Electronic apparatus including antenna element spaced apart from substrate

Abstract

This electronic apparatus may comprise: a substrate including a first layer and a second layer on the first layer; a support structure positioned on the second layer of the substrate; an antenna element spaced apart from the substrate by the support structure; a ground plate interposed between the first layer and the second layer of the substrate, configured to provide a ground for the antenna element, and including an opening; a feed line positioned under the first layer of the substrate; and a feed structure extending to the antenna element, through the opening in the ground plate, from the feed line positioned under the first layer.

Description

Electronic device including an antenna element spaced apart from a substrate

[0001] The present disclosure relates to an electronic device comprising an antenna element spaced apart from a substrate.

[0002] The electronic device may include a substrate. The electronic device may include an antenna element and a feed line electrically connected to the antenna element. The electronic device may include a substrate on which the feed line and the antenna element are placed. The electronic device may include a wireless communication circuit. The antenna element may be used to radiate a signal transmitted from the wireless communication circuit. The signal may be transmitted to the antenna element through the feed line.

[0003] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure.

[0004] No claim or determination is made as to whether any of the foregoing can be applied as prior art related to the present disclosure.

[0005] An electronic device is described. The electronic device may include a substrate comprising a first layer and a second layer on the first layer. The electronic device may include a support structure located on the second layer of the substrate. The electronic device may include an antenna element spaced apart from the substrate by the support structure. The electronic device may include a ground plate interposed between the first layer and the second layer of the substrate, configured to provide ground for the antenna element, and including an opening. The electronic device may include a feed line located below the first layer of the substrate. The electronic device may include a feed structure extending from the feed line located below the first layer to the antenna element through the opening of the ground plate.

[0006] An electronic device is described. The electronic device may include an antenna element. The electronic device may include a substrate. The electronic device may include a support structure located on a first surface of the substrate such that an air gap is interposed between the antenna element and the substrate. The electronic device may include a feed line located on a second surface of the substrate opposite to the first surface. The substrate may include a ground plate interposed between a first layer of the substrate including the first surface and a second layer of the substrate including the second surface, and including an opening. The feed line may extend to the antenna element through the opening of the ground plate.

[0007] Figure 1 illustrates an example of an environment containing an electronic device including an antenna element.

[0008] Figure 2 is a simplified block diagram of an exemplary electronic device.

[0009] Figure 3 illustrates a substrate of an exemplary electronic device.

[0010] FIG. 4a illustrates an opening included in the ground plate of an exemplary electronic device.

[0011] Figure 4b illustrates the power supply line of an exemplary electronic device.

[0012] FIGS. 5a to 5c are graphs showing the radiation patterns of exemplary electronic devices.

[0013] Figure 6 is a graph showing the effective permittivity according to the thickness of the air gap of an exemplary electronic device.

[0014] Figure 7 illustrates an array antenna of an exemplary electronic device.

[0015] FIG. 8 illustrates an exemplary electronic device including a substrate and an antenna element according to various embodiments.

[0016] Figure 1 illustrates an example of an environment containing an electronic device including an antenna element.

[0017] Referring to FIG. 1, the environment (150) may include an electronic device (100) and an external electronic device (110). For example, the electronic device (100) may be used to radiate electromagnetic waves or signals. For example, the electronic device (100) may be used to receive electromagnetic waves or signals. For example, the electronic device (100) may transmit a signal to the external electronic device (110). For example, the electronic device (100) may receive a signal from the external electronic device (110). For example, the electronic device (100) may transmit or receive the signal using an antenna included in the electronic device (100). For example, the state (130) may be described as an array antenna (140) included within the electronic device (100). For example, the array antenna (140) may include a patch antenna. For example, the array antenna (140) may include a microstrip patch antenna. For example, the array antenna (140) may include a coaxial feed patch antenna.

[0018] For example, the electronic device (100) can transmit or receive signals through an antenna. For example, the electronic device (100) can use high-frequency electromagnetic waves for miniaturization. For example, the higher the frequency of the electromagnetic waves radiated through the antenna of the electronic device (100), the smaller the size of the antenna of the electronic device (100). For example, the higher the frequency of the electromagnetic waves, the shorter the wavelength of the electromagnetic waves, so less diffraction of the electromagnetic waves may occur. For example, when the antenna of the electronic device (100) radiates high-frequency electromagnetic waves, the electronic device (100) may use multiple antennas to increase the distance over which the electromagnetic waves reach. For example, when the electronic device (100) radiates high-frequency electromagnetic waves, an array antenna (140) may be used to increase the distance over which the electromagnetic waves reach.

[0019] For example, the electronic device (100) can cause the battery of an external electronic device (110) to be charged by transmitting a power signal. For example, the battery of the external electronic device (110) can be charged by the power signal received from the electronic device (100). For example, the electronic device (100) can radiate a power signal through an antenna to charge a small external electronic device (110). For example, the electronic device (100) can radiate a power signal to charge the battery of an external electronic device (110) located within a specific distance (e.g., 5 m). For example, the power consumed by the external electronic device (110) charged by the power signal may be less than a threshold power (e.g., 1 W). For example, the structure of an antenna for transmitting a power signal to the external electronic device (110) located within the specific distance may be required. For example, an antenna structure may be required for high-frequency electromagnetic waves (e.g., 2.4 GHz and 5.8 GHz) radiated by an electronic device (100) to reach an external electronic device (110). For example, a plurality of parameters may be controlled for the antenna to reach the external electronic device (110). For example, the electromagnetic waves may reach the external electronic device (110) by controlling the parameters of the antenna. For example, the parameters may include a radiation pattern, antenna gain, directivity, half-power beamwidth (HPBW), radiation efficiency, and impedance. However, they are not limited thereto.

