Mounting device and mounting method

Abstract

Provided are a mounting device and a mounting method that improve the connection quality between a substrate and a semiconductor chip by suppressing bonding failure between the substrate and the semiconductor chip due to voids while improving image-based positioning accuracy. Specifically, the mounting device comprises: a first attachment 12 on which a substrate α is placed; a second attachment 23 which holds a semiconductor chip β; and a camera 24 which captures images for measuring the position of the substrate α placed on the first attachment 12 and the position of the semiconductor chip β held by the second attachment 23. The second attachment 23 has a plurality of camera through-holes 23c through which an optical axis L of the camera 24 passes, and at least a part of a holding surface 23a for holding the semiconductor chip β protrudes toward the first attachment 12. The camera 24 is configured to image the semiconductor chip β and the substrate α through the camera through-holes 23c.

Description

Mounting Device and Mounting Method

[0001] The present invention relates to a mounting device and a mounting method for mounting a semiconductor chip on a substrate.

[0002] With the miniaturization of bonding terminals, a mounting device for directly bonding a semiconductor chip to a substrate is known. The mounting device mounts a semiconductor chip with an activated bonding surface at a predetermined position on a substrate with an activated bonding surface, and heats the mounted substrate. The bonding surface of the semiconductor chip is directly bonded to the bonding surface of the substrate. By directly bonding the bonding terminals of the substrate and the bonding terminals of the semiconductor chip without using bumps or the like, fine bonding terminals can be joined together.

[0003] In such a mounting device, when directly bonding the bonding surface of the substrate and the bonding surface of the semiconductor chip, voids (air pockets) may occur between the bonding surface of the substrate and the bonding surface of the semiconductor chip. The occurrence of voids near the fine terminals of the semiconductor chip causes poor bonding between the fine terminals of the substrate located near the voids and the fine terminals of the semiconductor chip.

[0004] Therefore, a mounting device and a mounting method for suppressing the generation of voids between the directly bonded substrate and the semiconductor chip are known. The mounting device (bonding device) described in Patent Document 1 has an upper holding portion (second mounting device) for holding a semiconductor chip. The second mounting device has pins that can project from a holding surface (contact surface) for holding the semiconductor chip. The second mounting device pushes out and curves the semiconductor chip held on the contact surface by moving the pins. The bonding device releases the semiconductor chip from the first mounting device after bringing the top of the curved semiconductor chip into contact with the substrate. The semiconductor chip extrudes gas to the outside by contacting the substrate in order from the top. Thereby, the bonding device suppresses the generation of voids between the substrate and the semiconductor chip.

[0005] Japanese Patent No. 6218934

[0006] The bonding apparatus described in Patent Document 1 has movable pins within a second mounting device for bending a semiconductor chip. A drive device for moving the pins is located within the second mounting device. Therefore, in the bonding apparatus, high-precision measurement is difficult because multiple cameras are used to take images to avoid interference with the pins and the drive device, resulting in a misalignment of the relative positions of the multiple cameras, or because images are taken from a position that avoids interference with the second mounting device. As a result, the bonding position between the fine terminals of the substrate and the fine terminals of the semiconductor chip may be misaligned.

[0007] The object of the present invention is to provide a mounting apparatus and mounting method that improve the connection quality between a substrate and a semiconductor chip by suppressing bonding defects between the substrate and the semiconductor chip due to voids while increasing the precision of positioning based on images.

[0008] The inventors of the present invention have investigated a mounting apparatus and mounting method that improve the connection quality between a substrate and a semiconductor chip by suppressing bonding defects between the substrate and the semiconductor chip due to the generation of voids and improving bonding accuracy through high-precision position measurement. As a result of diligent investigation, the inventors have come up with the following configuration.

[0009] An embodiment of the present invention provides a mounting apparatus comprising: a stage on which a substrate on which a semiconductor chip is mounted is placed; a holding portion arranged opposite to the stage and holding the semiconductor chip; a pressing portion that supports the holding portion, moves the holding portion to an arbitrary position toward the stage, and presses the semiconductor chip held by the holding portion against the substrate; a camera that captures images for measuring the position of the substrate placed on the stage and the position of the semiconductor chip held by the holding portion; and a control unit that controls the pressing portion, the holding portion, and the camera. The mounting apparatus presses the semiconductor chip held by the holding portion against the substrate on the stage using the pressing portion, thereby bonding the semiconductor chip to the substrate.

[0010] The holding portion has a passage portion that allows light entering the camera to pass through. Furthermore, at least a portion of the holding surface of the holding portion that holds the semiconductor chip protrudes toward the stage. The camera is configured to photograph the semiconductor chip held by the holding portion and the substrate placed on the stage through the passage portion.

[0011] Furthermore, an embodiment of the present invention is a semiconductor chip mounting method for bonding a semiconductor chip to a substrate, comprising: a bending step of bending the bonding surface of the semiconductor chip so that it protrudes toward the substrate; a position calculation step of photographing the semiconductor chip and the substrate from the pressing direction while fixing the relative positions of the substrate and the semiconductor chip, and calculating the positions of the substrate and the semiconductor chip; a contact step of bringing the portion of the bonding surface of the semiconductor chip that protrudes the most toward the substrate, which was bent in the bending step, into contact with the substrate based on the position of the substrate calculated in the position calculation step; a placement step of bringing the portion of the bonding surface of the semiconductor chip that has not been in contact with the substrate in the contact step into contact with the substrate; and a bonding step of pressing the semiconductor chip placed on the substrate to bond it.

[0012] In the above configuration, the mounting apparatus holds the semiconductor chip with the holding surface of the holding part that protrudes toward the stage, thereby curving the bonding surface of the semiconductor chip toward the substrate (curving step). Furthermore, the mounting apparatus brings the top of the curved bonding surface of the semiconductor chip into contact with the bonding surface of the substrate (contact step), and then releases the semiconductor chip from the holding part (placement step). When the semiconductor chip is released from the holding part, it returns from a curved state to a flat state without elastic deformation due to elastic deformation. At this time, the portion of the bonding surface of the semiconductor chip that is not in contact with the bonding surface of the substrate comes into contact with the substrate sequentially, starting from the top and moving towards the portion with the smallest gap to the substrate. In other words, the semiconductor chip comes into contact with the substrate sequentially from the top toward the outer edge of the semiconductor chip. At this time, the semiconductor chip comes into contact with the substrate while pushing out the gas located between the substrate and the semiconductor chip. In this way, the mounting apparatus can suppress the generation of voids when placing the semiconductor chip on the substrate.

