Display panel and display device

Abstract

The present application relates to a display panel and a display device. The display panel comprises a display area and a non-display area. The non-display area comprises an opening and an isolation area, the isolation area is located between the opening and the display area, and the isolation region surrounds at least a portion of the opening. The display panel comprises a substrate layer, a planarization layer is provided on the substrate layer in the display area, the planarization layer has a first isolation structure on the substrate layer in the isolation area, and the first isolation structure comprises a main top surface and a main bottom surface opposite to each other in the direction perpendicular to the plane where the display panel is located, and a main side surface connecting the main top surface and the main bottom surface. The isolation area further comprises a strengthening structure, and the strengthening structure is in contact with at least a portion of the side surface of the first isolation structure, and is in contact with the substrate layer. In the present application, by providing the strengthening structure in the isolation area, the first isolation structure in the isolation area is optimized, so as to improve the bonding force between film layers in the isolation area of the display panel, reduce peeling between the film layers, and thereby effectively enhance the stability and reliability of a display surface.

Description

Display panel and display device Technical Field

[0001] This application relates to the field of display device technology, and more particularly to a display panel and a display device. Background Technology

[0002] With the continuous development of flexible OLED (Organic Light-Emitting Diode) devices, mobile electronic devices have an increasing demand for full-screen displays, making the punch-hole technology for display screens increasingly urgent.

[0003] In existing display panels, there is usually a barrier setting area between the screen hole (AAhole, AAH) and the display area. The barrier setting area is equipped with a barrier to prevent the vapor-deposited organic material that is prone to water absorption and failure from entering the AAH.

[0004] However, the use of a barrier structure will cause multiple stress concentration points in the barrier setting area. During the laser lift-off (LLO) process, which uses laser lift-off technology to peel the display components fabricated on the flexible substrate from the rigid substrate, the laser can easily cause the organic light-emitting layer in the barrier setting area to vaporize, causing the film layers to peel off and affecting the stability and reliability of the display panel. Summary of the Invention

[0005] This application provides a display panel that effectively solves the problem of film peeling. It includes a display area and a non-display area, the non-display area including an opening and a partition area, the partition area being located between the opening and the display area, and the partition area surrounding at least a portion of the opening;

[0006] The display panel includes a planarization layer in the display area, and the planarization layer has a first partition structure in the partition area. The first partition structure includes a main top surface and a main bottom surface opposite each other in a direction perpendicular to the plane of the display panel, and a main side surface connecting the main top surface and the main bottom surface.

[0007] The display panel is located in the partition, which includes a substrate layer. The first partition structure is formed on the substrate layer. A reinforcing structure is also provided on the substrate layer. The reinforcing structure is at least partially in contact with at least a portion of the side surface of the first partition structure and in contact with the substrate layer.

[0008] In one embodiment, the first partition structure includes a first partition portion and a second partition portion, wherein the first partition portion and the second partition portion are arranged sequentially along a direction perpendicular to the plane where the display panel is located.

[0009] The first partition includes a first bottom surface and a first top surface opposite each other in a direction perpendicular to the plane of the display panel, and a first side surface connecting the first top surface and the first bottom surface. The second partition includes a second bottom surface and a second top surface opposite each other in a direction perpendicular to the plane of the display panel, and a second side surface connecting the second top surface and the second bottom surface.

[0010] The first top surface and the second bottom surface are in at least partial contact.

[0011] In one embodiment, the second partition portion is located on the first top surface, and the area of ​​the second bottom surface of the second partition portion is smaller than the area of ​​the first top surface.

[0012] In one embodiment, the area of ​​the second bottom surface of the second partition is larger than the area of ​​the first bottom surface of the first partition, and the second bottom surface of the second partition completely covers the first side surface of the first partition.

[0013] In one embodiment, the reinforcing structure includes an auxiliary fixing layer that covers the substrate layer of the outer peripheral portion of the main bottom surface of the first partition structure to at least a portion of the main side surface of the first partition structure.

[0014] In one embodiment, the display panel further includes an anode layer, which is stacked sequentially with the planarization layer in a direction perpendicular to the plane of the display panel.

[0015] When the second partition is located on the first top surface, and the area of ​​the second bottom surface of the second partition is smaller than that of the first top surface, the anode layer forms the auxiliary fixing layer in the partition area, and the auxiliary fixing layer covers the first side surface of the first partition and the blank part on the first top surface of the first partition that is not covered by the second bottom surface.

[0016] In one embodiment, the auxiliary fixing layer covers the substrate layer, main side surface, and main top surface of the outer periphery of the main bottom surface of the first partition structure.

[0017] In one embodiment, a plurality of vent holes are provided on the auxiliary fixing layer located on the main top surface, and the vent holes are spaced apart on the auxiliary fixing layer.

[0018] In one embodiment, the reinforcing structure further includes a plurality of auxiliary fixing portions, the cross-sectional dimensions of which gradually increase along the direction away from the substrate layer; or

[0019] The cross-sectional dimensions of the auxiliary fixing part first decrease and then increase along the direction away from the substrate layer.

[0020] In one embodiment, the width of the auxiliary fixing part is less than one-quarter of the width of the first partition structure.

[0021] In one embodiment, when the second partition portion is located on the first top surface and the area of ​​the second bottom surface of the second partition portion is smaller than that of the first top surface, the auxiliary fixing portion is located between the first partition portion and the substrate layer, and / or

[0022] The auxiliary fixing part is located between the first partition part and the second partition part.

[0023] In one embodiment, when the auxiliary fixing part is located between the first partition part and the substrate layer, the first bottom surface of the first partition part at least partially covers at least part of the top surface of the auxiliary fixing part;

[0024] When the auxiliary fixing part is located between the first partition part and the second partition part, the second bottom surface of the second partition part at least partially covers the at least partial top surface of the auxiliary fixing part.

[0025] In one embodiment, when the area of ​​the second bottom surface of the second partition is greater than the area of ​​the first bottom surface of the first partition, and the second bottom surface of the second partition completely covers the first side surface of the first partition, the auxiliary fixing part is located on both sides of the first partition, and the second bottom surface of the second partition at least partially covers at least part of the top surface of the auxiliary fixing part.

[0026] In one embodiment, the first bottom surface of the first partition portion at least partially covers at least a portion of the top surface of the auxiliary fixing portion.

[0027] In one embodiment, the partition area further includes a second partition structure, the second partition structure comprising a third partition portion and a fourth partition portion; wherein,

[0028] The third partition is located between the display area and the first partition structure, and the fourth partition is located between the first partition structure and the opening.

[0029] In one embodiment, the display panel further includes a circuit layer, an anode layer, and a light-emitting layer in the display area, wherein the substrate layer, the circuit layer, the anode layer, the planarization layer, and the light-emitting layer in the display area are sequentially stacked.

[0030] The light-emitting layer is naturally cut into a first part and a second part by the first partition structure and the second partition structure within the partition area. The first part is located on the surface of the first partition structure and the second partition structure, and the second part is located on the surface of the substrate layer outside the first partition structure and the second partition structure.

[0031] In one embodiment, the circuit layer includes a semiconductor layer, a first gate insulating layer, a first gate metal layer, a second gate insulating layer, a second gate metal layer, a first interlayer dielectric layer, and a source / drain metal layer, which are sequentially stacked.

[0032] The first gate metal layer and / or the second gate metal layer have a raised structure within the isolation region, the raised structure being located below the second isolation structure.

