module

Abstract

A module 1 comprises: a substrate 10 having a first main surface 10a and a second main surface 10b facing each other in a thickness direction; a heat-generating element 20 disposed on the first main surface 10a of the substrate 10 and having a plurality of GND electrodes 21 on the first main surface 10a side; a plurality of heat-dissipation members 30 disposed on the second main surface 10b of the substrate 10; a connection conductor 40 penetrating the substrate 10 in the thickness direction and connecting the GND electrodes 21 of the heat-generating element 20 and the heat-dissipation members 30; and signal terminals 50 disposed on the second main surface 10b of the substrate 10 and connected to a signal line inside the substrate 10, the module being characterized in that the shape of the signal terminals 50 as viewed from the thickness direction is a substantially circular shape in which the dimension in the longitudinal direction and the dimension in the lateral direction are equal to each other, the plurality of signal terminals 50 are arranged at substantially equal intervals in the longitudinal direction and the lateral direction, respectively, a plurality of the heat-dissipation members 30 are connected to one of the GND electrodes 21, the number of GND electrodes 21 to which one heat-dissipation member 30 is connected is one, the number of heat-dissipation members 30 connected to each one of the GND electrode 21 is substantially the same, and the shape of the heat-dissipation members 30 when viewed from the thickness direction is substantially the same as the shape of the signal terminals 50.

Description

module

[0001] This invention relates to a module.

[0002] In modules, electronic components such as PAs (Power Amplifiers), which generate a large amount of heat, are sometimes placed on the top surface of the circuit board due to their height. In such modules, it is being considered to improve heat dissipation by placing heat dissipation elements that are thermally connected to the electronic components on the back surface of the circuit board.

[0003] For example, Patent Document 1 discloses a high-frequency module in which a power amplifier is mounted on the upper side of a mounting substrate and a metal block is mounted on the bottom side opposite to the upper side, in which the power amplifier and the metal block are connected by via conductors that penetrate the mounting substrate to improve the heat dissipation of the power amplifier.

[0004] Japanese Patent Publication No. 2020-126921

[0005] However, when a heat dissipation element (metal block) is provided on the back side of the substrate, as in Patent Document 1, there was a risk of cracks occurring at the interface between the heat dissipation element and the substrate due to the expansion of the heat dissipation element under thermal load. Furthermore, when the heat dissipation element is covered with a sealing resin or the like, there was a risk of cracks occurring at the interface between the heat dissipation element and the sealing resin. Moreover, there was a risk that the heat from the heat dissipation element could adversely affect the surrounding I / O terminals.

[0006] In addition, the method described in Patent Document 1 involves connecting a single large metal block to a substrate. When mounting such a large metal block onto the via conductors of a substrate, the amount of solder at the joint becomes large, which can sometimes lead to insufficient solder around the metal block and result in mounting defects.

[0007] This invention was made to solve the above problems and aims to provide a module that is less prone to cracking, has excellent heat dissipation, and is less susceptible to mounting defects.

[0008] A module according to the first embodiment of the present invention comprises a substrate having a first main surface and a second main surface facing each other in the thickness direction; a heating element disposed on the first main surface of the substrate and having a plurality of GND electrodes on the first main surface side; a plurality of heat dissipation members disposed on the second main surface of the substrate; a connecting conductor that penetrates the substrate in the thickness direction and connects the GND electrodes of the heating element and the heat dissipation members; and a signal terminal disposed on the second main surface of the substrate and connected to a signal line within the substrate, wherein the thickness direction The shape of the signal terminal as viewed from above is a substantially circular shape with equal vertical and horizontal dimensions, the multiple signal terminals are arranged at substantially equal intervals in the vertical and horizontal directions, multiple heat dissipation members are connected to one GND electrode, the number of GND electrodes to which one heat dissipation member is connected is one, the number of heat dissipation members connected to one GND electrode is substantially the same, and the shape of the heat dissipation member as viewed from the thickness direction is substantially the same as the shape of the signal terminal.

[0009] A module according to a second embodiment of the present invention comprises a substrate having a first main surface and a second main surface facing each other in the thickness direction; a heating element disposed on the first main surface of the substrate and having a plurality of GND electrodes on the first main surface side; a plurality of heat dissipation members disposed on the second main surface of the substrate; a connecting conductor that penetrates the substrate in the thickness direction and connects the GND electrodes of the heating element and the heat dissipation members; and a signal terminal disposed on the second main surface of the substrate and connected to a signal line within the substrate, wherein the shape of the signal terminal as viewed from the thickness direction is substantially circular with equal dimensions in the vertical and horizontal directions, the plurality of signal terminals are arranged at substantially equal intervals in the vertical and horizontal directions, the shape of the heat dissipation members as viewed from the thickness direction is substantially the same as the shape of the signal terminals, there is one heat dissipation member connected to one GND electrode, and when viewed from the thickness direction, the plurality of heat dissipation members are concentrated in the central part of the region overlapping with the heating element.

[0010] A module according to a third embodiment of the present invention comprises a substrate having a first main surface and a second main surface facing each other in the thickness direction; a heating element disposed on the first main surface of the substrate and having a plurality of GND electrodes on the first main surface side; a plurality of heat dissipation members disposed on the second main surface of the substrate; a connecting conductor that penetrates the substrate in the thickness direction and connects the GND electrodes of the heating element and the heat dissipation members; and a signal terminal disposed on the second main surface of the substrate and connected to a signal line within the substrate, wherein the shape of the signal terminal as viewed from the thickness direction is substantially circular with equal dimensions in the vertical and horizontal directions, the plurality of signal terminals are arranged at substantially equal intervals in the vertical and horizontal directions, the shape of the heat dissipation members as viewed from the thickness direction has a larger area than the signal terminals and is substantially similar in shape to the signal terminals, and the number of heat dissipation members connected to one GND electrode is one.

[0011] According to the present invention, it is possible to provide a module that is less prone to cracking, has excellent heat dissipation, and is less susceptible to mounting defects.

[0012] Figure 1 is a schematic cross-sectional view showing an example of a module according to the first embodiment of the present invention. Figure 2 is a cross-sectional view taken along line II-II of the module shown in Figure 1. Figure 3 is a cross-sectional view taken along line III-III of the module shown in Figure 1. Figure 4 is a schematic cross-sectional view showing another example of a module according to the first embodiment of the present invention. Figure 5 is a cross-sectional view taken along line V-V of the module shown in Figure 4. Figure 6 is a schematic cross-sectional view showing yet another example of a module according to the first embodiment of the present invention. Figure 7 is a schematic cross-sectional view showing yet another example of a module according to the first embodiment of the present invention. Figure 8 is a cross-sectional view taken along line VIII-VIII of the module shown in Figure 7. Figure 9 is a schematic cross-sectional view showing yet another example of a module according to the first embodiment of the present invention. Figure 10 is a cross-sectional view taken along line X-X of the module shown in Figure 9. Figure 11 is a schematic cross-sectional view showing yet another example of a module according to the first embodiment of the present invention. Figure 12 is a cross-sectional view taken along line XII-XII of the module shown in Figure 11. Figure 13 is a schematic cross-sectional view showing an example of a module according to the second embodiment of the present invention. Figure 14 is a cross-sectional view taken along the line XIV-XIV of the module shown in Figure 13. Figure 15 is a schematic cross-sectional view showing an example of a module according to the third embodiment of the present invention. Figure 16 is a cross-sectional view taken along the line XVI-XVI of the module shown in Figure 15.

