed element essential to the practice of the invention.

[0040]

[0036] Groupings of alternative elements or embodiments of the invention disclosed herein are not to be construed as limitations. Each group member can be referred to and claimed individually or in any combination with other members of the group or other elements found herein. One or more members of a group can be included in or deleted from a group for reasons of convenience and / or patentability. When any such inclusion or deletion occurs, the specification is herein deemed to contain the group as modified.

[0041]

[0037] The description that follows and the embodiments described therein are provided by way of illustration of an example, or examples, of particular embodiments of the principles and aspects of the present disclosure. These examples are provided for the purposes of explanation, and not of limitation, of those principles and of the disclosure.

[0042]

[0038] It should also be appreciated that the present disclosure can be implemented in numerous ways, including as a system, a method or a device. In this specification, these implementations, or any other form that the invention may take, may be referred to as processes. In general, the order of the steps of the disclosed processes may be altered within the scope of the invention.

[0043]

[0039] The headings and abstract of the invention provided herein are for convenience only and do not interpret the scope or meaning of the embodiments.

[0044]

[0040] The following discussion provides many example embodiments of the inventive subject matter. Although each embodiment represents a single combination of inventive elements, the inventive subject matter is considered to include all possible combinations of the disclosed elements. Thus, if one embodiment comprises elements A, B, and C, and a second embodiment comprises elements B and D, then the inventive subject matter is also considered to include other remaining combinations of A, B, C, or D, even if not explicitly disclosed.

[0041] The term “or,” as used herein, is generally employed in its sense, including “and / or” unless the content clearly dictates otherwise.

[0045]

[0042] Various terms are used herein to the extent a term used is not defined below; it should be given the broadest definition persons in the pertinent art have given that term as reflected in printed publications and issued patents at the time of filing.

[0046]

[0043] An embodiment of the present disclosure is to provide a satellite deployer (100) made of a high performance polymer (HPP), said deployer (100) comprising an outer structure (102), a lid (104), and at least one access panel (106), wherein at least one satellite (108) is configured within the outer structure (102), said at least one satellite (108) being operatively coupled with an ejector plate (110) to enable said at least one satellite (108) to be launched from said deployer (100).

[0047]

[0044] In an embodiment, the lid (104) has an opening mechanism operatively coupled with an actuator, wherein upon a signal from said actuator, the opening mechanism opens the lid (104) to create an opening through which the said at least one satellite (108) is launched, and wherein upon a second signal from said actuator, said ejector plate (110) is actuated with a spring so as to launch the at least one satellite (108).

[0048]

[0045] In an embodiment, the deployer (100) further comprises at least one separator (112) configured to enable two or more satellites (108) to be positioned in partitions created through the deployment of the at least one separator (112) so as to enable multiple satellites (108) to be stowed in each partition and launched in a single go.

[0049]

[0046] In an embodiment, the structure and / or components of the deployer (100) are manufactured using any or a combination of an injection molding or an extrusion process.

[0050]

[0047] In an embodiment, the HPP is selected from any or a combination of polyether ether ketone (PEEK), polyetherketoneketone (PEKK), polyphenylene sulfide (PPS), polyamide imide (PAI), polyphenylsulfone (PPSU), polysulfone (PSU), poly(ether-sulfone) (PES).

[0051]

[0048] In an embodiment, the HPP has a density of less than 2 g / cm3and thermal conductivity of less than 1 W / mK.

[0052]

[0049] In an embodiment, the access panel is configured any or a combination of side(s) of the outer structure (102) or on the top of the outer structure (102).

[0053]

[0050] In an embodiment, the deployer comprises a rear structure (114) on opposite side of the lid (104).

[0054]

[0051] In an embodiment, the outer structure is unibody.

[0052] In an embodiment, the at least one satellite (108) is integrated and supported within the outer structure in a manner so as to keep the sliding friction there between to be around 0.2.

[0055]

[0053] In an embodiment, the satellite deployer (100) is mounted on any or a combination of a rocket, a payload adapter (116), and a deck (118).