[0033] In one embodiment, the source / drain metal layer forms the auxiliary fixing portion, the third partition portion, and the fourth partition portion within the partition region, and the auxiliary fixing portion, the third partition portion, and the fourth partition portion are...

[0034] In one embodiment, the display panel further includes a cathode layer located on the side of the light-emitting layer away from the anode layer in the display area, and an encapsulation layer located on the side of the cathode layer away from the light-emitting layer.

[0035] The encapsulation layer comprises a first encapsulation inorganic layer, an encapsulation organic layer, and a second encapsulation inorganic layer, which are stacked sequentially; wherein

[0036] The first encapsulation inorganic layer, the encapsulation organic layer, and the second encapsulation inorganic layer cover the third partition portion, the first encapsulation inorganic layer and the second encapsulation inorganic layer cover the fourth partition portion, and the encapsulation organic layer does not overlap with the fourth partition portion.

[0037] This application also provides a display device, including a display panel as mentioned in any of the above embodiments.

[0038] The technical solutions provided by the embodiments of this application may include the following beneficial effects:

[0039] As can be seen from the above embodiments, the display panel of this application includes a display area and a non-display area. The non-display area includes an opening and a partition area, with the partition area located between the opening and the display area, and surrounding at least a portion of the opening. The display panel includes a substrate layer, and a planarization layer is disposed on the substrate layer of the display area. The planarization layer has a first partition structure on the substrate layer within the partition area. The first partition structure includes a main top surface and a main bottom surface facing each other in a direction perpendicular to the plane of the display panel, and a main side surface connecting the main top surface and the main bottom surface. The partition area also includes a reinforcing structure, which contacts at least a portion of the side surface of the first partition structure and the substrate layer. This application optimizes the first partition structure in the partition area by providing a reinforcing structure within the partition area, thereby improving the bonding force between the first partition structure and the substrate layer, reducing the peeling problem of the first partition structure, and effectively improving the stability and reliability of the display surface.

[0040] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this application. Attached Figure Description

[0041] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0042] Figure 1 is a schematic diagram of the problem of LLO causing peeling in the retaining wall setting area in one embodiment of this application.

[0043] Figure 2 is a schematic diagram of accelerated degradation strain simulation of a display panel provided in one embodiment of this application under an environment of 85℃ / 85%.

[0044] Figure 3 is a schematic diagram of the structure of a display panel provided in one embodiment of this application.

[0045] Figure 4 is a schematic cross-sectional view of a portion of a display panel provided in one embodiment of this application.

[0046] Figure 5 is a cross-sectional structural diagram of a portion of another display panel provided in one embodiment of this application.

[0047] Figure 6 is an enlarged structural diagram of part A in Figure 5.

[0048] Figures 7 to 11 are schematic cross-sectional views of partial areas of different display panels provided in one embodiment of this application.

[0049] Figure 12 is an enlarged structural diagram of part B in Figure 11.

[0050] Figures 13 to 16 are schematic cross-sectional views of partial areas of different display panels provided in one embodiment of this application.

[0051] Figure 17 is a top view of the opening and partition area of ​​a display panel provided in one embodiment of this application.

[0052] Figure label:

[0053] 001. Display area.

[0054] 1. Flexible substrate layer; 2. Buffer layer; 3. Circuit layer; 31. Semiconductor layer; 32. First gate insulating layer; 33. First gate metal layer; 34. Second gate insulating layer; 35. Second gate metal layer; 36. First interlayer dielectric layer; 37. Source / drain metal layer; 4. Planarization layer; 5. Anode layer; 6. Second interlayer dielectric layer; 7. Light-emitting layer; 9. Encapsulation layer; 91. First encapsulation inorganic layer; 92. Encapsulation organic layer; 93. Second encapsulation inorganic layer.

[0055] 002. Opening.

[0056] 003, Partition Area.

[0057] 30. First partition structure; 301. First partition part; 3011. First bottom surface; 3012. First top surface; 3013. First side surface; 302. Second partition part; 3021. Second bottom surface; 3022. Second top surface; 3023. Second side surface. 40. Second partition structure; 401. Third partition part; 402. Fourth partition part; 50. Reinforcing structure; 60. Heightening structure. Detailed Implementation

[0058] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The manner described in the following exemplary embodiments does not represent all manner consistent with this application. Rather, they are merely examples of apparatuses consistent with some aspects of this application as detailed in the appended claims.

[0059] As described in the background art, when the substrate of the display panel is a flexible substrate, the substrate is generally formed on a rigid substrate. After other functional layers are formed on the substrate, laser lift-off (LLO) technology is generally used to peel off and remove the rigid substrate.

[0060] Figure 1 illustrates the peeling problem caused by LLO in the barrier area during the LLO process. As shown in Figure 1, the high transmittance of the barrier area allows the laser to penetrate the substrate, causing the organic material film in the barrier area to vaporize. Furthermore, the significant stress concentration in the film layer of the barrier's sloping area results in poor adhesion of the vaporized organic material film, leading to peeling and affecting the structural stability and reliability of the display panel. Reliability can be understood as the integrity of the hole walls in the perforated area, its conductivity, and its long-term stability under environmental changes (such as temperature and humidity variations). Defects in the perforated area can affect the reliability of electronic devices, leading to performance degradation or malfunction.

[0061] Meanwhile, conventional retaining wall structures are generally multi-layered, resulting in multiple steps. Figure 2 shows a simulation diagram of accelerated degradation strain of the display panel at 85℃ / 85% temperature. As shown in Figure 3, each step is a stress concentration point, causing greater strain in the encapsulated inorganic material layer within the retaining wall area. This leads to the detachment of the encapsulated inorganic material layer, affecting the structural stability and reliability of the display panel.

[0062] Based on this, this application provides a display panel including a display area 001 and a non-display area. The non-display area includes an opening 002 and a partition area 003, the partition area 003 being located between the opening 002 and the display area 001, and the partition area 003 surrounding at least a portion of the opening 002. This application effectively improves the bonding force between the film layers within the partition area 003 by adding a reinforcing structure to the first partition structure used to partition the organic material within the display area 001, thereby reducing the risk of peeling between the film layers and improving the structural stability and reliability of the display panel.

[0063] Specifically, the partition area 003 surrounding at least part of the opening 002 can be configured to fully or partially surround it. For example, in part a of Figure 2, the display area 001 surrounds the opening 002, and correspondingly, the partition area 003 surrounds the opening 002. In part b of Figure 2, the display area 001 partially surrounds the opening 002, and correspondingly, the partition area 003 partially surrounds the opening 002.

[0064] The display panel in display area 001 includes a circuit layer 3, a planarization layer 4, an anode layer 5, and a light-emitting layer 7 stacked sequentially. The planarization layer 4 has a first partition structure 30 within the partition area 003. Alternatively, the first partition structure 30 can be understood as being formed by the planarization layer 4.

[0065] Specifically, the portion of the planarization layer 4 in the display area 001 needs to be patterned to form vias. Electrical connections between the anode layer 5 and the circuitry layer 3 are achieved through these vias. Therefore, during the patterning of the planarization layer 4, a raised structure can be simultaneously formed in the isolation area 003 (the raised structure is used to form the first isolation structure 30 in a subsequent process). That is, a planarization layer 4 is formed within the display area 001 to provide a planarized surface for the anode layer 5, facilitating light extraction. A first isolation structure 30 is formed within the isolation area 003 to isolate the light-emitting layer 7. The planarization layer 4 can be made of organic materials.

