Endoscope host and endoscope system

Abstract

Provided are an endoscope host and an endoscope system. The endoscope host comprises a main board (60), a heat dissipation support (10), a heat conduction member (20), heat dissipation fins (40), and a fan (30). The main board (60) is provided with a heat-generating device (61). The heat dissipation support (10) is disposed on the main board (60) and is in contact with the heat-generating device (61) in a fitted manner. The heat conduction member (20) is disposed on the heat dissipation support (10). The heat dissipation fins (40) are disposed on the heat dissipation support (10) and are in contact with the heat conduction member (20) in a fitted manner. The fan (30) is disposed on the heat dissipation support (10), and an air outlet side of the fan (30) faces the heat dissipation fins (40). The endoscope host and the endoscope system utilize the heat conduction member (20) to accelerate the heat transfer efficiency between the heat dissipation support (10) and the heat dissipation fins (40), thereby avoiding the problem of low heat transfer efficiency caused by incomplete contact between the heat dissipation support (10) and the heat dissipation fins (40). Moreover, the heat dissipation fins (40) are utilized to increase the heat dissipation area, thereby improving the heat dissipation efficiency; the fan (30) is utilized to accelerate the air circulation in the heat dissipation fins (40), such that the heat of the heat dissipation fins (40) can be quickly discharged, thereby further improving the heat dissipation efficiency.

Description

Endoscope host and endoscope system TECHNICAL FIELD

[0001] The present application relates to the technical field of endoscopes, in particular to an endoscope host. BACKGROUND

[0002] An endoscope system is a commonly used medical instrument. When in use, an endoscope is inserted into a patient's body through a natural orifice or a surgically formed incision. After the endoscope is introduced into an organ to be detected, a doctor can directly view the image of the lesion of the relevant part on the display screen of the host, thereby making a medical diagnosis.

[0003] The chip in the endoscope host needs to process a large amount of image information in real time, and the amount of computation is super large, so that the chip generates a large amount of heat when working, causing the temperature in the endoscope host to rise, affecting the normal work of the chip itself and the electronic components around it. Therefore, the heat dissipation system is generally designed for the heat generated by the chip. However, in the related art, the heat dissipation system for the chip has poor heat dissipation efficiency, and cannot timely discharge the heat in the endoscope host, affecting the working stability of the chip itself and the electronic components around it. SUMMARY

[0004] Therefore, it is necessary to provide an endoscope host and an endoscope system for improving the heat dissipation efficiency.

[0005] In one aspect, the present application provides an endoscope host, comprising:

[0006] a mainboard, wherein the mainboard is provided with a heat generating device;

[0007] a heat dissipation support, wherein the heat dissipation support is arranged on the mainboard and is in close contact with the heat generating device;

[0008] a heat conducting piece, wherein the heat conducting piece is arranged on the heat dissipation support;

[0009] a heat dissipation fin, wherein the heat dissipation fin is arranged on the heat dissipation support and is in close contact with the heat conducting piece; and

[0010] a fan, wherein the fan is arranged on the heat dissipation support and the air outlet side of the fan faces the heat dissipation fin.

[0011] The technical solutions are further described as follows:

[0012] In one of the embodiments, the endoscope host further comprises a shielding cover, the shielding cover is provided with a first air inlet and a first air outlet, and the first air inlet and the first air outlet are located on different surfaces of the shielding cover, respectively, the mainboard, the heat dissipation support, the heat conduction piece and the fan are located in the shielding cover, and the air inlet side of the fan faces the first air inlet, and the air outlet side of the fan faces the first air outlet.

[0013] In one of the embodiments, the shielding cover comprises an upper shell and a lower shell which are oppositely arranged along the height direction of the endoscope host, the mainboard is arranged in the lower shell, the first air inlet is arranged in the upper shell, and the first air outlet is located between the upper shell and the lower shell.

[0014] In one of the embodiments, the fan comprises a fan cover and a centrifugal impeller arranged in the fan cover, the fan cover is provided with a second air inlet corresponding to one side of the shaft of the centrifugal impeller to form the air inlet side, and the fan cover is provided with a second air outlet corresponding to one side of the circumference of the centrifugal impeller to form the air outlet side, wherein the second air inlet faces the first air inlet, and the second air outlet faces the heat dissipation fin and the first air outlet.

[0015] In one of the embodiments, the heat dissipation fin has an air inlet end and an air outlet end, the heat dissipation fin is formed with an air duct, the air duct penetrates the air inlet end and the air outlet end, the air inlet end is connected with the air outlet side of the fan, and the air outlet end extends out of the shielding cover from the first air outlet.

