Electronic device comprising display

Abstract

According to one embodiment disclosed herein, an electronic device may comprise: a housing forming at least a portion of the exterior of the electronic device; a display panel which is disposed on the housing and includes a first planar portion visible through the front surface of the electronic device, a bending portion extending from the first planar portion and at least partially bent, and a second planar portion extending from the bending portion and disposed below the first planar portion; a display driver integrated circuit disposed on one surface of the second planar portion facing the rear surface of the electronic device; and a flexible printed circuit board which is electrically connected to the second planar portion and disposed to cover the display driver integrated circuit. The flexible printed circuit board includes: a base part including at least one base conductive layer; and a first part which is positioned between the base part and the second planar portion and includes one or more first conductive layers, wherein an extension layer among the one or more first conductive layers of the first part extends along the second planar portion so as to protrude relative to the remaining first conductive layers of the first part, and may be electrically connected to the second planar portion. Various other embodiments may be possible.

Description

Electronic device including a display

[0001] The present disclosure relates to an electronic device including a display.

[0002] Driven by the remarkable advancements in information and communication technology and semiconductor technology, the distribution and use of various electronic devices are increasing rapidly. Electronic devices are being developed to enable portable communication.

[0003] The term "electronic device" refers to a device that performs specific functions according to an installed program, ranging from home appliances to electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, video / audio devices, desktop / laptop computers, or in-vehicle navigation systems. For example, these electronic devices can output stored information as sound or video. As the integration density of electronic devices increases and ultra-high-speed, high-capacity wireless communication becomes commonplace, various functions can be integrated into a single electronic device, such as a mobile communication terminal. For instance, not only communication functions but also entertainment functions like games, multimedia functions like music / video playback, communication and security functions like mobile banking, or functions such as schedule management and electronic wallets are being integrated into a single electronic device. These electronic devices are being miniaturized to allow users to carry them conveniently.

[0004] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art related to the present disclosure.

[0005] According to one embodiment of the present disclosure, an electronic device may include a housing, a display panel, a display driving integrated circuit, and a flexible printed circuit board. The housing may form at least a portion of the exterior of the electronic device. The display panel may be disposed on the housing. The display panel may include a first flat portion, a bending portion, and a second flat portion. The first flat portion may be visible through the front of the electronic device. The bending portion may extend from the first flat portion. The bending portion may be at least partially bent. The second flat portion may extend from the bending portion. The second flat portion may be disposed below the first flat portion. The display driving integrated circuit may be disposed on one side of the second flat portion facing the rear of the electronic device. The flexible printed circuit board may be electrically connected to the second flat portion. The flexible printed circuit board may be disposed to cover the display driving integrated circuit. The flexible printed circuit board may include a base part, a first part, and a second part. The base part may include at least one base conductive layer. The first part may be located between the base part and the second planar portion. The first part may include one or more first conductive layers. An extension layer among the one or more first conductive layers of the first part may be extended to protrude along the second planar portion relative to the remaining first conductive layers of the first part and may be electrically connected to the second planar portion.

[0006] According to one embodiment of the present disclosure, the device may include a housing, a display panel, a display driving integrated circuit, and a flexible printed circuit board. The housing may form at least a portion of the exterior of the electronic device. The display panel may be disposed on the housing. The display panel may include a first planar portion, a bending portion, and a second planar portion. The first planar portion may be visible through the front of the electronic device. The bending portion may extend from the first planar portion. The bending portion may be at least partially bent. The second planar portion may extend from the bending portion. The second planar portion may be disposed below the first planar portion. The display driving integrated circuit may be disposed on one side of the second planar portion facing the rear of the electronic device. The flexible printed circuit board may be electrically connected to the second planar portion. The flexible printed circuit board may enclose the display driving integrated circuit. The flexible printed circuit board may include a recess. The above recess may be recessed from one side of the flexible printed circuit board. The above recess may accommodate at least a portion of the display driving integrated circuit.

[0007] The aspects, configurations, and / or advantages described above regarding one embodiment of the present disclosure may become more apparent from the following detailed description with reference to the accompanying drawings.

[0008] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments.

[0009] FIG. 2 is a perspective view of an electronic device according to one embodiment of the present disclosure in an unfolded state.

[0010] FIG. 3 is a perspective view of an electronic device according to one embodiment of the present disclosure in an unfolded state.

[0011] FIG. 4 is a perspective view of an electronic device in a folded state according to one embodiment of the present disclosure.

[0012] FIG. 5 is a perspective view of an electronic device in a folded state according to one embodiment of the present disclosure.

[0013] FIG. 6 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0014] FIG. 7 is a plan view showing a display panel according to one embodiment of the present disclosure.

[0015] FIG. 8 is a cross-sectional view taken along the line AA' of FIG. 7 according to one embodiment of the present disclosure.

[0016] FIG. 9 is a cross-sectional view showing a display panel and a flexible printed circuit board according to one embodiment of the present disclosure.

[0017] FIG. 10 is a schematic diagram illustrating a plating process for forming a shielding member according to one embodiment of the present disclosure.

[0018] FIG. 11a is a cross-sectional view showing a flexible printed circuit board and a display panel according to one embodiment of the present disclosure.

[0019] FIG. 11b is a cross-sectional view showing a flexible printed circuit board and a display panel according to one embodiment of the present disclosure.

[0020] FIG. 12 is a cross-sectional view of a flexible printed circuit board according to one embodiment of the present disclosure.

[0021] FIG. 13 is a schematic diagram illustrating the configurations of a flexible printed circuit board according to one embodiment of the present disclosure.

[0022] FIG. 14 is a cross-sectional view of a multi-foldable electronic device according to one embodiment of the present disclosure.

[0023] FIG. 15 is a cross-sectional view of a multi-foldable electronic device according to one embodiment of the present disclosure.

[0024] FIG. 16 is a drawing illustrating an unfolded state of an electronic device according to one embodiment of the present disclosure.

[0025] FIG. 17 is a drawing illustrating a folded state of an electronic device according to one embodiment of the present disclosure.

[0026] FIG. 18 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0027] FIG. 19 is a plan view of a display panel according to one embodiment of the present disclosure.

[0028] FIG. 20 is a cross-sectional view taken along the line BB' of FIG. 19 according to one embodiment of the present disclosure.

[0029] FIG. 21 is a plan view illustrating the internal appearance of an electronic device according to one embodiment of the present disclosure.

[0030] FIG. 22 is a cross-sectional view taken along the C-C' and D-D' lines of FIG. 21 according to one embodiment of the present disclosure.

[0031] Throughout the attached drawings, similar parts, configurations, and / or structures may be assigned similar reference numbers.

[0032] Hereinafter, embodiments of the present disclosure are described in detail with reference to the drawings so that those skilled in the art can easily practice them. However, the present disclosure may be embodied in various different forms and is not limited to the embodiments described herein. In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and brevity.

[0033] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to various embodiments.

[0034] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0035] The processor (120) can control at least one other component (e.g., hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., program (140)), for example, and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., sensor module (176) or communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., central processing unit or application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., graphics processing unit, neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0036] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0037] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0038] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0039] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0040] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0041] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0042] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0043] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0044] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0045] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0046] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0047] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0048] The power management module (188) can manage the power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0049] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0050] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0051] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.

[0052] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0053] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0054] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0055] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0056] The electronic device according to the various embodiments disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0057] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as “coupled” or “connected” to another (e.g., 2nd) component, with or without the terms “functionally” or “communicationly,” it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0058] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0059] Various embodiments of the present document may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0060] According to one embodiment, the method according to the various embodiments disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or distributed online (e.g., download or upload) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0061] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0062] Hereinafter, an electronic device including a foldable housing is described with reference to FIGS. 2 to 6. For convenience of explanation, the orthogonal coordinate system (e.g., spatial coordinate system) shown in FIGS. 2 to 6 is described with respect to the first housing, but the present disclosure is not limited thereto. For example, the Z-axis direction shown in FIGS. 2 to 6 may be defined as the thickness direction of the first housing and / or electronic device, the Y-axis direction shown in FIGS. 2 to 6 may be defined as the length direction of the first housing and / or electronic device, and the X-axis direction shown in FIGS. 2 to 6 may be defined as the width direction of the first housing and / or electronic device.

[0063] FIG. 2 is a perspective view of an electronic device in an unfolded state according to one embodiment of the present disclosure. FIG. 3 is a perspective view of an electronic device in an unfolded state according to one embodiment of the present disclosure.

[0064] The embodiments of FIGS. 2 and 3 may be combined with the embodiment of FIG. 1 or the embodiments of FIGS. 4 to 22. The configurations of the embodiments of FIGS. 2 and 3 may be partially or wholly identical to the configurations of the embodiment of FIG. 1 or the configurations of FIGS. 4 to 22.

[0065] FIG. 2 may be a drawing of one side (e.g., front) of an electronic device viewed obliquely, and FIG. 3 may be a drawing of the other side (e.g., rear) of an electronic device viewed obliquely. As shown in FIG. 2 and FIG. 3, the unfolded state of the electronic device may be defined as a "first state."

[0066] According to one embodiment, an electronic device (101) (e.g., the electronic device (101) of FIG. 1) may include a housing (201) comprising a plurality of housing structures. The electronic device (101) may be defined and / or referred to as a multi-foldable electronic device. The housing (201) may be defined and / or referred to as a multi-foldable housing.

[0067] According to one embodiment, the electronic device (101) may include a display (202). The housing (201) may form a space in which the display (202) is placed. The display (202) (e.g., the display module (160) of FIG. 1) may include a flexible display. For example, the display (202) may be folded or rolled up in at least a portion and may be unfolded into a flat shape as shown in FIG. 2.

[0068] According to one embodiment, the display (202) may be configured to visually provide information to a user. The display (202) may include a display panel, a support plate configured to support the display panel and configured to be at least partially folded or unfolded, and a window member (e.g., a cover window) configured to cover the outer surface of the display panel and protect the display panel from external impact. For example, the display (202) may be formed as an assembly or laminate of the display panel, the support plate, the window member, and other parts, but is not limited thereto.

[0069] According to one embodiment, the housing (201) may include a first housing (210). The housing (201) may include a second housing (220). The housing (201) may include a third housing (230). The first housing (210) may be positioned between the second housing (220) and the third housing (230). For example, in an unfolded state (e.g., FIG. 2 and FIG. 3), the third housing (230) may be described as being positioned on one side of the first housing (210), while the second housing (220) is defined as being positioned on the other side of the first housing (210). The second housing (220) may be rotatably coupled to the first housing (210). The third housing (230) may be rotatably coupled to the first housing (210). The display (202) may include a first display area (202a) corresponding to the first housing (210), a second display area (202b) corresponding to the second housing (220), and a third display area (202c) corresponding to the third housing (230).

[0070] According to one embodiment, the display (202) may include a first folding area (202d). The first folding area (202d) may be connected to a first display area (202a) and a second display area (202b). The first folding area (202d) may be positioned corresponding to a first folding axis (e.g., the first folding axis (Ax1) of FIG. 6) provided by a first hinge (270). The first folding area (202d) may be at least partially folded or unfolded. For example, when the first housing (210) and the second housing (220) are positioned in a folded position relative to each other (e.g., FIG. 4 and FIG. 5), the first folding area (202d) may be folded. For example, when the first housing (210) and the second housing (220) are positioned in a spread-out position relative to each other (e.g., FIG. 2 and FIG. 3), the first folding area (202d) can be spread out.

[0071] According to one embodiment, the display (202) may include a second folding region (202e). The second folding region (202e) may be connected to the first display region (202a) and the third display region (202c). The second folding region (202e) may be positioned corresponding to a second folding axis (e.g., the second folding axis (Ax2) of FIG. 6) provided by a second hinge (280). The second folding region (202e) may be at least partially folded or unfolded. For example, when the first housing (210) and the third housing (230) are positioned in a folded position relative to each other (e.g., FIG. 4 and FIG. 5), the second folding region (202e) may be folded. For example, when the first housing (210) and the third housing (230) are positioned in a spread-out position relative to each other (e.g., FIG. 2 and FIG. 3), the second folding area (202e) can be spread out.

[0072] According to one embodiment, the electronic device (101) may include a support (240, 250, 260). The support (240, 250, 260) may be positioned between the housing (201) and the display (202). The support (240, 250, 260) may be coupled to the housing (201) and may support the display (202). The support (240, 250, 260) may be positioned to surround the edge of the display (202). The support (240, 250, 260) may extend along the perimeter of the housing (201). For example, the support (240, 250, 260) may suppress or prevent the edge portion of the display (202) from coming into direct contact with the housing (201). The support members (240, 250, 260) may include a first support member (240) disposed in a first housing (210), a second support member (250) disposed in a second housing (220), and a third support member (260) disposed in a third housing (230). The support members (240, 250, 260) may be named "body". The support members (240, 250, 260) may be named "frame". The support members (240, 250, 260) may be named "sealing member". The support members (240, 250, 260) may be named "peripheral part". The support (240, 250, 260) may be named a "circumferential part." The support (240, 250, 260) may be named a "pheripheral structure." The support (240, 250, 260) may be named a "circumferential structure." The support (240, 250, 260) may be placed between the housing (210, 220, 230) and the display (202). The support (240, 250, 260) may reduce friction between the housing (210, 220, 230) and the display (202).The support members (240, 250, 260) can be named "cushioning members".