[0066] The display panel includes a substrate layer within the partition area 003. The substrate layer may be formed from a portion of the film layer in the circuit layer 3 of the display area 001, or from a portion of the film layer below the circuit layer 3, or from a combination of a portion of the film layer below the circuit layer 3 and a portion of the film layer in the circuit layer 3. This application does not limit the composition of the substrate layer.

[0067] It should be noted that the circuit layer 3 mentioned in this embodiment can also be understood as an independent thin film transistor (TFT). This application does not limit the type of thin film transistor. It can be any one of LTPS TFT (Low-Temperature Polycrystalline Silicon Thin-Film Transistor), Oxide TFT, or LTPO TFT (Low Temperature Polycrystalline Oxide Thin Film Transistor).

[0068] In one embodiment, referring to FIG4, the circuit layer 3 in the display area 001 includes a semiconductor layer 31, a first gate insulating layer 32, a first gate metal layer 33, a second gate insulating layer 34, a second gate metal layer 35, a first interlayer dielectric layer 36, and a source / drain metal layer 37, which are sequentially stacked along the first direction X. A flexible substrate layer 1 and a buffer layer 2 are also disposed below the circuit layer 3, which are sequentially disposed along the first direction X. The substrate layer in the isolation area 003 includes the flexible substrate layer 1, the buffer layer 2, the first gate insulating layer 32, the second gate insulating layer 34, and the first interlayer dielectric layer 36 located in the isolation area 003.

[0069] The semiconductor layer 31 is used to form the channel pattern of the transistor and the wiring pattern in the circuit. The first gate insulating layer 32 can be made of silicon oxide to achieve insulation between the transistor gate and the semiconductor layer 31. The first gate metal layer 33 can be made of molybdenum (Mo) to form the gate pattern of the transistor and the lower electrode pattern of the capacitor. The second gate insulating layer 34 can be made of silicon nitride to act as the capacitor dielectric. The second gate metal layer 35 can also be made of molybdenum (Mo) to form the upper electrode pattern of the capacitor. The first interlayer dielectric layer 36 can be configured as a composite film to insulate between the transistor gate and the source / drain metal layer 37, and to provide H atoms in the polysilicon channel of the semiconductor layer 31 to fill defects. The source / drain metal layer 37 can be configured as a composite film, such as a titanium-aluminum-titanium film formed by titanium (Ti), aluminum (Al), and titanium (Ti). The height range of the source / drain metal layer 37 is [not specified in the original text]. (Angstrom, Å), where the thickness of the three elements can be set to... The thicknesses of the titanium metal located on the top and bottom sides are respectively The thickness of the aluminum metal in the middle is The source / drain metal layer 37 is used to form metal traces to provide current to the anode layer 5 and control the luminous brightness of the light-emitting device.

[0070] Furthermore, the flexible substrate layer 1 can be selected from any one of polyimide, polyethylene naphthalate (PEN), and polyethylene terephthalate (PET). The flexible substrate layer 1 can be a single layer or multiple layers, which is not limited here. The buffer layer 2 can be selected from any one of a-Si (amorphous silicon), SiNx (silicon nitride), and SiOx (silicon oxide), and the buffer layer 2 can be a single layer or multiple layers.

[0071] In some embodiments, continuing to refer to FIG4, the first partition structure 30 located on the substrate layer includes a main top surface and a main bottom surface opposite each other in a direction perpendicular to the plane of the display panel, and a main side surface connecting the main top surface and the main bottom surface. It should be noted that the direction perpendicular to the plane of the display panel is the first direction X mentioned above. For the sake of improving readability, the first direction X will be used as an alternative expression thereafter.

[0072] Specifically, the first partition structure 30 is a protruding structure relative to the substrate layer, that is, it can be a dam or retaining wall structure extending along the edge of the opening 002. It is used to naturally cut off the light-emitting layer 7 in the partition area 003 by the first partition structure 30, so that a continuous film layer from the opening 002 to the display area 001 cannot be formed. This prevents water and oxygen from entering through the light-emitting layer 7 and extending to the display area 001 during the process of opening the display panel, thus causing various display problems of the display panel.

[0073] Furthermore, this application does not limit the number of first partition structures 30. They can be one or multiple structures arranged at intervals. For example, for a circular opening 002, a first partition structure 30 can be provided around it, i.e., within the partition area 003, surrounding the opening 002. If multiple first partition structures 30 are provided, each partition structure can form a ring structure around the opening 002, and the multiple ring-shaped first partition structures 30 surrounding the opening 002 can be arranged at intervals.

[0074] In some embodiments, referring to Figures 5, 6, 11, and 12, the first partition structure 30 includes a first partition portion 301 and a second partition portion 302, which are sequentially arranged along a direction perpendicular to the plane of the display panel. The first partition portion 301 includes a first bottom surface 3011 and a first top surface 3012 facing each other in a direction perpendicular to the plane of the display panel, and a first side surface 3013 connecting the first top surface 3012 and the first bottom surface 3011. The second partition portion 302 includes a second bottom surface 3021 and a second top surface 3022 facing each other in a direction perpendicular to the plane of the display panel, and a second side surface 3023 connecting the second top surface 3022 and the second bottom surface 3021. The first top surface 3012 and the second bottom surface 3021 are at least partially in contact.

[0075] In some embodiments, depending on the different mask plates used in the fabrication process of the first partition 301 and the second partition 302, the first partition structure 30 as a whole can be formed into several different structural forms.

[0076] In one embodiment, referring to Figures 5 and 6, the second partition portion 302 is located on the first top surface 3012, and the area of ​​the second bottom surface 3021 of the second partition portion 302 is smaller than the area of ​​the first top surface 3012.

[0077] Furthermore, the cross-sectional dimensions of the first partition portion 301 and the second partition portion 302 gradually decrease along the direction away from the substrate layer, and the first partition portion 301 and the second partition portion 302 are superimposed and the overall cross-sectional shape of the two is stepped.

[0078] In one embodiment, referring to Figures 11 and 12, the area of ​​the second bottom surface 3021 of the second partition portion 302 is larger than the area of ​​the first bottom surface 3011 of the first partition portion 301, and the second bottom surface 3021 of the second partition portion 302 completely covers the first side surface 3013 of the first partition portion 301.

[0079] Furthermore, the cross-sectional dimensions of the first partition portion 301 and the second partition portion 302 gradually decrease along the direction away from the substrate layer, and the second partition portion 302 covers the first partition portion 301, forming a large-enclosing-small structure. Preferably, the cross-sectional shape of the first partition structure 30 is trapezoidal.

[0080] It should be noted that the first partition structure 30 may also include several other forms, not limited to the two stepped or large-enclosing-small forms mentioned above, nor limited to only setting two sub-partitions. Depending on actual needs, multiple overlapping or mutually enclosing partitions may also be set.

[0081] In some embodiments, continuing to refer to FIG4, the display panel further includes a second interlayer dielectric layer 6 in the display area 001, and the planarization layer 4 forms a first partition portion 301 in the partition area 003, and the second interlayer dielectric layer 6 forms a second partition portion 302 in the partition area 003.

