Radio frequency identification antenna and manufacturing method for radio frequency identification antenna

Abstract

A radio frequency identification antenna and a manufacturing method for the radio frequency identification antenna. The radio frequency identification antenna comprises: a conductive structure (110), the conductive structure (110) comprising a transmission portion (1101) and a binding portion (1102); an adhesive layer (120), the adhesive layer (120) having an antenna pattern; and a substrate (130). The transmission portion (1101) is processed by die cutting along the contour of the antenna pattern, at least part of the binding portion (1102) is processed by die cutting along the contour of the antenna pattern, and the conductive structure (110) is configured to be transferred to the substrate (130) after the die cutting; and after the conductive structure (110) is transferred to the substrate (130), at least part of the binding portion (1102) is processed by laser cutting.

Description

Radio frequency identification (RFID) antenna and its fabrication method

[0001] This application claims priority to Chinese Patent Application No. 202411496992.1, filed with the Chinese Patent Office on October 25, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of wireless communication technology, and for example to a radio frequency identification (RFID) antenna and a method for fabricating an RFID antenna. Background Technology

[0003] Radio Frequency Identification (RFID) technology is an automatic identification technology in the field of wireless communication.

[0004] The transponder in an RFID system, also known as an RFID electronic tag, consists of a chip and an antenna as its core components. With the continuous development of RFID technology in the Internet of Things (IoT), higher demands are being placed on the consistency, reliability, and applicability of RFID electronic tags. Since the antenna is a crucial component of an RFID electronic tag, it is necessary to improve the structural design, material selection, and manufacturing process of RFID antennas.

[0005] RFID antennas in related technologies are prone to short circuits, which affects their reliability. Summary of the Invention

[0006] This application provides an RFID antenna and a method for manufacturing the RFID antenna, in order to solve the problem that RFID antennas are prone to short circuits, which affects the reliability of RFID antennas.

[0007] This application provides an RFID antenna, including:

[0008] A conductive structure, comprising a transmission section and a bonding section, wherein the transmission section is configured to receive or transmit wireless radio frequency signals, and the bonding section is configured to bond a chip;

[0009] An adhesive layer is disposed on one side of the conductive structure, and the adhesive layer has an antenna pattern;

[0010] A substrate is disposed on the side of the adhesive layer away from the conductive structure; the adhesive layer is configured to bond the conductive structure and the substrate.

[0011] The transmission part is formed by die-cutting along the outline of the antenna pattern, and at least a portion of the bonding part is formed by die-cutting along the outline of the antenna pattern. The conductive structure is transferred to the substrate after die-cutting. After the conductive structure is transferred to the substrate, at least a portion of the bonding part is formed by laser cutting.

[0012] This application also provides a method for manufacturing an RFID antenna, including:

[0013] A conductive layer and a carrier film are provided, and one side of the conductive layer is attached to one side of the carrier film and bonded by a first adhesive layer.

[0014] An adhesive layer is formed on the side of the conductive layer away from the carrier film, and the adhesive layer has an antenna pattern;

[0015] The conductive layer is die-cut along the outer contour of the antenna pattern to form a conductive structure; wherein, the conductive structure includes a transmission part and a bonding part, the transmission part is configured to receive or transmit wireless radio frequency signals, and the bonding part is configured to bond a chip;

[0016] A substrate is provided, and the substrate is laminated with the side of the conductive layer away from the carrier film. The conductive structure is then bonded to the substrate through the adhesive layer.

[0017] The waste material from die-cutting of the carrier film and the conductive layer is removed, and the conductive structure is transferred to the substrate to form the initial antenna structure.

[0018] The bonding portion of the initial antenna structure is laser-cut to form an RFID antenna. Attached Figure Description

[0019] Figure 1 is a schematic diagram of the structure of an RFID antenna provided in an embodiment of this application;

[0020] Figure 2 is a schematic diagram of a conductive structure provided in an embodiment of this application;

[0021] Figure 3 is a structural schematic diagram of an antenna pattern provided in an embodiment of this application;

[0022] Figure 4 is a schematic diagram of the structure of a binding part before laser cutting according to an embodiment of this application;

[0023] Figure 5 is a schematic diagram of the structure of a binding part after laser cutting according to an embodiment of this application;

[0024] Figure 6 is a schematic diagram of a marker structure provided in an embodiment of this application;

[0025] Figure 7 is a flowchart of a method for manufacturing an RFID antenna according to an embodiment of this application;

[0026] Figure 8 is a schematic diagram of the bonding process between a conductive layer and a carrier film provided in an embodiment of this application;

[0027] Figure 9 is a schematic diagram of an adhesive layer formation process provided in an embodiment of this application;

[0028] Figure 10 is a schematic diagram of the process of a conductive layer being die-cut and then laminated with a substrate according to an embodiment of this application;

[0029] Figure 11 is a schematic diagram of the process of transferring a conductive structure to a substrate according to an embodiment of this application;

[0030] Figure 12 is a flowchart of another RFID antenna fabrication method provided in an embodiment of this application;

[0031] Figure 13 is a cross-sectional view along the AA' direction in Figure 6 provided in an embodiment of this application;

[0032] Figure 14 is a schematic diagram of the outline of an adhesive layer provided in an embodiment of this application;

[0033] Figure 15 is a field-of-view diagram provided in an embodiment of this application;

[0034] Figure 16 is a schematic diagram of a second marking structure and a conductive structure integrally disposed according to an embodiment of this application;

[0035] Figure 17 is a schematic diagram of a structure in which the second marking structure and the conductive structure are independently spaced apart, according to an embodiment of this application. Detailed Implementation

[0036] The present application will now be described in conjunction with the accompanying drawings and embodiments. The embodiments described herein are for illustrative purposes only. For ease of description, only the parts of the structure relevant to the present application are shown in the accompanying drawings.

[0037] Figure 1 is a schematic diagram of an RFID antenna provided in an embodiment of this application. As shown in Figure 1, the device includes: a conductive structure 110, which includes a transmission part 1101 and a bonding part 1102. The transmission part 1101 is configured to receive or transmit radio frequency signals, and the bonding part 1102 is configured to bond a chip; an adhesive layer 120 is disposed on one side of the conductive structure 110 and has an antenna pattern; a substrate 130 is disposed on the side of the adhesive layer 120 away from the conductive structure 110; the adhesive layer 120 is configured to bond the conductive structure 110 and the substrate 130; the transmission part 1101 is formed by die-cutting along the outline of the antenna pattern, and at least a portion of the bonding part 1102 is formed by die-cutting along the outline of the antenna pattern; the conductive structure 110 is transferred to the substrate 130 after die-cutting; after the conductive structure 110 is transferred to the substrate 130, at least a portion of the bonding part 1102 is formed by laser cutting.

