Display panel and manufacturing method therefor

Abstract

The present invention relates to a display device and a manufacturing method therefor, the display device comprising: a base layer having a first surface and a second surface opposite to the first surface; a first pixel circuit layer disposed on the first surface of the base layer and including insulating layers, a first wire, and a first electrode pad; a second pixel circuit layer disposed on the first surface of the base layer, spaced apart from the first pixel circuit layer, and including insulating layers, a second wire, and a second electrode pad; a first light-emitting diode disposed on the first pixel circuit layer and electrically connected to the first electrode pad; a second light-emitting diode disposed on the second pixel circuit layer and electrically connected to the second electrode pad; and a connection wire disposed on the first surface of the base layer and electrically connecting the first wire to the second wire, wherein each of the connection wire, the first electrode pad, and the second electrode pad has a lower surface facing the base layer and an upper surface opposite to the lower surface, and the upper surface of the connection wire protrudes from the upper surface of the first electrode pad and the upper surface of the second electrode pad.

Description

Display panel and method of manufacturing the same

[0001] The present invention relates to a display panel, a method for manufacturing the same, and an electronic device comprising a display panel. Embodiments of the present invention disclose a display panel, a method for manufacturing a display panel, and an electronic device comprising a display panel.

[0002] In general, as display panels that visually display electrical signals evolve, various display panels with excellent characteristics such as thinness, lightness, and low power consumption, as well as electronic devices containing them, are being introduced. For example, research and development is actively underway on display panels of various structures, such as flexible display panels that can be folded or rolled into a roll shape, and stretchable display panels, as well as electronic devices containing them.

[0003] In the process of bonding a light-emitting diode to an electrode pad, damage to the display panel may occur due to over-pressure. The present invention aims to solve various problems, including the above-mentioned problem, by providing a display panel, a manufacturing process for the display panel, and an electronic device including the display panel. However, these problems are exemplary and do not limit the scope of the present invention.

[0004] According to one aspect of the present invention, a base layer having a first surface and a second surface opposite to the first surface; a first pixel circuit layer disposed on the first surface of the base layer and comprising insulating layers, a first wiring, and a first electrode pad; a second pixel circuit layer disposed on the first surface of the base layer and spaced apart from the first pixel circuit layer, and comprising insulating layers, a second wiring, and a second electrode pad; a first light-emitting diode disposed on the first pixel circuit layer and electrically connected to the first electrode pad; and a second light-emitting diode disposed on the second pixel circuit layer and electrically connected to the second electrode pad. A display panel is provided, comprising: a connecting wire disposed on the first surface of the base layer and electrically connecting the first wire and the second wire; wherein each of the connecting wire, the first electrode pad, and the second electrode pad has a lower surface facing the base layer and an upper surface facing the lower surface, and the upper surface of the connecting wire protrudes from the upper surface of the first electrode pad and the upper surface of the second electrode pad.

[0005] In one embodiment, the connecting wiring may become thicker in the thickness direction of the display panel as it moves further away from the first light-emitting diode and the second light-emitting diode.

[0006] In one embodiment, the connecting wire on the plane may become thicker in a direction intersecting the extension direction of the connecting wire as it moves further away from the first light-emitting diode and the second light-emitting diode.

[0007] In one embodiment, the base layer can fill the opening defined by the first pixel circuit layer and the second pixel circuit layer.

[0008] In one embodiment, the connecting wire can fill a portion of the opening defined by the first pixel circuit layer and the second pixel circuit layer.

[0009] In one embodiment, the side of the opening may have a stepped shape.

[0010] In one embodiment, bonding layers may be interposed between the first light-emitting diode and the first electrode pad and between the second light-emitting diode and the second electrode pad, respectively.

[0011] In one embodiment, each of the first wiring and the second wiring may include a first part, a second part spaced apart from the first part, and a bridge wire connecting the first part and the second part.

[0012] In one embodiment, the display panel further comprises a cover layer located on the first light-emitting diode, the second light-emitting diode, and the connecting wiring; and the base layer and the cover layer may comprise an elastic body.

[0013] In one embodiment, the lower surface of the connecting wire may contact the base layer, and the upper surface of the connecting wire may contact the cover layer.

[0014] According to another aspect of the present invention, the method comprises the steps of: forming a pixel circuit layer on a first substrate, the pixel circuit layer comprising insulating layers, a first wiring, a second wiring, a first electrode pad electrically connected to the first wiring, and a second electrode pad electrically connected to the second wiring; forming a bonding layer to overlap each of the first electrode pad and the second electrode pad; forming a connecting wiring electrically connecting the first wiring and the second wiring; attaching a first light-emitting diode to the first electrode pad and attaching a second light-emitting diode to the second electrode pad; forming a cover layer on the first light-emitting diode, the second light-emitting diode, and the connecting wiring; separating the first substrate and the pixel circuit layer; removing a portion of the pixel circuit layer to form an opening and a first pixel circuit layer and a second pixel circuit layer spaced apart with the opening in between. A method for manufacturing a display panel is provided, comprising the step of forming a base layer that supports the first pixel circuit layer and the second pixel circuit layer.

[0015] In one embodiment, the step of attaching a first light-emitting diode to the first electrode pad and attaching a second light-emitting diode to the second electrode pad may include: a step of preparing a second substrate having a first surface facing the first substrate and a second surface opposite to the first surface, a resin layer disposed on the first surface of the second substrate, the first light-emitting diode attached to the resin layer, and the second light-emitting diode; and a step of applying pressure to the second substrate to attach the first light-emitting diode to the first electrode pad and attach the second light-emitting diode to the second electrode pad.

[0016] In one embodiment, when the second substrate is pressed, the connecting wire may come into contact with the resin layer.

[0017] In one embodiment, the connecting wiring may be formed to be thicker in the thickness direction of the display panel as it moves further away from the first light-emitting diode and the second light-emitting diode.

[0018] In one embodiment, the connecting wire may be thicker in a direction intersecting the extension direction of the connecting wire as it moves further away from the first light-emitting diode and the second light-emitting diode on a plane.

[0019] According to another aspect of the present invention, the method comprises the steps of: forming a pixel circuit layer on a first substrate, the pixel circuit layer comprising insulating layers, a first wiring, a second wiring, a first electrode pad electrically connected to the first wiring, and a second electrode pad electrically connected to the second wiring; removing a portion of the pixel circuit layer to form an opening and a first pixel circuit layer and a second pixel circuit layer spaced apart with the opening in between; patterning a bonding layer to overlap each of the first electrode pad and the second electrode pad; forming a connecting wiring that electrically connects the first wiring and the second wiring; attaching a first light-emitting diode to the first electrode pad and attaching a second light-emitting diode to the second electrode pad; and forming a cover layer on the first light-emitting diode, the second light-emitting diode, and the connecting wiring. A method for manufacturing a display panel is provided, comprising: a step of separating the first substrate, the first pixel circuit layer, the second pixel circuit layer, and the cover layer; and a step of forming a base layer that supports the first pixel circuit layer and the second pixel circuit layer.

[0020] In one embodiment, the step of attaching a first light-emitting diode to the first electrode pad and attaching a second light-emitting diode to the second electrode pad may include: a step of preparing a second substrate having a first surface facing the first substrate and a second surface opposite to the first surface, a resin layer disposed on the first surface of the second substrate, the first light-emitting diode attached to the resin layer, and the second light-emitting diode; and a step of applying pressure to the second substrate to attach the first light-emitting diode to the first electrode pad and attach the second light-emitting diode to the second electrode pad.

[0021] In one embodiment, when the second substrate is pressed, the connecting wire may come into contact with the resin layer.

[0022] In one embodiment, the connecting wire can fill a portion of the opening.

[0023] In one embodiment, the connecting wiring may be formed to be thicker in the thickness direction of the display panel as it moves further away from the first light-emitting diode and the second light-emitting diode.

[0024] According to another aspect of the present invention, a display panel; and a strain sensor comprising layers, patterns, or wirings in which a measurable physical quantity changes according to the stretching of the display panel; wherein the display panel comprises: a base layer having a first surface and a second surface facing the first surface; a first pixel circuit layer disposed on the first surface of the base layer and comprising insulating layers, a first wiring, and a first electrode pad; a second pixel circuit layer disposed on the first surface of the base layer and spaced apart from the first pixel circuit layer and comprising insulating layers, a second wiring, and a second electrode pad; a first light-emitting diode disposed on the first pixel circuit layer and electrically connected to the first electrode pad; and a second light-emitting diode disposed on the second pixel circuit layer and electrically connected to the second electrode pad. An electronic device is provided, comprising: a connecting wire disposed on the first surface of the base layer and electrically connecting the first wire and the second wire; wherein each of the connecting wire, the first electrode pad, and the second electrode pad has a lower surface facing the base layer and an upper surface facing the lower surface, and the upper surface of the connecting wire protrudes from the upper surface of the first electrode pad and the upper surface of the second electrode pad.

[0025] Other aspects, features, and advantages other than those described above will become clear from the following drawings, claims, and detailed description of the invention.

[0026] According to some embodiments of the present invention, a display panel having high elasticity and a high yield with a reduced defect rate in the manufacturing process, a manufacturing process of the display panel, and an electronic device including the display panel may be provided. The aforementioned effects are exemplary and the effects of the present invention are not limited to those described above.

[0027] The above-described features, other features, and effects of the present invention can be more clearly understood through the drawings and their description.

[0028] FIG. 1 is a schematic perspective view of a display panel according to one embodiment of the present invention.

[0029] FIGS. 2A and FIGS. 2B are perspective views showing the display panel of FIG. 1 extended in a first direction.

[0030] FIG. 2c is a perspective view showing the display panel of FIG. 1 extended in a second direction.

[0031] FIG. 2d is a perspective view showing the display panel of FIG. 1 extended in the first direction and the second direction.

[0032] FIG. 2e is a perspective view showing the display panel of FIG. 1 extended in a third direction.

[0033] FIGS. 3a and FIGS. 3b are each schematic plan views showing the display area of ​​a display panel according to one embodiment of the present invention.

[0034] FIG. 4 is a schematic diagram showing an electronic device according to one embodiment of the present invention.

[0035] FIGS. 5a to 5d are equivalent circuit diagrams of pixels of a display panel according to one embodiment of the present invention.

[0036] FIGS. 6a and FIGS. 6d are cross-sectional views schematically showing a light-emitting diode of a display panel according to one embodiment of the present invention.

[0037] FIG. 7 is a schematic plan view showing a part of the display area of ​​a display panel according to one embodiment of the present invention.

[0038] FIG. 8 is a cross-sectional view along line I-I' of the display panel of FIG. 7.

[0039] FIGS. 9a to 9h are cross-sectional views illustrating a process according to a method for manufacturing a display panel according to an embodiment of the present invention.

[0040] FIG. 10 is a schematic plan view showing a part of the display area of ​​a display panel according to one embodiment of the present invention.

[0041] FIG. 11 is a cross-sectional view schematically showing a part of a display panel according to one embodiment of the present invention.

[0042] FIG. 12 is a schematic plan view showing a part of the display area of ​​a display panel according to one embodiment of the present invention.

[0043] FIGS. 13a to 13d are cross-sectional views illustrating a process according to a method for manufacturing a display panel according to an embodiment of the present invention.

[0044] FIG. 14 is a cross-sectional view schematically showing a part of a display panel according to one embodiment of the present invention.

[0045] FIG. 15a is a schematic perspective view of an electronic device including a display panel according to one embodiment of the present invention.

[0046] FIG. 15b is a block diagram showing an electronic device including a display panel according to one embodiment of the present invention.

[0047] FIGS. 16a to 16d are schematic perspective views illustrating embodiments of an electronic device including a display panel according to one embodiment of the present invention.

[0048] FIGS. 17a to 17e are schematic perspective views illustrating embodiments of an electronic device including a display panel according to one embodiment of the present invention.

[0049] The present invention is capable of various modifications and may have various embodiments; specific embodiments are illustrated in the drawings and described in detail in the detailed description. The effects and features of the present invention, and the methods for achieving them, will become clear by referring to the embodiments described below in detail together with the drawings. However, the present invention is not limited to the embodiments disclosed below but can be implemented in various forms.

[0050] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings. When describing with reference to the drawings, identical or corresponding components are given the same reference numerals, and redundant descriptions thereof will be omitted.

[0051] In this specification, terms such as first, second, etc. are used not in a limiting sense, but for the purpose of distinguishing one component from another.

[0052] In this specification, singular expressions include plural expressions unless the context clearly indicates otherwise.

[0053] In this specification, terms such as "include" or "have" mean that the features or components described in the specification exist, and do not preclude the possibility that one or more other features or components may be added.

[0054] In this specification, when a part such as a film, region, or component is described as being on or above another part, it includes not only cases where it is immediately above the other part, but also cases where another film, region, or component is interposed therein.

