Display device and electronic device comprising same

Abstract

This display device comprises: an elastic functional layer comprising an elastic material and a thermally conductive material; a support plate disposed above the elastic functional layer; a display panel disposed above the support plate; a circuit board disposed below the elastic functional layer; a first adhesive layer connecting the display panel and the support plate to each other; and a second adhesive layer connecting the elastic functional layer and the circuit board to each other and having greater thermal conductivity than the first adhesive layer.

Description

Display device and electronic device including the same

[0001] The present invention relates to a display device and an electronic device including the same. More specifically, it relates to a flexible display device and an electronic device including the same.

[0002] A display device is a device that displays images to provide visual information to a user. A display device may include electronic components such as a display panel containing multiple pixels that emit light, a circuit board for supplying electrical signals to the display panel, and a battery for supplying power to the display panel. While each of the multiple pixels is in operation, heat is generated in the circuit board and electronic components, and this heat generation phenomenon may cause problems in the operation of the display panel. Accordingly, a heat dissipation layer is placed on the back of the display panel to mitigate problems caused by this heat generation phenomenon. Recently, graphite sheets, which are heat-processed products of natural graphite, are generally used as heat dissipation layers to increase thermal conductivity.

[0003] Meanwhile, flexible display devices are being developed to implement functions such as foldable, rollable, and stretchable, taking into account user convenience and portability. Since these stretchable display devices undergo deformation during use, a flexible elastic member is placed within the display device. Consequently, when a heat dissipation layer and an elastic member are placed simultaneously within a stretchable display device, there is a problem that the thickness of the display device increases.

[0004] One objective of the present invention is to provide a display device with improved heat dissipation efficiency.

[0005] Another objective of the present invention is to provide an electronic device including the above-mentioned display device.

[0006] However, the objectives of the present invention are not limited to the objectives described above and may be expanded in various ways without departing from the spirit and scope of the present invention.

[0007] To achieve one objective of the present invention as described above, a display device according to one embodiment of the present invention comprises an elastic functional layer, a support plate, a display panel, a circuit board, a first adhesive layer, and a second adhesive layer. The elastic functional layer comprises an elastic material and a thermally conductive material. The support plate is disposed on the elastic functional layer. The display panel is disposed on the support plate. The display panel includes a plurality of pixels. The circuit board is disposed below the elastic functional layer. The circuit board is electrically connected to the display panel. The first adhesive layer is disposed between the display panel and the support plate in cross-section. The first adhesive layer bonds the display panel and the support plate together. The second adhesive layer is disposed between the elastic functional layer and the circuit board in cross-section. The second adhesive layer bonds the elastic functional layer and the circuit board together. The second adhesive layer has a thermal conductivity greater than that of the first adhesive layer.

[0008] In one embodiment, the thermally conductive material may include at least one selected from the group consisting of graphite powder, graphene, carbon fiber, carbon nanotube, and boron nitride (BN).

[0009] In one embodiment, the elastic material may include at least one selected from the group consisting of silicon (Si), polyurethane (PU), thermoplastic polyurethane (TPU), and polydimethylacrylamide (PDMA).

[0010] In one embodiment, the weight ratio of the thermally conductive material included in the elastic functional layer may be about 50 wt% or less.

[0011] In one embodiment, the thickness of the elastic functional layer may be about 10 μm to about 300 μm.

[0012] In one embodiment, the thermal conductivity of the elastic functional layer may be about 5 W / (m·K) to about 40 W / (m·K).

[0013] In one embodiment, the display panel may include a foldable region and a non-folding region adjacent to the foldable region. The width of the elastic functional layer may be constant as it extends from the non-folding region toward the center of the foldable region.

[0014] In one embodiment, the support plate may include an expandable portion and a flat portion. The expandable portion may be disposed in the foldable area. The flat portion may be disposed in the non-folding area. A plurality of lattice holes penetrating the support plate in the thickness direction may be defined in the expandable portion.

[0015] In one embodiment, the elastic functional layer may overlap with the entire stretchable portion on a plane.

[0016] To achieve another objective of the present invention as described above, an electronic device according to one embodiment of the present invention comprises a display panel, an elastic functional layer, a support plate, a circuit board, a first adhesive layer, a second adhesive layer, and a housing plate. The elastic functional layer comprises an elastic material and a thermally conductive material. The support plate is disposed on the elastic functional layer. The display panel is disposed on the support plate. The display panel includes a plurality of pixels. The circuit board is disposed below the elastic functional layer. The circuit board is electrically connected to the display panel. The first adhesive layer is disposed between the display panel and the support plate in cross-section. The first adhesive layer bonds the display panel and the support plate together. The second adhesive layer is disposed between the elastic functional layer and the circuit board in cross-section. The second adhesive layer bonds the elastic functional layer and the circuit board together. The second adhesive layer has a thermal conductivity greater than that of the first adhesive layer. The housing plate provides a space for accommodating the display panel, the elastic functional layer, the support plate, and the circuit board.

[0017] In one embodiment, the thermally conductive material may include at least one selected from the group consisting of graphite powder, graphene, carbon fiber, carbon nanotube, and boron nitride (BN).

[0018] In one embodiment, the elastic material may include at least one selected from the group consisting of silicon (Si), polyurethane (PU), thermoplastic polyurethane (TPU), and polydimethylacrylamide (PDMA).

[0019] In one embodiment, the weight ratio of the thermally conductive material included in the elastic functional layer may be about 50 wt% or less.

[0020] In one embodiment, the thickness of the elastic functional layer may be about 10 μm to about 300 μm.

[0021] In one embodiment, the thermal conductivity of the elastic functional layer may be about 5 W / (m·K) to about 40 W / (m·K).

[0022] In one embodiment, the housing plate may include a housing and a hinge portion. The housing may be disposed in the non-folding area and may accommodate the circuit board. The hinge portion may be disposed in the foldable area and may protrude from one side of the housing plate toward the interior of the housing plate.

[0023] In one embodiment, the elastic functional layer may overlap the entire hinge portion on a plane.

[0024] In one embodiment, the width of the elastic functional layer may be constant as it moves from the non-folding region toward the center of the foldable region.

[0025] In one embodiment, the electronic device may further include a battery module. The battery module may be disposed in the non-folding region below the elastic functional layer. The battery module may supply power to the display panel. The second adhesive layer may bond the battery module and the elastic functional layer together.

[0026] To achieve another objective of the present invention described above, an electronic device according to one embodiment of the present invention comprises a display panel, an elastic functional layer, a support plate, a circuit board, and a housing plate. The elastic functional layer comprises an elastic material and a thermally conductive material. The support plate is disposed on the elastic functional layer. The display panel is disposed on the support plate. The display panel comprises a plurality of pixels. The circuit board is disposed below the elastic functional layer. The circuit board is electrically connected to the display panel. The housing plate comprises a housing and a hinge portion. The housing is disposed in the non-folding region and accommodates the circuit board. The hinge portion is disposed in the foldable region. The elastic functional layer overlaps the entire hinge portion in a plane. The width of the elastic functional layer is constant as it extends from the non-folding region toward the center of the foldable region.

[0027] In an electronic device according to embodiments of the present invention, the thermal conductivity of a first adhesive layer that bonds a support plate and an elastic functional layer together may be lower than the thermal conductivity of a second adhesive layer that bonds the elastic functional layer, a circuit board, and an electronic component together. Accordingly, heat emitted from each of the circuit board and the electronic component and transferred to the display panel can be effectively reduced. Thus, the electronic device with improved heat dissipation efficiency and improved display quality can be provided.

[0028] In addition, the elastic functional layer can overlap the entire hinge portion on a flat plane, and the width of the elastic functional layer can be constant as it extends from the non-folding region to the center of the foldable region. Accordingly, since an additional process is not required to process the graphite sheet included in the conventional electronic device so that its width decreases as it extends from the non-folding region to the foldable region, the time and cost in the manufacturing process of the electronic device can be reduced. Furthermore, since a single elastic functional layer performs both heat dissipation and elastic functions simultaneously, it is possible to easily manufacture an electronic device with a relatively thin thickness.

[0029] However, the effects of the present invention are not limited to the effects described above, and may be extended in various ways without departing from the spirit and scope of the present invention.

[0030] FIG. 1 is a perspective view showing an electronic device according to one embodiment of the present invention.

[0031] FIG. 2 is a perspective view showing the folded state of the electronic device of FIG. 1.

[0032] Figure 3 is a block diagram showing a display device included in the electronic device of Figure 1.

[0033] Figure 4 is an exploded perspective view showing the electronic device of Figure 1 disassembled.

[0034] Figure 5 is a cross-sectional view showing an example of a cross-section cut along the line I-I' of Figure 1.

[0035] Figure 6 is a cross-sectional view showing a part of the display module of Figure 4.

[0036] Figure 7 is a cross-sectional view showing another example of a cross-section cut along the line I-I' of Figure 1.

[0037] Figure 8 is a cross-sectional view showing a part of the housing plate of Figure 4.

[0038] FIG. 9 is a cross-sectional view showing the folded state of the housing plate of FIG. 8.

[0039] Figure 10 is a diagram illustrating the heat dissipation effect of the electronic device of Figure 1.

[0040] FIG. 11 is an exploded perspective view showing a conventional electronic device disassembled.

[0041] Figure 12 is a cross-sectional view showing a cross-section cut along the line II-II' of Figure 11.

[0042] FIG. 13 is a plan view comparing the electronic device of FIG. 1 and the conventional electronic device of FIG. 11.

[0043] FIG. 14 is a perspective view showing an electronic device according to another embodiment of the present invention.