[0013] Furthermore, since the mounting apparatus does not have a mechanism for bending the semiconductor chip in the holding portion, a passage portion can be formed at any position in the holding portion to allow light entering the camera to pass through. Also, the mounting apparatus can be configured to position the camera at a position overlapping with the holding portion when viewed in the pressing direction, and to have the optical axis of the camera pass through the passage portion. Therefore, in the mounting apparatus, since the camera is not positioned between the holding portion and the stage, the positions of the substrate and the semiconductor chip can be measured with high precision by photographing the substrate and the semiconductor chip while bringing them close together without contact between the substrate and the semiconductor chip. In this way, the mounting apparatus improves the connection quality between the substrate and the semiconductor chip by positioning the substrate and the semiconductor chip and placing the semiconductor chip on the substrate using the holding portion which has the passage portion and a protruding holding surface, thereby improving the precision of positioning the substrate and the semiconductor chip based on the image and suppressing poor bonding between the substrate and the semiconductor chip due to voids.

[0014] From another perspective, the mounting apparatus of the present invention preferably includes the following configuration: The holding surface is curved so as to protrude toward the stage.

[0015] In the above configuration, the entire holding surface of the holding portion that contacts the semiconductor chip is curved. The semiconductor chip held in the holding portion is curved along the holding surface. Therefore, the holding portion can bond the semiconductor chip to the substrate while the semiconductor chip is curved with a predetermined curvature. This improves the connection quality between the substrate and the semiconductor chip by suppressing bonding defects between the substrate and the semiconductor chip due to voids while increasing the precision of positioning based on the image.

[0016] From another perspective, the mounting apparatus of the present invention preferably includes the following configuration: The holding surface includes a columnar member protruding toward the stage.

[0017] In the above configuration, the holding surface includes the flat surface and a columnar member projecting perpendicular to the flat surface. The holding surface is formed by joining the columnar member to any position on the flat surface, for example, by thermocompression bonding. The semiconductor chip held in the holding portion is curved so as to project toward the stage by the height of the columnar member. Therefore, the holding portion can join the semiconductor chip to the substrate with the semiconductor chip curved at a predetermined curvature by the height of the columnar member. This improves the connection quality between the substrate and the semiconductor chip by suppressing bonding defects between the substrate and the semiconductor chip due to voids while increasing the accuracy of positioning based on the image.

[0018] From another perspective, the mounting apparatus of the present invention preferably includes the following configuration: The holding surface includes a first columnar member protruding toward the stage and a second columnar member having a smaller protrusion than the first columnar member. The holding portion supports the semiconductor chip with the first columnar member and the second columnar member.

[0019] In the above configuration, the holding surface includes the flat surface, a first columnar member protruding from the flat surface toward the stage, and a second columnar member. The holding surface is formed by joining the first columnar member and the second columnar member at arbitrary positions on the flat surface, for example, by thermocompression bonding. The semiconductor chip supported by the first columnar member and the second columnar member is curved toward the stage based on the difference between the height of the first columnar member and the height of the second columnar member. In this case, the semiconductor chip is supported by the first columnar member and the second columnar member at a position away from the flat surface, and therefore does not interfere with the flat surface. Thus, the mounting device can curve the semiconductor chip with any curvature. This improves the connection quality between the substrate and the semiconductor chip by suppressing poor bonding between the substrate and the semiconductor chip due to voids while increasing the accuracy of positioning based on the image.

[0020] From another perspective, the mounting apparatus of the present invention preferably includes the following configuration: The holding surface protrudes toward the stage by metal deposition.

[0021] In the above configuration, the holding surface includes the flat surface and a vapor-deposited metal layer deposited on the flat surface. The holding surface protrudes in the direction of the stage by laminating the metal vapor-deposited layer in a predetermined range at any position on the flat surface, at any predetermined range and height. In other words, the holding surface can have protruding portions and curved surfaces of shapes that can be formed by the vapor deposition of the metal. The semiconductor chip held in the holding portion is curved toward the stage according to the thickness of the vapor-deposited metal layer. Therefore, the holding portion can bond the semiconductor chip to the substrate in a state curved with a predetermined curvature by adjusting the thickness of the vapor-deposited metal layer. This improves the connection quality between the substrate and the semiconductor chip by suppressing bonding defects between the substrate and the semiconductor chip due to voids while increasing the accuracy of positioning based on the image.

[0022] From another perspective, the mounting apparatus of the present invention preferably includes the following configuration: The holding portion attracts the semiconductor chip to the holding surface by suction.

[0023] In the above configuration, the holding part can bend the semiconductor chip to conform to the holding surface by pressing it against the holding surface using suction from a suction pump or the like. This improves the connection quality between the substrate and the semiconductor chip by suppressing poor bonding between the substrate and the semiconductor chip due to voids while increasing the precision of positioning based on the image.

[0024] The technical terms used herein are used solely to define specific embodiments and are not intended to limit the invention.

[0025] In this specification, the use of “including,” “comprising,” or “having,” and variations thereof, identifies the presence of described features, processes, operations, elements, components, and / or equivalents thereof, but may include one or more of the steps, operations, elements, components, and / or groups thereof.

[0026] In this specification, “attached,” “connected,” “joined,” and / or their equivalents are used in a broad sense and include both “direct and indirect” attachments, connections, and combinations. Furthermore, “connected” and “joined” are not limited to physical or mechanical connections or combinations, but may include direct or indirect electrical connections or combinations.

[0027] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meanings as those generally understood by those skilled in the art to which this invention pertains.

[0028] [Substrate] In this specification, a substrate means a patterned wiring board made of materials such as silicon, ceramics, or resin, on which semiconductor chips are mounted. The substrate includes semiconductor chips having integrated circuits made of semiconductors such as silicon. Therefore, the mounting device has the function of mounting the semiconductor chips onto the substrate and the function of mounting semiconductor chips onto semiconductor chips.

[0029] [Semiconductor Chip] In this specification, a semiconductor chip means an integrated circuit made of a semiconductor such as silicon, molded with an insulator. The semiconductor chip is a flip-chip bonding chip mounted with its bonding surface (active surface) facing the substrate. The bonding surface of the semiconductor chip is polished. Furthermore, the semiconductor chip is subjected to high-cleanliness cleaning, plasma treatment, surface activation treatment, etc., on the bonding surface in order to activate bonding at least one of the insulator (e.g., SiO2) or connection terminal of the bonding surface to the corresponding insulator (e.g., SiO2) or connection terminal of the substrate. This enables activation bonding by functional groups on the bonding surface. The semiconductor chip also includes an integrated package in which multiple semiconductor chips are integrated and molded with an insulating resin.

