Driving module, optical assembly, camera module and electronic device

Abstract

The embodiments of the present application belong to the technical field of camera image stabilization. Provided are a driving module (101), an optical assembly (3), a camera module (100) and an electronic device (1000). The driving module (101) comprises a housing component (10), a moving component (30), a transmission board (50), a rolling component (80) and a driving component (70), wherein the moving component (30) is configured to carry an image sensing unit (103); the transmission board (50) comprises a first rigid board portion (51) and a flexible circuit board portion (53), which are fixed and electrically connected to each other, the first rigid board portion (51) being fixed to the inner wall of the housing component (10), the first rigid board portion (51) and the moving component (30) being stacked, the flexible circuit board portion (53) being arranged around the moving component (30) in the circumferential direction of the moving component (30), and the flexible circuit board portion (53) being electrically connected to the moving component (30); the driving component (70) is configured to drive the moving component (30) to perform an image stabilization motion; and in the direction in which the first rigid board portion (51) and the moving component (30) are stacked, the moving component (30) is in rolling contact with the housing component (10) by means of the rolling component (80), and the rolling component (80) is configured to support the moving component (30) in a first direction.

Description

Drive modules, optical components, camera modules and electronic devices

[0001] This application claims priority to Chinese patent application filed on October 30, 2024, with application number 202411539359.6 and entitled "Drive Module, Optical Component, Camera Module and Electronic Device", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of camera technology, and in particular to a driving module, optical component, camera module and electronic device. Background Technology

[0003] When electronic devices with camera functions (such as mobile phones and tablets) take photos, slight shaking often results in blurry, ghosted, or indistinct images. For example, when a person holds an electronic device, there is unavoidable physiological shaking. These irregular, involuntary shaking or vibrations cause blurry images and a poor user experience. Image stabilization can be achieved by moving the image sensor unit, which can improve the quality of photos or videos to some extent. One image stabilization solution uses a multi-wire flexible metal cantilever to support the moving parts, including the image sensor, and transmit electrical signals. However, the flexible metal cantilever has high rigidity, making it difficult to apply sufficient thrust when the moving parts undergo large strokes and large angles. This results in insufficient response speed during large-stroke and large-angle image stabilization, affecting the stabilization effect. Summary of the Invention

[0004] This application provides a drive module, optical components, camera module, and electronic device that can improve image stabilization.

[0005] In a first aspect, this application provides a driving module, which includes a housing component, a moving component, a transmission plate, a rolling component, and a driving component. At least a portion of the transmission plate, the driving component, and the moving component are housed within the housing component. The moving component carries an image sensing unit. The transmission plate includes a first rigid plate portion and a flexible circuit board portion fixedly and electrically connected to each other. The first rigid plate portion is fixed to the inner wall of the housing component. The first rigid plate portion and the moving component are stacked along a first direction, and the flexible circuit board portion is arranged circumferentially around the moving component. The flexible circuit board portion is electrically connected to the moving component. The driving component drives the moving component to move relative to the housing component. The rolling component is disposed in one of the moving component and the housing component. In the first direction, the side of the moving component away from the first rigid plate portion makes rolling contact with the inner wall of the housing component facing the first rigid plate portion via the rolling component.

[0006] The drive module provided in this application includes a transmission board comprising a first rigid board portion and a flexible circuit board portion connected together. Since the first rigid board portion uses a rigid circuit board, the rigid circuit board has higher structural strength and is less prone to deformation compared to the flexible circuit board. This can improve the support strength of the transmission board for the drive component, so that the position of the drive component on the transmission board does not change due to the pulling of the flexible circuit board portion, which is beneficial to improving the positional stability of the drive component on the transmission board.

[0007] Furthermore, the flexible circuit board is electrically connected between the first rigid board and the moving component. External signals are transmitted to the moving component via the first rigid board and the flexible circuit board, and then from the moving component to the image sensing unit. Compared to a flexible metal cantilever, the flexible circuit board has lower stiffness, lighter weight, and greater strength, requiring less driving force. Additionally, the image sensing unit has a smaller mass than the lens, resulting in less driving force required for optical image stabilization compared to moving the lens. This improves the response speed of the optical components during long-stroke, wide-angle stabilization movements and enhances high-frequency stabilization performance. The flexible circuit board is also suitable for heavier moving components.

[0008] Furthermore, this application utilizes a rolling component to support the moving component in the first direction while providing no support in the direction perpendicular to the first direction. This allows for rotation around the first direction and planar movement in the direction perpendicular to the first direction, meaning the drive module is a three-axis drive module. Compared to support solutions such as suspension cables in the optical axis direction, the rolling component's support of the moving component in the optical axis direction can also reduce reliability issues caused by suspension cable breakage that may occur with heavy suspensions.

[0009] According to the first aspect, in one possible implementation, the rolling component includes a group of balls, and the moving component has a receiving groove on the side away from the first rigid plate portion, the receiving groove containing the group of balls.

[0010] In this possible implementation, the receiving groove can limit the range of motion of the ball group in a plane perpendicular to the first direction. The ball group includes multiple balls that roll in contact with the moving part and the housing part, which helps to improve the smoothness of the movement of the moving part relative to the housing part. To further reduce friction, the surface of the balls can be coated with a lubricant, such as lubricating oil.

[0011] According to the first aspect, in one possible implementation, the moving component includes a moving frame and a guide bracket mounted on the moving frame, the moving frame being located in a first direction between the first rigid plate portion and the guide bracket. The guide bracket has a receiving groove on the side facing away from the moving frame in the first direction.

[0012] In this possible implementation, the guide bracket and the motion frame are set separately, which facilitates the setting of the rolling components.

[0013] According to the first aspect, in one possible implementation, one of the motion frame and housing components includes a magnetic material, and the other of the motion frame and housing component includes a magnetically conductive material. The magnetic material and the magnetically conductive material are magnetically attracted to each other in a first direction. The guide bracket is located between the magnetically conductive material and the magnetic material in a first direction. The rolling component is in rolling contact with the guide bracket in a first direction and with the housing component in a first direction.

[0014] In this possible implementation, the magnetic material and the magnetic material are magnetically attracted in the first direction to make effective contact between the rolling component and the housing component, and between the rolling component and the moving component, so that the rolling component effectively supports the moving component in the first direction.

[0015] According to the first aspect, in one possible implementation, the moving component further includes a magnetic chuck. The moving frame has a mounting groove on the side facing the guide bracket, and the magnetic chuck is received within the mounting groove. The guide bracket is located in a first direction on the side of the moving frame opposite to the first rigid plate portion and covers the mounting groove. The magnetic chuck comprises a magnetic material, and the housing component comprises a magnetically conductive material.

[0016] In this possible implementation, the magnetic component is housed in the assembly slot without occupying space outside the moving frame, which improves the ease of assembling the magnetic component with the moving frame and helps to reduce the size of the drive module in the first direction.

[0017] According to the first aspect, in one possible implementation, the housing component includes a first cover, a second cover, and a magnetic conductor. The first cover and the second cover are used to enclose a receiving space. The moving component, at least a portion of the transmission plate, the driving component, and the magnetic conductor are all received within the receiving space. A first rigid plate is located in a first direction between the first cover and the moving frame, and the first rigid plate is fixed to the first cover. The magnetic conductor is located in a first direction between the guide bracket and the second cover, and the magnetic conductor covers the receiving groove. The magnetic conductor includes a magnetically conductive material.

[0018] In this possible implementation, the magnetic conductor can magnetically attract the magnetic component while also confining the rolling component in the receiving groove, without the need for additional components to cover the receiving groove. This reduces the number of components in the drive module, thereby simplifying the structure and space occupied by the drive module.

[0019] According to the first aspect, in one possible implementation, the moving component includes a first corner region, a second corner region, a third corner region, and a fourth corner region. The first and second corner regions are arranged along a second direction, and the second and third corner regions are arranged along a third direction. The first and third corner regions are arranged along one diagonal of the moving component, and the second and fourth corner regions are arranged along the other diagonal of the moving component. The second direction is perpendicular to the first direction, the second direction is perpendicular to the third direction, and the third direction is perpendicular to the first direction. Each of the first, second, and third corner regions has a receiving groove.

[0020] In this possible implementation, the guide bracket is provided with receiving grooves corresponding to the first, second, and third corner areas, so that the ball bearings are distributed in both the second and third directions. This helps to improve the support stability of the rolling components on the moving frame and reduces the possibility of the moving frame swaying during movement. The receiving grooves can limit the range of motion of the ball bearings in the second, third, and around the third direction.

[0021] According to the first aspect, in one possible implementation, the moving part is provided with a first electrical connection terminal. The transmission plate also includes a second rigid plate portion, which is fixed and electrically connected to the flexible circuit board portion in the circumferential direction of the moving part. The second rigid plate portion is provided with a second electrical connection terminal, and the first electrical connection terminal is electrically connected to the second electrical connection terminal.