[0020] For example, the electronic device (100) may be required to reduce substrate loss caused by the substrate on which the antenna is arranged in order to increase the reach of high-frequency electromagnetic waves. For example, said substrate loss may include dielectric loss. For example, said dielectric loss may be caused by dielectric relaxation, hysteresis loss, and conduction loss. For example, said dielectric loss may increase as the dielectric constant of the material constituting the substrate on which the antenna of the electronic device (100) is arranged increases. For example, the electronic device (100) may be required to lower the dielectric constant of the substrate associated with the antenna to reduce said dielectric loss. For example, substrate loss may occur when a conductive patch is placed on the substrate. For example, substrate loss may occur when the conductive patch used to radiate electromagnetic waves is placed directly on the substrate. For example, when the conductive patch and a strip-shaped feed line are placed on the substrate, interference may occur between the feed line and the conductive patch. For example, as the above interference occurs, the antenna gain may be reduced. For example, the antenna included in the electronic device (100) may be required to mitigate or reduce the above interference. For example, the above interference may be mitigated or reduced by using a coaxial cable. For example, a patch antenna using the above coaxial cable may be referred to as a coaxial feeding patch antenna.

[0021] For example, if the conductive patch of the coaxial feed patch antenna is placed directly on the substrate, substrate loss may occur. The coaxial feed patch antenna, in which the conductive patch is placed directly on the substrate, may be required to reduce the substrate loss in order to radiate high-frequency electromagnetic waves over a long distance.

[0022] For example, the electronic device (100) may include an air gap to lower the dielectric constant of the substrate on which the antenna is placed. For example, a support structure for forming an air gap between the antenna element and the substrate, on which a signal is radiated, may be placed on the substrate. For example, the antenna element may include a conductive patch.

[0023] For example, the electronic device (100) may be required to reduce interference between the antenna element and the feed line electrically connected to the antenna element. For example, the interference may be caused by the interaction between electromagnetic waves radiated from the antenna element and electromagnetic waves radiated from the feed line.

[0024] For example, the interference can be mitigated by matching the impedance of the antenna element and the impedance of the feed line associated with the antenna element. For example, the interference can be mitigated by lowering the dielectric constant of the substrate. For example, the interference may depend on the method of connection between the feed line and the antenna element. For example, if the antenna element and the feed line are connected via a coaxial feed line, the interference can be mitigated. For example, the interference can be mitigated by inserting a ground plate between the substrates. For example, the electronic device (100) may have a ground plate placed within the substrate on which the feed line is placed.

[0025] For example, the electronic device (100) may include hardware components used to perform or execute the above operations. The hardware components are described and illustrated with reference to FIG. 2.

[0026] Figure 2 is a simplified block diagram of an exemplary electronic device.

[0027] Referring to FIG. 2, the electronic device (100) may include a first substrate (210), a second substrate (220), a ground plate (230), a feed line (240), a feed structure (250), an antenna element (225), and a circuit (245).

[0028] The first substrate (210) may be composed of a dielectric material. For example, the first substrate (210) may include a printed circuit board. For example, the first substrate (210) may include a first layer (e.g., the first layer (310) of FIG. 3) and a second layer (e.g., the second layer (315) of FIG. 3). For example, the material constituting the first substrate (210) may include FR-4. For example, the material constituting the first substrate (210) may include RO4350B. For example, the material constituting the first substrate (210) may include TLY-5. However, it is not limited thereto.

[0029] The second substrate (220) may be composed of a dielectric material. For a description of the material constituting the second substrate (220), refer to the description of the first substrate (210). The second substrate (220) may be used to support an antenna element (225). For example, the second substrate (220) may be spaced apart from the first substrate (210). For example, the second substrate (220) may be placed between the first substrate (210) and the antenna element (225).

[0030] The antenna element (225) may be used to radiate a signal obtained from the circuit (245). For example, the antenna element (225) may be used to receive a signal radiated from an external electronic device (110). For example, the antenna element (225) may include a conductive patch. For example, the material constituting the antenna element (225) may include a metal (e.g., copper).

[0031] A ground plate (230) may be used to mitigate interference between the feed line (240) and the antenna element (225). A ground plate (230) may be used to reduce noise. A ground plate (230) may be included in the first substrate (210). A ground plate (230) may be referred to as a ground layer or a ground plane.

[0032] The feed line (240) may be used to transmit a signal obtained. For example, the feed line (240) may be used to transmit a signal received by the antenna element (225) to the circuit (245). For example, the feed line (240) may be used to transmit a signal obtained from the circuit (245) to the antenna element (225). For example, the feed line (240) may be electrically connected to the circuit (245) and may be used to transmit a power signal to the antenna element (225). For example, the material constituting the feed line (240) may be a metal (e.g., copper). For example, the feed line (240) may include a transmission line. For example, the feed line (240) may be referred to as a strip transmission line and / or a microstrip transmission line.

[0033] The circuit (245) may be used to transmit or receive power signals wirelessly. For example, the circuit (245) may transmit a power signal to an antenna element (225) via a feed line (240). For example, the circuit (245) may receive a power signal from an antenna element (225) via a feed line (240). However, it is not limited thereto. For example, the circuit (245) may be used to transmit or receive data.

