Coating compositions and solvent-assisted degradable coatings formed therefrom

Abstract

Disclosed is a composition comprising a first component comprising a polyisocyanate; a second component comprising a polyol; an accelerator; and a filler, wherein the polyisocyanate and / or the polyol comprise a polysulfide linkage. Also disclosed is a composition comprising: a first component comprising a polyisocyanate; a second component comprising a polyol; an accelerator; and an amine, wherein the polyisocyanate and / or the polyol comprises a polysulfide linkage. The present disclosure is also directed to methods and systems for treating a substrate with a composition disclosed herein and to substrates comprising a layer formed from a composition disclosed herein.

Description

COATING COMPOSITIONS AND SOLVENT-ASSISTED DEGRADABLE COATINGS FORMED THEREFROMGOVERNMENT CONTRACT

[0001] This disclosure was made with Government support under Government Contract No. NCMS FY2021 Adhesive Perf. Improvements Phase 2 142120 awarded by GVSC. The United States Government may have certain rights in this disclosure.CROSS-REFERENCE TO RELATED APPLICATION

[0002] This application claims the benefit of U.S. Provisional Patent Application Serial No. 63 / 690,192 filed on September 3, 2024, entitled “Coating Compositions and Solvent- Assisted Degradable Coatings Formed Therefrom,” incorporated herein by reference in its entirety.FIELD

[0003] The present disclosure relates to curable coating compositions and solvent- assisted degradable coatings formed therefrom.BACKGROUND

[0004] Coating compositions, including sealants and adhesives, are utilized in a wide variety of applications to treat a variety of substrates or to bond together two or more substrate materials.SUMMARY

[0005] Disclosed herein are compositions comprising: a first component comprising a polyisocyanate; a second component comprising a first polyol; an accelerator; and a filler; wherein the polyisocyanate and / or the first polyol comprise a polysulfide linkage.

[0006] Also disclosed herein are compositions comprising: a first component comprising a polyisocyanate; a second component comprising a first polyol; an accelerator; and an amine; wherein the polyisocyanate and / or the first polyol comprises a polysulfide linkage.

[0007] Also disclosed herein are methods of coating a substrate comprising contacting a portion of a surface of the substrate with any of the compositions disclosed herein.

[0008] Also disclosed herein are methods of foiming an article comprising extruding or molding any of the compositions disclosed herein.

[0009] Also disclosed herein are substrates coated with a solvent-assisted degradable coating formed from any of the compositions disclosed herein.

[0010] Also disclosed herein are batteries comprising a battery cell and any of the compositions disclosed herein in a cured state.BRIEF DESCRIPTION OF THE DRAWINGS

[0011] FIG. 1 is a schematic of a top-down view of cylindrical battery cells.

[0012] FIG. 2 is a schematic of an exploded isometric view of an array of prismatic battery cells.

[0013] FIG. 3 is a schematic of a front view of an array of pouch battery cells.

[0014] FIG. 4 is a schematic of an isometric view of cylindrical cells positioned in a battery module.

[0015] FIG. 5 is a schematic of an exploded perspective view of a battery pack comprising multiple battery cells.

[0016] FIG. 6 is a schematic of an isometric view of (A) a battery cell, (B) a battery module, and (C) a battery pack.

[0017] FIG. 7 is a schematic of a perspective view of a battery pack.

[0018] FIG. 8 is a schematic of a cell to battery pack configuration.

[0019] FIG. 9 is a schematic of an isometric cut-out view of a cell to chassis battery assembly.

[0020] FIG. 10 is a bar graph of lap shear strength results of adhesives comprising varying amounts of disulfide content and fillers before and after degradation in various solvent systems over a thirty-minute period.

[0021] FIG. 11 is a bar graph of lap shear strength results of adhesives comprising varying amounts of disulfide content without filler before and after degradation in various solvent systems over a thirty-minute period.DETAILED DESCRIPTION

[0022] The present disclosure is directed to a composition comprising, or consisting essentially of, or consisting of, a first component and a second component. The first component may comprise, or consist essentially of, or consist of, a polyisocyanate. The second component may comprise, or consist essentially of, or consist of, a first polyol. The polyisocyanate and / or the first polyol may comprise a polysulfide linkage. As used herein, “polysulfide linkage” refers to the structure R-Sn-R’, wherein R and R’ may independently comprise a multivalent alkyl group, a multivalent (cyclo)alkyl group, an aromatic group, a urethane linkage, a urea linkage, anether linkage, or a heteroatom and n > 2. As used herein, “multivalent” means having a valence of two or more. The composition may further comprise a filler in the first component, the second component, and / or a third component. The composition may further comprise an amine and / or an accelerator in the second component and / or the third component. When cured, the coating compositions may form a solvent-assisted degradable coating. As used herein with respect to components, reference to “first,” “second,” “third,” etc., is for convenience only and does not refer to order of addition to the composition or the like. Furthermore, this language is not intended to be limiting and does not exclude the possibility of the composition comprising more than three components.Polyisocyanate

[0023] The first component disclosed herein may comprise, or consist essentially of, or consist of, a polyisocyanate. As used herein, “polyisocyanate” refers to a compound comprising more than one isocyanate functional group (-NCO). As used herein, the term “polyisocyanate” includes diisocyanates. As used herein, “diisocyanate” refers to a chemical compoumd comprising two isocyanate functional groups. As such, the polyisocyanate may comprise a diisocyanate and / or a polyisocyanate comprising more than two isocyanate functional groups.

[0024] The polyisocyanate may have an average isocyanate functionality of greater than 1, such as at least 1.5, such as at least 2. The polyisocyanate may have an average isocyanate functionality of no more than 6, such as no more than 5, such as no more than 3. The polyisocyanate may have an average isocyanate functionality of greater than 1 to 6, such as 1.5 to 5, such as 2 to 3.

[0025] The composition may be substantially free, essentially free, or completely free, of a monofunctional isocyanate. As used herein, “monofunctional isocyanate” refers to a polymer comprising an average isocyanate functionality of greater than zero to one.

[0026] Polyisocyanates that may be used in the compositions disclosed herein may comprise linear, branched, cyclic, aliphatic, and / or aromatic isocyanates.

[0027] Suitable aliphatic polyisocyanates include (i) alkylene polyisocyanates, such as; trimethylene diisocyanate; tetramethylene diisocyanate, such as 1,4-tetramethylene diisocyanate; pentamethylene diisocyanate, such as 1,5 -pentamethylene diisocyanate and 2-methyl-l,5- pentamethylene diisocyanate; hexamethylene diisocyanate (“HDI”), such as 1,6-hexamethylene diisocyanate and 2,2,4- and 2,4,4-trimethylhexamethylene diisocyanate, or mixtures thereof;heptamethylene diisocyanate, such as 1 ,7-heptamethylene diisocyanate; propylene diisocyanate, such as 1 ,2-propylcnc diisocyanatc; butylene diisocyanatc, such as 1 ,2-butylcnc diisocyanatc,2.3-butylene diisocyanate, 1,3-butylene diisocyanate, and 1,4-butylene diisocyanate; ethylene diisocyanate; decamethylene diisocyanate, such as 1,10-decamethylene diisocyanate; ethylidene diisocyanate; butylidene diisocyanate; and hexamethylene diisocyanate (“HD I”). Aliphatic polyisocyanates may also include (ii) cycloalkylene isocyanates, such as: cyclopentane diisocyanate, such as 1,3-cyclopentane diisocyanate; cyclohexane diisocyanate, such as 1,4- cyclohexane diisocyanate, 1,2-cyclohexane diisocyanate, isophorone diisocyanate (“IPDI”), IPDI trimer (commercially available as Desmodur® Z 4470 SN); methylene bis(4- cyclohexylisocyanate) (“HMDI”); polymeric methylene diphenyl diisocyanate (“MDI”); and mixed aralkyl diisocyanates such as tetramethylxylyl diisocyanates, such as metatetramethylxylylene diisocyanate (commercially available as TMXDI® from Allnex SA). Dimers, trimers, oligomers, and polymers of the above-mentioned polyisocyanates also may be used as the cyclotrimer of 1,6 hexamethylene diisocyanate (also known as the isocyanate trimer of HDI, commercially available as Desmodur N3300 (Covestro)).

[0028] Aromatic polyisocyanates may include (i) arylene isocyanates, such as: phenylene diisocyanate, such as m-phenylene diisocyanate, p-phenylene diisocyanate, and chlorophenylene2.4-diisocyanate; naphthalene diisocyanate, such as 1,5 -naphthalene diisocyanate and 1,4- naphthalene diisocyanate. Aromatic polyisocyanates may also include (ii) alkarylene polyisocyanates, such as: methylene-interrupted aromatic diisocyanates, such as 4, d’diphenylene methane diisocyanate (“MDI”), and alkylated analogs such as 3, 3’-dimethyl-4, d’diphenylmethane diisocyanate, and polymeric methylenediphenyl diisocyanate; toluene diisocyanate (“TDI”), such as 2,4-tolylene or 2,6-tolylene diisocyanate, or mixtures thereof; bitoluene diisocyanates; and 4,4-toluidine diisocyanate; dianisidine diisocyanate; xylylene diisocyanate; and other alkylated benzene diisocyanates.

[0029] Polyisocyanates may also include: triisocyanates, such as triphenyl methane- 4, 4’, 4” -triisocyanate, 1,3,5-triisocyanato benzene, and 2,4,6-triisocyanato toluene; tetraoisocyanates, such as 4,4’ -diphenyldimethyl methane-2,2’,5,5’-tetraoisocyanate; and polymerized polyisocyanates, such as tolylene diisocyanate dimers, trimers, and the like.

[0030] The polyisocyanate may comprise at least one functional group in addition to the isocyanate functional groups and optionally the polysulfide linkage.

[0031] The polyisocyanate may have an isocyanate equivalent weight of at least 100 g / cq, such as at least 150 g / cq. The polyisocyanatc may have an isocyanate equivalent weight of no more than 1,500 g / eq, such as no more than 500 g / eq. The polyisocyanate may have an isocyanate equivalent weight of 100 g / eq to 1,500 g / eq, such as 150 g / eq to 500 g / eq. As used herein, “isocyanate equivalent weight” refers to the total weight of isocyanate-containing components divided by the molar equivalents of isocyanate functionality. The value may be determined from the isocyanate content as measured in accordance with ASTM D2572-19.

[0032] The polyisocyanate may comprise a polysulfide linkage. The polysulfide linkage may be present in the backbone of the isocyanate. As used herein, “backbone” refers to the longest series of covalently bound atoms which forms the continuous chain of a polymer.

[0033] The polyisocyanate comprising the polysulfide linkage may comprise a reaction product of reactants comprising (i) an isocyanate-containing compound and (ii) a polysulfide linkage-containing compound.

[0034] Any suitable isocyanate-containing compounds may be used, including but not limited to any of the polyisocyanates disclosed above.

[0035] Any suitable poly sulfide linkage-containing compounds that is reactive with the isocyanate-containing compound may be used including, for example, 2-hydroxyethyl disulfide, 3,3 ’-dithiodipropionic acid, ethylene-2, 2’-bis(dithio)bis(ethanol), 4-aminophenyl disulfide, 2- aminophenyl disulfide, dihydroxydiphenyl disulfide, 2,2’ -dithiobenzoic acid, polysulfide (for example, polysulfides available as Thioplast G, such as Thioplast G4, and Thioplast EPS, such as Thioplast EPS 25), all commercially available from Nouryon), 3,3’-tetrathiobis(propyl- triethoxysilane), and / or diallyl trisulfide.

[0036] The polysulfide linkage may be an aliphatic polysulfide linkage. As used herein, “aliphatic poly sulfide linkage” refers to a polysulfide linkage that comprises open chains and is completely free of aromatic rings. Aliphatic polysulfide linkages are less thermally labile than aromatic poly sulfide linkages (that is, poly sulfide linkages containing at least one aromatic ring).

[0037] The polyisocyanate may comprise the polysulfide linkage in an amount of at least 0.6% by weight based on total weight of isocyanate-containing compounds and active hydrogencontaining compounds, such as at least 0.8% by weight, such as at least 1.0% by weight, such as at least 1.2% by weight. The polyisocyanate may comprise the polysulfide linkage in an amount of no more than 25% by weight based on total weight of isocyanate-containing compounds andactive hydrogen-containing compounds, such as no more than 15% by weight, such as no more than 10% by weight, such as no more than 5% by weight. The poly isocyanate may comprise the poly sulfide linkage in an amount of 0.6% by weight to 25% by weight based on total weight of isocyanate-containing compounds and active hydrogen -containing compounds, such as 0.8% by weight to 15% by weight, such as 1.0% by weight to 10% by weight, such as 1.2% by weight to 5% by weight.Polyol

[0038] The second component of the present disclosure may comprise, or consist essentially of, or consist of, a first polyol. As used herein, “polyol” refers to a chemical compound comprising an average hydroxyl functionality of more than one. As used herein, the term “polyol” includes diols. As used herein, “diol” refers to a chemical compound comprising an average hydroxyl functionality of two. As such, the polyol may comprise a diol and / or a polyol having an average functionality of greater than two.

[0039] Non-limiting examples of suitable polyols include but are not limited to polyether polyols, polyester polyols, polycaprolactone polyols, polycarbonate polyols, polyurethane polyols, poly vinyl alcohols, polymers containing hydroxyl functional acrylates, polymers containing hydroxyl functional methacrylates, polymers containing allyl alcohols, and / or hydroxyl functional polybutadienes.

[0040] The first polyol may have an average hydroxyl functionality of more than 1 , such as at least 2. The first polyol may have an average hydroxyl functionality of no more than 5, such as no more than 4, such as no more than 3. The first polyol may have an average hydroxyl functionality of more than 1 to 5, such as 2 to 4, such as 2 to 3.

[0041] The first polyol may have a hydroxyl equivalent weight of at least 50 g / eq, such as at least 75 g / eq. The first polyol may have a hydroxyl equivalent weight of no more than 2,500 g / eq, such as no more than 500 g / eq. The first polyol may have a hydroxyl equivalent weight of 50 g / eq to 2,500 g / eq, such as 75 g / eq to 500 g / eq. As used herein, “hydroxyl equivalent weight” refers to the total weight of hydroxyl-containing components divided by the molar equivalents of hydroxyl functionality, which may be determined in accordance with ASTM D4247-23.

[0042] The first polyol may comprise a polysulfide linkage. The first polyol may comprise a backbone comprising the polysulfide linkage. The first polyol comprising thepolysulfide linkage may comprise a reaction product of reactants comprising (i) a polyol reactant and (ii) a polysulfidc-linkagc containing compound. The polyol reactant may comprise any suitable polyol compound, including but not limited to the polyol compounds described herein. The polysulfide-linkage containing compound may comprise any suitable compound comprising a polysulfide linkage that is reactive with the polyol reactants, including but not limited to the polysulfide-linkage containing compounds disclosed herein.

[0043] The polysulfide linkage may be an aliphatic polysulfide linkage. As stated herein, aliphatic polysulfide linkages are less thermally labile than aromatic polysulfide linkages (that is, poly sulfide linkages containing at least one aromatic ring).