[0073] According to one embodiment, the support (240, 250, 260) may include a first support (240). The first support (240) may be positioned between the first housing (210) and the display (202) (e.g., the first display area (202a)). The first support (240) may be positioned along the edge of the first housing (210). The first support (240) may include a first-1 support (241) and a first-2 support (242). At least a portion of the display (202) may be positioned between the first-1 support (241) and the first-2 support (242). A first-1 support member (241) may be placed at one end (e.g., upper end) of the first housing (210), and a first-2 support member (242) may be placed at the other end (e.g., lower end) of the first housing (210). The support members (240, 250, 260) may be named "decoration members" or "non-conductive members."

[0074] According to one embodiment, the support (240, 250, 260) may include a second support (250). The second support (250) may be positioned between the second housing (220) and the display (202) (e.g., the second display area (202b)). The second support (250) may be positioned along the edge of the second housing (220). The second support (250) may include a second-1 support (251), a second-2 support (252), and a second-3 support (253). At least a portion of the display (202) may be positioned between the second-2 support (252) and the second-3 support (253). The second-1 support (251) may connect the second-2 support (252) and the second-3 support (253). The second-1 support (251) may extend along the edge of the second housing (220) (e.g., the edge (222) in FIG. 3). The second-1 support (251) may be positioned between the edge (222) of the second housing (220) and the display (202). The second-1 support (251) may be named "support frame" or "first support frame". The second-2 support (252) and the second-3 support (253) may each be named "second support frame".

[0075] According to one embodiment, the support (240, 250, 260) may include a third support (260). The third support (260) may be positioned between the third housing (230) and the display (202) (e.g., a third display area (202c)). The third support (260) may be positioned along the edge of the third housing (230). The third support (260) may include a third-1 support (261), a third-2 support (262), and a third-3 support (263). At least a portion of the display (202) may be positioned between the third-2 support (262) and the third-3 support (263). The third-1 support (261) may connect the third-2 support (262) and the third-3 support (263). The third-1 support (261) may extend along the edge of the third housing (230) (e.g., the edge (232) in FIG. 3). The third-1 support (261) may be positioned between the edge (232) of the third housing (230) and the display (202). The third-1 support (261) may be named a "support frame" or a "first support frame". The third-2 support (262) and the third-3 support (263) may each be named a "second support frame".

[0076] According to one embodiment, although the location or section has been described separately for convenience of explanation, the support members (240, 250, 260) may be arranged in a single frame shape or a closed curve shape to substantially surround the display (202). For example, the first support member (241) may connect the second support member (252) and the third support member (262), and the first support member (242) may connect the second support member (253) and the third support member (263). In one embodiment, the support members (240, 250, 260) may be separated from each other. For example, the second support (250) may be spaced apart from the first support (240) in an area adjacent to the first hinge (270) and / or the second hinge (280), and / or the third support (260) may be spaced apart from the first support (240). The shape or structure of these supports (240, 250, 260) may be appropriately implemented according to the specifications of the electronic device to be actually manufactured.

[0077] According to one embodiment, the first housing (210) may include a first-1 side portion (211) and a first-2 side portion (212). Each of the first-1 side portion (211) and the first-2 side portion (212) may form opposite sides of the first housing (210). The second housing (220) may be coupled to the first-1 side portion (211). For example, the second housing (220) may be rotatably connected to the first-1 side portion (211) via a first hinge (270). The third housing (230) may be coupled to the first-2 side portion (212). For example, the third housing (23) may be rotatably connected to the first-2 side portion (212) via a second hinge (280). The first-1 side part (211) may be named the "first connecting part." The first-2 side part (212) may be named the "second connecting part." The first-1 side part (211) may be named the "first part." The first-2 side part (212) may be named the "second part."

[0078] According to one embodiment, the second housing (220) may include a second-1 side portion (221) and a second-2 side portion (222). Each of the second-1 side portion (221) and the second-2 side portion (222) may form opposite sides of the second housing (220). The second-1 side portion (221) may be rotatably coupled to the first-1 side portion (211) of the first housing (210). The second-2 side portion (222) may form at least one side of the housing (201). The second-2 side portion (222) may be named "edge". The second-1 side portion (221) may be named "third side portion". The second-2 side portion (222) may be named "fourth side portion".

[0079] According to one embodiment, the third housing (230) may include a third-1 side portion (231) and a third-2 side portion (232). Each of the third-1 side portion (231) and the third-2 side portion (232) may form opposite sides of the third housing (230). The third-1 side portion (231) may be rotatably coupled to the first-2 side portion (212) of the first housing (210). The third-1 side portion (231) may be coupled to the first housing (210). The third-2 side portion (232) may form a side of the housing (201). The third-2 side portion (232) may be named "edge". The third-1 side portion (231) may be named "fifth side portion". The third-2nd side section (232) can be named the "sixth side section".

[0080] According to one embodiment, the electronic device (101) may include a first hinge (270) (e.g., the first hinge (270) of FIG. 4) and a second hinge (280) (e.g., the second hinge (280) of FIG. 4). The first hinge (270) may be positioned between a first housing (210) and a second housing (220). The first hinge (270) may be positioned between a first-1 side portion (211) and a second-1 side portion (221) and connected to the first-1 side portion (211) and the second-1 side portion (221). The first hinge (270) may rotatably connect the first housing (210) and the second housing (220). For example, the second hinge (280) may be positioned between the first housing (210) and the third housing (230). The second hinge (280) may be positioned between the first-2 side portion (212) and the third-1 side portion (231) and connected to the first-2 side portion (212) and the third-1 side portion (231). The second hinge (280) may rotatably connect the first housing (210) and the third housing (230).

[0081] According to one embodiment, when the electronic device (101) is in a folded state (e.g., FIG. 4 and FIG. 5), the second-second side portion (222) of the second housing (220) may be positioned between the first housing (210) and the third housing. In one embodiment, when the electronic device (101) is in a folded state, the second-second side portion (222) may be positioned adjacent to the second hinge (280).

[0082] According to one embodiment, the electronic device (101) may include a sub-display (205) (e.g., the display module (160) of FIG. 1). The sub-display (205) may be disposed in a first housing (210). For example, the sub-display (205) may be visually exposed through the rear of the first housing (210). For example, a first display area (203a) may be disposed on the front of the first housing (210), and a sub-display (205) may be disposed on the rear of the first housing (210). The sub-display (205) may display a screen in a direction different from the first display area (202a). For example, the sub-display (205) may output a screen in the opposite direction of the first display area (202a).

[0083] According to one embodiment, the electronic device (101) may include a camera assembly (208). The camera assembly (208) may be disposed in a third housing (230). For example, the camera assembly (208) may be exposed through at least a portion of the rear of the third housing (230). At least one camera of the camera assembly (208) may include one or more lenses, an image sensor, and / or an image signal processor. The camera assembly (208) may be defined and / or referred to as a rear camera assembly exposed through the rear of the third housing (230).

[0084] FIG. 4 is a perspective view of an electronic device in a folded state according to one embodiment of the present disclosure. FIG. 5 is a perspective view of an electronic device in a folded state according to one embodiment of the present disclosure.

[0085] The embodiments of FIGS. 4 and 5 may be combined with the embodiments of FIGS. 1 to 3, or the embodiments of FIGS. 6 to 22. The embodiments of FIGS. 4 and 5 may be partially or entirely identical to the configurations of the embodiments of FIGS. 1 to 3, or the configurations of the embodiments of FIGS. 6 to 22.

[0086] FIG. 4 may be a drawing of one side of the electronic device in a folded state (e.g., the front of the first housing) viewed obliquely, and FIG. 5 may be a drawing of the other side of the electronic device in a folded state (e.g., the rear of the third housing) viewed obliquely. As shown in FIG. 4 and FIG. 5, the unfolded state of the electronic device may be defined as a "second state."

[0087] According to one embodiment, the second housing (220) may be rotated relative to the first housing (210). For example, the second housing (220) may be rotated (or moved) relative to the first housing (210) between a position facing the first housing (210) (e.g., FIG. 4 and FIG. 5) and a position extended parallel to one side of the first housing (210) (e.g., FIG. 2 and FIG. 3). The first hinge (270) may provide a center of rotation to the second housing (220). For example, the second housing (220) may be rotated relative to the first housing (210) through the first hinge (270). The third housing (230) may be rotated relative to the first housing (210). For example, the third housing (230) may rotate (or move) relative to the first housing (210) between a position facing the first housing (210) and a position extended parallel to one side of the first housing (210). The second hinge (280) may provide a center of rotation to the third housing (230). For example, the third housing (230) may be rotated relative to the first housing (210) through the second hinge (280).

[0088] According to one embodiment, in the illustrated embodiment, when the second housing (220) and the third housing (230) are positioned facing the first housing (210), for example, in the folded state of FIGS. 4 and 5, the second housing (220) may be positioned between the first housing (210) and the third housing (230). In the structure in which the second housing (220) is positioned between the first housing (210) and the third housing (230) in the folded state, the width of the first hinge (270) (e.g., width in the Z-axis direction of FIGS. 4 and 5) may be smaller than the width of the second hinge (280) (e.g., width in the Z-axis direction of FIGS. 4 and 5). In one embodiment, the first hinge (270) may be defined and / or referred to as a narrow hinge, and the second hinge (280) may be defined and / or referred to as a wide hinge.

[0089] According to one embodiment, when the electronic device (101) is in a folded state, each of the housings (210, 220, 230) may be arranged or stacked in one direction (e.g., the Z-axis direction). For example, a second housing (220) may be placed on the upper side (e.g., +Z) of the first housing (210), and a third housing (230) may be placed on the upper side (e.g., +Z) of the second housing (220). For example, the second housing (220) may be placed between the first housing (210) and the third housing (230).

[0090] According to one embodiment, when the electronic device (101) is in a folded state, the first housing (210), the second housing (220), and the third housing (230) may be aligned so as to overlap each other. For example, when the electronic device (101) is in a folded state, the first housing (210), the second housing (220), and the third housing (230) may be aligned in one direction (e.g., +Z direction) in the order described.

[0091] According to one embodiment, when the electronic device (101) is in a folded state, a sub-display (205) placed in a first housing (210) may be positioned on one side of the electronic device (101) (e.g., the side facing the -Z direction in FIG. 4 and 5), and a camera assembly (208) placed in a third housing (230) may be positioned on the other side of the electronic device (101) (e.g., the side facing the +Z direction in FIG. 4 and 5).

[0092] FIG. 6 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0093] The embodiment of FIG. 6 may be combined with the embodiments of FIG. 1 to 5, or the embodiments of FIG. 7 to 22. The configurations of the embodiment of FIG. 6 may be partially or wholly identical to the configurations of the embodiments of FIG. 1 to 5, or the configurations of the embodiments of FIG. 7 to 22.

[0094] Figure 6 shows a state where the display (e.g., the display (202) of Figure 2) is not shown.

[0095] According to one embodiment, the first housing (210) may include a first housing body (216). The first housing (210) may include a first cover (217). The first housing body (216) and the first cover (217) may be combined. At least a portion of a display (e.g., the display (202) of FIG. 2) (e.g., the first display area (202a) of FIG. 2) may be seated on the first housing body (216). For example, the first display area of ​​a flexible display (e.g., the first display area (202a) of FIG. 2) may be supported by the first housing body (216).

[0096] According to one embodiment, the second housing (220) may include a second housing body (226). The second housing (220) may include a second cover (227). The second housing body (226) and the second cover (227) may be combined. At least a portion of a display (e.g., the display (202) of FIG. 2) (e.g., the second display area (202b) of FIG. 2) may be seated on the second housing body (226). For example, the second display area of ​​a flexible display (e.g., the second display area (202b) of FIG. 2) may be supported by the second housing body (226).

[0097] According to one embodiment, the third housing (230) may include a third housing body (236). The third housing (230) may include a third cover (237). The third housing body (236) and the third cover (237) may be combined. At least a portion of a display (e.g., the display (202) of FIG. 2) (e.g., the third display area (202c) of FIG. 2) may be seated on the third housing body (236). For example, the third display area of ​​a flexible display (e.g., the third display area (202c) of FIG. 2) may be supported by the third housing body (236).

[0098] According to one embodiment, each of the first housing body (216), the second housing body (226), and the third housing body (236) may have at least a portion of its side formed by an antenna radiator, but is not limited thereto.