[0022] In this possible implementation, during the movement of the moving part relative to the housing part, the flexible circuit board portion is stretched, and the second rigid plate portion is also subjected to the force of the flexible circuit board portion during the stretching and deformation process. Compared to the flexible circuit board portion, the second rigid plate portion is harder and stronger, making it less prone to displacement and deformation. As a result, the physical connection between the second electrical connection terminal and the first electrical connection terminal is less likely to loosen, and vice versa. The second rigid plate portion helps to improve the stability of the electrical connection between the first and second electrical connection terminals.

[0023] According to the first aspect, in one possible implementation, the moving component includes a top surface and a side surface connected together, with a first rigid plate portion and the top surface stacked along a first direction. A first electrical connection terminal is disposed on the side surface, and a flexible circuit board portion and a second rigid plate portion are disposed around the side surface, with the thickness direction of the flexible circuit board portion perpendicular to the first direction.

[0024] In this possible implementation, since the thickness direction of the flexible circuit board is approximately perpendicular to the optical axis direction, the flexible circuit board occupies a smaller size in the second and third directions, which is beneficial to reducing the planar size occupied by the transmission board in the second and third directions, thereby facilitating the miniaturization of the drive module and the camera module.

[0025] According to the first aspect, in one possible implementation, the transmission board further includes a third rigid plate portion, and the sides include a first side, a second side, a third side, and a fourth side connected together. The first side and the third side are arranged opposite each other in a second direction, and the second side and the fourth side are arranged opposite each other in a third direction. The first side is provided with a first electrical connection terminal, the third side is provided with a third electrical connection terminal, and the third rigid plate portion is provided with a fourth electrical connection terminal. The flexible circuit board portion includes a first part, a second part, and a third part arranged sequentially. At least one of the first part and the second part is fixed and electrically connected to the first rigid plate portion. The first part is located between the inner wall of the housing component and the second side, the second part is located between the inner wall of the housing component and the first side, and the third part is located between the inner wall of the housing component and the third side. The second rigid plate portion and the second part are connected at the end of the moving component circumferentially away from the first part; the third rigid plate portion and the third part are connected at the end of the moving component circumferentially away from the first part, and the third electrical connection terminal is electrically connected to the fourth electrical connection terminal.

[0026] In this possible implementation, the position and number of the flexible circuit board section and the rigid plate section can be flexibly arranged according to the shape or structure of the moving part. During the movement of the moving part relative to the housing part, the flexible circuit board section will be stretched, and the third rigid plate section will also be subjected to the force of the flexible circuit board section during the stretching and deformation process. Compared to the flexible circuit board section, the third rigid plate section is harder and stronger, making it less prone to movement and deformation. This reduces the likelihood of loosening of the physical connection between the fourth and third electrical connection terminals, thus improving the stability of the electrical connection between them.

[0027] According to the first aspect, in one possible implementation, the driving component includes a first magnetic element, a second magnetic element, a first coil, a second coil, a third coil, and a fourth coil. The first and second magnetic elements are disposed on the top surface of the moving component. The first magnetic element is disposed along a second direction, and the second magnetic element is disposed along a third direction. The first, second, third, and fourth coils are all fixed to the side of the first rigid plate facing the top surface. The first and second coils are disposed along the second direction and face-to-face with the first magnetic element. The third and fourth coils are disposed along the third direction and face-to-face with the second magnetic element. Any two of the first, second, and third directions are perpendicular to each other.

[0028] In this possible implementation, the scheme of using four sets of asymmetrical coils for control is beneficial to reducing the plane size occupied by the driving component, realizing the precise motion control of the moving component in the plane perpendicular to the first direction by the four sets of coils, and realizing the rotation of the moving component around the first direction and the movement in the plane perpendicular to the first direction.

[0029] According to the first aspect, in one possible implementation, the top surface further includes a first mounting recess and a second mounting recess. A first magnetic element is received in the first mounting recess. A second magnetic element is received in the second mounting recess.

[0030] In this possible implementation, the first magnetic element is housed in the first mounting recess, and the second magnetic element is housed in the second mounting recess, thereby reducing the size of the moving part in the first direction.

[0031] According to the first aspect, in one possible implementation, the driving component further includes a displacement sensor and a driving chip. The displacement sensor is used to collect jitter data from the image sensing unit and feed it back to the driving chip. The driving chip is used to calculate the required compensation value based on the received jitter data, and control the direction and magnitude of the energizing current in each of the first, second, third, and fourth coils according to the compensation value, so as to control the moving component to drive the image sensing unit to perform anti-shake movement.

[0032] Secondly, one embodiment of this application provides an optical component, which includes an image sensing unit and a driving module according to the first aspect.

[0033] Thirdly, one embodiment of this application provides a camera module, which further includes a lens and an optical assembly according to the second aspect, wherein the lens is located on the light-incident side of the image sensing unit.

[0034] Fourthly, one embodiment of this application provides an electronic device, which includes a device housing and a camera module according to a third aspect, the camera module being mounted on the device housing. Attached Figure Description

[0035] Figure 1 is a schematic diagram of the structure of an electronic device provided in one embodiment of this application;

[0036] Figure 2 is a schematic diagram of a partial cross-sectional structure of the electronic device shown in Figure 1, cut along line AA in some embodiments;

[0037] Figure 3 is a perspective view of a camera module provided in one embodiment of this application;

[0038] Figure 4 is a three-dimensional exploded view of the camera module shown in Figure 3;

[0039] Figure 5A is a perspective view of an image sensing unit provided in one embodiment of the application;

[0040] Figure 5B is a three-dimensional exploded view of the image sensing unit shown in Figure 5A;

[0041] Figure 6A is a simplified structural diagram of the camera module;

[0042] Figure 6B is a simplified schematic diagram of a periscope camera module provided in one embodiment of this application;

[0043] Figure 7 is a three-dimensional schematic diagram of the drive module;

[0044] Figure 8 is a three-dimensional exploded view of the drive module shown in Figure 7;

[0045] Figure 9 is a three-dimensional sectional view obtained along line BB in Figure 7;

[0046] Figure 10 is an enlarged schematic diagram of the local region I shown in Figure 9;

[0047] Figure 11 is a three-dimensional schematic diagram of the motion frame;

[0048] Figure 12 is a three-dimensional decomposition diagram of the motion frame and the image sensing unit;

[0049] Figure 13 is a three-dimensional schematic diagram of part of the optical component structure;

[0050] Figure 14 is a schematic diagram of the fit between the inverted wedge-shaped metal terminal and the connection hole provided in one embodiment of this application;

[0051] Figure 15 is a schematic diagram of the mating of a metal terminal of one possible shape with a connecting hole;

[0052] Figure 16 is a schematic diagram of the mating of a metal terminal with a connection hole of another possible shape;

[0053] Figure 17 is a three-dimensional exploded view of the motion frame, guide bracket, magnetic suction component, multiple ball bearing groups and magnetic conductive component;

[0054] Figure 18 is another three-dimensional schematic diagram of part of the drive module structure;

[0055] Figure 19 is a three-dimensional schematic diagram of the transmission board;

[0056] Figure 20 is a three-dimensional schematic diagram of the transmission plate shown in Figure 19 from another perspective;

[0057] Figure 21 is a cross-sectional view obtained along line CC shown in Figure 7;

[0058] Figure 22 is a schematic diagram of the drive module removing the first cover;

[0059] Figure 23 is a three-dimensional schematic diagram of the drive module after removing the first cover and the transmission plate;

[0060] Figure 24 is a planar schematic diagram of the distribution of the coils of the driving component on the transmission plate;

[0061] Figure 25 is a schematic diagram of the planar arrangement of the drive components;

[0062] Figure 26 is a schematic diagram of the arrangement of four displacement sensors and each coil provided in one embodiment of this application.

[0063] Reference numerals: 1000-Electronic device; 100-Camera module; 200-Equipment housing; 201-Frame; 202-Back cover; 203-Light transmission hole; 300-Screen; 1-Focusing actuator; 2-Lens; 3-Optical assembly; 101-Drive module; 103-Image sensing unit; 21-Additional circuit board; 211-Connection hole; 22-Image sensor; 23-Filter; 24-Supporting platform; 25-Reinforcing plate; 104-First optical path conversion component; 105-Second optical path conversion component; 10-Housing component; 11-First cover ; 111-Through hole; 12-Second cover; 13-Middle frame; 131-Frame; 132-Support plate; 15-Magnetic conductor; 30-Moving component; 31-Moving frame; 3110-Light-transmitting hole; 311-Top surface; 3115-First mounting recess; 3116-Second mounting recess; 313-Side; 3131-First side; 3132-Second side; 3133-Third side; 3134-Fourth side; 3135-First electrical connection terminal; 3136-Third electrical connection terminal; 315-Bottom surface; 315 1-First corner area; 3152-Second corner area; 3153-Third corner area; 3154-Fourth corner area; 3155-Assembly slot; 316-Metal terminal; 3161-First end face; 3163-Second end face; 3165-Protrusion; 33-Guide bracket; 331-Receiving slot; 35-Magnetic component; 36-Connector; 50-Transmission plate; 51-First rigid plate section; 511-Main body section; 513-Extension section; 53-Flexible circuit board section; 531-First part; 533-Second part; 535-Third part ; 55-Second rigid plate section; 551-Second electrical connection terminal; 57-Third rigid plate section; 571-Fourth electrical connection terminal; 70-Drive component; 7111-First magnetic component; 7113-First coil; 7115-Second coil; 7131-Second magnetic component; 7133-Third coil; 7135-Fourth coil; 731-First displacement sensor; 732-Second displacement sensor; 733-Third displacement sensor; 734-Fourth displacement sensor; 75-Drive chip; 80-Rolling component; 81-Ball group. Detailed Implementation

[0064] The embodiments of this application are described below with reference to the accompanying drawings.