[0044] The first polyol may comprise the polysulfide linkage in an amount of at least 0.6% by weight based on total weight of isocyanate-containing compounds and active hydrogencontaining compounds, such as at least 0.8% by weight, such as at least 1.0% by weight, such as at least 1.2% by weight. The first polyol may comprise the polysulfide linkage in an amount of no more than 25% by weight based on total weight of isocyanate-containing compounds and active hydrogen-containing compounds, such as no more than 15% by weight, such as no more than 10% by weight, such as no more than 5% by weight. The first polyol may comprise the polysulfide linkage in an amount of 0.6% by weight to 25% by weight based on total weight of isocyanate-containing compounds and active hydrogen -containing compounds, such as 0.8% by weight to 15% by weight, such as 1.0% by weight to 10% by weight, such as 1.2% by weight to 5% by weight.

[0045] The compositions may further comprise a second polyol. When the first polyol comprises a polysulfide linkage, the second polyol may be substantially free, essentially free, or completely free, of a polysulfide linkage. As used herein, “substantially free” when referring to a polysulfide linkage means that the compound comprises the polysulfide linkage in an amount of no more than 0.01% by weight based on total weight of isocyanate-containing compounds and active hydrogen-containing compounds. As used herein, “essentially free” when referring to a polysulfide linkage means that the compound comprises the polysulfide linkage in an amount of no more than 0.005% by weight based on total weight of the isocyanate-containing compounds and active hydrogen-containing compounds. As used herein, “completely free” when referring to a polysulfide linkage means that the compound does not comprise a polysulfide linkage in a detectable amount using conventional measurement techniques.

[0046] The second polyol may have an average hydroxyl functionality of more than 1 , such as at least 2. The second polyol may have an average hydroxyl functionality of no more than 15, such as no more than 8. The second polyol may have an average hydroxyl functionality of more than 1 to 15, such as 2 to 8.

[0047] The second polyol may have a hydroxyl equivalent weight of at least 50 g / eq, such as at least 100 g / eq. The second polyol may have a hydroxyl equivalent weight of no more than 2,500 g / eq, such as no more than 500 g / eq. The second polyol may have a hydroxyl equivalent weight of 50 g / eq to 2,500 g / eq, such as 100 g / eq to 500 g / eq.

[0048] The second polyol may comprise a secondary polyol. As used herein, a “secondary polyol” is a polyol comprising secondary hydroxyl groups.Amine

[0049] The composition may optionally comprise an amine. The amine may be present in the second component, or a third or higher component.

[0050] The amine may comprise a primary amine and / or a secondary amine. The amine may include polyamines. As used herein, “polyamine” refers to a compound comprising more than one amine functional group. The polyamine may comprise a diamine. As used herein, “diamine” refers to an amine comprising more than one to two amine functional groups. The amine may comprise an aromatic amine and / or an aliphatic, such as a cycloaliphatic amine. Non-limiting examples of suitable amines may include aliphatic polyamines, such as but not limited to ethylamine, isomeric propylamines, butylamines, pentylamines, hexylamines, cyclohexylamine, ethylene diamine, 1 ,2-diaminopropane, 1.4-diaminobutane, 1,3- diaminopentane, 1,6-diaminohexane, 2-methyl-l,5-pentane diamine, 2,5-diamino-2,5- dimethylhexane, 2,2,4- and / or 2,4, 4-trimethyl- 1 ,6-diamino-hexane, 1,11 -diaminoundecane, 1,12- diaminododecane, 1,3- and / or 1 ,4-cyclohexane diamine, l-amino-3,3,5-trimethyl-5- aminomethyl-cyclohexane, 2,4- and / or 2,6-hexahydrotoluolylene diamine, 2,4’- and / or 4,4’- diamino-dicyclohexyl methane and 3,3’-dialkyl-4,4’-diamino-dicyclohexyl methanes (such as 3,3’-dimethyl-4,4’-diamino-dicyclohexyl methane and 3,3’-diethyl-4,4’-diamino-dicyclohexyl methane), 2,4- and / or 2,6-diaminotoluene and 2,4’- and / or 4,4’ -diaminodiphenyl methane, piperazines, and / or adducts or derivatives thereof.

[0051] Non-limiting examples of secondary amines include mono- and poly-acrylate and methacrylate modified amines; polyaspartic esters which can include derivatives of compoundssuch as maleic acid, fumaric acid esters, and / or aliphatic polyamines and the like. The secondary amine may include an aliphatic amine, such as cycloaliphatic diamine. Such amines arc available commercially from Huntsman Corporation (Houston, Tex.) under the designation of JEFFLINK, such as JEFFLINK 754 from BASF as Baxxoder PC136.

[0052] The amine can include an amine-functional resin. Suitable amine-functional resins can be selected from a wide variety known in the art. The amine-functional resin may be an ester of an organic acid, for example, an aspartic ester-based amine-functional reactive resin that is compatible with isocyanate. The amine-functional resin may be solvent-free, and / or may have a mole ratio of amine-functionality to the ester of no more than 1:1, so that no excess primary amine remains upon reaction. A non-limiting example of such polyaspartic esters may include the derivative of diethyl maleate and l,5-diamino-2-methylpentane, (commercially available as DESMOPHEN NH1220 (Covestro)) and the derivative of diethyl maleate and 4,4’-methylenebis (cyclohaxan- 1 -amine) (commercially available as Desmophen NH1420 (Covestro)). Other suitable compounds containing aspartate groups may be employed as well.

[0053] The amine may include a primary amine, such as but not limited to a polyoxyalkyleneamine. Suitable polyoxyalkyleneamines may contain two or more primary amino groups attached to a backbone derived, for example, from propylene oxide, and / or ethylene oxide. Non-limiting examples of such amines may include those commercially available under the designation JEFF AMINE from Huntsman Corporation. Such amines may have a molecular weight ranging from 200 to 7500, such as but not limited to JEFF AMINE D- 230, D-400, D-2000, T-403, T-5000, XJS-616, and ED600. Other suitable amines include aliphatic and cycloaliphatic poly amines, such as the Ancamine® series commercially available from Evonik.

[0054] The amine may comprise an aromatic amine, such as an aromatic diamine. Examples of suitable aromatic diamines include but are not limited to phenylene diamine, diaminodiphenylmethane, 2,4-diaminomesitylene, l,3,5-triethyl-2,6-diaminobenzene, 1-methyl- 3,5-diethyl-2,4-diaminobenzene, isobutyl 4-chloro-3,5-diaminobenzoate, methylene bis(methylanthranilate), trimethylene glycol di-p-aminobenzoate, dimethylthiotoluenediamine, available as Ethacure 300, diethyltoluenediamine, available as Ethacure 100, and / or 4,4’ -bis(sec- butylamino)diphenyl methane, available as Ethancure 420.

[0055] The amine may be a sterically hindered aromatic diamine. As used herein, a “stcrically hindered aromatic diamine” refers to an aromatic diamine that comprises a substituent, usually a C1-C4 alkyl, C1-C4 alkoxy, or C1-C4 alkylthio group, for example, methyl, ethyl, n-propyl, isopropyl, n-butyl, sec -butyl, tert-butyl, isobutyl, methoxy, ethoxy, n- propoxy, isopropoxy, n-butoxy or isobutoxy, methylthio, ethylthio, n-propylthio, isopropylthio, n-butylthio, or isobutylthio, wherein the substituent is in at least one position ortho to each amino group. Sterically hindered aromatic diamine may also refer to an aromatic diamine in which the amine nitrogen additionally comprises a substituent such as an alkyl substituent. The aromatic diamine may be liquid at ambient conditions.

[0056] The amine may be substantially free, essentially free, or completely free of a polysulfide linkage. The amine may comprise, consist essentially of, or consist of a liquid amine. As used herein, a “liquid amine” refers to an amine that is liquid at room temperature.

[0057] The amine may have an amine equivalent weight of at least 24 g / eq, such as at least 50 g / eq. The amine may have an amine equivalent weight of no more than 1,500 g / eq, such as no more than 1,000 g / eq. The amine may have an amine equivalent weight of 24 g / eq to 1,500 g / eq, such as 50 g / eq to 1,000 g / eq. As used herein, “amine equivalent weight” refers to the total weight of amine-containing components divided by the molar equivalents of amine functionality, which can be determined in accordance with ASTM D6979-03.Accelerator

[0058] The composition of the present disclosure may further comprise an accelerator. As used herein, “accelerator” refers to a substance that increases the rate or decreases the activation energy of a chemical reaction in comparison to the same reaction in the absence of an accelerator. An accelerator may be either a “catalyst,” that is, without itself undergoing any permanent chemical change, or may be reactive, that is, capable of chemical reactions and includes any level of reaction from partial to complete reaction of a reactant.

[0059] The accelerator may be present in the second component and / or a third or higher component. The accelerator may comprise an amine-based catalyst and / or a metal-based catalyst.

[0060] The amine-based catalyst may comprise a tertiary amine, an A-heterocyclic carbene, or an amidine / guanidine. Suitable amine-based catalysts that may be used in the present disclosure include but are not limited to N, A-dimethylcyclohexylamine, N,N-dimethylethanolamine, AAncthyl morpholine, 2,2’ -dimorpholinodiethylether, dimcthylaminocthoxycthanol, tricthylcncdiaminc, bis(2-dimcthylaminocthyl)cthcr, N,N,N'- trimethylaminoethylethanolamine, AWA’,A’-tetramethyl- 1 ,6-hexanediamine, 1,3,5- tris(dimethylaminopropyl)-hexahydro-s-triazine, 1 ,8-diazabicyclo[5.4.0]undec-7-ene, N-(3- aminopropyl)imidazole, 1,2-dimethylimidazole, l,5,7-triazabicyclo[4.4.0]dec-5-ene, or 7- methyl-l,5,7-triazabicyclo[4.4.0]dec-5-ene.

[0061] The metal-based catalyst may comprise tin, titanium, bismuth, zirconium, aluminum, iron, and / or potassium. The metal-based catalyst may comprise an organometallic complex. Suitable organometallic complexes include titanates, such as tetrabutyl titanate or tetrapropyl titanate; tin compounds, such as dibutyltin dilaurate, dibutyltin diacetate, tin octoate, or dibutyl tin oxide; or other metal compounds, such as chelates of bismuth, zirconium, titanium, aluminum, potassium, or iron, such as zirconium acetylacetonate or iron acetylacetonate.

[0062] In examples, the accelerator may comprise a latent accelerator. As used herein, a “latent” accelerator refers to a molecule or a compound that is activated by an external energy source prior to reacting (i.e., crosslinking) or having a catalytic effect, as the case may be. The latent accelerator may be in the form of a solid at room temperature and has no catalytic effect until it is heated and melts. The latent accelerator may be blocked or encapsulated. A “blocked” accelerator means an accelerator that may be reversibly reacted with a second compound that prevents any catalytic effect until the reversible reaction is reversed by the application of heat and the second compound is removed, freeing the accelerator to catalyze reactions. An “encapsulated” accelerator may be encapsulated with a thermoplastic material which melts upon heating, releasing the accelerator to catalyze reactions.

[0063] The composition may comprise the accelerator in an amount of at least 0.05% by weight based on total weight of the composition, such as at least 0.1% by weight. The composition may comprise the accelerator in an amount of no more than 15 by weight based on total weight of the composition, such as no more than 1% by weight. The composition may comprise the accelerator in an amount of 0.05% by weight to 5% by weight based on total weight of the composition, such as 0.1% by weight to 1% by weight.Filler

[0064] The composition of the present disclosure may further comprise a filler. The filler may be present in the first component, the second component, and / or a third component. Thefiller may comprise particles of a single type of filler material or may comprise particles of two or more types of filler materials. That is, the filler may comprise particles of a first filler material and may further comprise particles of a second (and a third, a fourth, etc.) filler material that is different from the first filler material. As used herein with respect to types of filler material, reference to “first,” “second,” etc. is for convenience only and does not refer to order of addition to the composition or the like.

[0065] The filler may comprise a thermally conductive filler material and / or a non- thermally conductive filler.

[0066] The thermally conductive filler may have a thermal conductivity of at least 5 W / m K at 25°C (measured according to ASTM D7984-21), such as at least 18 W / m K, and may have a thermal conductivity of no more than 3,000 W / mK at 25°C, such as no more than 1,400 W / m K. The thermally conductive filler may have a thermal conductivity of 5 W / m K to 3,000 W / m K at 25°C (measured according to ASTM D7984-21), such as 18 W / mK to 1,400 W / m K.

[0067] The non-thermally conductive filler may have a thermal conductivity of less than 5 W / m K at 25°C (measured according to ASTM D7984-21), such no more than 3 W / m K, such as no more than 1 W / m K, such as no more than 0.1 W / m K, such as no more than 0.05 W / m K, such as 0.02 W / m K at 25°C to 5 W / m K at 25°C. Thermal conductivity may be measured as described above.

[0068] The filler may be electrically insulative. The electrically insulative filler may have a volume resistivity of at least 1 Q-m, such as at least 10 Q m, such as at least 100 Q m. Electrical insulation may be measured according to ASTM D257-19.

[0069] The filler may be electrically conductive. The electrically conductive filler may have a volume resistivity of less than 1 Q-m (measured according to ASTM D257-19), such as less than 0.1 Q-m.

[0070] Suitable TC / EI fillers include boron nitride (for example, commercially available as CarboTherm from Saint-Gobain, as CoolFlow and PolarTherm from Momentive, and as hexagonal boron nitride powder available from Panadyne), silicon nitride, or aluminum nitride (for example, commercially available as aluminum nitride powder available from Micron Metals Inc., and as Toyalnite from Toyal), metal oxides such as Boehmite, Pseudo Boehmite, aluminum oxide (for example, commercially available as Microgrit from Micro Abrasives, as Nabalox from Nabaltec, as Aeroxide from Evonik, and as Alodur from Imerys), magnesium oxide, berylliumoxide, titanium oxide, zinc oxide, nickel oxide, copper oxide, or tin oxide, metal hydroxides such as aluminum hydroxide or magnesium hydroxide, arsenides such as boron arsenide, carbides such as silicon carbide, minerals such as agate and emery, ceramics such as ceramic microspheres (for example, commercially available from Zeeospheres Ceramics or 3M), silicon carbide, and diamond. These fillers can also be surface modified, such as PYROKISUMA 530 IK available from Kyowa Chemical Industry Co., Ltd. These thermally conductive fillers may be used alone or in a combination of two or more. The TC / EI filler may also be ferromagnetic, ferrimagnetic, and / or superp aramagnetic.

[0071] Suitable TC / EC fillers include metals such as silver, zinc, copper, gold, or metal coated hollow particles, carbon compounds, such as graphite (such as Timrex commercially available from Imerys or ThermoCarb commercially available from Asbury Carbons), carbon black (for example, commercially available as Vulcan from Cabot Corporation), carbon fibers (for example, commercially available as milled carbon fiber from Zoltek), graphene and graphenic carbon particles (for example, xGnP graphene nanoplatelets commercially available from XG Sciences, and / or, for example, the graphene particles described below), carbonyl iron, copper (such as spheroidal powder commercially available from Sigma Aldrich), zinc (such as Ultrapure commercially available from Purity Zinc Metals and Zinc Dust XL and XLP available from US Zinc), and the like. Examples of “graphenic carbon particles” include carbon particles having structures comprising one or more layers of one-atom-thick planar sheets of sp2-bonded carbon atoms that are densely packed in a honeycomb crystal lattice. The average number of stacked layers may be less than 100, for example, less than 50. The average number of stacked layers may be 30 or less, such as 20 or less, such as 10 or less, such as 5 or less. The graphenic carbon particles may be substantially flat; however, at least a portion of the planar sheets may be substantially curved, curled, creased, or buckled. The particles typically do not have a spheroidal or equiaxed morphology. Suitable graphenic carbon particles are described in U.S. Publication No. 2012 / 0129980, at paragraphs

[0059] -

[0065] , the cited portion of which is incorporated herein by reference. Other suitable graphenic carbon particles are described in U.S. Pat. No. 9,562,175, at 6:6 to 9:52, the cited portion of which are incorporated herein by reference. As used herein, the term “substantially flat” means planar; “curved” or “curled” materials deviate from planarity by having a non-zero curvature; and “creased” or “buckled” indicates that at leasta portion of the area is thicker than one sheet, such that the plane is doubled or folded upon itself. The TC / EC filler may also be ferromagnetic, ferrimagnetic, and / or supcrparamagnctic.

