Home appliance comprising heat dissipation structure

Abstract

A robot cleaner according to an embodiment of the present disclosure may comprise: a main body; a cleaning unit connected to the main body; a traveling unit disposed on the bottom surface of the main body for the movement of the robot cleaner; and a control panel for controlling the operation of the robot cleaner. The control panel may comprise: a circuit board; an electronic component disposed on the circuit board; a shield can coupled to the circuit board and formed to surround the electronic component; a heat sink disposed on the shield can and having a plurality of heat dissipation fins arranged to diffuse heat generated by the electronic component; and a heat transfer member disposed between the electronic component and the heat sink. The shield can may include a support portion supporting the heat sink, a sidewall extending from the support portion and formed to surround at least a portion of the heat sink, and a fastening portion formed inwardly from the sidewall and coupled to the heat sink.

Description

Home appliances including a heat dissipation structure

[0001] Various embodiments of the present disclosure relate to a heat dissipation structure for shielding electromagnetic noise of electronic components placed inside a home appliance and dissipating heat generated from electronic components, and a home appliance including the same.

[0002] Generally, home appliances include a circuit board assembly (e.g., a printed board assembly (PBA)) for driving the appliance's components (e.g., a display). The circuit board assembly is typically located within a limited space inside the home appliance.

[0003] In such situations, for home appliances with sufficient space for airflow, the heat generated by electronic components (e.g., processors) placed on the circuit board assembly can be managed normally. However, for appliances with severe space constraints or high-temperature environments (e.g., robot vacuums, cooking appliances, air conditioners, washing machines (or dryers), or refrigerators), there is insufficient space for airflow, making it difficult to effectively dissipate the heat generated from the circuit board assembly. If heat is not effectively dissipated, the temperature of the electrical components placed on the circuit board assembly rises. This can lead to performance degradation of the electronic components.

[0004] Therefore, a heat dissipation structure and a design of a home appliance including the heat dissipation structure are discussed for effectively dissipating heat generated in the circuit board assembly of the home appliance, even in high-temperature environments and / or environments with space constraints.

[0005] A robot vacuum cleaner according to one embodiment of the present disclosure may include a main body, a cleaning unit connected to the main body, a driving unit disposed on the bottom surface of the main body for movement of the robot vacuum cleaner, and a control panel for controlling the operation of the robot vacuum cleaner. The control panel may include a circuit board, an electronic component disposed on the circuit board, a shield can formed to surround the electronic component and coupled with the circuit board, a heat sink disposed on the shield can and having a plurality of heat dissipation fins arranged to diffuse heat generated by the electronic component, and a heat transfer member disposed between the electronic component and the heat sink. The shield can may include a support portion supporting the heat sink, a side wall extending from the support portion and formed to surround at least a portion of the heat sink, and a fastening portion formed inside the side wall and coupled with the heat sink.

[0006] A home appliance according to one embodiment of the present disclosure may include a circuit board, an electronic component disposed on the circuit board, a shield can formed to surround the electronic component and coupled with the circuit board, a heat sink disposed on the shield can and having a plurality of heat dissipation fins arranged to diffuse heat generated by the electronic component, and a heat transfer member disposed between the electronic component and the heat sink. The shield can may include a support portion supporting the heat sink, a side wall extending from the support portion and formed to surround at least a portion of the heat sink, and a fastening portion formed inside the side wall and coupled with the heat sink.

[0007] However, the problems to be solved in this disclosure are not limited to those mentioned above, and may be determined in various ways without departing from the spirit and scope of this disclosure.

[0008] FIG. 1 is a perspective view of a robot vacuum cleaner according to one embodiment of the present disclosure.

[0009] FIG. 2 is a drawing of a robot vacuum cleaner viewed from below, according to one embodiment of the present disclosure.

[0010] FIG. 3 is a block diagram illustrating the relationships between components, focusing on the control and operation of a robot vacuum cleaner according to one embodiment of the present disclosure.

[0011] FIG. 4 is an exploded perspective view showing a circuit board, a display module, and a case having a shielding and heat dissipation structure arranged thereon, according to one embodiment of the present disclosure.

[0012] FIG. 5 is a perspective view showing a structure (e.g., a heat dissipation structure) for shielding and heat dissipation of an electronic component according to one embodiment of the present disclosure.

[0013] FIG. 6 is a cross-sectional view taken along the A-A' direction of FIG. 5 of a structure for shielding and heat dissipation of an electronic component (e.g., a heat dissipation structure) according to one embodiment of the present disclosure.

[0014] FIG. 7 is a cross-sectional view taken along the B-B' direction of FIG. 5 of a structure for shielding and heat dissipation of an electronic component (e.g., a heat dissipation structure) according to one embodiment of the present disclosure.

[0015] FIG. 8 is a cross-sectional view showing a heat dissipation path of a heat dissipation structure according to one embodiment of the present disclosure.

[0016] FIG. 9 is a top view of a heat dissipation structure according to one embodiment of the present disclosure.

[0017] FIG. 10 is a top view of a heat dissipation structure with a heat sink (heat transfer member) excluded, according to one embodiment of the present disclosure.

[0018] FIG. 11 is a top view of a shield can according to one embodiment of the present disclosure.

[0019] FIG. 12 is a view of a shield can according to one embodiment of the present disclosure, seen from below.

[0020] FIG. 13 is a diagram showing the connection between a circuit board and a shield can viewed from the side of a heat dissipation structure according to one embodiment of the present disclosure.

[0021] FIG. 14 is a view of the upper surface of a circuit board with a heat dissipation structure according to one embodiment of the present disclosure.

[0022] FIG. 15 is a perspective view showing a structure for shielding and heat dissipation of an electronic component (e.g., a heat dissipation structure (500a)) according to one embodiment of the present disclosure.

[0023] FIG. 16 is a perspective view showing a structure for shielding and heat dissipation of an electronic component (e.g., a heat dissipation structure (500b)) according to one embodiment of the present disclosure.

[0024] Figure 17a is a graph showing the temperature change of an electronic component inside a typical shield can in a high-temperature chamber.

[0025] FIG. 17b is a graph showing the temperature change of an electronic component with respect to a heat dissipation structure in a high-temperature chamber according to one embodiment of the present disclosure (the embodiment of FIG. 16).

[0026] FIG. 17c is a graph showing the temperature change of an electronic component with respect to a heat dissipation structure in a high-temperature chamber according to one embodiment of the present disclosure (the embodiment of FIG. 5 to 7).

[0027] FIG. 18a is a perspective view of a cooking appliance according to one embodiment of the present disclosure.

[0028] FIG. 18b is a drawing showing the door of a cooking appliance in an open state according to one embodiment of the present disclosure.

[0029] FIG. 18c is a side cross-sectional view of a cooking appliance according to one embodiment of the present disclosure.

[0030] FIG. 19 is a drawing illustrating an air conditioner according to one embodiment of the present disclosure.

[0031] FIG. 20a is a perspective view of a refrigerator in a closed state according to one embodiment of the present disclosure.

[0032] FIG. 20b is a perspective view of a refrigerator in an open state according to one embodiment of the present disclosure.

[0033] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments.

[0034] In relation to the description of the drawings, similar reference numerals may be used for similar or related components.

[0035] The singular form of the noun corresponding to the item may include one or multiple items, unless the relevant context clearly indicates otherwise.

[0036] In this document, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "at least one of A, B, or C" may include any one of the items listed together in the corresponding phrase, or all possible combinations thereof.

[0037] In this document, the term “and / or” includes a combination of multiple related described components or any of the multiple related described components.

[0038] In this document, terms such as "first," "second," or "first" or "second" may be used simply to distinguish a component from another component and do not limit the components in any other aspect (e.g., importance or order).

[0039] In this document, terms such as "front," "rear," "top," "bottom," "side," "left," "right," "top," and "bottom" are defined based on the drawings, and the shape and location of each component are not limited by these terms.

[0040] Where any (e.g., 1st) component is referred to as "coupled" or "connected" to another (e.g., 2nd) component, with or without the terms "functionally" or "communicationly," it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0041] Terms such as "include" or "have" are intended to specify the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in this document, and do not preclude the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0042] When it is said that a component is "connected," "combined," "supported," or "in contact" with another component, this includes not only cases where the components are directly connected, combined, supported, or in contact, but also cases where they are indirectly connected, combined, supported, or in contact through a third component.

[0043] When it is said that a component is located "on" another component, this includes not only cases where one component is in contact with the other, but also cases where another component exists between the two components.

[0044] FIG. 1 is a perspective view of a robot vacuum cleaner according to one embodiment of the present disclosure.

[0045] FIG. 2 is a drawing of a robot vacuum cleaner viewed from below, according to one embodiment of the present disclosure.

[0046] According to one embodiment, a robot vacuum cleaner (100) can perform the function of cleaning a floor while autonomously driving in a certain area. The floor cleaning may include sucking up dust and foreign matter from the floor or mopping (e.g., dry and / or wet cleaning). The robot vacuum cleaner (100) may include a main body, a cleaning unit connected to the main body, a driving unit positioned on the bottom surface of the main body for the movement of the robot vacuum cleaner, and a control panel for controlling the operation of the robot vacuum cleaner. The cleaning unit can be understood as a structure formed to suck up dust for dry cleaning and / or a structure that cleans the floor using liquid for wet cleaning. Hereinafter, an embodiment of a wet cleaning unit among dry and wet cleaning units is described. At least part of the configuration of the dry cleaning unit may adopt the configuration of the wet cleaning unit below.

[0047] According to one embodiment, the robot vacuum cleaner (100) may include a cleaning cloth module (140) (or a cleaning unit) (e.g., a wet mop or a dry mop). The robot vacuum cleaner (100) may perform cleaning (or mopping) to remove foreign matter attached to a surface to be cleaned (e.g., a floor surface) using a cleaning cloth (P) mounted on the cleaning cloth module (140). For example, the robot vacuum cleaner (100) may rotate the mounted cleaning cloth (P) and remove foreign matter attached to the floor surface by utilizing the frictional force between the cleaning cloth (P) and the floor surface generated by the rotation of the cleaning cloth (P).

[0048] Referring to FIGS. 1 and 2, the robot vacuum cleaner (100) may have a cleaning cloth (P) capable of contacting a surface to be cleaned (e.g., a floor surface) mounted on a cleaning cloth module (140).

[0049] According to one embodiment, when the robot vacuum cleaner (100) passes through a place where wet cleaning must be avoided, such as a carpet, during cleaning, it can be separated from the carpet by raising (e.g., raising) the cleaning cloth module (140).

[0050] According to one embodiment, the robot vacuum cleaner (100) may include a main body (110), a control panel (120), a driving unit (130), a cleaning cloth module (140) (or a cleaning unit) and a battery (150).

[0051] According to one embodiment, the main body (110) may form the substantial exterior of the robot vacuum cleaner (100). According to one embodiment, the main body (110) may include a vacuum cleaner body (111) and a vacuum cleaner cover (112). The vacuum cleaner body (111) may include a lower portion positioned adjacent to a floor surface (or surface to be cleaned) while the robot vacuum cleaner (100) is driven for cleaning, and a side portion extending upward from the corner of the lower portion to form the side of the robot vacuum cleaner (100). Although not illustrated, according to one embodiment, the robot vacuum cleaner (100) may include a bumper positioned on the side of the vacuum cleaner body (111) to cushion external impacts.

[0052] According to one embodiment, a power button (113) may be disposed on one side of the vacuum cleaner body (111). The power button (113) can be operated on / off by a user to turn the power of the robot vacuum cleaner (100) on / off. For example, the power button (113) may be implemented as a button or a touch method, but is not limited thereto.

[0053] According to one embodiment, the vacuum cleaner body (111) may be formed so that the upper side is open. According to one embodiment, an internal space may be formed inside the vacuum cleaner body (111) in which various components for operating the robot vacuum cleaner (100) (e.g., the drive unit (360) of FIG. 3 or a liquid container) are disposed.

[0054] According to one embodiment, the vacuum cleaner cover (112) may form the upper exterior of the robot vacuum cleaner (100). According to one embodiment, the vacuum cleaner cover (112) may be attached to the upper side of the vacuum cleaner body (111). According to one embodiment, the vacuum cleaner cover (112) may be provided to cover an opening formed by the vacuum cleaner body (111). According to one embodiment, the vacuum cleaner cover (112) may be detachably attached to the vacuum cleaner body (111). After detaching the vacuum cleaner cover (112), the user may access the parts inside the main body (110) through the upper opening formed by the vacuum cleaner body (111). According to one embodiment, the vacuum cleaner body (111) and the vacuum cleaner cover (112) may be formed as a single unit.

[0055] According to one embodiment, the control panel (120) may be positioned on the upper part of the robot vacuum cleaner (100). For example, the control panel (120) may be positioned on the vacuum cleaner cover (112), but is not limited thereto.

[0056] According to one embodiment, the control panel (120) can receive various commands regarding the operation of the robot vacuum cleaner (100) from a user. According to one embodiment, the control panel (120) may include an input device such as a switch (e.g., a button), a wheel, or a touch panel. The robot vacuum cleaner (100) can receive commands regarding the operation of the robot vacuum cleaner (100) (e.g., start / stop cleaning, or change cleaning mode) from a user through the control panel (120). According to one embodiment, the control panel (120) may include a signal input device that receives various commands input by a user via an external remote control in the form of an infrared signal, but is not limited to a specific form.

[0057] According to one embodiment, the control panel (120) may provide the user with the current status regarding the operation of the robot vacuum cleaner (100). According to one embodiment, the control panel (120) may include a display device such as a display. The robot vacuum cleaner (100) may visually convey information regarding the current status of the robot vacuum cleaner (100) (e.g., current cleaning mode or battery status) to the user through the display device. According to one embodiment, the control panel (120) may be provided with the aforementioned input device or display device as a single unit.

[0058] According to one embodiment, the driving unit (130) may be positioned on the bottom surface of the vacuum cleaner body (111). The driving unit (130) may be configured to enable free movement of the robot vacuum cleaner (100). The robot vacuum cleaner (100) can move freely through the cleaning space via the driving unit (130).

[0059] According to one embodiment, the driving unit (130) may include at least one wheel that rotates by receiving power from a driving unit (e.g., the driving driving unit (361) of FIG. 3). For example, the driving unit (130) may include a pair of main wheels (e.g., a first main wheel (131a) and a second main wheel (131b)). The first main wheel (131a) and the second main wheel (131b) may be positioned to maintain the balance of the robot vacuum cleaner (100). For example, the first main wheel (131a) and the second main wheel (131b) may be positioned on each side edge of the bottom surface of the vacuum cleaner body (111).

[0060] According to one embodiment, the driving unit (130) may include a first sub-wheel (132) and / or a second sub-wheel (133). The first sub-wheel (132) and the second sub-wheel (133) may be positioned in the front (e.g., F direction) and the rear (e.g., R direction), respectively, in a direction orthogonal to the direction in which the first main wheel (131a) and the second main wheel (131b) are positioned.

[0061] According to one embodiment, the direction of movement of the robot vacuum cleaner (100) can be determined by how the movement of each of the first main wheel (131a) and the second main wheel (131b) is controlled. For example, the robot vacuum cleaner (100) can move forward (e.g., in the F direction) or backward (e.g., in the R direction) when the first main wheel (131a) and the second main wheel (131b) are each controlled at the same speed. For example, the robot vacuum cleaner (100) can move by switching the direction of movement to correspond to a preset direction when the first main wheel (131a) and the second main wheel (131b) are each controlled at a speed relative to each other.

[0062] According to one embodiment, the first sub-wheel (132) and the second sub-wheel (133) can each be positioned to maintain the balance of the robot vacuum cleaner (100) when the robot vacuum cleaner (100) moves forward (e.g., in the F direction) or backward (e.g., in the R direction). For example, the first sub-wheel (132) can be positioned at the front portion (e.g., in the F direction) of the bottom surface of the vacuum cleaner body (111). For example, the second sub-wheel (133) can be positioned at the rear portion (e.g., in the R direction) of the bottom surface of the vacuum cleaner body (111).

[0063] According to one embodiment, the cleaning cloth module (140) may be positioned at the bottom of the robot vacuum cleaner (100). For example, the cleaning cloth module (140) may be positioned on the bottom surface of the vacuum cleaner body (111). According to one embodiment, the cleaning cloth module (140) may be positioned in front of the bottom surface of the vacuum cleaner body (111) (e.g., in the F direction), but is not limited thereto. The cleaning cloth module (140) may be detachably coupled with a cleaning cloth (P) (e.g., a wet mop or a dry mop) for wiping a surface to be cleaned, such as a floor surface.

[0064] According to one embodiment, the cleaning cloth module (140) can rotate clockwise or counterclockwise together with the cleaning cloth (P) mounted on the cleaning cloth module (140). When the cleaning cloth module (140) rotates together with the cleaning cloth (P) coupled thereto, friction may occur between the cleaning cloth (P) and the floor surface, thereby allowing the robot vacuum cleaner (100) to remove foreign matter attached to the floor surface.

[0065] According to one embodiment, the cleaning cloth module (140) can rise or fall within a predetermined range in the height direction of the robot vacuum cleaner (100) (or, a direction approximately perpendicular to the ground) (e.g., U or D direction in FIG. 1).

[0066] According to one embodiment, the cleaning cloth module (140) may include a first cleaning cloth module (140a) or a second cleaning cloth module (140b). The first cleaning cloth module (140a) and the second cleaning cloth module (140b) may be configured to correspond to each other in terms of operation, structure, and shape.