[0082] Specifically, during the patterning of the planarization layer 4, a first protrusion structure can be simultaneously formed in the partition region 003 (the first protrusion structure is used to form the first partition portion 301 in a subsequent process), and then the anode layer 5 and the second interlayer dielectric layer 6 are sequentially fabricated in the display region 001. During the patterning of the second interlayer dielectric layer 6, a second protrusion structure can be simultaneously formed in the partition region 003 (the second protrusion structure is used to form the second partition portion 302 in a subsequent process). Further, the second interlayer dielectric layer 6 can be a combination of a PDL (pixel delimiting layer) layer and a PS (pillar spacer) layer.

[0083] In some embodiments, the partition region 003 further includes a reinforcing structure 50. The reinforcing structure 50 contacts at least a portion of the side surfaces of the first partition structure 30 and also contacts the substrate layer. The reinforcing structure 50 can be a single layer or a stacked structure. The reinforcing structure 50 is made of a metallic material or a composite film of a metal and other materials. Specifically, the reinforcing structure 50 can be made of metallic materials such as IZO (Indium Zinc Oxide), AZO (Aluminum-doped Zinc Oxide), Ti / Al / Ti (Titanium / Aluminum / Titanium), or Mo (Molybdenum).

[0084] First, by setting the reinforcing structure 50, this application can effectively alleviate or release the stress of the display panel during the manufacturing process, thereby improving the bonding force between the first partition structure 30 and each film layer. That is, by improving the stress resistance of the light-emitting layer 7 or the encapsulation layer 9, the bonding force between the first partition structure 30 and the subsequently manufactured light-emitting layer 7 and encapsulation layer 9 is increased, thereby reducing the film peeling problem in the partition area 003 of the display panel.

[0085] Secondly, the reinforcement structure 50 can effectively increase the bonding force between the first partition structure 30 and the substrate layer, and between the film layers inside the first partition structure 30, and can further improve the isolation effect of the first partition structure 30 on the light-emitting layer 7, thereby improving the stability and reliability of the display panel.

[0086] Finally, the metal reinforcement structure 50 can effectively dissipate heat from the partition area 003, further reducing the risk of peeling of the membrane layers in the partition area 003.

[0087] It should be noted that the reinforcing structure 50 can be fabricated after the first partition structure 30 is fabricated, or it can be fabricated before the first partition structure 30 is fabricated, or it can be adjusted according to the first partition structure 30 and fabricated alternately with the first partition structure 30. This application does not limit the fabrication order of the reinforcing structure 50 and the first partition structure 30; its fabrication nodes automatically adapt to changes in its own structure and changes in the first partition structure 30 to meet actual needs.

[0088] Secondly, the reinforcing structure 50 can be prepared separately or formed from the metal layer in the display area 001. That is, the reinforcing structure 50 can be formed simultaneously in the partition area 003 during the patterning process of the metal layer.

[0089] The metal material used in the reinforcing structure 50 may be the same as or different from the material used in the metal layer of the display area 001. This application does not impose any restrictions here.

[0090] In some embodiments, the reinforcing structure 50 includes an auxiliary fixing layer 501 and an auxiliary fixing portion 502. It should be noted that, for ease of understanding, the reinforcing structure is distinguished into an auxiliary fixing layer 501 and an auxiliary fixing portion 502. The auxiliary fixing layer 501 can be understood as one or more deposited film layers, while the auxiliary fixing portion 502 can be understood as a composite film layer with a certain structure; however, their functions are the same. Different reinforcing structures 50 are adopted according to the actual needs in the display panel manufacturing process. For example, the partition area 003 may only have an auxiliary fixing layer 501, only an auxiliary fixing portion 502, or both. This application does not impose any limitations.

[0091] In one embodiment, the reinforcing structure 50 is configured as an auxiliary fixing layer 501. The auxiliary fixing layer 501 can also be understood as a metal layer formed on the first partition structure 30. The auxiliary fixing layer 501 has the following form on the first partition structure 30.

[0092] Referring to Figures 8 and 14, in the first configuration, the auxiliary fixing layer 501 covers the outer peripheral portion of the first partition structure 30 in contact with the substrate layer and at least a portion of the main side surface of the first partition structure 30. This arrangement ensures that the gas released inside the display panel during the LLO process does not escape from the main side surface and main top surface covered by the auxiliary fixing layer 501, thereby preventing structural damage or performance degradation of the display panel due to increased internal pressure.

[0093] Referring to Figures 5 and 11, the second configuration involves the auxiliary fixing layer 501 covering the substrate layer, main side surface, and main top surface of the main bottom surface of the first partition structure 30. This can be understood as the auxiliary fixing layer 501 completely covering the first partition structure 30. This configuration significantly increases the adhesion between the first partition structure 30 and the light-emitting layer 7 and the encapsulation layer 9, avoiding peeling issues between film layers and effectively improving the yield rate of the display panel. Simultaneously, the complete wrapping of the first partition structure 30 by the auxiliary fixing layer 501 increases the bonding force between the first partition structure 30 and the substrate layer, greatly improving the stability and reliability of the display panel.

[0094] Referring to Figures 7, 13, and 17, the third configuration is based on the second configuration, with several spaced-apart vent holes formed on the auxiliary fixing layer 501 located on the main top surface. When the opening 002 is an annular opening 002 and the first partition structure 30 arranged around the circle is annular, the vent holes on the main top surface are spaced apart on the annular auxiliary fixing layer 501, forming a ring arrangement. This configuration not only provides an effective channel for gas release inside the display panel, but the spaced arrangement also ensures the uniformity and efficiency of gas release, while utilizing the remaining auxiliary fixing layer 501 on the main top surface to improve the bonding force between the film layers.

[0095] In one embodiment, the reinforcing structure 50 is configured as an auxiliary fixing part 502. The auxiliary fixing part 502 can also be understood as a metal pillar formed of metal on the substrate layer. The auxiliary fixing part 502 can be configured with different shapes.

[0096] In one embodiment, the cross-sectional dimension of the auxiliary fixing part 502 gradually increases along the direction away from the substrate layer. This can also be understood as the cross-section of the auxiliary fixing part 502 having a snap-fit ​​tenon structure or an inverted trapezoidal structure with a larger top and smaller bottom. In another embodiment, the cross-sectional dimension of the auxiliary fixing part 502 first decreases and then increases along the direction away from the substrate layer. This can also be understood as the cross-sectional shape of the auxiliary fixing part 502 being I-shaped or mushroom-shaped.

[0097] In some embodiments, the source / drain metal layer 37 is a titanium / aluminum / titanium composite film layer, and the source / drain metal layer 37 has an auxiliary fixing portion 502 in the isolation region 003. It can also be understood that the source / drain metal layer 37 and the auxiliary fixing portion 502 in the isolation region 003 are fabricated in the same layer.

[0098] Specifically, referring to Figures 4, 9, 10, and 16, based on the preparation sequence of the titanium / aluminum / titanium composite film, the first titanium metal layer of the source / drain metal layer 37 forms a first sub-fixing part in the isolation region 003, the aluminum metal layer in the source / drain metal layer 37 forms a second sub-fixing part in the isolation region 003, and the second titanium metal layer of the source / drain metal layer 37 forms a third sub-fixing part in the isolation region 003. The first sub-fixing part, the second sub-fixing part, and the third sub-fixing part are superimposed to form an auxiliary fixing part 502, and the cross-sectional shape of the auxiliary fixing part 502 is I-shaped.