[0072] Suitable NTC / EI fillers include but are not limited to mica, wollastonite, calcium carbonate, glass microspheres, clay, silicon dioxide, or combinations thereof.

[0073] As used herein, the term “mica” generally refers to sheet silicate (phyllosilicate) minerals. The mica may comprise muscovite mica. Muscovite mica comprises a phyllosilicate mineral of aluminum and potassium with the formula KA12(AlSi30io)(F,OH)2 or (KF)2(AhO3)3(SiO2)6(H2O). Exemplary non-limiting commercially available muscovite mica include products sold under the trade name DakotaPURE™, such as DakotaPURE™ 700, DakotaPURE™ 1500, DakotaPURE™ 2400, DakotaPURE™ 3000, DakotaPURE™ 3500 and DakotaPURE™ 4000, available from Pacer Minerals. Wollastonite comprises a calcium inosilicate mineral (CaSiCE) that may contain small amounts of iron, aluminum, magnesium, manganese, titanium and / or potassium. Non-limiting examples of commercially available wollastonite include NY AD 400 available from NYCO Minerals, Inc.

[0074] The calcium carbonate (CaCCE) may comprise a precipitated calcium carbonate or a ground calcium carbonate. The calcium carbonate may or may not be surface treated, such as treated with stearic acid, such as Socal® 312, commercially available from IMERYS. Nonlimiting examples of commercially available precipitated calcium carbonate include Ultra- Pflex®, Albafil®, and Albacar HO® available from Specialty Minerals and Winnofil® SPT available from Solvay. Non-limiting examples of commercially available ground calcium carbonate include Duramite™ available from IMERYS and Marble white® available from Specialty Minerals.

[0075] Useful clay minerals include a non-ionic platy filler such as talc, pyrophyllite, chlorite, vermiculite, or combinations thereof.

[0076] The glass microspheres may be hollow borosilicate glass. Non-limiting examples of commercially available glass microspheres include 3M Glass bubbles type VS, K series, and S series available from 3M.

[0077] Coating compositions can comprise a flame retardant or combination of flame retardants. Certain TC materials described above such as aluminum hydroxide and magnesium hydroxide, for example, also may be flame retardants. As used herein, “flame retardant” refers to a material that slows down or stops the spread of fire or reduces its intensity. Flame retardantsmay be available as a powder that may be mixed with a composition, a foam, or a gel. In examples, when the coating compositions include a flame retardant, such compositions may form a coating on a substrate surface and such coating may function as a flame retardant.

[0078] As set forth in more detail below, a flame retardant can include a mineral, an organic compound, an organohalogen compound, an organophosphorous compound, or a combination thereof. Suitable examples of minerals include huntite, hydromagnesite, various hydrates, red phosphorous, boron compounds such as borates, carbonates such as calcium carbonate and magnesium carbonate, and combinations thereof. Suitable examples of organohalogen compounds include organochlorines such as chlorendic acid derivatives and chlorinated paraffins; organobromines such as decabromodiphenyl ether (decaBDE), decabromodiphenyl ethane (a replacement for decaBDE), polymeric brominated compounds such as brominated polystyrenes, brominated carbonate oligomers (BCOs), brominated epoxy oligomers (BEOs), tetrabromophthalic anyhydride, tetrabromobisphenol A (TBBPA) and hexabromocyclododecane (HBCD). Such halogenated flame retardants may be used in conjunction with a synergist to enhance their efficiency. Other suitable examples include antimony trioxide, antimony pentaoxide, and sodium antimonate. Suitable examples of organophosphorous compounds include triphenyl phosphate (TPP), resorcinol bis(diphenylphosphate) (RDP), bisphenol A diphenyl phosphate (BADP), and tricresyl phosphate (TCP); phosphonates such as dimethyl methylphosphonate (DMMP); and phosphinates such as aluminum diethyl phosphinate. In one class of flame retardants, compounds contain both phosphorus and a halogen. Such compounds include tris(2,3- dibromopropyl) phosphate (brominated tris) and chlorinated organophosphates such as tris( 1 ,3- dichloro-2-propyl)phosphate (chlorinated tris or TDCPP) and tetrakis(2- chlorethyl)dichloroisopentyldiphosphate (V6). Suitable examples of organic compounds include carboxylic acid, dicarboxylic acid, melamine, and organonitrogen compounds. Other suitable flame retardants include ammonium polyphosphate and barium sulfate.

[0079] The filler may comprise lightweight fillers. Lightweight fillers may be organic, inorganic, or combinations thereof. As used herein, the term “lightweight” when used with reference to particles of the present disclosure means that the particles have a specific gravity of no more than 1.0 when measured according to ASTM D5965, with “specific gravity” being the ratio of a mass of a solid or liquid (e.g., a mass of particles) to a mass of an equal volume ofdistilled water at the same temperature (e.g., 25°C). The lightweight fillers may have a specific gravity of at least 0.01 measured according to ASTM D5965, such as at least 0.02, such as at least 0.1. The lightweight fillers may have a specific gravity of no more than 1.0 measured according to ASTM D5965, such as no more than 0.7. The lightweight fillers may have a specific gravity of 0.01 to 1.0 measured according to ASTM D5965, such as 0.02 to 0.7.

[0080] Suitable lightweight fillers may comprise microspheres. Useful examples of lightweight fillers include polystyrene foam, microspheres of polyacrylates and polyolefins, and silica microspheres having particle sizes of 5 to 100 microns and a specific gravity of 0.25 (ECCOSPHERES®, Trelleborg Applied Technologies). Other examples include alumina / silica microspheres having particle sizes 5 to 300 microns and a specific gravity of 0.7 (FILLITE®, Pluess-Stauffer International), aluminum silicate microspheres having a specific gravity of 0.45 to 0.7 (Z-LIGHT®), and calcium carbonate-coated polyvinylidene copolymer microspheres having a specific gravity of 0.13 (DUALITE 6001 AE®, Pierce & Stevens Corp.). Other suitable lightweight fillers include, for example, hollow microspheres such as Expancel® microspheres (available from Nouryon) or Dualite® low density polymer microspheres (available from Henkel) or hollow borosilicate glass, such as 3M Glass bubbles type VS, K series and S series available from 3M. Compositions provided by the present disclosure include lightweight filler particles comprising an exterior surface coated with a thin coating, such as those described in U.S. Publication No. 2010 / 0041839 at paragraphs

[0016] -

[0052] , the cited portion of which is incorporated herein by reference.

[0081] Suitable lightweight fillers include, for example, those described in: U.S. Pat. No. 6,525,168, column 4, lines 14-55, incorporated herein by reference; and U.S. Pat. No. 8,816,023, column 3, line 18 to column 9, line 44, incorporated herein by reference.Solvent

[0082] The compositions disclosed herein may optionally comprise a solvent, such as an organic solvent. The solvent may be present in the first component, the second component, and / or a third or higher component.

[0083] The solvent may comprise comprise aliphatic solvents such as VM&P NAPTHA; aromatic petroleum distillates; cycloaliphatic solvents, such as cyclohexane; ketones, such as methylethyl ketone, methylisobutyl ketone, and methyl amyl ketone; alcohols, such as ethyl alcohol, propyl alcohol, and diacetone alcohol; acetates, such as butyl acetate and hexyl acetate;mono and dialkyl ethers of ethylene, propylene, and diethylene glycols, such as ethylene glycol moncthylcthcr, ethylene glycol monobutyl ether, dicthylcnc glycol diethyl ether, propylene glycol monomethyl ether, and dipropylene glycol ether; and monoalkyl ethers of monoester glycols, such as ethylene glycol monoethylether acetate and propylene glycol monomethyl ether acetate.

[0084] The composition may comprise solvent in an amount of at least 10% by weight based on total weight of the composition, such as at least 15% by weight. The composition may comprise solvent in an amount of no more than 90% by weight based on total weight of the composition, such as no more than 50% by weight. The composition may comprise solvent in an amount of 10% by weight to 90% by weight based on total weight of the composition, such as 15% by weight to 50% by weight.Additives

[0085] The compositions disclosed herein may optionally further comprise an additive. The additive(s) may be present in the first component, the second component, and / or a third or higher component so long as the additive is not reactive with any of the other ingredient in such components. As used herein, an “additive” refers to a pot life extender, a tackifier, a surfactant, a flame retardant, a corrosion inhibitor, a colorant, a tint, a plasticizer, an antioxidant, a UV light absorber or stabilizer, a flow control agent, a leveling agent, a defoamer, a grind vehicle, an adhesion promoter, a diluent, such as a non-reactive diluent, and / or a moisture scavenger.

[0086] As used herein, a “diluent” refers to a refers to a molecule or a compound that has a low vapor pressure such as 2 mm Hg or less at 25 °C determined by differential scanning calorimetry according to ASTM El 782 and is used to lower the viscosity of a resin.

[0087] As used herein, a “non-reactive diluent” refers to a diluent that does not have a functional group capable of reacting with functional group(s) on molecules or compounds in a composition and is thus left unreacted during cure.

[0088] If present at all, the diluent may be present in the first component.

[0089] Stabilizers may be blended to prevent reduction of molecular weight by heating, gelation, coloration, generation of an odor and the like in the composition to improve the stability of the composition.

[0090] Additive(s), if present at all, may be present in the composition in a combined amount of up to 15% by weight based on total weight of the composition. Additivc(s), if present at all, may be present in the composition in a combined amount of at least 0.5% by weight based on total weight of the composition, such as at least 1% by weight. Additive(s), if present at all, may be present in the composition in a combined amount of no more than 10% by weight based on total weight of the composition, such as no more than 5% by weight. The composition may comprise the additive in an amount of 0.5% by weight to 10% by weight based on total weight of the composition, such as 1% by weight to 5% by weight.Elastomeric Particles

[0091] The composition of the present disclosure may further comprise elastomeric particles. As used herein, “elastomeric particles” refers to particles comprising one or more materials having a glass transition temperature (Tg) of greater than -150°C and less than 30°C,calculated, for example, using the Fox equation: , wherein wt is the weight fraction of component I, Tgiis the glass transition temperature of the homopolymer of component / in absolute temperature units, and the summation is taken over all the components in the copolymer.

[0092] As used herein, the term “glass transition temperature” (“Tg”) refers to the temperature at which an amorphous material, such as glass or a polymer, changes from a brittle vitreous state to a plastic state or from a plastic state to a brittle vitreous state.

[0093] The elastomeric particles may have a core / shell structure. Suitable core-shell elastomeric particles may be comprised of an acrylic shell and an elastomeric core. The core may comprise natural or synthetic rubbers, polybutadiene, styrene-butadiene, polyisoprene, chloroprene, acrylonitrile butadiene, butyl rubber, polysiloxane, polysulfide, ethylene-vinyl acetate, fluoroelastomer, and / or polyolefin. The elastomeric particles may comprise a polybutadiene core, a styrene butadiene core, and / or a polysiloxane core.

[0094] The composition may comprise the elastomeric particles in an amount of up to 40% by weight based on total weight of the composition. The composition may comprise the elastomeric particles in an amount of at least 0.1% by weight based on total weight of the composition, such as at least 1% by weight. The composition may comprise the elastomericparticles in an amount of no more than 40% by weight based on total weight of the composition, such as no more than 20% by weight. The composition may comprise the elastomeric particles in an amount of 0.1% by weight to 40% by weight based on total weight of the composition, such as 1% by weight to 20% by weight.Dispersant

[0095] The composition may further comprise a dispersant. As used herein, the term “dispersant” refers to a substance that may be added to the composition to improve the separation of the thermally conductive filler particles by wetting the particles and breaking apart agglomerates.

[0096] The dispersant may be present in the composition in an amount of up to 10% by weight based on total weight of the composition. The dispersant may be present in the composition in an amount of at least 0.1% by weight based on total weight of the composition, such as at least 0.5% by weight, such as at least 1% by weight. The dispersant may be present in the composition in an amount of no more than 7% by weight based on total weight of the composition, such as no more than 5% by weight, such as no more than 3% by weight. The dispersant may be present in the composition in an amount of 0.1% by weight to 7% by weight based on total weight of the composition, such as 0.5% by weight to 5% by weight, such as 1% by weight to 3% by weight.

[0097] Suitable dispersants for use in the composition include fatty acid, phosphoric acid esters, polyacrylates, polyalkoxylates, sulfonates, polyethers, and / or polyesters. Non-limiting examples of commercially available dispersants include ANTI-TERRA-U100, DISPERBYK- 102, DISPERBYK-103, DISPERBYK-111, DISPERBYK-171, DISPERBYK-2151, DISPERBYK-2059, DISPERBYK-2000, DISPERBYK-2117, DISPERBYK-2118, and DISPERBYK-2152, all available from BYK Company, and SOLSPERSE 24000SC, SOLSPERSE 16000, and SOLSPERSE 8000 hyperdispersants available from The Lubrizol Corporation.Compositions

[0098] The compositions disclosed herein may be substantially free, essentially free, or completely free of solvent.

[0099] The compositions of the present disclosure may comprise an equivalence ratio of (i) isocyanate functional groups to (ii) a sum of hydroxyl functional groups and amine functionalgroups of at least 1 :2, such as at least 2:3, such as at least 1 :1.2. The compositions of the present disclosure may comprise an equivalence ratio of (i) isocyanate functional groups to (ii) a sum of hydroxyl functional groups and amine functional groups of no more than 2:1, such as no more than 3:2, such as no more than 1.2:1. The compositions of the present disclosure may comprise an equivalence ratio of (i) isocyanate functional groups to (ii) a sum of hydroxyl functional groups and amine functional groups of 1:2 to 2:1, such as 2:3 to 3:2, such as 1:1.2 to 1.2:1.

[0100] The first component may comprise a viscosity of at least 0.0001 Pa*s at 25°C, such as at least 0.001 Pa*s, such as at least 0.005 Pa*s. The first component may comprise a viscosity of no more than 3,000 Pa*s at 25°C, such as no more than 2,000 Pa*s, such as no more than 1,000 Pa*s. The first component may comprise a viscosity of 0.0001 Pa*s to 3,000 Pa*s at 25°C, such as 0.001 Pa*s to 2,000 Pa*s, such as 0.005 Pa*s to 1,000 Pa*s. The viscosities in this paragraph may be measured by parallel plate rheology with a plate diameter of 25 mm, a gap of 0.5 mm, and a shear rate of 1 s’1.

[0101] The second component may comprise a viscosity of at least 0.0001 Pa*s at 25°C, such as at least 0.001 Pa*s, such as at least 0.005 Pa*s. The second component may comprise a viscosity of no more than 3,000 Pa*s at 25°C, such as no more than 2,000 Pa*s, such as no more than 1,000 Pa*s. The second component may comprise a viscosity of 0.0001 Pa*s to 3,000 Pa*s at 25°C, such as 0.001 Pa*s to 2,000 Pa*s, such as 0.005 Pa*s to 1,000 Pa*s. The viscosities in this paragraph may be measured by parallel plate rheology with a plate diameter of 25 mm, a gap of 0.5 mm, and a shear rate of 1 s’1.