[0038] In this embodiment, the RFID antenna is an important component of the RFID electronic tag, configured to receive and transmit radio frequency signals. When the RFID electronic tag approaches the reader, it receives the radio frequency signals emitted by the reader, which are then transmitted to the chip via the RFID antenna. The RFID antenna is typically made of conductive material. Optionally, the RFID antenna may be made of aluminum foil or copper foil. The shape and size of the RFID antenna can be optimized according to the application and frequency of the RFID electronic tag.

[0039] For example, the conductive structure 110 can be interpreted as the conductive part constituting the RFID antenna, which is responsible for receiving and transmitting radio frequency signals to achieve wireless data transmission. Optionally, the material of the conductive structure 110 may include aluminum foil, copper foil, aluminum alloy foil, copper alloy foil, or non-metallic conductive materials, etc. The chip can be interpreted as the intelligent part of the RFID electronic tag. The chip may include a memory and a processor. When the RFID electronic tag receives a radio frequency signal from the reader, the chip reads data from the memory or writes data into the memory, and then sends the corresponding response signal back to the reader through the conductive structure 110. The type of chip in the RFID electronic tag may include passive, semi-active, or active, and its power consumption and functional characteristics vary, which can be set as needed.

[0040] In this embodiment of the application, the antenna pattern refers to the pattern of an antenna in the field of RFID, wherein the antenna pattern is adapted to the outer contour shape of the conductive structure 110 and / or the marking structure in the RFID antenna.

[0041] Figure 2 is a schematic diagram of a conductive structure provided in an embodiment of this application. As shown in Figure 2, the conductive structure 110 includes a transmission part 1101 and a bonding part 1102, with a through groove 11022 provided on the bonding part 1102. The transmission part 1101 can be interpreted as the part of the conductive structure 110 responsible for signal transmission, which can effectively transmit current or electrical signals from one place to another. The transmission part 1101 is configured to receive or transmit wireless radio frequency signals. The bonding part 1102 can be interpreted as the area in the conductive structure 110 configured to fix or connect the conductive structure 110 to other components. Optionally, the bonding part 1102 can be connected using conductive adhesive. The bonding part 1102 is configured to bond a chip. The bonding part 1102 is configured to electrically connect the conductive structure 110 and the chip.

[0042] An adhesive layer 120 is disposed on one side of the conductive structure 110, and the adhesive layer 120 has an antenna pattern.

[0043] In this embodiment, the adhesive layer 120 can be interpreted as an adhesive layer used between the conductive structure 110 of the RFID antenna and the substrate 130, or between the antenna and other components. Optionally, the adhesive layer 120 may include epoxy resin, polyurethane, acrylic adhesive, or ultraviolet curing adhesive (UV adhesive), etc.

[0044] Figure 3 is a structural schematic diagram of an antenna pattern provided in an embodiment of this application. As shown in Figure 3, optionally, the antenna pattern may include a preset antenna pattern 1201 and a preset marker pattern 1202. The antenna pattern can be interpreted as a specific shape or pattern pre-designed and defined, wherein the preset antenna pattern 1201 is adapted to the outer contour shape of the conductive structure 110 in the RFID antenna, and the preset marker pattern 1202 is adapted to the outer contour shape of the marker structure in the RFID antenna. It should be understood that the antenna pattern shown in Figure 3 refers to the shape of the adhesive layer 120 before the bonding part 1102 is laser-processed. When the bonding part 1102 is laser-processed, the depth of laser cutting may cover the thickness of the adhesive layer 120, thereby causing the adhesive layer 120 to be partially cut as well. Therefore, in the finished structure of the RFID antenna, the actual shape of the adhesive layer 120 may not be exactly the same as the antenna pattern. Similarly, the preset antenna pattern 1201 and preset marker pattern 1202 in the antenna pattern are adapted to the overall outer contour shape of the conductive structure 110 and the marker structure before laser processing, rather than completely overlapping with the projection shape of the conductive structure 110 and the marker structure in the finished RFID antenna on the projection horizontal plane.

[0045] The substrate 130 is disposed on the side of the adhesive layer 120 away from the conductive structure 110; the adhesive layer 120 is configured to bond the conductive structure 110 and the substrate 130.

[0046] In this embodiment, the substrate 130 can be interpreted as the main material serving as the carrier structure in the RFID antenna. Optionally, the material of the substrate 130 may include polyethylene terephthalate (PET) polyester film, polyvinyl chloride (PVC) film, polyimide (PI) film, polyamide film, coated paper, thermal paper, or cellulose film, etc. The selection of the substrate 130 can be determined according to application requirements, budget, and manufacturing process. The substrate 130 and the conductive structure 110 are bonded together by the adhesive layer 120, providing support and protection for the RFID antenna. Since the conductive structure 110 is processed before being transferred to the substrate 130 via the adhesive layer 120, the process variables during the processing of the substrate 130 are reduced, allowing for flexible selection of the material of the substrate 130, not limited to high-temperature resistant or corrosion-resistant materials. The use of die-cutting technology for the conductive structure 110 reduces the difficulty of die-cutting and lowers the requirements for thickness uniformity and material hardness of the substrate 130, thereby expanding the selection range of the substrate 130. Furthermore, since the conductive structure 110 is transferred to the substrate 130 after die-cutting, the surface of the substrate 130 is cleaner, free from cutting scratches or other damage, improving the reliability and aesthetics of the substrate 130 to meet the needs of different users.

[0047] In the field of RFID antennas, the integration of a chip and an RFID antenna is called an inlay, also known as an RFID transponder, and is the core component of an RFID electronic tag. An inlay is a pre-assembled unit containing an RFID chip and an RFID antenna. The substrate 130 is the main carrier of the inlay, serving a supporting and fixing function. During the manufacturing process of the RFID electronic tag, the chip and RFID antenna are typically bonded to the substrate 130. Simultaneously, the chip and RFID antenna are connected by an adhesive conductive material and fixed directly above the antenna pads. This structure forms the inlay, after which an encapsulation layer or printable faceplate is added. Alternatively, the transmission section 1101 of the inlay can be simplified by removing the part that amplifies the signal, retaining only the closed loop in the middle. This structure is called an RFID chip module or loop. The loop allows for close-range reading and is used in some special application scenarios.

[0048] Printable face material is the outermost layer of an RFID tag. It can be used to print or provide identification, enabling the RFID tag to carry product information, icons, or trademarks. Printable face material can be made of paper or plastic and can be white or transparent to meet different design and application requirements.