[0013] The modules of the present invention will be described below. However, the present invention is not limited to the following configurations, and may be modified as appropriate without departing from the spirit of the invention. Furthermore, a combination of several of the preferred configurations described below also constitutes the present invention.

[0014] The following diagrams are schematic representations, and their dimensions, aspect ratios, and scales may differ from those of the actual product. The same reference numerals are used for identical or equivalent parts in the diagrams. Furthermore, identical elements are denoted by the same reference numerals in each diagram, and redundant explanations are omitted.

[0015] In this specification, terms describing relationships between elements (e.g., "opposing," "orthogonal," etc.) and terms describing the shapes of elements mean not only their literal and precise forms, but also a range that is substantially equivalent, for example, a range that includes differences of a few percent.

[0016] Each of the embodiments described below is an exemplification, and it is needless to say that partial substitution or combination of the configurations shown in different embodiments is possible. In the description of each embodiment, the description of matters common to the already described embodiments is omitted, and only the differences are described. In particular, regarding the same operational effects due to the same configurations, they are not sequentially mentioned for each embodiment.

[0017] [Module according to the First Embodiment] The module according to the first embodiment of the present invention includes a substrate having a first main surface and a second main surface facing each other in the thickness direction, a heating element disposed on the first main surface of the substrate and having a plurality of GND electrodes on the first main surface side, a plurality of heat dissipation members disposed on the second main surface of the substrate, a connection conductor that penetrates the substrate in the thickness direction and connects the GND electrode of the heating element and the heat dissipation member, and a signal terminal disposed on the second main surface of the substrate and connected to a signal line in the substrate. The module is characterized in that the shape of the signal terminal as viewed from the thickness direction is a substantially circular shape in which the longitudinal dimension and the lateral dimension are equal, the plurality of signal terminals are arranged at substantially equal intervals in the longitudinal direction and the lateral direction, a plurality of the heat dissipation members are connected to one GND electrode, the number of GND electrodes to which one heat dissipation member is connected is one, the number of heat dissipation members connected to one GND electrode is substantially the same, and both the shape and the arrangement of the heat dissipation members as viewed from the thickness direction are substantially the same as the shape and the arrangement of the signal terminals.

[0018] FIG. 1 is a cross-sectional view schematically showing an example of a module according to the first embodiment of the present invention. FIG. 2 is a cross-sectional view taken along line II-II of the module shown in FIG. 1. Further, FIG. 3 is a cross-sectional view taken along line III-III of the module shown in FIG. 1.

[0019] The module 1 shown in FIG. 1 includes a substrate 10, a heating element 20, a plurality of heat dissipation members 30, and a connection conductor 40.

[0020] (Substrate) The substrate 10 has a first main surface 10a and a second main surface 10b that face each other in the thickness direction (the direction indicated by arrow Z in FIG. 1). Further, the substrate 10 has a first side surface 10c and a second side surface 10d that face each other in the lateral direction (the direction indicated by arrow X in FIG. 1) orthogonal to the thickness direction, and a third side surface and a fourth side surface that face each other in the longitudinal direction (the direction indicated by arrow Y in FIG. 2 described later) orthogonal to the thickness direction Z and the longitudinal direction X.

[0021] The substrate 10 may be a printed circuit board (also referred to as a p-board) or may be a low-temperature co-fired ceramic (LTCC) substrate. Further, the substrate 10 may be a resin multilayer substrate in which wiring is formed on a thermoplastic resin [e.g., polyether ether ketone (PEEK), polyimide (PI), liquid crystal polymer (LCP)] with a copper foil. A low-temperature co-fired ceramic (LTCC) substrate is a substrate in which insulating layers made of a low-temperature co-fired ceramic (LTCC) material are laminated and has internal wiring (internal wiring) inside.

[0022] A low-temperature co-fired ceramic material is a ceramic material that can be fired at a temperature of 1000°C or lower and can be co-fired with Au, Ag, Cu, etc. having a small specific resistance. Specifically, as the low-temperature co-fired ceramic material, a glass composite low-temperature fired ceramic material obtained by mixing a borosilicate glass into ceramic powders such as alumina, zirconia, magnesia, and forsterite, a crystallized glass-based low-temperature fired ceramic material using a ZnO-MgO-Al ２ O ３ -SiO ２ -based crystallized glass, a BaO-Al ２ O ３ -SiO ２ -based ceramic powder, or an Al ２ O ３ -CaO-SiO ２ -MgO-B ２ O ３ -based non-glass low-temperature fired ceramic material, etc. may be mentioned.

[0023] Examples of the internal wiring include Cu, Ag, Au, etc.

[0024] (Heating element) The heating element 20 is placed on the first main surface 10a of the substrate 10. The heating element 20 has a GND electrode 21 and a signal electrode on the side of the first main surface 10a of the substrate 10.

[0025] In Figure 1, the GND electrode 21 of the heating element 20 is shown protruding from the bottom surface of the heating element 20, but this is for the sake of simplicity and the design is not limited to this configuration. Therefore, in an actual heating element, it is not necessary for the GND electrode to protrude from the bottom surface of the heating element, and the bottom surface (mounting surface) of the heating element and the GND electrode may be flush. Although not shown in Figure 1, the same applies to the signal electrode as to the GND electrode 21; the signal electrode may protrude from the end surface of the heating element, or the bottom surface (mounting surface) of the heating element and the signal electrode may be flush. In other words, the GND electrode 21 and the signal electrode may be provided protruding from the bottom surface (mounting surface) of the heating element 20 toward the first main surface 10a of the substrate 10, or they may be provided so as to be flush with the bottom surface (mounting surface) of the heating element 20. When the GND electrode 21 and the signal electrode are provided so as to protrude from the bottom surface (mounting surface) of the heating element 20 toward the first main surface 10a of the substrate 10, the bottom surface (mounting surface) of the heating element 20 and the first main surface 10a of the substrate 10 do not come into contact. However, when the GND electrode 21 and the signal electrode are provided so as to be flush with the bottom surface (mounting surface) of the heating element 20, the bottom surface (mounting surface) of the heating element 20 and the first main surface 10a of the substrate 10 come into contact.

[0026] Examples of the heat-generating element 20 include semiconductor chips (dies). Examples of dies include integrated circuits (ICs) such as PAs (Power Amplifiers) and LNAs (Low Noise Amplifiers).

[0027] The height of the heating element 20 is not particularly limited, but it is preferably 250 μm or more and 350 μm or less. The height of the heating element is usually around 250 μm or more and 350 μm or less. Electronic components with a height of less than 250 μm are easier to mount on the second main surface of the substrate, but if the height of the heating element is less than 250 μm, the heating element may be prone to warping. In addition, some heating elements have low mechanical strength for the wafer substrate, and if polishing work is performed to reduce the height of such heating elements to less than 250 μm, there is a risk of damaging the heating element. For this reason, it can be technically difficult to prepare heating elements with a height of less than 250 μm. On the other hand, the height of the heating element 20 is usually around 350 μm. For the reasons above, it is difficult to mount heating elements such as PAs on the second main surface of the substrate, and it is required to mount them on the first main surface.

