Display module and display device

Abstract

A display module (100) and a display device. A display panel (11) comprises a non-display portion (NDA), the non-display portion (NDA) comprising a first area (na1) and a second area (na2); a chip-on-film (12) is bonded and provided in the first area (na1); a compensation film (bc1) is provided in the second area (na2) and is located on at least one side of the chip-on-film (12); an adhesive layer (13) covers the chip-on-film (12) and the compensation film (bc1); a polarizer (14) is provided on the display panel (11) and covers the non-display portion (NDA) and the adhesive layer (13).

Description

Display modules and display devices Technical Field

[0001] This application relates to the field of display technology, specifically to a display module and display device. Background Technology

[0002] The borderless technology of the bonding area of ​​the display screen is achieved by first bonding the bonding area with a flip-chip film, then attaching a polarizing film to cover the bonding area, and then filling the bonding area with adhesive. In the non-bonding area, a polarizing film is super-attached, and then encapsulating adhesive is applied to the side. Finally, a one-piece cutting method is used to achieve the four-sided borderless technology.

[0003] In the process of researching and practicing existing technologies, the inventors of this application discovered that the spacing between the flip-chip films in the bonding area affects the distribution of the adhesive during lateral coating. For example, the adhesive can completely fill the areas of the flip-chip films, but cannot completely fill the areas of the non-flip-chip films. This causes the portion of the polarizer corresponding to the non-flip-chip film area to be recessed, resulting in an uneven polarizer and reducing the overall visual appeal of the display screen. Invention Overview

[0004] This application provides a display module and display device that can improve the flatness of the polarizer.

[0005] On one hand, embodiments of this application provide a display module, which includes:

[0006] A display panel includes a non-display portion, the non-display portion including a first area and a second area disposed on at least one side of the first area;

[0007] A flip-chip film, wherein the flip-chip film is bonded to the first region;

[0008] A compensation film is disposed in the second region and located on at least one side of the flip-chip film;

[0009] Adhesive layer, covering the flip-chip film and the compensation film; and

[0010] A polarizer is disposed on the display panel and covers the non-display portion and the adhesive layer.

[0011] On the other hand, correspondingly, embodiments of this application also provide a display device, which includes a display module as described in any of the above embodiments. Attached Figure Description

[0012] Figure 1 is a top view of the display module provided in an embodiment of this application;

[0013] Figure 2 is a cross-sectional view along the MM line in Figure 1;

[0014] Figure 3 is a cross-sectional view along line NN in Figure 1;

[0015] Figure 4 is an enlarged view of part G in Figure 3;

[0016] Figure 5 is another cross-sectional view along line NN in Figure 1;

[0017] Figure 6 is a schematic diagram of the structure of the display device provided in an embodiment of this application. Embodiments of the present invention

[0018] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. In addition, it should be understood that the specific implementation methods described herein are only for illustration and explanation of this application and are not intended to limit this application. In this application, the embodiments can be combined with each other but will not be described in detail one by one. Unless otherwise stated, the directional terms such as "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, specifically the drawing directions in the accompanying drawings; while "inner" and "outer" refer to the outline of the device; the terms "first," "second," "third," etc. are only used as markings and do not impose numerical requirements or establish a sequence.

[0019] On one hand, embodiments of this application provide a display module, which includes:

[0020] A display panel includes a non-display portion, the non-display portion including a first area and a second area disposed on at least one side of the first area;

[0021] A flip-chip film, wherein the flip-chip film is bonded to the first region;

[0022] A compensation film is disposed in the second region and located on at least one side of the flip-chip film;

[0023] Adhesive layer, covering the flip-chip film and the compensation film; and

[0024] A polarizer is disposed on the display panel and covers the non-display portion and the adhesive layer.

[0025] Optionally, in some embodiments of this application, the display module further includes a conductive adhesive, which simultaneously covers the first area and the second area, and the flip-chip film and the compensation film are both connected to the conductive adhesive on the side away from the non-display portion.

