Display device

Abstract

A display device. The display device comprises a display substrate (10), a circuit board (20), a first encapsulation layer (30), and an encapsulation insulating layer (40), wherein the display substrate (10) has a display side (DS) and a non-display side (NS); the circuit board (20) is at least partially located on the non-display side (NS), and comprises a base layer (21) located on the non-display side (NS) and at least one first component (22) disposed on the side of the base layer (21) away from the display substrate (10), the at least one first component (22) comprising a first surface (22A) away from the base layer (21); the first encapsulation layer (30) is disposed on the side of the circuit board (20) away from the display substrate (10), and comprises a first encapsulation portion (31) located on the side of the first component (22) away from the display substrate (10) to cover the first surface (22A) and a second encapsulation portion (32) located around the first encapsulation portion (31); and the encapsulation insulating layer (40) is disposed on the side of the second encapsulation portion (32) close to the first component (22), so as to separate the second encapsulation portion (32) from the first component (22). The display substrate has better reliability.

Description

Display device Technical Field

[0001] Embodiments of this disclosure relate to a display device. Background Technology

[0002] With the gradual development of electronic products, the market has higher and higher requirements for display devices. For example, for electronic products such as mobile phones, tablets and laptops, consumers are gradually pursuing thinner and larger screen display devices. In response, foldable display devices have emerged.

[0003] To achieve thinner and lighter display devices, engineers need to redesign parts of the display device's structure to simultaneously meet various functional requirements.

[0004] Summary of the Invention

[0005] At least one embodiment of this disclosure provides a display device, the display device including a display substrate, a circuit board, a first encapsulation layer, and an encapsulation insulating layer; the display substrate has a display side and a non-display side; the circuit board is at least partially located on the non-display side, including a base layer located on the non-display side and at least one first component disposed on the base layer on a side away from the display substrate, wherein the at least one first component includes a first surface away from the base layer; the first encapsulation layer is disposed on the side of the circuit board away from the display substrate, including a first encapsulation portion located on the side of the first component away from the display substrate to cover the first surface and a second encapsulation portion located around the first encapsulation portion; the encapsulation insulating layer is disposed on the side of the second encapsulation portion near the first component to space the second encapsulation portion and the first component.

[0006] For example, in a display device provided in at least one embodiment of this disclosure, the encapsulation insulating layer surrounds the first component in a ring shape.

[0007] For example, in a display device provided in at least one embodiment of this disclosure, the first encapsulation portion and the second encapsulation portion form a first obtuse angle.

[0008] For example, in a display device provided in at least one embodiment of this disclosure, the encapsulation insulating layer comprises an organic material.

[0009] For example, in a display device provided in at least one embodiment of this disclosure, the first encapsulation layer further includes a third encapsulation portion surrounding the second encapsulation portion, the third encapsulation portion covering the surface of the substrate layer away from the display substrate, and the third encapsulation portion and the second encapsulation portion forming a second obtuse angle.

[0010] For example, in a display device provided in at least one embodiment of this disclosure, the third encapsulation portion includes at least one opening disposed around the at least one first component.

[0011] For example, in a display device provided in at least one embodiment of this disclosure, the at least one opening is planar or linear.

[0012] For example, in a display device provided in at least one embodiment of this disclosure, the circuit board further includes a second component disposed on the side of the substrate away from the display substrate, and the at least one opening includes a first opening disposed between the first component and the second component.

[0013] For example, in a display device provided in at least one embodiment of this disclosure, the at least one first component includes a first component and a second component, and the at least one opening includes a first opening, which is disposed between the first component and the second component.

[0014] For example, in a display device provided in at least one embodiment of this disclosure, the distance between the first component and the second component is less than or equal to 7 mm, and the first opening is linear.

[0015] For example, in a display device provided in at least one embodiment of this disclosure, the non-display side of the display substrate includes a bending area and a bonding area, the circuit board includes a flexible circuit board, the flexible circuit board is bonded to the bonding area, and the display device further includes: a second encapsulation layer, which at least covers the bending area and at least partially overlaps with the first encapsulation layer, wherein the first encapsulation layer includes a conductive layer and at least one insulating layer, and the edge of the conductive layer is at least flush with the edge of the at least one insulating layer.

[0016] For example, in a display device provided in at least one embodiment of this disclosure, the second encapsulation layer includes a first adhesive portion disposed on the display side, a second adhesive portion disposed on the bending region, and a third adhesive portion disposed on the non-display side. On the non-display side, the first encapsulation layer includes an edge portion on the side of the third adhesive portion away from the display substrate. The edge portion includes a first edge close to the second adhesive portion. In the direction away from the display substrate, the edge portion includes a first insulating layer, a conductive layer, and a second insulating layer. At the first edge, the conductive layer is flush with the second insulating layer and / or the first insulating layer.

[0017] For example, in a display device provided in at least one embodiment of this disclosure, the second encapsulation layer includes a first adhesive portion disposed on the display side, a second adhesive portion disposed on the bending region, and a third adhesive portion disposed on the non-display side. On the non-display side, the first encapsulation layer includes an edge portion of the third adhesive portion on the side away from the display substrate. The edge portion includes a first edge close to the second adhesive portion. In a direction away from the display substrate, the edge portion includes a first insulating layer, a conductive layer, and a second insulating layer. At the first edge, at least a portion of the conductive layer extends beyond the second insulating layer and / or the first insulating layer.

[0018] For example, in a display device provided in at least one embodiment of this disclosure, the conductive layer includes a first conductive portion extending beyond the second insulating layer, and the first conductive portion includes a through-hole.

[0019] For example, at least one embodiment of the display device provided in this disclosure further includes: a metal frame including a protrusion, wherein the protrusion is inserted into the through hole.

[0020] For example, in at least one embodiment of the display device provided in this disclosure, the through hole is circular.

[0021] For example, in a display device provided in at least one embodiment of this disclosure, the first conductive portion extends beyond the first insulating layer, and conductive adhesive is provided in the through hole and between the through hole and the third adhesive portion to connect the first conductive portion and the third adhesive portion.

[0022] For example, in at least one embodiment of the display device provided in this disclosure, the through hole is rectangular.

[0023] For example, in a display device provided in at least one embodiment of this disclosure, the conductive layer further includes a second conductive portion extending beyond the second insulating layer, and the first conductive portion and the second conductive portion are spaced apart. Attached Figure Description

[0024] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the accompanying drawings of the embodiments will be briefly described below. Obviously, the drawings described below only relate to some embodiments of this disclosure and are not intended to limit this disclosure.

[0025] Figure 1 is a schematic diagram of the non-display side of a display device provided in at least one embodiment of the present disclosure;

[0026] Figure 2 is a cross-sectional view of the display device in Figure 1 along line AA;

[0027] Figure 3 is a schematic diagram of the third encapsulation portion of the first encapsulation layer of a display device provided in at least one embodiment of the present disclosure;

[0028] Figure 4 is a partial cross-sectional schematic diagram of a display device provided in at least one embodiment of the present disclosure after the display substrate is bent.

