Battery cell processing device and control method and apparatus therefor, and storage medium

Abstract

Disclosed in the embodiments of the present disclosure are a control method and control apparatus for a battery cell processing device, and a storage medium. The control method comprises: acquiring respective state information of a battery cell feeding chamber, processing chambers and a battery cell discharging chamber of a battery cell processing device, wherein the state information is used for indicating whether there is a material to be transferred in each of the battery cell feeding chamber, the processing chambers and the battery cell discharging chamber; on the basis of the respective state information of the battery cell feeding chamber, the processing chambers and the battery cell discharging chamber, controlling the opening or closing of valves between the battery cell feeding chamber, the processing chambers and the battery cell discharging chamber, wherein the valves between at least a portion of adjacent processing chambers are synchronously opened or closed; and controlling the chambers having materials to be transferred to synchronously transfer said materials to the next chambers.

Description

Battery cell processing equipment, control methods, devices, and storage media

[0001] Cross-reference to related applications

[0002] This application is based on and claims priority to Chinese Patent Application No. 202411597454.1, filed on November 8, 2024, entitled “Battery Cell Processing Equipment and Control Method, Apparatus and Storage Medium Thereof”, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This disclosure relates to the field of semiconductor technology, and in particular to a control method, control device, and computer-readable storage medium for a battery cell processing equipment. Background Technology

[0004] Some semiconductor cell processing equipment can use chain plasma enhanced chemical vapor deposition (PECVD) technology to deposit semiconductor thin films on a substrate to fabricate cells. By optimizing and segmenting this process, the efficiency and quality of thin film deposition can be improved.

[0005] In chain-type PECVD production, a carrier frame carries the substrate from the loading chamber into the vacuum environment. After preheating in the preheating chamber, it undergoes coating in several process chambers. Then, it exits the vacuum environment from the unloading chamber, completing part or all of the coating process. This process involves continuous transfer from one chamber to the next. During this transfer, the load lock or isolation valve between chambers is opened and closed. Since the same chamber may only be used for loading or unloading, simultaneous loading and unloading is not possible. Therefore, the load lock is repeatedly opened and closed at different times during the entire transfer process, consuming time and reducing production efficiency. The efficiency of multi-chamber chain-type PECVD processes still needs improvement. Summary of the Invention

[0006] According to some aspects of embodiments of this disclosure, a control method for a solar cell processing apparatus is provided. The method is applied to a control system and includes: acquiring status information of a feeding chamber, a processing chamber, and an exiting chamber of the solar cell processing apparatus; the status information indicating whether each of the feeding chamber, the processing chamber, and the exiting chamber has materials to be transferred; controlling the opening or closing of valves between the feeding chamber, the processing chamber, and the exiting chamber based on the status information of each of the three chambers; and simultaneously opening or closing valves between at least some adjacent processing chambers.

[0007] The chamber containing the material to be transferred is controlled to synchronously transfer the material to the next chamber.

[0008] In some embodiments, the method further includes: when the valve between the loading chamber and the adjacent processing chamber is closed, if a discharge signal from the automated loading station is received, controlling the material to be transferred from the automated loading station to the loading chamber.

[0009] In some embodiments, controlling the transfer of the material to be transferred from the automated loading station to the wafer loading chamber includes: controlling the wafer loading chamber to break the vacuum; receiving an atmospheric signal from the wafer loading chamber; and if the atmospheric signal from the wafer loading chamber is received, initiating the wafer loading chamber to transfer the material, thereby transferring the material to be transferred from the automated loading station to the wafer loading chamber.

[0010] In some embodiments, the method further includes: when the valve between the output chamber and the adjacent processing chamber is closed, if a feeding signal from the automated unloading station is received, controlling the material to be transferred in the output chamber to be transferred to the automated unloading station.

[0011] In some embodiments, controlling the transfer of the material to be transferred in the film output chamber to the automated unloading station includes: controlling the film output chamber to break the vacuum; receiving an atmospheric signal from the film output chamber; and if an atmospheric signal from the film output chamber is received, initiating the film output chamber to transfer the material to be transferred to the automated unloading station.

[0012] In some embodiments, controlling the opening or closing of valves between the film inlet chamber, the processing chamber, and the film outlet chamber based on the respective status information of the film inlet chamber, the processing chamber, and the film outlet chamber includes: if the status information indicates that at least one chamber in the film inlet chamber and / or the processing chamber has material to be transferred, and the film outlet chamber does not have material to be transferred, then the valves between the film inlet chamber, the film outlet chamber, and the adjacent processing chamber are opened, and the valves between adjacent processing chambers are also opened.

[0013] In some embodiments, controlling the opening or closing of valves between the film loading chamber, the processing chamber, and the film exiting chamber based on the respective status information of the film loading chamber, the processing chamber, and the film exiting chamber includes: if the status information indicates that at least one chamber in the film loading chamber and / or the processing chamber has material to be transferred, and the film exiting chamber does not have material to be transferred, then opening the valve between the chamber with the material to be transferred and the next chamber, and closing the other valves.

[0014] In some embodiments, controlling the chamber containing the material to be transferred to synchronously transfer the material to the next chamber includes: if a valve opening signal is received from one or more valves between the film feeding chamber, the processing chamber, or the film output chamber, controlling the chamber containing the material to be transferred to synchronously transfer the material to the next chamber; the valve opening signal is used to indicate that the valve has completed the opening operation.

[0015] In some embodiments, the method further includes: after a synchronous transmission is completed, controlling the valves between the wafer loading chamber, the processing chamber, and the wafer unloading chamber to close; if a valve closing signal is received from each valve, controlling the processing chamber to process the material according to the corresponding process of the processing chamber; the valve closing signal is used to indicate that the valve has completed the closing operation.

[0016] In some embodiments, obtaining the status information of the infeed chamber and the outfeed chamber respectively includes: obtaining first detection information indicating whether the infeed chamber and the outfeed chamber contain a carrier; if the first detection information indicating that the infeed chamber or the outfeed chamber contains the carrier is received, then it is determined that the status information of the infeed chamber or the outfeed chamber indicates that the material to be transferred is in the infeed chamber or the outfeed chamber.

[0017] In some embodiments, obtaining the status information of each of the processing chambers includes: obtaining second detection information indicating whether each of the processing chambers contains a carrier; upon receiving the second detection information indicating that the processing chamber contains the carrier, if a transfer status request is received from the processing chamber, determining that the status information of the processing chamber indicates that there is material to be transferred in the processing chamber; the transfer status request is used to indicate that the processing chamber meets the conditions for opening the valve and has completed the process and needs to be transferred to the next chamber.

[0018] According to some aspects of embodiments of the present disclosure, a solar cell processing apparatus is provided, comprising: a plurality of chambers connected in sequence; the plurality of chambers including: a cell inlet chamber, at least one processing chamber, and a cell outlet chamber;

[0019] Control device and transmission unit; the control device includes:

[0020] The acquisition module is configured to acquire the status information of the feeding chamber, processing chamber, and exit chamber of the solar cell processing equipment; the status information is used to indicate whether there is material to be transferred in the feeding chamber, the processing chamber, and the exit chamber, respectively.

[0021] The first control module is configured to control the valves between the wafer loading chamber, the processing chamber, and the wafer unloading chamber to open or close based on the status information of each of the wafer loading chamber, the processing chamber, and the wafer unloading chamber; and the valves between at least some adjacent processing chambers to open or close synchronously.

[0022] The second control module is configured to control the chamber containing the material to be transferred to synchronously transfer the material to the next chamber.

[0023] In some embodiments, the cell processing equipment further includes an isolation chamber connected between the two processing chambers; the control device is further configured to control at most one valve on both sides of the isolation chamber to open at any given time.

[0024] According to some aspects of embodiments of the present disclosure, a control device is provided, comprising: a processor and a memory, the memory being configured to store a program, and the processor being configured to execute the program to implement the control method as described.

[0025] According to some aspects of embodiments of the present disclosure, a computer-readable storage medium is provided having a computer program stored thereon that, when executed, implements the control method as described. Attached Figure Description

[0026] Figures 1 and 2 are schematic diagrams of a battery cell processing apparatus according to embodiments of the present disclosure;

[0027] Figure 3 is a schematic diagram of a control method for a battery cell processing apparatus according to an embodiment of the present disclosure;

[0028] Figure 4 is a schematic diagram of a control device according to an embodiment of the present disclosure. Detailed Implementation

[0029] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the specific embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0030] In the following description, numerous specific details are set forth in order to provide a more thorough understanding of this disclosure. However, it will be apparent to those skilled in the art that this disclosure may be practiced without one or more of these details. In other instances, to avoid confusion with this disclosure, certain technical features well-known in the art have not been described; that is, not all features of actual embodiments are described herein, nor are well-known functions and structures described in detail.