[0026] Optionally, in some embodiments of this application, a first bonding pad is provided on the first region, and the flip-chip film includes a second bonding pad, the second bonding pad being bonded to the first bonding pad by the conductive adhesive;

[0027] The compensation film includes a third bonding pad, which is disposed on the conductive adhesive.

[0028] Optionally, in some embodiments of this application, the flip-chip film and the compensation film are disposed separately.

[0029] Optionally, in some embodiments of this application, the flip-chip film and the compensation film are integrally connected.

[0030] Optionally, in some embodiments of this application, the flip-chip film includes a substrate layer and a metal layer disposed on the substrate layer, the substrate layer extending from the first region to the second region, and the metal layer including a second bonding pad located in the first region and a third bonding pad located in the second region;

[0031] The compensation film is formed in the portion of the flip-chip film located in the second region.

[0032] Optionally, in some embodiments of this application, the non-display portion includes an electrostatic lead wire, and the third bonding pad of the compensation film located in the two side regions of the non-display portion is electrically connected to the electrostatic lead wire.

[0033] The metal layer includes a trace, a third bonding pad electrically connected to the electrostatic lead is connected to the trace, the trace extends from the region of the compensation film to the region of the flip-chip film, and the trace is configured to be grounded.

[0034] Optionally, in some embodiments of this application, the adhesive layer includes a first sub-layer and a second sub-layer, the first sub-layer covering the flip-chip film and the compensation film, and the second sub-layer covering the side of the first sub-layer away from the non-display portion;

[0035] The viscosity of the second sublayer is higher than that of the first sublayer.

[0036] Optionally, in some embodiments of this application, the first area and the second area are arranged alternately in the direction parallel to the long side of the non-display portion;

[0037] In the direction parallel to the long side of the non-display portion, two compensation films are provided in the second region between two adjacent first regions.

[0038] Optionally, in some embodiments of this application, the long side of the compensation film is flush with the side of the non-display portion.

[0039] Optionally, in some embodiments of this application, the display panel includes an array substrate and a counter substrate disposed on the array substrate, the polarizer is disposed on the side of the counter substrate away from the array substrate and extends beyond the counter substrate, and the adhesive layer connects the side of the counter substrate and the side of the polarizer close to the array substrate.

[0040] The non-display portion includes the portion of the array substrate located in the bonding region, and the flip-chip film and the compensation film are disposed on the array substrate.

[0041] On the other hand, correspondingly, embodiments of this application also provide a display device, which includes a display module as described in any of the above embodiments.

[0042] In the display module and display device of this application embodiment, the display panel includes a non-display portion, the non-display portion includes a first region and a second region disposed on at least one side of the first region, a flip-chip film is bonded to the first region, a compensation film is disposed in the second region and located on at least one side of the flip-chip film, an adhesive layer covers the flip-chip film and the compensation film, and a polarizer is disposed on the display panel and covers the non-display portion and the adhesive layer.

[0043] This application embodiment fills the height difference in the second region by setting a compensation film, reducing the step difference between the portion of the adhesive layer in the first region and the portion in the second region, improving the flatness of the adhesive layer, and thus improving the flatness of the polarizer.

[0044] This application provides a display module and a display device, which will be described in detail below. It should be noted that the order of description of the following embodiments is not intended to limit the preferred order of the embodiments.

[0045] Referring to Figures 1 to 3, the display panel 11 of the display module 100 includes, but is not limited to, one of the following: liquid crystal display (LCD) panel, organic light-emitting diode (OLED) panel, inorganic electroluminescent (EL) display panel, quantum dot light-emitting diode (QED) panel, micro LED display panel, nano LED display panel, field emission display (FED) panel, and electrophoretic display (EPD) panel. In the following description, an organic light-emitting diode (OLED) panel will be used as an example; however, the implementation is not limited to OLED panels, and other display panels listed above or known in the art can be applied to the implementation.