[0049] Backing paper is a material used to protect the chip and RFID antenna of an RFID tag when it is not in use. The chip and RFID antenna are wrapped between the backing paper and the printable face material. The backing paper can be made of release paper. If release paper is used, its inner side is coated with silicone oil to facilitate the peeling off of the tag and its application to the surface of the object to be labeled. The silicone oil side of the release paper contacts the chip and antenna, providing protection and support. The other side of the release paper is usually made of paper or plastic, allowing the RFID tag to be easily peeled off during end-use applications. When the RFID tag is actually used, the manufacturer can easily tear off the release paper and attach the RFID tag to the final product.

[0050] The transmission section 1101 is formed by die-cutting along the outline of the antenna pattern, and at least part of the bonding section 1102 is formed by die-cutting along the outline of the antenna pattern. The conductive structure 110 is configured to be transferred to the substrate 130 after die-cutting. After the conductive structure 110 is transferred to the substrate 130, at least part of the bonding section 1102 is formed by laser cutting.

[0051] In this application, die-cutting can be interpreted as a method of cutting materials using a die. The shape of the die is imprinted onto the material under high pressure to quickly and accurately cut the desired shape and size. In one embodiment of this application, the die is rotary, and the die-cutting process can be a rotary die-cutting process. Laser cutting can be interpreted as a method of cutting materials using a laser beam. It uses a high-energy-density laser beam to locally heat the material until it melts or vaporizes, thereby achieving cutting.

[0052] The overall RFID antenna processing technology employs a combination of die-cutting and laser cutting. The overall outline of the RFID antenna is completed by die-cutting, transferred to the substrate 130, and then a through groove 11022 is cut using laser cutting. This is because die-cutting can meet the cutting precision requirements of the RFID antenna outline. However, when short-circuit protection is applied to the bonding portion 1102 used for chip mounting on the RFID antenna, the cutting precision requirements are higher, which die-cutting cannot meet. Therefore, laser cutting, which has higher cutting precision, is used to cut the bonding portion 1102. It is important to understand that completing the overall outline of the antenna by die-cutting is not limited to the entire process of die-cutting alone. It can also include first die-cutting out the general outline, and then using laser or other methods to remove burrs from the edges of the die-cut antenna outline.

[0053] The key to preventing short circuits in the chip patch area of ​​the RFID antenna is to cut a through groove 1102 at the bonding part 1102 to prevent the RFID antenna from causing a short circuit after the chip is bonded to the bonding part 1102.

[0054] By performing laser cutting after the conductive structure 110 is transferred to the substrate 130, the deformation problem of the bonding portion 1102, which is prone to occur when laser cutting is performed before transfer to the substrate 130, can be effectively avoided. Because the anti-short-circuit structure of the bonding portion 1102, i.e., the through-groove 11022, is narrow after laser cutting, it is prone to deformation during transfer, leading to a risk of short circuits on both sides of the anti-short-circuit structure of the bonding portion 1102. This embodiment, by performing laser cutting after the conductive structure 110 is transferred to the substrate 130, ensures the structural stability of the bonding portion 1102 and improves its anti-short-circuit effect, thereby improving the reliability of the RFID antenna.

[0055] The RFID antenna provided in this embodiment is formed by bonding one side of the conductive layer to a carrier film and forming an adhesive layer 120 with an antenna pattern on the other side. The conductive layer is then die-cut along the outer contour of the antenna pattern to form a conductive structure 110. The conductive structure 110 is then transferred to a substrate 130 using the adhesive layer 120. The carrier film and waste generated from the die-cutting are removed, and the bonding portion 1102 is laser-cut to form the RFID antenna. Die-cutting allows for rapid cutting of most of the RFID antenna's shape and facilitates waste removal. Laser cutting of the bonding portion 1102, which requires higher precision, ensures accuracy and consistency. This process significantly improves processing efficiency while maintaining the RFID antenna's processing precision. Laser cutting of the bonding portion 1102 after transferring the conductive structure 110 to the substrate 130 ensures structural stability and better short-circuit protection, reducing the risk of short circuits and improving the reliability of the RFID antenna.

[0056] Based on the above embodiments, Figure 4 is a schematic diagram of the structure of a bonding portion before laser cutting according to an embodiment of this application. Optionally, as shown in Figure 4, the bonding portion 1102 may include at least two pads 11021, which are configured to bond chips; the pads 11021 are formed by die-cutting before the conductive structure 110 is transferred to the substrate 130. It can be understood that before the bonding portion 1102 is laser-cut to form a short-circuit protection structure, the two pads 11021 are connected as one piece.

[0057] In this embodiment, pad 11021 can be interpreted as a metal area for connecting the chip, providing electrical contact and mechanical fixation; it is typically connected to chip pins by soldering. The number of pads 11021 is determined by the pin requirements of the chip design itself; the RFID antenna chip design has at least two pins for electrical connection. Die-cutting is used to cut the pads 11021 because die-cutting can meet the required precision of the pads 11021.

[0058] Figure 5 is a schematic diagram of the structure of a bonding part after laser cutting according to an embodiment of this application. As shown in Figure 5, the through groove 11022 is disposed between two adjacent pads 11021. The through groove 11022 is formed by laser cutting after the conductive structure 110 is transferred to the substrate 130.

[0059] The orthographic projection of the chip on the substrate 130 at least partially covers the orthographic projection of the through-slot 11022 on the substrate 130. In this embodiment, orthographic projection can be interpreted as the projection of an object onto a specific plane, and can be used to describe the positional relationship between the chip and the through-slot 11022 on the surface of the substrate 130. By ensuring that the orthographic projection of the chip on the substrate 130 at least partially covers the orthographic projection of the through-slot 11022, it is possible to ensure effective connection between the chip and the pads 11021 on both sides of the through-slot 11022, thus optimizing the signal transmission path.

[0060] This embodiment of the application, by performing laser cutting after the conductive structure 110 is transferred to the substrate 130, effectively avoids the deformation problem of the through-groove 11022 that easily occurs when laser cutting is performed before transfer to the substrate 130. Because the through-groove 11022 is narrow, it is prone to deformation during the transfer process, leading to a risk of short circuits on both sides of the through-groove 11022 in the bonding portion 1102. This embodiment of the application, by forming the through-groove 11022 by laser cutting after the conductive structure 110 is transferred to the substrate 130, makes the structure of the through-groove 11022 stable, provides better short-circuit protection, and thus improves the reliability of the RFID antenna.