[0016] In one of the embodiments, the heat dissipation support comprises a heat absorption area attached to the heat generating device and a heat dissipation area extending out of the heat generating device, the heat conduction piece extends from the heat absorption area to the heat dissipation area, the fan is arranged in the heat absorption area, and the heat dissipation fin is arranged in the heat dissipation area.

[0017] In one of the embodiments, the number of the heat conduction pieces is multiple, and the multiple heat conduction pieces are arranged at intervals on the heat dissipation support.

[0018] In one of the embodiments, the arrangement interval of the heat conduction pieces in the heat dissipation area is greater than the arrangement interval of the heat conduction pieces in the heat absorption area.

[0019] In one of the embodiments, the side of the heat dissipation support away from the heat generating device is provided with a groove, the heat conduction piece is arranged in the groove, and the surface of the side of the heat conduction piece away from the heat generating device is flush with the surface of the side of the heat dissipation support away from the heat generating device.

[0020] In one of the embodiments, the heat conduction piece is a heat pipe.

[0021] In another aspect, the present application also provides an endoscope system comprising the endoscope host mentioned above.

[0022] In the endoscope host and the endoscope system mentioned above, the heat dissipation bracket is arranged on the mainboard and the heat generating device is attached to the heat dissipation bracket, the heat conducting member, the heat dissipation fins and the fan are arranged on the heat dissipation bracket, the heat dissipation fins are attached to the heat conducting member, and the air outlet side of the fan faces the heat dissipation fins. In this way, during operation, the heat generated by the heat generating device can be transferred to the heat conducting member through the heat dissipation bracket, and then transferred to the heat dissipation fins through the heat conducting member, and then the air outlet side of the fan blows air to the heat dissipation fins, and the heat is taken out of the endoscope host by the air to achieve heat dissipation. The heat conducting member is used to accelerate the heat transfer efficiency between the heat dissipation bracket and the heat dissipation fins, and avoid the problem of low heat transfer efficiency caused by the incomplete attachment of the heat dissipation bracket and the heat dissipation fins. At the same time, the heat dissipation fins increase the heat dissipation area and improve the heat dissipation efficiency, and the fan accelerates the air circulation in the heat dissipation fins, so that the heat of the heat dissipation fins can be quickly discharged, and the heat dissipation efficiency is further improved. BRIEF DESCRIPTION OF DRAWINGS

[0023] The accompanying drawings, which form a part of the present application, are intended to provide further understanding of the present application, and the illustrative embodiments of the present application and their description serve the purpose of explaining the present application. The accompanying drawings do not constitute an inappropriate limitation on the present application.

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the accompanying drawings needed in the embodiment description will be briefly introduced. Obviously, the accompanying drawings in the following description are only some embodiments of the present application, and other accompanying drawings can be obtained by those skilled in the art without creating any creative labor.

[0025] In addition, the drawings are not drawn to scale 1:1, and the relative sizes of the various elements are only exemplarily drawn in the drawings, but not necessarily drawn according to the true scale. In the drawings:

[0026] Fig. 1 is a structural schematic view of an endoscope host according to an embodiment.

[0027] Fig. 2 is an exploded view of the endoscope host shown in Fig. 1.

[0028] Fig. 3 is a structural schematic view of the endoscope host shown in Fig. 1 from another perspective after hiding the upper shell.

[0029] Explanation of reference signs

[0030] 10, heat dissipation support; 11, groove; 20, heat conduction member; 30, fan; 31, fan cover; 311, second air inlet; 312, second air outlet; 40, heat dissipation fin; 42, air duct; 421, air inlet end; 422, air outlet end; 50, shielding cover; 51, upper shell; 52, lower shell; 53, first air inlet; 54, first air outlet; 60, mainboard; 61, heat generating device. DETAILED DESCRIPTION

[0031] In order to make the above objectives, features and advantages of the present application more clear and easy to understand, the specific embodiments of the present application will be described in detail below with reference to the drawings. In the following description, a lot of specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be implemented in many different ways other than the embodiments described herein, and those skilled in the art can make similar improvements without departing from the spirit of the present application, so the present application is not limited to the specific embodiments disclosed below.

[0032] In the description of the present application, it should be understood that if these terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0033] In addition, if these terms "first", "second" appear, these terms are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features referred to. Therefore, the features limited by "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, if the term "a plurality of" appears, the meaning of "a plurality of" is at least two, for example, two, three, etc., unless otherwise specifically limited.