[0065] Please refer to Figure 1, which is a schematic diagram of the structure of an electronic device 1000 provided in one embodiment of this application.

[0066] In some embodiments, the electronic device 1000 can be a mobile phone, tablet personal computer, laptop computer, personal digital assistant (PDA), camera, personal computer, laptop computer, in-vehicle equipment, wearable device, augmented reality (AR) glasses, AR headset, virtual reality (VR) glasses, or VR headset, or other devices with camera functionality. The electronic device 1000 in the embodiment shown in Figure 1 is illustrated using a mobile phone as an example.

[0067] Please refer to Figures 1 and 2. Figure 2 is a schematic diagram of a partial cross-sectional structure of the electronic device 1000 shown in Figure 1 cut along line AA in some embodiments.

[0068] In some embodiments, the electronic device 1000 may include a camera module 100, a device housing 200, and a screen 300. The camera module 100 may be a rear-facing camera module or a front-facing camera module. It should be noted that Figure 1 and the related accompanying drawings below only schematically illustrate some components included in the electronic device 1000; the actual shape, size, position, and structure of these components are not limited by Figure 1 and the accompanying drawings. Furthermore, when the electronic device 1000 is a device of other forms, the electronic device 1000 may not include the screen 300.

[0069] The device housing 200 may include a frame 201 and a back cover 202. The back cover 202 is fixed to the frame 201. For example, the back cover 202 may be fixedly connected to the frame 201 by means of adhesive, snap-fit, or other methods. The back cover 202 may also be integrally formed with the frame 201, that is, the back cover 202 and the frame 201 are a single integral structure.

[0070] In some embodiments, the screen 300 may be located on the side of the bezel 201 away from the back cover 202. In this case, the screen 300 and the back cover 202 may be located on opposite sides of the bezel 201. The screen 300, the bezel 201, and the back cover 202 together enclose the interior of the electronic device 1000. The interior of the electronic device 1000 can be used to house components of the electronic device 1000, such as a battery, receiver, or microphone. The screen 300 may be a flat screen or a curved screen.

[0071] For example, the camera module 100 may be located inside the electronic device 1000. The camera module 100 may be located on the side of the screen 300 facing the rear cover 202. The rear cover 202 may have a light-transmitting hole 203. The shape of the light-transmitting hole 203 is not limited to the circle shown in Figure 1. The light-transmitting hole 203 connects the interior of the electronic device 1000 to the exterior of the electronic device 1000. Light from the exterior of the electronic device 1000 can enter the interior of the electronic device 1000 through the light-transmitting hole 203. The camera module 100 can capture the light entering the interior of the electronic device 1000.

[0072] In some embodiments, please refer to Figures 3 and 4. Figure 3 is a perspective view of a camera module provided in one embodiment of this application, and Figure 4 is an exploded perspective view of the camera module shown in Figure 3.

[0073] The camera module 100 may include a focus actuator 1, a lens 2, and an optical assembly 3. Exemplarily, the lens 2 may be mounted on the focus actuator 1, which drives the lens 2 to move along its optical axis for focusing or zooming. The photosensitive assembly 4 may, but is not limited to, be connected to the focus actuator 1 by adhesive bonding.

[0074] In this embodiment, the optical axis of lens 2 is parallel to the optical axis of camera module 100. The optical axis of lens 2 and the optical axis of camera module 100 are in the same direction. In some embodiments, when the electronic device 1000 is a mobile terminal such as a mobile phone or tablet, the optical axis of camera module 100 may be parallel to the thickness direction of electronic device 1000.

[0075] The optical component 3 includes an image sensing unit 103 and a driving module 101. The driving module 101 drives the image sensing unit 103 to move, thereby suppressing jitter in three directions: X-axis translation, Y-axis translation, and Z-axis rotation (within the XY plane). This addresses issues such as optical image instability, image rotation, crosstalk in drive control, and hysteresis, and also offers the advantage of high integration, thus improving the image or video capture quality of the camera module 100. In this application, the Z-axis corresponds to the first direction, the X-axis corresponds to the second direction, and the Y-axis corresponds to the third direction. Any two of the first, second, and third directions are perpendicular to each other.

[0076] Please refer to Figures 5A and 5B. Figure 5A is a perspective view of an image sensing unit 103 provided in one embodiment of this application, and Figure 5B is an exploded perspective view of the image sensing unit 103 shown in Figure 5A. The image sensing unit 103 includes an image sensor 22 and an additional circuit board 21 that carries the image sensor 22. The additional circuit board 21 can be carried in the driving module 101. For the camera module 100, the X-axis and Y-axis are two mutually perpendicular directions on the plane where the image sensor 22 is located, and the Z-axis is a direction perpendicular to the plane where the image sensor 22 is located.

[0077] Image sensor 22, also known as photosensitive chip or photosensitive element, is used to acquire ambient light and convert the image information carried by the ambient light into electrical signals. Image sensor 22 can be a charge-coupled device (CCD) or a complementary metal-oxide semiconductor (CMOS) sensor.

[0078] The image sensor 22 can be connected to the additional circuit board 21 via COP (Chip on board) technology. The additional circuit board 21 can be connected to the drive module 101 via laser welding technology, thereby enabling the image sensor 22 and the drive module 101 to be electrically connected.

[0079] The image sensing unit 103 may further include a filter 23, which can be fixed to the drive module 101 via a support platform 24. The filter 23 and the image sensor 22 are arranged opposite each other, with the filter 23 located above the image sensor 22, i.e., on the side of the image sensor 22 facing the lens 2. The filter 23 can be bonded to the support platform 24, which can be a frame structure surrounding the filter 23 without obstructing the image sensor 22. The support platform 24 can be bonded to an additional circuit board 21.

[0080] After light from outside the camera module 100 enters the optical components inside the image stabilization motor, it passes sequentially through the light filter 23 and the image sensor 22. Finally, the image sensor 22 converts the light signal into an image target signal. The light filter 23 can filter out certain wavelengths of light, allowing only certain wavelengths to pass through, thus reducing some ghosting and stray light, and also providing some protection for the image sensor 22. For example, the light filter 23 can be an infrared filter 23, which can filter out infrared light while allowing other wavelengths to pass through.

[0081] The image sensing unit 103 may also include a reinforcing plate 25, which can be attached to the bottom of the auxiliary circuit board 21, that is, to the side of the auxiliary circuit board 21 facing away from the lens 2. The reinforcing plate 25 can be a metal plate such as stainless steel. On the one hand, the reinforcing plate 25 can assist laser welding to increase the overall structural strength of the image sensing unit 103 and play a role in protecting the drive module 101 and the image sensor 22. On the other hand, the reinforcing plate 25 has good thermal conductivity, and copper foil or graphene can be attached to the reinforcing plate 25 to achieve good heat dissipation.

[0082] As shown in Figure 2 and Figure 6A, Figure 6A is a simplified structural diagram of the camera module 100. The driving module 101 can be applied to the vertical camera module 100, and light can directly enter the image sensor 22 from the lens 2.

[0083] The driving module 101 provided in this application embodiment can be applied to different types of camera modules 100, such as telephoto, main camera, and wide-angle cameras, as shown in Figure 6B. Figure 6B is a simplified schematic diagram of a periscope camera module 100 provided in one embodiment of this application. The driving module 101 can be applied to the periscope camera module 100. The camera module 100 may also include a first optical path converter 104 and a second optical path converter 105. The first optical path converter 104 and the second optical path converter 105 are used to convert the direction of light transmission. The first optical path converter 104 is located on the light-inlet side of the lens 2, and the second optical path converter 105 is located on the light-outlet side of the lens 2 and the light-inlet side of the image sensor 22. Light rays are converted by the first optical path converter 104 and then enter the lens 2. Light rays exiting the lens 2 are converted by the second optical path converter 105 and then enter the image sensor 22. It is understood that the optical path conversion component can be used to produce one or more total internal reflections of the light entering it. The specific shape, quantity and position of the optical path conversion component can be set according to the optical path required by the camera module 100. The optical path conversion component can include prisms, plane mirrors, etc.

[0084] Please refer to Figures 7, 8, and 9. Figure 7 is a perspective view of the drive module 101; Figure 8 is an exploded perspective view of the drive module 101 shown in Figure 7; and Figure 9 is a perspective sectional view obtained along line BB in Figure 7.