[0056]

[0054] Different types of CubeSat deployers made of high performance polymer (HPP) are as shown in Figure 1. These CubeSat deployers are manufactured with carbon-fdled PEEK / PEKK / PPS / PAI / PPSU / PSU / PES through injection molding. Figure 1 shows CubeSat deployer 1U (100a), CubeSat deployer 3U (100b), CubeSat deployer 6U (100c), CubeSat deployer 12U (lOOd), CubeSat deployer 12U with 16U and 2 3U’s (100c), CubeSat deployer 16U (lOOf), CubeSat deployer 6U with 2 3U’s (lOOh), CubeSat deployer 12U with 4 3U’s (lOOi) and CubeSat deployer 12U (lOOj).

[0057]

[0055] The exploded view of 12U deployer in 4x3U configuration is as shown in Figure 2 (A) which has components including outer surface (102), lid (104) and access panel (106), ejector plate (110), separator (112). The satellite (108) is configured within the outer structure (102). The satellite (108) is connected to an ejector plate (110) to allow it to be launched from the deployer. Further, the exploded view of 3U deployer is as shown in Figure 2 (B) which has components including outer surface (102), lid (104) and access panel (106), rear structure (114). The satellite (108) is configured within the outer structure (102).

[0056] The lid is manufactured from high performance polymers such as PEEK / PEKK / PPS / PAI / PPSU / PSU / PES with access port in centre as shown in Figure 3. It is based on shape memory alloy (SMA) based release mechanism. Dissimilar materials (Al based CubeSat & HPP Deployer) ensure no cold-welding whereas it is typically observed with Al-Al contact with improper anodization. The sliding friction coefficient is given in Table 1 below. The design of the present disclosure prevents cold-welding, thereby reducing the probability of failure during critical mission phases. Usually CubeSats are guided along hard anodized rails with approximately 1.6-micron surface finish, as specified by CDS, which are integrated into the deployer's structure and constructed from PEEK / PEKK / PPS / PAI / PPSU / PSU / PES material. In the present disclosure, rails are an integral part of the HPP structure and is achieved in one shot through injection molding. The area of contact can be seen in Figure 4 (A). The surface finish and dimensional accuracy of the PEEK rails are achieved through the precision manufacturing of the mold, the application of an appropriate coating on the mold's corresponding surface, and the proper ejection of the deployer from the mold. Table 1: Sliding friction coefficient of metal vs HPP.

[0058]

[0057] The lid activation and ejector plate activation occur through SMA pin-puller based mechanisms. These mechanisms are resettable for easy ground operations and testing. Lid opening is confirmed through a low-cost feedback mechanism utilizing a micro limit switch. Dual torsion hinges provide the necessary activation force for the lid upon receiving the release command. The different spring options can be used such as flat wire coil spring, coil spring, wave spring as shown in Figure 4 (C). In case of constant force spring, ejection velocity of CubeSat can be better estimated with the trade-off of deployer size.

[0059]

[0058] The CubeSat deployer 6U (100c), CubeSat deployer 12U (lOOd), CubeSat deployer 16U (lOOf) can be fitted with separately manufactured partitions. These get assembled into the standard deployers to provide modularity. The partitions will also be injection molded or extruded from PEEK / PEKK / PPS / PAI / PPSU / PSU / PES material. Same material ensures minimal effect of thermal expansion. Partitions must be assembled by fixturing mock-up CubeSats to eliminate assembly tolerances. The modularity in CubeSat deployer 12U (lOOd) is as shown in Figure 5.

[0060]

[0059] The flexible mounting option of deployer is also available. The CubeSat deployer 12U (lOOd) with flange mount on the payload adapter (116) is as shown in Figure 6 (A) whereas the CubeSat deployer 12U (lOOd) with base mount on the deck (118) is as shown in Figure 6 (B).

[0061]

[0060] Telemetry & Tele-Command (TTC) board (electronic module) mounted on top surface of deployer is as shown in Figure 7 (A) whereas the electronics mounted inside the deployer under ejector plate is as shown in Figure 7 (B). The dual RS485 channels ensure a redundant daisy-chain setup of deployers on a launch vehicle. Each TTC board is equipped with 16MB of persistent storage, enabling the collection and storage of telemetry data. It utilizes ECC-based memory to manage data corruption caused by any bit flips, ensuring reliable operation and data integrity and it is compliant with MIL-416G standards for EMI / EMC. The connector interface for power and communications is as shown in Figure 7 (C).

