BI-layer composite carbide for cutting element

Abstract

A cutting element may include a polycrystalline diamond (PCD) table. A cutting element may include a body including: a carbide substrate bonded directly to the PCD table, the carbide substrate including a first plurality of carbide particles and a first matrix phase interspersed between the carbide particles of the first plurality of carbide particles, and a base layer bonded directly to the carbide substrate, the base layer including a second plurality of carbide particles and a second matrix phase interspersed between the carbide particles of the second plurality of carbide particles, wherein the second plurality of carbide particles has a second grain size greater than a first grain size of the first plurality of carbide particles.

Description

BI-LAYER COMPOSITE CARBIDE FOR CUTTING ELEMENTCROSS REFERENCE TO RELATED APPLICATIONS

[0001] The present Application claims priority to and the benefit of United States Provisional Patent Application No. 63 / 710,886 filed October 23, 2024 and titled BI-LAYER COMPOSITE CARBIDE FOR CUTTING ELEMENT, the disclosure of which is incorporated herein by reference in its entirety.BACKGROUND

[0002] This section is intended to introduce the reader to various aspects of art that may be related to various aspects of the present disclosure, which are described and / or claimed below. This discussion is believed to be helpful in providing the reader with background information to facilitate a better understanding of the various aspects of the present disclosure. Accordingly, it should be understood that these statements are to be read in this light, and not as admissions of prior art.

[0003] Drill bits are used during drilling to produce wellbores for the discovery and extraction of hydrocarbons such as crude oil and natural gas from the earth’s crust. Generally, the cutting element of a drill bit is made of polycrystalline diamond (PCD) supported by a non-diamond substrate. Mismatches in material properties between the substrate and PCD table can induce failures during usage.SUMMARY

[0004] In some aspects, the techniques described herein relate to a cutting element, including: a polycrystalline diamond (PCD) table; and a body including: a carbide substrate bonded directly to the PCD table, the carbide substrate including a first plurality of carbide particles and a first matrix phase interspersed between the carbide particles of the first plurality of carbide particles, and a base layer bonded directly to the carbide substrate, the base layer including a second plurality of carbide particles and a second matrix phase interspersed between the carbide particles of the second plurality of carbide particles, wherein the second plurality of carbide particles has a second grain size greater than a first grain size of the first plurality of carbide particles.

[0005] In some aspects, the techniques described herein relate to a method of manufacturing a cutting element, the method including: positioning a substrate precursor on a base precursor, wherein the substrate precursor includes a first plurality of carbide particles and a first matrix phase interspersed between the carbide particles of the first plurality of carbide particles, and the base precursor includes a second plurality of carbide particles and a second matrix phase interspersed between the carbide particles of the second plurality of carbide particles, wherein the second plurality of carbide particles has a second grain size greater than a first grain size of the first plurality of carbide particles; sintering the substrate precursor on the base precursor to form a body; and sintering a polycrystalline diamond (PCD) table on the body.

[0006] In some aspects, the techniques described herein relate to a drill bit including: a bit body having at least one cutting element pocket therein; and a cutting element fixed in the cutting element pocket, the cutting element including: a polycrystalline diamond (PCD) table; and a body including: a carbide substrate bonded directly to the PCD table, the carbide substrate including a first plurality of carbide particles and a first matrix phase interspersed between the carbide particles of the first plurality of carbide particles, and a base layer bonded directly to the carbide substrate, the base layer including a second plurality of carbide particles and a second matrix phase interspersed between the carbide particles of the second plurality of carbide particles, wherein the second plurality of carbide particles has a second grain size greater than a first grain size of the first plurality of carbide particles.

[0007] This Summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.

[0008] Additional features and advantages will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the teachings herein. Features and advantages of the disclosure may be realized and obtained by means of the instruments and combinations particularly pointed out in the appended claims. Features of the present disclosure will become more fully apparent from the following description and appended claims or may be learned by the practice of the disclosure as set forth hereinafter.BRIEF DESCRIPTION OF THE DRAWINGS

[0009] The present disclosure is best understood from the following detailed description when read with the accompanying Figures. It is emphasized that, in accordance with the standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.