[0029] Figure 5 is a cross-sectional schematic diagram of another part of the display device provided in at least one embodiment of the present disclosure after the display substrate is bent;

[0030] Figure 6 is a plan view of the edge portion of the first encapsulation layer of a display device provided in at least one embodiment of the present disclosure;

[0031] Figure 7 is a plan view of the first conductive portion of the first encapsulation layer of a display device provided in at least one embodiment of the present disclosure;

[0032] Figure 8 is a schematic diagram of the metal frame of a display device provided in at least one embodiment of the present disclosure; and

[0033] Figure 9 is another planar schematic diagram of the first conductive portion of the first encapsulation layer of a display device provided in at least one embodiment of the present disclosure. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0035] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as “comprising” or “including” mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as “connected” or “linked” are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as “upper,” “lower,” “left,” and “right” are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0036] The inventors of this disclosure discovered in their research that while thin and light display devices improve the feel of a slimmer device, the corresponding structural performance may also decrease, such as the pressing performance of the cover plate. When the operator presses the cover plate, it may cause problems such as abnormal noise when the product is pressed.

[0037] At least one embodiment of this disclosure provides a display device, the display device including a display substrate, a circuit board, a first encapsulation layer, and an encapsulation insulating layer; the display substrate has a display side and a non-display side; the circuit board is at least partially located on the non-display side, including a base layer located on the non-display side and at least one first component disposed on the base layer on a side away from the display substrate, wherein the at least one first component includes a first surface away from the base layer; the first encapsulation layer is disposed on the side of the circuit board away from the display substrate, including a first encapsulation portion located on the side of the first component away from the display substrate to cover the first surface and a second encapsulation portion located surrounding the first encapsulation portion; the encapsulation insulating layer is disposed on the side of the second encapsulation portion near the first component to space the second encapsulation portion and the first component.

[0038] In the display device provided in the embodiments of this disclosure, the second encapsulation portion corresponds to the side of the first component and has a certain gap with the side. The first encapsulation layer has a certain adhesiveness. The encapsulation insulating layer is disposed between the second encapsulation portion and the first component to space the second encapsulation portion and the first component. A glue-free area is formed between the encapsulation insulating layer and the first component to avoid the generation of "weak adhesion" (sometimes sticking and sometimes loosening) between the second encapsulation portion and the first component during the process of pressing the display substrate, thereby avoiding problems such as abnormal pressing noise caused by the above-mentioned "weak adhesion".

[0039] The display device provided in this disclosure will be described in detail below through several specific embodiments.

[0040] This disclosure provides a display device in at least one embodiment. FIG1 shows a schematic diagram of the non-display side of the display device, and FIG2 shows a cross-sectional schematic diagram of the display device in FIG1 along line AA. As shown in FIG1 and FIG2, the display device includes a display substrate 10, a circuit board 20, a first encapsulation layer 30, and an encapsulation insulating layer 40, etc.

[0041] As shown in Figure 2, the display substrate 10 has a display side DS and a non-display side NS, with the display side DS used for display. The display substrate 10 can be various types of display substrates, such as organic light-emitting display substrates, liquid crystal display substrates, and quantum dot display substrates. The embodiments of this disclosure do not limit the specific form of the display substrate 10.

[0042] As shown in Figure 2, the circuit board 20 is at least partially located on the non-display side NS, including a base layer 21 located on the non-display side NS and at least one first component 22 disposed on the side of the base layer 21 away from the display substrate 10. For example, the circuit board 20 can be a flexible circuit board, and the base layer 21 can include a stack of multiple conductive layers and multiple insulating layers to form multiple connection traces, ground traces, ground layers, etc.; the first component 22 can include integrated circuits (ICs), capacitors, resistors, and other electrical devices; the embodiments of this disclosure do not limit the specific form of the base layer 21 and the first component 22. As shown in Figure 2, the first component 22 includes a first surface 22A away from the base layer 21.

[0043] As shown in Figure 2, the first encapsulation layer 30 is disposed on the side of the circuit board 20 away from the display substrate 10, including a first encapsulation portion 31 located on the side of the first component 22 away from the display substrate 10 to cover the first surface 22A, and a second encapsulation portion 32 located around the first encapsulation portion 31. At this time, the second encapsulation portion 32 is adjacent to the first encapsulation portion 31 and corresponds to the side of the first component 22.

[0044] As shown in Figure 2, the encapsulation insulating layer 40 is disposed on the side of the second encapsulation portion 32 near the first component 22 to separate the second encapsulation portion 32 and the first component 22.

[0045] For example, the inner side of the first encapsulation layer 30 (the side closest to the first component 22) is typically adhesive to fix the first encapsulation layer 30 to the circuit board 20. Without the encapsulation insulating layer 40, during the pressing process of the display substrate, due to the thin and light design of the display device, the cover plate is relatively soft. Pressing the cover plate can cause it to deform, thereby compressing the internal structure of the display device. During the deformation and recovery process of the cover plate, the second encapsulation portion 32 and the first component 22 are prone to the aforementioned problem of sometimes sticking and sometimes loosening, resulting in abnormal pressing noise. By providing the encapsulation insulating layer 40, the second encapsulation portion 32 is spaced from the first component 22, forming a glue-free area between the encapsulation insulating layer 40 and the first component 22, thereby avoiding the aforementioned problems such as abnormal pressing noise.

[0046] For example, in some embodiments, as shown in FIG2, the first encapsulation layer 30 can be a composite layer, such as including a first insulating layer 341, a conductive layer 342, and a second insulating layer 343 stacked together. For example, the first insulating layer 341 and the second insulating layer 343 have adhesive properties, such as being adhesive layers, and can be acrylic adhesives or composite layers of organic insulating layers and adhesives, such as composite layers of polyester layers and acrylic adhesives. The polyester layer can be, for example, made of polyethylene terephthalate (PET), polycarbonate (PC), or other materials. The conductive layer 342 can be made of metal or alloy materials, such as copper, gold, etc. In some examples, the first encapsulation layer 30 can be implemented as a cover tape.

[0047] For example, in some embodiments, as shown in Figures 1 and 2, the encapsulation insulating layer 40 surrounds the first component 22 in a ring shape. Thus, by surrounding the first component 22, the encapsulation insulating layer 40 spaces the second encapsulation portion 32 from the first component 22 in all directions, further avoiding the aforementioned problems such as abnormal pressing noise.

[0048] For example, in some embodiments, as shown in FIG2, the first component 22 has a certain height, so the first encapsulation portion 31 and the second encapsulation portion 32 are at a certain angle, for example, a first obtuse angle α. At this time, the second encapsulation portion 32 and the side of the first component 22 have a certain gap, and the encapsulation insulating layer 40 is at least disposed in the gap.