[0030] [Pressing direction] In the following embodiments, the pressing direction refers to the direction of movement of the holding portion that holds the semiconductor chip. Therefore, in the following embodiments, the pressing direction is the mounting direction of the semiconductor chip placed on the substrate.

[0031] According to one embodiment of the present invention, the connection quality between the substrate and the semiconductor chip can be improved by increasing the precision of positioning based on images while suppressing poor bonding between the substrate and the semiconductor chip due to voids.

[0032] Figure 1 is an overall configuration diagram of the mounting device in an embodiment of the present invention. Figure 2 is a control block diagram of the mounting device in an embodiment of the present invention. Figure 3 is a schematic diagram showing the positional relationship between the holding part and the camera of the mounting device in an embodiment of the present invention. Figure 4 is a view from arrow IV in Figure 3. Figure 5 is a process diagram of a mounting method for mounting a semiconductor chip on a substrate using the mounting device in an embodiment of the present invention. Figure 6 is a schematic diagram showing the bending process of the mounting device in an embodiment of the present invention. Figure 7 is a schematic diagram showing the position calculation process of the mounting device in an embodiment of the present invention. Figure 8 is a schematic diagram showing the contact process of the mounting device in an embodiment of the present invention. Figure 9 is a schematic diagram showing the mounting process and bonding process of the mounting device in an embodiment of the present invention. Figure 10 is a schematic diagram showing the holding part in modified example 1 of the mounting device in an embodiment of the present invention. Figure 11 is a schematic diagram showing the holding part of modified example 2 of the mounting device in an embodiment of the present invention. Figure 12 is a schematic diagram showing the holding part of modified example 3 of the mounting device in an embodiment of the present invention.

[0033] The mounting device according to the present invention will be described below with reference to the drawings. In each figure, the same parts are denoted by the same reference numerals, and the description of the same parts will not be repeated. The dimensions of the components in each figure do not faithfully represent the dimensions of the actual components or the dimensional ratios of each component. In the following description of embodiments of the present invention, the X direction and Y direction are assumed to be directions on the horizontal plane. The Y direction is perpendicular to the X direction. The Z direction is perpendicular to both the X and Y directions. In this embodiment, the Z direction is defined as the vertical direction. However, this definition of direction is not intended to limit the orientation of the positioning device when it is used in each embodiment.

[0034] Furthermore, in the following explanation, the terms “fixed,” “connected,” “joined,” and “attached” (hereinafter referred to as “fixed, etc.”) include not only cases where components are directly fixed, etc. to each other, but also cases where they are fixed, etc. through other components. In other words, in the following explanation, the terms “fixed, etc.” include both direct and indirect fixing, etc. to each other.

[0035] <Configuration of the Mounting Device> The mounting device 1, which is an embodiment of the mounting device according to the present invention, will be described using Figures 1 and 2. Figure 1 is an overall configuration diagram of the mounting device 1 in the embodiment of the present invention. Figure 2 is a control block diagram of the mounting device 1.

[0036] As shown in Figures 1 and 2, the mounting apparatus 1 mounts a semiconductor chip β onto a substrate α. The mounting apparatus 1 is installed in a semiconductor manufacturing apparatus (not shown). The mounting apparatus 1 includes a stage unit 10, a heater 11, a first attachment 12, a pickup unit 20, a pressing unit 21, a camera support 22, a second attachment 23, a camera 24, a position measurement unit 25, and a control device 30.

[0037] As shown in Figure 1, the stage unit 10 positions the substrate α at any position in the X and Y directions. The stage unit 10 is fixed to a frame (not shown) with its fixed surface 10a facing upwards. The stage unit 10 supports the heater 11 and the first attachment 12. The stage unit 10 is configured to move the heater 11 and the first attachment 12 to any position in the X and Y directions by a drive device (not shown). The stage unit 10 is connected to the control device 30.

[0038] The heater 11, which is the heating element, heats the substrate α via the first attachment 12. The heater 11 is, for example, a pulse heater having a ceramic housing. The heater 11 also includes laser heating type heaters that heat using a laser. The heater 11 is configured to rapidly raise the temperature to a preset temperature. The heater 11 is fixed to the fixed surface 10a of the stage unit 10 with its heating surface 11a facing upwards. The heater 11 is configured to be movable in the X and Y directions by the stage unit 10.

[0039] The first attachment 12, which is a stage, holds the substrate α. The first attachment 12 is made of, for example, a metal rectangular parallelepiped. The first attachment 12 is fixed to the heating surface 11a of the heater 11 in a detachable manner with its holding surface 12a facing upward. The first attachment 12 has a plurality of suction holes (not shown) on its holding surface 12a. The first attachment 12 is configured to hold the substrate α by adsorption using the suction force generated in the suction holes. The first attachment 12 is configured to be movable to any position in the X and Y directions, integrally with the heater 11, by the stage unit 10. The first attachment 12 is heated by the heater 11.

[0040] The pickup unit 20 positions the pressing unit 21 and the second attachment 23 at any position in the X and Y directions. The pickup unit 20 is fixed to a frame (not shown) with its fixed surface 20a facing the holding surface 12a of the first attachment 12. The pickup unit 20 supports the pressing unit 21. The pickup unit 20 is configured to move the pressing unit 21 to any position in the X and Y directions by a drive device (not shown). The pickup unit 20 is connected to the control device 30.

[0041] The pressing unit 21, which is the pressing part, is a unit that moves the second attachment 23 in the Z direction via the camera support part 22 and applies a predetermined force to the second attachment 23. The pressing unit 21 is fixed to the fixed surface 20a of the pickup unit 20 with its fixed surface 21a facing the holding surface 12a of the first attachment 12. The pressing unit 21 supports the camera support part 22. The pressing unit 21 applies a predetermined force in the Z direction to the second attachment 23 via the camera support part 22 by a drive device (not shown). The pressing unit 21 is also configured to be able to move the second attachment 23 to any position in the Z direction via the camera support part 22. The pressing unit 21 is connected to the control device 30.

[0042] The camera support portion 22 supports the camera 24. The upper end of the camera support portion 22 is fixed to the fixed surface 21a of the pressing unit 21. The lower end of the camera support portion 22 supports the second attachment 23. The inside of the camera support portion 22 is hollow. The lower end of the camera support portion 22 is configured so as not to overlap with the substrate α held by the first attachment and the semiconductor chip β held by the second attachment when viewed in the pressing direction. The camera 24 is fixed inside the camera support portion 22.