[0061] Optionally, the antenna pattern includes a preset antenna pattern 1201; the transmission section 1101 is formed by die-cutting along the contour of the preset antenna pattern 1201 before the conductive structure 110 is transferred to the substrate 130; the pad 11021 is formed by die-cutting along the contour of the preset antenna pattern 1201 before the conductive structure 110 is transferred to the substrate 130; the through groove 11022 is formed by laser cutting after the conductive structure 110 is transferred to the substrate 130; the orthographic projection of the conductive structure 110 on the substrate 130 completely covers the orthographic projection of the preset antenna pattern 1201 of the adhesive layer 120 on the substrate 130.

[0062] In this embodiment of the application, the preset antenna pattern 1201 can be interpreted as an antenna structure with a specific shape and layout that is predefined and designed in advance in RFID antenna design. It typically includes coils, radiating elements and other geometric structures to optimize radio frequency performance.

[0063] Before the RFID antenna is transferred to the substrate 130, the transmission part 1101 and the pad 11021 are die-cut. This is because the contours of the transmission part 1101 and the pad 11021 do not have high precision requirements, and the precision of the die-cutting can meet them. In addition, the die-cutting speed is fast, which can realize mass production and ensure the consistency of each pad 11021 and the transmission part 1101, thereby reducing performance fluctuations caused by cutting errors.

[0064] After the RFID antenna is transferred to the substrate 130, it is then laser-cut. This is because the width of the through groove 11022 is extremely small. If the cutting process is carried out before the transfer, the gap spacing may change due to the stretching of the metal foil, warping, etc. during the transfer process, resulting in a large error. Therefore, the laser cutting process can only be carried out after the antenna is transferred to the substrate 130.

[0065] Figure 6 is a schematic diagram of a marking structure provided in an embodiment of this application. Optionally, as shown in Figure 6, the RFID antenna further includes: at least one marking structure, and the antenna pattern of the adhesive layer 120 further includes a preset marking pattern; the marking structure is formed by die-cutting along the contour of the preset marking pattern before the conductive structure 110 is transferred to the substrate 130; the marking structure and the conductive structure 110 are disposed in the same layer; at least one marking structure and the conductive structure 110 at least partially overlap, or at least one marking structure and the conductive structure 110 are completely offset.

[0066] In this embodiment, the marking structure can be interpreted as a specific graphic or symbol designed on an RFID antenna or tag. The marking structure provides a positioning reference during the manufacturing of RFID antennas and RFID transponders, ensuring precise alignment of the components. Pre-defined marking graphics can be interpreted as the shape and style of the marking structure determined during the design phase; this pre-defined design helps ensure consistency in appearance and function for each RFID antenna.

[0067] Before transferring the conductive structure 110 to the substrate 130, the marking structure is formed by die-cutting along the contour of a pre-defined marking pattern on the adhesive layer 120. Placing the marking structure and the conductive structure 110 in the same layer reduces the number of steps in the production process, simplifies manufacturing, and ensures the accuracy and consistency of their relative positions. Furthermore, since the marking structure and the conductive structure 110 are on the same layer, the markings can be directly used for positioning the conductive structure 110, ensuring accurate alignment between them.

[0068] Overlapping the marking structure and conductive structure 110 allows them to be closer together, saving layout space and making it more suitable for laser cutting positioning lenses with small field of view. Completely separating the marking structure and conductive structure 110 allows them to be independent of each other, thus avoiding interference between the marking structure and the conductive structure 110, and facilitating later maintenance and expansion.

[0069] Optionally, as shown in Figure 6, the marking structure includes a first marking structure 12021 and a second marking structure 12022; the first marking structure 12021 is configured to serve as a positioning reference when the RFID antenna is feeding; the second marking structure 12022 is configured to serve as a positioning reference when the laser cuts the through slot 11022 of the binding part 1102, and when the chip is bound to the binding part 1102; the distance between the first marking structure 12021 and the transmission part 1101 is greater than or equal to a first preset distance; the distance between the second marking structure 12022 and the binding part 1102 is less than or equal to a second preset distance; the first preset distance is greater than or equal to the second preset distance.

[0070] In this embodiment, the first marking structure 12021 can be interpreted as a marking structure used in the manufacturing and application of RFID antennas. For example, as shown in FIG6, RFID antennas are placed side-by-side on a carrier tape in the actual manufacturing and chip bonding process. The carrier tape needs to be continuously moved so that each individual antenna placed on it can enter a designated processing or bonding position. This process can be understood as RFID antenna feeding. In the actual manufacturing and bonding process, the processing and bonding positions of RFID antennas are usually fixed and unique. Therefore, it is necessary to use photoelectric sensors to identify the marking structure corresponding to each individual RFID antenna, thereby determining the position of each individual RFID antenna during feeding. Therefore, the first marking structure 12021 is used as a positioning reference for the photoelectric sensor to determine the processing position of each individual RFID antenna during laser processing feeding, and as a positioning reference for the photoelectric sensor to determine the bonding position of each individual RFID antenna during chip bonding feeding, thereby ensuring that the RFID antennas can enter the laser processing position and the chip bonding position in the correct sequence during laser cutting and chip bonding.

[0071] The second marking structure 12022 can be interpreted as another marking element besides the first marking structure 12021. For example, the RFID antenna needs to utilize a vision sensor to determine the cutting and bonding positions during laser cutting and chip bonding processes. Specifically, the second marking structure 12022 serves as a positioning reference for the vision sensor to determine the cutting position when the laser cutting of the through-groove 11022 of the bonding portion 1102 is performed, and also serves as a positioning reference for the vision sensor to determine the bonding position when the chip is bonded to the bonding portion 1102. In other words, the second marking structure 12022 enables the RFID antenna to effectively guide the cutting position and reduce errors during laser cutting, and ensures that the chip is accurately placed in the predetermined position during chip bonding.

[0072] Both the first marking structure 12021 and the second marking structure 12022 are used throughout the entire production process of the RFID antenna and in the subsequent chip bonding stage. The first marking structure 12021 primarily ensures the accuracy of the processing and bonding positions of the conductive structure 110 during material feeding. The second marking structure 12022 primarily ensures that the laser can accurately cut the through-groove 11022 at the designated position on the bonding portion 1102, and that the chip can accurately and reliably attach to the bonding portion 1102.

[0073] The first preset distance can be interpreted as a pre-set distance between the first marking structure 12021 and the transmission unit 1101, used to ensure that there is enough space between them for processing or movement. The second preset distance can be interpreted as a set distance between the second marking structure 12022 and the bonding unit 1102, used to ensure that the bonding process will not interfere with or hinder other operations.