[0049] For example, in some embodiments, the encapsulation insulating layer 40 comprises organic materials, such as polymeric materials like polyester, such as polyethylene terephthalate (PET), polycarbonate (PC), etc. For example, in some examples, the encapsulation insulating layer 40 can be attached to the second encapsulation portion 32 using an adhesive, such as an acrylic adhesive, to form a stable connection between the encapsulation insulating layer 40 and the second encapsulation portion 32, preventing the encapsulation insulating layer 40 from detaching due to repeated pressing of the display substrate. For example, in other embodiments, the encapsulation insulating layer 40 may also be made of suitable inorganic materials; the embodiments disclosed herein do not limit the specific form of the encapsulation insulating layer 40.

[0050] For example, in some embodiments, as shown in FIG2, the first encapsulation layer 30 further includes a third encapsulation portion 33 surrounding the second encapsulation portion 32. The third encapsulation portion 33 covers the surface 21A of the base layer 21 that is away from the display substrate 10. The third encapsulation portion 33 and the second encapsulation portion 32 form a second obtuse angle b. The size of the second obtuse angle b is substantially equal to the size of the first obtuse angle a. Since the first component 22 has a certain height, the first surface 22A of the first component 22 and the surface 21A of the base layer 21 that is away from the display substrate 10 have a certain step difference. An inclined second encapsulation portion 32 is formed between the first encapsulation portion 32 covering the first surface 22A and the third encapsulation portion 33 covering the surface 21A. The third encapsulation portion 33 and the second encapsulation portion 32 form a second obtuse angle b. At this time, the second encapsulation portion 32 and the side surface of the first component 22 form a gap with a triangular cross section as shown in FIG2. The encapsulation insulating layer 40 is disposed at least in this gap.

[0051] For example, in some embodiments, as shown in Figures 1 and 2, the circuit board 20 may further include a bonding region 35, which includes a plurality of contact pads, for example implemented in the form of gold fingers, for electrical connection with other circuit structures (e.g., the circuit structure of the display substrate 10). For example, a third encapsulation portion 33 may also cover the bonding region 35.

[0052] For example, in some embodiments, since the first component 22 has a certain height, the first encapsulation layer 30 protrudes from the third encapsulation portion 32 corresponding to the first component 22. This causes stress in the third encapsulation portion 33, making it prone to bulging or other phenomena around the first component 22. The bulging location typically contacts the metal frame of the display substrate. During the pressing process of the display device, the metal frame also deforms, resulting in a pressing noise. To release / alleviate this stress and avoid bulging and pressing noise, the first encapsulation layer 30 can be optimized. For example, the third encapsulation portion 33 may include at least one opening around the first component 22, which can release / alleviate the aforementioned stress.

[0053] For example, Figure 3 shows a schematic diagram of the third encapsulation portion 33 including an opening 24. In some embodiments, as shown in Figure 3, at least one opening 24 may be planar (i.e., having a certain area) or linear (a shape with a length much greater than its width, and an area very small or close to 0).

[0054] For example, at least one opening 24 may include multiple openings. Figure 3 shows at least one opening 24 including a first opening 241, a second opening 242, and a third opening 243 as an example. In this example, the first opening 241 is linear, the second opening 242 is planar, for example, rectangular, and the third opening 243 is linear. Multiple openings 24 can improve the problem of high surrounding stress caused by the protrusion of the first package portion 32 around the first component 22, and thus also improve the "bulging" phenomenon and the aforementioned pressing noise problem.

[0055] For example, in some embodiments, as shown in FIG3, the at least one first component 22 includes a first component 22 and a second component 23, or the circuit board 20 further includes a second component 23 disposed on the side of the substrate 21 away from the display substrate 10, and a first opening 241 is disposed between the first component 22 and the second component 23. For example, the first opening 241 extends linearly along the edge of the first component 22 or the second component 23.

[0056] For example, in some embodiments, the distance D1 between the first component 22 and the second component is less than or equal to 7 mm. In this case, the first opening 241 is linear, which can ensure that the third encapsulation portion 33 between the first component 22 and the second component is tightly bonded to the surface 21A, and at the same time, it can achieve the function of stress relief. For example, in this embodiment, the linear shape of the first opening 241 can also be a linear shape caused by the cutting of the third encapsulation portion 33. In this case, the area of ​​the first opening 241 can be close to 0. For example, in some embodiments, the linear shape can also be in the form of a seam line / dotted line. In this case, the opening of the third encapsulation portion 33 is periodically interrupted to simultaneously ensure the encapsulation function and stress relief function of the third encapsulation portion 33.

[0057] For example, in some embodiments, as shown in FIG1, the first encapsulation layer 30 also covers the second component 23, and the form in which the first encapsulation layer 30 covers the second component 23 is basically the same as the form in which the first encapsulation layer 30 covers the first component 22. In this case, an encapsulation insulating layer 40 can also be provided around the second component 23 to avoid problems such as abnormal pressing noises near the second component 23. For example, the way the encapsulation insulating layer 40 is set around the second component 23 is basically the same as the way the encapsulation insulating layer 40 is set around the first component 22, and will not be described again here.

[0058] For example, in some other embodiments, the arrangement of the second component 23 may be different from that of the first component 22; for example, the first encapsulation layer 30 covers the second component 23, and no encapsulation insulation layer 40 is provided around the second component 23, or the second component 23 may be covered by other encapsulation layers, and an encapsulation insulation layer 40 is provided around it. The embodiments disclosed herein do not specifically limit this.

[0059] For example, in some embodiments, the circuit board 20 may include more components, and the first encapsulation layer 30 covers these components. These components may be of the same type or different types. In this case, an encapsulation insulating layer 40 may be provided around each component. The way the encapsulation insulating layer 40 is set can be referred to the way the encapsulation insulating layer 40 around the first component 22 is set, and will not be repeated here.

[0060] For example, Figure 4 shows a cross-sectional view of the display substrate after bending. In some embodiments, in conjunction with Figures 1 and 4, the non-display side NS of the display substrate 10 includes a bending region 20B and a bonding region 20A, and the circuit board 20 includes a flexible circuit board, which is bonded to the bonding region 20A.

[0061] For example, as shown in FIG4, the display device may further include a second encapsulation layer 50, which at least covers the bending region 20B and at least partially overlaps with the first encapsulation layer 30. The first encapsulation layer 30 includes a conductive layer 342 and at least one insulating layer 341 / 343, the edge of the conductive layer 342 being at least flush with the edge of the at least one insulating layer 341 / 343.

[0062] For example, as shown in Figure 4, the second encapsulation layer 50 includes a first adhesive portion 50A located on the display side DS, a second adhesive portion 50B located on the bending region 20B, and a third adhesive portion 50C located on the non-display side NS. The second encapsulation layer 50 can provide bending protection and prevent environmental factors such as moisture, oxygen, and temperature changes from damaging the display substrate 10 and the circuit board 20.