[0099] According to one embodiment, the first hinge (270) can rotatably connect the first housing body (216) and the second housing body (226). The second hinge (280) can rotatably connect the first housing body (216) and the third housing body (236).

[0100] According to one embodiment, a display (e.g., the display (202) of FIG. 2) may be disposed on the front surface (e.g., the side facing the +Z direction of FIG. 2 and FIG. 6) of the housing body(s) (216, 226, 236).

[0101] According to one embodiment, cover(s) (217, 227, 237) may be disposed on the rear surface (e.g., the side facing the -Z direction in FIG. 3 and FIG. 6) of the housing body(s) (216, 226, 236). The corresponding housing body(s) (216, 226, 236) and cover(s) (217, 227, 237) may be joined together to form an internal space for placing and / or mounting electrical / electronic components therein.

[0102] According to one embodiment, the electronic device (101) may include at least one battery (203) (e.g., the battery (189) of FIG. 1). The at least one battery (203) may supply power to the electrical components of the electronic device (101) (e.g., a display (202), a sub-display (205), a circuit board (204)). The at least one battery (203) may be provided in a plurality and at least one may be placed in each of the housings (210, 220, 230), but is not limited thereto. The at least one battery (203) may be placed between the housing body (216, 226, 236) and the cover (217, 227, 237).

[0103] According to one embodiment, the electronic device (101) may include at least one circuit board (204). The at least one circuit board (204) may be electrically connected to the electrical components of the electronic device (101) (e.g., a display (202), a sub-display (205), a battery (203)). The at least one circuit board (204) may be provided in a plurality and at least one may be disposed in each of the housings (210, 220, 230), but is not limited thereto. The at least one circuit board (204) may be disposed between the housing body (216, 226, 236) and the cover (217, 227, 237). At least one circuit board (204) may include at least one of a printed circuit board (PCB), a flexible printed circuit board (FPCB), and a rigid-flexible PCB (RF-PCB).

[0104] According to one embodiment, the electronic device (101) may include a camera assembly (208). The camera assembly (208) may be positioned between a third housing body (236) and a third cover (237).

[0105] According to one embodiment, the camera assembly (208) may be visually exposed to the outside of the third housing (230) at least partially through an opening formed in the third cover (237), but is not limited thereto.

[0106] According to one embodiment, the sub-display (205) may be visually exposed to the outside of the first housing (210) through the first cover (217). According to an embodiment, the sub-display (205) may be integrated with the first cover (217), or the sub-display (205) may form the first cover (217).

[0107] According to one embodiment, the electronic device (101) may include a flexible printed circuit board (209) (FPCB). The flexible printed circuit board (209) may be electrically connected to a circuit board (204).

[0108] The electronic device (101) disclosed in FIGS. 2 through 6 has the appearance of a foldable electronic device, but is not limited thereto. For example, the illustrated electronic device (101) may be a bar-type electronic device, a plate-type electronic device, or a rollable electronic device. The term "rollable electronic device" may refer to an electronic device in which a display (e.g., the display (202) in FIG. 2) is capable of bending deformation so that at least a portion can be wound or rolled or stored inside a housing (e.g., the housing (201) in FIG. 2). Depending on the user's needs, the rollable electronic device may be used by expanding the screen display area by unfolding the display or by exposing a larger area of ​​the display to the outside. The "rollable electronic device" may also be referred to as a slideable electronic device comprising a first housing portion and a second housing portion configured to be slidably moved relative to the first housing portion.

[0109] FIG. 7 is a plan view showing a display panel according to one embodiment of the present disclosure. FIG. 8 is a cross-sectional view taken along the line AA' of FIG. 7 according to one embodiment of the present disclosure.

[0110] The embodiments of FIGS. 7 and 8 may be combined with the embodiments of FIGS. 1 to 6 or the embodiments of FIGS. 9 to 22. The configurations of the embodiments of FIGS. 7 and 8 may be partially or wholly identical to the configurations of the embodiments of FIGS. 1 to 6 or the configurations of FIGS. 9 to 22.

[0111] Referring to FIGS. 7 and FIGS. 8, an electronic device (e.g., the electronic device (101) of FIGS. 2 to 6) may include a flexible display panel (310).

[0112] Referring to FIG. 7, the flexible display panel (310) may include a display panel comprising one or more pixels.

[0113] According to one embodiment, the flexible display panel (310) may be defined and / or interpreted as a part layer of the flexible display (e.g., the display (202) of FIG. 2), but is not limited thereto.

[0114] According to one embodiment, the flexible display panel (310) may include a first display area (311) (e.g., the first display area (202a) of FIG. 2), a second display area (312) (e.g., the second display area (202b) of FIG. 2), a third display area (313) (e.g., the third display area (202c) of FIG. 2), a first folding area (314) (e.g., the first folding area (202d) of FIG. 2), and a second folding area (315) (e.g., the second folding area (202e) of FIG. 2).

[0115] According to one embodiment, the second display area (312) may form a part of the flexible display panel (310). The coupling and / or connection relationship between the second display area (312) and the flexible printed circuit board (330) will be described below. This can be defined as the coupling and / or connection relationship between the display panel corresponding to the second display area (312), which is a part of the flexible display panel (310), and the flexible printed circuit board (330). For convenience of explanation, the second display area (312) may be referred to as "display panel (312)," and the display panel (312) may be interpreted as forming a part of the flexible display panel (310).

[0116] The display panel (312) may include a first planar portion (3121) that can be visually seen through the front of the electronic device (101) and a second planar portion (3122) positioned below the first planar portion (3121) (e.g., in the -Z direction).

[0117] According to one embodiment, the electronic device (101) may include a flexible printed circuit board (330) (flexible printed circuit board; FPCB).

[0118] According to one embodiment, the flexible printed circuit board (330) may be physically and / or electrically connected to the second planar portion (3122). The flexible printed circuit board (330) may include a connector (337) that is physically and / or electrically connected to a printed circuit board (PCB) including an application processor (e.g., processor (120) of FIG. 1).

[0119] Referring to FIG. 8, the display panel (312) may include a first flat portion (3121) that can be visually seen through the front of the electronic device. The first flat portion (3121) may be defined as an active area.

[0120] According to one embodiment, the display panel (312) may include a bending portion (3123) that extends from a first planar portion (3121) and is at least partially bent. The bending portion (3123) may face a side wall of a second housing (e.g., the second housing (220) of FIG. 2). However, the position and / or arrangement of the bending portion (3123) is not necessarily limited thereto.

[0121] According to one embodiment, the display panel (312) may include a second planar portion (3122) extending from a bending portion (3123). The second planar portion (3122) may be positioned substantially parallel to the first planar portion (3121), but is not limited thereto. The second planar portion (3122) may be positioned below (e.g., in the -Z direction) the first planar portion (3121).

[0122] According to one embodiment, the electronic device may include a display driver integrated circuit (320) (display driver integrated circuit; DDI).

[0123] According to one embodiment, the display driving integrated circuit (320) may be placed (or mounted) on the second planar portion (3122).

[0124] According to one embodiment, the display driving integrated circuit (320) can be controlled by an application processor. The display driving integrated circuit (320) is electrically connected to a second planar portion (3122) and can control at least one pixel of the display panel (312).

[0125] According to one embodiment, the display driving integrated circuit (320) may be placed on one side of a second planar portion (3122) facing the rear of the electronic device (101) (e.g., the side facing the -Z direction in FIG. 8), but is not limited thereto.

[0126] According to one embodiment, the display driving integrated circuit (320) may be provided in the form of a chip, but is not limited thereto. The structure in which the display driving integrated circuit (320) is disposed on the second planar portion (3122) may be interpreted as a CoP (Chip on Panel) structure, but is not limited thereto.

[0127] According to one embodiment, the flexible printed circuit board (330) may be physically and / or electrically connected to the surface of the second planar portion (3122).

[0128] According to one embodiment, the flexible printed circuit board (330) may include a tail part (331). The tail part (331) may be extended to protrude relative to other parts of the flexible printed circuit board (330) and may be coupled to a second planar part (3122) through a conductive film layer (336). The conductive film layer (336) may be physically and / or electrically connected to the tail part (331) and the second planar part (3122).

[0129] According to one embodiment, the conductive film layer (336) may include an anisotropic conductive film (ACF). Here, "anisotropic" may mean having physical and / or electrical anisotropy. For example, the anisotropic conductive film (ACF) may conduct electricity only in a direction perpendicular to the surface of the film and block electricity in a direction horizontal to the surface of the film. According to one embodiment, the anisotropic conductive film may include conductive particles and an insulating adhesive surrounding the conductive particles. However, examples of the conductive film layer (336) are not limited thereto.

[0130] According to one embodiment, the flexible printed circuit board (330) may include a recess (335). The recess (335) may be formed by a depression in one side of the flexible printed circuit board (330) in contact with the second planar portion (3122) (e.g., the side facing the +Z direction in FIG. 8). At least a portion of the display driving integrated circuit (320) may be accommodated in the recess (335).

[0131] According to one embodiment, as the display driving integrated circuit (320) is accommodated in the recess (335) of the flexible printed circuit board (330), the stacked structure of the flexible printed circuit board (330), the display driving integrated circuit (320), and the display panel (312) can be miniaturized. Accordingly, the space for accommodating electrical / electronic components inside the electronic device can be increased.

[0132] According to one embodiment, the flexible printed circuit board (330) may include a connector (337). The connector (337) may be physically and / or electrically connected to a printed circuit board including an application processor.

[0133] FIG. 9 is a cross-sectional view showing a display panel and a flexible printed circuit board according to one embodiment of the present disclosure. FIG. 10 is a schematic diagram illustrating a plating process for forming a shielding member according to one embodiment of the present disclosure.

[0134] The embodiments of FIGS. 9 and 10 may be combined with the embodiments of FIGS. 1 to 8, or the embodiments of FIGS. 11a to 22. The configurations of the embodiments of FIGS. 9 and 10 may be partially or wholly identical to the configurations of the embodiments of FIGS. 1 to 8, or the configurations of FIGS. 11a to 22.

[0135] Referring to FIG. 9, a flexible printed circuit board (400) (e.g., the flexible printed circuit board (330) of FIG. 8) may include a first part (401), a second part (402), and a base part (403).

[0136] According to one embodiment, a first part (410) of a flexible printed circuit board (400) may be placed on a second planar portion (3122) of a display panel (312).

[0137] According to one embodiment, an electronic device (e.g., the electronic device (101) of FIGS. 1 to 6) may further include a spacer (318). The spacer (318) may be positioned between a first planar portion (3121) and a second planar portion (3122). The spacer (318) may be at least partially wrapped by the first planar portion (3121), the second planar portion (3122), and the bending portion (3123). According to one embodiment, the spacer (318) may serve to provide rigidity to a flexible printed circuit board (400) including a bent portion.

[0138] According to one embodiment, the flexible printed circuit board (400) may include a plurality of conductive layers (411, 412, 413, 414, 415, 416, 417, 418). Each of the plurality of conductive layers (411, 412, 413, 414, 415, 416, 417, 418) may include copper, but is not limited thereto.

[0139] According to one embodiment, the base part (403) may include a non-conductive substrate (424) and at least one first base conductive layer (414, 415). Here, the non-conductive substrate (424) may be, for example, a polyimide (PI) film. The base part (403) may include wiring such as a power line, a ground line, and / or other signal lines in the first base conductive layers (414, 415). Thus, the base part (403) may provide ground to other conductive layers of the flexible printed circuit board (400) or provide power provided from a battery to other conductive layers of the flexible printed circuit board (400). However, the role of the base part (403) is not limited thereto.

[0140] According to one embodiment, the base part (403) may be a part that is initially formed in the manufacturing process of a flexible printed circuit board (400). According to one embodiment, the base part (403) may be composed of a base flexible copper clad laminate (FCCL) layer. For example, the base part (403) may be implemented as a double-sided flexible copper clad laminate (FCCL) by placing metal layers on both sides of a non-conductive substrate (424) made of polyimide (PI) material. At least one first base conductive layer (414, 415) may include a first metal layer (414) placed on one side of the non-conductive substrate (424) and a second metal layer (415) placed on the other side of the non-conductive substrate (424). And, the flexible printed circuit board (400) can be configured as a multi-layer flexible printed circuit board (FPCB) by laminating other non-conductive substrate(s) (e.g., polyimide (PI) layer) (421, 422, 423, 425, 426, 427) and other metal layer(s) (e.g., copper (cu)) (411, 412, 413, 416, 417, 418) on the upper and / or lower surfaces of the base part (403) in the form of a double-sided flexible copper clad laminate (FCCL). Here, other non-conductive substrate(s) (421, 422, 423, 425, 426, 427) and other metal layer(s) (411, 412, 413, 416, 417, 418) can be bonded to the base part (403) using adhesive layer(s) (405). Here, the adhesive layer(s) (405) may include a bonding sheet and / or prepreg (PPG; preimpregnated materials).For example, prepreg (PPG) is a material composed of carbon fibers, glass fibers and / or aramid fibers, etc., mixed with epoxy resin, and not only serves to bond one component to another component, but also, when cured, can serve to increase the rigidity of the flexible printed circuit board (400).