[0074] The first tag structure 12021 needs to maintain a distance of at least a first preset distance from the transmission unit 1101 to ensure that the RFID antenna has sufficient space during die-cutting and transmission, avoiding interference and errors. The distance between the second tag structure 12022 and the binding unit 1102 should be less than or equal to the second preset distance. This ensures that the tag structure can provide the necessary positioning support during chip binding without affecting the operation of other components.

[0075] Because laser cutting has a smaller field of view than die-cutting, a second preset distance is set to be less than or equal to the first preset distance. This setting serves two purposes: firstly, since the chip size is much smaller than the other components of the transmission unit 1101 and the bonding unit 1102, interference can be prevented during operation, ensuring accurate positioning and bonding. Secondly, it facilitates placing the second marking structure 12022 within the laser cutting field of view during laser cutting and chip bonding to the pads 11021 of the bonding unit 1102, improving the precision of laser cutting and thus enhancing the reliability of the RFID antenna.

[0076] Figure 7 is a flowchart of a method for fabricating an RFID antenna according to an embodiment of this application. As shown in Figure 7, optionally, based on the above embodiments, the method for fabricating an RFID antenna includes:

[0077] S210, Provide a conductive layer 140 and a carrier film 160, attach one side of the conductive layer 140 to one side of the carrier film 160 and bond them together with a first adhesive layer 150.

[0078] Figure 8 is a schematic diagram of the bonding process between a conductive layer and a carrier film according to an embodiment of this application. As shown in Figure 8, in this embodiment, the conductive layer 140 can be interpreted as the part of the RFID antenna responsible for signal transmission and reception, and is typically made of a conductive material. Optionally, the conductive layer 140 can be aluminum foil, copper foil, aluminum alloy foil, or copper alloy foil. The carrier film 160 can be interpreted as a material used to support and protect the conductive layer 140 of the RFID antenna; optionally, the carrier film 160 can be a PET plastic film. The first adhesive layer 150 can be interpreted as an adhesive layer used to bond the conductive layer 140 and the carrier film 160 together.

[0079] A conductive layer 140 and a carrier film 160 are provided. One side of the carrier film 160 is an adhesive self-adhesive film. The aluminum foil is directly laminated to the adhesive side of the carrier film 160. In this case, the first adhesive layer 150 is the adhesive layer on the carrier film 160. Optionally, the conductive layer 140 may include a metal foil or a non-metallic conductive material, and the carrier film 160 may include a plastic material.

[0080] S220, an adhesive layer 120 is formed on the side of the conductive layer 140 away from the carrier film 160, and the adhesive layer 120 has an antenna pattern.

[0081] For example, FIG9 is a schematic diagram of an adhesive layer formation process provided in an embodiment of this application. As shown in FIG9, in this embodiment of the application, an adhesive layer 120 with an antenna pattern is formed on the side of the conductive layer 140 away from the carrier film 160. The adhesive layer 120 facilitates the subsequent transfer of the conductive structure 110 to the substrate 130, and at the same time provides a contour for subsequent die-cutting.

[0082] S230. The conductive layer 140 is die-cut along the outer contour of the antenna pattern to form a conductive structure 110. The conductive structure 110 includes a transmission part 1101 and a bonding part 1102. The transmission part 1101 is configured to receive or transmit wireless radio frequency signals, and the bonding part 1102 is configured to bond chips.

[0083] For example, the antenna pattern is bonded to the conductive layer 140 with an adhesive material. The adhesive layer 120 and the conductive layer 140 have different reflectivities, which can be used for die-cutting positioning. The conductive layer 140 can be a metal foil, which is die-cut along the outer contour of the antenna pattern.

[0084] S240, Provide a substrate 130, composite the substrate 130 with the side of the conductive layer 140 away from the carrier film 160, and bond the conductive structure 110 to the substrate 130 through the adhesive layer 120.

[0085] For example, Figure 10 is a schematic diagram of the process of bonding a conductive layer to a substrate after die-cutting, according to an embodiment of this application. As shown in Figure 10, in this embodiment, after the conductive layer 140 is die-cut along the antenna pattern of the adhesive layer 120, the conductive layer 140 is bonded to the substrate 130. At this time, the conductive structure 110 is sandwiched between the substrate 130 and the carrier film 160, and one side of it is bonded to the surface of the substrate 130 through the adhesive layer 120. The adhesive layer 120 can be made of UV adhesive, which is applied locally to the conductive layer 140. The adhesive pattern can include a preset antenna pattern 1201 and at least one preset mark pattern, which can serve as a positioning reference point during die-cutting.

[0086] S250, the waste material after die-cutting of the carrier film 160 and conductive layer 140 is removed, and the conductive structure 110 is transferred to the substrate 130 to form the initial antenna structure.

[0087] For example, Figure 11 is a schematic diagram of a conductive structure transfer process to a substrate according to an embodiment of this application. As shown in Figure 11, in this embodiment, when removing the carrier film 160, since the first adhesive layer 150 is fully coated and the adhesive layer 120 is partially coated, the waste material of the conductive layer 140 only adheres to the carrier film 160 on one side, and does not adhere to the substrate 130 on the other side. Therefore, when removing the carrier film 160, the carrier film 160 will carry away the waste material of the conductive layer 140. Since the conductive structure 110 was previously firmly bonded to the surface of the substrate 130 by the adhesive layer 120, the conductive structure 110 will remain on the surface of the substrate 130 while the carrier film 160 is removed and the waste material of the conductive layer 140 is carried away. That is, the entire process transfers the conductive structure 110 to the substrate 130. "S1" shown in Figure 11 represents removing the carrier film 160 and flipping the substrate 130.

[0088] S260. The binding part 1102 of the initial antenna structure is laser-cut to form an RFID antenna.

[0089] In this embodiment, a bonding portion 1102 is provided on the conductive layer 140 for bonding the chip. The conductive layer 140 is cut at the center of the chip bonding area to prevent short circuits after chip bonding. Since the chip is small in size, the gap for the short-circuit protection cutting of the conductive layer 140 is very narrow, and laser cutting can meet the size requirements.

[0090] The RFID antenna fabrication method provided in this embodiment involves bonding one side of the conductive layer 140 to the carrier film 160, forming an adhesive layer 120 with an antenna pattern on the other side, die-cutting the conductive layer 140 along the outer contour of the antenna pattern to form a conductive structure 110, transferring the conductive structure 110 to the substrate 130 using the adhesive layer 120, removing the carrier film 160 and the waste generated from the die-cutting, and then using laser cutting to cut the initial antenna bonding portion 1102 to form the RFID antenna. Die-cutting can quickly cut out most of the shape of the RFID antenna and facilitates waste removal; laser cutting of the bonding portion 1102, which requires higher precision, ensures the accuracy and consistency of the cutting. Through the above process, the processing efficiency is greatly improved while ensuring the processing precision of the RFID antenna.