[0099] It should be noted that when the source / drain metal layer 37 and the auxiliary fixing part 502 are fabricated in the same layer, their heights are the same. Preferably, the height range of the auxiliary fixing part 502 is [missing information]. (Angstrom), where the thicknesses of the first sub-fixing part, the second sub-fixing part, and the third sub-fixing part can be set to respectively... The thicknesses of the first and third sub-fixing parts are: The thickness of the second fixing part is

[0100] In some embodiments, the width of the auxiliary fixing portion 502 is less than one-quarter of the width of the first partition structure 30. The auxiliary fixing portion 502 is mainly used to improve the adhesion between the first partition structure 30 and the substrate layer. In one embodiment, the width of the first partition structure 30 ranges from 30 μm to 50 μm, and the width of the auxiliary fixing portion 502 ranges from 5 μm to 15 μm.

[0101] In some embodiments, referring to FIG4, the partition region 003 further includes a second partition structure 40. The second partition structure 40 includes a third partition portion 401 and a fourth partition portion 402. The third partition portion 401 is located between the display region 001 and the first partition structure 30, and the fourth partition portion 402 is located between the first partition structure 30 and the opening 002. The light-emitting layer 7 is naturally cut into a first portion and a second portion within the partition region 003 by the first partition structure 30 and the second partition structure 40. The first portion is located on the surface of the first partition structure 30 and the second partition structure 40, and the second portion is located on the surface of the substrate layer outside the first partition structure 30 and the second partition structure 40.

[0102] This application adds a second partition structure 40 to the partition area 003 of the display panel, namely, adds a third partition part 401 and a fourth partition part 402, which can further improve the partitioning effect on the light-emitting layer 7 based on the first partition structure 30, and improve the problem of low display panel yield caused by water and oxygen intrusion into the display area 001.

[0103] Specifically, the structures of the third partition 401 and the fourth partition 402 can be the same as those of the auxiliary fixing part 502. That is, the cross-sections of the third partition 401 and the fourth partition 402 can both be a snap-fit ​​tenon structure with a larger top and a smaller bottom, or an inverted trapezoidal structure. Alternatively, the cross-sectional shapes of the third partition 401 and the fourth partition 402 can both be I-shaped or mushroom-shaped.

[0104] In one embodiment, when the source / drain metal layer 37 is a titanium / aluminum / titanium composite film layer, the source / drain metal layer 37 has a third partition portion 401 and a fourth partition portion 402 within the partition region 003. It can also be understood that the source / drain metal layer 37 is fabricated in the same layer as the third partition portion 401 and the fourth partition portion 402 within the partition region 003. The relationship between the structure of the third partition portion 401 and the fourth partition portion 402 and the film layer in the source / drain metal layer 37 can be referred to the specific details of the auxiliary fixing portion 502 described above, and will not be repeated here.

[0105] In one embodiment, the source / drain metal layer 37, the auxiliary fixing portion 502, the third partition portion 401, and the fourth partition portion 402 can be formed in the same layer, and the auxiliary fixing portion 502, the third partition portion 401, and the fourth partition portion 402 have the same height. Preferably, the height range of the auxiliary fixing portion 502, the third partition portion 401, and the fourth partition portion 402 is [missing information].

[0106] Furthermore, the width of the third partition portion 401 and the fourth partition portion 402 is the same as that of the auxiliary fixing portion 502. Alternatively, the width of the third partition portion 401 and the fourth partition portion 402 is greater than the width of the auxiliary fixing portion 502.

[0107] In some embodiments, continuing to refer to FIG4, the first gate metal layer 33 and / or the second gate metal layer 35 have a heightening structure 60 within the isolation region 003, the heightening structure 60 being located below the second isolation structure 40.

[0108] Specifically, the height-enhancing structure 60 can be formed by the first gate metal layer 33 or the second gate metal layer 35. Alternatively, it can be formed by both the first gate metal layer 33 and the second gate metal layer 35. For example, in Figure 4, the height-enhancing structure 60 is formed by the first gate metal layer 33 and the second gate metal layer 35.

[0109] Furthermore, an inorganic layer may be disposed between the heightening structure 60 and the first isolation structure 30 (planarization layer 4). The inorganic layer may be one or more of the first gate insulating layer 32, the second gate insulating layer 34, and the first interlayer dielectric layer 36. Continuing to refer to Figure 4, when the heightening structure 60 needs to be added to the isolation region 003, the substrate layer in the isolation region 003 includes a flexible substrate layer 1, a buffer layer 2, a first gate insulating layer 32, a first gate metal layer 33, a second gate insulating layer 34, a second gate metal layer 35, and a first interlayer dielectric layer 36, which are stacked sequentially.

[0110] This application adds a heightening structure 60 below the second partition structure 40, and does not set a heightening structure 60 outside the second partition structure 40, which makes the step difference between the light-emitting layer 7 at the top of the second partition structure 40 and the light-emitting layer 7 outside the second partition structure 40 greater, so as to improve the isolation effect on the light-emitting layer 7.

[0111] In some embodiments, continuing to refer to FIG4, the display panel further includes a cathode layer (not shown) located on the side of the light-emitting layer 7 away from the anode layer 5 in the display area 001, and an encapsulation layer 9 located on the side of the cathode layer away from the light-emitting layer 7. The encapsulation layer 9 includes a first encapsulation inorganic layer 91, an encapsulation organic layer 92, and a second encapsulation inorganic layer 93 stacked sequentially. The first encapsulation inorganic layer 91, the encapsulation organic layer 92, and the second encapsulation inorganic layer 93 cover the third partition portion 401, and the first encapsulation inorganic layer 91 and the second encapsulation inorganic layer 93 cover the fourth partition portion 402. The encapsulation organic layer 92 and the fourth partition portion 402 do not overlap.

[0112] Specifically, the first encapsulation inorganic layer 91 can be made of silicon oxynitride, and the second encapsulation inorganic layer 93 can be made of silicon nitride. The first and second encapsulation inorganic layers 91 and 93 cover the display area 001 to ensure that the display panel and cathode layer 8 are not invaded by water or oxygen, and cover the isolation area 003 to form a good encapsulation barrier effect. The encapsulation organic layer 92 covers the display area 001 to achieve planarization and encapsulate foreign objects, further improving encapsulation performance.

[0113] By combining the different forms of the first partition structure (the first partition part and the second partition part are superimposed or covered) mentioned above with different forms of reinforcing structure (auxiliary fixing layer 501 and auxiliary fixing part 502), the following several embodiments can be obtained. The manufacturing process of the display panel in each specific embodiment will be described in detail below with reference to the accompanying drawings.

[0114] It should be noted that the structure of the display panel in this embodiment is illustrated below through an example of the display panel fabrication process. The term "patterning" as used herein includes processes such as depositing film layers, coating photoresist, mask exposure, development, etching, and photoresist stripping. Deposition can be performed using any one or more methods selected from sputtering, evaporation, and chemical vapor deposition; coating can be performed using any one or more methods selected from spraying and spin coating; and etching can be performed using any one or more methods selected from dry etching and wet etching.

[0115] Example 1; Partial structure within the partition area can be seen in Figure 5. In this example, the first partition and the second partition are arranged in a stepped manner to jointly form the first partition structure. An auxiliary fixing layer is formed on the first partition structure. Specifically, this includes the following steps S10-S17.

[0116] Step S10: Prepare a flexible substrate layer. Clean the glass substrate (i.e., the rigid substrate) and coat the surface of the glass substrate with PI material to form a flexible substrate layer.

[0117] Step S11: Prepare a buffer layer. A composite film of SiNx and SiO2 is deposited on the flexible substrate. This film absorbs laser lift-off (LLO) energy during subsequent glass substrate peeling, preventing damage to the transistors (circuit layers).