[0067] According to one embodiment, the cleaning cloth module (140) may include a rotating member. For example, the first cleaning cloth module (140a) may include a first rotating member (141a), and the second cleaning cloth module (140b) may include a second rotating member (141b). A cleaning cloth (P) may be attached to the bottom surface of the rotating members (141a, 141b).

[0068] According to one embodiment, the first rotating member (141a) and the second rotating member (141b) may have an overall disc shape, but are not limited thereto. According to one embodiment, the diameter of the first rotating member (141a) may be set to be equal to or smaller than the diameter of the cleaning cloth (P), but is not limited thereto. The diameter of the second rotating member (141b) may be set to be equal to or smaller than the diameter of the cleaning cloth (P), but is not limited thereto.

[0069] According to one embodiment, the battery (150) may be positioned at the bottom of the robot vacuum cleaner (100). For example, the battery (150) may be detachably provided from the bottom surface of the vacuum cleaner body (111) downward, but the present disclosure is not limited thereto. According to one embodiment, the battery (150) may be electrically connected to a drive unit (e.g., drive unit (360) of FIG. 3) and may supply power to the drive unit (360). For example, the battery (150) may be electrically connected to a driving drive unit (e.g., driving drive unit (361) of FIG. 3) and may supply power to the driving drive unit (361). For example, the battery (150) may be electrically connected to a cleaning drive unit (e.g., cleaning drive unit (362) of FIG. 3) and may supply power to the cleaning drive unit (362). The battery (150) may be a rechargeable secondary battery, but is not limited thereto.

[0070] According to one embodiment, a driving unit (e.g., a driving unit (360) of FIG. 3) may be provided in at least a portion inside the main body (110) of the robot vacuum cleaner (100). For example, a driving unit (360) may be placed in at least a portion of the internal receiving space formed by the vacuum cleaner body (111). For example, the driving unit (360) may include a motor and / or actuator and may have a plurality of components for supplying power to each of the driving unit (130) and / or cleaning cloth module (140).

[0071] According to one embodiment, the robot vacuum cleaner (100) may include a liquid container (not shown) configured to store liquid for wet cleaning. For example, the liquid stored in the liquid container may be water, but is not limited thereto, and may be a liquid substance such as soap or solvent used for cleaning. The liquid container may be detachably placed within an internal receiving space of the vacuum cleaner body (111). A user may access the liquid container by detaching the vacuum cleaner cover (112) from the vacuum cleaner body (111) and opening the top of the vacuum cleaner body (111).

[0072] According to one embodiment, the robot vacuum cleaner (100) may include a liquid dispenser (not shown). For example, one end of the liquid dispenser may be fluidly connected to the liquid container, and the other end may be fluidly connected to a cleaning cloth module (140) positioned below the robot vacuum cleaner (100). For example, the liquid dispenser may be a pipe or a hose. The robot vacuum cleaner (100) may supply liquid (e.g., water) to a cleaning cloth (P) mounted on the cleaning cloth module (140) through the liquid container and / or the liquid dispenser.

[0073] Although not illustrated in FIGS. 1 and 2, the robot vacuum cleaner (100) may be equipped with a control unit (e.g., the control unit (350) of FIG. 3) that generates control commands for controlling the operation of each part of the robot vacuum cleaner (100). According to one embodiment, the control and operation of the robot vacuum cleaner (100) centered on the control unit (350) will be described with reference to FIG. 3.

[0074] FIG. 3 is a block diagram illustrating the relationships between components, focusing on the control and operation of a robot vacuum cleaner according to one embodiment of the present disclosure.

[0075] The configuration of the robot vacuum cleaner (100) of FIG. 3 may be substantially the same or similar to the configuration of the robot vacuum cleaner (100) of FIG. 1 and FIG. 2. FIG. 3 may describe a block diagram related to the control of the robot vacuum cleaner (100) of FIG. 1 and FIG. 2. For example, the robot vacuum cleaner (100) of FIG. 1 and FIG. 2 may include the configurations illustrated in FIG. 3. For example, the robot vacuum cleaner (100) of FIG. 3 may include the configurations illustrated in FIG. 1 and FIG. 2.

[0076] According to one embodiment, the robot vacuum cleaner (100) may include at least one of a sensing unit (310), a communication unit (320), an input unit (330), a memory (340), a control unit (350), or a driving unit (360).

[0077] According to one embodiment, the robot vacuum cleaner (100) may include a sensing unit (310). The sensing unit (310) may include a plurality of sensors, microphones and / or cameras for sensing the surrounding environment of the robot vacuum cleaner (100). For example, the sensing unit (310) may include a plurality of cameras to capture multiple directions. The sensors may include, but are not limited to, infrared sensors, ultrasonic sensors, radar sensors and / or lidar sensors.

[0078] According to one embodiment, the sensing unit (310) is coupled to each cleaning cloth module (e.g., cleaning cloth module (140) of FIG. 1) of the robot vacuum cleaner (100) and can detect the contamination level of each cleaning cloth (e.g., cleaning cloth (P) of FIG. 1) that is being used for cleaning.

[0079] According to one embodiment, the robot vacuum cleaner (100) may include a communication unit (320) that supports signal transmission and reception with the outside. For example, the communication unit (320) may receive and / or transmit wired / wireless signals between an external wired / wireless communication system, an external server, and / or other devices according to a predetermined wired / wireless communication protocol. For example, the communication unit (320) may transmit and receive data according to wireless internet communication protocols such as, for example, WLAN (Wireless LAN), Wi-Fi (Wireless-Fidelity), Wi-Fi Direct, DLNA (Digital Living Network Alliance), WiBro (Wireless Broadband), WiMAX (World Interoperability for Microwave Access), HSDPA (High Speed ​​Downlink Packet Access), HSUPA (High Speed ​​Uplink Packet Access), LTE (Long Term Evolution), or LTE-A (Long Term Evolution-Advanced). For example, the communication unit (320) can transmit and receive data according to any at least one short-range communication protocol, including, for example, Bluetooth, RFID (Radio Frequency Identification), Infrared Data Association (IrDA), UWB (Ultra-Wide Band), ZigBee, NFC (Near Field Communication), Wi-Fi, Wi-Fi Direct, and Wireless USB (Universal Serial Bus) technology.

[0080] According to one embodiment, the communication unit (320) can receive a setting data signal input by a user from a user's mobile device in the form of a wireless signal according to a predetermined wireless communication protocol. For example, the communication unit (320) can receive information and / or commands for controlling the operation of the robot vacuum cleaner (100) from an external server in the form of a signal according to a predetermined wired or wireless communication protocol. The communication unit (320) can transmit the received signals to the control unit (350) described later.

[0081] According to one embodiment, the communication unit (320) can transmit various data generated or acquired from the robot vacuum cleaner (100) in the form of wired or wireless signals according to a predetermined wired or wireless communication protocol, for example, to a user's mobile device or an external server.

[0082] According to one embodiment, the communication unit (320) may include a module for obtaining the location of the robot vacuum cleaner (100), for example, a GPS (global positioning system) module or a Wi-Fi module. If the robot vacuum cleaner (100) utilizes a GPS module, it can receive information regarding the location of the robot vacuum cleaner (100) using signals sent from GPS satellites. If the robot vacuum cleaner (100) utilizes a Wi-Fi module, it can receive information regarding the location of the robot vacuum cleaner (100) based on information from a wireless access point (AP) that transmits and receives wireless signals to and from the Wi-Fi module.

[0083] According to one embodiment, the robot vacuum cleaner (100) may include an input unit (330). The input unit (330) may receive information regarding the operation mode of the robot vacuum cleaner (100) from a user. For example, the input unit (330) may be composed of a device such as a keypad, a dome switch, a touch pad (pressure-type or capacitive), a jog wheel, a jog switch, or a remote control. In addition to the input unit (330) described above, the user may input information regarding the operation mode of the robot vacuum cleaner (100) using a portable device such as a terminal.

[0084] According to one embodiment, the robot vacuum cleaner (100) may include a memory (340). The memory (340) may include a circuit. According to one embodiment, the memory (340) may store data that supports various functions of the robot vacuum cleaner (100). For example, the memory (340) may store a number of applications (or applications) used in the robot vacuum cleaner (100), data for the operation of the robot vacuum cleaner (100), and / or commands. At least some of the applications may be downloaded from an external server via wireless communication. At least some of the applications may be stored in the memory (340) from the time of shipment for the basic functions of the robot vacuum cleaner (100). For example, the applications may be stored in the memory (340) and driven by the control unit (350) to perform the operation (or function) of the robot vacuum cleaner (100). According to one embodiment, the memory (340) may be included as part of the configuration of the control unit (350). According to one embodiment, the memory (340) can store information for setting the driving path of the robot vacuum cleaner (100).

[0085] According to one embodiment, the robot vacuum cleaner (100) may include a control unit (350). According to one embodiment, the control unit (350) may control the operation of the robot vacuum cleaner (100) using a signal received from a sensing unit (310), a communication unit (320), or an input unit (330). The control unit (350) may include at least one processor.

[0086] According to one embodiment, the control unit (350) may include at least one of a circuit such as a CPU (Central Processing Unit), MPU (Microprocessor Unit), GPU (Graphics Processing Unit), APU (Accelerated Processing Unit), DSP (Digital Signal Processor), FPGA (Field-Programmable Gate Array), CP (Control Processor), AP (Application Processor), SoC (System on Chip), or IC (Integrated Circuit).

[0087] According to one embodiment, the control unit (350) may include a command receiving unit (351). The command receiving unit (351) may receive operation-related commands input from the outside through the detection unit (310), the communication unit (320), and / or the input unit (330). The command receiving unit (351) may receive commands from a user received from the power button (113) and / or the control panel (120). For example, the command receiving unit (351) may receive each user command, including an operation on / off command, a cleaning start or pause command, or a cleaning mode setting command.

[0088] According to one embodiment, the control unit (350) may include a cleaning cloth replacement determination unit (352) that determines whether a cleaning cloth (P) attached to a cleaning cloth module (140) needs to be replaced during the cleaning process of the robot vacuum cleaner (100). According to one embodiment, the cleaning cloth replacement determination unit (352) may acquire a detection result from a contamination sensor (not shown) provided in the detection unit (310) and determine whether the cleaning cloth (P) needs to be replaced according to the acquired information. According to one embodiment, the cleaning cloth replacement determination unit (352) may determine whether the cleaning cloth (P) needs to be replaced according to the cleaning time elapsed after attaching the cleaning cloth (P) to the cleaning cloth module (140). According to one embodiment, the cleaning cloth replacement determination unit (352) may determine whether the cleaning cloth (P) needs to be replaced according to a command received from a command receiving unit (351).

[0089] According to one embodiment, the control unit (350) may include a driving path calculation unit (353) that calculates the driving path of the robot vacuum cleaner (100). According to one embodiment, the driving path calculation unit (353) may calculate the driving path of the robot vacuum cleaner (100) based on a predetermined algorithm, detection results detected by various sensors provided in the detection unit (310), and / or user commands received through the command receiving unit (351). According to one embodiment, the driving path calculation unit (353) may calculate the driving path by considering the detection results from the sensors provided in the detection unit (310).

[0090] According to one embodiment, when the cleaning cloth replacement determination unit (352) determines that the cleaning cloth (P) needs to be replaced, the driving path calculation unit (353) can calculate a driving path that moves the robot vacuum cleaner (100) to a preset position. For example, when the cleaning cloth replacement determination unit (352) determines that the cleaning cloth (P) needs to be replaced in the robot vacuum cleaner (100), it can calculate a driving path that drives the robot vacuum cleaner (100) to a docking station.

[0091] According to one embodiment, the control unit (350) may include a drive unit control command unit (354). According to one embodiment, the drive unit control command unit (354) may generate a control command to control each component of the drive unit (360) of the robot vacuum cleaner (100), such as each motor and / or actuator of each drive unit (360), according to various commands received from a user or external source through the aforementioned command receiving unit (351), detection results detected by various sensors equipped in the detection unit (310) of the robot vacuum cleaner (100), and / or a driving path determined by the driving path calculation unit (353).

[0092] According to one embodiment, each component of the drive unit (360) can operate according to a command generated by the drive unit control command unit (354). According to one embodiment, the drive unit (360) may include a driving drive unit (361) and a cleaning drive unit (362).

[0093] According to one embodiment, the driving / movement of the robot vacuum cleaner (100) can be controlled according to a command generated by the driving unit control command unit (354). For example, according to a command generated by the driving unit control command unit (354), the driving unit (e.g., driving driving unit (361)) can operate to control the rotation direction and / or speed of the main wheel (e.g., the first main wheel (131a) or the second main wheel (131b) of FIG. 2).

[0094] According to one embodiment, the driving drive unit (361) may be provided to include a pair of driving drive units. According to one embodiment, each of the pair of driving drive units (361) may include a motor and an actuator configuration. Each of the pair of driving drive units (361) may be connected to the first main wheel (131a) and the second main wheel (131b) of the aforementioned driving unit (e.g., the driving unit (130) of FIG. 1) to provide the power required to move the robot vacuum cleaner (100).

[0095] According to one embodiment, the rotation and / or vertical movement of the cleaning cloth module (e.g., the cleaning cloth module (140) of FIG. 2) can be controlled according to a command generated by the drive unit control command unit (354). For example, the vertical movement of the cleaning cloth module (140) can be controlled according to a command generated by the drive unit control command unit (354). Accordingly, the distance between the cleaning cloth module (140) and the floor surface can be adjusted. For example, according to a command generated by the drive unit control command unit (354), the cleaning drive unit (262) can operate to appropriately adjust the rotation speed of each rotating member (141a, 141b) of the cleaning cloth module (140). In this case, the floor surface cleaning intensity of the robot vacuum cleaner (100) can be adjusted.

[0096] According to one embodiment, the cleaning drive unit (362) may include a pair of cleaning drive units (362). Each of the pair of cleaning drive units (362) may include a rotary motor and an actuator configuration and may be connected to each of the aforementioned cleaning cloth modules (140), such as a first cleaning cloth module (e.g., the first cleaning cloth module (140a) of FIG. 2) and a second cleaning cloth module (e.g., the second cleaning cloth module (140b) of FIG. 2), to provide the power required to rotate the rotating members (141a, 141b) of each cleaning cloth module.

[0097] According to one embodiment, the cleaning cloth module (140) can be separated from the cleaning drive unit (362) according to a command generated by the drive unit control command unit (354). By the drive unit control command unit (354), the cleaning drive unit (362) can separate the cleaning cloth module (140) from the cleaning drive unit (362) by moving the cleaning cloth module (140) upward. A detailed description of the operation in which the robot vacuum cleaner (100) automatically separates the cleaning cloth module (140) from the cleaning drive unit (362) will be provided later.

[0098] FIG. 4 is an exploded perspective view showing a circuit board, a display module, and a case having a shielding and heat dissipation structure arranged thereon, according to one embodiment of the present disclosure.

[0099] According to one embodiment, a robot vacuum cleaner (e.g., the robot vacuum cleaner (100) of FIGS. 1 and 2) includes a control panel (e.g., the control panel (120) of FIGS. 1 and 2), and the control panel (120) can be understood as an interface for controlling the operation of the robot vacuum cleaner (100). The control panel (120) may include an interface such as a display unit, buttons, and / or a jog shuttle that provides cleaning information (e.g., setting information or operation status information) input by a user. The display unit may include a display module (410) for being visible in the field of view, and a case (420) for covering the display module (410).

[0100] According to one embodiment, the display module (410) may include a display panel (411), a front plate (412), and a circuit board (510) to visually provide information to a user from the robot vacuum cleaner (100). The display module (410) may visually provide information to an outside (e.g., a user) of the home appliance (e.g., the robot vacuum cleaner (100)). The display module (410) may include, for example, a display, a holographic device, or a projector and a control circuit (e.g., a circuit board (510)) for controlling said device.

[0101] According to one embodiment, the display module (410) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by the touch.

[0102] According to one embodiment, the display panel (411) may output a screen or be visually exposed through a significant portion of the front (e.g., front plate (412)). The display panel (411) may be combined with or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting magnetic field contact.

[0103] According to one embodiment, the front plate (412) may be formed of a material in which at least a portion is substantially transparent (e.g., a glass plate including various coating layers, or a polymer plate). The front plate (412) is exposed to the outside of the home appliance and can protect the display panel (411).

[0104] According to one embodiment, the display module (410) may include a circuit board (510). The circuit board (510) may be a rigid circuit board or a flexible circuit board. The circuit board (510) may be electrically connected to the display panel (411). A plurality of electronic components may be disposed on the circuit board (510). For example, the circuit board (510) may be equipped with a processor, memory, and / or an interface. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0105] According to one embodiment, some of the electronic components may generate a large amount of noise or heat. Accordingly, in order to maintain the performance of other adjacent electronic components, said electronic components need to shield electromagnetic noise or efficiently dissipate the generated heat. A heat dissipation structure (500) for the electronic components for shielding and / or heat dissipation may be configured on the circuit board (510). Specific details of the heat dissipation structure (500) will be described later.

[0106] According to one embodiment, an electronic component for shielding and / or heat dissipation may be named a processor. The processor may, for example, execute software (e.g., a program) to control at least one other component (e.g., a hardware or software component) of a home appliance connected to the processor and perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor may store commands or data received from other components (e.g., a sensor module or a communication module) in volatile memory, process the commands or data stored in volatile memory, and store the resulting data in non-volatile memory. According to one embodiment, the processor may include a main processor (e.g., a central processing unit or an application processor) or an auxiliary processor (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with it. For example, if the home appliance includes a main processor and an auxiliary processor, the auxiliary processor may be configured to use lower power than the main processor or to be specialized for a designated function. The auxiliary processor can be implemented separately from the main processor or as part of it.