[0063] For example, in some embodiments, the second encapsulation layer 50 may be implemented as an MCL (Micro Coating Layer) adhesive.

[0064] For example, in some embodiments, to achieve a thinner display device, the thickness of the second encapsulation layer 50 can be designed to be relatively small, for example, 45μm to 95μm, such as 45μm, 50μm, 60μm, 70μm, 80μm, or 95μm. Testing has shown that reducing the thickness of the second encapsulation layer 50 may affect the electrostatic discharge (ESD) performance of the display device. Therefore, it is necessary to redesign certain aspects of the display device's structure to improve its ESD performance.

[0065] For example, in some embodiments, as shown in FIG4, on the non-display side NS, the first encapsulation layer 30 includes an edge portion 34 located on the side of the third adhesive portion 50C away from the display substrate 10. The edge portion 34 includes a first edge 34A near the second adhesive portion 50B. In the direction away from the display substrate 10, the edge portion 34 includes a first insulating layer 341, a conductive layer 342, and a second insulating layer 343. At the first edge 34A, the conductive layer 342 is flush with the first insulating layer 341 and / or the second insulating layer 343. Thus, the edge of the conductive layer 342 is exposed.

[0066] For example, in some embodiments, as shown in FIG4, at the first edge 34A, the conductive layer 342 is flush with the first insulating layer 341, or the conductive layer 342 is flush with the second insulating layer 343, or the conductive layer 342 is flush with both the first insulating layer 341 and the second insulating layer 343. In this case, the edge portion 34 as a whole has a flush edge, so that the edge of the conductive layer 342 is fully exposed.

[0067] In the embodiments of this disclosure, by arranging the conductive layer 342 flush with the insulating layer, static electricity applied to the non-display side is more easily conducted through the exposed conductive layer 342 and grounded. For example, after the display device is manufactured, when performance testing is performed using an electrostatic gun, the electricity applied by the electrostatic gun will more easily enter the conductive layer 342, and then the conductive layer 342 will conduct the electricity to a grounding point or other suitable grounding point in the display substrate, thereby improving the electrostatic discharge performance of the display device.

[0068] For example, in other embodiments, the conductive layer 342 may also be designed to extend beyond the insulating layer. For example, as shown in FIG5, at the first edge 34A, at least a portion of the conductive layer 342 extends beyond the second insulating layer 343 and / or the first insulating layer 341. The conductive layer 342 extending beyond the second insulating layer 343 conducts static electricity more easily, thereby further improving the electrostatic discharge performance of the display device.

[0069] For example, as shown in FIG5, at least a portion of the conductive layer 342 extends beyond the first insulating layer 341 at the first edge 34A, or at least a portion of the conductive layer 342 extends beyond the second insulating layer 343, or at least a portion of the conductive layer 342 extends beyond both the first insulating layer 341 and the second insulating layer 343. Thus, more of the conductive layer 342 is exposed, making it easier to conduct static electricity, thereby further improving the electrostatic discharge performance of the display device.

[0070] For example, Figure 6 shows a schematic planar structure of the edge portion of the first encapsulation layer 30. As shown in Figure 6, in some embodiments, the conductive layer 342 includes a first conductive portion 61 extending beyond the second insulating layer 343. The first conductive portion 61 may be provided, for example, in a part of the display device that is prone to static electricity generation, to improve the static discharge performance of that part.

[0071] For example, in some examples, as shown in FIG6, the conductive layer 342 may further include a second conductive portion 62 extending beyond the second insulating layer 343, with the first conductive portion 61 and the second conductive portion 62 spaced apart, thereby improving the electrostatic discharge performance at multiple locations.

[0072] For example, in some embodiments, the conductive layer 342 may further include more conductive portions beyond the second insulating layer 343, which can be configured according to requirements. The embodiments of this disclosure do not limit the number of conductive portions. For example, FIG6 also shows a third conductive portion 63, with the first conductive portion 61, the second conductive portion 62, and the third conductive portion 63 spaced apart. Thus, multiple conductive portions can improve electrostatic discharge performance at more locations.

[0073] For example, Figure 7 shows a plan view of the first conductive portion. In some embodiments, as shown in Figure 7, the first conductive portion 61 may include a through hole 61A. For example, the through hole 61A can be used to connect other components to achieve functions such as electrostatic conduction and structural connection.

[0074] For example, in some embodiments, the display device further includes a metal frame. For instance, FIG8 shows a schematic diagram of the structure of the metal frame. As shown in FIG8, the metal frame 70 includes a protrusion 71 that can be inserted into a through hole 61A. Thus, static electricity on the first conductive portion 61 can be conducted to the metal frame 70 through the through hole 61A and the protrusion 71, and then grounded through the metal frame 70, thereby improving the electrostatic discharge performance.

[0075] For example, in the above embodiments, the through hole 61A can be circular and the protrusion 71 can be cylindrical, which helps to align and connect the through hole 61A and the protrusion 71 during the manufacturing process.

[0076] For example, Figure 9 shows another planar schematic diagram of the first conductive portion. In some other embodiments, the first conductive portion 61 extends beyond the first insulating layer 341, and there is a gap between the first conductive portion 61 and the third adhesive portion 50C of the second encapsulation layer 50. For example, conductive adhesive 80 is provided in the through hole 61A of the first conductive portion 61 and between the through hole 61A and the third adhesive portion 50C to connect the first conductive portion 61 and the third adhesive portion 50C, thereby achieving conductivity.

[0077] For example, in the embodiment of FIG9, the through hole 61A can be rectangular, and the rectangular area is larger. This facilitates the application of adhesive to the area between the first conductive part 61 and the third adhesive part 50C through the through hole 61A during the preparation process, and makes the adhesive fully fill the gap between the first conductive part 61 and the third adhesive part 50C, so as to improve the connection effect and conductivity.

[0078] For example, in some embodiments, when the conductive layer 342 includes multiple conductive portions, some or all of the multiple conductive portions may be provided with the above-mentioned through holes 61A. For example, in the embodiment shown in FIG6, through holes 61A may also be provided in the second conductive portion 62 and the third conductive portion 63, and the through hole 61A is provided in a manner similar to that of the first conductive portion 61 to achieve the above-mentioned technical effect.

[0079] The embodiments disclosed herein do not limit the specific structure of the display substrate 10. For example, in the stacked structure shown in FIG4 and FIG5, the display substrate 10 may include a substrate 106 (e.g., the substrate 106 may include a substrate and a driving circuit layer and a light-emitting device layer disposed on the substrate, etc.), a substrate 101 (e.g., an extension of the substrate 106, which is connected to the non-display side by bending, and which does not have functional structures such as light-emitting devices), heat dissipation layers 103-105 (e.g., including copper foil 103, foam 104 and adhesive layer 105 to achieve heat dissipation), a spacer layer 102 (e.g., having double-sided adhesive, with its two sides respectively attached to the substrate 101 and the copper foil 103), a polarizer 107 and an adhesive layer 108 (e.g., optically transparent adhesive OCA), etc., and a cover plate 60 is covered on the adhesive layer 108, which may be, for example, a glass cover plate.