[0043] The second attachment 23, which is the holding part, holds the semiconductor chip β. The second attachment 23 is made of, for example, an inorganic material such as ceramics or glass, or a metallic material. The second attachment 23 is fixed to the lower end surface of the camera support part 22 in a detachable manner, with its holding surface 23a facing the holding surface 12a of the first attachment 12. The second attachment 23 has a suction hole (not shown) on its holding surface 23a for holding the semiconductor chip β. The second attachment 23 holds the semiconductor chip β by suction force generated in the suction hole on its holding surface 23a. The second attachment 23 is configured to be movable to any position in the X and Y directions by the pickup unit 20. The second attachment 23 is configured to be movable to any position in the Z direction by the pressing unit 21.

[0044] The camera 24 captures an image for measuring the positions of the substrate α held by the first attachment 12 and the semiconductor chip β held by the second attachment 23. The camera 24 is, for example, a CMOS camera. At least a part of the camera 24 is supported inside the camera support portion 22. That is, the camera 24 is located above the second attachment 23. The camera 24 is configured to be able to capture the first attachment 12 and the second attachment 23 with the Z direction, which is the pressing direction, as the imaging direction. Therefore, the imaging angle of the camera 24 includes a part of the semiconductor chip β held on the holding surface 23a of the second attachment 23 and a part of the substrate α held by the first attachment 12. The camera 24 is configured to be movable to an arbitrary position in the X direction and the Y direction with respect to the camera support portion 22 by a driving device not shown. That is, the camera 24 is movable to an arbitrary position in the X direction and the Y direction with respect to the first attachment 12 and the second attachment 23.

[0045] The position measuring unit 25 detects the Z-direction position of the second attachment 23. The position measuring unit 25 is configured by, for example, a linear scale.

[0046] The suction pump 26 sucks gas through a suction hole (not shown) of the second attachment 23. That is, the suction pump 26 generates a negative pressure in the suction hole. Therefore, the suction pump 26 generates a suction force that sucks the semiconductor chip β to the holding surface 23a where the suction hole (not shown) is located by the negative pressure.

[0047] As shown in FIG. 2, the control device 30, which is a control unit, controls the stage unit 10, the heater 11, the pickup unit 20, the pressing unit 21, the camera 24, and the suction pump 26. The control device 30 acquires position information from the position measuring unit 25. Substantially, the control device 30 has a CPU, a ROM, a RAM, an HDD, etc. connected by a bus. Alternatively, various programs and data are stored to control the operations of the stage unit 10, the heater 11, the pickup unit 20, the pressing unit 21, the camera 24, and the suction pump 26.

[0048] The control device 30 is electrically connected to the X-direction actuator and the Y-direction actuator of the stage unit 10. The control device 30 is electrically connected to the heater 11. The control device 30 is electrically connected to the X-direction actuator and the Y-direction actuator of the pickup unit 20. The control device 30 is electrically connected to the Z-direction actuator of the pressing unit 21. The control device 30 is electrically connected to the suction pump 26.

[0049] Also, the control device 30 is electrically connected to the camera 24 and the X-direction actuator and the Y-direction actuator of the camera 24. The control device 30 is electrically connected to the X-direction scale and the Y-direction scale included in the stage unit 10 and the pickup unit 20. The control device 30 is electrically connected to the position measurement unit 25. The control device 30 uses the measurement value of the position measurement unit 25 as the Z-direction position of the second attachment 23.

[0050] The control device 30 is configured to be able to output a position control signal for positioning the first attachment 12 (see FIG. 1) fixed to the stage unit 10 at a target position with respect to the stage unit 10.

[0051] The control device 30 is configured to be able to output a position control signal for positioning the second attachment 23 at a target position with respect to the pickup unit 20. The control device 30 is configured to be able to output a position control signal for positioning the second attachment 23 at a target position with respect to the pressing unit 21. Also, the control device 30 is configured to be able to output a temperature control signal for raising the temperature to a predetermined temperature with respect to the heater 11. The control device 30 is configured to be able to output a position control signal for positioning the camera 24 at a target position with respect to the camera 二十四. The control device 30 is configured to be able to output a control signal for imaging the substrate α and the semiconductor chip β with respect to the camera 24. The control device 30 is configured to be able to output a suction control signal with respect to the suction pump 26.

[0052] The control device 30 can acquire the X and Y coordinates of the substrate α and semiconductor chip β using the camera 24. The control device 30 can acquire the X and Y coordinates of the first attachment 12 and the second attachment 23 using the X-direction scale and the Y-direction scale. The control device 30 can acquire the Z coordinate of the second attachment 23 using the position measurement unit 25.

[0053] In the mounting apparatus 1 configured in this way, when a substrate α is placed on the first attachment 12 of the stage unit 10 from an external transport device, the mounting apparatus 1 holds the substrate α by suction force. The mounting apparatus 1 holds the semiconductor chip β by suction force using the second attachment 23 of the pickup unit 20. The mounting apparatus 1 photographs the substrate α and semiconductor chip β with the camera 24 and calculates the positions of the substrate α and semiconductor chip β. The mounting apparatus 1 adjusts the position of the substrate α in the X and Y directions using the stage unit 10. Furthermore, the mounting apparatus 1 adjusts the position of the semiconductor chip β in the X and Y directions using the pickup unit 20. The mounting apparatus 1 adjusts the position of the semiconductor chip β in the Z direction using the pressing unit 21 and places the semiconductor chip β at a predetermined position on the substrate α.

[0054] The mounting apparatus 1 uses a pressing unit 21 to press the semiconductor chip β, which is positioned at a predetermined location on the substrate α, toward the substrate α. Simultaneously, the mounting apparatus 1 heats the substrate α via the first attachment 12 using a heater 11. In this way, the mounting apparatus 1 bonds the semiconductor chip β to the predetermined location on the substrate α.

[0055] <Details of the Second Attachment and Camera> The positional relationship between the second attachment 23 and the camera 24 will be explained in detail using the figures. Figure 3 is a schematic diagram showing the positional relationship between the second attachment 23, which is the holding part of the mounting device 1, and the camera 24. Figure 4 is a schematic diagram showing the positional relationship between the substrate α and the semiconductor chip β with respect to the second attachment 23 of the mounting device 1.