[0046] In Figures 1 and 2, the first direction F1 can be a direction parallel to one side of the display panel 11 in a plan view, and for example, it can be the lateral direction of the display panel 11. The second direction F2 can be a direction parallel to the other side of the display panel 11 in a plan view, and it can be the longitudinal direction of the display panel 11. The third direction F3 can be the thickness direction of the display panel 11. Optionally, in some embodiments, the first direction F1 and the second direction F2 can also be non-perpendicularly intersecting.

[0047] Optionally, the display panel 11 may have a rectangular shape in a plan view, but the implementation is not limited to this. In some embodiments, the display panel 11 may have a rectangular shape with vertical corners or rounded corners in a plan view. In a plan view, the display panel 11 has two long sides arranged in a first direction F1 and two short sides arranged in a second direction F2. That is, the long sides of the display panel 11 are parallel to the first direction F1, and the short sides of the display panel 11 are parallel to the second direction F2.

[0048] Display panel 11 may include a display area DA and a non-display area NDA. In a plan view, the shape of the display area DA may correspond to the shape of the display panel 11. For example, if the display panel 11 has a rectangular shape in a plan view, the display area DA may also have a rectangular shape.

[0049] The display area DA can be a region that includes pixels for displaying images. Pixels can be arranged in a matrix. Pixels can have rectangular, rhomboid, or square shapes in a planar view, but the implementation is not limited to these. For example, in a planar view, pixels can have a quadrilateral shape other than a rectangular, rhomboid, or square shape, a polygonal shape other than a quadrilateral shape, a circular shape, or an elliptical shape.

[0050] The non-display area NDA can be a region that does not contain pixels and does not display images. The non-display area NDA can be arranged near (or around) the display area DA. As shown in Figure 1, the non-display area NDA can surround the display area DA, but the implementation is not limited to this.

[0051] Among them, the part of the display panel 11 corresponding to the display area DA is the display part AA, and the part of the display panel 11 corresponding to the non-display area NDA is the non-display part NA.

[0052] Please refer to Figures 1 to 3. This application provides a display module 100, which includes a display panel 11, a flip-chip film 12, a compensation film bc1, an adhesive layer 13, a polarizer 14, and a circuit board 15.

[0053] Optionally, one end of the flip-chip film 12 is bonded to the display panel 11, and the other end of the flip-chip film 12 is bonded to the circuit board 15.

[0054] The non-display portion NA of the display panel 11 includes a first region na1 and a second region na2 disposed on at least one side of the first region na1. A flip-chip film 12 is bonded to the first region na1.

[0055] The compensation film bc1 is disposed in the second region na2 and is located on at least one side of the flip-chip film 12.

[0056] The adhesive layer 13 covers the flip-chip film 12 and the compensation film bc1. The polarizer 14 is disposed on the display panel 11 and covers the non-display portion NA and the adhesive layer 13.

[0057] It should be understood that, in this embodiment of the application, by setting a compensation film bc1 to fill the drop in the second region na2, the step difference between the adhesive layer 13 in the first region na1 and the second region na2 is reduced, thereby improving the flatness of the adhesive layer 13 and thus improving the flatness of the polarizer 14.

[0058] Optionally, in some embodiments of this application, the display panel 11 includes an array substrate 1a and a counter substrate 1b disposed on the array substrate 1a. A polarizer 14 is disposed on the side of the counter substrate 1b away from the array substrate 1a and extends beyond the counter substrate 1b. An adhesive layer 13 connects the side of the counter substrate 1b and the side of the polarizer 14 near the array substrate 1a.

[0059] The non-display portion NA includes the portion of the array substrate 1a located in the bonding region, and the flip-chip film 12 and the compensation film bc1 are disposed on the array substrate 1a.