[0034] The feed structure (250) can be used to electrically connect the feed line (240) and the antenna element (225). For example, the material constituting the feed structure (250) may be a metal (e.g., copper). For example, the feed structure (250) may be electrically connected to the feed line (240). For example, the feed structure (250) may be electrically connected to the antenna element (225). For example, the feed structure (250) may be referred to as a connector.

[0035] Figure 3 illustrates a substrate of an exemplary electronic device.

[0036] Referring to FIG. 3, the first substrate (210) may include a first layer (310) and a second layer (315). For example, the first layer (310) may be referred to as part of the first substrate (210). For example, the second layer (315) may be referred to as another part of the first substrate (210). For example, a ground plate (230) may be disposed between the first layer (310) and the second layer (315). For example, the ground plate (230) may be interposed between the first layer (310) and the second layer (315). For example, the ground plate (230) may be configured to provide ground. For example, the ground plate (230) may be configured to provide ground to the antenna element (225).

[0037] For example, the first layer (310) may be the bottom-most layer of the first substrate (210). For example, the second layer (315) may be the upper-most layer of the first substrate (210). For example, the second layer (315) may prevent the first layer (310) from bending. For example, the second layer (315) may prevent the first substrate (210) from bending. For example, the first layer (310) may be in contact with one (a) side of the ground plate (230). For example, the second layer (315) may be in contact with another side of the ground plate (230) different from the aforementioned side. For example, the second layer (315) may include a first side. For example, the first side may be described as the side of the second layer (315) on which the support structure (322) is located. For example, a gap may be formed between the first surface of the second layer (315) and the second substrate (220). For example, the first layer (310) may include a second surface. For example, the second surface may be described as the surface of the first layer (310) where the power supply line (240) is located. For example, the first substrate (210) may include a ground plate (230) that includes an opening (410) and is interposed between the second layer (315) including the first surface and the first layer (310) including the second surface.

[0038] A ground plate (230) may be placed between the first layer (310) and the second layer (315). For example, the ground plate (230) may be interposed between the first layer (310) and the second layer (315). For example, the ground plate (230) may provide ground. For example, the ground plate (230) may be configured to provide ground of the first substrate (210). For example, the ground plate (230) may be configured to provide ground of the antenna element (225). For example, the material constituting the ground plate (230) may include a metal (e.g., copper). For example, the ground plate (230) may be used to emit noise. For example, the first layer (310) and the second layer (315) are connected to the ground plate (230) so that noise generated from a conductive configuration (e.g., a feed line (240)) disposed on the first substrate (210) can be discharged to the ground plate (230). For example, the first layer (310) and the second layer (315) are in contact with the ground plate (230) so that noise generated from the feed line (240) can be discharged through the ground plate (230). For example, the first layer (310) and the second layer (315) are in contact with the ground plate (230) so that noise generated from the feed structure (250) can be discharged through the ground plate (230).

[0039] The second substrate (220) may be spaced apart from the first substrate (210) to form a void. For example, the second substrate (220) may be in contact with a support structure (e.g., support structure (322) and support structure (320)) to form the void. For example, the support structure (322) and / or support structure (320) may be placed between the first substrate (210) and the second substrate (220). For example, the second substrate (220) may be composed of the same material as the first substrate (210). However, it is not limited thereto. For example, the material constituting the second substrate (220) may be different from the material constituting the first substrate (210).

[0040] For example, the thickness (350) (e.g., 1.25 mm to 1.5 mm) of the air gap formed between the antenna element (225) and the first substrate (210) may be based on or depend on the frequency (e.g., 5.8 GHz) of the electromagnetic waves radiated through the antenna element (225). For example, the thickness (e.g., 0.5 mm to 1.0 mm) of the first layer (310) may be based on or depend on the frequency (e.g., 5.8 GHz) of the electromagnetic waves radiated through the antenna element (225). For example, the thickness (e.g., 0.5 mm to 1.0 mm) of the second layer (315) may be based on or depend on the frequency (e.g., 5.8 GHz) of the electromagnetic waves radiated through the antenna element (225).

[0041] The antenna element (225) may be spaced apart from the first substrate (210). For example, the antenna element (225) may be placed on a second substrate (220) supported by a support structure (322) and / or a support structure (320). The antenna element (225) may be used to radiate a signal transmitted through a feed line (240). For example, the signal may include a power signal. For example, the signal may include a signal for data transmission or data reception. For example, the antenna element (225) may be made of metal (e.g., copper). For example, the antenna element (225) may be in contact with the second substrate (220). For example, the antenna element (225) may be in contact with a feed structure (250). For example, the antenna element (225) may receive a signal through the feed structure (250). For example, the antenna element (225) can transmit the received signal to the feed line (240).

