Curable composition, electronic component, and method for producing electronic component

Abstract

The present invention provides a curable composition which is (1) capable of enhancing curability, (2) capable of lowering a curing shrinkage rate, (3) capable of enhancing hardness of a cured product obtained therefrom, and (4) capable of enhancing thermal cycle characteristics of a cured product obtained therefrom.　A curable composition according to the present invention contains a photocurable compound and a photopolymerization initiator, wherein: the photocurable compound contains a first (meth)acrylate compound which has two or more (meth)acryloyl groups and an alicyclic skeleton; the curable composition optionally contains a thermosetting component in an amount of less than 10 wt%; and (1) the photopolymerization initiator contains a photopolymerization initiator that has an α-aminoalkylphenone skeleton and a molecular weight of 800 or more, or (2) the photopolymerization initiator contains a photopolymerization initiator that has an α-aminoacetophenone skeleton, and the content of the photopolymerization initiator that has an α-aminoacetophenone skeleton is 0.5 wt% to 3 wt% inclusive in 100 wt% of the curable composition.

Description

Curable composition, electronic component, and method for manufacturing electronic component

[0001] The present invention relates to a curable composition containing a photocurable compound. The present invention also relates to an electronic component using the above curable composition, and a method for manufacturing an electronic component using the above curable composition.

[0002] Electronic components such as printed circuit boards and chassis are known. These electronic components are used, for example, in mobile phones, tablets, and personal computers. The surfaces of these electronic components usually have recesses. In recent years, there has been research into filling these recesses with fillers to protect the electronic components or to make their surfaces flat.

[0003] Furthermore, curable compositions that are applied by inkjet methods are known. For example, Patent Document 1 below discloses an inkjet-curable composition comprising (A) a photopolymerizable monomer having a cyclic skeleton and a shrinkage rate of less than 10%, (B) a photopolymerizable bifunctional monomer having a viscosity of 100 mPa·s or less at 25°C and a shrinkage rate of 10% to 20%, and (C) a photopolymerization initiator.

[0004] The curable composition described in Patent Document 1 can be used by printing it onto substrates for printed circuit boards, etc. Furthermore, the curable composition described in Patent Document 1 can be used as a solder resist.

[0005] WO2019 / 189157A1

[0006] Patent Document 1 does not clearly describe the use of the curable composition to fill recesses in electronic components. If a conventional curable composition like that described in Patent Document 1 is filled into a recess in an electronic component and irradiated with ultraviolet light, it may not be possible to sufficiently harden the deeper parts of the filler material or to sufficiently increase the hardness of the resulting cured material. This problem is particularly pronounced when the distance from the top surface to the bottom surface of the filler material is large (i.e., the recess is deep).

[0007] Furthermore, cured products of conventional curable compositions may have poor thermal cycling properties (resistance to thermal shock). Therefore, in electronic components using conventional curable compositions, repeated heating and cooling during use may cause the cured product of the composition to peel off from the substrate or develop cracks.

[0008] In other words, with conventional curable compositions, it is difficult to improve curability, reduce curing shrinkage, increase the hardness of the resulting cured product, and enhance the thermal cycling properties of the resulting cured product.

[0009] The object of the present invention is to provide a curable composition that can 1) improve curability, 2) reduce curing shrinkage, 3) increase the hardness of the resulting cured product, and 4) improve the thermal cycling properties of the resulting cured product. Another object of the present invention is to provide an electronic component using the above curable composition, and a method for manufacturing an electronic component using the above curable composition.

[0010] This specification discloses the following curable compositions, uses of curable compositions, electronic components, and methods for manufacturing electronic components.

[0011] Item 1. A curable composition comprising a photocurable compound and a photopolymerization initiator, wherein the photocurable compound comprises a first (meth)acrylate compound having two or more (meth)acryloyl groups and an alicyclic skeleton, the curable composition does not contain a thermosetting component, or contains a thermosetting component in an amount of less than 10% by weight of 100% by weight of the curable composition, and the curable composition satisfies the following first or second configuration.

[0012] First configuration: The photopolymerization initiator comprises a photopolymerization initiator having an α-aminoalkylphenone skeleton and a molecular weight of 800 or more.

[0013] Second configuration: The photopolymerization initiator comprises a photopolymerization initiator having an α-aminoacetophenone skeleton, and the content of the photopolymerization initiator having an α-aminoacetophenone skeleton is 0.5% by weight or more and 3% by weight or less in 100% by weight of the curable composition.

[0014] Item 2. The curable composition is the curable composition according to Item 1, satisfying the first configuration described above.

[0015] Item 3. The curable composition according to Item 1, wherein the curable composition satisfies the first configuration, and the content of a photopolymerization initiator having the α-aminoalkylphenone skeleton and a molecular weight of 800 or more is 0.5% by weight or more and 3% by weight or less in 100% by weight of the curable composition.

[0016] Item 4. The curable composition is the curable composition according to Item 1, satisfying the second configuration described above.

[0017] Item 5. The curable composition according to Item 1, wherein the curable composition satisfies the second configuration, and the photopolymerization initiator having an α-aminoacetophenone skeleton is a photopolymerization initiator having a structure represented by the following formula (1), or a photopolymerization initiator having an α-aminoacetophenone skeleton and an α-aminoalkylphenone skeleton and having a molecular weight of 800 or more.

[0018]

[0019] Item 6. The curable composition according to any one of items 1 to 5, wherein the content of the first (meth)acrylate compound is 20% by weight or more in 100% by weight of the curable composition.

[0020] Item 7. The curable composition according to any one of items 1 to 6, wherein the first (meth)acrylate compound comprises a (meth)acrylate compound having a dicyclopentadiene skeleton, a (meth)acrylate compound having a norbornene skeleton, or a (meth)acrylate compound having an adamantane skeleton.

[0021] Item 8. The curable composition according to any one of items 1 to 7, wherein the photocurable compound comprises a cyclopolymerizable compound or a second (meth)acrylate compound having one (meth)acryloyl group.

[0022] Item 9. The curable composition according to any one of items 1 to 8, wherein the photocurable compound comprises a cyclizable compound, and the content of the cyclizable compound in 100% by weight of the curable composition is 20% by weight or more and 50% by weight or less.

[0023] Item 10. The curable composition according to any one of items 1 to 9, wherein the photocurable compound comprises a cyclopolymerizable compound, and the content of a photopolymerization initiator having an α-aminoalkylphenone skeleton and a molecular weight of 800 or more is 1.0 part by weight or more and 14.5 parts by weight or less per 100 parts by weight of the cyclopolymerizable compound.

[0024] Item 11. The curable composition according to any one of items 1 to 9, wherein the curable composition satisfies the second configuration, the photocurable compound comprises a cyclizable compound, and the content of the photopolymerization initiator having an α-aminoalkylphenone skeleton is 1.0 part by weight or more and 14.5 parts by weight or less per 100 parts by weight of the cyclizable compound.

[0025] Item 12. The curable composition according to any one of items 1 to 11, wherein the photocurable compound comprises a urethane compound having a photocurable functional group, and the content of the urethane compound having a photocurable functional group is 1% by weight or more and 20% by weight or less in 100% by weight of the curable composition.

[0026] Item 13. The curable composition according to item 12, wherein the molecular weight of the urethane compound having the photocurable functional group is 500 or more and 2000 or less.

[0027] Item 14. A curable composition for inkjet printing, as described in any one of items 1 to 13.

[0028] Item 15. A curable composition according to any one of items 1 to 14, which is used to fill and cure recesses in electronic components.

[0029] Item 16. Use of a curable composition according to any one of items 1 to 15 for filling and curing recesses in electronic components to form a cured product in the recesses.

[0030] Item 17. An electronic component comprising an electronic component body having a recess on its surface, and a cured material filled in the recess in the electronic component body, wherein the cured material is a cured material of a curable composition according to any one of items 1 to 15.

[0031] Item 18. A method for manufacturing an electronic component, comprising the steps of: filling a recess in an electronic component body having a recess on its surface with a curable composition according to any one of items 1 to 15 using an inkjet device; and curing the curable composition by irradiation with light to form a cured product filled in the recess.

[0032] The curable composition according to the present invention comprises a photocurable compound and a photopolymerization initiator. In the curable composition according to the present invention, the photocurable compound comprises a first (meth)acrylate compound having two or more (meth)acryloyl groups and an alicyclic skeleton. The curable composition according to the present invention does not contain a thermosetting component, or contains a thermosetting component in an amount of less than 10% by weight of 100% by weight of the curable composition. With respect to the photopolymerization initiator, the curable composition according to the present invention satisfies the following specific first configuration or specific second configuration. First configuration: The photopolymerization initiator comprises a photopolymerization initiator having an α-aminoalkylphenone skeleton and a molecular weight of 800 or more. Second configuration: The photopolymerization initiator comprises a photopolymerization initiator having an α-aminoacetophenone skeleton, and the content of the photopolymerization initiator having an α-aminoacetophenone skeleton is 0.5% by weight or more and 3% by weight or less of 100% by weight of the curable composition. The curable composition according to the present invention has the above configuration, so that 1) curability can be improved, 2) curing shrinkage rate can be reduced, 3) hardness of the resulting cured product can be increased, and 4) thermal cyclic properties of the resulting cured product can be improved.

[0033] Figure 1 is a schematic cross-sectional view showing an electronic component obtained using the curable composition according to the first embodiment of the present invention. Figure 2(a) is a schematic plan view showing an electronic component obtained using the curable composition according to the second embodiment of the present invention. Figure 3(b) is a schematic cross-sectional view showing an electronic component obtained using the curable composition according to the second embodiment of the present invention. Figure 4 is a schematic cross-sectional view showing an electronic component obtained using the curable composition according to the third embodiment of the present invention.

[0034] The present invention will be described in detail below.

[0035] (S硬化性組成物) The curable composition according to the present invention contains (A) a photocurable compound and (B) a photoinitiator.

[0036] In the curable composition according to the present invention, (A) the photocurable compound contains (A1) a first (meth)acrylate compound having two or more (meth)acryloyl groups and an alicyclic skeleton.

[0037] The curable composition according to the present invention does not contain a thermosetting component, or contains the thermosetting component at less than 10% by weight in 100% by weight of the curable composition.

[0038] The curable composition according to the present invention optionally contains a thermosetting component. Specifically, the curable composition according to the present invention optionally contains the thermosetting component at a content of less than 10% by weight. The curable composition according to the present invention optionally contains the thermosetting component, and when the curable composition contains the thermosetting component, the curable composition contains the thermosetting component at a content of less than 10% by weight in 100% by weight of the curable composition. The curable composition according to the present invention may or may not contain the thermosetting component. In the present specification, the thermosetting component means (C) a thermosetting compound and (D) a thermosetting agent.

[0039] The curable composition according to the present invention satisfies the following first configuration or second configuration. The following first configuration or second configuration relates to (B) the photoinitiator. <U

[0040] First configuration: (B) The photoinitiator contains a photoinitiator having an α-aminoalkylphenone skeleton and a molecular weight of 800 or more

[0041] Second configuration: (B) The photoinitiator contains a photoinitiator having an α-aminoacetophenone skeleton, and the content of the photoinitiator having an α-aminoacetophenone skeleton in 100% by weight of the curable composition is 0.5% by weight or more and 3% by weight or less.

[0042] When the curable composition according to the present invention satisfies the first configuration described above, the curable composition satisfies the following requirements: a curable composition comprising a photocurable compound and a photopolymerization initiator, wherein the photocurable compound comprises a first (meth)acrylate compound having two or more (meth)acryloyl groups and an alicyclic skeleton, the photopolymerization initiator comprises a photopolymerization initiator having an α-aminoalkylphenone skeleton and a molecular weight of 800 or more, and the curable composition does not contain a thermosetting component, or contains a thermosetting component in an amount of less than 10% by weight of the curable composition by 100% by weight.

[0043] When the curable composition according to the present invention satisfies the second configuration described above, the curable composition satisfies the following requirements: a curable composition comprising a photocurable compound and a photopolymerization initiator, wherein the photocurable compound comprises a first (meth)acrylate compound having two or more (meth)acryloyl groups and an alicyclic skeleton, the photopolymerization initiator comprises a photopolymerization initiator having an α-aminoacetophenone skeleton, the content of the photopolymerization initiator having an α-aminoacetophenone skeleton is 0.5% by weight or more and 3% by weight or less in 100% by weight of the curable composition, and the curable composition does not contain a thermosetting component, or contains a thermosetting component in an amount of less than 10% by weight in 100% by weight of the curable composition.

[0044] When conventional curable compositions are used to fill recesses in electronic components and irradiated with ultraviolet light, it may be difficult to sufficiently cure the deeper parts of the filler or to achieve sufficient hardness in the resulting cured material. This problem is particularly pronounced when the distance from the top surface to the bottom surface of the filler is large (i.e., when the recess is deep).

[0045] On the other hand, if a photopolymerization initiator with high sensitivity in the long-wavelength region (e.g., 385 nm to 405 nm) is used to sufficiently cure the deeper parts of the filler, it may not be possible to sufficiently improve the curability of the surface of the filler.

[0046] Furthermore, if a photocurable compound having many photocurable functional groups is used to enhance the curability of the curable composition, the curing shrinkage rate of the curable composition may increase, causing the curable composition to shrink during curing and potentially altering the shape of the resulting cured product.

[0047] On the other hand, the curable composition according to the present invention has the above configuration, so that 1) curability can be improved, 2) curing shrinkage rate can be reduced, and 3) the hardness of the resulting cured product can be increased.

[0048] Furthermore, cured products of conventional curable compositions may have poor thermal cycling properties (resistance to thermal shock). Therefore, in electronic components using conventional curable compositions, repeated heating and cooling during use may cause the cured product of the composition to peel off from the substrate or other components (the material to which the curable composition is applied), or cracks may develop in the cured product.

[0049] Furthermore, conventional curable compositions and their cured products have the challenge of being difficult to improve reflow resistance. As a result, in electronic components using conventional curable compositions, the cured product of the curable composition may peel off from the substrate or cracks may appear in the cured product after the reflow process.

[0050] Fillers may be added to curable compositions to improve their thermal cycling properties and reflow resistance. However, if a large amount of filler is added to the curable composition, ejection failures may occur when the curable composition is ejected using an inkjet device.

[0051] On the other hand, since the curable composition according to the present invention has the above configuration, 4) the thermal cycle characteristics (thermal shock resistance) of the resulting cured product can be improved. Specifically, the curable composition according to the present invention can improve the adhesive strength between the substrate or the like (the member to which the curable composition is applied) and the cured product of the curable composition. As a result, in electronic components using the curable composition, even when repeatedly heated and cooled during use, the cured product of the curable composition can be prevented from peeling off from the electronic component body. Furthermore, in electronic components using the curable composition, even when repeatedly heated and cooled during use, cracks can be prevented from occurring in the cured product of the curable composition.

[0052] Furthermore, the curable composition according to the present invention can enhance reflow resistance. In electronic components using the curable composition according to the present invention, it is possible to prevent the cured product of the curable composition from peeling off from the electronic component body after the reflow process, and to prevent cracks from forming in the cured product of the curable composition. The curable composition according to the present invention can exhibit both high delamination suppression and high crack suppression effects as high thermal cycling characteristics.

[0053] The curable composition according to the present invention can exhibit the four effects described in 1) to 4) above, and can also exhibit the five effects described in 1) to 5) above. Furthermore, because the curable composition according to the present invention has the above configuration, 6) the storage stability of the curable composition can also be improved.

[0054] Furthermore, the curable composition according to the present invention can exhibit the effects described in 1) to 5) above even when it is filled into a recess in an electronic component (a recess in the electronic component body) and cured. The curable composition according to the present invention can effectively cure both the deep and surface portions of the filler or curable composition layer.