[0010] FIG. 1 is a perspective view of a cutting element, according to one or more embodiments of the present disclosure.

[0011] FIG. 2 is a side cross-sectional view of another embodiment of a cutting element, according to one or more embodiments of the present disclosure.

[0012] FIG. 3 is a side cross-sectional view of an embodiment of a cutting element with a transition zone, according to one or more embodiments of the present disclosure.

[0013] FIG. 4 is a flowchart illustrating a method of manufacture of a cutting element, according to one or more embodiments of the present disclosure.DETAILED DESCRIPTION

[0014] Illustrative examples of the subject matter claimed below will now be disclosed. In the interest of clarity, not all features of an actual implementation are described in this specification. It will be appreciated that in the development of any such actual implementation, numerous implementation-specific decisions may be made to achieve the developers’ specific goals, such as compliance with system-related and business-related constraints, which will vary from one implementation to another. Moreover, it will be appreciated that such a development effort, even if complex and time-consuming, would be a routine undertaking for those of ordinary skill in the art having the benefit of this disclosure.

[0015] Further, as used herein, the article “a” is intended to have its ordinary meaning in the patent arts, namely “one or more.” Moreover, examples herein are intended to be illustrative only and are presented for discussion purposes and not by way of limitation.

[0016] The present disclosure is generally related to methods of manufacture and systems and devices produced by such methods for improved performance of cutting elements. In some embodiments, the present disclosure is directed towards methods for producing a cutting element with improved thermal performance. In some embodiments,a cutting element is exposed to and / or generates heat at a working surface of the cutting element. For example, the working surface of the cutting element may be exposed to high temperatures a downhole environment. In some examples, the working surface may generate heat while contacting rock and other material during drilling operations in a downhole environment. In some examples, the working surface may generate heat while contacting concrete, cement, metal, or other materials during reaming and other borehole operations in a downhole environment.

[0017] Referring now to FIG. 1, in some embodiments, a cutting element 100 includes a body 102 with an ultrahard material at the working surface 104. For example, the working surface of the cutting element 100 may be a polycrystalline diamond (PCD) table 106. PCD tables include a plurality of diamond grains that provide a high hardness to the PCD, as well as a high thermal conductivity (e.g., greater than 1000 Watts per Meter per degree Kelvin (W / m*K)). The heat received and / or generated at the working surface, therefore, may be conducted to a body of the cutting elementat a high rate. . In some embodiments, the body of the cutting element may be a non-diamond substrate material with a lower thermal conductivity than the PCD table. For example, tungsten carbide has a thermal conductivity of 110 W / m*K. The body of the cutting element, in such embodiments, limits the overall thermal conductivity of the cutting element. A body with a thermal conductivity closer to that of the PCD table may better take advantage of the advantageous thermal conductivity properties of the PCD table and more effectively conduct heat from the working surface, leading to a lower temperature at the working surface.

[0018] As used herein, the term "ultrahard" is understood to refer to those materials known in the art to have a grain hardness of about 1,500 HV (Vickers hardness in kg / mm2) or greater. Such ultrahard materials can include but are not limited to diamond, sapphire, moissantite, hexagonal diamond (Lonsdaleite), cubic boron nitride (cBN), polycrystalline cBN (PcBN), Q-carbon, binderless PcBN, diamond-like carbon, boron suboxide, aluminum manganese boride, metal borides, boron carbon nitride, PCD (including, e.g., leached metal catalyst PCD, non-metal catalyst PCD, and binderless PCD or nanopolycrystalline diamond (NPD)) and other materials in the boron-nitrogen-carbon-oxygen system which have shown hardness values above 1,500 HV, as well as combinations of the above materials. In some embodiments, the ultrahard material may have a hardness values above 3,000 HV. In other embodiments, the ultrahard materialmay have a hardness value above 4,000 HV. In yet other embodiments, the ultrahard material may have a hardness value greater than 80 HRa (Rockwell hardness A).