[0107] In one embodiment, the case (420) may cover the side and rear of the display module (410). For example, the case (420) may be formed of a metal material and / or a non-metal (e.g., polymer) material. If the case (420) is formed at least partially of a metal material, a portion may function as an antenna.

[0108] According to one embodiment, a case (420) and a front plate (412) may be combined and named a housing. The housing (e.g., case (420)) may generally be defined as a structure for accommodating, protecting, or housing a circuit board (510) or related components.

[0109] According to one embodiment, a designated space (e.g., an air space) may be provided between one side (e.g., the rear) of the case (420) and the heat dissipation structure (500), and said space may provide a place or area that efficiently diffuses heat dissipated from the heat dissipation structure (500).

[0110] FIG. 5 is a perspective view showing a structure (e.g., a heat dissipation structure) for shielding and heat dissipation of an electronic component according to one embodiment of the present disclosure.

[0111] FIG. 6 is a cross-sectional view taken along the A-A' direction of FIG. 5 of a structure for shielding and heat dissipation of an electronic component (e.g., a heat dissipation structure) according to one embodiment of the present disclosure.

[0112] FIG. 7 is a cross-sectional view taken along the B-B' direction of FIG. 5 of a structure for shielding and heat dissipation of an electronic component (e.g., a heat dissipation structure) according to one embodiment of the present disclosure.

[0113] According to one embodiment, a home appliance (e.g., a robot vacuum cleaner (100) of FIGS. 1 and 2) may include a heat dissipation structure (500). The heat dissipation structure (500) may include at least one of a circuit board (510), at least one electronic component (520), a heat transfer member (e.g., a heat transfer member (530) of FIGS. 6 and 7), a shield can (540), and / or a heat sink (550).

[0114] According to one embodiment, the configuration of the heat dissipation structure (500) of the home appliance (e.g., the robot vacuum cleaner (100) of FIGS. 5 to 7) may be partially or entirely identical to the configuration of the heat dissipation structure (500) of FIGS. 4. The embodiments of FIGS. 5 to 7 may be optionally combined with the embodiments of FIGS. 1 to 4 and FIGS. 8 to 20b.

[0115] In FIGS. 5 to 7, '+Z or -Z' may indicate the upper and lower directions when viewing the heat dissipation structure (500) from the side (cross-section). '+Z or -Z' may indicate the front and rear directions relative to a home appliance (e.g., a robot vacuum cleaner (100)).

[0116] According to one embodiment, a plurality of electronic components may be disposed on one side of the circuit board (510). For example, a plurality of electronic components may be mounted on the circuit board (510). According to one embodiment, some of the electronic components (520)(s) among the plurality of electronic components may be heat-generating heat sources, for example, at least one chip disposed on at least one side of the circuit board (510), and may include at least one of a PMIC (power management integrated circuit), PAM (power amplifier), AP (application processor), CP (communication processor), Charger IC (charge integrated circuit), Driver IC (drive integrated circuit), or DC converter.

[0117] According to one embodiment, a plurality of electronic components may include a first electronic component (521)(s) and a second electronic component (522)(s). One of the first electronic components (521)(s) may be an application processor (AP), and the first electronic components (521)(s) may be located inside the shield can (540). The second electronic components (422)(s) may be located outside the shield can (540). For example, electromagnetic waves (e.g., noise) generated from the first electronic components (520)(s) may be shielded by the shield can (540).

[0118] According to one embodiment, the shield can (540) may be formed to be combined with the circuit board (510) and to enclose an electronic component (520) (e.g., a first electronic component (521)). For example, the shield can (540) may be mounted on the circuit board (510) in a state that accommodates the electronic component (520).

[0119] According to one embodiment, the shield can (540) is coupled to a circuit board (510) in a state of accommodating an electronic component (520) (or a heat transfer member (530)) and may include at least one opening (540a) formed to correspond to a part of the electronic component (520) (or a heat transfer member (530)). The opening (540a) may provide a space in which the heat transfer member (530) disposed on the electronic component (520) is disposed. For example, a part of the heat transfer member (530) may be positioned to pass through the opening (540a).

[0120] According to one embodiment, heat generated in an electronic component (520) can be transferred to a heat sink (550) through a heat transfer member (530) via an opening (540a). The opening (540a) may be sized to allow the heat transfer member (530) to pass through and may correspond to the upper surface of a plurality of electronic components (520).

[0121] According to one embodiment, a heat transfer member (530) may cover the upper surface of an electronic component (520) so that at least a portion of the electronic component (520) is not visible or exposed when viewed from above the shield can (540) (e.g., when viewed in a second direction (-Z axis direction). According to one embodiment, the shield can (540) may cover the upper surface of an electronic component (520) so that at least a portion of the electronic component (520) is not visible or exposed when viewed from above the shield can (540) (e.g., when viewed in a second direction (-Z axis direction).

[0122] According to one embodiment, when viewed from the side of the shield can (540), the shield can (540) can cover the side of the electronic component (520) so that the electronic component (520) is not visible or exposed from view. For example, if the electronic component (520) is in the shape of a cuboid, the shield can (540) may be in the shape of a cuboid with one side open to cover the sides of the electronic component (520) so that all four sides of the electronic component (520) are not visible from view.

[0123] According to one embodiment, the shield can (540) may include a support portion (541) that supports a heat sink (550), a side wall (543) that extends from the support portion (541) and is formed to surround at least a portion of an electronic component (520) or a heat sink (550), a connection portion (545) formed on one side of the side wall (543) to be connected to a circuit board (510), and a fastening portion (547) formed on the inner side of the side wall (543) to be fastened to the heat sink (550).

[0124] According to one embodiment, the support portion (541) of the shield can (540) may include an edge portion (5411) formed to support an edge region of the heat sink (550) and arranged parallel to face the circuit board (510), and an extension portion (5412) formed to support a portion of the center region of the heat sink (550) and extending to connect the regions facing each other among the edge portions (5411). According to one embodiment, the support portion (541) may form the upper surface of the shield can (540), and the support portion (541) may be a portion formed to surround the outer side of the opening (540a) for forming the opening (540a).

[0125] According to one embodiment, when viewed from above, the edge portion (5411) of the rectangular shield can (540) may be arranged adjacent to the side walls (543). The edge portion (5411) may be formed as a single unit or as a plurality of separate units. The edge portion (5411) may be in the shape of a plate, extending vertically from the side walls (543) into the interior of the shield can (540). For example, when viewed from above, the edge portion (5411) may be in the shape of a square.

[0126] According to one embodiment, when viewed from above, the rectangular shield can (540) may be positioned between spaced-apart regions of the edge portion (5411), connecting the spaced-apart regions, and positioned to traverse the interior of the shield can (540). In an automated process, to place the shield can (540) on a circuit board (510), the shield can (540) may be suctioned and moved using a suction gripper (or vacuum gripper). In this case, the extension portion (5412) may be used as a flat surface for the suction gripper to lift the shield can (540) through vacuum suction.

[0127] According to one embodiment, the side wall (543) of the shield can (540) may include an upper side wall (5431) forming an upper portion (e.g., a portion facing the +Z axis) and a lower side wall (5432) forming a lower portion (e.g., a portion facing the -Z axis). The side wall (543) of the shield can (540) forms the edge of the shield can (540) and may support the shield can (540) as a whole. The upper side wall (5431) may be positioned to enclose a portion of the heat sink (550). The lower side wall (5432) may be positioned to enclose at least a portion of the electronic component (520) and / or the heat transfer member (530).

[0128] According to one embodiment, the side wall (543) of the shield can (540) may extend in a direction perpendicular to the circuit board (510). According to one embodiment, when the shield can (540) is formed by manufacturing a single conductive plate through a plurality of bending processes, the bottom side wall (5432) may have a plate shape of two layers spaced apart from each other (e.g., an inner bottom wall (5432a) and an outer bottom wall (5432b)), and the top side wall (5431) may extend from the outer bottom wall (5432b) to the heat sink (550). For example, through a multiple bending process of a single conductive plate, a lower side wall (5432) extending from an edge portion (5411) may include an inner lower wall (5432a) extending in the -Z axis direction perpendicular to the edge portion (5411) and an outer lower wall (5432b) parallel to the inner lower wall (5432a). The portion connecting the inner lower wall (5432a) and the outer lower wall (5432b) may be a connecting portion (545) coupled with a circuit board (510).

[0129] According to one embodiment, the inner faces of the lower side wall (5432) of the shield can (540) may be spaced apart from the electronic component (520). According to one embodiment, the inner faces of the inner lower wall (5432a) of the shield can (540) may be spaced apart from the heat transfer member (530). For example, the electronic component (520) and / or the heat transfer member (530) have a cuboidal shape and are mounted on a circuit board (510), and the four outer faces of the electronic component (520) and / or the heat transfer member (530) may face each of the inner faces of the inner lower wall (5432a) while spaced apart from them.

[0130] According to one embodiment, the outer surfaces of the lower side wall (5432) (e.g., outer lower wall (5432b)) of the shield can (540) form the outer surface of the shield can (540) and may extend from one end of the connecting portion (545) to the upper side wall (5431). The inner lower wall (5432a) and the outer lower wall (5432b) of the lower side wall (5432) may extend parallel to each other and perpendicular to the circuit board (510).

[0131] According to one embodiment, the inner faces of the upper side wall (5431) of the shield can (540) may be positioned to surround the lower portion (e.g., base (551)) of the heat sink (550). The heat sink (550) may be located in the space formed by the upper side wall (5431) of the shield can (540) and may be fitted into the upper side wall (5431). The horizontal movement of the heat sink (550) may be restricted by the upper side wall (5431) of the shield can (540). For example, if the lower portion (e.g., base (551)) of the heat sink (550) is square in shape, the upper side wall (5431) may be formed to surround the outer surface of the square shape, thereby restricting the horizontal movement of the heat sink (550) (e.g., X-axis and Y-axis directions). As a result, the heat sink (550) remains fixed to the shield can (540) and may not be dislodged by external impact. Movement of the heat sink (550) in the Z-axis direction may be limited by the fastening part (547) of the shield can (540), which will be described below.

[0132] According to one embodiment, the fastening portion (547) of the shield can (540) may be formed in a plurality of portions that protrude from the inner side of the side wall (543) and can be fastened to the lower portion (e.g., base (551)) of the heat sink (550). The fastening portion (547) may extend from the upper side wall (5431) and be fastened to the lower portion (e.g., base (551)) of the heat sink (550) in a snap-fit ​​manner.

[0133] According to one embodiment, the fastening portion (547) of the shield can (540) has a shape such as a hook and can be named at least one of a hanger, a clip, a locking structure, or a grapple.

[0134] According to one embodiment, when a shield can (540) is formed by manufacturing a single conductive plate through a plurality of bending processes, the fastening portion (547) can be manufactured in a hook shape by pressing a part of the upper side wall (5431) inwardly after the upper side wall (5431) is completed.

[0135] According to one embodiment, the fastening portions (547) of the shield can (540) may have an inclined tapered shape arranged on the upper side wall (5431). The fastening portions (547) may include first hooks (5471) arranged along one side of the upper side wall (5431) and second hooks (5472) arranged along the other side of the upper side wall (5431) parallel to said side. The fastening portions (547) of the shield can (540) may restrict vertical movement (e.g., Z-axis direction) of the heat sink (550) so that the heat sink (550) seated on the shield can (540) is fixed. The heat sink (550) is restricted from moving in a planar direction (e.g., XY axis direction) by the upper side wall (5431) in addition to the vertical direction of the fastening part (547), so that it can be fixed to the shield can (540) and not be detached by external impact.

[0136] According to one embodiment, the shield can (540) can be coupled to the circuit board (510) through a connecting portion (545) formed at the bottom of the side wall (543). The shield can (540) can be coupled to one side of the circuit board (510) (e.g., one side facing the +Z axis direction). For example, a plurality of pads may be disposed on the circuit board (510) in an area facing the shield can (540), and the connecting portion (545) of the shield can (540) and the plurality of pads of the circuit board (510) may be coupled by a soldering method. For example, a plurality of clips may be disposed on the circuit board (510) in an area facing the shield can (540). The connecting portion (545) (and side wall (543)) of the shield can (540) can be fitted into a plurality of clips placed on the circuit board (510) to secure the shield can (540) to the circuit board (510). For example, the circuit board (510) includes a plurality of through holes, and after pushing the snap-fit ​​shaped connecting portion (545) of the shield can (540) into the through holes of the circuit board (510), the portion of the connecting portion (545) that passes through the through holes can be secured by hooking it onto the lower surface of the circuit board (510).

[0137] According to one embodiment, the shield can (540) and the heat sink (550) may be designed to completely seal the electronic component (520). For example, when looking at a cross-section of the heat dissipation structure (500), the shield can (540) and the heat sink (550) may be manufactured in a shape (e.g., a closed square loop) that completely encloses the electronic component (520) together with the circuit board (510). For example, as the top surface of the electronic component (520) is covered by the shield can (540) and the heat sink (550), the sides of the electronic component (520) are covered by the shield can (540), and the bottom surface of the electronic component (520) is covered by the circuit board (510), the heat dissipation structure (500) may provide a shielding function against electromagnetic waves that may be generated by the electronic component (520).

[0138] According to one embodiment, the shield can (540) may provide a heat conduction function for transferring heat generated by the electronic component (520) to the outside of the electronic component (520). For example, the upper surface of the shield can (540) may be in contact with a heat transfer member (530) or a heat sink (550) disposed on the electronic component (520), and the lower surface may be in contact with a circuit board (510). The shield can (540) may receive heat generated from the electronic component (520) from the heat transfer member (530) and / or the heat sink (550) and provide it to the circuit board (510).

[0139] According to one embodiment, the shield can (540) may be manufactured with various thicknesses capable of efficiently shielding electromagnetic waves (e.g., noise) of the electronic component (520). According to one embodiment, the thickness of the shield can (540) may be smaller than the thickness of the electronic component (520). For example, the thickness of the shield can (540) may have a size that is 0.15 to 0.25 times the thickness of the electronic component (520). For example, if the thickness of the electronic component (520) is approximately 0.9 to 1.3 mm, the thickness of the shield can (540) may be approximately 0.1 mm to 0.3 mm. For example, if the thickness of the electronic component (520) is approximately 1.1 mm, the thickness of the shield can (540) may be approximately 0.2 mm.

[0140] According to one embodiment, the shield can (540) may be manufactured from various materials capable of efficiently shielding electromagnetic waves of an electronic component (520). According to one embodiment, the shield can (540) may be formed from a metal material to reduce or limit electromagnetic waves (e.g., noise). For example, the material of the shield can (540) may include at least one of stainless steel (SUS), magnesium (Mg), copper (Cu), aluminum (Al), tungsten (W), nickel (Ni), or an alloy of at least some of these. According to the present disclosure, the shield can (540) may be manufactured from stainless steel (SUS).

[0141] According to one embodiment, a heat transfer member (520) is positioned between an electronic component (520) and a heat sink (550) so that heat generated from the electronic component (520) can be easily transferred to the heat sink (550). For example, the upper surface of the heat transfer member (530) may be positioned in contact with the heat sink (550), and the lower surface may be positioned in contact with the electronic component (520). As the heat transfer member (530) is positioned in direct contact with the electronic component (520) and the heat sink (550), heat generated from the electronic component (520) can be rapidly transferred to the heat sink (550).

[0142] According to one embodiment, the heat transfer member (530) may have an area corresponding to that of the electronic component (520). For example, the area of ​​the heat transfer member (530) may be substantially the same as the area of ​​the electronic component (520). Accordingly, when looking over the heat transfer member (530) or toward the opening of the shield can (540), the heat transfer member (530) may be formed so that the electronic component (520) is not visible in the field of view.

[0143] According to one embodiment, the area of ​​the heat transfer member (530) may be designed to be larger than the area of ​​the electronic component (520). For example, in order for heat generated from the electronic component (520) to rapidly diffuse and dissipate to the heat transfer member (530) in contact with the upper side, the area of ​​the first heat transfer member (530) may be larger than the area of ​​the electronic component (520).

[0144] According to one embodiment, the heat transfer member (530) may have a size that covers a plurality of electronic components (520). For example, the area of ​​the heat transfer member (530) may be formed to cover the area of ​​the electronic components (520). Accordingly, when looking up at the heat transfer member (530) or toward the opening of the shield can (540), the heat transfer member (530) may be formed so that the electronic components (520) are not visible in the field of view.

[0145] According to one embodiment, the heat transfer member (530) may be positioned so that at least a portion penetrates the opening (540a) of the shield can (540). The heat transfer member (530) needs to improve heat dissipation performance by rapidly transferring heat generated from the electronic component (520) to the conductive plate (570). Accordingly, the heat transfer member (530) may be formed to penetrate the opening (540a) formed in the shield can (540) and come into direct contact with the heat sink (550).

[0146] According to one embodiment, the heat transfer member (530) includes an upper portion and a lower portion, the upper portion is positioned to penetrate the opening (540a) of the shield can (540), and the lower portion is positioned so as not to overlap with the upper surface of the shield can (540) (e.g., support portion (541)). According to one embodiment, when designing the heat dissipation structure (500), a portion of the upper portion of the heat transfer member (530) can be made to protrude over the opening of the shield can (540) and then flattened with the upper surface of the shield can (540) by the pressure of the heat sink (550). The sides of the upper portion of the heat transfer member (530) can be formed to be surrounded by the support portion (541) of the shield can (540) (e.g., edge portion (5411) or extension portion (5412)). The sides of the upper portion of the heat transfer member (530) may be spaced apart from the support portion (541) of the shield can (540). According to one embodiment, the sides of the lower portion of the heat transfer member (530) may be positioned to be exposed to air so as not to come into contact with other parts. The sides of the lower portion of the heat transfer member (530) may be positioned facing the side wall (543) of the shield can (540) (e.g., inner bottom wall (5432a)).