[0034] In the present application, unless otherwise specifically defined and limited, if the terms "mounting", "connecting", "connecting", "fixing" and the like appear, these terms should be understood in a broad sense. For example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise specifically limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0035] In this application, unless otherwise clearly indicated and limited, if there is a description such as "on" or "under" or the like between the first feature and the second feature, it means that the first and second features are in direct contact or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature "above", "over" and "on" the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the first feature is higher than the second feature in horizontal height. The first feature "below", "under" and "under" the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the first feature is lower than the second feature in horizontal height.

[0036] It should be noted that if an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or there can be an intermediate element. If an element is considered to be "connected" to another element, it can be directly connected to the other element or there can be an intermediate element. If present, the terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used in this application are only for illustrative purposes and are not the only embodiment.

[0037] As described above, at present, the heat dissipation system of the chip of the endoscope host has poor heat dissipation efficiency, and cannot timely discharge the heat in the endoscope host, which affects the working stability of the chip itself and the electronic elements around it. Specifically, in the traditional endoscope host, the heat dissipation system usually includes a heat dissipation support, a heat dissipation fin and a heat dissipation fan which are stacked, the heat dissipation support is arranged on the chip, and the heat dissipation fin is installed on the heat dissipation support through screws and the like. However, considering the structure of the heat dissipation fin itself and the space layout in the endoscope host and the like, the heat dissipation fin cannot be completely attached to the heat dissipation support, resulting in low heat conduction efficiency between the heat dissipation fin and the heat dissipation support. At the same time, since the shielding cover of the endoscope host is relatively closed, the convection of hot air in the shielding cover is not smooth, and the heat is not easy to discharge, resulting in that the heat dissipation effect cannot meet the requirements.

[0038] Based on this, an embodiment of the present application provides an endoscope host. Specifically, referring to FIGS. 1 to 3, the endoscope host of an embodiment includes a mainboard 60, a heat dissipation support 10, a heat conduction piece 20, a heat dissipation fin 40 and a fan 30. The mainboard 60 is provided with a heat generating device 61. Exemplarily, the heat generating device 61 can be a chip or other electronic device that generates heat when working. The heat dissipation support 10 is arranged on the mainboard 60 and is attached to the heat generating device 61. The heat conduction piece 20 is arranged on the heat dissipation support 10. The heat dissipation fin 40 is arranged on the heat dissipation support 10 and is attached to the heat conduction piece 20. The fan 30 is arranged on the heat dissipation support 10, and the air outlet side of the fan 30 faces the heat dissipation fin 40.

[0039] In the endoscope host mentioned above, the heat dissipation bracket 10 is arranged on the mainboard 60 and is in close contact with the heat generating device 61, the heat conducting member 20, the heat dissipation fins 40 and the fan 30 are further arranged on the heat dissipation bracket 10, the heat dissipation fins 40 are in close contact with the heat conducting member 20, and the air outlet side of the fan 30 faces the heat dissipation fins 40. In this way, during operation, the heat generated by the heat generating device 61 can be transmitted to the heat conducting member 20 through the heat dissipation bracket 10, then transmitted to the heat dissipation fins 40 through the heat conducting member 20, and then the air outlet side of the fan 30 blows air to the heat dissipation fins 40, so that the heat is taken out of the endoscope host by the air to achieve heat dissipation. Among them, the arrangement of the heat conducting member 20 greatly improves the heat transfer efficiency of the heat dissipation bracket 10 and the heat dissipation fins 40, and avoids the problem of low heat transfer efficiency caused by the incomplete close contact of the heat dissipation bracket 10 and the heat dissipation fins 40. At the same time, the arrangement of the heat dissipation fins 40 greatly increases the heat dissipation area and improves the heat dissipation efficiency, and the arrangement of the fan 30 accelerates the air circulation in the heat dissipation fins 40, so that the heat of the heat dissipation fins 40 can be quickly discharged, further improving the heat dissipation efficiency.