[0141] FIG. 9 illustrates, as an example, that a first part (401) and a second part (402) are respectively disposed on one side of a base part (403). However, this is not necessarily limited thereto, and they may be disposed only on one side relative to the base part (403). According to one embodiment of the present disclosure, the flexible printed circuit board (400) may include only the side part where the recess and the display driving integrated circuit (320) are disposed relative to the base part (403). For example, it may include only the first part (401) disposed relative to one side relative to the base part (403), and the first part (401) may have a recess (450) formed therein and the display driving integrated circuit (320) disposed therein. If a recess (450) is formed in the second part (402) positioned on the other side relative to the base part (403) and a display driving integrated circuit (320) is positioned therein, then in this case, the first part (401) may be omitted as shown in FIG. 9.

[0142] FIG. 9 illustrates a first part (401) having three adhesive layers (405) and three metal layers (411, 412, 413) combined on one side relative to a base part (403), and a second part (402) having three adhesive layers (405) and three metal layers (416, 417, 418) combined on the other side, but the number of adhesive layers and / or metal layers of the present disclosure is not limited to those shown in the drawings. According to one embodiment, the first part (401) may be disposed between the base part (403) and the second planar portion (3122). According to one embodiment, the first part (401) may include one or more first conductive layers (411, 412, 413).

[0143] According to one embodiment, the flexible printed circuit board (400) may include an extension layer (4111) (e.g., a conductive layer). The extension layer (4111) may be formed by protruding from any one of the conductive layers (411, 412, 413, 414, 415, 416, 417, 418) of the flexible printed circuit board (400).

[0144] According to one embodiment of the present disclosure, the extension layer (4111) may be formed by protruding from any one of the conductive layers (411, 412, 413, 414) disposed between the non-conductive substrate (424) and the second planar portion (3122).

[0145] According to one embodiment, the first part (401) may include an extension layer (4111) extending from the first conductive layer (411). The extension layer (4111) may extend along the second planar portion (3122) and may be electrically connected to the end of the second planar portion (3122) through a conductive film layer (460) (e.g., the conductive film layer (336) of FIG. 8).

[0146] Although not illustrated in the drawing, the extension layer (4111) may be extended to protrude from the remaining first conductive layers (412, 413). The portion protruding from the remaining first conductive layers (412, 413) (e.g., extension layer (4111)) may also be extended along the second planar portion (3122) and may be electrically connected to the end of the second planar portion (3122) through the conductive film layer (460) (e.g., the conductive film layer (336) of FIG. 8).

[0147] According to one embodiment, the first part (401) may include a non-conductive extension layer (4221) (e.g., a polyimide film layer) laminated on one side of the extension layer (4111) (e.g., the first conductive layer (411)). According to one embodiment, an insulating layer (4222) (e.g., a non-conductive substrate made of polyimide (PI) material) and a coverlay layer (4223) may be laminated on one side and / or the other side of the extension layer (4111) and the non-conductive extension layer (4221). For example, the coverlay layer (4223) may serve to physically protect the extension layer (4111) and the non-conductive extension layer (4221) and to electrically insulate them from the outside. According to one embodiment, an insulating layer (4222) is laminated on the surface of a coverlay layer (4223) to increase flexibility and durability for the extension layer (4111) and the non-conductive extension layer (4221) extended from the first part (401).

[0148] According to one embodiment, the extension layer (4111) may be the first conductive layer (411) closest to the second planar portion (3122) among the first conductive layers (411, 412, 413). According to one embodiment, as the extension layer (4111) is composed of the conductive layer (411) closest to the second planar portion (3122) among the conductive layers (411, 412, 413, 414, 415, 416, 417, 418) of the flexible printed circuit board (400), the extension layer (4111) may be formed relatively close to a planar shape, and accordingly, the application of stress to a part of the second planar portion (3122) may be reduced and / or limited.

[0149] However, it should be noted that the scope of the present disclosure does not exclude the extension layer (4111) extending from other conductive layers (412, 413) except for the first conductive layer (411) closest to the second planar portion (3122) among the first conductive layers (411, 412, 413).

[0150] According to one embodiment, the second part (402) may be positioned between the base part (403) and the rear of the electronic device (101).

[0151] According to one embodiment, the second part (402) may include one or more second conductive layers (416, 417, 418). The second conductive layers (416, 417, 418) included in the second part (402) may include wiring such as a power line, a ground line, and / or other signal lines, which are additionally or substantially provided with respect to the first base conductive layers (414, 415). According to one embodiment, the second part (402) may be omitted from the flexible printed circuit board (400). If the second part (402) is omitted from the flexible printed circuit board (400), wiring such as power lines, ground lines, and / or other signal lines, which are additionally or substantially provided for the first base conductive layers (414, 415), may be configured through other parts of the flexible printed circuit board (400) by avoiding the recess provided in the first part (401). As described above, in some embodiments, a recess may be formed in the second part (402), and a display driving integrated circuit (320) may be accommodated in the recess.

[0152] According to one embodiment, the flexible printed circuit board (400) may include a first solder resist layer (433) disposed on one side of the first part (401) (e.g., the side facing the +Z direction in FIG. 9), a first EMI (electromagnetic interference) shielding layer (432) disposed on one side of the first solder resist layer (433), a second solder resist layer (434) disposed on one side of the second part (402) (e.g., the direction facing the -Z direction in FIG. 9), and a second EMI shielding layer (435) disposed on one side of the second solder resist layer (434).

[0153] According to one embodiment, the first solder resist layer (433) and the first EMI shielding layer (432) can be interpreted as part of the first part (401), and the second solder resist layer (434) and the second EMI shielding layer (435) can be interpreted as part of the second part (402).

[0154] According to one embodiment, the flexible printed circuit board (400) may include an adhesive member (431) (e.g., double-sided tape). The adhesive member (431) may be placed between the first part (401) and the second planar part (3122) and may be adhered to the first part (401) and the second planar part (3122).

[0155] According to one embodiment, the recess (450) may be formed by being recessed from one side of the first part (401) facing the second planar portion (3122) (e.g., the side facing the +Z direction in FIG. 9). The recess (450) may accommodate at least a portion of the display driving integrated circuit (320).

[0156] According to one embodiment, a shielding member (451, 452, 453) may be disposed in the recess (450). The shielding member (451, 452, 453) may include a first shielding portion (451) disposed on the bottom surface of the recess (450), a second shielding portion (452) disposed on a first side of the recess (450), and a third shielding portion (453) disposed on a second side different from the first side of the recess (450). For example, the shielding member (451, 452, 453) may be provided in the form of a shielding film.

[0157] According to one embodiment, the display driving integrated circuit (320) may be surrounded by shielding members (451, 452, 453). Accordingly, interference between the conductive layers (411 to 418) of the flexible printed circuit board (400) and noise generated from the display driving integrated circuit (320) may be limited and / or reduced.

[0158] According to one embodiment, an air gap may be formed between the shielding members (451, 452, 453) and the display driving integrated circuit (320), but is not limited thereto. According to an embodiment, a non-conductive material may be filled between the shielding members (451, 452, 453) and the display driving integrated circuit (320).

[0159] Referring to FIG. 10, a process for forming the shielding members (451, 452, 453) of FIG. 9 is described.

[0160] According to one embodiment, a flexible printed circuit board (400) including a recess (450) formed between an anode (10) and a cathode (20) through a drilling process or a laser process and a coating metal (40) (e.g., a metallic material such as copper, nickel, or silver) may be disposed.

[0161] According to one embodiment, the masking (30) may be positioned so that the recess (450) of the flexible printed circuit board (400) is exposed toward the coating metal (40), while other parts of the flexible printed circuit board (400) are not exposed to the coating metal (40).

[0162] According to one embodiment, when an electric field is formed between the anode (10) and the cathode (20) in a vacuum, atoms (51) of the coating metal (40) may be emitted. In this case, some of the atoms (51) may be deposited on the bottom or side surface of the recess (450) (e.g., see reference numeral 52). In this case, the atoms (52) emitted from the coating metal (40) and deposited on the recess (450) may form a shielding member (451, 452, 453). The shielding member (451, 452, 453) may be referred to as a plating layer.

[0163] FIG. 11a is a cross-sectional view showing a flexible printed circuit board and a display panel according to one embodiment of the present disclosure.

[0164] FIG. 11b is a cross-sectional view showing a flexible printed circuit board and a display panel according to one embodiment of the present disclosure.

[0165] The embodiments of FIGS. 11a and 11b may be combined with the embodiments of FIGS. 1 to 10, or the embodiments of FIGS. 12 to 22. The configurations of the embodiments of FIGS. 11a and 11b may be partially or wholly identical to the configurations of the embodiments of FIGS. 1 to 10, or the configurations of FIGS. 12 to 22.

[0166] Referring to FIGS. 11a and 11b, a flexible printed circuit board (400) can be bonded to a second planar portion (3122) through an adhesive member (406) (e.g., the adhesive member (431) of FIG. 9).

[0167] According to one embodiment, a spacer (318) may be disposed on one side of the second planar portion (3122) (e.g., the side facing the +Z direction in FIG. 11a and FIG. 11b), and a plate (319) may be disposed on one side of the spacer (318).

[0168] According to one embodiment, the tail portion (407) of the flexible printed circuit board (400) (e.g., the tail portion (331) of FIG. 8) may include an extension layer (e.g., the extension layer (4111) of FIG. 9). The extension layer of the end portion (408) of the tail portion (407) may be electrically connected to a second planar portion (3122) through a conductive film layer (4601) (e.g., the conductive film layer (336) of FIG. 8, or the conductive film layer (460) of FIG. 9).

[0169] According to one embodiment, the conductive film layer (4601) may be disposed in the recess of the second planar portion (3122), but is not limited thereto.

[0170] According to one embodiment, as the extension layer is positioned close to the second planar portion (3122), the tail portion (407) may protrude from the lower portion of the flexible printed circuit board (400). Accordingly, the tail portion (407) may have a relatively gentle slope. For example, the angle of inclination of the tail portion (407) (e.g., ratio of width (W) to height (H)) may be 45 degrees or less with respect to the second planar portion (3122), but is not limited thereto. Accordingly, the occurrence of excessive reaction force or moment at the end (408) of the tail portion (407) connected to the second planar portion (3122) through the conductive film layer (4061) may be limited and / or reduced.

[0171] Referring to FIG. 11a, the adhesive member (406) and the flexible printed circuit board (400) may form at least a portion of a recess (450) (e.g., the recess (450) of FIG. 9) for accommodating a display driving integrated circuit (320). The width (W) of the tail portion (408) defining the angle of inclination of the tail portion (408) may be about 0.9 mm to about 1.1 mm, but is not limited thereto. For example, the width (W) of the tail portion (408) may be about 1.0 mm. The height (H) of the tail portion (408) defining the angle of inclination of the tail portion (408) may be about 0.02 mm to about 0.04 mm, but is not limited thereto. For example, the height (H) of the tail portion (408) may be about 0.03 mm.

[0172] Referring to FIG. 11b, the adhesive member (406) and the flexible printed circuit board (400) may include a notch (450a) configured to cover at least a portion of the display driving integrated circuit (320). For example, one side of the display driving integrated circuit (320) (e.g., the side facing the +X direction in FIG. 11b) may not be covered by the adhesive member (406). The width (W) of the tail portion (408) defining the angle of inclination of the tail portion (408) may be about 1.0 mm. The height (H) of the tail portion (408) defining the angle of inclination of the tail portion (408) may be about 0.16 mm to about 0.36 mm, but is not limited thereto. For example, the height (H) of the tail portion (408) may be about 0.264 mm.

[0173] FIG. 12 is a cross-sectional view of a flexible printed circuit board according to one embodiment of the present disclosure.

[0174] The embodiment of FIG. 12 may be combined with the embodiments of FIG. 1 to 11b, or the embodiments of FIG. 13 to 22. The configurations of the embodiment of FIG. 12 may be partially or wholly identical to the configurations of the embodiments of FIG. 1 to 11b, or the configurations of FIG. 13 to 22.

[0175] Referring to FIG. 12, the flexible printed circuit board (400) may include shielding members (451a, 452a, 453a). The shielding members (451a, 452a, 453a) may form at least a portion of the recess (450a), but are not limited thereto.

[0176] According to one embodiment, the flexible printed circuit board (400) may include a conductive via (441, 443) electrically connected to a first metal layer (414) of a base part (e.g., base part (403) of FIG. 9) and one or more first conductive layers (411, 412, 413).

[0177] According to one embodiment, the flexible printed circuit board (400) may include a conductive via (442, 444) electrically connected to a second metal layer (415) of a base part and one or more second conductive layers (416, 417, 418).