[0042] The feed structure (250) can penetrate the first substrate (210). For example, the feed structure (250) can penetrate the first layer (310) of the first substrate (210), the second layer (315) of the first substrate (210), and the ground plate (230). For example, the feed structure (250) can extend through an opening in the ground plate (230) (e.g., the opening (410) in FIG. 4a). For example, the feed structure (250) can pass through an opening in the ground plate (230) (e.g., the opening (410) in FIG. 4a). For example, the feed structure (250) can connect the antenna element (225) and the feed line (240) through the opening in the ground plate (230). For example, the feed structure (250) may extend from the feed line (240) to the antenna element (225) through an opening in the ground plate (230) (e.g., the opening (410) in FIG. 4a). For example, the feed structure (250) may be used to transmit a signal from the feed line (240) to the antenna element (225). For example, the feed structure (250) may be used to transmit a signal from the antenna element (225) to the feed line (240). For example, the feed structure (250) may include a conductive line. For example, the feed structure (250) may be a transmission line electrically connected to the feed line (240) and electrically connected to the antenna element (225). For example, the feed structure (250) may be referred to as a feed pin. For example, the power supply structure (250) may include a transmission line. For example, the power supply structure (250) may include a coaxial power supply line. For example, the power supply structure (250) may be referred to as a connector. For example, the power supply structure (250) may be made of metal (e.g., copper).

[0043] For example, the point where the feed structure (250) and the antenna element (225) come into contact can be described as a feed point. For example, the impedance of the antenna element (225) may change depending on the location of the feed point. For example, the location of the feed point may be determined according to the frequency of the electromagnetic waves radiated by the antenna element (225). For example, the location of the feed point may be determined according to the target frequency. For example, the location of the feed point where the antenna element (225) comes into contact with the feed structure (250) may be determined based on the frequency of the electromagnetic waves radiated by the antenna element (225).

[0044] A support structure (322) may be used to support a second substrate (220). For example, the support structure (322) may surround a feed structure (250) located on the first substrate (210). For example, the material constituting the support structure (322) may include Teflon, but is not limited thereto. For example, the dielectric constant of the material constituting the support structure (322) may be lower than the dielectric constant of the material constituting the first substrate (210). For example, the dielectric constant of the material constituting the support structure (322) may be lower than the dielectric constant of the material constituting the second substrate (220). For example, the support structure (322) may be in contact with the first substrate (210) and the second substrate (220). For example, the support structure (322) may be disposed between the first substrate (210) and the second substrate (220) so as to form a gap between the antenna element (225) and the first substrate (210). For example, the support structure (322) may be interposed between the first substrate (210) and the second substrate (220). For example, the support structure (322) may be disposed between the second layer (315) of the first substrate (210) and the second substrate (220).

[0045] The support structure (320) may be further used to support the second substrate (220). For example, the material constituting the support structure (320) may include plastic, but is not limited thereto. For example, the dielectric constant of the material constituting the support structure (320) may be lower than the dielectric constant of the material constituting the first substrate (210). For example, the dielectric constant of the material constituting the support structure (320) may be lower than the dielectric constant of the material constituting the second substrate (220). For example, the support structure (320) may be in contact with the first substrate (210) and the second substrate (220). For example, the support structure (320) may be placed between the first substrate (210) and the second substrate (220) so that a gap is formed between the antenna element (225) and the first substrate (210). For example, the support structure (320) may be interposed between the first substrate (210) and the second substrate (220). For example, the support structure (320) may be disposed between the second layer (315) of the first substrate (210) and the second substrate (220).

[0046] The fastening structure (325) may be used to connect, fasten, or fix the second substrate (220) and the support structure (320). For example, the fastening structure (325) may penetrate the second substrate (220). For example, the material constituting the fastening structure (325) may include plastic. For example, the size of the fastening structure (325) may depend on or be based on the size of the second substrate (220). For example, the size of the fastening structure (325) may depend on or be based on the size of the antenna element (225).

[0047] The fastening structure (335) may be used to connect, fasten, or fix the first substrate (210) and the support structure (320). For example, the fastening structure (335) may penetrate the first substrate (210). For example, the material constituting the fastening structure (335) may include plastic. For example, the size of the fastening structure (335) may depend on or be based on the size or thickness of the first substrate (210).

[0048] The fastening structure (340) may be used to connect, fasten, or secure the first layer (310) and the second layer (315). For example, the fastening structure (340) may penetrate the first substrate (210). For example, the fastening structure (340) may penetrate the ground plate (230). For example, the material constituting the fastening structure (340) may include plastic. For example, the size of the fastening structure (340) may depend on or be based on the size or thickness of the first substrate (210).

[0049] According to one embodiment, the feed line (240) may extend to the antenna element (225). For example, referring to FIG. 3, a feed structure (250) electrically connecting the antenna element (225) and the feed line (240) is shown, but the feed line (240) may extend to the antenna element (225). For example, the feed line (240) may extend to the antenna element (225) by penetrating the first substrate (210) and the second substrate (220). For example, the feed line (240) located between the first substrate (210) and the second substrate (220) may be supported by a support structure (322) to support the second substrate (220).

[0050] A feed structure (250) or a feed line (240) may penetrate or pass through the first substrate (210). For example, the ground plate (230) may include an opening (e.g., the opening (410) in FIG. 4a). For example, the feed structure (250) or the feed line (240) may pass through the opening (e.g., the opening (410) in FIG. 4a) of the ground plate (230). A feed structure (250) connecting the antenna element (225) and the feed line (240) through the opening (e.g., the opening (410) in FIG. 4a) is described and illustrated in more detail with reference to FIG. 4a.

[0051] FIG. 4a illustrates an opening included in the ground plate of an exemplary electronic device.

[0052] Referring to FIG. 4a, the ground plate (230) may include an opening (410). For example, the first substrate (210) may include an opening (410). For example, the first layer (310) and the second layer (315) may include an opening (410). For example, the opening (410) may be referred to as a via or a hole.