[0055] Furthermore, the curable composition according to the present invention can exhibit the effects described in 1) to 3) above, making it possible to form partitions with a large aspect ratio. When a partition is formed on the periphery of an electronic element (such as an LED chip) using the curable composition according to the present invention, a partition with a large aspect ratio can be formed. The curable composition according to the present invention can form a partition having the aspect ratio (height / width) required for a light-emitting device. Since the curable composition according to the present invention can exhibit the effects described in 1) to 5) above, the curable composition according to the present invention is suitable for applications in forming partitions.

[0056] Furthermore, the curable composition according to the present invention can exhibit the effects of 4) and 5) above, even when no filler is added or when a small amount of filler is added. Therefore, the curable composition can be designed to be ejected using an inkjet device. In addition, the curable composition can be ejected well using an inkjet device, the curable composition can be applied with high precision, the cured product can be formed with high precision in a specific area, and the resulting electronic component can be miniaturized.

[0057] The curable composition according to the present invention may satisfy the first configuration, the second configuration, or both of the first and second configurations. The curable composition according to the present invention only needs to satisfy at least one of the first and second configurations. When the curable composition according to the present invention satisfies the first configuration, the content of the photopolymerization initiator having the α-aminoalkylphenone skeleton and having a molecular weight of 800 or more may be less than 0.5% by weight or more than 3% by weight. When the curable composition according to the present invention satisfies the second configuration, the molecular weight of the photopolymerization initiator having the α-aminoalkylphenone skeleton may be less than 800.

[0058] The details of each component contained in the above curable composition are described below. In this specification, "(meth)acryloyl" means either or both "acryloyl" and "methacryloyl," and "(meth)acrylate" means either or both "acrylate" and "methacrylate." In this specification, the CH group of the (meth)acryloyl group is also described below. ２ = C(H or CH) ３ The group(s) are not included in the vinyl group.

[0059] <(A) Photocurable Compound> The above curable composition contains (A) a photocurable compound. (A) A photocurable compound is a compound that can be photocured. (A) A photocurable compound has a photocurable functional group. (A) A may be used alone or in combination of two or more types.

[0060] (A) A photocurable compound may have one photocurable functional group, two photocurable functional groups, two or more photocurable functional groups, three or more photocurable functional groups, four or more photocurable functional groups, or five or more photocurable functional groups. (A) A photocurable compound may have 10 or fewer photocurable functional groups. (A) The range of the number of photocurable functional groups in a photocurable compound can be set by appropriately selecting the above lower limit and upper limit (the same applies to the range of the number of other functional groups described later).

[0061] From the viewpoint of further enhancing photocurability, further enhancing the overall curability of the cured product, better forming partitions with an even larger aspect ratio, and further enhancing thermal cycling characteristics (especially crack suppression), it is preferable that (A) the photocurable compound includes a photocurable compound having two or more photocurable functional groups. From the viewpoint of further enhancing photocurability, better forming partitions with an even larger aspect ratio, and further enhancing thermal cycling characteristics (especially crack suppression), it is preferable that the photocurable compound includes a photocurable compound having three or more photocurable functional groups.

[0062] (A) Examples of the above-mentioned photocurable functional groups in the photocurable compound include (meth)acryloyl groups and vinyl groups.

[0063] From the viewpoint of enhancing photocurability, it is preferable that the above-mentioned photocurable functional group of the photocurable compound (A) is a (meth)acryloyl group. From the viewpoint of enhancing photocurability, it is preferable that the photocurable compound (A) has a (meth)acryloyl group.

[0064] (A) The photocurable compound may have one (meth)acryloyl group, two (meth)acryloyl groups, two or more (meth)acryloyl groups, three or more (meth)acryloyl groups, four or more (meth)acryloyl groups, or five or more (meth)acryloyl groups. (A) The photocurable compound may have 10 or fewer (meth)acryloyl groups.

[0065] (A) The photocurable compound may or may not have a cyclic ether group. (A) The photocurable compound may or may not have an epoxy group. (A) The photocurable compound may or may not have a glycidyl group.

[0066] (A) The photocurable compound includes (A1) a first (meth)acrylate compound having two or more (meth)acryloyl groups and an alicyclic skeleton. Hereinafter, "(A1) a first (meth)acrylate compound having two or more (meth)acryloyl groups and an alicyclic skeleton" may be referred to as "(A1) the first (meth)acrylate compound".

[0067] (A) The photocurable compound may contain (A2) a second (meth)acrylate compound having one (meth)acryloyl group. Hereinafter, "(A2) a second (meth)acrylate compound having one (meth)acryloyl group" may be written as "(A2) a second (meth)acrylate compound".

[0068] (A) The photocurable compound may also contain (A3) a cyclopolymerizable compound.

[0069] (A) The photocurable compound may contain (A4) a third (meth)acrylate compound having two or more (meth)acryloyl groups and not having an alicyclic skeleton. Hereinafter, "(A4) a third (meth)acrylate compound having two or more (meth)acryloyl groups and not having an alicyclic skeleton" may be referred to as "(A4) a third (meth)acrylate compound".

[0070] (A) The photocurable compound preferably includes (A5) a urethane compound having a photocurable functional group. Hereinafter, "(A5) a urethane compound having a photocurable functional group" may be referred to as "(A5) a urethane compound".

[0071] (A) The photocurable compound may include other photocurable compounds different from the five types: (A1) the first (meth)acrylate compound, (A2) the second (meth)acrylate compound, (A3) the cyclopolymerizable compound, (A4) the third (meth)acrylate compound, and (A5) the urethane compound. Only one of the above other photocurable compounds may be used, or two or more may be used.

[0072] In 100% by weight of the above curable composition, the content of (A) the photocurable compound is preferably 10% by weight or more, more preferably 15% by weight or more, even more preferably 20% by weight or more, preferably 75% by weight or less, more preferably 70% by weight or less, and even more preferably 65% ​​by weight or less. When the content of (A) the photocurable compound is above the lower limit and below the upper limit, the photocurability can be further enhanced, the overall curability of the cured product can be further enhanced, partitions with an even larger aspect ratio can be formed well, and the thermal cycle characteristics (suppression of peeling and suppression of cracking) can be further enhanced.

[0073] (A1) A first (meth)acrylate compound having two or more (meth)acryloyl groups and an alicyclic skeleton: The effects of the present invention can be achieved by using (A1) the first (meth)acrylate compound. In particular, if the curable composition satisfies the first configuration, the effects of the present invention can be achieved by using (A1) the first (meth)acrylate compound in combination with (B1-1) the photopolymerization initiator described later. Furthermore, if the curable composition satisfies the second configuration, the effects of the present invention can be achieved by using (A1) the first (meth)acrylate compound in combination with (B1) the photopolymerization initiator described later. Moreover, if the curable composition satisfies the second configuration, the effects of the present invention can be achieved by using (A1) the first (meth)acrylate compound in combination with (B1) the photopolymerization initiator described later.

[0074] (A1) The first (meth)acrylate compound may have two (meth)acryloyl groups, two or more (meth)acryloyl groups, three or more (meth)acryloyl groups, four or more (meth)acryloyl groups, or five or more (meth)acryloyl groups. (A1) The first (meth)acrylate compound may have ten or fewer (meth)acryloyl groups. (A1) The range of the number of (meth)acryloyl groups in the first (meth)acrylate compound can be set by appropriately selecting the above lower limit and upper limit (the same applies to the range of the number of other functional groups described later).

[0075] Examples of the above-mentioned alicyclic skeletons include cyclopropane, cyclobutane, cyclopentane, cyclohexane, cycloheptane, cyclooctane, cyclononane, cyclodecane, cycloundecane, cyclododecane, naphthalene, tetracyclododecene, cubane, basquetane, dicyclopentadiene, norbornene, and adamantane.

[0076] (A1) Examples of the first (meth)acrylate compound include a (meth)acrylate compound having a dicyclopentadiene skeleton, a (meth)acrylate compound having a norbornene skeleton, or a (meth)acrylate compound having an adamantane skeleton.

[0077] The above alicyclic skeleton is preferably a dicyclopentadiene skeleton, a norbornene skeleton, or an adamantane skeleton, and more preferably a dicyclopentadiene skeleton. Therefore, it is preferable that the (A1) first (meth)acrylate compound includes a (meth)acrylate compound having a dicyclopentadiene skeleton, a (meth)acrylate compound having a norbornene skeleton, or a (meth)acrylate compound having an adamantane skeleton. In this case, the effects of the present invention can be exhibited even more effectively. From the viewpoint of exhibiting the effects of the present invention even more effectively, it is more preferable that the (A1) first (meth)acrylate compound includes a (meth)acrylate compound having a dicyclopentadiene skeleton.

[0078] (A1) The first (meth)acrylate compound may contain a (meth)acrylate compound having a dicyclopentadiene skeleton, a (meth)acrylate compound having a norbornene skeleton, or a (meth)acrylate compound having an adamantane skeleton.

[0079] Examples of (meth)acrylate compounds having the dicyclopentadiene skeleton mentioned above include tricyclodecanedimethanol di(meth)acrylate.

[0080] Examples of (meth)acrylate compounds having the norbornene skeleton mentioned above include isobornyl di(meth)acrylate.

[0081] Examples of (meth)acrylate compounds having the adamantane skeleton mentioned above include 1,3-adamantanediol di(meth)acrylate.

[0082] From the viewpoint of exhibiting the effects of the present invention more effectively, it is preferable that (A) the photocurable compound and (A1) the first (meth)acrylate compound contain tricyclodecanedimethanol di(meth)acrylate or 1,3-adamantanediol di(meth)acrylate. From the viewpoint of exhibiting the effects of the present invention even more effectively, it is more preferable that (A) the photocurable compound and (A1) the first (meth)acrylate compound contain tricyclodecanedimethanol di(meth)acrylate.

[0083] In 100% by weight of the above curable composition, the content of (A1) the first (meth)acrylate compound is preferably 5% by weight or more, more preferably 10% by weight or more, even more preferably 15% by weight or more, still more preferably 20% by weight or more, particularly preferably 25% by weight or more, most preferably 30% by weight or more, preferably 70% by weight or less, more preferably 65% ​​by weight or less, even more preferably 60% by weight or less, still more preferably 55% by weight or less, particularly preferably 50% by weight or less, most preferably 45% by weight or less. When the content of (A1) the first (meth)acrylate compound is above the lower limit and below the upper limit, the photocurability can be further enhanced, the overall curability of the cured product can be further enhanced, partitions with an even larger aspect ratio can be formed well, and the thermal cycle characteristics (suppression of peeling and suppression of cracking) can be further enhanced.

[0084] In the above curable composition, it is particularly preferable that the content of (A1) the first (meth)acrylate compound is 20% by weight or more. In this case, the hardness of the deeper parts of the cured product can be further increased.

[0085] (A2) A second (meth)acrylate compound having one (meth)acryloyl group: (A) The photocurable compound preferably contains (A3) a cyclopolymerizable compound or (A2) the second (meth)acrylate compound. In this case, the adhesive strength of the cured product of the curable composition can be further increased and the curing shrinkage rate can be further reduced. Furthermore, (A) the photocurable compound preferably contains (A2) the second (meth)acrylate compound. In this case, the adhesive strength of the cured product of the curable composition can be further increased and the curing shrinkage rate can be further reduced. (A2) The second (meth)acrylate compound may be used by one type only, or by two or more types.

[0086] (A2) The second (meth)acrylate compound includes methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, i-propyl (meth)acrylate, n-butyl (meth)acrylate, i-butyl (meth)acrylate, sec-butyl (meth)acrylate, t-butyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 3-hydroxybutyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, allyl (meth)acrylate, and Examples include methyl (meth)acrylate, phenyl (meth)acrylate, 2-methoxyethyl (meth)acrylate, 2-phenoxyethyl (meth)acrylate, methoxydiethylene glycol (meth)acrylate, methoxytriethylene glycol (meth)acrylate, methoxypropylene glycol (meth)acrylate, methoxydipropylene glycol (meth)acrylate, 2-hydroxy-3-phenoxypropyl (meth)acrylate, glycerol mono (meth)acrylate, 2-ethylhexyl (meth)acrylate, naphthyl (meth)acrylate, lauryl (meth)acrylate, and stearyl (meth)acrylate.

[0087] Furthermore, (A2) examples of the second (meth)acrylate compound include glycidyl (meth)acrylate and 4-hydroxybutyl (meth)acrylate glycidyl ether.

[0088] (A2) The second (meth)acrylate compound may have an alicyclic skeleton. Examples of the above alicyclic skeletons include cyclopropane, cyclobutane, cyclopentane, cyclohexane, cycloheptane, cyclooctane, cyclononane, cyclodecane, cycloundecane, cyclododecane, naphthalene, tetracyclododecene, cubane, basquetane, dicyclopentadiene, norbornene, and adamantane.

[0089] (A2) Examples of the second (meth)acrylate compound include (meth)acrylate compounds having a dicyclopentadiene skeleton, (meth)acrylate compounds having a norbornene skeleton, and (meth)acrylate compounds having an adamantane skeleton.

[0090] Examples of (meth)acrylate compounds having the dicyclopentadiene skeleton mentioned above include dicyclopentadienyl (meth)acrylate.

[0091] Examples of (meth)acrylate compounds having the norbornene skeleton mentioned above include isobornyl (meth)acrylate.

[0092] Examples of (meth)acrylate compounds having the adamantane skeleton include 1-adamantyl(meth)acrylate, 3-hydroxy-1-adamantyl(meth)acrylate, 2-ethyladamantan-2-yl(meth)acrylate, 2-isopropyl-2-adamantyl(meth)acrylate, and 2-methyladamantan-2-yl(meth)acrylate.

[0093] In 100% by weight of the above curable composition, the total content of (A3) the cyclizable compound and (A2) the second (meth)acrylate compound is 0% by weight (not present) or more. In 100% by weight of the above curable composition, the total content of (A3) the cyclizable compound and (A2) the second (meth)acrylate compound is preferably 20% by weight or more, more preferably 30% by weight or more, even more preferably 40% by weight or more, particularly preferably 50% by weight or more, preferably 85% by weight or less, more preferably 75% by weight or less, and even more preferably 65% ​​by weight or less. When the total content of (A3) the cyclizable compound and (A2) the second (meth)acrylate compound is above the lower limit and below the upper limit, the adhesive strength of the cured product of the above curable composition can be increased, and the thermal cycle characteristics (suppression of peeling and suppression of cracking) can be further enhanced. Furthermore, if the sum of the content of (A3) the cyclizable compound and the content of (A2) the second (meth)acrylate compound is equal to or greater than the lower limit, the thermal cycling properties (especially crack suppression) can be further enhanced. The range of the sum of the content of (A3) the cyclizable compound and the content of (A2) the second (meth)acrylate compound in 100% by weight of the curable composition can be set by appropriately selecting the lower limit and upper limit values.

[0094] In 100% by weight of the above curable composition, the content of the second (meth)acrylate compound (A2) is 0% by weight (not present) or more. In 100% by weight of the above curable composition, the content of the second (meth)acrylate compound (A2) is preferably 5% by weight or more, more preferably 7.5% by weight or more, even more preferably 10% by weight or more, preferably 65% ​​by weight or less, more preferably 50% by weight or less, even more preferably 45% by weight or less, particularly preferably 40% by weight or less, and most preferably 35% by weight or less. When the content of the second (meth)acrylate compound (A2) is above the lower limit and below the upper limit, the adhesive strength of the cured product of the above curable composition can be increased, and the thermal cycling properties (suppression of peeling and suppression of cracking) can be further enhanced. Also, when the content of the second (meth)acrylate compound (A2) is above the lower limit, the thermal cycling properties (especially the suppression of cracking) can be further enhanced. The range of the content of the second (meth)acrylate compound (A2) in 100% by weight of the above curable composition can be set by appropriately selecting the above lower limit and upper limit.

[0095] (A3) Cyclopolymerizable compound: (A) The photocurable compound preferably contains (A3) the cyclopolymerizable compound or (A2) the second (meth)acrylate compound. In this case, the adhesive strength of the cured product of the curable composition can be further increased and the curing shrinkage rate can be further reduced. Furthermore, (A) the photocurable compound is more preferably to contain (A3) the cyclopolymerizable compound. In this case, the adhesive strength of the cured product of the curable composition can be further increased and the curing shrinkage rate can be further reduced. (A3) The cyclopolymerizable compound may be used alone or in combination of two or more.