[0178] According to one embodiment, the shielding member (451a, 452a, 453a) may include a shielding sheet (451a) disposed on the bottom surface of the recess (450a).

[0179] According to one embodiment, the shielding member (451a, 452a, 453a) may include a first conductive ground via (452a) disposed adjacent to a first side of the recess (450a). The first conductive ground via (452a) may be electrically connected to one or more first conductive layers (441, 442, 443), a shielding sheet (451a), and a first metal layer (414).

[0180] According to one embodiment, the shielding member (451a, 452a, 453a) may include a second conductive ground via (453a) disposed adjacent to a second side other than the first side of the recess (450a). The second conductive ground via (453a) may be electrically connected to one or more first conductive layers (441, 442, 443), a shielding sheet (451a), and a first metal layer (414).

[0181] FIG. 13 is a schematic diagram illustrating the configurations of a flexible printed circuit board according to one embodiment of the present disclosure.

[0182] The embodiment of FIG. 13 may be combined with the embodiments of FIG. 1 to 12, or the embodiments of FIG. 14 to 22. The configurations of the embodiment of FIG. 13 may be partially or wholly identical to the configurations of the embodiments of FIG. 1 to 12, or the configurations of FIG. 14 to 22.

[0183] Referring to FIG. 13, a stacking diagram of a flexible printed circuit board (400) is shown.

[0184] The flexible printed circuit board (400) of FIG. 13 may illustrate other examples of the base part (403), the first part (401), and the second part (402) illustrated in the embodiment of FIG. 9. For example, FIG. 13 may illustrate a drawing of the embodiment of FIG. 9 inverted vertically. FIG. 13 illustrates conductive vias (e.g., 441, 442, 443, 452a, 453a of FIG. 12) along with at least two empty spaces (492, 493), unlike the embodiment illustrated in FIG. 9. Additionally, in the embodiment of FIG. 13, unlike the embodiment illustrated in FIG. 9, at least one copper plating layer (481) may be illustrated as forming a separate layer from the metal layers (411, 412, 413, 414, 415, 416, 417). As such, the embodiment of FIG. 13 may differ from the embodiment of FIG. 9 in some components. For the remaining components excluding those described above, the embodiment of FIG. 9 may be applied to the embodiment of FIG. 13.

[0185] According to one embodiment, an extension layer (4111) may be located in at least a portion of the first tail portion (R1, R2) of the flexible printed circuit board (400). Due to the empty space (491) of the first tail portion (R1, R2), the tail portion (R1, R2) may be thinner than the main body portion (R3, R4, R5).

[0186] According to one embodiment, the main body portion (R3, R4, R5) of the flexible printed circuit board (400) may include a recess (450).

[0187] According to one embodiment, the connector (R6, R7, R8) of the flexible printed circuit board (400) may be thinner than the main body (R3, R4, R5) due to at least two empty spaces (492, 493).

[0188] According to one embodiment, the flexible printed circuit board (400) may include conductive layers (411 to 418) comprising a metal (e.g., copper).

[0189] According to one embodiment, the flexible printed circuit board (400) may include non-conductive substrates (421 to 427) comprising a non-metal (e.g., a polyimide film).

[0190] According to one embodiment, the first metal layer (414) and the second metal layer (415) of the base part can be laminated on a non-conductive substrate (424).

[0191] According to one embodiment, the remaining conductive layers (411 to 413, 416 to 418) can each be laminated onto a non-conductive substrate (421, 422, 423, 425, 426, 427).

[0192] According to one embodiment, the flexible printed circuit board (400) may further include at least one copper plating layer (481), at least one adhesive layer (482) (e.g., insulating resin layer, PREPREG), at least one film layer (483) (e.g., polyimide (PI) film), at least one adhesive layer (484), at least one solder resist layer (485), and at least one EMI shielding layer (486).

[0193] According to one embodiment, the flexible printed circuit board (400) may include a metal layer (488) (e.g., stainless steel (STS)) located on the connector (R7, R8) and forming at least a portion of the outer surface of the connector (R7, R8). The flexible printed circuit board (400) may include an adhesive layer (487) (e.g., an adhesive layer for stainless steel) located on the connector (R7, R8) and bonded to one side of the metal layer (488). The adhesive layer (487) may be configured to fix the metal layer (488) and adjacent structures to each other, but is not limited thereto.

[0194] FIG. 14 is a cross-sectional view of a multi-foldable electronic device according to one embodiment of the present disclosure. FIG. 15 is a cross-sectional view of a multi-foldable electronic device according to one embodiment of the present disclosure.

[0195] The embodiments of FIGS. 14 and 15 may be combined with the embodiments of FIGS. 1 to 13, or the embodiments of FIGS. 16 to 22. The configurations of the embodiments of FIGS. 14 and 15 may be partially or wholly identical to the configurations of the embodiments of FIGS. 1 to 13, or the configurations of FIGS. 16 to 22.

[0196] Referring to FIGS. 14 and 15, the electronic device (101) may include a housing (201) and a display (202).

[0197] According to one embodiment, the housing (201) may include a first housing (210), a second housing (220) rotatably connected to the first housing (210), a third housing (230) rotatably connected to the first housing (210), a first hinge (270) positioned and connected between the first housing (210) and the second housing (220), and a second hinge (280) positioned and connected between the first housing (210) and the third housing (230).

[0198] According to one embodiment, the display (202) may include a first display area (202a) disposed in a first housing (210), a second display area (202b, 312) disposed in a second housing (220), a third display area (202c) disposed in a third housing (230), a first folding area (202d) disposed corresponding to a first hinge (270), and a second folding area (202e) disposed corresponding to a second hinge (280).

[0199] According to one embodiment, a first planar portion (3121) of the display (202) can be visually exposed through the front of the electronic device (101).

[0200] According to one embodiment, the second planar portion (3122) extends from the bending portion (3123) and can be positioned below the first planar portion (3121).

[0201] According to one embodiment, the flexible printed circuit board (600) may be physically and / or electrically connected to a second planar portion (3122). The flexible printed circuit board (600) may include a recess (650) for accommodating a display driving integrated circuit (320).

[0202] According to one embodiment, the flexible printed circuit board (600) may include an extension layer (6111) that extends outward from other conductive layers. The extension layer (6111) may be electrically connected to a second planar portion (3122) through a conductive film layer (660).

[0203] According to one embodiment, the display driving integrated circuit (320) and the second planar portion (3122) can be accommodated within the second housing (220).

[0204] Referring to FIG. 14, the printed circuit board (700) may include an application processor (e.g., the processor (120) of FIG. 1) and may be placed within a second housing (220).

[0205] According to one embodiment, the flexible printed circuit board (600) may include a connector (638) (e.g., connector (337) of FIG. 8), and the connector (638) may be physically and / or electrically connected to the printed circuit board (700) within the second housing (220).

[0206] Referring to FIG. 15, the printed circuit board (700a) may include an application processor (e.g., the processor (120) of FIG. 1) and may be placed within a third housing (230).

[0207] According to one embodiment, the flexible printed circuit board (600) may be arranged to span across the second housing (220), the first hinge (270), the first housing (210), the second hinge (280), and the third housing (230).

[0208] According to one embodiment, the flexible printed circuit board (600) may include a connector (638a) (e.g., connector (337) of FIG. 8), and the connector (638) may be physically and / or electrically connected to the printed circuit board (700a) within the third housing (230).

[0209] FIG. 16 is a drawing illustrating an unfolded state of an electronic device according to one embodiment of the present disclosure. FIG. 17 is a drawing illustrating a folded state of an electronic device according to one embodiment of the present disclosure.

[0210] The embodiments of FIGS. 16 and 17 may be combined with the embodiments of FIGS. 1 to 15, or the embodiments of FIGS. 18 to 22. The configurations of the embodiments of FIGS. 16 and 17 may be partially or wholly identical to the configurations of the embodiments of FIGS. 1 to 15, or the configurations of FIGS. 18 to 22.

[0211] Referring to FIGS. 16 and 17, an electronic device (1101) may include a housing (1202) for accommodating a component of the electronic device (1101) (e.g., a hinge structure (1280) of FIG. 18) and a flexible display (hereinafter, display (1230)) disposed within the space formed by the housing (1202). According to one embodiment, the housing (1202) may be referred to as a foldable housing. According to one embodiment, the display (1230) may be referred to as a foldable display.

[0212] According to one embodiment, the housing (1202) may include a first housing (1210) and a second housing (1220) configured to rotate relative to the first housing (1210).

[0213] According to one embodiment, the first housing (1210) and / or the second housing (1220) may form at least a portion of the exterior of the electronic device (1101). According to one embodiment, the side where the display (1230) is visually exposed is defined as the front of the electronic device (1101) and / or the housing (1202) (e.g., a first front (1210a) and a second front (1220a)). The side opposite to the front is defined as the rear of the electronic device (1101) (e.g., a first rear (1210b) and a second rear (1220b)). The side surrounding at least a portion of the space between the front and the rear is defined as the side of the electronic device (1101) (e.g., a first side (1210c) and a second side (1220c)).

[0214] According to one embodiment, the first housing (1210) may be rotatably connected to the second housing (1220) using a hinge structure (e.g., the hinge structure (1280) of FIG. 18). For example, the first housing (1210) and the second housing (1220) may each be rotatably connected to the hinge structure (1280). Accordingly, the electronic device (1101) may be varied to a folded state (e.g., FIG. 17) or an unfolded state (e.g., FIG. 16). In the folded state, the first front (1210a) of the electronic device (1101) may face the second front (1220a), and in the unfolded state, the direction in which the first front (1210a) faces may be substantially the same as the direction in which the second front (1220a) faces. For example, in the unfolded state, the first front surface (1210a) may be located on substantially the same plane as the second front surface (1220a). According to one embodiment, the second housing (1220) may provide relative movement with respect to the first housing (1210).

[0215] According to one embodiment, the first housing (1210) and the second housing (1220) are positioned on both sides of a folding axis (A) and may have a shape that is symmetrical with respect to the folding axis (A). The angle between the first housing (1210) and the second housing (1220) may be changed depending on whether the state of the electronic device (1101) is unfolded, folded, or an intermediate state between the unfolded state and the folded state.

[0216] According to one embodiment, the electronic device (1101) may include a hinge cover (1240). At least a portion of the hinge cover (1240) may be positioned between the first housing (1210) and the second housing (1220). According to one embodiment, the hinge cover (1240) may be covered by a portion of the first housing (1210) and the second housing (1220) or visually exposed to the outside of the electronic device (1101), depending on the state of the electronic device (1101). According to one embodiment, the hinge cover (1240) may protect the hinge structure (e.g., the hinge structure (1280) of FIG. 18) from external impacts of the electronic device (1101). According to one embodiment, the hinge cover (1240) may be interpreted as a hinge housing for protecting the hinge structure (e.g., the hinge structure (1280) of FIG. 18).

[0217] According to one embodiment, as shown in FIG. 16, when the electronic device (1101) is in an unfolded state, the hinge cover (1240) may be covered by the first housing (1210) and the second housing (1220) and not exposed. As another example, as shown in FIG. 17, when the electronic device (1101) is in a folded state (e.g., a fully folded state), the hinge cover (1240) may be visually exposed to the outside between the first housing (1210) and the second housing (1220). As yet another example, when the first housing (1210) and the second housing (1220) are in an intermediate state with a certain angle, the hinge cover (1240) may be partially visually exposed to the outside between the first housing (1210) and the second housing (1220). However, in this case, the exposed area may be smaller than when completely folded. In one embodiment, the hinge cover (1240) may include a curved surface.

[0218] According to one embodiment, the display (1230) can visually provide information to an external (e.g., user) of the electronic device (1101). The display (1230) may include, for example, a holographic device or a projector and a control circuit for controlling said device. According to one embodiment, the display (1230) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0219] According to one embodiment, the display (1230) may mean a display in which at least some area can be deformed into a flat or curved surface. For example, the display (1230) may be formed to be variable in response to the relative movement of the second housing (1220) with respect to the first housing (1210). According to one embodiment, the display (1230) may include a folding area (1233), a first display area (1231) positioned on one side (e.g., the +Y direction of FIG. 18) with respect to the folding area (1233), and a second display area (1232) positioned on the other side (e.g., the -Y direction of FIG. 18). According to one embodiment, the folding area (1233) may be positioned on a hinge structure (e.g., the hinge structure (1280) of FIG. 18). For example, at least a portion of the folding area (1233) may face the hinge structure (1280). According to one embodiment, the first display area (1231) may be placed on the first housing (1210), and the second display area (1232) may be placed on the second housing (1220). According to one embodiment, the display (1230) may be accommodated in the first housing (1210) and the second housing (1220).

[0220] However, the area division of the display (1230) shown in FIG. 16 above is exemplary, and the display (1230) may be divided into multiple areas (e.g., four or more or two) depending on the structure or function.