[0060] It should be noted that the number of flip-chip films 12 can be determined according to the actual size of the display panel 11. For example, a small-sized display panel 11 may have only one flip-chip film 12, while a large-sized display panel 11 requires multiple flip-chip films 12.

[0061] It is understood that, since the display panel 11 is an electroluminescent panel, the display panel 11 also includes light-emitting devices, which are disposed on the array substrate 1a. The opposing substrate 1b is an encapsulation cover. The light-emitting devices can be one of the following: organic light-emitting devices, inorganic light-emitting devices, quantum dot light-emitting devices, micro light-emitting devices, and sub-millimeter-scale light-emitting devices.

[0062] If the display panel 11 is a liquid crystal display panel, then the display panel 11 further includes a liquid crystal layer disposed between the array substrate 1a and the opposing substrate 1b. The opposing substrate 1b can be a color filter substrate containing a color filter layer, or it can be a substrate without a color filter layer.

[0063] Since the flip-chip film 12 and the compensation film bc1 are disposed on the array substrate 1a, the adhesive layer 13 will cover the portion of the array substrate 1a not covered by the opposing substrate 1b. The polarizer 14 will also cover the portion of the array substrate 1a not covered by the opposing substrate 1b to achieve a borderless design.

[0064] Referring to Figure 2, in some embodiments, the display module 100 may further include a heat sink 171 and a side coating 172. The heat sink 171 is disposed on the side of the array substrate 1a away from the opposing substrate 1b. The other end of the flip-chip film 12 is bent to the back of the heat sink 171, and the circuit board 15 is disposed on the back of the heat sink 171.

[0065] Side coating 172 covers the sides of the array substrate 1a and the opposing substrate 1b and connects to the polarizer 14. Optionally, in some embodiments, the display module 100 may further include a heat sink 171 and side coating 172. The heat sink 171 is disposed on the side of the array substrate 1a away from the opposing substrate 1b. The other end of the flip-chip film 12 is bent to the back of the heat sink 171, and the circuit board 15 is disposed on the back of the heat sink 171.

[0066] Side coating 172 covers the sides of array substrate 1a and opposing substrate 1b and connects to polarizer 14.

[0067] In some embodiments of this application, the display module 100 further includes a conductive adhesive 16, which simultaneously covers the first region na1 and the second region na2. The flip-chip film 12 and the compensation film bc1 are both connected to the side of the conductive adhesive 16 away from the non-display portion NA.

[0068] It is understandable that by attaching the integrated conductive adhesive 16 to the bonding area of ​​the non-display portion NA of the array substrate 1a, compared to setting the conductive adhesive only on the cover film, the embodiments of this application extend the conductive adhesive 16 to the second region na2, so that in the hot pressing process, the flip-chip film 12 and the compensation film bc1 can be bonded together on the same conductive adhesive 16, saving process steps.

[0069] In addition, the conductive adhesive 16 extends to the second region na2, further reducing the drop between the first region na1 and the second region na2, and improving the flatness of the adhesive layer 13 covering the non-display portion NA and the flatness of the polarizer 14.

[0070] Optionally, the hot-pressing process for the flip-chip film 12 and the compensation film bc1 can be as follows: First, a pre-pressing head is used to pre-press the flip-chip film 12 and the compensation film bc1 to bond them to the conductive adhesive 16; then, a long pressure head is used to hot-press all the flip-chip films 12 and all the compensation films bc1. Using a long pressure head to hot-press all the flip-chip films 12 and the compensation films bc1 ensures that they are subjected to the same pressure and the same pressure plane, improving the flatness of the conductive adhesive 16, and consequently improving the flatness of the flip-chip films 12 and the compensation films bc1.

[0071] Optionally, in some embodiments of this application, the flip-chip film 12 and the compensation film bc1 are integrally connected.