[0053] For example, the opening (410) of the ground plate (230) may extend to the first layer (310) and the second layer (315). For example, the opening (410) of the ground plate (230) may extend to one side and the other side of the first substrate (210). For example, the opening (410) of the ground plate (230) may extend to one side of the second layer (315) where the support structure (322) is located. For example, the opening (410) of the ground plate (230) may extend to one side of the first layer (310) where the power supply line (240) is arranged. For example, the first substrate (210) may include an opening linked to the opening (410) of the ground plate (230). For example, the first substrate (210) may include an opening extending from the opening (410) of the ground plate (230).

[0054] For example, the feed structure (250) may penetrate or pass through the first layer (310), the ground plate (230), and the second layer (315). For example, the feed structure (250) may be positioned spaced apart from the opening (410). For example, the feed structure (250) may be spaced apart from the surface inside the opening (410). For example, a gap may be formed between the feed structure (250) and the surface inside the opening (410). For example, based on the feed structure (250) being spaced apart from the inside of the opening (410), the signal transmitted through the feed structure (250) may be prevented from being emitted to the ground plate (230). For example, as the feed structure (250) is spaced apart from the surface inside the opening (410), it may transmit a signal from the feed line (240) to the antenna element (225). For example, the feed structure (250) can transmit a signal from the antenna element (225) to the feed line (240) as it is spaced apart from the surface inside the opening (410). For example, the feed structure (250) may not come into contact with the surface inside the opening (410). For example, the feed structure (250) may be oriented in the same direction as the opening (410) (e.g., +y direction). For example, the direction of the feed structure (250) (e.g., +y direction) may be parallel to the direction of the opening (410) (e.g., +y direction). For example, the direction of the feed structure (250) may be the same as the direction of the opening (410).

[0055] For example, a portion of the power supply structure (250) located in the opening (410) may be spaced apart from the ground plate (230). For example, a side inside the opening (410) may be spaced apart from the power supply structure (250). For example, the power supply structure (250) may be spaced apart from a side inside the opening (410). For example, the power supply structure (250) may be spaced apart from a side inside the opening (410) so that a gap is formed. For example, the power supply structure (250) may not come into contact with a side inside the opening (410). Referring to FIG. 4a, the ground plate (230) is depicted as having a thickness, but is not limited thereto. For example, the ground plate (230) may be a thin film. For example, since the ground plate (230) is a thin film, a side of the opening (410) may not (substantially) exist. For example, since the ground plate (230) is a thin film, it may be difficult to measure the side of the opening (410).

[0056] According to one embodiment, the feed line (240) may extend to the antenna element (225). For example, the feed line (240) placed on the first layer (310) may extend to the antenna element (225) through the opening (410). For example, a portion of the feed line (240) located at the opening (410) may be spaced apart from the ground plate (230). For example, the distance between the feed line (240) at the opening (410) and the ground plate (230) may be determined based on the frequency of the electromagnetic waves radiated by the antenna element (225).

[0057] For example, the size of the aperture (410) may be determined according to the frequency of the electromagnetic waves radiated through the antenna element (225). For example, the impedance may be changed according to the size of the aperture (410). For example, the impedance may be changed according to the distance between the side inside the aperture (410) and the feed structure (250). For example, the size of the aperture (410) may be determined for resonance or impedance matching of the signal radiated through the antenna element (225). For example, the distance between the side inside the aperture (410) and the feed structure (250) may be determined for resonance or impedance matching of the signal radiated through the antenna element (225). For example, the distance between the side inside the aperture (410) and the feed structure (250) may be determined based on the frequency of the electromagnetic waves radiated by the antenna element (225). For example, the distance between the feed structure (250) and the ground plate (230) in the opening (410) can be determined based on the frequency of the electromagnetic waves radiated by the antenna element (225). For example, the distance between a part of the feed structure (250) and the ground plate (230) in the opening (410) can be determined based on the frequency of the electromagnetic waves radiated by the antenna element (225).

[0058] For example, the power supply line (240) may be placed on the first layer (310) of the first substrate (210). For example, the power supply line (240) may include a strip transmission line. The power supply line (240) placed on the first substrate (210) is described and illustrated in more detail with reference to FIG. 4b.

[0059] Figure 4b illustrates the power supply line of an exemplary electronic device.

[0060] Referring to FIG. 4b, a first layer (310) of a first substrate (210) is shown. For example, a power supply line (240) may be placed on the first layer (310). For example, the power supply line (240) may be located on the first layer (310). For example, the power supply line (240) may be in contact with the first layer (310). For example, the power supply line (240) may be electrically connected to a circuit (245). For example, the power supply line (240) may transmit a signal (e.g., a power signal) transmitted from the circuit (245) to a power supply structure (250).

[0061] For example, the feed line (240) may be connected to the feed structure (250) through the opening (420). For example, the opening (420) may be included in the first layer (310). For example, the opening (420) may extend from the opening (410) of the ground plate (230). For example, the direction of the opening (420) (e.g., +y direction) may be the same as the direction of the opening (410) (e.g., +y direction). For example, the opening (420) may be referred to as a via or a hole.

[0062] According to one embodiment, the feed line (240) may extend to the antenna element (225) through the opening (420). For example, the feed line (240) may pass through the opening (420) and the opening (410). For example, the feed line (240) may penetrate the first substrate (210) through the opening (420) and the opening (410). For example, the feed line (240) may come into contact with the antenna element (225) and the second substrate (220).