[0080] For example, in other embodiments, the display substrate 10 may also have other suitable stacked structures, which will not be described in detail here.

[0081] At least one embodiment of this disclosure also provides a display device. Referring to Figures 2 and 3, the display device includes a display substrate 10, a circuit board 20, and a first encapsulation layer 30. The display substrate 10 has a display side DS and a non-display side NS. The circuit board 20 is at least partially located on the non-display side NS and includes a base layer 21 located on the non-display side NS and at least one first component 22 disposed on the side of the base layer 21 away from the display substrate 10. The at least one first component 22 includes a first surface 22A away from the base layer 21. The first encapsulation layer 30 is disposed on the side of the circuit board 20 away from the display substrate 10 and includes a first encapsulation portion 31 located on the side of the first component 22 away from the display substrate 10 to cover the first surface 22A, a second encapsulation portion 32 surrounding the first encapsulation portion 31, and a third encapsulation portion 33 at least partially surrounding the second encapsulation portion 32. The third encapsulation portion 33 covers the surface 21A of the base layer 21 away from the display substrate 10 and includes at least one opening 24 disposed around the first component 22.

[0082] For example, the circuit board 20 can be a flexible circuit board, and the base layer 21 can include a stack of multiple conductive layers and multiple insulating layers to form multiple connection traces, ground traces, ground layers, etc.; the first component 22 can include integrated circuits (ICs), capacitors, resistors and other electrical devices; the embodiments of this disclosure do not limit the specific form of the base layer 21 and the first component 22.

[0083] For example, in some embodiments, as shown in FIG3, at least one opening 24 may be planar (i.e., having a certain area) or linear (a shape whose length is much greater than its width, and whose area is very small or close to 0).

[0084] For example, at least one opening 24 may include multiple openings. Figure 3 shows at least one opening 24 including a first opening 241, a second opening 242, and a third opening 243 as an example. In this example, the first opening 241 is linear, the second opening 242 is planar, for example, rectangular, and the third opening 243 is linear. Multiple openings 24 can improve the problem of high surrounding stress caused by the protrusion of the first package portion 32 around the first component 22, and thus also improve the "bulging" phenomenon and the aforementioned pressing noise problem.

[0085] For example, in some embodiments, as shown in FIG3, the circuit board 20 further includes a second component 23 disposed on the side of the substrate 21 away from the display substrate 10, and a first opening 241 is disposed between the first component 22 and the second component 23. For example, the first opening 241 extends linearly along the edge of the first component 22 or the second component 23.

[0086] For example, in some embodiments, the distance D1 between the first component 22 and the second component is less than or equal to 7 mm. In this case, the first opening 241 is linear, which can ensure that the third encapsulation portion 33 between the first component 22 and the second component is tightly bonded to the surface 21A, and at the same time, it can achieve the function of stress relief. For example, in this embodiment, the linear shape of the first opening 241 can also be a linear shape caused by the cutting of the third encapsulation portion 33. In this case, the area of ​​the first opening 241 can be close to 0. For example, in some embodiments, the linear shape can also be in the form of a seam line / dotted line. In this case, the opening of the third encapsulation portion 33 is periodically interrupted to simultaneously ensure the encapsulation function and stress relief function of the third encapsulation portion 33.

[0087] For example, in some embodiments, referring to FIG1, the first encapsulation layer 30 also covers the second component 23, and the form in which the first encapsulation layer 30 covers the second component 23 is basically the same as the form in which the first encapsulation layer 30 covers the first component 22. In this case, an encapsulation insulating layer 40 can also be provided around the second component 23 to avoid problems such as abnormal pressing noise near the second component 23. For example, the way the encapsulation insulating layer 40 is set around the second component 23 is basically the same as the way the encapsulation insulating layer 40 is set around the first component 22, and will not be described again here.

[0088] For example, in some embodiments, as shown in FIG2, the display device may further include an encapsulation insulating layer 40 disposed on the side of the second encapsulation portion 32 near the first component 22 to space the second encapsulation portion 32 and the first component 22.

[0089] For example, the inner side of the first encapsulation layer 30 (the side closest to the first component 22) is typically adhesive to fix the first encapsulation layer 30 to the circuit board 20. Without the encapsulation insulating layer 40, during the pressing process of the display substrate, due to the thin and light design of the display device, the cover plate is relatively soft. Pressing the cover plate can cause it to deform, thereby compressing the internal structure of the display device. During the deformation and recovery process of the cover plate, the second encapsulation portion 32 and the first component 22 are prone to the aforementioned problem of sometimes sticking and sometimes loosening, resulting in abnormal pressing noise. By providing the encapsulation insulating layer 40, the second encapsulation portion 32 is spaced from the first component 22, forming a glue-free area between the encapsulation insulating layer 40 and the first component 22, thereby avoiding the aforementioned problems such as abnormal pressing noise.

[0090] For example, in some embodiments, as shown in FIG2, the first encapsulation layer 30 can be a composite layer, such as including a first insulating layer 341, a conductive layer 342, and a second insulating layer 343 stacked together. For example, the first insulating layer 341 and the second insulating layer 343 have adhesive properties, such as being adhesive layers, and can be acrylic adhesives or composite layers of organic insulating layers and adhesives, such as composite layers of polyester layers and acrylic adhesives. The polyester layer can be, for example, made of polyethylene terephthalate (PET), polycarbonate (PC), or other materials. The conductive layer 342 can be made of metal or alloy materials, such as copper, gold, etc. In some examples, the first encapsulation layer 30 can be implemented as a cover tape.

[0091] For example, in some embodiments, as shown in Figures 1 and 2, the encapsulation insulating layer 40 surrounds the first component 22 in a ring shape. Thus, by surrounding the first component 22, the encapsulation insulating layer 40 spaces the second encapsulation portion 32 from the first component 22 in all directions, further avoiding the aforementioned problems such as abnormal pressing noise.

[0092] For example, in some embodiments, as shown in FIG2, the first component 22 has a certain height, so the first encapsulation portion 31 and the second encapsulation portion 32 are at a certain angle, for example, a first obtuse angle α. At this time, the second encapsulation portion 32 and the side of the first component 22 have a certain gap, and the encapsulation insulating layer 40 is at least disposed in the gap.