[0055] In this specification, when it is stated that a membrane, region, component, etc. is connected, it includes cases where the membrane, region, or component is directly connected, or / or cases where other membranes, regions, or components are interposed between them to form an indirect connection. For example, when it is stated that a membrane, region, or component, etc. is electrically connected in this specification, it indicates cases where the membrane, region, or component, etc. are directly electrically connected, and / or cases where other membranes, regions, or components are interposed between them to form an indirect electrical connection.

[0056] In this specification, "A and / or B" indicates the case where it is A, B, or both A and B. And, "at least one of A and B" indicates the case where it is A, B, or both A and B.

[0057] In this specification, the x direction, y direction, and z direction are not limited to directions along the three axes of an orthogonal coordinate system, but can be interpreted in a broad sense that includes them. For example, the x direction, y direction, and z direction may be orthogonal to each other, but may also refer to different directions that are not orthogonal to each other.

[0058] In this specification, "planar" means when the subject part is viewed from above (e.g., when viewed from a direction perpendicular to the upper surface of the substrate), and "cross-sectional" means when the cross-section obtained by vertically cutting the subject part is viewed from the side.

[0059] In this specification, "the first component overlaps" the second component, meaning that the first component is positioned above or below the second component so that at least a portion overlaps on a plane.

[0060] Where any embodiment in this specification can be implemented differently, a specific process sequence may be performed differently from the order described. For example, two processes described consecutively may be performed substantially simultaneously or proceed in the reverse order of the description.

[0061] In the drawings, the size of components may be exaggerated or reduced for convenience of explanation. For example, the size and thickness of each component shown in the drawings are depicted arbitrarily for convenience of explanation, so the present invention is not necessarily limited to what is illustrated.

[0062] A person skilled in the art will understand that suitable features of various embodiments of the present invention may be combined or combined with one another, either partially or wholly, and may be technically linked and operate in a suitable manner. Furthermore, unless otherwise specified or implied within the technical scope of the present invention, each embodiment may be implemented independently of one another or combined with one another in any suitable manner.

[0063] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

[0064] FIG. 1 is a schematic perspective view of a display panel according to an embodiment of the present invention. FIG. 2a and FIG. 2b are perspective views showing the display panel of FIG. 1 extended in a first direction. FIG. 2c is a perspective view showing the display panel of FIG. 1 extended in a second direction. FIG. 2d is a perspective view showing the display panel of FIG. 1 extended in the first direction and the second direction. FIG. 2e is a perspective view showing the display panel of FIG. 1 extended in a third direction.

[0065] Referring to FIG. 1, a display panel (10) may include a display area (DA) and a non-display area (NDA) surrounding the boundary (or periphery) of the display area (DA). The display area (DA) may include a plurality of pixels. The display panel (10) may provide a predetermined image using light emitted from a plurality of pixels. The non-display area (NDA) may be placed outside the display area (DA). The non-display area (NDA) may completely surround the display area (DA).

[0066] The display panel (10) can be extended or retracted in various directions. The display panel (10) can be extended in a first direction (e.g., x direction and / or -x direction) by an external force applied by an external object or a user. In one embodiment, as shown in FIGS. 2a and 2b, the display area (DA) and / or non-display area (NDA) of the display panel (10) can be extended in a first direction (e.g., x direction and / or -x direction). For example, as shown in FIG. 2a, it can be extended along the x direction and -x direction, or as shown in FIG. 2b, it can be extended along the x direction while one side of the display panel (10) remains fixed.

[0067] The display panel (10) can be extended in a second direction (e.g., the y direction and / or the -y direction) by an external force applied by an external object or a user. In one embodiment, as shown in FIG. 2c, the display area (DA) and / or non-display area (NDA) of the display panel (10) can be extended in the y direction and the -y direction. In another embodiment, one side of the display panel (10) can be extended in the y direction or the -y direction while remaining fixed.

[0068] The display panel (10) can be extended in multiple directions, such as a first direction (e.g., x direction and / or -x direction) and a second direction (e.g., y direction and / or -y direction) by an external force applied by an external object or a part of a person's body. As shown in FIG. 2d, the display area (DA) and / or non-display area (NDA) of the display panel (10) can be extended in the ±x direction and ±y direction.

[0069] The display panel (10) may be extended in a third direction (e.g., z direction or -z direction) by an external force applied by an external object or part of a person's body. In one embodiment, FIG. 2e illustrates a part of the display panel (10), such as a part of the display area (DA), protruding in the z direction (e.g., thickness direction). In another embodiment, a part of the display panel (10), such as a part of the display area (DA), may be protruded along the z direction (or sunken along the -z direction).

[0070] FIGS. 2a to 2e illustrate a display panel (10) extended in a first direction, a second direction, and / or a third direction, but the present invention is not limited thereto. In other embodiments, the display panel (10) may be deformed into various irregular shapes, such as having two or more axes, being bent or twisted.

[0071] FIGS. 3a and FIGS. 3b are each schematic plan views showing the display area of ​​a display panel according to one embodiment of the present invention.

[0072] Referring to FIGS. 3a and 3b, the display area (DA) may include first areas (11) and a second area (12) surrounding each of the first areas (11). The first areas (11) may be arranged repeatedly along a first direction (e.g., x-direction) and a second direction (e.g., y-direction).

[0073] The display area (DA) may include a first area (11) and a second area (12) with different elongation rates. For example, the display panel (10) may include a first area (11) with a relatively small elongation rate and a second area (12) with a relatively large elongation rate. In this specification, the elongation rate is a numerical value representing the change in length (ÄL / L) by which the display panel (10) can be stretched without physical damage to the display panel (10) when an external force is applied to the display panel (10). Here, ÄL is the amount of change in length of the elongation area, and L represents the initial length of the elongation area. Accordingly, the elongation rate of each of the first area (11) and the second area (12) may represent the change in length of each of the first area (11) and the second area (12) when the same external force is applied to the first area (11) and the second area (12).

[0074] The fact that the elongation rate of the first region (11) is smaller than the elongation rate of the second region (12) indicates that the deformation of the first region (11) due to external force occurs relatively less. Therefore, the first region (11) can be called a low deformation region, and the second region (12) can be called a main deformation region or a high deformation region.

[0075] The first regions (11) may be spaced apart from each other and arranged two-dimensionally in the display area (DA). The first region (11) may be an area where pixels are placed, and thus, the first region (11) may be referred to as a pixel area or a light-emitting area. One or more pixels may be placed in each first region (11). In this specification, a pixel refers to a sub-pixel that emits red, green, blue, or white light.

[0076] Referring to FIG. 3a, a pixel may be placed in one first region (11). For example, a red pixel (PXr), a green pixel (PXg), or a blue pixel (PXb) may be placed in each first region (11). Referring to FIG. 3b, a pixel unit (PU) comprising a set of pixels may be provided in the first region (11). In one embodiment, each pixel unit (PU) may include a red pixel (PXr), a green pixel (PXg), and a blue pixel (PXb). The red pixel (PXr) may include a red light-emitting diode that emits red light, the green pixel (PXg) may include a green light-emitting diode that emits green light, and the blue pixel (PXb) may include a blue light-emitting diode that emits blue light.

[0077] The elongation rate of the first region (11) may be relatively smaller than the elongation rate of the second region (12) due to the light-emitting diode placed in the first region (11), electrode pads connected to the light-emitting diode, and wiring, etc.

[0078] The second region (12) may be located between adjacent first regions (11). The second region (12) may be referred to as a connecting portion that connects a plurality of first regions (11) to each other. As illustrated in FIGS. 3a and 3b, the second region (12) may have a shape that surrounds each of the first regions (11) in a planar configuration. The second region (12) may be an area where connecting wiring is arranged to electrically connect the wiring placed in each of the two adjacent first regions (11).

[0079] FIG. 4 is a schematic diagram showing an electronic device according to one embodiment of the present invention.

[0080] Referring to FIG. 4, the electronic device (1) may include a display unit (510), a controller (520), a scan driver (530), and a data driver (540). In this specification, the display unit (510) is a part that displays an image on a display panel (10) and may include a plurality of pixels (PX). The display unit (510) may be provided in a display area (DA) of the display panel (10), and the controller (520), scan driver (530), and data driver (540) may be provided in a non-display area (NDA).

[0081] A plurality of scan lines (SL1 to SLn), a plurality of data lines (DL1 to DLm), and a plurality of pixels (PX) connected thereto may be arranged in the display unit (510). Each of the pixels (PX) represents a sub-pixel. Each pixel (PX) may be connected to a corresponding scan line among the plurality of scan lines (SL1 to SLn) and a corresponding data line among the plurality of data lines (DL1 to DLm).

[0082] Each of the data lines (DL1 to DLm) can be connected to pixels (PX) located in the same column. Each of the scan lines (SL1 to SLn) can be connected to pixels (PX) located in the same row. Pixels (PX) can selectively emit light in response to data signals supplied from the data lines (DL1 to DLm) when scan signals are supplied from the scan lines (SL1 to SLn).

[0083] The controller (520) can generate control signals based on signals input from the outside and supply the control signals to the scan driver (530) and the data driver (540). The scan driver (530) can be connected to a plurality of scan lines (SL1 to SLn). The scan driver (530) can generate scan signals in response to the control signal from the controller (520) and supply them sequentially to each of the scan lines (SL1 to SLn). The data driver (540) can be connected to a plurality of data lines (DL1 to DLm). In response to the control signal from the controller (520), the data driver (540) can convert image data having a grayscale input from the controller (520) into a data signal and supply the data signal to each of the data lines (DL1 to DLm). The data signal can be input to row-unit pixels (PX) selected by the scan signal.

[0084] In one embodiment, when the display panel (10) has an active matrix structure, the display unit (510) can receive a first power supply voltage and a second power supply voltage in addition to the scan signal and data signal.

[0085] FIGS. 5a to 5d are equivalent circuit diagrams of pixels of a display panel according to one embodiment of the present invention.

[0086] FIGS. 5a to 5c are equivalent circuit diagrams schematically illustrating a pixel (PX) of a display panel (10) having a passive matrix structure, and FIG. 5d is an equivalent circuit diagram schematically illustrating a pixel (PX) of a display panel (10) having an active matrix structure.

[0087] Referring to FIG. 5a, a pixel (PX) may include a light-emitting diode (LED). A first electrode (e.g., an anode electrode) of the light-emitting diode (LED) may be electrically connected to a scan line (SL), and a second electrode (e.g., a cathode electrode) may be electrically connected to a data line (DL). In one embodiment, either a scan signal (Sn) applied to the scan line (SL) or a data signal (Dm) applied to the data line (DL) may have a negative voltage and the other may have a positive voltage. When a voltage greater than or equal to a threshold voltage is applied between the first electrode and the second electrode, the light-emitting diode (LED) emits light with a brightness corresponding to the magnitude of the applied voltage.

[0088] Referring to FIG. 5b, the connection direction of the light-emitting diode (LED) can be changed. For example, the second electrode (e.g., cathode electrode) of the light-emitting diode (LED) can be electrically connected to the scan line (SL), and the first electrode (e.g., anode electrode) can be electrically connected to the data line (DL). In this case, the direction of the voltage applied between the scan line (SL) and the data line (DL) can be opposite to each other.

[0089] Referring to FIG. 5c, a pixel (PX) may include two or more light-emitting diodes (LEDs) connected in different directions. For example, a pixel (PX) may include one light-emitting diode (LED) in which a first electrode is connected to a scan line (SL) and a second electrode is connected to a data line (DL), and another light-emitting diode (LED) in which a second electrode is connected to a scan line (SL) and a first electrode is connected to a data line (DL). In one embodiment, the polarity of a scan signal (Sn) applied to the scan line (SL) and the polarity of a data signal (Dm) applied to the data line (DL) may change over time. Depending on the direction of the voltage applied between the first electrode and the second electrode of each of the light-emitting diodes (LEDs), the light-emitting diode (LED) connected in the forward direction may emit light and the light-emitting diode (LED) connected in the reverse direction may not emit light, or the light-emitting diode (LED) connected in the forward direction may not emit light and the light-emitting diode (LED) connected in the reverse direction may emit light. Accordingly, the two light-emitting diodes (LEDs) can alternately emit light according to the scan signal (Sn) and the data signal (Dm).

[0090] Referring to FIG. 5d, a pixel (PX) may include a light-emitting diode (LED) and a pixel circuit (PC) electrically connected to the light-emitting diode (LED). The pixel circuit (PC) may include a first transistor (T1), a second transistor (T2), and a storage capacitor (Cst). The pixel circuit (PC) may be electrically connected to signal lines and voltage lines. The signal lines may include a gate line (GWL) and a data line (DL), and the voltage lines may include a first voltage line (VDDL) and a second voltage line (VSSL).