[0147] According to one embodiment, the heat transfer member (530) may include a thermal interface material (TIM) capable of easily transferring heat generated from an electronic component (520). For example, the TIM used as the heat transfer member (530) may include at least one of a carbon fiber-based thermal interface material, a silicon-based TIM, a graphene substrate TIM, and / or an acrylic-based TIM. For example, the TIM used as the heat transfer member (530) may include at least one of a liquid phase thermal interface material and / or a solid phase thermal interface material. However, the heat transfer member (530) is not limited to a TIM and may include various heat dissipation materials or members for transferring heat generated from the electronic component (520) to the outside of the appliance or to a conductive plate (570).

[0148] According to one embodiment, the heat transfer member (530) may be configured to include at least one of a heat pipe, a vapor chamber, a heat dissipation sheet, and / or a heat dissipation paint that can easily transfer heat generated from an electronic component (520). Here, the material of the heat dissipation sheet or the heat dissipation paint may include, for example, a high thermal conductivity material such as graphite, carbon nanotubes, natural renewable materials, silicon, or silicon.

[0149] According to one embodiment, the heat transfer member (530) is formed of an adhesive material and may be formed to be bonded to an electronic component (520) and a heat sink (550). The heat transfer member (530) can fill the fine gap between the electronic component (520) and the heat sink (550) and increase the contact surface area to improve heat transfer efficiency. Accordingly, heat can be effectively (e.g., quickly) transferred from the electronic component (520) to the heat sink (550).

[0150] According to one embodiment, the heat transfer member (530) can flow in an upward and downward direction perpendicular to the circuit board (510). For example, the heat transfer member (530) may be formed to be able to flow in a second direction (-Z) toward the electronic component (520) and a first direction (+Z) opposite to the second direction (-Z). The heat transfer member (530) may be provided with an elastic material to increase adhesion with the contacting components and to limit or reduce the impact directly applied to the electronic component (520) when an external force is applied due to an external impact.

[0151] According to one embodiment, the heat transfer member (530) can be manufactured in various shapes and thicknesses to efficiently transfer heat from the electronic component (520) and to optimize the design of the heat dissipation structure (500) together with the shield can (540) and heat sink (550). According to one embodiment, the heat transfer member (530) can be formed in a cuboid shape. The upper and lower surfaces of the heat transfer member (530) are formed with substantially the same area or the upper surface has a larger area than the lower surface, and are formed as flat surfaces to make full contact with one surface of the electronic component (520) and one surface of the heat sink (550), respectively, thereby increasing heat transfer performance.

[0152] According to one embodiment, the thickness of the heat transfer member (530) may be smaller than the thickness of the electronic component (520). For example, the thickness of the heat transfer member (530) may have a size that is 0.4 to 0.6 times the thickness of the electronic component (520). For example, if the thickness of the electronic component (520) is approximately 0.9 to 1.3 mm, the thickness of the heat transfer member (530) may be approximately 0.3 mm to 0.7 mm. For example, if the thickness of the electronic component (520) is approximately 1.1 mm, the thickness of the first heat transfer member (530) may be approximately 0.5 mm.

[0153] According to one embodiment, the heat transfer member (530) may be composed of a plurality of members. FIGS. 5 to 7 disclose a single heat transfer member (530) disposed in direct contact with an electronic component (511) and a heat sink (550), but is not limited thereto, and heat transfer members of various materials and sizes capable of efficiently transferring heat between the electronic component (511) and the heat sink (550) may be disposed therein.

[0154] According to one embodiment, the heat sink (550) may be disposed on the shield can (540) and formed to easily diffuse heat transferred from the electronic component (520) by contacting the heat transfer member (530). For example, the heat sink (550) may be supported by the support portion (541) of the shield can (540) and may diffuse the heat received from the heat transfer member (530) throughout through the base (551) of the heat sink (550) or dissipate heat into the air above through the heat dissipation fins (552) of the heat sink (550).

[0155] According to one embodiment, the heat sink (550) may include a base (551) for being seated on a shield can (540), a plurality of heat dissipation fins (552) for easily dissipating heat into the air, a flat surface (553) adjacent to the heat dissipation fins (552), and a step (554) that is coupled with a fastening part (547).

[0156] According to one embodiment, when viewed from above (e.g., in the second direction (-Z-axis direction)) the heat sink (550) is positioned to cover the opening (540a) of the shield can (540) and the heat transfer member (530) positioned to penetrate the opening (540a), so that the shield can (540) and the heat transfer member (530) are not visible or exposed from view.

[0157] According to one embodiment, when viewed from the side of the heat sink (550), the heat sink (550) may be arranged to be enclosed by a case (e.g., case (420) of FIG. 4), a shield can (540), and a heat transfer member (530). For example, the upper side of the heat sink (550) may be exposed to the air, and the lower side may be in contact with the heat transfer member (530).

[0158] According to one embodiment, the base (551) of the heat sink (550) may be positioned to be surrounded by the upper side wall (5431) of the shield can (540). The horizontal movement of the heat sink (550) may be restricted by the upper side wall (5431) of the shield can (540). For example, if the base (551) of the heat sink (550) is square in shape, the upper side wall (5431) may be formed to surround the outer surface of the square shape, thereby restricting the movement of the heat sink (550) in the X-axis and Y-axis directions.

[0159] According to one embodiment, a step (554) is disposed on one side of the base (551) of the heat sink (550) so as to be coupled with the fastening portion (547) of the shield can (540). For example, the base (551) may have a first step (5541) formed in an area corresponding to the first hooks (5471) of the fastening portion (547) and a second step (5542) formed in an area corresponding to the second hooks (5472). The first step (5541) is formed on one side of the base (551), and the second step (5542) is formed on the other side of the base (551), and may face in opposite directions. As the first step (5541) of the heat sink (550) is fitted onto the first hooks (5471) of the fastening portion (547), a portion of the first hook (5471) may be positioned on the first step (5541), and as the second step (5542) of the heat sink (550) is fitted onto the second hooks (5472) of the fastening portion (547), a portion of the second hook (5472) may be positioned on the second step (5542). Accordingly, the fastening portions (547) of the shield can (540) may restrict the heat sink (550) seated on the shield can (540) from moving in a vertical direction (e.g., Z-axis direction).

[0160] In FIGS. 6 and 7, the first step (5541) and the second step (5542) face each other and are formed only on a part of the square-shaped base (551), but are not limited thereto and can be designed to be changed to various positions so as to stably fix the heat sink (550).

[0161] According to one embodiment, the bottom surface of the base (551) of the heat sink (550) may be supported by the support portion (541) of the shield can (540). The edge portion (5411) of the support portion (541) may be formed to support the edge of the heat sink (550). For example, the edge portion (5411) may support each of the four corners of the square-shaped base (551), thereby allowing the heat sink (550) to remain stable without shaking. The connecting portion (545) of the support portion (541) may be formed to support the center portion of the heat sink (550). The connecting portion (545) of the support portion (541), together with the edge portion (5411), can stably support the heat sink (550).

[0162] According to one embodiment, a plurality of heat dissipation fins (552) of a heat sink (550) may extend upward from a base (551) and be arranged in parallel. The thickness of each of the plurality of heat dissipation fins (552) (e.g., length along the Z-axis) may be greater than the thickness of the base (551).

[0163] According to one embodiment, a plurality of heat dissipation fins (552) can rapidly absorb heat transferred to the base (551) and diffuse the heat over a wide surface area to release it to the outside (e.g., outside of the heat dissipation structure (500)). The heat diffusion method can be achieved through conduction and convection. The plurality of heat dissipation fins (552) are designed in a way that optimizes airflow so that heat can be efficiently released through air circulation. For example, as air flows between the heat dissipation fins (552), heat can be effectively transferred to provide a cooling function.

[0164] According to one embodiment, a flat surface (553) may be formed on the upper side of the heat sink (550). In an automated process, to align and place the heat sink (550) on a shield can (540), the heat sink (550) may be moved after suctioning using a suction gripper (or vacuum gripper). In this case, the flat surface (553) of the heat sink (550) may be used as a surface for the suction gripper to lift the heat sink (550) through vacuum suction. For the suction gripper to stably lift the heat sink (550), suction points may be required for mutually facing edge regions of the heat sink (550), for example, two or more suction points. Accordingly, the flat surface (553) of the heat sink (550) may be formed to encompass both edge regions in the X-axis direction or both edge regions in the Y-axis direction.

[0165] According to one embodiment, the flat surface (553) of the heat sink (550) is designed to have a height (e.g., thickness) greater than the height (e.g., thickness) of the heat dissipation fins (552), so that a suction gripper can easily adsorb the flat surface (553) without obstruction by the heat dissipation fins (552). According to one embodiment, the edge portion of the flat surface (553) of the heat sink (550) may extend toward the base (551) in various shapes. For example, it may be manufactured in a stepped shape or a curved shape.

[0166] According to one embodiment, the heat sink (550) may be manufactured from various materials capable of efficiently dissipating heat from the electronic component (520). According to one embodiment, the heat sink (550) may be manufactured from various thicknesses capable of efficiently shielding electromagnetic waves (e.g., noise) from the electronic component (520). The heat sink (550) may be formed to shield electromagnetic waves from the electronic component (520) that are not shielded by the shield can (540) as it is positioned to shield the opening (540a) of the shield can (540). The heat sink (550) may be formed from the same material as the shield can (540). The heat sink (550) may be formed from a metal material with high thermal conductivity. For example, the material of the heat sink (550) may include at least one of aluminum (Al), magnesium (Mg), copper (Cu), iron (Fe), nickel (Ni), gold (Au), silver (Ag), or an alloy of at least some of these. According to the present disclosure, the heat sink (550) may be made of aluminum (Al).

[0167] According to one embodiment, the heat sink (550) can diffuse heat generated by the electronic component (520) and transferred through the heat transfer member (530). The area of ​​the heat sink (550) may be designed to be larger than the area of ​​the heat transfer member (530). For example, the area of ​​the heat sink (550) may be larger than the area of ​​the heat transfer member (530) so that the heat transferred to the heat transfer member (530) can be rapidly diffused and dissipated to the heat sink (550) in contact with the upper surface.

[0168] According to one embodiment, the heat sink (550) can dissipate heat received from the heat transfer member (530) through two paths. For example, as the central part of the heat sink (550) and the heat transfer member (530) overlap and come into contact with each other, the heat received from the central part of the heat sink (550) can be diffused to the upper or edge part. For example, heat received from the central part of the conductive plate (570) can be dissipated into the upper air through a plurality of heat dissipation fins (552), or heat diffused to the edge part of the heat sink (550) can be diffused to the circuit board (510) through the shield can (540).

[0169] According to one embodiment, the heat sink (550) may be designed such that the distance between the upper surface (e.g., the top of a plurality of heat dissipation fins (552)) and the case (e.g., the case (420) of FIG. 8) is greater than the total height of the heat dissipation structure (500).

[0170] FIG. 8 is a cross-sectional view showing a heat dissipation path of a heat dissipation structure according to one embodiment of the present disclosure.

[0171] According to one embodiment, a home appliance (e.g., a robot vacuum cleaner (100) of FIG. 1 and 2) may include at least one of a circuit board (510), at least one electronic component (520), a heat transfer member (530), a shield can (540), and / or a heat sink (550).

[0172] According to one embodiment, the configuration of the circuit board (510), at least one electronic component (520), heat transfer member (530), shield can (540), and heat sink (550) of FIG. 8 may be partially or entirely identical to the configuration of the circuit board (510), at least one electronic component (520), heat transfer member (530), shield can (540), and heat sink (550) of FIG. 4 to 7. The embodiment of FIG. 8 may optionally be combined with the embodiments of FIG. 1 to 6 and FIG. 8 to 20b.

[0173] According to one embodiment, in a heat dissipation structure (500), an electronic component (520) is placed on a circuit board (510), and a shield can (540) may be formed to be coupled to one side of the circuit board (510) and to surround the electronic component (520). For example, the shield can (540) may be coupled to the circuit board (510) in a manner that accommodates the electronic component (520) and may include at least one opening (540a) formed to correspond to the electronic component (520) and / or a heat transfer member (530). The heat transfer member (530) may be placed between the electronic component (520) and a heat sink (550), and may be formed such that at least a portion of it penetrates the opening (540a) of the shield can (540). The heat sink (550) is placed on the support portion (541) of the shield can (540) and is in contact with the heat transfer member (530) to dissipate heat transferred to the electronic component (520).

[0174] According to one embodiment, when looking at a heat dissipation structure (500) stacked along the center of a shield can (540) and / or a heat sink (550), an electronic component (520), a heat transfer member (530), and a heat sink (550) are sequentially stacked in an upward direction (e.g., +Z-axis direction) with respect to a circuit board (510), and a case (420) providing a heat dissipation space may be positioned on the heat sink (550).

[0175] According to one embodiment, when looking at a heat dissipation structure (500) stacked along the edges of a shield can (540) and / or a heat sink (550), the shield can (540) and the heat sink (550) are sequentially stacked in an upward direction (e.g., +Z-axis direction) relative to a circuit board (510), and a case (420) providing a heat dissipation space may be positioned on the heat sink (550).

[0176] According to one embodiment, the heat dissipation structure (500) may provide various heat diffusion paths to transfer heat generated from the electronic component (520) in a plurality of directions. For example, the heat diffusion path through the heat dissipation structure (500) may include a path in which heat generated from the electronic component (520) diffuses into the air above the heat sink (550) (e.g., a first heat diffusion path (D1)), and a path in which heat generated from the electronic component (520) diffuses into the circuit board (510) below (e.g., a second heat diffusion path (D2)).

[0177] According to one embodiment, the heat dissipation structure (500) can provide more efficient heat dissipation performance by dissipating heat generated from the electronic component (520) through various paths. For example, heat diffusion through a single path may limit or reduce the heat dissipation generated from the electronic component (520). According to one embodiment, considering the heat diffusion rate and / or the surface area of ​​the structure in contact with the heat, the path for dissipating heat into the air (e.g., a first heat diffusion path (D1)) is more efficient than dissipating heat through the circuit board (510) (e.g., a second heat diffusion path (D2)), so the path for dissipating heat into the air can be designed to be expanded.

[0178] According to one embodiment, in a path for dissipating heat into the air (e.g., a first heat diffusion path (D1)), heat generated from an electronic component (520) can be dissipated into the air via a heat transfer member (530) and a heat sink (550). The electronic component (520), the heat transfer member (530), and the heat sink (550) can be arranged in contact with each other. Heat generated from the electronic component (520) can move upward to a plurality of heat dissipation fins (552) and / or a flat surface (553) of the heat transfer member (530) and the heat sink (550). Heat reaching the heat sink (550) can be diffused entirely over a plurality of heat dissipation fins (552) and / or a flat surface (553) with a large surface area (e.g., formed to have a surface area relatively larger than that of the heat transfer member (530), and then dissipated into the air above.

[0179] Hereinafter, a path for dissipating heat into the air (e.g., a first heat diffusion path (D1)) will be described in detail. According to one embodiment, heat generated from an electronic component (520) can be preferentially transferred in an upward direction. For example, a heat source such as an AP component generates high heat at the top of the component, and heat can easily diffuse in an upward direction. The heat from the electronic component (520) can be transferred to a heat transfer member (530) and a heat sink (550). Since the heat transfer member (530) is positioned to penetrate the opening (540a) of the shield can (540), the heat transferred to the heat transfer member (530) can move directly to the heat sink (550) without passing through the shield can (540). Heat transferred to the base (551) of the heat sink (550) can be diffused into the air through a plurality of heat dissipation fins (552) located on the upper side, or diffused horizontally and then diffused to the shield can (540) and circuit board (510) on the lower side. The heat dissipation fins (552) of the heat sink (550) and the shield can (540) are positioned between the base (551) of the heat sink (550), and when considering the directionality of heat (e.g., thermal conductivity), a relatively large amount of heat can be transferred to the heat dissipation fins (552). For example, the configuration of the heat dissipation fins (552) (e.g., increased contact area) can be formed to have higher thermal conductivity than the shield can (540), thereby leading the heat flow more favorably.

[0180] According to one embodiment, the shield can (540) (and the base (551) of the heat sink (550)) may be formed of a metal material to reduce or limit electromagnetic waves (e.g., noise). The shield can (540) may be formed of stainless steel (SUS) material.

[0181] According to one embodiment, the heat sink (550) may have a larger size (or surface area) than the heat transfer member (530) and the shield can (540). For example, the area of ​​the heat sink (550) may be more than twice (e.g., 7 to 9 times) the size of the electronic component (520) or the heat transfer member (530). For example, the path of heat diffusing from the electronic component (520) and the heat transfer member (530) is a vertical flow, and the path of heat diffusing from the base (551) of the heat sink (550) can be understood as a horizontal flow along with the vertical flow. Heat rapidly transferred upward through the electronic component (520) and the heat transfer member (530) can be evenly diffused across the entire surface of the heat dissipation fins (552) (or flat surface (553)) of the heat sink (550) and then dissipated into the air.