[0118] Step S12: Fabricate the circuit layer (i.e., thin-film transistor). Refer to steps S120 to S129.

[0119] Step S120: Fabrication of the semiconductor layer. An amorphous silicon layer is deposited on the buffer layer and subjected to hydrogen removal treatment, followed by laser annealing to convert the amorphous silicon into polycrystalline silicon, thereby forming the semiconductor layer. The polycrystalline silicon is then subjected to exposure, development, and etching to pattern the thin-film transistor channels and wiring.

[0120] Step S121: Prepare the first gate insulating layer. Deposit SiO2 material to form the first gate insulating layer.

[0121] Step S122: Prepare the first gate metal layer. Deposit molybdenum metal to form the first gate metal layer.

[0122] Step S123: Prepare the second gate insulating layer. Deposit SiNx material to form the second gate insulating layer.

[0123] Step S124: Prepare the second gate metal layer. Deposit molybdenum metal to form the second gate metal layer.

[0124] Step S125: Fabrication of the first interlayer dielectric layer. First, a SiO2 film and a SiNx film are deposited sequentially to form a composite first interlayer dielectric layer. Then, the first interlayer dielectric layer is hydrogenated. The first interlayer dielectric layer can be used to repair dangling bonds on the polycrystalline silicon surface. The first interlayer dielectric layer is then etched to form the first via required for the TFT (thin-film transistor).

[0125] Step S126: Fabricate the first source / drain metal layer. Ti metal, Al metal, and Ti metal are sequentially deposited within the first via to form the first source / drain metal layer, with thicknesses of 50 nm, 650 nm, and 50 nm, respectively. The first source / drain metal layer is then patterned.

[0126] Step S127: Prepare the first planarization layer. After the first source / drain metal layer is deposited, a first planarization layer is deposited on the display panel, and the first planarization layer is patterned.

[0127] It is worth noting that in this step, the first planarization layer located in the display area is etched to form the second via required by the TFT. Meanwhile, the first planarization layer in the isolation region forms an annular planarization layer boss (i.e., forms the first isolation portion), wherein the first isolation portion is formed on the first interlayer dielectric layer.

[0128] Step S128: Fabrication of the second source / drain metal layer. Ti metal, Al metal, and Ti metal are sequentially deposited and patterned within the second via to form the second source / drain metal layer, with thicknesses of 50 nm, 650 nm, and 50 nm, respectively. The second source / drain metal layer is then patterned.

[0129] It should be noted that, in this step, when the composite film layer of the second source / drain metal layer fills the second via in the display area, a third and fourth partition portion with a Ti / Al / Ti three-layer structure are simultaneously formed on both sides of the first partition portion in the partition area. Furthermore, the cross-sections of the third and fourth partition portions are I-shaped.

[0130] Step S129: Prepare the second planarization layer. After the second source / drain metal layer is deposited, a second planarization layer is deposited on the display panel, and the second planarization layer is patterned.

[0131] It is worth noting that in this step, the second planarization layer located in the display area is etched to form an anode via. Meanwhile, in the partition area, the second planarization layer forms an annular planarization layer boss (i.e., forms the second partition portion).

[0132] It should be noted that in this embodiment, the area of ​​the second bottom surface of the second partition is smaller than the area of ​​the first top surface of the first partition. Therefore, when the second partition is fabricated on the first partition, there is a certain distance between the edge of the second bottom surface of the second partition and the edge of the first top surface of the first partition, resulting in a certain blank area.

[0133] Therefore, in this embodiment, the main side of the first partition structure can be understood as the first side of the first partition part, the blank area of ​​the second bottom surface that does not cover the first top surface, and the second side of the second partition part; the main top surface of the first partition structure is equivalent to the second top surface; and the main bottom surface of the first partition structure is equivalent to the first bottom surface.

[0134] Step S13: Prepare the auxiliary fixing layer. Deposit and pattern indium zinc oxide material in the first partition structure region of the partition area of ​​the display panel to form the auxiliary fixing layer.

[0135] Specifically, during the deposition of indium zinc oxide material, the indium zinc oxide film completely covers the first partition structure. That is, the indium zinc oxide film covers the first interlayer dielectric layer at the outer periphery of the main bottom surface (first bottom surface) of the first partition structure, the main side surface of the first partition structure, and the main top surface (second top surface) of the first partition structure.

[0136] Step S14: Prepare the anode layer. Sequentially deposit and pattern the ITO / AG / ITO composite material on the second planarization layer to form the anode layer.

[0137] Step S15: Fabrication of the light-emitting layer. The light-emitting layer may include a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, and an electron injection layer. The fabrication sequence and materials are conventional techniques and will not be elaborated further.

[0138] Step S16: Prepare the cathode layer. The cathode layer can be a Mg / Ag alloy.

[0139] Step S17: Prepare the encapsulation layer. Sequentially deposit a SiON thin film, an organic material thin film, and a SiNx thin film to form a first encapsulation inorganic layer, an organic encapsulation layer, and a second inorganic encapsulation layer. The first and second encapsulation inorganic layers are stacked to cover the partition area of ​​the display panel.

[0140] At this point, the entire display panel manufacturing process is complete. The glass substrate can be peeled off from the display surface using LLO (Liquid Optical Loop) to form a flexible display panel.

[0141] In some embodiments, a second interlayer medium may be added between steps S129 and S13. Specifically, the second interlayer medium layer includes a PDL (pixel delimiting layer) layer and a PS (pillar spacer) layer prepared sequentially.

[0142] Furthermore, the PDL layer and / or PS layer form annular planarization layer bosses in the partition area. These bosses can refer to the second partition portion, or to other partition portions superimposed on the second partition portion and forming the first partition structure together with the first and second partition portions.

[0143] Example 2; The fabrication steps of the display panel in Example 2 are largely the same as those in Example 1, and will not be described in detail here. The difference between the two examples is that, in the case where the first partition structure is completely covered by the deposited indium zinc oxide film, step S130 is added after step S13. Specifically, the annular indium zinc oxide film located on the main top surface is etched to form several vent holes. Partial structures within the partition area can be seen in Figure 7.

[0144] Example 3; The fabrication steps of the display panel in Example 3 are largely the same as those in Example 1, and will not be described in detail here. The difference between the two examples is that the mask used in step S13 for depositing the indium zinc oxide thin film is different. In this example, by using a different mask, the indium zinc oxide thin film does not completely cover the first partition structure, but only covers a portion of the first partition structure. The partial structure within the partition area can be seen in Figure 8.

[0145] Specifically, the indium zinc oxide thin film covers the first interlayer dielectric layer on the outer periphery of the main bottom surface (first bottom surface) of the first partition structure and a portion of the main side surface of the first partition structure. Here, "a portion of the side surface" refers to the blank portion of the first side surface and the second bottom surface that does not cover the first top surface. It can also be understood as covering not only the first side surface of the first partition portion but also the corner of the step between the first and second partition portions.

[0146] In one embodiment, when the indium zinc oxide film covers the first interlayer dielectric layer on the outer periphery of the main bottom surface (first bottom surface) of the first partition structure and part of the main side surface of the first partition structure, the auxiliary fixing layer does not need to be prepared separately and can be directly made in the same layer as the second source / drain metal layer in step S128, then step S13 can be cancelled.