[0091] The second transistor (T2) can be electrically connected to the gate line (GWL) and the data line (DL). The gate line (GWL) can provide a gate signal (GW) to the gate electrode of the second transistor (T2). The second transistor (T2) can transmit a data signal (Dm) input from the data line (DL) to the first transistor (T1) according to the gate signal (GW) input from the gate line (GWL). The gate line (GWL) corresponds to the scan line (SL) of FIG. 5a, and the gate signal (GW) can correspond to the scan signal (Sn).

[0092] The storage capacitor (Cst) is electrically connected to the second transistor (T2) and the first voltage line (VDDL), and can store a voltage corresponding to the difference between the voltage received from the second transistor (T2) and the first power supply voltage (VDD) supplied by the first voltage line (VDDL).

[0093] The first transistor (T1) is a driving transistor capable of controlling the driving current flowing through the light-emitting diode (LED). The first transistor (T1) can be connected to the first voltage line (VDDL) and the storage capacitor (Cst). The first transistor (T1) can control the driving current flowing from the first voltage line (VDDL) to the light-emitting diode (LED) in correspondence with the voltage value stored in the storage capacitor (Cst). The light-emitting diode (LED) can emit light having a predetermined brightness by the driving current. The first electrode of the light-emitting diode (LED) is electrically connected to the first transistor (T1), and the second electrode can be electrically connected to the second voltage line (VSSL) that supplies the second power supply voltage (VSS).

[0094] FIG. 5d illustrates a pixel circuit (PC) comprising two transistors and one storage capacitor, but in other embodiments, the pixel circuit (PC) may comprise three or more transistors.

[0095] FIGS. 6a and FIGS. 6d are cross-sectional views schematically showing a light-emitting diode of a display panel according to one embodiment of the present invention.

[0096] Referring to FIG. 6a, the light-emitting diode (LED) may include an inorganic light-emitting diode containing an inorganic material. The light-emitting diode (LED) may include a first semiconductor layer (231), a second semiconductor layer (232), an intermediate layer (233) between the first semiconductor layer (231) and the second semiconductor layer (232), a first electrode (235) electrically connected to the first semiconductor layer (231), and a second electrode (238) electrically connected to the second semiconductor layer (232). The first electrode (235) and the second electrode (238) of the light-emitting diode (LED) may each be electrically connected to a first electrode pad (241) and a second electrode pad (242) disposed on the same layer.

[0097] In some embodiments, the first semiconductor layer (231) may include a p-type semiconductor layer. The p-type semiconductor layer is In x Al y Ga 1-x-y A semiconductor material having the composition formula N (0≤x≤1, 0≤y≤1, 0≤x+y≤1) can be selected from, for example, GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, etc., and p-type dopants such as Mg, Zn, Ca, Sr, and / or Ba can be doped.

[0098] The second semiconductor layer (232) may include, for example, an n-type semiconductor layer. The n-type semiconductor layer is In x Al y Ga 1-x-y A semiconductor material having the composition formula N (0≤x≤1, 0≤y≤1, 0≤x+y≤1) can be selected from, for example, GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, etc., and can be doped with an n-type dopant such as Si, Ge, and / or Sn.

[0099] The intermediate layer (233) is a region where electrons and holes recombine, and as electrons and holes recombine, they transition to a lower energy level and can generate light having a corresponding wavelength. The intermediate layer (233) is, for example, In x Al y Ga 1-x-y It can be formed by including a semiconductor material having a composition formula of N (0≤x≤1, 0≤y≤1, 0≤x+y≤1), and can be formed as a single quantum well structure or a multi-quantum well (MQW) structure. In addition, it may include a quantum wire structure or a quantum dot structure.

[0100] FIG. 6a illustrates that the first semiconductor layer (231) includes a p-type semiconductor layer and the second semiconductor layer (232) includes an n-type semiconductor layer, but the present invention is not limited thereto. In another embodiment, the first semiconductor layer (231) may include an n-type semiconductor layer and the second semiconductor layer (232) may include a p-type semiconductor layer.

[0101] FIG. 6a illustrates that the first electrode pad (241) and the second electrode pad (242) are disposed on the same layer, but the present invention is not limited thereto. Referring to FIG. 6b, the first electrode pad (241) and the second electrode pad (242) may be disposed on different layers. For example, a bank layer (230) having an opening that overlaps with at least a portion of the first electrode pad (241) may be disposed on the first electrode pad (241), and the second electrode pad (242) may be disposed on the upper surface of the bank layer (230). The structure of the light-emitting diode (LED) shown in FIG. 6b is the same as previously described with reference to FIG. 6a.

[0102] In another embodiment, as shown in FIG. 6c, the second electrode pad (242) may be positioned on both sides centered on the first electrode pad (241) in a cross-sectional view. The bank layer (230) includes an opening that overlaps at least a portion of the first electrode pad (241), and the second electrode pad (242) may be positioned around the opening of the bank layer (230). In some embodiments, the second electrode pad (242) may have a closed-loop shape that completely surrounds the opening of the bank layer (230) and / or the first electrode pad (241) in a planar view. The structure of the light-emitting diode (LED) shown in FIG. 6c is the same as previously described with reference to FIG. 6a.

[0103] FIGS. 6a to 6c illustrate the first electrode (235) and the second electrode (238) of a light-emitting diode (LED) facing in the same direction (e.g., downward direction, -z direction), but the present invention is not limited thereto. As shown in FIG. 6d, the first electrode (235) and the second electrode (238) of the light-emitting diode (LED) may face in opposite directions.

[0104] The bank layer (230) includes an opening that exposes at least a portion of the first electrode pad (241), and the thickness of the bank layer (230) may be substantially the same as the thickness of the light-emitting diode (LED). The opening of the bank layer (230) may be filled with a filling material (FM), and the second electrode pad (242) may be disposed on the upper surface of the bank layer (230) so as to be electrically connected (e.g., in contact) with the second electrode (238) of the light-emitting diode (LED). The filling material (FM) may be an organic material having insulating properties.

[0105] FIG. 7 is a schematic plan view showing a part of the display area of ​​a display panel according to one embodiment of the present invention, and FIG. 8 is a cross-sectional view along line I-I' of the display panel of FIG. 7.

[0106] Referring to FIG. 7, a pixel (PX) may be placed in a first region (11). In this regard, FIG. 7 illustrates that one pixel (PX) is placed in one first region (11). Each pixel (PX) may include a light-emitting diode (LED). The light-emitting diode (LED) may be an inorganic light-emitting diode. In one embodiment, a display panel (10, see FIG. 1) has an active matrix structure, and each pixel (PX) may include a pixel circuit (PC, see FIG. 5d) electrically connected to a light-emitting diode (LED). The pixel circuit (PC) may include transistors and capacitors, as described with reference to FIG. 5d. Hereinafter, the description will focus on the case where the display panel (10) has an active matrix structure and each pixel (PX) includes a pixel circuit (PC).

[0107] The first region (11) may have a smaller elongation rate than the second region (12). Accordingly, when the display panel (10) is stretched, the first region (11) may undergo less deformation than the second region (12). The first region (11) may be referred to as a low-deformation region (or low-deformation part) as previously described. Additionally, the first region (11) may be referred to as a pixel region or light-emitting region as an area where a light-emitting diode (LED) and a pixel circuit (PC) are placed.

[0108] The second region (12) surrounds the first region (11) and may have a greater elongation rate than the first region (11). The second region (12) may be an area where the main deformation occurs as the display device expands and contracts. Since the second region (12) is positioned between a plurality of first regions (11), it may be referred to as a connecting part that connects the first regions (11). Additionally, the second region (12) may be referred to as a main deformation area (or a peripheral deformation part) or a high deformation area (or a high deformation part). The second region (12) may be referred to as a non-pixel area or a non-luminous area, as it is an area within the display region where light-emitting diodes are not positioned.

[0109] Signal lines and / or voltage lines may be placed in the display area (DA). In one embodiment, FIG. 7 illustrates that a scan line (SL) and a data line (DL) are each placed in the first area (11). In one embodiment, the scan line (SL) may be electrically connected to the gate electrode of a transistor included in the pixel circuit (PC) through a second contact hole (CNT2). The data line (DL) may be electrically connected to one terminal of a transistor included in the pixel circuit (PC) through a fourth contact hole (CNT4). In another embodiment, the scan line (SL) may be electrically connected to a first electrode pad (241, see FIG. 6a) through a second contact hole (CNT2), and the data line (DL) may be electrically connected to a second electrode pad (242, see FIG. 6b) through a fourth contact hole (CNT4).

[0110] Two data lines (DL) placed in each of two first regions (11) adjacent in a second direction (e.g., y-direction) can be electrically connected by a connecting wire (hereinafter referred to as the first connecting wire, WL1). The first connecting wire (WL1) is placed in the second region (12) and can extend in the second direction (e.g., y-direction). The first connecting wire (WL1) can be connected to the data lines (DL) through contact electrodes (CM) and first contact holes (CNT1).

[0111] Two scan lines (SL) placed in each of two first regions (11) adjacent in a first direction (e.g., x-direction) can be electrically connected by a connecting wire (hereinafter referred to as the second connecting wire, WL2). The second connecting wire (WL2) is placed in the second region (12) and can extend in the first direction (e.g., x-direction). The second connecting wire (WL2) can be connected to the scan lines (SL) through contact electrodes (CM) and first contact holes (CNT1).

[0112] In other words, scan lines (SL) connected to pixels (PX) arranged in the same row can be electrically connected to each other by second connecting lines (WL2). Data lines (DL) connected to pixels (PX) arranged in the same column can be electrically connected to each other by first connecting lines (WL1).

[0113] Scan line (SL) and data line (DL) may intersect each other in the first region (11). In one embodiment, the data line (DL) may include a first part (DLa) and a second part (DLb) separated by the scan line (SL), and a bridge line (BL) that electrically connects the first part (DLa) and the second part (DLb). The bridge line (BL) is placed in the region where the data line (DL) and the scan line (SL) intersect, and may be placed on a different layer from the scan line (SL). In one embodiment, the first part (DLa) and the second part (DLb) of the data line (DL) are placed on the same layer as the scan line (SL), and one end of the bridge line (BL) may be connected to the first part (DLa) through the third-1 contact hole (CNT3a), and the other end of the bridge line (BL) may be connected to the second part (DLb) through the third-2 contact hole (CNT3b).

[0114] FIG. 7 illustrates a data line (DL) connected through a first part (DLa), a second part (DLb), and a bridge line (BL), but the present invention is not limited thereto. In another embodiment, a scan line (SL) may be separated into a first part and a second part and connected through a bridge line.

[0115] The elongation rate of each of the first connecting wire (WL1) and the second connecting wire (WL2) placed in the second area (12) may be greater than the elongation rate of each of the scan line (SL) and the data line (DL).

[0116] Each of the scan line (SL) and the data line (DL) may comprise one or more materials selected from aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), and / or copper (Cu). Each of the scan line (SL) and the data line (DL) may be a single layer or multiple layers comprising the aforementioned metals. In one embodiment, each of the scan line (SL) and the data line (DL) may comprise a metal thin film formed as a triple layer of a titanium (Ti) / aluminum (Al) / titanium (Ti) structure.

[0117] The first connecting wire (WL1) and the second connecting wire (WL2) may include liquid metal, a conductive composite material including a metal nanostructure, an elastic polymer, and / or an elastomer, or a conductive polymer. Thus, when the display panel (10, see FIG. 1) is stretched, the second region (12) may be deformed relatively more than the first region (11).

[0118] FIG. 7 illustrates that the first connecting wire (WL1) and the second connecting wire (WL2) are straight lines in a plane, but the present invention is not limited thereto. In one embodiment, each of the first connecting wire (WL1) and the second connecting wire (WL2) may have a wavy shape in a plane.

[0119] FIG. 7 illustrates that the scan line (SL) and the data line (DL) are each electrically connected to the second connecting wire (WL2) and the first connecting wire (WL1), respectively, but the present invention is not limited thereto. The first voltage line (VDDL) or the second voltage line (VSSL) described with reference to FIG. 5d may each be further placed in the first area (11) and may be electrically connected to additional connecting wires placed in the second area (12).

[0120] Referring to FIG. 8, the display panel (10) may include a first pixel circuit layer (PCL1) and a second pixel circuit layer (PCL2) disposed in each of two adjacent first regions (11), a first light-emitting diode (LED1) on the first pixel circuit layer (PCL1), a second light-emitting diode (LED2) on the second pixel circuit layer (PCL2), and a first connecting wire (WL1) that electrically connects the data lines (DL) of the first pixel circuit layer (PCL1) and the second pixel circuit layer (PCL2).

[0121] FIG. 8 schematically illustrates a display panel (10) having an active matrix structure in which each of the first pixel circuit layer (PCL1) and the second pixel circuit layer (PCL2) includes a pixel circuit (PC), and the pixel circuit (PC) includes transistors and capacitors, but the present invention is not limited thereto. In one embodiment, the display panel (10) has a passive matrix structure, and transistors or capacitors may be omitted. The present specification describes the case where the display panel (10) has an active matrix structure.