[0028] (Heat dissipation member) The heat dissipation member 30 is placed on the second main surface 10b of the substrate 10.

[0029] The heat dissipation member 30 is connected to the GND electrode 21 of the heating element 20 via a connecting conductor 40, which will be described later, and is a member that dissipates the heat generated by the heating element 20 from the second main surface 10b side of the substrate 10.

[0030] Examples of materials that make up the heat dissipation member 30 include Cu, Ag, Al, Au, etc.

[0031] (Connecting conductor) The connecting conductor 40 is positioned within the substrate 10 so as to penetrate the substrate 10 in the thickness direction Z. The connecting conductor 40 connects the GND electrode 21 of the heating element 20, which is positioned on the first main surface 10a of the substrate 10, to the heat dissipation member 30, which is positioned on the second main surface 10b of the substrate 10.

[0032] Examples of materials that make up the connecting conductor 40 include Cu, Ag, Al, and Au. The connecting conductor 40 may be, for example, a via conductor placed in the substrate 10 and stacked in the thickness direction Z. Alternatively, the connecting conductor 40 may be a metal block or the like that fills a hole that penetrates the substrate 10 in the thickness direction Z.

[0033] (Signal terminals) Multiple signal terminals 50 may be provided on the second main surface 10b of the circuit board 10. The signal terminals 50 are terminals connected to the signal lines within the circuit board 10. In the cross-section shown in Figure 1, the signal lines and signal terminals 50 are not shown connected, but the signal lines and signal terminals 50 are connected by routing the signal lines in parts not shown.

[0034] The shape of the signal terminal 50 as viewed from the thickness direction Z is preferably isotropic, with equal dimensions in the vertical direction Y and the horizontal direction X. Examples of isotropic shapes include a circular shape or a square shape. A square is preferably a square with rounded corners (R).

[0035] Figure 2 is a cross-sectional view of the module shown in Figure 1, taken along line II-II. Figure 2 shows the side of the substrate 10 of the heating element 20 facing the first main surface 10a. As shown in Figure 2, the heating element 20 has a plurality of GND electrodes 21 (21a, 21b, 21c, 21d) and a plurality of signal electrodes 22 on the first main surface 10a side of the substrate 10.

[0036] The GND electrode 21 is connected to the heat dissipation member 30 by a connecting conductor 40. The signal electrode 22 is connected to a signal line, which is an internal wiring within the substrate 10.

[0037] Figure 3 is a cross-sectional view of the module shown in Figure 1, taken along line III-III. As shown in Figure 3, a plurality of heat dissipation members 30 (30a, 30b, 30c, 30d) and a plurality of signal terminals 50 are arranged on the second main surface 10b of the substrate 10. The heat dissipation members 30a, 30b, 30c, and 30d are shown with the same hatching, and there are five of each type of heat dissipation member 30a, 30b, 30c, and 30d.

[0038] Each heat dissipation member 30 is connected to a connecting conductor 40 exposed on the second main surface 10b of the substrate 10, but the connecting conductor 40 and the heat dissipation member 30 overlap in the thickness direction Z. Therefore, when module 1 is viewed from the second main surface 10b side of the substrate 10, the connecting conductor 40 cannot be seen.

[0039] The shape of the heat dissipation member 30 as viewed from the thickness direction Z is approximately circular, with the vertical dimension Y being equal to the horizontal dimension X. The shape of the heat dissipation member 30 as viewed from the thickness direction Z is the same in all cases.

[0040] Multiple heat dissipation members 30 are arranged at predetermined intervals in the vertical direction Y and the horizontal direction X. The interval d between the heat dissipation members 30 in the horizontal direction X is １ This is the distance d between the heat dissipation members 30 in the vertical direction Y. ２ It is equal to. Multiple heat dissipation members 30 are arranged at approximately equal intervals in the vertical direction Y and the horizontal direction X.

[0041] The shape of the signal terminal 50 as viewed from the thickness direction Z is approximately circular, with equal dimensions in the vertical direction Y and the horizontal direction X. The shape of the signal terminal 50 as viewed from the thickness direction Z is the same in all cases.

[0042] Multiple signal terminals 50 are arranged at predetermined intervals in the vertical direction Y and the horizontal direction X. The interval d between signal terminals 50 in the horizontal direction X is Ｘ This is the center line A connecting the centers of the signal terminals 50 arranged in the vertical direction Y. Ｙ This is the distance between them in the horizontal direction X. d is the distance between signal terminals 50 in the vertical direction Y. Ｙ This is the center line A connecting the centers of the signal terminals 50 arranged in the horizontal direction X. Ｘ The distance between them in the vertical direction Y, and the distance d between the signal terminals 50 in the horizontal direction X. Ｘ It is equal to.

[0043] As shown in Figure 3, the distance d between the heat dissipation members 30 in the lateral direction X １ This is the distance d between the signal terminals 50 in the lateral direction X. Ｘ It is the same as above. Also, the distance d between the heat dissipation members 30 in the vertical direction Y. ２ This is the distance d between the signal terminals 50 in the vertical direction Y. Ｙ It is the same as this.

[0044] From the above, it can be said that the shape and arrangement of the heat dissipation member 30 when viewed from the thickness direction are the same as the shape and arrangement of the signal terminals 50. In the module 1 shown in Figure 3, the shape of the signal terminals 50 is approximately circular, so the shape of the heat dissipation member 30 is also approximately circular. However, if the shape of the signal terminals 50 is square, the shape of the heat dissipation member 30 should also be square.

[0045] Although not shown in Figures 2 and 3, the five heat dissipation members 30a are connected to the GND electrode 21a of the heating element 20. The five heat dissipation members 30b are connected to the GND electrode 21b of the heating element 20. The five heat dissipation members 30c are connected to the GND electrode 21c of the heating element 20. The five heat dissipation members 30d are connected to the GND electrode 21d of the heating element 20.

[0046] Furthermore, the heat dissipation member 30a is not connected to any GND electrode 21 other than GND electrode 21a. Also, the heat dissipation member 30b is not connected to any GND electrode 21 other than GND electrode 21b. The heat dissipation member 30c is not connected to any GND electrode 21 other than GND electrode 21c. The heat dissipation member 30d is not connected to any GND electrode 21 other than GND electrode 21d.

[0047] Therefore, multiple heat dissipation members 30 are connected to one GND electrode 21, and each heat dissipation member 30 is connected to one GND electrode, meaning that the number of heat dissipation members connected to each GND electrode is the same (in this case, all are five). Note that the assumption that the number of heat dissipation members connected to each GND electrode is the same is based on the premise that the amount of heat generated by each GND electrode is approximately the same. If the amount of heat generated by each GND electrode is approximately the same, then having approximately the same number of heat dissipation members connected to each GND electrode results in approximately uniform temperatures for each heat dissipation member, thereby suppressing the generation of thermal stress due to the temperature distribution of the heat dissipation members.