[0056] As shown in Figure 3, the holding surface 23a of the second attachment 23 has a shape based on the shape of the semiconductor chip when viewed in the pressing direction. In this embodiment, the second attachment 23 is formed in a square shape when viewed in the pressing direction (see Figure 4). The holding surface 23a is curved so as to protrude toward the first attachment 12 with the intersection of its diagonals as the apex 23b (see Figure 4). The holding surface 23a is also curved from the apex 23b to the outer edge. The curved surface of the holding surface 23a is configured as part of a sphere. Therefore, the vertical distance H from the virtual surface P tangent to the apex 23b to the holding surface 23a is equal on concentric circles of any size centered on the apex 23b. The holding surface 23a is curved toward the first attachment 12 when viewed from the X and Y directions.

[0057] Furthermore, negative pressure is generated in the multiple suction holes of the second attachment 23 by the suction force of the suction pump 26. The second attachment 23 can attract the semiconductor chip β to the holding surface 23a by the negative pressure in the multiple suction holes. In this way, the second attachment 23 can bend the semiconductor chip β along the holding surface 23a by holding the semiconductor chip β with the holding surface 23a.

[0058] As shown in Figures 3 and 4, the second attachment 23 has at least one camera through-hole 23c, which is a passage for light entering the camera 24. The camera through-hole 23c is positioned where the optical axis L of the camera 24 passes through. In this embodiment, the second attachment 23 has two camera through-holes 23c diagonally opposite each other. The camera through-holes 23c penetrate the second attachment 23 in the pressing direction. The camera through-holes 23c are positioned so as to overlap with at least one of the positioning marks Mα on the substrate α held by the first attachment 12 or the positioning mark Mβ on the semiconductor chip β held by the second attachment 23 when viewed in the pressing direction. In this embodiment, the positioning mark Mα on the substrate α and the positioning mark Mβ on the semiconductor chip β overlap with one and the other camera through-holes 23c, respectively, when viewed in the pressing direction.

[0059] The second attachment 23 does not have a mechanism to bend the semiconductor chip β using pins or the like. Therefore, the thickness of the second attachment 23 in the pressing direction is thinner than in the case where there is a mechanism to bend the semiconductor chip β. In addition, the second attachment 23 can have a camera through hole 23c formed at any position. Furthermore, the second attachment 23 does not restrict the range of movement of the camera 24 in the X and Y directions and beyond in the area that overlaps with the second attachment 23 when viewed in the pressing direction.

[0060] The camera 24 is movable to any position in the X and Y directions above the second attachment 23. The camera 24 is positioned with its optical axis L aligned with the second attachment 23 in the Z direction. The camera 24 can align its optical axis L with the camera through-hole 23c by a drive device (not shown). In other words, the camera 24 can photograph the positioning mark Mα, which is part of the substrate α held by the first attachment 12, and the positioning mark Mβ, which is part of the semiconductor chip β held by the second attachment 23, through the camera through-hole 23c from a position that aligns with the second attachment 23 when viewed in the pressing direction.

[0061] <Implementation Method> Next, an implementation method for implementing a semiconductor chip β on a substrate α using an implementation device 1 will be described using Figures 2 and 5 to 9. Figure 5 is a process diagram of the implementation method for implementing a semiconductor chip β on a substrate α using an implementation device 1. Figure 6 is a schematic diagram showing the bending process S1 of the implementation device 1. Figure 7 is a schematic diagram showing the position calculation process S2 of the implementation device 1. Figure 8 is a schematic diagram showing the contact process S3 of the implementation device 1. Figure 9 is a schematic diagram showing the placement process S4 and bonding process S5 of the implementation device 1.

[0062] In this embodiment, the mounting apparatus 1 holds the substrate α by adsorption to the first attachment 12.

[0063] As shown in Figure 6, the semiconductor chip β mounting method includes a bending step S1, a position calculation step S2, a contact step S3, a placement step S4, and a bonding step S5. The mounting apparatus 1 proceeds through the steps in the order of bending step S1, position calculation step S2, contact step S3, placement step S4, and bonding step S5.

[0064] As shown in Figures 2, 5, and 6, the bending process S1 is a process of bending the bonding surface β1 of the semiconductor chip β so that it protrudes toward the substrate α. In the bending process S1, the control device 30 transmits a control signal to the pickup unit 20 to move to the supply position A. The pickup unit 20 moves to the supply position A. Next, the control device 30 transmits a control signal to the suction pump 26 to start suction. A suction force is generated on the holding surface 23a of the second attachment 23 by the suction pump 26. The second attachment 23 uses its holding surface 23a to attract the molded surface of the semiconductor chip β at the supply position A. The semiconductor chip β is held by the second attachment 23 in a state of elastic deformation along the holding surface 23a.

[0065] As shown in Figures 2, 5, and 7, the position calculation step S2 is a step in which the positions of the substrate and the semiconductor chip are calculated. In the position calculation step S2, the control device 30 transmits a control signal to the pickup unit 20 to move to the bonding position B facing the first attachment 12. The pickup unit 20 moves to the bonding position B. Next, the control device 30 transmits a control signal to the camera 24 to move to a shooting position to photograph the positioning mark Mβ of the substrate α and a signal to photograph the positioning mark Mβ of the semiconductor chip β. The camera 24 moves to a shooting position in which the optical axis passes through the camera through-hole 23c that overlaps with the positioning mark Mβ of the semiconductor chip β when viewed in the pressing direction.

[0066] Camera 24 photographs the positioning mark Mβ of the semiconductor chip β at the shooting position. Similarly, the control device 30 transmits a control signal to camera 24 to move to a shooting position to photograph the positioning mark Mα of the substrate α, and a signal to photograph the positioning mark Mα of the substrate α. Camera 24 photographs the positioning mark Mα of the substrate α. At this time, the mounting apparatus 1 can bring the second attachment 23 closer to the first attachment 12 without the semiconductor chip β and the substrate α coming into contact, by positioning camera 24 above the second attachment 23. Therefore, camera 24 can acquire a more detailed image. The control device 30 calculates the positions of the substrate α and the semiconductor chip β from the images of the positioning mark Mα of the substrate α and the positioning mark Mβ of the semiconductor chip β that have been photographed.

[0067] As shown in Figures 2, 5, and 8, the contact step S3 is a step in which the top portion β2 that protrudes the most toward the substrate α from the bonding surface β1 of the semiconductor chip β that was curved in the bending step S1 is brought into contact with the substrate α based on the position of the substrate α calculated in the position calculation step S2. The control device 30 transmits a control signal to the pickup unit 20 to move the top portion β2 to a predetermined position in the X direction and Y direction based on the positions of the substrate α and the semiconductor chip β calculated in the position calculation step S2. The pickup unit 20 moves the semiconductor chip β held by the second attachment 23, together with the pressing unit 21 and the camera support 22, to the predetermined position in the X direction and Y direction.