[0085] The drive module 101 includes a housing component 10, a moving component 30, a transmission plate 50, a drive component 70, and a rolling component 80 (as shown in Figure 9). The moving component 30, the rolling component 80, the transmission plate 50, and at least a portion of the drive component 70 are housed within the housing component 10. The moving component 30 carries the additional circuit board 21 and the image sensor 22 to drive the image sensing unit 103 relative to the housing component 10 for image stabilization. The moving component 30 is electrically connected to the additional circuit board 21. The transmission plate 50 is connected between the housing component 10 and the moving component 30, and is electrically connected to the moving component 30. The image stabilization drive module drives the moving component 30 to move in the XY plane. The rolling component 80 is located at one of the housing component 10 and the moving component 30, and the moving component 30 and the housing component 10 are in rolling contact along the Z-axis via the rolling component 80. The rolling component 80 supports the moving component 30 along the Z-axis.

[0086] The rolling component 80 may include a plurality of ball groups 81, each containing a plurality of balls. The multiple balls roll in contact with the moving component 30 and the housing component 10, which improves the smoothness of movement of the moving component 30 relative to the housing component 10. To further reduce friction, the surfaces of the balls may be coated with a lubricant, such as lubricating oil. Compared to support schemes in the optical axis direction, such as suspension cables, this application provides support for the moving component 30 in the optical axis direction through the rolling component 80, avoiding reliability issues caused by suspension cable breakage that may result from heavy-weight suspension. In some embodiments of this application, the rolling component 80 includes a roller, which is generally cylindrical.

[0087] In the camera module 100, the elements that can move relative to the housing component 10 are collectively referred to as moving elements. For example, moving elements include moving component 30, rolling component 80, partial driving component 70, image sensing unit 103, etc. The housing component 10 and the elements that are relatively stationary relative to the housing component 10 are collectively referred to as stationary elements.

[0088] Please refer again to Figures 9 and 10. Figure 10 is an enlarged schematic diagram of a partial area I shown in Figure 9. The housing component 10 includes a first cover 11, a middle frame 13, a second cover 12, and a magnetic conductor 15. The middle frame 13 connects the first cover 11 and the second cover 12 along the Z-axis. The first cover 11, the second cover 12, and the middle frame 13 together form a receiving space, which is used to receive at least a portion of the transmission plate 50, the moving component 30, and the driving component 70. The first cover 11 has a through hole 111 for light transmission.

[0089] In some embodiments of this application, the middle frame 13 includes a frame body 131 and a support plate 132. The support plate 132 is fixed to one end of the frame body 131. The support plate 132 is located between the first cover 11 and the second cover 12 on the Z-axis. The support plate 132 can strengthen the housing component 10.

[0090] The magnetic guide 15 is housed within the receiving space and can be attached to the side of the support plate 132 facing the first cover 11. The rolling member 80 is located between the moving member 30 and the magnetic guide 15 along the Z-axis. The moving member 30 includes a magnetically conductive material. The magnetic guide 15 is used to magnetically attract the moving member 30 along the Z-axis, thereby ensuring effective contact between the rolling member 80 and the housing member 10, and between the rolling member 80 and the moving member 30, thus effectively supporting the moving member 30 with the rolling member 80 along the Z-axis. It is understood that the middle frame 13 of the housing member 10 can be omitted, and the magnetic guide 15 can be directly disposed on the side of the second cover 12 facing the first cover 11.

[0091] The moving component 30 includes a moving frame 31, a guide bracket 33, and a magnetic chuck 35. The moving frame 31 supports the image sensing unit 103. The guide bracket 33 is mounted on the side of the moving frame 31 opposite to the first cover 11 and supports the rolling component 80. The magnetic chuck 35 is made of a magnetically conductive material. The magnetic chuck 35 is disposed on the moving frame 31 and is used to magnetically attract the magnetically conductive component 15 along the Z-axis.

[0092] Please refer to Figure 11, which is a perspective view of the motion frame 31. The motion frame 31 includes a top surface 311 and a side surface connected together. The moving component 30 may include an insulating portion and a conductive portion. The conductive portion may be embedded in the insulating portion and may form multiple transmission channels for signal transmission. The conductive portion is used for electrical connection between the transmission plate 50 and the image sensing unit 103 (as shown in Figure 8).

[0093] The motion frame 31 also includes a top surface 311, a side surface, and a bottom surface 315. The side surface connects the top surface 311 and the bottom surface 315 along the Z-axis. The motion frame 31 is provided with a light-transmitting hole 3110 that passes through the top surface 311 and the bottom surface 315. The top surface 311 is also provided with a first mounting recess 3115 and a second mounting recess 3116, both of which are used to accommodate part of the drive component 70. The first mounting recess 3115 extends along the X-axis, and the second mounting recess 3116 extends along the Y-axis. The first mounting recess 3115 and the second mounting recess 3116 are provided one-to-one correspondingly along two adjacent edges of the top surface 311.

[0094] The sides are arranged facing the inner wall of the frame 131. The sides include a first side 3131, a second side 3132, a third side 3133, and a fourth side 3134. The first side 3131 and the third side 3133 are arranged opposite each other in the Y-axis direction, and the second side 3132 and the fourth side 3134 are arranged opposite each other in the X-axis direction. The X-axis is perpendicular to the Z-axis, the X-axis is perpendicular to the Y-axis, and the Z-axis is perpendicular to the Y-axis. The third side 3133 is provided with a first electrical connection terminal 3135, which is used for electrical connection with the transmission board 50.

[0095] Please refer to Figures 12 and 13. Figure 12 is an exploded perspective view of the motion frame 31 and the image sensing unit 103, and Figure 13 is a perspective view of a portion of the optical component 3. An additional circuit board 21 can be fixed to the bottom of the motion frame 31 away from the top surface 311. The additional circuit board 21 has connection holes 211 along its edge. For example, the additional circuit board 21 includes a first surface 213, a second surface 214, a third surface, and a fourth surface 216 connected circumferentially along the additional circuit board 21. The first surface 213 and the third surface are opposite each other, and the second surface 214 and the fourth surface 216 are opposite each other. Connection holes 211 are formed on both the first surface 213 and the fourth surface 216. The connection holes 211 can be formed using a half-hole process. The motion frame 31 also includes metal terminals 316 corresponding to the connection holes 211. The metal terminals 316 can be integrated onto the motion component 30 using processes such as injection molding, metal insert injection molding, etching, and stamping. The metal terminal 316 is roughly rectangular in shape and is fixed in the connection hole 211 by welding.

[0096] This application does not limit the metal terminal 316 to be rectangular. In some embodiments, please refer to FIG14, which is a schematic diagram of the cooperation between the inverted wedge-shaped metal terminal 316 and the connecting hole 211 provided in one embodiment of this application. The metal terminal 316 can be generally trapezoidal. The metal terminal 316 includes a first end face 3161 and a second end face 3163 disposed opposite to each other along the Z-axis. The first end face 3161 is located on the side of the metal terminal 316 closer to the top surface 311 of the moving part 30. The width of the first end face 3161 is smaller than the width of the second end face 3163, that is, the metal terminal 316 is generally inverted wedge-shaped. The metal terminal 316 passes through the connecting hole 211. The metal terminal 316 is fixedly connected to the inner wall of the connecting hole 211 by a connector 36. The connector 36 can cover the side of the metal terminal 316, as shown in FIG14, which exemplarily illustrates that a connecting hole 211 is filled with a connector 36. The connector 36 includes a solder or an adhesive. The metal terminal 316 is fixed and electrically connected by welding to the inner wall of the connection hole 211.

[0097] The disengagement direction of the metal terminal 316 of the moving part 30 from the connecting hole 211 is along the Z-axis and away from the top surface 311 of the moving part 30. Compared to a rectangular terminal, since the second end face 3163 of the metal terminal 316 is wider than the first end face 3161 in the disengagement direction, a pre-tightening force can be generated between the connector 36 and the metal terminal 316 when the moving part 30 and the auxiliary circuit board 21 disengage. This results in a stronger connection pre-tightening force as the disengagement tendency / degree increases, thereby improving the connection reliability between the moving part 30 and the auxiliary circuit board 21. When the auxiliary circuit board 21 is subjected to external force along the Z-axis in a direction away from the lens 2 (the disengagement direction in Figure 16), or when the moving part 30 is subjected to external force along the Z-axis in a direction towards the lens 2 (the opposite direction of the disengagement direction in Figure 16), the metal terminal 316 will be pulled tighter and tighter, achieving a high-strength bonding force to prevent the connector 36 from falling off.

[0098] In some possible implementations, considering the significant heat generated during soldering, which could potentially deform the components on the image sensor 22 and the additional circuit board 21, some surface connection holes 211 can be soldered to the metal terminals 316, while others can be bonded to their corresponding metal terminals 316. This reduces the likelihood of deformation of the components on the image sensor 22 and the additional circuit board 21. For example, the connection holes 211 on the first surface 213 and the third surface shown in Figure 12 can be fixed and electrically connected to their corresponding metal terminals 316 by soldering. Similarly, the connection holes 211 on the second surface 214 and the fourth surface 216 shown in Figure 12 can be fixedly connected to their corresponding metal terminals 316 using adhesive. The connection holes 211 on the first surface 213 and the third surface can be designed with exposed copper to achieve electrical connection between the connection holes 211 on the first surface 213 and the third surface and their corresponding metal terminals 316. This not only achieves electrical connection between the moving part 30 and the auxiliary circuit board 21, but also helps to improve the connection strength and stability between the moving part 30 and the auxiliary circuit board 21. The solder can be solder paste or other soldering agents.