[0048] By configuring the components as described above, it becomes unnecessary to dissipate heat from multiple GND electrodes 21 together using a single heat dissipation component (such as a metal block), thus reducing the contact area between the substrate and the heat dissipation component. This suppresses the occurrence of cracks due to thermal expansion of the heat dissipation component. Furthermore, because the contact area between the heat dissipation component and the substrate is reduced, mounting defects due to insufficient solder around the heat dissipation component can be suppressed. In addition, since the shape of the heat dissipation component is isotropic, problems such as thermal stress concentration at specific points on the heat dissipation component do not occur. Moreover, if the arrangement and shape of the heat dissipation component when viewed from the thickness direction are approximately the same as the shape and arrangement of the signal terminals, there is no need to distinguish between the heat dissipation component and the signal terminals during manufacturing, allowing the heat dissipation component and signal terminals to be manufactured simultaneously, simplifying the manufacturing process.

[0049] In this specification, "the number of heat dissipation members connected to one GND electrode is approximately the same" means that the number of heat dissipation members connected to one GND electrode is within the range of -1 or more and +1 or less of the reference value obtained by rounding the average value. For example, if a heating element has four GND electrodes and the number of heat dissipation members connected to each GND electrode is 4, 5, 5, and 6, the average value and the reference value are 5, and the number of heat dissipation members connected to one GND electrode is between 4 (reference value minus 1) and 6 (reference value plus 1), so it can be said that the number of heat dissipation members connected to one GND electrode is approximately the same.

[0050] In the module according to the first embodiment of the present invention, the fact that the number of heat dissipation members connected to a single GND electrode is approximately the same is based on the premise that the amount of heat generated by each GND electrode of the heating element is approximately the same. If the amount of heat generated by each GND electrode is approximately the same, then by having approximately the same number of heat dissipation members connected to a single GND electrode, the temperature of each heat dissipation member is made uniform, thereby suppressing the occurrence of thermal stress due to the temperature distribution of the heat dissipation members. On the other hand, if there is a difference in the amount of heat generated by each GND electrode, for example, if the temperature of the GND electrode differs for each GND electrode when the heating element is operating, and the difference is 10°C or more, then by setting the number of heat dissipation members connected to the GND electrode with a relatively higher temperature to be more than the reference value (reference value + 1), and setting the number of heat dissipation members connected to the GND electrode with a relatively lower temperature to be less than the reference value (reference value - 1), the difference in the amount of heat generated by the GND electrodes can be absorbed and the temperature of each heat dissipation member can be made uniform.

[0051] Note that the spacing between signal terminals in the vertical and / or horizontal directions does not have to be the same in all cases. For example, when viewing the substrate from the thickness direction Z, there may be two or more regions where the spacing between signal terminals in the vertical direction Y and / or horizontal direction X is different. In this case, the spacing between signal terminals in the region adjacent to the region overlapping with the heat-generating element (i.e., the region close to the heat-dissipating member) shall be compared with the spacing of the heat-dissipating member.

[0052] Furthermore, some signal terminals may differ in size and / or shape from other signal terminals. For example, there may be a signal terminal that occupies the area of ​​two normal signal terminals. However, such signal terminals that differ in size and / or shape from other signal terminals are not taken into consideration when determining the spacing between signal terminals as described above.

[0053] All heat dissipation members connected to the same heat-generating element are collectively referred to as a heat dissipation member group. For example, the total of 20 heat dissipation members, including five heat dissipation members 30a, five heat dissipation members 30b, five heat dissipation members 30c, and five heat dissipation members 30d, connected to the same heat-generating element 20, are collectively referred to as a heat dissipation member group 130.

[0054] When viewed from the thickness direction Z, it is preferable that all the heat dissipation members 30 constituting the corresponding heat dissipation member group 130 are arranged inside the region where the heat-generating element 20 is located. In Figure 3, the region where the heat-generating element 20 is located is shown enclosed by a dotted line.

[0055] In module 1 shown in Figure 3, heat dissipation members 30 of the same shape are arranged in four rows horizontally (X) and five columns vertically (Y) at equal intervals to form a group of heat dissipation members 130. Therefore, it can be said that the multiple heat dissipation members 30 are arranged symmetrically in the horizontal X and vertical Y directions. Accordingly, the multiple heat dissipation members 30 have lines of symmetry that are symmetrical in the horizontal X and vertical Y directions, and also have centers of symmetry that are rotationally symmetrical.

[0056] The line of symmetry in the vertical direction Y coincides with the line of symmetry in the vertical direction Y based on the external shape of the heating element 20 as viewed from the thickness direction Z. Similarly, the line of symmetry in the horizontal direction X coincides with the line of symmetry in the horizontal direction X based on the external shape of the heating element 20 as viewed from the thickness direction Z. Furthermore, the center of symmetry coincides with the center of symmetry based on the external shape of the heating element 20 as viewed from the thickness direction Z.

[0057] If the heat dissipation members 30 constituting the heat dissipation member group 130 are arranged symmetrically along a line and / or point, the symmetry of the temperature distribution during heat dissipation by the heat dissipation members 30 is enhanced, making it easier for thermal stresses to cancel each other out and reducing the likelihood of cracks. Furthermore, the fact that the symmetry line and / or points of the heat dissipation member group 130 substantially coincide with the symmetry line and / or points of the heat dissipation element 20 based on its external shape can be rephrased as the symmetry lines and / or points of the 20 heat dissipation members 30 constituting the heat dissipation member group 130 substantially coincide with the symmetry line and / or points of the heat dissipation element 20 based on its external shape.

[0058] The position on the first main surface 10a of the substrate 10 where the heating element 20 is placed is not particularly limited, but if the shape of the heating element 20 as viewed from the thickness direction Z is rectangular, it is preferable that the side of the heating element 20 placed closest to the side surface of the substrate 10 be the long side. In the case of a rectangular heating element 20, thermal stress tends to occur more easily on the short side than on the long side. Therefore, by placing the long side, which is less prone to thermal stress, at the position closest to the side surface of the substrate 10, thermal stress is less likely to concentrate at the position where the side of the heating element 20 is closest to the side surface of the substrate 10, and the occurrence of cracks can be suppressed.

[0059] (Other electronic components) Electronic components other than heating elements may be placed on the first and second main surfaces of the substrate.

[0060] In the module 1 shown in Figure 1, electronic components 60, 61, and 62 are arranged on the first main surface 10a of the substrate 10. Electronic component 63 is also arranged on the second main surface 10b of the substrate 10. These electronic components include semiconductor chips (dies), passive components such as capacitors and coils, and filters.

[0061] (Resin layer) The heating element 20, which is placed on the first main surface 10a of the substrate 10, may be sealed with a sealing resin 71. The sealing resin 71 may cover the entire first main surface 10a of the substrate 10, forming a resin layer 70. The second main surface 10b of the substrate 10 may also be sealed with a sealing resin 81. The sealing resin 81 may cover the entire second main surface 10b of the substrate 10, forming a resin layer 80.