[0031] It should be understood that when an element or layer is referred to as “on,” “adjacent to,” “connected to,” or “coupled to” other elements or layers, it may be directly on, adjacent to, connected to, or coupled to other elements or layers, or there may be intervening elements or layers. Conversely, when an element is referred to as “directly on,” “directly adjacent to,” “directly connected to,” or “directly coupled to” other elements or layers, there are no intervening elements or layers. The terminology used herein is intended only to describe particular embodiments and is not intended to be limiting of this disclosure. As used herein, the singular forms “a,” “an,” and “the” are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “compose” and / or “comprising,” as used in this specification, identify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups. As used herein, the term “and / or” includes any and all combinations of the associated listed items.

[0032] It should be understood that the phrases "some embodiments" or "an embodiment" throughout the specification mean that a specific feature, structure, or characteristic related to an embodiment is included in at least one embodiment of this disclosure. Therefore, "some embodiments" or "an embodiment" appearing throughout the specification do not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. It should be understood that in the various embodiments of this disclosure, the sequence numbers of the above processes do not imply a sequential order of execution; the execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this disclosure.

[0033] Thin-film silicon / crystalline silicon heterojunction solar cells are a type of high-efficiency crystalline silicon solar cell that can be fabricated at low cost. This type of solar cell utilizes a doped thin-film silicon layer to create a PN junction on a silicon substrate. This thin-film silicon layer can be several nanometers thick and can be deposited using PECVD technology at temperatures below 200°C. Compared to solar cells that rely on diffusion processes to fabricate PN junctions, thin-film silicon / crystalline silicon heterojunction solar cells require less investment and exhibit higher open-circuit voltage.

[0034] In some exemplary embodiments, thin-film silicon / crystalline silicon heterojunction solar cells have a symmetrical structure on both sides, and the special nature of this structure inevitably places higher demands on the equipment. A method for fabricating cells by double-sided deposition includes: depositing a thin film on one surface of a semiconductor substrate, removing it from the vacuum chamber after deposition on one side, flipping it, and then returning it to the vacuum chamber to deposit the other side. This flipping method requires disrupting the vacuum environment to remove the substrate, and then re-evacuating it back into the vacuum chamber, increasing the cell fabrication time. Furthermore, the side with the deposited film is easily oxidized or absorbs impurities from the air, reducing the photoelectric effect performance of the PN junction. In other embodiments, the flipping mechanism can be located within the chamber. However, the flipping mechanism requires a large space, necessitating sufficient reserved space in the vacuum chamber or the addition of a separate vacuum flipping chamber. This may increase equipment costs, and if fragmentation occurs during the flipping process, the vacuum chamber needs to be disassembled for cleaning, increasing process risks.

[0035] In some embodiments, the passivation layer of a heterojunction solar cell can be an intrinsic silicon I layer or other intrinsic semiconductor layers. Surface defects in the crystalline silicon in contact with the intrinsic silicon I layer are highly sensitive to cell efficiency. Some PECVD processes for depositing thin films for solar cells can be IN-IP, where an I layer is deposited first, followed by an N-type doped semiconductor layer (N layer). After exiting the vacuum chamber and flipping the wafer, an I layer and a P-type doped semiconductor layer (P layer) are deposited, resulting in a PIIN structure. The P and N layers are separated by two I layers, which may not have physical boundaries. The advantage of this process is fewer flipping operations. The disadvantage is that a doping chamber deposition has already been performed before the second I layer is formed, which can easily lead to some doped atoms, such as phosphorus atoms, adhering to the substrate surface, increasing surface defects and affecting efficiency.

[0036] In some embodiments, the process flow for depositing battery thin films using PECVD can be I-IN-P. After depositing an I layer, the film is removed from the vacuum deposition chamber, flipped, and re-enters the vacuum chamber to deposit a back I layer, followed by an N layer. The film is then removed from the vacuum chamber, flipped again, and a P layer is deposited. This process adds one flipping step, but the two intrinsic layers do not pass through an N-type chamber, thus avoiding contamination by dopants and reducing surface defects. In some specific embodiments, the I-IN-P deposition sequence can improve the average efficiency of the battery production line by 0.15% compared to IN-IP.

[0037] According to some aspects of the embodiments of this disclosure, a solar cell processing apparatus 1000 is provided. This apparatus can be a vapor deposition apparatus, including but not limited to a PECVD apparatus or a CVD (Chemical Vapor Deposition) apparatus. The solar cell processing apparatus 1000 can be applied to heterojunction solar cell coating or other deposition processes. The embodiments of this disclosure do not limit the application process of the apparatus or the type of semiconductor substrate. For example, the solar cell processing apparatus 1000 can be used for depositing amorphous silicon-based thin films on heterojunction solar cells. It may include an I-stage coating apparatus 100, an IN-stage coating apparatus 200, and a P-stage coating apparatus 300, each corresponding to a different process segment. For example, the I-stage coating apparatus 100 may correspond to or perform the first process segment, the IN-stage coating apparatus 200 may correspond to or perform the second process segment, and the P-stage coating apparatus 300 may correspond to or perform the third process segment. The first, second, and third processes constitute a complete process. A flipping device 10 is provided between the consecutive processes for automatic flipping. In some embodiments, after the first section is completed, the substrate forming layer I can be transferred to the second section, or wait for feeding at the feeding position of the second section. Each section can operate continuously independently without affecting the operation of other sections. When one section is running, other sections can run or stop.

[0038] In some embodiments, taking the I-segment coating equipment 100 in Figures 1 and 2 as an example, it may include a linearly arranged loading chamber 3 (Load lock In, LLI), a preheating chamber 4 (Prepare Heat Chamber, PHM), multiple intrinsic (Pi) process chambers 5 (Process Chamber-Pi, PM-Pi), and a loading chamber 7 (Load lock Out, LLO).

[0039] The IN-segment coating equipment 200 may include a linearly arranged wafer entry chamber 3, a preheating chamber 4, multiple intrinsic (Ni) process chambers 11 (Process Chamber-Ni, PM-Ni), an isolation chamber 12 (Isolating Chamber, ISO), multiple doped (N) process chambers 13 (Process Chamber-N, PM-N), and a wafer exit chamber 7. The P-segment coating equipment 300 may include a linearly arranged wafer entry chamber 3, a preheating chamber 4, multiple doped (P) process chambers 14 (Process Chamber-P, PM-P), and a wafer exit chamber 7. The number of process chambers may be related to the thickness of the film to be deposited and the deposition rate of the film. For example, if the required thickness of the intrinsic Pi layer is 9 nm, and each intrinsic (Pi) process chamber 5 can effectively deposit 3 nm within one process cycle, then three intrinsic (Pi) process chambers 5 are required. The valve 2 may also be an isolation valve or a chamber door. The preheating chamber 4 and the process chambers performing the coating may be referred to as the processing chamber 20.

[0040] For example, the substrate can be a semiconductor substrate, such as a silicon wafer or a silicon carbide wafer; the P-type dopant can be a trivalent element, including but not limited to boron, gallium, indium, etc., and a gas source including trivalent elements is introduced during deposition to dope the deposited layer. The N-type dopant can be a pentavalent element, including but not limited to arsenic, phosphorus, antimony, etc.

[0041] In some embodiments, the number of intrinsic (Pi) process chambers 5 can be 3, the number of intrinsic (Ni) process chambers 11 can be 2, the number of doped (N) process chambers 13 can be 4, and the number of doped (P) process chambers 14 can be 5. The process cycle time of each process chamber is similar. By aligning the cycle time of each stage, such as the wafer loading chamber 3, preheating chamber 4, wafer unloading chamber 7, and automated loading and unloading, with the process cycle time of each stage, the cycle time of the corresponding equipment in the entire process is basically consistent. This avoids waste of resources and waiting time in certain stages, and improves equipment utilization.