[0096] (A3) Cyclopolymerizable compounds are compounds that can be cyclized. (A3) Cyclopolymerizable compounds have cyclizable groups. (A3) Cyclopolymerizable compounds can form polymers having a cyclic skeleton. (A3) It is preferable that cyclopolymerizable compounds can form polymers having a cyclic skeleton in their main chain.

[0097] (A3) Cyclopolymerizable compounds are preferably cyclized by radical polymerization. (A3) Cyclopolymerizable compounds are preferably capable of forming polymers having a cyclic skeleton by radical polymerization, and more preferably capable of forming polymers having a cyclic skeleton in the main chain by radical polymerization. (A3) In cyclopolymerizable compounds, it is preferable that the radical polymerization reaction proceeds while cyclization is occurring.

[0098] From the viewpoint of increasing the adhesive strength of the cured product of the above curable composition and further enhancing the thermal cycling properties (particularly the ability to suppress peeling), it is preferable that the (A3) cyclizable compound is capable of forming a five-membered ring structure or a six-membered ring structure, and more preferably that it is capable of forming a five-membered ring ether structure. From the viewpoint of increasing the adhesive strength of the cured product of the above curable composition and further enhancing the thermal cycling properties (particularly the ability to suppress peeling), it is preferable that the (A3) cyclizable compound is capable of forming a five-membered ring structure, and more preferably that it is capable of forming a five-membered ring ether structure.

[0099] (A3) The cyclizable compound preferably has a photocurable functional group. (A3) The cyclizable compound preferably has a photocurable functional group and a cyclizable group. (A3) In the cyclizable compound, the photocurable functional group may be a part of the cyclizable group, or it may be a side chain of the cyclizable group. (A3) In the cyclizable compound, the photocurable functional group and the cyclizable group may share some atoms or some skeleton.

[0100] (A3) The cyclizable compound may have one, two, two or more, three or more, four or more, five or more, or six or more of the above-mentioned cyclizable groups. (A3) The cyclizable compound may have 12 or fewer, eight or fewer, or six or fewer of the above-mentioned cyclizable groups.

[0101] From the viewpoint of increasing the adhesive strength of the cured product of the above curable composition and further enhancing the thermal cycling properties (especially the ability to suppress peeling), it is preferable that the (A3) cyclizable compound has one cyclizable group. From the viewpoint of further enhancing photocurability, further enhancing the overall curability of the cured product, better forming partitions with an even larger aspect ratio, and further enhancing the thermal cycling properties (especially the ability to suppress cracking), it is preferable that the (A3) cyclizable compound has two or more cyclizable groups.

[0102] (A3) Cyclopolymerizable compounds may have one or more photocurable functional groups. (A3) The photocurable functional groups in cyclopolymerizable compounds may be groups that are not cyclized, and (A3) the photocurable functional groups in cyclopolymerizable compounds may be groups that are not included in the ring structure after cyclization (groups that do not constitute a ring structure after cyclization). (A3) When cyclopolymerizable compounds have photocurable functional groups, they may have the following number of photocurable functional groups: (A3) Cyclopolymerizable compounds may have one photocurable functional group, two photocurable functional groups, two or more photocurable functional groups, three or more photocurable functional groups, four or more photocurable functional groups, or five or more photocurable functional groups. (A3) Cyclopolymerizable compounds may have 10 or fewer photocurable functional groups. From the viewpoint of increasing the adhesive strength of the cured product of the above curable composition and further enhancing the thermal cycling properties (especially the ability to suppress peeling), it is preferable that the (A3) cyclizable compound contains a photocurable compound having one photocurable functional group. From the viewpoint of further enhancing photocurability, further enhancing the overall curability of the cured product, better forming partitions with an even larger aspect ratio, and further enhancing the thermal cycling properties (especially the ability to suppress cracking), it is preferable that the (A3) cyclizable compound contains a photocurable compound having two or more photocurable functional groups.

[0103] Examples of the above-mentioned cyclizable group, group containing the above-mentioned cyclizable group, or photocurable functional group include (meth)acryloyl group, α-(allyloxymethyl)acryloyl group, and vinyl group.

[0104] From the viewpoint of enhancing cyclization polymerizability, the above-mentioned cyclization polymerizable group or group containing the above-mentioned cyclization polymerizable group of the (A3) cyclization polymerizable compound is preferably a (meth)acryloyl group or an α-(allyloxymethyl)acryloyl group. From the viewpoint of enhancing photocurability, the above-mentioned photocurable functional group of the (A3) cyclization polymerizable compound is preferably a (meth)acryloyl group or an α-(allyloxymethyl)acryloyl group. From the viewpoint of enhancing cyclization polymerizability and photocurability, the (A3) cyclization polymerizable compound is preferably having a (meth)acryloyl group or an α-(allyloxymethyl)acryloyl group.

[0105] (A3) The cyclopolymerizable compound may have one (meth)acryloyl group or α-(allyloxymethyl)acryloyl group, two (meth)acryloyl groups or α-(allyloxymethyl)acryloyl groups, two or more (meth)acryloyl groups or α-(allyloxymethyl)acryloyl groups, three or more (meth)acryloyl groups or α-(allyloxymethyl)acryloyl groups, four or more (meth)acryloyl groups or α-(allyloxymethyl)acryloyl groups, or five or more (meth)acryloyl groups or α-(allyloxymethyl)acryloyl groups. (A3) The cyclopolymerizable compound may have ten or fewer (meth)acryloyl groups or α-(allyloxymethyl)acryloyl groups.

[0106] (A3) The cyclizable compound may be a monofunctional (meth)acrylate compound or monofunctional α-(allyloxymethyl)acrylic acid, or a polyfunctional (meth)acrylate compound or polyfunctional α-(allyloxymethyl)acrylic acid. (A3) The cyclizable compound may contain a difunctional (meth)acrylate compound or difunctional α-(allyloxymethyl)acrylic acid, a trifunctional (meth)acrylate compound or trifunctional α-(allyloxymethyl)acrylic acid, a tetrafunctional (meth)acrylate compound or tetrafunctional α-(allyloxymethyl)acrylic acid, a pentafunctional (meth)acrylate compound or pentafunctional α-(allyloxymethyl)acrylic acid, or a hexafunctional (meth)acrylate compound or hexafunctional α-(allyloxymethyl)acrylic acid. (A3) The cyclopolymerizable compound may contain heptafunctional or more (meth)acrylate compounds, or heptafunctional or more α-(allyloxymethyl)acrylic acid. (A3) The cyclopolymerizable compound may contain decahy

[0107] From the viewpoint of further enhancing cyclization polymerizability, further enhancing photocurability, further enhancing the overall curability of the cured product, and good formation of septa with an even larger aspect ratio, it is preferable that the (A3) cyclization polymerizable compound contains a polyfunctional (meth)acrylate compound or a polyfunctional α-(allyloxymethyl)acrylic acid. The above polyfunctional (meth)acrylate compound may be a difunctional (meth)acrylate compound or a difunctional α-(allyloxymethyl)acrylic acid, a trifunctional (meth)acrylate compound or a trifunctional α-(allyloxymethyl)acrylic acid, a tetrafunctional (meth)acrylate compound or a tetrafunctional α-(allyloxymethyl)acrylic acid, a pentafunctional (meth)acrylate compound or a pentafunctional α-(allyloxymethyl)acrylic acid, a hexafunctional (meth)acrylate compound or a hexafunctional α-(allyloxymethyl)acrylic acid.

[0108] Examples of the above-mentioned monofunctional (meth)acrylate compounds or monofunctional α-(allyloxymethyl)acrylic acids include methyl-2-(allyloxymethyl)acrylic acid, 2-methoxyethyl-2-(allyloxymethyl)acrylic acid, tetrahydrofuran-2-ylmethyl-2-(allyloxymethyl)acrylic acid, 2-phenoxyethyl-2-(allyloxymethyl)acrylic acid, cyclohexyl-2-(allyloxymethyl)acrylic acid, and isobornyl-2-(allyloxymethyl)acrylic acid.

[0109] Examples of the above-mentioned difunctional (meth)acrylate compounds or difunctional α-(allyloxymethyl)acrylic acid include tripropylene glycol di-2-(allyloxymethyl)acrylic acid, 1,6-hexanediol di-2-(allyloxymethyl)acrylic acid, neopentyl glycol di-2-(allyloxymethyl)acrylic acid, and tricyclodecanedimethanol di-2-(allyloxymethyl)acrylic acid.

[0110] Examples of the above-mentioned trifunctional (meth)acrylate compound or trifunctional α-(allyloxymethyl)acrylic acid include trimethylolpropanetri-2-(allyloxymethyl)acrylic acid.

[0111] Examples of the hexafunctional (meth)acrylate compound or hexafunctional α-(allyloxymethyl)acrylic acid mentioned above include dipentaerythritol hexa-2-(allyloxymethyl)acrylic acid.

[0112] From the viewpoint of exhibiting the effects of the present invention more effectively, it is preferable that the (A3) cyclizable compound has two or more carbon-carbon double bonds. The (A3) cyclizable compound may have 12 or fewer carbon-carbon double bonds, 8 or fewer carbon-carbon double bonds, or 6 or fewer carbon-carbon double bonds.

[0113] From the viewpoint of exhibiting the effects of the present invention more effectively, it is preferable that the (A3) cyclizable compound has an allyl ether group. From the viewpoint of exhibiting the effects of the present invention more effectively, it is preferable that the cyclizable group in the (A3) cyclizable compound is an allyl ether group.

[0114] The above-mentioned cyclopolymerizable group or group containing the above-mentioned cyclopolymerizable group is preferably a vinyl group, a (meth)acryloyl group, or an α-(allyloxymethyl)acryloyl group, and more preferably a (meth)acryloyl group or an α-(allyloxymethyl)acryloyl group. In this case, the thermal cycling properties can be further enhanced, the reflow resistance can be further enhanced, the overall curability of the cured product can be improved, and a partition wall with an even larger aspect ratio can be formed. The above-mentioned photocurable functional group is preferably a vinyl group, a (meth)acryloyl group, or an α-(allyloxymethyl)acryloyl group, and more preferably a (meth)acryloyl group or an α-(allyloxymethyl)acryloyl group. In this case, the thermal cycling properties can be further enhanced, the reflow resistance can be further enhanced, and a partition wall with an even larger aspect ratio can be formed. (A3) The cyclopolymerizable compound preferably has a vinyl group, a (meth)acryloyl group, or an α-(allyloxymethyl)acryloyl group, and more preferably has a (meth)acryloyl group or an α-(allyloxymethyl)acryloyl group. In this case, the thermal cycling properties can be further enhanced, the reflow resistance can be further enhanced, the overall curability of the cured product can be improved, and partitions with an even larger aspect ratio can be formed.

[0115] From the viewpoint of exhibiting the effects of the present invention more effectively, it is preferable that the (A3) cyclizable compound has a structure represented by the following formula (11).

[0116]

[0117] In formula (11) above, R represents an organic group having 1 to 200 carbon atoms.

[0118] (A3) If the cyclizable compound has the structure represented by formula (11) above, the cyclizable compound (A3) can form a polymer having a five-membered ring ether structure in its main chain by radical polymerization.

[0119] In formula (11) above, the number of carbon atoms in R is 1 or more, 200 or less, preferably 150 or less, and more preferably 100 or less. In formula (11) above, R is preferably an alkyl group. In formula (11) above, R may be a linear alkyl group, a branched alkyl group, or a cyclic alkyl group. In formula (11) above, R may contain an ether bond.

[0120] In the above formula (11), R can be a methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, sec-butyl group, tert-butyl group, isobutyl group, phenyl group, pentyl group, vinyl group, allyl group, clotyl group, cyclopropyl group, cyclobutyl group, cyclohexyl group, tetrahydrofurfuryl group, methoxymethyl group, methoxyethyl group, ethoxymethyl group, ethoxyethyl group, phenoxyethyl group, vinyloxyethyl group, epoxy group, isobornyl group, adamantyl group, dicyclopentadienyl group, and oxetanyl group.

[0121] From the viewpoint of adjusting the viscosity of the curable composition to an appropriate range and dispensing the curable composition well using an inkjet device, in formula (11) above, R is preferably a methyl group or an ethyl group, and more preferably a methyl group.

[0122] (A3) The cyclizable compound may have an alicyclic skeleton. (A3) The cyclizable compound may be a cyclizable compound having an alicyclic skeleton. (A3) The cyclizable compound may have a cyclizable group and also have an alicyclic skeleton. If the curable composition contains a cyclizable (meth)acrylate compound having two or more (meth)acryloyl groups and an alicyclic skeleton, the cyclizable (meth)acrylate compound having two or more (meth)acryloyl groups and an alicyclic skeleton is classified as (A1) the first (meth)acrylate compound.

[0123] Examples of cyclopolymerizable compounds having the above-mentioned alicyclic skeleton include cyclohexyl-2-(allyloxymethyl)acrylic acid, isobornyl-2-(allyloxymethyl)acrylic acid, and tricyclodecanedimethyldi-2-(allyloxymethyl)acrylic acid.

[0124] From the viewpoint of exhibiting the effects of the present invention more effectively, it is preferable that the (A3) cyclizable compound contains methyl-2-(allyloxymethyl)acrylic acid (i.e., methyl 2-(allyloxymethyl)acrylate).

[0125] In 100% by weight of the above curable composition, the content of (A3) cyclizable compound is 0% by weight (not present) or more. In 100% by weight of the above curable composition, the content of (A3) cyclizable compound is preferably 20% by weight or more, more preferably 25% by weight or more, even more preferably 30% by weight or more, preferably 85% by weight or less, more preferably 65% ​​by weight or less, even more preferably 60% by weight or less, particularly preferably 55% by weight or less, and most preferably 50% by weight or less. When the content of (A3) cyclizable compound is above the lower limit and below the upper limit, the adhesive strength of the cured product of the above curable composition can be increased, and the thermal cycling properties (suppression of peeling and suppression of cracking) can be further enhanced. Furthermore, when the content of (A3) cyclizable compound is above the lower limit, the thermal cycling properties (especially the suppression of cracking) can be further enhanced. The range of the content of the (A3) cyclizable compound in 100% by weight of the above curable composition can be set by appropriately selecting the above lower limit and upper limit.

[0126] In the above curable composition, the content of (A3) cyclizable compound is preferably 20% to 50% by weight. In this case, the adhesive strength of the cured product of the curable composition can be further increased and the curing shrinkage rate can be further reduced.

[0127] (A4) A third (meth)acrylate compound having two or more (meth)acryloyl groups and not having an alicyclic skeleton: From the viewpoint of further enhancing photocurability, further enhancing the overall curability of the cured product, and good formation of septa with an even larger aspect ratio, it is preferable that the (A) photocurable compound contains the (A4) third (meth)acrylate compound. The (A4) third (meth)acrylate compound may be used by one or two or more types.

[0128] (A4) The third (meth)acrylate compound may have two (meth)acryloyl groups, two or more (meth)acryloyl groups, three or more (meth)acryloyl groups, four or more (meth)acryloyl groups, or five or more (meth)acryloyl groups. (A4) The third (meth)acrylate compound may have ten or fewer (meth)acryloyl groups.

[0129] (A4) The third (meth)acrylate compound may be a difunctional (meth)acrylate compound, a trifunctional (meth)acrylate compound, a tetrafunctional (meth)acrylate compound, a pentafunctional (meth)acrylate compound, or a hexafunctional (meth)acrylate compound.

[0130] Examples of the above-mentioned difunctional (meth)acrylate compounds include 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,9-nonane di(meth)acrylate, 1,10-decanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 2,4-dimethyl-1,5-pentanediol di(meth)acrylate, butylethylpropanediol di(meth)acrylate, polyethylene glycol di(meth)acrylate, oligoethylene glycol di(meth)acrylate, ethylene glycol di(meth)acrylate, 2-ethyl-2-butylbutanediol di(meth)acrylate, 2-ethyl-2-butylpropanediol di(meth)acrylate, and dipropylene glycol di(meth)acrylate.