[0099] Normally, if rectangular metal terminals 316 are used for connection, adhesive must be applied in addition to soldering to strengthen the connection, which requires a larger diameter connection hole 211. However, by connecting non-rectangular metal terminals 316 to connection holes 211, no additional adhesive is needed to strengthen the connection after soldering. This helps to reduce the size of connection hole 211 in the plane of the auxiliary circuit board 21, which is beneficial for optimizing the miniaturization of optical component 3. It also reduces the width of the adhesive or solder applied to the end face 3161, saving planar dimensions.

[0100] It is understood that this application does not limit the surface arrangement of the auxiliary circuit board 21 along the circumferential direction. In one possible implementation, the auxiliary circuit board 21 includes a first surface 213 and a second surface 214 arranged along the circumference of the auxiliary circuit board 21. Both the first surface and the second surface are provided with connection holes 211. The connector 36 includes solder and adhesive. The inner wall of the connection hole 211 on the first surface is connected to the corresponding metal terminal 316 through the adhesive. The inner wall of the connection hole 211 on the second surface is connected to the corresponding metal terminal 316 through the solder.

[0101] It is understood that this application does not limit the shape and structure of the additional circuit board 21, and at least one connection hole 211 is fixed and electrically connected to the corresponding metal terminal 316 by soldering.

[0102] It is understood that the surface of the solder within the connection hole 211 may also be covered with an adhesive to strengthen the connection between the moving part 30 and the additional circuit board 21.

[0103] This application does not limit the metal terminal 316 to be wedge-shaped. In some possible implementations, as shown in FIG15, FIG15 is a schematic diagram of the fit between a metal terminal 316 of one possible shape and a connecting hole 211. Multiple protrusions 3165 are also formed on the sidewall of the metal terminal 316, and these protrusions 3165 are arranged along the Z-axis. The protrusions 3165 can be arranged circumferentially around the metal terminal 316. As shown in FIG16, FIG16 is a schematic diagram of the fit between a metal terminal 316 of another possible shape and a connecting hole 211. The protrusions 3165 are generally boss-shaped, used to further enhance the preload between the solder and the metal terminal 316, and between the adhesive and the metal terminal 316, so as to further strengthen the connection strength between the moving part 30 and the additional circuit board 21. In other embodiments, the metal terminal 316 can also be provided in other shapes such as rectangle.

[0104] Please refer to Figure 17, which is an exploded perspective view of the motion frame 31, guide bracket 33, magnetic attractor 35, multiple ball bearing groups 81, and magnetic conductor 15. The bottom surface 315 includes a first corner area 3151, a second corner area 3152, a third corner area 3153, and a fourth corner area 3154. The first corner area 3151 and the second corner area 3152 are arranged along the X-axis. The second corner area 3152 and the third corner area 3153 are arranged along the Y-axis. The third corner area 3153 and the fourth corner area 3154 are arranged along the X-axis. The first corner area 3151 and the third corner area 3153 are arranged along a diagonal of the bottom surface 315. The second corner area 3152 and the fourth corner area 3154 are arranged along another diagonal of the bottom surface 315. Each of the first corner area 3151, the second corner area 3152, and the third corner area 3153 is provided with an assembly groove 3155 for accommodating the magnetic attractor 35. The magnetic chuck 35 is housed within the assembly slot 3155 without occupying space outside the motion frame 31, which improves the ease of assembly between the magnetic chuck 35 and the motion frame 31 and helps to reduce the size of the drive module 101 along the Z-axis. In addition, the assembly slots 3155 are provided in the first corner region 3151, the second corner region 3152, and the third corner region 3153, which helps to improve the force balance of the motion frame 31 and improve the motion stability of the motion frame 31.

[0105] Referring to Figures 12 and 17, the guide bracket 33 can be fixed to the bottom surface 315 (as shown in Figure 12) and cover the assembly groove 3155 to prevent the magnetic component 35 from detaching from the assembly groove 3155. In some embodiments of this application, the guide bracket 33 is generally L-shaped, and the shape of the magnetic component 15 is adapted to the shape of the guide bracket 33. The guide bracket 33 is arranged around the light-transmitting hole 3110. On the side of the guide bracket 33 facing away from the moving frame 31, corresponding to the first corner area 3151, the second corner area 3152, and the third corner area 3153, there are receiving grooves 331, which are used to receive the ball group 81. The guide bracket 33 has receiving grooves 331 corresponding to the first corner area 3151, the second corner area 3152, and the third corner area 3153, so that the ball group 81 is distributed on both the X-axis and the Y-axis, which helps to improve the support stability of the rolling component 80 on the moving frame 31 and reduce the possibility of the moving frame 31 shaking during movement. The receiving groove 331 can limit the range of motion of the ball group 81 in the X-axis, Y-axis and around the Z-axis. Using the same guide bracket 33 to mount the rolling component 80, instead of covering it with three separate parts, helps reduce the number of components in the drive module 101. This application does not limit the position and number of the assembly grooves 3155; each assembly groove 3155 can correspond to one receiving groove 331.

[0106] Referring to Figures 10 and 17, the magnetic guide 15 is located on the side of the guide bracket 33 away from the moving frame 31 on the Z-axis, that is, the magnetic guide 15 is located between the guide bracket 33 and the support plate 132 on the Z-axis. The magnetic guide 15 covers the receiving groove 331 to keep the rolling component 80 within the receiving groove 331 and prevent the rolling component 80 from detaching from the receiving groove 331. Rolling components 80 are provided in the three corner areas of the moving component 30, that is, the moving component 30 is supported on the Z-axis by the rolling components 80 in the three corner areas, which helps to improve the movement stability of the moving component 30. The magnetic guide 15 can magnetically attract with the magnetic attractor 35 and also restrict the rolling component 80 in the receiving groove 331 without the need for additional components to cover the receiving groove 331, which helps to reduce the number of components in the drive module 101, thereby simplifying the structure and space occupied by the drive module 101. When the support plate 132 is omitted, the magnetic guide 15 can be located between the guide bracket 33 and the second cover 12 on the Z-axis.

[0107] Please refer to Figures 10, 12 and 18. Figure 18 is another three-dimensional schematic diagram of part of the structure of the drive module 101.

[0108] The magnetic attractor 35 can be a magnet. There are three magnetic attractors 35, each housed in an assembly slot 3155 in the first corner region 3151, the second corner region 3152, and the third corner region 3153, respectively. The magnetic attractors 35 in the first corner region 3151, the second corner region 3152, and the third corner region 3153 are all used to magnetically attract the same magnetic conductor 15 along the Z-axis. It is understood that this application does not limit the number of magnetic attractors 35, nor does it limit the number or shape of the magnetic conductor 15. For example, there can be four magnetic conductors 15 and four magnetic attractors 35, with the four magnetic conductors 15 corresponding to the four corner regions of the moving part 30, and each of the four magnetic attractors 35 corresponding to one of the four magnetic conductors 15.

[0109] It is understood that the magnetic suction component 35 can be set on the second cover 12, and the magnetic conductor 15 is set on the moving frame 31. The magnetic suction component 35 and the magnetic conductor 15 are magnetically attracted to each other along the Z-axis.

[0110] It is understandable that the magnetic conductive element 15 can be omitted. For example, the second cover 12 can be made of a magnetic material, and the magnetic material and the magnetic attracting element 35 are magnetically attracted to each other along the Z-axis.

[0111] In some possible implementations, the magnetic guide 15 may be omitted, the housing component 10 may include a magnetic material, the moving component 30 may include a magnetic material, the magnetic material and the magnetic material are magnetically attracted to each other along the Z-axis, the rolling component 80 is located between the magnetic material and the magnetic material along the Z-axis, the rolling component 80 is in rolling contact with the moving component 30 along the Z-axis, and the rolling component 80 is in rolling contact with the housing component 10 along the Z-axis.

[0112] In some possible implementations, one of the housing component 10 and the moving component 30 may include a magnetic material, and the other of the housing component 10 and the moving component 30 may include a magnetic material. The magnetic material and the magnetic material are magnetically attracted to each other along the Z-axis. The rolling component 80 is located between the magnetic material and the magnetic material along the Z-axis. The rolling component 80 makes rolling contact with the moving component 30 along the Z-axis and with the housing component 10 along the Z-axis.

[0113] Please refer to Figures 19 and 20. Figure 19 is a three-dimensional schematic diagram of the transmission plate 50, and Figure 20 is a three-dimensional schematic diagram of the transmission plate 50 shown in Figure 19 from another perspective.