[0062]

[0061] The deployers of the present disclosure are manufactured using injection molding process but can also be prepared by extrusion process. The injection molding process provides significant design freedom to combine multiple parts into a single part for uniform material properties, high stiffness and high dimensional accuracy. The key features of the injection molding process includes i) Standard injection molding machines of 100 to 400-ton range can be used, ii) Due to the high working temperature (350 - 400°C) and abrasive nature of carbon fibre infused PEEK / PEKK materials, molds will be manufactured from P20 or H13 tool steels, iii) Mold surfaces must be maintained at uniform temperature (around 200°C) to maintain crystalline structure and uniform temperature distribution across all areas, iv) For critical surfaces of the deployer, like the CubeSat rail interfaces, the molds must be coated with Diamond like carbon (DLC) or Titanium nitride (TiN) for wear resistance, surface finish and wear resistance, v) PEEK / PEKK raw material must be dried to a moisture content of less than 0.02% by keeping material in an oven for 4-6 hours at 160°C, before molding, vi) Shrinkage rate of carbon fibre filled PEEK / PEKK is lower than unfilled variants - molds design considers for the shrinkage rates provided by manufacturers, vii) Manufacturing must be done in a clean room environment to avoid any impurities.

[0063]

[0062] With the recommended storage and handling practices, the deployers of the present disclosure have a lifetime of 5-10 years. Storage and handling conditions includes i) Upon production, the deployers clean with solvents such as IPA, acetone or dry ice, ii) Deployers of the present disclosure are stored in a clean and dry environment to prevent contamination, iii) Exposure to dirt, moisture, sunlight must be minimized, iv) Storage facilities maintained at room temperature (25°C) with humidity control ensure a long shelf life, v) Vacuum bagged Polyethylene bags, foam inserts are used for storage and during transport and vi) Clean gloves and tools are used during handling to prevent oils, dirt, or moisture from transferring to the deployers.

[0064]

[0063] While the foregoing describes various embodiments of the disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof. The invention is not limited to the described embodiments, versions or examples, which are included to enable a person having ordinary skill in the art to make and use the invention when combined with information and knowledge available to the person skilled in the art.

[0065] EXAMPLES

[0066]

[0064] The present invention is further explained in the form of the following examples. However, it is to be understood that the following examples are merely illustrative and are not to be taken as limitations upon the scope of the invention.

[0067] Example 1

[0068]

[0065] A satellite deployer was prepared of PEEK. This deployer has an outer structure, a lid, and at least one access panel. Inside the outer structure, there's space for one or more satellites. Each satellite is attached to an ejector plate that helps launch it out of the deployer. The various properties of the PEEK are given in Table 2.

[0069] Example 2

[0070]

[0066] A satellite deployer was prepared of PEKK. This deployer has an outer structure, a lid, and at least one access panel. Inside the outer structure, there's space for one or more satellites. Each satellite is attached to an ejector plate that helps launch it out of the deployer. The various properties of the PEKK are given in Table 2.

[0071] Example 3 (Comparative)

[0072]

[0067] A satellite deployer was prepared of aluminium 6061. This deployer has an outer structure, a lid, and at least one access panel. Inside the outer structure, there's space for one or more satellites. Each satellite is attached to an ejector plate that helps launch it out of the deployer. The various properties of the aluminium 6061 are given in Table 2.

[0073] Table 2: Properties of PEEK, PEKK and aluminium 6061.

[0074]

[0068] It is observed from the Table 2 that PEEK and PEKK have nearly half the density of aluminum 6061, allowing for a significant weight reduction of approximately 50%. PEEK and PEKK have high strength-weight ratio compared with aluminium 6061 enables design flexibility. PEEK and PEKK have Higher vibration damping about lOOx compared to Aluminium 6061 provides safety for stowed CubeSats. High radiation tolerance enables deployers to function in deep space environments. The low outgassing property of PEEK and PEKK ensure ultra-high vacuum compatibility. The thermal insulation property ensures minimal impact of external environment on stowed CubeSats. These polymers (PEEK and PEKK) have space heritage and have been used for long duration satellite missions.