[0042] In some embodiments, as illustrated in FIG1, the cell processing equipment 1000 may include: an automated loading platform 1; the automated loading platform 1 is configured to lift the empty carrier 6 returned by the lower transfer device 9 to a certain height and place the silicon wafers to be coated on the empty carrier 6; the carrier 6 is used to carry the substrates to flow between various chambers or devices, and can also transfer heat to heat the substrates; a valve 2, located between adjacent chambers, maintains the state of each chamber and isolates it from other chambers; a wafer feeding chamber 3, located in the first chamber of the process section, is used for switching between vacuum and atmospheric states to realize the feeding function and the transmission function; a preheating chamber 4, through a lifting device, brings the heater into contact with the carrier 6 to realize heating and improve heat transfer efficiency; the heating method may include contact heating or non-contact heating.

[0043] The process chamber, used for film deposition, includes an intrinsic (Pi) process chamber 5, an intrinsic (Ni) process chamber 11, a doped (N) process chamber 13, and a doped (P) process chamber 14. Depending on the process requirements, the corresponding gas is introduced, a vacuum environment is created using a vacuum pump, or the gas pressure is maintained. Radio frequency energy is coupled to the space between the upper and lower parallel electrode plates using a radio frequency power supply to excite the process gas and form plasma. Intrinsic silicon thin films and N / P type silicon thin films are deposited within this process chamber. The process chamber and preheating chamber 4 can be referred to as the processing chamber 20. The processing chamber 20 may include: preheating chamber 4, intrinsic (Pi) process chamber 5, intrinsic (Ni) process chamber 11, doped (N) process chamber 13, and doped (P) process chamber 14.

[0044] The unloading chamber 7 is used for switching between vacuum and atmospheric conditions, enabling material unloading and conveying functions. The automated unloading platform 8 is used to remove the coated substrate and lower the empty carrier 6 to a certain height for transfer to the lower return device 9. The lower return device 9 is used to transfer the empty carrier 6 from the automated unloading platform 8 back to the automated loading platform 1. The automated flipping device 10 flips the substrate for coating operations on the other side. The isolation chamber 12 is located between different types of coating process chambers to reduce cross-contamination between different process gases. The isolation chamber 12 is located between an intrinsic (Ni) process chamber 11 and a doped (N) process chamber 13 to prevent mutual interference between the process gases of the intrinsic layer and the doped layer.

[0045] In some embodiments, referring to FIG1, taking the I-section coating equipment 100 as an example: each of the infeed chamber 3, the preheating chamber 4, and the three intrinsic (Pi) process chambers 5 contains a carrier 6, and the unloading chamber 7 is empty. All valves 2 between the infeed chamber 3 and the unloading chamber 7 are opened simultaneously, and the carriers 6 begin to transport simultaneously. After being transported to the next chamber, the carriers 6 stop, and all the valves 2 that were just opened are closed. Each chamber performs its own functional action. In the infeed chamber 3, a vacuum breaking action is performed. After the vacuum breaking is completed, a new carrier 6 is transferred in by the automated loading platform 1, and then pumped to a vacuum state. The preheating chamber 4 performs a lifting action, and contacts the carrier 6 for contact heating. The process chambers perform the coating operation. In the unloading chamber 7, a vacuum breaking action is performed. After the vacuum breaking is completed, the carrier 6 is transferred to the automated unloading platform 8, and then pumped to a vacuum state. The automated unloading station 8 performs the chip coding / picking action. After the functions of each chamber are completed, the in-out transmission action is performed, and the chips enter the IN section coating equipment 200 and the P section coating equipment 300, and so on in a cycle.

[0046] In some embodiments, in order to enable the coating and heating operations to be carried out quickly in the process chamber and the preheating chamber 4, the two chambers are continuously ventilated and a certain pressure is maintained during the continuous in-and-out transfer operation.

[0047] In some embodiments, the preheating chamber 4 uses argon to maintain the equilibrium pressure inside its chamber, and the process chamber uses process gas to maintain the equilibrium pressure inside its chamber. Hydrogen may be used as the homogenizing gas in the preheating chamber 4.

[0048] In some embodiments, during the continuous inlet / outlet transfer, since all chambers are in a connected state, a balancing gas is also filled in the inlet chamber 3 and the outlet chamber 7 to prevent the process gas in the middle process chamber from diffusing to the inlet / outlet chambers on both sides. The pressure of the balancing gas is slightly higher than the gas pressure in the process chamber and the preheating chamber 4. At the same time, the vacuum pump group in the process chamber and the preheating chamber 4 continuously stabilizes the pressure to ensure that the pressure in each chamber during the continuous inlet / outlet transfer process shows a trend of slightly higher at both ends and slightly lower in the middle, thus limiting the diffusion of process gas to both sides.

[0049] In some embodiments, in addition to the normal nitrogen (or atmospheric) vacuum breaking conduit, the inlet / outlet chamber has an additional separate, low-flow, low-pressure vacuum breaking conduit specifically for filling with balance gas. The gas used for filling with balance gas may include argon or helium.

[0050] In some embodiments, the lower heating plate of the preheating chamber 4 is liftable. When the carrier 6 is in position, the heating plate rises and heats the carrier 6 in close contact. Side heating elements are installed on all four sides of the preheating chamber 4 to help maintain the heating environment within the chamber. The preheating chamber 4 also has an upper heating plate, which does not contact the carrier 6. To improve the heating rate, uniformly distributed gas distribution holes are arranged on the heating plate to introduce airflow into the chamber, achieving uniform gas heating. The gas distribution gas may include, but is not limited to, argon, helium, nitrogen, or hydrogen.

[0051] In some embodiments, the heater of the preheating chamber 4 may be set to a temperature range of 100-300°C, for example, 150-250°C; the gas pressure of the preheating chamber 4 is similar to the gas pressure of the process chamber in the same section, for example, the gas pressure of the preheating chamber 4 in the I section coating equipment 100 is 50-150Pa, and the preheating chamber 4 in the P section is 500-800Pa, so that the pressure between each chamber is similar.

[0052] In some embodiments, the carrier 6 can be transported within the chamber by a servo motor outside the chamber transmitting power to each magnetofluid shaft via a synchronous belt drive, and then using rollers for transmission. In some embodiments, the magnetofluid can achieve a rotary seal; to prevent the magnetofluid from failing at high temperatures, cooling water can be introduced into the magnetofluid to cool it. The wheels of the transmission wheel structure are made of aluminum, and the wheel surface is embedded with rubber sheets or rubber O-rings. The rubber may include fluororubber or perfluororubber. The aluminum wheels are guided by an outer flange to guide the carrier 6 during transmission. The aluminum wheel flange has a 10-45 degree bevel to provide vertical guidance for the carrier 6 when it falls from its raised position.

[0053] In some embodiments, the lower return device 9 may be made of thermal insulation material, which can reduce the ineffective heat loss of the carrier 6 during return transmission, maintain it at a certain temperature, facilitate rapid heating after entering the preheating chamber 4, save heating time, and improve heating efficiency.

[0054] According to some aspects of the embodiments of this disclosure, FIG3 provides a control method for a solar cell processing equipment 1000. The method is applied to a control system and includes: acquiring status information of the feeding chamber, processing chamber, and output chamber of the solar cell processing equipment; the status information is used to indicate whether there is material to be transferred in the feeding chamber, the processing chamber, and the output chamber, respectively.

[0055] Based on the status information of the film loading chamber, the processing chamber, and the film unloading chamber, the valves between the film loading chamber, the processing chamber, and the film unloading chamber are controlled to open or close; at least some of the valves between adjacent processing chambers are opened or closed synchronously.

[0056] The chamber containing the material to be transferred is controlled to synchronously transfer the material to the next chamber.

[0057] The processing chamber 20 of the disclosed embodiment may include: a preheating chamber 4, an intrinsic (Pi) process chamber 5, an intrinsic (Ni) process chamber 11, a doped (N) process chamber 13, and a doped (P) process chamber 14 in the cell processing equipment 1000 illustrated in FIG1 and FIG2.

[0058] The control unit of the control system or the processor of the control equipment acquires the status information of the infeed chamber 3, the processing chamber 20, and the outfeed chamber 7. The status information can at least indicate whether there is material to be transferred in the infeed chamber 3, the processing chamber 20, and the outfeed chamber 7. The material to be transferred is a substrate carried on a carrier 6. The presence of a carrier 6 inside the chamber can be detected or confirmed to indicate that there is material to be transferred inside the chamber. For example, photoelectric detection devices can be installed on the chamber wall at the infeed end or the chamber wall at the outfeed end of each chamber, or on the side walls of the infeed end and the outfeed end, to detect whether there is a carrier 6 inside the chamber. For example, the photoelectric detection device can emit and receive light signals. When the light signal is blocked by the carrier 6, it can be indicated that there is a carrier 6 inside the chamber, that is, that there is material to be transferred inside the chamber.