[0114] In this embodiment, the transmission board 50 can be a rigid-flex board. A rigid-flex board refers to a board formed by combining a flexible circuit board and a printed circuit board through processes such as lamination. It has the advantages of reducing the overall assembly size, avoiding wiring errors, improving reliability, and realizing three-dimensional assembly under different assembly conditions.

[0115] The transmission board 50 includes a first rigid board portion 51, a flexible circuit board portion 53, a second rigid board portion 55, and a third rigid board portion 57 connected together. The first rigid board portion 51 is used to support at least a portion of the drive component 70. The first rigid board portion 51 is a rigid circuit board. The rigid circuit board typically includes a rigid substrate and a conductive layer disposed on the rigid substrate. The rigid substrate has high rigidity and support strength. The rigid substrate may include, but is not limited to, epoxy resin. The conductive layer may be, but is not limited to, made of conductive materials such as copper foil.

[0116] The first rigid plate portion 51 includes a main body portion 511 and an extension portion 513. Referring to FIG. 21, which is a cross-sectional view taken along line CC shown in FIG. 7, the main body portion 511 and the inner wall of the first cover 11 can be connected together by means of adhesion, but are not limited to adhesion. For example, the main body portion 511 and the first cover 11 can also be connected by means of snap-fit ​​or the like. The extension portion 513 passes through the housing component 10 and is exposed on the outside of the housing component 10. An electrical connector can be provided at the end of the extension portion 513 away from the main body portion 511. The electrical connector is used for electrical connection with the motherboard or other devices of the electronic device 1000. It is understood that the transmission board 50 can be electrically connected to external devices such as the motherboard in other ways. For example, the extension portion 513 can be omitted from the first rigid plate portion 51, and an electrical connection can be made to the first rigid plate portion 51 by passing an electrical connection wire through the housing component 10. It is understood that the electrical connector on the extension portion 513 can be omitted, and an electrical connector can be directly made to an external device of the photosensitive component via the extension portion 513.

[0117] The first cover 11, the main body 511, and the moving component 30 can be stacked along the Z-axis. During the movement of the moving component 30 relative to the housing component 10, the flexible circuit board portion 53 will be stretched, and the first rigid plate portion 51 will also be subjected to the force of the flexible circuit board portion 53 during the stretching and deformation process. Since the first rigid plate portion 51 uses a rigid circuit board, compared with the flexible circuit board, the rigid circuit board has higher structural strength and is not easily deformed, which can improve the support strength of the drive component 70 of the transmission plate 50 support portion, so that the position of the drive component 70 on the transmission plate 50 does not change due to the stretching of the flexible circuit board portion 53, which is beneficial to improving the positional stability of the drive component 70 on the transmission plate 50.

[0118] The flexible circuit board portion 53 is bendable relative to the first rigid plate portion 51. The flexible circuit board portion 53 may include a flexible substrate and a conductive layer disposed on the flexible substrate. The flexible circuit board portion 53 can be a flexible printed circuit (FPC). A flexible circuit board is a highly reliable flexible printed circuit board made from flexible materials such as polyimide or polyester film as the substrate. Flexible circuit boards are characterized by high wiring density, light weight, thinness, and good bendability. This application does not limit the material of the flexible circuit board portion 53; the flexible circuit board can be electrically connected between the first rigid plate portion 51 and the moving part 30, and the flexible circuit board portion 53 can be bent relative to the first rigid plate portion 51.

[0119] The drive module 101 provided in this application includes a transmission board 50 comprising a first rigid plate portion 51 and a flexible circuit board portion 53 connected together. Since the first rigid plate portion 51 uses a rigid circuit board, it has higher structural strength and is less prone to deformation compared to a flexible circuit board. This improves the support strength of the transmission board 50 for the drive component 70, ensuring that the position of the drive component 70 on the transmission board 50 does not change due to the pulling of the flexible circuit board portion 53, thus enhancing the positional stability of the drive component 70 on the transmission board 50. Furthermore, the flexible circuit board portion 53 is electrically connected between the first rigid plate portion 51 and the moving component 30. External signals are transmitted to the moving component 30 through the first rigid plate portion 51 and the flexible circuit board portion 53, and then from the moving component 30 to the image sensing unit 103. Compared to a flexible metal cantilever, the flexible circuit board portion 53 has lower stiffness, lighter weight, and greater strength, requiring less driving force. This improves the response speed and high-frequency anti-shake effect of the drive module 101 during heavy, long-stroke, and large-angle anti-shake movements.

[0120] Referring to Figures 19, 20, and 22, Figure 22 is a schematic diagram of the drive module 101 with the first cover 11 removed. The flexible circuit board portion 53 is arranged circumferentially around the moving part 30. The flexible circuit board portion 53 includes a first part 531, a second part 533, and a third part 535 connected together. The first part 531 is fixed and electrically connected to the main body portion 511. The first part 531 is connected to the second part 533 and the third part 535 at its two circumferential ends, respectively.

[0121] The first part 531 can be located between the inner wall of the housing component 10 and the second side 3132, and the second part 533 can be located between the inner wall of the housing component 10 and the first side 3131. The thickness direction of the flexible circuit board part 53 is approximately perpendicular to the Z-axis, and the Z-axis is approximately coincident with the optical axis. As a result, the flexible circuit board part 53 occupies a small planar dimension in the X and Y axes.

[0122] In related technologies that use flexible metal cantilever to drive the movement of image sensing units, the flexible metal cantilever is obtained by etching a metal sheet according to a preset planar pattern. Since the flexible metal cantilever is distributed in a plane perpendicular to the optical axis, the plane size occupied by the flexible metal cantilever is relatively large.

[0123] In the drive module 101 provided in this application, since the thickness direction of the flexible circuit board portion 53 is approximately perpendicular to the optical axis direction, the planar dimensions occupied by the flexible circuit board portion 53 in the X-axis and Y-axis are relatively small, which is beneficial to reducing the planar dimensions occupied by the transmission board 50 in the X-axis and Y-axis, thereby facilitating the miniaturization of the drive module 101 and the camera module 100.

[0124] In some embodiments of this application, the plane containing the first part 531 may not be parallel to the first side 3131, the plane containing the second part 533 may not be parallel to the second side 3132, and the plane containing the third part 535 may not be parallel to the third side 3133.

[0125] Both the second rigid plate portion 55 and the third rigid plate portion 57 can be rigid circuit boards. The end of the second rigid plate portion 55 and the second portion 533 away from the first portion 531 is fixed and electrically connected in the circumferential direction of the moving member 30. The first side surface 3131 is provided with a first electrical connection terminal 3135 (as shown in FIG. 12). The second rigid plate portion 55 is provided with a second electrical connection terminal 551 (as shown in FIG. 17). The second electrical connection terminal 551 is used to electrically connect with the first electrical connection terminal 3135 to transmit signals from the transmission board 50 through the moving member 30 to the image sensing unit 103. The second electrical connection terminal 551 and the first electrical connection terminal 3135 can both be metal terminals 316, and the second electrical connection terminal 551 and the first electrical connection terminal 3135 can be electrically connected by soldering. It is understood that this application does not limit the second electrical connection terminal 551 and the first electrical connection terminal 3135 to other methods of electrical connection, such as plugging, snap-fit, etc.

[0126] The third rigid plate portion 57 and the third portion 535, at their ends away from the first portion 531, are fixed circumferentially and electrically connected to the moving member 30. The third rigid plate portion 57 and the third portion 535 may be located between the inner wall of the housing member 10 and the third side surface 3133. A third electrical connection terminal 3136 is provided on the third side surface 3133 (as shown in FIG. 12). A fourth electrical connection terminal 571 is provided on the third rigid plate portion 57. The fourth electrical connection terminal 571 (as shown in FIG. 20 and FIG. 22) is used to electrically connect with the third electrical connection terminal 3136 on the third side surface 3133 to transmit signals from the transmission plate 50 through the moving member 30 to the image sensing unit 103. Both the third electrical connection terminal 3136 and the fourth electrical connection terminal 571 may be metal terminals 316, and the fourth electrical connection terminal 571 and the third electrical connection terminal 3136 may be electrically connected by soldering. It is understood that this application does not limit the third electrical connection terminal 3136 and the fourth electrical connection terminal 571 to other ways of electrical connection, such as plug-in, snap-in, etc.

[0127] During the movement of the moving part 30 relative to the housing part 10, the flexible circuit board part 53 is stretched. The second rigid part 55 and the third rigid part 57 are also subjected to the force of the flexible circuit board part 53 during the stretching and deformation of the flexible circuit board part 53. Compared with the flexible circuit board part 53, the second rigid part 55 and the third rigid part 57 are harder and stronger. Their positions are less likely to move and they are less likely to deform. As a result, the physical connection between the second electrical connection terminal 551 and the first electrical connection terminal 3135 is less likely to loosen, and the physical connection between the third electrical connection terminal 3136 and the fourth electrical connection terminal 571 is less likely to loosen. The second rigid part 55 helps to improve the electrical connection stability between the first electrical connection terminal 3135 and the second electrical connection terminal 551, and the third rigid part 57 helps to improve the electrical connection stability between the third electrical connection terminal 3136 and the fourth electrical connection terminal 571.