[0063] For example, the electronic device (100) can obtain an enhanced antenna gain and a realized gain based on an antenna element (225) spaced apart from the first substrate (210) and a ground plate (230) located within the first substrate (210). The realized gain may be referred to as the realized antenna gain. The realized gain is described and illustrated in more detail with reference to FIGS. 5a through 5c.

[0064] FIGS. 5a to 5c are graphs showing the radiation patterns of exemplary electronic devices.

[0065] Referring to FIG. 5a, the graph (510) shows the radiation pattern when the thickness (350) of the air gap is 1.3 mm. The graph (510) can show the first maximum realized gain. The graph (510) can show the first radiation efficiency.

[0066] Referring to FIG. 5b, the graph (520) shows the radiation pattern when the thickness (350) of the air gap is 1.5 mm. The graph (520) can show the second maximum realized gain. The graph (520) can show the second radiation efficiency.

[0067] Referring to FIG. 5c, graph (530) shows the radiation pattern when the thickness (350) of the air gap is 1.7 mm. Graph (530) can show the third maximum realized gain. Graph (530) can show the third radiation efficiency.

[0068] Radiation efficiency can be described as the ratio of radiated power to the power supplied to the antenna. Antenna gain (unit: dB (decibels)) can be described as the ability of an antenna to concentrate power in a specific direction. Realized gain can represent the loss due to the mismatch between the input impedance to the antenna and the specified impedance.

[0069] The first maximum realized gain may be smaller than the second maximum realized gain and the third maximum realized gain. The second maximum realized gain may be larger than the first maximum realized gain and the third maximum realized gain. The third maximum realized gain may be larger than the first maximum realized gain and smaller than the second maximum realized gain.

[0070] The first radiation efficiency may be smaller than the second radiation efficiency and the third radiation efficiency. The second radiation efficiency may be larger than the first radiation efficiency and the third radiation efficiency. The third radiation efficiency may be larger than the first radiation efficiency and smaller than the second radiation efficiency.

[0071] Referring to graphs (510), (520), and (530), the radiation pattern, radiation efficiency, and realized gain may differ depending on the thickness (350) of the air gap at the same frequency. For example, the thickness (350) of the air gap may be determined according to the target frequency.

[0072] The permittivity associated with the antenna element (225) of the electronic device (100) may change depending on the thickness (350) of the air gap. The permittivity associated with the antenna element (225) of the electronic device (100) may change depending on the thickness of the second layer (315). The change in permittivity is described and illustrated in more detail with reference to FIG. 6.

[0073] Figure 6 is a graph showing the effective permittivity according to the thickness of the air gap of an exemplary electronic device.

[0074] Referring to FIG. 6, the horizontal axis of the graph (610) represents the thickness (350) of the air gap of the electronic device (100) (unit: millimeters [mm]). The vertical axis of the graph (610) represents the effective permittivity between the antenna element (225) and the second layer (315).

[0075] For example, if the real permittivity of the material (e.g., FR-4) constituting the first substrate (210) and the second substrate (220) is low, the electronic device (100) can easily radiate electromagnetic waves using the antenna element (225). The imaginary permittivity of the material can cause loss of electromagnetic waves. For example, if the material constituting the first substrate (210) is FR-4, loss of electromagnetic waves radiated by the antenna element (225) may occur due to the imaginary permittivity of FR-4. Although the material constituting the first substrate (210) is described as FR-4, this is merely illustrative. For example, the electronic device (100) may be required to lower the imaginary permittivity associated with the antenna element (225) to increase radiation efficiency. For example, the electronic device (100) can lower the imaginary permittivity associated with the antenna element (225) by inserting a gap between the antenna element (225) and the first substrate (210). For example, the thickness (350) of the gap can be changed to lower the effective permittivity associated with the antenna element (225). For example, the effective permittivity based on the thickness (350) of the gap may be referenced by the following mathematical formula.

[0076]

[0077] The above represents the effective permittivity. The above represents the dielectric constant of the pore. The above represents the dielectric constant of the second layer (315) (or the first substrate (210)). represents the thickness (350) of the void. represents the thickness of the second layer (315). represents the design frequency (e.g., 5.8 GHz). The design frequency can be described as the frequency of the electromagnetic waves radiated through the antenna element (225).

[0078] The electronic device (100) may include a plurality of antenna elements. For example, the electronic device (100) may include an array antenna (e.g., the array antenna (710) of FIG. 7) that includes a plurality of antenna elements. The structure of the array antenna is described and illustrated in more detail with reference to FIG. 7.

[0079] Figure 7 illustrates an array antenna of an exemplary electronic device.

[0080] Referring to FIG. 7, the electronic device (100) may include an array antenna (710). For example, the electronic device (100) may include an antenna comprising a first substrate (210), an antenna element (225) spaced apart from the first substrate (210) to form an air gap, a ground plate (230) disposed within the first substrate (210), and a feed line (240) mounted on the first substrate (210). For example, the electronic device (100) may include an array antenna (710) in which a plurality of antennas identical to (substantially) the antenna are arranged.

[0081] For example, the electronic device (100) can increase the distance over which a signal reaches by using an array antenna (710). For example, the distance over which a signal radiated by a single antenna can reach may be shorter than the distance over which a signal(s) radiated by the array antenna (710) can reach. For example, a small antenna element (225) may be placed on the first substrate (210) to radiate high-frequency electromagnetic waves. For example, a plurality of antenna elements (substantially identical to) the antenna element (225) may be placed on the first substrate (210) that includes the array antenna (710). For example, the electronic device (100) can radiate a signal transmitted from the circuit (245) by using the array antenna (710).