[0072] It is understandable that the flip-chip film 12 and the compensation film bc1 are integrally connected, forming a whole and improving the stability of their connection; and during the pre-pressing step of the hot pressing, they can be aligned with the conductive adhesive 16 only once, and a single pre-pressing head can be used to pre-press both of them simultaneously, improving the efficiency of pre-pressing and the flatness of both during pre-pressing.

[0073] Optionally, the flip-chip film 12 extends from the first region na1 to the second region na2, wherein the portion of the flip-chip film 12 extending into the second region na2 is the compensation film bc1.

[0074] Optionally, in some embodiments of this application, the flip-chip film 12 and the compensation film bc1 may also be separately configured.

[0075] It is understandable that separating the flip-chip film 12 and the compensation film bc1 allows for the use of shorter pre-pressing heads to pre-press the flip-chip film 12 and the compensation film bc1 separately during pre-pressing, avoiding the use of longer pre-pressing heads and reducing costs.

[0076] In addition, the separate arrangement of the compensation film bc1 and the flip-chip film 12 facilitates the adjustment of their distance and the relative position and distance between them and the conductive adhesive 16, thereby better adjusting their flatness.

[0077] Figure 1 illustrates the example of the integrated connection between the flip-chip film 12 and the compensation film bc1, but it is not limited to this. The following text will also be described with reference to Figure 1.

[0078] The compensation film bc1 is disposed in the second region na2 and located on at least one side of the flip-chip film 12. The compensation film bc1 extends along the first direction F1.

[0079] It should be noted that a compensation film bc1 can be disposed on one side of a flip-chip film 12, so that the compensation film bc1 and the flip-chip film 12 can be integrally formed into an inverted L-shape; or two compensation films bc1 can be disposed on both sides of a flip-chip film 12, so that the compensation film bc1 and the flip-chip film 12 can be integrally formed into a T-shape.

[0080] In some embodiments of this application, the first region na1 and the second region na2 are alternately arranged in the long side direction (first direction F1) parallel to the non-display portion NA.

[0081] In the direction parallel to the long side of the non-display portion NA, two compensation films bc1 are provided in the second region na2 between two adjacent first regions na1.

[0082] It's important to understand that the number of compensation films bc1 in the second region na2 depends on the length of the second region na2. In other words, the longer the second region na2 is in the first direction F1, the more compensation films bc1 can be considered. However, this is not the only option. For example, based on the requirements of the hot pressing process, one compensation film bc1, two compensation films bc1, or even three or more compensation films bc1 can be set for each second region na2.

[0083] In the second region na2 between two adjacent first regions na1, two compensation films bc1 are provided, so that a compensation film bc1 is provided on both sides of a flip-chip film 12 to form a T-shaped integrated structure. This T-shaped structure can be pre-pressed simultaneously by a single pre-pressing head, improving pre-pressing efficiency. Furthermore, the T-shaped integrated structure places the flip-chip film 12 in the middle of the two compensation films bc1, ensuring the uniformity of the conductive adhesive 16 under the flip-chip film 12 during pre-pressing, and improving the bonding stability and effectiveness between the flip-chip film 12 and the array substrate 1a.

[0084] Optionally, in some embodiments of this application, the long side of the compensation film bc1 is flush with the side of the non-display portion NA.

[0085] It is understood that the long side of the compensation film bc1 is the side extending along the first direction F1. The side of the non-display portion NA is the side of the array substrate 1a. The long side of the compensation film bc1 is flush with the side of the array substrate 1a, which improves the integrity and flatness of the compensation film bc1 covering the second region na2, thereby improving the overall flatness of the adhesive layer 13.

[0086] Referring to Figures 3 and 4, optionally, in some embodiments of this application, a first bonding pad 111 is provided on the first region na1. The flip-chip film 12 includes a second bonding pad 121, which is bonded to the first bonding pad 111 by conductive adhesive 16.

[0087] The compensation film bc1 includes a third bonding pad ry1, which is disposed on the conductive adhesive 16.