[0062] The sealing resin 71 covering the first main surface 10a of the substrate 10 is also referred to as the first sealing resin, in distinction from the sealing resin 81 covering the second main surface 10b. The resin layer 70 formed by the first sealing resin 71 is also referred to as the first resin layer 70. Similarly, the sealing resin 81 covering the second main surface 10b of the substrate 10 is also referred to as the second sealing resin, in distinction from the first sealing resin 71, and the resin layer 80 formed by the second sealing resin 81 is also referred to as the second resin layer 80.

[0063] When the second resin layer 80 is formed, it is preferable that the lengths of the heat dissipation member 30 and the signal terminal 50 in the thickness direction Z are equal to the lengths of the second resin layer 80 in the thickness direction Z. In this case, the heat dissipation member 30 and the signal terminal 50 will be exposed on the bottom surface of the second resin layer 80 (the surface opposite to the substrate 10). At this time, the bottom surface of the second resin layer 80 constitutes the bottom surface 1b of the module 1. The bottom surface 1b of the module 1 is also the mounting surface of the module 1.

[0064] A shielding film 90 may be formed on the surface (top and side) of the resin layer 70. If a shielding film 90 is formed on the top surface of the resin layer 70, a through conductor may be provided in the resin layer 70 that penetrates the resin layer 70 in the thickness direction Z and connects the first main surface 10a of the substrate 10 and the shielding film 90.

[0065] A shielding film 90 may also be formed on the sides of the substrate 10. In the module 1 shown in Figure 1, the shielding film 90 is formed to cover the first side surface 10c and the second side surface 10d of the substrate. Although not shown, a shielding film 90 is also formed on the third and fourth side surfaces of the substrate.

[0066] A GND electrode 48 is exposed on the first side surface 10c and the second side surface 10d of the substrate 10, and this GND electrode 48 may be connected to the shielding film 90.

[0067] In the module according to the first embodiment of the present invention, it is preferable that, when the substrate is viewed from the thickness direction, signal terminals are not provided in the second main surface of the substrate at a location adjacent to the region overlapping with the heating element.

[0068] An example of such a module will be explained with reference to Figures 4 and 5.

[0069] Figure 4 is a schematic cross-sectional view showing another example of a module according to the first embodiment of the present invention. Figure 5 is a cross-sectional view of the module shown in Figure 4 along the line V-V. However, the shielding film is omitted in Figure 5.

[0070] Module 2, shown in Figures 4 and 5, has the same configuration as Module 1, shown in Figures 1 to 3, except that the arrangement of the signal terminals 50 is slightly different.

[0071] As shown in Figures 4 and 5, in module 2, the signal terminal 50 is not provided in a location adjacent to the area of ​​the second main surface 10b of the substrate 10 that overlaps with the heating element 20.

[0072] If the signal terminals 50 are placed on the second main surface 10b of the substrate 10 without considering the area overlapping with the heat-generating element 20, then, as shown in module 1 in Figure 3, signal terminals 50 will also be placed in positions adjacent to the area overlapping with the heat-generating element 20. When such an arrangement is adopted, the signal terminals 50 in positions adjacent to the area overlapping with the heat-generating element 20 are close to the heat-dissipating member 30, and are therefore more susceptible to the effects of heat from the heat-dissipating member 30 compared to signal terminals 50 in positions not adjacent to the area overlapping with the heat-generating element 20. Such an arrangement can also be described as having a gap of at least one pitch of signal terminals between the heat-dissipating member and the signal terminals. A state in which a gap of at least one pitch of signal terminals is provided can also be described as a state in which the distance (center-to-center distance) in the vertical Y and horizontal X directions between the signal terminal placed closest to the heat-dissipating member and the heat-dissipating member closest to that signal terminal is at least twice the distance between the signal terminals in the vertical Y and horizontal X directions. In this regard, as shown in Figure 5, by not providing the signal terminal 50 in a position adjacent to the area overlapping with the heat-generating element 20, it is possible to prevent the signal terminal 50 from getting too close to the heat dissipation member 30 and suppress the thermal influence on the signal terminal 50.

[0073] In the module according to the first embodiment of the present invention, when the substrate is viewed from the thickness direction, it is preferable that one or more GND terminals connected to GND wiring within the substrate are provided on the second main surface of the substrate at a position adjacent to the region overlapping with the heating element.

[0074] An example of such a module will be described with reference to Figure 6. Figure 6 is a schematic cross-sectional view showing yet another example of a module according to the first embodiment of the present invention.

[0075] Module 3, shown in Figure 6, has the same configuration as module 2, shown in Figure 5, except that the GND terminal is located adjacent to the region overlapping with the heating element.

[0076] In module 3, no signal terminals 50 are provided on the second main surface 10b of the substrate 10 in a location adjacent to the area overlapping the heat-generating element 20. A GND terminal 55 is provided in a location adjacent to the area overlapping the heat-generating element 20. The GND terminal 55 is a terminal that is connected to the GND wiring in the substrate 10. Since the GND terminal 55 is less affected by heat than the signal terminals 50, problems are less likely to occur even if it is placed in a location adjacent to the area overlapping the heat-generating element 20. In addition, the heat from the heat dissipation member 30 is used to raise the temperature of the GND terminal 55 located in a location adjacent to the area overlapping the heat-generating element 20, so the temperature rise to the signal terminals 50 (surrounding signal terminals 50) located in a location not adjacent to the area overlapping the heat-generating element 20 can be suppressed.

[0077] The GND terminal 55 is a terminal connected to the GND wiring within the substrate 10, and in principle, is not connected to the GND electrode 21 of the heating element 20. Similarly, the heat dissipation member 30 is a member connected to the GND electrode 21 of the heating element 20 via the connecting conductor 40 within the substrate 10, and in principle, is not connected to the GND wiring within the substrate 10. However, the second main surface 10b of the substrate 10 may have a terminal (member) that is connected to the GND terminal within the substrate 10 and also connected to the GND electrode 21 of the heating element 20. Such a terminal (member) is also called a GND heat dissipation member, and is different from both the normal GND terminal 55 and the normal heat dissipation member 30.

[0078] The module of the present invention may have a GND heat dissipation member. The GND heat dissipation member is included in the heat dissipation member. Therefore, the shape of the GND heat dissipation member when viewed from the thickness direction is substantially the same as the shape of the signal terminal, and the number of GND heat dissipation members is also taken into consideration when counting the number of heat dissipation members connected to the GND electrode. It is preferable that the GND heat dissipation member be provided at a position adjacent to the region overlapping with the heat generating element.

[0079] In the module according to the first embodiment of the present invention, the GND terminal 55 may be provided in a position not adjacent to the area overlapping with the heating element. For example, modules 1 shown in Figure 3 and module 2 shown in Figure 5, in which a part of the signal terminal 50 is replaced with a GND terminal 55, are also modules according to the first embodiment of the present invention.

[0080] In the module according to the first embodiment of the present invention, the arrangement of the heat dissipation members and the arrangement of the signal terminals, when viewed from the thickness direction, do not necessarily have to coincide.

[0081] Examples of such modules will be described with reference to Figures 7 and 8. Figure 7 is a schematic cross-sectional view showing yet another example of a module according to the first embodiment of the present invention. Figure 8 is a cross-sectional view of module 4 shown in Figure 7, taken along line VIII-VIII.