[0040] Referring to FIG. 1, in an embodiment, the endoscope host further comprises a shielding cover 50, which can protect the electronic devices in the endoscope host from water and dust, and also has an electromagnetic shielding effect. Specifically, the shielding cover 50 is provided with a first air inlet 53 and a first air outlet 54, and the first air inlet 53 and the first air outlet 54 are located on different surfaces of the shielding cover 50, respectively. The mainboard 60, the heat dissipation bracket 10, the heat conducting member 20 and the fan 30 are all located in the shielding cover 50, and the air inlet side of the fan 30 faces the first air inlet 53, and the air outlet side of the fan 30 faces the first air outlet 54. In this way, during operation, the cold air from the outside can enter the shielding cover 50 from the first air inlet 53 under the drive of the fan 30, take away the heat in the heat dissipation fins 40 after flowing through the heat dissipation fins 40, and finally be discharged from the first air outlet 54, ensuring the smoothness of the air flow in and out of the shielding cover 50, thereby improving the heat dissipation efficiency. At the same time, since the first air inlet 53 and the first air outlet 54 are located on different surfaces of the shielding cover 50, respectively, the first air inlet 53 and the first air outlet 54 can be separated, preventing the mixing of cold and hot air, and further improving the heat dissipation efficiency.

[0041] In combination with FIG. 2, in an embodiment, the shielding cover 50 comprises an upper shell 51 and a lower shell 52 arranged opposite along the height direction of the endoscope host, the mainboard 60 is arranged in the lower shell 52, the first air inlet 53 is arranged in the upper shell 51, and the first air outlet 54 is located between the upper shell 51 and the lower shell 52. That is, the first air inlet 53 is arranged on the top surface of the shielding cover 50, and the first air outlet 54 is arranged on the side surface of the shielding cover 50, so as to ensure that the air inlet direction and the air outlet direction of the shielding cover 50 are different and separated by a certain distance, further avoiding the mixing of cold and hot air, and further improving the heat dissipation efficiency.

[0042] Referring to FIG. 3, in an embodiment, the fan 30 comprises a fan cover 31 and a centrifugal impeller (not shown) arranged in the fan cover 31, the fan cover 31 is provided with a second air inlet 311 corresponding to one side of the shaft side of the centrifugal impeller to form an air inlet side, and the fan cover 31 is provided with a second air outlet 312 corresponding to one side of the circumferential side of the centrifugal impeller to form an air outlet side. Among them, the second air inlet 311 of the fan cover 31 faces the first air inlet 53 of the shielding cover 50, and the second air outlet 312 of the fan cover 31 faces the heat dissipation fin 40 and the first air outlet 54 of the shielding cover 50. That is, the fan 30 of the present embodiment is a centrifugal fan 30 with axial air inlet and radial air outlet, compared with the axial air inlet and axial air outlet used in the traditional heat dissipation system, the fan 30 of the present application can ensure that the air inlet direction is perpendicular to the air outlet direction, so as to be more suitable for the shielding cover 50 with the first air inlet 53 opened on the top surface and the first air outlet 54 opened on the side surface, ensuring that the cold air of the air inlet and the hot air of the air outlet are separated, preventing the mixing of cold and hot air, and thereby improving the heat dissipation efficiency. At the same time, when using the centrifugal fan 30, the heat dissipation fin 40 can be arranged on the outer circumferential side of the fan 30, so that the fan 30 and the heat dissipation fin 40 do not need to be stacked, reducing the space occupied by the combination of the fan 30 and the heat dissipation fin 40 in the height direction, thereby reducing the overall height of the endoscope main machine.

[0043] Referring to FIG. 3, optionally, in an embodiment, the heat dissipation fin 40 has an air inlet end 421 and an air outlet end 422, and a wind channel 42 is formed in the heat dissipation fin 40, which penetrates the air inlet end 421 and the air outlet end 422. Exemplarily, the heat dissipation fin 40 comprises an outer cover with both ends open, and a plurality of fins are arranged in the outer cover in a spaced manner, and the wind channel 42 is formed between adjacent two fins. Further, the air inlet end 421 of the heat dissipation fin 40 is connected with the air outlet side of the fan 30, and the air outlet end 422 of the heat dissipation fin 40 extends out of the shielding cover 50 from the first air outlet 54. Exemplarily, the opening of the air inlet end 421 of the heat dissipation fin 40 is connected with the second air outlet 312 of the fan 30, and the opening of the air outlet end 422 of the heat dissipation fin 40 is located outside the shielding cover 50. In this way, the cold air is sent into the wind channel 42 of the heat dissipation fin 40 from the opening of the air inlet end 421 of the heat dissipation fin 40 by the fan 30, and then the cold air exchanges heat with the fins in the wind channel 42 to form hot air, and the hot air is directly discharged to the outside of the shielding cover 50 from the opening of the air outlet end 422 of the heat dissipation fin, preventing the hot air from flowing back into the shielding cover 50, thereby further improving the heat dissipation effect.