[0082] For example, an antenna comprising a first substrate (210), an antenna element (225) spaced apart from the first substrate (210) to form a gap, a ground plate (230) disposed within the first substrate (210), and a feed line (240) mounted on the first substrate (210), and / or an array antenna (710) including said antenna may be included in various types of electronic devices. For example, said various types of electronic devices are described and illustrated in more detail with reference to FIG. 8.

[0083] FIG. 8 illustrates an exemplary electronic device including a substrate and an antenna element according to various embodiments.

[0084] Referring to FIG. 8, the state (810) may represent a type of electronic device that may include an antenna comprising a first substrate (210), an antenna element (225) spaced apart from the first substrate (210) to form an air gap, a ground plate (230) disposed within the first substrate (210), and a feed line (240) mounted on the first substrate (210). For example, the antenna may be included in an electronic device that uses relatively little power. For example, the antenna may be used in a television (820). For example, the antenna may be used in a speaker (830) or a soundbar. For example, the antenna may be used in a remote control (840). Referring to FIG. 8, the type of electronic device that may include the antenna is illustrated but is not limited thereto. For example, the antenna may be included in a desktop PC (personal computer) or a laptop PC.

[0085] The technical problems to be solved in this disclosure are not limited to those mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art to which this disclosure belongs.

[0086] An electronic device as described above (e.g., electronic device (100)) may include a substrate (e.g., first substrate (210)) comprising a first layer (e.g., first layer (310)) and a second layer (e.g., second layer (315)) on the first layer. The electronic device may include a support structure (e.g., support structure (320) and support structure (322)) located on the second layer of the substrate. The electronic device may include an antenna element (e.g., antenna element (225)) spaced apart from the substrate by the support structure. The electronic device may include a ground plate (e.g., ground plate (230)) interposed between the first layer and the second layer of the substrate, configured to provide ground for the antenna element, and including an opening (e.g., opening (410)). The electronic device may include a feed line (e.g., feed line (240)) located below the first layer of the substrate. The electronic device may include a feed structure (e.g., feed structure (250)) extending from the feed line located below the first layer to the antenna element through the opening of the ground plate.

[0087] According to one embodiment, the antenna element may be spaced apart from the substrate by the support structure so that a gap is formed between the antenna element and the substrate.

[0088] According to one embodiment, a part of the power supply structure located in the opening may be spaced apart from the ground plate.

[0089] According to one embodiment, the power supply structure may be a transmission line that is electrically connected to the power supply line and electrically connected to the antenna element.

[0090] According to one embodiment, the substrate may be a first substrate. The electronic device may further include a second substrate spaced apart from the first substrate by the support structure. The antenna element may be located on the second substrate.

[0091] According to one embodiment, the support structure may surround a part of the power supply structure.

[0092] According to one embodiment, the substrate may be a first substrate. The support structure may be configured to support a second substrate that is spaced apart from the feed structure and supports the antenna element.

[0093] According to one embodiment, the electronic device may further include a circuit for transmitting a power signal wirelessly. The feed line is electrically connected to the circuit and may be used to transmit the power signal to the antenna element.

[0094] According to one embodiment, the location of the feed point where the antenna element contacts the feed structure can be determined based on the frequency of the electromagnetic wave radiated by the antenna element.

[0095] According to one embodiment, the distance between the feed structure and the ground plate at the opening can be determined based on the frequency of the electromagnetic waves radiated by the antenna element.

[0096] According to one embodiment, the first dielectric constant of the material constituting the support structure may be lower than the second dielectric constant of the material constituting the substrate.

[0097] An electronic device as described above (e.g., electronic device (100)) may include an antenna element. The electronic device may include a substrate. The electronic device may include a support structure located on a first surface of the substrate such that an air gap is interposed between the antenna element and the substrate. The electronic device may include a feed line located on a second surface of the substrate opposite to the first surface. The substrate may include a ground plate interposed between a first layer of the substrate including the first surface and a second layer of the substrate including the second surface, and including an opening. The feed line may extend to the antenna element through the opening of the ground plate.

[0098] According to one embodiment, a portion of the power supply line located in the opening may be spaced apart from the ground plate.

[0099] According to one embodiment, the substrate may be a first substrate. The electronic device may further include a second substrate spaced apart from the first substrate by the support structure. The antenna element may be located on the second substrate.

[0100] According to one embodiment, the support structure may surround a portion of the power supply line located on the first surface of the substrate.

[0101] According to one embodiment, the substrate may be a first substrate. The support structure may be configured to support a second substrate that supports the antenna element, which is spaced apart from the feed line located on the first surface of the first substrate.

[0102] According to one embodiment, the electronic device may further include a circuit for transmitting a power signal wirelessly. The feed line is electrically connected to the circuit and may be used to transmit the power signal to the antenna element.

[0103] According to one embodiment, the location of the feed point where the antenna element contacts the feed line can be determined based on the frequency of the electromagnetic wave radiated by the antenna element.

[0104] According to one embodiment, the distance between the feed line and the ground plate at the opening can be determined based on the frequency of the electromagnetic waves radiated by the antenna element.

[0105] According to one embodiment, the first dielectric constant of the material constituting the support structure may be lower than the second dielectric constant of the material constituting the substrate.

[0106] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs.