[0102] The composition may comprise a polysulfide linkage in an amount of at least 0.6% by weight based on total weight of isocyanate-containing compounds and active hydrogencontaining compounds, such as at least 0.8% by weight, such as at least 1.0% by weight. The composition may comprise a poly sulfide linkage in an amount of no more than 25% by weight based on total weight of isocyanate-containing compounds and active hydrogen-containing compounds, such as no more than 15% by weight, such as no more than 10% by weight. The composition may comprise the poly sulfide linkage in an amount of 0.6% by weight to 25% by weight based on total weight of isocyanate-containing compounds and active hydrogencontaining compounds, such as 0.8% by weight to 15% by weight, such as 1.0% by weight to 10% by weight.

[0103] The compositions of the present disclosure may be formulated as two-component compositions. The first component and the second component may be liquid at ambient conditions, may be mixable at ambient temperature, and / or may be capable of curing at ambient conditions.

[0104] The compositions according to the present disclosure may be formulated as a coating composition. The coating composition may be formulated as a film-forming composition, an adhesive composition, a structural adhesive composition, a sealant composition, a pottant composition, a gap filler composition, a pre-preg composition, an embedding composition, an encapsulating composition, or the like. The compositions disclosed herein may form a foam, a sealant, an adhesive, a structural adhesive, a pottant, a gap filler, a pre-preg, an embeddant, and / or an encapsulant. The compositions disclosed herein also may be used to form a pad or a pottant through pouring the composition onto a mold, then curing the composition to form a molded foam.Methods and Kits

[0105] Also disclosed herein are methods for preparing one of the compositions disclosed above. The method optionally may comprise mixing a polyisocyanate with any of the optional ingredients that may be included in the first component to form the first component. For example, the polyisocyanate may be mixed with a filler and / or an additive to form the first component. A polyol may be mixed with a filler, an amine, an accelerator, and / or an additive to form the second component. The first component and the second component and optionally a third or higher component may be mixed to form one of the compositions disclosed above. Such mixing may be at a temperature of equal to or less than 50°C, such as from 0°C to 50°C, such as from 15°C to 35°C, such as at ambient temperature.

[0106] The composition described above may be applied alone or as part of a system that can be deposited in different ways onto a variety of substrates. Accordingly, disclosed herein are methods for treating a substrate comprising, or consisting essentially of, or consisting of, contacting at least a portion of a surface of the substrate with one of the compositions described hereinabove. That is, the composition can be applied to the surface of a substrate in any number of different ways, non-limiting examples of which include brushes, rollers, films, pellets, trowels, spatulas, dips, spray guns and applicator guns to form a coating on at least a portion of the substrate surface.

[0107] After application to the substrate(s), the composition may be cured. For example, the composition may be allowed to cure at room temperature or slightly thermal conditions, and for any desired time (e.g., from 5 minutes to 1 hour) sufficient to cure the composition on the substrate(s). The composition may be cured to form a coating on the substrate surface under ambient conditions or slightly thermal conditions. The coating may form a sealant, an adhesive, a gap filler, a pottant, or an encapsulant, such as a solid or gel, and / or a pad, such as a pad formed in- situ or a discrete pre-manufactured or pre-formed pad.

[0108] Also disclosed are methods for forming a bond between two substrates for a wide variety of potential applications in which the bond between the substrates provides mechanical properties related to lap shear strength. The method may comprise, or consist essentially of, or consist of, applying the composition described above to a first substrate; contacting a second substrate to the composition such that the composition is located between the first substrate and the second substrate; and curing the composition under ambient conditions or slightly thermal conditions. For example, the composition may be applied to either one or both of the substrate materials being bonded to form an adhesive bond there between and the substrates may be aligned, and pressure and / or spacers may be added to control bond thickness. The composition may be applied to cleaned or uncleaned (i.e., including oily or oiled) substrate surfaces. The composition also may be applied to a substrate that has been pretreated, coated with an electrodepositable coating, and / or coated with additional layers such as a primer, basecoat, or topcoat.

[0109] After application to the substrate(s), the composition may be cured. For example, the composition may be allowed to cure at ambient conditions or slightly thermal conditions. Additionally, the composition may be further cured by exposure to external energy sources known to those of ordinary skill in the ail, such as by thermal heating or baking (such as in an oven) or by actinic radiation. For example, the composition may be baked at elevated temperature, such as at a temperature of at least 40°C, such as at least 60°C, such as at least 80°C, such as at least 100°C, and in some cases at a temperature of no more than 125 °C, such as no more than 120°C, such as no more than 115 °C, such as no more than 110°C, and in some cases at a temperature of 40°C to 125°C, such as 60°C to 120°C, such as 80°C to 115°C, such as 100°C to 110°C, and for any desired time (e.g., from 1 minute to 5 hours) sufficient to cure thecoating composition on the substrate(s). The skilled person understands, however, that the time of curing varies with temperature.

[0110] The present disclosure is further directed to a method of forming an article comprising extruding any of the compositions disclosed herein. The extruding may comprise three-dimensional printing, set forth in more detail below.

[0111] The composition may be injected or otherwise placed in a die caster or a mold and cured under ambient conditions or by exposure to an external energy source, for example, such as by heating to a temperature of less than 180°C, such as less than 130°C, such as less than 90°C, to form a part or a member and optionally may be machined to a particular configuration.

[0112] The disclosure is further directed to a kit comprising (i) a first composition comprising any of the compositions disclosed herein for forming a solvent-assisted degradable coating and (ii) instructions for applying a second composition to the solvent-assisted degradable coating to initiate solvent-assisted degradation thereof.

[0113] The kit may further comprise the second composition. The second composition may comprise a solvent, a thiol, and / or a base. Suitable solvents include but are not limited to DMF, TEP, acetone, caprolactone, ethanol, and / or isopropanol.

[0114] The second composition may have the following Hansen parameters:(a) dispersion forces energy (3D) between molecules of at least 15 MPa05, such as at least 16 MPa05, such as at least 16.5 MPa05, such as no more than 20 MPa05, such as no more than 19 MPa05, such as no more than 18.5 MPa05, such as 15 MPa05to 20 MPa05, such as 16 MPa05to 19 MPa05, such as 16.5 MPa05to 18.5 MPa05;(b) dipolar intermolecular forces energy (8P) between molecules of at least 5 MPa05, such as at least 6 MPa05, such as at least 7 MPa05, such as no more than 20 MPa05, such as no more than 18 MPa05, such as no more than 15 MPa05, such as 5 MPa05to 20 MPa05, such as 6 MPa05to 18 MPa05, such as 7 MPa05to 15 MPa05; and / or(c) hydrogen bonds energy (6H) between molecules of at least 5 MPa05, such as at least 6 MPa05, such as at least 7 MPa05, such as no more than 20 MPa05, such as no more than 18 MPa05, such as no more than 15 MPa05, such as 5 MPa05to 20 MPa05, such as 6 MPa05to 18 MPa05, such as 7 MPa05to 18 MPa05.

[0115] Hansen solubility parameters may be calculated based on the methods provided in Diaz de los Rios, M., Hernandez Ramos, E., Determination of the Hansen solubility parametersand the Hansen sphere radius with the aid of the solver add-in of Microsoft Excel. SN Appl.Sci. 2, 676 (2020).

[0116] It has been surprisingly discovered that the second composition must comprise a thiol and a base to be capable of degrading a coating formed from the first composition. It has also been discovered that the second composition must have the Hansen parameters disclosed herein to be capable of degrading a coating formed from the first composition.Coatings

[0117] The coatings formed from the compositions disclosed herein may be used as structural adhesives, which is a surprising result. It has been surprisingly found that the coatings formed from the compositions disclosed herein are solvent-assisted degradable, as further described herein.

[0118] The coatings formed from the compositions disclosed herein surprisingly demonstrate:(a) a lap shear strength of at least 1 MPa measured according to ASTM D 1002- 10 using 3003 H24 aluminum substrate of 0.063 inch thickness, as measured by an INSTRON 5567 machine in tensile mode with a pull rate of 10 mm per minute, such as at least 2 MPa, such as at least 4 MPa, such as no more than 65 MPa, such as 1 MPa to 65 MPa, such as 2 MPa to 65 MPa, such as 4 MPa to 65 MPa; and / or(b) a tensile strength of at least 1 MPa measured according to ISO 37-C using an INSTRON 5567 machine in tensile mode with a pull rate of 10 mm per minute, such as at least 2 MPa, such as at least 4 MPa, such as no more than 65 MPa, such as 1 MPa to 65 MPa, such as 2 MPa to 65 MPa, such as 4 MPa to 65 MPa; and / or(c) a tensile strain of at least 50% as measured according to ISO 37-C using an INSTRON 5567 machine in tensile mode with a pull rate of 10 mm per minute, such as at least 100%, such as at least 300%, such as no more than 1,500%, such as no more than 1,000%, such as no more than 900%, such as 50% to 1,500%, such as 200% to 1,000%, such as 300% to 900%; and / or(d) a thermal conductivity of at least 0.1 W / m-K measured using a TIM Thermal Resistance and Conductivity Measurement Apparatus (model LW-9389) according to ASTM D5470-17 (steady-state methods), such as at least 0.5 W / m-K, such as at least 1.0 W / m-K, such as no more than 5.0 W / m-K, such as no more than 3.0 W / m-K, such as nomore than 2.0 W / m-K, such as 0. 1 W / m-K to 5.0 W / m-K, such as 0.5 W / m-K to 3.0 W / m-K, such as 1.0 W / m-K to 2.0 W / m-K.3-D Printing

[0119] Compositions of the present disclosure may be applied or deposited using any suitable method, including those aforementioned. Alternatively, the composition may be casted, extruded, molded, or machined to form a pail or a member in a dried or cured state.

[0120] The compositions disclosed herein may be used in any suitable additive manufacturing technology, such as three-dimensional (3D) printing, extrusion jetting, and binder jetting. Additive manufacturing refers to a process of producing a part or member by constructing it in layers, such as one layer at a time.

[0121] The present disclosure is also directed to the production of structural articles, such as by way of a non-limiting example, sound damping pads, using an additive manufacturing process, such as 3D printing. 3D printing refers to a computerized process, optionally including artificial intelligence modulation, by which materials are printed or deposited in successive layers to produce a 3D part or member, such as, by way of a non-limiting example, sound damping pads in a battery assembly. A 3D part or member may be produced by depositing successive portions or layers over a base of any spatial configuration and thereafter depositing additional portions or layers over the underlying deposited portion or layer and / or adjacent to the previously deposited portion or layer to produce the 3D printed part or member.

[0122] It will be appreciated that the configuration of the 3D printing process, including the selection of suitable deposition equipment, depends on factors such as the deposition volume, the viscosity of the composition, and the complexity of the part being fabricated. Any suitable mixing, delivery, and 3D printing equipment, as known to those skilled in the art, may be used. Compositions may be printed or deposited in any size and / or shape of droplets or extrudate, and in any patterns to produce the 3D structure.

[0123] Compositions as disclosed herein may be applied or deposited by any suitable 3D printing method as known to those skilled in the ait. The first component and the second component of the compositions disclosed herein may be mixed and then deposited, or the first component and the second component may be deposited separately, such as simultaneously or sequentially.

[0124] The first component and the second component may be premixed, i.e., mixed together, prior to application, and then deposited. The mixture may be partially reacted or thermoset when the material is deposited; the deposited reaction mixture may react after deposition and may also react with previously deposited portions and / or subsequently deposited portions of the article such as underlying layers or overlying layers of the article.

[0125] In a non-limiting example, the first component and the second component may be released from their individual storage containers and pushed, such as pumped through conduits, such as hoses, to a mixer, such as a static or dynamic mixer, wherein the composition may be mixed for a time sufficient to homogenize the composition, wherein the composition may then be released through an outlet. The outlet may be a deposition device, such as a printing head, and / or the materials may exit the mixing unit and be pushed, such as by a pump, through a conduit, such as a hose, to the printing head. The printing head may optionally be mounted on a 3D rotational robotic arm to allow delivery of 3D print compositions to any base in any spatial configuration and / or the base may be manipulated in any spatial configuration during the 3D printing process.

[0126] Alternatively, the first component and the second component may be deposited independently from different printing heads. The first component may be deposited from one printing head and the second component may be deposited from a second printing head. The first component and the second component may be deposited in any pattern such that the first component and the second component comprising any deposited layer can react together as well as react with underlying and / or overlying layers to produce the 3D printed part or member.

[0127] Methods provided by the present disclosure include printing the composition on a fabricated part. Methods provided by the present disclosure include directly printing parts.

[0128] Using the methods provided by the present disclosure parts can be fabricated. The entire part can be formed from one of the compositions disclosed herein, one or more portions of a part can be formed from one of the compositions disclosed herein, one or more different portions of a part can be formed using the compositions disclosed herein, and / or one or more surfaces of a part can be formed from a composition provided by the present disclosure. In addition, internal regions of a pail can be formed from a composition provided by the present disclosure.Dielectric Coating Compositions and Dielectric Coatings and Dielectric Systems and Kits

[0129] Also disclosed herein arc dielectric coating systems. The dielectric coating system may comprise: a first composition for application to a first portion of a substrate surface, the first composition comprising a dielectric coating composition; and a second composition for application to a second portion of a substrate surface, the second composition comprising any of the compositions disclosed above that, in a cured state, may form a second coating. The first portion and the second portion may be on a single substrate or may be on a first substrate and a second substrate, respectively.

[0130] Also disclosed herein are dielectric coating kits. The dielectric coating kit may comprise: a first composition for application to a first portion of a substrate surface, the first composition comprising a dielectric coating composition; and a second composition for application to a second portion of a substrate surface, the second composition comprising any of the compositions disclosed above that, in a cured state, may form a second coating. The first portion and the second portion may be on a single substrate or may be on a first substrate and a second substrate, respectively. The kit optionally may comprise instructions for applying the first composition and the second composition to the first portion and the second portion of the substrate surface, respectively.

[0131] When used with respect to the dielectric coating systems and kits disclosed herein, the first portion and the second portion may be the same or different, provided that the first portion and the second portion overlap to form a coating stack, e.g., a second coating on a dielectric coating. Such a coating stack does not preclude the possibility of coatings in addition to the dielectric coating and the second coating, wherein such additional coatings may or may not be between the dielectric coating and the second coating. Optionally, the coating stack may be formed between two substrates.

[0132] The dielectric coating may be formed on a first portion of a surface of a first substrate and the second coating be formed on a second portion of a surface of a second substrate and the substrates may be positioned such that the first portion and the second portion overlap to form a coating stack as described above.

[0133] As used herein, “dielectric” refers to a coating composition or coating comprising a dielectric strength of at least 10 kV / mm measured using a Sefelec Dielectric Strength Tester(RMG12AC-DC; voltage limit 12.0 kV, Imax Limit 0.1 mA, 19 sec ramp, 20 sec dwell, 2 sec fall) according to ASTM D149-09, such as at least 12 kV / mm, such as at least 15 kV / mm.