[0019] In some embodiments, a cutting element 100 according to the present disclosure includes a PCD table 106 bonded to a body 102. The body 102 is a bi-layer construction that includes a substrate 108 and a base layer 110. The substrate 108 is bonded directly to the PCD table106, and the base layer 110 is bonded to the substrate 108. In some embodiments, the substrate 108 is a carbide substrate that includes a first plurality of carbide particles with a first matrix phase interspersed therebetween. In some embodiments, the base layer includes a second plurality of carbide particles with a second matrix phase interspersed therebetween. In some embodiments, the carbide particles of the first plurality of carbide particles and the carbide particles of the second plurality of carbide particles are the same carbide. In some embodiments, the carbide particles of the first plurality of carbide particles and the carbide particles of the second plurality of carbide particles are tungsten carbide.

[0020] The bulk thermal conductivity of tungsten carbide is greater when the tungsten carbide has a larger grain size. However, tungsten carbide with a larger grain size can cause eruptions, elastic mismatch, thermal expansion mismatches, and other challenges at an interface with a PCD table. In some embodiments, a carbide substrate has a first grain size of the first plurality of carbide particles that is less than a second grain size of the second plurality of carbide particles of the base layer. In some embodiments, the carbide substrate has a lesser thermal conductivity that the base layer of the body. In some embodiments, the carbide substrate has a substrate thickness that is relatively thin compared to the base layer to allow the cutting element to better conduct heat away from the working surface during usage.

[0021] In some embodiments, a grain size of a plurality of carbide particles is the mean grain size. In some embodiments, a grain size of a plurality of carbide particles is the median grain size. In some embodiments, the first grain size of the first plurality of carbide particles in the carbide substrate is no more than 5 micrometers (pm). In some embodiments, the second grain size of the second plurality of carbide particles in the base layer is no less than 6 pm. In some embodiments, the second grain size is no less than 50% greater than the first grain size. For example, the second grain size may be 6 pm and the first grain size may be 4 pm. In some embodiments, the second grain size is no less than 100% greater than the first grain size. For example, the second grain sizemay be 8 m and the first grain size may be 4 pm. In some embodiments, the second grain size is no less than 200% greater than the first grain size. For example, the second grain size may be 9 pm and the first grain size may be 3 pm.

[0022] In some embodiments, the first matrix phase and the second matrix phase are the same. In some embodiments, the first matrix phase and the second matrix phase are different. In some embodiments, the first matrix phase defines a first weight percentage (wt%) of the carbide substrate and the second matrix phase defines a second wt% of the base layer, and the first wt% is greater than the second wt%. For example, the first matrix phase may have a first wt% that is 13% of the carbide substrate, and the second matrix phase may have a second wt% that is 12% of the base layer. In at least one example, the first matrix phase may be 10% Cobalt (Co) and 3% Nickel (Ni), while the second matrix phase may be 9.5% Co and 2.5% Ni. In some embodiments, a Ni wt% of the base layer is greater than a Ni wt% of the carbide substrate. For example, a greater Ni composition in the base layer may allow a stronger braze when the body is brazed to a cutting element pocket of a drill bit or other downhole tool.

[0023] In some embodiments, the first matrix phase has a different elemental composition than the second matrix phase. For example, the first matrix phase may include Co and Ni, and the second matrix phase may include Ni and copper (Cu). In some embodiments, the second matrix phase has a higher wt% of Nickel (Ni) than the first matrix phase.