[0093] For example, in some embodiments, as shown in FIG2, the third encapsulation portion 33 and the second encapsulation portion 32 form a second obtuse angle b. The size of the second obtuse angle b is approximately equal to the size of the first obtuse angle a. Since the first component 22 has a certain height, the first surface 22A of the first component 22 and the surface 21A of the substrate 21 that is away from the display substrate 10 have a certain step difference. An inclined second encapsulation portion 32 is formed between the first encapsulation portion 32 covering the first surface 22A and the third encapsulation portion 33 covering the surface 21A. The third encapsulation portion 33 and the second encapsulation portion 32 form a second obtuse angle b. At this time, the second encapsulation portion 32 and the side surface of the first component 22 form a gap with a triangular cross section as shown in FIG2. The encapsulation insulating layer 40 is at least disposed in this gap.

[0094] For example, in some embodiments, the encapsulation insulating layer 40 comprises organic materials, such as polymeric materials like polyester, such as polyethylene terephthalate (PET), polycarbonate (PC), etc. For example, in some examples, the encapsulation insulating layer 40 can be attached to the second encapsulation portion 32 using an adhesive, such as an acrylic adhesive, to form a stable connection between the encapsulation insulating layer 40 and the second encapsulation portion 32, preventing the encapsulation insulating layer 40 from detaching due to repeated pressing of the display substrate. For example, in other embodiments, the encapsulation insulating layer 40 may also be made of suitable inorganic materials; the embodiments disclosed herein do not limit the specific form of the encapsulation insulating layer 40.

[0095] For example, in some embodiments, as shown in Figures 1 and 2, the circuit board 20 may further include a bonding region 35, which includes a plurality of contact pads, for example implemented in the form of gold fingers, for electrical connection with other circuit structures. For example, a third package portion 33 may also cover the bonding region 35.

[0096] For example, in some embodiments, referring to Figures 1 and 4, the non-display side NS of the display substrate 10 includes a bending region 20B and a bonding region 20A, and the circuit board 20 includes a flexible circuit board bonded to the bonding region 20A.

[0097] For example, as shown in FIG4, the display device may further include a second encapsulation layer 50, which at least covers the bending region 20B and at least partially overlaps with the first encapsulation layer 30. The first encapsulation layer 30 includes a conductive layer 342 and at least one insulating layer 341 / 343, the edge of the conductive layer 342 being at least flush with the edge of the at least one insulating layer 341 / 343.

[0098] For example, as shown in FIG4, the second encapsulation layer 50 includes a first adhesive portion 50A located on the display side DS, a second adhesive portion 50B located on the bending region 20B, and a third adhesive portion 50C located on the non-display side NS. The second encapsulation layer 50 can provide bending protection and prevent environmental factors such as moisture, oxygen, and temperature changes from damaging the display substrate 10 and the circuit board 20. For example, in some embodiments, the second encapsulation layer 50 can be implemented as MCL (Micro Coating Layer) adhesive.

[0099] For example, in some embodiments, to achieve a thinner display device, the thickness of the second encapsulation layer 50 can be designed to be relatively small, for example, 45μm to 95μm, such as 45μm, 50μm, 60μm, 70μm, 80μm, or 95μm. Testing has shown that reducing the thickness of the second encapsulation layer 50 may affect the electrostatic discharge (ESD) performance of the display device. Therefore, it is necessary to redesign certain aspects of the display device's structure to improve its ESD performance.

[0100] For example, in some embodiments, as shown in FIG4, on the non-display side NS, the first encapsulation layer 30 includes an edge portion 34 located on the side of the third adhesive portion 50C away from the display substrate 10. The edge portion 34 includes a first edge 34A near the second adhesive portion 50B. In the direction away from the display substrate 10, the edge portion 34 includes a first insulating layer 341, a conductive layer 342, and a second insulating layer 343. At the first edge 34A, the conductive layer 342 is flush with the first insulating layer 341 and / or the second insulating layer 343. Thus, the edge of the conductive layer 342 is exposed.

[0101] For example, in some embodiments, as shown in FIG4, at the first edge 34A, the conductive layer 342 is flush with the first insulating layer 341, or the conductive layer 342 is flush with the second insulating layer 343, or the conductive layer 342 is flush with both the first insulating layer 341 and the second insulating layer 343. In this case, the edge portion 34 as a whole has a flush edge, so that the edge of the conductive layer 342 is fully exposed.

[0102] With the conductive layer 342 flush with the insulating layer, static electricity applied to the non-display side is more easily conducted through the exposed conductive layer 342 and grounded. For example, after the display device is manufactured, when performance testing is performed using an electrostatic gun, the electricity applied by the electrostatic gun will more easily enter the conductive layer 342, and then the conductive layer 342 will conduct the electricity to the grounding point in the display substrate or other suitable grounding point, thereby improving the electrostatic discharge performance of the display device.

[0103] For example, in other embodiments, the conductive layer 342 may also be designed to extend beyond the insulating layer. For example, as shown in FIG5, at the first edge 34A, at least a portion of the conductive layer 342 extends beyond the second insulating layer 343 and / or the first insulating layer 341. The conductive layer 342 extending beyond the second insulating layer 343 conducts static electricity more easily, thereby further improving the electrostatic discharge performance of the display device.

[0104] For example, as shown in FIG5, at least a portion of the conductive layer 342 extends beyond the first insulating layer 341 at the first edge 34A, or at least a portion of the conductive layer 342 extends beyond the second insulating layer 343, or at least a portion of the conductive layer 342 extends beyond both the first insulating layer 341 and the second insulating layer 343. Thus, more of the conductive layer 342 is exposed, making it easier to conduct static electricity, thereby further improving the electrostatic discharge performance of the display device.

[0105] For example, in some embodiments, as shown in FIG6, the conductive layer 342 includes a first conductive portion 61 extending beyond the second insulating layer 343. The first conductive portion 61 may be disposed, for example, in a part of the display device that is prone to generating static electricity, to improve the static discharge performance of that part.

[0106] For example, in some examples, as shown in FIG6, the conductive layer 342 may further include a second conductive portion 62 extending beyond the second insulating layer 343, with the first conductive portion 61 and the second conductive portion 62 spaced apart, thereby improving the electrostatic discharge performance at multiple locations.

[0107] For example, in some embodiments, the conductive layer 342 may further include more conductive portions beyond the second insulating layer 343, which can be configured according to requirements. The embodiments of this disclosure do not limit the number of conductive portions. For example, FIG6 also shows a third conductive portion 63, with the first conductive portion 61, the second conductive portion 62, and the third conductive portion 63 spaced apart. Thus, multiple conductive portions can improve electrostatic discharge performance at more locations.

[0108] For example, in some embodiments, as shown in FIG7, the first conductive portion 61 may include a through hole 61A. For example, the through hole 61A can be used to connect other components to achieve functions such as electrostatic conduction and structural connection.

[0109] For example, in some embodiments, the display device further includes a metal frame. For instance, FIG8 shows a schematic diagram of the structure of the metal frame. As shown in FIG8, the metal frame 70 includes a protrusion 71 that can be inserted into a through hole 61A. Thus, static electricity on the first conductive portion 61 can be conducted to the metal frame 70 through the through hole 61A and the protrusion 71, and then grounded through the metal frame 70, thereby improving the electrostatic discharge performance.