[0134] The dielectric coating composition may comprise a binder comprising a filmforming resin. As used herein, “film-forming resin” refers to one or more monomers, oligomers, prepolymers and / or polymers, such as homopolymers and / or copolymers, that can form a coating upon reaction with a curing agent or crosslinker, upon evaporation of a solvent, and / or upon photo or thermal activation. The dielectric coating composition may comprise any suitable filmforming resin, including organic film- forming resins and / or inorganic film- forming resins, such as silicon-based film-forming resins. Examples of suitable film-forming resins include but are not limited to polyester, alkyd, urethane, isocyanate, polyurea, epoxy, acrylic, polyether, polysulfide, polyamine, polyamide, polyvinyl chloride, polyolefin, polyvinylidene fluoride, polyolefin, polysiloxane, amine-aldehydes, resinous polyols, phosphatized polyepoxides, phosphatized acrylic polymers, and / or aminoplasts.

[0135] The dielectric coating composition may optionally comprise a curing agent and / or a crosslinker that is capable of crosslinking with the film-forming resin to cure the dielectric coating composition. Any suitable curing agent and / or crosslinker that is capable of crosslinking with the film-forming resin may be used. Examples of suitable curing agents include but are not limited to amines, aminoplasts, phenoplasts, polyisocyanates, including blocked polyisocyanates, polyepoxides, beta-hydroxyalkylamides, polyacids, organometallic acid-functional materials, polyamines, polyamides, polysulfides, polythiols, polyenes such as polyacrylates, polyols, and / or polysilanes, and the like.

[0136] The dielectric coating composition may optionally further comprise colorants, pigments, additives, and / or fillers. Suitable fillers that may be used in the dielectric coating composition include TC / EI filler materials, TC / EC filler materials, and / or NTC / EI filler materials.

[0137] The dielectric coating composition may comprise a thermoset coating composition, wherein the coating composition is cured upon crosslinking of a film-forming resin and a curing agent and / or crosslinker. Alternatively, the dielectric coating composition may comprise a thermoplastic coating composition, wherein the coating composition comprises a film-forming resin that cures upon evaporation of water and / or solvent. Alternatively, thedielectric coating composition may comprise a thermoset or thermoplastic coating composition that cures upon exposure to actinic radiation, such as ultraviolet light.

[0138] The dielectric coating composition may comprise a liquid coating composition or a powder coating composition. As used herein, when referring to a dielectric coating composition, “liquid” means a material having a viscosity less than 100,000 Pa-s at 25°C as measured by parallel plate rheology with a plate diameter of 25 mm, a gap of 0.5 mm, and a shear rate of 1 s’1.

[0139] Suitable liquid coating compositions include but are not limited to electrodepositable coating compositions, one-component coating compositions, and / or multicomponent coating compositions.

[0140] For example, the liquid dielectric coating composition may comprise an electrodepositable coating composition. The electrodepositable coating composition may comprise one or more cationic or anionic salt group-containing film-forming resins that may be deposited onto a metal or other conductive substrate under the influence of an applied electrical potential, i.e., by electrodeposition.

[0141] In other examples, the liquid dielectric coating composition may comprise a UV- curable coating composition comprising film-forming resins capable of curing upon exposure to UV radiation. Any suitable UV-curable film-forming resin may be used, such as free radical polymerizable resins containing ethylenic unsaturation or olefinic double bonds and / or filmforming resins that may react through a cationic photopolymerization mechanism. Examples of suitable UV-curable coating compositions that may be used include but are not limited to the RAYCRON line of UV-curable coatings, commercially available from PPG Industries, Inc.

[0142] Other suitable liquid dielectric coating compositions include but are not limited to the SPECTRACRON line of solvent-based coating compositions and the AQUACRON line of water-based coating compositions, all commercially available from PPG Industries, Inc. The liquid dielectric coating may also be applied as a two-component composition where the filmforming resins and the reactive curing agent and / or crosslinker are mixed just before application of the coating composition and may optionally cure under ambient conditions without any external energy source.

[0143] Alternatively, the dielectric coating composition may comprise a powder coating composition. As used herein, “powder coating composition” refers to any dielectric coatingcomposition in the form of a co-reactable solid in particulate form which may be substantially free, essentially free, or completely free of water and / or solvent. Suitable film-forming resins useful in dielectric powder coating compositions include those discussed in PCT Publ. No. WO 2021 / 173941A1, pars.

[0006] to

[0042] ,

[0057] to

[0068] ,

[0088] to

[0105] and

[0128] to

[0139] , incorporated herein by reference. Non-limiting examples of suitable powder compositions that may be used in the present disclosure include the polyester-based ENVIROCRON line of powder coating compositions (commercially available from PPG Industries, Inc.), silicon modified polyester compositions, epoxy-polyester hybrid compositions, and / or UV-curable powder compositions.

[0144] The dielectric coating composition may be applied to a substrate by any suitable method known in the art, including but not limited to electrodeposition, coil coating, spraying, such as electrostatic spraying, flow coating, spin coating, curtain coating, brushing, dipping, hot- melt extrusion, application of a film, and / or by the use of a fluidized bed. Once applied to the substrate, the dielectric coating composition may be cured by any method known in the art, such as baking, induction heating, infrared heating, and / or exposure to actinic radiation such as UV.

[0145] A dielectric coating may comprise a dielectric strength of at least 10 kV / mm measured using a Sefelec Dielectric Strength Tester (RMG12AC-DC; voltage limit 12.0 kV DC, Imax Limit 0.1 mA, 19 sec ramp, 20 sec dwell, 2 sec fall) according to ASTM D149-09, such as at least 12 kV / nuu, such as at least 15 kV / mm. The dielectric coating may comprise a dielectric strength of no more than 120 kV / mm measured using a Sefelec Dielectric Strength Tester (RMG12AC-DC; voltage limit 12.0 kV DC, Imax Limit 0.1 mA, 19 sec ramp, 20 sec dwell, 2 sec fall) according to ASTM D 149-09, such as no more than 100 kV / mm. The dielectric coating may comprise a dielectric strength of 10 kV / mm to 120 kV / mm measured using a Sefelec Dielectric Strength Tester (RMG12AC-DC; voltage limit 12.0 kV DC, Imax Limit 0.1 mA, 19 sec ramp, 20 sec dwell, 2 sec fall) according to ASTM D 149-09, such as 12 kV / mm to 100 kV / mm, such as 15 kV / mm to 100 kV / mm.

[0146] The dielectric coating may be formulated as a hot-melt or a film. As used herein when referring to a dielectric coating, a “film” refers to a sheet comprising a cured composition that may be formed independent of a substrate surface. The film may optionally comprise an adhesive layer, such as a pressure sensitive adhesive layer.Use of the Compositions and Coatings

[0147] The compositions disclosed herein may be used to form coatings having the following properties:(a) a lap shear strength of at least 1 MPa measured according to ASTM D 1002- 10 using 3003 H24 aluminum substrate of 0.063 inch thickness, as measured by an INSTRON 5567 machine in tensile mode with a pull rate of 10 mm per minute, such as at least 2 MPa, such as at least 4 MPa, such as no more than 65 MPa, such as 1 MPa to 65 MPa, such as 2 MPa to 65 MPa, such as 4 MPa to 65 MPa; and / or(b) a tensile strength of at least 1 MPa measured according to ISO 37-C using an INSTRON 5567 machine in tensile mode with a pull rate of 10 mm per minute, such as at least 2 MPa, such as at least 4 MPa, such as no more than 65 MPa, such as 1 MPa to 65 MPa, such as 2 MPa to 65 MPa, such as 4 MPa to 65 MPa; and / or(c) a tensile strain of at least 50% as measured according to ISO 37-C using an INSTRON 5567 machine in tensile mode with a pull rate of 10 mm per minute, such as at least 100%, such as at least 300%, such as no more than 1,500%, such as no more than 1,000%, such as no more than 900%, such as 50% to 1,500%, such as 200% to 1,000%, such as 300% to 900%; and / or(d) a thermal conductivity of at least 0.1 W / m-K measured using a TIM Thermal Resistance and Conductivity Measurement Apparatus (model LW-9389) according to ASTM D5470-17 (steady-state methods), such as at least 0.5 W / m-K, such as at least 1.0 W / m-K, such as no more than 5.0 W / m-K, such as no more than 3.0 W / m-K, such as no more than 2.0 W / m-K, such as 0.1 W / m-K to 5.0 W / m-K, such as 0.5 W / m-K to 3.0 W / m-K, such as 1.0 W / m-K to 2.0 W / m-K.Substrates

[0148] Compositions described herein may be coated or deposited on, or otherwise contacted with, any substrate or surface, such as, but not limited to metals or metal alloys, polymeric materials, such as plastics including filled and unfilled thermoplastic or thermoset materials, and / or composite materials. Other suitable substrates include, but are not limited to, glass or natural materials such as wood. Substrates may include two or more of any different materials in any combination, such as, but not limited to, two different metals, or a metal and a metal alloy, or a metal and a metal alloy and one or more composite materials.

[0149] Suitable substrates may include, but are not limited to, both flexible and rigid metal substrates such as ferrous metals, aluminum, aluminum alloys, magnesium, titanium, copper, and / or other metal and alloy substrates. The ferrous metal substrates may include, for example, iron, steel, and alloys thereof. Non-limiting examples of useful steel materials include cold rolled steel, nickel plated cold rolled steel, galvanized (zinc coated) steel, electrogalvanized steel, stainless steel, pickled steel, and / or zinc-iron alloy such as GALV ANNEAL. Aluminum alloys, such as those, for example, of the 1XXX, 2XXX, 3XXX, 4XXX, 5XXX, 6XXX, 7XXX, or 8XXX series as well as clad aluminum alloys and cast aluminum alloys, such as those, for example, of the A356, 1XX.X, 2XX.X, 3XX.X, 4XX.X, 5XX.X, 6XX.X, 7XX.X, or 8XX.X series also may be used as the substrate. The substrate also may comprise, for example, magnesium, such as magnesium alloys of the AZ31B, AZ91C, AM60B, or EV31A series, titanium and / or titanium alloys, such as those of grades 1-36 including H grade variants, copper and copper alloys, or other non-ferrous metals, as well as alloys of these materials. The substrate may comprise a composite material such as a plastic, fiberglass and / or carbon fiber composite.

[0150] It will also be understood that the substrate may comprise a bare substrate or the substrate may be pretreated or pre-coated with one or more layers. Suitable pretreatment solutions may include a zinc phosphate pretreatment solution such as, for example, those described in U.S. Pat. Nos. 4,793,867 and 5,588,989, or a zirconium containing pretreatment solution such as, for example, those described in U.S. Pat. Nos. 7,749,368 and 8,673,091.

[0151] The substrate may be in any form, such as, without limitation, a sheet, a foil, a laminate foil, a pad, a fabricated part, a component, or an article. Compositions comprising the materials disclosed herein may be used to coat a substrate, such as by depositing, applying, or contacting the compositions to a substrate surface. The compositions, in a cured state, may be used in any form, such as but not limited to, a coating, a sealant, an adhesive, a structural adhesive, a pottant, or an encapsulant, such as a solid or gel, such as a pad formed in-situ or a discrete pre-manufactured or pre-formed pad.

[0152] In examples, the substrate may be a multi-metal article. As used herein, the term “multi-metal article” refers to (1) an article that has one surface comprised of a first metal and one surface comprised of a second metal that is different from the first metal, (2) a first article that has one surface comprised of a first metal and a second article that has one surface comprised of a second metal that is different from the first metal, or (3) both (1) and (2).

[0153] The compositions disclosed herein are not limited and may be particularly suitable for use in various industrial or transportation applications including automotive applications, commercial applications, rail locomotive, marine applications, and / or aerospace applications. Suitable substrates for use in the present disclosure include those that are used in the assembly of vehicular’ bodies (for example, without limitation, door, body panel, trunk deck lid, roof panel, hood, roof, and / or stringers, rivets, landing gear components, and / or skins used on an aircraft), vehicular frames, vehicular’ parts, motorcycles, wheels, and industrial structures and components. As used herein, “vehicle” or variations thereof includes, but is not limited to, civilian and military vehicles, such as automobiles, motorcycles, and / or trucks, light and heavy commercial vehicles, and / or civilian and military aircraft.

[0154] FIGS. 1 to 9 illustrate non-limiting examples of battery assembly components and constructions as well as non-limiting applications or use of compositions as disclosed herein in said battery assemblies. Although FIGS. 1 to 9 illustrate specific examples of cell shapes and cell arrangements, cells may be arranged in any configuration known to those skilled in the art. Additionally, the compositions disclosed herein, in a cured state, may be used to form pads, adhesives, structural adhesives, coatings, pottants and the like, to provide thermal protection between battery cells, within battery modules and / or within battery packs. These materials may be used on any surface or in any space within such battery assemblies. For example, compositions disclosed herein also may be useful in battery assemblies including, but not limited to, cell to module (FIGS. 3, 4, 6B), module to pack (FIGS. 6C, 7), cell to pack (FIG. 8), and cell to chassis battery assemblies (FIG. 9). Such battery assemblies may be used in, but not limited to, any aforementioned application.

[0155] Battery assemblies may be any combination of one or more battery cells, the interconnects which provide electrical conductivity between them, as well as ancillary components such as, in non-limiting examples, control electronics and components that ensure the necessary structural, mechanical, and environmental requirements for the operation of a specific battery (for example, without limitation, cell interconnectors such as wires, battery pack enclosures including trays and lids, module enclosures, module frames and frame plates, module racking, cooling and heating components including cooling plates, cooling fins, and cooling tubes, electrical busbars, battery management systems, battery thermal management systems, chargers, inverters and converters).

[0156] Battery cells 10 are generally single unit energy storage containers that may be connected in scries or in parallel. Battery cells may be any suitable size or shape known to those skilled in the ait, such as but not limited to, cylindrical (FIGS. 1, 4 and 9), prismatic (FIGS. 2, 5- 8) and / or pouch (FIG. 3). Battery cells 10 are enclosed to provide desired mechanical protection and environmental isolation of the cell. For example, cylindrical and prismatic cells may be encased in metal cans, cases, and lids, while pouch cells may be enclosed in multilayer laminate foils. Battery terminals 1 connect the electrodes inside the battery cell to the electrical circuit outside the battery cell, with one being a positive terminal and the other being a negative terminal. As illustrated in FIG. 4, battery cells 10 may be connected by interconnector wires 5 with other battery cells 10 in series or in parallel to enable an electric current to flow between cells 10.

[0157] As illustrated in FIGS. 3 and 4, battery cells 10 may be arranged in modules 100 comprising multiple cells 10 connected in series or in parallel. The modules 100 may include an enclosure of the arranged cells 10. Ancillary components, such as those aforementioned, may be included. Spaces of any dimensions may be located between the plurality of cells, ancillary components, base, and / or any interior surface of the module wall or other enclosure 120.

[0158] FIG. 1 illustrates a top-down view of cylindrical battery cells 10 having terminals 1. As shown, the cells are arranged in rows with either cooling tubes 3 or dielectric insulation paper (e-paper) 4 between them. As shown, materials, such as adhesive 6 and / or pottants 7 optionally formed from the compositions disclosed herein in a cured state, may be positioned between the cells 10, cooling tubes 3 and / or e-paper 4.

[0159] FIG. 2 illustrates an exploded isometric view of an array of prismatic battery cells 10. As shown, each prismatic cell 10 may comprise a top 11, a bottom 12, and walls 13 positioned between the top and bottom and each having a surface. As shown, materials, such as pads 8 formed from the compositions disclosed herein in a cured state, may be positioned between surfaces of cell walls 13 of adjacent cells 10.