[0182] According to one embodiment, a heat transfer member (530) is in contact with the central portion of a heat sink (550), and heat transferred from the heat transfer member (530) to the central portion of the base (551) of the heat sink (550) can be diffused to the edge portion of the base (551) of the heat sink (550). For example, heat transferred to the central portion of the base (551) of the heat sink (550) can be directly dissipated into the upper air through the upper flat surface (553) (or heat dissipation fins (552)), or after being diffused to the edge portion of the heat sink (550), it can be dissipated into the upper air through the heat dissipation fins (552) (or flat surface (553)).

[0183] According to one embodiment, the heat sink (550) may be formed of a metal material having high thermal conductivity. For example, the heat sink (550) may be manufactured from aluminum (Al). In addition, the material of the heat sink (550) may include at least one of magnesium (Mg), copper (Cu), iron (Fe), nickel (Ni), gold (Au), silver (Ag), or an alloy of at least some of these.

[0184] According to one embodiment, in a path diffusing to a circuit board (510) (e.g., a second heat diffusion path (D2)), heat generated from an electronic component (520) can be dissipated to the circuit board (510) via a heat transfer member (530), a heat sink (550), and a shield can (540). The electronic component (520), the heat transfer member (530), the heat sink (550), the shield can (540), and the circuit board (510) can be arranged in contact with each other. Heat generated from the electronic component (520) moves upward to the base (551) of the heat transfer member (530) and heat sink (550), moves downward from the base (551) to the shield can (540), spreads horizontally within the shield can (540), and is transferred to the circuit board (510) positioned at the bottom, where it spreads out completely inside the circuit board (510) to dissipate heat.

[0185] Hereinafter, a path for dissipating heat that diffuses to the circuit board (510) (e.g., a second heat diffusion path (D2)) will be described in detail. According to one embodiment, heat generated from an electronic component (520) can be preferentially transferred in an upward direction. For example, a heat source such as an AP component generates high heat at the top of the component, and heat can easily diffuse in an upward direction. The heat from the electronic component (520) can be transferred to the base (551) of the heat sink (550) via a heat transfer member (530). The heat transfer member (530) is configured to penetrate the opening (540a) of the shield can (540) and is spaced apart, so that the heat transferred to the heat transfer member (530) cannot move directly or quickly to the shield can (540), but can move to the shield can (540) through the base (551) of the heat sink (550). The heat from the heat transfer member (530) can travel through the base (551) of the heat sink (550), diffuse from the support portion (541) of the shield can (540), and then move to the side wall (543) formed to surround the sides of the electronic component (520). For example, the path of heat diffusing from the electronic component (520), the heat transfer member (530), and the heat sink (550) is a vertical flow, and the path of heat diffusing from the base (551) of the heat sink (550) and the support portion (541) of the shield can (540) can be understood as a horizontal flow.

[0186] According to one embodiment, a heat transfer member (530) contacts the central portion of a heat sink (550), and heat transferred from the heat transfer member (530) to the central portion of the base (551) of the heat sink (550) can spread to the edge portion of the base (551) of the heat sink (550). Subsequently, heat transferred to the circuit board (510) through the support portion (541) and side wall (513) of the shield can (540) can spread evenly over the entire surface of the circuit board (510) and then dissipate heat. The amount of heat dissipated through the circuit board (510) may be relatively less than the amount of heat dissipated into the air through the heat dissipation fins (552) (or flat surface (553)) of the heat sink (550), but the heat dissipation performance of the electronic component (520) can be improved by providing heat dissipation simultaneously (or sequentially) in the upper and lower directions relative to the shield can (540) (or electronic component (520)).

[0187] FIG. 9 is a top view of a heat dissipation structure according to one embodiment of the present disclosure.

[0188] FIG. 10 is a top view of a heat dissipation structure with a heat sink (heat transfer member) excluded, according to one embodiment of the present disclosure.

[0189] FIG. 11 is a top view of a shield can according to one embodiment of the present disclosure.

[0190] FIG. 12 is a view of a shield can according to one embodiment of the present disclosure, seen from below.

[0191] According to one embodiment, a home appliance (e.g., a robot vacuum cleaner (100) of FIGS. 1 and 2) may include at least one of a circuit board (510), at least one electronic component (520), a heat transfer member (e.g., a heat transfer member (530) of FIGS. 6 and 7), a shield can (540), and / or a heat sink (550).

[0192] According to one embodiment, the configuration of the circuit board (510), at least one electronic component (520), heat transfer member (530), shield can (540), and heat sink (550) of FIGS. 9 to 12 may be partially or entirely identical to the configuration of the circuit board (510), at least one electronic component (520), heat transfer member (530), shield can (540), and heat sink (550) of FIGS. 5 to 8. The embodiments of FIGS. 9 to 12 may be optionally combined with the embodiments of FIGS. 1 to 8 and FIGS. 12 to 20b.

[0193] According to one embodiment, in a heat dissipation structure (500), an electronic component (520) is placed on a circuit board (510), and a shield can (540) may be formed to be coupled to one side of the circuit board (510) and to surround the electronic component (520). For example, the electronic component (520) may be an application processor (AP) that generates a lot of heat.

[0194] According to one embodiment, a heat transfer member (530) may be positioned to penetrate the opening (540a) of the shield can (540) from the inside of the shield can (540). The heat transfer member (530) is positioned between the electronic component (520) and the heat sink (550) and can transfer heat generated from the electronic component (520) in a vertical direction. The heat transfer member (530) may include a thermal interface material (TIM) capable of easily transferring heat. The TIM may be a silicon-based and / or graphene substrate TIM, and may be a solid TIM.

[0195] According to one embodiment, the heat transfer member (530) may have an adhesive and elastic material. The heat transfer member (530) is bonded while applying pressure toward the contacting electronic component (520), which can improve heat transfer efficiency by filling fine gaps inside the heat transfer member and increasing the contact surface. Accordingly, the assembly process of the heat dissipation structure (500) can be designed by taking into account the total thickness of the heat dissipation structure (500) and the thickness of the heat transfer member reduced when applied. For example, when stacking the electronic component (520), the heat transfer member (530), and the heat sink (550) on the circuit board (510), the base (551) of the electronic component (520), the heat transfer member (530), and the heat sink (550) may each have thicknesses of 1.1 mm, 1.0 mm, and 3.0 mm, respectively. When assembling a heat sink (550) on a heat transfer member (530), the upper side of the heat transfer member (530) that partially protrudes through the opening (540a) of the shield can (540) can be pressed and bonded and assembled. Accordingly, the heat transfer member (530) is assembled while being pressed by elasticity, and the total thickness can be reduced to 1.7 mm compared to the total thickness before assembly (e.g., 2.1 mm).

[0196] According to one embodiment, when a heat sink (550) is laminated on a shield can (540), the base (551) of the heat sink (550) may have a thickness of approximately 3.0 mm, and each of the heat dissipation fins (552) may have a thickness of approximately 5.0 mm. The heat dissipation fins (552), which have a large contact area with air, may be designed to be larger than the base (551) to be advantageous for heat dissipation.

[0197] According to one embodiment, the shield can (540) may include a support portion (541) providing a seating area for a heat sink (550), a plurality of side walls (543) supporting the shield can (540), and a fastening portion (547) for fixing the heat sink (550) placed in the seating area. The side walls (543) of the shield can (540) are arranged to surround the base (551) of the heat sink (550), and the support portion (541) of the shield can (540) may support the heat sink (550). For example, a space in which the heat sink (550) can be seated may be provided by the side walls (543) and the support portion (541) of the shield can (540).

[0198] According to one embodiment, the side wall (543) of the shield can (540) may include an upper side wall (5431) and a lower side wall (5432). When viewed from the upper or lower side of the shield can (540), the lower side wall (5432) may extend from one end of the connection portion (545) of the shield can (540) fixed to the circuit board (510) to the bottom surface of the heat sink (550), and the upper side wall (5431) may extend from the lower side wall (5432) to the base (551) of the heat sink (550). The lower side wall (5432) may have the shape of two plates arranged side by side and may include an inner lower wall (5432a) extending vertically with respect to the support portion (541) of the shield can (540) and an outer lower wall (5432b) extending in the same direction from the upper side wall (5431). According to one embodiment, the outer bottom wall (5432b) may be formed to at least partially surround the inner bottom wall (5432a). For example, when viewed from the upper or lower side of the shield can (540), the inner bottom wall (5432a) may have a closed loop shape, and at least a portion of the outer bottom wall (5432b) may have a corresponding shape. For example, when viewed from the upper or lower side of the shield can (540), the inner bottom wall (5432a) may have a closed loop shape, and the outer bottom wall (5432b) may have a portion (e.g., a corner portion) that surrounds the inner bottom wall (5432a) open so that a portion of the inner bottom wall (5432a) is exposed.

[0199] According to one embodiment, the fastening portion (547) of the shield can (540) can secure a heat sink (550) seated on the support portion (541). For example, a hook-shaped fastening portion (547) is disposed on one side of the upper side wall (5431) of the shield can (540), and a step (554) is formed on the base (551) of the heat sink (550), and the step (554) can be fitted and coupled into the inside of the hook.

[0200] According to one embodiment, the fastening portion (547) of the shield can (540) may include first hooks (5471) arranged along one side of the upper side wall (5431) and second hooks (5472) arranged along the other side of the upper side wall (5431) parallel to said one side. In FIGS. 11 and 12, the first hooks (5471) and the second hooks (5472) are formed three each on one side and the other side of the upper side wall (5431) in a shape facing each other and corresponding to each other, but are not limited thereto, and the design may be changed to a variety of numbers at various locations on the upper side wall (5431) so as to stably fix the heat sink (550).

[0201] According to one embodiment, a plurality of recesses (549) may be formed in the outer bottom wall (5432b) of the shield can (540) at positions corresponding to the fastening portion (547). For example, a plurality of recesses (549) may be arranged in parallel along the lower direction (e.g., -Z-axis direction) of the first hooks (5471) and the second hooks (5472) of the upper side wall (5431). Each of the recesses (549) of the outer bottom wall (5432b) may have a shape in which a space is opened toward the circuit board (510). For example, each of the openings (540a) of the outer bottom wall (5432b) may have a `┏┓` shape. According to one embodiment, when the fastening portion (547) of the shield can (540) and the step (554) of the heat sink (550) are fastened, the heat sink (550) is pressed downward and can be inserted up to the support portion (541) of the shield can (540) while pushing the hook-shaped fastening portion (547). In the fastening process, recesses (549) can be formed on the lower side of the fastening portion (547) to disperse the impact generated in the shield can (540) so that damage (e.g., crack) does not occur to the side wall (543) (e.g., outer bottom wall (5432b)) of the shield can (540) due to the pressure of the heat sink (550).

[0202] According to one embodiment, the support portion (541) of the shield can (540) may include an edge portion (5411) and an extension portion (5412). The edge portion (5411) is a portion that extends vertically with respect to the inner bottom wall (5432a) and may support the edge area of ​​the base (551) of the heat sink (550). Depending on the shape of the square shield can (540), the edge portion (5411) may include a first edge portion (5411a), a second edge portion (5411b), a third edge portion (5411c), and a fourth edge portion (5411d). For example, the first edge portion (5411a) and the third edge portion (5411c) may be arranged side by side. For example, the second edge portion (5411b) and the fourth edge portion (5411d) may be arranged side by side. For example, the edge portion (5411) has a closed loop shape when viewed from the upper or lower side of the shield can (540), the first edge portion (5411a) extends from the fourth edge portion (5411d) to the second edge portion (5411b), and the third edge portion (5411c) extends from the second edge portion (5411b) to the fourth edge portion (5411d).

[0203] According to one embodiment, the connecting portion (545) of the supporting portion (541) of the shield can (540) may be designed in various shapes that traverse the inside of the shield can (540). When viewed from the upper or lower side of the shield can (540), an opening (540a) may be formed in the central portion. The opening (540a) may be formed by a combination of the supporting portion (541) and the connecting portion (545). According to one embodiment, the connecting portion (545) may include a first connecting portion (545), a second connecting portion (545), and a third connecting portion (545). For example, the first connecting portion (545) may be located between the first edge portion (5411) and the third edge portion (5411) facing each other. The first connecting portion (545) may extend from one side of the first edge portion (5411) to one side of the third edge portion (5411). For example, the second connecting portion (545) may be located between the first connecting portion (545) and the second edge portion (5411) facing each other. The second connecting portion (545) may extend from one side of the first connecting portion (545) to one side of the second edge portion (5411). For example, the third connecting portion (545) may be located between the first connecting portion (545) and the fourth edge portion (5411) facing each other. The third connecting portion (545) may extend from one side of the first connecting portion (545) to one side of the fourth edge portion (5411).

[0204] According to one embodiment, the extension portion (5412) of the shield can (540) (e.g., first extension portion (5412a), extension portion (5412b), and / or extension portion (5412c)) may be formed as a flat surface. In an automated process, to place the shield can (540) on a circuit board (510), the shield can (540) may be suctioned using a suction gripper (or vacuum gripper). In this case, the extension portion (5412) may be used as a flat surface for the suction gripper to lift the shield can (540) through vacuum suction.

[0205] According to one embodiment, an extension portion (5412) of the shield can (540) (e.g., a first extension portion (5412a), an extension portion (5412b), and / or an extension portion (5412c)) extends to a circuit board (510) to partition each area within the shield can (540). For example, if shielding from the influence of noise between electronic components (520) placed within the shield can (540) is required, separate electronic components (520) may be placed in each area partitioned by the extension portion (5412) within the shield can (540).

[0206] FIG. 13 is a diagram showing the connection between a circuit board and a shield can viewed from the side of a heat dissipation structure according to one embodiment of the present disclosure.

[0207] FIG. 14 is a view of the upper surface of a circuit board with a heat dissipation structure according to one embodiment of the present disclosure.

[0208] According to one embodiment, a home appliance (e.g., a robot vacuum cleaner (100) of FIG. 1 and 2) may include at least one of a circuit board (510), at least one electronic component (520), a heat transfer member (530), a shield can (540), and / or a heat sink (550).

[0209] According to one embodiment, the configuration of the circuit board (510), at least one electronic component (520), heat transfer member (530), shield can (540), and heat sink (550) of FIGS. 13 and 14 may be partially or entirely identical to the configuration of the circuit board (510), at least one electronic component (520), heat transfer member (530), shield can (540), and heat sink (550) of FIGS. 4 to 12. The embodiment of FIGS. 13 and 14 may optionally be combined with the embodiment of FIGS. 1 to 12 and FIGS. 15 to 20b.

[0210] According to one embodiment, in a heat dissipation structure (500), an electronic component (520) is placed on a circuit board (510), and a shield can (540) may be formed to be coupled to one side of the circuit board (510) and to surround the electronic component (520). For example, the electronic component (520) may be an application processor (AP) that generates a lot of heat.

[0211] According to one embodiment, the shield can (540) can shield electromagnetic waves (e.g., noise) of an electronic component (520). The shield can (540) may have the shape of a rectangular prism (or a cuboid with one side open) with an open bottom, and may accommodate and shield the electronic component (520) inside. The shield can (540) may include a support portion (541), side walls (543)(s) extending vertically from the edge of the support portion (541) (e.g., toward the circuit board (510)), and a connecting portion (545) extending from the side walls (543)(s) for coupling with the circuit board (510). The side walls (543)(s) are structured to be continuous (e.g., connected) to each other to have a closed rectangular loop shape and may have a height corresponding to the sum of the thicknesses of the shield can (540) and the heat transfer member (530).

[0212] According to one embodiment, the shield can (540) can be coupled with the circuit board (510). For example, the shield can (540) can be fixed to the circuit board (510) by the connection portion (545) extending from the side wall (543)(s) of the shield can (540) being coupled with a plurality of pads (516) disposed on the circuit board (510). The connection portion (545) of the shield can (540) is a plate shape formed vertically from the end of the side wall (513)(s) (e.g., the outer / inner direction of the shield can (540)) and can come into contact with the pads (516) disposed on the circuit board (510). For example, the connecting portion (515) may be positioned between the inner bottom wall (5432a) and the outer bottom wall (5432b) and may have a shape extending from the inner bottom wall (5432a) to the outer bottom wall (5432b).

[0213] According to one embodiment, the connecting portion (545) of the shield can (540) may be arranged in a plurality of spaces spaced apart from each other by recesses (e.g., recesses (549) of FIG. 11 and FIG. 12) spaced apart from each other by the connecting portion (545) and recesses (549) arranged spaced apart below the fastening portion (547) for crack prevention. For example, the lower portion of the side wall (543) may have the connecting portion (545) and the recesses (549) arranged alternately.

[0214] According to one embodiment, the connecting portion (545) of the shield can (540) may be formed in a number corresponding to the pad (516) and arranged in multiple numbers. For example, the end of the side wall (513) and the connecting portion (545) may have a '┗┛' shape. The lower surface of the connecting portion (515) may be soldered in contact with the pad (516).

[0215] According to one embodiment, a plurality of pads (516) may be fixed on a circuit board (510). The plurality of pads (516) may be arranged along a closed square loop shape corresponding to the shape of the connection part(s) (515) of the shield can (540). The plurality of pads (516) may be spaced apart. The plurality of pads (516) may be arranged to surround at least one electronic component (520). When the plurality of pads (516) are arranged in a square shape (e.g., including a curve favorable for soldering), two or three pads may be placed on each side.

[0216] FIG. 15 is a perspective view showing a structure for shielding and heat dissipation of an electronic component (e.g., a heat dissipation structure (500a)) according to one embodiment of the present disclosure.