[0024] FIG. 2 is a side cross-sectional view of another embodiment of a cutting element 200. In some embodiments, the cutting element 200 includes a body 202 with a planar interface 212 between the carbide substrate 208 and the base layer 210. For example, the interface 212 may be substantially flat and uniform across a diameter of the body 202, while being substantially perpendicular to a longitudinal direction of the body 202. In some embodiments, the interface 212 is non-planar. In some examples, the interface 212 may be at least partially convex toward the working surface 204 and / or PCD table 206. In some examples, the interface 212 may be at least partially concave toward the working surface 204 and / or PCD table 206. In some examples, the interface 212 may be at least partially wavy in the longitudinal direction toward the working surface 204 and / or PCD table 206. In some examples, the interface 212 may be at least partially ridged or have a plurality of ridges in the longitudinal direction toward the working surface 204 and / or PCD table 206.

[0025] In some embodiments, the interface 212 may have a shape and / or contour based at least partially on a PCD interface 214 between the body 202 and the PCD table 206. For example, the interface 212 may be concave toward the working surface 204 and / or PCD table 206 and the PCD interface 214 may be concave toward the working surface 204 and / or PCD table 206. In some embodiments, the interface 212 may have a shape and / or contour based at least partially on a PCD interface 214 between the body 202 and the PCD table 206 such that a substrate thickness 216 of the substrate 208 is substantially uniform across the substrate 208.

[0026] FIG. 3 is a side cross-sectional view of an embodiment of a cutting element 300 with a transition zone 318 between the carbide substrate 308 and the base layer 310. In some embodiments, the first grain size of the first plurality of carbide particles in the carbide substrate 308 changes sharply at the interface (e.g., the interface 212 described in relation to FIG. 2) to the second grain size of the second plurality of carbide particles in the base layer 310. In some embodiments, a grain size of the carbide particles in the transition zone changes in a gradient between the first grain size of the first plurality of carbide particles in the carbide substrate 308 to the second grain size of the second plurality of carbide particles in the base layer 310.

[0027] In some embodiments, the transition zone 318 includes at least a portion of the first plurality of carbide particles. In some embodiments, the transition zone 318 includes at least a portion of the second plurality of carbide particles. In some embodiments, the transition zone 318 includes at least a portion of the first plurality of carbide particles and at least a portion of the second plurality of carbide particles.

[0028] FIG. 4 is a flowchart illustrating a method 420 of manufacture of a cutting element according to any embodiment described herein. In some embodiments, the method 420 includes positioning a substrate precursor on a base precursor at 422 and sintering the substrate precursor on the base precursor to form a body at 424. The method 420 further includes sintering a PCD table on the body at 426.

[0029] In some embodiments, the substrate precursor is or includes a powder that, when sintered, forms a substrate. In some embodiments, the base precursor is or includes a powder that, when sintered, forms a base layer. In some embodiments, the substrate precursor includes a first plurality of carbide particles and a first matrix phase interspersed between the carbide particles of the first plurality of carbide particles, and the base precursor includes a second plurality of carbide particles and a second matrixphase interspersed between the carbide particles of the second plurality of carbide particles, wherein the second plurality of carbide particles has a second grain size greater than a first grain size of the first plurality of carbide particles

[0030] In some embodiments, positioning a substrate precursor on a base precursor includes layering the substrate precursor and the base precursor and pressing the body in a green state. In some embodiments, the green body may be further machined or changed before sintering. In some embodiments, positioning a substrate precursor on a base precursor includes dipcoating the substrate precursor on the base precursor. For example, the base precursor may be dipped in a solution containing the substrate precursor to layer the substrate precursor on the base precursor in a substantially uniform thickness. In some embodiments, positioning a substrate precursor on a base precursor includes vapor depositing the substrate precursor on the base precursor. In some embodiments, positioning a substrate precursor on a base precursor includes spray depositing the substrate precursor on the base precursor.

[0031] In some embodiments, sintering the substrate precursor on the base precursor to form a body and / or sintering a PCD table on the body include sintering in a high-pressure, high-temperature (HPHT) press. In some embodiments, the method 420 includes sintering the substrate precursor on the base precursor to form a body and sintering a PCD table on the body in a shared HPHT press in a single (e.g., simultaneous) sintering.