[0122] The base layer (EL1) may include an elastomer. For example, the base layer (EL1) is thermoplastic polyurethane, silicone, thermoplastic rubbers, elastolefin, thermoplastic olefin, polyamide, polyether block amide, synthetic polyisoprene, polybutadiene, chloroprene rubber, butyl rubber, styrene-butadiene, epichlorohydrin rubber, polyacrylic rubber, silicone rubber, fluorosilicone rubber, fluoroelastomers, ethylene-vinyl acetate, PDMS (polydimethylsiloxane), and / or It may include at least one of the ecoflex.

[0123] A base layer (EL1) has a first surface (e.g., an upper surface, a surface in the +z direction) and a second surface (e.g., a lower surface, a surface in the -z direction), and a first pixel circuit layer (PCL1) and a second pixel circuit layer (PCL2) may be disposed on the first surface of the base layer (EL1). The first pixel circuit layer (PCL1) and the second pixel circuit layer (PCL2) may be disposed spaced apart from each other in a plane.

[0124] Each of the first pixel circuit layer (PCL1) and the second pixel circuit layer (PCL2) may include inorganic insulating layers (IIL), organic insulating layers (OIL), a pixel circuit (PC), wiring (DL, SL), electrode pads (241, 242), and connecting electrodes (CM). Each of the first pixel circuit layer (PCL1) and the second pixel circuit layer (PCL2) may be disposed on a first surface (e.g., a surface in the +z direction) of the base layer (EL1).

[0125] Inorganic insulating layers (IIL) may include a first inorganic insulating layer (IIL1) disposed below a pixel circuit (PC) and second inorganic insulating layers (IIL2) disposed between conductive layers and semiconductor layers constituting the pixel circuit (PC). Organic insulating layers (OIL) may include a first organic insulating layer (OIL1) disposed on an inorganic insulating layer (IIL) and a second organic insulating layer (OIL2) disposed on the first organic insulating layer (OIL1).

[0126] The first pixel circuit layer (PCL1) and the second pixel circuit layer (PCL2) may be spaced apart from each other in a plane. As illustrated in FIG. 8, the first pixel circuit layer (PCL1) and the second pixel circuit layer (PCL2) may each be placed in the first region (11) and may have an isolated shape. The first pixel circuit layer (PCL1) and the second pixel circuit layer (PCL2) may be spaced apart by an opening (OPa) defined by inorganic insulating layers (IIL) and organic insulating layers (OIL). The opening (OPa) may be formed by the overlapping of the opening of the first inorganic insulating layer (IIL1), the opening of the second inorganic insulating layer (IIL2), the opening of the first organic insulating layer (OIL1), and the opening of the second organic insulating layer (OIL2). The opening (OPa) is positioned in the second region (12) and may surround the first pixel circuit layer (PCL1) and the second pixel circuit layer (PCL2). In one embodiment, the opening (OPa) may be filled by the base layer (EL1).

[0127] In each of the first pixel circuit layer (PCL1) and the second pixel circuit layer (PCL2), the first inorganic insulating layer (IIL1) may be disposed on the base layer (EL1), and the pixel circuit (PC) may be disposed on the first inorganic insulating layer (IIL1). The first inorganic insulating layer (IIL1) may include an inorganic insulating material such as silicon oxide, silicon nitride and / or silicon oxynitride.

[0128] The pixel circuit (PC) may include transistors and capacitors. The pixel circuit (PC) may include at least one semiconductor layer and a conductive layer disposed between the first inorganic insulating layer (IIL1) and the second inorganic insulating layer (IIL2). The semiconductor layer may include an oxide-based semiconductor material, a silicon-based semiconductor material, and / or an organic semiconductor material. The conductive layers may include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), and / or titanium (Ti), and may be formed as a multilayer or single layer including the above materials.

[0129] A first portion (DLa) and a second portion (DLb) of a data line (DL), and a scan line (SL) may be disposed on a second inorganic insulating layer (IIL2). The first portion (DLa) and the second portion (DLb) of the data line (DL), and the scan line (SL) may include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), and / or titanium (Ti), and may be formed as a multilayer or single layer including the above materials. For example, the first portion (DLa) and the second portion (DLb) of the data line (DL), and the scan line (SL) may be provided as a triple layer with a titanium (Ti) / aluminum (Al) / titanium (Ti) structure.

[0130] A first organic insulating layer (OIL1) may be disposed on the first portion (DLa) and second portion (DLb) of the data line (DL) and on the scan line (SL). The first organic insulating layer (OIL1) may include an organic insulating material. The organic insulating material may include acrylic resin, epoxy resin, polyimide, polyethylene, etc. The first organic insulating layer (OIL1) may cover the sides of the inorganic insulating layers (IIL).

[0131] Bridge wires (BL) and first contact electrodes (CM1) may be disposed on the first organic insulating layer (OIL1). Each of the first contact electrodes (CM1) may be electrically connected to one of the first part (DLa) and the second part (DLb) of the data line (DL) through a contact hole penetrating the first organic insulating layer (OIL1). One end of the bridge wire (BL) may be electrically connected to the first part (DLa) of the data line (DL) through a contact hole penetrating the first organic insulating layer (OIL1), and the other end of the bridge wire (BL) may be electrically connected to the second part (DLb) through a contact hole penetrating the first organic insulating layer (OIL1). The bridge wire (BL) and the first contact electrode (CM1) may include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may be formed as a multilayer or single layer including the above materials. For example, the bridge wire (BL) and the first contact electrode (CM1) may be provided as a triple layer with a titanium (Ti) / aluminum (Al) / titanium (Ti) structure.

[0132] A second organic insulating layer (OIL2) may be disposed on the bridge wire (BL) and the first contact electrode (CM1). The second organic insulating layer (OIL2) may include an organic insulating material.

[0133] A first electrode pad (241), a second electrode pad (242), and a second contact electrode (CM2) may be disposed on a second organic insulating layer (OIL2). The first electrode pad (241), the second electrode pad (242), and the second contact electrode (CM2) may include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may be formed as a multilayer or single layer including the above materials. For example, the first electrode pad (241), the second electrode pad (242), and the second contact electrode (CM2) may be provided as a triple layer with a titanium (Ti) / aluminum (Al) / titanium (Ti) structure. Each of the second contact electrodes (CM2) may be connected to the first contact electrode (CM1) through a contact hole penetrating the second organic insulating layer (OIL2).

[0134] The first connecting wire (WL1) may be placed on the first surface (e.g., the surface in the +z direction) of the base layer (EL1). The first connecting wire (WL1) may be placed in the second region (12) and electrically connected to the second contact electrode (CM2) of the first pixel circuit layer (PCL1) and the second contact electrode (CM2) of the second pixel circuit layer (PCL2). The first connecting wire (WL1) may electrically connect two data lines (DL) (e.g., the first wire and the second wire) placed in each of the two adjacent first regions (11) through the contact electrodes (CM). One end of the first connecting wire (WL1) can be in contact with the second contact electrode (CM2) of the first pixel circuit layer (PCL1), and the other end of the first connecting wire (WL1) can be in contact with the second contact electrode (CM2) of the second pixel circuit layer (PCL2).

[0135] The first electrode pad (241) and the second electrode pad (242) can be electrically connected to the transistors of the lower pixel circuit (PC) through connecting electrodes (not shown) disposed between the first organic insulating layer (OIL1) and the second organic insulating layer (OIL2).

[0136] A first light-emitting diode (LED1) may be placed on a first pixel circuit layer (PCL1), and a second light-emitting diode (LED2) may be placed on a second pixel circuit layer (PCL2). The first light-emitting diode (LED1) may be electrically connected to the first electrode pad (241) and the second electrode pad (242) of the first pixel circuit layer (PCL1), and the second light-emitting diode (LED2) may be electrically connected to the first electrode pad (241) and the second electrode pad (242) of the second pixel circuit layer (PCL2). Each of the first light-emitting diode (LED1) and the second light-emitting diode (LED2) may have the same or similar structure as the light-emitting diode (LED) described above with reference to FIG. 6a. In another embodiment, the light-emitting diode (LED) may have a structure as shown in FIGS. 6b to 6d.

[0137] Bonding layers (BDs) may be interposed between the first and second electrode pads (241, 242) and the light-emitting diodes (LED1, LED2). The bonding layers (BDs) may be patterned corresponding to the first and second electrode pads (241, 242). Each of the bonding layers (BDs) may comprise copper (Cu), indium (In), gold (Au), tin (Sn), or an alloy thereof. In one embodiment, each of the bonding layers (BDs) may comprise a conductive composite material comprising conductive particles, metal nanostructures, and / or an elastomer.

[0138] Each of the first light-emitting diode (LED1) and the second light-emitting diode (LED2) can be covered by a protective layer (240). The protective layer (240) may include an organic insulating material with relatively high hardness so as to secure the light-emitting diodes (LED1, LED2) to the lower layers. The protective layer (240) can reduce mechanical damage to the light-emitting diodes (LED1, LED2) when the display panel (10) is stretched.

[0139] Each of the first light-emitting diode (LED1) and the second light-emitting diode (LED2) may have a first height (h1) in a third direction (e.g., the z direction or the thickness direction of the display panel (10). Each of the first connecting wire (WL1), the first electrode pad (241), and the second electrode pad (242) may have a lower surface (a surface in the -z direction) facing the base layer (EL1) and an upper surface (a surface in the +z direction) facing the lower surface. The upper surface of the first connecting wire (WL1) may protrude in a third direction (e.g., the z direction) from the upper surface of the first electrode pad (241) and the upper surface of the second electrode pad (242). For example, the upper surface of the first connecting wire (WL1) has a second height (h2) based on the upper surfaces of the first and second electrode pads (241, 242), and the second height (h2) may be 1% to 200% of the first height (h1). The second height (h2) may be adjusted by taking into account the thickness of the resin layer of the carrier substrate that transports the light-emitting diodes (LED1, LED2).

[0140] When bonding light-emitting diodes (LED1, LED2) to the first and second electrode pads (241, 242), the upper surface of the first connecting wire (WL1) may come into contact with the lower surface (-z direction surface) of the resin layer of the carrier substrate. Since the upper surface of the first connecting wire (WL1) protrudes from the upper surface of the first electrode pad (241) and the upper surface of the second electrode pad (242), even when the transfer substrate is not uniformly pressed, the pressure concentrated in some areas can be dispersed to prevent over-pressure of the bonding layer (BD).

[0141] In some embodiments, as shown in FIGS. 6b to 6d, the upper surface of the first electrode pad (241) and the upper surface of the second electrode pad (242) may be located at different levels. In this case, the second height (h2) may be determined based on the higher surface (the surface further from the base layer (EL1)) between the upper surface of the first electrode pad (241) and the upper surface of the second electrode pad (242).

[0142] A cover layer (EL2) may be disposed on light-emitting diodes (LED1, LED2), a protective layer (240), and a first connecting wire (WL1). The cover layer (EL2) may include an elastomer. For example, the cover layer (EL2) is thermoplastic polyurethane, silicone, thermoplastic rubbers, elastolefin, thermoplastic olefin, polyamide, polyether block amide, synthetic polyisoprene, polybutadiene, chloroprene rubber, butyl rubber, styrene-butadiene, epichlorohydrin rubber, polyacrylic rubber, silicone rubber, fluorosilicone rubber, fluoroelastomers, ethylene-vinyl acetate, PDMS (polydimethylsiloxane), and / or It may include at least one of the ecoflex.

[0143] The cover layer (EL2) can cover the light-emitting diodes (LED1, LED2) and the first connecting wire (WL1). The cover layer (EL2) can absorb stress that may be transmitted to the light-emitting diodes (LED1, LED2) and the first connecting wire (WL1) during the stretching of the display panel (10), and can flatten the upper surface of the display panel (10).

[0144] The base layer (EL1) fills the opening (OPa), and in the second region (12), the level of the upper surface of the base layer (EL1) (e.g., the surface in the +z direction) may be substantially the same as the level of the upper surface of the organic insulating layer (OIL), e.g., the upper surface of the second organic insulating layer (OIL2) (e.g., the surface in the +z direction). The second region (12), where inorganic insulating layers (IIL) and organic insulating layers (OIL) are not present, may be relatively prone to deformation. The lower surface of the first connecting wire (WL1) (e.g., the surface in the -z direction) may come into direct contact with the upper surface of the base layer (EL1) in the second region (12). The upper surface (e.g., the surface in the +z direction) and the side surface of the first connecting wire (WL1) may come into direct contact with the cover layer (EL2).

[0145] The cover layer (EL2) may come into direct contact with a portion of the upper surface of the base layer (EL1) exposed from the protective layer (240) and the connecting wires (WL1, WL2). In one embodiment, if the material of the base layer (EL1) and the material of the cover layer (EL2) are the same, the bonding strength between the base layer (EL1) and the cover layer (EL2) may be increased, thereby improving the airtightness of the display panel (10).