[0217] According to one embodiment, a home appliance (e.g., a robot vacuum cleaner (100) of FIGS. 1 and 2) may include a heat dissipation structure (500a). The heat dissipation structure (500a) may include at least one of a circuit board (510), at least one electronic component (e.g., an electronic component (520) of FIGS. 6 and 7), a heat transfer member (e.g., a heat transfer member (530) of FIGS. 6 and 7), a shield can (540), and / or a heat sink (550a).

[0218] According to one embodiment, the configuration of the circuit board (510), shield can (540), and heat sink (550a) of FIG. 15 may be partially or entirely identical to the configuration of the circuit board (510), shield can (540), and heat sink (550) of FIG. 4 to 14. The embodiments of FIG. 15 may be optionally combined with the embodiments of FIG. 1 to 14 and FIG. 16 to 20b.

[0219] Hereinafter, the configuration of a heat sink (550a) with a heat dissipation structure (500a) different from the embodiments of FIGS. 4 to 7 will be described.

[0220] According to one embodiment, the shield can (540) may be formed to be combined with the circuit board (510) and to enclose an electronic component. For example, the shield can (540) may be mounted on the circuit board (510) to accommodate an electronic component (520).

[0221] According to one embodiment, the shield can (540) may include a support portion (e.g., the support portion (541) of FIG. 11 and FIG. 12) that supports the heat sink (550a), a side wall (543) that extends from the support portion (541) and is formed to surround at least a portion of the electronic component (520) or the heat sink (550a), a connection portion (e.g., the connection portion (545) of FIG. 11 and FIG. 12) that is formed on one side of the side wall (543) to be connected to a circuit board (510), and a connection portion (547) that is formed on the inner side of the side wall (543) to be connected to the heat sink (550a).

[0222] According to one embodiment, the inner faces of the upper side wall (5431) of the shield can (540) may be arranged to surround the lower portion (e.g., base (551)) of the heat sink (550a). The heat sink (550a) may be located in the space formed by the upper side wall (5431) of the shield can (540) and may be fitted into the upper side wall (5431). The horizontal movement of the heat sink (550a) may be restricted by the upper side wall (5431) of the shield can (540). For example, if the lower portion (e.g., base (551)) of the heat sink (550a) is square in shape, the upper side wall (5431) may be formed to surround the outer surface of the square shape, thereby restricting the movement of the heat sink (550a) in the X-axis and Y-axis directions. As a result, the heat sink (550a) remains fixed to the shield can (540) and may not be dislodged by external impact.

[0223] According to one embodiment, the heat sink (550a) may be disposed on the shield can (540) and formed to easily diffuse heat transferred from the electronic component (520) by contacting the heat transfer member (530). For example, the heat sink (550a) may be supported by the support portion (541) of the shield can (540) and may diffuse the heat received by the heat transfer member (530) throughout the heat sink (550a) or dissipate heat into the air above through the heat dissipation fins (552) of the heat sink (550).

[0224] According to one embodiment, the heat sink (550a) may include a base (551) for being seated on a shield can (540), a plurality of heat dissipation fins (552) for easily dissipating heat into the air, and a flat surface (553) positioned adjacent to the heat dissipation fins (552). According to one embodiment, a step (554) is formed on one side of the base (551) of the heat sink (550a) so as to be coupled with a fastening portion (547) of the shield can (540).

[0225] According to one embodiment, the bottom surface of the base (551) of the heat sink (550a) may be supported by a support portion (541) of the shield can (540). An edge portion of the support portion (541) may be formed to support the edge of the heat sink (550a). For example, the edge portion may support each of the four corners of the square-shaped base (551), thereby allowing the heat sink (550a) to remain stable without shaking.

[0226] According to one embodiment, a plurality of heat dissipation fins (552) of a heat sink (550a) may extend upward from a base (551) and be arranged in parallel. The thickness of each of the plurality of heat dissipation fins (552) (e.g., length along the Z-axis) may be greater than the thickness of the base (551).

[0227] According to one embodiment, a plurality of heat dissipation fins (552) can rapidly absorb heat transferred to the base (551) and diffuse the heat over a wide surface area to release it to the outside (e.g., outside of the heat dissipation structure (500)). The heat diffusion method can be achieved through conduction and convection. The plurality of heat dissipation fins (552) are designed in a way that optimizes airflow so that heat can be efficiently released through air circulation. For example, as air flows between the heat dissipation fins (552), heat can be effectively transferred to provide a cooling function.

[0228] According to one embodiment, a flat surface (553) may be formed on the upper side of the heat sink (550a). A plurality of heat dissipation fins (552) are formed in the central part of the base (551), and the flat surface (553) may include a first flat surface (553a) disposed on one side of the heat dissipation fins (552) and a second flat surface (553b) disposed on the other side of the heat dissipation fins (552). The first flat surface (553a) and the second flat surface (553b) may be spaced apart between the heat dissipation fins (552). In an automated process, to align and place the heat sink (550a) on the shield can (540), the heat sink (550a) may be moved after suctioning using a suction gripper (or vacuum gripper). In this case, the flat surface (553) of the heat sink (550a) can be used as a surface for a suction gripper to lift the heat sink (550a) through vacuum suction. For the suction gripper to stably lift the heat sink (550a), suction points may be required on mutually facing edge regions of the heat sink (550a), for example, two or more suction points. Accordingly, the first flat surface (553a) and the second flat surface (553b) of the heat sink (550) may be spaced apart along both edge regions in the X-axis direction or spaced apart along both edge regions in the Y-axis direction.

[0229] According to one embodiment, the heat sink (550a) can diffuse heat generated by the electronic component (520) and transferred through the heat transfer member (530). The area of ​​the heat sink (550a) may be designed to be larger than the area of ​​the heat transfer member (530). For example, the area of ​​the heat sink (550a) may be larger than the area of ​​the heat transfer member (530) so that the heat transferred to the heat transfer member (530) can be rapidly diffused and dissipated to the heat sink (550a) in contact with the upper surface.

[0230] FIG. 16 is a perspective view showing a structure for shielding and heat dissipation of an electronic component (e.g., a heat dissipation structure (500b)) according to one embodiment of the present disclosure.

[0231] According to one embodiment, a home appliance (e.g., a robot vacuum cleaner (100) of FIGS. 1 and 2) may include a heat dissipation structure (500b). The heat dissipation structure (500b) may include at least one of a circuit board (510), at least one electronic component (e.g., an electronic component (520) of FIGS. 6 and 7), a heat transfer member (e.g., a heat transfer member (530) of FIGS. 6 and 7), a shield can (540), and / or a heat sink (550b).

[0232] According to one embodiment, the configuration of the circuit board (510), shield can (540), and heat sink (550b) of FIG. 16 may be partially or entirely identical to the configuration of the circuit board (510), shield can (540), and heat sink (550) of FIG. 4 to 14. The embodiments of FIG. 16 may be optionally combined with the embodiments of FIG. 1 to 15 and FIG. 17a to 20b.

[0233] Hereinafter, the configuration of a heat sink (550b) with a heat dissipation structure (500b) different from the embodiments of FIGS. 4 to 7 will be described.

[0234] According to one embodiment, the shield can (540) may be formed to be combined with the circuit board (510) and to enclose an electronic component. For example, the shield can (540) may be mounted on the circuit board (510) to accommodate an electronic component (520).

[0235] According to one embodiment, the shield can (540) may include a support portion (e.g., the support portion (541) of FIG. 11 and FIG. 12) that supports the heat sink (550b), a side wall (543) that extends from the support portion (541) and is formed to surround at least a portion of the electronic component (520) or the heat sink (550b), a connection portion (e.g., the connection portion (545) of FIG. 11 and FIG. 12) that is formed on one side of the side wall (543) to be connected to a circuit board (510), and a connection portion (547) that is formed on the inner side of the side wall (543) to be connected to the heat sink (550b).

[0236] According to one embodiment, the inner faces of the upper side wall (5431) of the shield can (540) may be arranged to surround the lower portion (e.g., base (551)) of the heat sink (550b). The heat sink (550b) may be located in the space formed by the upper side wall (5431) of the shield can (540) and may be fitted into the upper side wall (5431). The horizontal movement of the heat sink (550b) may be restricted by the upper side wall (5431) of the shield can (540). For example, if the lower portion (e.g., base (551)) of the heat sink (550b) is square in shape, the upper side wall (5431) may be formed to surround the outer surface of the square shape, thereby restricting the movement of the heat sink (550b) in the X-axis and Y-axis directions. As a result, the heat sink (550a) remains fixed to the shield can (540) and may not be dislodged by external impact.

[0237] According to one embodiment, the heat sink (550b) may be disposed on the shield can (540) and formed to easily diffuse heat transferred from the electronic component (520) by contacting the heat transfer member (530). For example, the heat sink (550b) may be supported by the support portion (541) of the shield can (540) and may diffuse the heat received by the heat transfer member (530) throughout the heat sink (550b) or dissipate heat into the air above through the heat dissipation fins (552) of the heat sink (550).

[0238] According to one embodiment, the heat sink (550b) may include a base (551) for being seated on a shield can (540), a plurality of heat dissipation fins (552) for easily dissipating heat into the air, and a flat surface (553) positioned adjacent to the heat dissipation fins (552). According to one embodiment, a step (554) is formed on one side of the base (551) of the heat sink (550b) so as to be coupled with a fastening portion (547) of the shield can (540).

[0239] According to one embodiment, the bottom surface of the base (551) of the heat sink (550b) may be supported by a support portion (541) of the shield can (540). An edge portion of the support portion (541) may be formed to support the edge of the heat sink (550b). For example, the edge portion may support each of the four corners of the square-shaped base (551), thereby allowing the heat sink (550b) to remain stable without shaking.

[0240] According to one embodiment, the bottom surface of the base (551) of the heat sink (550b) may be supported by a support portion (541) of the shield can (540). An edge portion of the support portion (541) may be formed to support the edge of the heat sink (550b). For example, the edge portion may support each of the four corners of the square-shaped base (551), thereby allowing the heat sink (550b) to remain stable without shaking.

[0241] According to one embodiment, a plurality of heat dissipation fins (552) of the heat sink (550b) may extend upward from the base (551) and be arranged in parallel. The thickness of each of the plurality of heat dissipation fins (552) (e.g., length along the Z-axis) may be greater than the thickness of the base (551). Unlike other embodiments, the embodiment of FIG. 16 excludes a flat surface, and the heat dissipation fins (552) may be placed on the entire surface above the base (551).

[0242] According to one embodiment, a plurality of heat dissipation fins (552) can rapidly absorb heat transferred to the base (551) and diffuse the heat over a wide surface area to release it to the outside (e.g., outside of the heat dissipation structure (500)). The heat diffusion method can be achieved through conduction and convection. The plurality of heat dissipation fins (552) are designed in a way that optimizes airflow so that heat can be efficiently released through air circulation. For example, as air flows between the heat dissipation fins (552), heat can be effectively transferred to provide a cooling function.

[0243] Figure 17a is a graph showing the temperature change of an electronic component inside a typical shield can in a high-temperature chamber.

[0244] FIG. 17b is a graph showing the temperature change of an electronic component with respect to a heat dissipation structure in a high-temperature chamber according to one embodiment of the present disclosure (the embodiment of FIG. 16).

[0245] FIG. 17c is a graph showing the temperature change of an electronic component with respect to a heat dissipation structure in a high-temperature chamber according to one embodiment of the present disclosure (the embodiment of FIG. 5 to 7).

[0246] According to one embodiment, a home appliance (e.g., a robot vacuum cleaner (100) of FIG. 1 and 2) may include at least one of a circuit board (e.g., a circuit board (510) of FIG. 6), at least one electronic component (e.g., an electronic component (520) of FIG. 6), a heat transfer member (e.g., a heat transfer member (530) of FIG. 6), a shield can (e.g., a shield can (540) of FIG. 6), and a heat sink (e.g., a heat sink (550) of FIG. 6) and / or a case (e.g., a case (420) of FIG. 4).

[0247] FIG. 17a shows the change in temperature during operation of an electronic component (520) without applying a separate structure for separate heat generation. FIG. 17b shows the change in temperature during operation of an electronic component (520) with a heat dissipation structure (500b) applied according to one embodiment of the present disclosure (e.g., the embodiment of FIG. 16) (shield can type 1). FIG. 17c shows the change in temperature during operation of an electronic component (520) with a heat dissipation structure (500) applied according to one embodiment of the present disclosure (e.g., the embodiments of FIG. 5 to 7) (shield can type 2).

[0248] According to one embodiment, FIG. 17b shows an experiment to test whether heat dissipation is improved on a circuit board (510) including a heat dissipation structure (500b) according to one embodiment of the present disclosure, and the configuration of the heat dissipation structure (500b) of FIG. 17b may be partially or entirely identical to the configuration of the heat dissipation structure (500b) of FIG. 16. According to one embodiment, FIG. 17c shows an experiment to test whether heat dissipation is improved on a circuit board (510) including a heat dissipation structure (500) according to one embodiment of the present disclosure, and the configuration of the heat dissipation structure (500) of FIG. 17c may be partially or entirely identical to the configuration of the heat dissipation structure (500) of FIG. 5 to FIG. 7.

[0249] In the experimental example for providing the graphs of FIGS. 17a, 17b, and 17c, the heat generated while an electronic component (520) operates in a high-temperature chamber of 60°C was checked over time, and the saturation temperature (MAX) was measured. The electronic component is an application processor (AP), and the measurement time was considered to be within approximately 3 hours.

[0250] Referring to Fig. 17a, it can be seen that the AP inside a typical shield can reached the saturation temperature (MAX) in 30 min to 60 min, and the saturation temperature (MAX) is approximately 71.2 ℃.

[0251] Referring to FIG. 17b, it can be seen that the AP in the heat dissipation structure of the embodiment of the present disclosure reached a saturation temperature (MAX) in 30 min to 60 min, and the saturation temperature (MAX) is approximately 57.5 ℃.

[0252] Referring to FIG. 17c, it can be seen that the AP in the heat dissipation structure of the embodiment of the present disclosure reached a saturation temperature (MAX) in 30 min to 60 min, and the saturation temperature (MAX) is approximately 56.6 ℃.

[0253] As in the experimental example, when using the heat dissipation structure (500), it was confirmed that the temperature of the AP can be reduced by approximately 13 to 15 ℃ due to the improvement in heat dissipation performance.

[0254] FIG. 18a is a perspective view of a cooking appliance according to one embodiment of the present disclosure.

[0255] FIG. 18b is a drawing showing the door of a cooking appliance in an open state according to one embodiment of the present disclosure.

[0256] FIG. 18c is a side cross-sectional view of a cooking appliance according to one embodiment of the present disclosure.

[0257] Referring to FIGS. 18a, 18b, and 18c, the cooking device (11) may be a device in which an oven and a cooktop (1130) located on top of the oven are combined or integrally formed. However, as this is an exemplary drawing for illustrative purposes, it may be configured with the cooktop (1130) excluded from the top of the oven.

[0258] According to one embodiment, in a cooking appliance (11) in which a cooktop (1130) and an oven are combined vertically, the cooktop (1130) and the oven may have various types of heating source combinations. For example, the cooktop (1130) may be equipped with an electric or gas heating source. For example, the oven may be electric or gas. For example, the heating methods of the cooktop (1130) and the oven may be different.

[0259] According to one embodiment, the cooking device (11) may include a main body (1110) comprising an inner case (1111) in which a cooking chamber (1120) is formed, and an outer case (1112) coupled to the outside of the inner case (1111) to form the exterior of the cooking device (11). The inner case (1111) and the outer case (1112) may each be formed so that their front surfaces are open.

[0260] According to one embodiment, the cooking appliance (11) may include a cooktop (1130) provided on the top of the cooking appliance (11) and capable of placing a container containing food on it to heat. The cooktop (1130) may be equipped with at least one heating element (1131). A container containing food can be placed on the heating element (1131) and heated. The cooktop (1130) may be omitted from the cooking appliance (11).

[0261] According to one embodiment, the cooking device (11) may include a door (1150) provided on the front of the main body (1110) to open and close the cooking chamber (1120).

[0262] According to one embodiment, the outer case (1112) may include a front panel (1113) forming the front of the main body (1110), a side panel (1114) forming the side of the main body (1110), and a rear panel (1115) forming the rear of the main body (1110).

[0263] According to one embodiment, an opening is provided in the front panel (1113), and the front of the cooking chamber (1120) provided inside the main body (1110) can be opened through the opening. A control panel (1141) covering the front of the electrical chamber (1140) can be provided on the upper part of the front panel (1113).

[0264] According to one embodiment, a display module (1160) may be mounted on the control panel (1141). The display module (1160) may include a front plate (1161) provided on the front of the display portion. The front plate (1161) may be mounted to protect the display portion of the display module (1160), but is not limited thereto, and may be mounted as a touch panel capable of receiving touch commands from a user.

[0265] According to one embodiment, the display module (1160) of the cooking appliance (11) may include a display panel and a circuit board electrically connected to the display panel. The circuit board may include an electronic component named as a heat source, such as an application processor (AP). A structure for shielding and heat dissipation of the electronic component (e.g., the heat dissipation structure (500) of FIG. 5) is provided on the circuit board, and the structure may incorporate the features of the heat dissipation structures and / or related elements disclosed in FIG. 3 through 16. For example, in the heat dissipation structure (500) of the cooking appliance (11), an electronic component (e.g., the electronic component (520) of FIG. 5) is placed on a circuit board (e.g., the circuit board (510) of FIG. 5), and a shield can (e.g., the shield can (540) of FIG. 5) may be formed to be coupled to one side of the circuit board (510) and to surround the electronic component (520). A bracket (e.g., bracket (550) of FIG. 5) is coupled to a circuit board (510) in a state that accommodates a shield can (540) and may include at least one opening (e.g., opening (540a) of FIG. 5) formed to correspond to an electronic component (520). A first heat transfer member (e.g., first heat transfer member (530) of FIG. 5) is disposed between the electronic component (520) and the shield can (540), and a second heat transfer member (e.g., second heat transfer member (530) of FIG. 5) is disposed on the shield can (540) and may be formed so that at least a portion penetrates the opening (540a). A conductive plate (e.g., conductive plate (570) of FIG. 5) is disposed on a guide (e.g., guide (551) of FIG. 5) of the bracket (550) and may come into contact with the second heat transfer member (530). The heat diffusion path through the heat dissipation structure (500) may include a path in which heat generated from the electronic component (520) diffuses into the air above the conductive plate (570), and a path in which heat generated from the electronic component (520) diffuses into the circuit board (510) below.