[0160] FIG. 3 illustrates a cut-out front view of an array of pouch battery cells 10 in a module 100. The module walls 120 partially or fully encase the cells 10. As shown, materials, such as pads 8 formed from the compositions disclosed herein in a cured state, may be positioned between surfaces of cells 10.

[0161] FIG. 4 illustrates an isometric view of cylindrical cells 10 in a battery module 100. Each cell may comprise a top 11, a bottom 12, and walls 13 positioned between the top and bottom and each having a surface. The top 11 and the bottom 12 may be oppositely charged terminals with one being a positive terminal 1 and the other being a negative terminal (not shown). The battery cells may be connected at their terminals by interconnectors such as wires 5 and the like to enable an electric current to flow between the electric cells. The module 100 or module walls 120 may form a space having a volume. The cells 10 may be positioned within the space to consume a portion of the volume. The material, such as a pottant 7 formed from the coating compositions disclosed herein may be positioned within the space to consume a portion of the volume such that the material is adjacent to a surface of a cell wall 13 and / or an interior surface of one or more of the walls 120 of the module 100.

[0162] FIG. 5 illustrates an exploded perspective view of a battery module 100 comprised of one or more arrays of battery cells 10, a cooling fin 230, and a cooling plate 240. Materials, such as pads 8 formed from the compositions disclosed herein in a cured state, may be positioned between cells 10. Additional pads 8 may be positioned between the cells 10, the cooling fin 230, the cooling plate 240, and / or an interior surface of walls 120. Other pads 8 may be positioned adjacent to an exterior surface of the walls 120.

[0163] FIG. 6 illustrates an isometric view of a battery cell 10 (FIG. 6A) to battery module 100 (FIG. 6B) to battery pack 200 (FIG. 6C) battery assembly. The battery module 100 comprises a plurality of battery cells 10 and the battery pack 200 comprises a plurality of battery modules 100.

[0164] FIG. 7 illustrates a perspective view of a battery pack 200 cutout. The battery pack includes a plurality of battery modules 100 and cells 10 within each module 100. The base of the battery pack 200 comprises a cooling plate 240. Materials, such as adhesives, 9 formed from the compositions disclosed herein in a cured state, may be positioned between the cooling plate 240 and interior surface of a wall of the battery pack 200. Materials, such as pads 8 formed from the compositions disclosed herein in a cured state, may be positioned between cells 10 within modules 100.

[0165] FIG. 8 illustrates an isometric view of a cell 10 to pack battery 200 assembly. Cells 10 are arranged within the pack 200 (without being in separate modules).

[0166] In other cases, the battery cells may be arranged on or within an article such as, but not limited to, a cell to chassis battery assembly, as illustrated in FIG. 9, wherein one or more cells is used to construct the battery assembly without prior assembly of the cells into modules and / or packs. FIG. 9 illustrates an isometric cut-out view of a cell to chassis battery assembly 300. Cells 10 are arranged on a base comprising the undercarriage 55 and supported by the vehicle frame 45 and under the vehicle interior floor 35.

[0167] Any battery assembly may further comprise a thermal management system comprising air or fluid circuits which may be liquid based (for example glycol solutions) or direct refrigerant based.

[0168] The substrate may comprise a solvent-assisted degradable coating formed by one of the compositions disclosed herein on a portion of a surface of the substrate that, in a cured state, has:(a) a lap shear strength of at least 1 MPa measured according to ASTM D 1002- 10 using 3003 H24 aluminum substrate of 0.063 inch thickness, as measured by an INSTRON 5567 machine in tensile mode with a pull rate of 10 mm per minute, such as at least 2 MPa, such as at least 4 MPa, such as no more than 65 MPa, such as 1 MPa to 65 MPa, such as 2 MPa to 65 MPa, such as 4 MPa to 65 MPa; and / or(b) a tensile strength of at least 1 MPa measured according to ISO 37 -C using an INSTRON 5567 machine in tensile mode with a pull rate of 10 mm per minute, such as at least 2 MPa, such as at least 4 MPa, such as no more than 65 MPa, such as 1 MPa to 65 MPa, such as 2 MPa to 65 MPa, such as 4 MPa to 65 MPa; and / or(c) a tensile strain of at least 50% measured according to ISO 37 -C using an INSTRON 5567 machine in tensile mode with a pull rate of 10 mm per minute, such as at least 100%, such as at least 300%, such as no more than 1,500%, such as no more than 1,000%, such as no more than 900%, such as 50% to 1,500%, such as 100% to 1,000%, such as 300% to 900%; and / or(d) a thermal conductivity of at least 0.1 W / m-K measured using a TIM Thermal Resistance and Conductivity Measurement Apparatus (model LW-9389) according to ASTM D5470-17 (steady-state methods), such as at least 0.5 W / m-K, such as at least 1.0 W / m-K, such as no more than 5.0 W / m-K, such as no more than 3.0 W / m-K, such as nomore than 2.0 W / m-K, such as 0. 1 W / m-K to 5.0 W / m-K, such as 0.50 W / m-K to 3.0 W / m-K, such as 1.0 W / m-K to 2.0 W / m-K.Definitions

[0169] For purposes of this detailed description, it is to be understood that the disclosure may assume various alternative variations and step sequences, except where expressly specified to the contrary.

[0170] The numerical values set forth in the specific examples are reported as precisely as possible. Any numerical value, however, inherently contains certain errors necessarily resulting from the standard variation found in their respective testing measurements.

[0171] Also, any numerical range recited herein is intended to include all sub-ranges subsumed therein. For example, a range of “1 to 10” is intended to include all sub-ranges between (and including) the recited minimum value of 1 and the recited maximum value of 10, that is, having a minimum value equal to or greater than 1 and a maximum value of equal to or less than 10.

[0172] As used herein, “including,” “containing,” and like terms are understood in the context of this application to be synonymous with “comprising” and are therefore open-ended and do not exclude the presence of additional undescribed or unrecited elements, materials, ingredients, or method steps. As used herein, “consisting of’ is understood in the context of this application to exclude the presence of any unspecified element, ingredient, or method step. As used herein, “consisting essentially of’ is understood in the context of this application to include the specified elements, materials, or ingredients or method steps “and those that do not materially affect the basic and novel characteristic(s)” of what is being described.

[0173] In addition, in this application, the use of “or” means “and / or” unless specifically stated otherwise, even though “and / or” may be explicitly used in certain instances.

[0174] As used herein, the terms “on,” “onto,” “applied on,” “applied onto,” “formed on,” “deposited on,” deposited onto,” and the like mean formed, overlaid, deposited, or provided on, but not necessarily in contact with, a substrate surface. For example, a composition “applied onto” a substrate surface does not preclude the present of one or more intervening coatings of the same or different composition located between the composition and the substrate surface.

[0175] As used herein, a “composition” or “coating composition” refers to a solution, mixture, or a dispersion that is capable of producing a coating on a surface of a substrate.

[0176] As used herein, “coating” refers to films, layers, and the like.

[0177] As used herein, a “scaling composition” refers to a curable composition that, when cured, forms a seal.

[0178] As used herein, a “sealant” refers to a cured coating that has the ability to resist atmospheric conditions such as temperature and moisture gradients and particulate matter, such as moisture and temperature, and block transmission of materials, such as particulates, water, fuel, and other liquids and gasses.

[0179] As used herein, an “adhesive composition” refers to a curable composition that, when cured, forms an adhesive or a structural adhesive.

[0180] As used herein, an “adhesive” refers to a cured coating that produces a loadbearing joint, such as a load-bearing joint having a lap shear strength of at least 0.05 MPa and less than 5 MPa, as determined according to ASTM D 1002- 10 using an Instron 5567 machine in tensile mode with a pull rate of 1.3 mm per minute.

[0181] As used herein, a “structural adhesive” refers to a cured coating that produces a load-bearing joint having a lap shear strength of at least 5 MPa measured according to ASTM D1002-10 using an Instron 5567 machine in tensile mode with a pull rate of 1.3 mm per minute.

[0182] As used herein, a “gap filler composition” refers to a curable composition that, when cured, forms a gap filler.

[0183] As used herein, a “gap filler” refers to a coating that fills a gap.

[0184] As used herein, a “pottant composition” refers to a curable composition that, when cured, forms a pottant.

[0185] As used herein, a “pottant” refers to an encapsulant.

[0186] As used herein, a “pre-preg” refers to a composition pre-impregnating reinforcement fibers prior to cure.

[0187] As further defined herein, ambient conditions generally refer to room temperature (e.g., 23°C) and humidity conditions or temperature and humidity conditions that are typically found in the area in which the composition is applied to a substrate, e.g., at 10°C to 40°C and 5% to 80% relative humidity, while slightly thermal conditions are temperatures that are slightly above ambient temperature, but are generally below the curing temperature for the composition (i.e., in other words, at temperatures and humidity conditions below which the reactivecomponents will readily react and cure, e.g., > 40°C and less than 220°C at 20% to 80% relative humidity).

[0188] As used herein, the term “two-component” or “2K” refers to a composition in which a portion of the reactive components readily associate to form an interaction or react to form a bond (physically or chemically), i.e., cure without activation from an external energy source, such as at ambient or slightly thermal conditions, when mixed. One of skill in the art understands that the two components of the composition are stored separately from each other and mixed just prior to application of the composition. Two-component compositions may optionally be heated or baked, as described below.

[0189] As used herein, the terms “cure,” “cured,” “curing,” or the like, means that the components that form the composition are crosslinked (i.e., interact and / or react) to form a coating or a bond. In the case of a 2K composition, the composition begins to cure when the components of the composition are mixed resulting in the reaction of the reactive functional groups of the components of the composition.

[0190] The term “curable,” as used, for example, in connection with a coating composition, means that the composition is able to be cured under ambient or slightly thermal conditions.

[0191] As used herein, “solvent-assisted degradable,” “solvent-assisted degradability,” and the like refer to a substance, such as a coating, that degrades upon exposure to a solvent or a blend of solvents capable of cleaving a disulfide bond, such as a reducing agent.

[0192] As used herein, “reducing agent” refers to a compound that donates electrons.

[0193] As used herein, unless indicated otherwise, “substantially free” refers to a particular material that is not purposefully added to a mixture or composition, respectively, and is present only as an impurity in a trace amount of less than 0.05% by weight based on total weight of the mixture or composition, respectively. As used herein, unless indicated otherwise, “essentially free” means that a particular material is not purposefully added to a mixture or composition and is present only as an impurity in a trace amount of less than 0.01% by weight based on total weight of the mixture or composition, respectively. As used herein, unless indicated otherwise, “completely free” means that a mixture or composition, respectively, does not comprise a particular material, i.e., the mixture or composition comprises 0% by weight of such material based on total weight of the mixture or composition.

[0194] In view of the foregoing description, the present disclosure thus relates to the following Aspects 1 to 97 without being limited thereto.

[0195] 1. A composition comprising: a first component comprising a polyisocyanate; a second component comprising a first polyol; and an accelerator; wherein the polyisocyanate and / or the first polyol comprise a polysulfide linkage.

[0196] 2. The composition of aspect 1, wherein the isocyanate comprising the polysulfide linkage comprises a reaction product of reactants comprising (i) an isocyanate reactant and (ii) a polysulfide-linkage containing compound.

[0197] 3. The composition of aspect 1 or aspect 2, wherein the polyisocyanate comprises the polysulfide linkage in an amount of at least 0.6% by weight based on total weight of the isocyanate-containing compounds and active hydrogen-containing compounds, such as at least 0.8% by weight.

[0198] 4. The composition of any preceding aspect, wherein the polyisocyanate comprises the poly sulfide linkage in an amount of at least 1.0% by weight based on total weight of isocyanate-containing compounds and active hydrogen-containing compounds, such as at least 1.2% by weight.

[0199] 5. The composition of any preceding aspect, wherein the polyisocyanate comprises the poly sulfide linkage in an amount of no more than 25% by weight based on total weight of isocyanate-containing compounds and active hydrogen-containing compounds, such as no more than 15% by weight.

[0200] 6. The composition of any preceding aspect, wherein the polyisocyanate comprises the polysulfide linkage in an amount of 0.6% by weight to 25% by weight based on total weight of isocyanate-containing compounds and active hydrogen-containing compounds, such as 0.8% by weight to 15% by weight.

[0201] 7. The composition of any preceding aspect, wherein the polyisocyanate comprises the poly sulfide linkage in an amount of no more than 10% by weight based on total weight of isocyanate-containing compounds and active hydrogen-containing compounds, such as no more than 5% by weight.

[0202] 8. The composition of any preceding aspect, wherein the polyisocyanate comprises the polysulfidc linkage in an amount of 1.0% by weight to 10% by weight based on total weight of isocyanate-containing compounds and active hydrogen-containing compounds, such as 1.2% by weight to 5% by weight.

[0203] 9. The composition of any preceding aspect, wherein the polyisocyanate has an average isocyanate functionality of at least 1.5, such as at least 1.9.

[0204] 10. The composition of any preceding aspect, wherein the polyisocyanate has an average isocyanate functionality of equal to or less than 8, such as equal to or less than 3.

[0205] 11. The composition of any preceding aspect, wherein the polyisocyanate has an average isocyanate functionality in a range of 1.5 to 8, such as 1.9 to 3.

[0206] 12. The composition of any preceding aspect, wherein the composition is substantially free, essentially free, or completely free of monofunctional isocyanate and / or solvent.

[0207] 13. The composition of any preceding aspect, wherein the polyisocyanate has an equivalent weight of at least 100 g / eq, such as at least 150 g / eq.

[0208] 14. The composition of any preceding aspect, wherein the polyisocyanate has an equivalent weight of equal to or less than 1,500 g / eq, such as equal to or less than 500 g / eq.

[0209] 15. The composition of any preceding aspect, wherein the polyisocyanate has an equivalent weight in a range of 100 g / eq to 1,500 g / eq, such as 150 g / eq to 500 g / eq.

[0210] 16. The composition of any preceding aspect, wherein the polyisocyanate comprises a functional group in addition to the polyisocyanate functional groups.

[0211] 17. The composition of any preceding aspect, wherein the polysulfide linkage comprises an aliphatic polysulfide linkage.

[0212] 18. The composition of any preceding aspect, wherein the first polyol has an average hydroxyl functionality in a range of more than 1, such as at least 2.

[0213] 19. The composition of any preceding aspect, wherein the first polyol has an average hydroxyl functionality of equal to or less than 5, such as equal to or less than 4.

[0214] 20. The composition of any preceding aspect, wherein the first polyol has an average hydroxyl functionality of equal to or less than 3.

[0215] 21. The composition of any preceding aspect, wherein the first polyol has an average hydroxyl functionality in a range of greater than 1 to 5, such as 2 to 4.

[0216] 22. The composition of any preceding aspect, wherein the first polyol has an average hydroxyl functionality of 2 to 3.

[0217] 23. The composition of any preceding aspect, wherein the first polyol has a hydroxyl equivalent weight of at least 50 g / eq, such as at least 75 g / eq.

[0218] 24. The composition of any preceding aspect, wherein the first polyol has a hydroxyl equivalent weight of equal to or less than 2,500 g / eq, such as equal to or less than 500 g / eq.

[0219] 25. The composition of any preceding aspect, wherein the first polyol has a hydroxyl equivalent weight in a range of 50 g / eq to 2,500 g / eq, such as 75 g / eq to 500 g / eq.