[0131] Examples of the above-mentioned trifunctional (meth)acrylate compounds include trimethylolpropane tri(meth)acrylate, trimethylolethane tri(meth)acrylate, trimethylolpropane alkylene oxide-modified tri(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol tri(meth)acrylate, trimethylolpropane tri((meth)acryloyloxypropyl) ether, isocyanuric acid alkylene oxide-modified tri(meth)acrylate, dipentaerythritol propionate tri(meth)acrylate, tri((meth)acryloyloxyethyl) isocyanurate, and sorbitol tri(meth)acrylate.

[0132] Examples of the above-mentioned tetrafunctional (meth)acrylate compounds include pentaerythritol tetra(meth)acrylate, sorbitol tetra(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, and dipentaerythritol tetra(meth)acrylate propionate.

[0133] Examples of the pentafunctional (meth)acrylate compounds mentioned above include sorbitol penta(meth)acrylate and dipentaerythritol penta(meth)acrylate.

[0134] Examples of the hexafunctional (meth)acrylate compounds mentioned above include dipentaerythritol hexa(meth)acrylate, sorbitol hexa(meth)acrylate, and alkylene oxide-modified hexa(meth)acrylate of phosphazene.

[0135] In 100% by weight of the above curable composition, the content of the third (meth)acrylate compound (A4) is 0% by weight (not present) or more. In 100% by weight of the above curable composition, the content of the third (meth)acrylate compound (A4) is preferably 5% by weight or more, more preferably 7.5% by weight or more, even more preferably 10% by weight or more, preferably 65% ​​by weight or less, more preferably 50% by weight or less, even more preferably 45% by weight or less, particularly preferably 40% by weight or less, and most preferably 35% by weight or less. When the content of the third (meth)acrylate compound (A4) is above the lower limit and below the upper limit, the adhesive strength of the cured product of the above curable composition can be increased, and the thermal cycling properties (suppression of peeling and suppression of cracking) can be further enhanced. Also, when the content of the third (meth)acrylate compound (A4) is above the lower limit, the thermal cycling properties (especially the suppression of cracking) can be further enhanced. The range of the content of the third (meth)acrylate compound (A4) in 100% by weight of the above curable composition can be set by appropriately selecting the above lower limit and upper limit.

[0136] (A5) Urethane compound having a photocurable functional group: (A) The photocurable compound preferably contains the (A5) urethane compound. In this case, the adhesive strength of the cured product of the curable composition can be further increased and the curing shrinkage rate can be further reduced. (A5) The urethane compound may be used alone or two or more may be used in combination.

[0137] (A5) The urethane compound may have one photocurable functional group, two photocurable functional groups, two or more photocurable functional groups, three or more photocurable functional groups, four or more photocurable functional groups, or five or more photocurable functional groups. (A5) The urethane compound may have 10 or fewer photocurable functional groups. From the viewpoint of further enhancing photocurability, further enhancing the overall curability of the cured product, better forming partitions with an even larger aspect ratio, and further enhancing thermal cycling characteristics (especially crack suppression), it is preferable that the (A5) urethane compound contains a photocurable compound having two or more photocurable functional groups.

[0138] (A5) Examples of the above-mentioned photocurable functional groups in urethane compounds include (meth)acryloyl groups and vinyl groups.

[0139] From the viewpoint of enhancing photocurability, the above-mentioned photocurable functional group of the (A5) urethane compound is preferably a (meth)acryloyl group. From the viewpoint of enhancing photocurability, the (A5) urethane compound is preferably having a (meth)acryloyl group.

[0140] (A5) Examples of urethane compounds include urethane (meth)acrylate compounds.

[0141] From the viewpoint of further increasing the adhesive strength of the cured product of the curable composition, it is preferable that (A) the photocurable compound and (A5) the urethane compound include a urethane (meth)acrylate compound.

[0142] The above-mentioned urethane (meth)acrylate compounds include aliphatic urethane (meth)acrylate compounds and aromatic urethane (meth)acrylate compounds, etc. (A5) The urethane compound does not need to have an alicyclic skeleton.

[0143] From the viewpoint of further reducing the curing shrinkage rate, it is preferable that the (A5) urethane compound contains an aliphatic urethane (meth)acrylate compound.

[0144] (A5) Examples of commercially available urethane compounds include "EBECRYL210", "EBECRYL220", "EBECRYL270", "EBECRYL8402", "EBECRYL8409", and "EBECRYL9270" manufactured by Daicel Ornex Co., Ltd.

[0145] (A5) The molecular weight of the urethane compound is preferably 500 or more, more preferably 650 or more, even more preferably 800 or more, preferably 2000 or less, more preferably 1500 or less, and even more preferably 1200 or less. (A5) If the molecular weight of the urethane compound is above the lower limit, the curing shrinkage rate can be further reduced. (A5) If the molecular weight of the urethane compound is below the upper limit, the ejection performance by inkjet can be further improved.

[0146] In 100% by weight of the above curable composition, the content of (A5) urethane compound is 0% by weight (not contained) or more. In 100% by weight of the above curable composition, the content of (A5) urethane compound is preferably 1% by weight or more, more preferably 5% by weight or more, even more preferably 7.5% by weight or more, particularly preferably 10% by weight or more, preferably 30% by weight or less, more preferably 25% by weight or less, and even more preferably 20% by weight or less. When the content of (A5) urethane compound is above the lower limit and below the upper limit, the adhesive strength of the cured product of the above curable composition can be increased, and the thermal cycling characteristics (suppression of peeling and suppression of cracking) can be further enhanced. Also, when the content of (A5) urethane compound is above the lower limit, the thermal cycling characteristics (especially the suppression of cracking) can be further enhanced. In 100% by weight of the above curable composition, the range of the content of (A5) urethane compound can be set by appropriately selecting the lower limit and upper limit values.

[0147] In the above curable composition, the content of (A5) urethane compound is preferably 1% by weight or more and 20% by weight or less. In this case, the adhesive strength of the cured product of the curable composition can be further increased.

[0148] <(B) Photopolymerization initiator> The above curable composition contains (B) a photopolymerization initiator. (B) may be used alone or in combination of two or more types.

[0149] If the curable composition satisfies the first configuration described above, the curable composition contains a photopolymerization initiator having a (B1-1) α-aminoalkylphenone skeleton and a molecular weight of 800 or more. Therefore, if the curable composition satisfies the first configuration described above, the (B) photopolymerization initiator contains a photopolymerization initiator having a (B1-1) α-aminoalkylphenone skeleton and a molecular weight of 800 or more. Hereinafter, "a photopolymerization initiator having an α-aminoalkylphenone skeleton and a molecular weight of 800 or more" may be referred to as "(B1-1) photopolymerization initiator".

[0150] If the curable composition satisfies the first configuration described above, the curable composition may or may not contain photopolymerization initiators other than (B1-1) photopolymerization initiator.

[0151] If the curable composition satisfies the second configuration described above, the curable composition contains a photopolymerization initiator having an (B1-1) α-aminoalkylphenone skeleton. Therefore, if the curable composition satisfies the second configuration described above, the (B) photopolymerization initiator contains a photopolymerization initiator having an (B1) α-aminoalkylphenone skeleton. Hereinafter, "photopolymerization initiator having an α-aminoalkylphenone skeleton" may be referred to as "(B1) photopolymerization initiator".

[0152] If the curable composition satisfies the second configuration described above, the curable composition may or may not contain photopolymerization initiators other than (B1) photopolymerization initiator.

[0153] (B) Examples of photopolymerization initiators include photoradical polymerization initiators and photocationic polymerization initiators. (B) The photopolymerization initiator is preferably a photoradical polymerization initiator.

[0154] The above-mentioned photoradical polymerization initiator is a compound that generates radicals upon irradiation with light and initiates a radical polymerization reaction.

[0155] Examples of the above-mentioned photoradical polymerization initiators include benzoin compounds such as benzoin, benzoin methyl ether, benzoin ethyl ether, and benzoin isopropyl ether; alkylphenone compounds such as 2-hydroxy-2-methyl-1-phenyl-propan-1-one; acetophenone compounds such as acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, and 1,1-dichloroacetophenone; and 2-methyl-1-[4-(methylthio)phenyl]-2-morpho Linopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1, 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone, N,N-dimethylaminoacetophenone, polyethylene glycol di(beta-4-[4-(2-dimethylamino-2-benzyl)butaonylphenyl]piperazine)propio Aminoacetophenone compounds such as methyl anthraquinone, 2-ethyl anthraquinone, 2-t-butyl anthraquinone, and other anthraquinone compounds; thioxanthone compounds such as 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2-chlorothioxanthone, and 2,4-diisopropylthioxanthone; ketal compounds such as acetophenone dimethyl ketal and benzyl dimethyl ketal; 2,4,6-trimethylbenzoyl diphenylphosphine oxide, bis(2,4,6-trimethyl Acyl phosphine oxide compounds such as benzoyl)-phenylphosphine oxide, ethyl phenyl(2,4,6-trimethylbenzoyl)phosphinate, and polymeric ethyl(2,4,6-trimethylbenzoyl)-phenylphosphinate; oxime ester compounds such as 1,2-octanedione, 1-[4-(phenylthio)-2-(o-benzoyl oxime)], ethanone, and 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl]-1-(o-acetyl oxime);Examples include titanocene compounds such as bis(cyclopentadienyl)-diphenyl-titanium, bis(cyclopentadienyl)-dichloro-titanium, bis(cyclopentadienyl)-bis(2,3,4,5,6-pentafluorophenyl)titanium, and bis(cyclopentadienyl)-bis(2,6-difluoro-3-(pyrrole-1-yl)phenyl)titanium. The above photoradical polymerization initiators may be used individually or in combination of two or more.

[0156] In addition to the above-mentioned photoradical polymerization initiator, a photopolymerization initiator aid may also be used. Examples of such photopolymerization initiator aids include (methylimino)diethylene-bis[4-(dimethylamino)benzoate], polyethylene glycol (200) di(β-(4(pasetylphenyl)piperazine))propionate, N,N-dimethylaminobenzoate ethyl ester, N,N-dimethylaminobenzoate isoamyl ester, pentyl-4-dimethylaminobenzoate, triethylamine, and triethanolamine. Other photopolymerization initiator aids may also be used. The above-mentioned photopolymerization initiator aids may be used individually or in combination of two or more.

[0157] Additionally, titaniumene compounds such as CGI-784 (manufactured by Ciba Specialty Chemicals), which have absorption in the visible light region, may be used to promote the photoreaction.

[0158] Examples of the above-mentioned photocationic polymerization initiators include sulfonium salts, iodonium salts, metallocene compounds, and benzointosylates. One of these photocationic polymerization initiators may be used, or two or more may be used in combination.

[0159] In 100% by weight of the above curable composition, the content of (B) photopolymerization initiator is preferably 0.1% by weight or more, more preferably 0.5% by weight or more, even more preferably 1% by weight or more, preferably 30% by weight or less, more preferably 20% by weight or less, and even more preferably 10% by weight or less. When the content of (B) photopolymerization initiator is above the lower limit and below the upper limit, the photocurability can be further enhanced, the adhesive strength of the cured product of the above curable composition can be increased, and the thermal cycling characteristics (especially the ability to suppress peeling) can be further enhanced. Furthermore, when the content of (B) photopolymerization initiator is above the lower limit and below the upper limit, the overall curability of the cured product can be further enhanced, and partitions with an even larger aspect ratio can be formed.

[0160] (A) The content of (B) the photopolymerization initiator per 100 parts by weight of the photocurable compound is preferably 6 parts by weight or more, more preferably 8 parts by weight or more, even more preferably 10 parts by weight or more, preferably 35 parts by weight or less, more preferably 30 parts by weight or less, and even more preferably 25 parts by weight or less. (B) When the content of the photopolymerization initiator is above the lower limit, the photocurability can be further enhanced, and partitions with an even larger aspect ratio can be formed. (B) When the content of the photopolymerization initiator is below the upper limit, the adhesive strength of the cured product of the curable composition can be increased, and the thermal cycling properties (especially the ability to suppress peeling) can be further enhanced.

[0161] <Explanation regarding photopolymerization initiators when the curable composition satisfies the first configuration> (B1-1) Explanation of photopolymerization initiator having an α-aminoalkylphenone skeleton and a molecular weight of 800 or more: The effects of the present invention can be achieved by using (B1-1) the photopolymerization initiator. In particular, the effects of the present invention can be achieved by using (A1) the first (meth)acrylate compound and (B1-1) the photopolymerization initiator in combination. (B1-1) The photopolymerization initiator may be used alone or two or more in combination.

[0162] (B1-1) Examples of photopolymerization initiators include compounds listed in (B) as photopolymerization initiators that have an α-aminoalkylphenone skeleton and a molecular weight of 800 or more.

[0163] (B1-1) The photopolymerization initiator preferably includes a photopolymerization initiator with CAS number 886463-10-1. In this case, the effects of the present invention can be further enhanced.

[0164] When the above curable composition satisfies the above first configuration, the molecular weight of the (B1-1) photopolymerization initiator is 800 or more. Therefore, the effects of the present invention can be exhibited. The molecular weight of the (B1-1) photopolymerization initiator is preferably 825 or more, more preferably 850 or more, preferably 1000 or less, more preferably 950 or less, and even more preferably 925 or less. When the molecular weight of the (B1-1) photopolymerization initiator is above the above lower limit, the effects of the present invention can be further enhanced more effectively. When the molecular weight of the (B1-1) photopolymerization initiator is below the above upper limit, the curability of the deeper parts of the cured product can be further enhanced. The range of the molecular weight of the (B1-1) photopolymerization initiator can be set by appropriately selecting the above lower limit and upper limit.

[0165] In 100% by weight of the above curable composition, the content of (B1-1) photopolymerization initiator is preferably 0.1% by weight or more, more preferably 0.5% by weight or more, even more preferably 1% by weight or more, preferably 30% by weight or less, more preferably 20% by weight or less, even more preferably 10% by weight or less, and particularly preferably 3% by weight or less. When the content of (B1-1) photopolymerization initiator is above the lower limit and below the upper limit, the photocurability can be further enhanced, the adhesive strength of the cured product of the above curable composition can be increased, and the thermal cycle characteristics (suppression of peeling and suppression of cracking) can be further enhanced. Furthermore, when the content of (B1-1) photopolymerization initiator is above the lower limit and below the upper limit, the overall curability of the cured product can be further enhanced, and partitions with an even larger aspect ratio can be formed.

[0166] In the above curable composition, the content of (B1-1) photopolymerization initiator is preferably 0.5% by weight or more and 3% by weight or less. In this case, the curability of the deeper parts of the cured product can be further enhanced.

[0167] (A) The content of (B1-1) the photopolymerization initiator per 100 parts by weight of the photocurable compound is preferably 6 parts by weight or more, more preferably 8 parts by weight or more, even more preferably 10 parts by weight or more, preferably 35 parts by weight or less, more preferably 30 parts by weight or less, and even more preferably 25 parts by weight or less. (B1-1) If the content of the photopolymerization initiator is above the lower limit, the photocurability can be further enhanced and a partition with an even larger aspect ratio can be formed. (B1-1) If the content of the photopolymerization initiator is below the upper limit, the adhesive strength of the cured product of the curable composition can be increased and the thermal cycle characteristics (suppression of peeling and suppression of cracking) can be further enhanced.

[0168] (A1) The content of (B1-1) the photopolymerization initiator per 100 parts by weight of the first (meth)acrylate compound is preferably 1.0 part by weight or more, more preferably 2.5 parts by weight or more, even more preferably 4.0 parts by weight or more, preferably 15.0 parts by weight or less, more preferably 11.0 parts by weight or less, and even more preferably 6.5 parts by weight or less. (B1-1) If the content of the photopolymerization initiator is above the lower limit, the photocurability can be further enhanced and a partition with an even larger aspect ratio can be formed. (B1-1) If the content of the photopolymerization initiator is below the upper limit, the adhesive strength of the cured product of the curable composition can be increased and the thermal cycle characteristics (suppression of peeling and suppression of cracking) can be further enhanced.