[0059] In some embodiments, when valve 2 between the wafer inlet chamber 3 and the automated loading platform 1 is closed, and valve between the wafer outlet chamber 7 and the automated unloading platform 8 is closed, when there is material to be transferred in any of the wafer inlet chamber 3 and the processing chamber 20, and the wafer inlet chamber 3 has completed vacuuming, the processing chamber 20 has completed preheating treatment, or the coating process has ended and is ready to transfer wafers to the next chamber; the valve between the wafer inlet chamber 3 and its adjacent processing chamber 20, as well as the valve between each adjacent processing chamber 20, can be opened; after the valve is opened, a valve opening signal is generated, and after receiving the valve opening signal, the material to be transferred is transferred to the next chamber; when the material to be transferred is synchronously transferred to the next chamber, all valves are controlled to close, and a valve closing signal is generated; after receiving the valve closing signal, and it is found that there is material in the chamber, the corresponding process processing of the chamber with material is started.

[0060] For example, as illustrated in Figure 2, when the status information indicates that there is material to be transferred in the loading chamber 3, and there is no material to be transferred in the preheating chamber 4 and the subsequent chambers, the valves between the loading chamber 3 and the preheating chamber 4, between the multiple intrinsic (Pi) process chambers 5, and between the last intrinsic (Pi) process chamber 5 and the unloading chamber 7 are opened, generating multiple valve opening signals. Upon receiving the valve opening signal, synchronous transfer is initiated, transferring the material to be transferred in the loading chamber 3 to the adjacent preheating chamber 4. Alternatively, only the valve between the loading chamber 3 and the preheating chamber 4 is opened, resulting in only one valve opening signal and transferring the material to be transferred in the loading chamber 3 to the preheating chamber 4. Since no material to be transferred is detected in the preheating chamber 4 and the subsequent chambers, the valves between the preheating chamber 4 and the adjacent intrinsic (Pi) process chamber 5, as well as the subsequent valves, can be closed, and no material is transferred, thereby reducing valve opening and closing operations. When the material in the loading chamber 3 is transferred to the preheating chamber 4, the open valve is closed and a valve closing signal is generated to preheat the material in the preheating chamber 4, while other process chambers without material are not coated.

[0061] In some embodiments, when the status information indicates that the wafer loading chamber 3, preheating chamber 4, and the intrinsic (Pi) process chamber 5 adjacent to the preheating chamber 4 in Figure 2 have materials to be transferred, and other chambers have no materials to be transferred; each chamber with materials to be transferred is ready to transfer materials; the wafer loading chamber 3 is in a vacuum and can issue a transfer status request, indicating that it has met the conditions for opening the valve; the preheating chamber 4 can issue a transfer status request after preheating, indicating that its heating treatment has been completed, the gas composition and pressure are within the process requirements range, and the conditions for opening the valve have been met; the intrinsic (Pi) process chamber 5 can issue a transfer status request after coating is completed. The system requests a state indicating that the valve opening conditions have been met; it opens the valve between the infeed chamber 3 and the preheating chamber 4, the valve between the preheating chamber 4 and the adjacent intrinsic (Pi) process chamber 5, and the valve between the intrinsic (Pi) process chamber 5 containing the material to be transferred and the next intrinsic (Pi) process chamber 5; after receiving the valve opening signal, it synchronously transfers the material to be transferred in the infeed chamber 3, the preheating chamber 4, and the intrinsic (Pi) process chamber 5 adjacent to the preheating chamber 4 backwards, and closes the valve after the transfer is completed; after receiving the valve closing signal, it controls each processing chamber 20 containing the material to perform process processing on the material. In some other embodiments, the infeed chamber 3 and all processing chambers 20 have material to be transferred, while the output chamber 7 has no material to be transferred. In this case, the valve between the infeed chamber 3 and the preheating chamber 4, the valve between the preheating chamber 4 and the process chambers, the valve between each process chamber, and the valve between the last process chamber and the output chamber 7 can be opened, and the material to be transferred in each chamber can be synchronously transferred backwards to one chamber.

[0062] In some embodiments, referring to FIG2, an automated loading platform 1 is connected to the loading end of the wafer loading chamber 3 for connecting the substrate to the empty carrier 6. The automated loading platform 1 is in an atmospheric state. Status information indicates that there is no material to be transferred in the wafer loading chamber 3. Before opening the valve between the wafer loading chamber 3 and the automated loading platform 1, the valve between the wafer loading chamber 3 and the adjacent processing chamber 20 (e.g., preheating chamber 4) must be closed to break the vacuum in the wafer loading chamber 3. Then, the valve between the wafer loading chamber 3 and the automated loading platform 1 is opened, and the automated loading platform 1 transfers the material to be transferred into the wafer loading chamber 3. For example, the control method further includes: when the valve between the wafer loading chamber 3 and the adjacent processing chamber 20 is closed, if a discharge signal is received from the automated loading platform 1, the material to be transferred from the automated loading platform 1 is controlled to be transferred to the wafer loading chamber 3. When the wafer loading chamber 3 is in a vacuum state or when transferring wafers to the adjacent processing chamber 20, the valve between the wafer loading chamber 3 and the automated loading platform 1 is closed to avoid atmospheric pollution from the external environment.

[0063] In some embodiments, controlling the transfer of the material to be transferred from the automated loading platform 1 to the wafer loading chamber 3 includes: controlling the wafer loading chamber 3 to break the vacuum while the valve between the automated loading platform 1 and the wafer loading chamber 3 is closed, and the valve between the wafer loading chamber 3 and the adjacent processing chamber 20 is closed; receiving an atmospheric signal from the wafer loading chamber 3; if an atmospheric signal from the wafer loading chamber 3 is received, opening the valve between the wafer loading chamber 3 and the automated loading platform 1, obtaining a valve opening signal from the valve between the wafer loading chamber 3 and the automated loading platform 1, and starting the wafer loading chamber 3 to transfer the material, so that the material to be transferred from the automated loading platform 1 is transferred to the wafer loading chamber 3.

[0064] In some embodiments, referring to FIG2, an automated unloading platform 8 is connected to the unloading end of the unloading chamber 7 for peeling the coated substrate from the carrier 6. The automated unloading platform 8 is in an atmospheric state. Status information indicates that the unloading chamber 7 has material to be transferred. Before opening the valve between the unloading chamber 7 and the automated unloading platform 8, the valve between the unloading chamber 7 and the adjacent intrinsic (Pi) process chamber 5 must be closed to break the vacuum in the unloading chamber 7. Then, the valve between the unloading chamber 7 and the automated unloading platform 8 is opened, and the automated unloading platform 8 transfers the material to be transferred to the loading chamber 3. For example, the control method further includes: when the valve between the unloading chamber 7 and the adjacent processing chamber 20 (e.g., the adjacent intrinsic (Pi) process chamber 5) is closed, if a feeding signal is received from the automated unloading platform 8, the material to be transferred in the unloading chamber 7 is controlled to be transferred to the automated unloading platform 8. When the unloading chamber 7 is in a vacuum state or receives a wafer transfer from the adjacent processing chamber 20, the valve between the unloading chamber 7 and the automated unloading platform 8 is closed to avoid atmospheric pollution from the external environment.

[0065] In some embodiments, controlling the transfer of the material to be transferred from the film output chamber 7 to the automated unloading platform 8 includes: controlling the film output chamber 7 to break the vacuum while the valve between the film output chamber 7 and the automated unloading platform 8 is closed, and the valve between the film output chamber 7 and the adjacent processing chamber 20 is closed; receiving an atmospheric signal from the film output chamber 7; if an atmospheric signal is received from the film output chamber 7, opening the valve between the film output chamber 7 and the automated unloading platform 8, obtaining a valve opening signal from the valve between the film output chamber 7 and the automated unloading platform 8, and starting the film output chamber 7 to transfer the material, so that the material to be transferred from the film output chamber 7 is transferred to the automated unloading platform 8.