[0044] FIG. 15 is a perspective view showing the electronic device of FIG. 14 in an extended state.

[0045] FIG. 16 is a cross-sectional view showing a cross- section of the electronic device of FIG. 14.

[0046] FIG. 17 is a cross-sectional view showing an extended cross-section of the electronic device of FIG. 14.

[0047] FIG. 18 is a block diagram showing the electronic device of FIG. 1 and FIG. 14.

[0048] With respect to the embodiments of the present invention disclosed in the text, specific structural or functional descriptions are provided merely for the purpose of explaining the embodiments of the present invention, and the embodiments of the present invention may be implemented in various forms and should not be interpreted as being limited to the embodiments described in the text.

[0049] The present invention is capable of various modifications and may take various forms, and specific embodiments are illustrated in the drawings and described in detail in the text. However, this is not intended to limit the invention to the specific disclosed forms, and it should be understood that the invention includes all modifications, equivalents, and substitutions that fall within the spirit and scope of the invention.

[0050] Terms such as "first," "second," etc., may be used to describe various components, but the components should not be limited by these terms. The terms may be used for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be named the second component, and similarly, the second component may be named the first component.

[0051] When it is stated that one component is “connected” or “connected” to another component, it should be understood that while it may be directly connected or connected to that other component, there may also be other components in between. Conversely, when it is stated that one component is “directly connected” or “directly connected” to another component, it should be understood that there are no other components in between. Other expressions describing the relationship between components, such as “between” and “exactly between” or “adjacent to” and “directly adjacent to,” should be interpreted in the same way.

[0052] The terms used in this application are used merely to describe specific embodiments and are not intended to limit the invention. The singular expression includes the plural expression unless the context clearly indicates otherwise. In this application, terms such as “comprising” or “having” are intended to specify the existence of the described features, numbers, steps, actions, components, parts, or combinations thereof, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0053] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by those skilled in the art to which the present invention pertains. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an ideal or overly formal sense unless explicitly defined in this application.

[0054] Meanwhile, if an embodiment can be implemented differently, a function or operation specified within a particular block may occur differently from the order specified in the flowchart. For example, two consecutive blocks may actually be executed substantially simultaneously, and depending on the related function or operation, the blocks may be executed in reverse order.

[0055] Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the attached drawings. Identical components in the drawings are denoted by the same reference numerals, and redundant descriptions of identical components are omitted.

[0056] FIG. 1 is a perspective view showing an electronic device according to one embodiment of the present invention. FIG. 2 is a perspective view showing a folded state of the electronic device of FIG. 1. For example, FIG. 1 may be a perspective view showing an unfolded (e.g., unfolded) state of the electronic device (ED).

[0057] Referring to FIGS. 1 and 2, an electronic device (ED) according to one embodiment of the present invention may include a display area (DA) and a non-display area (NDA). In one embodiment, the electronic device (ED) may be a foldable electronic device.

[0058] In this specification, a plane may be defined by a first direction (DR1) and a second direction (DR2) that intersects the first direction (DR1). For example, the first direction (DR1) and the second direction (DR2) may be orthogonal to each other. Additionally, a third direction (DR3) may be perpendicular to the plane.

[0059] The display area (DA) may be an area capable of generating light to display an image. Multiple pixels (PX) that emit light may be arranged in the display area (DA), and accordingly, the image may be displayed in the display area (DA). The multiple pixels (PX) may be arranged in a matrix form along a first direction (DR1) and a second direction (DR2) that intersects the first direction (DR1).

[0060] The non-display area (NDA) may be an area that does not display an image. The non-display area (NDA) may be adjacent to the display area (DA). In one embodiment, the non-display area (NDA) may surround at least a portion of the display area (DA). For example, the non-display area (NDA) may surround the entire display area (DA).

[0061] In one embodiment, the electronic device (ED) may be a foldable electronic device. The electronic device (ED) may include a first non-folding region (NFA1), a second non-folding region (NFA2), and a foldable region (FA) depending on whether it is folded. For example, the first non-folding region (NFA1) and the second non-folding region (NFA2) may be spaced apart from each other, and the foldable region (FA) may be located between the first non-folding region (NFA1) and the second non-folding region (NFA2).

[0062] A foldable region (FA) is a region where an electronic device (ED) is folded along a folding axis (FX) parallel to a first direction (DR1), and a first non-folding region (NFA1) and a second non-folding region (NFA2) may be regions where the electronic device (ED) is not folded. For example, the electronic device (ED) may be folded such that the first non-folding region (NFA1) and the second non-folding region (NFA2) face each other with respect to the foldable region (FA). Additionally, the foldable region (FA) may be folded to have a curvature. In this specification, the first non-folding region (NFA1) and the second non-folding region (NFA2) may be referred to as non-folding regions.

[0063] However, the number of each of the foldable region (FA) and non-folding region included in the electronic device (ED) according to the embodiments of the present invention, the direction of the folding axis, the number of times it is folded, etc. are exemplary and are not necessarily limited thereto.

[0064] For example, in FIGS. 1 and 2, the electronic device (ED) is illustrated as having one foldable region (FA) and being folded once, but the electronic device (ED) may include two or more foldable regions and three or more non-foldable regions. Additionally, the electronic device (ED) may be folded two or more times.

[0065] For example, in FIGS. 1 and 2, the foldable region (FA) is shown as being extended in a first direction (DR1) and the electronic device (ED) is folded in a second direction (DR2) along a folding axis (FX) parallel to the first direction (DR1), but the foldable region may be extended in a second direction (DR2) and the electronic device (ED) may be folded in a first direction (DR1) along a folding axis parallel to the second direction (DR2).

[0066] Figure 3 is a block diagram showing a display device included in the electronic device of Figure 1.

[0067] Referring to FIGS. 1 to 3, a display device (DD) included in an electronic device (ED) may include a display panel (DP) and a display panel driver. The display panel driver may include a drive control unit (CON), a gate driver (GDV), a gamma reference voltage generator (GMV), and a data driver (DDV).

[0068] Each of the display area (DA) and non-display area (NDA) included in the electronic device (ED) may also be included in the display device (DD). Additionally, each of the first non-folding area (NFA1), the second non-folding area (NFA2), and the foldable area (FA) included in the electronic device (ED) may also be included in the display device (DD). For example, when the electronic device (ED) is folded, the display device (DD) may also be folded along a folding axis (FX) extending in a first direction (DR1). Furthermore, the display panel (DP) may also include the first non-folding area (NFA1), the second non-folding area (NFA2), and the foldable area (FA).

[0069] In the display area (DA) of the display panel (DP), a plurality of pixels (PX), a plurality of gate lines (GL), and a plurality of data lines (DL) may each be disposed therein. In areas other than the display area (DA) of the display panel (DP) (e.g., non-display area (NDA), bending area (e.g., bending area (BA) of FIG. 5) and pad area (e.g., pad area (PA) of FIG. 5)), the display panel driving unit may be disposed therein.

[0070] One of the multiple pixels (PX) may include subpixels that emit light of different colors. For example, one of the pixels may include a first subpixel emitting a first color light, a second subpixel emitting a second color light, and a third subpixel emitting a third color light.

[0071] In one embodiment, the first color light may be red light, the second color light may be green light, and the third color light may be blue light. However, the color of the light emitted by each of the first subpixel, the second subpixel, and the third subpixel according to the embodiments of the present invention is not necessarily limited thereto. For example, each of the first subpixel, the second subpixel, and the third subpixel may be combined to emit magenta light, cyan light, or yellow light.

[0072] In one embodiment, a plurality of gate lines (GL) may extend along one direction. In one embodiment, a plurality of data lines (DL) may extend along one direction. In one embodiment, each of the plurality of gate lines (GL) may be spaced apart on a plane. In one embodiment, each of the plurality of data lines (DL) may be spaced apart on a plane.

[0073] In one embodiment, a plurality of gate wires (GL) and a plurality of data wires (DL) may intersect each other in a plane. For example, a plurality of gate wires (GL) and a plurality of data wires (DL) may be orthogonal in a plane.

[0074] The drive control unit (CON) can receive input image data (IMG) and input control signals (CONT) from an external device (e.g., a processor such as a graphic processing unit (GPU)). In one embodiment, the drive control unit (CON), the gamma reference voltage generation unit (GMV), and the data driver (DDV) may be formed integrally. For example, a module in which the drive control unit (CON) and the data driver (DDV) are formed integrally may be referred to as a timing controller embedded data driver (TED).

[0075] In one embodiment, the input image data (IMG) may include red image data, green image data, and blue image data. In one embodiment, the input image data (IMG) may further include white image data. In another embodiment, the input image data (IMG) may include magenta image data, yellow image data, and cyan image data.

[0076] In one embodiment, the input control signal (CONT) may include a master clock signal and a data enable signal. In one embodiment, the input control signal (CONT) may further include a vertical synchronization signal and a horizontal synchronization signal.

[0077] The drive control unit (CON) can generate a gate control signal (CONT1) to control the operation of the gate driver (GDV) based on an input control signal (CONT). The drive control unit (CON) can output the gate control signal (CONT1) to the gate driver (GDV). The gate control signal (CONT1) may include a vertical start signal and a gate clock signal.

[0078] The drive control unit (CON) can generate a data control signal (CONT2) to control the operation of the data drive unit (DDV) based on an input control signal (CONT). The drive control unit (CON) can output the data control signal (CONT2) to the data drive unit (DDV). The data control signal (CONT2) may include a horizontal start signal and a load signal.