[0169] (A3) The content of (B1-1) the photopolymerization initiator per 100 parts by weight of the cyclizable compound is preferably 1.0 part by weight or more, more preferably 2.5 parts by weight or more, even more preferably 4.0 parts by weight or more, preferably 14.5 parts by weight or less, more preferably 11.0 parts by weight or less, and even more preferably 8.0 parts by weight or less. When the content of (B1-1) the photopolymerization initiator is above the lower limit and below the upper limit, the photocurability can be further enhanced, the adhesive strength of the cured product of the curable composition can be increased, and the thermal cycle characteristics (suppression of peeling and suppression of cracking) can be further enhanced. Furthermore, when the content of (B1-1) the photopolymerization initiator is above the lower limit and below the upper limit, the overall curability of the cured product can be further enhanced, and partitions with an even larger aspect ratio can be formed.

[0170] (A3) The content of (B1-1) the photopolymerization initiator is preferably 1.0 part by weight or more and 14.5 parts by weight or less per 100 parts by weight of the cyclizable compound. In this case, the curability of the deeper parts of the cured product can be further improved.

[0171] <Explanation regarding photopolymerization initiators when the curable composition satisfies the second configuration> (B1) Explanation of photopolymerization initiators having an α-aminoacetophenone skeleton: The effects of the present invention can be achieved by using (B1) the photopolymerization initiator. In particular, the effects of the present invention can be achieved by using (A1) the first (meth)acrylate compound and (B1) the photopolymerization initiator in combination. Furthermore, the effects of the present invention can be achieved by using (A1) the first (meth)acrylate compound in combination with (B1) the photopolymerization initiator in a specific content. (B1) The photopolymerization initiator may be used alone or in combination of two or more types.

[0172] (B1) Examples of photopolymerization initiators include compounds having an α-aminoacetophenone skeleton among the compounds listed as photopolymerization initiators in (B).

[0173] (B) The photopolymerization initiator and (B1) the photopolymerization initiator preferably include a photopolymerization initiator with CAS number 886463-10-1, a photopolymerization initiator with CAS number 119313-12-1, or a photopolymerization initiator with CAS number 119344-86-4. In this case, the effects of the present invention can be further enhanced.

[0174] (B) The photopolymerization initiator and (B1) the photopolymerization initiator preferably include (B1-2) a photopolymerization initiator having a structure represented by the following formula (1), or (B1-1a) a photopolymerization initiator having an α-aminoacetophenone skeleton and an α-aminoalkylphenone skeleton and having a molecular weight of 800 or more. In this case, the effects of the present invention can be further enhanced.

[0175] Hereinafter, "(B1-2) Photopolymerization initiator having a structure represented by the following formula (1)" may be referred to as "(B1-2) Photopolymerization initiator." Also, "(B1-1a) Photopolymerization initiator having an α-aminoacetophenone skeleton and an α-aminoalkylphenone skeleton and having a molecular weight of 800 or more" may be referred to as "(B1-1a) Photopolymerization initiator."

[0176]

[0177] (B1-1a) The α-aminoacetophenone skeleton and the α-aminoalkylphenone skeleton in the photopolymerization initiator may share a portion of their skeletons. That is, a portion of the α-aminoacetophenone skeleton may be contained within the α-aminoalkylphenone skeleton, and a portion of the α-aminoalkylphenone skeleton may be contained within the α-aminoacetophenone skeleton.

[0178] (B1-1a) The molecular weight of the photopolymerization initiator is 800 or more. By using a (B1-1) photopolymerization initiator with this specific molecular weight, the effects of the present invention can be exhibited even more effectively. The molecular weight of the (B1-1a) photopolymerization initiator is preferably 825 or more, more preferably 850 or more, preferably 1000 or less, more preferably 950 or less, and even more preferably 925 or less. If the molecular weight of the (B1-1a) photopolymerization initiator is above the lower limit above, the effects of the present invention can be enhanced even more effectively. If the molecular weight of the (B1-1a) photopolymerization initiator is below the upper limit above, the curability of the deeper parts of the cured product can be enhanced even more effectively.

[0179] When the curable composition satisfies the second configuration described above, the content of (B1) photopolymerization initiator is 0.5% by weight or more and 3% by weight or less in 100% by weight of the curable composition. Therefore, the effects of the present invention can be achieved.

[0180] In 100% by weight of the above curable composition, the content of (B1) photopolymerization initiator is preferably 0.7% by weight or more, more preferably 1.0% by weight or more, even more preferably 1.5% by weight or more, preferably 2.9% by weight or less, more preferably 2.8% by weight or less, and even more preferably 2.6% by weight or less. When the content of (B1) photopolymerization initiator is above the lower limit and below the upper limit, the photocurability can be further enhanced, the adhesive strength of the cured product of the above curable composition can be increased, and the thermal cycle characteristics (suppression of peeling and suppression of cracking) can be further enhanced. Furthermore, when the content of (B1) photopolymerization initiator is above the lower limit and below the upper limit, the overall curability of the cured product can be further enhanced, and partitions with an even larger aspect ratio can be formed.

[0181] In 100% by weight of the above curable composition, the total content of (B1-2) photopolymerization initiator and (B1-1a) photopolymerization initiator is preferably 0.5% by weight or more, more preferably 1.0% by weight or more, even more preferably 1.5% by weight or more, preferably 3.0% by weight or less, more preferably 2.8% by weight or less, and even more preferably 2.6% by weight or less. When the total content of (B1-2) photopolymerization initiator and (B1-1a) photopolymerization initiator is above the lower limit and below the upper limit, the photocurability can be further enhanced, the adhesive strength of the cured product of the above curable composition can be increased, and the thermal cycle characteristics (suppression of peeling and suppression of cracking) can be further enhanced. Furthermore, when the total content of (B1-2) photopolymerization initiator and (B1-1a) photopolymerization initiator is above the lower limit and below the upper limit, the overall curability of the cured product can be increased, and partitions with an even larger aspect ratio can be formed.

[0182] In 100% by weight of the above curable composition, the content of (B1-2) photopolymerization initiator is preferably 0.5% by weight or more, more preferably 1.0% by weight or more, even more preferably 1.5% by weight or more, preferably 3.0% by weight or less, more preferably 2.8% by weight or less, and even more preferably 2.6% by weight or less. When the content of (B1-2) photopolymerization initiator is above the lower limit and below the upper limit, the photocurability can be further enhanced, the adhesive strength of the cured product of the above curable composition can be increased, the thermal cycle characteristics (suppression of peeling and suppression of cracking) can be further enhanced, and partitions with an even larger aspect ratio can be formed.

[0183] In 100% by weight of the above curable composition, the content of (B1-1a) photopolymerization initiator is preferably 0.5% by weight or more, more preferably 1.0% by weight or more, even more preferably 1.5% by weight or more, preferably 3.0% by weight or less, more preferably 2.8% by weight or less, and even more preferably 2.6% by weight or less. When the content of (B1-1a) photopolymerization initiator is above the lower limit and below the upper limit, the photocurability can be further enhanced, the adhesive strength of the cured product of the above curable composition can be increased, the thermal cycle characteristics (suppression of peeling and suppression of cracking) can be further enhanced, and partitions with an even larger aspect ratio can be formed.

[0184] (A) The content of (B1) the photopolymerization initiator per 100 parts by weight of the photocurable compound is preferably 6 parts by weight or more, more preferably 8 parts by weight or more, even more preferably 10 parts by weight or more, preferably 35 parts by weight or less, more preferably 30 parts by weight or less, and even more preferably 25 parts by weight or less. If the content of (B1) the photopolymerization initiator is above the lower limit, the photocurability can be further enhanced, and partitions with an even larger aspect ratio can be formed. If the content of (B1) the photopolymerization initiator is below the upper limit, the adhesive strength of the cured product of the curable composition can be increased, and the thermal cycle characteristics (suppression of peeling and suppression of cracking) can be further enhanced.

[0185] (A1) The content of (B1) the photopolymerization initiator per 100 parts by weight of the first (meth)acrylate compound is preferably 1.0 part by weight or more, more preferably 2.5 parts by weight or more, even more preferably 4.0 parts by weight or more, preferably 15.0 parts by weight or less, more preferably 11.0 parts by weight or less, and even more preferably 6.5 parts by weight or less. If the content of (B1) the photopolymerization initiator is above the lower limit, the photocurability can be further enhanced and a partition with an even larger aspect ratio can be formed. If the content of (B1) the photopolymerization initiator is below the upper limit, the adhesive strength of the cured product of the curable composition can be increased and the thermal cycle characteristics (suppression of peeling and suppression of cracking) can be further enhanced.

[0186] (A3) The content of (B1) the photopolymerization initiator per 100 parts by weight of the cyclizable compound is preferably 1.0 part by weight or more, more preferably 2.5 parts by weight or more, even more preferably 4.0 parts by weight or more, preferably 14.5 parts by weight or less, more preferably 11.0 parts by weight or less, and even more preferably 8.0 parts by weight or less. When the content of (B1) the photopolymerization initiator is above the lower limit and below the upper limit, the photocurability can be further enhanced, the adhesive strength of the cured product of the curable composition can be increased, and the thermal cycle characteristics (suppression of peeling and suppression of cracking) can be further enhanced. Furthermore, when the content of (B1) the photopolymerization initiator is above the lower limit and below the upper limit, the overall curability of the cured product can be further enhanced, and partitions with an even larger aspect ratio can be formed.

[0187] (A3) The content of (B1) the photopolymerization initiator is preferably 1.0 part by weight or more and 14.5 parts by weight or less per 100 parts by weight of the cyclizable compound. In this case, the curability of the deeper parts of the cured product can be further improved.

[0188] <(C) Thermosetting Compound> (C) Thermosetting compound is a thermosetting component. The above curable composition optionally contains (C) thermosetting compound. The above curable composition may or may not contain (C) thermosetting compound. (C) thermosetting compound is a thermosetting compound. (C) thermosetting compound has a thermosetting functional group. Only one type of (C) thermosetting compound may be used, or two or more types may be used in combination.

[0189] (C) Examples of thermosetting compounds include thermosetting compounds having a maleimide group, thermosetting compounds having a cyclic ether group, thermosetting compounds having a cyclic thioether group, thermosetting compounds having a thiirane group, and thermosetting compounds having a vinyl group.

[0190] From the viewpoint of enhancing thermosetting properties, (C) the thermosetting compound preferably has a cyclic ether group or a cyclic thioether group, and more preferably has an epoxy group. From the viewpoint of enhancing thermosetting properties, (C) the thermosetting compound preferably contains a thermosetting compound having a cyclic ether group or a thermosetting compound having a cyclic thioether group. From the viewpoint of enhancing thermosetting properties, (C) the thermosetting compound preferably contains an epoxy compound.

[0191] Examples of the epoxy compounds mentioned above include bisphenol A type epoxy compounds, bisphenol F type epoxy compounds, bisphenol S type epoxy compounds, phenol novolac type epoxy compounds, cresol novolac type epoxy compounds, biphenyl type epoxy compounds, biphenyl novolac type epoxy compounds, biphenol type epoxy compounds, naphthalene type epoxy compounds, fluorene type epoxy compounds, phenol aralkyl type epoxy compounds, naphthol aralkyl type epoxy compounds, dicyclopentadiene type epoxy compounds, anthracene type epoxy compounds, epoxy compounds having an adamantane skeleton, epoxy compounds having a tricyclodecane skeleton, naphthylene ether type epoxy compounds, and epoxy compounds having a triazine core as their skeleton.

[0192] The epoxy compound described above may also be a glycidyl ether type epoxy compound. A glycidyl ether type epoxy compound is an epoxy compound having at least one glycidyl ether group. Alternatively, the epoxy compound may also be a glycidylamine type epoxy compound. A glycidylamine type epoxy compound is an epoxy compound having at least one glycidylamine group.

[0193] From the viewpoint of increasing the adhesive strength of the cured product of the above curable composition and further enhancing the thermal cycling properties (especially the ability to suppress peeling), (C) the thermosetting compound preferably has an aromatic skeleton, and more preferably is a bisphenol A type epoxy compound or a bisphenol F type epoxy compound.

[0194] (C) The thermosetting compound preferably does not have a photocurable functional group and preferably does not have a (meth)acryloyl group.

[0195] The above curable composition either does not contain a thermosetting component or contains a thermosetting component in an amount of less than 10% by weight of the thermosetting component in 100% by weight of the curable composition. Because the content of the above thermosetting component in the above curable composition is low, the effects of the present invention can be exhibited.

[0196] In 100% by weight of the above curable composition, the content of the above thermosetting component is preferably 0% by weight (not present) or more, more preferably 0.1% by weight or more, even more preferably 1.0% by weight or more, less than 10% by weight, preferably 6.0% by weight or less, more preferably 4.5% by weight or less, and even more preferably 3.0% by weight or less. If the content of the thermosetting component is above the above lower limit, the adhesive strength of the cured product of the above curable composition can be increased, and the thermal cycling properties (especially the ability to suppress peeling) can be further enhanced. (C) If the content of the thermosetting compound is below (or less than) the above upper limit, the photocurability can be further enhanced, the overall curability of the cured product can be increased, and a partition with an even larger aspect ratio can be formed.

[0197] The above thermosetting component content refers to the sum of (C) the content of the thermosetting compound and (D) the content of the thermosetting agent.

[0198] (A) With respect to 100 parts by weight of the photocurable compound, (C) the content of the thermosetting compound is preferably 0 parts by weight (not contained) or more, more preferably 0.1 parts by weight or more, even more preferably 1.0 part by weight or more, preferably 6.5 parts by weight or less, more preferably 5.0 parts by weight or less, and even more preferably 3.5 parts by weight or less. (C) If the content of the thermosetting compound is above the lower limit, the adhesive strength of the cured product of the curable composition can be increased, and the thermal cycle characteristics (especially the ability to suppress peeling) can be further enhanced. (C) If the content of the thermosetting compound is below the upper limit, the photocurability can be further enhanced, the overall curability of the cured product can be increased, and partitions with an even larger aspect ratio can be formed.

[0199] <(D) Thermosetting Agent> (D) Thermosetting agent is a thermosetting component. The above curable composition optionally contains (D) thermosetting agent. The above curable composition may or may not contain (D) thermosetting agent. (D) thermosetting agent thermosetting (C) thermosetting compound. Only one type of (D) thermosetting agent may be used, or two or more types may be used.

[0200] (D) Examples of thermosetting agents include organic acids, amine compounds, amide compounds, hydrazide compounds, imidazole compounds, imidazoline compounds, phenol compounds, urea compounds, polysulfide compounds, and acid anhydrides. (D) Modified polyamine compounds such as amine-epoxy adducts may also be used as thermosetting agents. (D) Only one type of thermosetting agent may be used, or two or more types may be used in combination.

[0201] The above-mentioned amine compound refers to a compound having one or more primary to tertiary amino groups. Examples of the above-mentioned amine compound include (1) aliphatic amines, (2) alicyclic amines, (3) aromatic amines, (4) hydrazides, and (5) guanidine derivatives. Adduct forms of the above-mentioned amine compound may be used, such as epoxy compound-added polyamines (reaction product of epoxy compound and polyamine), Michael-added polyamines (reaction product of α,β-unsaturated ketone and polyamine), Mannich-added polyamines (condensate of polyamine, formalin, and phenol), thiourea-added polyamines (reaction product of thiourea and polyamine), and ketone-blocked polyamines (reaction product of ketone compound and polyamine [ketimine]).

[0202] Examples of the aliphatic amines mentioned in (1) above include diethylenetriamine, triethylenetetramine, tetraethylenepentamine, and diethylaminopropylamine.