[0066] In some embodiments, controlling the opening or closing of valves between the infeed chamber 3, processing chamber 20, and exit chamber 7 based on their respective status information includes: if the status information indicates that at least one chamber in the infeed chamber 3 and / or processing chamber 20 has material to be transferred, and the exit chamber 7 has no material to be transferred, then the valves between the infeed chamber 3, exit chamber 7, and adjacent processing chamber 20 are opened, as well as the valves between each processing chamber 20 are opened. For example, when the exit chamber 7 is empty or has completed discharge, only the infeed chamber 3 has material to be transferred, and the other processing chambers 20 have no material to be transferred; the valves between the infeed chamber 3 and its adjacent processing chamber 20 can be opened, as well as the valves between each processing chamber 20 are opened, and the valve between the last processing chamber 20 and the exit chamber 7 is opened, transferring the material to be transferred in the infeed chamber 3 to an adjacent processing chamber 20, such as the preheating chamber 4. For example, when there is no material to be transferred in the loading chamber 3, but there is material to be transferred in at least one processing chamber 20, or when there is material to be transferred in both the loading chamber 3 and at least one processing chamber 20, the valve between the loading chamber 3 and its adjacent processing chamber 20 can be opened, as well as the valve between each processing chamber 20 can be opened, and the valve between the last processing chamber 20 and the unloading chamber 7 can be opened; the chamber with material to be transferred can be controlled to synchronously transfer the material to be transferred to the next chamber.

[0067] In some embodiments, controlling the opening or closing of valves between the infeed chamber 3, the processing chamber 20, and the exit chamber 7 based on the respective status information of the infeed chamber 3, the processing chamber 20, and the exit chamber 7 includes: if the status information indicates that at least one chamber in the infeed chamber 3 and / or the processing chamber 20 has material to be transferred, and the exit chamber 7 has no material to be transferred, then opening the valve between the chamber with material to be transferred and the next chamber, and closing the other valves.

[0068] In some embodiments, controlling the chamber containing the material to be transferred to synchronously transfer the material to the next chamber includes: if a valve opening signal is received from one or more valves between the infeed chamber 3, the processing chamber 20, or the outfeed chamber 7, controlling the chamber containing the material to be transferred to synchronously transfer the material to the next chamber; the valve opening signal is used to indicate that the valve has completed the opening operation.

[0069] For example, when the status information indicates that there is material to be transferred in the wafer loading chamber 3, but there is no material to be transferred in the processing chamber 20, only the valve between the wafer loading chamber 3 and the preheating chamber 4 is opened, generating a valve opening signal. Upon receiving the valve opening signal, the material to be transferred in the wafer loading chamber 3 is transferred to the preheating chamber 4. Since there is no material to be transferred in the intrinsic (Pi) process chamber 5 adjacent to the preheating chamber 4, the valve between the preheating chamber 4 and the adjacent intrinsic (Pi) process chamber 5, as well as subsequent valves, can be closed, and no material is transferred, in order to reduce valve opening and closing operations. After the material in the wafer loading chamber 3 is transferred to the preheating chamber 4, all valves are closed and a valve closing signal is generated. Upon receiving the valve closing signal, the material in the preheating chamber 4 is preheated, while other process chambers without material are not coated.

[0070] In some embodiments, the control method further includes: after a synchronous transmission is completed, controlling the valves between the infeed chamber 3, the processing chamber 20, and the outfeed chamber 7 to close; if a valve closing signal is received from each valve, controlling the processing chamber 20 to process the material according to the corresponding process of the processing chamber 20; the valve closing signal is used to indicate that the valve has completed the closing operation. The valve closing state may include: when the status information of the infeed chamber 3, the processing chamber 20, and the outfeed chamber 7 is obtained, the valve is already closed, and no valve opening or material transmission action has been performed. If a valve closing signal is received at this time, the processing chamber 20 will not be controlled to perform the corresponding process processing on the material. Alternatively, each chamber meets the chamber transmission conditions, such as the infeed chamber 3 has been evacuated and the processing process of each processing chamber 20 has been completed. At this time, the valves between the infeed chamber 3 and the processing chamber 20, between each processing chamber 20, and between the processing chamber 20 and the outfeed chamber 7 are all closed. The valves between the chambers that need to transmit material are opened. Upon receiving a valve opening signal between the chambers that need to transmit material, the chambers that need to transmit material are controlled to synchronously transmit the material to the next chamber. For the material transfer process, after receiving the valve opening signal, the corresponding transfer motor of each chamber can be started to transfer the material synchronously. When the material is transferred to the position, the motor will decelerate. The transfer speed will decelerate until it stops, indicating that the material transfer is over. After receiving the deceleration signal of the motor until the motor stops, the valve opened for material transfer is closed and a valve closing signal is generated. After receiving the motor deceleration signal, the motor stop signal and the valve closing signal, the control processing chamber 20 is used to process the material according to the process corresponding to the processing chamber 20.

[0071] In some embodiments, acquiring the status information of the wafer loading chamber 3 and the wafer unloading chamber 7 includes: acquiring first detection information indicating whether the wafer loading chamber 3 and the wafer unloading chamber 7 contain a carrier 6; if the first detection information indicating that the wafer loading chamber 3 or the wafer unloading chamber 7 contains a carrier 6 is received, then it is determined that the status information of the wafer loading chamber 3 or the wafer unloading chamber 7 indicates that there is material to be transferred in the wafer loading chamber 3 or the wafer unloading chamber 7. The material to be transferred is a substrate carried on the carrier 6. The presence of a carrier 6 inside the chamber can be detected or confirmed to indicate that there is material to be transferred inside the chamber. Photoelectric detection devices can be provided at both ends of the chamber for emitting and receiving light signals. When the light signal is blocked by the carrier 6, it indicates that there is a carrier 6 inside the chamber, that is, it indicates that there is material to be transferred inside the chamber. The feeding end of the feeding chamber 3 is connected to the automated loading platform 1 through a valve or other means. The automated loading platform 1 is in an atmospheric state. After the feeding chamber 3 breaks the vacuum and switches to an atmospheric state, it opens the valve to transfer materials with the automated loading platform 1. The discharging end of the discharging chamber 7 is connected to the automated unloading platform 8 through a valve or other means. The automated unloading platform 8 is in an atmospheric state. After the discharging chamber 7 breaks the vacuum and switches to an atmospheric state, it opens the valve to transfer materials with the automated unloading platform 8. When transferring materials between the feeding chamber 3, the processing chamber 20, and the discharging chamber 7, it must be done under vacuum. The valve between the feeding chamber 3 and the automated loading platform 1 must be closed, and the valve between the discharging chamber 7 and the automated unloading platform 8 must be closed.

[0072] In some embodiments, when the first detection information indicates that the loading chamber 3 has a carrier 6, the valve between the chambers that need to transfer the material is opened, and the carrier 6 of the loading chamber 3 is transferred to the next processing chamber 20. When the first detection information indicates that the loading chamber 3 does not have a carrier 6, and the valve between the loading chamber 3 and the adjacent processing chamber 20 is closed, if a discharge signal from the automated loading platform 1 is received, the loading chamber 3 is controlled to break the vacuum, and the loading chamber 3 generates an atmospheric signal; if an atmospheric signal is received from the loading chamber 3, the valve between the loading chamber 3 and the automated loading platform 1 is opened, and the loading chamber 3 is started to transfer the material, so that the material to be transferred from the automated loading platform 1 is transferred to the loading chamber 3. After the transfer is completed, the valve between the loading chamber 3 and the automated loading platform 1 is closed. If a valve closing signal is received, the loading chamber 3 is evacuated. When the adjacent processing chamber 20 meets the valve opening conditions, such as no carrier 6 or having a carrier 6 and the process has been completed, the valve between the loading chamber 3 and the processing chamber 20 to be transferred is opened, and the material is transferred synchronously.

[0073] In some embodiments, when the first detection information indicates that there is no carrier 6 in the output chamber 7, the material is awaited to be transferred into the output chamber 7 from the adjacent processing chamber 20. When the first detection information indicates that there is a carrier 6 in the output chamber 7, with the valve between the output chamber 7 and the adjacent processing chamber 20 closed, if a feeding signal from the automated unloading platform 8 is received, the vacuum in the output chamber 7 is broken, and an atmospheric signal is generated in the output chamber 7. If an atmospheric signal is received in the output chamber 7, the valve between the output chamber 7 and the automated unloading platform 8 is opened, and the output chamber 7 is started to transfer the material to be transferred to the automated unloading platform 8. After the transfer is completed, the valve between the output chamber 7 and the automated unloading platform 8 is closed. If a valve closing signal is received, the output chamber 7 is evacuated. When the adjacent processing chamber 20 meets the valve opening conditions, such as having a carrier 6 and the process has been completed, the valve between the output chamber 7 and the processing chamber 20 to be transferred is opened, and the material is transferred synchronously.