[0266] According to one embodiment, the control panel (1141) may be disposed on at least a portion of the main body (1110). For example, the control panel (1141) may be disposed on the upper side of the main body (1110). For example, the control panel (1141) may be disposed on the upper front side of the main body (1110).

[0267] According to one embodiment, an inlet (1115a) may be provided in the rear panel (1115) to allow air to be drawn into the electrical chamber (1140). Air drawn into the electrical chamber (1140) through the inlet (1115a) flows inside the electrical chamber (1140) and can cool electrical components placed inside the electrical chamber (1140). Air flowing inside the electrical chamber (1140) can be discharged to the front of the cooking device (11) through the outlet (1180) along the discharge path (1172). The outlet (1180) may include the space between the front panel (1113) and the control panel (1141). However, it is not limited thereto, and the outlet (1180) may be provided at various locations to discharge the flowing air inside the electrical chamber (1140). The inlet (1115a) may be formed at various locations in addition to the rear panel (1115) to introduce air into the electrical room (1140).

[0268] According to one embodiment, the cooking chamber (1120) may be formed by an upper plate (1121), a bottom plate (1122), two side plates (1123) and a rear plate (1124) arranged to face each other. The cooking chamber (1120) is a cooking space, and the front is open through an opening in the front panel (1113) to allow food to be fed in and out.

[0269] According to one embodiment, a plurality of supports (1125) may be provided on the inner surface of both side plates (1123). The plurality of supports may be provided to protrude inwardly from both side plates (1123). At least one removable rack (1126) on which food can be placed may be mounted on the plurality of supports (1125). For example, the plurality of supports (1125) may be provided to extend in a horizontal direction to mount the rack (1126) horizontally.

[0270] According to one embodiment, a plurality of supports (1125) may be equipped with rails (not shown) capable of dividing the cooking chamber (1120) into multiple parts. A user can move a rack (1126) through the rails. A divider (not shown) capable of dividing the cooking chamber (1120) into multiple parts may be detachably mounted on the plurality of supports (1125). A user can utilize the space of the cooking chamber (1120) divided into multiple parts in various ways according to their intention. The divider may be provided with an insulating material to insulate each of the divided spaces.

[0271] According to one embodiment, a heater (1127) for heating food may be provided in the cooking chamber (1120). The heater (1127) may be an electric heater including an electric resistor. However, it is not limited thereto, and the heater (1127) may be a gas heater that generates heat by burning gas.

[0272] According to one embodiment, the rear plate (1124) of the cooking chamber (1120) may be provided with a circulation fan (1128) that circulates air in the cooking chamber (1120) to heat food evenly, and a circulation motor (1129) that drives the circulation fan (1128).

[0273] According to one embodiment, a fan cover (1128a) covering the circulation fan (1128) may be provided on the front of the circulation fan (1128), and an outlet hole (1128b) provided to allow air to flow may be formed in the fan cover (1128a).

[0274] According to one embodiment, the open front of the cooking chamber (1120) is opened and closed by a door (1150), and the door (1150) can be coupled to the main body (1110) so as to be rotatable relative to the main body (1110). For example, the door (1150) can be coupled to the main body (1110) by a hinge (1151) provided at the bottom of the main body (1110).

[0275] According to one embodiment, a handle that a user grasps to open and close the door (1150) to the cooking chamber (1120) may be provided on the upper front of the door (1150).

[0276] According to one embodiment, a control panel (1141) may be provided with a knob assembly (1190) capable of operating a cooking appliance (11). Multiple knob assemblies (1190) may be provided depending on the number of heating units (1131) to be operated. For example, four knob assemblies (1190) may be provided as illustrated. According to one example, the knob assembly (1190) may operate in a push-to-turn manner.

[0277] According to one embodiment, an insulating material (1120a) may be provided between the electrical room (1140) and the cooking room (1120) to prevent heat from the cooking room (1120) from being transferred to the electrical room (1140). The insulating material (1120a) can insulate the electrical room (1140) and the cooking room (1120). The insulating material (1120a) can cover not only the space between the electrical room (1140) and the cooking room (1120), but also the entire outside of the cooking room (1120) so that heat from the cooking room (1120) is not transferred to the outside of the cooking device (11).

[0278] According to one embodiment, since the temperature inside the electrical chamber (1140) can rise due to the heat from various electrical components, the cooking appliance (11) may be provided with a blower (1170) capable of cooling the electrical chamber (1140) by circulating air around the electrical chamber (1140). The blower (1170) may include a blower fan (1171) for circulating air and a discharge path (1172) provided to discharge the air sucked in by the blower fan (1171) toward the front of the cooking appliance (11).

[0279] According to one embodiment, the blower fan (1171) can draw in air in the axial direction and then discharge it in the radial direction. That is, the blower fan (1171) according to the present invention may be a centrifugal fan. Alternatively, the blower fan (1171) may include an axial fan.

[0280] According to one embodiment, a portion of the air inside the cooking chamber (1120) may be drawn into the exhaust passage (1172) through the cooking chamber passage (1173) and discharged to the outside of the cooking appliance (11). For example, the air inside the cooking chamber (1120) may be discharged to the front of the cooking appliance (11).

[0281] According to one embodiment, the exhaust passage (1172) may include a bypass hole (1174) that introduces a portion of the air flowing from the exhaust port (1180) into the cooking chamber passage (1173). The bypass hole (1174) may be opened and closed by an opening and closing device (1175). Depending on the opening and closing of the bypass hole (1174) by the opening and closing device (1175), the amount of air flowing from the exhaust passage (1172) to the exhaust port (1180) into the cooking chamber passage (1173) can be controlled. By controlling this air flow, the amount of air exhausted from the cooking chamber (1120) to the cooking chamber passage (1173) can be controlled.

[0282] According to one embodiment, the cooking appliance is not limited to the ovens shown in FIGS. 18a to 18c, and any cooking appliance requiring high-temperature operation may be included within the scope of the present disclosure.

[0283] FIG. 19 is a drawing illustrating an air conditioner according to one embodiment of the present disclosure.

[0284] Referring to FIG. 19, an air conditioner (2000) according to one embodiment may include an indoor unit (2100) and an outdoor unit (2200).

[0285] According to one embodiment, the indoor unit (2100) of the air conditioner (2000) may include a housing (2110) and internal components (e.g., an indoor heat exchanger and an indoor blower fan) disposed within the housing (2110).

[0286] According to one embodiment, an indoor unit (2100) of an air conditioner (2000) may include a housing (2110) forming an exterior. The housing (2110) may include a front housing (2112) covering the front of the housing (2110), a rear housing (2114) covering the rear, and a center housing (2116) disposed between them. According to one embodiment, each of the front housing (2112) and the rear housing (2114) may be detachable from the center housing (2116), and the present disclosure is not limited thereto.

[0287] According to one embodiment, the front housing (2112) may have a front panel (2118) disposed thereon.

[0288] According to one embodiment, the front panel (2118) may include an input unit (2120). According to one embodiment, the input unit (2120) includes any type of user input means including a button, a switch, and a touchpad, and setting data by a user (e.g., desired temperature, setting of operating mode for cooling / dehumidification / air purification, and setting of airflow) may be input through the input unit (2120).

[0289] According to one embodiment, the front panel (2118) may include a display module (2122). The display module (2122) may display information input by a user through an input unit (2120) (e.g., desired temperature, airflow setting, and / or operating mode setting). According to one embodiment, the display module (2122) may display various sensing information on the air conditioner (2000) (e.g., current indoor temperature measured by a temperature sensor), the current airflow or operating status of the air conditioner (2000), and / or various warning messages.

[0290] According to one embodiment, the display module (2122) may be provided at various locations on the air conditioner (2000). According to one embodiment of FIG. 19, the display module (2122) is exemplified as being provided on the front panel (2118), but is not limited thereto.

[0291] According to one embodiment, the display module (2122) of the indoor unit (2100) may include a display panel and a circuit board electrically connected to the display panel. The circuit board may include an electronic component named as a heat source, such as an application processor (AP). A structure for shielding and heat dissipation of the electronic component (e.g., the heat dissipation structure (500) of FIG. 5) is provided on the circuit board, and the structure may incorporate the features of the heat dissipation structures and / or related elements disclosed in FIG. 3 to FIG. 16. For example, in the heat dissipation structure (500) of the cooking appliance (11), an electronic component (e.g., the electronic component (520) of FIG. 5) is placed on a circuit board (e.g., the circuit board (510) of FIG. 5), and a shield can (e.g., the shield can (540) of FIG. 5) may be formed to be coupled to one side of the circuit board (510) and to surround the electronic component (520). A bracket (e.g., bracket (550) of FIG. 5) is coupled to a circuit board (510) in a state that accommodates a shield can (540) and may include at least one opening (e.g., opening (540a) of FIG. 5) formed to correspond to an electronic component (520). A first heat transfer member (e.g., first heat transfer member (530) of FIG. 5) is disposed between the electronic component (520) and the shield can (540), and a second heat transfer member (e.g., second heat transfer member (530) of FIG. 5) is disposed on the shield can (540) and may be formed so that at least a portion penetrates the opening (540a). A conductive plate (e.g., conductive plate (570) of FIG. 5) is disposed on a guide (e.g., guide (551) of FIG. 5) of the bracket (550) and may come into contact with the second heat transfer member (530). The heat diffusion path through the heat dissipation structure (500) may include a path in which heat generated from the electronic component (520) diffuses into the air above the conductive plate (570), and a path in which heat generated from the electronic component (520) diffuses into the circuit board (510) below.

[0292] According to one embodiment, the outdoor unit (2200) may include a housing (2210), internal components disposed within the housing (2210) (e.g., a compressor, an outdoor heat exchanger, and / or a flow switching valve), and an outdoor blower that generates forced air for heat exchange between the outdoor heat exchanger and the outdoor air. The outdoor blower may include one or more outdoor blower fans (2250) and fan motors, and the fan motor of the outdoor blower may provide driving force to the outdoor blower fans (2250) through a shaft.

[0293] According to one embodiment, the housing (2210) forms the exterior of the outdoor unit (2200) and can accommodate various components inside. The housing (2210) may have an overall cuboidal shape. The housing (2210) may include an upper housing (2215), a lower housing (2216), and a center housing (2211, 2212, 2213, 2214) positioned between the upper housing (2215) and the lower housing (2216).

[0294] The upper housing (2215) may be positioned to cover substantially the upper side (e.g., +Z-axis direction), for example. The lower housing (2216) may be positioned to cover substantially the lower side (e.g., -Z-axis direction), for example.

[0295] The center housing (2211, 2212, 2213, 2214) may include, for example, a front housing (2211) substantially covering the front (e.g., +X-axis direction), a rear housing (2212) substantially covering the rear (e.g., -X-axis direction), and a side housing (2213, 2214) substantially covering the side (e.g., +Y-axis and / or -Y-axis direction). The center housing (2211, 2212, 2213, 2214) may be formed integrally or made of a combination of two or more housings, as not illustrated.

[0296] Housings facing two or more of the respective housings (e.g., front, rear, side, top, bottom housings) of the housing (2210) may be formed as a single unit. For example, the front housing (2211) may include a front portion generally facing the front (e.g., +X-axis direction) and an extension portion extending from the front portion toward the side (e.g., +Y-axis and / or -Y-axis direction) or upward and downward (e.g., +Z-axis and / or -Z-axis direction). Each housing of the housing (2210) may be manufactured separately and assembled. The housing (2210) may be formed, for example, by press molding from sheet metal or injection molding from resin.

[0297] According to one embodiment, an intake port (not shown) for drawing in outside air may be formed in a region of the side housing (213) and / or rear housing (2212) of the housing (2210), and an exhaust port (2211c) for discharging the drawn-in outside air may be formed in a region of the front housing (2211). An outdoor blower fan (2250) is positioned adjacent to the exhaust port (2211c) and can forcibly draw in outside air by being rotated by a fan motor that rotates based on a control command. By rotating the outdoor blower fan (2250), air flow and heat exchange around the outdoor heat exchanger (e.g., the outdoor heat exchanger (240) of FIG. 2) of the air conditioner (2000) can be smoothly achieved.

[0298] According to one embodiment, an indoor unit (2100) and an outdoor unit (2200) may be connected by a pipe (P). Gaseous or liquid refrigerant may be moved through the pipe (P). The refrigerant of the air conditioner (2000) may circulate between the indoor unit (2100) and the outdoor unit (2200) through the pipe (P).

[0299] FIG. 20a is a perspective view of a refrigerator in a closed state according to one embodiment of the present disclosure.

[0300] FIG. 20b is a perspective view of a refrigerator in an open state according to one embodiment of the present disclosure.

[0301] Referring to FIGS. 20a and 20b, the refrigerator (3000) may include a main body (3010), a storage compartment (3020), a door (3030), and / or a cold air supply device.

[0302] According to one embodiment, the storage room (3020) may be partitioned inside the main body (3010) and formed into multiple spaces. A door (3030) may be positioned at the front of the main body (3010) to open and close the storage room (3020). A cold air supply device may be provided inside the main body (3010) to supply cold air to the storage room (3020).

[0303] According to one embodiment, the main body (3010) may include an inner housing (3011) and / or an outer housing (3012). The inner housing (3011) may be provided to form the exterior of, for example, a storage room (3020). The inner housing (3011) may be, for example, made of a plastic material and injection molded integrally. The outer housing (3012) may be provided to form at least a part of the exterior of, for example, a refrigerator (3000). The outer housing (3012) may be made of, for example, a metal material with excellent durability and aesthetic appeal. A receiving space may be formed between the inner housing (3011) and the outer housing (3012). A main body insulation material (not shown) that insulates the storage room (3020) may be provided in a part of the receiving space.

[0304] According to one embodiment, a cold air supply device can generate cold air by using a cooling circulation cycle that compresses, condenses, expands, and evaporates a refrigerant.

[0305] According to one embodiment, the storage room (3020) may be divided into multiple sections by partitions (3014). The storage room (3020) may be formed by the internal housing (3011) of the main body (3010) and the partitions (3014). Inside the storage room (3020), a plurality of shelves (3024) or storage containers (3025) may be provided to store food or the like. The plurality of shelves (3024) and storage containers (3025) may be provided to be separable, for example.

[0306] According to one embodiment, the storage room (3020) may be divided into a plurality of storage rooms (3021, 3022, 3023) by a partition (3014). For example, the storage room (3020) may include one first storage room (3021) located at the top (e.g., upper storage room) and two second storage rooms (3022) (e.g., lower storage rooms) and a third storage room (3023) (e.g., lower storage rooms) located at the bottom, as illustrated.

[0307] According to one embodiment, the partition wall (3014) may include a first partition wall (3141) and a second partition wall (3142). The partition wall (3014) may, for example, have a T-shaped cross-section. The first partition wall (3141) may be provided horizontally to partition, for example, the first storage room (3021) and the second and third storage rooms (3022, 23). The second partition wall (3142) may be provided vertically to partition, for example, the second storage room (3022) and the third storage room (3023). The second partition wall (3142) may be formed to protrude downward from the first partition wall (3141), for example. The illustrated second partition (3142) is formed protruding from the center of the first partition (3141), but is not limited thereto, and the size of the second storage room (3022) and the third storage room (3023) may vary depending on the position of the second partition (3142).

[0308] Among the illustrated storage rooms (3020), the first storage room (3021) can be used as a refrigerator, and the second and third storage rooms (3022, 23) can be used as freezers, but are not limited thereto, and the location and number of each refrigerator room and freezer room can be varied according to the user's needs.

[0309] According to one embodiment, the number, size, or shape of the storage rooms (3020) may vary depending on the shape or location of the partition wall (3014). The freezer room may be maintained at approximately minus 20 degrees, and the refrigerator room may be maintained at approximately plus 3 degrees. The storage rooms (3020) may be insulated, for example, by the partition wall (3014).

[0310] According to one embodiment, the storage room (3020) may be divided into left and right sections by a single vertical partition. Here, the vertical partition may be formed such that one end contacts the upper part of the inner housing (3011) and the other end contacts the lower part of the inner housing (3011). Depending on the position of the vertical partition, the size of the storage room (3020) divided into left and right sections may vary. For example, the vertical partition may be provided in the center so that the storage room (3020) divided into left and right sections is provided in a mirror-symmetric manner. According to one embodiment, there may be multiple vertical partitions. If there are multiple vertical partitions, three or more storage rooms (3020) may be provided in the left and right directions.