[0091] Optionally, Figure 12 is a flowchart of another RFID antenna fabrication method provided in an embodiment of this application. As shown in Figure 12, based on the above embodiments, the RFID antenna fabrication method includes:

[0092] S310, Provide a conductive layer 140 and a carrier film 160, attach one side of the conductive layer 140 to one side of the carrier film 160 and bond them together with a first adhesive layer 150.

[0093] S320, an adhesive layer 120 is formed on the side of the conductive layer 140 away from the carrier film 160, and the adhesive layer 120 has an antenna pattern.

[0094] S330, the antenna pattern includes a preset antenna pattern 1201 and at least one preset mark pattern; based on the preset mark pattern, the conductive layer 140 is die-cut along the outer contour of the preset antenna pattern 1201 to form a conductive structure 110 and a mark structure.

[0095] In this embodiment, the preset antenna pattern 1201 can be interpreted as a specific shape or pattern of an antenna that has been designed or defined in advance, and the preset marker pattern can be interpreted as a pattern of marker points that has been designed or defined in advance. The preset antenna pattern 1201 is adapted to the shape of the conductive structure 110 in the finished RFID antenna, and the preset marker pattern is adapted to the shape of the marker structure in the finished RFID antenna.

[0096] The conductive structure 110 and the marking structure are cut simultaneously because, during the design phase, they are typically considered as a single unit. Through proper layout and antenna patterning, they can be processed concurrently in the same die-cutting process. Simultaneous cutting of the conductive structure 110 and the marking structure reduces subsequent processing steps and improves production efficiency. The conductive structure 110 and the marking structure can be separated or partially overlapped; that is, in the finished RFID antenna, the conductive structure 110 can be independently installed or integrated with the marking structure.

[0097] Optionally, based on the above embodiments, referring to FIG6, the antenna pattern includes a first preset mark pattern and a second preset mark pattern; using the preset mark pattern as a reference, the conductive layer 140 is die-cut along the outer contour of the preset antenna pattern 1201 to form a conductive structure 110 and a mark structure, including: using the first preset mark pattern as a reference, the conductive layer 140 is die-cut along the outer contour of the preset antenna pattern 1201 to form a conductive structure 110, a first mark structure 12021, and a second mark structure 12022; wherein, the first mark structure 12021 is connected to or spaced apart from the transmission part 1101 of the conductive structure 110, and the second mark structure 12022 is connected to or spaced apart from the binding part 1102 of the conductive structure 110; the distance between the first mark structure 12021 and the transmission part 1101 is greater than or equal to the distance between the second mark structure 12022 and the binding part 1102; the area of ​​the first mark structure 12021 is greater than or equal to the area of ​​the second mark structure 12022.

[0098] In this embodiment, the first preset marking pattern can be interpreted as a reference for the RFID antenna during the die-cutting process, ensuring that the die-cut pattern remains consistent with the overall design. The second preset marking pattern can be interpreted as a reference for the RFID antenna during the laser cutting process, ensuring that the laser-cut pattern remains consistent with the overall design.

[0099] The first preset mark pattern is used as a reference because the reflectivity of the conductive layer 140 and the adhesive layer 120 is different. This characteristic can be used to identify the outline of the first preset mark pattern by using a coaxial laser sensor or a coaxial light source with vision, and then perform die cutting.

[0100] Figure 13 is a cross-sectional view along the AA' direction in Figure 6 provided by an embodiment of this application. Exemplarily, as shown in Figure 13, the conductive layer 140, after die-cutting, includes a conductive structure 110, a first marking structure 12021, and a second marking structure 12022. An adhesive layer 120 exists between the conductive structure 110, the first marking structure 12021, the second marking structure 12022, and the substrate 130. Using a first preset marking pattern as a visual reference point, the adhesive of the adhesive layer 120 is printed on a metal foil. The metal foil exhibits specular reflection, while the adhesive exhibits diffuse reflection; their reflectivities differ. Therefore, by using a coaxial laser sensor or a coaxial light source in conjunction with a vision system, the adhesive marking points can be identified on the metal foil without requiring additional coloring of the adhesive.

[0101] Figure 14 is a schematic diagram of the outline of an adhesive layer provided in an embodiment of this application. Furthermore, as shown in Figure 14, the actual die-cutting path is slightly larger than the outer contour of the specific pattern of the adhesive layer 120. The projected area of ​​the conductive structure 110, the first marking structure 12021, and the second marking structure 12022 in the horizontal direction is slightly larger than the area of ​​the antenna pattern on the adhesive layer 120. This is to prevent the adhesive layer of the adhesive layer 120 from being exposed outside the conductive layer 140, thus affecting the winding of the RFID antenna product.

[0102] S340, The conductive structure 110, the first marking structure 12021 and the second marking structure 12022 are bonded together to the substrate 130 through the adhesive layer 120; wherein, the orthographic projection of the conductive structure 110, the first marking structure 12021 and the second marking structure 12022 on the substrate 130 completely covers the orthographic projection of the adhesive layer 120 on the substrate 130.

[0103] In this embodiment, the conductive structure 110, the first marking structure 12021, and the second marking structure 12022 are on the same layer. They are bonded together to the substrate 130 and ultimately transferred to the substrate 130. This reduces operational steps and improves efficiency. The orthographic projection of the conductive structure 110, the first marking structure 12021, and the second marking structure 12022 onto the substrate 130 completely covers the orthographic projection of the adhesive layer 120 onto the substrate 130. This ensures that the projected area of ​​the finally cut conductive structure 110, the first marking structure 12021, and the second marking structure 12022 in the horizontal direction is slightly larger than the area of ​​the antenna pattern and positioning mark pattern on the adhesive layer 120. This prevents the adhesive layer from being exposed outside the metal layer, thus avoiding interference with the winding of the RFID antenna product.

[0104] S350, the initial antenna structure is formed by removing the waste material after die-cutting the carrier film 160 and the conductive layer 140.

[0105] S360. Using the second marking structure 12022 as a reference, the bonding part 1102 of the initial antenna structure is laser-cut to form a through groove 11022 and pads 11021 located on both sides of the through groove 11022.