[0110] For example, in the above embodiments, the through hole 61A can be circular and the protrusion 71 can be cylindrical, which helps to align and connect the through hole 61A and the protrusion 71 during the manufacturing process.

[0111] For example, in some other embodiments, the first conductive portion 61 extends beyond the first insulating layer 341, and there is a gap between the first conductive portion 61 and the third adhesive portion 50C of the second encapsulation layer 50. For example, conductive adhesive 80 is provided in the through hole 61A of the first conductive portion 61 and between the through hole 61A and the third adhesive portion 50C to connect the first conductive portion 61 and the third adhesive portion 50C, thereby achieving conductivity.

[0112] For example, in the embodiment of FIG9, the through hole 61A can be rectangular, and the rectangular area is larger. This facilitates the application of adhesive to the area between the first conductive part 61 and the third adhesive part 50C through the through hole 61A during the preparation process, and makes the adhesive fully fill the gap between the first conductive part 61 and the third adhesive part 50C, so as to improve the connection effect and conductivity.

[0113] For example, in some embodiments, when the conductive layer 342 includes multiple conductive portions, some or all of the multiple conductive portions may be provided with the above-mentioned through holes 61A. For example, in the embodiment shown in FIG6, through holes 61A may also be provided in the second conductive portion 62 and the third conductive portion 63, and the through hole 61A is provided in a manner similar to that of the first conductive portion 61 to achieve the above-mentioned technical effect.

[0114] At least one embodiment of this disclosure also provides a display device, which includes a display substrate 10 and a circuit board 20. As shown in FIG2, the display substrate 10 has a display side DS and a non-display side NS. The display side DS is used for display, and the circuit board 20 is at least partially located on the non-display side NS. Referring to FIGS. 1 and 4, the non-display side NS of the display substrate 10 includes a bending region 20B and a bonding region 20A. The circuit board 20 includes a flexible circuit board, which is bonded to the bonding region 20A.

[0115] For example, as shown in FIG4, the display device may further include a second encapsulation layer 50, which at least covers the bending region 20B and at least partially overlaps with the first encapsulation layer 30. The first encapsulation layer 30 includes a conductive layer 342 and at least one insulating layer 341 / 343, the edge of the conductive layer 342 being at least flush with the edge of the at least one insulating layer 341 / 343.

[0116] For example, as shown in FIG4, the second encapsulation layer 50 includes a first adhesive portion 50A located on the display side DS, a second adhesive portion 50B located on the bending region 20B, and a third adhesive portion 50C located on the non-display side NS. The second encapsulation layer 50 can provide bending protection and prevent environmental factors such as moisture, oxygen, and temperature changes from damaging the display substrate 10 and the circuit board 20. For example, in some embodiments, the second encapsulation layer 50 can be implemented as MCL (Micro Coating Layer) adhesive.

[0117] For example, in some embodiments, to achieve a thinner display device, the thickness of the second encapsulation layer 50 can be designed to be relatively small, for example, 45μm to 95μm, such as 45μm, 50μm, 60μm, 70μm, 80μm, or 95μm. Testing has shown that reducing the thickness of the second encapsulation layer 50 may affect the electrostatic discharge (ESD) performance of the display device. Therefore, it is necessary to redesign certain aspects of the display device's structure to improve its ESD performance.

[0118] For example, in some embodiments, as shown in FIG4, on the non-display side NS, the first encapsulation layer 30 includes an edge portion 34 located on the side of the third adhesive portion 50C away from the display substrate 10. The edge portion 34 includes a first edge 34A near the second adhesive portion 50B. In the direction away from the display substrate 10, the edge portion 34 includes a first insulating layer 341, a conductive layer 342, and a second insulating layer 343. At the first edge 34A, the conductive layer 342 is flush with the first insulating layer 341 and / or the second insulating layer 343. Thus, the edge of the conductive layer 342 is exposed.

[0119] For example, in some embodiments, as shown in FIG4, at the first edge 34A, the conductive layer 342 is flush with the first insulating layer 341, or the conductive layer 342 is flush with the second insulating layer 343, or the conductive layer 342 is flush with both the first insulating layer 341 and the second insulating layer 343. In this case, the edge portion 34 as a whole has a flush edge, so that the edge of the conductive layer 342 is fully exposed.

[0120] With the conductive layer 342 flush with the insulating layer, static electricity applied to the non-display side is more easily conducted through the exposed conductive layer 342 and grounded. For example, after the display device is manufactured, when performance testing is performed using an electrostatic gun, the electricity applied by the electrostatic gun will more easily enter the conductive layer 342, and then the conductive layer 342 will conduct the electricity to the grounding point in the display substrate or other suitable grounding point, thereby improving the electrostatic discharge performance of the display device.

[0121] For example, in other embodiments, the conductive layer 342 may also be designed to extend beyond the insulating layer. For example, as shown in FIG5, at the first edge 34A, at least a portion of the conductive layer 342 extends beyond the second insulating layer 343 and / or the first insulating layer 341. The conductive layer 342 extending beyond the second insulating layer 343 conducts static electricity more easily, thereby further improving the electrostatic discharge performance of the display device.

[0122] For example, as shown in FIG5, at least a portion of the conductive layer 342 extends beyond the first insulating layer 341 at the first edge 34A, or at least a portion of the conductive layer 342 extends beyond the second insulating layer 343, or at least a portion of the conductive layer 342 extends beyond both the first insulating layer 341 and the second insulating layer 343. Thus, more of the conductive layer 342 is exposed, making it easier to conduct static electricity, thereby further improving the electrostatic discharge performance of the display device.

[0123] For example, in some embodiments, as shown in FIG6, the conductive layer 342 includes a first conductive portion 61 extending beyond the second insulating layer 343. The first conductive portion 61 may be disposed, for example, in a part of the display device that is prone to generating static electricity, to improve the static discharge performance of that part.

[0124] For example, in some examples, as shown in FIG6, the conductive layer 342 may further include a second conductive portion 62 extending beyond the second insulating layer 343, with the first conductive portion 61 and the second conductive portion 62 spaced apart, thereby improving the electrostatic discharge performance at multiple locations.

[0125] For example, in some embodiments, the conductive layer 342 may further include more conductive portions beyond the second insulating layer 343, which can be configured according to requirements. The embodiments of this disclosure do not limit the number of conductive portions. For example, FIG6 also shows a third conductive portion 63, with the first conductive portion 61, the second conductive portion 62, and the third conductive portion 63 spaced apart. Thus, multiple conductive portions can improve electrostatic discharge performance at more locations.

[0126] For example, in some embodiments, as shown in FIG7, the first conductive portion 61 may include a through hole 61A. For example, the through hole 61A can be used to connect other components to achieve functions such as electrostatic conduction and structural connection.