[0221] Additionally, in the embodiment illustrated in FIG. 16, the area of ​​the display (1230) may be divided by a folding area (1233) extending parallel to the X-axis (e.g., the X-axis of FIG. 18) or a folding axis (A-axis), but in other embodiments, the area of ​​the display (1230) may be divided based on a different folding area (e.g., a folding area parallel to the Y-axis of FIG. 18) or a different folding axis (e.g., a folding axis parallel to the Y-axis of FIG. 18). According to one embodiment, the display (1230) may be combined with or placed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of the touch, and / or a digitizer configured to detect a magnetic field type stylus pen.

[0222] According to one embodiment, the electronic device (1101) may include a rear display (1234). The rear display (1234) may be positioned to face in a different direction from the display (1230). For example, the display (1230) may be visually exposed through the front of the electronic device (1101) (e.g., a first front (1210a) and / or a second front (1220a)), and the rear display (1234) may be visually exposed through the rear of the electronic device (1101) (e.g., a first rear (1210b)).

[0223] According to one embodiment, the electronic device (1101) may include at least one camera module (1204, 1206) and a flash (1208). According to one embodiment, the electronic device (1101) may include a front camera module (1204) exposed through the front (e.g., a first front (1210a)) and / or a rear camera module (1206) exposed through the rear (e.g., a first rear (1210b)). The camera module (1204, 1206) may include one or more lenses, an image sensor, a flash, and / or an image signal processor. The flash (1208) may include a light-emitting diode or a xenon lamp. According to one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device (1101). The configuration of the front camera module (1204) and / or the rear camera module (1206) may be partially or entirely the same as the configuration of the camera module (180) of FIG. 1.

[0224] FIG. 18 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0225] The embodiment of FIG. 18 may be combined with the embodiments of FIG. 1 to 17, or with the embodiments of FIG. 19 and 22. The configurations of the embodiment of FIG. 18 may be partially or entirely identical to the configurations of the embodiments of FIG. 1 to 17, or the configurations of the embodiments of FIG. 19 and 22.

[0226] Referring to FIG. 18, the electronic device (1101) may include a first housing (1210), a second housing (1220), a display (1230), a hinge cover (1240), a battery (1250), a printed circuit board (1260), a flexible circuit board (1270), and a hinge structure (1280). The configuration of the first housing (1210), the second housing (1220), the display (1230), and the hinge cover (1240) of FIG. 18 may be all or partly the same as the configuration of the first housing (1210), the second housing (1220), the display (1230), and the hinge cover (1240) of FIG. 16 and / or FIG. 17.

[0227] According to one embodiment, the electronic device (1101) may include a support member. For example, the electronic device (1101) may include a first support member (1212) and a second support member (1222). For example, a first housing (1210) may include the first support member (1212), and a second housing (1220) may include the second support member (1222). According to one embodiment, the first support member (1212) and / or the second support member (1222) may support components of the electronic device (1101) (e.g., a display (1230), a battery (1250), and a printed circuit board (1260)). According to one embodiment, the first support member (1212) may be named the first bracket (1212), and the second support member (1222) may be named the second bracket (1222).

[0228] According to one embodiment, the first support member (1212) and / or the second support member (1222) may be formed of a metal material and / or a non-metal (e.g., polymer) material. According to one embodiment, the first support member (1212) may be positioned between the display (1230) and the battery (1250). For example, the display (1230) may be attached to one side of the first support member (1212), and the battery (1250) and the printed circuit board (1260) may be positioned on the other side.

[0229] According to one embodiment, the electronic device (1101) may include a first protective member (1214) and a second protective member (1224). For example, a first housing (1210) may include the first protective member (1214), and a second housing (1220) may include the second protective member (1224). According to one embodiment, the protective members (1214, 1224) may protect the display (1230) from external impact. For example, the first protective member (1214) may surround at least a portion of the display (1230) (e.g., the first display area (1231) of FIG. 16), and the second protective member (1224) may surround at least a portion of the other portion of the display (1230) (e.g., the second display area (1232) of FIG. 16). According to one embodiment, the first protective member (1214) may be referred to as the first cover member, and the second protective member (1214) may be referred to as the second cover member.

[0230] According to one embodiment, the housing (1210, 1220) may include a first rear plate (1216) and a second rear plate (1226). For example, the first housing (1210) may include a first rear plate (1216) connected to a first support member (1212), and the second housing (1220) may include a second rear plate (1226) connected to a second support member (1222). According to one embodiment, the rear plates (1216, 1226) may form part of the exterior of the electronic device (1101). For example, the first rear plate (1216) may form a first rear (e.g., the first rear (1210b) of FIGS. 16 to 17), and the second rear plate (1226) may form a second rear (e.g., the second rear (1220b) of FIGS. 16 to 17). According to one embodiment, a first battery (1252) and a first printed circuit board (1262) may be disposed between a first support member (1212) and a first rear plate (1216), and a second battery (1254) and a second printed circuit board (1264) may be disposed between a second support member (1222) and a second rear plate (1226).

[0231] According to one embodiment, the hinge cover (1240) may accommodate at least a portion of the hinge structure (1280). For example, the hinge cover (1240) may include a receiving groove (1242) for accommodating the hinge structure (1280). According to one embodiment, the hinge cover (1240) may be coupled to the hinge structure (1280). According to one embodiment, when the electronic device (1101) is unfolded, at least a portion of the hinge cover (1240) may be located between the hinge structure (1280) and the housing (1210, 1220).

[0232] According to one embodiment, the battery (1250) is a device for supplying power to at least one component of the electronic device (1101) and may include a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. The battery (1250) may be integrally disposed inside the electronic device (1101) or may be detachably disposed from the electronic device (1101). According to one embodiment, the battery (1250) may include a first battery (1252) disposed within a first housing (1210) and a second battery (1254) disposed within a second housing (1220). For example, the first battery (1252) may be disposed on a first support member (1212), and the second battery (1254) may be disposed on a second support member (1222).

[0233] According to one embodiment, the printed circuit board (1260) may be equipped with a processor (e.g., processor (120) of FIG. 1), memory (e.g., memory (130) of FIG. 1), and / or an interface (e.g., interface (177) of FIG. 1). According to one embodiment, the printed circuit board (1260) may include a first printed circuit board (1262) disposed within a first housing (1210) and a second printed circuit board (1264) disposed within a second housing (1220).

[0234] According to one embodiment, a flexible circuit board (1270) can electrically connect a component located in a first housing (1210) (e.g., a first printed circuit board (1262)) and a component located in a second housing (1220) (e.g., a second printed circuit board (1264)). According to one embodiment, the flexible circuit board (1270) may be a flexible printed circuit board (FPCB). According to one embodiment, at least a portion of the flexible circuit board (1270) may cross a hinge cover (1240) and / or a hinge structure (1280). For example, a portion of the flexible circuit board (1270) may be placed within the first housing (1210), and another portion may be placed within the second housing (1220). According to one embodiment, the flexible circuit board (1270) may be connected to an antenna or to a display (1230). According to one embodiment, the flexible circuit board (1270) may be configured so that at least a portion is bendable.

[0235] According to one embodiment, the hinge structure (1280) may be connected to the first housing (1210) and the second housing (1220). According to one embodiment, the first housing (1210) may rotate relative to the second housing (1220) using the hinge structure (1280). According to one embodiment, the hinge structure (1280) may rotatably connect the first housing (1210) and the second housing (1220) from a folded state (e.g., FIG. 17) to an unfolded state (e.g., FIG. 16).

[0236] According to one embodiment, the hinge structure (1280) may include a plurality of hinge structures (1280-1, 1280-2) arranged in parallel. For example, the hinge structure (1280) may include a first hinge structure (1280-1) and a second hinge structure (1280-2) spaced apart from the first hinge structure (1280-1). According to one embodiment, the first hinge structure (1280-1) may be symmetric with respect to the second hinge structure (1280-2) and the longitudinal direction (e.g., Y-axis direction) of the electronic device (1101).

[0237] FIG. 19 is a plan view of a display panel according to one embodiment of the present disclosure. FIG. 22 is a cross-sectional view taken along the line BB' of FIG. 19 according to one embodiment of the present disclosure.

[0238] The embodiments of FIGS. 19 and 22 can be combined with the embodiments of FIGS. 1 to 18. The configurations of the embodiments of FIGS. 19 and 22 may be partially or entirely identical to the configurations of the embodiments of FIGS. 1 to 18.

[0239] Referring to FIG. 19, a display panel (1300) (e.g., a part layer of the display (1230) of FIG. 18) may include a first display area (1311) (e.g., the first display area (1231) of FIG. 18), a second display area (1312) (e.g., the second display area (1232) of FIG. 18), and a folding area (1313) (e.g., the folding area (1233) of FIG. 18).

[0240] According to one embodiment, the second region (1312) may include a first planar portion (13121), a second planar portion (13122), and a bending portion (13123).

[0241] According to one embodiment, a first part (1401) of a flexible printed circuit board (1400) may be placed on a second planar portion (13122) of a display panel (1312).

[0242] According to one embodiment, the electronic device may include a spacer (1318). The spacer (1318) may be positioned between a first planar portion (13121) and a second planar portion (13122). The spacer (1318) may be wrapped at least partially by the first planar portion (13121), the second planar portion (13122), and the bending portion (13123).

[0243] According to one embodiment, the flexible printed circuit board (1400) may include a plurality of conductive layers (1411 to 1418). Each of the plurality of conductive layers (1411 to 1418) may include copper, but is not limited thereto.

[0244] According to one embodiment, the base part (1403) may include a non-conductive substrate (1424) (e.g., a polyimide film) and at least one first base conductive layer (1414, 1415). The base part (1403) may be configured to provide ground to other conductive layers of the flexible printed circuit board (1400) or to provide power provided from a battery to other conductive layers of the flexible printed circuit board (1400), but is not limited thereto.

[0245] According to one embodiment, at least one first base conductive layer (1414, 1415) may include a first metal layer (1414) disposed on one side of a non-conductive substrate (1424) and a second metal layer (1415) disposed on the other side of the non-conductive substrate (1424).

[0246] According to one embodiment, the first part (1401) may be positioned between the base part (1403) and the second planar part (13122).

[0247] According to one embodiment, the first part (1401) may include one or more first conductive layers (1411, 1412, 1413).

[0248] According to one embodiment, the flexible printed circuit board (1400) may include an extension layer (14111) (e.g., a conductive layer). The extension layer (14111) may be formed by protruding from any one of the conductive layers (1411, 1412, 1413, 1414, 1415, 1416, 1417, 1418) of the flexible printed circuit board (1400).

[0249] According to one embodiment, the extension layer (14111) may be formed by protruding from any one of the conductive layers (1411, 1412, 1413, 1414) disposed between the non-conductive substrate (1424) and the second planar portion (13122).

[0250] According to one embodiment, the first part (1401) may include an extension layer (14111) extending from the first conductive layer (1411). The extension layer (14111) may extend along the second planar portion (13122) and may be electrically connected to the end of the second planar portion (13122) through a conductive film layer (1460) (e.g., the conductive film layer (336) of FIG. 8 and the conductive film layer (460) of FIG. 9). The extension layer (14111) may also extend so as to protrude over the remaining first conductive layers (1412, 1413). A portion protruding from the remaining first conductive layers (1412, 1413) (e.g., extension layer (14111)) may also extend along the second planar portion (13122) and may be electrically connected to the end of the second planar portion (13122) through a conductive film layer (1460) (e.g., conductive film layer (336) of FIG. 8 and conductive film layer (460) of FIG. 9).

[0251] According to one embodiment, the first part (1401) may include a non-conductive extension layer (14221) (e.g., a polyimide film) laminated on one side of an extension layer (14111) (e.g., a first conductive layer (1411)).

[0252] According to one embodiment, the extension layer (14111) may be the first conductive layer (1411) closest to the second planar portion (13122) among the first conductive layers (1411, 1412, 1413), but is not limited thereto. According to one embodiment, as the extension layer (14111) is composed of the conductive layer (1411) closest to the second planar portion (13122) among the conductive layers (1411 to 1418) of the flexible printed circuit board (1400), the extension layer (14111) may be formed relatively close to a planar shape, and accordingly, the application of stress to a part of the second planar portion (13122) may be reduced and / or limited.

[0253] According to one embodiment, the second part (1402) may be positioned between the base part (1403) and the rear of the electronic device.

[0254] According to one embodiment, the second part (1402) may include one or more second conductive layers (1416, 1417, 1418). Although not illustrated, a recess or opening may be formed in the second part (1402), and a display driving integrated circuit may be accommodated in the recess or opening.