[0032] In some embodiments, a drill bit includes any embodiment of a cutting element according to the present disclosure fixed in a cutting element pocket thereof. For example, any embodiment of a cutting element according to the present disclosure may be brazed in a cutting element pocket thereof. For example, any embodiment of a cutting element according to the present disclosure may be press fit in a cutting element pocket thereof. For example, any embodiment of a cutting element according to the present disclosure may be adhered in a cutting element pocket thereof. For example, any embodiment of a cutting element according to the present disclosure may be mechanically fastened in a cutting element pocket thereof.

[0033] The present disclosure generally relates to devices and methods of manufacturing said devices for improved cutting element performance in a drill bit and other downhole tools according to any of the clauses below:

[0034] Clause 1. A cutting element, comprising: a polycrystalline diamond (PCD) table; and a body including: a carbide substrate bonded directly to the PCD table, the carbide substrate including a first plurality of carbide particles and a first matrix phase interspersed between the carbide particles of the first plurality of carbide particles, and a base layer bonded directly to the carbide substrate, the base layer including a second plurality of carbide particles and a second matrix phase interspersed between the carbide particles of the second plurality of carbide particles, wherein the second plurality of carbide particles has a second grain size greater than a first grain size of the first plurality of carbide particles.

[0035] Clause 2. The cutting element of clause 1 , wherein the first plurality of carbide particles and the second plurality of carbide particles are tungsten carbide.

[0036] Clause 3. The cutting element of clause 1 or 2, wherein the second grain size is no less than 50% greater than the first grain size of the first plurality of carbide particles.

[0037] Clause 4. The cutting element of any preceding clause, wherein the first grain size is no more than 5 micrometers (pm).

[0038] Clause 5. The cutting element of any preceding clause, wherein the second grain size is no less than 6 pm.

[0039] Clause 6. The cutting element of any preceding clause, wherein the first matrix phase defines a first weight percentage (wt%) of the carbide substrate and the second matrix phase defines a second wt% of the base layer, and the first wt% is greater than the second wt%.

[0040] Clause 7. The cutting element of any preceding clause, wherein the first matrix phase has a different elemental composition than the second matrix phase.

[0041] Clause 8. The cutting element of any preceding clause, wherein the second matrix phase has a higher wt% of Nickel (Ni) than the first matrix phase.

[0042] Clause 9. The cutting element of any preceding clause, wherein an interface between the PCD table and the carbide substrate is non-planar.

[0043] Clause 10. The cutting element of clause 8, wherein the carbide substrate has a substantially uniform substrate thickness across the carbide substrate between the PCD table and the base layer.

[0044] Clause 11. The cutting element of any preceding clause, wherein the first grain size varies across a substrate thickness of the carbide substrate and increases from the PCD table toward the base layer.

[0045] Clause 12. The cutting element of clause 10, wherein a base thermal conductivity of the base layer is greater than a substrate thermal conductivity of the carbide substrate.

[0046] Clause 13. The cutting element of any preceding clause, wherein the base layer and carbide substrate are bonded at a transition zone that includes at least a portion of the first plurality of carbide particles and at least a portion of the second plurality of carbide particles.

[0047] Clause 14. A method of manufacturing a cutting element, the method comprising: positioning a substrate precursor on a base precursor, wherein the substrate precursor includes a first plurality of carbide particles and a first matrix phase interspersed between the carbide particles of the first plurality of carbide particles, and the base precursor includes a second plurality of carbide particles and a second matrix phase interspersed between the carbide particles of the second plurality of carbide particles, wherein the second plurality of carbide particles has a second grain size greater than a first grain size of the first plurality of carbide particles; sintering the substrate precursor on the base precursor to form a body; and sintering a polycrystalline diamond (PCD) table on the body.