[0068] Next, the control device 30 transmits a control signal to the pressing unit 21 to move the second attachment 23 toward the first attachment 12. The pressing unit 21 moves until the top portion β2 comes into contact with the bonding surface α1 of the substrate α. The pressing unit 21 brings the semiconductor chip β into contact with the substrate α, for example, by measuring the position of the position measuring unit 25 or by torque control that moves with a constant thrust. When the second attachment 23 reaches a predetermined position in the Z direction or when the movement of the second attachment 23 in the Z direction stops, the control device 30 determines that the top portion β2 and the bonding surface α1 have come into contact and transmits a control signal to the pressing unit 21 to stop operation.

[0069] As shown in Figures 2, 5, and 9, the mounting step S4 is a step in which the portion of the bonding surface β1 of the semiconductor chip β that is not in contact with the bonding surface α1 of the substrate α is brought into contact with the bonding surface α1. The control device 30 transmits a control signal to the suction pump 26 to stop suction. The second attachment 23 releases the semiconductor chip β from the holding surface 23a. At this time, the bonding surface β1 of the elastically deformed semiconductor chip β moves elastically from the top β2 towards the bonding surface α1 of the substrate α. The bonding surface β1 contacts the bonding surface α1 sequentially, starting from the top β2 where the vertical distance H to the bonding surface α1 (see Figure 3) is smallest, and moving toward the outer edge of the semiconductor chip β. The gas between the bonding surface β1 and the bonding surface α1 is pushed out from the top β2 toward the outer edge of the semiconductor chip β. As a result, the mounting device 1 places the semiconductor chip β on the substrate α while suppressing the generation of voids between the bonding surface β1 and the bonding surface α1.

[0070] Bonding step S5 is a step in which the semiconductor chip β placed on the substrate α is pressed and bonded. The control device 30 transmits a control signal to the heater 11 to start heating. The heater 11 heats the first attachment 12 to a predetermined temperature. The control device 30 transmits a control signal to the pressing unit 21 to move in the pressing direction with a predetermined force. The pressing unit 21 presses the second attachment 23 with a predetermined force. The semiconductor chip β is directly bonded to the substrate α which has been heated to a predetermined temperature.

[0071] The mounting apparatus 1 has a camera 24 positioned above the second attachment 23, overlapping with it when viewed in the pressing direction. This allows the mounting apparatus 1 to photograph the positioning marks Mα on the substrate α and Mβ on the semiconductor chip β from a direction approximately perpendicular to the substrate α and semiconductor chip β. Furthermore, the mounting apparatus 1 can photograph the positioning marks Mα on the substrate α and Mβ on the semiconductor chip β while fixing the relative positions of the substrate α and semiconductor chip β. Additionally, the mounting apparatus 1 can photograph the positioning marks Mα on the substrate α and Mβ on the semiconductor chip β while bringing the second attachment 23 closer to the first attachment 12, within a range where the semiconductor chip β and substrate α do not come into contact. Therefore, the mounting apparatus 1 can photograph the positioning marks Mα on the substrate α and Mβ on the semiconductor chip β with higher resolution compared to a case where the second attachment 23 is equipped with a mechanism to curve the semiconductor chip β. This improves the positioning accuracy of the semiconductor chip β relative to the substrate α using images, and suppresses poor connections between the connection terminals of the substrate α and the connection terminals of the semiconductor chip β.

[0072] Furthermore, in the mounting process S4, the mounting device 1 contacts the bonding surface α1 of the substrate α sequentially from the top β2 of the bonding surface β1 toward the outer edge of the semiconductor chip β, making it difficult for gas to enter between the bonded bonding surface α1 and the bonding surface β1. Therefore, the mounting device 1 can suppress bonding defects between the connection terminals of the substrate α and the connection terminals of the semiconductor chip β.

[0073] In this way, the mounting device 1 uses a second attachment 23, which has a camera through-hole 23c and is curved so that its holding surface 23a protrudes, to position the substrate α and semiconductor chip β and to place the semiconductor chip β on the substrate α. This improves the accuracy of positioning based on images while suppressing poor bonding between the substrate α and the semiconductor chip β due to voids. This improves the quality of the connection between the substrate α and the semiconductor chip β.

[0074] <Modification 1 of this Embodiment> Below, a mounting device 101 according to a modification of an embodiment of the mounting device according to the present invention will be described with reference to Figure 10. Figure 10 is a schematic diagram showing the second attachment 123 in Modification 1 of the mounting device 101. In the following description, components that are the same as in the embodiment will be denoted by the same reference numerals and their descriptions will be omitted, and only the parts that differ from the embodiment will be described. The mounting device 101 according to Modification 1 of this Embodiment has a second attachment 123 that has a different shape from the second attachment 23.

[0075] As shown in Figure 10, the holding surface 123a of the second attachment 123, which is the holding part, includes a flat surface 123d and a columnar member 123e. The columnar member 123e protrudes toward the first attachment 12 (see Figure 3). The columnar member 123e is located at the intersection of the diagonals of the flat surface 123d. The columnar member 123e protrudes perpendicularly from the flat surface 123d. The columnar member 123e is a member that supports the semiconductor chip β. The columnar member 123e is joined to the flat surface 123d, for example, by thermocompression bonding.

[0076] Furthermore, the flat surface 123d has a plurality of suction holes (not shown). A suction pump 26 is connected to the plurality of suction holes. The second attachment 23 can attract the semiconductor chip β to the flat surface 123d by the negative pressure from the plurality of suction holes. The second attachment 123 attracts the semiconductor chip β to the flat surface 123d by suction force while supporting approximately the center of the semiconductor chip β with the columnar member 123e. The second attachment 123 elastically deforms the semiconductor chip β by attracting the portion of the semiconductor chip β not supported by the columnar member 123e to the flat surface 123d by suction force. The semiconductor chip β is curved with the portion supported by the columnar member 123e as the apex β2. In this way, the second attachment 123 can curve the semiconductor chip β around the columnar member 123e by holding the semiconductor chip β with the holding surface 123a. The second attachment 123 can adjust the curvature of the semiconductor chip β by the height of the columnar member 123e.

[0077] <Modification 2 of this Embodiment> Below, a mounting device 201 according to modification 2 of the embodiment of the mounting device according to the present invention will be described with reference to Figure 11. Figure 11 is a schematic diagram showing the second attachment 223 of modification 2 of the mounting device 201. The mounting device 201 according to modification 2 of this embodiment has a second attachment 223 that has a different shape from the second attachment 23.