[0088] Understandably, the first bonding pad 111 is disposed on the array substrate 1a. The second bonding pad 121 of the flip-chip film 12 is bonded to the first bonding pad 111 by conductive adhesive 16 to enable signal transmission to the display panel 11.

[0089] The purpose of setting a third binding pad ry1 in the compensation membrane bc1 is to make the pressure on the compensation membrane bc1 and the flip-chip film 12 more balanced during pre-pressure and main pressure, thereby improving the uniformity of their compressive strength and reducing the risk of unevenness caused by uneven pressure.

[0090] Optionally, the distance between two adjacent third bonding pads ry1 is equal to the distance between two adjacent second bonding pads 121, in order to improve the flatness between the flip-chip film 12 and the compensation film bc1.

[0091] Optionally, based on the same spacing, the dimensions of the third bonding pad ry1 and the second bonding pad 121 are the same, which can further improve the flatness between the flip-chip film 12 and the compensation film bc1 during hot pressing.

[0092] Optionally, in some embodiments of this application, the flip-chip film 12 includes a substrate layer 12a and a metal layer 12b disposed on the substrate layer 12a. The substrate layer 12a extends from a first region na1 to a second region na2, and the metal layer 12b includes a second bonding pad 121 located in the first region na1 and a third bonding pad ry1 located in the second region na2.

[0093] Among them, the portion of the flip-chip thin film 12 located in the second region na2 forms a compensation film bc1.

[0094] Optionally, in some embodiments of this application, the non-display portion NA includes an electrostatic lead 112. The third bonding pad ry1 of the compensation film bc1 located in the regions on both sides of the non-display portion NA is electrically connected to the electrostatic lead 112.

[0095] Referring to Figure 1, the metal layer 12b includes a trace 12c. A third bonding pad ry1, electrically connected to the electrostatic lead 112, is connected to the trace 12c. The trace 12c extends from the region of the compensation film bc1 to the region of the flip-chip film 12, and the trace 12c is configured to be grounded.

[0096] Understandably, existing flip-chip films also incorporate grounding pads. Using the third bonding pad ry1 as a relay grounding pad avoids overcrowding the space for the second bonding pad 121 on the flip-chip film 12, and improves the uniformity of force distribution between the flip-chip film 12 and the compensation film bc1. Secondly, since the compensation film bc1 has ample space for the third bonding pad ry1, its area can be designed to be larger than that of the second bonding pad 121, thereby improving the bonding yield of the third bonding pad ry1 and enhancing its anti-static performance.

[0097] It should be noted that in some embodiments, when the flip-chip film 12 and the compensation film bc1 are set separately, the third bonding pad ry1 of the compensation film bc1 is configured not to output or input electrical signals, that is, the third bonding pad ry1 is a redundant bonding pad.

[0098] In some embodiments, when no bonding pads are provided in the array substrate 1a based on the second region na2, the thickness of the compensation film bc1 can be greater than the thickness of the flip-chip film 12 to compensate for the thickness difference of the first bonding pad 111, thereby improving the flatness of the compensation film bc1 and the flip-chip film 12.

[0099] Optionally, the thickness difference between the compensation film bc1 and the flip-chip film 12 is less than or equal to the thickness of the first bonding pad 111, so as to compensate for the thickness difference of the first bonding pad 111, thereby improving the flatness of the compensation film bc1 and the flip-chip film 12.

[0100] Optionally, for the portion of the array substrate 1a located in the second region na2 where no bonding pads are provided, the thickness of the third bonding pad ry1 in this region can be greater than the thickness of the second bonding pad 121. For example, the number of metal layers forming the third bonding pad ry1 is greater than the number of metal layers forming the second bonding pad 121.

[0101] The thickness of the third bonding pad ry1 is equal to the sum of the thickness of the first bonding pad 111 and the thickness of the second bonding pad 121, in order to improve the flatness of the flip-chip film 12 and the compensation film bc1.