[0075]

[0069] The weight of the existing deployers (1U, 3U, 6U and 12U) and the HPP deployer (1U, 3U, 6U and 12U) are given in Figure 8 indicating a drastic weight reduction when deployers are made of HPP.

[0076]

[0070] The cost of the existing deployers (1U, 3U, 6U and 12U) and the HPP deployer (1U, 3U, 6U and 12U) are given in Figure 9 indicating a significant manufacturing cost reduction when deployers are made of HPP. The cost savings of different HPP deployers (1U, 3U, 6U, 12U and 16U) is also given in Figure 10.

[0077] ADVANTAGES OF THE INVENTION

[0078]

[0071] The satellite deployers of the present disclosure have significant weight reduction about 50 % as compared to deployer made of metal.

[0079]

[0072] The satellite deployers of the present disclosure have significant cost effective as compared to deployer made of metal. Since the 3U and 6U (together volume to 55% of CubeSats launched) would be available at $12000. It would be 3x lower than any other Deployer in the market. This would be a disruptive pricing globally.

[0080]

[0073] This pricing would enable users to not just buy Flight Model for final integration, but two units at $24000 for qualification & flight both.

[0081]

[0074] The satellite deployers of the present disclosure have a long shelflife.

[0082]

[0075] The satellite deployers made of high performance polymer of the present disclosure ensure minimal friction and reduced chances of launch failures because of friction between Cube Sat rails & deployer rails and ensuring improved deployment reliability.

[0083]

[0076] PEEK would also provide thermal insulation to the Cube Sat inside the deployer, ensuring it can stay in the deployer for a longer duration.

Claims

We Claim:

1. A satellite deployer (100) made of a high performance polymer (HPP), said deployer (100) comprising an outer structure (102), a lid (104), and at least one access panel (106), wherein at least one satellite (108) is configured within the outer structure (102), said at least one satellite (108) being operatively coupled with an ejector plate (110) to enable said at least one satellite (108) to be launched from said deployer (100).

2. The satellite deployer (100) as claimed in claim 1, wherein the lid (104) has an opening mechanism operatively coupled with an actuator, wherein upon a signal from said actuator, the opening mechanism opens the lid (104) to create an opening through which the said at least one satellite (108) is launched, and wherein upon a second signal from said actuator, said ejector plate (110) is actuated with a spring so as to launch the at least one satellite (108).

3. The satellite deployer (100) as claimed in claim 1, wherein the deployer (100) further comprises at least one separator (112) configured to enable two or more satellites (108) to be positioned in partitions created through the deployment of the at least one separator (112) so as to enable multiple satellites (108) to be stowed in each partition and launched in a single go-4. The satellite deployer (100) as claimed in claim 1, wherein the structure and / or components of the deployer (100) are manufactured using any or a combination of an injection molding or an extrusion process.

5. The satellite deployer (100) as claimed in claim 1, wherein the HPP is selected from any or a combination of polyether ether ketone (PEEK), polyetherketoneketone (PEKK), polyphenylene sulfide (PPS), polyamide imide (PAI), polyphenylsulfone (PPSU), polysulfone (PSU), poly(ether-sulfone) (PES).

6. The satellite deployer (100) as claimed in claim 1, wherein the HPP has a density of less than 2 g / cm3 and thermal conductivity of less than 1 W / mK.

7. The satellite deployer (100) as claimed in claim 1, wherein the access panel is configured any or a combination of side(s) of the outer structure (102) or on the top of the outer structure (102).

8. The satellite deployer (100) as claimed in claim 1, wherein the deployer comprises a rear structure (114) on opposite side of the lid (104).

9. The satellite deployer (100) as claimed in claim 1, wherein the outer structure is unibody.

10. The satellite deployer (100) as claimed in claim 1, wherein the at least one satellite (108) is integrated and supported within the outer structure in a manner so as to keep the sliding friction there between to be around 0.2.

11. The satellite deployer (100) as claimed in claim 1, wherein the satellite deployer (100) is mounted on any or a combination of a rocket, a payload adapter (116), and a deck (118).

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