[0220] 26. The composition of any preceding aspect, wherein the first polyol comprising the polysulfide linkage comprises a reaction product of reactants comprising (i) a polyol reactant and (ii) a polysulfide-linkage containing compound.

[0221] 27. The composition of any preceding aspect, wherein the first polyol comprises the polysulfide linkage in an amount of at least 0.6% by weight based on total weight of the isocyanate-containing compounds and active hydrogen-containing compounds, such as at least 0.8% by weight.

[0222] 28. The composition of any preceding aspect, wherein the first polyol comprises the poly sulfide linkage in an amount of at least 1.0% by weight based on total weight of the isocyanate-containing compounds and active hydrogen-containing compounds, such as at least 1.2% by weight.

[0223] 29. The composition of any preceding aspect, wherein the first polyol comprises the poly sulfide linkage in an amount of no more than 25% by weight based on total weight of isocyanate-containing compounds and active hydrogen-containing compounds, such as no more than 15% by weight.

[0224] 30. The composition of any preceding aspect, wherein the first polyol comprises the polysulfide linkage in an amount of 0.6% by weight to 25% by weight based on total weight of isocyanate-containing compounds and active hydrogen-containing compounds, such as 0.8% by weight to 15% by weight.

[0225] 31. The composition of any preceding aspect, wherein the first polyol comprises the poly sulfide linkage in an amount of no more than 10% by weight based on totalweight of isocyanate-containing compounds and active hydrogen-containing compounds, such as no more than 5% by weight.

[0226] 32. The composition of any preceding aspect, wherein the first polyol comprises the polysulfide linkage in an amount of 1.0% by weight to 10% by weight based on total weight of isocyanate-containing compounds and active hydrogen-containing compounds, such as 1.2% by weight to 5% by weight.

[0227] 33. The composition of any preceding aspect, further comprising a second polyol.

[0228] 34. The composition of aspect 33, wherein the second polyol is present in the second component and / or a third component.

[0229] 35. The composition of aspect 33 or aspect 34, wherein the second polyol is substantially free, essentially free, or completely free of a polysulfide linkage.

[0230] 36. The composition of any aspect 33 to 35, wherein the second polyol has an average hydroxyl functionality of at least 2.

[0231] 37. The composition of any aspect 33 to 36, wherein the second polyol has an average hydroxyl functionality of equal to or less than 15, such as equal to or less than 8.

[0232] 38. The composition of any aspect 33 to 37, wherein the second polyol has an average hydroxyl functionality in a range of 2 to 15, such as 2 to 8.

[0233] 39. The composition of any aspect 33 to 38, wherein the second polyol comprises a secondary polyol.

[0234] 40. The composition of any preceding aspect, further comprising an amine.

[0235] 41. The composition of aspect 40, wherein the amine is present in the second component and / or a third component.

[0236] 42. The composition of aspect 40 or aspect 41, wherein the amine comprises a primary amine, a secondary amine, a diamine, an aromatic amine, and / or a liquid amine.

[0237] 43. The composition of any aspect 40 to 42, wherein the amine is substantially free, essentially free, or completely free of a polysulfide linkage.

[0238] 44. The composition of any aspect 40 to 43, wherein the amine has an amine equivalent weight in a range of at least 24 g / eq, such as at least 50 g / eq.

[0239] 45. The composition of any aspect 40 to 44, wherein the amine has an amine equivalent weight of equal to or less than 1,500 g / eq, such as equal to or less than 1,000 g / eq.

[0240] 46. The composition of any aspect 40 to 45, wherein the amine has an amine equivalent weight in a range of 24 g / cq to 1,500 g / cq, such as 50 g / cq to 1,000 g / cq.

[0241] 47. The composition of any preceding aspect, further comprising an accelerator.

[0242] 48. The composition of aspect 47, wherein the accelerator is present in the second component and / or a third component.

[0243] 49. The composition of aspect 47 or aspect 48, wherein the accelerator comprises an amine-based catalyst and / or a metal-based catalyst.

[0244] 50. The composition of any aspect 47 to 49, wherein the accelerator comprises a latent accelerator.

[0245] 51. The composition of any aspect 47 to 50, comprising the accelerator in an amount of at least 0.05% by weight based on total weight of the composition, such as at least 0.1% by weight.

[0246] 52. The composition of any aspect 47 to 51, comprising the accelerator in an amount of no more than 5% by weight based on total weight of the composition, such as no more than 1% by weight.

[0247] 53. The composition of any aspect 47 to 52, comprising the accelerator in an amount of 0.05% by weight to 5% by weight based on total weight of the composition, such as 0.1% by weight to 1% by weight.

[0248] 54. The composition of any preceding aspect, further comprising a filler.

[0249] 55. The composition of aspect 54, wherein the filler is present in the first component, the second component, and / or a third component.

[0250] 56. The composition of aspect 54 or aspect 55, comprising the filler in an amount of at least 10% by weight based on total weight of the composition, such as at least 50% by weight.

[0251] 57. The composition of any aspect 54 to 56, comprising the filler in an amount of no more than 90% by weight based on total weight of the composition, such as no more than 80% by weight.

[0252] 58. The composition of any aspect 54 to 57, comprising the filler in an amount of 10% by weight to 90% by weight based on total weight of the composition, such as 50% to 80% by weight.

[0253] 59. The composition of any aspect 54 to 58, wherein the filler comprises a thermally conductive, electrically insulative filler; a thermally conductive, electrically conductive filler; and / or a non-thermally conductive, electrically insulative filler.

[0254] 60. The composition of any aspect 1 to 11 or 13 to 59, further comprising a solvent.

[0255] 61. The composition of aspect 60, comprising the solvent in an amount of at least 10% by weight based on total weight of the composition, such as at least 15% by weight.

[0256] 62. The composition of aspect 60 or aspect 61, comprising the solvent in an amount of no more than 60% by weight based on total weight of the composition, such as no more than 50% by weight.

[0257] 63. The composition of any aspect 60 to 62, comprising the solvent in an amount of 10% by weight to 60% by weight based on total weight of the composition, such as 15% by weight to 50% by weight.

[0258] 64. The composition of any preceding aspect, further comprising an additive.

[0259] 65. The composition of aspect 64, comprising the additive in an amount of at least 0.5% by weight based on total weight of the composition, such as at least 1% by weight.

[0260] 66. The composition of aspect 64 or aspect 65, comprising the additive in an amount of no more than 10% by weight based on total weight of the composition, such as no more than 5% by weight.

[0261] 67. The composition of any aspect 64 to 66, comprising the additive in an amount of 0.5% by weight to 10% by weight based on total weight of the composition, such as 1% by weight to 5% by weight.

[0262] 68. The composition of any of the preceding aspects, further comprising elastomeric particles.

[0263] 69. The composition of aspect 68, comprising the elastomeric particles in an amount of at least 0.1% by weight based on total weight of the composition, such as at least 1% by weight.

[0264] 70. The composition of aspect 68 or aspect 69, comprising the elastomeric particles in an amount of no more than 50% by weight based on total weight of the composition, such as no more than 20% by weight.

[0265] 71 . The composition of any aspect 68 to 70, comprising the elastomeric particles in an amount of 0.1% by weight to 50% by weight based on total weight of the composition, such as 1% by weight to 20% by weight.

[0266] 72. The composition of any preceding aspect, further comprising a dispersant.

[0267] 73. The composition of aspect 72, comprising the dispersant in an amount of at least 0.1% by weight based on total weight of the composition, such as at least 1% by weight.

[0268] 74. The composition of aspect 72 or aspect 73, comprising the dispersant in an amount of no more than 7% by weight based on total weight of the composition, such as no more than 3% by weight.

[0269] 75. The composition of any aspect 72 to 74, comprising the dispersant in an amount of 0.1% by weight to 7% by weight based on total weight of the composition, such as 1% by weight to 3% by weight.

[0270] 76. The composition of any preceding aspect, wherein the first component has a viscosity at 25°C of at least 0.0001 Pa-s, such as at least 0.005 Pa-s, wherein the viscosity is measured by parallel plate rheology with a plate diameter of 25 mm, a gap of 0.3 mm, and a shear rate of 1 s’1.

[0271] 77. The composition of any preceding aspect, wherein the first component has a viscosity at 25°C equal to or less than 3,000 Pa-s, such as equal to or less than 1,000 Pa-s, wherein the viscosity is measured by parallel plate rheology with a plate diameter of 25 mm, a gap of 0.3 mm, and a shear rate of 1 s’1.

[0272] 78. The composition of any preceding aspect, wherein the first component has a viscosity at 25°C in a range of 0.0001 Pa-s to 3,000 Pa-s, such as 0.005 Pa-s to 1,000 Pa-s, wherein the viscosity is measured by parallel plate rheology with a plate diameter of 25 mm, a gap of 0.3 mm, and a shear rate of 1 s’1.

[0273] 79. The composition of any preceding aspect, wherein the second component has a viscosity at 25°C of at least 0.0001 Pa-s, such as at least 0.005 Pa-s, wherein the viscosity is measured by parallel plate rheology with a plate diameter of 25 mm, a gap of 0.3 mm, and a shear rate of 1 s’1.

[0274] 80. The composition of any preceding aspect, wherein the second component has a viscosity at 25°C equal to or less than 3,000 Pa-s, such as equal to or less than 1,000 Pa-s,wherein the viscosity is measured by parallel plate rheology with a plate diameter of 25 mm, a gap of 0.3 mm, and a shear rate of 1 s’1.

[0275] 81. The composition of any preceding aspect, wherein the second component has a viscosity at 25°C in a range of 0.0001 Pa-s to 3,000 Pa-s, such as 0.005 Pa-s to 1,000 Pa-s, wherein the viscosity is measured by parallel plate rheology with a plate diameter of 25 mm, a gap of 0.3 mm, and a shear rate of 1 s’1.

[0276] 82. The composition of any preceding aspect, comprising the polysulfide linkage in an amount of at least 0.6% by weight based on total weight of the isocyanate- containing compounds and active hydrogen -containing compounds, such as at least 1.0% by weight.

[0277] 83. The composition of any preceding aspect, comprising the poly sulfide linkage in an amount of no more than 25% by weight based on total weight of isocyanate- containing compounds and active hydrogen-containing compounds, such as no more than 10% by weight.

[0278] 84. The composition of any preceding aspect, comprising the polysulfide linkage in an amount of 0.6% by weight to 25% by weight based on total weight of isocyanate- containing compounds and active hydrogen-containing compounds, such as 1.0% by weight to 10% by weight.

[0279] 85. A substrate comprising a coating formed from the composition of any preceding aspect on a surface thereof.

[0280] 86. The substrate of aspect 85, further comprising a dielectric coating.

[0281] 87. A battery comprising the substrate of aspect 85 or aspect 86.10282] 88. A use of the composition of any aspect 1 to 84 to form a coating having a lap shear strength of at least 1 MPa, such as at least 4 MPa, measured according to ASTMD 1002- 10 using 3003 H24 aluminum substrate of 0.063-inch thickness, as measured by an INSTRON 5567 machine in tensile mode with a pull rate of 10 mm per minute.

[0283] 89. The use of aspect 88, to form a coating having a lap shear strength equal to or less than 65 MPa, measured according to ASTM D1002-10 using 3003 H24 aluminum substrate of 0.063-inch thickness, as measured by an INSTRON 5567 machine in tensile mode with a pull rate of 10 mm per minute.

[0284] 90. A use of the composition of any aspect 1 to 84 to form a coating having a tensile strength of at least 1 Pa, such as at least 4 MPa, measured according to ISO 37 -C using an INSTRON 5567 machine in tensile mode with a pull rate of 10 mm per minute.

[0285] 91. The use of aspect 90, to form a coating having a tensile strength equal to or less than 65 MPa, measured according to ISO 37-C using an INSTRON 5567 machine in tensile mode with a pull rate of 10 mm per minute.

[0286] 92. A use of the composition of any aspect 1 to 84 to form a coating having a tensile strain of at least 50%, such as at least 300%, measured according to ISO 37-C using an INSTRON 5567 machine in tensile mode with a pull rate of 10 mm per minute.

[0287] 93. The use of aspect 92, to form a coating having a tensile strain of equal to or less than 1,500%, such as equal to or less than 900%, measured according to ISO 37-C using an INSTRON 5567 machine in tensile mode with a pull rate of 10 mm per minute.

[0288] 94. A use of the composition of any aspect 1 to 84 to form a coating having a thermal conductivity of at least 0.1 W / m-K, such as at least 1.0 W / m-K, measured using a TIM Thermal Resistance and Conductivity Measurement Apparatus (model LW-9389) according to ASTM D5470-17 (steady-state methods).

[0289] 95. The use of aspect 94, to form a coating having a thermal conductivity of no more than 5.0 W / m-K, such as no more than 2.0 W / m-K.

[0290] 96. A kit comprising: a first composition for forming a solvent-assisted degradable foam, the first composition comprising the composition of any aspect 1 to 84; and a second composition for degradation of the solvent-assisted degradable foam.

[0291] 97. The kit of claim 96, wherein the second composition comprises a thiol and / or a base.

[0292] Illustrating the disclosed subject matter are the following examples that are not considered as limiting the disclosure to their details. All parts and percentages in the examples, as well as throughout the specification, are by weight unless otherwise indicated.ExamplesExample 1: Synthesis of Isocyanate Polymer 1TABLE 122- Hydroxyethyl disulfide is commercially available from Fisher Scientific.

[0293] Part #1 was added to a 500-mililiter, 4-necked round flask equipped with a motor driven stainless steel stir blade, a water-cooled condenser, a nitrogen blanket, and a heating mantle with a thermometer connected through a temperature feedback control device. Part #2 was then added to the flask dropwise and the reaction mixture was heated to 80°C. The reaction mixture was maintained at 80°C until the NCO equivalent weight was stalled, as determined by titration. The titration was performed by dissolving the isocyanate sample in a solution of n- dibutylamine in the appropriate solvent (e.g., toluene) and the mixture was stirred for 20 minutes, followed by dilution with isopropanol. The excess n-dibutylamine was back-titrated with HC1 solution. Once the NCO equivalent weight stalled, the reaction mixture was poured out at 40°C. The final NCO equivalent weight was 209 g / eq which was determined by titration.Example 2: Synthesis of Isocyanate Polymer 2TABLE 21PolyTHF 1000 is commercially available from BASF.2Polyol PPG- 1025 is commercially available from Covestro.

[0294] Part #1 was added to a 2000-mililitcr, 4-ncckcd round flask equipped with a motor driven stainless steel stir blade, a water-cooled condenser, a nitrogen blanket, and a heating mantle with a thermometer connected through a temperature feedback control device. Then the reaction mixture was heated to 70°C and Part #2 was added to the flask dropwise. The reaction mixture was maintained at 70°C until the NCO equivalent weight was stalled around 333 g / eq, determined by titration as described above. Part #3 was added dropwise over 1 hour. Then the reaction mixture was maintained at 70°C until the NCO equivalent weight was stalled around 510 g / eq, determined by titration as described above. The reaction mixture was poured out at 40°C. The final NCO equivalent weight was 510.2 g / eq, determined by titration as described above.Example 3: Synthesis of Isocyanate Polymer 3TABLE 311,6- hexanediol is commercially available from BASF.