[0079] The drive control unit (CON) can generate a data signal (DATA) based on input image data (IMG). Accordingly, the drive control unit (CON) can output the data signal (DATA) to the data drive unit (DDV) through a plurality of data wires (DL).

[0080] The driving control unit (CON) can generate a gamma control signal (CONT3) to control the operation of the gamma reference voltage generator (GMV) based on the input control signal (CONT). The driving control unit (CON) can output the gamma control signal (CONT3) to the gamma reference voltage generator (GMV).

[0081] The gate driver (GDV) can generate output signals for driving a plurality of gate wires (GL) in response to a gate control signal (CONT1) received from the drive control unit (CON). In one embodiment, the gate driver (GDV) may be included in the display panel (DP). For example, the gate driver (GDV) may be integrated within the non-display area (NDA) of the display panel (DP), so that the display device (DD) may have a gate-in-panel (GIP) structure in which the display panel (DP) and the gate driver (GDV) are formed integrally with each other. However, the gate driver (GDV) according to the embodiments of the present invention is not necessarily limited thereto, and the gate driver (GDV) may be provided within the display device (DD) separately from the display panel (DP).

[0082] The gamma reference voltage generator (GMV) can generate a gamma reference voltage (VGREF) in response to a gamma control signal (CONT3) received from the drive control unit (CON). The gamma reference voltage generator (GMV) can provide the gamma reference voltage (VGREF) to the data drive unit (DDV).

[0083] The data driver (DDV) can receive a data control signal (CONT2) and a data signal (DATA) from the driver control unit (CON). The data driver (DDV) can receive a gamma reference voltage (VGREF) from the gamma reference voltage generator (GMV). The data driver (DDV) can convert the data signal (DATA) into an analog data voltage (VDATA) using the gamma reference voltage (VGREF). The data driver (DDV) can output the data voltage (VDATA) to each of the multiple data wires (DL).

[0084] FIG. 4 is an exploded perspective view showing the electronic device of FIG. 1 disassembled. FIG. 5 is a cross-sectional view showing an example of a cross-section cut along the line I-I' of FIG. 1. FIG. 6 is a cross-sectional view showing a part of the display module of FIG. 4.

[0085] Referring to FIGS. 4 through 6, the electronic device (ED) may include a display module (DM), a support plate (PLT), a first adhesive layer (ADL1), an elastic functional layer (EFL), a second adhesive layer (ADL2), a circuit board (CB), a driving chip (DIC), an electronic component (EC), a third adhesive layer (ADL3), a fourth adhesive layer (ADL4), a fifth adhesive layer (ADL5), an optical functional layer (OFL), a sixth adhesive layer (ADL6), a cover window (WN), and a housing plate (HSP). The display module (DM) may include a display panel (DP) and an encapsulation layer (ENL). A display module (DM), a support plate (PLT), a first adhesive layer (ADL1), an elastic functional layer (EFL), a second adhesive layer (ADL2), a circuit board (CB), a driving chip (DIC), an electronic component (EC), a third adhesive layer (ADL3), a fourth adhesive layer (ADL4), a fifth adhesive layer (ADL5), and an optical functional layer (OFL) can define a display device (DD).

[0086] A display panel (DP) may include a substrate (SUB), a barrier layer (BAR), a buffer layer (BUF), a first insulating layer (IL1), an active layer (ACT), a second insulating layer (IL2), a gate electrode (GE), a third insulating layer (IL3), a source electrode (SE), a drain electrode (DE), a first organic insulating layer (OL1), a first connecting electrode (CNE1), a second organic insulating layer (OL2), a second connecting electrode (CNE2), a third organic insulating layer (OL3), a pixel electrode (PXE), a pixel defining layer (PDL), an emitting layer (EML), and a common electrode (CME). An encapsulation layer (ENL) may include a first encapsulation layer (ENL1), a second encapsulation layer (ENL2), and a third encapsulation layer (ENL3).

[0087] The active layer (ACT), gate electrode (GE), source electrode (SE), and drain electrode (DE) can define a transistor (TR). The pixel electrode (PXE), light-emitting layer (EML), and common electrode (CME) can define a light-emitting device (EE).

[0088] The display module (DM) may be positioned across a first non-folding area (NFA1), a second non-folding area (NFA2), and a foldable area (FA). The display panel (DP) may further include a bending area (BA) adjacent to the non-display area (NDA) and a pad area (PA) adjacent to the bending area (BA). A portion of the display panel (DP) located in the bending area (BA) may be bent toward the lower part of the support plate (PLT). A portion of the display panel (DP) located in the pad area (PA) may extend in a first direction (DR1) and a second direction (DR2) from the lower part of the support plate (PLT).

[0089] A substrate (SUB) can serve as the base of a display panel (DP). The substrate (SUB) can be formed from a transparent or opaque material. The substrate (SUB) can be formed from glass, quartz, plastic, etc. For example, the plastic may include polyimide, polyethylene naphthalate, polyethylene terephthalate, polycarbonate, polyetherimide, polyethersulfone, etc. These may be used alone or in combination with each other.

[0090] A barrier layer (BAR) can be disposed on a substrate (SUB). The barrier layer (BAR) can reduce the moisture permeability of the substrate (SUB) and prevent foreign substances from diffusing into the light-emitting element (EE). The barrier layer (BAR) may include amorphous silicon, silicon oxide, silicon nitride, etc. These may be used alone or in combination with each other.

[0091] In FIG. 6, the substrate (SUB) and the barrier layer (BAR) are each depicted as having a single-layer structure, but embodiments of the present invention are not limited thereto, and the substrate (SUB) and the barrier layer (BAR) may each have a multi-layer structure. Additionally, the substrate (SUB) may have a structure in which a plurality of layers included in the substrate (SUB) and a plurality of layers included in the barrier layer (BAR) are alternately stacked.

[0092] A buffer layer (BUF) can be placed on a barrier layer (BAR). The buffer layer (BUF) can prevent metal atoms or impurities from the substrate (SUB) from diffusing into the active layer (ACT). Additionally, the buffer layer (BUF) can control the heat transfer rate during the crystallization process for forming the active layer (ACT).

[0093] The first insulating layer (IL1) may be disposed on the buffer layer (BUF). The first insulating layer (IL1) may include an inorganic insulating material. The inorganic insulating material is silicon nitride (SiN x ), silicon oxide (SiO x), silicon oxynitride (SiO₂ x N y It may include ) etc. These can be used alone or in combination with each other.

[0094] An active layer (ACT) may be disposed on a first insulating layer (IL1). The active layer (ACT) may include amorphous silicon, polycrystalline silicon, or an oxide semiconductor. The active layer (ACT) may include an impurity-doped source region and a drain region, and a channel region disposed between the source region and the drain region.

[0095] A second insulating layer (IL2) may be disposed on a first insulating layer (IL1). The second insulating layer (IL2) may cover an active layer (ACT) on the first insulating layer (IL1). For example, the second insulating layer (IL2) may have a substantially uniform thickness along the profile of the active layer (ACT). However, the second insulating layer (IL2) according to embodiments of the present invention is not necessarily limited thereto, and the second insulating layer (IL2) may have a substantially flat upper surface that sufficiently covers the active layer (ACT) and does not create a step around the active layer (ACT).

[0096] In one embodiment, the second insulating layer (IL2) may include an inorganic insulating material. The inorganic insulating material may include silicon nitride, silicon oxide, silicon oxynitride, etc. These may be used alone or in combination with each other.

[0097] The gate electrode (GE) may be disposed on the second insulating layer (IL2). The gate electrode (GE) may overlap with the channel region of the active layer (ACT) in a planar manner. The gate electrode (GE) may include a metal, an alloy, a conductive metal oxide, a conductive metal nitride, a transparent conductive material, etc.

[0098] A third insulating layer (IL3) may be disposed on a second insulating layer (IL2). The third insulating layer (IL3) may cover a gate electrode (GE) on the second insulating layer (IL2). For example, the third insulating layer (IL3) may have a substantially uniform thickness along the profile of the gate electrode (GE). However, the third insulating layer (IL3) according to embodiments of the present invention is not necessarily limited thereto, and the third insulating layer (IL3) may have a substantially flat upper surface that sufficiently covers the gate electrode (GE) and does not create a step around the gate electrode (GE).

[0099] In one embodiment, the third insulating layer (IL3) may include an inorganic insulating material. The inorganic insulating material may include silicon nitride, silicon oxide, silicon oxynitride, etc. These may be used alone or in combination with each other.

[0100] The source electrode (SE) and the drain electrode (DE) may be disposed on the third insulating layer (IL3). The source electrode (SE) and the drain electrode (DE) may contact the active layer (ACT) through a contact hole penetrating the second insulating layer (IL2) and the third insulating layer (IL3). For example, the source electrode (SE) may contact the source region of the active layer (ACT), and the drain electrode (DE) may contact the drain region of the active layer (ACT). In one embodiment, the source electrode (SE) and the drain electrode (DE) may each include a metal, an alloy, a conductive metal oxide, a conductive metal nitride, a transparent conductive material, etc.

[0101] The first organic insulating layer (OL1) may be disposed on the third insulating layer (IL3). For example, the first organic insulating layer (OL1) may cover the source electrode (SE) and the drain electrode (DE) on the third insulating layer (IL3). In one embodiment, the first organic insulating layer (OL1) may have a substantially flat upper surface.

[0102] In one embodiment, a hole may be defined in the first organic insulating layer (OL1) such that a portion of the upper surface of the drain electrode (DE) is exposed. However, the first organic insulating layer (OL1) according to the embodiments of the present invention is not necessarily limited thereto, and a hole may be defined in the first organic insulating layer (OL1) such that a portion of the upper surface of the source electrode (SE) is exposed.