[0128] It is understood that the transmission board 50 may omit the second rigid board portion 55, and the flexible circuit board portion 53 may omit the second part 533, and the flexible circuit board portion 53 may be directly electrically connected to the moving part 30.

[0129] It is understandable that the transmission board 50 may omit the third rigid board section 57, and the flexible circuit board section 53 may omit the third part 535, and the flexible circuit board section 53 may be directly electrically connected to the moving part 30.

[0130] It is understood that the number of flexible circuit board sections 53 and rigid sections on the transmission board 50 is not limited, and the connection position and method of the flexible circuit board sections 53 and rigid sections are not limited.

[0131] It is understood that this application does not limit the shape of the moving part 30. The top surface 311 can be in an irregular or regular shape such as a circle or pentagon. The flexible circuit board part 53 is disposed around the moving part 30 along the circumference of the moving part 30, and the flexible circuit board part 53 is electrically connected to the moving part 30.

[0132] Please refer to Figures 21, 22, 23, 24, and 25. Figure 23 is a perspective view of the drive module 101 without the first cover 11 and the transmission plate 50. Figure 24 is a planar view of the coils of the drive component 70 distributed on the transmission plate 50. Figure 25 is a planar layout of the drive component 70. The drive component 70 includes a first magnetic element 7111, a second magnetic element 7131, a first coil 7113, a second coil 7115, a third coil 7133, and a fourth coil 7135. The first magnetic element 7111 is housed in a first mounting recess 3115, and the second magnetic element 7131 is housed in a second mounting recess 3116. The first coil 7113, the second coil 7115, the third coil 7133, and the fourth coil 7135 are located on the side of the main body 511 facing the moving component 30. The first coil 7113 and the second coil 7115 are both located between the main body 511 and the first magnetic component 7111, that is, the first coil 7113 and the second coil 7115 are both arranged along the X-axis, and the first coil 7113 and the first magnetic component 7111 are both facing each other on the Z-axis. The third coil 7133 and the fourth coil 7135 are both located between the main body 511 and the second magnetic component 7131, that is, the third coil 7133 and the fourth coil 7135 are both arranged along the Y-axis, and the third coil 7133 and the fourth coil 7135 are both facing each other on the Z-axis. The four coils of the driving component 70 are asymmetrically arranged along two adjacent edges of the main body 511, which can reduce the planar size.

[0133] The first coil 7113 and the second coil 7115 are used to interact with the first magnetic component 7111 when current is applied, and the third coil 7133 and the fourth coil 7135 are used to interact with the second magnetic component 7131 when current is applied, so as to output driving force and torque, thereby driving the moving component 30 to move relative to the housing component 10.

[0134] The driving component 70 also includes a displacement sensor and a driving chip 75. The displacement sensor is used to collect jitter data from the image sensing unit 103 and feed it back to the driving chip 75. The driving chip 75 is used to calculate the required compensation value based on the received jitter data, and control the direction and magnitude of the current flowing through each of the first coil 7113, the second coil 7115, the third coil 7133, and the fourth coil 7135 according to the compensation value, so as to control the moving component 30 to drive the image sensing unit 103 to translate or rotate in the XY plane. Each of the four coils is individually controlled by the driving chip 75. The driving chip 75 can be located on the main body 511 or on the moving component 30.

[0135] The displacement sensor can be a magnetic sensing device. The displacement sensor can be fixed to the main body 511 by SMT mounting or soldering process. The displacement sensor can be used to sense magnetic flux. The displacement sensor can include, but is not limited to, Hall sensor, GMR (Giant Magneto Resistance) sensor or TMR (Tunnel Magneto Resistance) sensor.

[0136] The number of displacement sensors can be three, including a first displacement sensor 731, a second displacement sensor 732, and a third displacement sensor 733. The first displacement sensor 731 is located on the X-axis between the first coil 7113 and the second coil 7115. The second displacement sensor 732 and the third displacement sensor 733 are positioned along the Y-axis. The third coil 7133 and the fourth coil 7135 are located on the Y-axis between the second displacement sensor 732 and the third displacement sensor 733. By sensing the components of magnetic flux along the Z-axis, X-axis, and Y-axis under different jitter postures, the three displacement sensors can monitor the relative position signal between the image sensor 22 and the center of the optical path. After image stabilization compensation, they can quickly re-detect the position signal of the image sensor 22, thereby achieving position feedback of the image sensor 22 in the X-axis translation, Y-axis translation, and R-axis directions. This allows determination of whether the image stabilization amplitude of the moving part 30 has reached the compensation value. The R-axis rotation is the rotation within the plane containing the X-axis and Y-axis.

[0137] When the moving part 30 only needs to translate along the X-axis, the compensation value includes a preset X-axis value. Based on the preset X-axis value, the drive chip 75 controls the output of different currents to the first coil 7113 and the second coil 7115. The energized first coil 7113 and the energized second coil 7115 interact with the first magnetic element 7111 to generate different driving forces and torques. The current directions and / or magnitudes in the energized first coil 7113 and the energized second coil 7115 are different. To overcome the R-axis crosstalk caused by the torque generated by the energized first coil 7113 and the energized second coil 7115, the drive chip 75 controls the output of different currents to the third coil 7133 and the fourth coil 7135. The energized third coil 7133, together with the second magnetic element 7131, generates different driving forces and torques, so that the moving part is balanced in the Y-axis and drives the moving part 30 to move along the X-axis by the preset X-axis value. The current directions and / or magnitudes in the energized third coil 7133 and the energized fourth coil 7135 are different.

[0138] When the moving part 30 only needs to translate along the Y-axis, the compensation value includes a preset Y-axis value. Based on the preset Y-axis value, the drive chip 75 controls the output of different currents to the third coil 7133 and the fourth coil 7135. The energized third coil 7133 and the energized fourth coil 7135 interact with the second magnetic element 7131 to generate different driving forces and torques. The current directions and / or magnitudes in the energized third coil 7133 and the energized fourth coil 7135 are different. To overcome the R-axis crosstalk caused by the torque generated by the energized third coil 7133 and the energized fourth coil 7135, the drive chip 75 controls the output of different currents to the first coil 7113 and the second coil 7115. The energized first coil 7113 and the energized second coil 7115 interact with the first magnetic element 7111 to output different driving forces and torques, so that the moving part 30 is force-balanced along the X-axis and drives the moving part 30 to move along the Y-axis by the preset Y-axis value.

[0139] When the moving part 30 only needs to rotate around the R-axis, the compensation value includes the preset value of the R-axis. According to the preset value of the R-axis, the drive chip 75 controls the output of different currents to the first coil 7113, the second coil 7115, the third coil 7133 and the fourth coil 7135 to generate different forces and torques, thereby realizing the condition that the moving part is only affected by the rotational torque and not by the translational force, thus realizing the rotational motion of the R-axis.

[0140] Other motion states of the moving part 30 are synthesized from the above three states.

[0141] In summary, the driving module 101 provided in this application corrects jitter by translating the image sensor 22 in a plane perpendicular to the optical axis, causing relative displacement between the image sensor 22 and the optical path. Simultaneously, the driving component 70 can drive the image sensor 22 to rotate around the R-axis in the plane containing the X and Y axes, achieving jitter correction of the rotation angle. The driving component consists of a coil connected to the first rigid plate 51 and a magnetic component connected to the moving component 30. By controlling the direction and magnitude of the coil current, translation and rotation in different directions are achieved to correct the jitter of the image sensor 22. The R-axis is the rotation axis in the plane containing the X and Y axes.

[0142] This application does not limit the number of displacement sensors. For example, the number of displacement sensors can also be four, as shown in Figure 26. Figure 26 is a schematic diagram of the arrangement of four displacement sensors and each coil provided in one embodiment of this application. The first coil 7113 and the second coil 7115 are located between the first displacement sensor 731 and the second displacement sensor 732 on the X-axis. The third coil 7133 and the fourth coil 7135 are located between the third displacement sensor 733 and the fourth displacement sensor 734 on the Y-axis. By sensing the components of magnetic flux on the Z-axis / X-axis / Y-axis under different jitter postures, the four displacement sensors can monitor the relative position signal between the image sensor 22 and the center of the optical path. After the image stabilization compensation, the position signal of the image sensor 22 is quickly re-detected, thereby realizing the position feedback of the image sensor 22 in the three directions of X-axis translation, Y-axis translation, and R-axis. Thus, it can be determined whether the anti-shake amplitude of the moving part 30 has reached the preset value.

[0143] In some implementations, the coil may be disposed on the moving part, and the magnetic part may be disposed on the stationary part.

[0144] Furthermore, in this application, the expression "and / or" includes any and all combinations of the associated listed words. For example, the expression "A and / or B" may include A, may include B, or may include both A and B.

[0145] In this application, expressions including ordinal numbers such as "first" and "second" may modify the elements. However, such elements are not limited by the foregoing expressions. For example, the foregoing expressions do not limit the order and / or importance of the elements. The foregoing expressions are only used to distinguish one element from other elements. For example, "first user equipment" and "second user equipment" refer to different user equipment, although both "first user equipment" and "second user equipment" are user equipment. Similarly, without departing from the scope of this application, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element.