[0147] Specifically, in step S128, when the composite film of the second source / drain metal layer fills the second via in the display area, the composite film of the second source / drain metal layer is also deposited on the first partition in the partition area, thereby forming an auxiliary fixing layer. Subsequently, a second partition is fabricated in the area of ​​the first partition that is not covered by the composite film of the second source / drain metal layer.

[0148] Example 4: The first partition and the second partition are arranged in a stepped manner to jointly form the first partition structure. An auxiliary fixing part is formed on the first partition structure.

[0149] The manufacturing process of the display panel in this embodiment is roughly the same as that of the display panel in embodiment 1. The difference is that the auxiliary fixing part in this embodiment does not need to be manufactured separately, but can be directly manufactured in the same layer as the first source / drain metal layer in step S126 and / or the second source / drain metal layer in step S128.

[0150] In one embodiment, during step S126, when Ti metal, Al metal, and Ti metal are sequentially deposited in the first via of the TFT in the display area to form the first source / drain metal layer, a Ti / Al / Ti composite thin film layer is also deposited in the partition region to form several annular first auxiliary fixing portions with an I-shaped cross-section. It is worth noting that, to easily distinguish the auxiliary fixing portions from those in other embodiments, the auxiliary fixing portion located on the first interlayer dielectric layer is named the first auxiliary fixing portion. Then, the first partition portion and the second partition portion, etc., are further fabricated on the first auxiliary fixing portion, following the same steps as in Embodiment 1, and will not be repeated here. Partial structures within the partition region can be seen in Figure 9.

[0151] Further, the partial structure within the partition area can be seen in Figure 9, where the first bottom surface of the first partition portion at least partially covers at least part of the top surface of the first auxiliary fixing portion. Specifically, a plurality of first auxiliary fixing portions are arranged at intervals, and the distance between two adjacent first auxiliary fixing portions is a first width, while the width of the first bottom surface in the first partition portion is a second width. Preferably, the first width is greater than the second width, so that when the first partition portion is fabricated on the first auxiliary fixing portion, the edge portion of the first partition portion can be located on the upper surface (i.e., the titanium metal layer) of the first auxiliary fixing portion, thereby effectively improving the adhesion between the film layers.

[0152] In one embodiment, during step S128, when Ti metal, Al metal, and Ti metal are sequentially deposited within the second via of the display area TFT to form a second source / drain metal layer, a Ti / Al / Ti composite thin film layer is also deposited within the partition region to form several annular second auxiliary fixing portions with an I-shaped cross-section. Here, the second auxiliary fixing portion refers to the auxiliary fixing portion located between the first and second partition portions. Then, the second partition portion and other film layers are prepared on the second auxiliary fixing portions, following the same steps as in Embodiment 1, and will not be repeated here.

[0153] Further, the partial structure within the partition region can be seen in Figure 10, where the second bottom surface of the second partition portion at least partially covers at least part of the top surface of the second auxiliary fixing layer. Specifically, a plurality of second auxiliary fixing portions are arranged at intervals, and the distance between two adjacent second auxiliary fixing portions is a third width, and the width of the second bottom surface in the second partition portion is a fourth width. Preferably, the third width is greater than the fourth width, so that when the second partition portion is fabricated on the second auxiliary fixing portion, the edge portion of the second partition portion can be located on the upper surface (i.e., the titanium metal layer) of the second auxiliary fixing portion, thereby effectively improving the adhesion between the film layers.

[0154] In one embodiment, the first auxiliary fixing part, the first partition part, the second auxiliary fixing part, and the second partition part are manufactured sequentially. The detailed manufacturing process is described in the above embodiment and will not be repeated here.

[0155] Example 5: The first partition and the second partition are arranged in a wrapping manner to jointly form a first partition structure. An auxiliary fixing layer is formed on the first partition structure.

[0156] The manufacturing process of the display panel in this embodiment is roughly the same as that of the display panel in embodiment 1. The only difference is the dimensional relationship between the first partition and the second partition in this embodiment.

[0157] Similarly, in this embodiment, the first partition portion is formed using the first planarization layer in step S127 and the second partition portion is formed using the second planarization layer in step S129. The difference is that in this embodiment, the area of ​​the second bottom surface of the second partition portion is larger than the area of ​​the first bottom surface of the first partition portion, and the second bottom surface of the second partition portion completely covers the first side surface of the first partition portion, so as to form a first partition structure with one large part covering the other.

[0158] It is worth noting that in this embodiment, the main side surface of the first partition structure is the second side surface of the second partition part; the main top surface of the first partition structure is the second top surface of the second partition part; the main bottom surface of the first partition structure can be understood as the first bottom surface of the first partition part and the part of the second partition part that does not cover the first top surface of the first partition part and is located on the first interlayer medium layer.

[0159] In one embodiment, the partial structure within the partition area can be referred to as Figure 11, where the auxiliary fixing layer completely covers the first partition structure. That is, the indium zinc oxide thin film used in the auxiliary fixing layer covers the first interlayer dielectric layer on the outer periphery of the main bottom surface (first bottom surface) of the first partition structure, the main side surface of the first partition structure (i.e., the second side surface of the second partition portion), and the main top surface of the first partition structure (i.e., the second top surface on the second partition portion).

[0160] In one embodiment, where the auxiliary fixing layer completely covers the first partition structure, a new step is added to etch an annular indium zinc oxide film located on the main top surface to form a plurality of vent holes.

[0161] In one embodiment, the auxiliary fixing layer only covers a portion of the first partition structure. That is, the indium zinc oxide thin film used in the auxiliary fixing layer covers the first interlayer dielectric layer at the outer periphery of the main bottom surface (the first bottom surface and part of the second bottom surface) of the first partition structure, and part of the main side surface of the first partition structure (i.e., the second side surface of the second partition portion).

[0162] Example 6: The first partition and the second partition are arranged in a wrapping manner to jointly form the first partition structure. An auxiliary fixing part is formed on the first partition structure. The manufacturing process steps of the display panel in this example are roughly the same as those of the display panel in Example 1. The difference is that the dimensional relationship between the first partition and the second partition and the auxiliary fixing part in this example do not need to be manufactured separately. They can be directly manufactured in the same layer as the first source / drain metal layer in step S126 or the second source / drain metal layer in step S128.

[0163] In one embodiment, in step S126, when Ti metal, Al metal and Ti metal are sequentially deposited in the first via of the TFT in the display area to form a first source / drain metal layer, a Ti / Al / Ti composite thin film layer is also deposited in the partition area to form several annular auxiliary fixing parts with an I-shaped cross-section.

[0164] Specifically, the structure within the partition area can be seen in Figure 16, where the first bottom surface of the first partition part at least partially covers at least part of the top surface of the auxiliary fixing part.

[0165] In one embodiment, during step S128, when Ti metal, Al metal and Ti metal are sequentially deposited in the second via of the display area TFT to form a second source / drain metal layer, a Ti / Al / Ti composite thin film layer is also deposited in the partition area to form several annular auxiliary fixing parts with an I-shaped cross-section.

[0166] Specifically, the structure within the partition area can be seen in Figure 15. The auxiliary fixing parts are arranged on both sides of the first partition part and are spaced apart from the first partition part. The second bottom surface of the second partition part at least partially covers at least part of the top surface of the auxiliary fixing parts.