[0255] According to one embodiment, a flexible printed circuit board (1400) may include a first solder resist layer (1433) disposed on one side of a first part (1401) (e.g., the side facing the +Z direction of FIG. 20), a first EMI (electromagnetic interference) shielding layer (1432) disposed on one side of the first solder resist layer (1433), a second solder resist layer (1434) disposed on one side of a second part (1402) (e.g., the side facing the -Z direction of FIG. 20), and a second EMI shielding layer (1435) disposed on one side of the second solder resist layer (1434).

[0256] According to one embodiment, the first solder resist layer (1433) and the first EMI shielding layer (1432) can be interpreted as part of the first part (1401), and the second solder resist layer (1434) and the second EMI shielding layer (1435) can be interpreted as part of the second part (1402).

[0257] According to one embodiment, the flexible printed circuit board (1400) may include an adhesive member (1431) (e.g., double-sided tape). The adhesive member (1431) may be placed between the first part (1401) and the second planar part (13122) and may be adhered to the first part (1401) and the second planar part (13122).

[0258] According to one embodiment, the recess (1450) may be formed by being recessed from one side of the first part (1401) facing the second planar portion (13122) (e.g., the side facing the +Z direction in FIG. 20). The recess (1450) may accommodate at least a portion of the display driving integrated circuit (1320).

[0259] According to one embodiment, a shielding member (1451, 1452, 1453) may be disposed in the recess (1450). The shielding member (1451, 1452, 1453) may include a first shielding portion (1451) disposed on the bottom surface of the recess (1450), a second shielding portion (1452) disposed on a first side of the recess (1450), and a third shielding portion (1453) disposed on a second side of the recess (1450) different from the first side.

[0260] According to one embodiment, the display driving integrated circuit (1320) may be surrounded by shielding members (1451, 1452, 1453). Accordingly, interference by noise generated from the display driving integrated circuit (1320) on the conductive layers (1411 to 1418) of the flexible printed circuit board (1400) may be limited and / or reduced.

[0261] According to one embodiment, an air gap may be formed between the shielding members (1451, 1452, 1453) and the display driving integrated circuit (1320), but is not limited thereto. According to an embodiment, a non-conductive material may be filled between the shielding members (1451, 1452, 1453) and the display driving integrated circuit (1320).

[0262] According to one embodiment, the conductive film layer (1460) (e.g., the conductive film layer (336) of FIG. 8) may be elongated or formed along the folding axis (e.g., the folding axis (A) of FIG. 16) and may be parallel to the folding axis, but is not limited thereto.

[0263] According to one embodiment, the display driving integrated circuit (1320) may be elongated so as to be parallel to the folding axis (e.g., folding axis (A) of FIG. 16), but is not limited thereto.

[0264] FIG. 21 is a plan view illustrating the interior of an electronic device according to one embodiment of the present disclosure. FIG. 22 is a cross-sectional view taken along the lines C-C' and D-D' of FIG. 21 according to one embodiment of the present disclosure.

[0265] The embodiments of FIGS. 21 and 22 can be combined with the embodiments of FIGS. 1 to 20. The configurations of the embodiments of FIGS. 21 and 22 may be partially or wholly identical to the configurations of the embodiments of FIGS. 1 to 20.

[0266] FIG. 21 is in a state where the display (e.g., the display (202) of FIG. 2) is not shown. According to one embodiment, the electronic devices (1501, 1601) may all include a housing (1510, 1601). Here, the electronic devices (1501, 1601) may have at least some of the same configuration as the foldable electronic devices described above (e.g., the electronic device (101) of FIG. 1 to 15, the electronic device (1101) of FIG. 16 to 20). For example, the electronic device (1501, 1601) may be the same as the housing (201) of the multi-foldable electronic device of FIG. 1 to 15, or the same as the housing (1202) of the foldable electronic device of FIG. 16 to 20, as the housing (1510, 1610). In FIG. 21, the appearance of a part of a housing (1510, 1610) (e.g., a first housing) may be shown as a part of the housing (201) of the electronic device of FIG. 1 to 15 which is multi-foldable or the housing (1202) of the electronic device of FIG. 16 to 20 which is foldable.

[0267] Referring to FIG. 21, the electronic device (1501, 1601) may include various components (e.g., a camera module (1508, 1608), a battery (1503, 1603), and a printed circuit board (1504, 1604). The various components (e.g., a camera module (1508, 1608), a battery (1503, 1603), and / or a printed circuit board (1504, 1604)) may be supported by a support member (1502, 1602) and placed in the internal space of the electronic device (1501, 1601).

[0268] In the left drawing of FIG. 21, a printed circuit board (1504) within an electronic device (1501) may be positioned relatively upper and relatively lower along the longitudinal direction (Y-axis direction) of the electronic device when viewed from above in relation to the battery (1503). The electronic device (1501) in the left drawing of FIG. 21 may be named a 'half-type PCB' due to the arrangement structure of the printed circuit board (1504).

[0269] The right-hand drawing of FIG. 21 illustrates that the printed circuit board (1604) and the battery (1603) within the electronic device (1601) are each extended along the length direction (Y-axis direction) of the electronic device and have a relatively narrow length along the width direction (X-axis direction) when viewed from above. The structure for limiting and / or reducing stress at the connection point between the display panel and the flexible printed circuit board, previously mentioned in the embodiments of FIG. 1 through 20, is applied to the electronic device (1601) of FIG. 21. The electronic device (1601) of FIG. 21 may be named an 'I-type PCB' due to the arrangement structure of the printed circuit board (1604).

[0270] According to the electronic device (1601) in the right drawing of FIG. 21, compared to the electronic device (1501) shown in the left drawing of FIG. 21, a printed circuit board is not placed above the battery, so a battery placement space can be secured in the longitudinal direction (Y-axis direction) of the electronic device (1601), and thus the battery capacity can be increased.

[0271] Referring to FIG. 22, an electronic device (e.g., the electronic device (1501, 1601) of FIG. 21) may include a display panel (1512, 1612) (e.g., the display panel (312) of FIG. 7 to 15, the display panel (1312) of FIG. 16 to 20). A support member (1502, 1602) may be disposed between the display panel (1512, 1612) and the battery (1503, 1603).

[0272] Referring to FIG. 22, a display panel (1512, 1612) of an electronic device (e.g., the electronic device (1501, 1601) of FIG. 21) may include a first planar portion that can be visually seen through the front of the electronic device (e.g., the first planar portion (3121) of FIG. 7 to 15, the first planar portion (13121) of FIG. 16 to 20). The first planar portion may be defined as an active area. According to one embodiment, the display panel (1512, 1612) may include a bending portion (e.g., the bending portion (3123) of FIG. 7 to 15, the bending portion (13123) of FIG. 16 to 20) that extends from the first planar portion and is at least partially bent. According to one embodiment, the display panel (1512, 1612) may include a second planar portion extending from a bending portion (e.g., the second planar portion (3122) of FIGS. 7 to 15, the second planar portion (13122) of FIGS. 16 to 20). The second planar portion may be positioned substantially parallel to the first planar portion, but is not limited thereto. According to one embodiment, the electronic device (1501) illustrated in the left side of FIG. 21 may, with reference to the CC' cross section of FIG. 22, have a support member (1502) positioned between the second planar portion and the battery (1503) and extend substantially parallel to the first planar portion of the display panel. In contrast, according to one embodiment, the electronic device (1601) illustrated in the right drawing of FIG. 22 may have a structure in which, with reference to the DD' cross-section of FIG. 22, the support member (1602) extends substantially parallel to the first planar portion of the display panel while positioned between the second planar portion and the battery (1603), and a portion of it is bent toward the first planar portion of the display panel.The electronic device (1601) illustrated in the right-hand drawing of FIG. 22 has the advantage of being able to secure a larger capacity of the battery (1603) along the height direction of the electronic device (1601) (e.g., the Z-axis direction of FIG. 21), as illustrated in the DD' cross-section of FIG. 22.

[0273] According to one embodiment, the electronic device may include a display driver integrated circuit (1550, 1650) (DDI). According to one embodiment, the display driver integrated circuit (1550, 1650) may be disposed on or mounted on a second planar portion.

[0274] According to one embodiment, with reference to the left side of FIG. 21 and the cross-section C-C' of FIG. 22 together, the electronic device (1501) may include a flexible printed circuit board (1540) for connecting a display driving integrated circuit (1550) to a printed circuit board (1504) of the electronic device (1501). Through the flexible printed circuit board (1540), the application processor of the printed circuit board (1504) (e.g., processor (120) of FIG. 1) may be electrically connected. According to one embodiment, the flexible printed circuit board (1540) may be electrically connected through a conductive film layer (1536) (e.g., anisotropic conductive film (ACF)) on one side of a second planar portion of a display panel on which the display driving integrated circuit (1550) is placed.

[0275] According to one embodiment, with reference to the left side of FIG. 21 and the cross-section C-C' of FIG. 22 together, the electronic device (1501) may further include a support plate (1570) for supporting a flexible printed circuit board (1504) and may further include an adhesive member (1531) disposed between the flexible printed circuit board (1540) and the support plate (1570). According to one embodiment, the support plate (1570) may extend between a first planar portion and a second planar portion of a display panel (1512), and a portion of the support plate (1570) may be configured to support the second planar portion of the display panel (1512) through a spacer (1560).

[0276] According to one embodiment, with reference to the right side of FIG. 21 and the D-D' section of FIG. 22 together, the electronic device (1601) may include a flexible printed circuit board (1640) for connecting a display driving integrated circuit (1650) to a printed circuit board (1604) of the electronic device (1601). Through the flexible printed circuit board (1640), the application processor of the printed circuit board (1604) (e.g., the processor (120) of FIG. 1) may be electrically connected. In the D-D' section of FIG. 22, the electrical and / or physical connection relationship between the flexible printed circuit board (1640) and the printed circuit board (1604) may be omitted.

[0277] According to one embodiment, with reference to the right side of FIG. 21 and the D-D' cross-section of FIG. 22 together, the electronic device (1601) may further include a support plate (1670) for supporting a flexible printed circuit board (1604) and may further include an adhesive member (1631) disposed between the flexible printed circuit board (1604) and the support plate (1670). According to one embodiment, the support plate (1670) may extend between a first planar portion and a second planar portion of a display panel (1612), and a portion of the support plate (1670) may be configured to support the second planar portion of the display panel (1612) through a spacer (1660).

[0278] According to one embodiment, with reference to the right side of FIG. 21 and the D-D' cross-section of FIG. 22 together, the electronic device (1601) may have a display driving integrated circuit (1650) disposed on one side of the support plate (1670) rather than on a second planar portion of the display panel (1612). According to one embodiment, a flexible printed circuit board (1640) may be electrically connected to one side of the support plate (1670) on which the display driving integrated circuit (1650) is disposed through a conductive film layer (1636) (e.g., anisotropic conductive film (ACF)). According to one embodiment, another adhesive member (1632) is provided between the flexible printed circuit board (1640) and the support member (1602) so that the flexible printed circuit board (1640) can be positioned more stably and the stress on the portion where the display panel (1612) and the flexible printed circuit board (1640) are connected can be limited and / or reduced.

[0279] According to one embodiment, the flexible printed circuit board (1640), which is referenced together with the right side of FIG. 21 and the D-D' cross-section of FIG. 22, may be compliant with the flexible printed circuit board (330) of FIG. 8, the flexible printed circuit board (400) according to the embodiments of FIG. 9 to 13, the flexible printed circuit board (600) according to the embodiments of FIG. 14 and 15, and the flexible printed circuit board (1400) according to the embodiments of FIG. 19 and 20.

[0280] According to one embodiment of the present disclosure, an electronic device including a display capable of limiting and / or reducing stress on a portion where a display panel and a flexible printed circuit board are connected may be provided.

[0281] However, the problems to be solved in this disclosure are not limited to those mentioned above, and may be expanded in various ways without departing from the spirit and scope of this disclosure.

[0282] According to one embodiment of the present disclosure, an electronic device including a display capable of improving connectivity between a display panel and a flexible printed circuit board while securing space for accommodating components of the electronic device may be provided.

[0283] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs from the description below.

[0284] According to one embodiment of the present disclosure, an electronic device (101) may include a housing (201) that forms at least a part of the exterior of the electronic device (101).

[0285] According to one embodiment, the electronic device (101) may further include a display panel (312) disposed on the housing (201), comprising a first planar portion (3121) visible through the front of the electronic device (101), a bending portion (3123) extending from the first planar portion (3121) and at least partially bent, and a second planar portion (3122) extending from the bending portion (3123) and disposed below the first planar portion (3121).

[0286] According to one embodiment, the electronic device (101) may include a display driving integrated circuit (320) disposed on one side of the second planar portion (3122) facing the rear of the electronic device (101).

[0287] According to one embodiment, the electronic device (101) may include a flexible printed circuit board (400) that is electrically connected to the second planar portion (3122) and arranged to cover the display driving integrated circuit (320).

[0288] According to one embodiment, the flexible printed circuit board (400) may include a base part (403) comprising at least one base conductive layer (414, 415).