[0106] In this embodiment, the through-slot 11022 can be interpreted as a groove-shaped structure disposed between the pads 11021, and its main function is to prevent short circuits in the conductive structure 110. The key to preventing short circuits in the chip mounting area of ​​the RFID antenna lies in cutting a through-slot 11022 at the bonding portion 1102 to prevent short circuits in the RFID antenna. Due to the small size of the chip, the through-slot 11022 for short-circuit protection of the conductive structure 110 is very narrow. Theoretically, the through-slot 11022 should be smaller than the spacing between chip pins, and its width should be less than or equal to 0.25 millimeters (mm). With the subsequent miniaturization of chips, the through-slot 11022 will become increasingly narrower. Laser cutting technology can achieve more precise cutting, ensuring that the shape and size of the through-slot 11022 meet design requirements.

[0107] Using the second marking structure 12022 as a reference, the relative positions of each component are ensured to be precise during the cutting process. High-precision cutting is achieved using laser cutting technology. The pad 11021 is used to connect the chip. The through-slot 11022 reduces signal interference and improves the performance of the RFID antenna. The frontal projection of the chip covers the through-slot 11022, ensuring the electrical connection between the chip and the antenna. Simultaneously, a reasonable layout allows for more efficient use of design space, contributing to better functional integration.

[0108] Laser cutting is performed only after the RFID antenna has been transferred to the substrate 130. This is because the through-slot 11022 is very small. If cutting were performed before the transfer, the spacing of the through-slot 11022 might change during the transfer process due to metal foil stretching, warping, or other reasons, increasing the error. Therefore, laser cutting can only be performed after the RFID antenna has been transferred to the substrate 130.

[0109] For example, the position of the second marking structure 12022 is set very close to the position of the through groove 11022 on the conductive structure 110 for short-circuit protection. For instance, the short-circuit protection process is performed on the conductive structure 110 within a 4x6mm range of the second marking structure 12022 to ensure that the second marking structure 12022 and the chip bonding area are both located within the 4x6mm field of view of the vision camera. In this way, the second marking structure 12022 can not only provide a visual reference point for laser cutting, but also provide a visual reference point for subsequent chip bonding.

[0110] In some embodiments, if the size of the second marker structure 12022 is too large, causing the second marker structure 12022 to be unable to be located within the field of view of the vision camera along with the chip bonding area, a laser can be used to cross-cut the second marker structure 12022 to reconstruct the marker structure, transforming the original oversized area marker structure (which can be a square or circular marker structure) into a cross-shaped marker structure, so as to ensure that the center point after the cross-cut is located within the field of view of the positioning camera.

[0111] Figure 15 is a schematic diagram of the field of view provided in an embodiment of this application. Exemplarily, as shown in Figure 15, the field of view (FOV), also known as the field of view angle, refers to the angular range within which a camera can receive images in an imaging scene; it is also commonly referred to as the field of view. FOV can be quantified in three directions: horizontal field of view, vertical field of view, and diagonal field of view. b1 is the field of view angle determined by the diameter of the visible range, P1 is the field of view angle of the lens, and a1 is the diameter of the lens's visible range. b2 is the field of view angle determined by the length of the imaging frame and the range that can be captured, P2 is the field of view angle of the lens, and a2 is the diameter of the lens's visible range.

[0112] Figure 16 is a schematic diagram of a second marking structure and a conductive structure integrally disposed according to an embodiment of this application. Figure 17 is a schematic diagram of a second marking structure and a conductive structure independently spaced according to an embodiment of this application. As shown in Figures 16 and 17, the pattern form, quantity, and distribution position of the second marking structure 12022 can be varied; it can be integrally disposed with the conductive structure 110, or it can be independently spaced from the conductive structure 110. Among them, the second marking structure 12022 and the conductive structure 110 can be integrally disposed in various ways, as shown in Figure 16, such as the “A” method shown in the figure: the second marking structure 12022 is located above the conductive structure 110; the “B” method shown in the figure: the second marking structure 12022 is located below the conductive structure 110; or the “C” method shown in the figure: the second marking structure 12022 is located on both sides of the conductive structure 110.

[0113] S370. Using the second marking structure 12022 as a reference, a chip is bonded to the pad 11021 of the bonding part 1102 to form an RFID transponder; wherein the orthogonal projection of the chip on the substrate 130 at least partially covers the orthogonal projection of the through groove 11022 on the substrate 130.

[0114] In this embodiment, using the second marker structure 12022 as a reference ensures accurate relative positioning of each component during the bonding process. By bonding the chip to the pad 11021, electrical contact between the chip and the RFID antenna is ensured, guaranteeing the stability and reliability of signal transmission.

[0115] Optionally, the peel force between the carrier film 160 and the conductive layer 140 is less than the peel force between the substrate 130 and the conductive layer 140.

[0116] In this embodiment, after the conductive layer 140 is laminated with the substrate 130, although both sides of the conductive layer 140 are bonded to the carrier film 160 and the substrate 130 respectively, the bond between the conductive layer 140 and the substrate 130 is stronger. That is, the peel force between the carrier film 160 and the conductive layer 140 is less than the peel force between the substrate 130 and the conductive layer 140. Therefore, when the carrier film 160 is removed, the conductive structure 110 on the conductive layer 140 will be retained on the substrate 130, and the waste material of the conductive layer 140 after die-cutting will be removed.

[0117] For example, the carrier film 160 is a low-viscosity self-adhesive film. In this case, it can be understood that the first adhesive layer 150 is fully coated on the carrier film 160, so the area of ​​the first adhesive layer 150 covers the entire conductive layer 140. The adhesive layer 120 is partially coated on the conductive layer 140, and the material of the adhesive layer 120 is a UV adhesive. The viscosity of the adhesive layer 120 after curing is much greater than the viscosity of the first adhesive layer 150. Therefore, the peel force between the conductive layer 140 and the substrate 130 is greater than the peel force between the conductive layer 140 and the carrier film 160. In actual testing, the peel force between the conductive layer 140 and the substrate 130 is 4-6 N / 15 mm, and the peel force between the conductive layer 140 and the carrier film 160 is 0.03-0.05 N / 15 mm (the unit N / 15 mm refers to the force required to peel off a 15 mm wide strip).

[0118] Therefore, by removing the carrier film 160, the waste removal of the conductive layer 140 and the transfer of the conductive layer 140 to the substrate 130 can be completed simultaneously.