[0146] FIG. 8 illustrates that the first connecting wire (WL1) electrically connects the data line (DL) of the first pixel circuit layer (PCL1) and the data line (DL) of the second pixel circuit layer (PCL2), but the present invention is not limited thereto. Each of the signal lines and / or voltage lines electrically connected to pixels (PX, see FIG. 4) of the same row or same column may be electrically connected through a connecting wire having the same or similar structure as the first connecting wire (WL1).

[0147] FIGS. 9a to 9h are cross-sectional views illustrating a process according to a method for manufacturing a display panel according to an embodiment of the present invention.

[0148] Referring to FIG. 9a, a first carrier substrate (CS1) can be prepared. In one embodiment, the first carrier substrate (CS1) may include a first substrate (100) and a first resin layer (110) disposed on the first substrate (100). The first substrate (100) may be a rigid substrate. For example, the first substrate (100) may be a transparent glass substrate with silicon oxide as the main component, or a substrate comprising a polymer resin material such as reinforced plastic. The first resin layer (110) may include a polymer resin. For example, the first resin layer (110) may include polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate and / or cellulose acetate propionate, etc. In one embodiment, the thickness of the first resin layer (110) may be greater than the thickness of the substrate (100).

[0149] A pixel circuit layer (PCL) may be formed on a first carrier substrate (CS1). The pixel circuit layer (PCL) may include inorganic insulating layers (IIL), organic insulating layers (OIL), pixel circuits (PC), wiring (DL, SL), electrode pads (241, 242), and connecting electrodes (CM). The inorganic insulating layers (IIL) may include a first inorganic insulating layer (IIL1) disposed below the pixel circuit (PC) and second inorganic insulating layers (IIL2) disposed between the conductive layers and semiconductor layers constituting the pixel circuit (PC). The organic insulating layers (OIL) may include a first organic insulating layer (OIL1) disposed on the inorganic insulating layer (IIL) and a second organic insulating layer (OIL2) disposed on the first organic insulating layer (OIL1).

[0150] Each of the first contact electrodes (CM1) can be connected to a first part (DLa) or a second part (DLb) of the data line (DL) through a contact hole penetrating the first organic insulating layer (OIL1). Each of the second contact electrodes (CM2) can be connected to the first contact electrode (CM1) through a contact hole penetrating the second organic insulating layer (OIL2). A bridge line (BL) can electrically connect the first part (DLa) and the second part (DLb) of the data line (DL).

[0151] Inorganic insulating layers (IIL) may be placed only in the first region (11) and not in the second region (12). For example, a portion of the first region (11) that overlaps with the second region (12) may be removed through an etching process.

[0152] Referring to FIG. 9b, a bonding layer (BD) may be formed on the first electrode pads (241) and the second electrode pads (242). The bonding layer (BD) may be formed by patterning to overlap each of the first electrode pads (241) and the second electrode pads (242).

[0153] Referring to FIG. 9c, a first connecting wire (WL1) can be formed to electrically connect data lines (DL) placed in two adjacent first regions (11). The first connecting wire (WL1) can be placed in a second region (12) between two adjacent first regions (11) and can extend from either of the two adjacent first regions (11) across the second region (12) toward the other.

[0154] A data line (DL) placed in one first area (11) may be referred to as the first wiring, and a data line (DL) placed in another first area (11) may be referred to as the second wiring. One end of the first connecting wiring (WL1) may be formed to contact a second contact electrode (CM2) electrically connected to the first wiring, and the other end of the first connecting wiring (WL1) may be formed to contact a second contact electrode (CM2) electrically connected to the second wiring.

[0155] In one embodiment, the first connecting wire (WL1) may include a liquid metal or a conductive composite material including a metal nanostructure, an elastic polymer, and / or an elastomer. The first connecting wire (WL1) may be formed through a deposition process, a screen printing process, an inkjet printing process, and / or coating, etc. The upper surface of the first connecting wire (WL1) may protrude in a third direction (e.g., z-direction) from the upper surface of the first electrode pad (241) and the upper surface of the second electrode pad (242).

[0156] Referring to FIG. 9d, a first light-emitting diode (LED1) can be attached to first and second electrode pads (241, 242) placed in one first region (11) using a second carrier substrate (CS2), and a second light-emitting diode (LED2) can be attached to first and second electrode pads (241, 242) placed in another first region (11).

[0157] The second carrier substrate (CS2) may include a second substrate (300) and a second resin layer (310) disposed on the lower surface of the second substrate (300) (e.g., the surface facing the first carrier substrate (CS1)). The second substrate (300) may be a rigid substrate. For example, the second substrate (300) may be a transparent glass substrate with silicon oxide as the main component, or a substrate comprising a polymer resin material such as reinforced plastic. The second resin layer (310) may include an elastomer. The second resin layer (310) is thermoplastic polyurethane, silicone, thermoplastic rubbers, elastolefin, thermoplastic olefin, polyamide, polyether block amide, synthetic polyisoprene, polybutadiene, chloroprene rubber, butyl rubber, styrene-butadiene, epichlorohydrin rubber, polyacrylic rubber, silicone rubber, fluorosilicone rubber, fluoroelastomers, ethylene-vinyl acetate, PDMS (polydimethylsiloxane), and / or It may include at least one of the ecoflex.

[0158] On the lower surface of the second resin layer (310) (the surface facing the first carrier substrate (CS1)), light-emitting diodes (LED1, LED2) may be repeatedly arranged along a first direction (e.g., x-direction) and a second direction (e.g., y-direction). Each of the light-emitting diodes (LED1, LED2) may be arranged such that a first electrode (235, see FIG. 6A) and a second electrode (238, see FIG. 6A) correspond to a first electrode pad (241) and a second electrode pad (242). The light-emitting diodes (LED1, LED2) may be attached to and moved on the second resin layer (310) of the second carrier substrate (CS2) such that the first electrode (235) and the second electrode (238) face the first carrier substrate (CS1).

[0159] By pressing the second carrier substrate (CS2), each of the light-emitting diodes (LED1, LED2) can be bonded to the corresponding first and second electrode pads (241, 242). When the second carrier substrate (CS2) is pressed, the first connecting wire (WL1) can come into contact with the second resin layer (310). That is, the upper surface of the first connecting wire (WL1) comes into contact with the lower surface of the second resin layer (310) and can function as a spacer that evenly distributes the pressure of the second carrier substrate (CS2).

[0160] Each of the first light-emitting diode (LED1) and the second light-emitting diode (LED2) may have a first height (h1) in the third direction (e.g., z direction), and the second resin layer (310) may have a third height (h3) in the third direction (e.g., z direction). The upper surface of the first connecting wire (WL1) may have a second height (h2) based on the upper surfaces of the first and second electrode pads (241, 242). As the third height (h3) increases, the second height (h2) may decrease. That is, as the thickness of the second resin layer (310) decreases, the thickness of the first connecting wire (WL1) can be increased to uniformly distribute pressure when the second carrier substrate (CS2) is pressed. The second height (h2) may be 1% to 200% of the first height (h1).

[0161] In one embodiment, the Young's modulus of the first connecting wire (WL1) may be greater than the Young's modulus of the second resin layer (310). The Young's modulus of the first connecting wire (WL1) may be 100% to 300% of the Young's modulus of the second resin layer (310).

[0162] Referring to FIG. 9e, the second carrier substrate (CS2) can be removed, and a protective layer (240) covering each of the light-emitting diodes (LED1, LED2) can be formed. After forming the protective layers (240), a cover layer (EL2) covering the light-emitting diodes (LED1, LED2), the protective layers (240), and the first connecting wires (WL1) can be formed. The cover layer (EL2) can be in direct contact with the upper surface (e.g., the surface in the +z direction) and the side surface of the first connecting wires (WL1). The cover layer (EL2) can be formed by coating a material (e.g., an elastomer) that forms the cover layer (EL2) and then curing it. The curing process may utilize heat or light such as UV.

[0163] A third carrier substrate (CS3) may be attached to the cover layer (EL2). In one embodiment, the third carrier substrate (CS3) may be a rigid substrate. For example, the third carrier substrate (CS3) may be a transparent glass substrate with silicon oxide as the main component, or a substrate containing a polymer resin material such as reinforced plastic.

[0164] Referring to FIG. 9f, an opening (OPa) can be formed by removing the first carrier substrate (CS1) and removing a portion of the pixel circuit layer (PCL) overlapping the second region (12). First, in the structure according to the process of FIG. 9e, a laser can be irradiated onto the lower surface of the first carrier substrate (CS1) (e.g., the surface in the -z direction) to remove the first substrate (100) from the first resin layer (110). Afterward, the upper and lower sides of the structure from which the first substrate (100) has been removed can be inverted, and then a portion of the pixel circuit layer (PCL) overlapping the first resin layer (110) and the second region (12) can be removed through a dry etching process. At this time, since the etching rate of the second inorganic insulating layer (IIL2) is lower than the etching rate of the organic insulating layers (OIL), the second inorganic insulating layer (IIL2) can function as a mask. Accordingly, the pixel circuit layer (PCL) overlapping the first regions (11) is not etched, and the first pixel circuit layer (PCL1) and the second pixel circuit layer (PCL2) can be formed in an isolated shape. A portion of the pixel circuit layer (PCL) overlapping the second region (12) can be removed to form an opening (OPa). The opening (OPa) can surround the first pixel circuit layer (PCL1) and the second pixel circuit layer (PCL2), respectively, on a plane.

[0165] Referring to FIG. 9g, a base layer (EL1) can be formed on the structure of FIG. 9f. The base layer (EL1) can be arranged to cover the first pixel circuit layer (PCL1) and the second pixel circuit layer (PCL2). The base layer (EL1) can fill the opening (OPa). The base layer (EL1) can directly contact one side of the first connecting wire (WL1) through the opening (OPa). The base layer (EL1) can directly contact a part of the cover layer (EL2). The base layer (EL1) can support the components of the display panel (10, see FIG. 1) and can absorb stress generated during the stretching of the display panel (10).

[0166] Referring to FIG. 9h, the structure of FIG. 9g can be inverted again and the third carrier substrate (CS3) removed to form a display panel (10) as shown in FIG. 8. The third carrier substrate (CS3) can be removed by a laser lift-off process or by using a peel tape.

[0167] FIG. 10 is a schematic plan view showing a part of the display area of ​​a display panel according to one embodiment of the present invention.

[0168] Referring to FIG. 10, two or more pixels (PX) may be placed in a first region (11). Each pixel (PX) may include a light-emitting diode (LED, see FIG. 5a). In one embodiment, a display panel (10, see FIG. 1) has an active matrix structure, and each pixel (PX) may include a pixel circuit (PC, see FIG. 5d) electrically connected to a light-emitting diode (LED). The pixel circuit (PC) may include transistors and capacitors.

[0169] The first region (11) may have a smaller elongation rate than the second region (12). The first region (11) is an area where light-emitting diodes are placed and may be referred to as a pixel area or a light-emitting area. The second region (12) surrounds the first region (11) and may have a larger elongation rate than the first region (11). The second region (12) is an area within the display region where light-emitting diodes are not placed and may be referred to as a non-pixel area or a non-light-emitting area.

[0170] Signal lines and / or voltage lines may be placed in the display area (DA). FIG. 10 illustrates that a scan line (SL) and a data line (DL) are each placed in the first area (11), but the invention is not limited thereto. Various signal lines and voltage lines may be further placed in the first area (11), and additional connecting lines connecting the signal lines and voltage lines may be further placed in the second area (12).

[0171] In one embodiment, the scan line (SL) may be electrically connected to the gate electrode of the transistor included in the pixel circuit (PC) through the second contact hole (CNT2). The data line (DL) may be electrically connected to one terminal of the transistor included in the corresponding pixel circuit (PC) through the fourth contact hole (CNT4). In another embodiment, the scan line (SL) may be electrically connected to the first electrode pad (241, see FIG. 6a) through the second contact hole (CNT2), and the data line (DL) may be electrically connected to the second electrode pad (242, see FIG. 6b) through the fourth contact hole (CNT4).

[0172] Three data lines (DL) may be placed in one first region (11). Corresponding data lines (DL) placed in each of two first regions (11) adjacent in a second direction (e.g., y-direction) may be electrically connected by a connecting wire (hereinafter referred to as the first connecting wire, WL1). The first connecting wire (WL1) is placed in the second region (12) and may extend in the second direction (e.g., y-direction). The first connecting wire (WL1) may be connected to the data lines (DL) through contact electrodes (CM) and first contact holes (CNT1).

[0173] Two scan lines (SL) placed in each of two first regions (11) adjacent in a first direction (e.g., x-direction) can be electrically connected by a connecting wire (hereinafter referred to as the second connecting wire, WL2). The second connecting wire (WL2) is placed in the second region (12) and can extend in the first direction (e.g., x-direction). The second connecting wire (WL2) can be connected to the scan lines (SL) through contact electrodes (CM) and first contact holes (CNT1).