[0167] It should be noted that the display panels involved in Embodiments 1 to 6 are slightly different from those in the accompanying drawings provided in this application. The main difference lies in the circuit layers; Embodiments 1 to 5 use a double-layer source / drain metal layer structure. However, the shape and reinforcing structure of the first partition structure involved in the different embodiments are consistent. Therefore, the structures mentioned in Embodiments 1 to 5, such as the first bottom surface, second bottom surface, first top surface, second top surface, first side surface, and second side surface, can be understood in conjunction with some of the accompanying drawings provided in this application.

[0168] This application also provides a display device, including a display panel as mentioned in any of the above embodiments. The specific structure and principle of the display panel are the same as those in the above embodiments, and will not be repeated here. The display device can be any product or device with display function, such as a monitor, mobile phone, television, tablet computer, etc., which will not be listed here.

[0169] The terms "first," "second," and similar terms used in this application and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms "an" or "a" do not indicate a quantity limitation, but rather indicate the presence of at least one, unless otherwise specified. "A plurality" or "several" indicates two or more. The term "and / or" as used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0170] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

Claims

1. A display panel, characterized in that, It includes a display area and a non-display area, the non-display area including an opening and a partition area, the partition area being located between the opening and the display area, and the partition area surrounding at least a portion of the opening; The display panel includes a planarization layer in the display area, and the planarization layer has a first partition structure in the partition area. The first partition structure includes a main top surface and a main bottom surface opposite each other in a direction perpendicular to the plane of the display panel, and a main side surface connecting the main top surface and the main bottom surface. The display panel includes a substrate layer in the partition area, the first partition structure is formed on the substrate layer, and a reinforcing structure is also provided on the substrate layer. The reinforcing structure is at least partially in contact with at least a portion of the side of the first partition structure and in contact with the substrate layer.

2. The display panel according to claim 1, characterized in that, The first partition structure includes a first partition part and a second partition part, which are arranged sequentially along a direction perpendicular to the plane where the display panel is located. The first partition includes a first bottom surface and a first top surface opposite each other in a direction perpendicular to the plane of the display panel, and a first side surface connecting the first top surface and the first bottom surface. The second partition includes a second bottom surface and a second top surface opposite each other in a direction perpendicular to the plane of the display panel, and a second side surface connecting the second top surface and the second bottom surface. The first top surface and the second bottom surface are in at least partial contact.

3. The display panel according to claim 2, characterized in that, The second partition is located on the first top surface, and the area of ​​the second bottom surface of the second partition is smaller than the area of ​​the first top surface.

4. The display panel according to claim 2, characterized in that, The area of ​​the second bottom surface of the second partition is larger than the area of ​​the first bottom surface of the first partition, and the second bottom surface of the second partition completely covers the first side surface of the first partition.

5. The display panel according to any one of claims 1-4, characterized in that, The reinforcing structure includes an auxiliary fixing layer that covers the substrate layer of the outer periphery of the main bottom surface of the first partition structure to at least a portion of the main side surface of the first partition structure.

6. The display panel according to claim 5, characterized in that, The display panel further includes an anode layer, which is stacked sequentially with the planarization layer in a direction perpendicular to the plane of the display panel. When the second partition is located on the first top surface, and the area of ​​the second bottom surface of the second partition is smaller than that of the first top surface, the anode layer forms the auxiliary fixing layer in the partition area, and the auxiliary fixing layer covers the first side surface of the first partition and the blank part on the first top surface of the first partition that is not covered by the second bottom surface.

7. The display panel according to claim 5, characterized in that, The auxiliary fixing layer covers the base plate layer, main side surface, and main top surface of the outer periphery of the main bottom surface of the first partition structure.

8. The display panel according to claim 7, characterized in that, A plurality of vent holes are provided on the auxiliary fixing layer located on the main top surface, and the vent holes are spaced apart on the auxiliary fixing layer.

9. The display panel according to any one of claims 1-4, characterized in that, The reinforcing structure further includes several auxiliary fixing parts, the cross-sectional dimensions of which gradually increase along the direction away from the substrate layer; or The cross-sectional dimensions of the auxiliary fixing part first decrease and then increase along the direction away from the substrate layer.

10. The display panel according to claim 9, characterized in that, The width of the auxiliary fixing part is less than one-quarter of the width of the first partition structure.

11. The display panel according to claim 9, characterized in that, When the second partition portion is located on the first top surface, and the area of ​​the second bottom surface of the second partition portion is smaller than that of the first top surface, the auxiliary fixing portion is located between the first partition portion and the substrate layer, and / or The auxiliary fixing part is located between the first partition part and the second partition part.

12. The display panel according to claim 11, characterized in that, When the auxiliary fixing part is located between the first partition part and the substrate layer, the first bottom surface of the first partition part at least partially covers at least part of the top surface of the auxiliary fixing part; When the auxiliary fixing part is located between the first partition part and the second partition part, the second bottom surface of the second partition part at least partially covers the at least partial top surface of the auxiliary fixing part.

13. The display panel according to claim 9, characterized in that, When the area of ​​the second bottom surface of the second partition is greater than the area of ​​the first bottom surface of the first partition, and the second bottom surface of the second partition completely covers the first side surface of the first partition, the auxiliary fixing part is located on both sides of the first partition, and the second bottom surface of the second partition at least partially covers at least part of the top surface of the auxiliary fixing part.

14. The display panel according to claim 13, characterized in that, The first bottom surface of the first partition portion at least partially covers at least part of the top surface of the auxiliary fixing portion.

15. The display panel according to claim 1, characterized in that, The partition area further includes a second partition structure, which comprises a third partition portion and a fourth partition portion; wherein... The third partition is located between the display area and the first partition structure, and the fourth partition is located between the first partition structure and the opening.

16. The display panel according to claim 15, characterized in that, The display panel further includes a circuit layer, an anode layer, and a light-emitting layer in the display area, wherein the substrate layer, the circuit layer, the anode layer, the planarization layer, and the light-emitting layer in the display area are sequentially stacked. The light-emitting layer is naturally cut into a first part and a second part by the first partition structure and the second partition structure within the partition area. The first part is located on the surface of the first partition structure and the second partition structure, and the second part is located on the surface of the substrate layer outside the first partition structure and the second partition structure.

17. The display panel according to claim 16, characterized in that, The circuit layer includes a semiconductor layer, a first gate insulating layer, a first gate metal layer, a second gate insulating layer, a second gate metal layer, a first interlayer dielectric layer, and a source / drain metal layer, which are stacked sequentially. The first gate metal layer and / or the second gate metal layer have a raised structure within the isolation region, the raised structure being located below the second isolation structure.

18. The display panel according to claim 9 or 17, characterized in that, The source / drain metal layer forms the auxiliary fixing part, the third partition part, and the fourth partition part within the partition area, and the auxiliary fixing part, the third partition part, and the fourth partition part are...

19. The display panel according to claim 17, characterized in that, The display panel further includes a cathode layer located on the side of the light-emitting layer away from the anode layer in the display area, and an encapsulation layer located on the side of the cathode layer away from the light-emitting layer. The encapsulation layer includes a first encapsulation inorganic layer, an encapsulation organic layer, and a second encapsulation inorganic layer stacked sequentially. in The first encapsulation inorganic layer, the encapsulation organic layer, and the second encapsulation inorganic layer cover the third partition portion, the first encapsulation inorganic layer and the second encapsulation inorganic layer cover the fourth partition portion, and the encapsulation organic layer does not overlap with the fourth partition portion.

20. A display device, characterized in that, Includes the display panel as described in any one of claims 1-19.

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