[0119] In this embodiment, the conductive structure 110, the first marking structure 12021, and the second marking structure 12022 are transferred together to the substrate 130 via the adhesive layer 120 and laminated with the substrate 130. Then, the carrier film 160 and waste materials generated from die-cutting are removed. Next, using the second marking structure 12022 as a reference, the bonding portion 1102 of the initial antenna structure is laser-cut to form a through groove 11022 and pads 11021 located on both sides of the through groove 11022. A chip is then bonded to the pads 11021 of the bonding portion 1102 to form an RFID antenna. Since there are only a few processing steps after transferring the conductive structure 110, the first marking structure 12021, and the second marking structure 12022 to the substrate 130, there are no requirements for the material of the substrate 130; that is, this transfer method removes material limitations for the substrate 130. In addition, the use of laser cutting for the high-precision bonding part 1102 can ensure the accuracy of the size and position of the through groove 11022 and the pad 11021, which facilitates later maintenance and chip replacement.

Claims

1. A radio frequency identification antenna, comprising: A conductive structure, comprising a transmission section and a bonding section, wherein the transmission section is configured to receive or transmit wireless radio frequency signals, and the bonding section is configured to bond a chip; An adhesive layer is disposed on one side of the conductive structure, and the adhesive layer has an antenna pattern; A substrate is disposed on the side of the adhesive layer away from the conductive structure; the adhesive layer is configured to bond the conductive structure and the substrate. The transmission part is formed by die-cutting along the outline of the antenna pattern, and at least a portion of the bonding part is formed by die-cutting along the outline of the antenna pattern. The conductive structure is transferred to the substrate after die-cutting. After the conductive structure is transferred to the substrate, at least a portion of the bonding part is formed by laser cutting.

2. The radio frequency identification antenna according to claim 1, wherein, The binding part includes: At least two pads are provided for bonding the chip; the pads are formed by die-cutting before the conductive structure is transferred to the substrate. A through groove is provided between two adjacent pads, and the through groove is formed by laser cutting after the conductive structure is transferred to the substrate; The orthographic projection of the chip onto the substrate at least partially covers the orthographic projection of the through-groove onto the substrate.

3. The radio frequency identification antenna according to claim 2, wherein, The antenna pattern includes a preset antenna graphic; The transmission section is formed by die-cutting along the contour of the preset antenna pattern before the conductive structure is transferred to the substrate; The pads are formed by die-cutting along the contour of the preset antenna pattern before the conductive structure is transferred to the substrate; The through groove is formed by laser cutting after the conductive structure is transferred to the substrate; The orthographic projection of the conductive structure onto the substrate completely covers the orthographic projection of the preset antenna pattern onto the substrate of the adhesive layer.

4. The radio frequency identification antenna according to claim 3, further comprising: At least one marking structure, wherein the antenna pattern of the adhesive layer further includes a preset marking pattern; the marking structure is formed by die-cutting along the contour of the preset marking pattern before the conductive structure is transferred to the substrate; The marking structure is disposed in the same layer as the conductive structure; At least one of the marking structures overlaps at least partially with the conductive structure, or at least one of the marking structures is completely offset from the conductive structure.

5. The radio frequency identification antenna according to claim 4, wherein, The marking structure includes a first marking structure and a second marking structure; The first marking structure is configured to serve as a positioning reference during the feeding of the radio frequency identification antenna; The second marking structure is configured to serve as a positioning reference when laser-cutting the through-groove of the bonding portion, and as a positioning reference for determining the bonding position when the chip is bonded to the bonding portion; The distance between the first marker structure and the transmission unit is greater than or equal to a first preset distance; The distance between the second marking structure and the binding part is less than or equal to the second preset distance; the first preset distance is greater than or equal to the second preset distance.

6. A method for fabricating a radio frequency identification antenna, comprising: A conductive layer and a carrier film are provided, and one side of the conductive layer is attached to one side of the carrier film and bonded by a first adhesive layer. An adhesive layer is formed on the side of the conductive layer away from the carrier film, and the adhesive layer has an antenna pattern; The conductive layer is die-cut along the outer contour of the antenna pattern to form a conductive structure; wherein, the conductive structure includes a transmission part and a bonding part, the transmission part is configured to receive or transmit wireless radio frequency signals, and the bonding part is configured to bond a chip; A substrate is provided, and the substrate is laminated with the side of the conductive layer away from the carrier film. The conductive structure is then bonded to the substrate through the adhesive layer. The waste material from die-cutting of the carrier film and the conductive layer is removed, and the conductive structure is transferred to the substrate to form the initial antenna structure. The bonding portion of the initial antenna structure is laser-cut to form a radio frequency identification antenna.

7. The method for manufacturing a radio frequency identification antenna according to claim 6, wherein, The antenna pattern includes a preset antenna pattern and at least one preset marker pattern; The step of die-cutting the conductive layer along the outer contour of the antenna pattern to form a conductive structure includes: Using the preset marking pattern as a reference, the conductive layer is die-cut along the outer contour of the preset antenna pattern to form a conductive structure and a marking structure.

8. The method for manufacturing a radio frequency identification antenna according to claim 7, wherein, The antenna pattern includes a first preset marker graphic and a second preset marker graphic; The step of die-cutting the conductive layer along the outer contour of the preset antenna pattern, using the preset marking pattern as a reference, to form a conductive structure and a marking structure, includes: Using the first preset mark pattern as a reference, the conductive layer is die-cut along the outer contour of the preset antenna pattern to form a conductive structure, a first mark structure, and a second mark structure. Wherein, the first marking structure is connected to or spaced apart from the transmission part of the conductive structure, and the second marking structure is connected to or spaced apart from the binding part of the conductive structure; the distance between the first marking structure and the transmission part is greater than or equal to the distance between the second marking structure and the binding part; and the area of ​​the first marking structure is greater than or equal to the area of ​​the second marking structure.

9. The method for manufacturing a radio frequency identification antenna according to claim 8, wherein, The process involves laminating the substrate to the side of the conductive layer away from the carrier film, and then bonding the conductive structure to the substrate via the adhesive layer, including: The conductive structure, the first marking structure, and the second marking structure are bonded to the substrate through the adhesive layer; Wherein, the orthographic projection of the conductive structure, the first marking structure, and the second marking structure onto the substrate completely covers the orthographic projection of the adhesive layer onto the substrate.

10. The method for fabricating a radio frequency identification antenna according to claim 8, wherein, The step of laser-cutting the bonding portion of the initial antenna structure to form a radio frequency identification antenna includes: Using the second marking structure as a reference, the bonding part of the initial antenna structure is laser-cut to form a through groove and pads located on both sides of the through groove; Using the second marking structure as a reference, a chip is bonded to the pad of the bonding portion to form an RFID transponder; wherein the orthogonal projection of the chip onto the substrate at least partially covers the orthogonal projection of the through groove onto the substrate.

11. The method for manufacturing a radio frequency identification antenna according to claim 6, wherein, The peel force between the carrier film and the conductive layer is less than the peel force between the substrate and the conductive layer.

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