[0107] The device described above may be implemented as a hardware component, a software component, and / or a combination of a hardware component and a software component. For example, the device and components described in the embodiments may be implemented using one or more general-purpose or special-purpose computers, such as a processor, a controller, an arithmetic logic unit (ALU), a digital signal processor, a microcomputer, a field programmable gate array (FPGA), a programmable logic unit (PLU), a microprocessor, or any other device capable of executing and responding to instructions. The processing unit may execute an operating system (OS) and one or more software applications executed on said operating system. Additionally, the processing unit may access, store, manipulate, process, and generate data in response to the execution of the software. For ease of understanding, the processing unit may be described as being used as a single unit, but those skilled in the art will understand that the processing unit may include multiple processing elements and / or multiple types of processing elements. For example, the processing unit may include multiple processors or one processor and one controller. In addition, other processing configurations, such as parallel processors, are also possible.

[0108] Software may include computer programs, code, instructions, or a combination of one or more of these, and may configure a processing unit to operate as desired or instruct the processing unit independently or collectively. Software and / or data may be embodied in any type of machine, component, physical device, computer storage medium, or device so as to be interpreted by the processing unit or to provide instructions or data to the processing unit. Software may be distributed over networked computer systems and may be stored or executed in a distributed manner. Software and data may be stored on one or more computer-readable recording media.

[0109] The method according to the embodiment may be implemented in the form of program instructions that can be executed through various computer means and recorded on a computer-readable medium. In this case, the medium may continuously store a computer-executable program, or temporarily store it for execution or download. Additionally, the medium may be various recording or storage means in the form of a single or several combined hardware, and may not be limited to a medium directly connected to a computer system but may exist distributed over a network. Examples of media may include magnetic media such as hard disks, floppy disks, and magnetic tapes; optical recording media such as CD-ROMs and DVDs; magneto-optical media such as floptical disks; and media configured to store program instructions, including ROM, RAM, and flash memory. Additionally, other examples of media may include recording or storage media managed by app stores that distribute applications or sites and servers that supply or distribute various other software.

[0110] Although the embodiments have been described above with reference to limited examples and drawings, those skilled in the art can make various modifications and variations from the description above. For example, suitable results may be achieved even if the described techniques are performed in a different order than described, and / or the components of the described system, structure, device, circuit, etc. are combined or assembled in a form different from described, or replaced or substituted by other components or equivalents.

[0111] Therefore, other implementations, other embodiments, and equivalents to the claims set forth below are also within the scope of the claims. According to one embodiment, the method according to the various embodiments disclosed herein may be provided as a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or distributed online (e.g., download or upload) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created in a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0112] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In an electronic device, A substrate comprising a first layer and a second layer on the first layer; A support structure located on the second layer of the above substrate; An antenna element spaced apart from the substrate by the above support structure; A ground plate interposed between the first layer and the second layer of the substrate, configured to provide ground for the antenna element, and including an opening; A power supply line located below the first layer of the above substrate; and A feed structure including, extending from the feed line located below the first layer to the antenna element through the opening of the ground plate, Electronic device.

2. In claim 1, the antenna element is, A spaced apart from the substrate by the support structure so as to form a gap between the antenna element and the substrate, Electronic device.

3. In claim 1, the part of the power supply structure located in the opening is spaced apart from the ground plate. Electronic device.

4. In claim 1, the power supply structure is, A transmission line electrically connected to the above feed line and electrically connected to the above antenna element, Electronic device.

5. In claim 1, the substrate is, It is the first substrate, and The above electronic device is, It further includes a second substrate spaced apart from the first substrate by the above support structure, and The above antenna element is, Located on the second substrate, Electronic device.

6. In claim 1, the support structure is, Surrounding a part of the above-mentioned power supply structure, Electronic device.

7. In claim 1, the substrate is, It is a first substrate, and The above support structure is, A second substrate that is spaced apart from the above-mentioned feed structure and supports the antenna element, Electronic device.

8. In claim 1, the electronic device is, It further includes a circuit for transmitting power signals wirelessly, and The above power supply line is, Electrically connected to the above circuit and used to transmit the power signal to the antenna element, Electronic device.

9. In claim 1, the position of the feed point where the antenna element contacts the feed structure is, Determined based on the frequency of the electromagnetic waves radiated by the above antenna element, Electronic device.

10. In Claim 1, the distance between the power supply structure and the ground plate at the opening is, Determined based on the frequency of the electromagnetic waves radiated by the above antenna element, Electronic device.

11. In claim 1, the first dielectric constant of the material constituting the support structure is, Lower than the second dielectric constant of the material constituting the above substrate, Electronic device.

12. In an electronic device, Antenna element; Substrate; A support structure positioned on a first surface of the substrate such that a gap is interposed between the antenna element and the substrate; and It includes a power supply line located on the second surface of the substrate opposite to the first surface, and The above substrate is, A ground plate interposed between a first layer of the substrate including the first surface and a second layer of the substrate including the second surface, and including an opening, and The above power supply line is, Extending to the antenna element through the opening of the ground plate, Electronic device.

13. In claim 12, a portion of the power supply line located in the opening is, spaced apart from the ground plate, Electronic device.

14. In claim 12, the substrate is, It is the first substrate, and The above electronic device is, It further includes a second substrate spaced apart from the first substrate by the above support structure, and The above antenna element is, Located on the second substrate, Electronic device.

15. In claim 12, the support structure is, A portion of the feed line located on the first surface of the substrate, surrounding the portion of the feed line Electronic device.

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