[0078] As shown in Figure 11, the holding surface 223a of the second attachment 223, which is the holding part, has a shape based on the shape of the semiconductor chip when viewed in the pressing direction. In this embodiment, the holding surface 223a of the second attachment 223 includes a flat surface 223d, one first columnar member 223e, and four second columnar members 223f. The first columnar member 223e and the second columnar members 223f protrude toward the first attachment 12 (see Figure 3). The first columnar member 223e and the second columnar members 223f protrude in a direction perpendicular to the flat surface 223d. The first columnar member 223e is located at the intersection of the diagonals of the flat surface 223d. The second columnar members 223f are located at the four corners of the flat surface 223d. The amount of protrusion of the second columnar members 223f is smaller than that of the first columnar members 223e. In other words, the first columnar member 223e is a member for bending the semiconductor chip β. The four second columnar members 223f are members for supporting the semiconductor chip β. The first columnar member 223e and the second columnar members 223f are joined to a flat surface 223d, for example, by thermocompression bonding.

[0079] Furthermore, the flat surface 223d has a plurality of suction holes (not shown). A suction pump 26 is connected to the plurality of suction holes. The second attachment 223 can attract the semiconductor chip β to the flat surface 223d by the negative pressure from the plurality of suction holes. The second attachment 223 attracts the semiconductor chip β to the flat surface 223d by suction force while supporting the approximate center of the semiconductor chip β with the first columnar member 223e. The second attachment 223 elastically deforms the semiconductor chip β by attracting the portion of the semiconductor chip β not supported by the first columnar member 223e to the second columnar member 223f by suction force. In other words, the semiconductor chip β is supported by the first columnar member 223e and the second columnar member 223f. Furthermore, the semiconductor chip β is curved so that the portion supported by the first columnar member 223e is the top portion β2. Thus, in the second attachment 223, the curved semiconductor chip β and the flat surface 223d do not interfere with each other by holding the semiconductor chip β with the first columnar member 223e and the second columnar member 223f. Furthermore, the second attachment 223 can adjust the curvature of the semiconductor chip β by the difference in height between the first columnar member 223e and the second columnar member 223f.

[0080] <Modification 3 of this Embodiment> Below, with reference to Figure 12, a mounting device 301 according to modification 3 of the embodiment of the mounting device according to the present invention will be described. Figure 12 is a schematic diagram showing the second attachment 323 of modification 3 of the mounting device 301. The mounting device 301 according to modification 3 of this embodiment has a second attachment 323 that has a different shape from the second attachment 23.

[0081] As shown in Figure 12, the holding surface 323a of the second attachment 323, which is the holding part, has a shape based on the shape of the semiconductor chip when viewed in the pressing direction. In this embodiment, the second attachment 323 is formed in a square shape when viewed in the pressing direction. The holding surface 323a includes a flat surface 323d and a metal deposition part 323g. The metal deposition part 323g is the part on the flat surface 323d to which metal has been deposited. The metal deposition part 323g protrudes toward the first attachment 12. The metal deposition part 323g is located at the intersection of the diagonals of the flat surface 323d. The metal deposition part 323g protrudes perpendicularly from the flat surface 323d. The metal deposition part 323g is a member that supports the semiconductor chip β.

[0082] The metal-deposited portion 323g is formed, for example, by laminating metal-deposited layers onto a flat surface 323d. The first metal-deposited portion 323g1, which is the first layer of the metal-deposited portion 323g, is formed by depositing metal onto a flat surface 323c using a mask having a first opening. The second metal-deposited portion 323g2, which is the second layer of the metal-deposited portion 323g, is formed by depositing metal onto the first metal-deposited portion 323g1 using a mask having a second opening smaller than the first opening. The third metal-deposited portion 323g3, which is the third layer of the metal-deposited portion 323g, is formed by depositing metal onto the second metal-deposited portion 323g2 using a mask having a third opening smaller than the second opening. The metal-deposited portion 323g formed in this way is configured as a curved surface protruding from the flat surface 232d.

[0083] Furthermore, the flat surface 323d has a plurality of suction holes (not shown). A suction pump 26 is connected to the plurality of suction holes. The second attachment 23 can attract the semiconductor chip β to the flat surface 323d by the negative pressure from the plurality of suction holes. The second attachment 323 attracts the semiconductor chip β to the flat surface 323d by suction force while supporting the approximate center of the semiconductor chip β with the metal deposition portion 323g. The second attachment 323 elastically deforms the semiconductor chip β by attracting the portion of the semiconductor chip β not supported by the metal deposition portion 323g to the flat surface 323d by suction force. The semiconductor chip β is curved so that the portion supported by the metal deposition portion 323g becomes the top portion β2 and follows the metal deposition portion 323g. In this way, the second attachment 323 can curve the semiconductor chip β around the metal deposition portion 323g by holding the semiconductor chip β with the holding surface 323a. The second attachment 323 can adjust the curvature of the semiconductor chip β by controlling the amount of metal deposition and the number of layers of the metal deposition portion 323g.

[0084] The holding surface 323a can be made to protrude to any predetermined range and height by depositing metal in a predetermined range at any position on the flat surface 323d. In other words, the holding surface 323a can have protruding portions and curved surfaces of shapes that can be formed by depositing metal. The second attachment 323 can directly bond the semiconductor chip β to the substrate α in a curved state with a predetermined curvature by adjusting the thickness of the metal-deposited portion 323g. This improves the connection quality between the substrate α and the semiconductor chip β by suppressing bonding defects between the substrate α and the semiconductor chip β due to voids while increasing the precision of positioning accuracy based on the image.

[0085] [Other Embodiments] In the above-described embodiment, at least a portion of the camera 24 is located above the second attachment 23 in the mounting apparatus 1. However, the camera only needs to be configured such that its optical axis extends from above the second attachment toward the substrate α and the semiconductor chip β.

[0086] In the above-described embodiment, the camera 24 is configured as, for example, a CMOS camera. However, if the positioning mark Mβ of the semiconductor chip β is located on the bonding surface β1, the camera may be configured to photograph the positioning mark Mβ of the semiconductor chip β using a camera that corresponds to a highly transparent wavelength, such as an infrared camera. Alternatively, the camera may be a CCD camera.

[0087] In the above-described embodiment, the second attachment 23 has a camera through-hole 23c as a passage portion. However, the second attachment may be made of a light-transmitting member such as glass as a passage portion for allowing light entering the camera to pass through. The light-transmitting member is configured to transmit light without distortion. In the light-transmitting member, the light-incoming surface and the light-outcoming surface of the portion for allowing light entering the camera to pass through are configured perpendicular to the substrate α.