[0311] According to one embodiment, the storage room (3020) may be divided only into upper and lower sections by a single horizontal partition. That is, the storage room (3020) may be divided into two sections, an upper storage room and a lower storage room. Here, the horizontal partition may be formed such that one end contacts the left side of the inner housing (3011) and the other end contacts the right side of the inner housing (3011). Depending on the position of the horizontal partition, the size of the upper and lower sections of the storage room (3020) may vary. According to one embodiment, there may be multiple horizontal partitions. If there are multiple horizontal partitions, three or more storage rooms (3020) may be provided in the vertical direction. In addition to the above-described embodiment, multiple storage rooms (3020) of various types may be configured depending on the shape and number of the partitions (3014).

[0312] According to one embodiment, the door (3030) may include a first door (3031) (e.g., upper door) or a second door (3032) (e.g., lower door) as illustrated. The door (3030) may be provided to open and close, for example, an opening (3010a) of the main body (3010). The first door (3031) may be provided as a pair (e.g., double door) to open and close, for example, a first storage room (3021). The second door (3032) may be provided as a pair (e.g., double door) to open and close, for example, a second storage room (3022) or a third storage room (3023). In addition, the number and shape of the doors (3030) may vary in correspondence with the number and shape of the storage room (3020), and the doors (3030) may be configured not only in a rotating manner around the hinge (3016) but also in a sliding manner.

[0313] According to one embodiment, the display module (3500) may be provided at various locations on the door (3030). For example, according to one embodiment in FIG. 20a, the display module (3500) is illustrated as being provided on the first door (3031) (e.g., the upper door), but is not limited thereto.

[0314] According to one embodiment, a display module (3500) of a refrigerator (3000) may include a display panel and a circuit board electrically connected to the display panel. The circuit board may include an electronic component named as a heat source, such as an application processor (AP). A structure (e.g., a heat dissipation structure (30)) for shielding and heat dissipation of the electronic component is provided on the circuit board, and the structure may feature the heat dissipation structure and / or related elements disclosed in FIGS. 3 to 16. For example, in the heat dissipation structure (500) of the refrigerator (3000), an electronic component (e.g., an electronic component (520) of FIG. 5) is placed on a circuit board (e.g., a circuit board (510) of FIG. 5), and a shield can (e.g., a shield can (540) of FIG. 5) may be formed to be coupled to one side of the circuit board (510) and to surround the electronic component (520). A bracket (e.g., bracket (550) of FIG. 5) is coupled to a circuit board (510) in a state that accommodates a shield can (540) and may include at least one opening (e.g., opening (540a) of FIG. 5) formed to correspond to an electronic component (520). A first heat transfer member (e.g., first heat transfer member (530) of FIG. 5) is disposed between the electronic component (520) and the shield can (540), and a second heat transfer member (e.g., second heat transfer member (530) of FIG. 5) is disposed on the shield can (540) and may be formed so that at least a portion penetrates the opening (540a). A conductive plate (e.g., conductive plate (570) of FIG. 5) is disposed on a guide (e.g., guide (551) of FIG. 5) of the bracket (550) and may come into contact with the second heat transfer member (530). The heat diffusion path through the heat dissipation structure (500) may include a path in which heat generated from the electronic component (520) diffuses into the air above the conductive plate (570), and a path in which heat generated from the electronic component (520) diffuses into the circuit board (510) below.

[0315] According to one embodiment, a rotating bar (3316) may be provided on one of a pair of first doors (3031). The rotating bar (3316) may be positioned, for example, on the side opposite to the side forming the axis of rotation in one of the pair of first doors (3031). The rotating bar (3316) may be provided, for example, so that the axis of rotation is fixed to the side of one of the pair of first doors (3031) and can rotate around the axis of rotation. The rotating bar (3316) may be provided, for example, to be positioned in the center of the front of the main body (3010) when one of the pair of first doors (3031) is closed. The rotating bar (3316) may seal the gap between the pair of first doors (3031) when the pair of first doors (3031) are closed. The main body (3010) may be provided with a rotating bar guide (3015) that guides the movement of the rotating bar (3316) when one of the pair of first doors (3031) is closed.

[0316] According to one embodiment, the door (3030) (e.g., the first door (3031) or the second door (3032)) may include a door panel (3030a) or a door body (3030b). The door panel (3030a) and the door body (3030b) may be joined so as to be separable.

[0317] According to one embodiment, the door body (3030b) may be fixed to the main body (3010) at one side by a hinge (3016), for example. The door body (3030b) may be provided to be rotatable relative to the main body (3010). The door panel (3030a) may form part of the front exterior of the refrigerator (3000), for example. The door panel (3030a) may be an important aesthetic element, particularly when the refrigerator (3000) is placed indoors. Accordingly, the user may customize the front exterior of the refrigerator (3000) as desired by replacing the door panel (3030a) with one having a different color or design. According to some embodiments, the door panel (3030a) and the door body (3030b) may be formed as a single unit.

[0318] For convenience of explanation, only one first door (3031) and one second door (3032) will be described below, and the description of the remaining first door (3031) and the remaining second door (3032) will be omitted. However, the first door (3031) and the second door (3032) for which the description has been omitted may each have a configuration approximately identical to that of the first door (3031) and the second door (3032) described below, except that they are arranged in a mutual mirror-symmetrical manner. Additionally, the second door (3032) may have a configuration identical to that of the first door (3031), and a detailed description may be omitted.

[0319] According to one embodiment, the first door (3031) may include a first door handle (30 not shown), a first door shelf (3313), a first shelf support (3314), or a first gasket (3315). The first door (3031) may be rotatably coupled to the main body (3010), for example, to open and close at least a portion of the first storage room (3021). A user may open and close the first door (3031) using the first door handle. The first door handle may be formed as a recess on the bottom surface of the first door (3031) or as a protrusion on the front surface of the first door (3031), but is not limited thereto.

[0320] According to one embodiment, the first door shelf (3313) may be provided to store food, for example. On both the left and right sides of the first door shelf (3313), a first shelf support (3314) may be provided to support the first door shelf (3313). The first shelf support (3314) may be formed to extend vertically from the first door (3031), for example. That is, the first shelf support (3314) may be provided to protrude rearward from the back surface of the first door (3031) and extend in the vertical direction. The first shelf support (3314) may be provided detachably to the first door (3031) as a separate component, for example, or may be formed integrally. The first shelf support (3314) may be formed to protrude rearward from the rear surface of the door body (3030b), for example.

[0321] According to one embodiment, the first gasket (3315) may be provided to wrap around the back edge of the first door (3031), for example. Specifically, the first gasket (3315) may be provided to wrap around the edge of the door body (3030b). The first gasket (3315) may be provided to seal the gap with the main body (3010) when the first door (3031) is closed.

[0322] According to one embodiment, the second door (3032) may include a second door handle (3321) or a second gasket (3322). The second door (3032) may be rotatably coupled to the main body (3010), for example, to open and close the second storage room (3022) or the third storage room (3023). A user may open and close the second door (3032) using the second door handle (3321). The second door handle (3321) may be formed as a recess on the upper surface of the second door (3032) or as a protrusion on the front surface of the second door (3032), but is not limited thereto.

[0323] According to one embodiment, the second gasket (3322) may be provided to wrap around, for example, the back edge of the second door (3032). The second gasket (3322) may be provided to seal the gap with the main body (3010) when the second door (3032) is closed.

[0324] Although not illustrated, the second door (3031) may further include a configuration that is wholly or partially identical to the first door shelf (3313) and the first shelf support (3314) of the first door (3032).

[0325] Although the refrigerator (3000) according to one embodiment of the present disclosure has been described as an example of the present disclosure on the premise that it is a cold-cooling refrigerator, the concept of the present disclosure is not limited thereto and can also be applied to a direct-cooling refrigerator.

[0326] Generally, printed circuit boards (PCBs) and various electronic components are installed in home appliances. Some circuit electronic components mounted on the printed circuit board (PCB) generate electromagnetic waves (e.g., noise) and / or heat, and said generated electromagnetic waves (e.g., noise) and / or heat can cause malfunction and performance degradation of the home appliance.

[0327] A home appliance according to one embodiment of the present disclosure may provide a heat dissipation structure in which a shield can and a heat dissipation component (e.g., a thermal transfer material (TIM), a heat sink) are simultaneously applied to provide heat dissipation of electronic components and shielding of electromagnetic waves (e.g., noise).

[0328] According to one embodiment of the present disclosure, a heat dissipation structure can be provided for effective heat dissipation for a circuit board (or circuit board assembly) included in a home appliance in a high-temperature environment and / or a space-constrained environment (e.g., an environment having constraints on mounting space). For example, a heat dissipation structure and a heat dissipation structure design can be provided for optimizing the operation of an electronic component (e.g., a processor) of a circuit board assembly included in a component (e.g., a display module) of a home appliance (e.g., a robot vacuum cleaner).

[0329] A home appliance according to one embodiment of the present disclosure can provide effective heat dissipation performance by implementing a heat dissipation structure capable of forming a plurality of heat transfer paths. For example, it can provide a path for dissipating heat into a conductive plate placed above an electronic component and into the air, and a path for dissipating heat into a circuit board placed below the electronic component.

[0330] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs from the description below.

[0331] A robot vacuum cleaner (100) according to one embodiment of the present disclosure may include a main body (110), a cleaning unit (140) connected to the main body (110), a driving unit (130) disposed on the bottom surface of the main body for moving the robot vacuum cleaner, and a control panel (120) for controlling the operation of the robot vacuum cleaner. The control panel (120) may include a circuit board (510), an electronic component (520) disposed on the circuit board, a shield can (540) formed to be combined with the circuit board and to surround the electronic component, a heat sink (550) disposed on the shield can and having a plurality of heat dissipation fins arranged to diffuse heat generated by the electronic component, and a heat transfer member (530) disposed between the electronic component and the heat sink. The shield can may include a support portion (541) that supports the heat sink, a side wall (543) that extends from the support portion and is formed to surround at least a portion of the heat sink, and a fastening portion (547) that is formed inside the side wall and is coupled to the heat sink.

[0332] According to one embodiment, the shield can (540) may include at least one opening (540a) formed to contact the heat transfer member and the heat sink.

[0333] According to one embodiment, at least a portion of the heat transfer member (530) is formed to penetrate the opening and may be configured to diffuse heat generated from the electronic component by contacting the heat sink.

[0334] According to one embodiment, the side wall of the shield can may include a lower side wall (5432) spaced apart from the electronic component and the heat transfer member, and an upper side wall (5431) extending from a portion of the lower side wall and formed to surround the heat sink.

[0335] According to one embodiment, the fastening portion of the shield can may include a plurality of hooks (5471; 5472) that protrude from the inner side of the side wall and are fastened to the base of the heat sink.

[0336] According to one embodiment, a portion of the lower part of the side wall of the shield can positioned below the fastening portion may form a recess (549) with an opening at the bottom. The recess may be configured to disperse the impact generated in the shield can when the heat sink presses against the fastening portion and is joined.

[0337] According to one embodiment, the heat sink may include a plurality of heat dissipation fins (552) arranged in a direction perpendicular to the circuit board to easily dissipate heat, and a base (551) that supports the plurality of heat dissipation fins and is seated on the shield can.

[0338] According to one embodiment, a portion of the upper surface of the base of the heat sink may form a flat surface (553) for easy adsorption with an external suction gripper.

[0339] According to one embodiment, the flat surface of the heat sink may be positioned along the central region of the base.

[0340] According to one embodiment, the flat surface of the heat sink may be arranged along both edge regions of the base.

[0341] According to one embodiment, the support portion of the shield can may include an edge portion (5411) that supports an edge region of the heat sink, and an extension portion (5412) that extends to connect regions facing each other among the edge portions (5411) and supports a center region of the heat sink.

[0342] According to one embodiment, a portion of the extension of the shield can may include a flat surface for easy adsorption with an external suction gripper.

[0343] According to one embodiment, the extended portion of the shield can extends downward to be coupled with the circuit board and may be configured to partition the space within the shield can for shielding between a plurality of electronic components.

[0344] According to one embodiment, the heat sink mounted on the shield can may be configured to have its horizontal movement restricted by the upper side wall (5431) of the shield can and its vertical movement restricted by the fastening portion (547) of the shield can (540).

[0345] According to one embodiment, the robot vacuum cleaner may further include a case (420) covering the shield can and the heat sink, and an air space formed between the heat sink and the case. The air space may be configured to circulate heat diffused from the heat sink.

[0346] A home appliance according to one embodiment of the present disclosure may include a control panel (120) for controlling the operation of the home appliance. The control panel (120) may include a circuit board (510), an electronic component (520) disposed on the circuit board, a shield can (540) formed to surround the electronic component and coupled with the circuit board, a heat sink (550) disposed on the shield can and having a plurality of heat dissipation fins arranged to diffuse heat generated by the electronic component, and a heat transfer member (530) disposed between the electronic component and the heat sink. The shield can may include a support portion (541) that supports the heat sink, a side wall (543) that extends from the support portion and is formed to surround at least a portion of the heat sink, and a fastening portion (547) formed inside the side wall and coupled with the heat sink.

[0347] According to one embodiment, at least a portion of the heat transfer member is formed to penetrate the opening of the shield can and may be configured to diffuse heat generated from the electronic component by contacting the heat sink.

[0348] According to one embodiment, the side wall of the shield can may include a lower side wall (5432) spaced apart from the electronic component and the heat transfer member, and an upper side wall (5431) extending from a portion of the lower side wall and formed to surround the heat sink.

[0349] According to one embodiment, a portion of the lower part of the side wall of the shield can positioned below the fastening portion forms a recess (549) with an open lower side, and the recess may be configured to disperse the impact generated in the shield can when the heat sink presses the fastening portion and is joined.

[0350] According to one embodiment, the heat sink may include a plurality of heat dissipation fins (552) arranged in a direction perpendicular to the circuit board to easily dissipate heat, a base (551) supporting the plurality of heat dissipation fins and seated on the shield can, and a flat surface (553) positioned adjacent to the plurality of heat dissipation fins (552) and for easy adsorption with an external suction gripper.

Claims

1. In a robot vacuum cleaner (100), Main body (110); A cleaning unit (140) connected to the main body (110); A driving unit (130) positioned on the bottom surface of the main body for the movement of the robot vacuum cleaner; and It includes a control panel (120) for controlling the operation of the robot vacuum cleaner, and The above control panel (120) is, Circuit board (510); Electronic components (520) placed on the above circuit board; A shield can (540) formed to be combined with the circuit board and to surround the electronic component; A heat sink (550) disposed on the shield can and having a plurality of heat dissipation fins arranged to diffuse heat generated by the electronic component, and It includes a heat transfer member (530) disposed between the electronic component and the heat sink, and A robot vacuum cleaner comprising a shield can that includes a support portion (541) that supports the heat sink, a side wall (543) that extends from the support portion and is formed to surround at least a portion of the heat sink, and a fastening portion (547) that is formed inside the side wall and is coupled to the heat sink.

2. In Paragraph 1, A robot vacuum cleaner, wherein the shield can comprises at least one opening (540a) formed to contact the heat transfer member and the heat sink.

3. In Paragraph 2, A robot vacuum cleaner, wherein at least a portion of the heat transfer member is formed to penetrate the opening and configured to diffuse heat generated from the electronic component in contact with the heat sink.

4. In any one of paragraphs 1 to 3, A robot vacuum cleaner, wherein the side wall of the shield can comprises a lower side wall (5432) spaced apart from the electronic component and the heat transfer member, and an upper side wall (5431) extending from a portion of the lower side wall and formed to surround the heat sink.

5. In any one of paragraphs 1 through 4, A robot vacuum cleaner comprising a plurality of hooks (5471; 5472) that protrude from the inner side of the side wall and are connected to the base of the heat sink, the fastening portion of the shield can.

6. In any one of paragraphs 1 through 5, A robot vacuum cleaner, wherein a portion of the lower part of the side wall of the shield can positioned below the above-mentioned fastening portion forms a recess (549) with an opening at the bottom, and the recess is configured to disperse the impact generated in the shield can when the heat sink presses the fastening portion and is joined.

7. In any one of paragraphs 1 through 6, A robot vacuum cleaner comprising a plurality of heat dissipation fins (552) arranged perpendicular to the circuit board to facilitate heat dissipation, and a base (551) supporting the plurality of heat dissipation fins and mounted on the shield can.

8. In Paragraph 7, A robot vacuum cleaner, wherein a portion of the upper surface of the base of the heat sink forms a flat surface (553) for easy adsorption with an external suction gripper.

9. In Paragraph 8, The flat surface of the heat sink is a robot vacuum cleaner positioned along the central area of ​​the base.

10. In Paragraph 8, The flat surface of the heat sink is arranged along the two edge regions of the base, a robot vacuum cleaner.

11. In any one of paragraphs 1 through 10, A robot vacuum cleaner, wherein the support portion of the shield can comprises an edge portion (5411) that supports an edge region of the heat sink, and an extension portion (5412) that extends to connect regions facing each other among the edge portions (5411) and supports a center region of the heat sink.

12. In Paragraph 11, A robot vacuum cleaner in which a portion of the extension part of the shield can includes a flat surface for easy adsorption with an external suction gripper.

13. In Article 11 or Article 12, A robot vacuum cleaner, wherein the extended portion of the shield can extends downward to be coupled with the circuit board and is configured to partition the space within the shield can for shielding between a plurality of electronic components.

14. In any one of paragraphs 1 through 13, A robot vacuum cleaner in which the heat sink seated on the shield can is configured such that horizontal movement is restricted by the upper side wall (5431) of the shield can and vertical movement is restricted by the fastening part (547) of the shield can (540).

15. In any one of paragraphs 1 through 10, A case (420) covering the shield can and the heat sink; and It further includes an air space formed between the heat sink and the case, A robot vacuum cleaner configured such that the air space above is configured to circulate heat diffused from the heat sink.

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