[0103] In one embodiment, the first organic insulating layer (OL1) may include an organic insulating material. For example, the organic insulating material may include acrylic resin, epoxy resin, polyimide, polyethylene, etc. These may be used alone or in combination with each other.

[0104] The first connecting electrode (CNE1) may be disposed on the first organic insulating layer (OL1). In one embodiment, the first connecting electrode (CNE1) may be in contact with the drain electrode (DE) through the hole that exposes the upper surface of the drain electrode (DE). In another embodiment, the first connecting electrode (CNE1) may be in contact with the source electrode (SE) through the hole that exposes the upper surface of the source electrode (SE). In one embodiment, the first connecting electrode (CNE1) may include a metal, an alloy, a conductive metal oxide, a conductive metal nitride, a transparent conductive material, etc.

[0105] A second organic insulating layer (OL2) may be disposed on a first organic insulating layer (OL1). For example, the second organic insulating layer (OL2) may cover a first connecting electrode (CNE1) on the first organic insulating layer (OL1). The second organic insulating layer (OL2) may have a substantially flat upper surface. A hole may be defined in the second organic insulating layer (OL2) to expose a portion of the upper surface of the first connecting electrode (CNE1).

[0106] In one embodiment, the second organic insulating layer (OL2) may include an organic insulating material. For example, the organic insulating material may include an acrylic resin, an epoxy resin, a polyimide, polyethylene, etc. These may be used alone or in combination with each other.

[0107] The second connecting electrode (CNE2) may be disposed on the second organic insulating layer (OL2). The second connecting electrode (CNE2) may come into contact with the first connecting electrode (CNE1) through the hole defined in the second organic insulating layer (OL2). The second connecting electrode (CNE2) may include a metal, an alloy, a conductive metal oxide, a conductive metal nitride, a transparent conductive material, etc.

[0108] In one embodiment, the first connecting electrode (CNE1) and the second connecting electrode (CNE2) may physically and / or electrically connect the drain electrode (DE) and the pixel electrode (PXE). However, the first connecting electrode (CNE1) and the second connecting electrode (CNE2) according to embodiments of the present invention are not necessarily limited thereto, and the first connecting electrode (CNE1) and the second connecting electrode (CNE2) may physically and / or electrically connect the source electrode (SE) and the pixel electrode (PXE). Additionally, although the display panel (DP) in FIG. 6 is illustrated as including two connecting electrodes, the display panel (DP) in embodiments of the present invention is not necessarily limited thereto. For example, the display panel (DP) may include one or fewer or three or more connecting electrodes.

[0109] A third organic insulating layer (OL3) may be disposed on a second organic insulating layer (OL2). The third organic insulating layer (OL3) may cover a second connecting electrode (CNE2) on the second organic insulating layer (OL2). In one embodiment, the third organic insulating layer (OL3) may have a substantially flat upper surface. A hole may be defined in the third organic insulating layer (OL3) in which a portion of the upper surface of the second connecting electrode (CNE2) is exposed.

[0110] In one embodiment, the third organic insulating layer (OL3) may include an organic insulating material. For example, the organic insulating material may include an acrylic resin, an epoxy resin, a polyimide, polyethylene, etc. These may be used alone or in combination with each other.

[0111] A pixel electrode (PXE) may be disposed on a third organic insulating layer (OL3). In one embodiment, the pixel electrode (PXE) may contact a second connecting electrode (CNE2) through a hole defined in the third organic insulating layer (OL3). In one embodiment, the pixel electrode (PXE) may comprise a metal, an alloy, a conductive metal oxide, a conductive metal nitride, a transparent conductive material, etc. These may be used alone or in combination with each other. For example, the pixel electrode (PXE) may comprise silver (Ag) and indium tin oxide (ITO).

[0112] A pixel defining film (PDL) may be disposed on a third organic insulating layer (OL3). The pixel defining film (PDL) may partially cover a pixel electrode (PXE). Additionally, a hole may be defined in the pixel defining film (PDL) to expose at least a portion of the pixel electrode (PXE). For example, the hole in the pixel defining film (PDL) may expose the central portion of the pixel electrode (PXE), and the pixel defining film (PDL) may cover the edge of the pixel electrode (PXE). The pixel defining film (PDL) may comprise an organic insulating material such as polyimide.

[0113] In one embodiment, the pixel defining layer (PDL) may further include a light-blocking material. The light-blocking material may include carbon black, carbon nanotubes, a resin or paste containing a black dye, metal particles, etc. The metal particles may include nickel (Ni), aluminum (Al), molybdenum (Mo), chromium (Cr), etc. These may be used alone or in combination with each other. When the pixel defining layer (PDL) includes the light-blocking material, it may reduce external light reflection caused by metal structures (e.g., pixel electrodes (PXE), etc.) disposed below the pixel defining layer (PDL).

[0114] The light-emitting layer (EML) may be disposed on the pixel electrode (PXE). For example, the light-emitting layer (EML) may be disposed on the pixel electrode (PXE) exposed by the hole of the pixel defining film (PDL). The light-emitting layer (EML) may include an organic light-emitting material. The organic light-emitting material may include a low-molecular-weight organic compound or a high-molecular-weight organic compound. However, the present invention is not limited thereto, and the light-emitting layer (EML) may include materials such as quantum dots.

[0115] A common electrode (CME) may be disposed on an emitting layer (EML). For example, the common electrode (CME) may cover the emitting layer (EML) and the pixel defining film (PDL). In one embodiment, the common electrode (CME) may include a metal, an alloy, a conductive metal oxide, a conductive metal nitride, a transparent conductive material, etc. For example, the common electrode (CME) may include aluminum, platinum (Pt), silver, magnesium (Mg), gold (Au), chromium, tungsten (W), titanium (Ti), etc. These may be used alone or in combination with each other.

[0116] The first encapsulation layer (ENL1) may be disposed on the common electrode (CME). The first encapsulation layer (ENL1) may cover the light-emitting element (EE). The first encapsulation layer (ENL1) may have a substantially uniform thickness along the profile of the common electrode (CME). The first encapsulation layer (ENL1) may comprise an inorganic insulating material. For example, the inorganic insulating material may include silicon nitride, silicon oxide, silicon oxynitride, etc. These may be used alone or in combination with each other.

[0117] A second encapsulation layer (ENL2) may be disposed on a first encapsulation layer (ENL1). The second encapsulation layer (ENL2) may have a substantially flat upper surface without creating a step around the first encapsulation layer (ENL1). The second encapsulation layer (ENL2) may include an organic insulating material. For example, the organic insulating material may include acrylic resin, epoxy resin, polyimide, polyethylene, etc. These may be used alone or in combination with each other.

[0118] A third encapsulation layer (ENL3) may be disposed on the second encapsulation layer (ENL2). The third encapsulation layer (ENL3) may have a substantially uniform thickness and a substantially flat upper surface. The third encapsulation layer (ENL3) may include an inorganic insulating material. For example, the inorganic insulating material may include silicon nitride, silicon oxide, silicon oxynitride, etc. These may be used alone or in combination with each other. The encapsulation layer (ENL) may seal the display area (DA) to protect the light-emitting element (EE) from external impurities.

[0119] In one embodiment, the encapsulation layer (ENL) comprising a first encapsulation layer (ENL1), a second encapsulation layer (ENL2), and a third encapsulation layer (ENL3) may be a thin film encapsulation layer. However, the structure of the encapsulation layer (ENL) according to the embodiments of the present invention is not necessarily limited thereto, and the encapsulation layer (ENL) may be a single-layer structure and the encapsulation layer (ENL) may be a glass substrate.

[0120] A support plate (PLT) may be positioned below a display panel (DP). For example, the support plate (PLT) may be positioned across a first non-folding area (NFA1), a second non-folding area (NFA2), and a foldable area (FA) below the display panel (DP). The support plate (PLT) may support the display panel (DP) to supplement the rigidity of the electronic device (ED). In one embodiment, the support plate (PLT) may include a metallic material. For example, the metallic material may include stainless steel (SUS), aluminum, etc. These may be used alone or in combination with each other.

[0121] In one embodiment, the support plate (PLT) may include a polymer material. For example, the polymer material may include polymethylmethacrylate (PMMA), polycarbonate (PC), polyvinyl alcohol (PVA), acrylonitrile-butadiene-styrene (ABS), polyethylene terephthalate (PET), glass fiber reinforced plastic (GFRP), carbon fiber reinforced plastic (CFRP), etc. These may be used alone or in combination with each other.

[0122] The support plate (PLT) may include a first flat portion (FLP1), a second flat portion (FLP2), and an elongation portion (ELP). The first flat portion (FLP1) may be placed in a first non-folding area (NFA1), and the second flat portion (FLP2) may be placed in a second non-folding area (NFA2). The elongation portion (ELP) may be placed in a foldable area (FA). In this specification, the first flat portion (FLP1) and the second flat portion (FLP2) may be referred to as flat portions. In one embodiment, the thickness of the support plate (PLT) may be about 0.1 mm to about 0.25 mm.

[0123] A plurality of lattice holes (LH) penetrating the support plate (PLT) in the thickness direction (e.g., the third direction (DR3)) may be defined in the expandable portion (ELP). The expandable portion (ELP) may be folded through the plurality of lattice holes (LH). In one embodiment, the plurality of lattice holes (LH) may be repeatedly arranged in a specific pattern in the first direction (DR1) and the second direction (DR2) within the foldable area (FA). The expandable portion (ELP) may have a repeating lattice pattern having a specific rule by the arrangement of the plurality of lattice holes (LH). However, the expandable portion (ELP) according to the embodiments of the present invention is not necessarily limited thereto, and a plurality of lattice holes (LH) may not be defined in the expandable portion (ELP).