[0074] In some embodiments, if a first detection information indicating that the loading chamber 3 has a carrier 6 is obtained, and another first detection information indicating that the unloading chamber 7 has a carrier 6 is obtained, the automatic loading platform 1 can perform the loading operation to the loading chamber 3 and the unloading operation to the automatic unloading platform 8 can be performed simultaneously or sequentially.

[0075] In some embodiments, when any chamber in the processing chamber 20 has no material to be transferred, the valve between this chamber and the next adjacent chamber may not be opened; when the chamber above the chamber that has no material to be transferred has material to be transferred, the chamber above needs to transfer the material to be transferred to the next chamber after the process is completed.

[0076] In some embodiments, obtaining the status information of each processing chamber 20 includes: obtaining second detection information indicating whether each processing chamber 20 contains a carrier 6; if the second detection information indicating that the processing chamber 20 contains a carrier 6 is received, and a transfer status request is received from the processing chamber 20, then the status information of the processing chamber 20 indicates that there is material to be transferred in the processing chamber 20; the transfer status request is used to indicate that the processing chamber 20 meets the conditions for opening the valve and has completed the process and needs to be transferred to the next chamber.

[0077] When the second detection information indicating that the corresponding processing chamber 20 contains the carrier 6 is obtained, if a transfer status request for the processing chamber 20 is also received, it means that the processing chamber 20 has materials to be transferred and is ready to be transferred to the next chamber. This may include, but is not limited to, the heating is finished, the process gas is applied, the gas pressure in the chamber is within the process requirement range, the opening conditions for opening the valve between the next chamber are met, and the process is completed. The valve is opened to transfer the materials to be transferred to the next chamber.

[0078] Specifically, when the system receives the first detection information indicating that the wafer loading chamber 3 in Figure 2 has a carrier 6, and the second detection information indicating that the preheating chamber 4 and the adjacent intrinsic (Pi) process chamber 5 have carriers 6, and if other chambers, including the wafer exit chamber 7, do not have carriers 6; each chamber with carriers 6 is ready to transfer materials; the wafer loading chamber 3 is in a vacuum and can issue a transfer status request, indicating that it has met the conditions for opening the valve; the preheating chamber 4 can issue a transfer status request after preheating, indicating that its heating treatment has been completed, and the gas composition and pressure are within the process requirements, meeting the conditions for opening the valve; the intrinsic (Pi) process chamber 5 can issue a transfer status request after coating is completed. The request indicates that the coating process has been completed and the gas composition and pressure are within the required range, thus meeting the conditions for opening the valves; the valve between the loading chamber 3 and the preheating chamber 4 is opened, the valve between the preheating chamber 4 and the adjacent intrinsic (Pi) process chamber 5 is opened, and the valve between the intrinsic (Pi) process chamber 5 containing the material to be transferred and the next intrinsic (Pi) process chamber 5 is opened; after receiving the valve opening signal, the material to be transferred in the loading chamber 3, the preheating chamber 4, and the intrinsic (Pi) process chamber 5 adjacent to the preheating chamber 4 is synchronously transferred backward, and the valves are closed after the transfer is completed; after receiving the valve closing signal, the processing chambers 20 with carriers are controlled to process the material.

[0079] In some embodiments, the cell processing equipment 1000 may have multiple operating condition control applications. For example, in the loading chamber 3, there is a carrier 6; in the preheating chamber 4, there is a carrier 6; in the process chamber, there is a carrier 6; and in the unloading chamber 7, there is no carrier 6. Valve 2 between the process chamber and the unloading chamber 7 is open; valve 2 between the preheating chamber 4 and the process chamber is open; and valve 2 between the loading chamber 3 and the preheating chamber 4 is open. A valve opening signal is given, the conveyor motor in the unloading chamber 7 starts to feed material; the conveyor motor in the process chamber starts to feed and discharge material; the conveyor motor in the preheating chamber 4 starts to feed and discharge material; and the conveyor motor in the loading chamber 3 starts to discharge material. The unloading chamber 7 receives a deceleration signal, and the conveying speed decreases until... When the output chamber 7 receives a stop signal, the transmission motor in the output chamber 7 stops. When the process chamber receives a deceleration signal, the transmission speed decreases until the process chamber receives a stop signal, and the transmission motor in the process chamber stops. When the preheating chamber 4 receives a deceleration signal, the transmission speed decreases until the preheating chamber 4 receives a stop signal, and the transmission motor in the preheating chamber 4 stops. When the input chamber 3 receives a transmission motor, the output chamber 7 sends a signal indicating that the carrier 6 is present. When the process chamber sends a signal indicating that the carrier 6 is present, the preheating chamber 4 sends a signal indicating that the carrier 6 is present. When the valve 2 between the process chamber and the output chamber 7 is closed, the valve 2 between the preheating chamber 4 and the process chamber is closed. When the valve 2 between the input chamber 3 and the preheating chamber 4 is closed, a valve closure signal is sent.

[0080] The vacuum in the wafer exit chamber 7 is broken, giving an atmospheric signal; the automated unloading platform 8, without a carrier 6, gives a feeding signal; the discharge valve in the wafer exit chamber 7 opens, giving a valve opening signal; the transmission motor of the automated unloading platform 8 starts feeding; the transmission motor of the wafer exit chamber 7 starts discharging, receiving a deceleration signal; the transmission speed decreases until a stop signal is received; the transmission motors of the wafer exit chamber 7 and the automated unloading platform 8 stop; the carrier 6 signal in the wafer exit chamber 7 is removed; the discharge valve in the wafer exit chamber 7 closes, giving a valve closing signal; and a vacuum signal is given during vacuuming. (At the same time, the wafer entry chamber 3 completes the vacuum breaking and gives an atmospheric signal, the transmission feeding action, and the vacuuming and vacuuming actions; the given process inert gas maintains the process pressure and gives a uniform gas signal; the preheating chamber 4 completes preheating and gives a preheating completion signal; the given process inert gas maintains the process pressure and gives a uniform gas signal; the substrate on the carrier 6 in the process chamber completes the process and gives a process completion signal.)

[0081] According to some aspects of embodiments of this disclosure, a solar cell processing apparatus is provided, comprising: a plurality of chambers connected in sequence; the plurality of chambers including: a feeding chamber 3, at least one processing chamber 20, and a discharge chamber 7; a control device and a conveying unit; the control device including: an acquisition module configured to acquire status information of the feeding chamber, processing chamber, and discharge chamber of the solar cell processing apparatus respectively; the status information being used to indicate whether the feeding chamber, processing chamber, and discharge chamber respectively have material to be conveyed; a first control module configured to control the valves between the feeding chamber, processing chamber, and discharge chamber to open or close according to the status information of the feeding chamber, processing chamber, and discharge chamber respectively; the valves between at least some adjacent processing chambers to open or close synchronously; and a second control module configured to control the chamber containing the material to be conveyed to synchronously convey the material to be conveyed to the next chamber.

[0082] In some embodiments, the control device further includes a third control module configured to, when the valve between the loading chamber and the adjacent processing chamber is closed, control the material to be transferred from the automated loading station to the loading chamber if a discharge signal from the automated loading station is received.

[0083] In some embodiments, the third control module includes: a first control unit configured to control the vacuum breaking of the wafer loading chamber; a first receiving unit configured to receive an atmospheric signal from the wafer loading chamber; and a first starting unit configured to, if the atmospheric signal from the wafer loading chamber is received, start the wafer loading chamber to transfer material, so that the material to be transferred from the automated loading station is transferred to the wafer loading chamber.

[0084] In some embodiments, the control device further includes a fourth control module configured to, when the valve between the output chamber and the adjacent processing chamber is closed, control the material to be transferred in the output chamber to be transferred to the automated unloading station if a feeding signal from the automated unloading station is received.