[0174] Scan line (SL) and data line (DL) may intersect each other in the first region (11). In one embodiment, the data line (DL) may include a first part (DLa) and a second part (DLb) separated by the scan line (SL), and a bridge line (BL) that electrically connects the first part (DLa) and the second part (DLb). The bridge line (BL) is placed in the region where the data line (DL) and the scan line (SL) intersect, and may be placed on a different layer from the scan line (SL). In one embodiment, the first part (DLa) and the second part (DLb) of the data line (DL) are placed on the same layer as the scan line (SL), and one end of the bridge line (BL) may be connected to the first part (DLa) through the third-1 contact hole (CNT3a), and the other end of the bridge line (BL) may be connected to the second part (DLb) through the third-2 contact hole (CNT3b).

[0175] The connecting wires (WL1, WL2) placed in the second area (12) can be stretched better than the wires placed in the first area (11), such as the scan line (SL) and the data line (DL). The elongation rate of each of the first connecting wire (WL1) and the second connecting wire (WL2) can be greater than the elongation rate of each of the scan line (SL) and the data line (DL).

[0176] Each of the scan line (SL) and the data line (DL) may comprise one or more materials selected from aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), and / or copper (Cu). Each of the scan line (SL) and the data line (DL) may be a single layer or multiple layers comprising the aforementioned metals. In one embodiment, each of the scan line (SL) and the data line (DL) may comprise a metal thin film formed as a triple layer of a titanium (Ti) / aluminum (Al) / titanium (Ti) structure. The first connecting wire (WL1) and the second connecting wire (WL2) may include liquid metal, a conductive composite material including a metal nanostructure, an elastic polymer, and / or an elastomer, or a conductive polymer.

[0177] FIG. 11 is a cross-sectional view schematically showing a part of a display panel according to one embodiment of the present invention. FIG. 12 is a plan view schematically showing a part of a display area of ​​a display panel according to one embodiment of the present invention.

[0178] The display panel (10) of FIG. 11 is similar to the display panel (10) shown in FIG. 8, but differs in that the cross-section of the first connecting wire (WL1) has a convex shape at the center. Hereinafter, descriptions of identical or similar configurations will be omitted, and the explanation will focus on the differences.

[0179] Referring to FIG. 11, the first connecting wire (WL1) may become thicker in a third direction (e.g., z-direction, thickness direction) as it moves away from the light-emitting diodes (LED1, LED2). That is, the first connecting wire (WL1) may have a convex shape at its center, becoming thicker as it approaches the midpoint between the first light-emitting diode (LED1) and the second light-emitting diode (LED2), and thinner as it approaches each of the first light-emitting diode (LED1) and the second light-emitting diode (LED2).

[0180] The portion of the first connecting wire (WL1) far from the light-emitting diodes (LED1, LED2) can function as a spacer by contacting the second resin layer (310, see FIG. 9d) when bonding the light-emitting diodes (LED1, LED2) by pressing the second carrier substrate (CS2, see FIG. 9d). At this time, the portion close to the light-emitting diodes (LED1, LED2) of the first connecting wire (WL1) is relatively thin, so interference with the bonding process caused by deformation, etc., can be reduced or prevented. This shape can be applied in the same way to other connecting wires (e.g., the second connecting wire, WL2).

[0181] Referring to FIG. 12, the width of the first connecting wire (WL1) may increase in the direction intersecting the extension direction (e.g., y direction) of the first connecting wire (WL1) (e.g., y direction) as it moves further away from the pixel (PX, or light-emitting diode) on the plane (e.g., x direction). The width of the second connecting wire (WL2) may increase in the direction intersecting the extension direction (e.g., x direction) of the second connecting wire (WL2) (e.g., y direction) as it moves further away from the pixel (PX, or light-emitting diode) on the plane (e.g., x direction).

[0182] For example, the first connecting wire (WL1) may have a first width (w1) in a second direction (e.g., y-direction) at both ends close to the pixel (PX) and a second width (w2) in a second direction (e.g., y-direction) at an intermediate point between the connecting pixels (PX). Likewise, the second connecting wire (WL2) may have a first width (w1) in a first direction (e.g., x-direction) at both ends close to the pixel (PX) and a second width (w2) in a first direction (e.g., x-direction) at an intermediate point between the connecting pixels (PX). The second width (w2) may be larger than the first width (w1).

[0183] The material forming the first connecting wire (WL1) and the second connecting wire (WL2) can have a high height at the midpoint between pixels (PX) having a large width as it contracts due to surface tension. Accordingly, as shown in FIG. 11, the first connecting wire (WL1) and the second connecting wire (WL2) can more easily form a convex shape that is thicker in the third direction (e.g., z-direction, thickness direction) as they move away from the light-emitting diodes (LED1, LED2).

[0184] FIGS. 13a to 13d are cross-sectional views illustrating a process according to a method for manufacturing a display panel according to an embodiment of the present invention.

[0185] Referring to FIG. 13a, an opening (OPa) can be formed by removing a portion of the pixel circuit layer (PCL) overlapping the second region (12) in the structure of FIG. 9a through a dry etching process. In one embodiment, a hard mask layer having an opening overlapping the second region (12) can be formed on the pixel circuit layer (PCL), and the pixel circuit layer (PCL) can be dry etched using this, and the hard mask layer can be removed to form the opening (OPa). The pixel circuit layers (PCL) overlapping the first regions (11) are not etched, and a first pixel circuit layer (PCL1) and a second pixel circuit layer (PCL2) of an isolated shape can be formed. The opening (OPa) can surround each of the first pixel circuit layer (PCL1) and the second pixel circuit layer (PCL2) on a plane.

[0186] A bonding layer (BD) may be formed on the first electrode pads (241) and the second electrode pads (242). The bonding layer (BD) may be formed by patterning to overlap each of the first electrode pads (241) and the second electrode pads (242).

[0187] Referring to FIG. 13b, a first connecting wire (WL1) can be formed to electrically connect data lines (DL) placed in two adjacent first regions (11). The first connecting wire (WL1) can be placed in a second region (12) between two adjacent first regions (11) and can extend from one of the two adjacent first regions (11) toward the other.

[0188] A data line (DL) placed in one first area (11) may be referred to as the first wiring, and a data line (DL) placed in another first area (11) may be referred to as the second wiring. One end of the first connecting wiring (WL1) may be formed to contact a second contact electrode (CM2) electrically connected to the first wiring, and the other end of the first connecting wiring (WL1) may be formed to contact a second contact electrode (CM2) electrically connected to the second wiring.

[0189] At this time, the first connecting wire (WL1) can fill a portion of the opening (OPa). For example, the lower surface of the first connecting wire (WL1) (e.g., the surface in the -z direction) can come into direct contact with the first resin layer (110) through the opening (OPa). Thus, the first connecting wire (WL1) can be prevented from protruding excessively from the upper surface of the first and second electrode pads (241, 242). Additionally, as the first connecting wire (WL1) comes into direct contact with the side of the organic insulating layer (OIL) through the opening (OPa), the connection between the first connecting wire (WL1) and the first pixel circuit layer (PCL1) and the second pixel circuit layer (PCL2) can be strengthened.

[0190] Referring to FIG. 13c, a first light-emitting diode (LED1) can be attached to first and second electrode pads (241, 242) placed in one first region (11) using a second carrier substrate (CS2), and a second light-emitting diode (LED2) can be attached to first and second electrode pads (241, 242) placed in another first region (11).

[0191] The second carrier substrate (CS2) may include a second substrate (300) and a second resin layer (310) disposed on the lower surface of the second substrate (300) (e.g., the surface facing the first carrier substrate (CS1)). The second substrate (300) may be a rigid substrate. For example, the second substrate (300) may be a transparent glass substrate with silicon oxide as the main component, or a substrate comprising a polymer resin material such as reinforced plastic. The second resin layer (310) may include an elastomer.

[0192] On the lower surface of the second resin layer (310) (the surface facing the first carrier substrate (CS1)), light-emitting diodes (LED1, LED2) may be repeatedly arranged along a first direction (e.g., x direction) and a second direction (e.g., y direction). Each of the light-emitting diodes (LED1, LED2) may be arranged such that a first electrode (235, see FIG. 6A) and a second electrode (238, see FIG. 6A) correspond to a first electrode pad (241) and a second electrode pad (242).

[0193] By pressing the second carrier substrate (CS2), each of the light-emitting diodes (LED1, LED2) can be bonded to the corresponding first and second electrode pads (241, 242). When the second carrier substrate (CS2) is pressed, the first connecting wire (WL1) can come into contact with the second resin layer (310). That is, the upper surface of the first connecting wire (WL1) comes into contact with the lower surface of the second resin layer (310) and can function as a spacer for the second carrier substrate (CS2).

[0194] Each of the first light-emitting diode (LED1) and the second light-emitting diode (LED2) may have a first height (h1) in the third direction (e.g., z direction), and the second resin layer (310) may have a third height (h3) in the third direction (e.g., z direction). The upper surface of the first connecting wire (WL1) may have a second height (h2) based on the upper surfaces of the first and second electrode pads (241, 242). As the third height (h3) increases, the second height (h2) may decrease, and the same may be true in the opposite case. That is, as the thickness of the second resin layer (310) decreases, the thickness of the first connecting wire (WL1) can be increased to evenly distribute the pressure when the second carrier substrate (CS2) is pressed. The second height (h2) may be 1% to 200% of the first height (h1).

[0195] In one embodiment, the Young's modulus of the first connecting wire (WL1) may be greater than the Young's modulus of the second resin layer (310). The Young's modulus of the first connecting wire (WL1) may be 100% to 300% of the Young's modulus of the second resin layer (310).

[0196] Referring to FIG. 13d, the second carrier substrate (CS2) can be removed, and a protective layer (240) covering each of the light-emitting diodes (LED1, LED2) can be formed. After forming the protective layers (240), a cover layer (EL2) covering the light-emitting diodes (LED1, LED2), the protective layers (240), and the first connecting wires (WL1) can be formed. The cover layer (EL2) can be in direct contact with the upper surface (e.g., the surface in the +z direction) and the side surface of the first connecting wires (WL1). Afterward, the first carrier substrate (CS1) and the first resin layer (110) can be removed, and a base layer (EL1) can be formed. The base layer (EL1) can be positioned to cover the lower surface (e.g., the surface in the -z direction) of the first pixel circuit layer (PCL1) and the second pixel circuit layer (PCL2). As described with reference to FIG. 9g, a structure having a cover layer (EL2) formed thereon can be attached to a third carrier substrate (CS3) and inverted vertically so that the first resin layer (110) is removed and a base layer (EL1) can be formed. The base layer (EL1) can be in direct contact with one side of the first connecting wire (WL1) that fills the opening (OPa). The base layer (EL1) can be in direct contact with a part of the cover layer (EL2).

[0197] FIGS. 13a to 13d illustrate the formation of an opening (OPa) by etching both the first organic insulating layer (OIL1) and the second organic insulating layer (OIL2), but the present invention is not limited thereto. Only a portion of the organic insulating layers (OIL) may be etched to form a groove corresponding to the planar shape of the first connecting wire (WL1). In this case, similar to the process described in FIG. 9f, the opening (OPa) may be formed in the process of removing the first carrier substrate (CS1).

[0198] FIG. 14 is a schematic cross-sectional view of a portion of a display panel according to an embodiment of the present invention. FIG. 14 is similar to FIG. 13d, but differs in that the side of the opening (OPa) has a stepped shape.

[0199] Referring to FIG. 14, the organic insulating layers (OIL) forming the sides of the opening (OPa) may have a step with respect to the upper surface of the base layer (EL1) (e.g., the surface in the +z direction). For example, the first organic insulating layer (OIL1) may have a stepped cross-section corresponding to the inorganic insulating layers (IIL) having the step. The end of the first organic insulating layer (OIL1) may be positioned closer to the center of the opening (OPa) than the end of the second organic insulating layer (OIL2). This structure can be formed by patterning the first organic insulating layer (OIL1) and the second organic insulating layer (OIL2), respectively. For example, a first organic insulating layer (OIL1) can be formed by patterning it to correspond to inorganic insulating layers (IIL), and a second organic insulating layer (OIL2) can be formed by patterning it to correspond to the first organic insulating layer (OIL1). The first organic insulating layer (OIL1) can cover the side of the inorganic insulating layer (IIL).

[0200] FIG. 15a is a schematic perspective view of an electronic device including a display panel according to one embodiment of the present invention, and FIG. 15b is a schematic block diagram of an electronic device including a display panel according to one embodiment of the present invention.