[0203] Examples of the alicyclic amines in (2) above include mensendiamine, isophoronediamine, N-aminoethylpiperazine, 3,9-bis(3-aminopropyl)-2,4,8,10-tetraoxaspiro(5,5)undecane adduct, bis(4-amino-3-methylcyclohexyl)methane, and bis(4-aminocyclohexyl)methane.

[0204] The above (3) aromatic amines include m-phenylenediamine, p-phenylenediamine, o-xylenediamine, m-xylenediamine, p-xylenediamine, 4,4-diaminodiphenylmethane, 4,4-diaminodiphenylpropane, 4,4-diaminodiphenyl ether, 4,4-diamino-3,3-diethyl-5,5-dimethyldiphenylmethane, diphenylmethane, 4,4-diaminodicyclohexane, bis(4-aminophenyl)phenylmethane, 1,5-diaminonaphthalene, 1, Examples include 1-bis(4-aminophenyl)cyclohexane, 2,2-bis[(4-aminophenoxy)phenyl]propane, bis[4-(4-aminophenoxy)phenyl]sulfone, bis[4-(3-aminophenoxy)phenyl]sulfone, 1,3-bis(3-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 1,4-bis(4-aminophenoxy)benzene, 4,4-methylene-bis(2-chloroaniline), and 4,4-diaminodiphenylsulfone.

[0205] Examples of the hydrazides mentioned in (4) above include carbodihydrazide, adipic acid dihydrazide, sebacate acid dihydrazide, dodecanediic acid dihydrazide, and isophthalic acid dihydrazide.

[0206] Examples of the above (5) guanidine derivatives include dicyandiamide, 1-o-tolyl diguanide, α-2,5-dimethylguanide, α,ω-diphenyl diguanidide, α,α-bisguanylguanidinodiphenyl ether, p-chlorophenyl diguanide, α,α-hexamethylenebis[ω-(p-chlorophenol)]diguanide, phenyl diguanide oxalate, acetylguanidine, and diethylcyanoacetylguanidine.

[0207] Examples of the above-mentioned phenol compounds include polyhydric phenol compounds. Examples of the above-mentioned polyhydric phenol compounds include phenol, cresol, ethylphenol, butylphenol, octylphenol, bisphenol A, tetrabrombisphenol A, bisphenol F, bisphenol S, 4,4'-biphenylphenol, naphthalene skeleton-containing phenol novolac resin, xylylene skeleton-containing phenol novolac resin, dicyclopentadiene skeleton-containing phenol novolac resin, and fluorene skeleton-containing phenol novolac resin.

[0208] Examples of the above-mentioned acid anhydrides include phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylnadic anhydride, dodecyl succinic anhydride, chlorendic anhydride, pyromellitic anhydride, benzophenonetetracarboxylic anhydride, methylcyclohexenetetracarboxylic anhydride, trimellitic anhydride, and polyazelaic anhydride.

[0209] From the viewpoint of good ejection of the curable composition using an inkjet device, (D) the thermosetting agent is preferably an aromatic amine. The aromatic amine may have one, two, two or more, or three or more benzene rings. The aromatic amine may have 10 or fewer benzene rings. The aromatic amine may have one, two, two or more, or three or more amino groups. The aromatic amine may have 10 or fewer amino groups. From the viewpoint of good ejection of the curable composition using an inkjet device, it is preferable that the aromatic amine has two or more benzene rings and two or more amino groups.

[0210] From the viewpoint of good ejection of the curable composition using an inkjet device, it is preferable that in the above aromatic amine, adjacent benzene rings are bonded by oxygen atoms or sulfur atoms. From the viewpoint of good ejection of the curable composition using an inkjet device, it is preferable that in the above aromatic amine, adjacent benzene rings are bonded by ether bonds or thioether bonds.

[0211] Aromatic amines having two or more benzene rings and two or more amino groups, in which adjacent benzene rings are bonded by oxygen or sulfur atoms, include bis[4-(3-aminophenoxy)phenyl]sulfone, 1,3-bis(3-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 1,4-bis(4-aminophenoxy)benzene, 4,4-diaminodiphenylsulfone, and 4,4-diaminodiphenyl ether. From the viewpoint of good ejection of the curable composition using an inkjet device, the above aromatic amine is more preferably 1,3-bis(3-aminophenoxy)benzene or bis[4-(3-aminophenoxy)phenyl]sulfone, and even more preferably 1,3-bis(3-aminophenoxy)benzene. From the viewpoint of good ejection of the curable composition using an inkjet device, (D) the thermosetting agent is preferably composed of 1,3-bis(3-aminophenoxy)benzene or bis[4-(3-aminophenoxy)phenyl]sulfone, and more preferably composed of 1,3-bis(3-aminophenoxy)benzene.

[0212] (C) The content of the thermosetting agent is preferably 25 parts by weight or more, more preferably 30 parts by weight or more, even more preferably 35 parts by weight or more, preferably 90 parts by weight or less, more preferably 80 parts by weight or less, and even more preferably 70 parts by weight or less, per 100 parts by weight of the thermosetting compound. (D) When the content of the thermosetting agent is above the lower limit, the adhesive strength of the cured product of the curable composition can be increased, and the thermal cycle characteristics (especially the ability to suppress peeling) can be further enhanced. (D) When the content of the thermosetting agent is below the upper limit, the thermosetting properties can be further enhanced, the overall curability of the cured product can be increased, and partitions with an even larger aspect ratio can be formed.

[0213] <Curing Accelerator> The curable composition may optionally contain a curing accelerator. The curable composition may or may not contain the curing accelerator. In this specification, the curing accelerator is not included in the thermosetting component. Only one type of curing accelerator may be used, or two or more types may be used in combination.

[0214] Examples of the curing accelerators mentioned above include tertiary amines, imidazoles, quaternary ammonium salts, quaternary phosphonium salts, organometallic salts, phosphorus compounds, and urea compounds.

[0215] The above curable composition preferably does not contain a curing accelerator, or contains a curing accelerator in an amount of 5% by weight or less per 100% by weight of the above curable composition. In this case, the effects of the present invention can be exhibited even more effectively. The content of the curing accelerator in 100% by weight of the above curable composition is preferably 0% by weight or more (not contained), more preferably 0.01% by weight or more, even more preferably 0.05% by weight or more, preferably 3% by weight or less, more preferably 1% by weight or less, and even more preferably 0.5% by weight or less.

[0216] <Solvent> The above curable composition optionally contains a solvent. The above curable composition may or may not contain a solvent. Only one type of solvent may be used, or two or more types may be used in combination.

[0217] Examples of the solvents mentioned above include water and organic solvents.

[0218] From the viewpoint of further improving the ability to remove residues, the above solvent is preferably an organic solvent.

[0219] Examples of the above-mentioned organic solvents include alcohols such as ethanol, ketones such as acetone, methyl ethyl ketone, and cyclohexanone, aromatic hydrocarbons such as toluene, xylene, and tetramethylbenzene, glycol ethers such as cellosolve, methyl cellosolve, butyl cellosolve, carbitol, methyl carbitol, butyl carbitol, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol diethyl ether, and tripropylene glycol monomethyl ether, esters such as ethyl acetate, butyl acetate, butyl lactate, cellosolve acetate, butyl cellosolve acetate, carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether acetate, dipropylene glycol monomethyl ether acetate, and propylene carbonate, aliphatic hydrocarbons such as octane and decane, and petroleum-based solvents such as petroleum ether and naphtha.

[0220] When using the above-mentioned curable composition as a filler or when forming a composition layer using the above-mentioned curable composition, from the viewpoint of further improving the thickness accuracy of the filler or composition layer, it is preferable to have a lower solvent content in the above-mentioned curable composition.

[0221] The curable composition is preferably free of solvent or contains the solvent in an amount of 5% by weight or less per 100% by weight of the curable composition. The solvent content per 100% by weight of the curable composition is preferably 0% by weight (not present) or more, preferably 5% by weight or less, more preferably 1% by weight or less, and even more preferably 0.5% by weight or less. The curable composition is most preferably free of the solvent.

[0222] <Other Components> The above curable composition may contain other components besides those described above. Examples of these other components include coupling agents, flame retardants, colorants, fillers, leveling agents, defoamers, antioxidants, and polymerization inhibitors.

[0223] The above curable composition may or may not contain a filler. From the viewpoint of miniaturizing the electronic component obtained by ejecting the curable composition well using an inkjet device and coating the curable composition near a light-emitting device with high precision, it is preferable that the above curable composition contains a filler in an amount of 30% by weight or less per 100% by weight of the curable composition, or does not contain a filler. When the above curable composition contains a filler, the amount of the filler in 100% by weight of the curable composition is preferably 20% by weight or less, more preferably 10% by weight or less, and even more preferably 5% by weight or less. From the viewpoint of miniaturizing the electronic component obtained by ejecting the curable composition well using an inkjet device and coating the curable composition near a light-emitting device with high precision, it is most preferable that the above curable composition does not contain a filler.

[0224] (Further details of the curable composition, electronic components, and methods for manufacturing electronic components) The curable composition is preferably liquid at 25°C. Liquid also includes paste. The viscosity of the curable composition at 25°C and 10 rpm is preferably 3 mPa·s or more, more preferably 5 mPa·s or more, even more preferably 10 mPa·s or more, still more preferably 30 mPa·s or more, still more preferably 40 mPa·s or more, particularly preferably 60 mPa·s or more, and most preferably 80 mPa·s or more. The viscosity of the curable composition at 25°C and 10 rpm is preferably 1000 mPa·s or less, more preferably 500 mPa·s or less, even more preferably 400 mPa·s or less, particularly preferably 300 mPa·s or less, and most preferably 160 mPa·s or less. From the viewpoint of further improving inkjet ejection performance, further improving the thickness accuracy of the filler or curable composition layer, and further reducing the likelihood of voids forming in the filler or curable composition layer, it is particularly preferable that the viscosity of the curable composition at 25°C and 10 rpm be 10 mPa·s or more and 160 mPa·s or less.

[0225] Since the curable composition can be precisely positioned in a predetermined location, it is preferable that the curable composition is an inkjet-compatible curable composition. It is preferable that the curable composition is applied using an inkjet device. It is preferable that the inkjet-compatible curable composition is different from a curable composition applied by screen printing, and also different from a curable composition applied by a dispenser.

[0226] The above viscosity is measured in accordance with JIS K2283 using an E-type viscometer (for example, "TVE22L" manufactured by Toki Sangyo Co., Ltd.) under conditions of 25°C and 10 rpm.

[0227] The above-mentioned curable composition is used after curing by irradiation with light. Preferably, the above-mentioned curable composition is used after curing by irradiation with light and then curing by heating.

[0228] Regarding an example of an electronic component, the electronic component comprises an electronic component body having a recess on its surface, and a cured material filled in the recess in the electronic component body. The cured material is a cured product of the curable composition described above.

[0229] Examples of electronic components in which a hardened material is filled into the recesses described above include printed circuit boards and chassis.

[0230] By filling the recesses with the hardened material, the electronic component can be protected, or its surface can be made flat. Furthermore, an electronic component with a flattened surface can be easily bonded to other materials. For example, if the electronic component is used in a mobile phone, tablet, or personal computer, it can be bonded to other electronic components such as a display.

[0231] The depth of the recess (filling height of the cured material) is preferably 0.1 mm or more, more preferably 0.4 mm or more, even more preferably 0.8 mm or more, particularly preferably 1.1 mm or more, preferably 5.0 mm or less, more preferably 2.0 mm or less, even more preferably 1.75 mm or less, and particularly preferably 1.50 mm or less. When the depth of the recess (filling height of the cured material) is greater than or equal to the lower limit, the effects of the present invention can be exhibited more effectively. When the depth of the recess (filling height of the cured material) is less than or equal to the upper limit, the curability of the entire cured material can be improved more effectively.

[0232] An electronic component in which a cured material is filled into the recesses described above can be obtained through the following steps (method of manufacturing an electronic component): (1) A step of filling the recesses of an electronic component body having recesses on its surface with the curable composition described above (filling step). (2) A step of curing the curable composition by irradiation with light to form a cured material filled in the recesses (curing step).

[0233] In the above filling step, it is preferable to fill the curable composition described above using an inkjet device (by inkjet method).

[0234] The above curable composition is preferably used by filling and curing a recess in an electronic component (a recess in the body of the electronic component) (use of a curable composition for filling and curing a recess in an electronic component (a recess in the body of the electronic component)) (use of a curable composition for filling and curing a recess in an electronic component (a recess in the body of the electronic component) to form a cured product in the recess). The above curable composition is preferably a filler for recesses in electronic components (a filler for recesses in the body of the electronic component).

[0235] Regarding another example of an electronic component, the electronic component comprises a substrate, an electronic element disposed on a first surface of the substrate, and a partition wall disposed on the first surface of the substrate. In the electronic component, the partition wall is arranged on the first surface of the substrate so as to surround the electronic element. In the electronic component, the partition wall is a cured product of the curable composition described above.

[0236] It is preferable that the partition wall is arranged in a frame shape. It is preferable that the partition wall is not located in the center of the substrate. In the electronic component, it is preferable that there is a gap between the outer surface of the electronic element and the inner surface of the partition wall. In the electronic component, it is preferable that there is a space between the outer surface of the electronic element and the inner surface of the partition wall.

[0237] Examples of electronic components with partitions formed as described above include LED modules.

[0238] The above substrate may be made of a transparent material or not. Examples of the above substrate include circuit boards and silicon substrates.

[0239] Examples of the above electronic elements include light-emitting elements. Preferably, the above electronic element is a light-emitting element. Examples of the above electronic elements include semiconductor elements, etc. Preferably, the above electronic element is a semiconductor element. Examples of the above semiconductor elements include LED chips, etc. Preferably, the above semiconductor element is an LED chip.

[0240] The LED chip may be a red LED chip, a blue LED chip, a green LED chip, a UV-LED chip, or a combination of these LED chips. The UV-LED chip may be a deep ultraviolet UV-LED chip.

[0241] An electronic component with a partition wall as described above can be obtained through the following steps (method of manufacturing an electronic component): (1) A step of applying the curable composition in a frame shape onto the first surface of a substrate to form a curable composition layer (coating step). (2) A step of curing the curable composition layer to form a partition wall (curing step). (3) A step of arranging an electronic element on the first surface of the substrate and inside the area surrounded by the partition wall.

[0242] Furthermore, (4) it is preferable that the step of forming a reflective film on the inner wall surface of the partition wall is further provided.

[0243] In the above coating step, it is preferable to apply the curable composition in a frame shape using an inkjet device (by inkjet method). The above curing step may include (2A) a step of irradiating the curable composition layer with light to form a B-stage compound (photocuring step) and (2B) a step of thermally curing the B-stage compound by heating to form a partition wall (thermocuring step).

[0244] By repeating the above coating step and the above curing step, a partition wall with a large aspect ratio may be formed.

[0245] The width and height of the above-mentioned bulkhead can be changed as appropriate.

[0246] The width of the above-mentioned partition may be 30 μm or more, 50 μm or more, 70 μm or more, 1000 μm or less, 800 μm or less, or 700 μm or less.

[0247] The height of the above-mentioned partition wall is preferably 100 μm or more, more preferably 250 μm or more, even more preferably 400 μm or more, preferably 3000 μm or less, more preferably 2000 μm or less, and even more preferably 1500 μm or less.

[0248] The height of the partition wall is preferably 50 μm or more higher than the height of the electronic element, more preferably 100 μm or more higher, and even more preferably 200 μm or more higher.

[0249] The aspect ratio (height / width ratio) of the partition wall is preferably 3 or more, more preferably 4 or more, and even more preferably 5 or more. The aspect ratio (height / width ratio) of the partition wall may be 100 or less, 50 or less, 25 or less, or 15 or less.