[0295] Part #1 was added to a 500-mililiter, 4-necked round flask equipped with a motor driven stainless steel stir blade, a water-cooled condenser, a nitrogen blanket, and a heating mantle with a thermometer connected through a temperature feedback control device. Part#2 was added to the flask dropwise. Then the reaction mixture was heated to and maintained at 80°C until the NCO equivalent weight was stalled, as determined by titration as described above. Then the reaction mixture was poured out at 40°C. The final NCO equivalent weight was 190.7 g / eq, which was determined by titration as described above.Example 4: Synthesis of Isocyanate Polymer 4TABLE 411,4-butanediol is commercially available from BASF.

[0296] Part #1 was added to a 5000-mililiter, 4-necked round flask equipped with a motor driven stainless steel stir blade, a water-cooled condenser, a nitrogen blanket, and a heating mantle with a thermometer connected through a temperature feedback control device. Then the reaction mixture was heated to 70°C. Part #2 was added dropwise to the flask at 70°C. The reaction mixture was maintained at 70°C until the NCO equivalent weight was stalled around 333 g / eq. Part #3 was added dropwise over 1 hour. The reaction mixture was maintained at 70°C until the NCO equivalent weight was stalled around 504 g / eq, determined by titration as described above. The reaction mixture was poured out at 40°C. The final NCO equivalent weight was 514.3 g / eq, determined by titration as described above.Example 5: Synthesis of Polyol Polymer 1TABLE 5

[0297] Part #1 was added to a 2000-mililiter, 4-necked round flask equipped with a motor driven stainless steel stir blade, a water-cooled condenser, a nitrogen blanket, and a heating mantle with a thermometer connected through a temperature feedback control device. Part #2 was added dropwise to the flask. Then the reaction mixture was heated to and maintained at 65°C until IR spectroscopy showed the absence of the characteristic NCO band (2269 cm-1) using the Thermo Scientific Nicolet iS5 FT-IR. The reaction mixture was poured out at 40°C. The final OH equivalent weight was 1238.1 g / eq, which was determined by esterification with excess acetic anhydride at elevated temperatures using imidazole as a catalyst. The excess acetic anhydride was converted to acetic acid by hydrolysis and titrated potentiometrically with standard potassium hydroxide.Example 6: Preparation of Compositions

[0298] All quantities in the following tables are measured in terms of weight in grams unless otherwise noted. Compositions I-IV, 1-8, and 9-13 were prepared using the materials and quantities listed in Tables 7, 8, and 9, respectively. Part A and Part B of each composition were formed by blending the liquid components and mixing for 1 minute at 1800 RPM using a Dual-Asymmetric Mixer (SpeedMixer®), then adding portions of the solid components and mixing for 1 minute at 1800 RPM between each addition. The individual pails were mixed for 2 minutes at 1800 RPM for a final mix. Part A and Part B were then combined and mixed for 1 minute at 1800 RPM using a SpeedMixer®. Lap shears were prepared on 0.063"xl"x2" degreased pieces of 3003 H24 aluminum. Each composition was applied to approximately 0.30" to the end of a substrate and 0.02" diameter glass beads were lightly applied on top of the composition. A second substrate was applied to create a 0.25" bond overlap of adhesive between the two substrates. The joints for compositions I-IV were cured in an oven at 70°C for 24 hours. The joints for compositions 1-18 were cured for seven days at 25°C and 50% relative humidity.

[0299] Lap shear strength was tested using an INSTRON 5567 machine in tensile mode with a pull rate of 10 mm per minute according to ASTM DI 002- 10 using 3003 H24 aluminum substrates of 0.063 in. thickness, 1 in. width and 2 in. length, and a 0.25" bond overlap. Tensile samples for compositions 1-8 were prepared by pressing wet adhesive between two sheets of polyethylene plastic to 1 / 8” thickness then cut with an ISO 37 -C die after curing for 7 days at25°C and 50% humidity according to ISO 37:2017. The tensile samples were tested on an Instron 5567 frame using a pull rate of 10 mm / min at a temperature of 23 °C.

[0300] Samples for thermal conductivity testing were prepared in molds with a 2.25” diameter and a thickness of at least 0.2”. Thermal conductivity testing was conducted in accordance with ASTM D7984-21 using a C-Therm Thermal Conductivity Instrument (TCI) with the Modified Transient Plane Source (MTPS) method.

[0301] Results of lap shear strength and thermal conductivity testing for Compositions I to IV are provided in Table 7. Results of lap shear strength, thermal conductivity, tensile strength, and tensile strain testing are provided in Table 8.Example 7 : Preparation of Solvent Blend

[0302] A blend of solvents (Solvent Blend 1) was prepared by mixing caprolactone, acetone, and ethanol in the proportions indicated in Table 6.Table 61Caprolactone is commercially available from Fisher Scientific.2Acetone is commercially available from Fisher Scientific.3Ethanol is commercially available from Fisher Scientific.Example 8: Preparation of Solutions

[0303] The solvents used include dimethyl formamide (DMF), triethyl phosphate (TEP), Solvent Blend 1, heptanes and water. Each solution for solvent assisted debonding tests was prepared via the following procedure. To a glass jar (8 oz) was added the appropriate solvent (100 g), 3,6-Dioxa-l,8-octancdithiol (20 g), and tris-(dimcthylaminomcthyl) phenol (20 g). One solution was prepared by mixing 100 g Solvent Blend 1 and 20 g tris-(dimethylaminomethyl) phenol, but not thiol. Each glass jar was then capped and gently swirled until the contents were well mixed. Table 7 provides the Hansen solubility parameters of the solvents used. The Hansen solubility parameters refer to the dispersion forces, dipolar intermolecular forces, and hydrogen bonding between two materials, which may be used to predict whether one material will dissolve in the other to form a solution. Hansen solubility parameters may be calculatedbased on the methods provided in Diaz de los Rios, M., Hernandez Ramos, E., Determination of the Hansen solubility parameters and the Hansen sphere radius with the aid of the solver add-in of Microsoft Excel. SN Appl. Sci. 2, 676 (2020). As shown in the results in Table 9 and FIGS. 10 and 11, solvents with higher Hansen solubility parameters, such as Solvent Blend 1 and are more effective at degrading the foam.Table 7 : Hansen Solubility Parameters of SolventsExample 9: Solvent Assisted Degradation

[0304] Solvent assisted degradations were performed using Fisherbrand™ 112xx series advanced ultrasonic cleaner filled with water at 20-25 °C and set at 37 Hz and 100% power. For each composition, three replications of lap shear joints were added to a glass jar containing the appropriate solution described in Example 8. For the sonication step, two glass jars each containing the appropriate solution and lap shear joints of the appropriate composition were capped and suspended in the ultrasonic cleaner water bath equidistant from the walls using a custom-built sample holder. The samples were sonicated for 30 minutes, with one-minute pauses after every 5 minutes to inspect the samples for degradation and swap their positions to improve consistency. The water in the ultrasonic cleaner bath was changed after every 30 minutes of sonication to maintain a consistent starling temperature of 20-25 °C for every test. After sonication the lap shear joints were removed from the glass jars and washed with acetone followed by blowing with nitrogen until dry (approximately 2 minutes). Subsequently, lap shear specimens that were still intact were tested for lap shear strength using an INSTRON 5567 machine in tensile mode with a pull rate of 10 mm per minute as described in Example 6. The results for Compositions I to IV are provided in Table 8. The results for Compositions 1-8 are provided in Table 9. FIG. 10 provides the lap shear strength before degradation and afterdegradation in compositions comprising filler. FIG. 11 provides the lap shear strength before degradation and after degradation in compositions without filler.Table 8: Compositions and test results for comp I-IV1Aluminum Oxide (TM-3310)2Sylosiv A3 is zeolite powder available from W.R. Grace and Company3Disperbyk 2152 is a dispersant available from BYK4PolyTHF 250 is a polytetrahydrofuran polyol available from BASF5Ethacure 300 is a Dimethylthiotoluenediamine available from Albemarle Corporation6Siliquest Al 00 is a 33% solution of triethylenediamine in dipropylene glycol available from Evonik Industries AG7Dabco L33V is a 33% solution of triethylenediamine in dipropylene glycol available from Evonik Industries AG

[0305] The results provided in Table 7 demonstrate that incorporating an amine into the compositions significantly increased lap shear strength. The results further demonstrate that incorporating thermally conductive filler significantly increased lap shear strength and thermal conductivity.Table 9: Compositions and test results for Comps 1-8

[0306] The results in Table 9 demonstrate that coatings formed from compositions comprising an isocyanate polymer comprising a polysulfide linkage demonstrate thermal conductivity, lap shear, and tensile properties comparable to coatings prepared from compositions that do not contain a polysulfide linkage. However, the coatings comprising an isocyanate polymer comprising a polysulfide linkage also exhibited solvent-assisted reversibility. Additionally, the results in Table 8 demonstrate that incorporating thermally conductive filler in the composition increased lap shear- strength and thermal conductivity. Finally, the results in Table 9 demonstrate that the solvent used to degrade coatings prepared from the compositions disclosed herein must contain a base and a thiol for successful degradation.

[0307] The results demonstrated in FIGS. 10 and 11 demonstrate that increasing the disulfide content in both filled and unfilled compositions, respectively, resulted in faster solvent- assisted degradation.Example 10: Solvent Assisted Degradation of Compositions Incorporating Disulfide in Part A or Part B

[0308] Solvent assisted degradations were performed as described in Example 9. Subsequently, lap shear specimens that were still intact were tested for lap shear strength using an INSTRON 5567 machine in tensile mode with a pull rate of 10 mm per minute as described in Example 6. The results are shown in Table 10.Table 10: Compositions Incorporating Disulfide in Both Sides

[0309] The results in Table 10 demonstrate that compositions comprising incorporation of a polysulfide linkage in either the isocyanate, the polyol, or both demonstrated lap shear strength comparable or better than a composition comprising no polysulfide linkage (see Composition 1, Table 9). However, compositions comprising a polysulfide linkage demonstrated the intended drop in debonding strength following 30 minutes sonication in the prescribed solvent blend (Solvent Blend 1). These results demonstrate that incorporation of the polysulfide in the composition results in solvent degradation, regardless of whether it is added into either side independently or in both Pail A and Pail B.Example 11: Solvent Assisted Degradation Coatings Compositions

[0310] Compositions 14-18 were prepared with the components listed in Table 11 using the same procedure set forth in Example 6. The resulting mixtures were applied to cleaned and degreased 4” x 3” x 0.063” thick Al. 2024 substrate via a l” foam brush. The compositions were then allowed to cure and dry over the course of 48 hours. After 48 hours, two cleaned and degreased 10 mm diameter DeFelsko adhesion dollies were adhered to the cured coating using 3M DP460 Epoxy (commercially available from 3M) . The dollies were then allowed to cure for 48 hours.

[0311] Three coated panels with adhered dollies were created for each composition. The first was tested before sonication, the second was tested after sonicating with Solvent Blend 1 as prepared in Example 7 (No Active Ingredients), and the third was tested after sonicating with the solution comprising Solvent Blend 1 and the active ingredients, as prepared in Example 8. Solvent assisted degradations were performed using Fisherbrand™ FS60H series advanced ultrasonic cleaner filled with water at 20-25°C and set at 42 Hz and 100% power. For eachsonication trial, a coated panel with adhered dollies was added to an empty 2L DAC cup. The DAC cup was then suspended in the sonication bath. 100 g of the appropriate solvent blend was added to the DAC cup. The panel was allowed to sonicate within the solvent blend, for five minutes. After sonication, the panel was rinsed with acetone and allowed to dry.

[0312] For specimens that were still intact, film thickness tests were performed using a Fisher Technology, Inc. FISCHERSCOPE MMS Permascope. Readings were taken in three different locations on the panel and averaged. Pull off tests were performed using a Delsko Corporation PosiTest ATA-B adhesion tester, configured to pull 10 mm dollies at a rate of 4.0 MPa / s. Results are provided in Table 10. “N / A” indicates that it could not be tested because the coating fully degraded.Table 11: Coating Compositions

[0313] The results in Table 11 demonstrate that the incorporation of disulfide linkages on either Pail A or Part B of the composition results in a coating that can be removed following 5 minutes of sonication in solvent.

[0314] Whereas aspects of the disclosure have been described in detail, it will be appreciated by those skilled in the art that various modifications and alternatives to those details could be developed in light of the overall teachings of the disclosure. Accordingly, the particular arrangements disclosed are meant to be illustrative only and not limited as to the scope of the disclosure which is to be given the full breadth of the claims and aspects appended and any and all equivalents thereof.

Claims

We claim:

1. A composition comprising: a first component comprising a polyisocyanate; a second component comprising a first polyol; an accelerator; and a filler, wherein the polyisocyanate and / or the first polyol comprise a polysulfide linkage.

2. A composition comprising: a first component comprising a polyisocyanate; a second component comprising a first polyol; an accelerator; and an amine, wherein the polyisocyanate and / or the first polyol comprise a polysulfide linkage.

3. The composition of claim 2, further comprising a filler.

4. The composition of any of the preceding claims, wherein the polyisocyanate comprises a reaction product of reactants comprising (i) an isocyanate-containing compound and (ii) a polysulfide linkage-containing compound and / or wherein the first polyol comprises a reaction product of reactants comprising (i) a hydroxide-containing compound and (ii) a polysulfide linkage-containing compound.

5. The composition of any of the preceding claims, wherein the polyisocyanate comprises an aromatic polyisocyanate.

6. The composition of any of the preceding claims, wherein the polyisocyanate comprises a backbone comprising the polysulfide linkage; and / or the first polyol comprises a backbone comprising the polysulfide linkage.

7. The composition of any of the preceding claims, wherein:(a) the polyisocyanatc comprises the polysulfidc linkage in an amount of 0.6% by weight to 25% by weight based on total weight of poly isocyanate-containing compounds and active hydrogen-containing compounds; and / or(b) the first polyol comprises the polysulfide linkage in an amount of 0.6% by weight to 25% by weight based on total weight of polyisocyanate-containing compounds and active hydrogen-containing compounds.

8. The composition of any of the preceding claims, wherein:(a) the isocyanate comprises an isocyanate equivalent weight in a range of 100 g / eq to 1,500 g / eq;(b) the first polyol comprises a hydroxyl equivalent weight in a range of 24 g / eq to 5,000 g / eq; and / or;(c) the amine comprises an amine equivalent weight in a range of 24 g / eq to 2,000 g / eq.

9. The composition of any of the preceding claims, wherein the polysulfide linkage comprises an aliphatic polysulfide linkage.

10. The compositions of any of the preceding claims, further comprising a second polyol, a dispersant, a thermally conductive filler, a tertiary amine, a solvent, and / or a metal catalyst.

11. The composition of any of the preceding claims, wherein the composition comprises an equivalence ratio of (i) isocyanate functional groups to (ii) a sum of hydroxyl functional groups and amine functional groups in a range of 1:2 to 2:1.

12. The composition of any of the preceding claims, wherein the composition is substantially free of a monofunctional isocyanate.

13. A method of coating a substrate comprising: contacting a portion of a surface of the substrate with the composition of any of the preceding claims.

14. A method of forming an article comprising extruding or molding the composition of any of claims 1 to 12.

15. A substrate coated with a solvent-assisted degradable coating formed from the composition of any of claims 1 to 12.

16. The substrate of claim 15, wherein the substrate comprises or forms parts of a vehicle, a personal electronic device, a part, an article, components thereof, or a combination thereof.

17. The substrate of claim 16, wherein the vehicle comprises an automobile or an aircraft.

18. A battery, comprising a battery cell and the composition of any of claims 1 to 12 in a cured state.

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