[0082] Module 4, shown in Figures 7 and 8, has the same configuration as module 3, shown in Figure 6, except that the arrangement of the heat dissipation members has been changed.

[0083] Module 4 is provided with a total of 28 heat dissipation members 31. The 28 heat dissipation members 31 are collectively referred to as the heat dissipation member group 131.

[0084] The heat dissipation members 31 constituting the heat dissipation member group 131 consist of seven heat dissipation members 31a connected to the GND electrode 21a of the heating element 20, seven heat dissipation members 31b connected to the GND electrode 21b of the heating element 20, seven heat dissipation members 31c connected to the GND electrode 21c of the heating element 20, and seven heat dissipation members 31d connected to the GND electrode 21d of the heating element 20. The GND electrodes 21a, GND electrodes 21b, GND electrodes 21c, and GND electrodes 21d can be the same as those shown in Figure 2. The same applies to subsequent drawings.

[0085] The number of heat dissipation members 31 connected to each GND electrode 21 is seven, and they are all the same.

[0086] The spacing between the multiple heat dissipation members 31 is different from the spacing between the signal terminals 50. Specifically, the spacing d in the lateral direction X of the heat dissipation members 31 is different. ３ The distance d between the signal terminals 50 in the lateral direction X is Ｘ It is smaller than the spacing d in the vertical direction Y of the heat dissipation member 31. ４ The interval d of the signal terminals 50 in the vertical direction Y is ＹIt is the same as above. Since the multiple heat dissipation members 31 are arranged at equal intervals in the horizontal direction X and the vertical direction Y, the multiple heat dissipation members 31 have lines of symmetry that are symmetric with respect to the horizontal direction X and the vertical direction Y, and also have a center of symmetry that is rotationally symmetric.

[0087] The line of symmetry in the vertical direction Y coincides with the line of symmetry in the vertical direction Y based on the external shape of the heating element 20 as viewed from the thickness direction Z. Similarly, the line of symmetry in the horizontal direction X coincides with the line of symmetry in the horizontal direction X based on the external shape of the heating element 20 as viewed from the thickness direction Z. Furthermore, the center of symmetry coincides with the center of symmetry based on the external shape of the heating element 20 as viewed from the thickness direction Z.

[0088] In the module according to the first embodiment of the present invention, when viewed from the thickness direction, a plurality of heat dissipation members may be concentrated in the central part of the region that overlaps with the heat generating element.

[0089] An example of such a module will be described with reference to Figures 9 and 10. Figure 9 is a schematic cross-sectional view showing yet another example of a module according to the first embodiment of the present invention. Figure 10 is a cross-sectional view of the module shown in Figure 9 taken along the line X-X.

[0090] Module 5, shown in Figures 9 and 10, has the same configuration as Module 4, shown in Figures 7 and 8, except that the arrangement of the heat dissipation members has been changed.

[0091] Module 5 is provided with a total of 35 heat dissipation members 32. The 35 heat dissipation members 32 are collectively referred to as the heat dissipation member group 132. The heat dissipation members 32 that make up the heat dissipation member group 132 consist of eight heat dissipation members 32a connected to the GND electrode 21a of the heating element 20, nine heat dissipation members 32b connected to the GND electrode 21b of the heating element 20, ten heat dissipation members 32c connected to the GND electrode 21c of the heating element 20, and eight heat dissipation members 32d connected to the GND electrode 21d of the heating element 20.

[0092] The number of heat dissipation members 32 connected to one GND electrode 21 is 8, 9, 9, and 10, so the reference value is 9, which is the average value of 8.75 rounded up. The number of heat dissipation members 32 connected to one GND electrode 21 is between 8 (reference value (9) minus 1) and 10 (reference value (9) plus 1), so the number of heat dissipation members 32 connected to one GND electrode 21 is approximately the same.

[0093] The spacing between the multiple heat dissipation members 32 differs between the region overlapping the outer edge of the heat-generating element 20 and the other regions when viewed from the thickness direction. The region other than the region overlapping the outer edge is also called the central region.

[0094] The heat dissipation member 32, which is positioned in a region overlapping the outer edge of the heating element 20, has a spacing d in the lateral direction X. ５ They are arranged at this interval d. ５ The distance d between the signal terminals 50 in the lateral direction X is Ｘ It is smaller than that. On the other hand, the heat dissipation member 32, which is positioned in the region overlapping the outer edge of the heat generating element 20, has a spacing d in the vertical direction Y. ６ They are arranged at this interval d. ６ The interval d of the signal terminals 50 in the vertical direction Y is Ｙ It is the same as above. The heat dissipation member 32, which is located in the central part of the heat generating element 20, except for the area that overlaps with the outer edge of the heat generating element 20, is spaced d in the vertical direction Y. ６ , with a spacing d in the horizontal direction X ５ Between the heat dissipation members, which are arranged at equal intervals, there is a gap d in the lateral direction X. ６ Half of that, with a vertical Y-axis spacing d ５ The heat dissipation members are arranged in a staggered pattern, shifted by half a portion of the original heat source. Therefore, it can be said that the heat dissipation members 31 are concentrated in the area that overlaps with the central part of the heat generating element 20.

[0095] The region overlapping the outer edge of the heating element 20 is the region where the signal terminals are located furthest out when multiple heat dissipation members 32 are arranged in the same configuration as the signal terminals 50 within the region overlapping the heating element 20. Similarly, the region overlapping the central part of the heating element 20 is the region where the signal terminals that are not located furthest out are located when multiple heat dissipation members 32 are arranged in the same configuration as the signal terminals within the region overlapping the heating element 20.

[0096] In module 5 shown in Figure 10, a total of 35 heat dissipation members 32 have a line of symmetry in the vertical direction Y, a line of symmetry in the horizontal direction X, and a center of symmetry that is rotationally symmetric. The line of symmetry in the vertical direction Y coincides with the line of symmetry in the vertical direction Y based on the external shape of the heat-generating element 20 when viewed from the thickness direction Z. Similarly, the line of symmetry in the horizontal direction X coincides with the line of symmetry in the horizontal direction X based on the external shape of the heat-generating element 20 when viewed from the thickness direction Z. Furthermore, the center of symmetry coincides with the center of symmetry based on the external shape of the heat-generating element 20 when viewed from the thickness direction Z.

[0097] In the module according to the first embodiment of the present invention, the shape of the heat dissipation member may differ between the region overlapping the outer edge of the heating element and the region overlapping the central part. For example, the heat dissipation member may have a first heat dissipation member arranged in the region overlapping the outer edge of the heating element and a second heat dissipation member arranged in the other region (the region overlapping the central part of the heating element).

[0098] In this case, the shape of the first heat dissipation member or the shape of the second heat dissipation member may be substantially the same as the shape of the signal terminal. For example, the shape and arrangement of the first heat dissipation member may be substantially the same as the shape and arrangement of the signal terminal, and the shape of the second heat dissipation member may be larger in area than the signal terminal and substantially similar in shape to the signal terminal.

[0099] Examples of such modules will be described with reference to Figures 11 and 12. Figure 11 is a schematic cross-sectional view showing yet another example of a module according to the first embodiment of the present invention. Figure 12 is a cross-sectional view of the module shown in Figure 11 taken along line XII-XII.