[0250] The above curable composition is preferably used, for example, to form partitions (use of the above curable composition for forming partitions). Partitions can be formed using the above curable composition. It is preferable that the above curable composition is used to form partitions. It is preferable that the above curable composition is a curable composition for forming partitions. It is preferable that the above curable composition is used to form partitions in electronic components (use of the above curable composition for forming partitions in electronic components). The above curable composition is particularly preferably used to form partitions in LED modules (use of the above curable composition for forming partitions in LED modules). It is preferable that the above curable composition is a curable composition for forming partitions. The above curable composition is preferably used to form partitions in the gaps between multiple LED chips (use of the above curable composition for forming partitions in the gaps between multiple LED chips). The above curable composition is preferably used to form partitions at the periphery of the mounting area of ​​an LED chip (use of the above curable composition for forming partitions at the periphery of the mounting area of ​​an LED chip). This makes it possible to increase the utilization efficiency of light generated from the LED chips and suppress discoloration when the LED module is viewed from an oblique angle. Furthermore, if the LED chip is an LED chip that emits ultraviolet light (UV-LED chip), the luminous efficiency of the LED chip itself may be low. Since the light extraction efficiency can be increased by using the above-mentioned curable composition, the above-mentioned curable composition can be used particularly suitably when the LED chip is an LED chip that emits ultraviolet light.

[0251] The curable composition is preferably used by being applied to the first surface of the substrate so as to surround the electronic element placed on the first surface of the substrate. The curable composition is preferably used by being applied in a frame shape on the first surface of the substrate. The curable composition is preferably used to form a frame-shaped partition (use of the curable composition to form a frame-shaped partition). It is preferable that an electronic element is located inside the frame-shaped partition. It is preferable that an internal space is located inside the partition. It is preferable that a void is located inside the partition.

[0252] Furthermore, the curable composition described above may be used for applications other than filling and partition formation. Examples of such applications include marking materials, adhesives, coatings, and light-shielding materials. Since peeling and cracking can be effectively suppressed by using the curable composition according to the present invention, reliability can be improved by using the curable composition according to the present invention in marking materials, adhesives, coatings, and light-shielding materials. Since the curable composition according to the present invention can be finely coated from an inkjet device, it can be more preferably used as a marking material, adhesive for electronic components, coating material for electronic components, or light-shielding material for electronic components.

[0253] Specific embodiments of the present invention will be described below with reference to the drawings.

[0254] Figure 1 is a schematic cross-sectional view showing an electronic component obtained using a curable composition according to the first embodiment of the present invention.

[0255] The electronic component 1 shown in Figure 1 comprises an electronic component body 11 and a cured product 12. The electronic component body 11 has a recess 11a on its surface. The cured product 12 is filled into the recess 11a. The cured product 12 is a cured product of the curable composition described above.

[0256] Figure 2(a) is a schematic plan view showing an electronic component obtained using the curable composition according to the second embodiment of the present invention. Figure 3(b) is a schematic cross-sectional view showing an electronic component obtained using the curable composition according to the second embodiment of the present invention. Figure 3(b) is a cross-sectional view taken along the line I-I in Figure 2(a).

[0257] The electronic component 2 shown in Figures 2(a) and 3(b) comprises a substrate 21, an electronic element 22 disposed on a first surface 21a of the substrate 21, and a partition wall 23 disposed on the first surface 21a of the substrate 21. In the electronic component 2, the partition wall 23 is arranged on the first surface 21a of the substrate 21 so as to surround the electronic element 22. In the electronic component 2, the partition wall 23 is a cured product of the curable composition described above. There is a gap between the outer surface of the electronic element 22 and the inner surface of the partition wall 23. A space exists between the outer surface of the electronic element 22 and the inner surface of the partition wall 23. In the electronic component 2, the partition wall 23 is formed from the curable composition described above. The partition wall 23 is not disposed (formed) on the surface of the electronic element 22. The upper surface of the electronic element 22 is not covered by the partition wall 23. The shape of the partition wall 23 is frame-like.

[0258] Figure 4 is a schematic cross-sectional view showing an electronic component obtained using a curable composition according to a third embodiment of the present invention.

[0259] The electronic component 2A shown in Figure 4 further comprises a substrate 21, an electronic element 22 disposed on a first surface 21a of the substrate 21, a partition wall 23 disposed on the first surface 21a of the substrate 21, and a reflective film 24 on the inner wall surface (inner surface) of the partition wall 23. There is a gap between the outer surface of the electronic element 22 and the inner surface of the partition wall 23. There is a gap between the outer surface of the electronic element 22 and the inner surface of the partition wall 23. There is a gap between the outer surface of the electronic element 22 and the inner surface of the reflective film 24. There is a space between the outer surface of the electronic element 22 and the inner surface of the reflective film 24. The electronic component 2A differs from the electronic component 2 only in the presence or absence of the reflective film 24. The electronic component may or may not further have a reflective film on the inner wall surface of the partition wall.

[0260] The present invention will be described in more detail below with reference to examples. The present invention is not limited to the following examples.

[0261] Experimental examples of curable compositions satisfying the first configuration and experimental examples of curable compositions satisfying the second configuration are shown separately below. Note that some of the experimental examples of curable compositions satisfying the first configuration and some of the experimental examples of curable compositions satisfying the second configuration overlap.

[0262] <Experimental example regarding a curable composition that satisfies the first configuration> The following materials were prepared.

[0263] (A) Photocurable compound Tricyclodecanedimethanol diacrylate ("IRR214-K" manufactured by Daicel Ornex, (A1) First (meth)acrylate compound) 1,3-Adamantanediol diacrylate ((A1) First (meth)acrylate compound) Isobornyl acrylate ("IBOA" manufactured by Daicel Ornex, (A2) Second (meth)acrylate compound) 2-Ethyl-2-adamantyl acrylate ("EtADA" manufactured by Osaka Organic Chemical Industry Co., Ltd., (A2) Second (meth)acrylate compound) Polypropylene glycol diacrylate ("APG-700" manufactured by Shin Nakamura Chemical Industry Co., Ltd., (A4) Third (meth)acrylate compound) Tripropylene glycol diacrylate ("APG-200" manufactured by Shin Nakamura Chemical Industry Co., Ltd., (A4) Third (meth)acrylate compound) 1,9-nonanediol diacrylate (A-NOD-N, manufactured by Shin-Nakamura Chemical Industry Co., Ltd., (A4) third (meth)acrylate compound) Tris-(2-acryloxyethyl) isocyanurate (A-9300S, manufactured by Shin-Nakamura Chemical Industry Co., Ltd., (A4) third (meth)acrylate compound) Trimethylolpropane triacrylate (TMPTA, manufactured by Daicel Ornex, Inc., (A4) third (meth)acrylate compound) 2-ethylhexyl acrylate (AEH, manufactured by Nippon Shokubai Co., Ltd., (A2) second (meth)acrylate compound) 2-(allyloxymethyl)methyl acrylate (AOMA, manufactured by Nippon Shokubai Co., Ltd., (A3) cyclopolymerizable compound) Urethane (meth)acrylate compound 1 (EBECRYL8402, manufactured by Daicel Ornex, (A5) urethane compound, molecular weight 1000) Urethane (meth)acrylate compound 2 (EBECRYL210, manufactured by Daicel Ornex, (A5) urethane compound, molecular weight 1500)

[0264] ((B) Photopolymerization initiator) Polyethylene glycol di(beta-4-[4-(2-dimethylamino-2-benzyl)butaonylphenyl]piperazine)propionate (Omnipol 910, manufactured by IGM Resins, (B1-1) Photopolymerization initiator, CAS number: 886463-10-1, molecular weight 901) Phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide (Omnirad 819, manufactured by IGM Resins, other photopolymerization initiator, molecular weight 418.5)

[0265] ((C) Thermosetting Compounds) Bisphenol F type liquid epoxy compound (DIC Corporation "830CRP") Bisphenol F type solid epoxy compound (Mitsubishi Chemical Corporation "JER4005P")

[0266] ((D) Thermosetting agent) 1,3-bis(3-aminophenoxy)benzene ("APB-N" manufactured by Mitsui Chemicals, Inc.) Trialkyltetrahydrophthalic anhydride ("YH306" manufactured by Mitsubishi Chemical Corporation) N-(3-aminopropyl)cyclohexylamine (alicyclic amine)

[0267] (Polymerization inhibitor) Aluminum N-nitrosophenylhydroxylamine (Q-1301, manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.)

[0268] (Antioxidant) 3,9-bis[2-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propionyloxy]-1,1-dimethylethyl]-2,4,8,10-tetraoxaspiro[5.5]undecane (ADEKA Corporation "AO-80")

[0269] (Coupling agent) 3-Glycidoxypropyltriethoxysilane (Shin-Etsu Chemical Co., Ltd. "KBE-403")

[0270] (Examples 1-30 and Comparative Examples 1-5) The components shown in Tables 1, 3, 5, 7, 9, 11, and 13 were blended in the amounts (weight %) shown in Tables 1, 3, 5, 7, 9, 11, and 13, and uniformly mixed to obtain a curable composition (inkjet curable composition).

[0271] (Evaluation) (1) Twelve types of plates (material: SUS) were prepared, each having a recess (cylindrical, 0.4 cm in diameter) on the curable surface of the curable composition. The twelve types of plates differ in the depth of the recess. The depths of the recesses of the twelve types of plates are 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1.0 mm, 1.1 mm, and 1.2 mm.

[0272] The above-mentioned curable composition was filled into the recesses of the twelve types of plates in an amount equivalent to the volume of the recesses.

[0273] The filler material in the recess is exposed to ultraviolet light with a wavelength of 365 nm at an irradiance of 2000 mW / cm². ２ and irradiation time 3 seconds (cumulative light intensity 6000 mJ / cm²) ２ The filler was cured by irradiation under the following conditions.

[0274] Subsequently, the hardened material from the recess was removed to obtain 12 types of hardened material. The heights of the 12 types of hardened material were 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1.0 mm, 1.1 mm, and 1.2 mm.

[0275] The reaction rate of the surface located at the bottom of the recess in the above-mentioned cured product was measured as follows.

[0276] Method for measuring reaction rate: The reaction rate was measured using the ATR method with an IR spectrometer ("Nicolet iS5 Spectrophotometer" manufactured by Thermo Scientific) and an ATR measurement attachment ("iD7 ATR Accessory" manufactured by Thermo Scientific). To determine the amount of unreacted material (curable composition) and reacted material (cured material) on the surface located at the bottom of the recess of the cured product, the infrared absorption spectrum of the surface located at the bottom of the recess of the cured product was measured. The obtained infrared absorption spectrum was measured at 798 cm⁻¹. －１ ~825cm －１ The spectral areas were calculated for each (S-curable composition, S-cured product). The reaction rate was calculated using the following formula.

[0277] Reaction rate (%) = [S cured product / S curable composition] x 100

[0278] Based on the above reaction rates, the curability of the curable composition was determined according to the following criteria.

[0279] [Criteria for determining the curability of curable compositions] ○○○: Does not meet the criteria for ×, △, ○, and ○○. ○○: Does not meet the criteria for ×, △, and ○, and at least one of the three types of cured products with heights of 0.8 mm, 0.9 mm, and 1.0 mm has a reaction rate of less than 70%. ○: Does not meet the criteria for × and △, and at least one of the four types of cured products with heights of 0.4 mm, 0.5 mm, 0.6 mm, and 0.7 mm has a reaction rate of less than 70%. △: Does not meet the criteria for ×, and one type of cured product with a height of 0.3 mm has a reaction rate of less than 70%. ×: At least one of the two types of cured products with heights of 0.1 mm and 0.2 mm has a reaction rate of less than 70%.

[0280] (2) Curing shrinkage rate The specific gravity of the curable composition was measured. In addition, a cured product with a height of 0.1 mm obtained in the evaluation of the curability of the curable composition in (1) was prepared. The specific gravity of this cured product was measured. From the specific gravity of the curable composition and the specific gravity of the cured product, the curing shrinkage rate was calculated using the following formula.

[0281] Curing shrinkage rate (%) = [(Specific gravity of cured product - Specific gravity of curable composition) / Specific gravity of cured product] × 100

[0282] The curing shrinkage rate was determined according to the following criteria.

[0283] [Criteria for determining curing shrinkage rate] ○○○: Curing shrinkage rate of 10% or less ○○: Curing shrinkage rate exceeding 10% but 12% or less ○: Curing shrinkage rate exceeding 12% but 14% or less △: Curing shrinkage rate exceeding 14% but 16% or less ×: Curing shrinkage rate exceeding 16%

[0284] (3) Hardness of the cured product (after photocuring) A cured product with a height of 0.1 mm was prepared, obtained in the evaluation of the curability of the curable composition in (1) above. The pencil hardness of the surface located at the bottom of the recess of the cured product was measured in accordance with JIS K5600-5-4 as follows.

[0285] Method for measuring pencil hardness: The hardened material was positioned so that a pencil could be placed on the surface located at the bottom of the recess. Using the level of the pencil hardness tester, the pencil of the pencil hardness tester was placed on the surface of the hardened material for a length that allowed for horizontal alignment, and the test was conducted.

[0286] The hardness of the cured material (after light curing) was determined according to the following criteria.

[0287] [Criteria for determining the hardness of cured material (after light curing)] ○○○: Pencil hardness of 5H or higher ○○: Pencil hardness of 3H or 4H ○: Pencil hardness of H or 2H ×: Pencil hardness of F or lower

[0288] (4) Thermal Cycling Characteristics The curable composition was dropped onto a SUS substrate (5 cm x 5 cm) and coated onto the SUS substrate using a spin coater (MIKASA Corporation "Spin Coater MS-B100"). A soda glass substrate (5 cm x 5 cm) was bonded to the side of the SUS substrate to which the curable composition had been applied. The bonding area of ​​the two substrates was 5 cm in length, 1 cm in width, and 30 μm in thickness. After bonding the two substrates, ultraviolet light with a wavelength of 365 nm was applied to the curable composition from the soda glass substrate side at an irradiance of 2000 mW / cm². ２ and irradiation time 3 seconds (cumulative light intensity 6000 mJ / cm²) ２ The curable composition was cured by irradiation under the following conditions to obtain a laminate.

[0289] The obtained laminate was cooled at -40°C for 30 minutes, heated to 75°C at a heating rate of 100°C / min, heated at 75°C for 30 minutes, and cooled to -40°C at a cooling rate of 100°C / min. This process constituted one cycle, and this process was repeated 500 times to perform a thermal cycle test. The shear bond strength of the laminate before and after the thermal cycle test was measured using a tensile testing machine (A&D Company, Limited's "Tensilon Universal Material Testing Machine RTH Series"). The bond strength before the thermal cycle test was denoted as F1, and the bond strength after the thermal cycle test was denoted as F2, and the ratio (F2 / F1) was calculated.

[0290] The thermal cycling characteristics were determined according to the following criteria.

[0291] [Criteria for determining thermal cycling characteristics] ○○○: Ratio (F2 / F1) is 0.80 or higher ○○: Ratio (F2 / F1) is 0.60 or higher and less than 0.80 ○: Ratio (F2 / F1) is 0.40 or higher and less than 0.60 ×: Ratio (F2 / F1) is less than 0.40

[0292] (5) Storage stability of the curable composition The viscosity (η0) of the curable composition in the initial stages was measured in accordance with JIS K2283 using an E-type viscometer (for example, "TVE22L" manufactured by Toki Sangyo Co., Ltd.) at 25°C and 10 rpm.

[0293] Furthermore, the curable composition was stored at 60°C for 12 hours. The viscosity (η60) of the curable composition after storage was measured in the same manner as the viscosity (η0) of the initial curable composition.

[0294] The viscosity (η0) and viscosity (η60) were used to calculate the viscosity increase ratio using the following formula.

[0295] Viscosity (%) = [(Viscosity (η60) - Viscosity (η0)) / Viscosity (η0)] × 100

[0296] The storage stability of the curable composition was determined according to the following criteria.

[0297] [Criteria for determining the storage stability of curable compositions] ○○○: Thickening rate of 101% or less ○○: Thickening rate exceeding 101% and 102% or less ○: Thickening rate exceeding 102% and 103% or less ×: Thickening rate exceeding 103%

[0298] The composition and results are shown in Tables 1 to 14 below.