[0048] Clause 15. The method of clause 14, wherein sintering the substrate precursor on the base precursor and sintering the PCD table on the body occur in a shared high-pressure, high-temperature press.

[0049] Clause 16. The method of clause 14 or 15, wherein positioning the substrate precursor on the base precursor includes pressing the substrate precursor on the base precursor in a green state prior to sintering.

[0050] Clause 17. The method of any of clauses 14 through 16, wherein positioning the substrate precursor on the base precursor includes dipcoating the substrate precursor on the base precursor.

[0051] Clause 18. The method of any of clauses 14 through 17, wherein positioning the substrate precursor on the base precursor includes vapor deposition.

[0052] Clause 19. The method of any of clauses 14 through 18, wherein positioning the substrate precursor on the base precursor includes spray deposition.

[0053] Clause 20. A drill bit comprising: a bit body having at least one cutting element pocket therein; and a cutting element fixed in the cutting element pocket, the cutting element including: a polycrystalline diamond (PCD) table; and a body including: a carbide substrate bonded directly to the PCD table, the carbide substrate including a first plurality of carbide particles and a first matrix phase interspersed between the carbide particles of the first plurality of carbide particles, and a base layer bonded directly to the carbide substrate, the base layer including a second plurality of carbide particles and a second matrix phase interspersed between the carbide particles of the second plurality of carbide particles, wherein the second plurality of carbide particles has a second grain size greater than a first grain size of the first plurality of carbide particles.

[0054] The terms “comprising,” “including,” and “having” are intended to be inclusive and mean that there may be additional elements other than the listed elements. Additionally, it should be understood that references to “one embodiment” or “an embodiment” of the present disclosure are not intended to be interpreted as excluding the existence of additional embodiments that also incorporate the recited features. For example, any element described in relation to an embodiment herein may be combinable with any element of any other embodiment described herein. Numbers, percentages, ratios, or other values stated herein are intended to include that value, and also other values that are “about” or “approximately” the stated value, as would be appreciated by one of ordinary skill in the art encompassed by embodiments of the present disclosure. A stated value should therefore be interpreted broadly enough to encompass values that are at least close enough to the stated value to perform a desired function or achieve a desired result. The stated values include at least the variation to be expected in a suitable manufacturing or production process, and may include values that are within 5%, within 1%, within 0.1%, or within 0.01% of a stated value.

[0055] A person having ordinary skill in the art should realize in view of the present disclosure that equivalent constructions do not depart from the spirit and scope of the present disclosure, and that various changes, substitutions, and alterations may be made to embodiments disclosed herein without departing from the spirit and scope of the present disclosure. Equivalent constructions, including functional “means-plus-function” clauses are intended to cover the structures described herein as performing the recitedfunction, including both structural equivalents that operate in the same manner, and equivalent structures that provide the same function. It is the express intention of the applicant not to invoke means-plus-function or other functional claiming for any claim except for those in which the words ‘means for’ appear together with an associated function. Each addition, deletion, and modification to the embodiments that falls within the meaning and scope of the claims is to be embraced by the claims.

[0056] It should be understood that any directions or reference frames in the preceding description are merely relative directions or movements. For example, any references to “front” and “back” or “top” and “bottom” or “left” and “right” are merely descriptive of the relative position or movement of the related elements.

[0057] The present disclosure may be embodied in other specific forms without departing from its spirit or characteristics. The described embodiments are to be considered as illustrative and not restrictive. The scope of the disclosure is, therefore, indicated by the appended claims rather than by the foregoing description. Changes that come within the meaning and range of equivalency of the claims are to be embraced within their scope.