[0085] In some embodiments, the fourth control module includes: a second control unit configured to control the vacuum breaking of the film output chamber; a second receiving unit configured to receive an atmospheric signal from the film output chamber; and a second starting unit configured to, if the atmospheric signal from the film output chamber is received, start the film output chamber to transmit material, so that the material to be transmitted in the film output chamber is transmitted to the automated unloading platform.

[0086] In some embodiments, the first control module includes: a first valve control unit configured to open the valves between the infeed chamber, the output chamber and the adjacent processing chamber, and open the valves between adjacent processing chambers if the status information indicates that at least one chamber in the infeed chamber and / or the processing chamber has material to be transferred and the output chamber has no material to be transferred.

[0087] In some embodiments, the first control module includes a second valve control unit configured to, if the status information indicates that at least one chamber in the feeding chamber and / or the processing chamber has material to be transferred, and the output chamber does not have material to be transferred, open the valve between the chamber containing the material to be transferred and the next chamber, and close the other valves.

[0088] In some embodiments, the second control module includes: a transmission control unit configured to, upon receiving a valve opening signal from one or more valves between the infeed chamber, the processing chamber, or the outfeed chamber, control the chamber containing the material to be transmitted to synchronously transmit the material to be transmitted to the next chamber; the valve opening signal is used to indicate that the valve has completed the opening operation.

[0089] In some embodiments, the control device further includes: a fifth control module configured to control the valves between the wafer loading chamber, the processing chamber, and the wafer unloading chamber to close after one synchronous transmission is completed; and a sixth control module configured to control the processing chamber to process the material according to the corresponding process of the processing chamber if a valve closing signal is received from each valve; the valve closing signal is used to indicate that the valve has completed the closing operation.

[0090] In some embodiments, the acquisition module includes: a first acquisition unit configured to acquire first detection information indicating whether the loading chamber and the unloading chamber contain a carrier; and a first determination unit configured to, if receiving the first detection information indicating that the loading chamber or the unloading chamber contains the carrier, determine that the status information of the loading chamber or the unloading chamber indicates that the material to be transferred is present in the loading chamber or the unloading chamber.

[0091] In some embodiments, the acquisition module includes: a second acquisition unit configured to acquire second detection information indicating whether each of the processing chambers contains a carrier; and a second determination unit configured to, upon receiving the second detection information indicating that the processing chamber contains the carrier, if a transfer status request is received from the processing chamber, determine that the status information of the processing chamber indicates that there is material to be transferred in the processing chamber; the transfer status request is used to indicate that the processing chamber meets the conditions for opening the valve and has completed the process and needs to be transferred to the next chamber.

[0092] In some embodiments, the cell processing equipment 1000 further includes an isolation chamber 12 connected between the two processing chambers 20; the control device is further configured to control at most one valve on both sides of the isolation chamber 12 to open at any given time. The control unit may be a processor or a controller, and the conveying unit may include a conveying motor corresponding to each chamber.

[0093] Referring to the cell processing equipment 1000 shown in Figure 1, the IN-segment coating equipment 200 includes an isolation chamber disposed between different types of coating process chambers to reduce cross-contamination between different process gases. An isolation chamber 12 is disposed between an intrinsic (Ni) process chamber 11 and a doped (N) process chamber 13 to avoid mutual interference between the process gases of the intrinsic layer and the doped layer. Upon receiving a process completion signal or transfer status request from the intrinsic (Ni) process chamber 11 adjacent to the feed end of the isolation chamber 12, and finding no material to be transferred in the isolation chamber 12, the valve between the intrinsic (Ni) process chamber 11 and the isolation chamber 12 is opened, while the valve between the discharge end of the isolation chamber 12 and the adjacent doped (N) process chamber 13 is closed. The transfer motor of the intrinsic (Ni) process chamber 11 is started to discharge material, and the transfer motor of the isolation chamber 12 is started to feed material, thus transferring the material from the intrinsic (Ni) process chamber 11 to the isolation chamber 12. Upon receiving a process completion signal or transfer status request from the intrinsic (Ni) process chamber 11 adjacent to the feed end of the isolation chamber 12, and upon receiving a process completion signal or transfer request from the previous intrinsic (Ni) process chamber 11, and provided there is no material to be transferred in the isolation chamber 12, the valve between the two intrinsic (Ni) process chambers 11 is opened, and the valve between the isolation chamber 12 and its adjacent intrinsic (Ni) process chamber 11 is opened, while the valve between the discharge end of the isolation chamber 12 and the adjacent doped (N) process chamber 13 is closed; the material to be transferred in the two intrinsic (Ni) process chambers 11 is synchronously transferred backward; after the transfer is completed, the opened valves are closed, and the corresponding process processing is initiated in the processing chamber 20 containing the material.

[0094] In some embodiments, if it is found that there is material to be transferred in the isolation chamber 12 and there is no material to be transferred in the adjacent doping (N) process chamber 13 at the discharge end of the isolation chamber 12, the valve between the isolation chamber 12 and the doping (N) process chamber 13 is opened to transfer the material to be transferred in the isolation chamber to the adjacent doping (N) process chamber 13; or if it is found that there is material to be transferred in the isolation chamber 12 and there is material to be transferred in the adjacent doping (N) process chamber 13, and the doping (N) process chamber 13 completes the process and issues a transfer status request, the valve between the isolation chamber and the adjacent doping (N) process chamber 13 is opened, and the valve between the two doping (N) process chambers 13 is opened, and the valve between the feed end of the isolation chamber 12 and the adjacent intrinsic (Ni) process chamber 11 is closed, the material to be transferred in the isolation chamber 12 and the material to be transferred in the adjacent doping (N) process chamber 13 are transferred backward synchronously, and after the transfer is completed, the opened valve is closed, and the processing chamber 20 with the material starts the corresponding process processing.

[0095] In some embodiments, the substrate is prepared to perform the first process from the automated loading table 1 and carrier 6 of the I-section coating equipment 100. The carrier 6 carries the substrate into the wafer loading chamber 3, the preheating chamber 4, and the three intrinsic (Pi) process chambers 5 in sequence. After the first semiconductor layer (intrinsic I layer) of the target thickness is deposited on the first surface, it is transferred out from the wafer unloading chamber 7. After the substrate is separated from the carrier 6 by the automated unloading table 8, it is flipped by the flipping device 10 and prepared to enter the IN-section coating equipment 200 for the second surface coating process. The substrate with the intrinsic I layer enters the automated loading table 1 of the IN section coating equipment 200 and is combined with the carrier 6 to prepare for the second process. The carrier 6 carries the substrate and enters the wafer loading chamber 3, the preheating chamber 4, two intrinsic (Ni) process chambers 11, the isolation chamber 12, and four doped (N) process chambers 13 in sequence. The intrinsic I layer and the N-type semiconductor layer are stacked on the second surface. The carrier 6 is then transferred out of the wafer unloading chamber 7. After the substrate is separated from the carrier 6 by the automated unloading table 8, it is flipped by the flipping device 10 to prepare for entering the P section coating equipment 300 for the first surface coating process. The substrate enters the automated loading platform 1 of the P-segment coating equipment 300 and combines with the carrier 6 to prepare for the third stage. The carrier 6 carries the substrate into the wafer loading chamber 3, the preheating chamber 4, and the five doping (P) process chambers 14 in sequence. After forming a P-type semiconductor layer of the target thickness on the intrinsic I layer of the first surface, it is transferred out from the wafer exit chamber 7. After the substrate is separated from the carrier 6 by the automated unloading platform 8, it undergoes subsequent processes such as quality inspection and warehousing. The empty carrier 6 is transferred to the automated loading platform 1 through the lower return device 9 for recycling.

[0096] According to some aspects of embodiments of this disclosure, FIG4 provides a control device 400, including: a processor 401 and a memory 402, the memory 402 being configured to store a program, and the processor 401 being configured to execute the program to implement the control method as described.

[0097] The control device in Figure 4 can be a component of the cell processing equipment 1000, or it can be used as a server, cloud computing, or database device to control the cell processing equipment 1000. The control device can acquire equipment information of the cell processing equipment in Figures 1 and 2, status information of whether there is a carrier in each chamber, valve opening information, process execution information of each chamber, air pressure information of each chamber, and operating information of each transmission motor. Based on the equipment information, it sends control commands to each component of the cell processing equipment to control each component of the cell processing equipment to run the task group in the preset program.