[0124] An elastic functional layer (EFL) may be disposed on the underside of a support plate (PLT). For example, the elastic functional layer (EFL) may be disposed across a first non-folding area (NFA1), a second non-folding area (NFA2), and a foldable area (FA) on the underside of the support plate (PLT). In one embodiment, the elastic functional layer (EFL) may overlap in a plane with the entire stretchable portion (ELP). For example, the elastic functional layer (EFL) may overlap in a plane with the entire plurality of lattice holes (LH).

[0125] In one embodiment, the width of the elastic functional layer (EFL) (e.g., length in the first direction (DR1)) may be constant as it extends from the first non-folding region (NFA1) or the second non-folding region (NFA2) toward the center of the foldable region (FA). Specifically, the length in the first direction (DR1) of the portion of the elastic functional layer (EFL) located in the foldable region (FA) may be substantially the same as the length in the first direction (DR1) of the portion of the elastic functional layer (EFL) located in the first non-folding region (NFA1) or the second non-folding region (NFA2). In one embodiment, the elastic functional layer (EFL) may have a rectangular planar shape. However, the planar shape of the elastic functional layer (EFL) according to the embodiments of the present invention is not necessarily limited thereto.

[0126] In one embodiment, while the electronic device (ED) repeatedly performs folding and unfolding, the elastic functional layer (EFL) can prevent foreign substances from penetrating into the stretchable portion (ELP). Additionally, while the electronic device (ED) repeatedly performs folding and unfolding, the elastic functional layer (EFL) can repeatedly stretch and contract so that the stretchable portion (ELP) is not exposed.

[0127] In one embodiment, the elastic functional layer (EFL) can perform a heat dissipation function for heat emitted from the circuit board (CB) and the electronic component (EC), respectively. Specifically, the elastic functional layer (EFL) can evenly distribute the heat emitted from the circuit board (CB) and the electronic component (EC), respectively, in a first direction (DR1) and a second direction (DR2).

[0128] In one embodiment, the elastic functional layer (EFL) may include an elastic material having a relatively large elastic force or a relatively large resilience and a thermally conductive material. For example, the elastic material may include silicon (Si), polyurethane (PU), thermoplastic polyurethane (TPU), polydimethylacrylamide (PDMA), etc. These may be used alone or in combination with each other. Additionally, the thermally conductive material may include graphite powder, graphene, carbon fiber, carbon nanotube, boron nitride (BN), etc. These may be used alone or in combination with each other.

[0129] In one embodiment, the weight ratio of the thermally conductive material included in the elastic functional layer (EFL) may be about 50 wt% or less. Preferably, the weight ratio of the thermally conductive material included in the elastic functional layer (EFL) may be about 10 wt% or more and about 50 wt% or less. If the weight ratio of the thermally conductive material exceeds 50 wt%, the elastic functional layer (EFL) may not be easily stretched or shrunk.

[0130] In one embodiment, the thermal conductivity of the elastic functional layer (EFL) may be about 5 W / (m·K) to about 40 W / (m·K). Preferably, the thermal conductivity of the elastic functional layer (EFL) may be about 5 W / (m·K) to about 30 W / (m·K). More preferably, the thermal conductivity of the elastic functional layer (EFL) may be about 6 W / (m·K) to about 20 W / (m·K).

[0131] In one embodiment, the thickness of the elastic functional layer (EFL) may be about 10 μm to about 300 μm. Preferably, the thickness of the elastic functional layer (EFL) may be about 150 μm to about 250 μm. More preferably, the thickness of the elastic functional layer (EFL) may be about 160 μm to about 200 μm.

[0132] The first adhesive layer (ADL1) may be disposed between the support plate (PLT) and the elastic functional layer (EFL) in cross-section. The first adhesive layer (ADL1) may bond the support plate (PLT) and the elastic functional layer (EFL) together. In one embodiment, the first adhesive layer (ADL1) may be a pressure-sensitive adhesive (PSA), PET tape, etc.

[0133] In one embodiment, the first adhesive layer (ADL1) may be disposed across the first non-folding region (NFA1), the second non-folding region (NFA2), and the foldable region (FA). However, the placement and type of the first adhesive layer (ADL1) according to the embodiments of the present invention are not necessarily limited thereto. For example, the first adhesive layer (ADL1) may be disposed only in the first non-folding region (NFA1) and the second non-folding region (NFA2) to bond the support plate (PLT) and the elastic functional layer (EFL) together.

[0134] A circuit board (CB) may be placed below an elastic functional layer (EFL). For example, the circuit board (CB) may be placed in a pad area (PA) on a display panel (DP). Specifically, the circuit board (CB) may be placed on a portion of the display panel (DP) that is bent and extends to the lower part of the elastic functional layer (EFL). In one embodiment, the circuit board (CB) may be a printed circuit board (PCB).

[0135] A circuit board (CB) may overlap in a plane with a portion of a display panel (DP) located in a pad area (PA). The circuit board (CB) may be electrically connected to the display panel (DP). For example, the circuit board (CB) and the display panel (DP) may be electrically connected to each other through pad electrodes that overlap in a plane simultaneously with the circuit board (CB) and the display panel (DP). In one embodiment, the circuit board (CB) may be placed in a second non-folding area (NFA2). However, the placement of the circuit board (CB) according to embodiments of the present invention is not necessarily limited thereto.

[0136] The driver chip (DIC) may be located in the bending area (BA). For example, the driver chip (DIC) may be placed on the display panel (DP) in the bending area (BA). Specifically, the driver chip (DIC) may have a chip-on-panel (COP) structure mounted on the display panel (DP). However, the mounting structure of the driver chip (DIC) according to the embodiments of the present invention is exemplary and is not necessarily limited thereto.

[0137] At least a portion of the display panel driver for driving the display panel (DP) may be formed as a driver chip (DIC) in the form of a chip. In one embodiment, the driver chip (DIC) may include a data driver (DDV) of FIG. 3. In one embodiment, the driver chip (DIC) may include a data driver (DDV) and a gamma reference voltage generator (GMV) of FIG. 3. In one embodiment, the driver chip (DIC) may include a driver control unit (CON), a data driver (DDV), and a gamma reference voltage generator (GMV) of FIG. 3. However, the driver chip (DIC) according to the embodiments of the present invention is not necessarily limited thereto.

[0138] The electronic component (EC) may be placed below the elastic functional layer (EFL). For example, the electronic component (EC) may be placed in the first non-folding region (NFA1) below the elastic functional layer (EFL). The electronic component (EC) may include a battery module for supplying power to an electronic device (ED). However, the placement and type of the electronic component (EC) according to the embodiments of the present invention are not necessarily limited thereto.

[0139] The second adhesive layer (ADL2) may be disposed between the elastic functional layer (EFL), the circuit board (CB), and the electronic component (EC) in a cross-sectional view. The second adhesive layer (ADL2) may bond the elastic functional layer (EFL), the circuit board (CB), and the electronic component (EC) to each other. In one embodiment, the second adhesive layer (ADL2) may be a pressure-sensitive adhesive (PSA), PET tape, etc. However, the bonding relationship between the circuit board (CB) and the electronic component (EC) according to the embodiments of the present invention is not necessarily limited thereto, and the adhesive layer to which the circuit board (CB) and the elastic functional layer (EFL) are bonded and the adhesive layer to which the electronic component (EC) is bonded may be separated from each other in a planar view as separate configurations.

[0140] In one embodiment, the second adhesive layer (ADL2) may be disposed across the first non-folding region (NFA1), the second non-folding region (NFA2), and the foldable region (FA). However, the arrangement and type of the second adhesive layer (ADL2) according to the embodiments of the present invention are not necessarily limited thereto. In one embodiment, the thermal conductivity of the first adhesive layer (ADL1) may be lower than the thermal conductivity of the second adhesive layer (ADL2). This will be explained later with reference to FIG. 10.

[0141] The third adhesive layer (ADL3) may be placed in the first non-folding area (NFA1). The third adhesive layer (ADL3) may be placed between the support plate (PLT) and the display panel (DP) in cross-section. The third adhesive layer (ADL3) may bond the support plate (PLT) and the display panel (DP) together. In one embodiment, the third adhesive layer (ADL3) may be a pressure-sensitive adhesive (PSA), PET tape, etc. However, the placement and type of the third adhesive layer (ADL3) according to the embodiments of the present invention are not necessarily limited thereto.

[0142] The fourth adhesive layer (ADL4) may be placed in the second non-folding area (NFA2). The fourth adhesive layer (ADL4) may be placed between the support plate (PLT) and the display panel (DP) in cross-section. The fourth adhesive layer (ADL4) may bond the support plate (PLT) and the display panel (DP) together. In one embodiment, the fourth adhesive layer (ADL4) may be a pressure-sensitive adhesive (PSA), PET tape, etc. However, the placement and type of the fourth adhesive layer (ADL4) according to the embodiments of the present invention are not necessarily limited thereto.

[0143] In one embodiment, the third adhesive layer (ADL3) and the fourth adhesive layer (ADL4) may be formed integrally. However, the relationship between the third adhesive layer (ADL3) and the fourth adhesive layer (ADL4) according to the embodiments of the present invention is not necessarily limited thereto.