[0201] Referring to FIG. 15a, the electronic device (1) can be freely deformed in three dimensions and can provide a three-dimensional image surface through the display area (DA). The statement that the electronic device (1) can be freely deformed in three dimensions is distinguished from the operation of an electronic device having a rollable display device, such as when a part of the rolled-up display area is visible to the user, and then another part of the rolled-up display area is unfolded so that the entire display area is visible to the user (or when the entire unfolded display area is visible to the user, and then the display area is rolled up so that only a part of the display area is visible to the user). The electronic device (1) according to embodiments of the present invention can exhibit deformation such as increasing or decreasing the area of ​​the entire display area (DA) as it deforms in the x direction, y direction, and / or z direction.

[0202] Referring to FIG. 15b, the electronic device (1) may include a processor (1100), memory (1200), input module (1300), display module (1400), power module (1500), built-in module (1600), and external module (1700). According to one embodiment, at least one of the above-described components may be omitted from the electronic device (1), or one or more other components may be added. According to one embodiment, some of the above-described components (e.g., built-in module (1600)) may be integrated into another component (e.g., display module (1400)).

[0203] The processor (1100) can execute software to control at least one other component (e.g., a hardware or software component) of the electronic device (1) connected to the processor (1100) and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (1100) can store commands or data received from other components (e.g., an input module (1300), a sensor module (1610), or a communication module (1730)) in a volatile memory (1210), process the commands or data stored in the volatile memory (1210), and store the resulting data in a non-volatile memory (1220).

[0204] The processor (1100) may include a main processor (1110) and an auxiliary processor (1120). The main processor (1110) may include at least one of a central processing unit (1111, CPU) or an application processor (AP). The main processor (1110) may further include at least one of a graphic processing unit (1112, GPU), a communication processor (CP), or an image signal processor (ISP). The main processor (1110) may further include a neural processing unit (1113, NPU). The neural processing unit is a processor specialized for processing artificial intelligence models, and the artificial intelligence model may be generated through machine learning. The artificial intelligence model may include a plurality of artificial neural network layers. An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially. At least two of the processing unit and processor described above may be implemented as a single integrated configuration (e.g., a single chip), or each may be implemented as an independent configuration (e.g., multiple chips).

[0205] The auxiliary processor (1120) may include a controller (1121). The controller (1121) may include an interface conversion circuit and a timing control circuit. The controller (1121) receives a video signal from the main processor (1110), converts the data format of the video signal to match the interface specifications with the display module (1400), and outputs video data. The controller (1121) may output various control signals required for driving the display module (1400).

[0206] The auxiliary processor (1120) may further include data processing circuits such as a data conversion circuit (1122), a gamma correction circuit (1123), and a rendering circuit (1124). The data conversion circuit (1122) receives image data from the controller (1121) and can compensate the image data so that the image is displayed at a desired brightness according to the characteristics of the electronic device (1) or the user's settings, or can convert the image data to reduce power consumption or compensate for afterimages. The gamma correction circuit (1123) can convert image data or gamma reference voltage, etc. so that the image displayed on the electronic device (1) has desired gamma characteristics. The rendering circuit (1124) receives image data from the controller (1121) and can render the image data by considering the pixel arrangement of the display panel (10) applied to the electronic device (1). At least one of the data conversion circuit (1122), gamma correction circuit (1123), or rendering circuit (1124) may be integrated into another component (e.g., main processor (1110) or controller (1121)). In one embodiment, the auxiliary processor (1120) may be integrated into the data driver (1430).

[0207] The memory (1200) can store various data used by at least one component of the electronic device (1) (e.g., a processor (1100) or a sensor module (1610)) and input or output data for commands related thereto. The memory (1200) may include at least one of a volatile memory (1210) or a non-volatile memory (1220).

[0208] The input module (1300) can receive commands or data to be used for components of the electronic device (1) (e.g., processor (1100), sensor module (1610) or sound output module (1630)) from outside the electronic device (1) (e.g., user or external electronic device (2000)).

[0209] The input module (1300) may include a first input module (1310) into which commands or data are input from a user and a second input module (1320) into which commands or data are input from an external electronic device (2000).

[0210] The first input module (1310) may include a microphone, a mouse, a keyboard and / or a pen (e.g., a passive pen or an active pen). The first input module (1310) may include mechanical input means or touch input means, such as a button, a dome switch, a jog wheel, a jog switch, etc., located on the rear or side of the electronic device (1). The touch input means may include a touchscreen layer of the display panel (10).

[0211] The second input module (1320) can be connected to various types of external electronic devices (2000) connected to the electronic device (1) via wired or wireless connection. According to one embodiment, the second input module (1320) may include a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The second input module (1320) may include a connector capable of physically connecting the electronic device (1) to the external electronic device (2000), for example, an HDMI connector, a USB connector, an SD card connector, and / or an audio connector (e.g., a headphone connector). The electronic device (1) can perform appropriate control related to the connected external electronic device (2000) in response to the external electronic device (2000) being connected to the second input module (1320).

[0212] The display module (1400) provides information visually to the user. The display module (1400) may include a display panel (10), a scan driver (1420), and a data driver (1430).

[0213] The display panel (10) displays (outputs) information processed by the electronic device (1). The display panel (10) can display information on the execution screen of an application running on the electronic device (1), or UI (User Interface) and GUI (Graphic User Interface) information based on the execution screen information.

[0214] The scan driver (1420) may be mounted on the display panel (10) as a driving chip. Alternatively, the scan driver (1420) may be formed directly on the display panel (10). For example, the scan driver (1420) may include an ASG (Amorphous Silicon TFT Gate driver circuit), an LTPS (Low Temperature Polycrystalline Silicon) TFT Gate driver circuit, and / or an OSG (Oxide Semiconductor TFT Gate driver circuit) embedded in the display panel (10). The scan driver (1420) receives a control signal from the controller (1121) and outputs scan signals to the display panel (10) in response to the control signal.

[0215] The display panel (or, display device) (10) may further include a light emission control driver. The light emission driver outputs a light emission control signal to the display panel (10) in response to a control signal received from the controller (1121). The light emission control driver may be formed separately from the scan driver (1420) or may be integrated into the scan driver (1420).

[0216] The data driver (1430) receives a control signal from the controller (1121), converts the image data into an analog voltage data voltage in response to the control signal, and then outputs the data voltages to the display panel (10).

[0217] The data driver (1430) may be integrated with some components of the auxiliary processor (1120). For example, the data driver (1430) may be provided as a timing controller embedded driver integrated circuit (Timing controller embedded driver IC) including a controller (1121).

[0218] The power module (1500) supplies power to the components of the electronic device (1). The power module (1500) may include a battery that charges the power voltage. Additionally, the power module (1500) is provided with a connection port, and the connection port may be included in a second input module (1320) to which an external charger that supplies power for charging the battery is connected. Alternatively, the power module (1500) may include a wireless power transmission and reception member so that the battery can be charged wirelessly. The wireless power transmission and reception member may include a plurality of coil-shaped antenna radiators. The power module (1500) may include a PMIC (power management integrated circuit). The PMIC supplies optimized power to each of the components of the electronic device (1).

[0219] The electronic device (1) may further include an internal module (1600) and an external module (1700). The internal module (1600) may include a sensor module (1610), an antenna module (1620), and an audio output module (1630). The external module (1700) may include a camera module (1710), a light module (1720), and / or a communication module (1730).

[0220] The sensor module (1610) may include touch electrodes of the touchscreen layer of the display panel (10) and a touch sensor driver. The sensor module (1610) may detect input by the user's body or input by a pen and generate an electrical signal or data value corresponding to the input. The sensor module (1610) may include at least one of a fingerprint sensor (1611), an input sensor (1612), or a digitizer (1613).

[0221] The fingerprint sensor (1611) can generate a data value corresponding to the user's fingerprint. The fingerprint sensor (1611) may include either an optical or capacitive fingerprint sensor.

[0222] The input sensor (1612) can generate a data value corresponding to coordinate information of input by the user's body or input by a pen. The input sensor (1612) generates a data value of the amount of change in capacitance due to the input. The input sensor (1612) can detect input by a passive pen or transmit and receive data with an active pen.

[0223] The input sensor (1612) may measure biosignals such as blood pressure, water content, or body fat. For example, if a user contacts a part of their body to the sensor layer or sensing panel and does not move for a certain period of time, the input sensor (1612) may detect biosignals based on changes in the electric field caused by the part of the body and output information desired by the user to the display module (1400).

[0224] The digitizer (1613) can generate a data value corresponding to the coordinate information of the input by the pen. The digitizer (1613) generates the amount of electromagnetic change caused by the input as a data value. The digitizer (1613) can detect input by a passive pen or transmit and receive data with an active pen.

[0225] The strain sensor (1614) may include layers, patterns, or wirings in which a measurable physical quantity changes according to the stretching of the display panel (10). For example, the strain sensor (1614) may include wirings in which resistance and / or capacitance changes due to the stretching of the display panel (10). In another embodiment, the strain sensor (1614) may include an optical layer or optical pattern in which transmittance and / or reflectance changes due to the stretching of the display panel (10).

[0226] Based on the physical quantity of the stretching of the display panel (10) measured by the strain sensor (1614), the electronic device (1) can improve the quality of the image implemented on the display panel (10) or control the display panel (10). The control operation of the display panel (10) may include, for example, displaying an operation image for the protection of the display panel (10), cutting off the voltage for driving the display panel (10), or stopping the stretching operation of the display panel (10).

[0227] In one embodiment, at least one of a fingerprint sensor (1611), an input sensor (1612), a digitizer (1613), or a strain sensor (1614) may be embedded in the display panel (10). For example, at least one of the fingerprint sensor (1611), the input sensor (1612), the digitizer (1613), or the strain sensor (1614) may be formed through a process that is continuous with the process of forming the pixel circuits and light-emitting diodes of the display panel (10). As a result, the display panel (10) may function as one of the input modules (1300) that provide an input interface between the electronic device (1) and the user, and may also function as a display module (1400) that provides an output interface between the electronic device (1) and the user.

[0228] In one embodiment, at least two of the fingerprint sensor (1611), input sensor (1612), digitizer (1613), and strain sensor (1614) may be formed to be integrated into a single sensing panel through the same process. The sensing panel may be positioned between the display panel (10) and a window positioned above the display panel (10), but the present invention is not limited thereto.

[0229] The antenna module (1620) may include one or more antennas for transmitting a signal or power to the outside or receiving it from the outside. According to one embodiment, the communication module (1730) may transmit a signal to an external electronic device or receive it from an external electronic device through an antenna suitable for a communication method. The antenna pattern of the antenna module (1620) may be integrated with one component of the display module (1400) (e.g., a display panel (10)) or an input sensor (1612), etc.

[0230] The sound output module (1630) is a device for outputting sound signals to the outside of the electronic device (1), and can output sound data received from the communication module (1730) or stored in the memory (1200) in call signal reception, call mode or recording mode, voice recognition mode, broadcast reception mode, etc. The sound output module (1630) can output sound signals related to functions performed in the electronic device (1) (e.g., call signal reception sound, message reception sound, etc.). The sound output module (1630) may include a receiver and a speaker. At least one of the receiver or the speaker may be a sound generating device attached to the lower part of the display panel (10) to vibrate the display panel (10) and output sound. The sound generating device may be a piezoelectric element or a piezoelectric actuator that contracts and expands according to an electric signal, or an exciter that generates magnetic force using a voice coil to vibrate the display panel (10).

[0231] The camera module (1710) can capture still images and video. According to one embodiment, the camera module (1710) may include one or more lenses, image sensors, or image signal processors. The camera module (1710) may further include an infrared camera capable of measuring the presence or absence of a user, the location of the user, the user's gaze, etc.

[0232] The light module (1720) can use light from a light source to output a signal to indicate the occurrence of an event or provide light for image acquisition. Here, examples of event occurrences may include receiving a message, receiving a call signal, a missed call, an alarm, a schedule notification, receiving an email, or receiving battery charge capacity information notifications. The light module (1720) may include a light-emitting diode or a xenon lamp. The light module (1720) may emit single-color or multiple-color light toward the front or rear of the electronic device (1). The light module (1720) may operate in conjunction with the camera module (1710) or operate independently.

[0233] The communication module (1730) can support the establishment of a wired or wireless communication channel between an electronic device (1) and an external electronic device (2000), and the performance of communication through the established communication channel. The communication module (1730) may include one or all of a wireless communication module such as a cellular communication module, a short-range wireless communication module, or a GNSS (global navigation satellite system) communication module, and a wired communication module such as a LAN (local area network) communication module or a power line communication module. The communication module (1730) can transmit and receive wireless signals over an internet network using at least one of WLAN (Wireless LAN), Wi-Fi (Wireless-Fidelity), Wi-Fi (Wireless Fidelity) Direct, or DLNA (Digital Living Network Alliance) technology. Additionally, the communication module (1730) can support short-range communication using at least one of Bluetooth™, RFID (Radio Frequency Identification), Infrared Data Association (IrDA), Ultra Wideband (UWB), ZigBee, NFC (Near Field Communication), Wi-Fi (Wireless-Fidelity), or Wi-Fi Direct and Wireless USB (Wireless Universal Serial Bus) technologies. The various types of communication modules (1730) described above may be implemented as a single chip or as separate chips.