[0098] Referring to FIG4, the control device may include a processor 401, a communication interface 403, and a memory 402. The processor 401 and the memory 402 are coupled and interact with each other via the communication interface 403. The processor 401 can control the overall operation of the control device 400, including but not limited to the control method of the control device provided in the embodiments of this disclosure. The communication interface 403 enables the electronic device of the device to communicate with other terminals or servers via a network. The memory 402 is configured to store instructions and applications executable by the processor 401, and can also cache data to be processed or already processed by various modules in the processor 401 and the electronic device (e.g., image data, audio data, voice communication data, and video communication data). It can be implemented using flash memory or random access memory (RAM). Data can be transmitted between the processor 401, the communication interface 403, and the memory 402 via a bus 404. The processor 401 is used to execute some or all of the steps in the control method of the control device described above.

[0099] According to some aspects of embodiments of the present disclosure, a computer-readable storage medium is provided having a computer program stored thereon that, when executed, implements the control method as described.

[0100] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Industrial applicability

[0101] This disclosure provides a control method for a solar cell processing equipment, applied to a control system. The method includes at least: acquiring the status information of the feeding chamber, processing chamber, and output chamber of the solar cell processing equipment, which can be used to indicate whether there is material to be transferred in the feeding chamber, processing chamber, and output chamber respectively; controlling the valves between the feeding chamber, processing chamber, and output chamber to open or close according to the status information of the feeding chamber, processing chamber, and output chamber respectively; simultaneously opening or closing the valves between at least some adjacent processing chambers; controlling the chamber with material to be transferred to simultaneously transfer the material to the next chamber; and simultaneously opening the valves of multiple chambers that meet the process pressure and process node, completing the material transfer process while transferring the material out. This process can reduce the single-sided valve opening and closing process of one material transfer (or one material transfer), saving transfer time for the entire automated production line and improving process cycle efficiency.

Claims

1. A control method for a battery cell processing equipment (1000), the method being applied to a control system, the method comprising: The status information of the feeding chamber (3), processing chamber (20) and the output chamber (7) of the cell processing equipment (1000) is obtained; the status information is used to indicate whether there are materials to be transferred in the feeding chamber (3), the processing chamber (20) and the output chamber (7) respectively; Based on the status information of the film loading chamber (3), the processing chamber (20), and the film unloading chamber (7), the valves (2) between the film loading chamber (3), the processing chamber (20), and the film unloading chamber (7) are controlled to open or close; at least some of the valves (2) between adjacent processing chambers (20) are opened or closed synchronously; The chamber containing the material to be transferred is controlled to synchronously transfer the material to the next chamber.

2. The control method according to claim 1, wherein, The method further includes: With the valve (2) between the loading chamber (3) and the adjacent processing chamber (20) closed, in response to receiving the discharge signal from the automated loading station (1), the material to be transferred from the automated loading station (1) is controlled to be transferred to the loading chamber (3).

3. The control method according to claim 2, wherein, The process of controlling the automated loading station (1) to transfer the material to be transferred to the loading chamber (3) includes: Control the vacuum in the wafer loading chamber (3); Receive the atmospheric signal from the wafer loading chamber (3); In response to receiving an atmospheric signal from the loading chamber (3), the loading chamber (3) is activated to transfer the material, so that the material to be transferred from the automated loading station (1) is transferred to the loading chamber (3).

4. The control method according to any one of claims 1 to 3, wherein, The method further includes: With the valve (2) between the output chamber (7) and the adjacent processing chamber (20) closed, in response to receiving a feeding signal from the automated unloading station (8), the material to be transferred in the output chamber (7) is controlled to be transferred to the automated unloading station (8).

5. The control method according to claim 4, wherein, The process of controlling the transfer of materials to be transferred from the output chamber (7) to the automated unloading station (8) includes: Control the vacuum in the film output chamber (7); Receive the atmospheric signal from the output chamber (7); In response to receiving an atmospheric signal from the film output chamber (7), the film output chamber (7) is activated to transmit the material, so that the material to be transmitted in the film output chamber (7) is transmitted to the automated unloading station (8).

6. The control method according to any one of claims 1 to 5, wherein, The step of controlling the valve (2) between the film loading chamber (3), the processing chamber (20), and the film output chamber (7) to open or close based on the status information of each of the three chambers includes: Based on the status information indicating that at least one chamber in the loading chamber (3) and / or the processing chamber (20) has material to be transferred, and the unloading chamber (7) has no material to be transferred, the valve (2) between the loading chamber (3), the unloading chamber (7) and the adjacent processing chamber (20) is opened, and the valve (2) between each adjacent processing chamber (20) is also opened.

7. The control method according to any one of claims 1 to 5, wherein, The step of controlling the valve (2) between the film loading chamber (3), the processing chamber (20), and the film output chamber (7) to open or close based on the status information of each of the three chambers includes: Based on the status information indicating that at least one of the loading chamber (3) and / or the processing chamber (20) has material to be transferred, and the unloading chamber (7) has no material to be transferred, the valve (2) between the chamber with the material to be transferred and the next chamber is opened, and the other valves (2) are closed.

8. The control method according to any one of claims 1 to 7, wherein, Controlling the chamber containing the material to be transferred to synchronously transfer the material to the next chamber includes: In response to receiving a valve opening signal from one or more valves (2) between the feeding chamber (3), the processing chamber (20), or the output chamber (7), the chamber containing the material to be transferred is controlled to synchronously transfer the material to be transferred to the next chamber; the valve opening signal is used to indicate that the valve (2) has completed the opening operation.

9. The control method according to any one of claims 1 to 8, wherein, The method further includes: After one synchronous transmission is completed, the valve (2) between the wafer loading chamber (3), the processing chamber (20), and the wafer unloading chamber (7) is closed. In response to receiving valve closing signals from each valve (2), the processing chamber (20) is controlled to process the material according to the process corresponding to the processing chamber (20); the valve closing signal is used to indicate that the valve (2) has completed the closing operation.

10. The control method according to any one of claims 1 to 9, wherein, Obtaining the status information of the film loading chamber (3) and the film unloading chamber (7), including: First detection information is acquired to indicate whether the film loading chamber (3) and the film unloading chamber (7) contain a carrier (6); In response to receiving the first detection information indicating that the loading chamber (3) or the unloading chamber (7) contains the carrier (6), it is determined that the status information of the loading chamber (3) or the unloading chamber (7) indicates that the material to be transferred is in the loading chamber (3) or the unloading chamber (7).

11. The control method according to any one of claims 1 to 10, wherein, Obtaining the status information of each of the processing chambers (20), including: Second detection information is acquired to indicate whether each of the processing chambers (20) contains a carrier (6); Upon receiving the second detection information indicating that the processing chamber (20) contains the carrier (6), in response to receiving a transfer status request sent by the processing chamber (20), the status information of the processing chamber (20) is determined to indicate that there is material to be transferred in the processing chamber (20); the transfer status request is used to indicate that the processing chamber (20) meets the conditions for opening the valve (2) and has completed the process and needs to be transferred to the next chamber.

12. The control method according to any one of claims 1 to 11, wherein, The processor (401) of the control device (400) is configured to execute a program to implement the method; the program is stored in the memory (402) of the control device (400).

13. A solar cell processing equipment 1000, comprising: Multiple chambers connected in sequence; The plurality of chambers include: a film loading chamber (3), at least one processing chamber (20), and a film unloading chamber (7); A control device (400) and a transmission unit; the control device (400) includes: The acquisition module is configured to acquire the status information of the infeed chamber (3), processing chamber (20) and the outfeed chamber (7) of the cell processing equipment (1000); the status information is used to indicate whether the infeed chamber (3), the processing chamber (20) and the outfeed chamber (7) have materials to be transferred respectively; The first control module is configured to control the valves (2) between the film loading chamber (3), the processing chamber (20), and the film output chamber (7) to open or close based on the status information of each of the film loading chamber (3), the processing chamber (20), and the film output chamber (7); and to control the valves (2) between at least some adjacent processing chambers (20) to open or close synchronously. The second control module is configured to control the chamber containing the material to be transferred to synchronously transfer the material to the next chamber.

14. The battery cell processing equipment (1000) according to claim 13, wherein, Also includes: An isolation chamber (12) is connected between the two processing chambers (20); the control device (400) is also configured to: At most one of the valves (2) on both sides of the isolation chamber (12) is open at any given time.

15. A computer-readable storage medium having a computer program stored thereon, said computer program, when executed, implementing the control method as described in any one of claims 1 to 12.

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