[0044] Referring to FIG. 3, in an embodiment, the heat dissipation support 10 comprises a heat absorbing area attached to the heat generating device 61 and a heat dissipating area extending out of the heat generating device 61, the heat conducting member 20 extends from the heat absorbing area to the heat dissipating area, the fan 30 is arranged at the heat absorbing area, and the heat dissipation fins 40 are arranged at the heat dissipating area. In this way, the heat conducting member 20 can exchange heat with the heat generating device 61 at the heat absorbing area, and then transfer the heat to the heat dissipation fins 40 at the heat dissipating area. In addition, the fan 30 arranged at the heat absorbing area can not only dissipate heat for the heat dissipation fins 40 at the heat dissipating area, but also dissipate heat for the heat conducting member 20 at the heat absorbing area, thereby further improving the heat dissipation efficiency.

[0045] Referring to FIG. 3, the number of the heat conducting members 20 is multiple, and the multiple heat conducting members 20 are arranged at intervals on the heat dissipation support 10. For example, the number of the heat conducting members 20 can be two, three, four or more, which is not limited herein.

[0046] Further, the arrangement interval of the heat conducting members 20 at the heat dissipating area is greater than the arrangement interval of the heat conducting members 20 at the heat absorbing area. For example, the portions of the heat conducting members 20 at the heat dissipating area are arranged close to each other and parallel to each other, so that the heat conducting members 20 are arranged densely at the heat dissipating area, and the portions of the heat conducting members 20 at the heat dissipating area are bent in different directions, so that the heat conducting members 20 are arranged sparsely at the heat dissipating area. In this way, at the heat dissipating area, the heat conducting members 20 are arranged densely, so that the heat generating device 61 below can exchange heat with more heat conducting members 20, thereby improving the heat absorbing efficiency. At the heat dissipating area, the heat conducting members 20 are arranged sparsely, so that the heat of the heat conducting members 20 is more easily dissipated and transferred to the heat dissipation fins 40, thereby further improving the heat dissipation efficiency.

[0047] Referring to FIG. 3, the side of the heat dissipation support 10 away from the heat generating device 61 is provided with a groove 11, the heat conducting member 20 is arranged in the groove 11, and the surface of the side of the heat conducting member 20 away from the heat generating device 61 is flush with the surface of the side of the heat dissipation support 10 away from the heat generating device 61. In this way, the surface of the side of the heat dissipation support 10 away from the heat generating device 61 is flat, which is convenient for arranging the heat dissipation fins 40 and the fan 30 thereon. In addition, the surface of the heat conducting member 20 is flush with the surface of the heat dissipation support 10, so that the heat dissipation fins 40 can be attached to the heat conducting member 20 and the heat dissipation support 10 at the same time, thereby the heat dissipation support 10 can also be directly transferred to the heat dissipation fins 40, further improving the heat dissipation efficiency.

[0048] Optionally, in an embodiment, the heat conducting member 20 is a heat pipe. The heat pipe is a heat transfer element that relies on the phase change of the working liquid inside itself to realize heat transfer. The heat pipe mainly relies on the vapor-liquid phase change of the working liquid inside to transfer heat, and the thermal resistance is very small, so it has very high heat conduction capacity. Compared with silver, copper, aluminum and other metals, the heat pipe can transfer several orders of magnitude of heat per unit weight, thereby greatly enhancing the heat transfer efficiency between the heat dissipation support 10 and the heat dissipation fins 40, and further improving the heat dissipation efficiency.

[0049] Another embodiment of the present application also provides an endoscope system. Specifically, the endoscope system of an embodiment comprises the endoscope host mentioned above. Further, the endoscope system also comprises an endoscope body which is electrically connected with the endoscope host.

[0050] In the endoscope system mentioned above, the heat dissipation bracket 10 is arranged on the mainboard 60 of the endoscope host and is in close contact with the heat generating device 61, the heat conducting member 20, the heat dissipation fins 40 and the fan 30 are arranged on the heat dissipation bracket 10, the heat dissipation fins 40 are in close contact with the heat conducting member 20, and the air outlet side of the fan 30 faces the heat dissipation fins 40. In this way, when working, the heat generated by the heat generating device 61 can be transmitted to the heat conducting member 20 through the heat dissipation bracket 10, then transmitted to the heat dissipation fins 40 by the heat conducting member 20, and then blown to the heat dissipation fins 40 by the air outlet side of the fan 30, so as to take out the heat from the endoscope host by air to achieve heat dissipation. The arrangement of the heat conducting member 20 greatly accelerates the heat transfer efficiency between the heat dissipation bracket 10 and the heat dissipation fins 40, and avoids the problem of low heat transfer efficiency caused by the incomplete close contact between the heat dissipation bracket 10 and the heat dissipation fins 40. At the same time, the arrangement of the heat dissipation fins 40 greatly increases the heat dissipation area and improves the heat dissipation efficiency, and the arrangement of the fan 30 accelerates the air circulation in the heat dissipation fins 40, so that the heat of the heat dissipation fins 40 can be quickly discharged, further improving the heat dissipation efficiency.