Claims

CLAIMSWhat is claimed is:

1. A cutting element, comprising:a polycrystalline diamond (PCD) table; anda body including:a carbide substrate bonded directly to the PCD table, the carbide substrate including a first plurality of carbide particles and a first matrix phase interspersed between the carbide particles of the first plurality of carbide particles, anda base layer bonded directly to the carbide substrate, the base layer including a second plurality of carbide particles and a second matrix phase interspersed between the carbide particles of the second plurality of carbide particles, wherein the second plurality of carbide particles has a second grain size greater than a first grain size of the first plurality of carbide particles.

2. The cutting element of claim 1 , wherein the first plurality of carbide particles and the second plurality of carbide particles are tungsten carbide.

3. The cutting element of claim 1 or 2, wherein the second grain size is no less than 66% greater than the first grain size of the first plurality of carbide particles.

4. The cutting element of any preceding claim, wherein the first grain size is no more than 5 micrometers (pm).

5. The cutting element of any preceding claim, wherein the second grain size is no less than 6 pm.

6. The cutting element of any preceding claim, wherein the first matrix phase defines a first weight percentage (wt%) of the carbide substrate and the second matrix phase defines a second wt% of the base layer, and the first wt% is greater than the second wt%.

7. The cutting element of any preceding claim, wherein the first matrix phase has a different elemental composition than the second matrix phase.

8. The cutting element of any preceding claim, wherein the second matrix phase has a higher wt% of Nickel (Ni) than the first matrix phase.

9. The cutting element of any preceding claim, wherein an interface between the PCD table and the carbide substrate is non-planar.

10. The cutting element of claim 8, wherein the carbide substrate has a substantially uniform substrate thickness across the carbide substrate between the PCD table and the base layer.

11. The cutting element of any preceding claim, wherein the first grain size varies across a substrate thickness of the carbide substrate and increases from the PCD table toward the base layer.

12. The cutting element of any preceding claim, wherein a base thermal conductivity of the base layer is greater than a substrate thermal conductivity of the carbide substrate.

13. The cutting element of any preceding claim, wherein the base layer and carbide substrate are bonded at a transition zone that includes at least a portion of the first plurality of carbide particles and at least a portion of the second plurality of carbide particles.

14. A method of manufacturing the cutting element of claim 1 , the method comprising:positioning a substrate precursor on a base precursor, wherein the substrate precursor includes a first plurality of carbide particles and a first matrix phase interspersed between the carbide particles of the first plurality of carbide particles, and the base precursor includes a second plurality of carbide particles and a second matrix phase interspersed between the carbide particles of the second plurality of carbide particles, wherein the second plurality of carbide particles has a second grain size greater than a first grain size of the first plurality of carbide particles;sintering the substrate precursor on the base precursor to form a body; and sintering a polycrystalline diamond (PCD) table on the body.

15. The method of claim 14, wherein sintering the substrate precursor on the base precursor and sintering the PCD table on the body occur in a shared high-pressure, high-temperature press.

16. The method of claims 14 or 15, wherein positioning the substrate precursor on the base precursor includes pressing the substrate precursor on the base precursor in a green state prior to sintering.

17. The method of any of claims 14 through 16, wherein positioning the substrate precursor on the base precursor includes dipcoating the substrate precursor on the base precursor.

18. The method of any of claims 14 through 17, wherein positioning the substrate precursor on the base precursor includes vapor deposition.

19. The method of any of claims 14 through 18, wherein positioning the substrate precursor on the base precursor includes spray deposition.

20. A drill bit comprising:a bit body having at least one cutting element pocket therein; anda cutting element fixed in the cutting element pocket, the cutting element including:a polycrystalline diamond (PCD) table; anda body including:a carbide substrate bonded directly to the PCD table, the carbide substrate including a first plurality of carbide particles and a first matrix phase interspersed between the carbide particles of the first plurality of carbide particles, anda base layer bonded directly to the carbide substrate, the base layer including a second plurality of carbide particles and a second matrix phase interspersed between the carbide particles of the second plurality of carbide particles, wherein the secondplurality of carbide particles has a second grain size greater than a first grain size of the first plurality of carbide particles.

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