[0100] Module 6, shown in Figures 11 and 12, has the same configuration as module 5, shown in Figures 9 and 10, except that the arrangement of the heat dissipation members has been changed.

[0101] In the module 6 shown in Figures 11 and 12, a total of 19 heat dissipation members 33 are provided. The multiple heat dissipation members 33 include 14 first heat dissipation members 33a, 33b, 33c, and 33d, which are positioned in the region overlapping the outer edge of the heat generating element 20, and 5 second heat dissipation members 133a, 133b, which are positioned in the region overlapping the central part of the heat generating element 20. １ , 133b ２ It consists of 133c and 133d. The shape and arrangement of the first heat dissipation members 33a, 33b, 33c, and 33d are the same as the shape and arrangement of the signal terminals 50.

[0102] The second heat dissipation member consists of four heat dissipation members 133a and 133b, which have a larger area than the signal terminal 50 and are roughly similar in shape to the signal terminal 50 (circular in this case). １ , 133c, 133d and one heat dissipation member 133b having the same shape as the signal terminal 50 ２ It consists of.

[0103] In Figures 11 and 12, the second heat dissipation members are heat dissipation members 133a and 133b, which have a larger area than the signal terminals and a shape substantially similar to that of the signal terminals. １ , 133c, 133d, and heat dissipation member 133b which has the same shape as the signal terminal. ２ The example shows both arrangements, but the second heat dissipation member may consist only of a heat dissipation member that has a larger area than the signal terminal and a shape substantially similar to that of the signal terminal.

[0104] [Module according to the second embodiment] The module according to the second embodiment of the present invention comprises a substrate having a first main surface and a second main surface facing each other in the thickness direction, a heating element disposed on the first main surface of the substrate and having a plurality of GND electrodes on the first main surface side, a plurality of heat dissipation members disposed on the second main surface of the substrate, a connecting conductor that penetrates the substrate in the thickness direction and connects the GND electrodes of the heating element and the heat dissipation members, and a signal terminal disposed on the second main surface of the substrate and connected to a signal line in the substrate, wherein the shape of the signal terminal as viewed from the thickness direction is substantially circular with equal dimensions in the vertical and horizontal directions, the plurality of signal terminals are arranged at substantially equal intervals in the vertical and horizontal directions, the shape of the heat dissipation members as viewed from the thickness direction is substantially the same as the shape of the signal terminals, there is one heat dissipation member connected to one GND electrode, and when viewed from the thickness direction, the plurality of heat dissipation members are concentrated in the central part of the region overlapping with the heating element.

[0105] Figure 13 is a schematic cross-sectional view showing an example of a module according to a second embodiment of the present invention. Figure 14 is a cross-sectional view of the module shown in Figure 13 along the line XIV-XIV. The module 7 shown in Figures 13 and 14 has the same configuration as the module 2 shown in Figures 4 and 5, except that the arrangement of the heat dissipation members is different.

[0106] In module 7, a plurality of heat dissipation members 34 (34a, 34b, 34c, 34d) are provided on the second main surface 10b of the substrate 10. When viewed from the thickness direction Z, the shapes of the heat dissipation members 34a, 34b, 34c, and 34d are the same as the shape of the signal terminal 50, that is, they are approximately circular in shape with the vertical Y dimension and the horizontal X dimension being equal.

[0107] As shown in Figure 13, the heat dissipation member 34a is connected to the GND electrode 21a of the heating element 20. The heat dissipation member 34b is connected to the GND electrode 21b of the heating element 20. Although not shown in Figures 13 and 14, the heat dissipation member 34c is connected to the GND electrode 21c of the heating element 20, and the heat dissipation member 34d is connected to the GND electrode 21d of the heating element 20. Therefore, there is one heat dissipation member 34 connected to each GND electrode 21.

[0108] Furthermore, as shown in Figure 14, the four heat dissipation members 34a, 34b, 34c, and 34d are concentrated in the central part of the region that overlaps with the heat generating element 20.

[0109] If the heat dissipation member 34 is concentrated in the central part of the area that overlaps with the heat-generating element 20, the surrounding signal terminals will be less affected by the heat from the heat dissipation member 34.

[0110] The distinction between the outer edge and the central part of the region overlapping with the heating element 20 is the same as in the case of the module according to the first embodiment.

[0111] The four heat dissipation members 34a, 34b, 34c, and 34d have the same shape. Furthermore, among the four heat dissipation members 34a, 34b, 34c, and 34d, the distance between heat dissipation members 34a and 34b in the lateral direction X is equal, as is the distance between heat dissipation members 34c and 34d. Also, the distance between heat dissipation members 34a and 34c, and between heat dissipation members 34b and 34d in the vertical direction Y is equal. Therefore, the multiple heat dissipation members 34 have lines of symmetry that are symmetrical with respect to the lateral direction X and the vertical direction Y, and also have centers of symmetry that are rotationally symmetrical.

[0112] The line of symmetry in the vertical direction Y coincides with the line of symmetry in the vertical direction Y based on the external shape of the heating element 20 as viewed from the thickness direction Z. Similarly, the line of symmetry in the horizontal direction X coincides with the line of symmetry in the horizontal direction X based on the external shape of the heating element 20 as viewed from the thickness direction Z. Furthermore, the center of symmetry coincides with the center of symmetry based on the external shape of the heating element 20 as viewed from the thickness direction Z.

[0113] By configuring the system as described above, it becomes unnecessary to dissipate heat from multiple GND electrodes 21 together using a single heat dissipation component (such as a metal block), thus reducing the contact area between the substrate and the heat dissipation component. This suppresses the occurrence of cracks due to thermal expansion of the heat dissipation component. Furthermore, because the contact area between the heat dissipation component and the substrate is reduced, mounting defects caused by insufficient solder around the heat dissipation component can be suppressed. In addition, since the shape of the heat dissipation component is isotropic, problems such as thermal stress concentration at specific points on the heat dissipation component do not occur.

[0114] [Module according to the third embodiment] The module according to the third embodiment of the present invention comprises a substrate having a first main surface and a second main surface facing each other in the thickness direction; a heating element disposed on the first main surface of the substrate and having a plurality of GND electrodes on the first main surface side; a plurality of heat dissipation members disposed on the second main surface of the substrate; a connecting conductor that penetrates the substrate in the thickness direction and connects the GND electrodes of the heating element and the heat dissipation members; and a signal terminal disposed on the second main surface of the substrate and connected to a signal line in the substrate, wherein the shape of the signal terminal as viewed from the thickness direction is substantially circular with equal dimensions in the vertical and horizontal directions, the plurality of signal terminals are arranged at substantially equal intervals in the vertical and horizontal directions, the shape of the heat dissipation members as viewed from the thickness direction has a larger area than the signal terminals and is substantially similar in shape to the signal terminals, and the number of heat dissipation members connected to one GND electrode is one.

[0115] Figure 15 is a schematic cross-sectional view showing an example of a module according to the third embodiment of the present invention. Figure 16 is a cross-sectional view taken along line XVI-XVI of the module shown in Figure 15. The module 8 shown in Figures 15 and 16 has the same configuration as the module 3 shown in Figure 6, except that the shape and arrangement of the heat dissipation members are different.