[0299]

[0300]

[0301]

[0302]

[0303]

[0304]

[0305]

[0306]

[0307]

[0308]

[0309]

[0310]

[0311]

[0312]

[0313] <Experimental example regarding a curable composition that satisfies the second configuration> The following materials were prepared.

[0314] (A) Photocurable compound Tricyclodecanedimethanol diacrylate ("IRR214-K" manufactured by Daicel Ornex, (A1) First (meth)acrylate compound) 1,3-Adamantanediol diacrylate ((A1) First (meth)acrylate compound) Isobornyl acrylate ("IBOA" manufactured by Daicel Ornex, (A2) Second (meth)acrylate compound) Polypropylene glycol diacrylate ("APG-700" manufactured by Shin Nakamura Chemical Industry Co., Ltd., (A4) Third (meth)acrylate compound) 1,9-Nonanediol diacrylate ("A-NOD-N" manufactured by Shin Nakamura Chemical Industry Co., Ltd., (A4) Third (meth)acrylate compound) Tris-(2-acryloxyethyl)isocyanurate (A-9300S, manufactured by Shin-Nakamura Chemical Industry Co., Ltd., (A4) third (meth)acrylate compound) Methyl 2-(allyloxymethyl)acrylate (AOMA, manufactured by Nippon Shokubai Co., Ltd., (A3) cyclopolymerizable compound) Urethane (meth)acrylate compound (EBECRYL8402, manufactured by Daicel Ornex Co., Ltd., (A5) urethane compound, molecular weight 1000)

[0315] ((B) Photopolymerization Initiator) Polyethylene glycol di(beta-4-[4-(2-dimethylamino-2-benzyl)butaonylphenyl]piperazine)propionate (Omnipol 910, manufactured by IGM Resins, (B1) Photopolymerization Initiator ((B1-1) Photopolymerization Initiator), CAS number: 886463-10-1, Molecular weight 901) 2-benzyl-2-(dimethylamino)-1-[4-(morpholino)phenyl]-1-butanone (Omnirad 369, manufactured by IGM Resins, (B1) Photopolymerization Initiator, CAS number: 119313-12-1, Molecular weight 366.5) 2-(dimethylamino)-2-(4-methylbenzyl)-1-(4-morpholinophenyl)butan-1-one (IGM Omnirad 379 (B1), manufactured by IGM RESINS, a photopolymerization initiator; CAS number: 119344-86-4; molecular weight 380.5; Phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide (Omnirad 819, manufactured by IGM RESINS, and other photopolymerization initiators); 2,4,6-trimethylbenzoyldiphenylphosphine oxide (Omnirad TPO, manufactured by IGM RESINS, and other photopolymerization initiators).

[0316] ((C) Thermosetting Compounds) Bisphenol F type liquid epoxy compound (DIC Corporation "830CRP") Bisphenol F type solid epoxy compound (Mitsubishi Chemical Corporation "JER4005P")

[0317] ((D) Thermosetting agent) 1,3-bis(3-aminophenoxy)benzene ("APB-N" manufactured by Mitsui Chemicals, Inc.) Trialkyltetrahydrophthalic anhydride ("YH306" manufactured by Mitsubishi Chemical Corporation) N-(3-aminopropyl)cyclohexylamine (alicyclic amine)

[0318] (Polymerization inhibitor) Aluminum N-nitrosophenylhydroxylamine (Q-1301, manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.)

[0319] (Antioxidant) 3,9-bis[2-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propionyloxy]-1,1-dimethylethyl]-2,4,8,10-tetraoxaspiro[5.5]undecane (AO-80 manufactured by ADEKA Corporation)

[0320] (Coupling agent) 3-glycidoxypropyltriethoxysilane (KBE-403 manufactured by Shin-Etsu Chemical Co., Ltd.)

[0321] (Examples 1 to 15, Reference Examples 1, 2 and Comparative Examples 1 to 6) The components shown in Tables 15, 17, 19, 21 and 23 were blended in the blending amounts (wt%) shown in Tables 15, 17, 19, 21 and 23 and uniformly mixed to obtain a curable composition (curable composition for inkjet).

[0322] (Evaluation) (1) Twelve types of plates (material: SUS) having recesses (cylindrical, diameter 0.4 cm) on the curable upper surface of the curable composition were prepared. The depths of the recesses of the twelve types of plates were different. The depths of the recesses of the twelve types of plates were 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1.0 mm, 1.1 mm, and 1.2 mm.

[0323] An amount of the curable composition corresponding to the volume of the recess was filled into the recesses of the twelve types of plates.

[0324] The filler in the recess was irradiated with ultraviolet light having a wavelength of 365 nm at an illuminance of 2000 mW / cm ２ and an irradiation time of 3 seconds (integrated light amount 6000 mJ / cm ２ ) under the conditions to cure the filler.

[0325] Thereafter, the cured products in the recesses were taken out to obtain twelve types of cured products. The heights of the twelve types of cured products were 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1.0 mm, 1.1 mm, and 1.2 mm.

[0326] The reaction rate of the surface located on the bottom side of the recess of the cured product was measured as follows.

[0327] Method for measuring reaction rate: The reaction rate was measured using the ATR method with an IR spectrometer ("Nicolet iS5 Spectrophotometer" manufactured by Thermo Scientific) and an ATR measurement attachment ("iD7 ATR Accessory" manufactured by Thermo Scientific). To determine the amount of unreacted material (curable composition) and reacted material (cured material) on the surface located at the bottom of the recess of the cured product, the infrared absorption spectrum of the surface located at the bottom of the recess of the cured product was measured. The obtained infrared absorption spectrum was measured at 798 cm⁻¹. －１ ~825cm －１ The spectral areas were calculated for each (S-curable composition, S-cured product). The reaction rate was calculated using the following formula.

[0328] Reaction rate (%) = [S cured product / S curable composition] x 100

[0329] Based on the above reaction rates, the curability of the curable composition was determined according to the following criteria.

[0330] [Criteria for determining the curability of curable compositions] ○○○: Does not meet the criteria for ×, △, ○, and ○○. ○○: Does not meet the criteria for ×, △, and ○, and at least one of the three types of cured products with heights of 0.8 mm, 0.9 mm, and 1.0 mm has a reflectance of less than 70%. ○: Does not meet the criteria for × and △, and at least one of the four types of cured products with heights of 0.4 mm, 0.5 mm, 0.6 mm, and 0.7 mm has a reflectance of less than 70%. △: Does not meet the criteria for ×, and one type of cured product with a height of 0.3 mm has a reaction rate of less than 70%. ×: At least one of the two types of cured products with heights of 0.1 mm and 0.2 mm has a reaction rate of less than 70%.

[0331] (2) Curing shrinkage rate The specific gravity of the curable composition was measured. In addition, a cured product with a height of 0.1 mm obtained in the evaluation of the curability of the curable composition in (1) was prepared. The specific gravity of this cured product was measured. From the specific gravity of the curable composition and the specific gravity of the cured product, the curing shrinkage rate was calculated using the following formula.

[0332] Curing shrinkage rate (%) = [(Specific gravity of cured product - Specific gravity of curable composition) / Specific gravity of cured product] × 100

[0333] The curing shrinkage rate was determined according to the following criteria.

[0334] [Criteria for determining curing shrinkage rate] ○○○: Curing shrinkage rate of 10% or less ○○: Curing shrinkage rate exceeding 10% but 12% or less ○: Curing shrinkage rate exceeding 12% but 14% or less △: Curing shrinkage rate exceeding 14% but 16% or less ×: Curing shrinkage rate exceeding 16%

[0335] (3) Hardness of the cured product (after photocuring) A cured product with a height of 0.1 mm was prepared, obtained in the evaluation of the curability of the curable composition in (1) above. The pencil hardness of the surface located at the bottom of the recess of the cured product was measured in accordance with JIS K5600-5-4 as follows.

[0336] Method for measuring pencil hardness: The hardened material was positioned so that a pencil could be placed on the surface located at the bottom of the recess. Using the level of the pencil hardness tester, the pencil of the pencil hardness tester was placed on the surface of the hardened material for a length that allowed for horizontal alignment, and the test was conducted.

[0337] The hardness of the cured material (after light curing) was determined according to the following criteria.

[0338] [Criteria for determining the hardness of cured material (after light curing)] ○○○: Pencil hardness of 5H or higher ○○: Pencil hardness of 3H or 4H ○: Pencil hardness of H or 2H ×: Pencil hardness of F or lower

[0339] (4) Thermal Cycling Characteristics The curable composition was dropped onto a SUS substrate (5 cm x 5 cm) and coated onto the SUS substrate using a spin coater (MIKASA Corporation "Spin Coater MS-B100"). A soda glass substrate (5 cm x 5 cm) was bonded to the side of the SUS substrate to which the curable composition had been applied. The bonding area of ​​the two substrates was 5 cm in length, 1 cm in width, and 30 μm in thickness. After bonding the two substrates, ultraviolet light with a wavelength of 365 nm was applied to the curable composition from the soda glass substrate side at an irradiance of 2000 mW / cm². ２ and irradiation time 3 seconds (cumulative light intensity 6000 mJ / cm²) ２ The curable composition was cured by irradiation under the following conditions to obtain a laminate.

[0340] The obtained laminate was cooled at -40°C for 30 minutes, heated to 75°C at a heating rate of 100°C / min, heated at 75°C for 30 minutes, and cooled to -40°C at a cooling rate of 100°C / min. This process constituted one cycle, and this process was repeated 500 times to perform a thermal cycle test. The shear bond strength of the laminate before and after the thermal cycle test was measured using a tensile testing machine (A&D Company, Limited's "Tensilon Universal Material Testing Machine RTH Series"). The bond strength before the thermal cycle test was denoted as F1, and the bond strength after the thermal cycle test was denoted as F2, and the ratio (F2 / F1) was calculated.

[0341] The thermal cycling characteristics were determined according to the following criteria.

[0342] [Criteria for determining thermal cycling characteristics] ○○○: Ratio (F2 / F1) is 0.80 or higher ○○: Ratio (F2 / F1) is 0.60 or higher and less than 0.80 ○: Ratio (F2 / F1) is 0.40 or higher and less than 0.60 ×: Ratio (F2 / F1) is less than 0.40

[0343] (5) Storage stability of the curable composition The viscosity (η0) of the curable composition in the initial stages was measured in accordance with JIS K2283 using an E-type viscometer (for example, "TVE22L" manufactured by Toki Sangyo Co., Ltd.) at 25°C and 10 rpm.

[0344] Furthermore, the curable composition was stored at 60°C for 12 hours. The viscosity (η60) of the curable composition after storage was measured in the same manner as the viscosity (η0) of the initial curable composition.

[0345] The viscosity (η0) and viscosity (η60) were used to calculate the viscosity increase ratio using the following formula.

[0346] Viscosity (%) = [(Viscosity (η60) - Viscosity (η0)) / Viscosity (η0)] × 100

[0347] The storage stability of the curable composition was determined according to the following criteria.

[0348] [Criteria for determining the storage stability of curable compositions] ○○○: Thickening rate of 101% or less ○○: Thickening rate exceeding 101% and 102% or less ○: Thickening rate exceeding 102% and 103% or less ×: Thickening rate exceeding 103%

[0349] The composition and results are shown in Tables 15-24 below.

[0350]

[0351]

[0352]

[0353]

[0354]

[0355]

[0356]

[0357]

[0358]

[0359]

[0360] Although the curable compositions of Reference Examples 1 and 2 do not satisfy the second configuration described above, they do satisfy the first configuration described above. For this reason, the results of Reference Examples 1 and 2 were superior to the results of Comparative Examples 1 to 6.

[0361] 1, 2, 2A... Electronic component 11... Electronic component body 11a... Recess 12... Cured material 21... Substrate 21a... First surface 22... Electronic element 23... Partition 24... Reflective film

Claims

1. A curable composition comprising a photocurable compound and a photopolymerization initiator, wherein the photocurable compound comprises a first (meth)acrylate compound having two or more (meth)acryloyl groups and an alicyclic skeleton, the curable composition does not contain a thermosetting component, or contains a thermosetting component in an amount of less than 10% by weight of 100% by weight of the curable composition, and the curable composition satisfies either the following first or second configuration. First configuration: The photopolymerization initiator comprises a photopolymerization initiator having an α-aminoalkylphenone skeleton and a molecular weight of 800 or more. Second configuration: The photopolymerization initiator comprises a photopolymerization initiator having an α-aminoacetophenone skeleton, and the content of the photopolymerization initiator having an α-aminoacetophenone skeleton is 0.5% by weight or more and 3% by weight or less in 100% by weight of the curable composition.

2. The curable composition is the curable composition according to claim 1, which satisfies the first configuration described above.

3. The curable composition according to claim 1, wherein the curable composition satisfies the first configuration, and the content of a photopolymerization initiator having the α-aminoalkylphenone skeleton and a molecular weight of 800 or more is 0.5% by weight or more and 3% by weight or less in 100% by weight of the curable composition.

4. The curable composition according to claim 1, wherein the curable composition satisfies the second configuration described above.

5. The curable composition according to claim 1, wherein the curable composition satisfies the second configuration, and the photopolymerization initiator having an α-aminoacetophenone skeleton is a photopolymerization initiator having a structure represented by the following formula (1), or a photopolymerization initiator having an α-aminoacetophenone skeleton and an α-aminoalkylphenone skeleton and having a molecular weight of 800 or more.

6. The curable composition according to any one of claims 1 to 5, wherein the content of the first (meth)acrylate compound is 20% by weight or more in 100% by weight of the curable composition.

7. The curable composition according to any one of claims 1 to 6, wherein the first (meth)acrylate compound comprises a (meth)acrylate compound having a dicyclopentadiene skeleton, a (meth)acrylate compound having a norbornene skeleton, or a (meth)acrylate compound having an adamantane skeleton.

8. The curable composition according to any one of claims 1 to 7, wherein the photocurable compound comprises a cyclopolymerizable compound or a second (meth)acrylate compound having one (meth)acryloyl group.

9. The curable composition according to any one of claims 1 to 8, wherein the photocurable compound comprises a cyclizable compound, and the content of the cyclizable compound in 100% by weight of the curable composition is 20% by weight or more and 50% by weight or less.

10. The curable composition according to any one of claims 1 to 9, wherein the photocurable compound comprises a cyclizable compound, and the content of the photopolymerization initiator having an α-aminoalkylphenone skeleton and a molecular weight of 800 or more is 1.0 part by weight or more and 14.5 parts by weight or less per 100 parts by weight of the cyclizable compound.

11. The curable composition according to any one of claims 1 to 9, wherein the curable composition satisfies the second configuration, the photocurable compound comprises a cyclizable compound, and the content of the photopolymerization initiator having an α-aminoalkylphenone skeleton is 1.0 part by weight or more and 14.5 parts by weight or less per 100 parts by weight of the cyclizable compound.

12. The curable composition according to any one of claims 1 to 11, wherein the photocurable compound comprises a urethane compound having a photocurable functional group, and the content of the urethane compound having a photocurable functional group is 1% by weight or more and 20% by weight or less in 100% by weight of the curable composition.

13. The curable composition according to claim 12, wherein the molecular weight of the urethane compound having the photocurable functional group is 500 or more and 2000 or less.

14. A curable composition for inkjet printing, as described in any one of claims 1 to 13.

15. A curable composition according to any one of claims 1 to 14, which is used by filling and curing a recess in an electronic component.

16. Use of the curable composition according to any one of claims 1 to 15 for filling and curing recesses in electronic components to form a cured product in the recesses.

17. An electronic component comprising an electronic component body having a recess on its surface, and a cured material filled in the recess in the electronic component body, wherein the cured material is a cured material of the curable composition described in any one of claims 1 to 15.

18. A method for manufacturing an electronic component, comprising the steps of: filling a recess in an electronic component body having a recess on its surface with a curable composition according to any one of claims 1 to 15 using an inkjet device; and curing the curable composition by irradiation with light to form a cured product filled in the recess.

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