[0102] Figure 5 shows a schematic view of a display module 100 according to one or more embodiments of this application. Compared with the embodiment corresponding to Figure 2, the adhesive layer of the display module 100 in the embodiment corresponding to Figure 5 includes at least two sublayers.

[0103] In Figure 5, the parts that differ from the above embodiments will be described in order to avoid redundancy.

[0104] Optionally, the adhesive layer 13 includes a first sublayer 131 and a second sublayer 132. The first sublayer 131 covers the flip-chip film 12 and the compensation film bc1, and the second sublayer 132 covers the side of the first sublayer 131 away from the non-display portion NA.

[0105] The viscosity of the second sublayer 132 is higher than that of the first sublayer 131.

[0106] Understandably, the viscosity of the second sub-layer 132 is higher than that of the first sub-layer 131, resulting in better sealing performance of the first sub-layer 131 and better flowability of the second sub-layer 132. The better sealing performance of the first sub-layer 131 effectively seals the flip-chip film 12 and the compensation film bc1, while the better flowability of the second sub-layer 132 allows for better leveling of the morphology of the first sub-layer 131, thereby improving the flatness of the adhesive layer 13 and consequently improving the flatness of the polarizer 14.

[0107] Figure 6 shows a schematic diagram of the structure of a display device 1000 according to an embodiment of this application. This application also provides a display device 1000, which includes a display module 100 as described in any of the above embodiments.

[0108] It should be noted that the structure of the display module 100 of the display device 1000 disclosed in this application is similar to or the same as the structure of the display module 100 of the above embodiments, so it will not be described again here.

[0109] Optionally, the display device 1000 may also include an outer frame 200, with the display module 100 disposed within the outer frame 200.

[0110] In the display device 1000 of this application embodiment, the display panel 11 includes a non-display portion NA, the non-display portion NA includes a first region na1 and a second region na2 disposed on at least one side of the first region na1, a flip-chip film is bonded to the first region na1, a compensation film is disposed in the second region na2 and located on at least one side of the flip-chip film 12, an adhesive layer covers the flip-chip film 12 and the compensation film bc1, and a polarizer is disposed on the display panel 11 and covers the non-display portion NA and the adhesive layer 13.

[0111] In this embodiment, by setting a compensation film bc1 to fill the drop in the second region na2, the step difference between the adhesive layer 13 in the first region na1 and the second region na2 is reduced, thereby improving the flatness of the adhesive layer 13 and thus improving the flatness of the polarizer 14.

[0112] The above provides a detailed description of a display module and display device provided in the embodiments of this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A display module, comprising: A display panel includes a non-display portion, the non-display portion including a first area and a second area disposed on at least one side of the first area; A flip-chip film, wherein the flip-chip film is bonded to the first region; A compensation film is disposed in the second region and located on at least one side of the flip-chip film; Adhesive layer, covering the flip-chip film and the compensation film; and A polarizer is disposed on the display panel and covers the non-display portion and the adhesive layer.

2. The display module according to claim 1, wherein, The display module further includes a conductive adhesive, which simultaneously covers the first area and the second area. The flip-chip film and the compensation film are both connected to the conductive adhesive on the side away from the non-display portion.

3. The display module according to claim 2, wherein, A first bonding pad is provided on the first region, and the flip-chip film includes a second bonding pad, which is bonded to the first bonding pad by the conductive adhesive; The compensation film includes a third bonding pad, which is disposed on the conductive adhesive.

4. The display module according to any one of claims 1-3, wherein, The flip-chip film and the compensation film are disposed separately.

5. The display module according to any one of claims 1-3, wherein, The flip-chip film and the compensation film are integrally connected.

6. The display module according to claim 5, wherein, The flip-chip film includes a substrate layer and a metal layer disposed on the substrate layer. The substrate layer extends from the first region to the second region. The metal layer includes a second bonding pad located in the first region and a third bonding pad located in the second region. The portion of the flip-chip film located in the second region forms the compensation film.