[0051] The technical features of the above-mentioned embodiments can be combined in any way. In order to make the description simple, all possible combinations of the technical features in the above-mentioned embodiments are not described, but as long as the combination of the technical features does not exist contradictory, it should be considered as the scope of the present application.

[0052] The above-mentioned embodiments only express several implementation manners of the present application, and the description is more specific and detailed, but it should not be understood as a limitation on the patent scope of the application. It should be pointed out that for ordinary skilled in the art, without departing from the concept of the present application, some modifications and improvements can be made, which are all within the protection scope of the present application. Therefore, the patent protection scope of the present application should be subject to the appended claims.

Claims

1. An endoscope host machine, characterized by, The endoscope main machine comprises: a mainboard provided with a heat generating device; a heat dissipation support arranged on the mainboard and in abutting cooperation with the heat generating device; a heat conducting member arranged on the heat dissipation support; a heat dissipation fin arranged on the heat dissipation support and in abutting cooperation with the heat conducting member; and a fan arranged on the heat dissipation support and having an air outlet side facing the heat dissipation fin.

2. The endoscope host unit of claim 1, wherein, The endoscope main machine further comprises a shielding cover provided with a first air inlet and a first air outlet, and the first air inlet and the first air outlet are located on different surfaces of the shielding cover, the mainboard, the heat dissipation support, the heat conducting member and the fan are located in the shielding cover, and the air inlet side of the fan faces the first air inlet, and the air outlet side of the fan faces the first air outlet.

3. The endoscope host unit of claim 2, wherein, The shielding cover comprises an upper shell and a lower shell arranged opposite along the height direction of the endoscope main machine, the mainboard is arranged on the lower shell, the first air inlet is arranged on the upper shell, and the first air outlet is located between the upper shell and the lower shell.

4. The endoscope host unit of claim 2, wherein, The fan comprises a fan cover and a centrifugal impeller arranged in the fan cover, the fan cover is provided with a second air inlet corresponding to one side of the shaft of the centrifugal impeller to form the air inlet side, and the fan cover is provided with a second air outlet corresponding to one side of the circumference of the centrifugal impeller to form the air outlet side, wherein the second air inlet faces the first air inlet, and the second air outlet faces the heat dissipation fin and the first air outlet.

5. The endoscope host unit of claim 2, wherein, The heat dissipation fin has an air inlet end and an air outlet end, a wind channel is formed in the heat dissipation fin, the wind channel penetrates the air inlet end and the air outlet end, the air inlet end is connected with the air outlet side of the fan, and the air outlet end extends out of the shielding cover from the first air outlet.

6. The endoscope host unit of claim 1, wherein, The heat dissipation support comprises a heat absorbing area abutting the heat generating device and a heat dissipation area extending out of the heat generating device, the heat conducting member extends from the heat absorbing area to the heat dissipation area, the fan is arranged in the heat absorbing area, and the heat dissipation fin is arranged in the heat dissipation area.

7. The endoscope host unit of claim 6, wherein, The number of the heat conducting members is multiple, and the multiple heat conducting members are arranged at intervals on the heat dissipation support.

8. The endoscope host unit of claim 7, wherein, The arrangement interval of the heat conducting members in the heat dissipation area is greater than the arrangement interval of the heat conducting members in the heat absorbing area.

9. The endoscope host unit of claim 6, wherein, The side of the heat dissipation support away from the heat generating device is provided with a groove, the heat conducting member is arranged in the groove, and the surface of the side of the heat conducting member away from the heat generating device is flush with the surface of the side of the heat dissipation support away from the heat generating device.

10. The endoscope host unit of any of claims 1-9, wherein, The heat conducting member is a heat pipe.

11. An endoscope system characterized by comprising: The endoscope main machine comprises any one of claims 1-10. The endoscope main machine comprises any one of claims 1-10.

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