[0144] The optical functional layer (OFL) may be disposed on the encapsulation layer (ENL). For example, the optical functional layer (OFL) may be disposed across a first non-folding region (NFA1), a second non-folding region (NFA2), and a foldable region (FA) on the encapsulation layer (ENL).

[0145] The optical functional layer (OFL) can control external light incident on the display panel (DP). In one embodiment, the optical functional layer (OFL) may be a polarizing layer. The polarizing layer may be stretched in one direction. The direction in which the polarizing layer is stretched may be an absorption axis that absorbs light, and the direction perpendicular to the direction of absorption may be a transmission axis that transmits light. However, the optical functional layer (OFL) according to the embodiments of the present invention is not limited to a polarizing layer, and the electronic device (ED) may have a structure that does not include a polarizing layer. If the electronic device (ED) does not include a polarizing layer, the optical functional layer (OFL) may be a color filter, etc.

[0146] The fifth adhesive layer (ADL5) may be disposed across the first non-folding region (NFA1), the second non-folding region (NFA2), and the foldable region (FA). The fifth adhesive layer (ADL5) may be disposed between the encapsulation layer (ENL) and the optical functional layer (OFL) on one side. The fifth adhesive layer (ADL5) may bond the encapsulation layer (ENL) and the optical functional layer (OFL) together. In one embodiment, the fifth adhesive layer (ADL5) may be a pressure-sensitive adhesive (PSA), PET tape, optical clear resin (OCR), optical clear adhesive (OCA), etc.

[0147] A cover window (WN) may be placed on an optical functional layer (OFL). For example, the cover window (WN) may be placed across a first non-folding area (NFA1), a second non-folding area (NFA2), and a foldable area (FA) on the optical functional layer (OFL). The cover window (WN) may serve to protect the screen of an electronic device (ED).

[0148] In one embodiment, the cover window (WN) may be ultra-thin glass. For example, the cover window (WN) may include soda-lime glass, alkali aluminosilicate glass, borosilicate glass, lithium alumina-silicate glass, etc. These may be used alone or in combination with each other. However, the cover window (WN) of the present invention is not limited thereto and may include various materials such as plastic.

[0149] The sixth adhesive layer (ADL6) may be disposed across the first non-folding region (NFA1), the second non-folding region (NFA2), and the foldable region (FA). The sixth adhesive layer (ADL6) may be disposed between the optical functional layer (OFL) and the cover window (WN) on one side. The sixth adhesive layer (ADL6) may bond the optical functional layer (OFL) and the cover window (WN) together. In one embodiment, the sixth adhesive layer (ADL6) may be a pressure-sensitive adhesive (PSA), PET tape, optical clear resin (OCR), optical clear adhesive (OCA), etc.

[0150] The housing plate (HSP) can accommodate at least a portion of the display device (DD). For example, the housing plate (HSP) can provide space for accommodating a circuit board (CB), electronic components (EC), an elastic functional layer (EFL), a support plate (PLT), and a display panel (DP). However, the accommodating range of the housing plate (HSP) according to the embodiments of the present invention is not necessarily limited thereto.

[0151] The housing plate (HSP) may include a first housing (HS1), a second housing (HS2), a hinge portion (HG), a hinge cover (HGC), and a bridge structure (BRG). The first housing (HS1) may provide a space for receiving a circuit board (CB). The first housing (HS1) may be positioned corresponding to a first non-folding area (NFA1). The second housing (HS2) may provide a space for receiving an electronic component (EC). The second housing (HS2) may be positioned corresponding to a second non-folding area (NFA2). In this specification, the first housing (HS1) and the second housing (HS2) may be referred to as housings.

[0152] In one embodiment, the hinge portion (HG) may be positioned corresponding to the foldable area (FA). Specifically, the hinge portion (HG) may be located at the center portion of each of the two sides parallel to the first direction (DR1) of the housing plate (HSP). While the electronic device (ED) repeatedly performs folding and unfolding, the hinge portion (HG) may rotate and / or move. The hinge portion (HG) may protrude inward from the side parallel to the second direction (DR2) of the housing plate (HSP).

[0153] The hinge cover (HGC) can cover the surface facing the outside of the hinge portion (HG). The hinge cover (HGC) can be positioned between the first housing (HS1) and the second housing (HS2). For example, the hinge cover (HGC) can cover the hinge portion (HG) between the first housing (HS1) and the second housing (HS2). In one embodiment, the hinge cover (HGC) may have a curved surface.

[0154] The bridge structure (BRG) can be connected to the hinge portion (HG). For example, the bridge structure (BRG) can define a hinge assembly that is combined with the hinge portion (HG) to assist the housing plate (HSP) in performing folding or unfolding operations. The bridge structure (BRG) can extend along a first direction (DR1). Specifically, the bridge structure (BRG) can connect two hinge portions located on both sides parallel to the first direction (DR1) of the housing plate (HSP). In one embodiment, after the hinge portion (HG) and the bridge structure (BRG) are connected to each other, they can be connected to the first and second housings (HS1, HS2), respectively.

[0155] In one embodiment, the housing plate (HSP) may overlap with the elastic functional layer (EFL) in a plane. In one embodiment, the elastic functional layer (EFL) may overlap with the entire hinge portion (HG) in a plane. For example, the elastic functional layer (EFL) may overlap with each of the hinge portions located at the center portion of each of the two sides parallel to the first direction (DR1) of the housing plate (HSP) in a plane.

[0156] The structure of the electronic device (ED) according to the embodiments of the present invention is not necessarily limited thereto, and a light control film and a light-blocking member for controlling the viewing angle may be further disposed between the optical functional layer (OFL) and the cover window (WN), or a touch panel for detecting a user's touch may be further disposed between the encapsulation layer (ENL) and the optical functional layer (OFL).

[0157] Figure 7 is a cross-sectional view showing another example of a cross-section cut along the line I-I' of Figure 1.

[0158] The structure of the electronic device (ED) described with reference to FIG. 7 may be substantially identical or similar to the structure of the electronic device (ED) described with reference to FIG. 6, except that it further includes a flexible circuit film (FF). In the following, content that overlaps with the content described with reference to FIG. 6 may be omitted or briefly explained.

[0159] Referring to FIGS. 6 and 7, the electronic device (ED) may further include a flexible circuit film (FF). The substrate (SUB) included in the display panel (DP) may be a rigid substrate that is not bent in the bending area (BA). In one embodiment, the flexible circuit film (FF) may be a flexible printed circuit board (FPCB).

[0160] The flexible circuit film (FF) can electrically connect the display panel (DP) and the circuit board (CB) to each other. In one embodiment, the flexible circuit film (FF) can be bent from a second non-folding area (NFA2) toward the lower part of the support plate (PLT). The area where the flexible circuit film (FF) overlaps with the circuit board (CB) can be defined as a pad area (PA).

[0161] The driving chip (DIC) may be placed on a flexible circuit film (FF). The driving chip (DIC) may be electrically connected to the flexible circuit film (FF). In other words, the driving chip (DIC) may have a COF (chip on film) structure. However, the mounting structure of the driving chip (DIC) according to the embodiments of the present invention is exemplary and is not necessarily limited thereto.

[0162] FIG. 8 is a cross-sectional view showing a part of the housing plate of FIG. 4. FIG. 9 is a cross-sectional view showing the folded state of the housing plate of FIG. 8. For example, FIG. 8 may be a cross-sectional view showing the housing plate (HSP) in an unfolded (e.g., unfolded) state.

[0163] Referring to FIGS. 8 and 9, the housing plate (HSP) may include a guide projection (GPJ), a first rotation plate (RP1), a second rotation plate (RP2), and a rotation support plate (SP). In one embodiment, the guide projection (GPJ) may serve as the rotation axis of the first rotation plate (RP1). For example, the guide projection (GPJ) may extend along the opposite direction of the second direction (DR2), so that the rotation axis is parallel to the second direction (DR2). In one embodiment, the guide projection (GPJ) may be coupled with a hinge portion (HG).

[0164] In one embodiment, a first rotating plate (RP1) may be disposed in each of a first non-folding area (NFA1) and a second non-folding area (NFA2). In one embodiment, a guide groove (GDH) may be defined in the first rotating plate (RP1). The guide groove (GDH) may be a space for receiving a guide projection (GPJ). Accordingly, the guide projection (GPJ) can connect the first rotating plate (RP1) and the hinge portion (HG) through the guide groove (GDH).

[0165] In one embodiment, a second rotating plate (RP2) may be disposed in each of the first non-folding area (NFA1) and the second non-folding area (NFA2). In one embodiment, the second rotating plate (RP2) may be coupled to the first rotating plate (RP1). Specifically, as the electronic device (ED) is folded, when the first rotating plate (RP1) rotates with the guide projection (GDJ) as the rotation axis, the second rotating plate (RP2) may also rotate with the part coupled to the first rotating plate (RP1) as the rotation axis.

[0166] A rotating support plate (SP) may be placed in each of the first non-folding area (NFA1) and the second non-folding area (NFA2). For example, the rotating support plate (SP) placed in the first non-folding area (NFA1) can connect the second rotating plate (RP2) placed in the first non-folding area (NFA1) with the first housing (HS1). Additionally, the rotating support plate (SP) placed in the second non-folding area (NFA2) can connect the second rotating plate (RP2) placed in the second non-folding area (NFA2) with the second housing (HS2). Accordingly, as the electronic device (ED) is folded, the housing plate (HSP) can also perform a folding operation.