7. The display module according to claim 6, wherein, The non-display portion includes electrostatic leads, and the third bonding pad of the compensation film located in the two side regions of the non-display portion is electrically connected to the electrostatic leads; The metal layer includes a trace, a third bonding pad electrically connected to the electrostatic lead is connected to the trace, the trace extends from the region of the compensation film to the region of the flip-chip film, and the trace is configured to be grounded.

8. The display module according to any one of claims 1-3, wherein, The adhesive layer includes a first sublayer and a second sublayer, the first sublayer covering the flip-chip film and the compensation film, and the second sublayer covering the side of the first sublayer away from the non-display portion; The viscosity of the second sublayer is higher than that of the first sublayer.

9. The display module according to any one of claims 1-3, wherein, The first area and the second area are arranged alternately in the direction parallel to the long side of the non-display portion; In the direction parallel to the long side of the non-display portion, two compensation films are provided in the second region between two adjacent first regions.

10. The display module according to any one of claims 1-3, wherein, The long side of the compensation film is flush with the side of the non-display portion.

11. The display module according to any one of claims 1-3, wherein, The display panel includes an array substrate and a counter substrate disposed on the array substrate. The polarizer is disposed on the side of the counter substrate away from the array substrate and extends beyond the counter substrate. The adhesive layer connects the side of the counter substrate and the side of the polarizer close to the array substrate. The non-display portion includes the portion of the array substrate located in the bonding region, and the flip-chip film and the compensation film are disposed on the array substrate.

12. A display device, comprising a display module, the display module comprising: A display panel includes a non-display portion, the non-display portion including a first area and a second area disposed on at least one side of the first area; A flip-chip film, wherein the flip-chip film is bonded to the first region; A compensation film is disposed in the second region and located on at least one side of the flip-chip film; Adhesive layer, covering the flip-chip film and the compensation film; and A polarizer is disposed on the display panel and covers the non-display portion and the adhesive layer.

13. The display device according to claim 12, wherein, The display module further includes a conductive adhesive, which simultaneously covers the first area and the second area. The flip-chip film and the compensation film are both connected to the conductive adhesive on the side away from the non-display portion.

14. The display device according to claim 13, wherein, A first bonding pad is provided on the first region, and the flip-chip film includes a second bonding pad, which is bonded to the first bonding pad by the conductive adhesive; The compensation film includes a third bonding pad, which is disposed on the conductive adhesive.

15. The display device according to any one of claims 12-14, wherein, The flip-chip film and the compensation film are disposed separately.

16. The display device according to any one of claims 12-14, wherein, The flip-chip film and the compensation film are integrally connected.

17. The display device according to claim 16, wherein, The flip-chip film includes a substrate layer and a metal layer disposed on the substrate layer. The substrate layer extends from the first region to the second region. The metal layer includes a second bonding pad located in the first region and a third bonding pad located in the second region. The portion of the flip-chip film located in the second region forms the compensation film.

18. The display device according to claim 17, wherein, The non-display portion includes electrostatic leads, and the third bonding pad of the compensation film located in the two side regions of the non-display portion is electrically connected to the electrostatic leads; The metal layer includes a trace, a third bonding pad electrically connected to the electrostatic lead is connected to the trace, the trace extends from the region of the compensation film to the region of the flip-chip film, and the trace is configured to be grounded.

19. The display device according to any one of claims 12-14, wherein, The adhesive layer includes a first sublayer and a second sublayer, the first sublayer covering the flip-chip film and the compensation film, and the second sublayer covering the side of the first sublayer away from the non-display portion; The viscosity of the second sublayer is higher than that of the first sublayer.

20. The display device according to any one of claims 12-14, wherein, The first area and the second area are arranged alternately in the direction parallel to the long side of the non-display portion; In the direction parallel to the long side of the non-display portion, two compensation films are provided in the second region between two adjacent first regions.

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