[0116] In module 8, a plurality of heat dissipation members 35 (35a, 35b, 35c, 35d) are provided on the second main surface 10b of the substrate 10. The shapes of the heat dissipation members 35a, 35b, 35c, and 35d, as viewed from the thickness direction Z, are similar in shape to the signal terminal 50 (approximately circular), but the area of ​​the heat dissipation members 35 is larger than the area of ​​the signal terminal 50.

[0117] As shown in Figure 15, the heat dissipation member 35a is connected to the GND electrode 21a of the heating element 20. The heat dissipation member 35b is connected to the GND electrode 21b of the heating element 20. Although not shown in Figures 15 and 16, the heat dissipation member 35c is connected to the GND electrode 21c of the heating element 20, and the heat dissipation member 35d is connected to the GND electrode 21d of the heating element 20. Therefore, there is one heat dissipation member 35 connected to each GND electrode 21.

[0118] By configuring the system as described above, it becomes unnecessary to dissipate heat from multiple GND electrodes 21 together using a single heat dissipation component (such as a metal block), thus reducing the contact area between the substrate and the heat dissipation component. This suppresses the occurrence of cracks due to thermal expansion of the heat dissipation component. Furthermore, because the contact area between the heat dissipation component and the substrate is reduced, mounting defects caused by insufficient solder around the heat dissipation component can be suppressed. In addition, since the shape of the heat dissipation component is isotropic, problems such as thermal stress concentration at specific points on the heat dissipation component do not occur.

[0119] 1, 2, 3, 4, 5, 6, 7, 8 Module 10 Substrate 10a First main surface of the substrate 10b Second main surface of the substrate 10c First side surface of the substrate 10d Second side surface of the substrate 20 Heating element 21 GND electrode 22 Signal electrode 30, 30a, 30b, 30c, 30d, 31, 31a, 31b, 31c, 31d, 32, 32a, 32b, 32c, 32d, 33, 34, 34a, 34b, 34c, 34d, 35, 35a, 35b, 35c, 35d Heat dissipation member 33a, 33b, 33c, 33d First heat dissipation member 133a, 133b １ , 133b ２,133c,133d Second heat dissipation member 40 Connecting conductor 48 GND wiring 50 Signal terminal 55 GND terminal 60,61,62,63 Electronic component 70 Resin layer (first resin layer) 71 Sealing resin (first sealing resin) 80 Resin layer (second resin layer) 81 Sealing resin (second sealing resin) 90 Shielding film 130,131,132 Heat dissipation member group A Ｙ Centerline A: A line connecting the centers of signal terminals arranged vertically. Ｘ The center line d connects the centers of the signal terminals arranged horizontally. １ d ３ d ５ The distance between heat dissipation members in the lateral direction d ２ d ４ d ６ The distance between heat dissipation members in the vertical direction d Ｘ The distance between signal terminals in the lateral direction d Ｙ The spacing between signal terminals in the vertical direction

Claims

1. A module comprising: a substrate having a first main surface and a second main surface facing each other in the thickness direction; a heating element disposed on the first main surface of the substrate and having a plurality of GND electrodes on the first main surface side; a plurality of heat dissipation members disposed on the second main surface of the substrate; a connecting conductor that penetrates the substrate in the thickness direction and connects the GND electrodes of the heating element and the heat dissipation members; and a signal terminal disposed on the second main surface of the substrate and connected to a signal line within the substrate, wherein the shape of the signal terminal as viewed from the thickness direction is a substantially circular shape with equal dimensions in the vertical and horizontal directions; the plurality of signal terminals are arranged at substantially equal intervals in the vertical and horizontal directions, a plurality of heat dissipation members are connected to one GND electrode, and the number of GND electrodes to which one heat dissipation member is connected is one; and the number of heat dissipation members connected to one GND electrode is substantially the same. A module characterized in that the shape of the heat dissipation member when viewed from the thickness direction is substantially the same as the shape of the signal terminal.

2. A module comprising: a substrate having a first main surface and a second main surface facing each other in the thickness direction; a heating element disposed on the first main surface of the substrate and having a plurality of GND electrodes on the first main surface side; a plurality of heat dissipation members disposed on the second main surface of the substrate; a connecting conductor that penetrates the substrate in the thickness direction and connects the GND electrodes of the heating element and the heat dissipation members; and a signal terminal disposed on the second main surface of the substrate and connected to a signal line within the substrate, wherein the shape of the signal terminal as viewed from the thickness direction is substantially circular with equal dimensions in the vertical and horizontal directions; the plurality of signal terminals are arranged at substantially equal intervals in the vertical and horizontal directions, respectively; the shape of the heat dissipation members as viewed from the thickness direction is substantially the same as the shape of the signal terminals; the number of heat dissipation members connected to one GND electrode is one; and when viewed from the thickness direction, the plurality of heat dissipation members are concentrated in the central part of the region overlapping with the heating element.

3. A module comprising: a substrate having a first main surface and a second main surface facing each other in the thickness direction; a heating element disposed on the first main surface of the substrate and having a plurality of GND electrodes on the first main surface side; a plurality of heat dissipation members disposed on the second main surface of the substrate; a connecting conductor that penetrates the substrate in the thickness direction and connects the GND electrodes of the heating element and the heat dissipation members; and a signal terminal disposed on the second main surface of the substrate and connected to a signal line within the substrate, wherein the shape of the signal terminal as viewed from the thickness direction is substantially circular with equal dimensions in the vertical and horizontal directions; the plurality of signal terminals are arranged at substantially equal intervals in the vertical and horizontal directions, respectively; the shape of the heat dissipation member as viewed from the thickness direction has a larger area than the signal terminal and is substantially similar in shape to the signal terminal; and the number of heat dissipation members connected to one GND electrode is one.

4. The module according to any one of claims 1 to 3, wherein, when the substrate is viewed from the thickness direction, the signal terminal is not provided in the second main surface of the substrate at a location adjacent to the region overlapping the heating element.

5. The module according to claim 4, wherein, when the substrate is viewed from the thickness direction, one or more GND terminals connected to GND wiring within the substrate are provided on the second main surface of the substrate at a position adjacent to the region where the heating element is arranged.

6. The module according to any one of claims 1 to 5, wherein, when the substrate is viewed from the thickness direction, a plurality of the heat dissipation members are arranged symmetrically along a line and / or at a point, and the line of symmetry or center of symmetry of the heat dissipation members substantially coincides with the line of symmetry or center of symmetry based on the external shape of the heating element when viewed from the thickness direction.

7. The module according to claim 1, wherein the arrangement and shape of the heat dissipation member when viewed from the thickness direction is substantially the same as the arrangement and shape of the signal terminals.

8. The module according to claim 1, wherein the heat dissipation member comprises a first heat dissipation member positioned in a region overlapping the outer edge of the heating element when viewed from the thickness direction, and a second heat dissipation member positioned in the remaining region, wherein the shape and arrangement of the first heat dissipation member when viewed from the thickness direction is substantially the same as the shape and arrangement of the signal terminals, and the shape of the second heat dissipation member is larger in area than the signal terminals and substantially similar in shape to the signal terminals.

Images