[0088] Furthermore, in the above-described embodiment, the mounting apparatus 1 heats the substrate α with a heater 11. However, when the mounting apparatus directly bonds the semiconductor chip β to the substrate α, it may be configured not to heat with a heater or the like. The mounting apparatus directly bonds the semiconductor chip β to the substrate α by pressing it against the substrate α without heating.

[0089] Furthermore, in the above-described embodiment, the mounting device 1 holds the substrate α by the first attachment 12. However, the mounting device may also have a configuration without an attachment. In a mounting device without an attachment, the substrate α is held by the stage unit without the use of an attachment or the like.

[0090] Furthermore, in the above-described embodiment, the mounting apparatus 1 holds the substrate α with the first attachment 12 and the semiconductor chip β with the second attachment 23. However, the mounting apparatus may also be configured to hold the semiconductor chip β with the first attachment and the substrate α with the second attachment.

[0091] Furthermore, in the above-described embodiment, the mounting device 1 curves the semiconductor chip β using a holding surface 23a on which the top of the curved surface 23b is located in the center of the second attachment 23. However, the mounting device may also be configured to curve the semiconductor chip β using a holding surface on which the top of the curved surface is located on the outer edge of the second attachment or the like.

[0092] Furthermore, in the above-described embodiment, the mounting apparatus 1 bends the semiconductor chip β using the second attachment 23. However, the mounting apparatus only needs to be configured to bend at least one of the substrate α or the semiconductor chip β.

[0093] Furthermore, in the above-described embodiment, the mounting apparatus 1 heats the first attachment 12 with the heater 11. However, the mounting apparatus only needs to be configured to heat at least one of the substrate α or the semiconductor chip β.

[0094] Furthermore, in the above-described embodiment, the mounting device 1 holds the semiconductor chip β on the second attachment 23 by the suction force of the suction pump 26. However, the mounting device may also be configured to hold the semiconductor chip β by a force such as magnetic force or electrostatic attraction force.

[0095] Furthermore, in the above-described modified examples 1 and 2, the second attachments 123 and 223 curve the semiconductor chip β using columnar members 123e, 223e, and 223f. However, the second attachment may also be configured to curve the semiconductor chip β using a plate-shaped member or the like.

[0096] Furthermore, in the above-described embodiment, the camera 24 photographs the substrate α and the semiconductor chip β through the camera through-hole 23c of the second attachment 23. However, the camera 24 may also be configured to transmit materials and structures that transmit visible light and suppress distortion of visible light.

[0097] Furthermore, in the above-described embodiment, the mounting device 1 heats the first attachment 12 with a ceramic heater, which is a heater 11. However, the mounting device may also be configured to heat the first attachment with a constant heater or a pulse heater.

[0098] Although embodiments of the present invention have been described above, the embodiments described above are merely examples for carrying out the present invention. Therefore, the invention is not limited to the embodiments described above, and it is possible to carry out the invention by appropriately modifying the embodiments described above without departing from the spirit of the invention.

[0099] 1, 101, 201, 301 Mounting device 10 Stage unit 10a, 20a, 21a Fixing surface 11 Heater 11a Heating surface 12 First attachment 12a, 23a, 123a, 223a, 323a Holding surface 20 Pickup unit 21 Pressing unit 22 Camera support part 23, 123, 223, 323 Second attachment 23b Top of holding surface 23c Through hole for camera 123d, 223d, 323d Flat surface 123e Columnar member 223e First columnar member 223f Second columnar member 323g Metal deposition part 323g1 First metal deposition part 323g2 Second metal deposition part 323g3 Third metal deposition part 24 Camera 25 Position measurement part 26 Suction pump 30 Control device α Substrate β Semiconductor chip α1, β1 Bonding surface β2 Top of bonding surface H Vertical distance L Optical axis Mα Positioning mark for substrate Mβ Positioning mark for semiconductor chip S1 Bending process S2 Position calculation process S3 Contact process S4 Placement process S5 Bonding process P Virtual surface A Supply position B Bonding position

Claims

1. A mounting apparatus comprising: a stage on which a substrate on which a semiconductor chip is mounted is placed; a holding part disposed opposite to the stage and holding the semiconductor chip; a pressing part that supports the holding part and moves the holding part to an arbitrary position toward the stage and presses the semiconductor chip held by the holding part against the substrate; a camera that takes images for measuring the position of the substrate placed on the stage and the position of the semiconductor chip held by the holding part; and a control unit that controls the pressing part, the holding part and the camera, wherein the semiconductor chip held by the holding part is pressed by the pressing part against the substrate on the stage and the semiconductor chip is bonded to the substrate, wherein the holding part has a passing part that allows light entering the camera to pass through, at least a part of the holding surface that holds the semiconductor chip protrudes toward the stage, and the camera is configured to photograph the semiconductor chip held by the holding part and the substrate placed on the stage through the passing part.

2. The mounting apparatus according to claim 1, wherein the through portion is a camera through-hole that allows light entering the camera to pass through.

3. The mounting apparatus according to claim 1, wherein the passing portion is a transparent member capable of transmitting light entering the camera.

4. A mounting apparatus according to claim 1, wherein the holding surface is curved so as to protrude toward the stage.

5. A mounting apparatus according to claim 1, wherein the holding surface includes a columnar member protruding toward the stage.

6. A mounting apparatus according to claim 1, wherein the holding surface includes a first columnar member protruding toward the stage and a second columnar member having a smaller protrusion than the first columnar member, and the semiconductor chip is supported by the first columnar member and the second columnar member.

7. A mounting apparatus according to claims 1 to 6, wherein the holding portion attracts the semiconductor chip to the holding surface by suction.

8. A semiconductor chip mounting method for bonding a semiconductor chip to a substrate, comprising: a bending step of curving the bonding surface of the semiconductor chip so that it protrudes toward the substrate; a position calculation step of photographing the semiconductor chip and the substrate from the pressing direction while fixing the relative positions of the substrate and the semiconductor chip, and calculating the positions of the substrate and the semiconductor chip; a contact step of bringing the top portion of the bonding surface of the semiconductor chip that protrudes the most toward the substrate, which was curved in the bending step, into contact with the substrate based on the position of the substrate calculated in the position calculation step; a placement step of bringing the portion of the bonding surface of the semiconductor chip that has not been in contact with the substrate in the contact step into contact with the substrate; and a bonding step of pressing the semiconductor chip placed on the substrate to bond it.

Images