[0167] When the electronic device (ED) is fully unfolded, the first housing (HS1) and the second housing (HS2) may cover a portion of the surface facing the outside of the hinge cover (HGC). When the electronic device (ED) is fully folded, the hinge cover (HGC) may be spaced apart from each of the first housing (HS1) and the second housing (HS2). However, the arrangement relationship of the first housing (HS1), the second housing (HS2), and the hinge cover (HGC) according to the operation of the electronic device (ED) according to embodiments of the present invention is not necessarily limited thereto.

[0168] Figure 10 is a diagram illustrating the heat dissipation effect of the electronic device of Figure 1.

[0169] Referring to FIGS. 1, FIGS. 3 and FIGS. 10, while the display module (DM) is in operation, heat generated from the circuit board (CB) and the electronic component (EC), respectively, can spread toward the display module (DM) according to the temperature gradient. If heat generated from the circuit board (CB) and the electronic component (EC), respectively, is continuously released to the display module (DM), the performance of the display module (DM) may be degraded.

[0170] As described above, the thermal conductivity of the first adhesive layer (ADL1) may be lower than the thermal conductivity of the second adhesive layer (ADL2). Accordingly, heat emitted from the circuit board (CB) and the electronic component (EC), respectively, can pass through the second adhesive layer (ADL2), which has a relatively higher thermal conductivity, and reach the elastic functional layer (EFL).

[0171] Heat reaching the elastic functional layer (EFL) can easily diffuse in a planar direction parallel to the elastic functional layer (EFL), and can also diffuse in the thickness direction of the elastic functional layer (EFL) to reach the first adhesive layer (ADL1). Heat reaching the first adhesive layer (ADL1) cannot easily pass through the first adhesive layer (ADL1), which has a relatively low thermal conductivity, and can reduce the transfer of heat toward the display module (DM).

[0172] Accordingly, heat can be diffused to the maximum extent using the elastic functional layer (EFL), and heat transferred to the display module (DM) through the first adhesive layer (ADL1) can be reduced, thereby enabling a heat dissipation effect within the electronic device (ED). Therefore, since the performance of the display module (DM) (e.g., display panel (DP)) is not degraded, the display quality of the display device (DD) included in the electronic device (ED) can be improved. In addition, the thermal durability of the electronic device (ED) can be improved. That is, an electronic device (ED) with improved heat dissipation efficiency can be provided.

[0173] FIG. 11 is an exploded perspective view showing a conventional electronic device disassembled. FIG. 12 is a cross-sectional view showing a cross section cut along the line II-II' of FIG. 11.

[0174] The structure of the conventional electronic device (ED') described with reference to FIGS. 11 and 12 may be substantially identical or similar to the electronic device (ED) described with reference to FIGS. 4 and 5, except that it further includes an elastic member (EM) and a graphite sheet layer (GPL). In the following, content that overlaps with the content described with reference to FIGS. 4 and 5 may be omitted or briefly described.

[0175] Referring to FIGS. 11 and 12, a conventional electronic device (ED') comprises an elastic member (EM) and a graphite sheet layer (GPL) disposed below a support plate (PLT). The elastic member (EM) is a member having a relatively large elastic force or a relatively large restoring force to enable folding and unfolding of the electronic device (ED'). The elastic member (EM) comprises thermoplastic polyurethane (TPU).

[0176] The graphite sheet layer (GPL) is a sheet for implementing a heat dissipation function of an electronic device (ED'). The graphite sheet layer (GPL) is bonded to an elastic member (EM) through a second-1 adhesive layer (ADL2-1). The graphite sheet layer (GPL) is bonded to a circuit board (CB) and an electronic component (EC), respectively, through a second-2 adhesive layer (ADL2-2).

[0177] The graphite sheet layer (GPL) included in the conventional electronic device (ED') does not overlap with the hinge portion (HG) in a plane. In one embodiment, the graphite sheet layer (GPL) may have a width (e.g., length in the first direction (DR1)) that decreases as it goes from the first non-folding region (NFA1) or the second non-folding region (NFA2) toward the center of the foldable region (FA). For example, the graphite sheet layer (GPL) may have a planar shape that is chamfered in the foldable region (FA) and has a width smaller than that of the first non-folding region (NFA1) or the second non-folding region (NFA2). Specifically, the length of the graphite sheet layer (GPL) in the first direction (DR1) from the foldable region (FA) may be smaller than the length of the graphite sheet layer (GPL) in the first direction (DR1) from the first non-folding region (NFA1) or the second non-folding region (NFA2). The elastic member (EM) and the graphite sheet layer (GPL) may correspond to the elastic functional layer (EFL) of FIG. 4.

[0178] FIG. 13 is a plan view showing a comparison between the electronic device of FIG. 1 and the conventional electronic device of FIG. 11. For example, FIG. 13(a) is a plan view to explain the planar overlap relationship between the housing plate (HSP) of FIG. 5 and the elastic functional layer (EFL) included in the electronic device (ED) of FIG. 1, and FIG. 13(b) is a plan view to explain the planar overlap relationship between the housing plate (HSP), the graphite sheet layer (GPL), and the elastic member (EM) included in the conventional electronic device of FIG. 11.

[0179] Referring to FIGS. 1, 11, and 13, an elastic functional layer (EFL) included in an electronic device (ED) according to one embodiment of the present invention may overlap the entire hinge portion (HG) on a plane. For example, the elastic functional layer (EFL) may cover the hinge portion (HG) together with a second adhesive layer (ADL2). In contrast, a graphite sheet layer (GPL) included in a conventional electronic device (ED') is chamfered in the foldable region (FA) and does not overlap the hinge portion (HG) on a plane.

[0180] Accordingly, in an electronic device (ED) according to one embodiment of the present invention, since the elastic functional layer (EFL) overlaps with the hinge portion (HG) on a plane, an additional process may not be required during the manufacturing process of the elastic functional layer (EFL) to ensure that the shape of the graphite sheet layer (GPL) included in the conventional display device (ED') does not overlap with the hinge portion (HG). Accordingly, the time and cost in the manufacturing process of the display device (DD) and the electronic device (ED) of FIG. 3 may be reduced.

[0181] In addition, unlike conventional electronic devices (ED') that implement heat dissipation and elastic functions using two layers, an elastic member (EM) and a graphite sheet layer (GPL), the heat dissipation and elastic functions are performed simultaneously with a single layer, an elastic functional layer (EFL), so the time and cost in the manufacturing process can be further reduced compared to conventional electronic devices (ED'). In addition, it is possible to easily manufacture an electronic device (ED) with a thickness thinner than that of conventional electronic devices (ED').

[0182] FIG. 14 is a perspective view showing an electronic device according to another embodiment of the present invention. FIG. 15 is a perspective view showing the electronic device of FIG. 14 in an expanded state. For example, FIG. 14 is a perspective view showing the electronic device (EDa) according to another embodiment of the present invention in a state prior to expansion.

[0183] Referring to FIGS. 14 and 15, an electronic device (EDa) according to another embodiment of the present invention may include a display area (DA) and a non-display area (NDA). Additionally, the electronic device (EDa) may include an extension (EXP). The display area (DA) is defined as an area for displaying an image, and the non-display area (NDA) may be defined as an area for not displaying an image. The non-display area (NDA) may surround at least a portion of the display area (DA). In one embodiment, the electronic device (EDa) may be a stretchable electronic device.

[0184] The electronic device (EDa) can be extended through the extension part (EXP). For example, when a user pulls the extension part (EXP) or presses a button to move the extension part (EXP), the electronic device (EDa) can be extended along the first direction (DR1). However, the method of operation of the extension part (EXP) according to the embodiments of the present invention is not necessarily limited thereto.

[0185] An extended portion of the electronic device (EDa) may define an extended area (EA). The first extended area (EA) may correspond to a display area (DA). For example, an image may be displayed in the first extended area (EA). The second extended area (EA2) may correspond to a non-display area (NDA). For example, an image may not be displayed in the second extended area (EA2).

[0186] FIG. 16 is a cross-sectional view showing a cross-section of the electronic device of FIG. 14. FIG. 17 is a cross-sectional view showing a cross-section of the electronic device of FIG. 14 in an expanded state. For example, FIG. 16 is a perspective view showing the state of the electronic device (EDa) before it is expanded.

[0187] The electronic device (EDa) described with reference to FIGS. 16 and 17 may be substantially identical or similar to the electronic device (ED) described with reference to FIG. 5, except for the structure of the housing plate (HSPa). In the following, content that overlaps with the content described with reference to FIG. 5 may be omitted or briefly described.

[0188] Referring to FIGS. 16 and 17, the electronic device (EDa) may include a display device (DDa) and a housing plate (HSPa) that accommodates at least a portion of the display device (DDa). The housing plate (HSPa) may include a first roller part (RLP1), a second roller part (RLP2), a first support part (SP1), and a second support part (SP2). The first roller part (RLP1) and the second roller part (RLP2) may rotate to expand the electronic device (EDa). For example, the first roller part (RLP1) and the second roller part (RLP2) may rotate so that the first support part (SP1) and the second support part (SP2) connected to each may move away from each other in a plane. Accordingly, the components of the electronic device (EDa) located in the expansion area (EA) may extend in the expanded direction.

[0189] In one embodiment, the support plate (PLT) is bonded through an elastic functional layer (EFL) and a first adhesive layer (ADL1), and the elastic functional layer (EFL) can be bonded to a circuit board (CB) and an electronic component (EC), respectively, through a second adhesive layer (ADL2). In one embodiment, the thermal conductivity of the first adhesive layer (ADL1) may be lower than the thermal conductivity of the second adhesive layer (ADL2). In one embodiment, the width of the elastic functional layer (EFL) (e.g., width in the first direction (DR1) or the second direction (DR2) of FIG. 14) may be constant as it moves from the non-display area (NDA) toward the center of the display area (DA).