[0289] According to one embodiment, the flexible printed circuit board (400) may include a first part (401) positioned between the base part (403) and the second planar part (3122) and comprising one or more first conductive layers (411, 412, 413).

[0290] According to one embodiment, among the one or more first conductive layers (411, 412, 413) of the first part (401), the extension layer (411, 4111) is extended to protrude along the second planar portion (3122) relative to the remaining first conductive layers (412, 413) of the first part (401) and can be electrically connected to the second planar portion (3122).

[0291] According to one embodiment, the flexible printed circuit board (400) may further include a recess (450) recessed from one side of the first part (401) connected to the second planar portion (3122).

[0292] According to one embodiment, the display driving integrated circuit (320) can be accommodated at least partially in the recess (450).

[0293] According to one embodiment, the flexible printed circuit board (400) may include a second part (402) positioned between the base part (403) and the rear surface of the electronic device (101) and comprising one or more second conductive layers (416, 417, 418).

[0294] According to one embodiment, the flexible printed circuit board (400) may further include shielding members (451, 452, 453) disposed on the side or bottom surface of the recess (450) and disposed to surround the display driving integrated circuit (320).

[0295] According to one embodiment, the shielding member (451, 452, 453) may include a plating layer.

[0296] According to one embodiment, an air gap may be formed between the shielding members (451, 452, 453) and the display driving integrated circuit (320).

[0297] According to one embodiment, the shielding member (451a, 452a, 453a) may include a shielding sheet (451a) disposed on the bottom surface of the recess (450).

[0298] According to one embodiment, the shielding member (451a, 452a, 453a) may include a conductive via (452a, 453a) disposed on the side of the recess (450) and electrically connected to one or more first conductive layers (411, 412, 413) of the first part (401).

[0299] According to one embodiment, the conductive vias (452a, 453a) may include a first conductive ground via (452a) disposed adjacent to a first side of the recess (450) and electrically connected to one or more first conductive layers (411, 412, 413) of the first part (401).

[0300] According to one embodiment, the conductive vias (452a, 453a) may include a second conductive ground via (453a) disposed adjacent to a second side of the recess (450) and electrically connected to one or more first conductive layers (411, 412, 413) of the first part (401).

[0301] According to one embodiment, the extension layer (4111) may be the first conductive layer (411) closest to the second planar portion (3122) among the one or more first conductive layers (411, 412, 413).

[0302] According to one embodiment, the electronic device (101) may further include a conductive film layer (460) disposed between the extension layer (4111) and the second planar portion (3122) and connected to the extension layer (4111) and the second planar portion (3122).

[0303] According to one embodiment, the electronic device (101) may further include an adhesive member (406) disposed between the flexible printed circuit board (400) and the second planar portion (3122) and bonded to the flexible printed circuit board (400) and the second planar portion (3122).

[0304] According to one embodiment, the thickness of the conductive film layer (4601) may be thinner than the thickness of the adhesive member (406).

[0305] According to one embodiment, the electronic device (101) may further include a battery (203) housed in the housing (201) and positioned so as not to overlap with the flexible printed circuit board (400) in a first direction toward the second flat portion (3122) from the first flat portion (3121).

[0306] According to one embodiment, the base part (403) may further include a non-conductive substrate (424).

[0307] According to one embodiment, the one or more first base conductive layers (414, 415) of the base part (403) may include a first metal layer (414) comprising a metal material disposed on one surface of the non-conductive substrate (424).

[0308] According to one embodiment, the one or more first base conductive layers (414, 415) of the base part (403) may include a second metal layer (415) comprising a metal material disposed on the other side of the non-conductive substrate (424).

[0309] According to one embodiment, the housing (1202) may include a first housing portion (1210) and a second housing portion (1220) rotatably connected to the first housing portion (1210).

[0310] According to one embodiment, the display panel (1230) may be disposed in the first housing portion (1210) and the second housing portion (1220) and configured to be at least partially folded or unfolded with respect to a folding axis.

[0311] According to one embodiment, a portion of the extension layer (411, 4111) connected to the second planar portion (3122) may be parallel to the folding axis.

[0312] According to one embodiment, the housing (201) may include a first housing (210), a second housing (220) rotatably connected to the first housing (210), a third housing (230) rotatably connected to the first housing (210), a first hinge (270) disposed between the first housing (210) and the second housing (220), and a second hinge (280) disposed between the second housing (220) and the third housing (230).

[0313] According to one embodiment, the first planar portion of the display (202) may be placed over the first housing (210), the second housing (220), the third housing (230), the first hinge (270), and the second hinge (280).

[0314] According to one embodiment, the second planar portion of the display (202), the display driving integrated circuit (320), and the flexible printed circuit board (400, 600) can be accommodated in the second housing (220).

[0315] According to one embodiment, the electronic device (101) may further include a printed circuit board (700) that is housed in the second housing (220) and includes an application processor (120).

[0316] According to one embodiment, the flexible printed circuit board (400, 600) can be connected to the printed circuit board (700) within the second housing (220).

[0317] According to one embodiment, the electronic device (101) may further include a printed circuit board (700a) that is housed in the third housing (230) and includes an application processor (120).

[0318] According to one embodiment, the flexible printed circuit board (400, 600) is positioned to span the second housing (220), the first hinge (270), the first housing (210), the second hinge (280), and the third housing (230), and can be connected to the printed circuit board (700a) within the third housing (230).

[0319] According to one embodiment of the present disclosure, an electronic device (101) may include a housing (201) that forms at least a part of the exterior of the electronic device (101).

[0320] According to one embodiment, the electronic device (101) may include a display panel (312) disposed on the housing (201), comprising a first planar portion (3121) visible through the front of the electronic device (101), a bending portion (3123) extending from the first planar portion (3121) and at least partially bent, and a second planar portion (3122) extending from the bending portion (3123) and disposed below the first planar portion (3121).

[0321] According to one embodiment, the electronic device (101) may include a display driving integrated circuit (320) disposed on one side of the second planar portion (3122) facing the rear of the electronic device (101).

[0322] According to one embodiment, the electronic device (101) may include a flexible printed circuit board (400) that is electrically connected to the second planar portion (3122) and surrounds the display driving integrated circuit (320).

[0323] According to one embodiment, the flexible printed circuit board (400) may include a recess (450) that is recessed from one side of the flexible printed circuit board (400) and accommodates at least a portion of the display driving integrated circuit (320).

[0324] According to one embodiment, the recess (450) may be formed on one surface of the flexible printed circuit board (400) in contact with the second planar portion (3122).

[0325] According to one embodiment, the electronic device (101) may further include a shielding member (451, 452, 453) disposed on at least one surface of the recess (450).

[0326] According to one embodiment, the flexible printed circuit board (400) may include an extension layer (411, 4111).

[0327] According to one embodiment, the extension layer (411, 4111) is extended to protrude relative to adjacent layers and can be electrically connected to the second planar portion (3122).

[0328] According to one embodiment, the electronic device (101) may further include a conductive film layer (460) disposed between the extension layer (411, 4111) and the second planar portion (3122).

[0329] Although specific embodiments have been described in the detailed description of this document, it will be obvious to those skilled in the art that various modifications are possible within the scope of this document.

Claims

1. In an electronic device (101), A housing (201) forming at least a part of the exterior of the electronic device (101); A display panel (312) disposed on the housing (201), comprising: a first planar portion (3121) visible through the front of the electronic device (101); a bending portion (3123) extending from the first planar portion (3121) and at least partially bent; and a second planar portion (3122) extending from the bending portion (3123) and disposed below the first planar portion (3121); A display driving integrated circuit (320) disposed on one side of the second planar portion (3122) facing the rear of the electronic device (101); and It includes a flexible printed circuit board (400) electrically connected to the second planar portion (3122) and positioned to cover the display driving integrated circuit (320), and The above flexible printed circuit board (400) is, A base part (403) comprising at least one base conductive layer (414, 415); and A first part (401) positioned between the base part (403) and the second planar part (3122) and comprising one or more first conductive layers (411, 412, 413); comprising An extension layer (411, 4111) of one or more first conductive layers (411, 412, 413) of the first part (401) is extended to protrude along the second planar portion (3122) relative to the remaining first conductive layers (412, 413) of the first part (401), and is an electronic device (101) electrically connected to the second planar portion (3122).

2. In Paragraph 1, The flexible printed circuit board (400) further includes a recess (450) recessed from one side of the first part (401) connected to the second planar portion (3122), and The above display driving integrated circuit (320) is an electronic device (101) that is at least partially accommodated in the recess (450).

3. In Paragraph 1 or 2, An electronic device (101) comprising a second part (402) positioned between the base part (403) and the rear surface of the electronic device (101) and comprising one or more second conductive layers (416, 417, 418).

4. In any one of paragraphs 1 to 3, The flexible printed circuit board (400) further includes shielding members (451, 452, 453) disposed on the side or bottom surface of the recess (450) and arranged to surround the display driving integrated circuit (320). The shielding members (451, 452, 453) include a plating layer, An electronic device (101) in which an air gap is formed between the shielding members (451, 452, 453) and the display driving integrated circuit (320).

5. In any one of paragraphs 1 through 4, The shielding members (451a, 452a, 453a) are, A shielding sheet (451a) disposed on the bottom surface of the above recess (450); An electronic device (101) comprising conductive vias (452a, 453a) disposed on the side of the recess (450) and electrically connected to one or more first conductive layers (411, 412, 413) of the first part (401).

6. In any one of paragraphs 1 through 5, The above conductive vias (452a, 453a) are, A first conductive ground via (452a) disposed adjacent to the first side of the recess (450) and electrically connected to one or more first conductive layers (411, 412, 413) of the first part (401); and An electronic device (101) comprising a second conductive ground via (453a) disposed adjacent to a second side of the recess (450) and electrically connected to one or more first conductive layers (411, 412, 413) of the first part (401).

7. In any one of paragraphs 1 through 6, The above extension layer (4111) is an electronic device (101) which is the first conductive layer (411) closest to the second planar portion (3122) among the one or more first conductive layers (411, 412, 413).

8. In any one of paragraphs 1 through 7, An electronic device (101) further comprising a conductive film layer (460) disposed between the extension layer (4111) and the second planar portion (3122) and connected to the extension layer (4111) and the second planar portion (3122).

9. In any one of paragraphs 1 through 8, It further includes an adhesive member (406) disposed between the flexible printed circuit board (400) and the second flat portion (3122) and bonded to the flexible printed circuit board (400) and the second flat portion (3122). The thickness of the conductive film layer (4601) is thinner than the thickness of the adhesive member (406) of the electronic device (101).

10. In any one of paragraphs 1 through 9, An electronic device (101) further comprising a battery (203) housed in the housing (201) and positioned in a first direction toward the second planar portion (3122) from the first planar portion (3121) so as not to overlap with the flexible printed circuit board (400).

11. In any one of paragraphs 1 through 10, The above base part (403) is, It further includes a non-conductive substrate (424), The one or more first base conductive layers (414, 415) of the base part (403) are, A first metal layer (414) disposed on one surface of the above-mentioned non-conductive substrate (424) and comprising a metal material; and An electronic device (101) comprising a second metal layer (415) comprising a metal material disposed on the other side of the above-mentioned non-conductive substrate (424).

12. In any one of paragraphs 1 through 11, The above housing (1202) includes a first housing portion (1210) and a second housing portion (1220) rotatably connected to the first housing portion (1210). The display panel (1230) is disposed in the first housing portion (1210) and the second housing portion (1220) and is configured to be at least partially folded or unfolded with respect to a folding axis. A portion of the extension layer (411, 4111) connected to the second planar portion (3122) is an electronic device (101) parallel to the folding axis.

13. In any one of paragraphs 1 through 12, The above housing (201) is, It includes a first housing (210), a second housing (220) rotatably connected to the first housing (210), a third housing (230) rotatably connected to the first housing (210), a first hinge (270) disposed between the first housing (210) and the second housing (220), and a second hinge (280) disposed between the second housing (220) and the third housing (230). The first planar portion of the display (202) is positioned on the first housing (210), the second housing (220), the third housing (230), the first hinge (270), and the second hinge (280), and The second planar portion of the display (202), the display driving integrated circuit (320), and the flexible printed circuit board (400, 600) are an electronic device (101) housed in the second housing (220).

14. In any one of paragraphs 1 through 13, It further includes a printed circuit board (700) that is housed in the second housing (220) and includes an application processor (120), and The above flexible printed circuit board (400, 600) is an electronic device (101) connected to the printed circuit board (700) within the second housing (220).

15. In any one of paragraphs 1 through 14, It further includes a printed circuit board (700a) that is housed in the third housing (230) and includes an application processor (120), and The flexible printed circuit board (400, 600) is arranged to span the second housing (220), the first hinge (270), the first housing (210), the second hinge (280), and the third housing (230), and is connected to the printed circuit board (700a) within the third housing (230) in an electronic device (101).

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