[0127] For example, in some embodiments, the display device further includes a metal frame. For instance, FIG8 shows a schematic diagram of the structure of the metal frame. As shown in FIG8, the metal frame 70 includes a protrusion 71 that can be inserted into a through hole 61A. Thus, static electricity on the first conductive portion 61 can be conducted to the metal frame 70 through the through hole 61A and the protrusion 71, and then grounded through the metal frame 70, thereby improving the electrostatic discharge performance.

[0128] For example, in the above embodiments, the through hole 61A can be circular and the protrusion 71 can be cylindrical, which helps to align and connect the through hole 61A and the protrusion 71 during the manufacturing process.

[0129] For example, in some other embodiments, the first conductive portion 61 extends beyond the first insulating layer 341, and there is a gap between the first conductive portion 61 and the third adhesive portion 50C of the second encapsulation layer 50. For example, conductive adhesive 80 is provided in the through hole 61A of the first conductive portion 61 and between the through hole 61A and the third adhesive portion 50C to connect the first conductive portion 61 and the third adhesive portion 50C, thereby achieving conductivity.

[0130] For example, in the embodiment of FIG9, the through hole 61A can be rectangular, and the rectangular area is larger. This facilitates the application of adhesive to the area between the first conductive part 61 and the third adhesive part 50C through the through hole 61A during the preparation process, and makes the adhesive fully fill the gap between the first conductive part 61 and the third adhesive part 50C, so as to improve the connection effect and conductivity.

[0131] For example, in some embodiments, when the conductive layer 342 includes multiple conductive portions, some or all of the multiple conductive portions may be provided with the above-mentioned through holes 61A. For example, in the embodiment shown in FIG6, through holes 61A may also be provided in the second conductive portion 62 and the third conductive portion 63, and the through hole 61A is provided in a manner similar to that of the first conductive portion 61 to achieve the above-mentioned technical effect.

[0132] The following points also need to be explained:

[0133] (1) The accompanying drawings of the embodiments of this disclosure only involve the structures involved in the embodiments of this disclosure, and other structures can be referred to the general design.

[0134] (2) For clarity, the thickness of layers or regions is enlarged or reduced in the drawings used to describe embodiments of the present disclosure, i.e., these drawings are not drawn to actual scale. It will be understood that when an element such as a layer, film, region or substrate is referred to as being “above” or “below” another element, the element may be “directly” located “above” or “below” the other element or there may be intermediate elements.

[0135] (3) Where there is no conflict, the embodiments of this disclosure and the features in the embodiments can be combined with each other to obtain new embodiments.

[0136] The above are merely specific embodiments of this disclosure, but the scope of protection of this disclosure is not limited thereto. The scope of protection of this disclosure shall be determined by the scope of the claims.

Claims

A display device, comprising: The display substrate has a display side and a non-display side. A circuit board, at least partially located on the non-display side, includes a base layer located on the non-display side and at least one first component disposed on the base layer on a side away from the display substrate, wherein the at least one first component includes a first surface away from the base layer. A first encapsulation layer, disposed on the side of the circuit board away from the display substrate, includes a first encapsulation portion located on the side of the first component away from the display substrate to cover the first surface, and a second encapsulation portion located surrounding the first encapsulation portion. An encapsulation insulating layer is disposed on the side of the second encapsulation portion closer to the first component, so as to separate the second encapsulation portion and the first component. The display device according to claim 1, wherein, The encapsulation insulating layer surrounds the first component in a ring shape. The display device according to claim 1 or 2, wherein, The first encapsulation portion and the second encapsulation portion form a first obtuse angle. The display device according to any one of claims 1-3, wherein, The encapsulation insulating layer comprises organic materials. The display device according to any one of claims 1-4, wherein, The first encapsulation layer further includes a third encapsulation portion surrounding the second encapsulation portion, the third encapsulation portion covering the surface of the substrate layer remote from the display substrate. The third encapsulation portion and the second encapsulation portion form a second obtuse angle. The display device according to claim 5, wherein, The third packaging portion includes at least one opening disposed around the at least one first component. The display device according to claim 6, wherein, The at least one opening is planar or linear. The display device according to claim 6, wherein, The circuit board also includes a second component disposed on the side of the substrate layer away from the display substrate. The at least one opening includes a first opening, which is disposed between the first component and the second component. The display device according to claim 6, wherein, The at least one first component includes a first component and a second component, and the at least one opening includes a first opening, which is disposed between the first component and the second component. The display device according to claim 9, wherein, The distance between the first component and the second component is less than or equal to 7 mm, and the first opening is linear. The display device according to any one of claims 1-10, wherein, The non-display side of the display substrate includes a bending area and a bonding area, and the circuit board includes a flexible circuit board, which is bonded to the bonding area. The display device further includes: The second encapsulation layer at least covers the bending area and at least partially overlaps with the first encapsulation layer. The first encapsulation layer includes a conductive layer and at least one insulating layer, wherein the edge of the conductive layer is at least flush with the edge of the at least one insulating layer. The display device according to claim 11, wherein, The second encapsulation layer includes a first adhesive portion located on the display side, a second adhesive portion located in the bending area, and a third adhesive portion located on the non-display side. On the non-display side, the first encapsulation layer includes an edge portion located on the side of the third adhesive portion away from the display substrate, and the edge portion includes a first edge close to the second adhesive portion. In a direction away from the display substrate, the edge portion includes a first insulating layer, a conductive layer, and a second insulating layer. At the first edge, the conductive layer is flush with the second insulating layer and / or the first insulating layer. The display device according to claim 11, wherein, The second encapsulation layer includes a first adhesive portion located on the display side, a second adhesive portion located in the bending area, and a third adhesive portion located on the non-display side. On the non-display side, the first encapsulation layer includes an edge portion located on the side of the third adhesive portion away from the display substrate, and the edge portion includes a first edge close to the second adhesive portion. In a direction away from the display substrate, the edge portion includes a first insulating layer, a conductive layer, and a second insulating layer. At the first edge, at least a portion of the conductive layer extends beyond the second insulating layer and / or the first insulating layer. The display device according to claim 13, wherein, The conductive layer includes a first conductive portion extending beyond the second insulating layer, and the first conductive portion includes a through-hole. The display device according to claim 14 further includes: A metal frame includes a protrusion, wherein the protrusion is inserted into the through hole. The display device according to claim 15, wherein, The through hole is circular. The display device according to claim 14, wherein, The first conductive portion extends beyond the first insulating layer. Conductive adhesive is provided in the through hole and between the through hole and the third adhesive portion to connect the first conductive portion and the third adhesive portion. The display device according to claim 17, wherein, The through hole is rectangular. The display device according to claim 14, wherein, The conductive layer further includes a second conductive portion extending beyond the second insulating layer, wherein the first conductive portion and the second conductive portion are spaced apart.

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