[0234] FIGS. 16a to 16d are schematic perspective views illustrating embodiments of an electronic device including a display device according to one embodiment of the present invention.

[0235] Referring to FIG. 16a, a display device according to one embodiment of the present invention can be utilized in a wearable electronic device (1000A) that can be worn on a part of a user's body. The wearable electronic device (1000A) may include a body part (3110) and a display part (3120) provided in the body part (3110). The display device according to embodiments of the present invention can be used as the display part (3120) of the wearable electronic device (1000A). As illustrated in FIG. 16a, the wearable electronic device (1000A) may be modified. In one embodiment, it can be used as a smart watch or a smartphone depending on the user's choice.

[0236] FIG. 16b illustrates a medical electronic device (1000B). In one embodiment, the medical electronic device (1000B) may include a body part (3210) and a light-emitting part (3220). A display device according to embodiments of the present invention may be used as the light-emitting part (3220) of the medical electronic device (1000B). The light-emitting part (3220) may emit light of a specific wavelength band (e.g., infrared, visible light, etc.) to the patient's body. In one embodiment, the body part (3210) may have a stretchable fiber material and may have a structure that can be worn on the body of the user of the light-emitting part.

[0237] FIG. 16c illustrates an educational electronic device (1000C). In one embodiment, the educational electronic device may include a display unit (3310) provided within a frame (3320). The display unit (3310) may utilize a display device according to embodiments of the present invention. The display unit (3310) may provide images such as a sea with waves, a snow-covered mountain, or a volcano with flowing lava, wherein the display unit (3310) may extend in the height direction (e.g., z-direction) to reflect the height of the waves, mountain, and / or volcano. In some embodiments, a portion of the display unit (3310) may sequentially vary in height along the direction of the lava flow to show the movement of the lava in three dimensions. The educational electronic device (1000C) may include a plurality of pins (or stroke units, 3330) arranged on the back of the display unit (3320) so that the display unit (3310) extends in the height direction. The pins (3330) can be implemented to move along a third direction (e.g., z direction or –z direction) so that the image displayed on the display unit (3320) has a three-dimensional height. FIG. 16c illustrates an educational electronic device (1000C), but its use is not limited as long as it provides a certain image information.

[0238] FIG. 16d illustrates that a display device is used in a wearable electronic device (1000D-1), such as a smart watch. In one embodiment, the display device corresponding to the display portion (3310) of the electronic device (1000D-1) can be stretched three-dimensionally, so it can provide various haptic information to the user. In one embodiment, the electronic device (1000D-1) can provide haptic information, such as Braille markings for the visually impaired or tactile stimulation linked to images, by using a plurality of pins (or stroke portions, 3330) placed below the display portion (3310). The display device forming the display portion (3310) can be stretched three-dimensionally, so it can provide the aforementioned haptic information to the user.

[0239] The embodiment described with reference to FIGS. 16a to 16d describes an electronic device (1000A, 1000B, 1000C, 1000D-1) in which the display portion can be deformed in three dimensions, but the present invention is not limited thereto. As in the embodiments described below, the display device according to the embodiments of the present invention may be used in an electronic device in which the shape of the portion capable of displaying an image (e.g., a screen) is fixed.

[0240] FIGS. 17a to 17e are each schematic perspective views of an electronic device according to one embodiment of the present invention.

[0241] FIG. 17a illustrates a display device being used in a wearable electronic device (1000D-2), such as a smart watch. The electronic device (1000D-2) illustrated in FIG. 17a includes a display unit (3310), wherein the display unit (3310) may be a three-dimensional dome shape (or hemispherical shape). In the manufacturing process of the electronic device (1000D-2), the display device may be assembled on a dome-shaped body frame, and since the display device is three-dimensionally stretchable, it may be assembled in a stretched state along the shape of a hemispherical body frame.

[0242] FIG. 17b illustrates that, in one embodiment of the present invention, another electronic device (1000E) includes a robot. The robot can move or perceive objects using a camera module (1710) and can display a predetermined image to a user through a display unit (3420, 3430). In some embodiments, since the display devices according to one embodiment of the present invention can be extended in various directions as described above, they can be assembled to a body frame having a hemispherical shape, and thus the robot may include a hemispherical display unit (3420, 3430).

[0243] FIG. 17c illustrates a vehicle display device (1000F) as another electronic device in one embodiment of the present invention. The vehicle display device (1000F) may include a cluster (3510), a Center Information Display (CID) (3520), and / or a passenger display (3530). Since the display device according to an embodiment of the present invention can be extended in various directions, it can be used for the cluster (3510), the Center Information Display (CID) (3520), and / or the co-driver display (3530) without being constrained by the shape of the vehicle's internal frame.

[0244] FIG. 17c illustrates the cluster (3510), the Center Information Display (CID) (3520), and / or the co-driver display (3530) being separated, but the invention is not limited thereto. In another embodiment, two or more selected from the cluster (3510), the Center Information Display (CID) (3520), and the co-driver display (3530) may be connected as a single unit.

[0245] In some embodiments, the vehicle display device (1000F) may include a button (3540) capable of displaying a predetermined image. Referring to the enlarged view of FIG. 17c, the hemispherical button (3540) may include an object (3542) that provides a sense of use of the button while moving in the z-direction or –z-direction, and a display device placed on the object (3542). In some embodiments, if the object (3542) has a three-dimensionally rounded surface, the display device may also have a three-dimensionally rounded surface.

[0246] FIG. 17d illustrates that an electronic device according to one embodiment of the present invention is an electronic device (1000G) for advertising or display. In some embodiments, the electronic device (1000G) for advertising or display may be installed on a fixed structure (3610), such as a wall or a column. If the structure (3610) includes an uneven surface as shown in FIG. 17d, the electronic device (1000G) for advertising or display may also be placed along the uneven surface of the structure (3610). In some embodiments, the electronic device (1000G) for advertising or display may be installed on the structure (3610) using a heat-shrink film or the like.

[0247] FIG. 17e illustrates that an electronic device (1000H) according to one embodiment of the present invention is a controller. The controller may include image-type buttons. For example, the controller may include first to third button areas (3720, 3730, 3740) in which a portion of the display portion (3710) protrudes in the z-direction or protrudes in the –z-direction (or is recessed in the z-direction). In some embodiments, the first and third button areas (3720, 3740) may protrude in the z-direction, and the second button area (3730) may protrude in the –z-direction (or be recessed in the z-direction).

[0248] The present invention has been described with reference to the embodiments illustrated in the drawings, but this is merely illustrative, and those skilled in the art will understand that various modifications and equivalent alternative embodiments are possible therefrom. Accordingly, the true technical scope of protection of the present invention should be determined by the technical spirit of the appended claims.

Claims

A base layer having a first surface and a second surface opposite to the first surface; A first pixel circuit layer disposed on the first surface of the base layer and comprising insulating layers, a first wiring, and a first electrode pad; A second pixel circuit layer disposed on the first surface of the base layer, spaced apart from the first pixel circuit layer, and comprising insulating layers, a second wiring, and a second electrode pad; A first light-emitting diode disposed on the first pixel circuit layer and electrically connected to the first electrode pad; A second light-emitting diode disposed on the second pixel circuit layer and electrically connected to the second electrode pad; and A connecting wire disposed on the first surface of the base layer and electrically connecting the first wire and the second wire; comprising Each of the above connecting wire, the first electrode pad, and the second electrode pad has a lower surface facing the base layer and an upper surface facing the lower surface, and The upper surface of the above connecting wire is a display panel protruding from the upper surface of the first electrode pad and the upper surface of the second electrode pad. In paragraph 1, A display panel in which the above connecting wiring becomes thicker in the thickness direction of the display panel as it moves away from the first light-emitting diode and the second light-emitting diode. In paragraph 1, A display panel in which the connecting wire on a plane becomes thicker in a direction intersecting the extension direction of the connecting wire as it moves further away from the first light-emitting diode and the second light-emitting diode. In paragraph 1, A display panel in which the base layer fills an opening defined by the first pixel circuit layer and the second pixel circuit layer. In paragraph 1, A display panel in which the above connecting wires fill a portion of the opening defined by the first pixel circuit layer and the second pixel circuit layer. In paragraph 5, A display panel having a stepped shape on the side of the above-mentioned opening. In paragraph 1, A display panel having a bonding layer interposed between the first light-emitting diode and the first electrode pad and between the second light-emitting diode and the second electrode pad, respectively. In paragraph 1, Each of the above first wiring and the above second wiring is, A display panel comprising a first part, a second part spaced apart from the first part, and a bridge line connecting the first part and the second part. In paragraph 1, The device further comprises a cover layer located on the first light-emitting diode, the second light-emitting diode, and the connecting wire. A display panel comprising the above base layer and the above cover layer, wherein the above base layer and the above cover layer include an elastic material. In Paragraph 9, A display panel in which the lower surface of the connecting wire contacts the base layer and the upper surface of the connecting wire contacts the cover layer. A step of forming a pixel circuit layer on a first substrate, comprising insulating layers, a first wiring, a second wiring, a first electrode pad electrically connected to the first wiring, and a second electrode pad electrically connected to the second wiring; A step of forming a bonding layer so as to overlap each of the first electrode pad and the second electrode pad; A step of forming a connecting wire that electrically connects the first wiring and the second wiring; A step of attaching a first light-emitting diode to the first electrode pad and attaching a second light-emitting diode to the second electrode pad; A step of forming a cover layer on the first light-emitting diode, the second light-emitting diode, and the connecting wiring; A step of separating the first substrate and the pixel circuit layer; A method for manufacturing a display panel, comprising the step of forming a base layer that supports the pixel circuit layer. In Paragraph 11, A display panel further comprising the step of removing a portion of the pixel circuit layer to form an opening and a first pixel circuit layer and a second pixel circuit layer spaced apart with the opening in between. In Paragraph 11, The step of attaching a first light-emitting diode to the first electrode pad and attaching a second light-emitting diode to the second electrode pad is A step of preparing a second substrate having a first surface facing the first substrate and a second surface opposite to the first surface, a resin layer disposed on the first surface of the second substrate, the first light-emitting diode and the second light-emitting diode attached to the resin layer; and A method for manufacturing a display panel comprising the step of applying pressure to the second substrate to attach the first light-emitting diode to the first electrode pad and attach the second light-emitting diode to the second electrode pad. In Paragraph 12, A method for manufacturing a display panel in which, when the second substrate is pressed, the connecting wire contacts the resin layer. In Paragraph 11, A method for manufacturing a display panel, wherein the above connecting wire is formed to be thicker in the thickness direction of the display panel as it moves further away from the first light-emitting diode and the second light-emitting diode. In Paragraph 11, A method for manufacturing a display panel in which the above connecting wire becomes thicker in the direction intersecting the extension direction of the above connecting wire as it moves away from the first light-emitting diode and the second light-emitting diode on a plane. A step of forming a pixel circuit layer on a first substrate, comprising insulating layers, a first wiring, a second wiring, a first electrode pad electrically connected to the first wiring, and a second electrode pad electrically connected to the second wiring; A step of removing a portion of the pixel circuit layer to form an opening and a first pixel circuit layer and a second pixel circuit layer spaced apart with the opening in between; A step of patterning a bonding layer to overlap each of the first electrode pad and the second electrode pad; A step of forming a connecting wire that electrically connects the first wiring and the second wiring; A step of attaching a first light-emitting diode to the first electrode pad and attaching a second light-emitting diode to the second electrode pad; A step of forming a cover layer on the first light-emitting diode, the second light-emitting diode, and the connecting wiring; A step of separating the first substrate, the first pixel circuit layer, the second pixel circuit layer, and the cover layer; and A method for manufacturing a display panel, comprising the step of forming a base layer that supports the first pixel circuit layer and the second pixel circuit layer. In Paragraph 16, The step of attaching a first light-emitting diode to the first electrode pad and attaching a second light-emitting diode to the second electrode pad is A step of preparing a second substrate having a first surface facing the first substrate and a second surface opposite to the first surface, a resin layer disposed on the first surface of the second substrate, the first light-emitting diode and the second light-emitting diode attached to the resin layer; and A method for manufacturing a display panel comprising the step of applying pressure to the second substrate to attach the first light-emitting diode to the first electrode pad and attach the second light-emitting diode to the second electrode pad. In Paragraph 17, A method for manufacturing a display panel in which, when the second substrate is pressed, the connecting wire contacts the resin layer. In Paragraph 16, A method for manufacturing a display panel in which the above connecting wires fill a part of the above opening. In Paragraph 16, A method for manufacturing a display panel, wherein the above connecting wire is formed to be thicker in the thickness direction of the display panel as it moves further away from the first light-emitting diode and the second light-emitting diode.

Images