[0146] When a component is referred to as "connected" or "accessed" to other components, it should be understood that this component not only connects directly to or accesses other components, but also that another component may exist between this component and other components. On the other hand, when a component is referred to as "directly connected" or "directly accessed" to other components, it should be understood that no component exists between them.

[0147] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A drive module (101), characterized in that, The drive module (101) includes a housing component (10), a moving component (30), a transmission plate (50), a rolling component (80), and a drive component (70), wherein the transmission plate (50), the drive component (70), and the moving component (30) are all housed within the housing component (10); The moving part (30) is used to carry the image sensing unit (103); The transmission plate (50) includes a first rigid plate portion (51) and a flexible circuit board portion (53) that are fixed and electrically connected to each other. The first rigid plate portion (51) is fixed to the inner wall of the housing component (10). The first rigid plate portion (51) and the moving component (30) are stacked together along a first direction. The flexible circuit board portion (53) is arranged around the moving component (30) along a portion of the circumference of the moving component (30). The flexible circuit board portion (53) is electrically connected to the moving component (30). The driving component (70) is used to drive the moving component (30) to move relative to the housing component (10); The rolling member (80) is disposed in one of the moving member (30) and the housing member (10), and in the first direction, the moving member (30) and the housing member (10) are in rolling contact through the rolling member (80).

2. The drive module (101) according to claim 1, characterized in that, The rolling component (80) includes a ball group (81), and the moving component (30) has a receiving groove (331) on the side away from the first rigid plate portion (51), and the receiving groove (331) contains the ball group (81).

3. The drive module (101) according to claim 2, characterized in that, The moving component (30) includes a moving frame (31) and a guide bracket (33) mounted on the moving frame (31), wherein the moving frame (31) is located between the first rigid plate portion (51) and the guide bracket (33) in the first direction; The guide bracket (33) has the receiving groove (331) on the side opposite to the motion frame (31) in the first direction.

4. The drive module (101) according to claim 3, characterized in that, One of the motion frame (31) and the housing component (10) includes a magnetic material, and the other of the motion frame (31) and the housing component (10) includes a magnetically conductive material. The magnetic material and the magnetically conductive material are magnetically attracted in the first direction. The guide bracket (33) is located between the magnetically conductive material and the magnetic material in the first direction. The rolling component (80) is in rolling contact with the guide bracket (33) in the first direction and is in rolling contact with the housing component (10) in the first direction.

5. The drive module (101) according to claim 4, characterized in that, The moving part (30) also includes a magnetic attractor (35); The motion frame (31) has an assembly groove (3155) on the side facing the guide bracket (33), and the magnetic suction member (35) is housed in the assembly groove (3155). The guide bracket (33) is located on the side of the motion frame (31) away from the first rigid plate portion (51) in the first direction and covers the mounting groove (3155), the magnetic suction member (35) includes the magnetic material, and the housing component (10) includes the magnetic conductive material.

6. The drive module (101) according to claim 5, characterized in that, The housing component (10) includes a first cover (11), a second cover (12), and a magnetic conductor (15). The first cover (11) and the second cover (12) are used to enclose a receiving space. The moving component (30), at least a portion of the transmission plate (50), the driving component (70), and the magnetic conductor (15) are all received within the receiving space. The first rigid plate portion (51) is located between the first cover (11) and the moving frame (31) in the first direction. The first rigid plate portion (51) is fixed to the first cover (11). The magnetic conductor (15) is located between the guide bracket (33) and the second cover (12) in the first direction. The magnetic conductor (15) covers the receiving groove (331). The magnetic conductor (15) includes the magnetic material.

7. The drive module (101) according to any one of claims 2-6, characterized in that, The moving component (30) includes a first corner region (3151), a second corner region (3152), a third corner region (3153), and a fourth corner region (3154). The first corner region (3151) and the second corner region (3152) are arranged along a second direction, and the second corner region (3152) and the third corner region (3153) are arranged along a third direction. The first corner region (3151) and the third corner region (3153) are arranged along one diagonal of the moving component (30), and the second corner region (3152) and the fourth corner region (3154) are arranged along the other diagonal of the moving component (30). The second direction is perpendicular to the first direction, the second direction is perpendicular to the third direction, and the third direction is perpendicular to the first direction. The first corner region (3151), the second corner region (3152) and the third corner region (3153) are all formed with the receiving groove (331).

8. The drive module (101) according to any one of claims 1-7, characterized in that, The moving part (30) is provided with a first electrical connection terminal (3135); The transmission plate (50) further includes a second rigid plate portion (55), which is fixed and electrically connected to the flexible circuit board portion (53) in the circumference of the moving component (30). The second rigid plate portion (55) is provided with a second electrical connection terminal (551), and the first electrical connection terminal (3135) is electrically connected to the second electrical connection terminal (551).

9. The drive module (101) according to claim 8, characterized in that, The moving part (30) includes a top surface (311) and a side surface connected together, and the first rigid plate part (51) and the top surface (311) are stacked together along the first direction; The first electrical connection terminal (3135) is disposed on the side surface, and the flexible circuit board portion (53) and the second rigid board portion (55) are disposed around the side surface. The thickness direction of the flexible circuit board portion (53) is perpendicular to the first direction.

10. The drive module (101) according to claim 9, characterized in that, The transmission plate (50) also includes a third rigid plate portion (57), and the side includes a first side (3131), a second side (3132), a third side (3133) and a fourth side (3134) connected together; The first side (3131) and the third side (3133) are disposed opposite each other in the second direction, the second side (3132) and the fourth side (3134) are disposed opposite each other in the third direction, the first side (3131) is provided with the first electrical connection terminal (3135), the third side (3133) is provided with the third electrical connection terminal (3136), the third rigid plate portion (57) is provided with the fourth electrical connection terminal (571), the second direction is perpendicular to the first direction, the second direction is perpendicular to the third direction, and the third direction is perpendicular to the first direction; The flexible circuit board portion (53) includes a first portion (531), a second portion (533), and a third portion (535) sequentially connected. At least one of the first portion (531) and the second portion (533) is fixed and electrically connected to the first rigid board portion (51). The first portion (531) is located between the inner wall of the housing component (10) and the second side surface (3132), and the second portion (533) is located between the inner wall of the housing component (10) and the first side surface (3131). The third part (535) is located between the inner wall of the housing component (10) and the third side surface (3133). The second rigid plate part (55) and the second part (533) are connected to the moving part (30) at one end circumferentially away from the first part (531). The third rigid plate part (57) and the third part (535) are connected to the moving part (30) at one end circumferentially away from the first part (531). The third electrical connection terminal (3136) is electrically connected to the fourth electrical connection terminal (571).

11. The drive module (101) according to any one of claims 1-10, characterized in that, The driving component (70) includes a first magnetic element (7111), a second magnetic element (7131), a first coil (7113), a second coil (7114), a third coil (7132), and a fourth coil (7134). The first magnetic element (7111) and the second magnetic element (7131) are disposed on the top surface (311) of the moving component (30). The first magnetic element (7111) is disposed along a second direction, and the second magnetic element (7131) is disposed along a third direction. The first coil (7113), the second coil (7114), the third coil (7132), and the fourth coil (7134) are all fixed to the side of the first rigid plate (51) facing the top surface (311). The first coil (7113) and the second coil (7114) are arranged along the second direction and are face-to-face with the first magnetic element (7111). The third coil (7132) and the fourth coil (7134) are arranged along the second direction and are face-to-face with the second magnetic element (7131). Any two of the first direction, the second direction, and the third direction are perpendicular to each other.

12. The drive module (101) according to claim 11, characterized in that, The top surface (311) is also provided with a first mounting recess (3115) and a second mounting recess (3116); The first magnetic element (7111) is housed in the first mounting recess (3115); The second magnetic element (7131) is housed in the second mounting recess (3116).

13. The drive module (101) according to any one of claims 1-12, characterized in that, The driving component (70) further includes a displacement sensor (73) and a driving chip (75). The displacement sensor (73) is used to collect the jitter data of the image sensing unit (103) and feed it back to the driving chip (75). The driving chip (75) is used to calculate the required compensation value based on the received jitter data, and control the direction and magnitude of the current in each of the first coil (7113), the second coil (7114), the third coil (7132), and the fourth coil (7134) according to the compensation value, so as to control the moving part (30) to drive the image sensing unit (103) to perform anti-shake movement.

14. An optical component (3), characterized in that, The optical component (3) includes an image sensing unit (103) and a drive module (101) according to any one of claims 1-13, wherein the moving part (30) of the drive module (101) carries the image sensing unit (103).

15. A camera module (100), characterized in that, The camera module (100) further includes a lens (2) and an optical component (3) according to claim 13, wherein the lens (2) is located on the light-incident side of the image sensing unit (103).

16. An electronic device (1000), characterized in that, The electronic device (1000) includes a device housing (200) and a camera module (100) according to claim 15, the camera module (100) being mounted on the device housing (200).

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