[0190] However, although the structure in which the driving chip (DIC) of FIG. 5 is mounted is not illustrated in FIG. 16 and FIG. 17, the structure in which the driving chip is mounted on a display panel included in the display module (DM) of the electronic device (EDa) may be substantially identical or similar to the structure of the electronic device (ED) of FIG. 5 or FIG. 6.

[0191] As described above, in the electronic device (EDa) of the embodiments of the present invention, the thermal conductivity of the first adhesive layer (ADL1) that bonds the support plate (PTL) and the elastic functional layer (EFL) together may be lower than the thermal conductivity of the second adhesive layer (ADL2) that bonds the elastic functional layer (EFL) to the circuit board (CB) and the electronic component (EC). Accordingly, the heat emitted from the circuit board (CB) and the electronic component (EC), respectively, and transferred to the display panel (DP) can be effectively reduced. Thus, an electronic device (EDa) with improved heat dissipation efficiency and improved display quality can be provided.

[0192] FIG. 18 is a block diagram showing the electronic device of FIG. 1 and FIG. 14.

[0193] Referring to FIG. 18, the electronic device (1000) may include a processor (1010), a memory device (1020), a storage device (1030), an input / output device (1040), a power supply (1050), and a display device (1060). The electronic device (1000) may be the electronic device (ED, EDa) of FIG. 1 and FIG. 14. If the electronic device (1000) includes a display device (1060), the display device (1060) may be the display device (DD, DDa) of FIG. 4 and FIG. 16. Additionally, the electronic device (1000) may further include multiple ports capable of communicating with a video card, sound card, memory card, USB device, etc., or communicating with other systems.

[0194] In one embodiment, the electronic device (1000) may be implemented as a smartphone. However, the types of the electronic device (1000) according to the embodiments of the present invention are exemplary, and the types of the electronic device (1000) are not necessarily limited thereto. For example, the electronic device (1000) may be implemented as a mobile phone, video phone, smart pad, smart watch, tablet PC, vehicle navigation system, computer monitor, laptop, head-mounted display device, etc. In addition, the electronic device (1000) may be various types of flexible electronic devices in addition to the aforementioned foldable electronic device and stretchable electronic device.

[0195] In one embodiment, the processor (1010) may be a microprocessor, a central processing unit, an application processor, etc. The processor (1010) may be connected to other components via an address bus, a control bus, a data bus, etc. According to an embodiment, the processor (1010) may also be connected to an expansion bus such as a Peripheral Component Interconnect (PCI) bus.

[0196] In one embodiment, the processor (1010) can output the input image data (IMG) and the input control signal (CONT) to the drive control unit (200) of FIG. 1.

[0197] In one embodiment, the memory device (1020) can store data necessary for the operation of the electronic device (1000). For example, the memory device (1020) may include non-volatile memory devices such as an Erasable Programmable Read-Only Memory (EPROM) device, an Electrically Erasable Programmable Read-Only Memory (EEEPROM) device, a flash memory device, a Phase Change Random Access Memory (PRAM) device, a Resistance Random Access Memory (RRAM) device, a Nano Floating Gate Memory (NFGM) device, a Polymer Random Access Memory (PoRAM) device, a Magnetic Random Access Memory (MRAM) device, a Ferroelectric Random Access Memory (FRAM) device, and / or volatile memory devices such as a Dynamic Random Access Memory (DRAM) device, a Static Random Access Memory (SRAM) device, a mobile DRAM device, etc.

[0198] In one embodiment, the storage device (1030) may include a solid state drive (SSD), a hard disk drive (HDD), a CD-ROM, etc.

[0199] In one embodiment, the input / output device (1040) may include input means such as a keyboard, keypad, touchpad, touchscreen, mouse, etc. and output means such as a speaker, printer, etc.

[0200] In one embodiment, the display device (1060) may be included in the input / output device (1040). However, the relationship between the input / output device (1040) and the display device (1060) according to embodiments of the present invention is not necessarily limited thereto. In one embodiment, the power supply (1050) may supply power required for the operation of the electronic device (1000). In one embodiment, the display device (1060) may be connected to other components through the buses or other communication links.

[0201] The present invention may be applied to display devices and electronic devices including the same. For example, the present invention may be applied to high-resolution smartphones, mobile phones, smartpads, smartwatches, tablet PCs, vehicle navigation systems, televisions, computer monitors, laptops, etc.

[0202] Although the present invention has been described above with reference to exemplary embodiments, those skilled in the art will understand that various modifications and changes can be made to the invention without departing from the spirit and scope of the invention as set forth in the following claims.

Claims

1. An elastic functional layer comprising an elastic material and a thermally conductive material; A support plate disposed on the above elastic functional layer; A display panel disposed on the above support plate and comprising a plurality of pixels; A circuit board disposed below the elastic functional layer and electrically connected to the display panel; A first adhesive layer disposed between the display panel and the support plate in cross-section to bond the display panel and the support plate together; and A display device comprising a second adhesive layer disposed between the elastic functional layer and the circuit board in cross-section to bond the elastic functional layer and the circuit board together, and having a thermal conductivity greater than that of the first adhesive layer.

2. A display device according to claim 1, characterized in that the thermally conductive material comprises at least one selected from the group consisting of graphite powder, graphene, carbon fiber, carbon nanotube, and boron nitride (BN).

3. A display device according to claim 2, wherein the elastic material comprises at least one selected from the group consisting of silicon (Si), polyurethane (PU), thermoplastic polyurethane (TPU), and polydimethylacrylamide (PDMA).

4. A display device according to claim 1, characterized in that the weight ratio of the thermally conductive material included in the elastic functional layer is 50 wt% or less.

5. A display device according to claim 1, characterized in that the thickness of the elastic functional layer is 10 μm to 300 μm.

6. A display device according to claim 1, characterized in that the thermal conductivity of the elastic functional layer is 5W / (m·K) to 40W / (m·K).

7. In claim 1, the display panel includes a foldable area and a non-foldable area adjacent to the foldable area, and A display device characterized in that the width of the elastic functional layer is constant as it progresses from the non-folding region toward the center of the foldable region.

8. In claim 7, the support plate comprises an expandable portion disposed in the foldable area and a flat portion disposed in the non-foldable area, and A display device characterized by having a plurality of lattice holes defined in the above-mentioned expansion portion that penetrate the support plate in the thickness direction.

9. A display device according to claim 8, characterized in that the elastic functional layer overlaps with the entire stretchable portion on a flat plane.

10. A display panel comprising a plurality of pixels including a foldable region and a non-folding region adjacent to the foldable region; An elastic functional layer comprising an elastic material and a thermally conductive material disposed in the foldable region and the non-foldable region below the display panel; A support plate disposed on the foldable region and the non-folding region on the elastic functional layer; A circuit board disposed in the non-folding area below the elastic functional layer and electrically connected to the display panel; A first adhesive layer disposed between the display panel and the support plate in cross-section to bond the display panel and the support plate together; A second adhesive layer disposed between the elastic functional layer and the circuit board in cross-section to bond the elastic functional layer and the circuit board together, and having a thermal conductivity greater than the thermal conductivity of the first adhesive layer; and An electronic device comprising the above-mentioned display panel, the above-mentioned elastic functional layer, the above-mentioned support plate, and a housing plate providing a space for accommodating the above-mentioned circuit board.

11. An electronic device according to claim 10, wherein the thermally conductive material comprises at least one selected from the group consisting of graphite powder, graphene, carbon fiber, carbon nanotube, and boron nitride (BN).

12. An electronic device according to claim 11, wherein the elastic material comprises at least one selected from the group consisting of silicon (Si), polyurethane (PU), thermoplastic polyurethane (TPU), and polydimethylacrylamide (PDMA).

13. An electronic device according to claim 10, characterized in that the weight ratio of the thermally conductive material included in the elastic functional layer is 50 wt% or less.

14. An electronic device according to claim 10, characterized in that the thickness of the elastic functional layer is 10 μm to 300 μm.

15. An electronic device according to claim 10, characterized in that the thermal conductivity of the elastic functional layer is 5W / (m·K) to 40W / (m·K).

16. In claim 10, the housing plate is, A housing disposed in the above-mentioned non-folding area and accommodating the circuit board; An electronic device characterized by including a hinge portion disposed in the foldable area and protruding from one side of the housing plate toward the interior of the housing plate.

17. An electronic device according to claim 16, characterized in that the elastic functional layer overlaps the entire hinge portion in a planar plane.

18. An electronic device according to claim 10, characterized in that the width of the elastic functional layer becomes constant as it moves from the non-folding region toward the center of the foldable region.

19. In claim 10, further comprising a battery module disposed in the non-folding area below the elastic functional layer and supplying power to the display panel, An electronic device characterized by the second adhesive layer bonding the battery module and the elastic functional layer together.

20. A display panel comprising a plurality of pixels including a foldable region and a non-folding region adjacent to the foldable region; An elastic functional layer comprising an elastic material and a thermally conductive material disposed in the foldable region and the non-foldable region below the display panel; A support plate disposed on the foldable region and the non-folding region on the elastic functional layer; A circuit board disposed in the non-folding area below the elastic functional layer and electrically connected to the display panel; and It includes a housing plate comprising a housing disposed in the non-folding region and accommodating the circuit board, and a hinge portion disposed in the foldable region. The above elastic functional layer overlaps with the entire hinge portion on a plane, and An electronic device characterized in that the width of the elastic functional layer is constant as it progresses from the non-folding region toward the center of the foldable region.

Images